JP5504638B2 - Lighting device - Google Patents

Description

  The present invention relates to a lighting device using a semiconductor light emitting element.

  Generally, there is a spotlight as an illumination device used for illumination in a theater or a television studio. A halogen light bulb or a discharge lamp is used as the light source of the spotlight. In addition, spotlights using LEDs, which are semiconductor light emitting elements, as light sources have been developed. A large number of LEDs are arranged as a light source on a curved surface, and the irradiation beam of each LED is condensed at one point to constitute a virtual single point light source unit, and the positional relationship between the light source unit and the lens is made variable to change the irradiation surface. There is a spotlight in which the illuminance and the illuminance distribution are changed (see, for example, Patent Document 1).

  Also, in order to obtain a desired color, colors such as blue green, orange, and red are mixed as colors other than white, and the contour (edge) of the projection aperture that concentrates the irradiation beam of each LED is blurred and color unevenness is achieved. In order to suppress this, a diffusion filter is provided, or a focus handle and a zoom handle are provided so that an irradiation shift does not occur even when the subject is out of focus or is blurred (for example, see Patent Document 2).

  FIG. 6 is a configuration diagram of an illumination device using a conventional LED as a light source. The illumination device includes a light source unit 11 and a projection unit 12, and the light source unit 11 includes a light source unit housing 14 that houses an LED light source unit 13, and a radiator 15 that radiates heat generated by the LED light source unit 13. Composed. An aperture 16 serving as a pseudo light source unit is formed in the light source unit housing 14, and the LED light source unit 13 is configured by arranging a plurality of LEDs 17 so that a light beam is directed to the aperture 16. Thereby, the condensing point of the light from the plurality of LEDs 17 of the LED light source unit 13 becomes the position of the aperture 16, thereby forming a pseudo light source by the aperture 16.

  The power source unit 18 that supplies the lighting power to the LED light source unit 13 and the control circuit unit 19 that controls the lighting of the LED light source unit 13 are arranged on both side surfaces of the light source unit housing 14 so as to operate the lighting device. The operation unit 20 is provided on the side surface of the light source unit housing 14. Further, the aperture 16 is provided with a cutter unit 21, and by operating the cutter unit 21, the shape of the aperture 16, that is, the shape of the pseudo light source can be changed.

  On the other hand, the projection unit 12 is provided with projection lenses 22a and 22b that condense the light from the light source unit 11 and emit the light to the outside.

JP 2001-307502 A JP 2005-158699 A

  However, in the conventional illumination device, the LED light source unit 13 is configured by arranging a plurality of LEDs 17 so that the light beam is directed to the aperture 16, and therefore, a predetermined distance between the LED light source unit 13 and the aperture 16. Need to keep. In the illumination device, the illumination illuminance of light emitted to the outside is determined by the brightness of the focus positions (focus positions) of the projection lenses 22a and 22b, and the LED light source unit 13 is as close as possible to the focus positions of the projection lenses 22a and 22b. Although the brightness at the focus position increases with the arrangement, it is necessary to maintain a predetermined distance between the LED light source unit 13 and the aperture 16, so there is a limit to increasing the illumination intensity.

  When the LED light source unit 13 is brought close to the focus position of the projection lenses 22a and 22b, the light incident angle from the LED light source unit 13 to the focus position is increased, so that the incident light rate to the projection lenses 22a and 22b is decreased. The LED, which is a light source, does not have a light amount as compared with a halogen bulb or the like, and the color of the irradiated light is adjusted by blending multicolored LEDs, so that color unevenness may occur in the irradiated light. Further, when color adjustment is not performed, a single-color LED is obtained. However, even in the case of a single color, unevenness in the brightness of the plurality of LEDs may cause unevenness in irradiation light.

  An object of the present invention is to provide an illuminating device that can reduce the size of the entire device, ensure the amount of irradiation light, and reduce the occurrence of color unevenness.

A lighting device according to a first aspect of the present invention is a planar light source in which a plurality of semiconductor light emitting elements are arranged in a plane; and a cylindrical shape that has a reflection characteristic inside and guides light from the planar light source An optical path; a projection lens for projecting light emitted from the cylindrical optical path and controlling irradiation light; and disposed between the projection lens and the cylindrical optical path, for light emitted from the cylindrical optical path A cutter unit that controls the shape; and a diffusion filter that is disposed in the cylindrical optical path and diffuses light from the planar light source, and the planar light source is disposed outside the depth of field of the projection lens, The diffusion filter is provided at a position outside the depth of field of the projection lens, and a pseudo surface light source is formed at an opening end of the cylindrical optical path .

  In the present invention and the following inventions, definitions and technical meanings of terms are as follows unless otherwise specified.

  A planar light source refers to a light source formed by arranging one or more semiconductor light emitting elements on a planar insulating material, for example. The semiconductor light emitting element is, for example, an LED or an organic EL. The cylindrical optical path refers to an optical path that guides light from a planar light source. Reflecting means is provided inside the cylindrical optical path, and most of the emitted light from the planar light source is emitted from the opening end of the cylindrical optical path due to the reflection characteristics of the reflecting means. As a result, the brightness of the emitted light from the cylindrical optical path is substantially equal to the brightness of the emitted light from the planar light source, and a pseudo planar light source is provided at the opening end of the cylindrical optical path. . The reflecting surface of the reflecting means may be a diffuse reflecting surface in addition to a mirror-like reflecting surface.

  A projection lens refers to a lens that controls light emitted from a cylindrical optical path. The lens includes a combination of one or more lenses. By adjusting the position of the projection lens, for example, the light emitted from the cylindrical optical path is irradiated to the outside after being enlarged, reduced or focused. The cutter unit refers to one that controls the shape of the light emitted from the cylindrical optical path.For example, the cutter unit changes the shape of the light emitted from the cylindrical optical path to an arbitrary shape such as a circle, square, or triangle. Control. The focus position of the projection lens refers to a position where the light emitted from the point light source is concentrated at one point when it is assumed that the point light source is located at the irradiation surface of the projection lens.

  The diffusion filter refers to a filter that functions to diffuse light when the light emitted from the semiconductor light emitting element of the planar light source is transmitted and suppress the occurrence of color unevenness and irradiation unevenness.

  The depth of field refers to a range in which clear images before and after a certain point can be obtained.

According to a second aspect of the present invention, there is provided a lighting device according to the first aspect of the present invention, wherein the lighting device has a plurality of holes into which the plurality of semiconductor light emitting elements of the planar light source are inserted, and is formed on a side surface of each hole. A planar porous reflector is provided for controlling the light distribution characteristics of the semiconductor light emitting device to emit light from the semiconductor light emitting device forward.

  The planar porous reflector is a reflector that controls the light distribution characteristics of the semiconductor light emitting element and emits light from the semiconductor light emitting element forward, and is formed of a material that can withstand the heat of the semiconductor light emitting element. For example, one semiconductor light emitting element is inserted into each of the plurality of holes, and light from the semiconductor light emitting element is directly emitted forward, and a part of the light from the semiconductor light emitting element is emitted. Is reflected by the light reflecting surface formed on the side surface of the hole and directly emitted forward.

According to the invention of claim 1, since the light source that emits the light to be projected is a planar surface light source, the entire apparatus can be reduced in size, and light from the semiconductor light emitting element of the surface light source can be achieved. Is emitted from the cylindrical optical path to the cutter unit, so that attenuation of the amount of light emitted from the planar light source can be suppressed. Moreover, since the diffusion filter for diffusing the light from the planar light source is provided in the cylindrical optical path, the light can be diffused. Accordingly, it is possible to further suppress the crispy, color unevenness and irradiation unevenness. In addition, since the planar light source is disposed outside the depth of field of the projection lens, it is possible to reduce the sensation of each of the semiconductor light emitting elements of the planar light source, thereby reducing color unevenness and irradiation unevenness. In addition, since the diffusion filter is disposed outside the depth of field of the projection lens, it is possible to reduce the inclusion of the image of the diffusion filter in the irradiation light. In other words, since a pseudo surface light source is formed at the opening end of the cylindrical light path, the sensation of each of the semiconductor light emitting elements of the surface light source is less likely to appear in the irradiation region without a decrease in light output. Moreover, it is possible to prevent the image of the main body of the diffusion filter from being projected, and to reduce color unevenness and irradiation unevenness while improving the efficiency of the illumination device.

According to the second aspect of the present invention, the light distribution characteristics of the semiconductor light emitting device are controlled by the reflecting surface formed on the side surface of each of the holes. Since the planar porous reflector for emitting the light from the semiconductor light emitting element forward is provided, the light from the plurality of semiconductor light emitting elements can be mixed in the cylindrical light path on the planar light source side with respect to the diffusion filter. Unevenness can be further prevented.

The block diagram of the illuminating device concerning embodiment of this invention. The top view of the planar light source in embodiment of this invention. Explanatory drawing of the planar porous reflector in embodiment of this invention. The perspective view of the cylindrical optical path in embodiment of this invention. Explanatory drawing of the arrangement position of the surface light source in embodiment of this invention. The block diagram of the illuminating device which uses conventional LED as a light source.

  FIG. 1 is a configuration diagram of a lighting apparatus according to an embodiment of the present invention. In the following description, a case where a light emitting diode (LED) is used as the semiconductor light emitting element will be described. The illumination device according to the embodiment of the present invention is a power supply unit 18 that supplies a lighting power to the planar light source 24 using the LED light source unit 13 of the light source unit 11 as a planar light source 24 in contrast to the conventional example shown in FIG. In addition, a control circuit unit 19 that controls lighting of the planar light source 24 is provided on both side surfaces of the light source unit 11, and an operation unit 20 that performs lighting operation of the planar light source 24 is provided on the opposite side surface of the power supply unit 18. .

  As shown in FIG. 1, the planar light source 24 of the light source unit 11 emits light with a plurality of LEDs 17 which are semiconductor light emitting elements arranged in a plane. Hereinafter, a case where the semiconductor light emitting element is an LED will be described. A planar porous reflector 25 is attached to the planar light source 24, and the light distribution characteristic of the LED 17 is controlled by the planar porous reflector 25 to emit light from the LED 17 forward. Details of the planar light source 24 and the planar porous reflector 25 will be described later.

  The back surface of the planar light source 24 is directly attached to the radiator 15, and heat generated by the planar light source 24 is radiated from the radiation fins 16 of the radiator 15. In addition, a cylindrical optical path 26 is provided in the vicinity of the planar porous reflector 25, and the cylindrical optical path 26 guides the light of the LED 17 whose light distribution characteristics are controlled by the planar porous reflector 25 to the projection unit 12. Shine. Reflecting means having a mirror-like reflection characteristic is provided on the inner surface of the cylindrical optical path 26. In addition, a diffusion filter 27 that diffuses light from the planar light source 24 whose light distribution is controlled by the planar porous reflector 25 is provided inside the cylindrical optical path 26.

A cutter unit 28 is provided at a position between the cylindrical optical path 26 and the projection unit 12 and in the vicinity of the opening end of the cylindrical optical path 26. Therefore, the cutter unit 28 will be most of the light emitted from the planar light source 24 reaches the light leakage and light loss is improved efficiency being suppressed.

  The shape of the light emitted from the cylindrical optical path 26 is controlled by the cutter unit 28, and the light whose shape is controlled by the cutter unit 28 is projected to the projection lenses 22 a and 22 b via the diffusion sheet 34 of the projection unit 12. Is emitted. The projection lenses 22a and 22b irradiate the light that has passed through the cutter unit 28 with enlargement, reduction, and focusing. The diffusion sheet 34 is provided in order to blur the edge portion of the light shape cut by the cutter unit 28. When the edge portion of the light shape is clear, it is not necessary to provide the diffusion sheet 34.

  The light source unit 11 is formed to be detachably attached to the projection unit 12 by a support bar 35. The support bar 35 is detachably attached to the projection unit 12 by insertion.

  FIG. 2 is a plan view of the planar light source 24. The printed board 29 is formed by printing wiring with a copper foil on a flat insulating material, and a plurality of LEDs 17 are attached to the printed board 29. FIG. 2 shows a case where 45 LEDs 17 are attached, and shows a case where three blue LEDs 17b and six red LEDs 17r are provided as complementary colors in addition to the white LEDs 17w.

  FIG. 3 is an explanatory view of the planar porous reflector 25. FIG. 3 (a) is a perspective view of the planar porous reflector 25, FIG. 3 (b) is a cross-sectional view of the planar porous reflector 25, and FIG. It is explanatory drawing of the light distribution characteristic of the light of the semiconductor light-emitting device inserted in the planar porous reflector 25. FIG. As shown in FIG. 3A, the reflector body 29 of the planar porous reflector 25 is made of a white heat-resistant material. This is because the planar porous reflector 25 controls the light distribution to the irradiation side of the LED 17, and the opposite side of the irradiation side of the LED 17 is in contact with the printed circuit board 29 of the planar light source 24 and is affected by the heat generation of the LED 17.

  The planar porous reflector 25 has a plurality of holes 30 into which the individual LEDs 17 of the planar light source 24 are inserted one by one, and a reflective surface 31 is formed on the side surface of each hole 30. As shown in FIG. 3B, one LED 17 is inserted into each hole 30, and the reflection surface 31 formed on the side surface of the hole 30 has a wide angle with respect to the direction of light emission from the LED 17. It is configured. Further, the depth (thickness of the planar porous reflector 25) h of each hole 30 is formed such that the tip of the light emitting part of the LED 17 substantially coincides with the opening tip of the hole 30. This is because when the depth of the hole 30 is increased, the reflection surface 31 of the hole 30 becomes longer and the light from the LED 17 is attenuated by the reflection surface 31, so that the loss of light from the LED 17 emitted from the hole 30 of the planar porous reflector 25 is lost. This is to alleviate the problem.

  As described above, the planar porous reflector 25 inserts each LED 17 into the hole 30 and directly emits the light from the LED 17 and reflects the light at the reflecting surface 31 of the hole 30 and emits it forward. As a result, the light distribution characteristic L1 indicated by the dotted line in FIG. 3C is obtained, and the light emitting portions of the individual LEDs 17 are enlarged to reduce the sensation of the LEDs 17 of the planar light source 24 and to reduce the uneven color of the irradiated light. .

Further, the reflecting surface 31 of the hole 30 is a mirror or white, if the reflectance is a major diffuse reflective surface as the light distribution characteristic L2 shown by the solid line in FIG. 3 (c), the light distribution characteristic shown by the dotted line A light distribution characteristic L2 diffused more than L1 is obtained. Thereby, the color of LED17 of several colors can be mixed appropriately, and it can prevent that a color nonuniformity arises.

  FIG. 4 is a perspective view of the cylindrical optical path 26. The cylindrical optical path 26 includes a cylindrical portion 32 and a flange portion 33, and the inner surface of the cylindrical portion 32 is formed of a reflective surface having reflection characteristics. In addition, a diffusion filter 27 that diffuses light is provided inside the cylindrical portion 32. The cylindrical optical path 26 maintains a distance between the planar light source 24 and the cutter unit 28.

  The shorter the distance between the planar light source 24 and the cutter unit 28, the brighter the irradiated light. However, if the interval is shortened, the projection lenses 22a and 22b that project the light that has passed through the cutter unit 28 are used. The sensation of the LED 17 is projected as it is. Therefore, the variation in luminance of the LED 17 of the planar light source 24 and the color of the LED 17 become uneven as they are and are projected onto the irradiation light.

  On the contrary, if the distance between the planar light source 24 and the cutter unit 28 is long, the irradiation light becomes dark. However, by using the cylindrical optical path 26 in which the inside is a reflective surface, the light from the planar light source 24 can be efficiently used. It becomes possible to irradiate the cutter unit 28, and the length of the cylindrical optical path 26 is secured to some extent, and a reflection film 27 is placed in the cylindrical optical path 26 so as to reduce unevenness of irradiation light. Yes.

FIG. 5 is an explanatory diagram of the arrangement position of the planar light source in the embodiment of the present invention. FIG. 5 shows a state where the positions of the projection lenses 22a and 22b and the range of the depth of field 36 are maximized in a state where the irradiation light is maximally reduced.

  As shown in FIG. 5, the projection lenses 22 a and 22 b are arranged such that the focus position 37 is located in the vicinity of the cutter unit 28. Then, when the positions of the projection lenses 22a and 22b are adjusted by the adjustment handles 23a and 23b to reduce the irradiation light to the maximum, the range of the depth of field 36 is increased. In this state, the planar light source 24 and the diffusion filter 27 are disposed so as to be located outside the range of the depth of field 36 of the projection lenses 22a and 22b. In addition, when the positions of the projection lenses 22a and 22b are adjusted by the adjustment handles 23a and 23b to maximize the irradiation light, the focus position 37 does not change and the range of the depth of field 36 does not change. It becomes small in the direction toward 37. Even in this state, the planar light source 24 and the diffusion filter 27 are located outside the range of the depth of field 36 of the projection lenses 22a and 22b.

  As described above, the planar light source 24 and the diffusion filter 27 are disposed so as to be located outside the range of the depth of field 36 of the projection lenses 22a and 22b. Since a pseudo planar light source is disposed by the means, it is difficult for the sensation of each of the semiconductor light emitting elements of the planar light source 24 to appear in the irradiation region without a decrease in light output, Further, it is possible to prevent the shadow image of the main body of the diffusion filter 27 from being displayed, and it is possible to reduce color unevenness and irradiation unevenness while improving the efficiency of the illumination device.

  According to the embodiment of the present invention, the planar light source 24 is configured by arranging a plurality of LEDs 17 on the same plane, and the radiator 15 is directly attached to the side opposite to the irradiation side of the planar light source 24. It is possible to reduce the size. In addition, since the planar light source is disposed outside the depth of field of the projection lens, it is possible to reduce the sensation of each of the semiconductor light emitting elements of the planar light source, thereby reducing color unevenness and irradiation unevenness. it can.

  In addition, the cylindrical light path 26 having a reflection characteristic and having a diffusion filter 27 in the interior secures a length between the surface light source 26 and the cutter portion 28 so that unevenness of irradiation light does not occur. It is possible to relieve the sensation of the LED 17 while suppressing the attenuation of the amount of light from 24, and to prevent color unevenness and irradiation unevenness from occurring. Furthermore, the diffusion filter for diffusing the light from the planar light source is provided in the cylindrical optical path, so that the light can be diffused, and further, the crispness, color unevenness and irradiation unevenness can be prevented.

  Further, a planar porous reflector 25 for controlling the light from the LED 17 of the planar light source 24 is provided, and the light from each LED 17 is reflected forward by the reflecting surface 31 of the hole 30 of the planar porous reflector 25. Since the light is emitted, color unevenness and irradiation unevenness can be prevented.

DESCRIPTION OF SYMBOLS 11 ... Light source unit, 12 ... Projection unit, 13 ... LED light source part, 14 ... Light source part housing | casing, 15 ... Radiator, 16 ... Radiation fin, 17 ... LED, 18 ... Power supply unit, 19 ... Control circuit unit, 20 ... Operation unit, 21 ... cutter unit, 22 ... projection lens, 23 ... adjustment handle, 24 ... planar light source, 25 ... planar porous reflector, 26 ... cylindrical optical path, 27 ... diffusion filter, 28 ... cutter unit, 29 ... print Substrate, 30 ... hole, 31 ... reflecting surface, 32 ... cylindrical part, 33 ... trench, 34 ... diffusion sheet, 35 ... support bar, 36 ... depth of field, 37 ... focus position

Claims (2)

A planar light source in which a plurality of semiconductor light emitting elements are arranged in a plane;
A cylindrical optical path that has internal reflection characteristics and guides light from the planar light source;
A projection lens for projecting light emitted from the cylindrical optical path and controlling irradiation light;
A cutter unit disposed between the projection lens and the cylindrical optical path for controlling the shape of light emitted from the cylindrical optical path;
A diffusion filter disposed in the cylindrical optical path and diffusing light from the planar light source ;
The planar light source is disposed outside the depth of field of the projection lens;
The diffusion filter is provided at a position outside the depth of field of the projection lens;
A lighting device, wherein a pseudo surface light source is formed at an opening end of the cylindrical optical path . A plurality of holes for inserting a plurality of semiconductor light emitting elements of the planar light source are provided, and a light distribution characteristic of the semiconductor light emitting element is controlled by a reflecting surface formed on a side surface of each hole to remove light from the semiconductor light emitting element. The illumination device according to claim 1, further comprising a planar porous reflector for emitting forward light.

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