JP5629076B2 - Identification code marking device and method, and semiconductor device with identification code marked - Google Patents

Description

  The present invention relates to an apparatus and method for marking an identification code on a semiconductor device used as a semiconductor chip component or an electronic component material, and a semiconductor device on which the identification code is marked.

  Semiconductor devices incorporating semiconductor chip components, electronic component materials, and the like are used in a wide variety of fields such as home appliances, automobiles, and industrial products. The semiconductor device is mass-produced based on a predetermined manufacturing method and manufacturing conditions, and is managed so that stable quality is always maintained.

  In quality control of the semiconductor device, inspection is appropriately performed during the manufacturing process or before shipment. If the inspection fails, the cause can be analyzed and the manufacturing method and manufacturing conditions can be improved.

  On the other hand, a defect is rarely found after the semiconductor device is inspected in a manufacturing process and a product that has passed the inspection is shipped. When it is found that the defect is caused by the manufacturing method or manufacturing conditions, the date of manufacture or the manufacturing lot is clearly indicated, and the user is notified to prompt repair or collection.

  Therefore, managing the manufacturing method and manufacturing conditions is important for maintaining the quality of the semiconductor device. It is also important for the shipped product to have a manufacturing history such as the manufacturing method and manufacturing conditions, which can be referred to later.

  As a means for clarifying the manufacturing history, a method of adding a unique ID called an identification code (for example, a two-dimensional code) (hereinafter referred to as an identification code) is used in the manufacturing process of the semiconductor device.

  The identification code can specify the manufacturing history by adding and registering the equipment used for manufacturing, the manufacturing date, the manufacturing lot, the destination, and other information. Various information such as the identification code, the manufacturing method, manufacturing conditions, and inspection results are registered in a database so that they can be referred to later.

  FIG. 6 shows a correlation between a conventional semiconductor device manufacturing process flow and the identification code and database to be marked. The identification code includes a wafer ID 30a and a chip ID 30c.

  In the previous step (s100), cleaning, film formation, exposure, development, etching, and the like are repeatedly performed, and the alignment mark 101 and the circuit pattern are formed on the semiconductor wafer 10.

  Thereafter, the semiconductor wafer 10 is subjected to continuity inspection and insulation inspection such as a probe electrical test (s101).

  The wafer ID 30a is marked on the semiconductor wafer 10 before and after the previous process or before and after the inspection, and is used for management in the manufacturing process of the semiconductor device.

  Subsequently, in order to confirm the presence or absence of foreign matter or scratches on the surface of the semiconductor wafer 10, a final inspection such as an appearance inspection is performed (s102).

  Subsequently, the chip ID 30c is marked on the surface protective film protecting the circuit on each semiconductor chip 102 before being cut out on the semiconductor wafer 10 (s103).

  Thereafter, the semiconductor wafer 10 is diced, and the semiconductor chip 104 after cutting is completed (s104).

  Subsequently, the semiconductor chip 104 is inspected (s105), and the process proceeds to a chip assembly process and a packaging process (s110).

  The semiconductor wafer 10 inspected in the wafer inspection step (s101) is read with the wafer ID 30a, and the inspection result is registered in the database 120 (s121).

  As for the marked chip ID 30c, the layout information of the semiconductor chip to which the ID is added is registered in the database 120 (s123).

  After the cut-out semiconductor chip 104, the chip ID 30c is read, and the inspection result of the semiconductor chip is registered in the database 120 (s125).

  If the chip ID 30c is added to all the semiconductor devices 110, the chip ID 30c is read and collated with the information stored in the database 120 in the manufacturing process of the semiconductor device even after being diced into individual pieces. For example, the history of the manufacturing information of the semiconductor device 110 can be referred to.

  Therefore, if inspection is performed in the manufacturing process of the semiconductor device and a defect is found, it can be determined whether the cause of the defect is in the manufacturing condition, and the manufacturing condition can be improved.

  The cut semiconductor chip 104 is joined to the lead frame or resin molded. The semiconductor chip packaged with the resin mold is packaged as a semiconductor device 110 and then shipped.

  As the semiconductor wafer 10 used in the manufacturing process of the semiconductor device 110, single crystal silicon is generally used, but in addition to single crystal silicon, a substrate made of polycrystalline silicon, a substrate made of glass, plastic, or other material. A case where a semiconductor material is formed on the substrate and a circuit pattern is formed thereon is also included.

  The identification code is marked using an ink material containing a metal material so that the X-ray can be read even after the semiconductor wafer 10 having been marked is molded with resin. .

  Since the ink material forming the dot portion of the identification code and the material portion other than the dot portion have different X-ray transmittances, the identification code inside the semiconductor device can be read.

  Even after the semiconductor device 110 is shipped as a product, the chip ID 30 c inside the package is read and collated with information stored in the database 120, thereby referring to the manufacturing information history of the semiconductor device 110. be able to.

  Therefore, when a failure occurs in a product after shipment, if it is found that the failure is caused by a specific period, device, or process, the shipping destination is searched, the user is notified, and repair or recovery is performed. To prevent similar failures from occurring.

FIG. 7 shows a cross-sectional view of a conventional semiconductor device.
According to Patent Document 1, a method and apparatus for forming a chip ID 30c on a base member 30d after applying a base member on the surface of a semiconductor chip to form a base member 30d is disclosed.

  A circuit pattern 108 is formed on the semiconductor wafer 10, and an insulating layer 109 is further formed thereon. A base member 30d is formed on the insulating layer 109, and a chip ID 30c composed of a group of ink materials 31b applied thereon is formed.

  According to Patent Document 2, in order to create an identification code on a glass substrate or the like used for a liquid crystal display or an organic EL display device, the substrate is washed, lyophobized, and the identification code is drawn by droplet discharge. A technique for heat treatment or drying treatment is disclosed.

JP 2009-105210 A JP 2006-192321 A

  When an identification code is marked on the conventional base member 30d having liquid repellency, the contact angle between the base member 30d and the dot portion forming the identification code increases (the contact area decreases), and the identification code In some cases, the adhesion of the dot portions that form the film decreases. If the adhesive force between the base member 30d and the identification code is insufficient, the dot portion forming the identification code may be peeled off from the base member 30d, and the identification code may not be correctly identified later.

  In addition, the conventional base member 30d having liquid repellency is often made of a transparent or light-shielding material. Therefore, when the identification code is read using reflected illumination in the manufacturing process of the semiconductor device, the circuit pattern 108 and the insulating layer 109 under the identification code are seen through, and the identification code is correctly identified. There was a possibility that it could not be done. Therefore, special techniques and experience are required, such as devising the illumination color and the irradiation angle in order to correctly identify the identification code.

  Further, since the identification code and the base member 30d are different materials, it is necessary to use a dedicated application means for applying the base member 30d, which increases the cost of the marking device.

Therefore, the object of the present invention is to
It is an object of the present invention to provide an inexpensive identification code marking device and method that have high adhesion between an identification code and a base member and that can correctly identify the identification code.

In order to solve the above problems, the invention described in claim 1
In a manufacturing process of a semiconductor device, after applying a base member for an identification code to a semiconductor wafer and marking the identification code on the base member, the semiconductor wafer is separated into semiconductor chips.
Applying a base member on the semiconductor wafer;
Applying and marking an identification code on the applied base member;
The base member and the identification code are formed of the same material,
This is a method for marking an identification code.

The invention described in claim 2
The material used for forming the base member and the identification code includes a material that absorbs or reflects X-rays,
The identification code marking method according to claim 1.

The invention according to claim 3
In order to increase the thickness of the identification code, the ink material that forms the identification code is further marked on the ink material that forms the identification code,
The identification code marking method according to claim 1.

The invention according to claim 4
The base member has a shape in which the central part is substantially flat and the outer peripheral part is raised,
Inside the raised portion of the outer peripheral portion of the base member,
Marking the identification code,
The identification code marking method according to claim 1.

The invention described in claim 5
An apparatus for applying a base member for an identification code on a semiconductor chip used in a semiconductor device and marking the identification code on the base member,
Means for applying a base member on the surface of the semiconductor chip;
On the applied the base member, and means for marking by applying an identification code,
The base member and the identification code are formed of the same material,
This is an identification code marking device.

The invention described in claim 6
The material used for forming the base member and the identification code includes a material that absorbs or reflects X-rays,
An identification code marking device according to claim 5.

The invention described in claim 7
6. The apparatus according to claim 5, further comprising means for marking the ink material forming the identification code on the ink material forming the identification code so as to increase a thickness of the identification code. 6. An identification code marking device according to item 6.

The invention according to claim 8 provides:
The base member has a shape in which the central part is substantially flat and the outer peripheral part is raised,
Inside the raised portion of the outer peripheral portion of the base member,
A means for marking the identification code is provided,
An identification code marking device according to claim 5.

The invention according to claim 9 is:
A semiconductor device in which an identification code is marked inside the package,
A semiconductor chip constituting the semiconductor device;
A base member formed by coating on the semiconductor chip;
And having the identification code coated and marked from above the base member formed by coating ,
In the semiconductor device, the base member and the identification code are formed of the same material.

The invention according to claim 10 is:
The material forming the base member and the identification code is:
Containing a material that absorbs or reflects X-rays,
A semiconductor device according to claim 9.

The invention according to claim 11
The base member has a shape in which the central part is substantially flat and the outer peripheral part is raised,
Inside the raised portion of the outer peripheral portion of the base member,
The identification code is marked,
A semiconductor device according to claim 9.

  The identification code formed by using the identification code marking apparatus and method of the present invention has an increased adhesion to the base member, and can prevent the dot portions forming the identification code from coming off. Further, since the base member shields the background pattern of the circuit pattern, it can be correctly identified when the identification code is read using the reflected illumination.

  In addition, since a step of using a special liquid repellent material can be omitted, an identification code marking device can be provided at a low cost.

  Further, since the semiconductor device of the present invention has an identification code formed inside the package, it can be identified even after product shipment.

It is a perspective view which shows an example of embodiment of this invention. It is a system configuration figure showing an example of an embodiment of the present invention. It is a side view which shows the marking by embodiment of this invention. It is sectional drawing which shows an example of the semiconductor device of this invention. (A), (b) It is the top view and sectional drawing which show an example of the semiconductor device of this invention. The figure which showed the correlation with the flow of the manufacturing process of the conventional semiconductor device, and the identification code and database which are marked It is sectional drawing of the conventional semiconductor device.

DESCRIPTION OF EMBODIMENTS Embodiments for carrying out the present invention will be described with reference to the drawings. The marking of the identification code of the present invention will be described by exemplifying the marking of the chip ID 30c.
FIG. 1 is a perspective view showing an example of an embodiment of the present invention.
In each figure, the three axes of the orthogonal coordinate system are X, Y, and Z, the XY plane is the horizontal plane, and the Z direction is the vertical direction. In particular, in the Z direction, the direction of the arrow is represented as the top, and the opposite direction is represented as the bottom.

  The marking device 1 includes a portal-type structure including a device base 11, a column 12 attached on the device base 11, and a beam 13 attached on the column 12. Furthermore, the marking device 1 includes a stage unit 2, a marking head unit 3, an alignment camera unit 4, and a control unit 9.

  The stage unit 2 includes an X-axis stage 21, a Y-axis stage 22, a θ-axis motor 23, and a table 24 that are mounted on the apparatus base 11.

  An X-axis stage 21 is attached on the apparatus base 11. A Y-axis stage 22 is mounted on the X-axis stage 21, and the Y-axis stage 22 can be moved in the X direction. A θ-axis motor 23 is mounted on the Y-axis stage 22, and the θ-axis motor 23 can be moved in the Y direction. A table 24 is mounted on the θ-axis motor 23, and the table 24 can be rotated in the θ direction.

  The semiconductor wafer 10 is placed on the table 24. Grooves and holes are provided on the surface of the table 24, and the grooves and holes are connected to a vacuum source via an opening / closing control valve. The semiconductor wafer 10 placed on the table 24 is sucked and held by a negative pressure so as not to be displaced during movement.

  Since the stage unit 2 has the above-described configuration, the semiconductor wafer 10 placed on the table 24 can be moved in the XY direction and rotated in the θ direction.

  The marking head unit 3 is mounted on the beam 13 disposed above the stage unit 2, and can apply the ink material 31 toward the semiconductor wafer 10.

  The marking head unit 3 includes a liquid feeding unit 32 that sends out an ink material 31 that is a material for forming the chip ID 30 c and an application nozzle for applying the ink material 31 to the semiconductor wafer 10.

  The alignment camera unit 4 is mounted on the beam 13 and includes a camera 40, a lens, and illumination.

  Examples of the camera 40 include an imaging camera using a CCD, a CMOS, and other imaging elements, and any camera that can output a captured image as a video signal to the control unit 9 may be used.

  Examples of the lens include optical parts using glass, plastic, and other materials, such as a lens and a mirror that can focus on the surface of the semiconductor wafer 10 and observe an image with the camera 40. Any optical component may be used.

  Examples of the illumination include LEDs, halogens, incandescent light bulbs, and other light emitting means. In order to observe the pattern of the surface of the semiconductor wafer 10 with the camera, according to the sensitivity wavelength of the camera 40, Any device that emits a light beam having a predetermined wavelength may be used.

FIG. 2 is a system configuration diagram showing an example of an embodiment of the marking device of the present invention.
As shown in FIG. 2, a control computer 90, an information input unit 91, an information output unit 92, a reporting unit 93, an information recording unit 94, and a device control unit 95 are connected to the control unit 9. Has been included.

Examples of the control computer 90 include a computer equipped with a numerical operation unit such as a microcomputer, a personal computer, or a workstation.
Examples of the information input unit 91 include a keyboard, a mouse, and a switch.
Examples of the information output unit 92 include an image display display and a lamp.

Examples of the reporting means 93 include those that can alert an operator, such as a buzzer, a speaker, and a lamp.
Examples of the information recording means 94 include a semiconductor recording medium, a magnetic recording medium, a magneto-optical recording medium, such as a memory card and a data disk.
Examples of the device control unit 95 include devices called programmable controllers and motion controllers.

  A video signal output from the camera 40 is input to the control computer 90 via the image processing unit.

  The device control unit 95 includes an X-axis stage 21, a Y-axis stage 22, a θ-axis 23, a liquid feeding unit 32, a camera 40, a light amount adjustment unit 41 for illumination, and other control devices (not shown). Are connected.

  The device control unit 95 can operate and stop each device by giving a control signal to each connected device.

  In the marking apparatus 1, the common marking head unit 3 and the ink material 31 are used to apply the base member 30 b and the chip ID 30 c. Application conditions such as the application position and application amount of the base member 30b, the marking position of the chip ID 30c and the pattern of the chip ID 30c, the application amount and application pitch of the marking material per dot, the temperature of the ink material 31, the temperature of the atmosphere, and the drying time It is preferable to adjust appropriately.

  Various conditions necessary for the above-described marking are set using an information input unit 91 connected to the control computer 90 of the control unit 9 and can be confirmed by the information display unit 92. The settings of the various conditions can be read, edited and changed as appropriate, and can be registered in the information recording means 94 connected to the control computer 90.

  Since the marking device 1 has the above-described configuration, the alignment mark on the semiconductor wafer 10 placed on the table is read, and a predetermined location on the surface of the semiconductor wafer 10 is set. Further, after the base member 30b is applied and the base member 30b is dried or only the surface is dried, the ink material 31 for forming the chip ID 30c is applied to mark the identification code.

  In addition, an identification code having an increased thickness can be marked by applying the ink material 31 that forms the chip ID 30c in an overlapping manner on the formed chip ID 30c.

  FIG. 3 is a side view showing how the chip ID 30 c is marked using the marking device 1. The ink material 31a is ejected from the marking head unit 3 toward the semiconductor wafer 10, and the base member 30b is applied to a predetermined range on the insulating layer 109 on the circuit pattern 108 formed on the semiconductor wafer 10. Further, the ink material 31b applied thereon is fixed. The applied ink material 31b forms a dot portion of the chip ID 30c, and can be handled as the chip ID 30c when viewed in plan.

  Examples of the ink material 31 include liquids containing colored solids such as dyes and pigments. Furthermore, it is preferable that the material which reflects the light irradiated from illumination is included. The reflection of the light beam includes partial reflection to total reflection. Therefore, when reading the identification code, the intensity, color, and irradiation angle of illumination may be appropriately adjusted in order to obtain optimum brightness.

  Then, when the chip ID 30c is read using the reflective illumination, the base member 30b and the top of the chip ID 30c reflect the light beam to become a bright part, and the convex boundary part of the dot part forming the identification code is It looks dark. Therefore, the outline of the dark portion, that is, the dot portion forming the identification code, can be identified as the identification code. Further, the circuit pattern under the base member 30b is not seen through, and the chip ID 30c can be correctly identified.

  Examples of the ink material 31 include a liquid material in which nanometer-sized metal fine particles are mixed, such as silver nanopaste. The metal fine particles may be other than silver, carbon, aluminum, manganese, iron, cobalt, nickel, copper, ruthenium, rhodium, palladium, indium, tin, barium, tungsten, platinum, gold, bismuth, and the like, The oxide compound, nitride compound, other compounds, and other mixtures can be used as long as the material reflects visible light.

  Further, the ink material 31 preferably contains a material that absorbs X-rays. By forming the chip ID 30c with a material that absorbs X-rays, it is possible to irradiate the resin-molded semiconductor product with X-rays from the outside and identify the chip ID 30c from the intensity of the transmitted X-rays.

  Further, as the ink material 31, a material containing a material that reflects X-rays may be used instead of the material that absorbs X-rays described above. Alternatively, a material including a material that absorbs X-rays and a material that reflects X-rays may be used. The resin-molded semiconductor product is irradiated with X-rays from the outside to transmit the transmitted X-rays. The chip ID 30c can be identified from the strength.

  Examples of means for applying the ink material 31 include an inkjet and a dispenser. The application means may be appropriately selected depending on the dimensions of the chip ID 30c and the physical properties of the ink material 31.

  When a dispenser is used as the application means, a metal nano paste is filled in a syringe and the metal nano paste is pushed out by a piston. The metal nano paste discharged from the needle attached to the tip of the syringe is dropped into a predetermined place.

  When forming the base member 30b, the discharge amount may be increased or the coating pitch may be reduced. When applying the dot portions constituting the chip ID 30c, the amount of ink material 31 discharged may be reduced or overcoated.

  The same means can be used as the application means of the base member 30b. For example, a dispenser can be illustrated. In the case of a dispenser using a microneedle or an ink jet, it can be applied by reducing the size of the chip ID 30 or finely adjusting the shape of the base member.

FIG. 4 is a cross-sectional view showing an example of the semiconductor device of the present invention.
An insulating layer 109 is formed on the circuit pattern 108 of the semiconductor wafer 10, a base member 30b is formed on the insulating layer 109, and a chip ID 30c, which is an example of a chip ID 30c, is formed on the base member 30b. Is formed.

  The chip ID 30c applies the ink material 31 in a predetermined number of times. By doing so, the aspect ratio of the dot part which comprises chip ID30c can be made high.

  By increasing the thickness of the chip ID 30c, it becomes sufficiently thicker than the base member 30b, and it becomes easy to identify at the time of reading. The reason why the identification at the time of reading is facilitated is that if the thickness of the chip ID 30c is made sufficiently thicker than the thickness of the base member, the difference in the X-ray transmittance at the time of reading increases, and the contrast as the chip ID 30c is increased. It is because it becomes easy to come out.

  Since the chip ID 30c is formed of the same material as the base member 30b, the bonding force can be increased compared to the base member 30d formed using a liquid repellent material or the like. Therefore, even if the aspect ratio of the chip ID 30c is increased, it is possible to prevent the dot portion forming the chip ID 30c from being peeled off or collapsed from the base member 30b.

  The base member 30b and the chip ID 30c may be applied at room temperature, but it is preferable that the temperature of the semiconductor wafer 10 and the atmosphere is increased to be cured quickly. Then, the processing time can be shortened.

  Moreover, it is preferable that the temperature of the semiconductor wafer 10 and the atmosphere is further increased and the chip ID 30c is applied after the base member 30b is applied. Then, the applied chip ID 30c dries quickly, and the chip ID 30c can be overlaid and marked in a short time, so that the processing time can be shortened.

FIG. 5A is a plan view showing an example of an identification code marked on the semiconductor device of the present invention, and FIG. 5B is a cross-sectional view taken along line AA of FIG.
A circuit pattern 108 is formed on the wafer 10, an insulating layer 109 is formed thereon, an upper base member 30b is formed on the insulating layer 109, and a chip ID 30c is formed on the base member 30b. The chip ID 30c is configured by collecting applied ink materials 31b.

  When the base member 30b is coated on the wafer 10 and then dried, a stain phenomenon occurs, and the central portion 301 of the base member is substantially flat, but the outer peripheral portion tends to rise. Therefore, if the raised portion 302 on the outer peripheral portion of the base member and the chip ID 30c are adjacent to each other or overlapped with each other, it is difficult to distinguish the raised portion 302 on the outer peripheral portion of the base member from the convex portion of the chip ID 30c. Become. In this case, even if the applied ink material 31b is not present, the identification code may not be correctly identified because it is determined as a convex portion. Alternatively, the identification code may not be correctly identified because the convex portion of the chip ID 30c on the raised portion 302 on the outer peripheral portion of the base member cannot be distinguished from the convex portion.

  Therefore, when the base member 30b is applied, the base member 30b is applied so that the raised portion 302 of the outer peripheral portion of the base member appears outside the place where the chip ID 30c is marked. Thereafter, when the chip ID 30c is marked at a pre-registered location, the outer periphery of the chip ID 30c is placed inside the raised portion 302 of the outer peripheral portion of the base member. By applying the base member 30b and marking the chip ID 30c in the above procedure, the chip ID 30c can be correctly identified even if the outer peripheral portion of the base member 30b is raised.

  Using the marking device 1 of the present invention, the outer dimension of the base member 30b is (Xbo, Ybo) and the dimension of the inner side 303 of the raised portion of the base member is (Xbi, Ybi) at a predetermined location on the wafer 10. As such, the base member 30b is applied. Thereafter, a chip ID 30b having an outer dimension (Xc, Yc) is marked on the central portion 301 of the base member. By doing so, gaps d1 to d8 are formed between the base member 30b and the chip ID 30c.

  The appropriate distance between the raised portion 302 of the outer peripheral portion of the base member and the chip ID 30c varies depending on the viscosity of the ink material used, the manner of application, the performance of the identification means, the lighting conditions, etc. It may be determined as appropriate.

  As described above, the substantially flat surface of the central portion 301 of the base member is not limited to a completely horizontal surface, and when the chip ID 30c is identified using reflected illumination, a portion where the dot portion of the chip ID 30c does not exist is represented by a dot portion. It is considered to be substantially flat, including a state where there is an inclination or unevenness to the extent that it is not mistakenly recognized.

  In the above description, the identification ID marking according to the present invention has been described by taking the chip ID 30c as an example. However, the wafer ID 30a can be similarly implemented and applied. Further, not only a two-dimensional code but also a unique ID constituted by using characters and symbols, that is, an identification code can be applied.

  Furthermore, when adding information indicating the characteristic unique to the semiconductor device 110 in addition to the unique ID as the identification code of the present invention, it can be handled as the identification code of the present invention and can be implemented in the same manner as described above. Thus, the present invention can be applied.

DESCRIPTION OF SYMBOLS 1 Marking apparatus 2 Stage part 3 Marking head part 4 Alignment camera part 4
DESCRIPTION OF SYMBOLS 9 Control part 10 Semiconductor wafer 10v Movement direction 11 Apparatus base 12 Support | pillar 13 Beam 21 X-axis stage 22 Y-axis stage 23 θ-axis motor 24 Table 30a Wafer ID
30b Base member 30c Chip ID
30d Base member 31 Ink material 31a Ejected ink material 31b Applied ink material 32 Liquid feeding unit 40 Camera 41 Illumination light quantity adjustment unit 90 Control computer 91 Information input means 92 Information display means 93 Reporting means 94 Information recording means 95 Device control unit 101 Alignment mark 102 Semiconductor chip 104 before cutting out Semiconductor chip 108 after cutting out Circuit pattern 109 Insulating layer 110 Semiconductor device 120 Database 301 Center part 302 of base member Swelling part 303 of base member Outer part of base member Inside the raised part of the club

Claims (11)

In a manufacturing process of a semiconductor device, after applying a base member for an identification code to a semiconductor wafer and marking the identification code on the base member, the semiconductor wafer is separated into semiconductor chips.
Applying a base member on the semiconductor wafer;
Applying and marking an identification code on the applied base member;
The method for marking an identification code, wherein the base member and the identification code are formed of the same material. The material used for forming the base member and the identification code includes a material that absorbs or reflects X-rays,
The identification code marking method according to claim 1. In order to increase the thickness of the identification code, the ink material that forms the identification code is further marked on the ink material that forms the identification code,
The identification code marking method according to claim 1. The base member has a shape in which the central part is substantially flat and the outer peripheral part is raised,
Inside the raised portion of the outer peripheral portion of the base member,
Marking the identification code,
The identification code marking method according to claim 1. An apparatus for applying a base member for an identification code on a semiconductor chip used in a semiconductor device and marking the identification code on the base member,
Means for applying a base member on the surface of the semiconductor chip;
On the applied the base member, and means for marking by applying an identification code,
An identification code marking device, wherein the base member and the identification code are formed of the same material. The material used for forming the base member and the identification code includes a material that absorbs or reflects X-rays,
The identification code marking device according to claim 5. In order to increase the thickness of the identification code, the ink material for forming the identification code is further overlaid on the ink material for forming the identification code, and marking means is provided.
The identification code marking device according to claim 5. The base member has a shape in which the central part is substantially flat and the outer peripheral part is raised,
Inside the raised portion of the outer peripheral portion of the base member,
A means for marking the identification code is provided,
The marking device for an identification code according to claim 5. A semiconductor device in which an identification code is marked inside the package,
A semiconductor chip constituting the semiconductor device;
A base member formed by coating on the semiconductor chip;
And having the identification code coated and marked from above the base member formed by coating ,
The semiconductor device, wherein the base member and the identification code are made of the same material. The material forming the base member and the identification code is:
Containing a material that absorbs or reflects X-rays,
The semiconductor device according to claim 9. The base member has a shape in which the central part is substantially flat and the outer peripheral part is raised,
Inside the raised portion of the outer peripheral portion of the base member,
The identification code is marked,
The semiconductor device according to claim 9.

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