JP5617612B2 - servo amplifier - Google Patents
servo amplifier Download PDFInfo
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- JP5617612B2 JP5617612B2 JP2010290246A JP2010290246A JP5617612B2 JP 5617612 B2 JP5617612 B2 JP 5617612B2 JP 2010290246 A JP2010290246 A JP 2010290246A JP 2010290246 A JP2010290246 A JP 2010290246A JP 5617612 B2 JP5617612 B2 JP 5617612B2
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- Prior art keywords
- regenerative resistor
- servo amplifier
- heat sink
- heat
- panel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Description
本発明は、各種産業機械の運転制御に使用する回生抵抗器内蔵型のサーボアンプに関し、詳しくは回生抵抗器の実装構造に関する。 The present invention relates to a servo amplifier with a built-in regenerative resistor used for operation control of various industrial machines, and more particularly to a mounting structure of a regenerative resistor.
周知のように、サーボアンプは回生電流を消費する回生抵抗器を備えている。この場合に、容量の大きなサーボアンプ，あるいはサーボモータの始動／停止制御を頻繁に繰り返すもののでは回生抵抗器の発熱量が大となることから、サーボアンプ本体とは別に外部回生抵抗器を用いているが、容量の低いサーボアンプでは回生抵抗器をサーボアンプ本体に搭載装備するようにしている（例えば、特許文献１参照）。 As is well known, the servo amplifier includes a regenerative resistor that consumes a regenerative current. In this case, if the servo amplifier with a large capacity or the servo motor start / stop control is repeated frequently, the heat generated by the regenerative resistor will be large, so use an external regenerative resistor separately from the servo amplifier body. However, in a servo amplifier with a low capacity, a regenerative resistor is mounted on the servo amplifier body (see, for example, Patent Document 1).
次に、本発明の出願人が製造した製品を例に、従来における回生抵抗器内蔵型のサーボアンプの組立構造を図４，図５に示す。まず、図４において、１は本体ケースの骨格をなすフレーム構造のヒートシンク（アルミダイカスト製）、１ａはヒートシンク１のフレーム後部に形成した取付台座、１ｂはフレーム側部に形成した放熱フィン、２はヒートシンク１に組合せて本体ケースを構成するケースカバー（モールド樹脂製）、３はケースカバー２の前面に配した制御用操作パネル、４は前記放熱フィン１ａに重ねてヒートシンク１の外側面に取り付けた回生抵抗器、５は放熱フィン１ｂに並置してヒートシンク１の側面に組み付けたファンであり、回生抵抗器４はヒートシンク１の放熱フィン１ｂとともにファン５により風冷冷却するようにしている。なお、ファン５に吸い込まれた外気は二手に分かれて放熱フィン１ｂを洗流した後、本体ケースの上方，および下方に向けて放流される。 Next, taking a product manufactured by the applicant of the present invention as an example, an assembly structure of a conventional servo amplifier with a built-in regenerative resistor is shown in FIGS. First, in FIG. 4, 1 is a heat sink (made of aluminum die casting) having a frame structure forming the skeleton of the main body case, 1a is a mounting base formed on the rear part of the frame of the heat sink 1, 1b is a heat radiation fin formed on the side of the frame, A case cover (made of molded resin) constituting the main body case in combination with the heat sink 1, 3 is a control operation panel arranged on the front surface of the case cover 2, and 4 is attached to the outer surface of the heat sink 1 so as to overlap the heat radiating fins 1 a. The regenerative resistor 5 is a fan juxtaposed to the heat radiating fin 1 b and assembled to the side surface of the heat sink 1, and the regenerative resistor 4 is cooled by the fan 5 together with the heat radiating fin 1 b of the heat sink 1. The outside air sucked into the fan 5 is divided into two hands and washed away from the heat radiating fins 1b, and then discharged toward the upper and lower sides of the main body case.
また、図示してないがサーボアンプの回路部品は回路基板に搭載してケースカバー１の内方に収容されており、このうち発熱の大きな回路部品であるパワー半導体モジュールはヒートシンク１の内面に直接マウントして発生熱をヒートシンクに伝熱して外部に放熱するようにしている。 Although not shown, the circuit components of the servo amplifier are mounted on the circuit board and housed inside the case cover 1. Among these, the power semiconductor module, which is a circuit component generating a large amount of heat, is directly on the inner surface of the heat sink 1. The heat generated is transferred to the heat sink to dissipate it to the outside.
一方、図５の製品例では、回生抵抗器４をケースカバー２の内方に収容配置し、前記のパワー半導体モジュールと同様にヒートシンク１の内面にマウントして回生抵抗器４の通電に伴う発生熱をヒートシンク１に伝熱して外部に放熱するようにしている。なお、図中で６はケースカバー２の内方に組み込んだ回路基板、７は回路基板６に実装した回路部品である。 On the other hand, in the product example of FIG. 5, the regenerative resistor 4 is accommodated and disposed inside the case cover 2, and is mounted on the inner surface of the heat sink 1 in the same manner as the power semiconductor module. Heat is transferred to the heat sink 1 to be radiated to the outside. In the figure, reference numeral 6 denotes a circuit board incorporated inside the case cover 2, and 7 denotes a circuit component mounted on the circuit board 6.
ところで、前記した従来製品における内蔵回生抵抗器の取り付け構造では次記のような問題点がある。すなわち、図４の実装構造では、サーボアンプの使用中にそのヒートシンク１の外側面に露呈している回生抵抗器４に誤って手を触れると、回生抵抗器４の高温発熱により火傷を負う危険がある。そのほか、図６のように複数台のサーボアンプを左右に並べて制御盤などの盤内取付板８に設置して使用すると、回生抵抗器４の発熱が隣接するサーボアンプの本体ケースに輻射伝熱し（図中の点線矢印）、このためにケースカバー２，およびその内部温度が上昇して回路部品７に熱的な悪影響を及ぼすほか、回生抵抗器４に焼損事故が生じて異常に過熱した状態になると、この高温を受けて隣接するサーボアンプのケースカバー（熱可塑性のプラスチック製）２が溶け出したり、周囲の可燃物に引火するおそれがある。そこで、従来は隣接するサーボアンプとの間の間隔Ａを十分に確保して配置するようにしているが、この間隔Ａを大きく確保するとサーボアンプの設置スペースが拡大して盤内のスペース効率が低下する。 By the way, the above-mentioned conventional regenerative resistor mounting structure has the following problems. That is, in the mounting structure of FIG. 4, if the hand is accidentally touched with the regenerative resistor 4 exposed on the outer surface of the heat sink 1 during use of the servo amplifier, there is a risk of burns due to the high temperature heat generation of the regenerative resistor 4. There is. In addition, when a plurality of servo amplifiers are arranged on the left and right as shown in FIG. 6 and installed on an in-panel mounting plate 8 such as a control panel, the heat generated by the regenerative resistor 4 is radiated to the main body case of the adjacent servo amplifier. (Dotted line arrow in the figure). For this reason, the case cover 2 and its internal temperature rise to cause a thermal detrimental effect on the circuit component 7, and the regenerative resistor 4 is overheated due to a burnout accident. If this happens, the case cover (made of thermoplastic plastic) 2 of the adjacent servo amplifier may be melted by this high temperature, or the surrounding combustible material may be ignited. Therefore, in the past, a sufficient space A between adjacent servo amplifiers was ensured, but if this space A was large enough, the installation space for the servo amplifier was expanded and the space efficiency in the panel was increased. descend.
また、図５の実装構造は回生抵抗器４が本体ケースの内部に収容されているので、運転中に外部から手が触れるおそれはないが、回生抵抗器４の発熱により本体ケースの内部温度が上昇して回路部品への熱的干渉が生じる問題がある。 In addition, since the regenerative resistor 4 is housed inside the main body case in the mounting structure of FIG. 5, there is no risk of touching from the outside during operation, but the internal temperature of the main body case is increased due to the heat generated by the regenerative resistor 4. There is a problem of rising and causing thermal interference with circuit components.
本発明は上記の点に鑑みなされたものであり、その目的は前記課題を解消して発熱した回生抵抗器に外部から人の手が直接触れるのを防止し、併せて本体ケース内部の回路部品，および盤内に並置した隣接サーボアンプに及ぼす熱的影響を低減化しつつ、回生抵抗器の発生熱をヒートシンクに伝熱して放熱できるように内蔵回生抵抗器の実装構造を改良した回生抵抗器内蔵型のサーボアンプを提供することにある。 The present invention has been made in view of the above points, and its object is to solve the above-mentioned problems and prevent a regenerative resistor that has generated heat from being directly touched by a human hand from the outside, and at the same time, a circuit component inside the main body case. Built-in regenerative resistor that improves the mounting structure of the built-in regenerative resistor so that the heat generated by the regenerative resistor can be transferred to the heat sink while reducing the thermal effect on adjacent servo amplifiers placed side by side in the panel The purpose is to provide a servo amplifier of the type.
上記目的を達成するために、本発明によれば、本体ケースの骨格をなすフレーム構造のヒートシンクにケースカバーを組合せて回路基板および回路部品を収容した構成になる回生抵抗器内蔵型のサーボアンプであって、前記ヒートシンクに形成した取付台座を介して当該サーボアンプを盤内に設置するようにしたものにおいて、前記ヒートシンクはそのフレーム側部に放熱フィン，フレーム後部に取付台座を形成し、前記取付台座の背面に凹所を形成し、この凹所内に回生抵抗器を伝熱的に取付けて格納する。 In order to achieve the above object, according to the present invention, a servo amplifier with a built-in regenerative resistor configured to accommodate a circuit board and circuit components by combining a case cover with a heat sink having a frame structure forming a skeleton of a main body case. there, in that through a mounting base formed on the heat sink so as to install the servo amplifier in the panel, said heat sink mounting base to form the heat radiating fin, the rear frame in the frame side, the mounting A recess is formed in the back surface of the pedestal, and a regenerative resistor is heat-transferred and stored in the recess.
上記構成によれば、次記効果を奏することができる。
（１）サーボアンプを盤内に据付けた使用状態では、回生抵抗器がヒートシンク後部の取付台座に形成した凹所内に格納して盤側の取付板との間に閉じ込められているので、外部から人の手が高温の回生抵抗器に触れて火傷を負う危険がなく、また回生抵抗器に焼損事故が万一発生しても周囲の可燃物に引火するおそれもなくて高い安全性を確保できる。
（２）また、回生抵抗器の発生熱はヒートシンクに伝熱し、その放熱フィンから外方に放熱されるので、回路部品を収容した本体ケースの内部温度上昇を防ぐことができる。
（３）さらに、複数台のサーボアンプを左右に並べて盤内に設置した使用状態でも、回生抵抗器の発熱が隣接サーボアンプに輻射伝熱することがなく、これによりサーボアンプ同士を近接配備して盤内の省スペース化が図れる。
According to the said structure, there can exist the following effect.
(1) When the servo amplifier is installed in the panel, the regenerative resistor is housed in a recess formed in the mounting base at the rear of the heat sink and is confined between the mounting plate on the panel side. There is no danger of burns caused by human hands touching the high temperature regenerative resistor, and even if a burnout accident occurs in the regenerative resistor, there is no risk of flammable surrounding combustibles ensuring high safety. .
(2) Moreover, since the heat generated by the regenerative resistor is transferred to the heat sink and radiated outward from the radiating fins, an increase in the internal temperature of the main body case containing the circuit components can be prevented.
(3) Furthermore, even when multiple servo amplifiers are placed side by side and installed in the panel, the heat generated by the regenerative resistor does not radiate heat to adjacent servo amplifiers. The space inside the board can be saved.
以下、本発明の実施の形態を図１〜図３に示す実施例に基づいて説明する。なお、実施例の図中で図４〜図６に対応する部材には同じ符号を付してその説明は省略する。
図示実施例のサーボアンプの本体ケースは、基本的に図４に示した従来構造と同様であるが、その本体ケースに内蔵する回生抵抗器４が次記のようにヒートシンク１に実装されている。すなわち、図１で示すように本体ケースの骨格をなすアルミダイカスト製のヒートシンク１には、そのフレーム後部の取付台座１ａに背面側に開放した凹所１ｃを形成し、この凹所１ｃの中に回生抵抗器４を格納している。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below based on the examples shown in FIGS. In addition, in the figure of an Example, the same code | symbol is attached | subjected to the member corresponding to FIGS. 4-6, and the description is abbreviate | omitted.
The main body case of the servo amplifier of the illustrated embodiment is basically the same as the conventional structure shown in FIG. 4, but the regenerative resistor 4 built in the main body case is mounted on the heat sink 1 as described below. . That is, as shown in FIG. 1, the aluminum die-cast heat sink 1 that forms the skeleton of the main body case is provided with a recess 1c that is open to the back side on the mounting base 1a at the rear of the frame, and the recess 1c The regenerative resistor 4 is stored.
ここで、回生抵抗器４は前記凹所１ｃの底壁へ伝熱的に重ねてねじ止めされており、回生抵抗器４のリード線４ａは凹所１ａの周壁に開口した穴を通してケースカバー２の内方に引出すようにしている。そして、このサーボアンプを制御盤の盤内に設置するには、図２のようにヒートシンク１の取付台座１ａを盤内に布設した取付板８の前面に重ねてボルト締結する。 Here, the regenerative resistor 4 is heat-transferred and screwed to the bottom wall of the recess 1c, and the lead wire 4a of the regenerative resistor 4 passes through a hole opened in the peripheral wall of the recess 1a. I'm trying to pull it inward. In order to install the servo amplifier in the panel of the control panel, the mounting base 1a of the heat sink 1 is overlapped on the front surface of the mounting plate 8 installed in the panel as shown in FIG.
このサーボアンプの設置状態では、回生抵抗器４がヒートシンク１の取付台座１ａに形成した凹所１ｃの中に閉じ込められて外方に露呈することがなく、したがって外部から高温の回生抵抗器４に人の手が触れるおそれはない。また、回生抵抗器４の通電に伴う発生熱は、ヒートシンク１の取付台座１ｃに伝熱し、放熱フィン１ｂを介して外方に放熱される。これにより、回生抵抗器４の発熱による本体ケースの内部温度上昇が抑えられるとともに、ケースカバー２の内方に収容した回路部品に及ぼす熱的影響も十分に低減できる。 In the installation state of the servo amplifier, the regenerative resistor 4 is confined in the recess 1c formed in the mounting base 1a of the heat sink 1 and is not exposed to the outside, so that the high temperature regenerative resistor 4 is externally exposed. There is no danger of human touch. Further, the heat generated by energization of the regenerative resistor 4 is transferred to the mounting base 1c of the heat sink 1 and is radiated to the outside through the radiation fins 1b. As a result, an increase in the internal temperature of the main body case due to the heat generated by the regenerative resistor 4 can be suppressed, and the thermal influence on the circuit components housed inside the case cover 2 can be sufficiently reduced.
さらに、図３で示すように複数台のサーボアンプを左右に並べて制御盤などの盤内取付板８に設置した使用状態でも、図６のように回生抵抗器４の発生熱が隣接するサーボアンプに輻射伝熱してそのケース内部の温度を高めることがない。これにより、サーボアンプ同士を近接配置して盤内の省スペース化が図れる。 Further, as shown in FIG. 3, even in a use state in which a plurality of servo amplifiers are arranged on the left and right sides and installed on an in-panel mounting plate 8 such as a control panel, the servo amplifiers in which the heat generated by the regenerative resistor 4 is adjacent as shown in FIG. It does not radiate heat and raise the temperature inside the case. As a result, the servo amplifiers can be arranged close to each other to save space in the panel.
また、サーボアンプを設置した状態では、回生抵抗器４はヒートシンク１に形成した凹所１ａと盤内取付板８によって周囲が金属で囲まれることになるので、万一に回生抵抗器４が破損して火花が飛散しても、周囲に引火する危険性は低く、高い安全性を確保することができる。 Further, in the state where the servo amplifier is installed, the regenerative resistor 4 is surrounded by metal by the recess 1a formed in the heat sink 1 and the in-panel mounting plate 8, so that the regenerative resistor 4 is damaged by any chance. Even if sparks are scattered, the risk of igniting the surroundings is low, and high safety can be ensured.
さらに、回生抵抗器４の発熱は、放熱フィン１ｂからの放熱以外にも盤内取付板８を介して放熱されることにより、本体ケースの内部温度の上昇を防止することができる。 Further, the heat generated by the regenerative resistor 4 is radiated through the in-panel mounting plate 8 in addition to the heat radiated from the heat radiating fins 1b, thereby preventing the internal temperature of the main body case from rising.
１ ヒートシンク
１ａ 取付台座
１ｂ 放熱フィン
１ｃ 凹所
２ ケースカバー
４ 回生抵抗器
５ ファン
７ 回路部品
DESCRIPTION OF SYMBOLS 1 Heat sink 1a Mounting base 1b Radiation fin 1c Recess 2 Case cover 4 Regenerative resistor 5 Fan 7 Circuit parts
Claims (1)
前記ヒートシンクはそのフレーム側部に放熱フィン，フレーム後部に取付台座を形成し、前記取付台座の背面に凹所を形成し、この凹所内に回生抵抗器を伝熱的に取付けて格納することを特徴とするサーボアンプ。 A servo amplifier with a built-in regenerative resistor in which a circuit board and circuit components are accommodated by combining a case cover with a heat sink having a frame structure that forms a skeleton of the main body case, and is connected via a mounting base formed on the heat sink. In the servo amplifier installed in the panel,
The heat sink has a heat radiating fin on the side of the frame and a mounting base on the rear of the frame , a recess is formed on the back of the mounting base, and a regenerative resistor is mounted in the recess and stored in a heat transfer manner. Servo amplifier features.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010290246A JP5617612B2 (en) | 2010-12-27 | 2010-12-27 | servo amplifier |
| CN 201220421770 CN202841781U (en) | 2010-12-27 | 2011-12-27 | Servo amplifier |
| CN 201120553657 CN202603115U (en) | 2010-12-27 | 2011-12-27 | Servo amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010290246A JP5617612B2 (en) | 2010-12-27 | 2010-12-27 | servo amplifier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012138485A JP2012138485A (en) | 2012-07-19 |
| JP5617612B2 true JP5617612B2 (en) | 2014-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010290246A Active JP5617612B2 (en) | 2010-12-27 | 2010-12-27 | servo amplifier |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6944251B2 (en) * | 2017-02-27 | 2021-10-06 | 川崎重工業株式会社 | control panel |
| JP7106269B2 (en) * | 2017-12-19 | 2022-07-26 | 日本電産サンキョー株式会社 | motor controller |
| WO2019198161A1 (en) | 2018-04-10 | 2019-10-17 | 三菱電機株式会社 | Motor drive device |
| JP2021048300A (en) * | 2019-09-19 | 2021-03-25 | オムロン株式会社 | Servo driver |
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| JP4496403B2 (en) * | 2001-04-27 | 2010-07-07 | 三菱電機株式会社 | control panel |
| JP2008140803A (en) * | 2006-11-30 | 2008-06-19 | Fuji Electric Fa Components & Systems Co Ltd | Heat sink |
| US7902957B2 (en) * | 2007-04-30 | 2011-03-08 | Rockwell Automation Technologies, Inc. | Phase change cooled electrical resistor |
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