JP5632423B2 - Distance sensor and distance image sensor - Google Patents

Description

  The present invention relates to a distance sensor and a distance image sensor.

  A conventional active optical distance measuring sensor irradiates light from a light source for light projection such as an LED (Light Emitting Diode), and detects reflected light from the object with a light detection element. It is known to output a signal corresponding to the distance up to. A PSD (Position Sensitive Detector) is known as an optical triangulation type optical distance measuring sensor that can easily measure the distance to an object, but in recent years, in order to perform more precise distance measurement, The development of TOF (Time-Of-Flight) type optical ranging sensor is expected.

  Image sensors that can simultaneously acquire distance information and image information with the same chip are required for in-vehicle use, factory automatic manufacturing systems, and the like. If an image sensor is installed in front of the vehicle, it is expected to be used for detection / recognition of the vehicle ahead and detection / recognition of pedestrians. Apart from image information, an image sensor that acquires a distance image composed of a single distance information or a plurality of distance information is also expected. It is preferable to use the TOF method for such a distance measuring sensor.

  The TOF method emits pulsed light from a light source for projection toward an object, and detects the pulsed light reflected by the object with a light detection element, thereby making the time difference between the emission timing of the pulsed light and the detection timing. Is measuring. This time difference (Δt) is the time required for the pulsed light to fly at the speed of light (= c) twice as much as the distance d to the object (2 × d), so d = (c × Δt) / 2 is established. The time difference (Δt) can be rephrased as the phase difference between the emission pulse from the light source and the detection pulse. If this phase difference is detected, the distance d to the object can be obtained.

  The charge distribution type image sensor has attracted attention as a light detection element for performing distance measurement by the TOF method. That is, in the charge distribution type image sensor, for example, the charge generated in the image sensor in response to the incident detection pulse is distributed in one potential well during the ON period of the emission pulse, and OFF. Distribute to the other potential well during the period. In this case, the ratio of the amount of charge distributed to the left and right is proportional to the phase difference between the detection pulse and the emission pulse, that is, the time required for the pulsed light to fly at the speed of light over twice the distance to the object. It will be. Various methods can be considered as the charge distribution method.

  In Patent Document 1, as a distance sensor (distance image sensor) of a charge distribution method, a semiconductor substrate, a photogate electrode that is provided on the surface of the semiconductor substrate and has two sides whose planar shapes face each other, and the surface And a plurality of gate electrodes respectively provided adjacent to two sides of the photogate electrode, and a charge having a conductivity type different from that of the semiconductor substrate and flowing from a region immediately below the photogate electrode to a region immediately below each gate electrode And a plurality of semiconductor regions for reading out each of them.

Special Table 2007-526448

  In the distance sensor (distance image sensor) of the charge distribution method as described above, a bias voltage (for example, 5 V) is applied to each semiconductor region in order to reset prior to distance measurement. At this time, the depletion layer extends not only from the region immediately below the photogate electrode but also from each semiconductor region. If the depletion layer extends from each semiconductor region, the generated charge may be directly taken into the depletion layer spreading from each semiconductor region without being taken into the depletion layer spreading from the region immediately below the photogate electrode. . In the distance sensor (distance image sensor) of the charge distribution method, a signal based on the charge that reaches directly below the photogate electrode and is distributed by the gate electrode contributes to the distance information. Therefore, a depletion layer that spreads from each semiconductor region The charge directly taken in and accumulated in each semiconductor region becomes an unnecessary noise component (DC component).

  An object of the present invention is to provide a distance sensor and a distance image sensor capable of suppressing generation of unnecessary noise components and performing highly accurate distance detection.

  A distance sensor according to the present invention is provided with a light incident surface, a semiconductor substrate having a surface opposite to the light incident surface, a photogate electrode provided on the surface, and a photogate electrode on the surface adjacent to the photogate electrode. From the first and second gate electrodes, the first and second semiconductor regions for reading out the electric charge flowing from the region immediately below the photogate electrode and immediately below the first and second gate electrodes, and the first and second semiconductor regions, respectively And a third semiconductor region that is provided apart from the light incident surface and has a conductivity type opposite to that of the first and second semiconductor regions.

  In the distance sensor according to the present invention, the third semiconductor region having the opposite conductivity type to the first and second semiconductor regions is provided away from the first and second semiconductor regions on the light incident surface side. For this reason, the depletion layer extending from the first and second semiconductor regions is prevented from spreading to the light incident surface side by the third semiconductor region, and extends beyond the third semiconductor region to the light incident surface side. Absent. As a result, the generated charge is suppressed from being directly taken into the depletion layer spreading from the first and second semiconductor regions, and the generation of unnecessary noise components can be suppressed.

  Note that the depletion layer extending from the region immediately below the photogate electrode is not suppressed by the third semiconductor region, but extends toward the light incident surface. Therefore, the third semiconductor region does not hinder the charge intake into the depletion layer extending from the region immediately below the photogate electrode. In addition, since the third semiconductor region is provided apart from the first and second semiconductor regions, there is a barrier to the potential gradient from the region immediately below the photogate electrode toward the region immediately below the first and second semiconductor regions. It is not formed, and there is no trouble in charge transfer.

  The distance image sensor according to the present invention includes an imaging region composed of a plurality of units arranged one-dimensionally or two-dimensionally on a semiconductor substrate, and based on the amount of charge output from the unit, a distance image is obtained. In the obtained distance image sensor, one unit is the distance sensor. In the present invention, as described above, the generated charge is suppressed from being directly taken into the depletion layer spreading from the first and second semiconductor regions, and generation of unnecessary noise components can be suppressed.

  Preferably, the first and second gate electrodes are provided around each of the first and second semiconductor regions so as to surround the first and second semiconductor regions. In this case, the first and second gate electrodes are positioned around the first and second semiconductor regions. Conversely, the first and second semiconductor regions are also disposed around the first and second gate electrodes. Will be located. Since the first and second gate electrodes surround the first and second semiconductor regions, by supplying a signal for transferring charges to the first and second gate electrodes, the charges from all directions are changed to the first and second gate electrodes. It is possible to transfer to the second semiconductor region. That is, substantially all the peripheral regions of the first and second gate electrodes can function as a charge generation region, and the aperture ratio is further improved significantly. Therefore, the signal amount can be increased and a distance image with a good S / N ratio can be obtained. Focusing on one distance sensor, since charges can be transferred from all directions outside the first and second gate electrodes to the inside first and second semiconductor regions, a lot of charges can be collected, When the distance is obtained based on the distance, a distance output with a good S / N ratio can be obtained.

  Preferably, the first and second gate electrodes have a ring shape. As a result, it is possible to steadily collect charges flowing into the regions immediately below the first and second gate electrodes from all directions, and to prevent the inflow thereof.

  ADVANTAGE OF THE INVENTION According to this invention, the generation | occurrence | production of an unnecessary noise component can be suppressed and the distance sensor and distance image sensor which can perform distance detection with high precision can be provided.

It is explanatory drawing which shows the structure of the distance measuring device which concerns on this embodiment. It is a figure for demonstrating the cross-sectional structure of a distance image sensor. It is a schematic plan view of a distance image sensor. It is a schematic diagram for demonstrating the structure of the pixel of a distance image sensor. It is a figure which shows the cross-sectional structure along the VV line in FIG. It is a figure which shows potential distribution for demonstrating accumulation | storage operation | movement of a signal charge. It is a schematic diagram for demonstrating the structure of a pixel. It is a figure which shows typically the expansion of a depletion layer. It is a figure which shows potential distribution in the thickness direction of a semiconductor substrate in the position in which the 1st and 2nd semiconductor region was provided. It is a figure which shows typically the expansion of a depletion layer. It is a figure which shows potential distribution in the thickness direction of a semiconductor substrate in the position in which the 1st and 2nd semiconductor region was provided. It is a figure which shows potential distribution for demonstrating accumulation | storage operation | movement of a signal charge. It is a schematic plan view of the modification of a distance image sensor. It is a figure which shows the cross-sectional structure along the XIV-XIV line | wire in FIG. It is a figure which shows typically the expansion of a depletion layer.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  FIG. 1 is an explanatory diagram showing the configuration of the distance measuring apparatus.

The distance measuring device, a distance image sensor 1, a light source 3 for emitting near-infrared light, a driving circuit 4 to be supplied to the light source 3 a pulse drive signal S _P, first included in each pixel of the range image sensor 1 and a second gate electrode (TX1, TX2: see FIG. 4), the pulsed driving signal _S and the control circuit 2 to provide a detection gate signals _S 1, _{S 2} in synchronization with the _P, the distance the first and second image sensors 1 An arithmetic circuit 5 is provided that calculates a distance from a signal d ′ (m, n) indicating distance information read from the semiconductor region (FD1 to FD2: see FIG. 4) to an object H such as a pedestrian. . The distance in the horizontal direction D from the distance image sensor 1 to the object H is defined as d.

The control circuit 2 is input to the pulse drive signal S _P to the switch 4b of the driving circuit 4. A light projecting light source 3 comprising an LED or a laser diode is connected to a power source 4a via a switch 4b. Therefore, when the pulse drive signal S _P is input to the switch 4b, a drive current having the same waveform as the pulse drive signal S _P is supplied to the light source 3, the pulse light L _P as a probe light for distance measurement from the light source 3 Is output.

When the pulse light L _P is irradiated on the object H, the pulse light is reflected by the object H, the pulse light L _D, the distance is incident on the image sensor 1 outputs a pulse detection signal S _D.

  The distance image sensor 1 is fixed on the wiring board 10, and a signal d ′ (m, n) having distance information is output from each pixel via the wiring on the wiring board 10.

The waveform of the pulse drive signal S _P, a square wave of period T, the high level "1", when the low level is "0", the voltage V (t) is given by the following equation.
・ Pulse drive signal S _P :
・ V (t) = 1 (provided that 0 <t <(T / 2))
・ V (t) = 0 (provided that (T / 2) <t <T)
・ V (t + T) = V (t)

The waveforms of the detection gate signals S ₁ and S ₂ are square waves having a period T, and the voltage V (t) is given by the following equation.
・ Detection gate signal S ₁ :
・ V (t) = 1 (provided that 0 <t <(T / 2))
・ V (t) = 0 (provided that (T / 2) <t <T)
・ V (t + T) = V (t)
Detection gate signal S ₂ (= inversion of S ₁ ):
・ V (t) = 0 (provided that 0 <t <(T / 2))
V (t) = 1 (provided that (T / 2) <t <T)
・ V (t + T) = V (t)

The pulse signal _{S P, S 1, S 2} , S D , it is assumed that has all pulse period 2 × _{T P.} Detection gate signal S ₁ and the pulse detection signal S _D are both the amount of charge generated by the distance image sensor within 1 when "1" Q1, the detection gate signal S ₂ and the pulse detection signal S _D are both "1" In this case, the amount of charge generated in the distance image sensor 1 is Q2.

The phase difference between _one detection gate signal S ₁ and the pulse detection signal _{SD in} the distance image sensor 1 is the distance in the overlap period when the other detection gate signal S ₂ and the pulse detection signal _SD are “1”. It is proportional to the amount of charge Q2 generated in the image sensor 1. That is, the charge amount Q2 is the charge amount for the period logical product of the detection gate signal S ₂ and the pulse detection signal S _D is "1". The total charge quantity generated in one pixel is Q1 + Q2, when the pulse width of the half cycle of the drive signal _{S P} and _{T P, Δt = T P ×} Q2 / (Q1 + Q2) long enough, with respect to the drive signal _{S P} The pulse detection signal _SD is delayed. The flight time Δt of one pulsed light is given by Δt = 2d / c, where d is the distance to the object and c is the speed of light. Therefore, a signal d ′ (m, n) having distance information from a specific pixel. two charge amount as) (Q1, Q2) when is outputted, the arithmetic circuit 5, a charge amount Q1, Q2 input, based on the half cycle pulse width T _P that is known in advance, the object H Distance d = (c × Δt) / 2 = c × T _P × Q2 / (2 × (Q1 + Q2)) is calculated.

  As described above, if the charge amounts Q1 and Q2 are read out separately, the arithmetic circuit 5 can calculate the distance d. The above-described pulse is repeatedly emitted, and the integrated value can be output as the respective charge amounts Q1 and Q2.

  The ratio of the charge amounts Q1 and Q2 to the total charge amount corresponds to the above-described phase difference, that is, the distance to the object H. The arithmetic circuit 5 calculates the distance to the object H according to this phase difference. As described above, when the time difference corresponding to the phase difference is Δt, the distance d is preferably given by d = (c × Δt) / 2, but an appropriate correction operation may be added to this. . For example, when the actual distance and the calculated distance d are different, a coefficient β for correcting the latter is obtained in advance, and the product after shipping is obtained by multiplying the calculated distance d by the coefficient β. The calculation distance d may be used. When the outside air temperature is measured and the light speed c varies depending on the outside air temperature, the distance calculation can be performed after performing the calculation for correcting the light speed c. The relationship between the signal input to the arithmetic circuit and the actual distance may be stored in advance in the memory, and the distance may be calculated by a lookup table method. The calculation method can also be changed depending on the sensor structure, and a conventionally known calculation method can be used for this.

  FIG. 2 is a diagram for explaining a cross-sectional configuration of the distance image sensor.

The distance image sensor 1 includes a semiconductor substrate 1A. The semiconductor substrate 1A has a reinforcing frame portion F and a thin plate portion TF thinner than the frame portion F, and these are integrated. The thickness of the thin plate portion TF is 5 μm or more and 100 μm or less. The thickness of the frame portion F in this example is 200 μm or more and 600 μm or less. The entire semiconductor substrate 1A may be thinned. The range image sensor 1, a pulse light L _D is made incident from the light incident surface 1BK. A surface 1FT opposite to the light incident surface 1BK of the distance image sensor 1 is connected to the wiring substrate 10 via an adhesion region AD. The adhesion region AD is a region including an adhesion element such as a bump electrode, and has an insulating adhesive or filler as necessary.

  FIG. 3 is a schematic plan view of the distance image sensor.

  In the distance image sensor 1, the semiconductor substrate 1A has an imaging region 1B composed of a plurality of pixels P (m, n) arranged in a two-dimensional manner. From each pixel P (m, n), two charge amounts (Q1, Q2) are output as the signal d '(m, n) having the above-described distance information. Each pixel P (m, n) outputs a signal d '(m, n) corresponding to the distance to the object H as a minute distance measuring sensor. Therefore, if the reflected light from the object H is imaged on the imaging region 1B, a distance image of the object as a collection of distance information to each point on the object H can be obtained. One pixel P (m, n) functions as one distance sensor.

  FIG. 4 is a schematic diagram for explaining the configuration of the pixels of the distance image sensor. FIG. 5 is a diagram showing a cross-sectional configuration along the line VV in FIG. In FIG. 4, the conductor 11 is not shown.

The distance image sensor 1 includes a light incident surface 1BK and a semiconductor substrate 1A having a surface 1FT opposite to the light incident surface 1BK, a photogate electrode PG, first and second gate electrodes TX1 and TX2, Second semiconductor regions FD1 and FD2 and a third semiconductor region SR1 are provided. The photogate electrode PG is provided on the surface 1FT via the insulating layer 1E. The first and second gate electrodes TX1, TX2 are provided adjacent to the photogate electrode PG via the insulating layer 1E on the surface 1FT. The first and second semiconductor regions FD1 and FD2 accumulate charges that flow into regions immediately below the gate electrodes TX1 and TX2. The third semiconductor region SR1 is provided away from the first and second semiconductor regions FD1, FD2 toward the light incident surface 1BK, and has a conductivity type opposite to that of the first and second semiconductor regions FD1, FD2. The semiconductor substrate 1A of the present embodiment is made of Si, the insulating layer 1E is made of SiO _2. The semiconductor substrate 1A may be made of an epitaxial layer.

  The photogate electrode PG has a rectangular shape in plan view. In the present embodiment, the photogate electrode PG has a rectangular shape. That is, the photogate electrode PG has a planar shape having first and second long sides LS1, LS2 facing each other and first and second short sides SS1, SS2 facing each other. A region corresponding to the photogate electrode PG in the semiconductor substrate 1A (a region immediately below the photogate electrode PG) functions as a photosensitive region in which charges are generated according to incident light. The photogate electrode PG is made of polysilicon, but other materials may be used.

  The first semiconductor region FD1 is disposed along the first long side LS1 on the first long side LS1 side of the photogate electrode PG. The second semiconductor region FD2 is disposed along the second long side LS2 on the second long side LS2 side of the photogate electrode PG. The first semiconductor region FD1 and the second semiconductor region FD2 are opposed to the first and second long sides LS1 and LS2 (hereinafter sometimes simply referred to as “opposing directions”) with the photogate electrode PG interposed therebetween. Opposite. The first and second semiconductor regions FD1, FD2 have a rectangular shape in plan view. In the present embodiment, the first and second semiconductor regions FD1, FD2 have a rectangular shape in which the long side direction of the photogate electrode PG is the long side direction.

  The first gate electrode TX1 is provided between the photogate electrode PG and the first semiconductor region FD1. The second gate electrode TX2 is provided between the photogate electrode PG and the second semiconductor region FD2. The first and second gate electrodes TX1, TX2 have a rectangular shape in plan view. In the present embodiment, the first and second gate electrodes TX1, TX2 have a rectangular shape in which the long side direction of the photogate electrode PG is the long side direction. The lengths of the first and second gate electrodes TX1, TX2 in the long side direction are set to be the same. The first and second gate electrodes TX1 and TX2 are made of polysilicon, but other materials may be used.

  The third semiconductor region SR1 is located between the first and second semiconductor regions FD1, FD2 and the light incident surface 1BK, and viewed from the direction orthogonal to the light incident surface 1BK, the first and second semiconductor regions FD1, It is formed so as to cover FD2. The third semiconductor region SR1 has a rectangular shape in plan view. In the present embodiment, the third semiconductor region SR1 has a rectangular shape in which the long side direction of the photogate electrode PG is the long side direction.

  The semiconductor substrate 1A is made of a P-type semiconductor substrate having a low impurity concentration, and the first and second semiconductor regions FD1, FD2 are regions made of an N-type semiconductor having a high impurity concentration, and are floating diffusion regions. The third semiconductor region SR1 is a region having the same conductivity type as the semiconductor substrate 1A and having a higher impurity concentration than the semiconductor substrate 1A, that is, a high impurity concentration P-type semiconductor. The third semiconductor region SR1 may be a P-type diffusion region or a P-type well region.

The thickness / impurity concentration of each semiconductor region is as follows.
Semiconductor substrate 1A: thickness 5 to 100 μm / impurity concentration 1 × 10 ¹² to 10 ¹⁵ cm ⁻³
First and second semiconductor regions FD1, FD2: thickness 0.1 to 0.4 μm / impurity concentration 1 × 10 ¹⁸ to 10 ²⁰ cm ⁻³
Third semiconductor region SR1: thickness 0.5 to 5 μm / impurity concentration 1 × 10 ¹⁵ to 10 ¹⁹ cm
^-3

  The insulating layer 1E is provided with contact holes for exposing the surfaces of the first and second semiconductor regions FD1, FD2. A conductor 11 for connecting the first and second semiconductor regions FD1, FD2 to the outside is disposed in the contact hole.

Part of the first and second semiconductor regions FD1, FD2 is in contact with a region immediately below the gate electrodes TX1, TX2 in the semiconductor substrate 1A. An antireflection film 1D is provided on the light incident surface 1BK side of the semiconductor substrate 1A. The material of the antireflection film 1D is SiO ₂ or SiN.

  The wiring substrate 10 is electrically connected to the first and second semiconductor regions FD1 and FD2, the first and second gate electrodes TX1 and TX2, the photogate electrode PG, and the like through bump electrodes in the adhesion region AD. A through electrode (not shown) is provided. The through electrode of the wiring board 10 is exposed on the back surface of the wiring board 10. A light-shielding layer (not shown) is formed on the surface of the insulating substrate constituting the wiring substrate 10 on the interface side with the adhesion region AD, so that the light transmitted through the distance image sensor 1 is prevented from entering the wiring substrate 10. doing. In this distance measuring device, when the distance image sensor 1 is mounted on the wiring board 10, the signal can be given to each electrode through each wiring, and the device is miniaturized.

  When a high level signal (positive potential) is applied to the first and second gate electrodes TX1 and TX2, the potential below the first and second gate electrodes TX1 and TX2 is below the photogate electrode PG in the semiconductor substrate 1A. Lower with respect to the potential of the region. As a result, negative charges (electrons) are drawn in the direction of the first and second gate electrodes TX1, TX2, and accumulated in the potential well formed by the first and second semiconductor regions FD1, FD2. An n-type semiconductor includes a positively ionized donor, has a positive potential, and attracts electrons. When a low level (ground potential) is applied to the first and second gate electrodes TX1 and TX2, a potential barrier is generated by the first and second gate electrodes TX1 and TX2. Therefore, the charge generated in the semiconductor substrate 1A is not drawn into the first and second semiconductor regions FD1, FD2.

  In the distance image sensor 1, charges generated in the deep part of the semiconductor in response to the incidence of light for projection are drawn into a potential well provided in the vicinity of the charge generation position on the opposite side to the light incident surface 1BK, so that it is accurate at high speed. Ranging is possible.

Pulse light L _D from the object incident from the light incident surface (back surface) 1BK of the semiconductor substrate 1A leads to the region immediately below the photogate electrode PG provided on the surface side of the semiconductor substrate 1A. The charges generated in the semiconductor substrate 1A with the incidence of the pulsed light are distributed from the region immediately below the photogate electrode PG to the region immediately below the first and second gate electrodes TX1 and TX2 adjacent thereto. That is, the detection gate signal _S 1, _{S 2} in synchronization with the drive signal _{S P} output light source to the first and second gate electrodes TX1, TX2, via the wiring board 10, given alternating, the photo gate electrode PG Charges generated in the region immediately below flow into regions immediately below the first and second gate electrodes TX1 and TX2, respectively, and flow into the first and second semiconductor regions FD1 and FD2.

The ratio of the charge amounts Q1 and Q2 accumulated in the first semiconductor region FD1 or the second semiconductor region FD2 to the total charge amount (Q1 + Q2) is the emission pulse light emitted by applying the drive signal _SP to the light source, and This corresponds to the phase difference of the detection pulse light that has returned by reflecting the outgoing pulse light by the object H.

Increasing the frequency of the drive signals (detection gate signals S ₁ and S ₂ ) to the first and second gate electrodes TX1 and TX2 makes it possible to receive near infrared light even if the charge distribution speed is increased. The generation area of the charges generated according to the above is closer to the surface 1FT on the opposite side than the light incident surface 1BK of the semiconductor substrate 1A, so that a large amount of charges from the area immediately below the photogate electrode PG from the first and second semiconductors. The stored charges Q1 and Q2 can be read out from the regions FD1 and FD2 through the wiring (not shown) of the wiring board 10 from these regions.

  Although not shown, the distance image sensor 1 includes a back gate semiconductor region for fixing the potential of the semiconductor substrate 1A to a reference potential.

  FIG. 6 is a diagram showing a potential distribution in the vicinity of the surface 1FT of the semiconductor substrate 1A for explaining the signal charge accumulation operation. In FIG. 6, the downward direction is the positive direction of the potential.

At the time of light incidence, the potential φPG in the region immediately below the photogate electrode _PG is set slightly higher than the substrate potential. The figure potential phi _TX1 in the region immediately below the first gate electrode TX1, the region of potential phi _TX2 immediately below the second gate electrode TX2, the first semiconductor region FD1 of the potential phi _FD1, and the second semiconductor region FD2 The potential φ _FD2 is shown.

High potential of the detection gate signals S ₁ is inputted to the first gate electrode TX1, as shown in FIG. 6 (a), charges generated immediately below the photogate electrode PG, according to the potential gradient, Accumulation is performed in the potential well of the first semiconductor region FD1 via the region immediately below the first gate electrode TX1. The charge amount Q1 is accumulated in the potential well of the first semiconductor region FD1.

Following the detection gate signal S _1, the high potential of the detection gate signal S ₂ is inputted to the second gate electrode TX2, as shown in FIG. 6 (b), immediately below the photogate electrode PG The generated charges are accumulated in the potential well of the second semiconductor region FD2 via the region immediately below the second gate electrode TX2 according to the potential gradient. The charge amount Q2 is accumulated in the potential well of the second semiconductor region FD2.

  FIG. 7 is a schematic diagram for explaining a configuration of a pixel.

The first gate electrode TX1, the detection gate signals _{S 1} supplied. The second gate electrode TX2, the detection gate signal _{S 2} is applied. That is, charge transfer signals having different phases are applied to the first gate electrode TX1 and the second gate electrode TX2.

Charge generated in the photosensitive region immediately below the photogate electrode PG, when the detection gate signals S ₁ at a high level to the first gate electrode TX1 is given, the potential formed by a first semiconductor region FD1 It flows into the well as signal charge. The signal charges accumulated in the first semiconductor region FD1 is read from the first semiconductor region FD1 as an output corresponding to the accumulated charge amount _{Q 1 (V out1).} Charge generated in the photosensitive region immediately below the photogate electrode PG, when the second gate electrode TX2 detection gate signal S ₂ of the high level is given, the potential formed by the second semiconductor region FD2 It flows into the well as signal charge. The signal charges accumulated in the second semiconductor region FD2 is read from the second semiconductor region FD2 as an output corresponding to the accumulated charge amount _{Q 2 (V out2).} These outputs (V _out1 , V _out2 ) correspond to the signal d ′ (m, n) described above.

  By the way, in the distance image sensor 1, a bias voltage (for example, 5V) is applied to the first and second semiconductor regions FD1 and FD2 in order to reset prior to the distance measurement. At this time, as shown in FIG. 8, the depletion layers DL1 and DL2 extend not only from the region immediately below the photogate electrode PG but also from the first and second semiconductor regions FD1 and FD2.

  However, in the distance image sensor 1, since the third semiconductor region SR1 is provided away from the first and second semiconductor regions FD1, FD2 toward the light incident surface 1BK, the first and second semiconductor regions FD1, FD2 are provided. The depletion layer DL2 spreading from the side is suppressed from spreading toward the light incident surface 1BK by the third semiconductor region SR1. That is, the depletion layer DL2 extending from the first and second semiconductor regions FD1, FD2 does not extend to the light incident surface 1BK side beyond the third semiconductor region SR1. As a result, the generated charge is suppressed from being directly taken into the depletion layer DL2 spreading from the first and second semiconductor regions FD1 and FD2, and generation of unnecessary noise components can be suppressed. Therefore, according to the distance image sensor 1, generation of unnecessary noise components can be suppressed and highly accurate distance detection can be performed.

  When distributing charges, a positive high-level detection signal is normally applied to one of the first gate electrode TX1 and the second gate electrode TX2 (for example, the first gate electrode TX1). At the same time, the other gate electrode (for example, the second gate electrode TX2) is supplied with detection signals having a phase difference of 180 degrees. At this time, when a detection signal applied to the other gate electrode (for example, the second gate electrode TX2) is applied at a lower level (for example, a negative bias voltage), the potential immediately below the second gate electrode TX2 is increased. A mountain of potential is formed. Thereby, it becomes difficult for the electric charge to flow from the photogate electrode PG side to the second semiconductor region FD2, and generation of unnecessary noise components can be suppressed.

  FIG. 9 is a diagram showing a potential distribution in the thickness direction of the semiconductor substrate 1A at the position where the first and second semiconductor regions FD1, FD2 are provided in the semiconductor substrate 1A. In FIG. 9, the downward direction is the positive direction of the potential. As shown in FIG. 9, the provision of the third semiconductor region SR1 forms a potential gradient from the light incident surface 1BK side in the thickness direction of the semiconductor substrate 1A toward the first and second semiconductor regions FD1, FD2. It will never be done. Also from this, it can be understood that the generated charges are suppressed from being directly taken into the depletion layer DL2 spreading from the first and second semiconductor regions FD1, FD2.

  On the other hand, when the third semiconductor region SR1 is not provided, as shown in FIG. 10, the depletion layer DL extending from the first and second semiconductor regions FD1, FD2 is depleted layer DL extending from the photogate electrode PG. In the same manner as above, it spreads toward the light incident surface 1BK. For this reason, as shown in FIG. 11, a potential gradient from the light incident surface 1BK side in the thickness direction of the semiconductor substrate 1A toward the first and second semiconductor regions FD1, FD2 is formed, and the generated charge is generated. Is directly taken into the depletion layer DL extending from the first and second semiconductor regions FD1, FD2.

  The depletion layer DL1 extending from the region immediately below the photogate electrode PG is not suppressed by the third semiconductor region SR1, but is expanded toward the light incident surface 1BK as shown in FIG. . Therefore, the third semiconductor region SR1 does not hinder the intake of charges into the depletion layer DL1 extending from the region immediately below the photogate electrode PG.

  Since the third semiconductor region SR1 is provided apart from the first and second semiconductor regions FD1 and FD2, the third semiconductor region SR1 extends from the region immediately below the photogate electrode PG to the region immediately below the first and second semiconductor regions FD1 and FD2. No barrier is formed in the potential gradient, and there is no problem in charge transfer. On the other hand, when the third semiconductor region SR1 is provided immediately below the first and second semiconductor regions FD1, FD2, the first semiconductor region SR1 starts from the region immediately below the photogate electrode PG as shown in FIG. In addition, a barrier is formed in the potential gradient toward the region immediately below the second semiconductor regions FD1 and FD2, and this hinders charge transfer. From the above viewpoint, the distance between the first and second semiconductor regions FD1, FD2 and the third semiconductor region SR1 in the thickness direction of the semiconductor substrate 1A is preferably set to 0 to 3 μm.

  Next, a modification of the distance image sensor 1 will be described with reference to FIGS. FIG. 13 is a schematic plan view of a modified example of the distance image sensor. FIG. 14 is a diagram showing a cross-sectional configuration along the line XIV-XIV in FIG.

  The photogate electrode PG has a lattice shape in plan view. That is, the photogate electrode PG has an electrode portion extending in the X-axis direction and an electrode portion extending in the Y-axis direction.

  The first semiconductor region FD1 and the second semiconductor region FD2 are located between the electrode portion extending in the X-axis direction and the electrode portion extending in the Y-axis direction of the photogate electrode PG, and in the X-axis direction and the Y-axis direction. Alternatingly arranged. In this modification, the first and second semiconductor regions FD1, FD2 have a square shape.

  The first gate electrode TX1 is provided around each first semiconductor region FD1 so as to surround the first semiconductor region FD1. When viewed in the X-axis direction and the Y-axis direction, one side of the first gate electrode TX1 is located between the photogate electrode PG and the first semiconductor region FD1. The second gate electrode TX2 is provided around each second semiconductor region FD2 so as to surround the second semiconductor region FD2. When viewed in the X-axis direction and the Y-axis direction, one side of the second gate electrode TX2 is positioned between the photogate electrode PG and the second semiconductor region FD2. The first and second gate electrodes TX1 and TX2 have an annular shape, and in this modification, an angular ring shape.

  The third semiconductor region SR1 is located between the first and second semiconductor regions FD1, FD2 and the light incident surface 1BK, and viewed from the direction orthogonal to the light incident surface 1BK, the first and second semiconductor regions FD1, It is formed so as to cover the entire FD2. The third semiconductor region SR1 has a square shape in plan view.

  Also in this modified example, as shown in FIG. 15, the depletion layer DL2 extending from the first and second semiconductor regions FD1, FD2 is prevented from expanding toward the light incident surface 1BK by the third semiconductor region SR1. As a result, the generated charge is suppressed from being directly taken into the depletion layer DL2 spreading from the first and second semiconductor regions FD1 and FD2, and generation of unnecessary noise components can be suppressed. Therefore, also according to this modification, generation of unnecessary noise components can be suppressed and highly accurate distance detection can be performed.

  The preferred embodiments of the present invention have been described above. However, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

  For example, a high concentration layer having the same conductivity type as that of the semiconductor substrate 1A and having a higher impurity concentration than the semiconductor substrate 1A is formed on the light incident surface 1BK side of the semiconductor substrate 1A, and the light incident surface 1BK is irregular. Concavities and convexities are formed, and the light incident surface 1BK may be optically exposed. The irregular irregularities can be formed by irradiating the light incident surface 1BK of the semiconductor substrate 1A with a picosecond to femtosecond pulsed laser beam as a pulsed laser beam.

  According to the photodiode manufacturing method of the present invention, when irregular irregularities are formed on the light incident surface 1BK of the semiconductor substrate 1A, the light incident on the semiconductor substrate 1A is reflected, scattered, or After being diffused, the semiconductor substrate 1A travels a long distance. Thereby, most of the light incident on the semiconductor substrate 1A is absorbed by the semiconductor substrate 1A without passing through the semiconductor substrate 1A. Therefore, the traveling distance of the light incident on the semiconductor substrate 1A becomes longer and the distance at which the light is absorbed becomes longer, so that the spectral sensitivity characteristic in the near-infrared wavelength band is improved.

  In addition, since the high-concentration layer is formed, unnecessary carriers generated regardless of light are recombined on the light incident surface 1BK side, and dark current can be reduced. In addition, the high concentration layer suppresses carriers generated by light in the vicinity of the light incident surface 1BK of the semiconductor substrate 1A from being trapped by the light incident surface 1BK. For this reason, the carrier generated by light efficiently moves to the light sensitive region, and the light detection sensitivity is improved.

  INDUSTRIAL APPLICABILITY The present invention can be used for a distance sensor and a distance image sensor mounted on a product monitor or a vehicle in a factory production line.

  DESCRIPTION OF SYMBOLS 1 ... Distance image sensor, 1A ... Semiconductor substrate, 1B ... Imaging region, 1BK ... Light incident surface, 1FT ... Surface, DL1, DL2 ... Depletion layer, FD1 ... First semiconductor region, FD2 ... Second semiconductor region, PG ... Photo Gate electrode, SR1 ... third semiconductor region, TX1 ... first gate electrode, TX2 ... second gate electrode.

Claims (4)

A semiconductor substrate having a light incident surface and a surface opposite to the light incident surface, and a light-sensitive region in which charge is generated according to incident light is provided on the surface side;
A semiconductor region that is provided on the surface side of the semiconductor substrate and accumulates charges generated in the photosensitive region;
An electrode provided on the surface and transferring charges generated in the photosensitive region to the semiconductor region;
The semiconductor substrate is located between the semiconductor region and the light incident surface and is formed so as to cover the semiconductor region when viewed from a direction orthogonal to the light incident surface, and is opposite to the semiconductor region. A semiconductor region having a conductivity type ,
The semiconductor region for accumulating charges generated in the photosensitive region is provided surrounded by the photosensitive region,
A distance sensor that transfers charges generated in the photosensitive region to the semiconductor region from all directions of the semiconductor region that accumulates charges generated in the photosensitive region . The distance sensor according to claim 1 , wherein the electrode is provided around the semiconductor region for accumulating charges generated in the photosensitive region so as to surround the semiconductor region. The distance sensor according to claim 2 , wherein the electrode has an annular shape. In a distance image sensor that has an imaging region composed of a plurality of units arranged one-dimensionally or two-dimensionally on a semiconductor substrate and obtains a distance image based on the amount of charge output from the unit,
One said unit is the distance sensor as described in any one of Claims 1-3 , The distance image sensor characterized by the above-mentioned.

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