JP5508651B2

JP5508651B2 - Fluid heating apparatus and substrate processing apparatus using the same

Info

Publication number: JP5508651B2
Application number: JP2009162769A
Authority: JP
Inventors: 清川井
Original assignee: 株式会社幸和電熱計器
Priority date: 2009-07-09
Filing date: 2009-07-09
Publication date: 2014-06-04
Anticipated expiration: 2029-07-09
Also published as: JP2011017496A

Description

本発明は、流体加熱装置およびそれを用いた基板処理装置の技術に関し、より詳細には、誘導加熱コイルに高周波電流を流して発熱体を発熱させ、該発熱体により配管内を流れる流体を加熱する流体加熱装置およびそれを用いた基板処理装置に関する。 The present invention relates to a technology of a fluid heating device and a substrate processing apparatus using the fluid heating device, and more specifically, heats a heating element by flowing a high-frequency current through an induction heating coil, and heats the fluid flowing in a pipe by the heating element. The present invention relates to a fluid heating apparatus and a substrate processing apparatus using the fluid heating apparatus.

従来、半導体や液晶ディスプレイの製造装置に関し、半導体ウェハやガラス基板に対して所定の処理を施す基板処理装置の構成が公知である。この種の基板処理装置においては、例えば、レジスト剥離装置（アッシング装置）として、数十℃〜百数十℃程度の所定の温度まで加熱した処理液（剥離液）をポンプにより圧送し、かかる処理液を基板処理用の処理液槽や基板そのものに供給する構成や、ウェハ乾燥装置として、イソプロピルアルコールなどのアルコール蒸気を所定温度に加熱して、減圧状態のチャンバ内に収容された基板に供給する構成などが採用されている。また、大気圧プラズマを用いた基板表面への処理装置として、成膜用の成分ガスや処理ガスを加熱して供給する構成も採用されている。 2. Description of the Related Art Conventionally, regarding a semiconductor or liquid crystal display manufacturing apparatus, a configuration of a substrate processing apparatus that performs a predetermined process on a semiconductor wafer or a glass substrate is known. In this type of substrate processing apparatus, for example, as a resist stripping apparatus (ashing apparatus), a processing liquid (stripping liquid) heated to a predetermined temperature of about several tens of degrees Celsius to hundreds of tens of degrees Celsius is pumped by a pump, and the processing is performed. The liquid is supplied to the processing liquid tank for processing the substrate and the substrate itself, or as a wafer drying apparatus, alcohol vapor such as isopropyl alcohol is heated to a predetermined temperature and supplied to the substrate accommodated in the chamber under reduced pressure. Configuration is adopted. In addition, as a processing apparatus for the substrate surface using atmospheric pressure plasma, a configuration in which a component gas for forming a film and a processing gas are heated and supplied is also employed.

通常、このような基板処理装置においては、配管内を流れる各種流体を加熱して供給するための流体加熱装置が設けられている。近年では、流体加熱装置として、非磁性材料より成り内部空間内に流体が給送される管体と、管体の外側に巻回される誘導加熱コイルと、磁性材料より成り誘導加熱により発熱される発熱体とを具備してなり、誘導加熱コイルに高周波電流を流して発熱体を発熱させ、この発熱体により配管内を流れる流体を加熱する構成が公知となっている。 In general, such a substrate processing apparatus is provided with a fluid heating device for heating and supplying various fluids flowing in the piping. In recent years, as a fluid heating device, a tube body made of a non-magnetic material and fluid is fed into an internal space, an induction heating coil wound around the outside of the tube body, and a magnetic material made of heat by induction heating. There is a known configuration in which a high-frequency current is passed through an induction heating coil to heat the heating element, and the fluid flowing in the piping is heated by the heating element.

誘導加熱によって流体を加熱する流体加熱装置においては、発熱体を配管の内部空間に配置することで、流体と接触する発熱体の表面積を大きく確保して、流体の加熱効率を向上させることができる。しかしながら、上述した基板処理装置では、処理液としての各種有機溶剤やアルコール蒸気等の反応性ガスなどの各種流体が供給されるため、流体加熱装置において発熱体を流体中に直接暴露すると、各種有機溶剤や反応性ガスにより発熱体が劣化してしまい、発熱体の交換に要するメンテナンスが煩雑となり、さらには、発熱体が流体中で剥離して微粒化したり金属成分が溶出したりして流体を汚染してしまうといった課題があった。 In a fluid heating apparatus that heats a fluid by induction heating, by disposing the heating element in the internal space of the pipe, it is possible to secure a large surface area of the heating element that contacts the fluid and improve the heating efficiency of the fluid. . However, in the above-described substrate processing apparatus, various fluids such as various organic solvents as reactive liquids and reactive gases such as alcohol vapor are supplied. Therefore, when the heating element is directly exposed to the fluid in the fluid heating apparatus, various organic solvents are used. The heating element deteriorates due to the solvent or reactive gas, and the maintenance required to replace the heating element becomes complicated.Furthermore, the heating element is peeled off in the fluid and atomized, or the metal component is eluted and the fluid is removed. There was a problem of contamination.

かかる観点から、従来の流体加熱装置においては、例えば、表面に耐熱酸化性の被覆部材をコーティングした発熱体を用いた構成（特許文献１参照）や、加熱容器（管体）の軸線方向に沿って管状部が形設され、管状部により形成され端部が外部に開口した間通行に金属材料によって棒状に形成された発熱体が挿入され、管状の保護部材によって被覆された状態で発熱体を加熱容器の内部に配設させた構成（特許文献２参照）などが提案されている。 From this point of view, in the conventional fluid heating apparatus, for example, a configuration using a heating element whose surface is coated with a heat-resistant oxidation-resistant coating member (see Patent Document 1), or along the axial direction of the heating container (tubular body). A heating element formed in a rod shape with a metal material is inserted into the passage while the tubular part is formed and the end part is opened to the outside, and the heating element is covered with the tubular protective member. The structure (refer patent document 2) etc. which were arrange | positioned inside the heating container are proposed.

特開２００１−２０３１３８号公報JP 2001-203138 A 特開２０００−１２１１５３号公報JP 2000-121153 A

しかしながら、特許文献１に開示される流体加熱装置の構成では、発熱体の表面を覆うようにして被覆部材がコーティングされるため、発熱体がより高温に加熱されたり、加熱・冷却が繰り返されたりすると、発熱体と被覆部材との加熱膨張率の差によって、発熱体から被覆部材が剥離してしまう場合があった。そのため、かかる構成では発熱体の製品寿命に劣り、発熱体を交換するためのメンテナンスの点で上述した課題を改善するには至っていない。 However, in the configuration of the fluid heating device disclosed in Patent Document 1, since the covering member is coated so as to cover the surface of the heating element, the heating element is heated to a higher temperature, or heating / cooling is repeated. Then, the covering member may peel from the heating element due to the difference in the thermal expansion coefficient between the heating element and the covering member. Therefore, in such a configuration, the product life of the heating element is inferior, and the problems described above have not been improved in terms of maintenance for replacing the heating element.

また、特許文献２に開示される流体加熱装置の構成では、発熱体に被覆部材が直接コーティングされる構成ではないため、上述した特許文献１に開示される流体加熱装置の構成のように、被覆部材が剥離してしまう問題は回避されるが、その一方で、管状部が加熱容器（管体）の軸線方向に貫通されるとともに、加熱容器の軸線周りに等配されるように構成されるため、流体に対する発熱体の加熱領域（面積）が制限されてしまい、流体の加熱効率に劣っていた。特に、近年の流体加熱装置においては、流体の加熱効率を高め、より短い間で瞬時に流体を加熱できる装置が待望されているところであり、かかる構成では、発熱体から流体への入熱が小さく、装置を大型化・複雑化しなければ流体を急速加熱することができないという課題があった。 Further, in the configuration of the fluid heating device disclosed in Patent Document 2, since the coating member is not directly coated on the heating element, the coating is performed as in the configuration of the fluid heating device disclosed in Patent Document 1 described above. The problem that the member peels is avoided, but on the other hand, the tubular portion is penetrated in the axial direction of the heating container (tubing body) and is arranged equally around the axis of the heating container. For this reason, the heating region (area) of the heating element with respect to the fluid is limited, and the heating efficiency of the fluid is poor. In particular, in recent fluid heating devices, there is a need for a device that can increase the heating efficiency of the fluid and heat the fluid instantly in a shorter time. However, there is a problem that the fluid cannot be rapidly heated unless the apparatus is enlarged and complicated.

そこで、本発明では、流体加熱装置およびそれを用いた基板処理装置に関し、前記従来の課題を解決するもので、発熱体の劣化を防止しつつ、流体の加熱効率を高めた流体加熱装置およびそれを用いた基板処理装置を提案するものである。 Therefore, the present invention relates to a fluid heating apparatus and a substrate processing apparatus using the same, which solves the above-described conventional problems, and a fluid heating apparatus that improves the heating efficiency of the fluid while preventing deterioration of the heating element, and the same We propose a substrate processing apparatus using the above.

本発明の解決しようとする課題は以上の如くであり、次にこの課題を解決するための手段を説明する。 The problem to be solved by the present invention is as described above. Next, means for solving the problem will be described.

すなわち、請求項１においては、非磁性材料より成り内部空間内に流体が給送される配管と、前記配管の外側に巻回される誘導加熱コイルと、磁性材料より成り誘導加熱により発熱される発熱体とを具備してなり、前記誘導加熱コイルに高周波電流を流して前記発熱体を発熱させ、該発熱体により前記配管内を流れる流体を加熱する流体加熱装置において、前記配管は、内部中空を有する筒状の本体部と、前記本体部の軸中心上に沿って内部空間の中途部まで延出されるとともに、前記本体部の内部空間と区画されかつ外部空間と連通される収容部とが設けられ、前記発熱体が前記収容部に収容されて配設されるものである。 That is, in claim 1, a pipe made of a non-magnetic material and fluid is fed into the internal space, an induction heating coil wound around the pipe, and a magnetic material that generates heat by induction heating. A fluid heating apparatus comprising: a heating element, wherein a high-frequency current is supplied to the induction heating coil to cause the heating element to generate heat, and the fluid flowing through the pipe is heated by the heating element. A cylindrical main body part, and a housing part that extends to the middle part of the internal space along the axial center of the main body part, and that is partitioned from the internal space of the main body part and communicates with the external space. Provided, and the heating element is accommodated and disposed in the accommodating portion.

請求項２においては、前記収容部は、前記本体部と同心円の筒状に形成され、前記本体部の内側面との間に所定の離間を有するように前記本体部の軸中心と同一軸心上に配設されるものである。 In Claim 2, The said accommodating part is formed in the cylindrical shape concentric with the said main-body part, and has the same axial center as the axial center of the said main-body part so that it may have predetermined spacing between the inner surface of the said main-body part. It is arranged on the top.

請求項３においては、前記収容部は、前記本体部の端面又は外周面に開口された開口部の縁部から前記本体部の内部方向に向けて延出される隔壁部材により構成され、前記発熱体が前記隔壁部材により囲繞された空間内に収容されるものである。 In Claim 3, The said accommodating part is comprised by the partition member extended toward the internal direction of the said main-body part from the edge of the opening part opened to the end surface or outer peripheral surface of the said main-body part, The said heat generating body Is accommodated in a space surrounded by the partition member.

請求項４においては、前記本体部及び収容部は、石英ガラスより成形されるものである。 According to a fourth aspect of the present invention, the main body portion and the accommodating portion are formed from quartz glass.

請求項５においては、前記発熱体は、カーボン系材料より成形されるものである。 In the present invention, the heating element is formed from a carbon-based material.

請求項６においては、前記本体部は、外周面がフッ素樹脂材料より成形される保護部材により覆われるものである。 According to a sixth aspect of the present invention, the main body is covered with a protective member whose outer peripheral surface is molded from a fluororesin material.

請求項７においては、前記請求項１乃至請求項６のいずれか一項に記載の流体加熱装置と、前記流体加熱装置に流体を供給する流体供給装置と、前記流体加熱装置により加熱された流体が供給されて基板に対して各種の処理を施す処理装置と、を具備してなるものである。 In Claim 7, The fluid heating apparatus as described in any one of the said Claim 1 thru | or 6, The fluid supply apparatus which supplies the fluid to the said fluid heating apparatus, The fluid heated by the said fluid heating apparatus And a processing apparatus for performing various types of processing on the substrate.

本発明の効果として、本体部の内部空間を給送される流体中に発熱体が直接暴露されないため、発熱体の劣化を防止できるとともに、発熱体により流体を加熱可能な領域が増大されるため、流体の加熱効率を高めることができる。 As an effect of the present invention, since the heating element is not directly exposed to the fluid fed through the internal space of the main body, it is possible to prevent deterioration of the heating element and to increase the area in which the fluid can be heated by the heating element. The heating efficiency of the fluid can be increased.

本発明の一実施例に係る基板処理装置の全体的な構成を示した模式図。The schematic diagram which showed the whole structure of the substrate processing apparatus which concerns on one Example of this invention. 流体加熱装置の側断面図。The sectional side view of a fluid heating apparatus. 図２におけるＡ−Ａ矢視断面図。AA arrow sectional drawing in FIG. 本体部の内部空間内の流体の流れを示した側断面図。The sectional side view which showed the flow of the fluid in the internal space of a main-body part. 別実施例の流体加熱装置の側断面図。The sectional side view of the fluid heating apparatus of another Example. 同じく別実施例の流体加熱装置の側断面図。The side sectional view of the fluid heating device of another example similarly. 同じく別実施例の流体加熱装置の側断面図。The side sectional view of the fluid heating device of another example similarly.

次に、発明を実施するための形態を説明する。
以下の実施例においては、基板処理装置１を半導体ウェハに対して乾燥処理を施すウェハ乾燥装置として構成した場合について説明する。本実施例の基板処理装置１では、処理装置４に収容された半導体ウェハに対して流体加熱装置２にて所定温度に温調されたアルコール蒸気が吹きつけられて乾燥処理が施される。 Next, modes for carrying out the invention will be described.
In the following embodiments, a case where the substrate processing apparatus 1 is configured as a wafer drying apparatus that performs a drying process on a semiconductor wafer will be described. In the substrate processing apparatus 1 of the present embodiment, the semiconductor wafer accommodated in the processing apparatus 4 is subjected to a drying process by blowing alcohol vapor adjusted to a predetermined temperature by the fluid heating apparatus 2.

まず、本実施例の基板処理装置１の全体構成について、以下に概説する。
図１に示すように、本実施例の基板処理装置１は、誘導加熱により流体を加熱する流体加熱装置２と、流体加熱部２に流体を供給する流体供給装置３と、流体加熱部２により加熱された流体が供給されて半導体ウェハに対して乾燥処理など各種処理を施す処理装置４等とで構成されている。流体加熱装置２は、接続管１０で接続された流体供給装置３と処理装置４との間に挿設されている。基板処理装置１では、イソプロピルアルコールなどのアルコール蒸気が流体供給装置３から接続管１０を介して流体加熱部２に給送される。そして、流体加熱部２によりかかるアルコール蒸気が所定温度（７０℃〜９０℃）に温調された後に、接続管１０を介して処理装置４に給送され、減圧状態のチャンバ内に収容された半導体ウェハに吹き付けられる。 First, the overall configuration of the substrate processing apparatus 1 of this embodiment will be outlined below.
As shown in FIG. 1, the substrate processing apparatus 1 of the present embodiment includes a fluid heating device 2 that heats a fluid by induction heating, a fluid supply device 3 that supplies a fluid to the fluid heating unit 2, and a fluid heating unit 2. The heated fluid is supplied, and the processing apparatus 4 is configured to perform various processes such as a drying process on the semiconductor wafer. The fluid heating device 2 is inserted between the fluid supply device 3 and the processing device 4 connected by the connecting pipe 10. In the substrate processing apparatus 1, alcohol vapor such as isopropyl alcohol is fed from the fluid supply device 3 to the fluid heating unit 2 through the connection pipe 10. And after the alcohol vapor | steam which this fluid heating part 2 temperature-controls to predetermined temperature (70 to 90 degreeC), it was sent to the processing apparatus 4 via the connecting pipe 10, and was accommodated in the chamber of the pressure reduction state. Sprayed onto the semiconductor wafer.

次に、本実施例の流体加熱装置２の構成について、以下に詳述する。
図１に示したように、本実施例の流体加熱装置２は、非磁性材料より成り内部空間内に流体が給送される配管５と、配管５の外側に巻回される誘導加熱コイル６と、磁性材料より成り誘導加熱により発熱される発熱体７等とを具備してなり、誘導加熱コイル６に接続された加熱制御装置８によって誘導加熱コイル６に高周波電流を流して発熱体７を発熱させ、かかる発熱体７によって配管５内を流れる流体が加熱されるように構成されている。 Next, the configuration of the fluid heating device 2 of the present embodiment will be described in detail below.
As shown in FIG. 1, the fluid heating device 2 of the present embodiment includes a pipe 5 made of a nonmagnetic material and fluid is fed into an internal space, and an induction heating coil 6 wound around the pipe 5. And a heating element 7 made of a magnetic material and generating heat by induction heating. A heating control device 8 connected to the induction heating coil 6 causes a high-frequency current to flow through the induction heating coil 6 to cause the heating element 7 to flow. Heat is generated, and the fluid flowing in the pipe 5 is heated by the heating element 7.

配管５は、断面円形であって内部中空の筒状に形成され、後述するように基板処理装置１の接続管１０に接続される流体給入口５２及び流体排出口５３が設けられており、この流体給入口５２を介して接続管１０内の流体が配管５の内部空間内に給送されるとともに、流体排出口５３を介して配管５の内部空間内の流体が接続管１０内へと排出される。本実施例の配管５は非磁性材料より成り、耐熱性の観点から、非磁性材料として石英ガラス（透明石英ガラス、不透明ガラス、合成石英ガラスなど）が好ましく用いられる。具体的には、本実施例の配管５は、非磁性材料としての石英ガラスを母材として、筒状（チューブ状）に成形されている。 The pipe 5 is formed in a cylindrical shape having a circular cross section and a hollow inside, and is provided with a fluid inlet 52 and a fluid outlet 53 connected to the connecting pipe 10 of the substrate processing apparatus 1 as described later. The fluid in the connection pipe 10 is fed into the internal space of the pipe 5 through the fluid inlet 52 and the fluid in the internal space of the pipe 5 is discharged into the connection pipe 10 through the fluid discharge port 53. Is done. The pipe 5 of the present embodiment is made of a nonmagnetic material, and quartz glass (transparent quartz glass, opaque glass, synthetic quartz glass, etc.) is preferably used as the nonmagnetic material from the viewpoint of heat resistance. Specifically, the pipe 5 of the present embodiment is formed in a cylindrical shape (tube shape) using quartz glass as a nonmagnetic material as a base material.

また、本実施例の配管５には、配管５の内部空間と区画されかつ外部空間と連通される収容部５１が形成されており、収容部５１に発熱体７が収容されることで、発熱体７が配管５の内部空間内を流れる流体に直接暴露されないように構成されている。この収容部５１の詳細は後述する（図２等参照）。 In addition, the pipe 5 of the present embodiment is formed with an accommodating portion 51 that is partitioned from the internal space of the pipe 5 and communicated with the external space, and the heating element 7 is accommodated in the accommodating portion 51, thereby generating heat. The body 7 is configured not to be directly exposed to the fluid flowing in the internal space of the pipe 5. Details of the accommodating portion 51 will be described later (see FIG. 2 and the like).

誘導加熱コイル６は、銅材などの導電性材料より成り、配管５の外周形状に沿うように延出されて配管５の外側に巻回されている。誘導加熱コイル６の端部（リード導体部）は、後述する加熱制御装置８の高周波電源８０に接続され、かかる高周波電源８０から一方の端部に供給された高周波電流は、誘導加熱コイル６の形状にそって流れた後に、他方の端部より高周波電源８０に戻る。 The induction heating coil 6 is made of a conductive material such as a copper material, extends along the outer peripheral shape of the pipe 5, and is wound around the outside of the pipe 5. An end portion (lead conductor portion) of the induction heating coil 6 is connected to a high frequency power source 80 of a heating control device 8 to be described later, and the high frequency current supplied from the high frequency power source 80 to one end portion of the induction heating coil 6 After flowing along the shape, it returns to the high-frequency power source 80 from the other end.

発熱体７は、磁性材料より成り、配管５と断面同心円の円柱部材として形成され、配管５に設けられた収容部５１に収容されて配設される。磁性材料としては、ステンレス鋼などの金属系材料やシリコンカーバイドなどの炭化ケイ素系材料を用いることができるが、耐熱性及び化学的安定性の観点から、特に、カーボン単体（黒鉛など）、カーボン複合体（カーボン−セラミックス、ガラス状カーボンなど）等のカーボン系材料が好ましく用いられる。特に、カーボン系材料は、熱伝導がよく、さらに一般的な金属系材料に比べて熱膨張率が小さいため、好ましく用いられる。カーボン系材料を母材として発熱体７を成形した場合には、発熱による熱変化（寸法変化）が小さく、かつ高温でムラなく発熱させることができる。 The heating element 7 is made of a magnetic material, is formed as a cylindrical member having a concentric cross section with the pipe 5, and is housed and disposed in a housing portion 51 provided in the pipe 5. As the magnetic material, metal materials such as stainless steel and silicon carbide materials such as silicon carbide can be used, but from the viewpoint of heat resistance and chemical stability, carbon alone (graphite etc.), carbon composite A carbon-based material such as a body (carbon-ceramics, glassy carbon, etc.) is preferably used. In particular, a carbon-based material is preferably used because it has good thermal conductivity and a smaller coefficient of thermal expansion than a general metal-based material. When the heating element 7 is molded using a carbon-based material as a base material, a heat change (dimensional change) due to heat generation is small, and heat can be generated evenly at a high temperature.

加熱制御装置８は、誘導加熱コイル６に高周波電流を供給する高周波電源８０と、誘導加熱コイル６への高周波電流の供給量を制御する電流制御部８１と、流体加熱装置２の温度を検出する温度検出部８２等とで構成されている。電流制御部８１では、誘導加熱コイル６が所定温度となるように高周波電源８０から誘導加熱コイル６に供給される高周波電流が制御される。また、温度検出部８２は、電熱対や測温抵抗体などで構成され、配管５の外周面５０ａに配設される。 The heating control device 8 detects the temperature of the fluid heating device 2, a high-frequency power source 80 that supplies a high-frequency current to the induction heating coil 6, a current control unit 81 that controls the amount of high-frequency current supplied to the induction heating coil 6, and the like. It is comprised with the temperature detection part 82 grade | etc.,. In the current control unit 81, the high frequency current supplied from the high frequency power supply 80 to the induction heating coil 6 is controlled so that the induction heating coil 6 has a predetermined temperature. Further, the temperature detection unit 82 is configured by an electric heating pair, a resistance temperature detector, or the like, and is disposed on the outer peripheral surface 50 a of the pipe 5.

加熱制御装置８による発熱体７の加熱制御方法について説明すると、まず、温度検出部８２により配管５の温度が検出され、温度検出部８２により検出された温度信号に基づいて、配管５が所定温度となるように高周波電源８０から誘導加熱コイル６に供給される高周波電流が電流制御部８１により制御される。誘導加熱コイル６では、高周波電源８０より所定電流に制御された高周波電流が流れることで交番磁束が発生され、この交番磁束によって発熱体７にうず電流が発生する。そして、発熱体７に発生するうず電流による抵抗発熱と、誘導加熱コイル６からの交番磁束によるヒステリシス損から生じる発熱とによって発熱体７が発熱され、発熱体７が所定温度に加熱される。 The heating control method of the heating element 7 by the heating control device 8 will be described. First, the temperature of the pipe 5 is detected by the temperature detection unit 82, and the pipe 5 is set to a predetermined temperature based on the temperature signal detected by the temperature detection unit 82. The high frequency current supplied from the high frequency power source 80 to the induction heating coil 6 is controlled by the current control unit 81. In the induction heating coil 6, an alternating magnetic flux is generated when a high-frequency current controlled to a predetermined current flows from the high-frequency power source 80, and an eddy current is generated in the heating element 7 by the alternating magnetic flux. Then, the heating element 7 is heated by the resistance heating due to the eddy current generated in the heating element 7 and the heat generation caused by the hysteresis loss due to the alternating magnetic flux from the induction heating coil 6, and the heating element 7 is heated to a predetermined temperature.

次に、本実施例の配管５の構成について、以下に詳述する。
図２乃至図４に示すように、本実施例の配管５は、流体としてのアルコール蒸気に直接暴露されないように発熱体７を配設可能な構成とされており、具体的には、内部中空を有する筒状の本体部５０と、本体部５０の軸中心Ｃ上に沿って内部空間の中途部まで延出されるとともに、本体部５０の内部空間と区画されかつ外部空間と連通される収容部５１と、本体部５０の内部空間と連通される流体給入口５２及び流体排出口５３等とで構成されている。 Next, the configuration of the pipe 5 of this embodiment will be described in detail below.
As shown in FIGS. 2 to 4, the pipe 5 of the present embodiment is configured such that a heating element 7 can be disposed so as not to be directly exposed to alcohol vapor as a fluid. A cylindrical main body 50 having a central portion and an accommodating portion that extends to the middle of the internal space along the axial center C of the main body 50 and that is separated from the internal space of the main body 50 and communicates with the external space 51, a fluid supply port 52 and a fluid discharge port 53, etc. that communicate with the internal space of the main body 50.

本体部５０は、円筒状に成形された石英ガラスより構成され、外周面５０ａの形状に沿って上述した誘導加熱コイル６が巻回されている。本体部５０は、一方の端部が閉止されて端面５０ｂが形成されるとともに、他方の端部の端面５０ｃが開口されて開口部５０ｄが形成されている。また、本体部５０の両端部には、同じく石英ガラスより成形された流体給入口５２及び流体排出口５３が設けられており、流体給入口５２は、流体の送給方向の上流側（図２において下側）の端面５０ｂに軸中心Ｃ上に沿う方向に向けて突設され、流体排出口５３は、流体の送給方向の下流側（図２において上側）の外周面５０ａに軸中心Ｃと直交する方向に向けて突設されている。流体は、流体給入口５２を介して本体部５０の一方の端部より内部空間内に給送され、流体排出口５３を介して本体部５０の他方の端部より内部空間外に排出される。 The main body 50 is made of quartz glass formed in a cylindrical shape, and the induction heating coil 6 described above is wound along the shape of the outer peripheral surface 50a. In the main body 50, one end is closed to form an end surface 50b, and the other end 50c is opened to form an opening 50d. In addition, a fluid supply port 52 and a fluid discharge port 53 that are also formed of quartz glass are provided at both ends of the main body 50, and the fluid supply port 52 is located upstream in the fluid feeding direction (FIG. 2). The fluid discharge port 53 protrudes from the end surface 50b on the lower side in FIG. 2 in a direction along the axis C, and the fluid discharge port 53 has a center C on the outer peripheral surface 50a on the downstream side (upper side in FIG. 2). It protrudes in the direction orthogonal to the direction. The fluid is fed into the internal space from one end of the main body 50 through the fluid supply port 52 and discharged from the other end of the main body 50 through the fluid discharge port 53 to the outside of the internal space. .

収容部５１は、本体部５０と同心円の筒状に形成され、本体部５０の軸中心Ｃ上に沿って内部空間の中途部まで延出されており、具体的には、一方の端部が本体部５０の内部空間内で閉止されて端面５１ａが形成されるとともに、他方の端部が本体部５０の端面５０ｃに開口されている。本実施例の収容部５１は、本体部５０と同じく発熱体７の保護部材としての石英ガラスより成形され、本体部５０の他方の端部の端面５０ｃに開口された開口部５０ｄの縁部から、本体部５０の内部方向に向けて延出される隔壁部材５４により構成されている。 The accommodating part 51 is formed in a cylindrical shape concentric with the main body part 50, and extends to the middle part of the internal space along the axial center C of the main body part 50. Specifically, one end part is The end surface 51 a is formed by being closed in the internal space of the main body 50, and the other end is opened to the end surface 50 c of the main body 50. The accommodating part 51 of the present embodiment is formed from quartz glass as a protective member of the heating element 7 in the same manner as the main body part 50, and from the edge part of the opening part 50d opened in the end surface 50c of the other end part of the main body part 50. The partition member 54 extends toward the inside of the main body 50.

このように本実施例の配管５は、本体部５０において、両端部が端面５０ｂ・５０ｃで閉止されて内部空間が外部空間と遮断されるとともに、収容部５１において、隔壁部材５４にて本体部５０の内部空間が区画されつつ、隔壁部材５４にて囲繞される空間が本体部５０の開口部５０ｄを介して外部空間と連通されている。発熱体７は、収容部５１において隔壁部材５４により囲繞された空間内に収容されることで、本体部５０の内部空間と隔壁部材５４によって隔離されるとともに、開口部５０ｄを介して外部空間と連通された状態で配設される。 As described above, the pipe 5 according to the present embodiment has the main body portion 50 with both end portions closed by the end faces 50b and 50c and the internal space being shut off from the external space. The space surrounded by the partition wall member 54 is communicated with the external space through the opening 50d of the main body 50 while the internal space 50 is partitioned. The heating element 7 is housed in the space surrounded by the partition wall member 54 in the housing portion 51, thereby being separated from the internal space of the main body 50 by the partition wall member 54, and from the external space via the opening 50d. It arrange | positions in the state connected.

本実施例の配管５は、発熱体７が本体部５０の開口部５０ｄを介して収容部５１に挿脱され、本体部５０において少なくとも開口部５０ｄが発熱体７の内径よりも大きく、かつ収容部５１において少なくとも発熱体７の内径よりも大きくなるように形成されている。また、配管５は、本体部５０の開口部５０ｄが上方を向くようにして設置されることから（図２参照）、発熱体７は、配管５の上方より本体部５０の開口部５０ｄに挿通されて収容部５１内に収容され、収容部５１の一方の端部（端面５１ａ）にて係止された状態で配置される。 In the pipe 5 of this embodiment, the heating element 7 is inserted into and removed from the accommodating part 51 through the opening 50d of the main body part 50, and at least the opening part 50d is larger than the inner diameter of the heating element 7 in the main body part 50 and accommodated. The portion 51 is formed so as to be at least larger than the inner diameter of the heating element 7. Further, since the pipe 5 is installed such that the opening 50d of the main body 50 faces upward (see FIG. 2), the heating element 7 is inserted into the opening 50d of the main body 50 from above the pipe 5. It is accommodated in the accommodating part 51, and is arrange | positioned in the state latched by one edge part (end surface 51a) of the accommodating part 51. FIG.

収容部５１の延出長さは、本体部５０の軸中心Ｃ上に沿った内部空間の中途部であって、少なくとも収容部５１に収容された発熱体７が誘導加熱コイル６によって発熱可能な領域にまで延出される。すなわち、本実施例の収容部５１に収容された発熱体７は、収容部５１の端面５１ａにて係止された状態で、長さ方向の領域内に誘導加熱コイル６が位置するように配置される。 The extension length of the accommodating portion 51 is a midway portion of the internal space along the axial center C of the main body portion 50, and at least the heating element 7 accommodated in the accommodating portion 51 can generate heat by the induction heating coil 6. It extends to the area. That is, the heating element 7 accommodated in the accommodating portion 51 of the present embodiment is disposed so that the induction heating coil 6 is positioned in the region in the length direction while being locked by the end surface 51a of the accommodating portion 51. Is done.

収容部５１は、本体部５０の軸中心Ｃと同一軸心上に配置され、本体部５０の内側面５０ｅと側面５１ｂの間に離間Ｄを有するようにして配設されている（図３参照）。収容部５１は、本体部５０と同心円の筒状に形成されるため、本体部５０の軸中心Ｃと同一軸心上に配置されることで、離間Ｄは本体部５０の軸中心Ｃに対して円周方向に同一とされる。また、収容部５１が本体部５０の軸中心Ｃと同一軸心上に配置されることで、収容部５１に収容された発熱体７においても同様に、本体部５０の軸中心Ｃと同一軸心上に配置される。 The accommodating part 51 is arrange | positioned on the same axial center as the axial center C of the main-body part 50, and is arrange | positioned so that it may have the space | interval D between the inner surface 50e and the side surface 51b of the main-body part 50 (refer FIG. 3). ). Since the accommodating portion 51 is formed in a cylindrical shape that is concentric with the main body portion 50, the separation D is arranged with respect to the axial center C of the main body portion 50 by being arranged on the same axial center as the axial center C of the main body portion 50. And the same in the circumferential direction. In addition, since the accommodating portion 51 is disposed on the same axis as the axial center C of the main body portion 50, the heating element 7 accommodated in the accommodating portion 51 similarly has the same axis as the axial center C of the main body portion 50. Placed on the mind.

このように収容部５１が形成されることで、本体部５０の内部空間には、流体を給送可能な二つの領域空間Ａ及び領域空間Ｂが形成されている。具体的には、領域空間Ａは、流体の給送方向の上流側（図２において下側）の空間であって、流体の給送方向に対して本体部５０の端面５０ｂから収容部５１の一方の端部（端面５１ａ）までの空間である。一方、領域空間Ｂは、流体の給送方向の下流側（図２において上側）の本体部５０の内側面５０ｅと収容部５１の側面５１ｂとの離間Ｄに形成された空間であって、流体の給送方向に対して収容部５１の一方の端部（端面５１ａ）から他方の端部、すなわち本体部５０の端面５０ｃまでの空間である。 By forming the accommodating part 51 in this way, two area spaces A and B that can feed fluid are formed in the internal space of the main body part 50. Specifically, the area space A is a space on the upstream side (the lower side in FIG. 2) in the fluid feeding direction, and from the end surface 50 b of the main body 50 to the fluid feeding direction. This is the space up to one end (end surface 51a). On the other hand, the region space B is a space formed in the space D between the inner side surface 50e of the main body 50 and the side surface 51b of the accommodating portion 51 on the downstream side (upper side in FIG. 2) in the fluid feeding direction. This is a space from one end portion (end surface 51 a) of the storage portion 51 to the other end portion, that is, the end surface 50 c of the main body portion 50 with respect to the feeding direction.

そして、図２及び図４において矢印で示すように、まず、流体給入口５２を介して本体部５０の内部空間内に給送された流体は（図２の矢印ａ）、領域空間Ａを本体部５０の軸心方向に沿って下流側へと移送される（図４の矢印ｂ）。次いで、かかる流体は、収容部５１の一方の端部に形成された端面５１ａに当接され、収容部５１の端面５１ａ及び側面５１ｂに沿って発熱体７によって加熱されながら領域空間Ｂへと移送され（図４の矢印ｃ）、やがて所定温度にまで加熱されて流体排出口５３を介して外部空間へと排出される（図２の矢印ｄ）。 2 and 4, first, the fluid fed into the internal space of the main body 50 through the fluid inlet 52 (arrow a in FIG. 2) It is transferred downstream along the axial direction of the portion 50 (arrow b in FIG. 4). Next, the fluid is brought into contact with an end surface 51 a formed at one end of the accommodating portion 51, and is transferred to the region space B while being heated by the heating element 7 along the end surface 51 a and the side surface 51 b of the accommodating portion 51. Then, it is heated to a predetermined temperature and discharged to the external space through the fluid discharge port 53 (arrow d in FIG. 2).

以上のように、本実施例の流体加熱装置２は、非磁性材料より成り内部空間内に流体が給送される配管５と、配管５の外側に巻回される誘導加熱コイル６と、磁性材料より成り誘導加熱により発熱される発熱体７とを具備してなり、誘導加熱コイル６に高周波電流を流して発熱体７を発熱させ、この発熱体７により配管５内を流れる流体を加熱する流体加熱装置において、配管５は、内部中空を有する筒状の本体部５０と、本体部５０の軸中心Ｃ上に沿って本体部５０の内部空間の中途部まで延出されるとともに、本体部５０の内部空間と区画されかつ外部空間と連通される収容部５１とが設けられ、発熱体７が収容部５１に収容されて配設されるため、発熱体７の劣化を防止しつつ、流体の加熱効率を高めることができるのである。 As described above, the fluid heating device 2 according to the present embodiment includes the pipe 5 made of a nonmagnetic material and fluid fed into the internal space, the induction heating coil 6 wound around the pipe 5, and the magnetic The heating element 7 is made of a material and generates heat by induction heating. A high-frequency current is passed through the induction heating coil 6 to generate heat, and the heating element 7 heats the fluid flowing in the pipe 5. In the fluid heating apparatus, the pipe 5 extends to the middle of the internal space of the main body 50 along the axial center C of the main body 50 and the cylindrical main body 50 having an internal hollow. Storage section 51 that is partitioned from the internal space and communicated with the external space is provided, and the heating element 7 is accommodated and disposed in the accommodation section 51. Heating efficiency can be increased.

すなわち、本実施例の流体加熱装置２は、配管５の構成において、本体部５０の内部空間と区画されかつ外部空間と連通される収容部５１に収容されるため、発熱体７が本体部５０の内部空間を給送される流体中に直接暴露されることなく、各種有機溶剤や反応性ガスなどによって劣化するのを防止し、また発熱体７が流体中で剥離して微粒化したり金属成分が溶出したりして流体を汚染するのを防止することができる。また、発熱体７を外部空間と連通された状態で収容することができるため、誘導加熱コイル６により発熱体７が高温状態になっても、発熱体７自体が熱膨張により変形したり、収容部５１内の空気が熱膨張したりすることによって配管５が損傷等するのを防止できる。 That is, the fluid heating device 2 according to the present embodiment is accommodated in the accommodating portion 51 that is separated from the internal space of the main body 50 and communicates with the external space in the configuration of the pipe 5. Without being directly exposed to the fluid being fed into the interior space, it is prevented from being deteriorated by various organic solvents, reactive gases, etc., and the heating element 7 is exfoliated and atomized in the fluid or metal components Elution or contamination of the fluid can be prevented. Further, since the heating element 7 can be accommodated in communication with the external space, even if the heating element 7 is heated to a high temperature by the induction heating coil 6, the heating element 7 itself is deformed or accommodated by thermal expansion. It is possible to prevent the pipe 5 from being damaged due to thermal expansion of the air in the portion 51.

さらに、収容部５１を本体部５０の軸中心Ｃ上に沿って内部空間の中途部まで延出させることで、収容部５１の外側面（本実施例では端面５１ａ及び側面５１ｂ）が本体部５０の内部空間内に露出されるため、流体に対する発熱体７の加熱領域を大きくして発熱体７から流体への入熱を増大でき、本体部５０の内部空間内を給送される流体の加熱効率をより高めることができるとともに、ひいては、装置全体を大型化・複雑化することなく流体を所定温度まで急速加熱することが可能となる。 Furthermore, by extending the accommodating part 51 along the axial center C of the main body part 50 to the middle part of the internal space, the outer side surfaces (the end surface 51a and the side surface 51b in this embodiment) of the accommodating part 51 become the main body part 50. Therefore, the heating area of the heating element 7 with respect to the fluid can be increased to increase the heat input from the heating element 7 to the fluid, and the fluid fed in the inner space of the main body 50 can be heated. The efficiency can be further increased, and as a result, the fluid can be rapidly heated to a predetermined temperature without increasing the size and complexity of the entire apparatus.

また、本実施例の流体加熱装置２は、収容部５１が本体部５０と同心円の筒状に形成され、本体部５０の内側面５０ｅとの間に所定の離間Ｄを有するように収容部５１が本体部５０の軸中心Ｃと同一軸心上に配設されるため、収容部５１と本体部５０の内側面５０ｅとの間に形成される領域に向けて収容部５１の側面５１ｂが円周方向に均等に露出されるため、かかる領域を流れる流体を均等に加熱することができ、流体の加熱効率をより向上できる。 Further, in the fluid heating apparatus 2 according to the present embodiment, the accommodating portion 51 is formed in a cylindrical shape concentric with the main body portion 50, and has a predetermined distance D between the inner surface 50 e of the main body portion 50. Is disposed on the same axis as the axial center C of the main body 50, so that the side surface 51b of the storage 51 is circular toward the region formed between the storage 51 and the inner surface 50e of the main body 50. Since the fluid is exposed evenly in the circumferential direction, the fluid flowing in the region can be heated uniformly, and the heating efficiency of the fluid can be further improved.

本実施例の流体加熱装置２は、収容部５１が本体部５０の端面５０ｃに開口された開口部５０ｄの縁部から本体部５０の内部方向に向けて延出される隔壁部材５４により構成され、隔壁部材５４により囲繞された空間内に発熱体７が収容されるため、簡易な構成で収容部５１を構成することができ、また発熱体７の収容部５１への挿脱が容易である。 The fluid heating device 2 of the present embodiment is configured by a partition member 54 in which the accommodating portion 51 extends from the edge of the opening 50d opened in the end surface 50c of the main body 50 toward the inside of the main body 50, Since the heating element 7 is accommodated in the space surrounded by the partition member 54, the accommodating part 51 can be configured with a simple configuration, and the heating element 7 can be easily inserted into and removed from the accommodating part 51.

なお、基板処理装置１及び流体加熱装置２の構成としては、上述した実施例に限定されず、本発明の目的を逸脱しない限りにおいて種々の変更が可能である。 In addition, as a structure of the substrate processing apparatus 1 and the fluid heating apparatus 2, it is not limited to the Example mentioned above, A various change is possible unless it deviates from the objective of this invention.

すなわち、上述した実施例の配管５は、各部材（本体部５０、収容部５１、流体給入口５２、及び流体排出口５３）が石英ガラスによって成形されるが、少なくとも本体部５０及び収容部５１が非磁性材料より成形されればよく、また、非磁性材料としては、その他に、アルミナやサファイア等の酸化アルミニウムを用いることができる。 That is, in the pipe 5 of the above-described embodiment, each member (the main body portion 50, the housing portion 51, the fluid supply port 52, and the fluid discharge port 53) is formed of quartz glass, but at least the main body portion 50 and the housing portion 51. May be formed from a nonmagnetic material, and aluminum oxide such as alumina or sapphire may be used as the nonmagnetic material.

上述した実施例の配管５は、本体部５０が円筒状に成形された石英ガラスより成形されるが、図５に示すように、さらに本体部５０の外周面５０ａを保護部材５５で覆ってダブルチューブ構造として構成されてもよい。保護部材５５としては、耐熱性、耐薬品性、及び本体部５０の強度補強の観点から、フッ素樹脂材料が好ましく用いられる。このように、本体部５０の外周面５０ａがフッ素樹脂材料より成形される保護部材５５により覆われる構成とすることで、石英ガラスより成形される本体部５０の強度を高めることができ、また本体部５０が破損等した場合であっても、本体部５０の内部空間内の流体が系外に漏出するのを防止できる。 The pipe 5 of the above-described embodiment is formed of quartz glass in which the main body portion 50 is formed into a cylindrical shape. As shown in FIG. 5, the outer peripheral surface 50a of the main body portion 50 is further covered with a protective member 55 and doubled. It may be configured as a tube structure. As the protective member 55, a fluororesin material is preferably used from the viewpoint of heat resistance, chemical resistance, and strength reinforcement of the main body 50. As described above, the outer peripheral surface 50a of the main body 50 is covered with the protective member 55 formed of a fluororesin material, whereby the strength of the main body 50 formed of quartz glass can be increased. Even when the part 50 is damaged or the like, the fluid in the internal space of the main body part 50 can be prevented from leaking out of the system.

また、上述した実施例の配管５は、収容部５１が本体部５０の他方の端部の端面５０ｃに開口された開口部５０ｄの縁部から、本体部５０の内部方向に向けて延出される隔壁部材５４により構成されるが、かかる収容部５１の構成としてはこれに限定されない。例えば、図６に示す実施例のように、本体部１５０の外周面１５０ａに開口された開口部１５０ｄの縁部から、本体部１５０の内部方向に向けて延出される隔壁部材１５４により構成されてもよい。 Further, the pipe 5 of the above-described embodiment is extended toward the inside of the main body 50 from the edge of the opening 50 d where the housing 51 is opened on the end surface 50 c of the other end of the main body 50. Although it is comprised by the partition member 54, as a structure of this accommodating part 51, it is not limited to this. For example, as in the embodiment shown in FIG. 6, the partition wall member 154 extends from the edge of the opening 150 d opened in the outer peripheral surface 150 a of the main body 150 toward the inside of the main body 150. Also good.

かかる実施例の配管１０５では、本体部１５０は、外周面１５０ａに開口部１５０ｄが形成されるとともに、両端部が閉止されて端面１５０ｂ・１５０ｃが形成されている。収容部１５１は、本体部１５０と同心円の略筒状に形成され、本体部１５０の軸中心Ｃ上に沿って内部空間の中途部まで延出されており、両端部が本体部１５０の内部空間内で閉止されて端面１５１ａ・１５１ｂが形成されるとともに、外周面１５１ｃの一部が開口されて本体部１５０の外周面１５０ａに形成された開口部１５０ｄと連通されている。そして、配管１０５は、本体部１５０の開口部１５０ｄが上方を向くようにして設置され（図６参照）、発熱体１０７は、配管１０５の上方より水平状態で本体部１５０の開口部１５０ｄに挿通されて収容部１５１内に収容される。収容部１５１に収容された発熱体１０７は、上述した実施例と同じく、本体部１５０の軸中心Ｃと同一軸心上に配置される。 In the pipe 105 of this embodiment, the main body 150 has an opening 150d on the outer peripheral surface 150a, and both ends are closed to form end surfaces 150b and 150c. The accommodating portion 151 is formed in a substantially cylindrical shape concentric with the main body portion 150, extends to the middle portion of the internal space along the axial center C of the main body portion 150, and both end portions are internal spaces of the main body portion 150. The end surfaces 151 a and 151 b are formed by being closed inside, and a part of the outer peripheral surface 151 c is opened to communicate with an opening 150 d formed on the outer peripheral surface 150 a of the main body 150. The pipe 105 is installed so that the opening 150d of the main body 150 faces upward (see FIG. 6), and the heating element 107 is inserted into the opening 150d of the main body 150 in a horizontal state from above the pipe 105. And accommodated in the accommodating portion 151. The heating element 107 accommodated in the accommodating portion 151 is disposed on the same axis as the axial center C of the main body 150, as in the above-described embodiment.

上述した実施例（図２等参照）の配管５は、本体部５０に対して、流体給入口５２が流体の送給方向の上流側の端面５０ｂに軸中心Ｃ上に沿う方向に向けて突設され、流体排出口５３が流体の送給方向の下流側の外周面５０ａに軸中心Ｃと直交する方向に向けて突設されているが、流体給入口５２及び流体排出口５３の配置構成はこれに限定されず、例えば、図７に示すように、流体給入５２が流体の送給方向の下流側の外周面５０ａに軸中心Ｃと直交する方向に向けて突設されてもよい。 In the pipe 5 of the above-described embodiment (see FIG. 2 and the like), the fluid supply port 52 projects from the main body 50 in the direction along the axial center C on the upstream end surface 50b in the fluid feeding direction. The fluid discharge port 53 is provided on the outer peripheral surface 50a on the downstream side in the fluid feeding direction so as to project in a direction perpendicular to the axis center C. The arrangement configuration of the fluid supply port 52 and the fluid discharge port 53 is provided. For example, as shown in FIG. 7, the fluid supply 52 may protrude from the outer peripheral surface 50 a on the downstream side in the fluid feeding direction in a direction orthogonal to the axis center C. .

上述した実施例の発熱体７は、配管５と断面同心円の円柱部材として形成されるが、発熱体７の形状はこれに限定されず、例えば、円筒状や角柱部材として形成されてもよい。 The heating element 7 of the above-described embodiment is formed as a columnar member having a cross section concentric with the pipe 5, but the shape of the heating element 7 is not limited to this, and may be formed as, for example, a cylindrical shape or a prismatic member.

上述した実施例の加熱処理装置２は、半導体や液晶ディスプレイの製造装置で用いられる半導体ウェハやガラス基板に対して所定の処理を施す基板処理装置（レジスト剥離装置、塗布／現像装置、ウェハ乾燥装置、薄膜製造装置など）に用いることができるとともに、その他、各種の液体や気体を処理する汎用の流体処理装置（洗浄装置、恒温装置など）に用いることができる。 The heat treatment apparatus 2 of the embodiment described above is a substrate processing apparatus (resist stripping apparatus, coating / developing apparatus, wafer drying apparatus) that performs a predetermined process on a semiconductor wafer or glass substrate used in a semiconductor or liquid crystal display manufacturing apparatus. In addition, it can be used for a general-purpose fluid processing apparatus (cleaning apparatus, thermostatic apparatus, etc.) for processing various liquids and gases.

１基板処理装置
２流体加熱装置
３加熱処理装置
４処理装置
５配管
６誘導加熱コイル
７発熱体
８加熱制御装置
５０本体部
５１収容部 DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Fluid heating apparatus 3 Heat processing apparatus 4 Processing apparatus 5 Piping 6 Induction heating coil 7 Heating element 8 Heating control apparatus 50 Main body part 51 Storage part

Claims

A pipe made of a non-magnetic material for supplying fluid into the internal space;
An induction heating coil wound around the outside of the pipe;
Comprising a heating element made of a magnetic material and generating heat by induction heating,
In the fluid heating apparatus that causes the heating element to generate heat by flowing a high-frequency current through the induction heating coil, and heats the fluid flowing in the pipe by the heating element.
The piping is
A cylindrical main body having an internal hollow;
A housing part that extends to the middle part of the internal space along the axial center of the main body part and that is partitioned from the internal space of the main body part and communicates with the external space is provided,
The fluid heating apparatus, wherein the heating element is accommodated in the accommodating portion.

The accommodating portion is formed in a cylindrical shape concentric with the main body portion, and is disposed on the same axial center as the axial center of the main body portion so as to have a predetermined separation from the inner surface of the main body portion. The fluid heating apparatus according to claim 1.

The accommodating portion is constituted by a partition member that extends from an edge portion of an opening portion opened on an end surface or an outer peripheral surface of the main body portion toward an inner direction of the main body portion,
The fluid heating device according to claim 1, wherein the heating element is accommodated in a space surrounded by the partition member.

The fluid heating device according to any one of claims 1 to 3, wherein the main body portion and the housing portion are formed of quartz glass.

The fluid heating device according to any one of claims 1 to 4, wherein the heating element is formed of a carbon-based material.

The fluid heating device according to any one of claims 1 to 5, wherein the main body portion is covered with a protective member whose outer peripheral surface is formed of a fluororesin material.

The fluid heating apparatus according to any one of claims 1 to 6,
A fluid supply device for supplying fluid to the fluid heating device;
A processing apparatus for supplying the fluid heated by the fluid heating apparatus to perform various processes on the substrate;
A substrate processing apparatus comprising: