JP5587227B2 - Inkjet head electrical connection structure, electrical connection method, and inkjet head manufacturing method - Google Patents

Description

  The present invention relates to an electrical connection structure for an inkjet head, an electrical connection method, and a method for manufacturing an inkjet head, and more particularly, an electrical connection structure for an inkjet head that electrically connects a wiring on a substrate side and a tip on the support member side using a support member. The present invention relates to an electrical connection method and an inkjet head manufacturing method.

  2. Description of the Related Art Conventionally, a connection structure that performs electrical connection using a flexible flexible substrate is known. For electrical connection, a plate-like member having a flexible substrate attached to a support member is electrically connected to the wiring formed on the flow path substrate side through the wiring member holding hole. At this time, if the support member is inserted obliquely, positional displacement occurs, and electrical connection can be made to one side of the wiring formed on both sides of the support member, but the flexible substrate floats on the other side, resulting in high Due to this, there was a problem that electrical connection could not be made without contact.

  In order to solve such a problem, for example, the following Patent Document 1 includes a flexible wiring board connected to a lead electrode and a support member to which the wiring board is connected. It is described that a buffer member (Teflon (registered trademark)) is provided and pressed evenly. Further, Patent Document 2 describes that electrical connection is made with an uneven fitting portion.

JP 2009-255516 A JP 2006-281863 A

  However, the liquid jet head described in Patent Document 1 can cope with the roughness of the surface by providing the buffer member, but the support member is inclined and the distance between the terminals to be connected is increased. It was difficult to respond. If the connection is forced, it is necessary to apply an excessive load on one side and crush it, which may destroy the flow path substrate itself. Patent Document 2 does not discuss a problem corresponding to the inclination of the support member.

  The present invention has been made in view of such circumstances, and an electrical connection structure and an electrical connection method for an ink jet head capable of reliably electrically connecting the wiring on the flow path forming substrate side and the wiring on the tip on the support member side. And it aims at providing the manufacturing method of an inkjet head.

In order to achieve the above object, the present invention provides a liquid discharge port through which liquid is discharged, a pressure chamber forming substrate constituting a pressure chamber communicating with the liquid discharge port, and the liquid discharge port of the pressure chamber forming substrate. An energy generating element provided on the opposite side, a recess structure is provided on the energy generating element side of the pressure chamber forming substrate, one end is connected to the energy generating element, and the other end The part is bonded to the side surface in the concave structure and the substrate wiring disposed on the bottom surface , the side surface of the supporting member , and the surface in contact with the pressure chamber forming substrate to form a supporting member wiring pattern. An electrical connection structure for an ink-jet head is provided, wherein the electrical connection structure is brought into contact with and electrically connected to the flexible substrate.

According to the present invention, when the concave portion is provided in the pressure chamber forming substrate and the wiring is also formed in the concave portion, the support member provided with the flexible substrate is inserted vertically with respect to the pressure chamber forming substrate. Connected to the wiring on both sides as usual. In addition, when the support member is inserted obliquely, by connecting a part of the tip of the support member to the concave portion on the pressure chamber forming substrate, the wiring on the other side can also be connected obliquely. The wiring of the flexible board on both sides can be reliably connected.
Further, by providing the flexible substrate on the side surface and tip of the support member and the substrate wiring on the side surface and bottom surface in the recess structure, electrical connection can be made at any location even when the support member is inserted obliquely.

  In addition, as an energy generation element, various energy generation elements, such as a piezoelectric element, a heater (heating element) in a thermal system, and various actuators, such as an electrostatic actuator, can be used.

  In the present invention, it is preferable that at least a part of the flexible substrate is connected to the substrate wiring in the recess structure.

  According to the present invention, since the recess is formed in the pressure chamber forming substrate, when the support member is inserted obliquely, it can be arranged so that at least a part of the flexible substrate is connected to the wiring inside the recess, Since the other flexible substrate can also be electrically connected to the edge portion or the wiring provided outside the recessed portion, it can be reliably connected electrically.

  In the present invention, it is preferable that a linear or curved taper shape is formed on at least one of the tip of the support member and the concave structure of the pressure chamber forming substrate.

  According to the present invention, since at least one of the tip of the support member and the recess of the pressure chamber forming substrate is tapered, reliable electrical connection can be achieved even if the support member is tilted. In addition, alignment is possible.

  In the present invention, it is preferable that the shape of the recess structure formed on the pressure chamber forming substrate substantially matches the shape of the tip of the support member.

  According to the present invention, the contact area at the time of electrical connection can be increased by making the shape of the concave structure and the shape of the tip of the support member substantially the same shape.

  In the present invention, it is preferable that the tip of the support member has an R shape that protrudes outward, and the concave structure of the pressure chamber forming substrate has a tapered shape.

  According to the present invention, the support member is inserted into the recess structure even if the inclination of the support member increases because the support member has an R shape with the tip protruding outward and the recess structure of the pressure chamber forming substrate has a tapered shape. It is possible to make an electrical connection reliably. Further, alignment can be easily performed.

  In the present invention, it is preferable that a resin layer is provided between the pressure chamber forming substrate and at least a part of the substrate wiring, and the concave structure is formed in the resin layer.

  According to the present invention, since the resin layer is provided at least on the electrical connection portion on the pressure chamber forming substrate and the concave structure is formed in the resin layer, the concave structure can be easily formed.

  In the present invention, it is preferable that an abutting portion is provided on one of the longitudinal ends of the concave structure of the pressure chamber forming substrate, and the support member is brought into contact with the abutting portion to align in the longitudinal direction.

  According to the present invention, the longitudinal end of the support member can be aligned by using the end in the longitudinal direction of the concave structure formed in the pressure chamber forming substrate as the abutting portion of the support member.

  In the present invention, it is preferable that the abutting portion is provided in a tapered shape at an end portion in the longitudinal direction of the concave structure.

  When the concave structure is formed by, for example, anisotropic wet etching of Si, a tapered shape is formed not only on the side surface portion of the concave portion but also on the front surface and the back surface portion. According to the present invention, by separately providing an abutting portion in the tapered shape, the longitudinal alignment can be performed by bringing the support member into contact with the abutting portion.

  In the present invention, it is preferable that a pin is provided at the tip of the support member, and a position determining hole corresponding to the pin is provided in the concave structure of the substrate.

  According to the present invention, the pin is provided at the tip of the support member, and the position determining hole corresponding to the pin is provided in the concave structure of the pressure chamber forming substrate. Therefore, the support member and the pressure chamber forming substrate can be aligned by connecting the support member so that the pin and the position determining hole fit.

  In the present invention, it is preferable to use conductive particles for connection between the flexible substrate and the electrical connection portion.

  When the support member is inserted obliquely, the flexible substrate and the wiring are in line contact with each other in the longitudinal direction, so there is a concern that the contact area is reduced and the connection reliability is lowered. According to the present invention, by using conductive particles for connection, the number of contact points for electrical connection can be increased, and the connection reliability can be increased.

In order to achieve the above object, the present invention provides a liquid discharge port through which liquid is discharged, a pressure chamber forming substrate constituting a pressure chamber communicating with the liquid discharge port, and the liquid discharge port of the pressure chamber forming substrate. An energy generating element provided on the opposite side, a recess structure is provided on the energy generating element side of the pressure chamber forming substrate, one end is connected to the energy generating element, and the other end The part is bonded to the side surface in the concave structure and the substrate wiring disposed on the bottom surface , the side surface of the supporting member , and the surface in contact with the pressure chamber forming substrate to form a supporting member wiring pattern. An inkjet head electrical connection method is provided, wherein the flexible substrate is joined by bringing the tip of the support member into contact with the recess structure.

  According to the present invention, since the tip of the support member and the concave structure are brought into contact with each other, even if the support member is inserted obliquely, electrical connection is made at the side of the support member, the side surface of the concave structure, etc. And electrical connection can be made reliably.

The present invention, in order to achieve the above object, provides a method of manufacturing an ink jet head, which comprises using an electrical connection method of the ink jet head described above.

  According to the present invention, since electrical connection can be reliably performed, it can be suitably used as a method for manufacturing an inkjet head.

  According to the electrical connection structure of the ink jet head of the present invention, the flow path forming substrate is provided with a recessed portion formed inside, and the flexible substrate and a part of the wiring are connected in the recessed portion, so that the other flexible The substrate can also be electrically connected, and both sides can be reliably electrically connected. Therefore, even if the support member is inserted obliquely, electrical connection can be ensured and alignment can be performed.

It is sectional drawing which shows the electrical connection structure of an inkjet head. It is a figure explaining the example of the connection structure in which the supporting member was inserted diagonally. It is a figure explaining other embodiment of the composition of a crevice. It is a figure explaining other embodiment of composition of a crevice. It is a figure explaining the positioning method of a supporting member. It is a figure explaining the other alignment method of a supporting member.

  Hereinafter, preferred embodiments of an electrical connection structure, an electrical connection method, and an inkjet head manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings.

  First, the structure of an inkjet head according to an application example of the invention will be described. FIG. 1 is a cross-sectional view of the liquid discharge head. The liquid discharge head 10 includes a nozzle substrate 14 having a nozzle opening 12, a pressure chamber forming substrate 18 which is bonded to the upper surface of the nozzle substrate 14 and forms a partition portion 17 of the pressure chamber 16, and the pressure chamber formation. A diaphragm 20 joined to the upper surface of the substrate 18, a piezoelectric element 22 joined to the upper surface of the diaphragm 20, and an upper space (displacement space) of the piezoelectric element 22 while securing an upper portion of the piezoelectric element 22. A support member 62 having a reservoir forming substrate 26 that forms the reservoir 24 and a flexible substrate 60 for electrical connection with the piezoelectric element 22 is provided.

  A plurality of pressure chambers 16 formed so as to correspond to the plurality of nozzle openings 12 are formed by a space surrounded by the partition wall portion 17 by the pressure chamber forming substrate 18, the nozzle substrate 14, and the vibration plate 20. The

  The reservoir 24 is a liquid chamber that temporarily holds (stores) the liquid introduced from the liquid inlet 32 connected to a liquid tank (not shown), and the liquid is supplied from the reservoir 24 to each pressure chamber 16. That is, the reservoir 24 serves as a common liquid holding chamber (common liquid chamber) for the plurality of pressure chambers 16.

  A communication part 36 communicating with the reservoir part 34 formed by the reservoir forming substrate 26 and an individual supply path 38 for guiding the liquid from the reservoir 24 to each pressure chamber 16 through the communication part 36 are formed by the pressure chamber forming substrate 18. Is done.

  The diaphragm 20 that covers the upper surface of the pressure chamber forming substrate 18 includes an elastic film 42 facing the pressure chamber 16 and a lower electrode 44 provided on the upper surface of the elastic film 42. The lower electrode 44 functions as a common electrode for the plurality of piezoelectric elements 22 corresponding to each pressure chamber 16. In this example, the diaphragm 20 having a structure in which the lower electrode 44 is superimposed on the elastic film 42 is used. Instead of such a configuration, the elastic film 42 is formed by using a metal diaphragm. It is possible to adopt a structure that is omitted and a diaphragm that also serves as a common electrode.

  The piezoelectric element 22 includes a piezoelectric film 46 provided on the upper surface of the lower electrode 44, and an upper electrode 48 provided on the upper surface of the piezoelectric film 46. That is, the piezoelectric element 22 is configured by the lower electrode 44, the upper electrode 48, and the piezoelectric film 46 interposed between the two electrode films. The piezoelectric element 22 is provided for each pressure chamber 16, and the upper electrode 48 functions as an individual electrode of each piezoelectric element 22.

  In the reservoir forming substrate 26, a region facing the piezoelectric element 22 is provided with a piezoelectric element holding portion 50 that can seal the space while ensuring a space that does not hinder the movement of each piezoelectric element 22. Yes. Thus, the reservoir forming substrate 26 functions as a sealing member for sealing the piezoelectric element 22 by blocking the piezoelectric element 22 from the external environment.

  Of the piezoelectric elements 22 sealed by the piezoelectric element holding part 50, one end of the upper electrode 48 extends to the outside of the piezoelectric element holding part 50, and is a connection for wiring connection of the flexible substrate 60. It is a terminal part (electrode lead-out part). In FIG. 1, the upper electrode 48 is extended to form wiring, but other methods, for example, a lead electrode made of, for example, gold (Au) or the like is connected on the upper electrode, Can be extended outside the piezoelectric element holding portion 50 to form a connection terminal portion.

  The reservoir forming substrate 26 is provided with a through hole 64 that penetrates the reservoir forming substrate 26 in the thickness direction. The through hole 64 is provided between the piezoelectric element holding portions 50 in the present embodiment. The end portion of the upper electrode 48 drawn out from each piezoelectric element 22 is provided so as to be exposed in the through hole 64.

  The flexible substrate 60 that is electrically connected to the piezoelectric element 22 has a lower end connected to the upper electrode 48 and is raised substantially vertically and bonded to the side surface of the support member 62. In the present embodiment, a wiring board is constituted by the support member 62, the flexible board 60, and a drive circuit (not shown).

  Further, as shown in FIG. 1, a compliance substrate 70 including a sealing film 66 and a fixing plate 68 is bonded onto the reservoir forming substrate 26. Here, the sealing film 66 is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide (PPS) film), and one surface of the reservoir 24 is sealed by the sealing film 66. The fixing plate 68 is made of a hard material such as metal (for example, stainless steel (SUS)). Since the region of the fixing plate 68 facing the reservoir 24 is an opening 72 that is completely removed in the thickness direction, one surface of the reservoir 24 is sealed only with a flexible sealing film 66. Has been.

  Further, a head case 74 that is a holding member is provided on the compliance substrate 70. The head case 74 is provided with an ink introduction path that communicates with the ink introduction port and supplies ink from ink storage means such as a cartridge to the reservoir 24. The head case 74 is formed with a recess in a region facing the opening 72 so that the deflection of the opening 72 is appropriately performed. Further, the head case 74 is provided with a wiring member holding hole 78 communicating with the through hole 64 provided in the reservoir forming substrate 26, and the wiring member is inserted into the wiring member holding hole 78 to be the upper electrode 48. Connected with. The support member 62 inserted into the wiring member holding hole 78 of the head case 74 is bonded to the head case 74 via an adhesive 80.

  As shown in FIG. 1, the partition portion 17 of the pressure chamber forming substrate 18 has a concave shape at a location where the flexible substrate 60 attached to the support member 62 is connected to the pressure chamber forming substrate (flow path forming substrate) 18. Is formed. Further, the upper electrode 48 that is a connection portion with the flexible substrate is connected to the inside of the recess 82. When the support member 62 is inserted vertically by being formed in a concave shape, it is connected to the upper electrode 48. When the support member is inserted to be inclined with respect to the pressure chamber forming substrate 18, as shown in FIG. 2, either one of the flexible substrates 60 attached to both sides of the support member 62 is connected to the upper electrode in the recess 82. 48 is connected. The other flexible substrate can also be bonded to the flexible substrate 60 inside the recess 82 or at the edge portion, so that the flexible substrates on both sides can be reliably electrically bonded.

  FIG. 2 shows an example of the shape of the tip (electrical connection portion) of the support member and the flow path substrate side recess 82. 2, 3, 5, and 6, only the pressure chamber forming substrate 18 and the upper electrode 48 are shown and described in order to simplify the configuration.

  2A and 2B illustrate a pressure chamber forming substrate (hereinafter, also simply referred to as “substrate”) having a concave portion 82 and a support member 62 having a quadrilateral shape, and FIG. When the tip of the support member 62 is thicker, (b) shows the case where the tip of the support member 62 is narrower than the recess 82. In FIG. 2C, the concave portions 82 of the substrate and the tips of the support members 62 are trapezoidal. Further, the concave portions 82 and the tips of the supporting members 62 of the substrate shown in FIG. In any shape, the edge portion at the tip of the support member 62 or the edge portion of the concave portion 82 of the substrate can be connected to the other wiring. In FIG. 2E, the concave portions 82 of the substrate and the tips of the support members 62 have an R shape. By setting it as R shape, the board | substrate recessed part 82 and the front-end | tip of the supporting member 62 can be made to contact in any position.

  2A to 2E, the shape of the recess 82 of the substrate and the shape of the tip of the support member 62 are the same, but the present invention is not limited to this, and the shape of the substrate recess 82 is illustrated. It is also possible to configure the tip of the support member 62 to have a different shape. As such a configuration, for example, as shown in FIG. 2 (f), the shape of the substrate recess 82 can be a trapezoid, and the tip of the support member 62 can be an R shape.

  The electrical connection portion has either the tip of the support member 62 (electrical connection portion) and the shape of the concave portion 82 of the substrate, or both have an R shape, or a tapered shape in which the concave portion 82 side of the substrate extends toward the opening. It is preferable. By making either one of the R shape or the shape having an inclined surface, electrical connection can be made even if the support member 62 has a large inclination.

  The shape of the tip of the support member 62 and the concave portion 82 of the substrate is preferably an R shape having the same curvature. By making it R shape with the same curvature, while being able to respond | correspond to the inclination of the supporting member 62, a contact area can be increased. However, since it is difficult to create an R shape having the same curvature with a concave portion as an R shape, the substrate 18 side is formed as a concave portion having an inclined surface as shown in FIG. The tip may have an R shape. By making the shape of the tip of the support member 62 or the shape of the concave portion 82 of the substrate R-shaped, it is possible to prevent the wiring from being cut due to a step or the like.

  Further, as shown in FIG. 2G, the shape of the tip of the support member 62 may be a combination of a trapezoid and an R shape. By adopting such a shape, the shape of the recess 82 on the substrate 18 side can also be reduced, so that the effect of being able to be electrically connected even if the alignment and the support member are tilted is maintained while maintaining the effect of the inkjet head. The dimensions can be reduced.

  As described above, the shape of the tip of the support member and the shape of the concave portion of the substrate have been described with specific examples. However, the present invention is not limited to these, and the dimensional accuracy of processing and the accuracy of inclination at the time of connection so that electrical connection can be made. In consideration of the above, it is necessary to design the shape and size of the substrate recess, the shape and size of the tip of the support member, and the shape and size of the wiring.

[Method of forming recesses]
The method for forming the recess is not particularly limited, and can be formed, for example, by etching, particularly wet etching utilizing anisotropy. When SiO ₂ is used as the material of the vibration plate 20, SiO ₂ is patterned only in a portion where the concave portion of the pressure chamber forming substrate 18 is not formed, and the concave portion is formed in the pressure chamber forming substrate 18 using the vibration plate 20 as a mask. can do. When both the pressure chamber forming substrate 18 and the vibration plate 20 are made of Si, the pressure chamber forming substrate 18 and the vibration plate 20 may be etched at the same time after the vibration plate 20 is formed on the pressure chamber forming substrate 18. . In this case, it is necessary to provide an insulating layer such as thermally-oxidized SiO ₂ or resin by spray coating on the lower layer of the lower electrode 44.

  Thereafter, the piezoelectric film 46 is formed by a sol-gel method or a sputtering method, and a metal (upper electrode 48) to be a wiring is formed by a sputtering method or the like. Since there is a step due to the recess, the patterning of the wiring can be performed by spray-coating a resist, exposing and developing, etching the wiring, and if necessary, increasing the thickness of the wiring by plating.

  As another method for forming the recesses, as shown in FIG. 3, a resin layer 84 is formed on the diaphragm 20, a recess 86 is formed in the resin layer 84, and wiring (upper electrode) is formed on the resin layer 84. 48) can also be formed. The concave portion 86 can be formed by using a photosensitive resist material for the resin layer 84, adjusting exposure and development conditions, or forming a tapered concave portion 86 using a gray mask. Furthermore, as another method, it is also possible to form the recesses by bonding separately processed resin sheet materials. When the resin sheet material 85 is bonded, as shown in FIG. 4, the resin sheet material 85 is not provided between the pressure chamber forming substrate 18 and the piezoelectric element 22, and the resin sheet is placed on the pressure chamber forming substrate 18. It is preferable to form the recess 86 by providing the material 85 and forming the wiring (upper electrode) 48 thereon. This is because if the sheet material 85 is present under the piezoelectric element 22, the deformation of the piezoelectric element 22 is reduced and the efficiency is deteriorated.

  The piezoelectric element 22 (the lower electrode 44, the piezoelectric film 46, and the upper electrode 48) can be manufactured by a method similar to the conventional method. In addition, as a method for forming a wiring in the concave portion, it is also possible to form a wiring in the step portion using an ink jet.

  As the material of the support member 62, a material having a thermal expansion coefficient close to or equal to that of the pressure chamber forming substrate 18 can be used. For example, if the material of the pressure chamber forming substrate 18 is Si, the material of the support member 62 is preferably Si or invar having a thermal expansion coefficient close to that.

  The support member 62 is preferably formed of a material having a linear expansion coefficient equivalent to that of the head case 74 that is a holding member. For example, stainless steel Si can be used. By using a material having a similar linear expansion coefficient between the support member 62 and the head case 74, when the ink jet head expands / contracts due to heat, warpage or breakage due to a difference in the linear expansion coefficient between the head case 74 and the support member is prevented. Can be prevented. Further, if materials having different linear expansion coefficients are used, it is considered that the support member presses the pressure chamber forming substrate 18 and cracks are generated in the pressure chamber forming substrate 18.

  As a material of the flexible substrate 60 to be attached to the support member 62, polyimide is used. NCP (Insulating Paste), NCF (Insulating Film), ACP (Anisotropic Conductive Paste), ACF (ACF (Electrical Conductive Paste)) are used for the electrical connection for connecting the wiring formed on the flexible substrate and the wiring formed on the pressure chamber forming substrate. An anisotropic conductive film), a solder bump, or the like can be used. As for these materials, NCP and ACP are applied to the electrical connection portion before connection, and NCF and ACF sheet-like materials can be attached to the electrical connection portion. Solder bumps can be used by forming them on the electrical connection portion.

  Furthermore, it is preferable to use ACP or ACF containing conductive particles so as to cope with the surface roughness. By using ACP or ACF containing conductive particles, when the support member 62 and the pressure chamber forming substrate 18 come into contact with each other, the conductive particles are crushed and electrical connection can be made. In the present invention, in particular, when the support member 62 is inserted obliquely, the contact area between the flexible substrate 60 on the support member 62 side and the upper electrode 48 on the pressure chamber forming substrate 18 side becomes small. Since it is only in the depth direction in the figure, it is considered that there may be a line contact. By including conductive particles, the number of contact points for electrical connection can be increased, so that the reliability of connection can be increased.

  In the figure, one flexible substrate 60 is provided on each side surface of the support member 62, but there is no particular limitation, and a flexible substrate may be provided only on one side surface, and two or more flexible substrates may be provided on both sides. A substrate 60 can also be provided. Also, a single continuous substrate can be used for the flexible substrates on both sides. When one piece is provided on each side surface of the support member, it is necessary to determine the position of the wiring on each side surface. By using a single continuous substrate, such positioning is not performed. Can be manufactured.

  The support member 62 and the head case 74 can be connected by adhering the head case 74 and the support member 62 via an adhesive in an area where the holding opening of the flexible substrate 60 is provided. The case 74 may be bonded. Further, the space between the reservoir forming substrate 26 and the support member 62 may be molded with a molding material.

  In FIG. 1, two rows in which the pressure chambers 16 are provided on the pressure chamber forming substrate 18 are provided, but the number of rows in this case is not particularly limited. There may be one row or three or more rows. In the case of a plurality of rows, at least two rows may be provided so as to face each other.

  Further, when the support member 62 is made of a conductive material, the support member 62 may be grounded. By grounding the support member 62, noise generated from the drive circuit or the like can be shielded, and inhibition of the drive signal or the like due to noise can be suppressed. Further, by grounding the support member 62, it is possible to reduce the occurrence of noise due to floating metal when the inkjet head is moved.

[Positioning of support member]
When a concave portion is formed on the pressure chamber forming substrate 18 by, for example, Si anisotropic wet etching, a tapered shape is also formed in the depth direction of FIG. 1 as shown in FIG. Therefore, as shown in FIG. 5, a pin 90 is provided at the tip of the support member 62, and a position determining hole 92 corresponding to the pin 90 is also provided in the recess 82 on the pressure chamber forming substrate 18 side. When the wiring is connected, the pin 90 is fitted to the position determining hole 92, whereby the support member 62 and the pressure chamber forming substrate 18 can be positioned in the longitudinal direction (left and right direction in FIG. 5B). However, since the support member 62 may be inclined, the position determining hole 92 formed in the pressure chamber forming substrate 18 is arranged in the width direction so that the pin 90 and the position determining hole 92 are fitted even when the support member 62 is inclined. It is preferable that the shape has a sufficient margin. The number of pins 90 may be one or plural, and the position to be provided is provided only at one place in FIG. 5B, but it may be provided at one place or plural places. Further, by providing a hole corresponding to the pin 90 in the flexible substrate 60, it is also possible to use it for positioning the support member 62 and the flexible substrate 60.

  FIG. 6 shows another correspondence of the alignment of the support member 62. As shown in FIG. 6A, the support member 62 is positioned in the depth direction by placing a butting member 94 in the recess formed by anisotropic etching when the recess 82 is formed. Positioning can be performed by applying the support member 62 to 94. In addition, as shown in FIG. 6B, when the concave portion 82 is formed by a method in which the tapered portion is not formed, the end portion of the concave portion 82 can be used for positioning as an abutting position.

  DESCRIPTION OF SYMBOLS 10 ... Liquid discharge head, 12 ... Nozzle opening part, 14 ... Nozzle board | substrate, 16 ... Pressure chamber, 17 ... Partition part, 18 ... Pressure chamber formation board, 20 ... Vibration plate, 22 ... Piezoelectric element, 24 ... Reservoir, 26 ... Reservoir forming substrate 32 ... Liquid introduction port 34 ... Reservoir part 36 ... Communication part 38 ... Individual supply path 42 ... Elastic film 44 ... Lower electrode 46 ... Piezoelectric film 48 ... Upper electrode 50 ... Piezoelectric Element holding part, 60 ... flexible substrate, 62 ... support member, 64 ... through-hole, 66 ... sealing film, 68 ... fixing plate, 70 ... compliance substrate, 72 ... opening, 74 ... head case, 78 ... wiring member holding Hole, 80 ... Adhesive, 82, 86 ... Recess, 84 ... Resin layer, 85 ... Sheet material, 90 ... Pin, 92 ... Position determining hole, 94 ... Abutting member

Claims (12)

A liquid discharge port through which liquid is discharged, a pressure chamber forming substrate constituting a pressure chamber communicating with the liquid discharge port, an energy generating element provided on the opposite side of the pressure discharge port of the pressure chamber forming substrate, Have
A concave structure is provided on the energy generating element side of the pressure chamber forming substrate,
One end is connected to the energy generating element, the other end is a side surface in the concave structure , and a substrate wiring disposed on the bottom surface ,
A flexible substrate bonded to the side surface of the support member and the surface in contact with the pressure chamber forming substrate, and a pattern of the support member wiring is formed;
An electrical connection structure for an ink jet head, wherein:   2. The electrical connection structure for an ink jet head according to claim 1, wherein at least a part of the flexible substrate is connected to a substrate wiring in the recess structure. 3. The inkjet head according to claim 1, wherein a linear or curved taper shape is formed on at least one of the tip of the support member and the concave structure of the pressure chamber forming substrate. Electrical connection structure. Wherein the shape of the recess structure formed in the pressure chamber formation substrate, wherein the supporting member electrically connecting structure of the ink-jet head according to any one of claims 1 to 3, characterized in that substantially conforms to the shape of the tip of the . The inkjet head according to any one of claims 1 to 3 , wherein a tip of the support member has an R shape that is convex outward, and a concave structure of the pressure chamber forming substrate is a tapered shape. Electrical connection structure. Said pressure chamber forming substrate, said having at least a portion of the substrate wiring, the resin layer during any of claims 1 to 5, wherein the recess structure is formed on the resin layer 2. An electrical connection structure for an ink jet head according to item 1. 2. The abutting portion is provided at one of longitudinal end portions of the concave structure of the pressure chamber forming substrate, and the support member is brought into contact with the abutting portion, thereby aligning in the longitudinal direction. The electrical connection structure for an inkjet head according to any one of items 1 to 6 . The electrical connection structure for an ink jet head according to claim 7 , wherein the abutting portion is provided in a tapered shape at a longitudinal end portion of the concave structure. Has a pin at the tip of the support member, in a recess structure of the pressure chamber formation substrate, according to any one of claims 1 to 6, characterized in that it comprises a position determination holes corresponding to the pins Electrical connection structure of inkjet head. Electrical connection structure of the ink-jet head according to any one of claims 1 9, characterized in that a conductive particle for connection with the substrate wiring and the flexible substrate. A liquid discharge port through which liquid is discharged, a pressure chamber forming substrate constituting a pressure chamber communicating with the liquid discharge port, an energy generating element provided on the opposite side of the pressure discharge port of the pressure chamber forming substrate, Have
A concave structure is provided on the energy generating element side of the pressure chamber forming substrate,
One end is connected to the energy generating element, the other end is a side surface in the concave structure , and a substrate wiring disposed on the bottom surface ,
A flexible substrate bonded to the side surface of the support member and the surface in contact with the pressure chamber forming substrate, and a pattern of the support member wiring is formed;
A method of electrically connecting an ink jet head, wherein the tip of the support member and the concave structure are brought into contact with each other. An ink jet head manufacturing method using the ink jet head electrical connection method according to claim 11 .

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