JP5505886B2 - Metal material, manufacturing method thereof, and die using the metal material - Google Patents
Metal material, manufacturing method thereof, and die using the metal material Download PDFInfo
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- JP5505886B2 JP5505886B2 JP2011119751A JP2011119751A JP5505886B2 JP 5505886 B2 JP5505886 B2 JP 5505886B2 JP 2011119751 A JP2011119751 A JP 2011119751A JP 2011119751 A JP2011119751 A JP 2011119751A JP 5505886 B2 JP5505886 B2 JP 5505886B2
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- 239000007769 metal material Substances 0.000 title claims description 50
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 87
- 238000007747 plating Methods 0.000 claims description 82
- 229910052804 chromium Inorganic materials 0.000 claims description 75
- 239000011651 chromium Substances 0.000 claims description 75
- 238000000034 method Methods 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 35
- 238000003756 stirring Methods 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 239000010410 layer Substances 0.000 description 77
- 239000010408 film Substances 0.000 description 17
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 230000007547 defect Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001339 C alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910019589 Cr—Fe Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 150000001844 chromium Chemical class 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Electroplating Methods And Accessories (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Coating Apparatus (AREA)
- Laminated Bodies (AREA)
Description
本発明は、金属母材の表面に形成させたクロムめっき層の微細なクラックを減少、または消滅させた金属材およびその製造方法に関する。並びに、該金属材を使用し、高精度の膜厚を有するフィルムの製造に用いられるTダイおよびコーティングダイに関する。 The present invention relates to a metal material in which fine cracks of a chromium plating layer formed on the surface of a metal base material are reduced or eliminated, and a method for manufacturing the same. In addition, the present invention relates to a T die and a coating die that are used for manufacturing a film having a highly accurate film thickness using the metal material.
従来、クロムめっきは、樹脂等が凝着しにくいことに加えて、優れた耐摩耗特性を有しているため、フィルム成形用のTダイリップ部や塗工用コーティングダイリップ部等に広く利用されている。しかしながら、金属材の表面にクロムめっき層を形成させる汎用の硬質クロムめっき処理によれば、得られるクロムめっき層表面および内部にクラック等の不可避的な欠陥が多数存在する。このクラックは、めっき層形成後の脱水素処理時に必ず発生する不可避的な現象である。このクラックがTダイのリップランド部やリップエッジ部のコーナー角の鋭利かつ高精度加工を困難とさせるため、R形状とせざるを得なくなっている。このようなクロムめっき層を有する金属材を、フィルム成形用のTダイのリップランド部またはリップエッジ部に使用すると、割れや欠けに詰まった原料樹脂が次回以降の成形時に異物として混入してしまうことが問題となる。塗工用コーティングダイの場合も、割れや欠けに原料樹脂が詰まることで、次回以降の塗工時に異物として混入する。更に、Tダイおよびコーティングダイの寿命という観点からも、欠陥の発生の抑制が求められている。 Conventionally, chrome plating has excellent wear resistance properties in addition to the fact that resin and the like do not adhere easily, so it has been widely used for T-die lip part for film forming, coating die lip part for coating, etc. Yes. However, according to a general-purpose hard chrome plating process for forming a chrome plating layer on the surface of a metal material, there are many inevitable defects such as cracks on the surface and inside of the obtained chrome plating layer. This crack is an inevitable phenomenon that always occurs at the time of dehydrogenation after the formation of the plating layer. Since this crack makes the corner angle of the lip land part and lip edge part of the T-die sharp and difficult to process with high precision, it is unavoidable to have an R shape. When a metal material having such a chrome plating layer is used for the lip land or lip edge of a T-die for film molding, the raw material resin clogged with cracks and chips will be mixed in as a foreign object during the next molding. Is a problem. Also in the case of a coating die for coating, the raw material resin is clogged with cracks and chips, so that it will be mixed as a foreign substance during the next coating. Furthermore, suppression of generation | occurrence | production of a defect is calculated | required also from a viewpoint of the lifetime of T die and a coating die.
この対策の一つとして、パルス電流を利用したパルスめっき処理を行うことで、クラックのないクロム層を形成できることが確認されている(例えば、特開平3−207884号公報)。この方法によれば、1工程処理でクラックのないクロムめっき層を得ることができるようになる。しかし、このパルスめっき処理によれば、熱履歴を受けるとクロム層に大きなクラック(マクロクラック)が発生し易いという問題があり、Tダイやコーティングダイのリップランド部やリップエッジ部への適用は困難となっていた。 As one of countermeasures, it has been confirmed that a chromium layer having no cracks can be formed by performing a pulse plating process using a pulse current (for example, JP-A-3-207844). According to this method, a chromium plating layer having no cracks can be obtained by a one-step process. However, according to this pulse plating treatment, there is a problem that a large crack (macro crack) is likely to occur in the chromium layer when it receives a thermal history, and the application to the lip land part and lip edge part of the T die and coating die is not possible. It was difficult.
一方で、光学フィルム等の製造においては、近年特にフィルムを高精度の膜厚にすることが要求されている。一般に、押出成形において厚み精度を上げ、ダイラインのような傷をなくすためには、製造設備の加工精度を上げる必要がある。中でも、Tダイやコーティングダイは厚み精度、およびダイラインの発生に大きく影響する最重要設備であり、特にTダイおよびコーティングダイのリップランド部および先端部のリップエッジ部のコーナー角は高度な加工精度が要求される。 On the other hand, in the production of optical films and the like, in recent years, it has been particularly required that the film has a highly accurate film thickness. In general, in order to increase the thickness accuracy in extrusion molding and eliminate scratches such as die lines, it is necessary to increase the processing accuracy of manufacturing equipment. Above all, T dies and coating dies are the most important equipment that greatly affects the thickness accuracy and the generation of die lines. Especially, the corner angles of the lip land and tip lip edge of T dies and coating dies are highly machined. Is required.
しかしながら、通常、Tダイおよびコーティングダイのリップランド部およびリップエッジ部には、耐食性や耐摩耗性を上げるために硬質クロムめっき処理を行っている。クロムめっき層には不可避的なクラックが生じ、このクラックがTダイのリップランド部やリップエッジ部のコーナー角の鋭利かつ高精度加工を困難とさせ、押出成形において樹脂の滞留の原因となり、得られるフィルムの厚み精度を低下させたり、ダイラインを発生させたりするという問題があった。 However, in general, hard chrome plating is performed on the lip land portion and the lip edge portion of the T die and the coating die in order to improve corrosion resistance and wear resistance. Inevitable cracks occur in the chrome plating layer, and these cracks make it difficult to sharpen the corner angles of the lip land and lip edge of the T-die and make high-precision processing difficult. There has been a problem that the thickness accuracy of the film to be produced is lowered and a die line is generated.
本発明の目的は、クラックなどの欠陥が少なく、割れや欠けが生じ難いクロム層を有する金属材およびその製造方法、並びに該金属材を使用することにより、膜厚精度が高く、ダイラインの発生を抑制した樹脂フィルムやコーティング層を得ることを可能とするダイを提供することにある。 An object of the present invention is to provide a metal material having a chromium layer that has few defects such as cracks and is less likely to be cracked or chipped, a method for producing the same, and the use of the metal material, thereby providing high film thickness accuracy and generating a die line. An object of the present invention is to provide a die that makes it possible to obtain a suppressed resin film or coating layer.
本発明による金属材は、クラックなどの欠陥を大幅に減少させ、クラック密度(クラック数/cm)が最大でも100以下であるクロムめっき層を表面に有する金属材である。クラック数が少ないことにより、Tダイのリップランド部やリップエッジ部のコーナー角の鋭利かつ高精度加工が容易となり、クロムめっき層に割れや欠けが生じ難い。 The metal material according to the present invention is a metal material having a chromium plating layer on the surface that greatly reduces defects such as cracks and has a crack density (number of cracks / cm) of 100 or less at the maximum. Since the number of cracks is small, sharp and high-precision processing of the corner angle of the lip land portion and lip edge portion of the T die is facilitated, and cracks and chips are hardly generated in the chromium plating layer.
また、本発明による金属材は、金属表面に形成したクロムめっき層表面に摩擦攪拌プロセスを施すことにより、クラック密度が100以下であるクロム層を形成した金属材である。摩擦攪拌プロセスを施すことにより、クラック数の少ないクロム層を形成することができる。 Moreover, the metal material by this invention is a metal material which formed the chromium layer whose crack density is 100 or less by giving a friction stirring process to the chromium plating layer surface formed in the metal surface. By performing the friction stirring process, a chromium layer with a small number of cracks can be formed.
本発明よる金属材の製造方法は、金属表面に形成したクロムめっき層表面に摩擦攪拌プロセスを施すことにより、製造するものである。摩擦攪拌プロセスを施すことにより、クラック数の少ないクロムめっき層を有する金属材を製造することができる。 The metal material manufacturing method according to the present invention is manufactured by subjecting the surface of the chromium plating layer formed on the metal surface to a friction stirring process. By performing the friction stirring process, a metal material having a chromium plating layer with a small number of cracks can be manufactured.
本発明によるダイは、金属母材表面にクロムめっき層を形成し、該クロムめっき層表面に摩擦攪拌プロセスを施すことにより得られた金属材を、リップランド部またはリップエッジ部に用いることによって製造することができる。クラック数の少ないクロムめっき層を有する金属材を使用することで、高精度の膜厚を有し、ダイラインの発生が抑制されたフィルムの製造に用いられるTダイとすることができる。また、該金属材を使用することで、高精度の膜厚を有し、ダイラインの発生が抑制されたコーティング層の形成に用いられるコーティングダイとすることができる。ダイにはTダイおよびコーティングダイが含まれるが、これらに限定されない。 The die according to the present invention is manufactured by forming a chromium plating layer on the surface of a metal base material, and using the metal material obtained by subjecting the chromium plating layer surface to a friction stir process to a lip land portion or a lip edge portion. can do. By using a metal material having a chromium plating layer with a small number of cracks, a T-die used for manufacturing a film having a highly accurate film thickness and suppressed generation of die lines can be obtained. Moreover, it can be set as the coating die used for formation of the coating layer which has a highly accurate film thickness and generation | occurrence | production of die line was suppressed by using this metal material. Dies include, but are not limited to, T dies and coating dies.
本発明の金属材では、金属母材表面に形成したクロム層のクラック密度が小さいことにより、割れや欠けが生じにくく、金属材の加工精度を向上させることができる。また、クラック密度が小さいことにより、クロム層を鏡面仕上げ加工した場合の表面粗さを小さくすることができるため、加工精度が向上する。 In the metal material of the present invention, since the crack density of the chromium layer formed on the surface of the metal base material is small, cracks and chips are hardly generated, and the processing accuracy of the metal material can be improved. Further, since the crack density is small, the surface roughness when the chrome layer is mirror-finished can be reduced, so that the processing accuracy is improved.
本発明の金属材では、金属母材表面に形成したクロムめっき層の表面に摩擦攪拌プロセスを施すことにより、クラック密度が小さくなる。一般の硬質クロムめっきの場合は、一定以上の厚さになるとクラック密度が大幅に大きくなるが、本発明の金属材では、クロム層の厚さに関わらず、クラック密度の小さいクロム層を形成した金属材となる。 In the metal material of the present invention, the crack density is reduced by subjecting the surface of the chromium plating layer formed on the surface of the metal base material to a friction stirring process. In the case of general hard chrome plating, the crack density increases significantly when the thickness exceeds a certain level. However, in the metal material of the present invention, a chromium layer having a low crack density was formed regardless of the thickness of the chromium layer. It becomes a metal material.
本発明の金属材の製造方法では、金属母材表面にクロムめっき処理を行った後、摩擦攪拌プロセスを施すことにより、クロム層の厚さに関わらず、クラック密度が小さいクロム層を有する金属材を製造することができる。また、摩擦攪拌プロセスを施し、クロムめっき層と金属母材の界面近傍を塑性流動させることにより、クロムめっき層/金属母材の界面において高い密着強度を有する金属材を製造することができる。更に、低入熱の条件で摩擦攪拌プロセスを施すことにより、クロムめっき層の結晶化に伴う硬度の低下を抑制することができる。 In the method for producing a metal material of the present invention, a metal material having a chromium layer with a small crack density regardless of the thickness of the chromium layer by performing a friction stir process after performing a chromium plating process on the surface of the metal base material. Can be manufactured. In addition, a metal material having high adhesion strength at the interface between the chromium plating layer and the metal base material can be manufactured by applying a friction stirring process and plastically flowing the vicinity of the interface between the chromium plating layer and the metal base material. Furthermore, by applying the friction stirring process under conditions of low heat input, it is possible to suppress a decrease in hardness accompanying crystallization of the chromium plating layer.
本発明の金属材を使用したダイでは、金属母材表面に形成されたクロム層のクラック密度が小さく、割れや欠けが生じにくい。そのため、リップランド部またはリップエッジ部のコーナー角を精密に加工することができる。また、欠けや割れ等の欠陥に詰まった原料樹脂が次回以降の成形時または塗工時に異物として混入することが軽減される。更に、割れや欠けが生じ難いことで、ダイの寿命を向上させることができる。 In the die using the metal material of the present invention, the crack density of the chromium layer formed on the surface of the metal base material is small, and cracks and chips are not easily generated. Therefore, the corner angle of the lip land part or the lip edge part can be precisely processed. Further, it is reduced that the raw material resin clogged with defects such as chipping and cracking is mixed as a foreign substance during the next molding or coating. Furthermore, since the cracks and chips are less likely to occur, the life of the die can be improved.
本発明の金属材を使用したTダイでは、本発明の金属材をリップランド部またはリップエッジ部に使用することで、樹脂フィルムの押出成形において、膜厚精度が高く、ダイラインの発生を抑制した樹脂フィルムを得ることができる。 In the T die using the metal material of the present invention, by using the metal material of the present invention for the lip land part or the lip edge part, in the extrusion molding of the resin film, the film thickness accuracy is high and the generation of the die line is suppressed. A resin film can be obtained.
本発明の金属材を使用したコーティングダイでは、本発明の金属材をリップランド部またはリップエッジ部に使用することで、ガラス基板等への樹脂の塗工において、膜厚精度が高く、ダイラインの発生を抑制したコーティング層を得ることができる。 In the coating die using the metal material of the present invention, by using the metal material of the present invention for the lip land part or the lip edge part, in the coating of the resin to the glass substrate or the like, the film thickness accuracy is high, and the die line A coating layer with suppressed generation can be obtained.
図1に本発明の金属材の製造方法の模式図を示す。高速回転する円筒状の摩擦攪拌プロセス用ツール30を金属母材表面に形成されたクロムめっき層12に圧入し、摩擦攪拌プロセス用ツール30を任意の方向に移動させることで、クラック密度が小さいクロム層を形成させる。なお、摩擦攪拌プロセス用ツール30を圧入後、移動させることなく引抜いた場合には、摩擦攪拌プロセス用ツール30の底面形状に対応した領域で、クラック数が減少したクロムめっき層が得られる。摩擦攪拌プロセス用ツール30で攪拌された領域には塑性流動が生じるため、金属母材10とクロムめっき層12の界面における密着強度を向上させることができる。 FIG. 1 shows a schematic diagram of a method for producing a metal material of the present invention. Chromium having a low crack density is obtained by pressing a cylindrical friction stir process tool 30 that rotates at high speed into the chromium plating layer 12 formed on the surface of the metal base material and moving the friction stir process tool 30 in an arbitrary direction. A layer is formed. When the friction stir process tool 30 is pressed and pulled out without being moved, a chromium plating layer with a reduced number of cracks is obtained in a region corresponding to the bottom shape of the friction stir process tool 30. Since plastic flow occurs in the region stirred by the friction stirring process tool 30, the adhesion strength at the interface between the metal base material 10 and the chromium plating layer 12 can be improved.
摩擦攪拌プロセスは、1991年に英国のTWI(The Welding Institute)で考案された接合技術である摩擦攪拌接合法を、金属材の表面改質法として応用したものである。摩擦攪拌接合は、高速で回転する円柱状のツールを接合したい領域に圧入(ツール底面にプローブと呼ばれる突起を有しており、該プローブが圧入される)し、摩擦熱によって軟化した被接合材を攪拌しながら接合したい方向に移動することで、接合を達成する技術である。回転するツールによって攪拌された領域は一般的に攪拌部と呼ばれ、接合条件によっては材料の均質化および結晶粒径の減少に伴う機械的特性の向上がもたらされる。摩擦攪拌による材料の均質化および結晶粒径の減少に伴う機械的特性の向上を表面改質して用いる技術が摩擦攪拌プロセスであり、近年広く研究の対象になっている。なお、本発明で用いる摩擦攪拌プロセス用ツール30の底面には、必ずしもプローブを有している必要はなく、プローブを有さない所謂フラットツールを用いることができる。 The friction stir process is an application of the friction stir welding method, which is a joining technique devised by TWI (The Welding Institute) in 1991, as a surface modification method for metal materials. Friction stir welding is a material to be joined that is press-fitted into a region where a cylindrical tool rotating at high speed is to be joined (having a protrusion called a probe on the bottom of the tool, and the probe is press-fitted), and softened by frictional heat. This is a technique for achieving joining by moving in the direction to join while stirring. The region agitated by the rotating tool is generally called an agitator, and depending on the joining conditions, the material is homogenized and the mechanical properties are improved with the reduction of the crystal grain size. A technology that uses surface modification to improve the mechanical properties associated with the homogenization of materials and the reduction in crystal grain size by friction stirring is a friction stirring process, and has been widely studied in recent years. The bottom surface of the friction stir process tool 30 used in the present invention does not necessarily have a probe, and a so-called flat tool without a probe can be used.
クロムめっき層を形成する金属母材10には、種々の金属材料を用いることができ、鉄系合金、銅系合金、チタン合金、アルミニウム合金、マグネシウム合金を例示することができる。Tダイに使用する金属材の金属母材には、鉄系合金を用いることが好ましい。 Various metal materials can be used for the metal base material 10 forming the chromium plating layer, and examples thereof include iron alloys, copper alloys, titanium alloys, aluminum alloys, and magnesium alloys. It is preferable to use an iron-based alloy for the metal base material of the metal material used for the T-die.
クロムめっき層のクラック密度はクラック数/cmで表される。クロムめっき層を光学顕微鏡で観察することにより、測定することができる。 The crack density of the chromium plating layer is represented by the number of cracks / cm. It can be measured by observing the chromium plating layer with an optical microscope.
金属母材10の表面に形成するクロムめっき層12は、所謂硬質クロムめっきによって形成することができる。また、該クロムめっき層は、Cr、Cr−C合金、Cr−C−P合金、Cr−W合金、Cr−Mo合金、Cr−Fe合金、Cr−Ni合金、Cr−Cu合金からなるめっき層を例示することができる。 The chromium plating layer 12 formed on the surface of the metal base material 10 can be formed by so-called hard chromium plating. The chromium plating layer is a plating layer made of Cr, Cr—C alloy, Cr—C—P alloy, Cr—W alloy, Cr—Mo alloy, Cr—Fe alloy, Cr—Ni alloy, Cr—Cu alloy. Can be illustrated.
金属母材10の表面に形成するクロムめっき層12は、1層からなるめっき層に限られず、2以上の層からなるめっき層であってもよい。金属母材10の表面にニッケルめっき処理を行った後に、クロムめっき処理を行うことが好ましい。金属母材の表面に銅めっき層を形成した後に、ニッケルめっき層を形成し、その上にクロムめっき層を形成させることもできる。また、クロムめっき層12の厚さは特に限定されない。 The chromium plating layer 12 formed on the surface of the metal base material 10 is not limited to a single plating layer, and may be a plating layer including two or more layers. It is preferable to perform a chromium plating process after performing the nickel plating process on the surface of the metal base material 10. After forming a copper plating layer on the surface of the metal base material, a nickel plating layer can be formed, and a chromium plating layer can be formed thereon. Moreover, the thickness of the chromium plating layer 12 is not specifically limited.
図2に本発明の金属材の断面模式図を示す。クロムめっき層12の表面近傍に、摩擦攪拌プロセス用ツール30の圧入によって、クラックの数が減少し、またはクラックが消滅したクロムめっき層が形成される。 FIG. 2 shows a schematic cross-sectional view of the metal material of the present invention. In the vicinity of the surface of the chromium plating layer 12, the number of cracks is reduced or a chromium plating layer in which the cracks disappear is formed by press-fitting the friction stirring process tool 30.
図3に本発明の金属材を使用したTダイの断面模式図を示す。Tダイのリップエッジ部44に本発明の金属材を使用することで、鋭利なコーナー角を有し、欠けや割れの少ないリップエッジ部44を有するTダイとすることができる。また、Tダイのリップランド部42に本発明の金属材を使用することで、割れや欠けに詰まった原料樹脂が次回以降の成型時に異物として混入することが軽減される。押出成形において得られるフィルムの厚み精度を向上させ、ダイラインの発生を抑制することができる。 FIG. 3 shows a schematic cross-sectional view of a T die using the metal material of the present invention. By using the metal material of the present invention for the lip edge portion 44 of the T die, a T die having a sharp corner angle and having a lip edge portion 44 with little chipping or cracking can be obtained. In addition, by using the metal material of the present invention for the lip land portion 42 of the T die, it is possible to reduce the mixing of the raw material resin clogged with cracks and chips as foreign matters during the next molding. The thickness accuracy of the film obtained by extrusion molding can be improved, and the generation of die lines can be suppressed.
以下に本発明の実施例及び比較例を図面を参照して説明するが、本発明はこれらの実施例に限定されるものではない。
実施例1
SS400板材の表面に硬質クロムめっき処理を施し、厚さ約300μmのクロムめっき層を形成させた後、クロムめっき層表面に摩擦攪拌プロセスを施した。図4に摩擦攪拌プロセスを施した後のSS400材のクロムめっき層表面の写真を示す。表面にクラックが観察されないクロムめっき層が形成されていることが確認できる。
EXAMPLES Examples and comparative examples of the present invention will be described below with reference to the drawings, but the present invention is not limited to these examples.
Example 1
The surface of the SS400 plate was subjected to a hard chromium plating process to form a chromium plating layer having a thickness of about 300 μm, and then subjected to a friction stirring process on the surface of the chromium plating layer. FIG. 4 shows a photograph of the surface of the chromium plating layer of the SS400 material after the friction stirring process. It can be confirmed that a chromium plating layer in which no crack is observed is formed on the surface.
図5にクロムめっき層表面に摩擦攪拌プロセスを施した後の金属材のクロムめっき層/SS400材の界面近傍の断面写真を示す。クロムめっき層/SS400材の界面が凹凸状となっており、摩擦攪拌プロセスによって、クロムめっき層がSS400材から剥離することなく、一体となって塑性流動したことが確認され、該界面の密着強度が高いことが分かる。 FIG. 5 shows a cross-sectional photograph in the vicinity of the interface of the chromium plating layer / SS400 material of the metal material after the friction stirring process is performed on the surface of the chromium plating layer. The interface of the chromium plating layer / SS400 material is uneven, and the friction stir process confirmed that the chromium plating layer was integrally plastically flowed without peeling from the SS400 material. Is high.
比較例1
SS400板材の表面に硬質クロムめっき処理を施し、厚さ約300μmのクロムめっき層を形成させた。図6にクロムめっき層表面の写真を示す。表面に多数のクラックが生じていることが確認できる。
Comparative Example 1
The surface of the SS400 plate material was subjected to a hard chrome plating process to form a chromium plating layer having a thickness of about 300 μm. FIG. 6 shows a photograph of the surface of the chromium plating layer. It can be confirmed that many cracks are generated on the surface.
図7にSS400板材の表面に硬質クロムめっき処理を施し、厚さ約300μmのクロムめっき層を形成させたときのクロムめっき層/SS400材の界面近傍の断面写真を示す。クロムめっき層/SS400材の界面は直線状であり、該界面の密着強度が低いことが分かる。 FIG. 7 shows a cross-sectional photograph of the vicinity of the interface of the chromium plating layer / SS400 material when the surface of the SS400 plate material is subjected to a hard chromium plating process to form a chromium plating layer having a thickness of about 300 μm. It can be seen that the interface of the chromium plating layer / SS400 material is linear, and the adhesion strength of the interface is low.
実施例2
SS400板材の表面に硬質クロムめっき処理を施し、厚さ約300μmのクロムめっき層を形成させた後、該クロムめっき層表面に摩擦攪拌プロセスを施した。その後、該SS400板材を使用して、該クロムめっき層がリップランド部およびリップエッジ部となるようにTダイを作製した。図8に該Tダイのリップエッジ部近傍の写真を示す。リップエッジ部に割れや欠けがないことが確認できる。
Example 2
The surface of the SS400 plate was subjected to hard chrome plating to form a chromium plating layer having a thickness of about 300 μm, and then subjected to a friction stirring process on the surface of the chromium plating layer. Then, using this SS400 board | plate material, T die was produced so that this chromium plating layer might become a lip land part and a lip edge part. FIG. 8 shows a photograph of the vicinity of the lip edge portion of the T die. It can be confirmed that the lip edge portion is not cracked or chipped.
比較例2
SS400板材の表面に硬質クロムめっき処理を施し、厚さ約300μmのクロムめっき層を形成させた。該SS400板材を使用して、該クロムめっき層がリップランド部およびリップエッジ部となるようにTダイを作製した。図9に該Tダイのリップエッジ部近傍の写真を示す。リップエッジ部に割れが確認できる。
Comparative Example 2
The surface of the SS400 plate material was subjected to a hard chrome plating process to form a chromium plating layer having a thickness of about 300 μm. Using the SS400 plate material, a T-die was prepared so that the chromium plating layer became a lip land part and a lip edge part. FIG. 9 shows a photograph of the vicinity of the lip edge portion of the T die. Cracks can be confirmed at the lip edge.
表1に実施例1および比較例1のクラック密度、並びにSS400板材の表面に種々の厚さで硬質クロムめっき処理を施したときのクロムめっき層のクラック密度(比較例3〜7)およびそれぞれのクロムめっき層に摩擦攪拌プロセスを施した後のクラック密度(実施例3〜7)を示す。いずれのクロムめっき層厚さでも、摩擦攪拌プロセスを施すことにより、クラック密度は大幅に減少することが分かる。 Table 1 shows the crack density of Example 1 and Comparative Example 1, and the crack density (Comparative Examples 3 to 7) of the chromium plating layer when the surface of the SS400 plate was subjected to hard chromium plating treatment with various thicknesses. The crack density (Examples 3-7) after giving a friction stirring process to a chromium plating layer is shown. It can be seen that the crack density is greatly reduced by applying the friction stirring process at any chrome plating layer thickness.
10…金属母材
12…クロムめっき層
20…改質領域
30…摩擦攪拌プロセス用ツール
40…Tダイ
42…リップランド部
44…リップエッジ部
DESCRIPTION OF SYMBOLS 10 ... Metal base material 12 ... Chrome plating layer 20 ... Modified area | region 30 ... Friction stirring process tool 40 ... T die 42 ... Lip land part 44 ... Lip edge part
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