JP5648972B2 - Resin composition for encapsulant - Google Patents
Resin composition for encapsulant Download PDFInfo
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- JP5648972B2 JP5648972B2 JP2011044708A JP2011044708A JP5648972B2 JP 5648972 B2 JP5648972 B2 JP 5648972B2 JP 2011044708 A JP2011044708 A JP 2011044708A JP 2011044708 A JP2011044708 A JP 2011044708A JP 5648972 B2 JP5648972 B2 JP 5648972B2
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- 239000011342 resin composition Substances 0.000 title claims description 17
- 239000008393 encapsulating agent Substances 0.000 title claims description 5
- 238000005984 hydrogenation reaction Methods 0.000 claims description 33
- 239000003054 catalyst Substances 0.000 claims description 25
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 claims description 24
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 claims description 22
- 150000004678 hydrides Chemical class 0.000 claims description 18
- 239000000178 monomer Substances 0.000 claims description 14
- 229920005672 polyolefin resin Polymers 0.000 claims description 12
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 claims description 11
- 239000003566 sealing material Substances 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 10
- 238000005727 Friedel-Crafts reaction Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000004040 coloring Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 229910015900 BF3 Inorganic materials 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- FYGHSUNMUKGBRK-UHFFFAOYSA-N 1,2,3-trimethylbenzene Chemical compound CC1=CC=CC(C)=C1C FYGHSUNMUKGBRK-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000005909 Kieselgur Substances 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000010538 cationic polymerization reaction Methods 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- NTDQQZYCCIDJRK-UHFFFAOYSA-N 4-octylphenol Chemical compound CCCCCCCCC1=CC=C(O)C=C1 NTDQQZYCCIDJRK-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 235000016796 Euonymus japonicus Nutrition 0.000 description 1
- 240000006570 Euonymus japonicus Species 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- QROGIFZRVHSFLM-QHHAFSJGSA-N [(e)-prop-1-enyl]benzene Chemical compound C\C=C\C1=CC=CC=C1 QROGIFZRVHSFLM-QHHAFSJGSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 238000007327 hydrogenolysis reaction Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- VENBJVSTINLYEU-UHFFFAOYSA-N phenol;trifluoroborane Chemical compound FB(F)F.OC1=CC=CC=C1 VENBJVSTINLYEU-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Description
本発明はガラスや金属などの幅広い部材との密着性に優れ、かつ透明性、耐候性に優れるポリオレフィン系の封止材用樹脂組成物に関する。 The present invention relates to a polyolefin-based resin composition for an encapsulant that has excellent adhesion to a wide range of members such as glass and metal, and is excellent in transparency and weather resistance.
ポリエチレンをはじめとするポリオレフィン樹脂は安価で加工性に優れ、かつ、透明性、耐候性、耐熱性、耐薬品性などの諸物性に優れるために、光学用途の封止材に用いることが期待されている。
しかしながら、ポリオレフィン樹脂は分子構造が無極性であり、且つ結晶性であるために、それら単独では各種部材との接着性が乏しい欠点があった。そのために、各種粘着付与樹脂等を添加し、密着性を向上させることが考えられる。しかし、光学用途では着色した粘着付与樹脂を用いることはできない。無色透明の粘着付与樹脂であれば使用することはできるが、粘着付与樹脂は、高温下にさらされたり、長期間紫外線に曝されると着色したり、変質したりするという問題があった。
Polyolefin resins such as polyethylene are inexpensive, have excellent processability, and have excellent physical properties such as transparency, weather resistance, heat resistance, and chemical resistance, and are expected to be used as sealing materials for optical applications. ing.
However, since the polyolefin resin has a non-polar molecular structure and is crystalline, there is a drawback in that the adhesiveness with various members is insufficient by themselves. Therefore, it is conceivable to add various tackifying resins and improve the adhesion. However, colored tackifier resins cannot be used for optical applications. Although it can be used as long as it is a colorless and transparent tackifying resin, the tackifying resin has a problem that it is colored or deteriorated when exposed to high temperatures or exposed to ultraviolet rays for a long time.
本発明は、優れた密着性を有し、溶融・加工等の処理を行う際に、加工性や耐熱性、耐光性に優れた透明な封止材用樹脂組成物を提供することを目的とする。 An object of the present invention is to provide a transparent resin composition for a sealing material having excellent adhesion and excellent workability, heat resistance, and light resistance when performing processing such as melting and processing. To do.
本発明者は、封止材用樹脂組成物について種々検討したところ、ポリオレフィン樹脂に特定のC9系芳香族炭化水素樹脂の水素化物を添加することで、各種基材との密着性に優れ、かつ透明性が高く、耐光性や耐熱性に優れる組成物が得られることを見出し、上記課題を解決することができることに想到し、本発明に到達した。 The present inventor has made various studies on the resin composition for a sealing material, and by adding a hydride of a specific C9 aromatic hydrocarbon resin to a polyolefin resin, it has excellent adhesion to various substrates, and The inventors have found that a composition having high transparency and excellent in light resistance and heat resistance can be obtained, and have conceived that the above problems can be solved, and have reached the present invention.
すなわち、本発明は、(A)ポリオレフィン系樹脂および(B)水素化率80%以上のC9系芳香族炭化水素樹脂の水素化物を含み、前記(B)がビニルトルエンを50重量%以上、インデンを20重量%以下の割合で含有するC9系重合性モノマーの重合物を水素化したものであることを特徴とする透明な封止材用樹脂組成物である。
That is, the present invention, (A) seen containing a hydride of a polyolefin resin and (B) hydrogenation of at least 80% of the C9 aromatic hydrocarbon resins, wherein (B) is vinyltoluene 50 wt% or more, A transparent resin composition for a sealing material , wherein a polymer of a C9 polymerizable monomer containing indene in a proportion of 20% by weight or less is hydrogenated .
本発明の封止材用樹脂組成物は、透明であり、溶融・加工等の処理を行う際に、加工性に優れ、高い透明性を維持しつつ、耐光性および耐熱性に優れ、極めて高い安定性を有するものである。 The encapsulant resin composition of the present invention is transparent, and has excellent processability when performing processing such as melting and processing, while maintaining high transparency and excellent light resistance and heat resistance, and extremely high. It has stability.
本発明の封止材用樹脂組成物は、(A)ポリオレフィン系樹脂(以下、(A)成分ともいう。)及び(B)水素化率80%以上のC9系芳香族炭化水素樹脂の水素化物(以下、(B)成分ともいう。)を含有する組成物を溶融・加工等の処理を行うことにより得られる。 The resin composition for a sealing material of the present invention includes (A) a polyolefin resin (hereinafter also referred to as component (A)) and (B) a hydride of a C9 aromatic hydrocarbon resin having a hydrogenation rate of 80% or more. It is obtained by subjecting a composition containing (hereinafter also referred to as component (B)) to a treatment such as melting and processing.
上記(A)成分としては、オレフィン系樹脂であれば特に限定されず、
例えば、ポリエチレン、ポリプロピレン、ポリブテン、ポリペンテン、ポリヘキセン、ポリオクテン等が挙げられる。これらのオレフィン系樹脂は、1種又は2種以上の混合物であっても良い。また、例えばエチレンに少量のオクテンを混合するなど2種類以上の炭素−炭素二重結合を有するモノマーを共重合させたポリオレフィンであっても良い。上記(A)成分は、種々のオレフィン系樹脂から選択される少なくとも1種類のものである。
The component (A) is not particularly limited as long as it is an olefin resin,
Examples thereof include polyethylene, polypropylene, polybutene, polypentene, polyhexene, polyoctene and the like. These olefin resins may be one kind or a mixture of two or more kinds. Further, for example, a polyolefin obtained by copolymerizing a monomer having two or more types of carbon-carbon double bonds such as mixing a small amount of octene with ethylene may be used. The component (A) is at least one selected from various olefin resins.
上記(B)成分は、C9系重合性モノマーの重合物を水素化することによって得られるものであって、水素化率が80%以上のものである。(B)成分は、従来からこの分野で慣用されているものであればいずれも使用できる。 The component (B) is obtained by hydrogenating a polymer of a C9-based polymerizable monomer, and has a hydrogenation rate of 80% or more. As the component (B), any of those conventionally used in this field can be used.
上記C9系重合性モノマーは、ナフサをクラッキングして得られる分解油留分のうち、常圧での沸点が140〜280℃程度であるC9留分であり、具体的には、スチレン、α−メチルスチレン、β−メチルスチレン、ビニルトルエン、インデン、アルキルインデン、ジシクロペンタジエン、エチルベンゼン、トリメチルベンゼン、ナフタリン等が主としてあげられる。通常、C9留分中のC9系重合性モノマーは、ビニルトルエン、インデンをそれぞれ40重量%程度含有し、残り20重量%程度がスチレン等からなる。本発明では、こうしたC9留分を蒸留することにより、C9留分のインデン類や高沸点の化合物等を除去し、C9系重合性モノマーの重合物中のビニルトルエン含有量が50重量%以上で、インデンの含有量が20重量%以下(ビニルトルエン含有量/インデン含有量=2.5以上)となるように調製したものを用いることが好ましい。C9系重合性モノマーの重合物中のビニルトルエン含有量は、55重量%以上、さらには60重量%以上とすることがより好ましく、多い程よい。インデンの含有量は、15重量%以下、さらには10重量%以下とすることがより好ましく、少ない程よい。 The C9 polymerizable monomer is a C9 fraction having a boiling point at atmospheric pressure of about 140 to 280 ° C. among cracked oil fractions obtained by cracking naphtha, specifically, styrene, α- Main examples include methylstyrene, β-methylstyrene, vinyltoluene, indene, alkylindene, dicyclopentadiene, ethylbenzene, trimethylbenzene, and naphthalene. Usually, the C9 polymerizable monomer in the C9 fraction contains about 40% by weight of vinyltoluene and indene, and the remaining about 20% by weight is made of styrene or the like. In the present invention, by distilling the C9 fraction, the indene and high boiling point compounds of the C9 fraction are removed, and the vinyl toluene content in the polymer of the C9 polymerizable monomer is 50% by weight or more. It is preferable to use those prepared so that the indene content is 20% by weight or less (vinyl toluene content / indene content = 2.5 or more). The vinyltoluene content in the polymer of the C9 polymerizable monomer is more preferably 55% by weight or more, and further preferably 60% by weight or more, and the higher the better. The indene content is more preferably 15% by weight or less, and even more preferably 10% by weight or less, and the lower the better.
上記C9系重合性モノマーの重合物は、C9系重合性モノマーを公知の方法でカチオン重合により重合することにより得られる。このようなC9系重合性モノマーの重合物は、公知のものを使用できる。通常、その軟化点(JIS K2207に従う環球法による測定。)は、70〜150℃程度、好ましくは80〜150℃であり、重量平均分子量(ゲルパーメーションクロマトグラフィーによるポリスチレン換算値)は300〜2000程度、好ましくは500〜1500程度のものを使用する。 The polymer of the C9 polymerizable monomer is obtained by polymerizing a C9 polymerizable monomer by cationic polymerization by a known method. As such a polymer of the C9 polymerizable monomer, a known product can be used. Usually, the softening point (measured by the ring and ball method according to JIS K2207) is about 70 to 150 ° C., preferably 80 to 150 ° C., and the weight average molecular weight (polystyrene conversion value by gel permeation chromatography) is 300 to 2000. About, preferably about 500-1500 is used.
C9系重合性モノマーの重合は、非フェノール系フリーデルクラフツ型触媒を用いて重合することが好ましい。非フェノール系フリーデルクラフツ型触媒とは、触媒を用いて重合を行って得られるC9系芳香族炭化水素樹脂から実質的にフェノール類が検出されない触媒をいう。検出方法としては、たとえば、塩化鉄(III)を使用する呈色法(船久保英一著、「有機化合物確認法I」、養賢堂、(1967年)、第1章 第9〜12頁)等があげられる。対象となるフェノール類としては、フェノールまたはクレゾール、キシレノール、p−tert―ブチルフェノール、p−オクチルフェノール、ノニルフェノール等のアルキル置換フェノール類等の分子中に−OH基を有する通常炭素数6〜20のものがあげられる。 The polymerization of the C9 polymerizable monomer is preferably performed using a non-phenolic Friedel-Crafts type catalyst. The non-phenolic Friedel-Crafts type catalyst refers to a catalyst in which phenols are not substantially detected from a C9 aromatic hydrocarbon resin obtained by polymerization using a catalyst. As a detection method, for example, a coloration method using iron (III) chloride (Eiichi Funakubo, “Organic Compound Confirmation Method I”, Yokendo, (1967), Chapter 1, pages 9-12 ) Etc. Examples of the phenols to be used include those having an —OH group in the molecule such as phenol or cresol, xylenol, p-tert-butylphenol, p-octylphenol, nonylphenol, and other alkyl-substituted phenols. can give.
非フェノール系フリーデルクラフツ型触媒としては、例えば、三フッ化ホウ素ガスまたは三フッ化ホウ素エーテル錯体等が挙げられる。このような触媒を用いた場合は、C9系芳香族炭化水素樹脂の水素化物を加熱しても着色し難い傾向にある。そのため、本発明におけるC9系芳香族炭化水素樹脂の重合においては、三フッ化ホウ素フェノール錯体等のフェノール類を含有するフリーデルクラフツ型触媒を用いない方が好ましい。 Examples of the non-phenolic Friedel-Crafts catalyst include boron trifluoride gas or boron trifluoride ether complex. When such a catalyst is used, there is a tendency that coloring is difficult even when a hydride of a C9 aromatic hydrocarbon resin is heated. Therefore, in the polymerization of the C9 aromatic hydrocarbon resin in the present invention, it is preferable not to use a Friedel-Crafts type catalyst containing phenols such as a boron trifluoride phenol complex.
上記(B)成分の水素化率は、80%以上であることを要する。特に水素化率が90%以上の(B)成分は、オレフィン系樹脂と相溶性が非常に高いことから、透明性が極めて高い封止材用樹脂組成物を得ることが可能となる。また、得られる封止材用樹脂組成物の耐光性の観点より、上記(B)成分の水素化率はより高い方が好ましい。 The hydrogenation rate of the said (B) component needs to be 80% or more. In particular, the component (B) having a hydrogenation rate of 90% or more has a very high compatibility with the olefin resin, so that it becomes possible to obtain a resin composition for a sealing material having extremely high transparency. Moreover, the one where the hydrogenation rate of the said (B) component is higher is preferable from the viewpoint of the light resistance of the resin composition for sealing materials obtained.
水素化率は、NMR測定法により求められ、C9系芳香族炭化水素樹脂及び得られたC9系芳香族炭化水素樹脂の水素化物の1H−NMRの7ppm付近に現れる芳香環の1H−スペクトル面積から以下の(1)式に基づいて計算する。
水素化率={1−(C9系芳香族炭化水素樹脂の水素化物のスペクトル面積/未水素化C9系芳香族炭化水素樹脂のスペクトル面積)}×100(%) (1)
Hydrogenation rate, determined by NMR measurement method, 1 H- spectrum of aromatic rings appearing near 7ppm of 1 H-NMR of the C9 aromatic hydrocarbon resins and the resulting C9 aromatic hydrocarbon resins hydride It calculates based on the following formula (1) from the area.
Hydrogenation rate = {1- (spectral area of hydride of C9 aromatic hydrocarbon resin / spectral area of unhydrogenated C9 aromatic hydrocarbon resin)} × 100 (%) (1)
水素化反応は、前記C9系石油樹脂の水素化率が目標レベルとなるように、水素化触媒の存在下に、条件を適宜に調整して行う。 The hydrogenation reaction is performed by appropriately adjusting the conditions in the presence of a hydrogenation catalyst so that the hydrogenation rate of the C9 petroleum resin becomes a target level.
上記水素化は、通常C9系重合性モノマーの重合物を、水素化触媒の存在下で反応を行う。水素化圧力、反応温度は、使用する触媒によって適宜決定されればよいが、通常、0.98〜29.4MPa程度、好ましくは、1.0〜24.5MPa程度、150〜400℃程度、好ましくは、200〜350℃程度である。水素化圧力が0.98MPaに満たない場合又は反応温度が150℃に満たない場合には、水素化反応が進行し難い。逆に水素化圧力が29.4MPaを越える場合には、経済性、安全性の点から好ましくなく、又、反応温度が400℃を越える場合には、樹脂の水素化分解反応が著しくなり、いずれの場合も好ましくない。但し、水素化圧力0.98MPa以下の圧力で反応を起こしうる触媒を用いれば、記載の圧力条件は限定されるものではない。反応形式としては、回分式、流通式(固定床式、流動床式等)等を採用することができる。 In the hydrogenation, a polymer of a C9 polymerizable monomer is usually reacted in the presence of a hydrogenation catalyst. The hydrogenation pressure and reaction temperature may be appropriately determined depending on the catalyst used, but are usually about 0.98 to 29.4 MPa, preferably about 1.0 to 24.5 MPa, about 150 to 400 ° C., preferably Is about 200-350 degreeC. When the hydrogenation pressure is less than 0.98 MPa or when the reaction temperature is less than 150 ° C., the hydrogenation reaction hardly proceeds. On the other hand, when the hydrogenation pressure exceeds 29.4 MPa, it is not preferable from the viewpoint of economy and safety, and when the reaction temperature exceeds 400 ° C., the hydrogenolysis reaction of the resin becomes remarkable. This is also not preferable. However, if a catalyst capable of causing a reaction at a hydrogenation pressure of 0.98 MPa or less is used, the described pressure conditions are not limited. As the reaction format, a batch system, a flow system (fixed bed system, fluidized bed system, etc.), etc. can be employed.
使用する水素化触媒としては、公知のものを用いることができる。具体的には、ニッケル、パラジウム、白金、コバルト、ロジウム、ルテニウム、モリブデン、オスミウム、イリジウム、レニウム、銅、鉄等の金属又はこれらの酸化物、硫化物等の金属化合物等各種のものを使用できる。これら水素化触媒は、一種若しくは二種以上混合して使用してもよい。更に、かかる水素化触媒は、多孔質で表面積の大きい、各種公知の担体、例えば、アルミナ、シリカ(ケイソウ土)、活性炭、チタニア、シリカアルミナ等の担体に担持して使用してもよい。担持量としては、担体1gあたり、0.0001g〜1g、好ましくは、0.005g〜0.7gがよい。これらの触媒の中でも、芳香環の水素化効率や費用の面から、ニッケル/ケイソウ土触媒が好ましい。この場合、ニッケルの担持量としては、20〜150重量%が好ましい。尚、本発明においては、担持量X%というのは、担体100重量部に対して、ニッケルX重量部担持させた量をいう。上記触媒は、公知のものを用いても良いし、公知の触媒調製法を組み合わせて独自に調製しても良い。触媒の形態としては、粒状、紛状、俵状、円柱状、押出成形型等が挙げられるが、特に限定されない。 Known hydrogenation catalysts can be used. Specifically, various kinds of metals such as nickel, palladium, platinum, cobalt, rhodium, ruthenium, molybdenum, osmium, iridium, rhenium, copper, iron, or metal compounds such as oxides or sulfides thereof can be used. . These hydrogenation catalysts may be used alone or in combination. Further, such a hydrogenation catalyst may be used by being supported on various known carriers having a large surface area such as alumina, silica (diatomaceous earth), activated carbon, titania, silica alumina and the like. The supported amount is 0.0001 g to 1 g, preferably 0.005 g to 0.7 g, per 1 g of the carrier. Among these catalysts, nickel / diatomaceous earth catalysts are preferable from the viewpoint of hydrogenation efficiency of aromatic rings and cost. In this case, the supported amount of nickel is preferably 20 to 150% by weight. In the present invention, the supported amount X% means an amount of nickel X parts by weight supported on 100 parts by weight of the carrier. A known catalyst may be used as the catalyst, or it may be prepared independently by combining known catalyst preparation methods. Examples of the form of the catalyst include granular, powdery, bowl-like, cylindrical, and extrusion molds, but are not particularly limited.
回分式の場合、触媒の使用量は、(B)成分又は下記に述べるその減圧処理物に対して、通常0.01〜10重量%程度、好ましくは0.1〜3.0重量%程度である。0.01重量%に満たない場合には、水素化反応が進行し難く、10重量%を越える場合には、経済的でない。また、水素化の反応時間は、通常1〜7時間程度、好ましくは2〜7時間程度である。 In the case of the batch type, the amount of the catalyst used is usually about 0.01 to 10% by weight, preferably about 0.1 to 3.0% by weight, relative to the component (B) or the decompressed product described below. is there. If it is less than 0.01% by weight, the hydrogenation reaction hardly proceeds, and if it exceeds 10% by weight, it is not economical. Moreover, the reaction time of hydrogenation is about 1 to 7 hours normally, Preferably it is about 2 to 7 hours.
上記水素化反応は、C9系重合性モノマーの重合物を溶融した状態、又は溶媒に溶解した状態で行う。溶媒としては、反応に不活性で原料や生成物が融解しやすい溶媒であれば足り、具体的には、炭化水素類が例示される。炭化水素類としては、シクロヘキサン、n−ヘキサン、n−ヘプタン、デカリン等が挙げられ、好ましくはシクロヘキサンがよい。 The hydrogenation reaction is performed in a molten state of a polymer of a C9 polymerizable monomer or in a state dissolved in a solvent. As the solvent, any solvent that is inert to the reaction and easily melts the raw materials and products is sufficient, and specifically, hydrocarbons are exemplified. Examples of the hydrocarbons include cyclohexane, n-hexane, n-heptane, decalin and the like, preferably cyclohexane.
上記溶媒は、1種単独で使用してもよく、2種以上を組み合わせて使用してもよい。溶媒の適当な使用量は、(B)成分又は下記に述べるその減圧処理物に対して、固形分が10〜80重量%の範囲となるような量が好ましいが、特に限定されるものではない。 The said solvent may be used individually by 1 type, and may be used in combination of 2 or more type. An appropriate amount of the solvent used is preferably an amount such that the solid content is in the range of 10 to 80% by weight with respect to the component (B) or the decompressed product described below, but is not particularly limited. .
上記水素化後は、減圧蒸留、濾過などの常法により、溶媒、触媒等を除去する。 After the hydrogenation, the solvent, catalyst and the like are removed by a conventional method such as distillation under reduced pressure or filtration.
上記減圧蒸留は、特に限定されるものではないが、通常、減圧処理は、6.7KPa程度以下、200℃程度以上の条件で、10時間程度以内の範囲で行う。減圧処理条件が6.7KPa以下、200℃以上とすることで、低沸成分を充分に除去できる。好ましくは、減圧処理条件は、5.2KPa以下、より好ましくは2.6KPa以下の減圧下で、210〜280℃程度の温度条件で行うのがよい。 Although the said vacuum distillation is not specifically limited, Usually, a pressure reduction process is performed in the range for about 10 hours or less on the conditions of about 6.7 KPa or less and about 200 degreeC or more. By setting the decompression treatment conditions to 6.7 KPa or less and 200 ° C. or more, low boiling components can be sufficiently removed. Preferably, the decompression treatment condition is 5.2 KPa or less, more preferably 2.6 KPa or less under a temperature condition of about 210 to 280 ° C.
上記(B)成分の軟化点は70〜150℃程度が好ましい。この場合、溶融・加工等の処理を行う際に、加工性に優れ、また接着性、透明性、耐久性に優れた封止材用樹脂組成物を得ることができる。70℃未満の場合は、得られるシートの耐熱性という点で不十分であり、150℃を超えると、溶融した際の粘度が高く、加工性が悪くなるという点で問題がある。より好ましくは、90〜140℃である。 The softening point of the component (B) is preferably about 70 to 150 ° C. In this case, it is possible to obtain a resin composition for a sealing material that is excellent in processability and excellent in adhesiveness, transparency, and durability when performing treatment such as melting and processing. When it is less than 70 ° C., it is insufficient in terms of heat resistance of the obtained sheet, and when it exceeds 150 ° C., there is a problem in that the viscosity at the time of melting is high and the workability is deteriorated. More preferably, it is 90-140 degreeC.
上記(B)成分の重量平均分子量は800〜3000程度であることが好ましい。この場合、溶融・加工等の処理を行う際に、加工性に優れ、また接着性、透明性、耐久性に優れた封止材用樹脂組成物を得ることができる。重量平均分子量が800未満であると、得られるシートの耐熱性という点で問題があり、3000を超えると溶融した際の粘度が高く、加工性が悪くなる。より好ましくは、900〜2500である。 The weight average molecular weight of the component (B) is preferably about 800 to 3000. In this case, it is possible to obtain a resin composition for a sealing material that is excellent in processability and excellent in adhesiveness, transparency, and durability when performing treatment such as melting and processing. If the weight average molecular weight is less than 800, there is a problem in terms of the heat resistance of the resulting sheet, and if it exceeds 3000, the viscosity at the time of melting is high, and the workability deteriorates. More preferably, it is 900-2500.
上記(B)成分の配合量は、(A)成分100重量部に対して、1〜200重量部、好ましくは1〜50重量部である。 The blending amount of the component (B) is 1 to 200 parts by weight, preferably 1 to 50 parts by weight with respect to 100 parts by weight of the component (A).
本発明の封止材用樹脂組成物は、優れた透明性や耐光性、耐熱性などの特徴を利用して、電子材料、例えば、液晶、有機EL、プラズマディスプレー、太陽電池等のモジュールをガラスや金属等の間に封止する用途で使用することができる。 The resin composition for an encapsulant of the present invention uses an excellent feature such as transparency, light resistance, and heat resistance to make electronic materials such as liquid crystal, organic EL, plasma display, solar cell modules, etc. into glass. It can be used for the purpose of sealing between metal and metal.
以下に本発明を実施例により更に具体的に説明する。ただし、本発明はこれら実施例に限定されるものではない。また実施例中、「部」は特に断りのない限り「重量部」を意味する。 Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples. In the examples, “parts” means “parts by weight” unless otherwise specified.
実施例1
エチレン−オクテン共重合体(ダウ・ケミカル(株)製 商品名 エンゲージ8200)80部とC9系芳香族炭化水素樹脂の水素化物として、樹脂a(荒川化学工業(株)製、水素化率94%)20部を約200℃で加熱溶融して混合させた。この溶融混合物を約50mm×20mm×1mmのガラス板およびアルミ板基材上に滴下・圧着させた後、室温まで冷却して凝固させた。基材より突出した余剰部分をカッターで除去して約50mm×20mm×1mmのシートを作製した。
Example 1
As a hydride of 80 parts of ethylene-octene copolymer (trade name Engage 8200, manufactured by Dow Chemical Co., Ltd.) and C9 aromatic hydrocarbon resin , resin a (produced by Arakawa Chemical Industries, Ltd. , hydrogenation rate: 94% 20 parts were heated and melted at about 200 ° C. and mixed. This molten mixture was dropped and pressure-bonded onto a glass plate and an aluminum plate substrate of about 50 mm × 20 mm × 1 mm, and then cooled to room temperature and solidified. The excess part which protruded from the base material was removed with the cutter, and the sheet | seat of about 50 mm x 20 mm x 1 mm was produced.
実施例2、比較例1
使用するC9系芳香族炭化水素樹脂の水素化物の種類を表1に記載のとおりに代えた他は、実施例1と同様にしてシートを作成した。
Example 2 and Comparative Example 1
A sheet was prepared in the same manner as in Example 1 except that the hydride of the C9 aromatic hydrocarbon resin used was changed as shown in Table 1.
比較例2
エチレン−オクテン共重合体(ダウ・ケミカル(株)製 商品名 エンゲージ8200)80部とC9系芳香族炭化水素樹脂の水素化物(荒川化学工業(株)製 商品名『アルコンM100』、水素化率70%、ビニルトルエン/インデン比=1.1)20部を約200℃で加熱溶融して混合させた。この溶融混合物を約50mm×20mm×1mmのガラス板およびアルミ板基材上に圧着させた後、室温まで冷却して凝固させた。基材より突出した余剰部分をカッターで除去して約50mm×20mm×1mmのシートを作製した。
Comparative Example 2
Ethylene-octene copolymer (trade name Engage 8200, manufactured by Dow Chemical Co., Ltd.) 80 parts and hydride of C9 aromatic hydrocarbon resin (trade name “Arcon M100”, manufactured by Arakawa Chemical Industries, Ltd., hydrogenation rate 20 parts of 70%, vinyltoluene / indene ratio = 1.1) were heated and melted at about 200 ° C. and mixed. The molten mixture was pressed on a glass plate and an aluminum plate substrate of about 50 mm × 20 mm × 1 mm, and then cooled to room temperature and solidified. The excess part which protruded from the base material was removed with the cutter, and the sheet | seat of about 50 mm x 20 mm x 1 mm was produced.
比較例3
エチレン−オクテン共重合体(ダウ・ケミカル(株)製 商品名 エンゲージ8200)100部を約200℃で加熱溶融させた。この溶融混合物を約50mm×20mm×1mmのガラス板およびアルミ板基材上に圧着させた後、室温まで冷却して凝固させた。基材より突出した余剰部分をカッターで除去して約50mm×20mm×1mmのシートを作製した。
Comparative Example 3
100 parts of an ethylene-octene copolymer (trade name Engage 8200, manufactured by Dow Chemical Co., Ltd.) was heated and melted at about 200 ° C. The molten mixture was pressed on a glass plate and an aluminum plate substrate of about 50 mm × 20 mm × 1 mm, and then cooled to room temperature and solidified. The excess part which protruded from the base material was removed with the cutter, and the sheet | seat of about 50 mm x 20 mm x 1 mm was produced.
(密着性の評価)
ガラス板およびアルミ上に圧着・作製した膜厚が約1mmのシートの基材との表面密着性を評価した。結果を表1に示す。表1中、「密着性」の項目における「◎」はシートが基材に完全に密着し、指で容易に剥がすことができないことを示し、「×」はシートが基材から指で容易に剥がれることを示す。
(Evaluation of adhesion)
The surface adhesion of the sheet having a thickness of about 1 mm that was press-bonded and produced on a glass plate and aluminum was evaluated. The results are shown in Table 1. In Table 1, "◎" in the item of "Adhesion" indicates that the sheet is completely adhered to the substrate and cannot be easily peeled off with a finger, and "X" indicates that the sheet is easily removed from the substrate with a finger. Indicates peeling off.
(透明性の評価)
本発明におけるシートの透明性は目視判定した。判定基準は以下の通りである。結果を表1に示す。
○:透明
△:少し白濁しているが透明
×:かなり白濁
(Evaluation of transparency)
The transparency of the sheet in the present invention was visually determined. Judgment criteria are as follows. The results are shown in Table 1.
○: Transparent △: Slightly cloudy but transparent ×: Slightly cloudy
(耐熱性の評価)
本発明におけるシートの耐熱性は、180℃にて4時間熱した時の着色性を目視判定した。判定基準は以下の通りである。結果を表1に示す。
○着色なし。△やや着色がみられる。×着色が著しい。
(Evaluation of heat resistance)
As for the heat resistance of the sheet in the present invention, the colorability when heated at 180 ° C. for 4 hours was visually determined. Judgment criteria are as follows. The results are shown in Table 1.
○ No coloring. Δ Slightly colored. X Coloring is remarkable.
(耐光性の評価)
本発明におけるシートの耐光性は、耐光性試験機(キセノンランプ照射、HERAEUS社製、SUNTEST耐光性試験機)に入れ、72時間光照射した。その後試験片の着色程度を目視判定した。判定基準は以下の通りである。○着色無し。△やや着色が見られる。×着色が著しい。結果を表1に示す。
(Evaluation of light resistance)
The light resistance of the sheet in the present invention was placed in a light resistance tester (xenon lamp irradiation, manufactured by HERAEUS, SUNTEST light resistance tester) and irradiated with light for 72 hours. Thereafter, the degree of coloring of the test piece was visually determined. Judgment criteria are as follows. ○ No coloring. Δ Slightly colored. X Coloring is remarkable. The results are shown in Table 1.
表1中の用語は以下を意味する。
ポリオレフィン:エチレン−オクテン共重合体(ダウ・ケミカル(株)製 商品名 エンゲージ8200)
樹脂a:ビニルトルエン58%、インデン9%を含有する重合性C9留分を、三フッ化ホウ素ガスを触媒としてカチオン重合したC9系芳香族炭化水素樹脂の水素化物(荒川化学工業(株)製 水素化率=94%)
樹脂b:ビニルトルエン58%、インデン9%を含有する重合性C9留分を、三フッ化ホウ素ガスを触媒としてカチオン重合したC9系芳香族炭化水素樹脂の水素化物(荒川化学工業(株)製 水素化率=99%)
P100:C9系芳香族炭化水素樹脂の水素化物(荒川化学工業(株)製 商品名『アルコンP100』 水素化率=90% ビニルトルエン/インデン比=1.1)
M100:C9系芳香族炭化水素樹脂の水素化物(荒川化学工業(株)製 商品名『アルコンM100』 水素化率=70%)
The terms in Table 1 mean the following:
Polyolefin: ethylene-octene copolymer (trade name Engage 8200, manufactured by Dow Chemical Co., Ltd.)
MASAKI fat a: vinyltoluene 58%, a polymerizable C9 fractions containing 9% indene, boron trifluoride gas cationic polymerized C9 aromatic hydrocarbon resins hydride as catalyst (Arakawa Chemical Industries Co. (Production hydrogenation rate = 94%)
Resin b: hydride of C9 aromatic hydrocarbon resin obtained by cationic polymerization of a polymerizable C9 fraction containing 58% vinyltoluene and 9% indene using boron trifluoride gas as a catalyst (manufactured by Arakawa Chemical Industries, Ltd.) (Hydrogenation rate = 99%)
P100: hydride of C9 aromatic hydrocarbon resin (trade name “Arcon P100” manufactured by Arakawa Chemical Industries, Ltd.) Hydrogenation rate = 90% Vinyltoluene / indene ratio = 1.1)
M100: hydride of C9 aromatic hydrocarbon resin (trade name “ Arcon M100 ” manufactured by Arakawa Chemical Industries, Ltd. = 70% hydrogenation rate)
Claims (5)
The transparent sealing according to any one of claims 1 to 4 , wherein a hydride of (B) a C9 aromatic hydrocarbon resin is 1 to 50 parts by weight with respect to 100 parts by weight of the (A) polyolefin resin. Resin composition for materials.
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