JP5542514B2 - High thermal conductivity thermoplastic resin composition - Google Patents

Description

The present invention relates to a novel high thermal conductive thermoplastic resin material excellent in thermal conductivity. Specifically, it shows high thermal conductivity with a resin alone without adding a thermal conductive filler, etc., and also shows an innovative high thermal conductivity compared to materials known so far by adding a thermal conductive filler, Further, the present invention relates to a resin composition having good injection moldability.

  When a thermoplastic resin composition is used in various applications such as personal computers and display housings, electronic device materials, automotive interiors and exteriors, plastic is generated because it has lower thermal conductivity than inorganic materials such as metal materials. Difficult to escape heat can be a problem. In order to solve such problems, attempts have been widely made to obtain a high thermal conductive resin composition by blending a large amount of a high thermal conductive inorganic substance in a thermoplastic resin.

  As the high thermal conductivity inorganic compound, it is necessary to blend a high thermal conductivity inorganic material such as graphite, carbon fiber, alumina, boron nitride, etc. into the resin with a high content of usually 30% by volume or more, and further 50% by volume or more. There is. However, even if a large amount of the inorganic substance is blended, the thermal conductivity of the resin alone is low, so that the thermal conductivity of the resin composition has a limit.

In addition, when a thermoplastic resin composition highly filled with such a filler is subjected to a molding process such as injection molding in a state melted at a high temperature due to the influence of the filler, various side reactions occur due to the influence of heat. There is a problem that the thermal stability is lowered. In order to solve these problems, various stabilizers such as heat aging inhibitors have been manufactured and sold, but it is necessary to study stabilizers according to the characteristics of each resin. There are no known stabilizers available.
As a thermosetting resin excellent in thermal conductivity of a single resin, for example, an epoxy resin described in Patent Document 1 or Patent Document 2 or a bismaleimide resin described in Patent Document 3 has been reported. However, since these resins exhibit thermosetting properties, they cannot be applied with a molding method such as injection molding, and have a drawback that the molecular structure is complicated and the production is difficult. The epoxy resin described in Patent Document 2 is relatively simple to synthesize, but has insufficient thermal conductivity.

On the other hand, for thermoplastic resins, there are research examples that give high thermal conductivity in a specific direction by adopting special molding methods such as stretching and magnetic field orientation during injection molding, but without using special molding methods. There have been no reports on resins that can obtain high thermal conductivity by ordinary injection molding.
Regarding the liquid crystalline thermoplastic resin, Non-Patent Documents 1 to 4 describe alternating polycondensates of mesogenic groups exhibiting a liquid crystal phase and alkyl chains. However, there is no description regarding the thermal stability, thermal conductivity, moldability, etc. of these polymers.

International Publication Number WO2002 / 094905 International Publication Number WO2006 / 120993 JP 2007-2224060 A

Macromolecules, vol 17, P2288 (1984). Polymer, vol24, P1299 (1983) Eur. Polym. J. et al. , Vol16, P303 (1980) Mol. Cryst. Liq. Cryst. , Vol88, P295 (1982)

An object of the present invention is to provide a high thermal conductive resin material in which a single resin is excellent in thermal conductivity, easy to manufacture, and obtains a high thermal conductive molded article having good thermal stability during molding processing. To do.

The present inventor improves the thermal stability during molding of the composition by adding a specific stabilizer to a thermoplastic resin having a specific structure and exhibiting excellent thermal conductivity as a single resin. Thus, the present inventors have found that it is possible to achieve both a good appearance of a molded product and thermal conductivity. That is, the present invention has the following configuration.

1). A thermoplastic resin mainly composed of a repeating unit represented by the following general formula (1), mainly composed of a chain structure, and having a thermal conductivity of 0.45 W / (m · K) or more as a single resin ( A) High thermal conductivity containing 0.01 to 5.0% by weight of one or more stabilizers (C) selected from phosphite stabilizers, thioether stabilizers, and phenol stabilizers with respect to 100 parts by weight. Thermoplastic resin composition.
-M-Sp- (1)
(In the formula, M represents a mesogenic group, and Sp represents a spacer.)

2). The high thermal conductive resin composition according to 1), wherein the general formula (1) includes a repeating unit of a unit represented by the following general formula (2).
^{-A 1 -x-A 2 -y-} R-z- (2)
(In the formula, A ¹ and A ² each independently represent a substituent selected from an aromatic group, a condensed aromatic group, an alicyclic group, and an alicyclic heterocyclic group. X, y, and z are each independently a direct _{bond, -CH 2 -, - C (} CH 3) 2 -, - O -, - S -, - CH 2 -CH 2 -, - C = C -, - C≡C -, - CO 2 selected from the group of-, -CO-O-, -CO-NH-, -CH = N-, -CH = N-N = CH-, -N = N- or -N (O) = N-. R represents a divalent substituent which may contain a branch having 2 to 20 main chain atoms.)

3). The portion corresponding to -A ¹ -x-A ² -is a mesogenic group represented by the following general formula (3), characterized in that the high thermal conductivity thermoplastic resin composition according to 2).

  4). The high thermal conductivity thermoplastic resin composition according to 2) or 3), wherein a portion corresponding to R of the thermoplastic resin is a linear aliphatic hydrocarbon chain.

  5). 2. The high thermal conductivity thermoplastic resin composition according to any one of 2) to 4), wherein the number of carbon atoms in the R molecular chain of the thermoplastic resin is an even number.

6). R of the thermoplastic resin is at least one selected from — (CH ₂ ) ₈ —, — (CH ₂ ) ₁₀ —, and — (CH ₂ ) ₁₂ —, and the number average molecular weight is 3000 to 40000 2) -5) The high thermal conductivity thermoplastic resin composition according to any one of the above.

  7). A highly thermally conductive resin material using the thermoplastic resin according to 2), wherein -yRz- of the thermoplastic resin is -O-CO-R-CO-O-.

  8). The high thermal conductive resin thermoplastic composition according to any one of 1) to 7), which contains an inorganic filler (B).

  9). 8. The high thermal conductive resin thermoplastic composition according to 8), wherein the inorganic filler (B) is an inorganic compound having a thermal conductivity of 12 W / m · K or more as a simple substance.

  10). 8. The high thermal conductive resin thermoplastic composition according to 8) or 9), wherein the inorganic filler (B) is an electrically insulating high thermal conductive inorganic compound.

  11). 8. The high thermal conductive resin thermoplastic composition according to 8) or 9), wherein the inorganic filler (B) is an electrically conductive high thermal conductive inorganic compound.

  12). The high thermal conductivity according to any one of 1) to 11), wherein the stabilizer (C) is used in combination with a phosphite stabilizer and / or a thioether stabilizer and a phenol stabilizer. Resin thermoplastic composition.

Since the high thermal conductivity thermoplastic resin composition of the present invention exhibits high thermal conductivity, it is possible to obtain a high thermal conductivity thermoplastic resin composition by adding only a small amount of a high thermal conductivity inorganic filler. Even when molded by a method or the like, it is excellent in thermal stability, and a molded product having both a good molded product appearance and high thermal conductivity can be easily obtained.

The resin used in the highly heat-conductive thermoplastic resin composition of the present invention is characterized in that the main chain is mainly composed of a repeating unit represented by the following general formula (1) and mainly has a chain structure. .
-M-Sp- (1)
(In the formula, M represents a mesogenic group, and Sp represents a spacer.)
The thermoplasticity referred to in the present invention is a property of plasticizing by heating.
The term “mainly” as used in the present invention means that the amount of the general formula (1) contained in the main chain of the molecular chain is 50 mol% or more, preferably 70 mol% or more, and more preferably 90 mol%, based on all structural units. % Or more, and most preferably essentially 100 mol%. When it is less than 50 mol%, the crystallinity of the resin is lowered, and the thermal conductivity may be lowered.
The resin of the present invention has extremely high symmetry and has a structure in which a rigid straight chain is bound by a bent chain, so that the orientation of the molecule is high, the formed higher order structure is dense, and has excellent thermal conductivity.

  The thermal conductivity of the resin used in the high thermal conductivity thermoplastic resin composition of the present invention is 0.45 W / (m · K) or more, preferably 0.6 W / (m · K) or more, more preferably 0. 0.8 W / (m · K) or more, more preferably 1.0 W / (m · K) or more, more preferably 1.2 W / (m · K) or more, and particularly preferably 1.3 W / (m · K). ) That's it. The upper limit of the thermal conductivity is not particularly limited and is preferably as high as possible. Generally, values of 30 W / (m · K) or less, and further 10 W / (m · K) or less can be exemplified.

The mesogenic group contained in the resin used in the high thermal conductivity thermoplastic resin composition of the present invention means a rigid and highly oriented substituent. Preferred mesogenic groups include the following general formula -A ¹ -x-A ^2-
(A ¹ and A ² each independently represent a substituent selected from an aromatic group, a condensed aromatic group, an alicyclic group, and an alicyclic heterocyclic group. X is a connector, a direct bond,- _{CH 2 -, - C (CH} 3) 2 -, - O -, - S -, - CH 2 -CH 2 -, - C = C -, - C≡C -, - CO -, - CO-O- , —CO—NH—, —CH═N—, —CH═N—N═CH—, —N═N— or —N (O) ═N— are each a divalent substituent. ) Is represented. A ¹ and A ² are each independently a hydrocarbon group having 6 to 12 carbon atoms having a benzene ring, a hydrocarbon group having 10 to 20 carbon atoms having a naphthalene ring, and 12 to 24 carbon atoms having a biphenyl structure. Hydrocarbon group having 3 or more benzene rings, a hydrocarbon group having 12 to 36 carbon atoms, a hydrocarbon group having 12 to 36 carbon atoms having a condensed aromatic group, and an alicyclic heterocyclic group having 4 to 36 carbon atoms It is preferable that it is selected from.

Specific examples of A ¹ and A ² include phenylene, biphenylene, naphthylene, anthracenylene, cyclohexyl, pyridyl, pyrimidyl, thiophenylene, and the like. These may be unsubstituted or may be a derivative having a substituent such as an aliphatic hydrocarbon group, a halogen group, a cyano group, or a nitro group.

Among these, when the number of atoms in the main chain of x corresponding to the bond is an even number, the molecular width of the mesogen group is small, the degree of freedom of rotation of the bond is small, and the crystallization rate tends to be high. It is preferable because the thermal conductivity is easily improved. That is, a direct bond, —CH ₂ —CH ₂ —, —C═C—, —C≡C—, —CO—O—, —CO—NH—, —CH═N—, —CH═N—N═CH A divalent substituent selected from the group of-, -N = N- or -N (O) = N- is preferred.

  Specific examples of mesogenic groups include biphenyl, terphenyl, quarterphenyl, stilbene, diphenyl ether, 1,2-diphenylethylene, diphenylacetylene, benzophenone, phenylbenzoate, phenylbenzamide, azobenzene, 2-naphthoate, phenyl-2-naphthoate, and Examples thereof include a divalent group having a structure in which two hydrogen atoms are removed from these derivatives. Of these, direct bonding is preferred, and specific examples include biphenyl, terphenyl, and quarterphenyl.

  More preferably, it is a mesogenic group represented by the following general formula (3). This mesogenic group is rigid and highly oriented due to its structure, and is easily available or synthesized.

  The highly heat-conductive thermoplastic resin of the present invention can be made into a composition by itself or using various blends. The mesogenic group contained in the high thermal conductive thermoplastic resin used in the composition is preferably one that does not contain a crosslinkable substituent.

  The spacer of the general formula (1) according to the present invention means a flexible molecular chain and includes a bonding group with a mesogenic group. The number of main chain atoms of the spacer is preferably 4 to 28, more preferably 6 to 24, and still more preferably 8 to 20. When the number of main chain atoms of the spacer is in this range, the molecular structure of the thermoplastic resin is sufficiently flexible, and the crystallinity is high and the thermal conductivity is preferable. The type of atoms constituting the main chain of the spacer is not particularly limited, and any type can be used. However, it is preferably at least one atom selected from C, H, O, S, and N.

As a preferable spacer, the following general formula -yRz-
(Y and z are each independently a direct bond, —CH ₂ —, —C (CH ₃ ) ₂ —, —O—, —S—, —CH ₂ —CH ₂ —, —C═C—, — C≡C—, —CO—, —CO—O—, —CO—NH—, —CH═N—, —CH═N—N═CH—, —N═N— or —N (O) ═N -Represents a divalent substituent selected from the group of-R. R represents a divalent substituent which may contain a branch having 2 to 20 main chain atoms, and may be a branch. It is done. Here, R has a chain saturated hydrocarbon group having 2 to 20 carbon atoms, a saturated hydrocarbon group having 2 to 20 carbon atoms including 1 to 3 cyclic structures, and 1 to 5 unsaturated groups. A hydrocarbon group having 2 to 20 carbon atoms, a hydrocarbon group having 2 to 20 carbon atoms having 1 to 3 aromatic rings, and a polyether group having 2 to 20 carbon atoms having 1 to 5 oxygen atoms Those selected from are preferred.

  Specific examples of the spacer include an aliphatic hydrocarbon chain and a polyether chain. Since the crystallinity of the thermoplastic resin is increased and the thermal conductivity tends to be high, R is preferably a linear aliphatic hydrocarbon chain that does not include a branch. R may be saturated or unsaturated, but is preferably a saturated aliphatic hydrocarbon chain because the high thermal conductivity thermoplastic resin of the present invention has appropriate flexibility. In the total R, the unit exceeding 50% by weight is preferably a saturated aliphatic hydrocarbon chain, and most preferably it does not contain an unsaturated bond.

  R preferably has 2 to 20 carbon atoms, more preferably 4 to 18 carbon atoms, and even more preferably 6 to 16 carbon atoms. Further, when the mesogenic groups are connected in a straight line, the crystallinity is unlikely to decrease, and the thermal conductivity can be secured. Therefore, R is preferably a straight-chain saturated aliphatic hydrocarbon having these carbon numbers, and the number of carbons is even. It is preferable that In the case of an even number, since the mesogenic groups are arranged more regularly, the thermal conductivity tends to be high.

In particular, R is at least one selected from — (CH ₂ ) ₈ —, — (CH ₂ ) ₁₀ —, and — (CH ₂ ) ₁₂ — from the viewpoint that a resin having excellent thermal conductivity can be obtained. Is preferred. y and z are groups for bonding the substituent R to the mesogenic group. Among the spacers having such a group, the general formula (4) is —CO—O—R—O—CO— or —O—CO—R—CO— from the viewpoint that a resin having excellent thermal conductivity can be obtained. Those having a structure of O- are preferable, and -O-CO-R-CO-O- is particularly preferable.

The number average molecular weight of the resin used in the composition of the present invention is polystyrene as a standard, and the thermoplastic resin used in the present invention is 0.25 in a 1: 2 (Vol ratio) mixed solvent of p-chlorophenol and o-dichlorobenzene. It can measure at 80 degreeC by GPC using the solution prepared by melt | dissolving so that it might become a weight% density | concentration. The number average molecular weight of the thermoplastic resin of the present invention is preferably 3000 to 40000, more preferably 3000 to 30000, and particularly preferably 3000 to 20000 in view of the upper limit. On the other hand, considering the lower limit, it is preferably 3000 to 40000, more preferably 5000 to 40000, and particularly preferably 7000 to 40000. Furthermore, when an upper limit and a lower limit are considered, it is more preferable that it is 5000-30000, and it is most preferable that it is 7000-20000. When the number average molecular weight is less than 3000 or greater than 40000, even if the resin has the same primary structure, the thermal conductivity may be 0.45 W / (m · K) or less.
The liquid crystalline thermoplastic resin used as the organic heat conductive additive of the present invention preferably contains lamellar crystals. In the liquid crystalline thermoplastic resin of the present invention, the amount of lamellar crystals can be used as an index of crystallinity. The more lamellar crystals, the higher the crystallinity.
The lamellar crystal referred to in the present invention corresponds to a plate-like crystal in which long chain molecules are folded and arranged in parallel. Whether or not such crystals exist in the resin can be easily determined by observation with a transmission electron microscope (TEM) or X-ray diffraction.

The ratio of lamellar crystals forming the continuous phase can be calculated by directly observing a sample stained with RuO ₄ with a transmission electron microscope (TEM). As a specific method, as a sample for TEM observation, a part of a molded sample having a thickness of 6 mm × 20 mmφ is cut out, stained with RuO _4, and then an ultrathin section having a thickness of 0.1 μm prepared by a microtome is used. It shall be. The prepared slice is observed with a TEM at an acceleration voltage of 100 kV, and a lamella crystal region can be determined from the obtained 40,000-fold scale photograph (20 cm × 25 cm). The boundary of the region can be determined by using the lamellar crystal region as a region where periodic contrast exists. Since the lamella crystals are similarly distributed in the depth direction, the ratio of the lamella crystals is calculated as a ratio of the lamella crystal region to the entire area of the photograph. Moreover, in order for resin itself to have high thermal conductivity, it is preferable that the ratio of a lamellar crystal is 10 Vol% or more. The ratio of lamellar crystals is more preferably 20 Vol% or more, further preferably 30 Vol% or more, and particularly preferably 40 Vol% or more.
The liquid crystalline thermoplastic resin of the present invention preferably contains crystals. In the present invention, the degree of crystallinity can be obtained from the ratio of lamellar crystals in the liquid crystalline thermoplastic resin by the following calculation formula.
Crystallinity (%) = ratio of lamellar crystals (Vol%) x 0.7
In order for the resin itself to have high thermal conductivity, the crystallinity of the liquid crystalline thermoplastic resin is preferably 7% or more. The degree of crystallinity is more preferably 14% or more, further preferably 21% or more, and particularly preferably 28% or more.

In order for the liquid crystalline thermoplastic resin of the present invention to exhibit high thermal conductivity, the density of the resin itself is preferably 1.1 g / cm ³ or more, more preferably 1.13 g / cm ³ or more. It is preferably 1.16 g / cm ³ or more. A high resin density means that the content of lamellar crystals is high, that is, the degree of crystallinity is high.

  The liquid crystalline thermoplastic resin used in the present invention preferably has an isotropic high thermal conductivity. As a method for measuring whether or not the thermal conductivity is isotropic, for example, a sample in which a thermoplastic resin is made into a disk shape having a thickness of 1 mm × 25.4 mmφ, the thickness direction by the Xe flash method, A method of separately measuring the thermal conductivity in the plane direction is mentioned. The thermal conductivity of the thermoplastic resin according to the present invention is isotropically high, and the thermal conductivity in the thickness direction and the plane direction measured by the above measurement method is 0.3 W / (m · K) or more. is there.

  The thermoplastic resin used in the composition of the present invention may be produced by any known method. From the viewpoint that the control of the structure is simple, a method of reacting a compound having a reactive functional group at both ends of the mesogenic group with a compound having a reactive functional group at both ends of the substituent R is preferable. . As such a reactive functional group, known groups such as a hydroxyl group, a carboxyl group, an alkoxy group, an amino group, a vinyl group, an epoxy group, and a cyano group can be used, and the conditions for reacting these are not particularly limited.

  From the viewpoint of ease of synthesis, a reaction with a hydroxyl group and a carboxyl group is preferred. Specifically, a compound having a hydroxyl group at both ends of the mesogenic group and a compound having a carboxyl group at both ends of the substituent R, or a compound having a carboxyl group at both ends of the mesogenic group and a hydroxyl group at both ends of the substituent R The manufacturing method which makes the compound which has it react is mentioned.

  An example of a method for producing a thermoplastic resin comprising a compound having a hydroxyl group at both ends of a mesogenic group and a compound having a carboxyl group at both ends of the substituent R is as follows. A method in which a fatty acid is individually or collectively converted into an acetate ester and then subjected to a deacetic acid polycondensation reaction with a compound having a carboxyl group at both ends of the substituent R in another reaction tank or the same reaction tank. Can be mentioned. The polycondensation reaction is preferably carried out in the substantial absence of a solvent. The reaction temperature is preferably 200 to 350 ° C, more preferably 230 to 330 ° C, particularly preferably 250 to 300 ° C. Moreover, it is preferable to carry out for 0.5 to 5 hours by presence of inert gas, such as nitrogen, under a normal pressure or pressure reduction. If the reaction temperature is too low, the reaction proceeds slowly, and if it is too high, side reactions such as decomposition tend to occur.

  A multi-stage reaction temperature may be employed. In some cases, the reaction product can be withdrawn in a molten state and recovered as soon as the temperature rises or when the maximum temperature is reached. The obtained thermoplastic resin may be used as it is, or it may be subjected to solid phase polymerization in order to remove unreacted raw materials or improve physical properties.

  In the case of performing solid phase polymerization, the obtained thermoplastic resin is mechanically pulverized into particles having a particle size of 3 mm or less, preferably 1 mm or less, and an inert gas such as nitrogen at 250 to 350 ° C. in a solid state. The treatment is preferably performed under an atmosphere or under reduced pressure for 1 to 20 hours. If the particle size of the polymer particles is 3 mm or more, the treatment is not sufficient, and problems with physical properties are caused, which is not preferable. It is preferable to select the treatment temperature and the rate of temperature increase during solid phase polymerization so that the thermoplastic resin particles do not cause fusion.

  The acid anhydride of the lower fatty acid used in the production of the resin of the present invention includes an acid anhydride of a lower fatty acid having 2 to 5 carbon atoms, such as acetic anhydride, propionic anhydride, monochloroacetic anhydride, dichloroacetic anhydride, trichloroanhydride. Acetic anhydride, monobromoacetic anhydride, dibromoacetic anhydride, tribromoacetic anhydride, monofluoroacetic anhydride, difluoroacetic anhydride, trifluoroacetic anhydride, butyric anhydride, isobutyric anhydride, valeric anhydride, pivalic anhydride, etc. , Propionic anhydride and trichloroacetic anhydride are particularly preferably used.

  The amount of the lower fatty acid anhydride used is preferably 1.01 to 1.50 times equivalent, more preferably 1.02 to 1.2 times equivalent to the total of the hydroxyl groups of the mesogenic groups used. As for other production methods in which a compound having a carboxyl group at both ends of a mesogenic group and a compound having a hydroxyl group at both ends of the substituent R are reacted, for example, as described in JP-A-2-258864, 4,4′- A method of melt polymerization of dimethyl biphenyldicarboxylate and an aliphatic diol is mentioned.

  The terminal structure of the resin of the present invention is not particularly limited, but from the viewpoint that a resin suitable for molding such as injection molding can be obtained, the terminal is blocked with a hydroxyl group, a carboxyl group, an ester group, an acyl group, an alkoxy group, or the like. It is preferably stopped. When the terminal has a highly reactive functional group such as an epoxy group or a maleimide group, the resin becomes thermosetting and the injection moldability may be impaired.

  The resin of the present invention may be copolymerized with another monomer to such an extent that the effect is not lost. For example, aromatic hydroxycarboxylic acid, aromatic dicarboxylic acid, aromatic diol, aromatic hydroxyamine, aromatic diamine, aromatic aminocarboxylic acid or caprolactam, caprolactone, aliphatic dicarboxylic acid, aliphatic diamine, aliphatic diol, Examples include alicyclic dicarboxylic acids, alicyclic diols, aromatic mercaptocarboxylic acids, aromatic dithiols, and aromatic mercaptophenols.

  Specific examples of the aromatic hydroxycarboxylic acid include 4-hydroxybenzoic acid, 3-hydroxybenzoic acid, 2-hydroxybenzoic acid, 2-hydroxy-6-naphthoic acid, 2-hydroxy-5-naphthoic acid, 2-hydroxy 7-naphthoic acid, 2-hydroxy-3-naphthoic acid, 4'-hydroxyphenyl-4-benzoic acid, 3'-hydroxyphenyl-4-benzoic acid, 4'-hydroxyphenyl-3-benzoic acid and their Examples thereof include alkyl, alkoxy, and halogen-substituted products.

  Specific examples of the aromatic dicarboxylic acid include terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 1,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 4,4′-dicarboxybiphenyl, 3 , 4′-dicarboxybiphenyl, 4,4 ″ -dicarboxyterphenyl, bis (4-carboxyphenyl) ether, bis (4-carboxyphenoxy) butane, bis (4-carboxyphenyl) ethane, bis (3- Carboxyphenyl) ether and bis (3-carboxyphenyl) ethane and the like, alkyl, alkoxy or halogen substituted products thereof.

  Specific examples of the aromatic diol include, for example, hydroquinone, resorcin, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 3,3′-dihydroxybiphenyl, 3,4′-dihydroxybiphenyl. 4,4′-dihydroxybiphenyl, 4,4′-dihydroxybiphenol ether, bis (4-hydroxyphenyl) ethane, 2,2′-dihydroxybinaphthyl, and the like, and alkyl, alkoxy or halogen substituted products thereof. .

  Specific examples of the aromatic hydroxyamine include 4-aminophenol, N-methyl-4-aminophenol, 3-aminophenol, 3-methyl-4-aminophenol, 4-amino-1-naphthol, 4-amino- 4'-hydroxybiphenyl, 4-amino-4'-hydroxybiphenyl ether, 4-amino-4'-hydroxybiphenylmethane, 4-amino-4'-hydroxybiphenyl sulfide and 2,2'-diaminobinaphthyl and their alkyls , Alkoxy or halogen-substituted products.

  Specific examples of the aromatic diamine and aromatic aminocarboxylic acid include 1,4-phenylenediamine, 1,3-phenylenediamine, N-methyl-1,4-phenylenediamine, N, N′-dimethyl-1,4. -Phenylenediamine, 4,4'-diaminophenyl sulfide (thiodianiline), 4,4'-diaminobiphenyl sulfone, 2,5-diaminotoluene, 4,4'-ethylenedianiline, 4,4'-diaminobiphenoxyethane 4,4′-diaminobiphenylmethane (methylenedianiline), 4,4′-diaminobiphenyl ether (oxydianiline), 4-aminobenzoic acid, 3-aminobenzoic acid, 6-amino-2-naphthoic acid and 7-amino-2-naphthoic acid and alkyl, alkoxy or halogen substituted products thereof It is below.

Specific examples of the aliphatic dicarboxylic acid include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, tetradecanedioic acid, fumaric acid, maleic acid Etc.
Specific examples of the aliphatic diamine include 1,2-ethylenediamine, 1,3-trimethylenediamine, 1,4-tetramethylenediamine, 1,6-hexamethylenediamine, 1,8-octanediamine, 1,9- Nonanediamine, 1,10-decanediamine, 1,12-dodecanediamine, and the like can be given.

  Specific examples of the alicyclic dicarboxylic acid, aliphatic diol and alicyclic diol include hexahydroterephthalic acid, trans-1,4-cyclohexanediol, cis-1,4-cyclohexanediol, and trans-1,4-cyclohexane. Dimethanol, cis-1,4-cyclohexanedimethanol, trans-1,3-cyclohexanediol, cis-1,2-cyclohexanediol, trans-1,3-cyclohexanedimethanol, ethylene glycol, propylene glycol, butylene glycol, 1,3-propanediol, 1,2-propanediol, 1,4-butanediol, 1,6-hexanediol, 1,8-octanediol, 1,10-decanediol, 1,12-dodecanediol, neo Such as pentyl glycol Such Jo or branched chain aliphatic diols, as well as reactive derivatives thereof.

  Specific examples of the aromatic mercaptocarboxylic acid, aromatic dithiol and aromatic mercaptophenol include 4-mercaptobenzoic acid, 2-mercapto-6-naphthoic acid, 2-mercapto-7-naphthoic acid, benzene-1,4- Dithiol, benzene-1,3-dithiol, 2,6-naphthalene-dithiol, 2,7-naphthalene-dithiol, 4-mercaptophenol, 3-mercaptophenol, 6-mercapto-2-hydroxynaphthalene, 7-mercapto-2 -Hydroxynaphthalene and the like, as well as reactive derivatives thereof.

The thermal conductivity of the high thermal conductivity thermoplastic resin composition of the present invention is preferably 0.4 W / (m · K) or more, more preferably 1.0 W / (m · K) or more, and further preferably 5. It is 0 W / (m · K) or more, particularly preferably 10 W / (m · K) or more. By containing the inorganic filler (B) in the thermoplastic resin (A), higher thermal conductivity can be obtained. If the thermal conductivity is low, it is difficult to efficiently transmit the heat generated from the electronic component to the outside. The upper limit of the thermal conductivity is not particularly limited, and is preferably as high as possible. Generally, a thermal conductivity of 100 W / (m · K) or less, further 80 W / (m · K) or less is used. Since the thermoplastic resin (A) has excellent thermal conductivity, it is possible to easily obtain a high thermal conductivity thermoplastic resin composition having a thermal conductivity in the above range.
Various types of (C) stabilizers used in the present invention are known. For example, “Antioxidant Handbook” issued by Taiseisha, “Deterioration and Stabilization of Polymer Materials” (235-235) issued by CM Chemical Co., Ltd. 242) and the like, but are not limited thereto. Among these stabilizers, phosphite stabilizers, thioether stabilizers, phenol stabilizers such as hindered phenol stabilizers and monoacrylate phenol stabilizers can be preferably used.

Examples of phosphite stabilizers include tris (2,4-di-tert-butylphenyl) phosphite, bis [2,4-bis (1,1-dimethylethyl) -6-methylphenyl] ethyl ester phosphorus Acid, bis (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, bis (2,4-dicumylphenyl) pentaerythritol diphosphite, bis (2,6-di-tert-butyl-4) -Methylphenyl) pentaerythritol-di-phosphite and the like. In the product name, ADK STAB PEP-36, ADK STAB PEP-4C, ADK STAB PEP-8, ADK STAB PEP-8F, ADK STAB PEP-8W, ADK STAB PEP-11C, ADK STAB PEP-24G, ADK STAB HP-10, ADK STAB 2112, ADK STAB 260, ADK STAB P, ADK STAB QL, ADK STAB 522A, ADK STAB 329K, ADK STAB 1178, ADK STAB 1500, ADK STAB C, ADK STAB 135A, ADK STAB 3010, ADK STAB TPP (all manufactured by ADK, Inc.), Irgafos 38, IrPG As mentioned above, phosphite stabilizers such as Ciba Specialty Chemicals Co., Ltd. can be exemplified. . Among these, Adeka Stab PEP-36, Adeka Stub, and the like, can effectively show the effect of suppressing the transesterification and hydrolysis reaction of the resin (A), and the stabilizer itself has a high melting point and hardly volatilizes from the resin. HP-10, ADK STAB 2112, ADK STAB PEP-24G, and the like can be preferably used.
Examples of the thioether-based stabilizer include ADK STAB AO-23, ADK STAB AO-412S, ADK STAB AO-503A (all of which are manufactured by ADEKA CORPORATION). Among these, Adekastab AO-412S, which is a tetraester type thioether stabilizer, can be preferably used because it is excellent in the effect of improving the thermal stability of the resin (A).

  The following can be illustrated as a hindered phenol type stabilizer among phenol type stabilizers. 2,6-di-tert-butyl-4-methylphenol, 2,6-di-tert-butyl-4-ethylphenol, mono (or di or tri) (α methylbenzyl) phenol, 2,2′-methylenebis (4-ethyl-6-tert-butylphenol), 2,2'-methylenebis (4-methyl-6-tert-butylphenol), 4,4'-butylidenebis (3-methyl-6-tert-butylphenol), 4, 4′-thiobis (3-methyl-6-tert-butylphenol), 2,5-di-tert-butylhydroquinone, 2,5-di-tert-amylhydroquinone, triethylene glycol-bis- [3- (3- t-butyl-5-methyl-4-hydroxyphenyl) propionate], 1,6-hexanediol-bis [3 (3,5-di-t-butyl-4-hydroxyphenyl) propionate], 2,4-bis- (n-octylthio) -6- (4-hydroxy-3,5-di-t-butylanilino) -1 , 3,5-triazine, pentaerythritol-tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 2,2-thio-diethylenebis [3- (3,5-di -T-butyl-4-hydroxyphenyl) propionate], octadecyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate, N, N′-hexamethylenebis (3,5-di-) t-butyl-4-hydroxy-hydrocinnamamide), 3,5-di-t-butyl-4-hydroxy-benzylphosphonate-diethyl ester, 1,3,5-to Limethyl-2,4,6-tris (3,5-di-tert-butyl-4-hydroxybenzyl) benzene, bis (3,5-di-tert-butyl-4-hydroxybenzylphosphonic acid ethyl) calcium, tris -(3,5-di-t-butyl-4-hydroxybenzyl) isocyanurate, 2,4-2,4-bis [(octylthio) methyl] o-cresol, N, N'-bis [3- (3 , 5-di-t-butyl-4-hydroxyphenyl) propionyl] hydrazine, tris (2,4-di-t-butylphenyl) phosphite, 2- (5-methyl-2-hydroxyphenyl) benzotriazole, 2 -[2-Hydroxy-3,5-bis (α, α-dimethylbenzyl) phenyl] -2H-benzotriazole, 2- (3,5-di-t-butyl-2-hydroxyl Enyl) benzotriazole, 2- (3-t-butyl-5-methyl-2-hydroxyphenyl) -5-chlorobenzotriazole, 2- (3,5-di-t-butyl-2-hydroxyphenyl) -5 -Chlorobenzotriazole, 2- (3,5-di-t-amyl-2-hydroxyphenyl) benzotriazole, 2- (2'-hydroxy-5'-t-octylphenyl) -benzotriazole, methyl-3- [3-t-butyl-5- (2H-benzotriazol-2-yl) -4-hydroxyphenyl] propionate-condensate with polyethylene glycol (molecular weight about 300), hydroxyphenylbenzotriazole derivative, 2- (3 5-Di-t-butyl-4-hydroxybenzyl) -2-n-butylmalonate bis (1,2,2,6,6- Ntamechiru 4-piperidyl), 2,4-di -t- butyl-3,5-di -t- butyl-4-hydroxybenzoate, and the like.

  In terms of product names, Nocrack 200, Nocrack M-17, Nocrack SP, Nocrack SP-N, Nocrack NS-5, Nocrack NS-6, Nocrack NS-30, Nocrack 300, Nocrack NS-7, Nocrack DAH (all above Manufactured by Ouchi Shinsei Chemical Co., Ltd.), ADK STAB AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-60, ADK STAB AO-616, ADK STAB AO-635, ADK STAB AO-658, ADK STAB AO- 80, ADK STAB AO-15, ADK STAB AO-18, ADK STAB 328, ADK STAB AO-37 (all manufactured by ADK), IRGANOX-245, IRGANOX-259, IRGANOX-565, IRGANOX-1010, RGANOX-1024, IRGANOX-1035, IRGANOX-1076, IRGANOX-1081, IRGANOX-1098, IRGANOX-1222, IRGANOX-1330, IRGANOX-1425WL (all of which are manufactured by Ciba Specialty Chemicals), Sumilizer GA-80 (The above are all manufactured by Sumitomo Chemical Co., Ltd.), but are not limited thereto.

Furthermore, a monoacrylate phenol stabilizer having both an acrylate group and a phenol group can be used as the phenol stabilizer. Examples of monoacrylate phenol-based stabilizers include 2-t-butyl-6- (3-t-butyl-2-hydroxy-5-methylbenzyl) -4-methylphenyl acrylate (trade name Sumilizer GM), 2,4. Examples include -di-t-amyl-6- [1- (3,5-di-t-amyl-2-hydroxyphenyl) ethyl] phenyl acrylate (trade name: Sumilizer GS).
In addition to these exemplified stabilizers, various stabilizers can be used in combination. As stabilizers that can be used in combination, nitroxide compounds, light stabilizers, and the like are preferably used in combination.

  Nitroxide compounds include, but are not limited to, 2,2,6,6-substituted-1-piperidinyloxy radicals and 2,2,5,5-substituted-1-pyrrolidinyloxy radicals and the like from cyclic hydroxyamines. The nitroxy free radicals are exemplified. As the substituent, an alkyl group having 4 or less carbon atoms such as a methyl group or an ethyl group is suitable. Specific nitroxy free radical compounds include, but are not limited to, 2,2,6,6-tetramethyl-1-piperidinyloxy radical (TEMPO), 2,2,6,6-tetraethyl-1- Piperidinyloxy radical, 2,2,6,6-tetramethyl-4-oxo-1-piperidinyloxy radical, 2,2,5,5-tetramethyl-1-pyrrolidinyloxy radical, 1, Examples include 1,3,3-tetramethyl-2-isoindolinyloxy radical, N, N-di-t-butylamineoxy radical, and the like. Instead of the nitroxy free radical, a stable free radical such as a galvinoxyl free radical may be used.

  As the light stabilizer, various stabilizers can be used in combination. The effect is further exhibited by the combined use, and the heat resistance may be particularly improved. Tinuvin C353, Tinuvin B75 (all of which are manufactured by Nippon Ciba Geigy Co., Ltd.) and the like in which an antioxidant and a light stabilizer are mixed in advance may be used.

  Among these stabilizers, the combined use of phosphite stabilizers and / or thioether stabilizers and phenol stabilizers increases the synergistic effect of various stabilizers, and also causes thermal decomposition and hydrolysis due to radical generation. It is preferable because a plurality of reactions that may occur in a high-temperature molten state such as decomposition and transesterification can be simultaneously suppressed, and an excellent thermal stabilization effect can be exhibited.

  (C) The amount of the stabilizer used is preferably 0.01 to 5.0% by weight of the stabilizer (C) with respect to 100 parts by weight of the thermoplastic resin (A) because the heat stabilization effect can be enhanced. . A more preferable range is 0.02 to 3.0% by weight, and a most preferable range is 0.05 to 2.0% by weight.

  Since the thermoplastic resin (A) of the present invention has excellent thermal conductivity, it has excellent thermal conductivity without using the inorganic filler (B), but heat is obtained by using the inorganic filler (B). The conductivity can be further improved.

  In the high thermal conductive resin composition of the present invention, when the inorganic filler (B) is used, the amount used is preferably 99: 1 to 20 by volume ratio of the thermoplastic resin (A) and the inorganic filler (B). : 80, preferably 90:10 to 30:70, more preferably 80:20 to 40:60, and particularly preferably 70:30 to 50:50. When the volume ratio of (A) and (B) is within these ranges, the balance between thermal conductivity and mechanical properties is favorable, which is preferable.

  Moreover, even when the volume ratio of the thermoplastic resin (A) and the inorganic filler (B) is as small as 90:10 to 70:30, the high thermal conductivity thermoplastic resin composition has excellent thermal conductivity, At the same time, since the amount of the inorganic filler (B) used is small, the appearance of the molded product is improved during molding, and the density of the molded product can be reduced. The excellent thermal conductivity and appearance of the molded product and the low density are advantageous when used as a resin material for heat dissipation and heat transfer in various situations such as in the electric / electronic industry field and the automobile field.

  As the inorganic filler (B), known fillers can be widely used. The thermal conductivity of the inorganic filler (B) alone is not particularly limited, but is preferably 0.5 W / m · K or more, more preferably 1 W / m · K or more. From the viewpoint that the resulting composition is excellent in thermal conductivity, it is particularly preferable that the composition is a highly thermally conductive inorganic compound having a single thermal conductivity of 10 W / m · K or more.

  The thermal conductivity of the high thermal conductivity inorganic compound alone is preferably 12 W / m · K or more, more preferably 15 W / m · K or more, most preferably 20 W / m · K or more, particularly preferably 30 W / m · K. The above is used. The upper limit of the thermal conductivity of the high thermal conductivity inorganic compound alone is not particularly limited, and it is preferably as high as possible, but is generally 3000 W / m · K or less, more preferably 2500 W / m · K or less. Used.

  In the case where the molded body is used in applications where electrical insulation is not particularly required, a metal-based compound, a conductive carbon compound, or the like can be used as the conductive highly thermally conductive inorganic compound. Examples of the conductive carbon compound include graphite and carbon fiber because of excellent thermal conductivity. As the metal compound, highly heat conductive inorganic compounds such as conductive metal powders, conductive metal fibers, ferrites, and metal oxides can be preferably used. As conductive metal powder, conductive metal powder obtained by atomizing various metals, as conductive metal fiber, conductive metal fiber obtained by processing various metals into fibers, as ferrite, various ferrites such as soft magnetic ferrite, metal Examples of the oxide include highly thermally conductive inorganic compounds such as metal oxides such as zinc oxide.

  Among these, one or more conductive high thermal conductive inorganic compounds selected from the group consisting of graphite, conductive metal powder, soft magnetic ferrite, carbon fiber, conductive metal fiber, and zinc oxide are preferable.

When the molded body is used for applications requiring electrical insulation, a compound exhibiting electrical insulation is preferably used as the highly thermally conductive inorganic compound. Specifically, the electrical insulating property indicates an electrical resistivity of 1 Ω · cm or more, preferably 10 Ω · cm or more, more preferably 10 ⁵ Ω · cm or more, and further preferably 10 ¹⁰ Ω · cm or more. It is preferable to use a material having a size of cm or more, most preferably 10 ¹³ Ω · cm or more. There is no particular restriction on the upper limit of the electrical resistivity, generally less 10 ¹⁸ Ω · cm. It is preferable that the electrical insulation of the molded product obtained from the high thermal conductivity thermoplastic resin composition of the present invention is also in the above range.

  Among the high thermal conductive inorganic compounds, examples of the electrically insulating high thermal conductive inorganic compounds exhibiting electrical insulation include metal oxides, metal nitrides, metal carbides, metal carbonates, insulating carbon materials, and metal hydroxides. can do. Examples of the metal oxide include aluminum oxide, magnesium oxide, silicon oxide, beryllium oxide, copper oxide, and cuprous oxide. Examples of the metal nitride include boron nitride, aluminum nitride, and silicon nitride.

  Examples of the metal carbide include silicon carbide, examples of the metal carbonate include magnesium carbonate, examples of the insulating carbon material include diamond, and examples of the metal hydroxide include aluminum hydroxide and magnesium hydroxide.

  Among them, one or more electrically insulating high heat conductive inorganic substances selected from the group consisting of boron nitride, aluminum nitride, silicon nitride, aluminum oxide, magnesium oxide, magnesium carbonate, aluminum hydroxide, magnesium hydroxide, beryllium oxide, and diamond Compounds are preferred. These can be used alone or in combination.

  Various shapes can be applied to the shape of the high thermal conductive inorganic compound. For example, particles, fine particles, nanoparticles, aggregated particles, tubes, nanotubes, wires, rods, needles, plates, irregular shapes, rugby balls, hexahedrons, large particles and fine particles are combined Various shapes such as a composite particle shape, a liquid, etc. can be exemplified. These high thermal conductivity inorganic compounds may be natural products or synthesized ones. In the case of a natural product, there are no particular limitations on the production area and the like, which can be selected as appropriate. These high thermal conductive inorganic compounds may be used alone or in combination of two or more different shapes, average particle diameters, types, surface treatment agents, and the like.

  These highly heat-conductive inorganic compounds may be those that have been surface-treated with a surface treatment agent in order to enhance the adhesion at the interface between the resin and the inorganic compound or to facilitate workability. It does not specifically limit as a surface treating agent, For example, conventionally well-known things, such as a silane coupling agent and a titanate coupling agent, can be used. Among them, an epoxy group-containing silane coupling agent such as epoxy silane, an amino group-containing silane coupling agent such as aminosilane, polyoxyethylene silane, and the like are preferable because they hardly reduce the physical properties of the resin. The surface treatment method of the inorganic compound is not particularly limited, and a normal treatment method can be used.

  In the resin composition of the present invention, known inorganic fillers can be widely used depending on the purpose in addition to the above-described highly thermally conductive inorganic compound. Since the thermal conductivity of the single resin is high, even if the thermal conductivity of the inorganic compound is relatively low at less than 10 W / mK, the resin composition can exhibit high thermal conductivity.

  Examples of inorganic fillers other than the high thermal conductivity inorganic compound include diatomaceous earth powder; basic magnesium silicate; calcined clay; fine powder silica; quartz powder; crystalline silica; kaolin; talc; antimony trioxide; Examples thereof include molybdenum sulfide; rock wool; ceramic fiber; inorganic fiber such as asbestos; and glass fillers such as glass fiber, glass powder, glass cloth, and fused silica.

  By using these fillers, for example, it is possible to improve favorable characteristics in applying a resin composition such as thermal conductivity, mechanical strength, or abrasion resistance. Further, if necessary, organic fillers such as paper, pulp, wood, synthetic fibers such as polyamide fiber, aramid fiber, and boron fiber; resin powder such as polyolefin powder; can be used in combination.

  The high thermal conductivity thermoplastic resin composition of the present invention includes an epoxy resin, a polyolefin resin, a bismaleimide resin, a polyimide resin, a polyether resin, a phenol resin, a silicone resin, and a polycarbonate as long as the effects of the present invention are not lost. Any known resin such as resin, polyamide resin, polyester resin, fluororesin, acrylic resin, melamine resin, urea resin, urethane resin may be contained. Specific examples of preferred resins include polycarbonate, polyethylene terephthalate, polybutylene terephthalate, liquid crystal polymer, nylon 6, nylon 6,6 and the like. When these resins are used in combination, the amount used is preferably from 0 to 10,000 parts by weight with respect to 100 parts by weight of the thermoplastic resin (A) usually contained in the resin composition.

  In the high thermal conductive resin material of the present invention, as an additive other than the above resin and filler, any other components such as a reinforcing agent, a thickener, a release agent, a coupling agent, a difficult agent, and the like, depending on the purpose. A flame retardant, a flame retardant, a pigment, a colorant, other auxiliary agents, and the like can be added as long as the effects of the present invention are not lost. The amount of these additives used is preferably in the range of 0 to 20 parts by weight in total with respect to 100 parts by weight of the thermoplastic resin.

  The method for producing the composition of the present invention is not particularly limited. For example, it can be produced by drying the above-described components, additives and the like and then melt-kneading them in a melt-kneader such as a single-screw or twin-screw extruder. Moreover, when a compounding component is a liquid, it can also manufacture by adding to a melt-kneader on the way using a liquid supply pump etc.

  Examples of usage forms include various forms such as a resin film, a resin molded product, a resin foam, a paint and a coating agent. As the molding method, for example, injection molding, extrusion molding, vacuum molding, press molding, calendar molding, blow molding, or the like can be used. Since the high thermal conductive thermoplastic resin composition obtained in the present invention is excellent in moldability, it is possible to use injection molding machines that are widely used at present, and special molding such as insert molding, hot runner molding, etc. Is easy to mold.

  The high thermal conductivity thermoplastic resin composition of the present invention can be widely used in various applications such as electronic materials, magnetic materials, catalyst materials, structural materials, optical materials, medical materials, automotive materials, and building materials. is there. In particular, since it has excellent properties such as excellent appearance of molded products and high thermal conductivity, it is very useful as a resin material for heat dissipation and heat transfer.

  The high thermal conductivity thermoplastic resin composition of the present invention can be suitably used for injection molded articles such as home appliances, OA equipment parts, AV equipment parts, automobile interior and exterior parts, and the like. In particular, it can be suitably used as an exterior material in home appliances and office automation equipment that generate a lot of heat. Furthermore, in an electronic device having a heat source inside but difficult to be forcibly cooled by a fan or the like, it is suitably used as an exterior material for these devices in order to dissipate the heat generated inside to the outside.

  Among these, small or portable electronic devices such as portable computers such as notebook computers, PDAs, cellular phones, portable game machines, portable music players, portable TV / video devices, portable video cameras, etc. are preferable among these. It is very useful as a resin for housings, housings, and exterior materials. It can also be used very effectively as a resin for battery peripherals in automobiles, trains, etc., a resin for portable batteries in home appliances, a resin for power distribution parts such as breakers, and a sealing material for motors.

  The highly heat-conductive thermoplastic resin composition of the present invention has a good moldability because it can reduce the blending amount of the high-heat-conductive inorganic material as compared with a conventionally well-known composition, and is a substrate for the above use. It has a useful characteristic as a part or housing use.

Next, the composition of the present invention and the molded product thereof will be described in more detail with reference to examples and comparative examples, but the present invention is not limited to such examples. Unless otherwise specified, the reagents listed below were manufactured by Wako Pure Chemical Industries, Ltd.

[Production Example 1]
4,4′-Dihydroxybiphenyl, tetradecanedioic acid, and acetic anhydride were charged into a closed reactor at a molar ratio of 1: 1.05: 2.1, respectively. A time acetylation reaction was carried out, and polycondensation was carried out by heating to 265 ° C. at a rate of 1 ° C./min. When the acetic acid distillate amount reached 90% of the theoretical acetic acid production amount, while maintaining the temperature, the pressure was reduced to 1.0 torr over about 20 minutes, and melt polymerization was carried out to a high molecular weight. One hour after the start of decompression, the pressure was returned to normal pressure with an inert gas, and the produced polymer (thermoplastic resin (A)) was taken out. The obtained polymer is the thermoplastic resin of the present invention.

  The obtained polymer was dissolved in a 1: 2 (Vol ratio) mixed solvent of p-chlorophenol and o-dichlorobenzene so as to have a concentration of 0.25% by weight, and high-temperature GPC (manufactured by Waters, Inc .; 150- CPC), GPC measurement was performed using polystyrene as a standard substance under the conditions of INJECTOR COMP: 80 ° C., COLUMN COMP: 80 ° C., PUMP / SOLVENT COMP: 60 ° C., and Injection Volume: 200 μl. As a result, the number average molecular weight was 8,500, and the weight average molecular weight was 18,800.

  Moreover, two cylindrical test pieces of 30 mmφ × 3.0 mm thickness were press-molded at 240 ° C., and the thermal conductivity was measured with a 4φ sensor using a hot disk method thermal conductivity measuring device manufactured by Kyoto Electronics Industry. As a result of measurement, the thermal conductivity was 1.36 W / mK.

[Evaluation method]
Thermal conductivity: A test piece was molded from the obtained composition with a 75 t injection molding machine. Two 30 mm square × 3.2 mm thick plate columnar test pieces were cut out from the obtained test pieces, and the thermal conductivity was measured with a 4φ sensor using a hot disk method thermal conductivity measuring device manufactured by Kyoto Electronics Industry.

  Appearance of molded product: Appearance defects such as coloring on the surface of the obtained molded product were visually observed and evaluated according to the following criteria. A: Appearance is very good with no coloration, etc. B: Appearance is good in a range where there is no problem in practical use although slight coloration is seen, Δ: Appearance defects such as partial coloration are seen, X: Coloring Appearance failure, XX: Vigorous coloring and appearance is extremely poor.

[Example 1]
With respect to 100 parts by weight of the thermoplastic resin (A) synthesized in Production Example 1, 0.2 part by weight of HP-10 (manufactured by ADEKA Co., Ltd.), which is a phosphite-based stabilizer, is used as a stabilizer. After adding 0.2 parts by weight of AO-60 (manufactured by ADEKA Co., Ltd.) as a system stabilizer and mixing it with a Henschel mixer, it is near the screw root of a 45 mm co-directional meshing twin screw extruder TEX44 manufactured by Nippon Steel Works. It was introduced from the hopper provided. The set temperature was 200 ° C. in the vicinity of the supply port, and the set temperature was sequentially increased, and the extruder screw tip temperature was set to 220 ° C.

  Under these conditions, a highly heat conductive thermoplastic resin composition was obtained. The obtained composition was dried at 140 ° C. for 4 hours, and then injection molded using a 75 tmm injection molding machine manufactured by Toshiba Machine. The molding conditions were set to a cylinder temperature of 220 ° C, a nozzle part temperature of 220 ° C, and a mold temperature of 120 ° C. As a result of evaluating the thermal conductivity of the obtained molded product, the thermal conductivity was 1.36 W / mK, and the molded product appearance was ◎.

[Example 2]
Boron nitride powder (PT110 manufactured by Momentive Performance Materials, Inc., single unit thermal conductivity 60 W / m · K) with respect to 100 parts by weight of the thermoplastic resin (A) synthesized in Production Example 1 , Volume average particle diameter 45 μm, electric insulation, volume resistivity 10 ¹⁴ Ω · cm) (h-BN) 50 parts by weight, (C) HP-10 as a phosphite stabilizer as a stabilizer (Corporation) ADEKA) 0.2 parts by weight, phenolic stabilizer AO-60 (Adeka Co., Ltd. ADEKA) 0.2 parts by weight, mixed in a Henschel mixer, 45mm in the same direction meshing It injected | thrown-in from the hopper provided in the screw | thread base vicinity of type | mold biaxial extruder TEX44.

  The set temperature was 200 ° C. in the vicinity of the supply port, and the set temperature was sequentially increased, and the extruder screw tip temperature was set to 250 ° C. Under these conditions, a highly heat conductive thermoplastic resin composition was obtained. The obtained composition was injection-molded in the same manner as in Example 1. As a result, the injection moldability was good, the thermal conductivity of the molded product was 5.61 W / mK, and the appearance of the molded product was ◯.

[Comparative Example 1]
(C) Evaluation was performed in the same manner as in Example 1 except that no stabilizer was used. As a result of evaluating the obtained molded product, the thermal conductivity was 1.36 W / mK, and the appearance of the molded product was colored, resulting in Δ.

[Comparative Example 2]
(C) Evaluation was performed in the same manner as in Example 2 except that no stabilizer was used. As a result of evaluating the obtained molded product, the thermal conductivity was 5.70 W / mK, and the appearance of the molded product: considerable coloring was generated.

[Comparative Example 3]
Evaluation was performed in the same manner as in Example 1 except that polyethylene terephthalate (Bell Polyester Products Belpet EFG-70) was used as the thermoplastic resin, and the extruder screw tip temperature and die temperature were set to 270 ° C. It was. As a result of evaluating the obtained molded product, the thermal conductivity was 0.21 W / mK and the molded product appearance was ◎.

[Comparative Example 4]
Evaluation was performed in the same manner as in Example 2 except that polyethylene terephthalate (Bell Polyester Products Belpet EFG-70) was used as the thermoplastic resin and the extruder screw tip temperature and parison temperature were set to 270 ° C. It was. As a result of evaluating the molded product, the thermal conductivity was 1.05 W / mK, the molded product appearance was ◯, and the thermal conductivity was significantly lower than that of Example 2.

[Example 3]
For 100 parts by weight of the thermoplastic resin (A) synthesized in Production Example 1, natural scaly graphite powder as an inorganic filler (B) (BF-250A manufactured by Chuetsu Graphite Co., Ltd., thermal conductivity 1200 W / alone) m · K, volume average particle diameter 250.0 μm, conductivity) (GC) 50 parts by weight, phenol stabilizer AO-60 (manufactured by ADEKA) 0.2 part by weight, Henschel mixer Then, the mixture was fed from a hopper provided in the vicinity of the screw root of a 45 mm same-direction meshing twin screw extruder TEX44 manufactured by Nippon Steel Works.

  The set temperature was 200 ° C. in the vicinity of the supply port, and the set temperature was sequentially increased, and the extruder screw tip temperature was set to 250 ° C. A high thermal conductive resin composition was obtained under these conditions. The obtained composition was injection-molded in the same manner as in Example 1. As a result, the moldability was good, the thermal conductivity of the molded product was 40.1 W / mK, and the appearance of the molded product was ◯.

As described above, since the high thermal conductivity thermoplastic resin composition of the present invention uses a thermoplastic resin having excellent thermal conductivity, high thermal conductivity can be obtained without blending a large amount of high thermal conductivity inorganic filler. The resin composition shown is obtained. Therefore, when the resin composition is injection-molded, a molded product having a good appearance can be obtained without causing problems such as coloring in the molded product. Such a composition can be used as a heat-dissipating / heat-transfer resin material in various situations such as in the electric / electronic industrial field and the automobile field, and is industrially useful.

Claims (10)

Repeating units of units (A) a main chain represented by the following following general formula (1), comprising more than 50 mol% relative to all the structural units in the main chain, the general formula (1) is the following general formula (2) consists repeating units of units represented, with respect mainly consists chain structure, the thermal conductivity of a resin alone is 0.45 W / thermoplastic resin is (m · K) or more fat (a) 100 parts by weight of, A highly heat-conductive thermoplastic resin composition containing 0.01 to 5.0% by weight of one or more stabilizers (C) selected from phosphite stabilizers, thioether stabilizers, and phenol stabilizers.
-M-Sp- (1)
(In the formula, M represents a mesogenic group, and Sp represents a spacer.)
^{-A 1 -x-A 2 -y-} R-z- (2)
(In the formula, A ¹ and A ² each independently represent a substituent selected from an aromatic group, a condensed aromatic group, an alicyclic group, and an alicyclic heterocyclic group. X represents a direct bond, —CH _{2 -CH 2 -, - C =} C -, - C≡C -, - CO-O -, - CO-NH -, - CH = N -, - CH = N-N = CH -, - N = N A divalent substituent selected from the group of-or -N (O) = N-, -yRz- is -O-CO-R-CO-O-, and R is a straight chain (It is an aliphatic hydrocarbon chain.) The high thermal conductivity thermoplastic resin composition according to claim 1, wherein R has 2 to 20 main chain atoms . The portion corresponding to -A ¹ -x-A ² -is a mesogenic group represented by the following general formula (3), characterized in that it has a high thermal conductivity thermoplastic resin composition according to claim 1 or 2. .

The high thermal conductivity thermoplastic resin composition according to any one of claims 1 to 3 , wherein the number of carbon atoms in the R molecular chain of the thermoplastic resin is an even number. R of the thermoplastic resin is at least one selected from — (CH ₂ ) ₈ —, — (CH ₂ ) ₁₀ —, and — (CH ₂ ) ₁₂ —, and the number average molecular weight is 3000 to 40000. The high thermal conductivity thermoplastic resin composition according to any one of 1 to 4 . Inorganic filler (B) containing claim 1-5 highly thermally conductive thermoplastic resin composition according to any one. Inorganic filler (B), characterized in that the thermal conductivity by itself is an inorganic compound described above 12W / m · K, highly thermally conductive thermoplastic resin composition according to claim 6. Inorganic filler (B), characterized in that electrically insulating highly thermally conductive inorganic compounds, highly thermally conductive thermoplastic resin composition according to claim 6 or 7. Inorganic filler (B), characterized in that it is a conductive highly thermally conductive inorganic compounds, highly thermally conductive thermoplastic resin composition according to claim 6 or 7. The high thermal conductivity according to any one of claims 1 to 9 , wherein the stabilizer (C) is used in combination with a phosphite stabilizer and / or a thioether stabilizer and a phenol stabilizer . The thermoplastic resin composition.