JP5582820B2 - Circuit component built-in connector - Google Patents

Description

The present invention relates to that circuitry component built connectors used to connect electronic devices to each other provided in automobiles.

  An automobile as a moving body is provided with an antenna as an electronic device and a receiver as an electronic device that receives various broadcast waves via the antenna. In such an automobile, a circuit component built-in connector (see, for example, Patent Document 1) is used to connect the antenna and the receiver.

  The circuit component built-in connector disclosed in Patent Document 1 includes a cylindrical housing, a printed wiring board accommodated in the housing, and a circuit component mounted on the printed wiring board. The cylindrical housing is provided with a connector portion for connection with a cable connected to the antenna and the receiver. The printed wiring board connects the connector portions, that is, the cables through circuit components and the like. An amplifier or the like is used as a circuit component. The amplifier of the circuit component built-in connector disclosed in Patent Document 1 has a circuit configuration with a wide dynamic range so that the signal is less likely to be distorted during amplification when the strength of the received signal is excessive.

JP 2009-4906

  The above-described circuit component built-in connector disclosed in Patent Document 1 described above includes only a printed wiring board for connecting a pair of connector portions, that is, electronic devices, via the circuit components by a printed wiring board housed in the housing. In addition, it is necessary to provide terminal fittings connected to the cable and the printed wiring board in the connector portion described above. Thus, in the above-described circuit component built-in connector, the housing tends to be enlarged in order to accommodate the printed wiring board in which the circuit component is mounted in the housing and the pair of terminal fittings are attached, that is, the circuit component built-in connector. It itself tended to increase in size.

Accordingly, an object of the present invention is to provide a circuit component built-in connector capable of achieving downsizing.

In order to solve the above-mentioned problems and achieve the object, a circuit component built-in connector according to the present invention according to claim 1 is a housing, an integrated circuit component built in the housing, and a housing attached to the housing. A circuit component built-in connector comprising a pair of terminal fittings connected to each other via an integrated circuit component and connected to an electronic device, wherein the integrated circuit component is accommodated and a first of the pair of terminal fittings is provided. One connector and a second connector having the other of the pair of terminal fittings, the pair of terminal fittings extending along a connecting direction of the first connector and the second connector. The integrated circuit component includes a component main body and a circuit element mounted on the component main body, and one surface of the component main body and the one surface of the component main body. Each of which is provided with electrodes connected to the circuit element on each of the other surfaces on the back side of the first connector, the electrodes being provided facing the one side and the other side in the connection direction, respectively. When the second connector is connected to the second connector, the pair of terminal fittings are attached to the housing in contact with the electrodes .

According to the circuit component built-in connector of the first aspect of the present invention, since the electrodes connected to the circuit elements are provided on both surfaces of the component main body including the circuit elements, the cable connected to the electronic device is connected to the electrodes. By connecting a terminal fitting to which is attached, electronic devices can be electrically connected to each other without using components other than the integrated circuit component and the terminal fitting.

Furthermore, according to the circuit component built-in connector of the present invention, an integrated circuit component in which electrodes connected to the circuit element are provided on both surfaces of the component main body incorporating the circuit element, and a state in which the electrode is in contact with each electrode Since the pair of terminal fittings attached to the housing is provided, the electronic devices can be electrically connected without using components other than the above-described integrated circuit components and terminal fittings.

  Further, since the terminal fittings are brought into direct contact with the electrodes of the integrated circuit component and are electrically connected to each other, it is not necessary to use wire bonding or the like, and the configuration is simplified.

As described above, the present invention according to claim 1, without using any parts other than Integrated Circuit parts and the terminal fitting, since the electronic apparatus to each other can be electrically connected, with the integrated circuit components In addition, the circuit component built-in connector itself can be reduced in size.

Furthermore , since electronic devices can be electrically connected to each other without using components other than the above-described integrated circuit components and terminal fittings, it is necessary to house these components other than the integrated circuit components and terminal fittings in the housing. The housing, that is, the circuit component built-in connector itself can be downsized.

  In addition, since it is not necessary to use wire bonding or the like and the configuration is simple, it is possible to reduce the size and cost, and to obtain good high-frequency characteristics.

1 is a perspective view of a circuit component built-in connector according to a first embodiment of the present invention. It is a disassembled perspective view of the circuit component built-in connector shown by FIG. It is sectional drawing which follows the III-III line in FIG. FIG. 2 is an exploded perspective view of an IC chip of the circuit component built-in connector shown in FIG. 1. FIG. 5 is a circuit diagram of a transistor of the IC chip shown in FIG. 4. It is sectional drawing of the circuit component built-in connector concerning the 2nd Embodiment of this invention. FIG. 7 is an exploded perspective view of the circuit component built-in connector shown in FIG. 6.

  A circuit component built-in connector (hereinafter simply referred to as a connector) 1 according to a first embodiment of the present invention will be described with reference to FIGS.

  The connector 1 is used to connect an antenna (not shown) as an electronic device provided in an automobile and a receiver as an electronic device provided in the automobile. As shown in FIGS. 1 and 2, the connector 1 includes a first connector 2, a second connector 3, and an IC chip 4 (shown in FIG. 2) as an integrated circuit component.

  As shown in FIGS. 2 and 3, the first connector 2 includes a terminal fitting 6 connected to a coaxial cable 5 as an electric wire, an insulating member 7, a ground member 8, and a first housing 9 as a housing. I have.

  As shown in FIGS. 2 and 3, the coaxial cable 5 includes a center conductor 10, an insulating inner coating 11 covering the center conductor 10, and a braided conductor 12 as an outer conductor covering the inner coating 11. And a known coaxial cable provided with an insulating sheath 13 as a jacket covering the braided conductor 12.

  The center conductor 10 is made of a conductive metal and is formed in a linear shape with a circular cross section. The center conductor 10 is composed of one or more strands. The inner coating 11 is made of an insulating synthetic resin. The braided conductor 12 is formed in a knitted shape by knitting a plurality of strands made of conductive metal. The insulating sheath 13 is made of an insulating synthetic resin.

  In the coaxial cable 5 having the above-described configuration, a part of the insulating sheath 13 is removed at the end thereof, the braided conductor 12 is exposed, and the exposed braided conductor 12 is folded back and covered with the insulating sheath 13. It is connected to the earth member 8. Further, the coaxial cable 5 has its inner conductor 11 and a part of the braided conductor 12 removed at the end thereof, and the central conductor 10 is exposed. The proximal end portion of the coaxial cable 5 is connected to one of the pair of electronic devices such as the antenna and the receiver described above.

  The terminal fitting 6 is obtained by punching and bending a conductive sheet metal, and integrally includes a cylindrical wire connecting portion 14 and an electric contact portion 15 connected to the wire connecting portion 14. . The wire connection portion 14 is crimped to the center conductor 10 by inserting the center conductor 10 inside. The electrical contact portion 15 is configured to be convexly curved in a direction away from the electric wire connection portion 14. The electrical contact portion 15 is in contact with and electrically connected to the electrode 38 of one flat plate electrode 35 on the left side in FIG.

  The insulating member 7 is made of an insulating synthetic resin and is formed in a cylindrical shape. The inner diameter of the insulating member 7 is formed larger than the outer diameter of the wire connecting portion 14 of the terminal fitting 6, and the outer diameter of the insulating member 7 is formed to be substantially equal to the outer diameter of the braided conductor 12 covered on the insulating sheath 13. Yes. The insulating member 7 is overlapped on the end of the coaxial cable 5 through the terminal fitting 6 that is crimped to the center conductor 10 on the inner side. The IC chip 4 is overlaid on the insulating member 7.

  The ground member 8 is made of a conductive metal, and integrally includes a cylindrical member main body 16 and a frame-shaped portion 17 connected to the member main body 16. The member main body 16 is formed so that the inner diameter thereof is substantially equal to the outer diameter of the braided conductor 12 and the insulating member 7 covered with the insulating sheath 13. The frame-like portion 17 is formed in a flat plate shape connected to the edge of the member main body 16 near the first connector 2. The frame-like portion 17 is provided with a hole 18 having a planar shape similar to the planar shape of the IC chip 4 and slightly smaller than the planar shape of the IC chip 4 at the center thereof.

  The ground member 8 is overlapped on the IC chip 4 in which the frame-like portion 17 is overlaid on the insulating member 7, and the member main body 16 is placed on the braided conductor 12 and is separated from the first connector 2 of the member main body 16. The side edge is attached to the end of the coaxial cable 5 by crimping the edge of the braided conductor 12. At this time, the ground member 8 has the frame-shaped portion 17 sandwiching the IC chip 4 between the insulating member 7 and the frame-shaped portion 17 is grounded to the other flat plate electrode 35 on the right side in FIG. The electrode 39 is in contact with and electrically connected to the ground electrode 39.

  The first housing 9 includes a housing main body 19 made of an insulating synthetic resin and formed in a cylindrical shape, and a lock protrusion 20 provided so as to protrude from the outer surface of the housing main body 19. The inner diameter of the housing body 19 is formed substantially equal to the outer diameter of the ground member 8. The housing main body 19 accommodates the coaxial cable 5, the terminal fitting 6, the insulating member 7, the IC chip 4, and the ground member 8 inside. Thus, the housing body 19, that is, the first housing 9 contains the IC chip 4.

  The 2nd connector 3 is provided with the terminal metal fitting 22 connected to the coaxial cable 21 as an electric wire, the insulating member 23, the earth member 24, and the 2nd housing 25 as a housing.

  As shown in FIG. 3 and the like, the coaxial cable 21 has the same configuration as that of the coaxial cable 5 described above. The proximal end portion of the coaxial cable 21 is connected to the other of the pair of electronic devices such as the antenna and the receiver described above.

  The terminal fitting 22 has the same configuration as the terminal fitting 6 described above, as shown in FIG. The electrical contact portion 15 of the terminal fitting 22 is in contact with the electrode 38 of the other flat plate electrode 35 on the right side in FIG. 3 to be described later of the IC chip 4 and is electrically connected to the electrode 38.

  The insulating member 23 is made of an insulating synthetic resin, and integrally includes a cylindrical member main body 26 and a tapered portion 27 connected to the member main body 26. The space inside the insulating member 23 is formed larger than the wire connecting portion 14 of the terminal fitting 22. The outer diameter of the member main body 26 is formed to be substantially equal to the outer diameter of the braided conductor 12 covered on the insulating sheath 13. The tapered portion 27 is formed such that the outer diameter gradually decreases as the member body 26 approaches the first connector 2. The insulating member 23 has a member main body 26 superimposed on the end of the coaxial cable 21 through a terminal fitting 22 that is crimped to the center conductor 10 on the inside.

  The ground member 24 is made of a conductive metal, and has a cylindrical member main body 28, a frame-shaped portion 29 connected to the member main body 28, and a cylindrical portion erected from the inner edge of the frame-shaped portion 29. 30 in an integrated manner. The member main body 28 has an inner diameter that is substantially equal to the outer diameter of the braided conductor 12 and the insulating member 23 that are covered with the insulating sheath 13. The frame-shaped part 29 is formed in a flat plate shape connected to the edge of the member main body 28 near the first connector 2. The frame-shaped portion 29 is provided with a hole 31 in the center of which the planar shape is similar to the planar shape of the IC chip 4 and slightly smaller than the planar shape of the IC chip 4 and the planar shape of the hole 18. The cylindrical portion 30 is erected from the periphery of the hole 31 toward the first connector 2.

  The ground member 24 has a frame-like portion 29 and a cylindrical portion 30 superimposed on a tapered portion 27 of the insulating member 23, and a member main body 26 is placed on the member main body 26 of the insulating member 23 and the braided conductor 12, and is coaxial. It is attached to the end of the cable 21. When the connectors 2 and 3 are fitted to each other, the ground member 24 enters the hole 18 into the hole 18 and is connected to the ground electrode 39 of the other flat plate electrode 35 on the right side of the IC chip 4 in FIG. It contacts and is electrically connected to the ground electrode 39.

  The second housing 25 includes a housing main body 32 made of an insulating synthetic resin and formed in a cylindrical shape, and a lock arm 33 connected to the outer surface of the housing main body 32. The inner diameter of the housing body 32 is formed to be approximately equal to the outer diameter of the member body 28 of the ground member 24. The housing main body 32 accommodates the coaxial cable 21 and the member main body 28 of the ground member 24 inside.

  The lock arm 33 is provided with a claw portion 34 whose central portion in the longitudinal direction is continuous with the outer surface of the second housing 25 and that engages with the lock protrusion 20 at an edge portion near the first connector 2. The lock arm 33 engages the connectors 2 and 3 with each other when the claw portion 34 is engaged with the lock protrusion 20.

  As shown in FIG. 4, the IC chip 4 includes a pair of flat plate electrodes 35 made of conductive sheet metal, and a flat plate electrode overlaid on one of the pair of flat plate electrodes 35 on the front side in FIG. A silicon layer 36 formed in a thick flat plate shape close to 35 and a flat plate shape provided in plural (four in the illustrated example) between the silicon layer 36 and the other flat plate electrode 35 on the back side in FIG. Wiring pattern 37. The silicon layer 36 and the plurality of wiring patterns 37 constitute a component main body described in a half-page of the claims.

  The plate electrode 35 includes an electrode 38 to which the terminal fittings 6 and 22 are connected, and a ground electrode 39 provided around the electrode 38 and spaced from the electrode 38. The electrodes 38 of the pair of flat plate electrodes 35 are electrically connected to each other by through holes or the like provided in the silicon layer 36 and the plurality of wiring patterns 37, and the ground electrodes 39 of the pair of flat plate electrodes 35 are connected to the silicon layer 36. In addition, they are electrically connected to each other by through holes provided in the plurality of wiring patterns 37. For this reason, the electrodes 38 of the pair of flat plate electrodes 35 are electrically connected to the electronic devices such as the antenna and the receiver described above via the terminal fittings 6 and 22.

  The silicon layer 36 is provided with a circuit pattern on the surface thereof. Further, various circuit elements (only one is shown in FIG. 4) such as the transistor 40 electrically connected to each other by a circuit pattern are mounted on the silicon layer 36.

  As shown in FIG. 5, the transistor 40 includes an amplifier 41 connected to both the electrodes 38 of the pair of flat plate electrodes 35 described above, a switch 42 provided in parallel with the amplifier 41, and a level detection circuit 43. ing. That is, the transistor 40 is connected to both the electrodes 38 of the pair of flat plate electrodes 35. The amplifier 41 receives a signal received by the antenna and output toward the receiver, and amplifies the signal. The level detection circuit 43 determines whether or not the strength of the signal received by the antenna and output toward the receiver exceeds a predetermined strength.

  When the level detection circuit 43 determines that the strength of the signal received by the antenna and output toward the receiver exceeds a predetermined strength, the level detection circuit 43 turns on the switch 42 and the signal is amplified by the amplifier 41. Output to the receiver via the switch 42 without going through. Thus, when the level detection circuit 43 determines that the intensity of the signal exceeds the predetermined intensity, the amplifier 41 does not amplify the signal.

  When the level detection circuit 43 determines that the strength of the signal received by the antenna and output toward the receiver is equal to or lower than a predetermined strength, the level detection circuit 43 turns off the switch 42 and the signal is sent to the amplifier 41. Through the receiver. Thus, when the level detection circuit 43 determines that the intensity of the signal is equal to or less than a predetermined intensity, the amplifier 41 amplifies the signal.

  The plurality of wiring patterns 37 are configured by a silicon wafer or the like having a predetermined circuit pattern or through hole provided on the surface. The wiring pattern 37 electrically connects the above-described electrode 38 of the plate electrode 35, the ground electrode 39, and circuit elements such as the transistor 40 mounted on the silicon layer 36 according to a predetermined pattern.

  The IC chip 4 having the above-described configuration is obtained by sequentially stacking one flat plate electrode 35, a silicon layer 36, a plurality of wiring patterns 37, and the other flat plate electrode 35. Therefore, the electrode 38 and the ground electrode 39 of the pair of flat plate electrodes 35 are provided on one surface of the component main body and the other surface on the back side of the one surface. An insulating film (not shown) is provided between the one flat electrode 35, the silicon layer 36, the plurality of wiring patterns 37, and the other flat plate electrode 35 to insulate them from each other. .

  In the IC chip 4, the electrode 38 of one flat plate electrode 35 is in contact with the electrical contact portion 15 of the terminal fitting 6 of the first connector 2, and the ground electrode 39 of the other flat plate electrode 35 is the ground member of the first connector 2. 8 is housed in the first connector 2 in contact with the frame portion 17. When the connectors 2 and 3 of the IC chip 4 are fitted to each other, the cylindrical portion 30 of the ground member 24 of the second connector 3 contacts the ground electrode 39 of the other flat plate electrode 35. For this reason, when the connectors 2 and 3 are fitted to each other, the IC chip 4 connects the terminal fittings 6 and 22 connected via the coaxial cables 5 and 21 to each other. Further, when the connectors 2 and 3 are fitted to each other, the IC chip 4 and the terminal fittings 6 and 22 are in a state in which the pair of terminal fittings 6 and 22 and the electrodes 38 of the flat plate electrode 35 are in contact with each other. It becomes the appearance attached to.

  According to the present embodiment, since the electrode 38 connected to the transistor 40 is provided on both the surface of the silicon layer 36 incorporating the circuit element such as the transistor 40 and the surface of the wiring pattern 37, the antenna 38 is provided on the electrode 38. By connecting terminal fittings 6 and 22 to which cables connected to electronic devices such as receivers and receivers are connected, the electronic devices can be electrically connected to each other without using components other than the IC chip 4 and the terminal fittings 6 and 22. Can be connected. For this reason, the connector 1 itself provided with the IC chip 4 can be downsized.

  Further, the level detection circuit 43 of the transistor 40 determines whether or not the strength of the signal received by the antenna and output toward the receiver exceeds a predetermined strength, and the signal strength described above is determined. If it is determined that the signal intensity exceeds the predetermined intensity, the amplifier 41 does not amplify the signal. The signal is amplified. For this reason, it is not necessary to widen the dynamic range of the amplifier 41.

  Further, since the terminal fittings 6 and 22 are in direct contact with the electrodes 38 of the IC chip 4 and are electrically connected to each other, it is not necessary to use wire bonding or the like, and the configuration is simplified. For this reason, the connector 1 can be reduced in size and cost, and good high-frequency characteristics can be obtained.

  Next, a circuit component built-in connector (hereinafter simply referred to as a connector) 1 according to a second embodiment of the present invention will be described with reference to FIGS. 6 and 7, the same components as those in the first embodiment described above are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIGS. 6 and 7, the connector 1 according to this embodiment includes a housing 45, a connection terminal member 46, a shield body 47, and an IC chip 4 having the same configuration as that of the first embodiment described above (FIG. 6 includes a flat plate electrode 35, only the component main body described above, and omits the silicon layer 36, the transistor 40, and the wiring pattern 37), and a terminal fitting 48.

  Each of the housings 45 includes a flat plate housing 49 made of an insulating synthetic resin and a housing body 50. The flat plate housing 49 is formed in a thick flat plate shape. The housing body 50 integrally includes a flat plate portion 51 and a cylindrical portion 52 erected from the center of the flat plate portion 51. The flat plate portion 51 has a planar shape equal to that of the flat plate housing 49. The flat plate portion 51 is overlapped with the flat plate housing 49 at a distance from the flat plate housing 49. The cylindrical portion 52 is erected in a direction away from the flat plate housing 49 from the central portion of the flat plate portion 51. The space inside the cylindrical portion 52 penetrates the flat plate portion 51, and a tapered surface 52 a whose inner diameter gradually decreases toward the flat plate portion 51 is provided on the inner surface of the cylindrical portion 52.

  Each connection terminal member 46 includes one electrode connection member 53 made of a conductive metal, two pairs of ground electrode connection members 54, and a pair of spring connection members 55. The electrode connecting member 53 is formed in a belt shape and is wound around the central portion in the longitudinal direction of the flat plate housing 49. The electrode connecting member 53 contacts the electrode 38 of one flat plate electrode 35 located on the lower side of the IC chip 4 in FIG. 6 and is electrically connected to the electrode 38. The electrode connecting member 53 is a terminal fitting described in the claims.

  The ground electrode connection members 54 are formed in a band shape and are provided in pairs at both ends in the longitudinal direction of the flat plate housing 49. The ground electrode connecting member 54 is disposed around the flat plate housing 49 while being spaced apart from each other and spaced apart from the electrode connecting member 53.

  The pair of spring connection members 55 are formed by bending a band-shaped metal plate, and are provided at both ends in the longitudinal direction of the flat plate housing 49 and between the pair of ground electrode connection members 54 provided at each end. Is provided. The spring connecting member 55 sandwiches the flat plate housing 49 and the IC chip 4 stacked on the flat plate housing 49 in a state where the ground electrode connecting member 54 and the electrode connecting member 53 are spaced apart from each other. The spring connecting member 55 contacts the ground electrode 39 of the other flat plate electrode 35 located on the upper side in FIG. 6 of the IC chip 4 and is electrically connected to the ground electrode 39.

  The shield body 47 is made of a conductive metal, and integrally includes a U-shaped portion 56 and a cylindrical portion 57. The U-shaped portion 56 includes a flat plate-shaped flat plate portion 58 and a pair of side plate portions 59 erected from both longitudinal ends of the flat plate portion 58, and is formed in a U-shape when viewed from the side. . The cylindrical portion 57 is formed in a cylindrical shape standing from the center of the flat plate portion 58 of the U-shaped portion 56. The inner diameter of the cylindrical portion 57 is formed to be equal to the outer diameter of the cylindrical portion 52 of the housing body 50. Of course, the space inside the cylindrical portion 57 passes through the flat plate portion 58.

  The terminal fitting 48 is made of a conductive metal and includes a rod-shaped electric contact portion 60. In the terminal fitting 48, the electrical contact portion 60 is inserted into the cylindrical portion 52, and comes into contact with the electrode 38 of the other plate electrode 35 located on the upper side of the IC chip 4 in FIG. Connected and attached to the housing 45.

  In the connector 1 according to this embodiment described above, after the electrode connection member 53 and the two pairs of ground electrode connection members 54 are attached to the flat plate housing 49, one of the IC chips 4 is attached to these electrode connection members 53 and 54. The IC chip 4 is overlaid in a state where the plate electrodes 35 overlap. Then, the spring connecting member 55 is attached to the flat plate housing 49. Then, the spring connecting member 55 sandwiches the IC chip 4 between the flat plate housing 49 and the electrode connecting members 53 and 54, and the electrode 38 of one flat plate electrode 35 of the IC chip 4 is electrically connected to the electrode connecting member 53. The ground electrode 39 of one flat plate electrode 35 of the IC chip 4 is electrically connected to the ground electrode connection member 54.

  Then, the flat plate portion 51 of the housing body 50 is overlaid on the IC chip 4 mounted on the flat plate housing 49. The flat plate portion 58 of the U-shaped portion 56 of the shield main body 47 is further overlapped with the flat plate portion 51, and the cylindrical portion 52 of the housing main body 50 is accommodated in the cylindrical portion 57 of the shield main body 47, and between the pair of side plate portions 59. With the ground electrode connecting member 54 attached to the flat plate housing 49 being sandwiched between them, the edge of the side plate portion 59 on the side away from the flat plate portion 58 is caulked to connect the housing main body 50 and the shield main body 47 to the flat plate housing. It fixes to 49 etc. Then, the electric contact portion 60 of the terminal fitting 48 is brought into contact with the electrode 38 of the other flat plate electrode 35, and the terminal fitting 48 is attached to the housing body 50 or the like. In this way, the electrode connecting member 53 and the terminal fitting 48 are electrically connected to each other by the IC chip 4, and the connector 1 is assembled. The electrode connecting member 53 is connected to one of a pair of electronic devices such as an antenna and a receiver, and the terminal fitting 48 is connected to the other.

  According to the present embodiment, as in the first embodiment described above, the electrode 38 connected to the transistor 40 on both the surface of the silicon layer 36 incorporating the circuit element such as the transistor 40 and the surface of the wiring pattern 37. Therefore, it is possible to use components other than the IC chip 4 and the terminal fitting 48 by connecting the electrode connecting member 53 connected to the electronic device such as an antenna and a receiver, the terminal fitting 48, and the like to the electrode 38. In addition, the electronic devices can be electrically connected to each other. For this reason, the connector 1 itself provided with the IC chip 4 can be downsized.

  Further, it is not necessary to widen the dynamic range of the amplifier 41 of the transistor 40, the connector 1 can be reduced in size and cost, and good high frequency characteristics can be obtained.

  The above-described embodiments are merely representative forms of the present invention, and the present invention is not limited to the embodiments. That is, various modifications can be made without departing from the scope of the present invention. That is, the circuit component built-in connector 1 of the present invention may connect electronic devices other than the antenna and the receiver to each other, and the IC chip 4 of the present invention may include circuit elements other than the transistor 40 described above. . In the present invention, circuit elements such as the transistor 40 may include circuits other than the amplifier 41 and the level detection circuit 43.

1 Circuit component built-in connector 4 IC chip (integrated circuit component)
6 Terminal fitting 9 First housing (housing)
22 Terminal fitting 25 Second housing (housing)
36 Silicon layer (component body)
37 Wiring pattern (component body)
38 electrodes 40 transistors (circuit elements)
45 Housing 48 Terminal fitting 53 Electrode connection member (terminal fitting)

Claims (1)

A circuit component built-in connector comprising a housing, an integrated circuit component built in the housing, and a pair of terminal fittings attached to the housing and connected to each other via the integrated circuit component and connected to an electronic device In
A first connector that accommodates the integrated circuit component and includes one of the pair of terminal fittings, and a second connector that includes the other of the pair of terminal fittings,
The pair of terminal fittings are provided along a connection direction between the first connector and the second connector,
The integrated circuit component includes a component body, Rutotomoni and a circuit element mounted on the component body, in each of said parts one surface and the back side of the other surface of the one surface of the body, the An electrode connected to a circuit element, each electrode being provided facing one side and the other side of the connection direction,
The circuit component built-in connector , wherein when the first connector and the second connector are connected, the pair of terminal fittings are attached to the housing in contact with the electrodes.

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