JP5524543B2 - Planar electromagnetic actuator and manufacturing method thereof - Google Patents

Description

  The present invention relates to a planar electromagnetic actuator manufactured using semiconductor manufacturing technology and a manufacturing method thereof.

  Conventionally, as this type of planar electromagnetic actuator, a semiconductor substrate is anisotropically etched, and a frame-shaped fixed portion, a movable portion, and a torsion bar that pivotally supports the movable portion so as to be swingable are integrated with the fixed portion. There is a configuration in which a drive coil is formed on the movable part, and a static magnetic field generating means (for example, a permanent magnet) for applying a static magnetic field to the drive coil portions at both ends of the movable part parallel to the axial direction of the torsion bar is provided. . In this electromagnetic actuator, when a current is supplied to the drive coil from an external drive circuit, the drive force (Lorentz force) generated by the interaction between the current flowing through the drive coil and the static magnetic field of the permanent magnet acts on the movable part, making it movable. The part is driven around the axis of the torsion bar. Then, the current supply to the drive coil of the movable part that rotates is performed by electrically connecting the electrode terminal on the fixed part side provided for connection with the external drive circuit and the drive coil by the lead wiring arranged on the torsion bar. I try to connect. However, because the lead wire is wired on the surface of the torsion bar, excessive torsional stress acts on the lead wire due to repeated torsional motion of the torsion bar accompanying the swinging of the movable part, and metal fatigue is likely to occur. was there.

  In order to solve this problem, a planar electromagnetic actuator as described in Patent Document 1 has been proposed. This planar electromagnetic actuator has a structure in which a groove is formed in the torsion bar and the lead-out wiring is embedded in the groove, thereby reducing torsional stress acting on the lead-out wiring.

JP 2001-51224 A

  However, in the configuration in which the lead wiring is embedded in the groove as in Patent Document 1, the side surface of the groove tends to spread outward due to the torsional motion of the torsion bar. For this reason, for example, in order to drive the movable part at a high resonance frequency, when the torsion bar is formed of silicon having a high rigidity or a material mainly composed of silicon, stress concentration occurs at the edge part of the bottom of the groove, Cracks are likely to occur from the stress concentration portion, causing a problem that the strength of the torsion bar is lowered.

  The present invention has been made paying attention to the above problems, and an object of the present invention is to provide a planar electromagnetic actuator capable of reducing metal fatigue of the lead wiring without reducing the strength of the torsion bar. It is another object of the present invention to provide a method for manufacturing the planar electromagnetic actuator.

For this reason, the planar electromagnetic actuator according to the first aspect of the present invention includes a torsion bar that pivotally supports the movable part on the fixed part so that the movable part can swing, and a drive coil on the movable part side and an electrode terminal on the fixed part side. A lead wire to be connected is provided, and each portion of the fixed portion, the movable portion, and the torsion bar is integrally formed by providing the electrode terminal, the lead wire and the drive coil, and the lead wire at a substantially central position of the torsion bar. And an upper layer part integrally formed by providing a through hole at a part corresponding to the electrode terminal, the lead-out wiring, and the drive coil .

  In such a configuration, the deformation operations of the lower layer portion and the upper layer portion associated with the torsional motion of the torsion bar are restricted to each other, and the occurrence of cracking of the torsion bar due to the deformation operation can be prevented.

The lower layer portion may be configured such that the lead-out wiring is provided at a substantially central position on the upper surface of the flat torsion bar portion. Further, the upper layer portion may have a structure in which a groove portion is provided instead of the through hole in a portion corresponding to the lead-out wiring and the drive coil as in the third aspect.

According to a fourth aspect of the present invention, there is provided a planar electromagnetic actuator in which a drive coil on the movable part side and an electrode terminal on the fixed part side are connected to a torsion bar that pivotally supports the movable part on the fixed part. The lead wire is positioned at a substantially central position of the torsion bar and the lower portion of the fixed portion, the movable portion, and the torsion bar that are integrally formed by providing the electrode terminal and the lead wire. An upper layer part that is joined to the lower layer part and is integrally formed by providing a drive coil on the upper surface and providing a through hole in a portion corresponding to the electrode terminal, and the lower layer lead wiring and the upper layer part The drive coil is connected by a conductive member.

In the configuration of claim 4, as in claim 5, the upper layer portion may have a groove portion at a portion corresponding to the lead-out wiring. Further, in the configurations of claim 1 and claim 4, as in claim 6, the lower layer portion may be formed with a groove portion at a substantially central position on the upper surface of the torsion bar portion, and the lead wiring is provided in the groove portion. . Moreover, in the structure in any one of Claims 1-6, a recessed part is formed in one joining surface of the said lower layer part and the said upper layer part mutually joined like Claim 7, and the other joining surface If the convex portion that can be fitted to the concave portion is formed at the time of bonding, the bonding area between the lower layer portion and the upper layer portion increases, and a higher bonding force can be obtained.

The planar electromagnetic actuator of the present invention according to claim 8 connects the drive coil on the movable part side and the electrode terminal on the fixed part side to the torsion bar that pivotally supports the movable part on the fixed part. Through-holes in portions corresponding to the electrode terminals and the lead-out wiring, and at least a portion corresponding to the electrode terminal and the lead-out wiring. An intermediate layer bonded to the lower layer portion, and penetrating through a portion corresponding to the electrode terminal that is bonded to the lower layer portion via the intermediate layer so that the lead-out wiring is positioned at a substantially central position of the torsion bar. It is characterized by having a laminated structure comprising an upper layer part formed integrally with a hole, and the drive coil is provided on the upper surface of either the lower layer part or the upper layer part.

As in claim 9 , when the intermediate layer is provided with the drive coil on the lower layer side, a through hole is provided in a portion corresponding to the electrode terminal, drive coil, and lead-out line on the lower layer side. Good.

As in claim 10, the drive coil is formed across the upper surface of the lower layer part and the upper surface of the intermediate layer, and the part corresponding to the drive coil on the lower surface of the intermediate layer and the part corresponding to the drive coil on the lower surface of the upper layer part It is preferable that each groove is formed. According to another aspect of the present invention, the driving coil is provided in the movable portion on the upper surface of the upper layer portion, and the lead-out wiring on the lower layer portion side and the driving coil on the upper layer portion side are connected via a conductive member. . In any one of Claims 1-11, like Claim 12, the said lower layer part and the said upper layer part are good to integrally form with the material which has silicon or a silicon as a main component.

According to a thirteenth aspect of the present invention, there is provided a lead wire for connecting the drive coil on the movable part side and the electrode terminal on the fixed part side at a substantially central position of a torsion bar that pivotally supports the movable part on the fixed part. In the planar electromagnetic actuator manufacturing method provided, the electrode terminal, the lead-out wiring, and the drive coil are formed in a lower layer portion integrally formed with the fixed portion, the torsion bar, and the movable portion, and the fixed portion, the torsion bar, and the movable portion are provided. A through hole is formed in a portion corresponding to the electrode terminal, the lead wiring, and the drive coil of the integrally formed upper layer portion, the upper layer portion is joined to the lower layer portion, and the lead wiring is positioned substantially at the center of the torsion bar. It is characterized by.

As in the fourteenth aspect, a groove may be formed in each upper layer portion of the movable portion and the torsion bar in place of the through hole.

According to a fifteenth aspect of the present invention, there is provided a lead wiring for connecting the drive coil on the movable part side and the electrode terminal on the fixed part side at a substantially central position of the torsion bar that pivotally supports the movable part on the fixed part. In the planar type electromagnetic actuator manufacturing method provided, the fixed portion, the torsion bar and the movable portion are integrally formed with the fixed portion and the torsion bar portion of the lower layer portion, and the fixed portion, The drive coil is formed on the upper surface of the movable portion of the upper layer portion in which the torsion bar and the movable portion are integrally formed, the upper layer portion is joined to the lower layer portion, and the lead-out wiring is positioned substantially at the center of the torsion bar. The lead-out wiring on the side and the drive coil on the upper layer side are electrically connected with a conductive material.

In the configuration of claims 13 and 15, as in claim 16, a groove is formed on the upper surface of the lower portion of the torsion bar, the lead-out wiring is formed in the groove, and the upper layer of the torsion bar may be joined. .

As in claim 17, the lower layer portion and the upper layer portion may be joined by anodic bonding, and as in claim 18 , the lower layer portion and the upper layer portion may be joined by room temperature bonding.

According to a nineteenth aspect of the present invention, there is provided a lead wire for connecting the drive coil on the movable part side and the electrode terminal on the fixed part side at a substantially central position of the torsion bar that pivotally supports the movable part on the fixed part. In the planar electromagnetic actuator manufacturing method provided, the electrode terminal, the drive coil and the lead-out wiring are formed on a lower layer portion integrally formed with the fixed portion, the movable portion, and the torsion bar , and the electrode terminal on the lower layer portion, An intermediate layer in which a through hole is formed at a portion corresponding to the drive coil and the lead wire is joined, and an upper layer portion integrally formed with a fixed portion, a movable portion and a torsion bar is joined on the intermediate layer, and the lead wire is connected to the torsion bar. It is characterized by being located at the approximate center of

According to a twentieth aspect of the present invention, there is provided a lead wire for connecting the drive coil on the movable part side and the electrode terminal on the fixed part side at a substantially central position of the torsion bar that pivotally supports the movable part on the fixed part. In the planar electromagnetic actuator manufacturing method provided, the electrode terminal, the lead-out wiring, and a part of the drive coil are formed in a lower layer portion integrally formed with the fixed portion, the movable portion, and the torsion bar , An intermediate layer in which a through hole is formed in a corresponding portion, a groove portion is formed in a portion corresponding to a part of the drive coil, and the remaining portion of the drive coil is formed on the upper surface is joined on the lower portion, connect the driving coil portion of the driving coil portion and the intermediate layer side conductive member, wherein the fixing portion, a groove in a portion corresponding to the drive coil formed on the intermediate layer with integrally form the torsion bars and the movable portion The upper layer portion form, characterized by positioning said lead-out wiring are bonded onto the intermediate layer substantially at the center of the torsion bar.

According to the planar type electromagnetic actuator of the present invention, the lower layer portion integrally formed with the fixed portion, the movable portion and the torsion bar is also provided with the upper layer portion formed integrally with the fixed portion, the movable portion and the torsion bar at the substantially center position of the torsion bar. in that said lead-out wiring is configured to junction to be positioned, each modified operation of the lower portion and the upper portion due to the twisting movement of the torsion bar is restrained to each other, the cracking of the torsion bar due to deformation operation Occurrence can be prevented. Therefore, for example, the strength of a torsion bar made of a highly rigid material such as silicon or a material containing silicon as a main component can be prevented, and the torsional stress acting on the wiring can be reduced. It is possible to prevent a decrease in the life of the wiring.

The top view which shows 1st Embodiment of the planar type | mold electromagnetic actuator of this invention. The top view of the lower layer part in 1st Embodiment. The top view of the upper layer part in 1st Embodiment. AA arrow sectional drawing of FIG. Explanatory drawing of the manufacturing process of the planar type electromagnetic actuator of 1st Embodiment. Sectional drawing of the torsion bar part in the modification of 1st Embodiment. The top view of the upper layer part in the modification of FIG. The top view which shows 2nd Embodiment of the planar type | mold electromagnetic actuator of this invention. The top view of the upper layer part in 2nd Embodiment. BB arrow sectional drawing of FIG. Explanatory drawing of the manufacturing process of the planar type electromagnetic actuator of 2nd Embodiment. Explanatory drawing of the manufacturing process following FIG. Sectional drawing of the torsion bar part in each modification of 2nd Embodiment. The top view which shows an example of the upper layer part at the time of applying this invention to the planar electromagnetic actuator of a two-dimensional drive type The schematic plan view which shows 3rd Embodiment of this invention. The schematic plan view which shows 4th Embodiment of this invention. Sectional drawing which shows another structural example of the joint surface of the lower layer part and upper layer part in each embodiment. The top view which shows 5th Embodiment of the planar type | mold electromagnetic actuator of this invention. Explanatory drawing of the manufacturing process of the planar type electromagnetic actuator of 5th Embodiment. Explanatory drawing of the manufacturing process of the upper layer part of 5th Embodiment. The top view which shows 6th Embodiment of the planar type | mold electromagnetic actuator of this invention. Explanatory drawing of the manufacturing process of the planar type electromagnetic actuator of 6th Embodiment. The disassembled perspective view which shows 7th Embodiment of the planar type electromagnetic actuator of this invention. The disassembled perspective view which shows 8th Embodiment of the planar type | mold electromagnetic actuator of this invention. Sectional drawing of the torsion bar part which shows the division | segmentation structure example on either side of the planar type electromagnetic actuator of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a plan view of a first embodiment of a planar electromagnetic actuator of the present invention.
In FIG. 1, the planar electromagnetic actuator 1 of this embodiment is a one-dimensional drive type, and a plate-like movable portion 4 can be rotated via a pair of torsion bars 3, 3 on a frame-like fixed portion 2. Pivot. The fixed portion 2, the torsion bars 3, 3 and the movable portion 4 are formed by using, for example, an SOI (Silicon-on-insulator) substrate, which is a semiconductor substrate, and is integrally formed as shown in FIG. 1A and the upper layer part 1B as shown in FIG. 3 joined to the lower layer part 1A in substantially the same shape as the lower layer part 1A.

  As shown in FIG. 2, the lower layer portion 1A is formed with a drive coil 5 for supplying current to the peripheral portion on the movable portion lower layer portion 4A, and both ends of the drive coil 5 are connected to the torsion bar lower layer portions 3A and 3A. It is electrically connected to a pair of electrode terminals 7 and 7 formed on the fixed portion lower layer portion 2A via the lead wiring 6 formed above.

  On the other hand, as shown in FIG. 3, on the joint surface side of the upper layer portion 1B, the portions of the movable portion upper layer portion 4B corresponding to the drive coil forming region and the torsion bar upper layer portions 3B and 3B corresponding to the lead-out wiring forming region are provided. A groove 8 as shown by a broken line in FIG. 3 is formed in the part. In addition, a through hole 9 for electrically connecting the electrode terminal 7 to an external drive circuit by wire bonding is formed in a portion of the fixed portion upper layer portion 2B corresponding to the electrode terminal formation region.

  Then, for example, by bonding the upper layer portion 1B having substantially the same thickness to the lower layer portion 1A having a thickness approximately half that of the prior art, silicon or silicon as shown in FIG. The lead-out wiring 6 comes to be positioned substantially at the center of the torsion bars 3 and 3 formed of a material mainly composed of (for example, silicon nitride).

  In addition, a pair of static magnetic fields acting on the drive coil 5 portion of the movable portion opposite to the outer side of the fixed portion 2 facing the movable portion opposite to the opposite side parallel to the axial direction of the torsion bars 3 and 3 as in the prior art. For example, the permanent magnets 10 and 10 are arranged so that opposite magnetic poles face each other. Here, a driving force (Lorentz force) is generated by the interaction between the current flowing through the driving coil 5 and the static magnetic field of the permanent magnets 10 and 10 to drive the movable portion 4. An electromagnet may be used instead of the permanent magnet.

The bonding method between the lower layer portion 1A and the upper layer portion 1B is anodic bonding or room temperature bonding. In the case of anodic bonding, a glass material containing alkali ions (for example, sodium ions) is used for the upper layer portion 1B, and is directly brought into contact with the lower layer portion 1A of silicon to perform bonding processing (heating / voltage application). In addition, when silicon is used for the upper layer portion 1B, a glass component layer (for example, SiO ₂ layer) containing alkali ions (for example, sodium ions) is provided on either the bonding surface side of the lower layer portion 1A or the upper layer portion 1B. It may be formed by sputtering or the like and bonded. In addition, what is necessary is just to form in the upper surface whole region of the lower layer part 1A, when forming the said glass component layer in the lower layer part 1A side. Moreover, when forming the said glass component layer in the upper layer part 1B side, you may form in the whole lower surface of the upper layer part 1B including the groove part 8, and only to joining surfaces other than the groove part 8 directly joined to the lower layer part 1A upper surface. You may make it form. In the case of room temperature bonding, the upper layer portion 1B may be a material that can be bonded to the lower layer portion 1A of silicon at room temperature, and is more preferably a material that has substantially the same thermal expansion coefficient as the silicon of the lower layer portion 1. .

  According to the configuration of the present embodiment, since the lead wiring 6 is provided at the center position of the torsion bar where the torsional stress acting on the torsion bars 3 and 3 during the swinging operation of the movable portion 4 is small, the twist acting on the lead wiring 6 is provided. The stress can be reduced, and the life reduction of the lead wiring 6 due to metal fatigue can be prevented. Further, since the lead wiring 6 is embedded in the torsion bars 3 and 3, when copper or aluminum is used for the lead wiring 6, corrosion can be prevented. Furthermore, since the drive coil 5 and the lead wiring 6 can be shielded from the outside air by the sealing structure in which the drive coil 5 and the lead wiring 6 are covered with the upper layer portion 1B, the corrosion of the drive coil 5 and the lead wiring 6 using copper or aluminum is prevented. Can be further suppressed. Therefore, the lifetime of the planar electromagnetic actuator 1 can be improved.

Next, the manufacturing process of the planar type electromagnetic actuator of the first embodiment will be described with reference to FIG. FIG. 5 shows a cross section taken along X-O-Y in FIG.
In step (a), an SOI substrate 100 is prepared. The SOI substrate 100 has a structure in which, for example, a silicon active layer 100a, a buried oxide film 100b, and a silicon support substrate layer 100c are stacked. Thermal oxide films (SiO ₂ films) 101a and 101b of about 1 μm, for example, are formed on both surfaces of the SOI substrate 100.

  Next, in the step (b), the drive coil 5, the lead wiring 6 and the electrode terminal 7 are formed. For example, an aluminum thin film having a thickness of about 1 μm is formed by sputtering or the like as a highly conductive metal on substantially the entire surface of the thermal oxide film 101a. Thereafter, the aluminum thin film is etched by masking portions corresponding to the drive coil, the lead wiring, the electrode terminal, and the contact portion with a positive resist, and then the positive resist is removed. As a result, the electrode terminal portion, the drive coil portion, the lead-out wiring portion, and the contact portion in the first layer are formed. Further, after applying an inorganic or organic insulating material and masking the drive coil portion of the first layer, the insulating material is removed. As a result, an interlayer insulating film 102 covering the first-layer drive coil portion is formed. Further, the electrode terminal part, the drive coil part, the lead-out wiring part, and the contact part of the second layer are formed by the same formation method as that of the first layer. As a result, the drive coil 5 in which the electrode terminal 7, the lead-out wiring 6, the first layer and the second layer are connected by the contact portion 5a is formed. In addition, you may form a protective film on these electric wiring as needed.

Next, in step (c), after removing the SiO ₂ film 101a in the bonding region of the upper layer portion 1B of FIG. 3 formed by processing a glass material (including alkali ions) in advance, the upper layer portion 1B is anodic bonded. To do. Thereafter, the electrode terminal 7 is masked with a resist so as not to be etched, and the SiO ₂ film 101b and the silicon support substrate layer 100c on the back surface side are removed by etching.

  Next, in the step (d), the buried oxide film 100b on the back surface is removed, and the silicon active layer 100a in the region excluding the lower region of the fixed portion 2, the movable portion 4, and the torsion bars 3 and 3 is etched. Remove. Thereby, the electromagnetic actuator 1 of FIG. 1 is manufactured.

  Thereafter, for example, a reflecting mirror such as gold is formed on both or either of the upper and lower surfaces of the movable part 4, this actuator chip is attached to the substrate, and electrically connected to an external circuit by wire bonding. By attaching the yoke and the permanent magnets 10 and 10, a planar electromagnetic actuator for optical scanning can be provided.

  As a modification of the first embodiment, a through hole 21 may be provided instead of the groove 8 as shown in FIG. In this case, as shown in FIG. 7, a continuous through hole 21 is formed in a portion of the upper layer portion 1B corresponding to the formation region of the electrode terminal, the lead wiring, and the drive coil of the lower layer portion 1A.

Next, a second embodiment of the planar electromagnetic actuator of the present invention will be described.
8 is a plan view of a planar electromagnetic actuator according to a second embodiment of the present invention, FIG. 9 is a plan view of an upper layer portion of the actuator, and FIG. 10 is a cross-sectional view taken along line BB in FIG.
Similarly to the planar electromagnetic actuator 1 of the first embodiment, the electromagnetic actuator 31 of the second embodiment also includes a frame-shaped fixed portion 32, a pair of torsion bars 33, 33, and a plate-shaped movable portion 34. The fixed portion 32, the torsion bars 33 and 33, and the movable portion 34 are, for example, a lower layer portion 31A formed integrally using, for example, an SOI (Silicon-on-insulator) substrate which is a semiconductor substrate, and substantially the same shape as the lower layer portion 31A. The upper layer portion 31B shown in FIG. 9 is bonded to the lower layer portion 31A, and is bonded by anodic bonding or room temperature bonding as in the first embodiment. A pair of permanent magnets as a static magnetic field generating means is not shown.

  In the electromagnetic actuator 31 of the second embodiment, as shown in FIG. 10, a groove portion 41 is formed at a substantially central position of the torsion bar lower layer portion 33A, a lead wire 36 is provided in the groove portion 41, and a torsion bonded to the lower layer portion 33A. Unlike the actuator 1 of the first embodiment, the joint surface of the bar upper layer portion 33B is formed flat.

  As shown in FIG. 9, the upper layer portion 31B includes a groove portion in a portion of the movable portion upper layer portion 34B and a portion of the fixed portion upper layer portion 32B corresponding to the drive coil formation region and the electrode terminal formation region of the lower layer portion 31A. 38 and the through hole 39 are formed as in the upper layer portion 1B of the first embodiment. Further, in the lower layer portion 31A, the drive coil 35 and the pair of electrode terminals 37, 37 are formed in the same manner as in the first embodiment, and the first embodiment except that the groove portion 41 is formed in the torsion bar lower layer portion 33A. This is the same configuration as the lower layer portion 1A.

  Similar to the first embodiment, the second embodiment can reduce the torsional stress acting on the lead wiring 36 to prevent the life of the lead wiring 36 from being reduced due to metal fatigue. Since the sealing structure covered with the upper layer portion 31B can suppress the corrosion of the drive coil and the lead wiring using copper or aluminum, the life of the planar electromagnetic actuator 1 can be improved. Further, the torsion bar upper layer part 33B joined to both sides of the groove part 41 of the torsion bar lower part part 33A prevents the both sides of the groove part 41 from spreading outward even when a torsional stress is applied to the torsion bar 33. The crack phenomenon which generate | occur | produces in the edge part of the groove part 41 bottom can be prevented. Accordingly, it is possible to suppress a reduction in strength of a torsion bar formed of a material having high rigidity such as silicon or a material mainly composed of silicon.

  Next, the manufacturing process of the planar type electromagnetic actuator of the second embodiment will be described with reference to FIGS. 11 and 12 show a cross section along X-O-Y in FIG.

Step (a) is the same as in the first embodiment. For example, an SOI substrate 100 having a structure in which a silicon active layer 100a, a buried oxide film 100b, and a silicon support substrate layer 100c are stacked is prepared, and a thermal oxide film (SiO ₂ film) 101a of about 1 μm, for example, is formed on both surfaces of the SOI substrate 100. , 101b.

Next, in step (b), the thermal oxide film (SiO ₂ film) in the extraction wiring formation region in the torsion bar lower layer formation region of the SOI substrate 100 is removed by etching, and further, the silicon active layer 100a is formed by dry etching or wet etching. For example, the groove 41 is formed by etching about 5 μm.

  Next, in step (c), a thermal oxide film is again formed to insulate the lead wiring 36 and the silicon active layer 100a to form a thermal oxide film in the groove 41, and then a conventionally known technique such as sputtering, vapor deposition, or plating. An aluminum lead-out wiring 36 is formed in the groove 41 using the above. The lead wiring 36 is not limited to aluminum but may be any metal that has a small electrical resistance such as copper or gold and can be easily formed. Further, after forming the lead wiring, CMP (Chemical Mechanical Polishing) may be performed in order to planarize the surface.

  In step (d), the drive coil 35 and the electrode terminal 37 are formed so as to be electrically connected to the lead wiring 36. This step is substantially the same as step (b) in the first embodiment. That is, an aluminum thin film is formed on substantially the entire surface by sputtering or the like. Then, after etching the aluminum thin film by masking portions corresponding to the drive coil, electrode terminal, and contact portion with a positive resist, the positive resist is removed, and the first electrode terminal portion, the drive coil portion, A contact portion is formed. Furthermore, after applying an inorganic or organic insulating material and masking the first-layer driving coil portion, the insulating material is removed to form an interlayer insulating film 102 covering the first-layer driving coil portion. Further, the electrode terminal portion, the drive coil portion, and the contact portion of the second layer are formed by the same formation method as that of the first layer, and the electrode terminal 37 and the drive coil 35 that are electrically connected to the lead wiring 36 are formed. . In the figure, reference numeral 35a denotes a contact portion. Moreover, you may form a protective film on these electric wiring as needed.

Next, in the step (e), as in the first embodiment, the SiO ₂ film 101a in the bonding region of the upper layer portion 31B of FIG. 9 formed by processing a glass material (including alkali ions) in advance is removed. Thereafter, the upper layer portion 31B is anodically bonded. Thereafter, the electrode terminal 37 is masked with a resist so as not to be etched, and the SiO ₂ film 101b and the silicon support substrate layer 100c on the back surface side are removed by etching.

  Next, in the step (f), similarly to the first embodiment, the buried oxide film 100b on the back surface is removed, and the fixed portion 32, the movable portion 34, and the torsion bars 33, 33 except for the lower layer regions. The silicon active layer 100a is removed by etching. Thereby, the electromagnetic actuator 31 of FIG. 8 is manufactured.

  After that, as described above, a reflective mirror is formed, attached to the substrate, electrically connected to an external circuit by wire bonding, and further provided with a planar electromagnetic actuator for optical scanning by attaching a yoke and a permanent magnet. it can.

  As a modification of the second embodiment, as shown in FIG. 13A, an upper layer portion 31B having the same shape as the first embodiment in which the groove portion 8 is formed in the torsion bar 33B portion may be joined. Alternatively, as shown in FIG. 7B, the upper layer portion 31B in which the same through hole 21 as in FIG. 7 is formed may be joined.

Each of the above embodiments has been described with respect to a one-dimensional drive type electromagnetic actuator, but can also be applied to a two-dimensional drive type electromagnetic actuator.
The two-dimensional drive type is a frame-shaped outer movable portion that is pivotally supported by a frame-shaped fixed portion via an outer torsion bar, and an outer side via an inner torsion bar whose axial direction is orthogonal to the outer torsion bar. And an inner movable portion that is pivotally supported inside the movable portion so that the inner movable portion can be driven two-dimensionally.

FIG. 14 shows an example of the upper layer portion in the case where the upper layer portion is bonded to the entire lower layer portion in the two-dimensional drive type having such a configuration.
In FIG. 14, 2B is a frame-like fixed part upper layer part, 3B-1 is an outer torsion bar upper layer part, 3B-2 is an inner torsion bar upper layer part, 4B-1 is an outer movable part upper layer part, and 4B-2 is an inner movable part. The upper layer part is shown. In the case of the two-dimensional drive type, there are an outer drive coil provided in the outer movable part and an inner drive coil provided in the inner movable part. For this reason, since there are four electrode terminals in the fixed portion, four through holes 9 are formed in the frame-shaped fixed portion upper layer portion 2B as shown in FIG. Further, since the lead wires of the inner and outer drive coils are wired in parallel to the outer torsion bar, when the groove portion 8 is formed in the torsion bar portion as in the first embodiment, the outer torsion bar upper layer portion 3B- In 1, two grooves are formed in parallel.

  In each of the above embodiments, the structure in which the upper layer portion is joined to the entire surface of the electromagnetic actuator has been described. However, in the one-dimensional drive type and the two-dimensional drive type as in the third embodiment in FIG. 15 and the fourth embodiment in FIG. The upper layer portion 60 may be joined only to the torsion bar portions of the actuator lower layer portions 1A, 31A, 51A. In FIGS. 15 and 16, the drive coil portion on the movable portion is not shown for the sake of simplicity.

  In the configuration in which the upper layer portion is provided only in the torsion bar portion as described above, the movable portion can be reduced in weight as compared with the case where the upper layer portion is provided on the entire surface, so that the drive frequency (resonance frequency) can be increased. However, in the configuration in which the upper layer portion is provided on the entire surface, it is possible to divide the wafers each having a large number of lower layer portions and upper layer portions into pieces after bonding them, so that the manufacturing process is easy. There is.

  In each of the embodiments described above, the bonding surface between the upper layer portion and the lower layer portion is flattened. However, as shown in FIG. 17A, a recess 25 is formed in the bonding surface of the lower layer portion 1A, and the bonding surface of the upper layer portion 1B. When the convex portion 26 is formed in the lower layer portion 1A and the upper layer portion 1B, the concave portion 25 and the convex portion 26 are preferably fitted to each other as shown in FIG. With this configuration, the bonding strength can be further increased.

  Note that the convex portion 26 may be formed on the lower layer portion 1A side and the concave portion 25 may be formed on the upper layer portion 1B side. Although the first embodiment has been described as an example in FIG. 17, it goes without saying that other embodiments can be similarly configured.

In each of the embodiments described above, the configuration in which the drive coil is formed on the lower layer side has been described. However, the drive coil may be formed on the upper layer side, and FIG. 18 shows an example thereof.
FIG. 18 is a plan view showing a fifth embodiment of the planar electromagnetic actuator of the present invention.
In FIG. 18, the electromagnetic actuator 71 of the fifth embodiment has the same configuration as that of the first embodiment except that the drive coil 75 is formed on the movable portion on the upper surface of the upper layer portion 71B. A pair of torsion bars 73 and 73 and a plate-like movable portion 74 are provided, and are composed of, for example, a lower layer portion 71A formed integrally using an SOI substrate and an upper layer portion 71B joined on the lower layer portion 71A. The lower layer portion 71A and the upper layer portion 71B are joined by anodic bonding or room temperature bonding. A hatched portion in the drawing indicates an insulating protective film 80 that covers the drive coil 75. Reference numeral 81 denotes a conductive member such as a conductive resin, which will be described later, which electrically connects the drive coil 75 on the upper layer portion 71B side and the lead wiring 76 on the lower layer portion 71A side. A pair of permanent magnets as a static magnetic field generating means is not shown.

  Next, the manufacturing process of the planar type electromagnetic actuator of 5th Embodiment is demonstrated based on FIG.19 and FIG.20. 19 and 20 show a cross section taken along X-O-Y in FIG.

19, in step (a), an SOI substrate 100 having a structure in which, for example, a silicon active layer 100a, a buried oxide film 100b, and a silicon support substrate layer 100c are stacked is prepared, and about 1 μm, for example, is formed on both sides of the SOI substrate 100. The thermal oxide films (SiO ₂ films) 101a and 101b are formed.

  Next, in step (b), the lead wiring 76 and the electrode terminal 77 are formed by the same method as in the first embodiment. For example, an aluminum thin film is formed on substantially the entire surface of the thermal oxide film 101a using a conventionally known technique such as sputtering, vapor deposition, or plating. Thereafter, portions corresponding to the lead wiring and the electrode terminal are masked with a positive resist to etch the aluminum thin film, and then the positive resist is removed. Thereby, the electrode terminal 77 and the lead wiring 76 are formed. Further, after applying an inorganic or organic insulating material, and masking the lead wiring portion except for the drive coil connecting end portion, the insulating material is removed to form the insulating film 102 covering the lead wiring 76.

Next, in step (c), as shown in FIG. 20, after the drive coil 75 is formed and processed in advance, the SiO ₂ film 101a in the bonding region of the upper layer portion 71B is removed, and then the upper layer portion 71B is anodic bonded. Thereafter, the electrode terminal 77 is masked with a resist so as not to be etched, and the SiO ₂ film 101b and the silicon support substrate layer 100c on the back surface side are removed by etching.

  Next, in step (d), the buried oxide film 100b on the back surface is removed, and the silicon active layer 100a in the region excluding the lower region of the fixed portion 72, the movable portion 74, and the torsion bars 73 and 73 is etched. Remove. Thereafter, in order to electrically connect the lead-out wiring 76 of the lower layer portion 71A and the drive coil 75 of the upper layer portion 71B, a through hole 82 (shown in FIG. 20) in which a conductive member 81 such as a conductive resin is formed in the upper layer portion 71B. Fill. Thereby, the electromagnetic actuator 71 of FIG. 18 is manufactured.

  About the manufacturing process of the upper layer part 71B shown in FIG. 20, the glass material 200 of thickness 400micrometer is prepared by process (a), for example.

  Next, in step (b), a drive coil is formed on the upper surface of the glass material 200. For example, an aluminum thin film is formed on substantially the entire surface of the glass material 200 using a conventionally known technique such as sputtering, vapor deposition, or plating. Thereafter, portions corresponding to the drive coil 75 and the contact portion 75a are masked with a positive resist to etch the aluminum thin film, and then the positive resist is removed. As a result, the first-layer drive coil portion and contact portion are formed. Further, after applying an inorganic or organic insulating material and masking the drive coil portion of the first layer, the insulating material is removed. Thereby, an interlayer insulating film is formed to cover the first-layer drive coil portion. Further, the electrode terminal part and the contact part of the second layer are formed by the same formation method as that of the first layer. Thereafter, the protective film 80 is formed except for the end of the drive coil connected to the lead wiring 76.

  In the step (c), the glass material 200 is etched or polished to a desired thickness (for example, 100 μm). Thereafter, the part corresponding to the lead wiring 76 is etched, and then the through holes 79 and 82 are etched through. Thereby, the upper layer part 71B which provided the drive coil 75 on the upper surface is formed.

  FIG. 21 is a plan view showing a sixth embodiment of the planar electromagnetic actuator of the present invention in which the drive coil is formed on the upper layer side in the upper and lower layer portions of the second embodiment. In addition, the same code | symbol is attached | subjected to the same element as 5th Embodiment.

  In FIG. 21, the electromagnetic actuator 91 of the sixth embodiment has the same configuration as that of the second embodiment except that the drive coil 95 is formed on the movable portion on the upper surface of the upper layer portion 91B. A pair of torsion bars 93, 93 and a plate-like movable portion 94 are provided, and the lower portion 91A and the upper layer portion 91B joined to the lower portion 91A are configured. The hatched portion in the figure shows the insulating protective film 80 described in the fifth embodiment covering the drive coil 95. Reference numeral 81 denotes a conductive member similar to that of the fifth embodiment that electrically connects the drive coil 95 on the upper layer portion 91B side and the lead-out wiring 96 on the lower layer portion 91A side. A pair of permanent magnets as a static magnetic field generating means is not shown.

  Next, the manufacturing process of the planar type electromagnetic actuator of 6th Embodiment is demonstrated based on FIG. FIG. 22 shows a cross section taken along the line X-O-Y of FIG.

In FIG. 22, in step (a), an SOI substrate 100 having a structure in which, for example, a silicon active layer 100a, a buried oxide film 100b, and a silicon support substrate layer 100c are stacked is prepared, and about 1 μm, for example, is formed on both surfaces of the SOI substrate 100. The thermal oxide films (SiO ₂ films) 101a and 101b are formed.

Next, in the step (b), as in the second embodiment, the thermal oxide film (SiO ₂ film) in the lead wiring formation region in the torsion bar lower layer formation region of the SOI substrate 100 is removed by etching, and further dry etching is performed. Alternatively, the trench 41 is formed by etching the silicon active layer 100a by, for example, about 5 μm by wet etching.

  Next, in step (c), a thermal oxide film is formed again in order to insulate the lead wiring 96 and the silicon active layer 100a to form a thermal oxide film in the groove portion 41, and then a conventionally known technique such as sputtering, vapor deposition or plating. An aluminum lead-out wiring 96 and an electrode terminal 97 are formed in the groove 41 using the above. Furthermore, an inorganic or organic insulating material is applied, masked except for the electrode terminal and the drive coil connection end of the lead wiring portion, and then the insulating material is removed to form the insulating film 102 covering the lead wiring 96. . Thereby, the lower layer part 91A is completed. Incidentally, after the formation of the lead wiring 96 and the electrode terminal 97, CMP (Chemical Mechanical Polishing) may be performed in order to planarize the surface.

Next, in step (d), after removing the SiO ₂ film 101a in the bonding region of the upper layer portion 91B that has been formed and processed in advance, the electrode terminal 97 is not etched after the upper layer portion 91B is anodically bonded. In this way, the resist is masked and the back side SiO ₂ film 101b and the silicon support substrate layer 100c are removed by etching. The manufacturing process of the upper layer portion 91B is substantially the same as that of the fifth embodiment described with reference to FIG. 20, except that the portion corresponding to the lead wiring 96 is not etched. .

  Next, in step (e), the buried oxide film 100b on the back surface is removed, and the silicon active layer 100a in the region excluding the fixed portion 92, the movable portion 94, and the torsion bars 93, 93 is etched and removed. . Thereafter, as in the fifth embodiment, in order to electrically connect the lead-out wiring 96 of the lower layer portion 91A and the drive coil 95 of the upper layer portion 91B, a through hole in which a conductive member 81 such as a conductive resin is formed in the upper layer portion 91B. 82 is filled. Thereby, the electromagnetic actuator 91 of FIG. 21 is manufactured.

  Each of the above embodiments has a two-layer structure of a lower layer portion and an upper layer portion. In this case, it is necessary to perform groove processing on at least one of the layers in order to avoid interference with the electric wiring portion. In grooving, control of the depth and the like is troublesome. In order to solve such a problem, it is preferable to have a three-layer structure in which an intermediate layer is interposed between the lower layer portion and the upper layer portion as in the seventh embodiment shown in FIG.

FIG. 23 is an exploded perspective view showing a seventh embodiment of the present invention having a three-layer structure with an intermediate layer interposed.
In FIG. 23, the planar electromagnetic actuator 301 of this embodiment includes a lower layer portion 301A in which a drive coil 305, a lead wire 306, and an electrode terminal 307 are formed, and portions corresponding to the drive coil 305, the lead wire 306, and the electrode terminal 307. A through hole 310 is formed in the intermediate layer 301C to be bonded onto the lower layer portion 301A, and a wire bonding through hole 309 for electrically connecting the electrode terminal 307 and an external circuit is formed and bonded to the intermediate layer 301C. And an upper layer portion 301B formed in a substantially flat plate shape.

  According to such a configuration, it is only necessary to perform through-hole processing by through-etching, which is easier to process than groove processing in which depth control and the like are troublesome, for the intermediate layer 301C and the upper layer portion 301B, and manufacturing is facilitated.

  As in the fifth and sixth embodiments, a through hole for connecting the lead wiring and the drive coil is provided in the movable portion forming region of the upper layer portion 301, and the drive coil is formed on the upper surface of the upper layer portion 301B. May be. In this case, in the intermediate layer 301C, the through hole 310 may be formed only in a portion corresponding to the lead wiring and the electrode terminal.

  Further, as in the eighth embodiment shown in FIG. 24, a part of the drive coil 305 is formed on the upper surface of the lower layer portion 301A so that the drive coil 305 straddles the upper surface of the lower layer portion 301A and the upper surface of the intermediate layer 301C. The upper surface of the movable part region of 301C may be formed in a planar shape to form the remaining part of the drive coil 305. In this case, the lower surface portion of the intermediate layer 301C corresponding to the drive coil portion 305a on the lower layer portion 301A side and the lower surface portion of the upper layer portion 301B corresponding to the drive coil portion 305b on the intermediate layer 301C side interfere with the drive coil portions 305a and 305b. Grooves (not shown) are respectively formed so as not to occur. The same elements as those in the embodiment of FIG.

  In the case of the eighth embodiment of FIG. 24, the drive coil portion 305a is formed in advance in the lower layer portion 301A, the drive coil portion 305b is formed in advance in the intermediate layer 301C, and the drive coil portion 305a and the lead wiring on the lower layer portion 301A side. A through hole is formed in a connection region with 306, an intermediate layer 301C is joined on the lower layer portion 301A, and then a conductive member (not shown) such as a conductive resin is filled in the through hole, for example, to drive coil portion What is necessary is just to manufacture by making 305a and 305b and the drive coil part 305b, and the extraction wiring 306 mutually conduct. The intermediate layer 301C is not limited to a single layer, and a plurality of layers may be provided, and a drive coil portion may be disposed in each intermediate layer.

  In each of the above-described embodiments, the portions of the fixed portion, the torsion bar, and the movable portion are divided into upper and lower parts so that the lead-out wiring is arranged at the substantially center position of the torsion bar. As shown in FIG. 25, the lead wire 321 may be arranged at a substantially central position of the torsion bar 320 by dividing the fixed part, the torsion bar, and the movable part along the left and right sides. FIG. 25A shows a configuration in which a lead-out wiring 321 is provided by forming a groove 322 in one of the joining surfaces of the torsion bar regions 320A and 320B of the divided member divided into left and right. FIG. 5B shows a configuration in which the joining surfaces of the torsion bar regions 320A and 320B of the divided members are formed in a stepped shape, and the lead-out wiring 321 is disposed in the stepped portion.

  The configuration in which the drive coil is provided on the upper surface of the upper layer portion or the configuration in which the intermediate layer is interposed is also applicable to a two-dimensional drive type electromagnetic actuator. Further, as shown in FIG. 17, it goes without saying that the present invention can also be applied to a configuration in which the convex portion 26 is formed on one of the bonding surface of the lower layer portion and the bonding surface of the upper layer portion 1B and the concave portion 25 is formed on the other. .

1, 31, 71, 91, 301 Electromagnetic actuators 1A, 31A, 51A, 71A, 91A, 301A Lower layer parts 1B, 31B, 60, 71B, 91B, 301B Upper layer parts 2, 32, 72, 92 Fixed parts 3, 33, 73, 93 Torsion bar 4, 34, 74, 94 Movable part 5, 35, 75, 95, 305 (305a, 305b) Drive coil 6, 36, 76, 96, 306 Lead wiring 7, 37, 77, 97, 307 Electrode terminal 8, 38, 41 Groove 9, 21, 39, 79, 82, 99, 309, 310 Through hole 25 Recess 26 Protrusion 80 Protective film 82 Conductive member 301C Intermediate layer

Claims (20)

Provided on the torsion bar that pivotally supports the movable part so that the movable part can swing on the fixed part, lead wires for connecting the drive coil on the movable part side and the electrode terminal on the fixed part side, and each of the fixed part, the movable part, and the torsion bar A portion is joined to the lower layer portion integrally formed by providing the electrode terminal, the lead wire and the drive coil, and the lower layer portion so that the lead wire is positioned at a substantially central position of the torsion bar. A planar electromagnetic actuator having a laminated structure including an upper layer portion integrally formed by providing a through hole in a portion corresponding to a drive coil . 2. The planar electromagnetic actuator according to claim 1 , wherein the lower layer portion is configured to provide the lead-out wiring at a substantially central position on an upper surface of a flat torsion bar portion . 3. The planar electromagnetic actuator according to claim 1, wherein the upper layer portion is configured to provide a groove portion instead of the through hole at a portion corresponding to the lead-out wiring and the drive coil . Provided on the torsion bar that pivotally supports the movable part so that the movable part can swing on the fixed part, lead wires for connecting the drive coil on the movable part side and the electrode terminal on the fixed part side, and each of the fixed part, the movable part, and the torsion bar The electrode terminal and the lead wire are provided integrally with the lower layer portion, and the lead wire is joined to the lower layer portion so that the lead wire is located at a substantially central position of the torsion bar, and a drive coil is provided on the upper surface. A planar electromagnetic actuator having a laminated structure comprising an upper layer portion integrally formed by providing a through hole in a portion corresponding to the above, and connecting the lower layer lead-out wiring and the upper layer drive coil with a conductive member .   The planar electromagnetic actuator according to claim 4, wherein the upper layer portion has a groove portion at a portion corresponding to the lead-out wiring. The lower section, the groove is formed on an upper surface substantially middle position of the torsion bar portions, the planar type electromagnetic actuator according to claim 1 or 4 which is a configuration in which the lead wiring in the groove portion. A recess on one of the bonding surfaces either of the lower portion and the upper portion joined together, according to claim 6 is configured to form the recess and fittable protrusions at the time of bonding to the other joining surface A planar electromagnetic actuator according to any one of the above. Provided on the torsion bar that pivotally supports the movable part so that the movable part can swing on the fixed part, lead wires for connecting the drive coil on the movable part side and the electrode terminal on the fixed part side, and each of the fixed part, the movable part, and the torsion bar A lower layer part integrally formed by providing at least the electrode terminal and the lead wiring, an intermediate layer having a through hole in a part corresponding to at least the electrode terminal and the lead wiring, and a torsion bar A laminated structure composed of an upper layer portion integrally formed by providing a through hole in a portion corresponding to the electrode terminal and being joined to the lower layer portion via the intermediate layer so that the lead-out wiring is positioned at a substantially central position of A planar electromagnetic actuator in which a drive coil is provided on the upper surface of one of a lower layer portion and an upper layer portion . The planar electromagnetic actuator according to claim 8 , wherein the intermediate layer is configured to provide a through hole in a portion corresponding to the drive coil on the lower layer side when the drive coil is provided on the lower layer side. The drive coil is formed across the upper surface of the lower layer portion and the upper surface of the intermediate layer, and a groove portion is formed in a portion corresponding to the drive coil on the lower surface of the intermediate layer and a portion corresponding to the drive coil on the lower surface of the upper layer portion, respectively. The planar electromagnetic actuator according to claim 8 . The planar electromagnetic according to claim 8, wherein the driving coil is provided in a movable part on the upper surface of the upper layer part, and the lead-out wiring on the lower layer part side and the driving coil on the upper layer part side are connected via a conductive member. Actuator. The planar electromagnetic actuator according to any one of claims 1 to 11, wherein the lower layer portion and the upper layer portion are integrally formed of silicon or a material containing silicon as a main component. Planar electromagnetic actuator manufacturing method in which a lead-out wiring for connecting a drive coil on the movable part side and an electrode terminal on the fixed part side is provided at a substantially central position of a torsion bar that pivotally supports the movable part so that the movable part can swing on the fixed part In the above, the electrode terminal, the lead-out wiring and the drive coil are formed in the lower layer part integrally formed with the fixed part, the torsion bar and the movable part, and the electrode terminal of the upper layer part integrally formed with the fixed part, the torsion bar and the movable part A method of manufacturing a planar type electromagnetic actuator , wherein a through hole is formed in a portion corresponding to the lead wire and the drive coil, the upper layer portion is joined to the lower layer portion, and the lead wire is positioned at the approximate center of the torsion bar . The method for manufacturing a planar electromagnetic actuator according to claim 13 , wherein a groove portion is formed in each upper layer portion of the movable portion and the torsion bar in place of the through hole. Planar electromagnetic actuator manufacturing method in which a lead-out wiring for connecting a drive coil on the movable part side and an electrode terminal on the fixed part side is provided at a substantially central position of a torsion bar that pivotally supports the movable part so that the movable part can swing on the fixed part In the above, the fixed portion, the torsion bar and the movable portion are integrally formed with the fixed portion and the torsion bar portion of the lower layer portion, and the fixed portion, the torsion bar and the movable portion are integrally formed. The drive coil is formed on the upper surface of the movable portion of the upper layer portion, the upper layer portion is joined on the lower layer portion, the lead wire is positioned at the approximate center of the torsion bar, and the lead wire on the lower layer portion side and the upper layer portion side electrically connected to Help Leena type production method of the electromagnetic actuator and a drive coil with a conductive material. The planar electromagnetic according to any one of claims 13 to 15 , wherein a groove is formed on an upper surface of the lower portion of the torsion bar, the lead-out wiring is formed in the groove, and the upper layer of the torsion bar is joined. Actuator manufacturing method. The method for manufacturing a planar electromagnetic actuator according to any one of claims 13 to 16, wherein the lower layer portion and the upper layer portion are joined by anodic bonding. The method for manufacturing a planar electromagnetic actuator according to any one of claims 13 to 16, wherein the lower layer portion and the upper layer portion are bonded by room temperature bonding. Planar electromagnetic actuator manufacturing method in which a lead-out wiring for connecting a drive coil on the movable part side and an electrode terminal on the fixed part side is provided at a substantially central position of a torsion bar that pivotally supports the movable part so that the movable part can swing on the fixed part The electrode terminal, the drive coil, and the lead wire are formed in a lower layer portion integrally formed with the fixed portion, the movable portion, and the torsion bar , and the portion corresponding to the electrode terminal, the drive coil, and the lead wire is formed on the lower layer portion. A planar type electromagnetic that joins an intermediate layer formed with a through-hole to an intermediate layer, and joins an upper layer portion integrally formed with a fixed portion, a movable portion, and a torsion bar on the intermediate layer to position the lead-out wiring at the approximate center of the torsion bar. Actuator manufacturing method. Planar electromagnetic actuator manufacturing method in which a lead-out wiring for connecting a drive coil on the movable part side and an electrode terminal on the fixed part side is provided at a substantially central position of a torsion bar that pivotally supports the movable part so that the movable part can swing on the fixed part A part of the electrode terminal, the lead wiring and the drive coil is formed in a lower layer part integrally formed with the fixed part, the movable part and the torsion bar , and a through hole is formed in a portion corresponding to the electrode terminal and the lead wiring. An intermediate layer in which a groove portion is formed in a portion corresponding to a part of the drive coil and the remaining portion of the drive coil is formed on the upper surface is joined onto the lower layer portion, and the drive coil portion on the lower layer side and the drive on the intermediate layer side are joined. connect the coil unit in the conducting member, the fixing portion, the upper layer portion formed a groove in a portion corresponding to the drive coil formed on the intermediate layer with integrally form the torsion bars and the movable portion, the intermediate Method of manufacturing a planar type electromagnetic actuator for positioning the lead-out wiring by joining up substantially in the center of the torsion bar.

Images