JP5578922B2 - Temperature protection element - Google Patents

Temperature protection element Download PDF

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JP5578922B2
JP5578922B2 JP2010101586A JP2010101586A JP5578922B2 JP 5578922 B2 JP5578922 B2 JP 5578922B2 JP 2010101586 A JP2010101586 A JP 2010101586A JP 2010101586 A JP2010101586 A JP 2010101586A JP 5578922 B2 JP5578922 B2 JP 5578922B2
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bimetal
contact
ptc
terminal
conductor
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JP2011233314A (en
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正弘 武富
正泰 西川
智宏 田所
憲之 前田
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エヌイーシー ショット コンポーネンツ株式会社
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Description

本発明は、バイメタルを利用して回路接点間をオン−オフする温度保護素子、特に、通電加熱素子の発熱によって、バイメタル動作時のオフ状態を異常解消まで維持する温度保護素子に関する。   The present invention relates to a temperature protection element that uses bimetal to turn on and off between circuit contacts, and more particularly to a temperature protection element that maintains an off state during bimetal operation until the abnormality is eliminated by heat generation of an energization heating element.

従来から、バイメタルを回路遮断素子として利用することはよく知られている。例えば、充電による温度上昇時に充電を停止させるために、バイメタルサーモスタットをオフにすると同時にこれと並列に加熱素子を設けてサーモスタットの復帰を阻止する過充電防止用回路保護素子があり、この過充電防止用回路保護素子を用いるパック電池が知られている。特許文献1に開示されるパック電池は、感熱遮断素子のバイメタルサーモスタットと並列に遮断状態の感熱遮断素子を加熱する加熱抵抗を同一ケース内に内蔵させたもので、加熱抵抗のジュール熱が一緒に内蔵した感熱遮断素子を加熱して復帰を防止する。   Conventionally, it is well known to use a bimetal as a circuit interruption element. For example, in order to stop charging when the temperature rises due to charging, there is an overcharge prevention circuit protection element that turns off the bimetal thermostat and at the same time provides a heating element in parallel with this to prevent the thermostat from returning. A battery pack using a circuit protection element is known. The battery pack disclosed in Patent Document 1 has a built-in heating resistor that heats the thermal shutdown element in the cutoff state in parallel with the bimetallic thermostat of the thermal shutdown element, and the Joule heat of the heating resistance is combined together. The built-in thermal shut-off element is heated to prevent recovery.

感熱遮断素子と加熱抵抗を内蔵するパック電池の安全装置の改良案として、特許文献2は、ターミナル間に可動アームを設け、この可動アームをバイメタルで作動させると同時に加熱素子にPTCを併用し、遮断中のオフ状態時に可動アーム、バイメタル、およびPTCをベース側ターミナルと導通状態にする安全装置を開示する。このバイメタルを用いた安全装置は、正常時には、可動アームがターミナル間の通電路となって、バイメタルおよびPTCは電気回路上接続されていない状態にされている。一方、周辺温度が上昇してバイメタルが反転する作動時に可動アームを押し上げ、接点を開放し、同時に反転状態のバイメタルを介してPTCに通電する電気回路に切り替え、電源電圧が低下するまでPTCの発熱によってバイメタルの反転状態を保持する。   As an improvement plan for a battery pack safety device incorporating a thermal shutdown element and a heating resistor, Patent Document 2 provides a movable arm between terminals, and this movable arm is operated by a bimetal, and at the same time, PTC is used in combination with the heating element. Disclosed is a safety device that brings a movable arm, a bimetal, and a PTC into a conductive state with a base-side terminal in an off state during shut-off. In the safety device using the bimetal, the movable arm serves as an energization path between the terminals in a normal state, and the bimetal and the PTC are not connected on the electric circuit. On the other hand, when the ambient temperature rises and the bimetal reverses, the movable arm is pushed up, the contact is opened, and at the same time, the circuit is switched to an electric circuit that supplies current to the PTC through the inverted bimetal, and the PTC generates heat until the power supply voltage decreases. Holds the inverted state of the bimetal.

特許文献1:特開平07−153499号公報
特許文献2:特開2005−203277号公報
Patent Document 1: JP 07-153499 A Patent Document 2: JP 2005-203277 A

特許文献2が開示する安全装置は、可動アームを用いるために回路構成を複雑化させるとともに、バイメタル作動時にPTCの発熱に加えて、バイメタル自体の比較的高抵抗による通電熱、および可動アームとバイメタルの間の接触抵抗による通電熱とが生じる。それゆえ、所望しない発熱が可動アームに伝熱されて過熱状態となる。また、可動アームの過熱は、これらの構成部品を収容する絶縁ケースを熱変形させる。特に、可動アーム上に被せたプラッチック製カバーの熱変形を防止するために、予め金属薄板等をカバー内面に成形加工して組み込む必要が生じ、ケースカバーを可動アームの熱から遮蔽する必要があった。このように、可動アームのほかにアーム過熱対策用金属薄板などの付属部品やその組立構造上の加工処理など、部品点数の増加と組立作業の複雑化に伴うコスト面の欠点があった。   The safety device disclosed in Patent Document 2 complicates the circuit configuration to use the movable arm, and in addition to the heat generated by the PTC when the bimetal is operated, the energization heat due to the relatively high resistance of the bimetal itself, and the movable arm and the bimetal. And heat generated by contact resistance between the two. Therefore, undesired heat generation is transferred to the movable arm and becomes overheated. Further, the overheating of the movable arm causes the insulating case that accommodates these components to thermally deform. In particular, in order to prevent thermal deformation of the cover made of PLATCH on the movable arm, it is necessary to form and incorporate a thin metal plate on the inner surface of the cover in advance, and it is necessary to shield the case cover from the heat of the movable arm. It was. As described above, in addition to the movable arm, there are disadvantages in terms of cost associated with an increase in the number of parts and the complexity of the assembly work, such as accessory parts such as a metal thin plate for preventing arm overheating and processing on the assembly structure.

したがって、本発明の目的は上述する欠点を解消するために提案されたものであり、使用部品点数の削減によるローコスト化および感熱遮断素子のバイメタルの作動後のオフ(開離)状態に、所望しない回路上の通電発熱を阻止し、加熱素子のPTCを適切に作動維持させる機能を備える新規かつ改良された温度保護素子の提供にある。   Therefore, the object of the present invention is proposed in order to eliminate the above-mentioned drawbacks, and it is not desired to reduce the cost by reducing the number of parts used and to turn off (separate) the thermal shut-off element after the bimetal is activated. It is an object of the present invention to provide a new and improved temperature protection element having a function of preventing energization heat generation on a circuit and maintaining a PTC of a heating element appropriately in operation.

本発明による温度保護素子は、一対のターミナルに接点を設けた絶縁ケースに感熱遮断素子のバイメタルと加熱素子のPTCを収容し、バイメタルが正常時にはターミナル用接点間を閉接するオン状態に、加熱異常時にはターミナル用接点間を開離するオフ状態に作動し、異常時にPTCに通電するようにしてPTCを発熱させることで、バイメタルのオフ状態を保持する温度保護素子において、バイメタルは先端側に導電体が設けられ、一対のターミナルの2つの接点間をバイメタル先端側に設けた導電体により架橋接続してオン状態に作動させる。すなわち、第1ターミナルに設けた第1接点と、第2ターミナルに設けた第2接点と、第1ターミナルに接続したPTCと、さらに、このPTCにバイメタルを介して接続する第2ターミナルか、またはこのPTCに接続された第2ターミナルに固定したバイメタルか、のいずれかを備え、バイメタルはその先端側に第1および第2接点間を架接する導電路を接点材により形成した導電体を具備し、一対のターミナルの導出部分以外を絶縁ケースと絶縁カバーによりパッケージした温度保護素子である。なお、必要に応じて、第1ターミナルにはPTCの一方の電極端子との接続用に第3接点を設け、第2ターミナルにはバイメタルおよびPTCの他方の電極端子との接続用に分岐を設けて一括固定される。ここで、バイメタルのオン状態には、一対のターミナル間は第1ターミナル−第1接点−導電体−第2接点−第2ターミナルから形成される主回路に通電され、正常のオン状態を維持する。一方、バイメタルのオフ状態には、第1ターミナル−PTC−バイメタル−第2ターミナルか、または第1ターミナル−PTC−第2ターミナルから形成される通電加熱回路に通電され、PTCの通電加熱でバイメタルのオフ状態が維持される。バイメタルおよびPTCは絶縁カバー付きケースに収納されて構成部品が保護される。バイメタルは、正常時には導電体で第1接点と第2接点の間を架橋接続し、異常時にバイメタルの反転作用で第1接点と第2接点間が開離される。そして、正常時は導電体を経て両ターミナル間を通電する主回路を形成し、異常時はPTCを経由する通電発熱回路に切り換える温度保護素子となる。   The temperature protection element according to the present invention accommodates the bimetal of the thermal shutdown element and the PTC of the heating element in an insulating case provided with contacts on a pair of terminals. In the temperature protection element that keeps the bimetal off by operating in an off state that sometimes breaks the terminal contacts and generating heat by energizing the PTC in the event of an abnormality, the bimetal is a conductor on the tip side. Is provided, and the two contacts of the pair of terminals are bridge-connected by a conductor provided on the bimetal distal end side to be turned on. That is, a first contact provided at the first terminal, a second contact provided at the second terminal, a PTC connected to the first terminal, and a second terminal connected to the PTC via a bimetal, or The bimetal has either a bimetal fixed to the second terminal connected to the PTC, and the bimetal has a conductor in which a conductive path connecting the first and second contacts is formed by a contact material on the tip side. The temperature protection element is packaged by an insulating case and an insulating cover except for the lead-out portions of the pair of terminals. If necessary, the first terminal is provided with a third contact for connection with one electrode terminal of the PTC, and the second terminal is provided with a branch for connection with the other electrode terminal of the bimetal and the PTC. Are fixed together. Here, in the on state of the bimetal, the main circuit formed by the first terminal, the first contact, the conductor, the second contact, and the second terminal is energized between the pair of terminals, and the normal on state is maintained. . On the other hand, in the off state of the bimetal, the energization heating circuit formed from the first terminal-PTC-bimetal-second terminal or the first terminal-PTC-second terminal is energized. The off state is maintained. Bimetal and PTC are housed in a case with an insulating cover to protect the components. The bimetal is a conductor and bridges between the first contact and the second contact when normal, and the first contact and the second contact are separated by the reversal action of the bimetal when abnormal. In the normal state, a main circuit is formed which energizes between the two terminals via the conductor. In the abnormal state, the temperature protection element is switched to the energization heat generation circuit via the PTC.

本発明によれば、正常時の電流は、一方のターミナルに設けた第1接点からバイメタルに設けた低抵抗の導電体の架橋接続により、他方のターミナルに設けた第2接点へ通じる主回路に流れ、より抵抗値の高いバイメタルとPTCには通電せず、通電加熱回路による電力損失を最小限に抑える。一方、異常時の温度上昇を検知したときは、バイメタルの反転作動により、第1接点および第2接点が開離して、主にPTCへの通電発熱回路に電流が流れるように切り換わる。このように本発明の温度保護素子は、バイメタル先端側に設けた低抵抗の導電体と、それより高抵抗のバイメタル自体またはPTCとの間の電気抵抗差を利用して高抵抗側に流れる電流を制限して、通常時にターミナルおよびバイメタルとPTCとが接触した状態にあっても、正常に機能させることができる。   According to the present invention, the normal current flows from the first contact provided at one terminal to the second contact provided at the other terminal by the bridge connection of the low resistance conductor provided at the bimetal. The current and the higher resistance bimetal and PTC are not energized, and the power loss due to the energization heating circuit is minimized. On the other hand, when the temperature rise at the time of abnormality is detected, the first contact and the second contact are separated by the reversing operation of the bimetal, and switching is performed so that a current flows mainly through the energization heat generation circuit to the PTC. As described above, the temperature protection element of the present invention has a current flowing on the high resistance side using the electrical resistance difference between the low resistance conductor provided on the bimetal tip side and the higher resistance bimetal itself or PTC. Thus, even when the terminal, the bimetal, and the PTC are in contact with each other at normal times, they can function normally.

本発明の温度保護素子は、バイメタルの先端部に一対のターミナル間を架接する導電体を設けたので正常時の主回路の電気抵抗を小さくして消費電力を最小限に抑えることができる。さらに、異常時にはバイメタル自体に通電させないか、あるいは通電距離を最小限に抑えることで、バイメタルの過度の抵抗加熱を阻止できる。このため構成部品にバイメタルの通電過熱対策を施す必要がなく、構成部品を簡素化できるので経済的効果も大きい。特に、バイメタルの一対のターミナルを特定構造として両者の接点を互いに近接配置してバイメタルに設けた導電体を架接用の共通接点としたので構成部品の使用点数を減らし、それにより組立を容易にして工数低減に寄与し、ローコストの温度保護素子を提供できる。   In the temperature protection element of the present invention, since the conductor connecting the pair of terminals is provided at the tip of the bimetal, the electric resistance of the main circuit in the normal state can be reduced and the power consumption can be minimized. Furthermore, excessive resistance heating of the bimetal can be prevented by not energizing the bimetal itself at the time of abnormality or by minimizing the energization distance. For this reason, it is not necessary to take measures against energization overheating of the bimetal on the component parts, and the component parts can be simplified, so that the economic effect is great. In particular, with a pair of bimetal terminals as a specific structure, the contacts on both sides are placed close to each other and the conductor provided on the bimetal is used as a common contact point for mounting, reducing the number of components used, thereby facilitating assembly. This contributes to a reduction in man-hours and can provide a low-cost temperature protection element.

本発明に係る実施例1の温度保護素子の要部構成を示す分解斜視図である。It is a disassembled perspective view which shows the principal part structure of the temperature protection element of Example 1 which concerns on this invention. 同じく図1の温度保護素子を示し、図2(a)はカバーを除く絶縁ケース本体側の正面図、図2(b)は正常時のオン状態における断面図および図2(c)は異常時のオフ状態における断面図である。Similarly, FIG. 2A shows the temperature protection element of FIG. 1, FIG. 2A is a front view of the insulating case body side excluding the cover, FIG. 2B is a cross-sectional view in a normal on state, and FIG. It is sectional drawing in an OFF state. 本発明に係る実施例1の温度保護素子の変形例を示し、図3(a)はカバーを除く絶縁ケース本体側の正面図、図3(b)は正常時のオン状態における断面図および図3(c)は異常時のオフ状態における断面図である。FIG. 3A is a front view of the insulating case main body side excluding the cover, and FIG. 3B is a cross-sectional view and a diagram in the normal on state. FIG. 3C is a cross-sectional view in an off state at the time of abnormality. 本発明に係る実施例2の温度保護素子の要部構成を示す分解斜視図である。It is a disassembled perspective view which shows the principal part structure of the temperature protection element of Example 2 which concerns on this invention. 同じく図4の温度保護素子を示し、図5(a)はカバーを除く絶縁ケース本体側の正面図、図5(b)は正常時のオン状態における断面図および図5(c)は異常時のオフ状態における断面図である。FIG. 5 (a) is a front view of the insulating case main body side excluding the cover, FIG. 5 (b) is a cross-sectional view in the normal on state, and FIG. 5 (c) is an abnormal state. It is sectional drawing in an OFF state.

以下、発明を実施の形態について図面を参照して詳細に説明する。
図1および図2は、本発明の実施例1に係る温度保護素子10を示し、一対の導出ターミナル11を設けた絶縁ケース12からなる。絶縁ケース12は、ポリアミド、ポリアセタール、ポリカーボネート、ポリブチレンテレフタレート、変性ポリフェニレンオキサイド、ポリフェニレンサルファイド、ポリサルホン、ポリエーテルサルホン、ポリエーテルエーテルケトン、ポリアリレート、ポリエーテルイミド、ポリメチルペンテン、液晶ポリマー、フッ素樹脂などのエンジニアリングプラスチックを射出成形により、各ターミナルを内包するプラスチック製筐体に成形加工したものである。絶縁ケース12には、第1ターミナル11−1、第2ターミナル11−2を備え、予め適宜フォーミングされた各ターミナルを絶縁ケースに射出成形により一体成形すると共に、この絶縁ケース内にはターミナルの接続用電極部分を露呈させて設けている。すなわち、図1に示すように、一対のターミナル11を絶縁ケース12に一体化した加工部品、このケースの開口を覆う絶縁カバー19、絶縁ケース12内に収容するPTC22およびバイメタル25からなる4つの部品から構成される。先端部に導電体26を設けたバイメタル25は後端部を第2ターミナル11−2と接続する電極部13で接続固定され、PTC22はその下面が第1ターミナルと接続するように、第1ターミナル11−1に電極部(第3接点)14を設けている。さらに、主回路を形成するために、第1ターミナル11−1に電極部15と接点17、および第2ターミナル11−2に電極部16と接点18が設けられる。これらの接点17,18は、バイメタル25の導電体26と接触自在に配置され主回路をオン−オフする。両面に電極を有するPTC22は第1ターミナル11−1の電極部(第3接点)14およびバイメタル25と接続するように設置される。それにより、PTC22は第1および第2ターミナル間に配置接続される。PTC22の上下面には、例えばAg、Zn、Ni、カーボンなどの単体または複合体からなる電極を施している。また、図示しないがバイメタルが反転作動した際に、バイメタルと上記PTCの電極とを圧接させる目的で、バイメタル下面に接触突起を設けることが好ましい。なお、バイメタル25の架接用通電路となる導電体26は、バイメタル本体の材料より電気抵抗が小さい導電材であればよく、例えばCu、Ag、AuやCu合金、Ag合金、Au合金のような金属材料の中から選定することができ、選ばれた材料を接合固定するか、接点材のクラッドもしくはめっきして形成する。絶縁ケース12はPTC22およびバイメタル25を組み込み後、その開口部に絶縁カバー19が掛けられ、絶縁ケース開口部を絶縁カバー19で被ってパッケージする。実施例1では、図2(b)に示すように絶縁カバー19の内側に押圧部19−1を設けることで、バイメタルの初期変形を拘束してバイメタルのチャタリング動作を抑制している。
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
1 and 2 show a temperature protection element 10 according to a first embodiment of the present invention, which includes an insulating case 12 provided with a pair of lead-out terminals 11. Insulating case 12 is made of polyamide, polyacetal, polycarbonate, polybutylene terephthalate, modified polyphenylene oxide, polyphenylene sulfide, polysulfone, polyethersulfone, polyetheretherketone, polyarylate, polyetherimide, polymethylpentene, liquid crystal polymer, fluororesin Engineering plastics such as these are molded into plastic casings that enclose each terminal by injection molding. The insulating case 12 includes a first terminal 11-1 and a second terminal 11-2. Each terminal formed in advance is integrally formed in the insulating case by injection molding, and the terminals are connected in the insulating case. The electrode portion for use is exposed. That is, as shown in FIG. 1, four parts including a processed part in which a pair of terminals 11 are integrated in an insulating case 12, an insulating cover 19 covering the opening of the case, a PTC 22 housed in the insulating case 12, and a bimetal 25. Consists of The bimetal 25 provided with the conductor 26 at the front end is connected and fixed at the electrode portion 13 whose rear end is connected to the second terminal 11-2, and the PTC 22 is connected to the first terminal so that the lower surface thereof is connected to the first terminal. An electrode portion (third contact) 14 is provided at 11-1. Furthermore, in order to form a main circuit, the electrode part 15 and the contact 17 are provided in the 1st terminal 11-1, and the electrode part 16 and the contact 18 are provided in the 2nd terminal 11-2. These contacts 17 and 18 are disposed so as to be in contact with the conductor 26 of the bimetal 25 and turn on and off the main circuit. PTC22 which has an electrode on both surfaces is installed so that it may connect with the electrode part (3rd contact) 14 and the bimetal 25 of the 1st terminal 11-1. Thereby, the PTC 22 is arranged and connected between the first and second terminals. On the upper and lower surfaces of the PTC 22, for example, electrodes made of a simple substance or a composite such as Ag, Zn, Ni, and carbon are applied. Although not shown, it is preferable to provide a contact protrusion on the lower surface of the bimetal for the purpose of press-contacting the bimetal and the PTC electrode when the bimetal is reversed. Note that the conductor 26 serving as an electrical connection path for the bimetal 25 may be any conductive material having a lower electrical resistance than the material of the bimetal body, such as Cu, Ag, Au, Cu alloy, Ag alloy, and Au alloy. The metal material can be selected from various metal materials, and the selected material is bonded and fixed, or the contact material is clad or plated. After the PTC 22 and the bimetal 25 are assembled in the insulating case 12, the insulating cover 19 is put over the opening, and the insulating case opening is covered with the insulating cover 19 and packaged. In the first embodiment, as shown in FIG. 2B, by providing a pressing portion 19-1 inside the insulating cover 19, the initial deformation of the bimetal is restrained and the bimetal chattering operation is suppressed.

図3は、本発明の実施例1に係る温度保護素子10の変形例を示す。温度保護素子10においては、絶縁カバー内側に押圧部を設けているが、変形例では、図3(b)に示すように、絶縁カバーの内側を平坦に成形してある点が異なっている。変形例の温度保護素子は、組立工程でバイメタル表面の一部をレーザー加工することで、チャタリング動作の抑制と反転温度の微調整を行う。上記の変形例では、バイメタルが反転作動した際にバイメタルとPTCとを圧接させる目的で、バイメタル25の凹面の内側部分に接触突起25−1を設けてもよい。   FIG. 3 shows a modification of the temperature protection element 10 according to the first embodiment of the present invention. In the temperature protection element 10, a pressing portion is provided on the inner side of the insulating cover, but the modification is different in that the inner side of the insulating cover is formed flat as shown in FIG. The temperature protection element of the modification performs suppression of chattering operation and fine adjustment of the reversal temperature by laser processing a part of the bimetal surface in the assembly process. In the above modification, the contact protrusion 25-1 may be provided on the inner side of the concave surface of the bimetal 25 for the purpose of pressing the bimetal and the PTC when the bimetal is reversed.

図4および図5は、本発明に係る実施例2の温度保護素子30を示すが、実施例1と同様な構造については詳細な説明を省略する。実施例1においては絶縁ケース本体がターミナル部品と一括して加工されたのに対し、この実施例2では一対のターミナルも構成部品として挙げられ、図4に示すように、6つの部品で構成される。すなわち、絶縁ケース32と絶縁カバー33が所定形状に成形加工され、第1ターミナル31−1と第2ターミナル31−2が所定形状に板金加工されて用意される。PTC42およびバイメタル45は、絶縁ケース32と絶縁カバー33からなるパッケージの内部に収容される。一対のターミナル31はそれぞれに接点37と接点38が設けられており。これらの接点間のオン−オフがバイメタル45の先端部に設けた導電体46の作動により行うのは実施例1と同様である。また、PTC42が一対のターミナル31間に配置され、互いに接触して通電発熱回路を形成するのも実施例1と同様である。この実施例では、第1ターミナル31−1およびこれと対峙する第2ターミナル31−2の各平面部分に方形状PTC42が挟持状態で配置される。また、バイメタル45の先端側に設けた導電体46は、第1接点37および第2接点38の間を架接して開閉自在に配置し、バイメタル45の後端側は第2ターミナル31−2の上面と接合させて固定する。導電体46は、実施例1と同様にバイメタル材より電気抵抗が小さい導電材であればよく、例えばCu、Ag、AuやCu合金、Ag合金、Au合金のような金属材料の中から選ばれる。   4 and 5 show the temperature protection element 30 of the second embodiment according to the present invention, but detailed description of the same structure as that of the first embodiment will be omitted. In the first embodiment, the insulating case main body is processed together with the terminal parts, whereas in this second embodiment, a pair of terminals are also cited as constituent parts, which are composed of six parts as shown in FIG. The That is, the insulating case 32 and the insulating cover 33 are molded into a predetermined shape, and the first terminal 31-1 and the second terminal 31-2 are prepared by sheet metal processing into a predetermined shape. The PTC 42 and the bimetal 45 are accommodated in a package including the insulating case 32 and the insulating cover 33. Each of the pair of terminals 31 is provided with a contact point 37 and a contact point 38. The on / off operation between these contacts is performed by the operation of the conductor 46 provided at the tip of the bimetal 45 as in the first embodiment. Further, the PTC 42 is disposed between the pair of terminals 31 and is in contact with each other to form an energization heat generation circuit, as in the first embodiment. In this embodiment, a rectangular PTC 42 is disposed in a sandwiched state on each planar portion of the first terminal 31-1 and the second terminal 31-2 facing it. The conductor 46 provided on the front end side of the bimetal 45 is disposed so as to be openable and closable between the first contact 37 and the second contact 38, and the rear end side of the bimetal 45 is connected to the second terminal 31-2. Join and fix to the top surface. The conductor 46 may be a conductive material having an electric resistance smaller than that of the bimetal material as in the first embodiment, and is selected from metal materials such as Cu, Ag, Au, Cu alloy, Ag alloy, and Au alloy. .

上述する実施例において、バイメタルに施す低抵抗の導電体は、めっき等の成膜によってバイメタルの表面全面または電気接触が必要とされる一部に部分的に設けてもよく、特に部分的に導電体を設ける場合は、低抵抗の単一材料やクラッド材等を該当部分に抵抗溶接するのが好ましい。また、方形板状PTCの上面に対向する部分のターミナルやバイメタルの接触面は全面もしくは一部分をクラッドもしくはめっきにより形成させてもよい。バイメタルに設ける導電体は、バイメタルとの境界面に、低抵抗導電材の組成分とバイメタル材質とが互いに拡散などにより混ざり合うことがないよう、Niなどのバリア層を設けるのが好ましい。この他に導電体は、Cu、Ag、Au、Cu合金、Ag合金、Au合金の中から選ばれた少なくとも1つの導電材を導電フィラーに用いた導電塗料をバイメタルアームに塗布し、使用するバイメタルとPTCよりも低抵抗の皮膜を形成させて設けてもよい。   In the above-described embodiments, the low-resistance conductor applied to the bimetal may be partially provided on the entire surface of the bimetal or a part where electrical contact is required by film formation such as plating. When the body is provided, it is preferable to resistance-weld a low-resistance single material or a clad material to the corresponding portion. Further, the terminal or bimetal contact surface of the portion facing the upper surface of the rectangular plate-like PTC may be formed entirely or partially by cladding or plating. The conductor provided on the bimetal is preferably provided with a barrier layer such as Ni on the interface with the bimetal so that the composition of the low-resistance conductive material and the bimetal material do not mix with each other due to diffusion or the like. In addition to this, the conductor is a bimetal that is used by applying a conductive paint using at least one conductive material selected from Cu, Ag, Au, Cu alloy, Ag alloy, and Au alloy as a conductive filler to the bimetal arm. A film having a resistance lower than that of PTC may be formed.

図2の実施例1の温度保護素子では、絶縁ケース12は液晶ポリマーの射出成形により作製された。また、ターミナルのバイメタルやPTCとの接続電極や接点電極の各電極部は筐体内側に銅材を露出させている。具体的に、絶縁ケース12内の第1ターミナル11−1には、Ag−Ni合金材からなる第1接点17と第3接点14とを設け、PTC装入孔22−1の中央部に位置する第3接点14と円盤状のセラミック製PTC22とを接触させている。さらにPTC22の上面と接触するバイメタル25を第2ターミナル11−2に接合する電極部13をAg−Ni合金材により設けている。絶縁ケース開口部を覆う絶縁カバーも液晶ポリマー製である。実施例1で用いる導電体26は、テープ状のクロスバー型接点材をプロジェクション溶接によってバイメタル端部の所定位置に設ける。この実施例の保護素子が異常温度を検知したときは、図2(c)に示すように、バイメタルの反転による作動でバイメタル25の端部を動かし、導電体26が第1接点17と第2接点18の架接を開離する。その結果、専らPTC22の通電発熱回路に電流が流れるように切り換わる。過電流に対しては、電流値がバイメタル端部に設置した導電体26の通電容量を超えたときに、導電体の抵抗発熱によってバイメタルが反転作動する。作動による開離よりオフ状態となった後はPTC22を経る通電発熱回路が働き、その時点でバイメタルアームの自己発熱は停止する。   In the temperature protection element of Example 1 in FIG. 2, the insulating case 12 was produced by injection molding of a liquid crystal polymer. Further, the copper material is exposed on the inner side of the casing of each electrode portion of the connection electrode and the contact electrode with the bimetal or PTC of the terminal. Specifically, the first terminal 11-1 in the insulating case 12 is provided with a first contact 17 and a third contact 14 made of an Ag—Ni alloy material, and is positioned at the center of the PTC insertion hole 22-1. The third contact 14 and the disk-shaped ceramic PTC 22 are in contact with each other. Furthermore, the electrode part 13 which joins the bimetal 25 which contacts the upper surface of PTC22 to the 2nd terminal 11-2 is provided with the Ag-Ni alloy material. The insulating cover that covers the opening of the insulating case is also made of a liquid crystal polymer. The conductor 26 used in Example 1 is provided with a tape-shaped crossbar contact material at a predetermined position of the end of the bimetal by projection welding. When the protection element of this embodiment detects an abnormal temperature, as shown in FIG. 2 (c), the end of the bimetal 25 is moved by the operation of reversing the bimetal, and the conductor 26 is connected to the first contact 17 and the second contact. The connection of the contact 18 is released. As a result, switching is performed so that current flows exclusively through the energization heat generation circuit of the PTC 22. For an overcurrent, when the current value exceeds the energization capacity of the conductor 26 installed at the end of the bimetal, the bimetal reversely operates due to resistance heat generation of the conductor. The energization heat generation circuit that passes through the PTC 22 operates after being turned off by the opening due to the operation, and the self-heating of the bimetal arm stops at that time.

実施例1の変形例は、図3(b)に示すように、液晶ポリマー製絶縁カバーの内側を平坦に成形している。また、バイメタル25の凹面の内側部分に接触突起25−1を設け、作動時にバイメタルをセラミック製PTC22に圧接させて接触性を向上させている。その他の部分の構成や作動原理については、実施例1と同様であるので省略する。   In the modification of the first embodiment, as shown in FIG. 3B, the inside of the liquid crystal polymer insulating cover is formed flat. Further, a contact protrusion 25-1 is provided on the inner side of the concave surface of the bimetal 25, and the bimetal is pressed against the ceramic PTC 22 during operation to improve the contact property. Other configurations and operating principles are the same as those in the first embodiment, and are therefore omitted.

図5の実施例2の温度保護素子では、絶縁ケース32と絶縁カバー33は液晶ポリマー製絶縁物質で成形加工されている。ケース内部に、フォーミングを施した銅製の一対のターミナル31間に方形板状のセラミック製PTC42を挟み込んで収め、PTC42を第1ターミナル31−1と第2ターミナル31−2とに接触させ、さらに第2ターミナル上部にバイメタル45を接合している。各ターミナル31の各接点37,38はAg−Cu合金材からなり、バイメタル45の先端部に設けた導電体46もAg−Cu合金材からなる。絶縁ケース32の開口部を絶縁カバー33で被って、両者を融着させてある。実施例2で用いる導電体46は、テープ状のクロスバー型接点材をプロジェクション溶接によってバイメタル端部の所定位置に設けてある。この実施例2の温度保護素子30が異常温度を検知したときは、図5(c)に示すように、バイメタルの反転作動により導電体46が第1接点と第2接点の架接を開離する。その結果、専らPTC42に通電する通電発熱回路に電流が流れる。一方、過電流に対しては、電流値がバイメタル端部に設けた導電体の通電容量を超えたときに、導電体の抵抗発熱によってバイメタル45が反転作動することで両接点を開離し、この作動後はPTC42を経る通電発熱回路に切り替わるため、その時点でバイメタルの自己発熱は停止する。   In the temperature protection element of Example 2 in FIG. 5, the insulating case 32 and the insulating cover 33 are molded with a liquid crystal polymer insulating material. A rectangular plate-shaped ceramic PTC 42 is sandwiched between a pair of formed copper terminals 31 inside the case, the PTC 42 is brought into contact with the first terminal 31-1 and the second terminal 31-2, and The bimetal 45 is joined to the upper part of the two terminals. The contacts 37 and 38 of each terminal 31 are made of an Ag—Cu alloy material, and the conductor 46 provided at the tip of the bimetal 45 is also made of an Ag—Cu alloy material. The opening of the insulating case 32 is covered with an insulating cover 33, and both are fused. The conductor 46 used in Example 2 is provided with a tape-like crossbar contact material at a predetermined position at the end of the bimetal by projection welding. When the temperature protection element 30 of the second embodiment detects an abnormal temperature, as shown in FIG. 5C, the conductor 46 opens the first contact and the second contact by reversing the bimetal. To do. As a result, a current flows through the energization heat generation circuit that exclusively energizes the PTC 42. On the other hand, for the overcurrent, when the current value exceeds the current carrying capacity of the conductor provided at the end of the bimetal, the bimetal 45 is reversed by the resistance heat generation of the conductor, thereby opening both the contacts. Since it switches to the energization heat generation circuit which passes through PTC42 after an operation | movement, the self-heating of a bimetal stops at that time.

本発明の温度保護素子は、電気・電子回路の過熱防止に利用され、とりわけ二次電池の過充電防止用保護素子として有用である。   The temperature protection element of the present invention is used for preventing overheating of electric / electronic circuits, and is particularly useful as a protection element for preventing overcharge of secondary batteries.

10,30・・・温度保護素子、 11,31・・・ターミナル、
11−1,31−1・・・第1ターミナル、
11−2,31−2・・・第2ターミナル、
12,32・・・絶縁ケース、 19,33・・・絶縁カバー、
13・・・バイメタル用電極部、 14・・・PTC用電極部(第3接点)、
15・・・第1接点用電極部、 16・・・第2接点用電極部、
17,37・・・第1接点 、 22,42・・・PTC、
18,38・・・第2接点 、 25,45・・・バイメタル、
26,46・・・導電体、 19−1・・・バイメタル押圧部、
22−1・・・PTC装入孔、 25−1・・・接触突起。
10, 30 ... temperature protection element, 11, 31 ... terminal,
11-1, 31-1 ... Terminal 1,
11-2, 31-2 ... Terminal 2,
12, 32 ... Insulating case 19, 33 ... Insulating cover,
13 ... Bimetal electrode part, 14 ... PTC electrode part (third contact),
15 ... 1st contact electrode part, 16 ... 2nd contact electrode part,
17, 37 ... 1st contact, 22, 42 ... PTC,
18, 38 ... second contact, 25, 45 ... bimetal,
26, 46 ... conductor, 19-1 ... bimetal pressing part,
22-1 ... PTC insertion hole, 25-1 ... contact protrusion.

Claims (2)

第1接点を有する第1ターミナルと、第1ターミナルに接続したPTCと、第2接点を有し前記PTCに接続した第2ターミナルと、接点材からなる導電体を有し第2ターミナルに固定したバイメタルと、バイメタルとPTCを収納する絶縁ケースおよびカバーとを備え、前記バイメタルの前記導電体により、前記第1接点と第2接点の間を架橋接続し、前記バイメタルの反転作用によって第1接点と第2接点の間の接続を開離して、前記PTCに通電する通電発熱回路と前記導電体を経て両ターミナル間に通電する主回路を切り替える温度保護素子であって、前記導電体は、前記バイメタル材より電気抵抗が小さいCu、Ag、Au、Cu合金、Ag合金、Au合金の群の何れかから選択された金属材料であることを特徴とする温度保護素子。 A first terminal having a first contact, a PTC connected to the first terminal, a second terminal having a second contact and connected to the PTC, and a conductor made of a contact material and fixed to the second terminal. A bimetal, an insulating case and a cover for storing the bimetal and the PTC, the first metal contact and the second contact are bridge-connected by the conductor of the bimetal, and the first contact is formed by an inversion action of the bimetal. A temperature protection element that disconnects the connection between the second contacts and switches between an energization heating circuit that energizes the PTC and a main circuit that energizes between both terminals via the conductor, the conductor comprising the bimetal A temperature protection element characterized by being a metal material selected from the group consisting of Cu, Ag, Au, Cu alloy, Ag alloy, and Au alloy, which has a lower electrical resistance than the material . 前記バイメタルに設ける前記導電体は、前記バイメタルとの境界面に、低抵抗導電材の組成分とバイメタル材質とが互いに拡散などにより混ざり合うことがないよう、Niのバリア層を設けたことを特徴とする請求項1に記載の温度保護素子。The conductor provided on the bimetal is characterized in that a Ni barrier layer is provided on the boundary surface with the bimetal so that the composition of the low-resistance conductive material and the bimetal material do not mix with each other due to diffusion or the like. The temperature protection element according to claim 1.
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