JP5526911B2 - Polishing pad - Google Patents
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- JP5526911B2 JP5526911B2 JP2010069763A JP2010069763A JP5526911B2 JP 5526911 B2 JP5526911 B2 JP 5526911B2 JP 2010069763 A JP2010069763 A JP 2010069763A JP 2010069763 A JP2010069763 A JP 2010069763A JP 5526911 B2 JP5526911 B2 JP 5526911B2
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本発明は、半導体、誘電/金属複合体及び集積回路等において平坦面を形成するのに使用される研磨パッドに関するものである。 The present invention relates to a polishing pad used to form a flat surface in semiconductors, dielectric / metal composites, integrated circuits, and the like.
半導体デバイスが高密度化するにつれ、多層配線と、これに伴う層間絶縁膜形成や、プラグ、ダマシンなどの電極形成等の技術が重要度を増している。これに伴い、これら層間絶縁膜や電極の金属膜の平坦化プロセスの重要度は増しており、この平坦化プロセスのための効率的な技術として、CMP(Chemical Mechanical Polishing)と呼ばれる研磨技術が普及している。 As the density of semiconductor devices increases, the importance of multilayer wiring and the accompanying interlayer insulation film formation, electrode formation of plugs, damascene, and the like is increasing. Along with this, the importance of the flattening process of these interlayer insulating films and electrode metal films has increased, and a polishing technique called CMP (Chemical Mechanical Polishing) has become widespread as an efficient technique for this flattening process. doing.
金属膜を平坦化する場合は、金属膜が完全に除去される終点を研磨中に検出する必要がある(図1)。この様な終点検出をおこなう時には窓付き研磨パッド(図2)が使用されている。図2上は上面図であり、図2下は断面図である。窓付き研磨パッドが研磨層1とクッション層4が、図では表していないが、粘着層で貼り合わされている場合、窓付き研磨パッドの研磨層1上に滴下されたスラリーは、研磨層1内に浸透し、クッション層4の上面に到達することがある。このスラリーは、クッション層4の上側の粘着層と化学反応を起こすことにより、ガスを発生させる。このガスは、窓部材2の下の空洞に収集される。すると、この部分で貼り合わされている研磨層1がクッション層4から剥離し、研磨層1の窓部材2の周囲が盛り上がる。この結果、被研磨面の金属膜に窓部材2が強く当たり、スクラッチを発生するという不具合が発生する。
When the metal film is planarized, it is necessary to detect the end point at which the metal film is completely removed during polishing (FIG. 1). When such end point detection is performed, a polishing pad with a window (FIG. 2) is used. 2 is a top view and FIG. 2 is a cross-sectional view. When the polishing pad with window is not shown in the figure, the
この様な問題を解決する手段として、研磨層とクッション層と窓部材からなる積層パッドで、クッション層の一部に窓部材の下の空洞から排気路が設けられおり、空洞内に貯まるガスが排気路を通して放圧して、窓部材の盛り上がりを防止する技術が知られていた(特許文献1)。しかしながら、クッション層に設けられた排気路の上部の研磨層部分では、陥没が排気路に発生し、陥没部分にスラリー屑が貯まり、スクラッチの原因となるという問題があることが判明した。 As a means for solving such a problem, a laminated pad comprising a polishing layer, a cushion layer and a window member is provided, and an exhaust passage is provided in a part of the cushion layer from a cavity under the window member, and gas stored in the cavity is A technique for releasing pressure through an exhaust passage to prevent the window member from rising is known (Patent Document 1). However, it has been found that there is a problem that in the polishing layer portion on the upper portion of the exhaust passage provided in the cushion layer, a depression occurs in the exhaust passage, and slurry debris accumulates in the depressed portion, causing a scratch.
本発明は、かかる従来技術の背景に鑑み、金属膜の被研磨材を研磨パッド上にスラリーを供給し終点検出をおこないながら研磨をおこなう際に、スクラッチが生じないで良好な終点検出が実現できる研磨パッドを提供することにある。 In view of the background of the prior art, the present invention can realize good end point detection without scratching when polishing a metal film to be polished while supplying slurry to the polishing pad and detecting end point. It is to provide a polishing pad.
本発明は、上記課題を解決するために、次のような手段を採用するものである。すなわち、研磨層とクッション層と窓部材からなる研磨パッドであって、窓部材がフッ素を含有する重合体で作成され、該窓部材には表面から裏面に最大孔径が0.01mm以上0.1mm以下の貫通孔を有していることを特徴とする研磨パッド。 In order to solve the above problems, the present invention employs the following means. That is, a polishing pad comprising a polishing layer, a cushion layer, and a window member, wherein the window member is made of a polymer containing fluorine, and the maximum hole diameter from the front surface to the back surface of the window member is 0.01 mm or more and 0.1 mm. A polishing pad having the following through-holes.
本発明により、金属膜の被研磨材を研磨パッド上にスラリーを供給し終点検出をおこないながら研磨をおこなう際に、スクラッチが生じないで良好な終点検出が実現できる。 According to the present invention, when polishing is performed while supplying a slurry to a material to be polished of a metal film on a polishing pad and detecting an end point, good end point detection can be realized without causing a scratch.
本発明は、金属膜の被研磨材を研磨パッド上にスラリーを供給しながら研磨をおこなう際に、スクラッチが発生せずに、終点検出が良好に研磨が出来る研磨パッドを鋭意検討した結果、研磨層とクッション層と窓部材からなる研磨パッドであって、窓部材がフッ素を含有する重合体で作成され、該窓部材には表面から裏面に最大孔径が0.01mm以上0.1mm以下の貫通孔を有していることを特徴とする研磨パッドにしたところ、かかる課題を一挙に解決することができることを究明したものである。 The present invention is a result of intensive investigation of a polishing pad that can be polished with good end point detection without causing scratches when polishing a metal film to be polished while supplying slurry onto the polishing pad. A polishing pad comprising a layer, a cushion layer, and a window member, wherein the window member is made of a fluorine-containing polymer, and the window member has a maximum hole diameter of 0.01 mm to 0.1 mm from the front surface to the back surface. When a polishing pad having a hole is used, it has been found that such problems can be solved at once.
本発明の研磨パッドを構成する研磨層としては、マイクロゴムA硬度で75度以上であり、独立気泡を有する構造のものが、半導体、誘電/金属複合体及び集積回路等において平坦面を形成するので好ましい。特に限定されないが、かかる構造体を形成する材料としては、ポリエチレン、ポリプロピレン、ポリエステル、ポリウレタン、ポリウレア、ポリアミド、ポリ塩化ビニル、ポリアセタール、ポリカーボネート、ポリメチルメタクリレート、ポリテトラフルオロエチレン、エポキシ樹脂、ABS樹脂、AS樹脂、フェノール樹脂、メラミン樹脂、ネオプレンゴム、ブタジエンゴム、スチレンブタジエンゴム、エチレンプロピレンゴム、シリコンゴム、フッ素ゴムおよびこれらを主成分とした樹脂等が挙げられる。このような樹脂においても、独立気泡径が比較的容易にコントロールできる点でポリウレタンを主成分とする素材がより好ましい。 As a polishing layer constituting the polishing pad of the present invention, a micro rubber A hardness of 75 degrees or more and a structure having closed cells forms a flat surface in a semiconductor, a dielectric / metal composite, an integrated circuit, or the like. Therefore, it is preferable. Although not particularly limited, materials for forming such a structure include polyethylene, polypropylene, polyester, polyurethane, polyurea, polyamide, polyvinyl chloride, polyacetal, polycarbonate, polymethyl methacrylate, polytetrafluoroethylene, epoxy resin, ABS resin, Examples include AS resin, phenol resin, melamine resin, neoprene rubber, butadiene rubber, styrene butadiene rubber, ethylene propylene rubber, silicon rubber, fluoro rubber, and resins mainly composed of these. Even in such a resin, a material mainly composed of polyurethane is more preferable in that the closed cell diameter can be controlled relatively easily.
本発明におけるポリウレタンとは、ポリイソシアネートの重付加反応または重合反応に基づき合成される高分子である。ポリイソシアネートの対称として用いられる化合物は、含活性水素化合物、すなわち、二つ以上のポリヒドロキシ基、あるいはアミノ基含有化合物である。ポリイソシアネートとして、トリレンジイソシアネート、ジフェニルメタンジイソシアネート、ナフタレンジイソシアネート、ヘキサメチレンジイソシアネート、イソホロンジイソシアネートなど挙げることができるがこれに限定されるものではない。ポリヒドロキシ基含有化合物としてはポリオールが代表的であり、ポリエーテルポリオール、ポリテトラメチレンエーテルグリコール、エポキシ樹脂変性ポリオール、ポリエステルポリオール、アクリルポリオール、ポリブタジエンポリオール、シリコーンポリオール等が挙げられる。硬度,気泡径および発泡倍率によって、ポリイソシアネートとポリオール、および触媒、発泡剤、整泡剤の組み合わせや最適量を決めることが好ましい。 The polyurethane in the present invention is a polymer synthesized based on polyisocyanate polyaddition reaction or polymerization reaction. The compound used as the symmetry of the polyisocyanate is an active hydrogen-containing compound, that is, a compound containing two or more polyhydroxy groups or amino groups. Examples of the polyisocyanate include tolylene diisocyanate, diphenylmethane diisocyanate, naphthalene diisocyanate, hexamethylene diisocyanate, and isophorone diisocyanate, but are not limited thereto. The polyhydroxy group-containing compound is typically a polyol, and examples thereof include polyether polyol, polytetramethylene ether glycol, epoxy resin-modified polyol, polyester polyol, acrylic polyol, polybutadiene polyol, and silicone polyol. The combination and optimum amount of polyisocyanate and polyol, catalyst, foaming agent, and foam stabilizer are preferably determined according to the hardness, the bubble diameter, and the expansion ratio.
これらのポリウレタン中への独立気泡の形成方法としては、ポリウレタン製造時における樹脂中への各種発泡剤の配合による化学発泡法が一般的であるが、機械的な撹拌により樹脂を発泡させたのち硬化させる方法も好ましく使用することができる。 As a method of forming closed cells in these polyurethanes, the chemical foaming method is generally used by blending various foaming agents into the resin during polyurethane production, but it is cured after foaming the resin by mechanical stirring. The method of making it can also be used preferably.
かかる独立気泡の平均気泡径は30μm以上で150μm以下であることがスクラッチは少なく、半導体基板の局所的凹凸の平坦性が良好であることを両立できる点で好ましい。平均気泡径が140μm以下、さらには130μm以下であることがさらに好ましい。平均気泡径が30μm未満の場合、スクラッチが多くなり好ましくない場合がある。本発明の研磨層は、密度が0.3〜0.9g/cm3の範囲にあることが好ましい。密度が0.3g/cm3に満たない場合、局所的な平坦性が不良となり、グローバル段差が大きくなる場合がある。密度が0.9g/cm3を越える場合は、スクラッチが発生しやすくなる。さらに好ましい密度は、0.5〜0.8g/cm3、また、さらに好ましい密度は0.60〜0.75g/cm3の範囲である。 The average cell diameter of such closed cells is preferably 30 μm or more and 150 μm or less, which is preferable in terms of having little scratches and good flatness of local unevenness of the semiconductor substrate. The average cell diameter is more preferably 140 μm or less, and further preferably 130 μm or less. When the average bubble diameter is less than 30 μm, the number of scratches may increase, which may be undesirable. The polishing layer of the present invention preferably has a density in the range of 0.3 to 0.9 g / cm 3 . When the density is less than 0.3 g / cm 3 , local flatness may be poor, and the global level difference may be increased. When the density exceeds 0.9 g / cm 3 , scratches are likely to occur. A more preferable density is 0.5 to 0.8 g / cm 3 , and a more preferable density is 0.60 to 0.75 g / cm 3 .
本発明の研磨パッドの研磨層表面には、ハイドロプレーン現象を抑える為に、溝切り形状、ディンプル形状、スパイラル形状、同心円形状等、通常の研磨パッドがとり得る溝(グルーブ)が形成されて使用される。 On the surface of the polishing layer of the polishing pad of the present invention, in order to suppress the hydroplane phenomenon, grooves (grooves) that can be taken by a normal polishing pad, such as a grooving shape, dimple shape, spiral shape, concentric shape, etc., are formed and used. Is done.
本発明のクッション層は、発泡型のクッション層でも無発泡ポリウレタンゴムでもどちらでも使用できる。 The cushion layer of the present invention can be either a foam type cushion layer or non-foamed polyurethane rubber.
本発明の窓部材には、窓部材の下の空洞に貯まるガスを抜くために、最大孔径で0.01mm以上0.1mm以下の貫通孔が開けられている。ドリルなどの機械的な加工やレーザー等の加工を適用する事が出来る。最大孔径とは、複数の貫通孔が存在する場合の最大の孔径を意味する。単独の貫通孔が存在する場合はそれ自身の直径となる。最大孔径で0.01mm以上0.1mm以下の貫通孔を開けた場合、窓材料がフッ素を含有する重合体で作成されていると撥水性が高いので、ガス抜きとして開けられた最大孔径0.01mm以上0.1mm以下の貫通孔から研磨中に供給されるスラリーや水が下に漏れることは防止できる。 In the window member of the present invention, a through hole having a maximum hole diameter of 0.01 mm or more and 0.1 mm or less is formed in order to remove gas accumulated in a cavity below the window member. Mechanical processing such as drilling and laser processing can be applied. The maximum hole diameter means the maximum hole diameter when there are a plurality of through holes. If there is a single through hole, it has its own diameter. When a through hole having a maximum hole diameter of 0.01 mm or more and 0.1 mm or less is opened, the window material made of a fluorine-containing polymer has high water repellency. It is possible to prevent the slurry and water supplied during polishing from leaking through a through hole of 01 mm or more and 0.1 mm or less.
特に、フッ素原子が3〜17個を含有するメチルメタアクリレート系モノマーから重合された重合体で作成された窓部材は、撥水性が高いので、最大孔径0.01mm以上0.1mm以下の貫通孔を開けても、スラリーや水が漏れることなく、良好にガス抜きが可能であるので好ましい。 In particular, a window member made of a polymer polymerized from a methyl methacrylate monomer containing 3 to 17 fluorine atoms has high water repellency, so that a through-hole having a maximum pore diameter of 0.01 mm or more and 0.1 mm or less Even if it is opened, it is preferable because degassing can be satisfactorily performed without leakage of slurry and water.
フッ素原子が3〜17個を含有するメチルメタアクリレート系モノマーの中でも、2,2,2トリフルオロエチルメタアクリレートまたは2,2,3,3−テトラフルオロプロピルメタアクリレートまたは1H,1H,5H−オクタフルオロペンチルメタアクリレートまたは1,1,2,2−パーフルオロデシルメタアクリレートの中から選ばれたモノマーから重合された重合体で作成された窓部材は、撥水性が高いので、最大孔径0.01mm以上0.1mm以下の貫通孔を開けても、スラリーや水が漏れることなく、良好にガス抜きが可能で、さらにドレサーで適度な研削が出来るので、研磨中に研磨層の高さと窓部材の高さが同じレベルとなり、窓部材が被研磨面に強くこすりつけられることが無く、スクラッチが入らないので、特に好ましい。 Among methyl methacrylate monomers containing 3 to 17 fluorine atoms, 2,2,2 trifluoroethyl methacrylate or 2,2,3,3-tetrafluoropropyl methacrylate or 1H, 1H, 5H-octa A window member made of a polymer polymerized from a monomer selected from fluoropentyl methacrylate or 1,1,2,2-perfluorodecyl methacrylate has high water repellency, and therefore has a maximum pore diameter of 0.01 mm. Even if a through hole with a diameter of 0.1 mm or less is opened, the slurry and water do not leak, it is possible to vent the gas well, and further, appropriate dressing can be performed with a dresser. Since the height is the same level, the window member is not strongly rubbed against the surface to be polished, and scratches do not enter. Masui.
これらのモノマーを重合する方法としては、窓部材と同じ間隙となる様な金型容器にモノマーとラジカル開始剤を添加して流し込み、加温することで重合をおこなうことで可能である。重合温度しては、40〜60℃で、ラジカル開始剤として、アゾビス系の開始剤や過酸化物系の開始剤が使用できる。窓部材の大きさは、厚みは研磨層と同じ厚みとし、大きさは、研磨層の窓部材はめ込み穴にはめ込める様に、0.5mm程度小さい大きさにするとはめ込みやすいので、好ましい。クッション層の貫通孔は、窓部材より端から最低2mm程度小さい大きさとすることで、研磨層のはめ込み穴にかからないクッション層の肩の部分が出来、ここに接着剤または粘着剤を塗布しておくことで、窓部材を研磨層のはめ込み穴に納めた際に、クッション層の肩の部分に固定されるので、スラリーや水がクッション層の貫通孔部分にリークすることはない。窓部材の0.01mm以上0.1mm以下の貫通孔は、クッション層の貫通孔に連絡する位置に開けておく必要がある。なぜなら、クッション層の貫通孔に蓄積されるガスを抜くことが、窓部材の貫通孔の目的であるからである。 As a method for polymerizing these monomers, it is possible to perform polymerization by adding the monomer and the radical initiator to a mold vessel that has the same gap as the window member, and pouring and heating. The polymerization temperature is 40 to 60 ° C., and an azobis-based initiator or a peroxide-based initiator can be used as a radical initiator. As for the size of the window member, the thickness is the same as that of the polishing layer, and the size of the window member of the polishing layer is preferably about 0.5 mm smaller so that the window member can be fitted into the fitting hole. By making the through hole of the cushion layer at least 2 mm smaller than the end of the window member, a shoulder portion of the cushion layer that does not cover the insertion hole of the polishing layer can be formed, and an adhesive or a pressure-sensitive adhesive is applied thereto. Thus, when the window member is placed in the fitting hole of the polishing layer, it is fixed to the shoulder portion of the cushion layer, so that slurry or water does not leak into the through hole portion of the cushion layer. It is necessary to open the through-hole of 0.01 mm or more and 0.1 mm or less of a window member in the position connected with the through-hole of a cushion layer. This is because the purpose of the through hole of the window member is to remove the gas accumulated in the through hole of the cushion layer.
本発明の研磨パッドを用いて、スラリーとしてシリカ系スラリー、酸化アルミニウム系スラリー、酸化セリウム系スラリー等を用いて半導体ウェハ上での金属配線を終点検出しながらスクラッチが生じることなく良好に研磨ができる。 By using the polishing pad of the present invention, silica-based slurry, aluminum oxide-based slurry, cerium oxide-based slurry, etc. can be used as the slurry, and polishing can be satisfactorily performed without detecting scratch while detecting the end point of the metal wiring on the semiconductor wafer. .
本発明の研磨パッドの対象は、例えば半導体ウェハの上に形成された金属配線の表面であるが、金属配線としては、アルミ、タングステン、銅等であり、構造的にダマシン、デュアルダマシン、プラグなどがある。銅を金属配線とした場合には、窒化珪素等のバリアメタルも研磨対象となる。本発明の研磨パッドでは、金属配線を終点検出しながらスクラッチが入ることなく、良好な研磨が可能である。 The object of the polishing pad of the present invention is, for example, the surface of a metal wiring formed on a semiconductor wafer, and the metal wiring is aluminum, tungsten, copper or the like, and structurally damascene, dual damascene, plug, etc. There is. When copper is used as the metal wiring, a barrier metal such as silicon nitride is also subject to polishing. With the polishing pad of the present invention, good polishing is possible without scratching while detecting the end point of the metal wiring.
以下、実施例によって、さらに本発明の詳細を説明する。しかし、本実施例により本発明が限定して解釈される訳ではない
実施例1
2,2,2トリフルオロエチルメタアクリレート100重量部、アゾイソブチロニトリル0.3重量部を金型容器に注入して、金型容器ごと65℃の温水浴に24時間浸漬して、厚み2mmの板を成型した。該成型シートから縦57.5mm、横18.5mmの窓部材を作成し、窓部材の中央部に直径0.05mmの貫通孔をレーザーで開けた。
Hereinafter, the details of the present invention will be described with reference to examples. However, the present invention is not construed as being limited by the present embodiment.
100 parts by weight of 2,2,2 trifluoroethyl methacrylate and 0.3 parts by weight of azoisobutyronitrile are poured into a mold container, and the mold container is immersed in a warm water bath at 65 ° C. for 24 hours to obtain a thickness. A 2 mm plate was molded. A window member having a length of 57.5 mm and a width of 18.5 mm was formed from the molded sheet, and a through-hole having a diameter of 0.05 mm was opened by a laser at the center of the window member.
ポリエーテル系ウレタンポリマ(ユニローヤル社製アジプレンL−325)78重量部と4,4´−メチレン−ビス2−クロロアニリン20重量部と中空高分子微小球(ケマノーベル社製エクスパンセル551 DE)3.6重量部をRIM成形機で混合して金型に吐出して高分子成形体を作成した。この高分子成形体をスライサーで2.0mm厚みにスライスして、研磨シートを作成した。この研磨シートのマイクロゴムA硬度は、90度、密度は、0.73g/cm3、平均気泡径は、30μであった。クッションシートとして密度0.55g/cm3、厚み1mmの発泡ポリウレタンシートを用意した。 78 parts by weight of a polyether-based urethane polymer (Adiprene L-325 manufactured by Uniroyal), 20 parts by weight of 4,4′-methylene-bis-2-chloroaniline and hollow polymer microspheres (Expancel 551 DE manufactured by Keman Nobel) 3.6 parts by weight were mixed with a RIM molding machine and discharged into a mold to prepare a polymer molded body. This polymer molded body was sliced with a slicer to a thickness of 2.0 mm to prepare an abrasive sheet. The polishing sheet had a micro rubber A hardness of 90 degrees, a density of 0.73 g / cm 3 , and an average cell diameter of 30 μm. A foamed polyurethane sheet having a density of 0.55 g / cm 3 and a thickness of 1 mm was prepared as a cushion sheet.
得られた研磨シートから直径508mmの円形の研磨層を切り出した。はめ込み穴の研磨層の中心に近い端の位置が研磨層の中心から74mmのところに、縦58mm、横19mmのめ込み穴を打ち抜き機で形成した。クッションシートを積水化学工業(株)製の粘着テープ5782Wと住友3M(株)製442J両面テープを貼り合わせてから直径508mmの得られた円形のテープ付きクッション層を作成し、テープ付きクッション層の端から76mmのところに、縦54mm、横15mmの貫通孔を作成する。該研磨層のはめ込み穴と該クッション層の貫通孔がそれぞれ合わさる様に粘着テープ面で貼り合わせをおこない、研磨層のはめ込み穴に該窓部材をはめ込んで、クッション層の粘着面で窓部材を固定して、窓付き研磨パッドを作成した。窓部材以外の研磨層表面に溝幅1.0mm、溝ピッチ10.0mm、溝深さ1.0mmの格子状に配列された溝を、NC(数値制御)ルーターを用いて形成した。 A circular polishing layer having a diameter of 508 mm was cut out from the obtained polishing sheet. An inset hole having a length of 58 mm and a width of 19 mm was formed by a punching machine at a position where the end of the inset hole near the center of the polishing layer was 74 mm from the center of the polishing layer. After the cushion sheet was bonded to Sekisui Chemical Co., Ltd. adhesive tape 5782W and Sumitomo 3M Co., Ltd. 442J double-sided tape, a circular cushion layer with a tape having a diameter of 508 mm was prepared. A through hole with a length of 54 mm and a width of 15 mm is formed at a position 76 mm from the end. Adhesion is performed on the adhesive tape surface so that the fitting hole of the polishing layer and the through hole of the cushion layer are aligned, and the window member is fitted into the fitting hole of the polishing layer, and the window member is fixed with the adhesion surface of the cushion layer. Thus, a polishing pad with a window was prepared. Grooves arranged in a grid pattern with a groove width of 1.0 mm, a groove pitch of 10.0 mm, and a groove depth of 1.0 mm were formed on the surface of the polishing layer other than the window member using an NC (numerical control) router.
ここに作製された研磨パッドを、レーザーで終点検出が可能な研磨機に貼り付けて、フジミ製Cu用スラリーPL−7105(登録商標)を150ml/分流し、研磨圧力=2psi、研磨定盤速度=33rpm、研磨ヘッド速度=30rpmでSKW製の8インチCu用パターンウェハーをSKW6−3.18C(登録商標)を用いCuクリアー後、過研磨時間=10秒で研磨をおこなった。この時、研磨中の終点検出シグナルは安定して、きっちり終点検出ができた。また、CuクリアーしたCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ30個と少なかった。 The polishing pad prepared here was attached to a polishing machine capable of detecting the end point with a laser, and 150 ml / minute of a slurry for Fujimi PL-7105 (registered trademark) was supplied, polishing pressure = 2 psi, polishing plate speed Polishing was performed at an over-polishing time of 10 seconds after SKW 6- 3.18C (registered trademark) was used to clear Cu using a SKW 6- 3.18C (registered trademark) at a polishing wafer speed of 33 rpm and a polishing head speed of 30 rpm. At this time, the end point detection signal during polishing was stable and the end point could be detected exactly. Further, when the scratches of 0.15 μm or more were measured with a defect inspection apparatus on the Cu-cleared Cu pattern wafer, the number was as small as 30.
同研磨条件で1000枚研磨をおこない、終点検出の安定性を見たが、安定しており、1000枚後に研磨したCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ35個と少なかった。また、窓部材の上部への膨れも見られず、窓部材の下のクッション層の貫通孔に、スラリーや水が漏れていなかった。 Polishing 1000 sheets under the same polishing conditions and seeing the stability of the end point detection, it was stable, and when a scratch of 0.15 μm or more was measured with a defect inspection apparatus on a Cu patterned wafer polished 1000 sheets later, 35 There were few. Moreover, the swelling to the upper part of a window member was not seen, and the slurry and water did not leak into the through-hole of the cushion layer under a window member.
実施例2
2,2,3,3−テトラフルオロプロピルメタアクリレート100重量部、アゾイソブチロニトリル0.3重量部を金型容器に注入して、金型容器ごと65℃の温水浴に24時間浸漬して、厚み2mmの板を成型した。該成型シートから縦57.5mm、横18.5mmの窓部材を作成し、窓部材の中央部に直径0.01mmの貫通孔をレーザーで開けた。
Example 2
100 parts by weight of 2,2,3,3-tetrafluoropropyl methacrylate and 0.3 parts by weight of azoisobutyronitrile are poured into a mold container, and the mold container is immersed in a warm water bath at 65 ° C. for 24 hours. Then, a 2 mm thick plate was molded. A window member having a length of 57.5 mm and a width of 18.5 mm was prepared from the molded sheet, and a through-hole having a diameter of 0.01 mm was opened by a laser at the center of the window member.
実施例1で作成した同じ研磨パッドを用意し、研磨層のはめ込み穴に該窓部材をはめ込んで、クッション層の粘着面で窓部材を固定して、窓付き研磨パッドを作成した。窓部材以外の研磨層表面に溝幅1.0mm、溝ピッチ10.0mm、溝深さ1.0mmの格子状に配列された溝を、NC(数値制御)ルーターを用いて形成した。 The same polishing pad prepared in Example 1 was prepared, and the window member was fitted into the fitting hole of the polishing layer, and the window member was fixed with the adhesive surface of the cushion layer to prepare a polishing pad with a window. Grooves arranged in a grid pattern with a groove width of 1.0 mm, a groove pitch of 10.0 mm, and a groove depth of 1.0 mm were formed on the surface of the polishing layer other than the window member using an NC (numerical control) router.
ここに作製された研磨パッドを、レーザーで終点検出が可能な研磨機に貼り付けて、フジミ製Cu用スラリーPL−7105(登録商標)を150ml/分流し、研磨圧力=2psi、研磨定盤速度=33rpm、研磨ヘッド速度=30rpmでSKW製の8インチCu用パターンウェハーをSKW6−3.18C(登録商標)を用いCuクリアー後、過研磨時間=10秒で研磨をおこなった。この時、研磨中の終点検出シグナルは安定して、きっちり終点検出ができた。また、CuクリアーしたCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ20個と少なかった。 The polishing pad prepared here was attached to a polishing machine capable of detecting the end point with a laser, and 150 ml / minute of a slurry for Fujimi PL-7105 (registered trademark) was supplied, polishing pressure = 2 psi, polishing plate speed Polishing was performed at an over-polishing time of 10 seconds after SKW 6- 3.18C (registered trademark) was used to clear Cu using a SKW 6- 3.18C (registered trademark) at a polishing wafer speed of 33 rpm and a polishing head speed of 30 rpm. At this time, the end point detection signal during polishing was stable and the end point could be detected exactly. Further, when the scratches of 0.15 μm or more were measured with a defect inspection apparatus on the Cu-cleared pattern wafer for Cu, the number was as small as 20.
同研磨条件で1000枚研磨をおこない、終点検出の安定性を見たが、安定しており、1000枚後に研磨したCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ22個と少なかった。また、窓部材の上部への膨れも見られず、窓部材の下のクッション層の貫通孔に、スラリーや水が漏れていなかった。 Polishing 1000 sheets under the same polishing conditions and seeing the stability of the end point detection was stable, and when a scratch of 0.15 μm or more was measured with a defect inspection apparatus on a Cu pattern wafer polished 1000 sheets later, 22 There were few. Moreover, the swelling to the upper part of a window member was not seen, and the slurry and water did not leak into the through-hole of the cushion layer under a window member.
実施例3
1H,1H,5H−オクタフルオロペンチルメタアクリレート100重量部、アゾイソブチロニトリル0.3重量部を金型容器に注入して、金型容器ごと65℃の温水浴に24時間浸漬して、厚み2mmの板を成型した。該成型シートから縦57.5mm、横18.5mmの窓部材を作成し、窓部材の中央部に直径0.1mmの貫通孔をレーザーで開けた。
Example 3
100 parts by weight of 1H, 1H, 5H-octafluoropentyl methacrylate and 0.3 part by weight of azoisobutyronitrile are poured into a mold container, and the mold container is immersed in a hot water bath at 65 ° C. for 24 hours. A 2 mm thick plate was molded. A window member having a length of 57.5 mm and a width of 18.5 mm was formed from the molded sheet, and a through-hole having a diameter of 0.1 mm was opened by a laser at the center of the window member.
実施例1で作成した同じ研磨パッドを用意し、研磨層のはめ込み穴に該窓部材をはめ込んで、クッション層の粘着面で窓部材を固定して、窓付き研磨パッドを作成した。窓部材以外の研磨層表面に溝幅1.0mm、溝ピッチ10.0mm、溝深さ1.0mmの格子状に配列された溝を、NC(数値制御)ルーターを用いて形成した。 The same polishing pad prepared in Example 1 was prepared, and the window member was fitted into the fitting hole of the polishing layer, and the window member was fixed with the adhesive surface of the cushion layer to prepare a polishing pad with a window. Grooves arranged in a grid pattern with a groove width of 1.0 mm, a groove pitch of 10.0 mm, and a groove depth of 1.0 mm were formed on the surface of the polishing layer other than the window member using an NC (numerical control) router.
ここに作製された研磨パッドを、レーザーで終点検出が可能な研磨機に貼り付けて、フジミ製Cu用スラリーPL−7105(登録商標)を150ml/分流し、研磨圧力=2psi、研磨定盤速度=33rpm、研磨ヘッド速度=30rpmでSKW製の8インチCu用パターンウェハーをSKW6−3.18C(登録商標)を用いCuクリアー後、過研磨時間=10秒で研磨をおこなった。この時、研磨中の終点検出シグナルは安定して、きっちり終点検出ができた。また、CuクリアーしたCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ40個と少なかった。 The polishing pad prepared here was attached to a polishing machine capable of detecting the end point with a laser, and 150 ml / minute of a slurry for Fujimi PL-7105 (registered trademark) was supplied, polishing pressure = 2 psi, polishing plate speed Polishing was performed at an over-polishing time of 10 seconds after SKW 6- 3.18C (registered trademark) was used to clear Cu using a SKW 6- 3.18C (registered trademark) at a polishing wafer speed of 33 rpm and a polishing head speed of 30 rpm. At this time, the end point detection signal during polishing was stable and the end point could be detected exactly. Further, when the scratches of 0.15 μm or more were measured with a defect inspection apparatus on Cu-cleared Cu pattern wafers, the number was as small as 40.
同研磨条件で1000枚研磨をおこない、終点検出の安定性を見たが、安定しており、1000枚後に研磨したCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ33個と少なかった。また、窓部材の上部への膨れも見られず、窓部材の下のクッション層の貫通孔に、スラリーや水が漏れていなかった。 After polishing 1000 sheets under the same polishing conditions and seeing the stability of end point detection, it was stable, and when a scratch of 0.15 μm or more was measured with a defect inspection apparatus on a Cu pattern wafer polished 1000 sheets later, 33 There were few. Moreover, the swelling to the upper part of a window member was not seen, and the slurry and water did not leak into the through-hole of the cushion layer under a window member.
実施例4
1,1,2,2−パーフルオロデシルメタアクリレート100重量部、アゾイソブチロニトリル0.3重量部を金型容器に注入して、金型容器ごと65℃の温水浴に24時間浸漬して、厚み2mmの板を成型した。該成型シートから縦57.5mm、横18.5mmの窓部材を作成し、窓部材の中央部に直径0.01mmの貫通孔をレーザーで開けた。
Example 4
100 parts by weight of 1,1,2,2-perfluorodecyl methacrylate and 0.3 parts by weight of azoisobutyronitrile are poured into a mold container and immersed in a hot water bath at 65 ° C. for 24 hours together with the mold container. Then, a 2 mm thick plate was molded. A window member having a length of 57.5 mm and a width of 18.5 mm was prepared from the molded sheet, and a through-hole having a diameter of 0.01 mm was opened by a laser at the center of the window member.
実施例1で作成した同じ研磨パッドを用意し、研磨層のはめ込み穴に該窓部材をはめ込んで、クッション層の粘着面で窓部材を固定して、窓付き研磨パッドを作成した。窓部材以外の研磨層表面に溝幅1.0mm、溝ピッチ10.0mm、溝深さ1.0mmの格子状に配列された溝を、NC(数値制御)ルーターを用いて形成した。 The same polishing pad prepared in Example 1 was prepared, and the window member was fitted into the fitting hole of the polishing layer, and the window member was fixed with the adhesive surface of the cushion layer to prepare a polishing pad with a window. Grooves arranged in a grid pattern with a groove width of 1.0 mm, a groove pitch of 10.0 mm, and a groove depth of 1.0 mm were formed on the surface of the polishing layer other than the window member using an NC (numerical control) router.
ここに作製された研磨パッドを、レーザーで終点検出が可能な研磨機に貼り付けて、フジミ製Cu用スラリーPL−7105(登録商標)を150ml/分流し、研磨圧力=2psi、研磨定盤速度=33rpm、研磨ヘッド速度=30rpmでSKW製の8インチCu用パターンウェハーをSKW6−3.18C(登録商標)を用いCuクリアー後、過研磨時間=10秒で研磨をおこなった。この時、研磨中の終点検出シグナルは安定して、きっちり終点検出ができた。また、CuクリアーしたCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ20個と少なかった。 The polishing pad prepared here was attached to a polishing machine capable of detecting the end point with a laser, and 150 ml / minute of a slurry for Fujimi PL-7105 (registered trademark) was supplied, polishing pressure = 2 psi, polishing plate speed Polishing was performed at an over-polishing time of 10 seconds after SKW 6- 3.18C (registered trademark) was used to clear Cu using a SKW 6- 3.18C (registered trademark) at a polishing wafer speed of 33 rpm and a polishing head speed of 30 rpm. At this time, the end point detection signal during polishing was stable and the end point could be detected exactly. Further, when the scratches of 0.15 μm or more were measured with a defect inspection apparatus on the Cu-cleared pattern wafer for Cu, the number was as small as 20.
同研磨条件で1000枚研磨をおこない、終点検出の安定性を見たが、安定しており、1000枚後に研磨したCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ22個と少なかった。また、窓部材の上部への膨れも見られず、窓部材の下のクッション層の貫通孔に、スラリーや水が漏れていなかった。 Polishing 1000 sheets under the same polishing conditions and seeing the stability of the end point detection was stable, and when a scratch of 0.15 μm or more was measured with a defect inspection apparatus on a Cu pattern wafer polished 1000 sheets later, 22 There were few. Moreover, the swelling to the upper part of a window member was not seen, and the slurry and water did not leak into the through-hole of the cushion layer under a window member.
比較例1
ポリエーテル系ウレタンポリマ(ユニローヤル社製アジプレンL−325)78重量部と4,4´−メチレン−ビス2−クロロアニリン20重量部をRIM成形機で混合して金型に吐出して厚み2mmの成型シートを作成した。該成型シートから縦57.5mm、横18.5mmの窓部材を作成し、窓部材の中央部に直径0.05mmの貫通孔をレーザーで開けた。
Comparative Example 1
78 parts by weight of a polyether-based urethane polymer (Adiprene L-325 manufactured by Uniroyal) and 20 parts by weight of 4,4′-methylene-bis-2-chloroaniline are mixed in a RIM molding machine and discharged to a mold to a thickness of 2 mm The molding sheet was made. A window member having a length of 57.5 mm and a width of 18.5 mm was formed from the molded sheet, and a through-hole having a diameter of 0.05 mm was opened by a laser at the center of the window member.
実施例1で作成した同じ研磨パッドを用意し、研磨層のはめ込み穴に該窓部材をはめ込んで、クッション層の粘着面で窓部材を固定して、窓付き研磨パッドを作成した。窓部材以外の研磨層表面に溝幅1.0mm、溝ピッチ10.0mm、溝深さ1.0mmの格子状に配列された溝を、NC(数値制御)ルーターを用いて形成した。 The same polishing pad prepared in Example 1 was prepared, and the window member was fitted into the fitting hole of the polishing layer, and the window member was fixed with the adhesive surface of the cushion layer to prepare a polishing pad with a window. Grooves arranged in a grid pattern with a groove width of 1.0 mm, a groove pitch of 10.0 mm, and a groove depth of 1.0 mm were formed on the surface of the polishing layer other than the window member using an NC (numerical control) router.
ここに作製された研磨パッドを、レーザーで終点検出が可能な研磨機に貼り付けて、フジミ製Cu用スラリーPL−7105(登録商標)を150ml/分流し、研磨圧力=2psi、研磨定盤速度=33rpm、研磨ヘッド速度=30rpmでSKW製の8インチCu用パターンウェハーをSKW6−3.18C(登録商標)を用いCuクリアー後、過研磨時間=10秒で研磨をおこなった。この時、研磨中の終点検出シグナルは安定して、きっちり終点検出ができた。また、CuクリアーしたCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ20個と少なかった。 The polishing pad prepared here was attached to a polishing machine capable of detecting the end point with a laser, and 150 ml / minute of a slurry for Fujimi PL-7105 (registered trademark) was supplied, polishing pressure = 2 psi, polishing plate speed Polishing was performed at an over-polishing time of 10 seconds after SKW 6- 3.18C (registered trademark) was used to clear Cu using a SKW 6- 3.18C (registered trademark) at a polishing wafer speed of 33 rpm and a polishing head speed of 30 rpm. At this time, the end point detection signal during polishing was stable and the end point could be detected exactly. Further, when the scratches of 0.15 μm or more were measured with a defect inspection apparatus on the Cu-cleared pattern wafer for Cu, the number was as small as 20.
同研磨条件で1000枚研磨をおこない、終点検出の安定性を見たが、不安定であり、1000枚後に研磨したCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ20個と少なかった。また、窓部材の上部への膨れは見られなかったが、窓部材の下のクッション層の貫通孔に、スラリーや水が漏れていた。 Polishing 1000 sheets under the same polishing conditions and seeing the stability of the end point detection is unstable. When Cu pattern wafer polished 1000 sheets later is measured with a defect inspection apparatus for scratches of 0.15 μm or more, 20 There were few. Moreover, although the swelling to the upper part of a window member was not seen, the slurry and water were leaking into the through-hole of the cushion layer under a window member.
比較例2
ポリエーテル系ウレタンポリマ(ユニローヤル社製アジプレンL−325)78重量部と4,4´−メチレン−ビス2−クロロアニリン20重量部をRIM成形機で混合して金型に吐出して厚み2mmの成型シートを作成した。該成型シートから縦57.5mm、横18.5mmの窓部材を作成した。窓部材には貫通孔を開けていない。
Comparative Example 2
78 parts by weight of a polyether-based urethane polymer (Adiprene L-325 manufactured by Uniroyal) and 20 parts by weight of 4,4′-methylene-bis-2-chloroaniline are mixed in a RIM molding machine and discharged to a mold to a thickness of 2 mm The molding sheet was made. A window member having a length of 57.5 mm and a width of 18.5 mm was formed from the molded sheet. The window member has no through hole.
実施例1で作成した同じ研磨パッドを用意し、研磨層のはめ込み穴に該窓部材をはめ込んで、クッション層の粘着面で窓部材を固定して、窓付き研磨パッドを作成した。窓部材以外の研磨層表面に溝幅1.0mm、溝ピッチ10.0mm、溝深さ1.0mmの格子状に配列された溝を、NC(数値制御)ルーターを用いて形成した。 The same polishing pad prepared in Example 1 was prepared, and the window member was fitted into the fitting hole of the polishing layer, and the window member was fixed with the adhesive surface of the cushion layer to prepare a polishing pad with a window. Grooves arranged in a grid pattern with a groove width of 1.0 mm, a groove pitch of 10.0 mm, and a groove depth of 1.0 mm were formed on the surface of the polishing layer other than the window member using an NC (numerical control) router.
ここに作製された研磨パッドを、レーザーで終点検出が可能な研磨機に貼り付けて、フジミ製Cu用スラリーPL−7105(登録商標)を150ml/分流し、研磨圧力=2psi、研磨定盤速度=33rpm、研磨ヘッド速度=30rpmでSKW製の8インチCu用パターンウェハーをSKW6−3.18C(登録商標)を用いCuクリアー後、過研磨時間=10秒で研磨をおこなった。この時、研磨中の終点検出シグナルは安定して、きっちり終点検出ができた。また、CuクリアーしたCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ20個と少なかった。 The polishing pad prepared here was attached to a polishing machine capable of detecting the end point with a laser, and 150 ml / minute of a slurry for Fujimi PL-7105 (registered trademark) was supplied, polishing pressure = 2 psi, polishing plate speed Polishing was performed at an over-polishing time of 10 seconds after SKW 6- 3.18C (registered trademark) was used to clear Cu using a SKW 6- 3.18C (registered trademark) at a polishing wafer speed of 33 rpm and a polishing head speed of 30 rpm. At this time, the end point detection signal during polishing was stable and the end point could be detected exactly. Further, when the scratches of 0.15 μm or more were measured with a defect inspection apparatus on the Cu-cleared pattern wafer for Cu, the number was as small as 20.
同研磨条件で1000枚研磨をおこない、終点検出の安定性を見たが、安定であったが、1000枚後に研磨したCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ130個と多かった。また、窓部材の上部への膨れは見られたが、窓部材の下のクッション層の貫通孔に、スラリーや水が漏れていなかった。 Polishing 1000 sheets under the same polishing conditions and seeing the stability of end point detection was stable, but when a scratch of 0.15 μm or more was measured with a defect inspection apparatus on a Cu patterned wafer polished 1000 sheets later There were as many as 130. Moreover, although the swelling to the upper part of a window member was seen, the slurry and water did not leak into the through-hole of the cushion layer under a window member.
比較例3
1,1,2,2−パーフルオロデシルメタアクリレート100重量部、アゾイソブチロニトリル0.3重量部を金型容器に注入して、金型容器ごと65℃の温水浴に24時間浸漬して、厚み2mmの板を成型した。該成型シートから縦57.5mm、横18.5mmの窓部材を作成し、窓部材の中央部に直径0.12mmの貫通孔をレーザーで開けた。
Comparative Example 3
100 parts by weight of 1,1,2,2-perfluorodecyl methacrylate and 0.3 parts by weight of azoisobutyronitrile are poured into a mold container and immersed in a hot water bath at 65 ° C. for 24 hours together with the mold container. Then, a 2 mm thick plate was molded. A window member having a length of 57.5 mm and a width of 18.5 mm was prepared from the molded sheet, and a through-hole having a diameter of 0.12 mm was opened by a laser at the center of the window member.
実施例1で作成した同じ研磨パッドを用意し、研磨層のはめ込み穴に該窓部材をはめ込んで、クッション層の粘着面で窓部材を固定して、窓付き研磨パッドを作成した。窓部材以外の研磨層表面に溝幅1.0mm、溝ピッチ10.0mm、溝深さ1.0mmの格子状に配列された溝を、NC(数値制御)ルーターを用いて形成した。 The same polishing pad prepared in Example 1 was prepared, and the window member was fitted into the fitting hole of the polishing layer, and the window member was fixed with the adhesive surface of the cushion layer to prepare a polishing pad with a window. Grooves arranged in a grid pattern with a groove width of 1.0 mm, a groove pitch of 10.0 mm, and a groove depth of 1.0 mm were formed on the surface of the polishing layer other than the window member using an NC (numerical control) router.
ここに作製された研磨パッドを、レーザーで終点検出が可能な研磨機に貼り付けて、フジミ製Cu用スラリーPL−7105(登録商標)を150ml/分流し、研磨圧力=2psi、研磨定盤速度=33rpm、研磨ヘッド速度=30rpmでSKW製の8インチCu用パターンウェハーをSKW6−3.18C(登録商標)を用いCuクリアー後、過研磨時間=10秒で研磨をおこなった。この時、研磨中の終点検出シグナルは安定して、きっちり終点検出ができた。また、CuクリアーしたCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ20個と少なかった。 The polishing pad prepared here was attached to a polishing machine capable of detecting the end point with a laser, and 150 ml / minute of a slurry for Fujimi PL-7105 (registered trademark) was supplied, polishing pressure = 2 psi, polishing plate speed Polishing was performed at an over-polishing time of 10 seconds after SKW 6- 3.18C (registered trademark) was used to clear Cu using a SKW 6- 3.18C (registered trademark) at a polishing wafer speed of 33 rpm and a polishing head speed of 30 rpm. At this time, the end point detection signal during polishing was stable and the end point could be detected exactly. Further, when the scratches of 0.15 μm or more were measured with a defect inspection apparatus on the Cu-cleared pattern wafer for Cu, the number was as small as 20.
同研磨条件で1000枚研磨をおこない、終点検出の安定性を見たが、不安定であり、1000枚後に研磨したCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ20個と少なかった。また、窓部材の上部への膨れも見られず、窓部材の下のクッション層の貫通孔に、スラリーや水が漏れていた。 Polishing 1000 sheets under the same polishing conditions and seeing the stability of the end point detection is unstable. When Cu pattern wafer polished 1000 sheets later is measured with a defect inspection apparatus for scratches of 0.15 μm or more, 20 There were few. Moreover, the swelling to the upper part of a window member was not seen, but the slurry and water were leaking into the through-hole of the cushion layer under a window member.
比較例4
1,1,2,2−パーフルオロデシルメタアクリレート100重量部、アゾイソブチロニトリル0.3重量部を金型容器に注入して、金型容器ごと65℃の温水浴に24時間浸漬して、厚み2mmの板を成型した。該成型シートから縦57.5mm、横18.5mmの窓部材を作成し、窓部材の中央部に直径0.005mmの貫通孔をレーザーで開けた。
Comparative Example 4
100 parts by weight of 1,1,2,2-perfluorodecyl methacrylate and 0.3 parts by weight of azoisobutyronitrile are poured into a mold container and immersed in a hot water bath at 65 ° C. for 24 hours together with the mold container. Then, a 2 mm thick plate was molded. A window member having a length of 57.5 mm and a width of 18.5 mm was prepared from the molded sheet, and a through-hole having a diameter of 0.005 mm was opened by a laser at the center of the window member.
実施例1で作成した同じ研磨パッドを用意し、研磨層のはめ込み穴に該窓部材をはめ込んで、クッション層の粘着面で窓部材を固定して、窓付き研磨パッドを作成した。窓部材以外の研磨層表面に溝幅1.0mm、溝ピッチ10.0mm、溝深さ1.0mmの格子状に配列された溝を、NC(数値制御)ルーターを用いて形成した。 The same polishing pad prepared in Example 1 was prepared, and the window member was fitted into the fitting hole of the polishing layer, and the window member was fixed with the adhesive surface of the cushion layer to prepare a polishing pad with a window. Grooves arranged in a grid pattern with a groove width of 1.0 mm, a groove pitch of 10.0 mm, and a groove depth of 1.0 mm were formed on the surface of the polishing layer other than the window member using an NC (numerical control) router.
ここに作製された研磨パッドを、レーザーで終点検出が可能な研磨機に貼り付けて、フジミ製Cu用スラリーPL−7105(登録商標)を150ml/分流し、研磨圧力=2psi、研磨定盤速度=33rpm、研磨ヘッド速度=30rpmでSKW製の8インチCu用パターンウェハーをSKW6−3.18C(登録商標)を用いCuクリアー後、過研磨時間=10秒で研磨をおこなった。この時、研磨中の終点検出シグナルは安定して、きっちり終点検出ができた。また、CuクリアーしたCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ30個と少なかった。 The polishing pad prepared here was attached to a polishing machine capable of detecting the end point with a laser, and 150 ml / minute of a slurry for Fujimi PL-7105 (registered trademark) was supplied, polishing pressure = 2 psi, polishing plate speed Polishing was performed at an over-polishing time of 10 seconds after SKW 6- 3.18C (registered trademark) was used to clear Cu using a SKW 6- 3.18C (registered trademark) at a polishing wafer speed of 33 rpm and a polishing head speed of 30 rpm. At this time, the end point detection signal during polishing was stable and the end point could be detected exactly. Further, when the scratches of 0.15 μm or more were measured with a defect inspection apparatus on the Cu-cleared Cu pattern wafer, the number was as small as 30.
同研磨条件で1000枚研磨をおこない、終点検出の安定性を見たが、安定であり、1000枚後に研磨したCu用パターンウェハーを欠陥検査装置で0.15μm以上のスクラッチを測定したところ130個と多かった。また、窓部材の上部への膨れが見られ、窓部材の下のクッション層の貫通孔に、スラリーや水が漏れていなかった。 Polishing 1000 sheets under the same polishing conditions and seeing the stability of end point detection, it was stable, and when the scratches of 0.15 μm or more were measured with a defect inspection apparatus on the polished Cu pattern wafer after 1000 sheets, 130 pieces There were many. Moreover, the swelling to the upper part of a window member was seen, and the slurry and water did not leak into the through-hole of the cushion layer under a window member.
1 研磨層
2 窓部材
3 終点検出用研磨パッド
4 クッション層
5 被研磨材(ウェハー)
6 研磨ヘッド
7 レーザーまたは白色光
8 ビームスプリッター
9 光源
10 光検出部
11 入射光
12 反射光
13 定盤
14 定盤の窓部材
DESCRIPTION OF
6 Polishing head 7 Laser or white light 8
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