JP5632633B2 - Imprint apparatus, imprint method, and article manufacturing method - Google Patents

Description

The present invention relates to an imprint apparatus , an imprint method, and an article manufacturing method.

  In recent years, imprint technology that enables the formation of fine patterns has attracted attention as a technology for manufacturing various devices (semiconductor devices such as IC and LSI, liquid crystal devices, imaging devices such as CCDs, magnetic heads, etc.). ing. In the imprint technique, a resin is cured to form a fine pattern on a substrate while a master (mold) on which a fine pattern is formed is pressed against the resin on the substrate such as a silicon wafer or a glass plate.

  There are several resin curing methods in imprint technology, and a photocuring method is known as one of such resin curing methods. In the photocuring method, ultraviolet rays are irradiated in a state where a transparent mold is pressed against an ultraviolet curable resin, and the mold is peeled (released) after the resin is exposed and cured. The imprint technique based on the photocuring method is suitable for manufacturing a device because the temperature can be controlled relatively easily and the alignment mark on the substrate can be observed through a transparent mold.

  In the imprint technology, if the release force (release force) required to release the mold from the cured resin is large, the pattern formed on the substrate may tear off while remaining attached to the mold. It may be displaced (or deformed) from a predetermined position. Therefore, it is necessary to make the peeling force as small as possible, and several techniques for this have been proposed (see Patent Documents 1 and 2). Specifically, a surfactant (release agent) is applied to the surface of the mold outside the imprint apparatus, or the mold is pressed against a resin containing the surfactant a predetermined number of times, so that the surfactant is applied to the surface of the mold. The peeling force is reduced by adhering.

JP-T 2006-528088 JP 2007-523249 A

  However, when a surfactant is applied to the surface of the mold outside the imprint apparatus, an apparatus other than the imprint apparatus is used, which requires cost and time, and affects productivity. .

  On the other hand, when the mold is pressed against the resin containing the surfactant a predetermined number of times, there is a possibility that the mold is pressed against the resin more times than necessary to adhere the surfactant to the mold surface. . In such a case, the throughput and mold life are reduced. Further, even if the mold is pressed a predetermined number of times against a resin containing a surfactant, the surfactant may not be sufficiently adhered to the surface of the mold for some reason.

  The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide a technique that is advantageous in terms of product productivity.

In order to achieve the above object, an imprint apparatus according to one aspect of the present invention performs a mold release by pressing a resin and a mold on a substrate against each other to cure the resin and releasing the mold from the cured resin. a imprint apparatus performs the imprint process that forms a pattern on the substrate has a measuring unit for measuring the force required to the release, and a control unit for controlling the imprint processing, the When the force measured by the measurement unit is not less than or equal to a threshold value in a preparatory operation including the imprint process using a resin containing a release agent and the measurement of the force in the imprint process , the control unit The preparation operation is executed again, and the preparation operation is terminated when the force is equal to or less than a threshold value .

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, an imprint apparatus that is advantageous in terms of product productivity can be provided.

It is a figure which shows the structure of the imprint apparatus as 1 side surface of this invention. It is a figure for demonstrating that a pattern defect part arises when surfactant does not fully adhere to the pattern surface of a mold. It is a figure for demonstrating that a pattern is formed with high precision, when surfactant is fully adhering to the pattern surface of a mold. It is a figure which shows the relationship between the frequency | count of pressing a mold to resin containing surfactant, and the peeling force required when peeling the mold from the resin which hardened | cured. 3 is a flowchart for explaining the operation of the imprint apparatus shown in FIG. 1. It is a figure which shows the relationship between the frequency | count of pressing a mold to resin containing surfactant, and the peeling force required when peeling the mold from the resin which hardened | cured. 3 is a flowchart for explaining the operation of the imprint apparatus shown in FIG. 1.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

  FIG. 1 is a diagram illustrating a configuration of an imprint apparatus 100 according to one aspect of the present invention. The imprint apparatus 100 performs imprint processing for forming a pattern on a substrate by curing the resin while pressing the mold against the resin on the substrate, and peeling (releasing) the mold (mold) from the cured resin. Do.

  As shown in FIG. 1, the imprint apparatus 100 includes a substrate stage 102, a mold stage 106 that holds a mold 104, a supply unit 108, a drive unit 110, a light source 112, a scope 114, and a measurement unit 116. And a control unit 118.

  The substrate stage 102 holds and moves the substrate ST such as a silicon wafer or a glass plate via the substrate chuck, thereby positioning the substrate ST at a predetermined position. The substrate stage 102 is moved by driving an actuator (not shown) (for example, a linear motor).

  The mold 104 is made of a material that transmits light from the light source 112, and has a pattern surface 104a on which a pattern (uneven pattern) to be transferred to the substrate ST is formed. The mold 104 is held on the mold stage 106 via a mold chuck.

  The supply unit 108 includes a plurality of dispensers that discharge the resin RS as droplets, and supplies (applies) the resin RS onto the substrate ST (shot region where a pattern is to be formed). Specifically, the resin RS can be applied onto the substrate ST by driving the substrate stage 102 (scan driving or step driving) while discharging the resin RS from the dispenser constituting the supply unit 108. . In the present embodiment, the resin RS is a photo-curing resin including a release agent (typically a surfactant, hereinafter referred to as a surfactant).

  The drive unit 110 includes an actuator configured by an air cylinder, a linear motor, or the like, and drives the mold 104 (the mold stage 106 that holds the mold 104). The drive unit 110 presses the mold 104 against the resin RS supplied onto the substrate ST by driving the mold 104 downward. Further, the driving unit 110 drives the mold 104 upward to peel (release) the mold 104 from the cured resin RS on the substrate ST.

  In a state where the mold 104 is pressed against the resin RS supplied onto the substrate ST (that is, via the mold 104), the light source 112 irradiates the resin RS with ultraviolet rays to cure the resin RS. In other words, the light source 112 functions as a curing unit that cures the resin RS supplied on the substrate ST.

  The scope 114 detects an alignment mark formed on the substrate ST or an alignment mark formed on the mold 104. The scope 114 can also detect a reference mark formed on the substrate stage 102.

  The measuring unit 116 measures the imprinting force when the mold 104 is pressed against the resin RS supplied onto the substrate ST and the peeling force required when peeling the mold 104 from the cured resin RS on the substrate ST. To do. In the present embodiment, the measurement unit 116 is configured by a load cell disposed on the mold stage 106. However, the measuring unit 116 is not limited to the load cell, and includes a voltmeter that measures a voltage supplied to the substrate stage 102 when the mold 104 is peeled off. The peeling force is determined from the voltage measured by the voltmeter. The structure which estimates this may be sufficient.

  The control unit 118 includes a CPU and a memory, and controls each unit of the imprint apparatus 100 to operate the imprint apparatus 100. For example, the control unit 118 causes the drive unit 110, the light source 112, and the like to perform a preparation operation (preparation imprint process) for attaching the surfactant contained in the resin RS to the pattern surface 104a of the mold 104. The control unit 118 causes the driving unit 110, the light source 112, and the like to perform imprint processing (prepared imprint processing) for forming a pattern on the substrate ST.

  Here, the necessity of the preparatory operation for attaching the surfactant contained in the resin RS to the pattern surface 104a of the mold 104 will be described. In molds that have never been used for imprint processing (unused molds) or molds that have not been used for imprint processing (use stoppage period) are longer than a predetermined period, the interface on the pattern surface The activator is not fully adhered. Therefore, the peeling force required to peel the mold from the cured resin becomes larger than the expected value, and the pattern formed on the substrate is peeled off while being attached to the mold, or the mold or the substrate is removed from a predetermined position. It shifts (or deforms).

  For example, as shown in FIG. 2A, a case where the surfactant is not sufficiently attached to the pattern surface 104a of the mold 104 and the surfactant is attached only to a part of the pattern surface 104a is considered. . In the state shown in FIG. 2A, the mold 104 is pressed against the resin RS on the substrate ST to fill the resin RS between the mold 104 and the substrate ST. Then, when the resin RS is cured and the mold 104 is peeled from the cured resin RS, as shown in FIG. 2B, a portion where the pattern of the mold 104 cannot be formed on the substrate ST (pattern defective portion). It will occur.

  On the other hand, as shown in FIG. 3A, a case where the surfactant is sufficiently (uniformly) attached to the pattern surface 104a of the mold 104 will be considered. In the state shown in FIG. 3A, the mold 104 is pressed against the resin RS on the substrate ST to fill the resin RS between the mold 104 and the substrate ST. When the resin RS is cured and the mold 104 is peeled from the cured resin RS, as shown in FIG. 3B, the pattern of the mold 104 is accurately formed on the substrate ST without generating a defective pattern portion. Can be formed.

  Thus, in order to form the pattern of the mold 104 with high accuracy, the surfactant is uniformly attached to the pattern surface 104a of the mold 104, and the peeling force required for peeling the mold 104 from the cured resin RS is obtained. It needs to be reduced.

  In order to attach the surfactant to the pattern surface 104a of the mold 104, as described above, a surfactant is applied to the pattern surface 104a outside the imprint apparatus 100, or a resin RS containing a surfactant is used. It is necessary to press the mold 104 to the surface. However, when a surfactant is applied to the pattern surface 104a outside the imprint apparatus 100, an apparatus other than the imprint apparatus 100 (a process other than the semiconductor process) is required, which requires cost and time, and is produced. Will affect sex. Further, when the mold 104 is pressed against the resin RS containing the surfactant, the throughput and the mold 104 are not set unless the number of times the mold 104 is pressed is set to the minimum number necessary for uniformly attaching the surfactant to the pattern surface 104a. Will affect the lifespan. Furthermore, after the mold 104 is pressed against the resin RS, it is necessary to check whether or not the surfactant is uniformly attached to the pattern surface 104a to prevent occurrence of a defective pattern portion.

  On the other hand, in this embodiment, in the preparatory operation for attaching the surfactant contained in the resin RS to the pattern surface 104a of the mold 104, the number of times the mold 104 is pressed is necessary to uniformly attach the surfactant to the pattern surface 104a. It is possible to set the minimum number of times.

  First, the principle for minimizing the number of times the mold 104 is pressed in the preparatory operation for attaching the surfactant contained in the resin RS to the pattern surface 104a of the mold 104 will be described.

  FIG. 4 is a diagram showing the relationship between the number of times the mold is pressed against the resin RS containing the surfactant (number of times of stamping) N and the peeling force P required when peeling the mold from the cured resin RS. Referring to FIG. 4, the peeling force P1 corresponding to the plot R1 is peeled off from a resin RS that has cured a mold that has never been used for imprint processing or a mold in which the use stop period is longer than a predetermined period. It shows the peel force required for this. In this case, since the surfactant contained in the resin RS is not sufficiently attached to the pattern surface, the peeling force P1 is larger than the threshold value TH1. The threshold value TH1 is set to a value equal to or less than the maximum value of the peeling force necessary for forming the mold pattern on the substrate without damage (that is, a value including a predetermined margin with respect to the maximum value). It is a value derived experimentally or theoretically.

  By repeatedly pressing the mold onto the resin RS containing the surfactant (multiple times), the surfactant gradually adheres to the pattern surface. Therefore, as shown in plots R2, R3, R4, and R5, the peeling force required to peel the mold from the cured resin RS gradually decreases with the peeling forces P2, P3, P4, and P5. When the surfactant uniformly adheres to the pattern surface, as shown in plots R6 and R7, the peeling force required for peeling the mold from the cured resin RS is saturated (near the peeling forces P5, P6, and P7). Value).

As shown in the following formula 1, when the peeling force P is equal to or less than the threshold TH1 (peeling force P5 to P7), the surfactant is uniformly attached to the pattern surface, and without causing a pattern defect portion, It is considered that a mold pattern can be formed on the substrate with high accuracy.
P ≦ TH1 (Formula 1)
Here, an example of setting the threshold value TH1 will be described. First, an imprint process is performed on each of a plurality of shot areas on a substrate using an unused mold. At this time, for each of a plurality of shot regions on the substrate, a peeling force required for peeling the mold from the cured resin is measured. Next, for example, using SEM, the quality of the pattern formed in each of the plurality of shot areas is determined, and the shot area in which the pattern determined to be non-defective is formed. Then, the threshold value TH1 is set (determined) based on the peeling force measured for each of the plurality of shot regions and the determination result of the quality of the pattern formed in each of the plurality of shot regions. Specifically, as shown in FIG. 4, a diagram is created that shows the relationship between the peel force measured for each of the plurality of shot regions and the determination result of the quality of the pattern formed in each of the plurality of shot regions. . For example, when the peeling force measured in the shot area where the pattern determined to be non-defective is the peeling forces R5 to R7, the threshold value TH1 may be set as shown in FIG. it can. Moreover, it is preferable to set threshold value TH1 according to the result which performed the process mentioned above using several molds of the same kind.

  Note that, as in the prior art, consider the case where the number of times of pressing the mold against the resin containing the surfactant (the number of times of imprinting) is set based only on the determination result of the quality of the pattern formed in each of the plurality of shot regions. . When multiple molds of the same type are used, since the mold states are not completely the same, there is a variation in the determination result of the pattern quality (that is, it was necessary to determine that the pattern is non-defective) The number of stamps will be different). Therefore, since the average value or maximum value of the number of times of stamping required until the pattern is determined to be non-defective is set as the number of times the mold is pressed against the resin containing the surfactant, the mold is more than necessary. There is a possibility of pressing.

  On the other hand, if the peeling force required when peeling the mold from the cured resin is used as in this embodiment, even if the number of times required for the pattern to be determined to be good is different, the pattern is It can be seen that the peel force when the product is judged to be non-defective is the same. Therefore, rather than setting the number of times of imprinting for attaching the surfactant to the pattern surface based only on the judgment result of the quality of the pattern, the peeling force for ending the preparatory operation for attaching the surfactant to the pattern surface. It is advantageous to set the threshold value TH1.

  The threshold value TH1 depends on the combination of the type of resin containing the surfactant and the type of mold. Therefore, the threshold value TH1 is set for each combination of the type of resin containing the surfactant and the type of mold, and the threshold value TH1 can be selected according to the combination of the type of resin containing the surfactant and the type of mold. preferable.

  Hereinafter, the operation of the imprint apparatus 100 will be described with reference to FIG. 5, particularly focusing on the preparatory operation performed before the imprint process. Such an operation is executed by the control unit 118 controlling the respective units of the imprint apparatus 100 in an integrated manner.

  In S <b> 502, the mold 104 is carried into the imprint apparatus 100 and the mold 104 is held on the mold stage 106.

  In S504, the mold 104 carried in S502 is a mold that has never been used for imprint processing (unused mold) or a period that is not used for imprint processing (use stop period). It is determined whether the mold is longer than T. When the mold 104 is an unused mold or a mold whose use stop period is longer than a predetermined time T, the process proceeds to S506 and a preparatory operation is started. If the mold 104 is not an unused mold or a mold whose use stop period is longer than a predetermined time T, the process proceeds to S516 and the imprint process is started.

  Note that the predetermined period T is a period from when the imprint process immediately before using the mold 104 is completed to when the surfactant attached to the pattern surface 104a starts to be peeled off. It can be calculated theoretically. In addition, a mold management table for managing a usage history of the mold 104 is stored in a storage unit such as a memory of the control unit 118, for example. Therefore, the control unit 118 can determine whether the mold 104 is an unused mold or a mold whose use stop period is longer than a predetermined period T by referring to the mold management table. it can.

  In step S <b> 506, a substrate for preparatory operation different from the substrate ST that performs imprint processing is carried into the imprint apparatus 100, and the substrate for preparatory operation is held on the substrate stage 102.

  In step S <b> 508, a preparatory operation for attaching the surfactant contained in the resin RS to the pattern surface 104 a of the mold 104 is performed. Specifically, first, a resin RS containing a surfactant is supplied to each of a plurality of regions (corresponding to shot regions) on the substrate for the preparation operation by the supply unit 108. Next, the substrate for the preparatory operation is driven by the substrate stage 102, and the region (target region) on which the mold 104 is to be pressed on the substrate for the preparatory operation is arranged at a position corresponding to the mold 104 (the pattern surface 104a). At this time, the scope 114 simultaneously detects the alignment mark formed on the mold 104 and the alignment mark formed on the target region on the substrate for the preparation operation. Based on the detection result, the mold 104 and the preparation operation are detected. Alignment with the substrate for use. Next, the mold 104 is driven downward by the driving unit 110 to press the mold 104 against the resin RS supplied on the substrate for the preparatory operation. Next, in a state where the mold 104 is pressed against the resin RS, the resin RS is cured by irradiating the resin RS with ultraviolet rays by the light source 112. Next, the mold 104 is driven upward by the driving unit 110, and the mold 104 is peeled from the cured resin RS on the substrate for the preparation operation. At this time, the measuring unit 116 measures the peeling force P required to peel the mold 104 from the cured resin RS on the substrate for the preparatory operation. In this way, in the preparatory operation, the surfactant adheres to the pattern surface 104a by pressing the mold 104 against the resin RS containing the surfactant.

  In S510, it is determined whether or not the peeling force P measured in the preparatory operation in S508 is equal to or less than a threshold (that is, equal to or less than the threshold TH1). When the peeling force P is not equal to or less than the threshold value TH1, that is, larger than the threshold value TH1, it is considered that the surfactant is not uniformly attached to the pattern surface 104a as described above. The preparation operation is performed (that is, the preparation operation is continued). When the peeling force P is equal to or less than the threshold value TH1, as described above, it is considered that the surfactant is uniformly attached to the pattern surface 104a. Therefore, the process proceeds to S512, and the substrate for the preparatory operation is performed. Is unloaded from the imprint apparatus 100 and the preparation operation is terminated.

  In S514, the substrate ST to be imprinted is loaded into the imprint apparatus 100, and the substrate ST is held on the substrate stage 102.

  In S516, the imprint process for forming the pattern of the mold 104 on the substrate ST carried in S514 is performed as a ready imprint process, and the operation is terminated. The specific imprint process is the same as the above-described preparatory operation, except that the substrate for the preparatory operation is replaced with the substrate ST, and a detailed description thereof will be omitted here.

  Thus, according to the present embodiment, when the peeling force required for peeling the mold 104 from the cured resin RS on the substrate exceeds the threshold value TH1, a preparatory operation is performed, which is equal to or lower than the threshold value TH1. In this case, the preparation operation is terminated. Thereby, in the preparatory operation, the surfactant can be uniformly attached to the pattern surface 104a of the mold 104 while the number of times of pressing the mold 104 is minimized (that is, the time required for the preparatory operation is shortened). it can. Therefore, the imprint apparatus 100 according to the present embodiment suppresses a decrease in throughput and a decrease in the lifetime of the mold 104, and forms the pattern of the mold 104 on the substrate ST with high accuracy without generating a defective pattern portion. be able to.

  In the preparation operation, the mold 104 is displaced (or deformed) from a predetermined position because the peeling force required to peel the mold 104 from the cured resin RS on the substrate exceeds the threshold value TH1. Sometimes. Therefore, it is preferable to adjust the position of the mold 104 using the scope 114 when performing the imprint process after the preparation operation. However, when the positional deviation (or deformation) of the mold 104 is within an allowable range, it is not necessary to adjust the position of the mold 104.

  In the present embodiment, the control unit 118 controls the re-execution of the preparatory operation when the peeling force P measured by the measurement unit 116 exceeds the threshold value TH1, and the peeling force measured by the measurement unit 116. When P is less than or equal to the threshold value TH1, execution of the preparation operation is terminated. However, when the peeling force P measured by the measuring unit 116 exceeds the threshold value TH1, the control unit 118 may output information indicating that the peeling force P has exceeded the threshold value TH1. Even with such control, it is possible to avoid excessive or insufficient preparation operations. Note that information indicating that the peeling force P has exceeded the threshold value TH1 may be information indicating that a preparatory operation is being performed, for example.

In the preparatory operation, even if the mold 104 is pressed against the resin RS containing the surfactant more than a specified number of times, the peeling force required to peel the mold 104 from the cured resin RS may not be less than the threshold value TH1. FIG. 6 is a diagram showing the relationship between the number of times the mold is pressed against the resin RS containing the surfactant (number of times of stamping) N and the peeling force P required when peeling the mold from the cured resin RS. Referring to FIG. 6, in plots R1 to R7, the peeling force P is equal to or less than the threshold value TH1 before the number of stamps N reaches the specified number of times TH2. On the other hand, in the plots R1 ′ to R7 ′, the peeling force P is not less than or equal to the threshold value TH1 even when the number of stamps N is equal to or greater than the specified number TH2. In such a case, since the resin RS or the mold 104 containing the surfactant may not be in a normal state, the preparatory operation is terminated, the resin RS or the mold 104 is inspected, and the inspection result is determined. Therefore, it is necessary to replace the resin RS and the mold 104. Then, after confirming that the relationship between the peeling force P and the threshold value TH1 and the relationship between the number of times of stamping N and the specified number of times TH2 satisfy the following expression 2, the imprint process is performed.
P ≦ TH1 and N ≦ TH2 (Formula 2)
Note that the specified number of times TH2 may be set (determined) based on the number of stamps required until it is determined that the pattern formed on the substrate is a non-defective product in the above-described setting of the threshold value TH1. For example, the specified number of times TH2 can be set from an average value or standard deviation of the number of times of stamping required until the pattern is determined to be non-defective.

  Hereinafter, with reference to FIG. 7, the operation of the imprint apparatus 100 when the number of times the mold is pressed against the resin RS (the number of times of imprinting) in the preparation operation will be described. Note that S702 to S716 shown in FIG. 7 are the same as S502 to S516 shown in FIG. However, in S710, if the peeling force P is not equal to or less than the threshold value TH1, that is, greater than the threshold value TH1, the process proceeds to S718.

  In S718, in the preparatory operation in S708, it is determined whether or not the number N of times the mold is pressed against the resin RS containing the surfactant (number of times of stamping) is equal to or less than the specified number TH2. If the number of stamps N is equal to or less than the prescribed number TH2, the process proceeds to S708 and a preparation operation is performed (that is, the preparation operation is continued). If the number of stamps N exceeds the specified number of times TH2, the process proceeds to S720.

  In S720, the substrate for the preparation operation is unloaded from the imprint apparatus 100, and the preparation operation is finished. In S722, the mold 104 is unloaded from the imprint apparatus 100.

  In S724, the resin RS on the substrate for preparatory operation carried out in S720 and the mold 104 carried out in S722 are inspected. Then, predetermined processing (for example, replacement of the resin RS and the mold 104) is performed according to the inspection result of the resin RS and the mold 104, and the process proceeds to S706.

  Thus, according to the present embodiment, when the number of stamps N in the preparation operation exceeds the specified number TH2, the preparation operation is terminated. Accordingly, the preparatory operation is continued when the resin RS or the mold 104 containing the surfactant is not in a normal state and the peeling force P does not become the threshold value TH1 or less even when the number of times of stamping N is increased (that is, It is possible to prevent the time required for the preparatory operation from becoming long.

  In the above description, the preparatory operation is performed using the substrate for the preparatory operation different from the substrate ST that performs the imprint process. However, the preparatory operation may be performed using the substrate ST that performs the imprint process. . In this case, when the peeling force P required for peeling the mold 104 from the cured resin RS on the substrate ST by the control unit 118 is equal to or less than the threshold value TH1, the pattern of the mold 104 formed on the substrate ST is Judged to be non-defective. When the peeling force P exceeds the threshold value TH1, it is determined that the pattern of the mold 104 formed on the substrate ST is a defective product. And the determination result of the control part 118 which functions as a determination part which determines the quality of the pattern of the mold 104 formed on the board | substrate ST is memorize | stored in memory | storage parts, such as memory, and it uses for the inspection process etc. as a post process. To do. Specifically, in the inspection process, a shot region in which a pattern determined to be defective can be excluded from the semiconductor manufacturing process. Of course, even a shot region in which a pattern determined to be defective is formed does not need to be excluded from the semiconductor manufacturing process if the inspection result in the inspection process is good. As described above, the control unit 118 performs information on the pattern formed with the peeling force P exceeding the threshold value TH1 and information on the substrate on which the pattern is formed with the peeling force P exceeding the threshold value TH1. Information for specifying the information may be output. Note that the preparatory operation may become part of the imprint process by performing the preparatory operation using the substrate ST.

  Further, the resin used for the preparatory operation for attaching the surfactant to the pattern surface and the resin used for the imprint process for forming the mold pattern may not be the same resin. For example, the resin used for the imprint process may not contain a surfactant.

  Further, the pressing condition of the mold in the preparatory operation for attaching the surfactant to the pattern surface may be different from the pressing condition of the mold in the imprint process performed thereafter. For example, the pressing time of the mold in the preparation operation may be longer than the pressing time of the mold in the imprint process, or the pressing force of the mold in the preparation operation may be larger than the pressing force of the mold in the imprint process. In the preparatory operation, the mold and the substrate may be relatively vibrated. This makes it possible to reduce the number of times the mold is pressed to attach the surfactant to the pattern surface, and shorten the time required for the preparation operation.

  A method of manufacturing a device (semiconductor device, liquid crystal display element, etc.) as an article includes a step of transferring (forming) a pattern onto a substrate (wafer, glass plate, film-like substrate, etc.) using the imprint apparatus 100. The manufacturing method further includes a step of etching the substrate on which the pattern is transferred. In addition, when manufacturing other articles, such as a pattern dot media (recording medium) and an optical element, this manufacturing method includes the other process step which processes the board | substrate with which the pattern was transferred instead of an etching step. .

  As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

Claims (10)

An imprint apparatus that performs an imprint process of pressing a resin and a mold on a substrate against each other to cure the resin, releasing the mold from the cured resin to form a pattern on the substrate,
A measurement unit for measuring the force required for the mold release;
A control unit for controlling the imprint processing,
Have
When the force measured by the measurement unit is not less than or equal to a threshold value in the preparatory operation including the imprint process using a resin containing a release agent and the measurement of the force in the imprint process , the control unit The imprinting apparatus, wherein the preparatory operation is executed again, and the preparatory operation is terminated when the force is equal to or less than a threshold value . Wherein the control unit outputs information indicating that you are running a Symbol preparation operation, the imprint apparatus according to claim 1, characterized in that. Wherein, the case imprint process does not use the type period is longer than a predetermined time period, or, if not also used the type of once the imprint process, the preparation It causes execution of operation, the imprint apparatus according to claim 1 or 2, characterized in that. Wherein, when said repeat count of preparation operation has exceeded the prescribed number, to terminate the preparatory operation, it imprint apparatus according to any one of claims 1 to 3, wherein. Wherein, when the force has terminated the preparatory operation equal to or less than the threshold value, it causes execution of the imprint process after completion of the preparation operation to the substrate used in the preparation operation, The imprint apparatus according to claim 1, wherein the imprint apparatus is any one of claims 1 to 4 . Wherein, in as claimed in any one of claims 1 to 5, wherein the type of resin containing a release agent to change the threshold value in accordance with a combination of the type of the mold, it Printing device. Wherein the control unit, the imprint apparatus according to claim 5, wherein the pattern before Symbol force is formed above the threshold and outputs information indicating that there may be poor, and wherein the. Wherein the control unit, the imprint apparatus according to claim 5, before Symbol force exceeds the threshold value and outputs the information for specifying the shot area on the substrate on which the pattern is formed, characterized in that. It is an imprint method for performing an imprint process in which a resin and a mold are pressed against each other to cure the resin and release from the cured resin,
Performing a preparatory operation including the imprint process using a resin containing a release agent and the measurement of the force required for the mold release in the imprint process,
When the force is not less than or equal to a threshold value in the preparation operation, the preparation operation is performed again, and when the force is less than or equal to the threshold value, the preparation operation is terminated.
An imprint method characterized by the above. Forming a pattern on a substrate using the imprint apparatus according to any one of claims 1 to 8 or the imprint method according to claim 9 ;
A step of processing the substrate formed with the pattern in step,
A method for producing an article comprising:

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