JP5494704B2 - Optical waveguide device module - Google Patents

Optical waveguide device module Download PDF

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JP5494704B2
JP5494704B2 JP2012060154A JP2012060154A JP5494704B2 JP 5494704 B2 JP5494704 B2 JP 5494704B2 JP 2012060154 A JP2012060154 A JP 2012060154A JP 2012060154 A JP2012060154 A JP 2012060154A JP 5494704 B2 JP5494704 B2 JP 5494704B2
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optical waveguide
waveguide element
substrate
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wiring
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JP2012141632A (en
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基弘 竹村
慎介 菅野
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Sumitomo Osaka Cement Co Ltd
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本発明は、光導波路素子モジュールに関し、特に、光導波路素子と接続基板とを筐体内に収容した光導波路素子モジュールに関する。   The present invention relates to an optical waveguide element module, and more particularly to an optical waveguide element module in which an optical waveguide element and a connection substrate are accommodated in a housing.

光計測技術分野や光通信技術分野において、光変調器や光スイッチなどの電気光学効果を有する基板に光導波路を形成した光導波路素子が多用されている。これらの光導波路素子は、通常、密閉される筐体(ケース)内に収容されて、光導波路素子モジュールを構成している。   In the optical measurement technical field and the optical communication technical field, an optical waveguide element in which an optical waveguide is formed on a substrate having an electrooptic effect such as an optical modulator or an optical switch is often used. These optical waveguide elements are usually housed in a hermetically sealed casing (case) to constitute an optical waveguide element module.

特許文献1に示すように、光導波路素子モジュールの筐体内には、外部からの入力線を光導波路素子の制御電極に電気的に接続するための中継基板や、光導波路素子の制御電極の出力側に電気的に接続され、出力信号を吸収又はモジュール外に導出するための終端基板が収容されている。   As shown in Patent Literature 1, a relay substrate for electrically connecting an external input line to a control electrode of an optical waveguide element and an output of the control electrode of the optical waveguide element are provided in the housing of the optical waveguide element module. A termination board is accommodated which is electrically connected to the side and absorbs the output signal or leads it out of the module.

通常は、接続部での不連続性を減らし周波数特性を向上するために、図1に示すように、光導波路素子を構成する変調用基板と中継基板の電極寸法や接地電極(GND)の間隔が等しくなるように設計されている。また、終端基板と変調用基板との接続でも同じことが言える。このように変調用基板と接続基板との電極の寸法や間隔を合わせると、光導波路素子の種類だけ接続基板を用意する必要があり、製造コストの増加の原因となる。   Usually, in order to reduce the discontinuity at the connection portion and improve the frequency characteristics, as shown in FIG. 1, the electrode dimensions of the modulation substrate and the relay substrate constituting the optical waveguide element and the distance between the ground electrode (GND) Are designed to be equal. The same applies to the connection between the termination substrate and the modulation substrate. Thus, when the dimensions and intervals of the electrodes of the modulation substrate and the connection substrate are matched, it is necessary to prepare connection substrates for the types of optical waveguide elements, which causes an increase in manufacturing cost.

また、光導波路素子の高周波化(広域化)が進み、図2に示す中継基板にアルミナなど光導波路素子を構成する基板(変調用基板)と比較して低誘電率な材料が用いられるようになっている。このような場合には、中継基板と光導波路素子とでは誘電率が異なるため接続部において不連続性が発生し、電気特性が劣化する原因となる。また、中継基板の入力側と出力側との間で、信号線路の幅や接地(GND)線路の間隔を急激に変化させると、外部からの入力線と中継基板及び光導波路素子のインピーダンス不整合が発生しやすくなり、電気特性の劣化が一層顕著なものとなる。   Further, as the frequency of optical waveguide elements is increased (widened), a material having a low dielectric constant is used for the relay substrate shown in FIG. 2 as compared with a substrate (modulation substrate) such as alumina that constitutes the optical waveguide element. It has become. In such a case, since the dielectric constants of the relay substrate and the optical waveguide element are different, discontinuity occurs in the connection portion, which causes the electrical characteristics to deteriorate. In addition, if the width of the signal line and the distance between the ground (GND) lines are suddenly changed between the input side and the output side of the relay board, impedance mismatch between the external input line and the relay board and the optical waveguide element Is likely to occur, and the deterioration of electrical characteristics becomes more remarkable.

特開2003−233043号公報JP 2003-233043 A

本発明が解決しようとする課題は、上述したような問題を解決し、外部からの入力線と中継基板及び光導波路素子のインピーダンスを整合させ、さらに光導波路素子と接続基板(中継基板又は終端基板)との電気的接続の不連続性を減少させ、電気特性の劣化を防止した光導波路素子モジュールを提供することである。しかも、異なる種類の光導波路素子に対し共通の接続基板を利用することを可能とし、製造コストを低減した光導波路素子モジュールを提供することである。   The problem to be solved by the present invention is to solve the above-described problems, match the impedance of the external input line, the relay substrate and the optical waveguide element, and further connect the optical waveguide element and the connection substrate (relay substrate or termination substrate). And an optical waveguide element module in which the electrical discontinuity is reduced and deterioration of electrical characteristics is prevented. In addition, it is possible to provide an optical waveguide element module that enables a common connection substrate to be used for different types of optical waveguide elements, and that reduces manufacturing costs.

上記課題を解決するため、請求項1に係る発明は、電気光学効果を有する基板と、該基板に形成された光導波路と、該光導波路を伝搬する光波を制御するための制御電極とを有する光導波路素子と、該光導波路素子の外部に設けられ、該制御電極と電気的に接続された配線を有する接続基板と、該光導波路素子と該接続基板とを筐体内に収容する光導波路素子モジュールにおいて、該制御電極は、信号電極と該信号電極を挟むように配置された接地電極とから構成され、該接続基板は、信号線路と該信号線路を挟むように配置された接地線路とが設けられ、該接続基板の誘電率は、該光導波路素子を構成する前記基板の誘電率より低く、該制御電極の入力端部又は出力端部における該信号電極の幅S1は、該光導波路素子側の該信号線路の幅S2以下であって、該入力端部又は該出力端部における該接地電極の間隔W1が、該接続基板の該光導波路素子側の該接地線路の間隔W2よりも大きく、該制御電極は、該入力端部又は該出力端部から離れた部分に、該接地電極の間隔が該間隔W2よりも小さい部分を有し、該光導波路素子と該接続基板とを繋ぐ接地用の配線を有することを特徴とする。   In order to solve the above problems, an invention according to claim 1 includes a substrate having an electro-optic effect, an optical waveguide formed on the substrate, and a control electrode for controlling a light wave propagating through the optical waveguide. An optical waveguide element, a connection substrate provided outside the optical waveguide element and having a wiring electrically connected to the control electrode, and an optical waveguide element that accommodates the optical waveguide element and the connection substrate in a housing In the module, the control electrode includes a signal electrode and a ground electrode disposed so as to sandwich the signal electrode, and the connection substrate includes a signal line and a ground line disposed so as to sandwich the signal line. The dielectric constant of the connection substrate is lower than the dielectric constant of the substrate constituting the optical waveguide element, and the width S1 of the signal electrode at the input end or output end of the control electrode is determined by the optical waveguide element. Width of the signal line on the side 2 or less, and the interval W1 between the ground electrodes at the input end or the output end is larger than the interval W2 between the ground lines on the optical waveguide element side of the connection substrate, and the control electrode A portion remote from the input end portion or the output end portion, and having a portion where the interval between the ground electrodes is smaller than the interval W2, and having a grounding wiring for connecting the optical waveguide element and the connection substrate. Features.

請求項2に係る発明は、請求項1に記載の光導波路素子モジュールにおいて、該接地電極と該接地線路とは複数の接地用配線で接続されていることを特徴とする。   According to a second aspect of the present invention, in the optical waveguide element module according to the first aspect, the ground electrode and the ground line are connected by a plurality of ground wirings.

請求項3に係る発明は、請求項1又は2に記載の光導波路素子モジュールにおいて、該接地用の配線間隔Wが、該間隔W1よりも小さい配線を有することを特徴とする。   The invention according to claim 3 is the optical waveguide element module according to claim 1 or 2, wherein the ground wiring interval W is smaller than the interval W1.

請求項4に係る発明は、請求項1乃至3のいずれかに記載の光導波路素子モジュールにおいて、該接地用の配線の該光導波路素子側の端部の接続位置が、該間隔W2よりも小さい部分に接続されている配線を有することを特徴とする。   According to a fourth aspect of the present invention, in the optical waveguide element module according to any one of the first to third aspects, the connection position of the end portion on the optical waveguide element side of the grounding wiring is smaller than the interval W2. It has the wiring connected to the part.

請求項5に係る発明は、請求項1乃至4のいずれかに記載の光導波路素子モジュールにおいて、該光導波路素子と該接続基板を繋ぐ前記接地用の配線を挟むように配置され、配線間隔が該間隔W1よりも大きい他の配線を有することを特徴とする。   According to a fifth aspect of the present invention, in the optical waveguide device module according to any one of the first to fourth aspects, the grounding wiring that connects the optical waveguide device and the connection substrate is sandwiched, and a wiring interval is set. Another wiring is larger than the interval W1.

請求項6に係る発明は、請求項1乃至5のいずれかに記載の光導波路素子モジュールにおいて、該光導波路素子と該接続基板とを繋ぐ配線は、ワイヤーボンディングであることを特徴とする。   The invention according to claim 6 is the optical waveguide element module according to any one of claims 1 to 5, wherein the wiring connecting the optical waveguide element and the connection substrate is wire bonding.

請求項1に係る発明により、該接続基板の誘電率は、該光導波路素子を構成する前記基板の誘電率より低く、該制御電極の入力端部又は出力端部における該信号電極の幅S1は、該光導波路素子側の該信号線路の幅S2以下であって、該入力端部又は該出力端部における該接地電極の間隔W1が、接続基板の該光導波路素子側の接地線路の間隔W2よりも大きく、該制御電極は、該入力端部又は該出力端部から離れた部分に、該接地電極の間隔が該間隔W2よりも小さい部分を有し、該光導波路素子と該接続基板とを繋ぐ接地用の配線を有するため、外部からの入力線と中継基板及び光導波路素子のインピーダンスを整合させることが可能となる。また、このようにインピーダンスを整合させた場合には通常は接続部による電気的不連続が発生するが、本発明によって電気強度の不連続を抑制し、電気特性の劣化を防止することができる。しかも、電極の寸法や間隔の異なる光導波路素子に対しても共通の接続基板で対応が可能となり、製造コストの低減が実現できる。   According to the invention of claim 1, the dielectric constant of the connection substrate is lower than the dielectric constant of the substrate constituting the optical waveguide element, and the width S1 of the signal electrode at the input end or output end of the control electrode is The width W2 of the signal line on the optical waveguide element side is equal to or smaller than the width S2, and the distance W1 between the ground electrodes at the input end or the output end is equal to the distance W2 between the ground lines on the optical waveguide element side of the connection substrate. The control electrode has a portion where the distance between the ground electrodes is smaller than the distance W2 at a portion away from the input end portion or the output end portion, and the optical waveguide element and the connection substrate Therefore, it is possible to match the input lines from the outside with the impedance of the relay substrate and the optical waveguide element. In addition, when impedance is matched in this way, an electrical discontinuity usually occurs due to the connecting portion. However, according to the present invention, the electrical strength discontinuity can be suppressed and deterioration of electrical characteristics can be prevented. In addition, it is possible to cope with optical waveguide elements having different electrode dimensions and intervals with a common connection substrate, thereby realizing a reduction in manufacturing cost.

請求項2に係る発明により、接地電極と該接地線路とは複数の接地用配線で接続されているため、接続基板と光導波路素子との間との電気的接続性が不連続になることを抑制し、電気特性が劣化することを防止することが可能になる。   According to the invention according to claim 2, since the ground electrode and the ground line are connected by a plurality of grounding wires, the electrical connectivity between the connection substrate and the optical waveguide element is discontinuous. It is possible to suppress and prevent deterioration of electrical characteristics.

請求項3に係る発明により、接地用の配線間隔Wが、該間隔W1よりも小さい配線を有するため、信号部分と接地部分における電界強度が、接続基板と光導波路素子との間で異なることが抑制され、両者の接続部分における電気的な不連続部分が減少し、高周波特性など電気特性が劣化することを防止することが可能となる。   According to the invention of claim 3, since the ground wiring interval W is smaller than the interval W1, the electric field strength in the signal portion and the ground portion is different between the connection substrate and the optical waveguide element. It is possible to suppress the electrical discontinuous portion at the connecting portion between the two and prevent the electrical characteristics such as the high frequency characteristics from deteriorating.

請求項4に係る発明により、接地用の配線の光導波路素子側の端部の接続位置は、間隔W2よりも小さい部分に接続されているため、接続基板側から光導波路素子側への電界強度の変化をより連続的に変化させることができ、電気特性の劣化を抑制することが可能となる。   According to the invention of claim 4, since the connection position of the end portion of the grounding wiring on the side of the optical waveguide element is connected to a portion smaller than the interval W2, the electric field strength from the connection substrate side to the optical waveguide element side Can be changed more continuously, and it is possible to suppress deterioration of electrical characteristics.

請求項5に係る発明により、光導波路素子と接続基板を繋ぐ接地用の配線を挟むように配置され、配線間隔が間隔W1よりも大きい他の配線を有するため、接地部分の電気的接続をより確実に行うことが可能となる。   According to the fifth aspect of the present invention, since the wiring for grounding that connects the optical waveguide element and the connection substrate is sandwiched between the wirings, and the wiring spacing is larger than the interval W1, the grounding portion is more electrically connected. It is possible to perform reliably.

請求項6に係る発明により、光導波路素子と接続基板とを繋ぐ配線は、ワイヤーボンディングであるため、接地用の配線間隔Wが、間隔W1よりも小さくなるように、容易に設定することが可能となる。   According to the invention of claim 6, since the wiring connecting the optical waveguide element and the connection substrate is wire bonding, the wiring interval W for grounding can be easily set so as to be smaller than the interval W1. It becomes.

従来の光導波路素子モジュールを説明する図である。It is a figure explaining the conventional optical waveguide element module. 中継基板に光導波路素子の基板より低誘電率の材料を用いた、本発明の電極構造等を説明する図である。It is a figure explaining the electrode structure of this invention etc. which used the material whose dielectric constant is lower than the board | substrate of an optical waveguide element for a relay board | substrate. 本発明の光導波路素子モジュールに利用される光導波路素子と接続基板との配線状況を説明する図である。It is a figure explaining the wiring condition of the optical waveguide element utilized for the optical waveguide element module of this invention, and a connection board | substrate. 図2及び図3に示す本発明の光導波路素子モジュールを用いた場合それぞれの光周波数応答の結果を示すグラフである。It is a graph which shows the result of each optical frequency response at the time of using the optical waveguide element module of this invention shown in FIG.2 and FIG.3. 本発明の光導波路素子モジュールにおける光導波路素子の接地電極の間隔が急に変化した場合の配線例を示す図である。It is a figure which shows the example of wiring when the space | interval of the ground electrode of the optical waveguide element in the optical waveguide element module of this invention changes suddenly. 本発明の光導波路素子モジュールにおける光導波路素子の信号電極の幅と、接続基板の信号線路の幅とが等しい場合の配線例を示す図である。It is a figure which shows the example of wiring when the width | variety of the signal electrode of the optical waveguide element in the optical waveguide element module of this invention and the width | variety of the signal line | wire of a connection board | substrate are equal.

以下、本発明の光導波路素子モジュールについて、好適例を用いて詳細に説明する。図2は本発明の電極構造等を説明する図であり、図2(a)の中継基板には光導波路素子を構成する基板より低誘電率な材料が用いられている。
そして本発明は、図2(b)(図2(a)の符号X部分の拡大図である。)に示すように、電気光学効果を有する基板と、該基板に形成された光導波路と、該光導波路を伝搬する光波を制御するための制御電極とを有する光導波路素子と、該光導波路素子の外部に設けられ、該制御電極と電気的に接続された配線を有する接続基板と、該光導波路素子と該接続基板とを筐体内に収容する光導波路素子モジュールにおいて、該制御電極は、信号電極と該信号電極を挟むように配置された接地電極とから構成され、該接続基板は、信号線路と該信号線路を挟むように配置された接地線路とが設けられ、該接続基板の誘電率は、該光導波路素子を構成する前記基板の誘電率より低く、該制御電極の入力端部又は出力端部における該信号電極の幅S1は、該光導波路素子側の該信号線路の幅S2以下であって、該入力端部又は該出力端部における該接地電極の間隔W1が、該接続基板の該光導波路素子側の該接地線路の間隔W2よりも大きく、該制御電極は、該入力端部又は該出力端部から離れた部分に、該接地電極の間隔が該間隔W2よりも小さい部分を有し、該光導波路素子と該接続基板とを繋ぐ接地用の配線2を有することを特徴とする。なお、符号1及び2は、光導波路素子と中継基板とを電気的に接続する配線である。
Hereinafter, the optical waveguide device module of the present invention will be described in detail using preferred examples. FIG. 2 is a diagram for explaining the electrode structure and the like of the present invention, and a material having a lower dielectric constant than the substrate constituting the optical waveguide element is used for the relay substrate of FIG.
And as shown in FIG.2 (b) (it is an enlarged view of the code | symbol X part of Fig.2 (a)), this invention is a board | substrate which has an electrooptic effect, The optical waveguide formed in this board | substrate, An optical waveguide element having a control electrode for controlling a light wave propagating through the optical waveguide; a connection substrate provided outside the optical waveguide element and having a wiring electrically connected to the control electrode; and In the optical waveguide device module that houses the optical waveguide device and the connection substrate in a housing, the control electrode is composed of a signal electrode and a ground electrode arranged so as to sandwich the signal electrode. A signal line and a ground line arranged so as to sandwich the signal line, and a dielectric constant of the connection substrate is lower than a dielectric constant of the substrate constituting the optical waveguide element, and an input end of the control electrode Alternatively, the width S1 of the signal electrode at the output end The width W2 of the signal line on the optical waveguide element side is equal to or smaller than the width S2 of the ground line on the optical waveguide element side of the connection substrate. The control electrode has a portion where the distance between the ground electrodes is smaller than the interval W2 at a portion away from the input end portion or the output end portion, and the control electrode is connected to the optical waveguide element and the connection. It has the wiring 2 for grounding which connects a board | substrate, It is characterized by the above-mentioned. Reference numerals 1 and 2 are wirings for electrically connecting the optical waveguide element and the relay substrate.

電気光学効果を有する基板としては、特に、LiNbO,LiTaO又はPLZT(ジルコン酸チタン酸鉛ランタン)のいずれかの単結晶が好適に利用可能である。特に、光変調器で多用されているLiNbO,LiTaOが、好ましい。また、基板に形成する光導波路は、例えば、LiNbO基板(LN基板)上にチタン(Ti)などの高屈折率物質を熱拡散することにより形成される。また、光導波路の側面に溝を形成したり、光導波路部分の厚みを他の基板部分より厚く形成して、リッジ型導波路とすることも可能である。 As a substrate having an electro-optic effect, any single crystal of LiNbO 3 , LiTaO 5 or PLZT (lead lanthanum zirconate titanate) can be suitably used. In particular, LiNbO 3 and LiTaO 5 frequently used in optical modulators are preferable. The optical waveguide formed on the substrate is formed, for example, by thermally diffusing a high refractive index material such as titanium (Ti) on a LiNbO 3 substrate (LN substrate). It is also possible to form a ridge-type waveguide by forming a groove on the side surface of the optical waveguide or by forming the optical waveguide portion thicker than other substrate portions.

制御電極は、信号電極や接地電極から構成され、基板表面に、Ti・Auの電極パターンを形成し、金メッキ方法などにより形成することが可能である。さらに、必要に応じて光導波路形成後の基板表面に誘電体SiO等のバッファ層を設けることも可能である。 The control electrode is composed of a signal electrode and a ground electrode, and can be formed by forming a Ti / Au electrode pattern on the surface of the substrate and using a gold plating method or the like. Furthermore, a buffer layer such as a dielectric SiO 2 can be provided on the substrate surface after the formation of the optical waveguide, if necessary.

本発明における「接続基板」とは、外部から電気信号が入力される入力端子と光導波路素子の信号入力部とを接続する中継基板や、光導波路素子の信号電極の出力端部に接続される、電気信号の反射を抑制するため、電気信号を抵抗器等で吸収する終端器、あるいは、光導波路素子の信号電極の出力端部と出力用端子とを接続する終端基板などを意味する。接続基板の基板材料は、光導波路素子の基板材料よりも誘電率が低い材料、例えば、アルミナや半導体材料が使用される。これは、光導波路素子の広帯域化に寄与するためである。   The “connection board” in the present invention is connected to a relay board for connecting an input terminal for inputting an electric signal from the outside and a signal input portion of the optical waveguide element, or to an output end portion of a signal electrode of the optical waveguide element. It means a terminator that absorbs an electric signal with a resistor or the like in order to suppress reflection of the electric signal, or a termination substrate that connects the output end of the signal electrode of the optical waveguide element and the output terminal. As the substrate material of the connection substrate, a material having a dielectric constant lower than that of the substrate material of the optical waveguide element, for example, alumina or a semiconductor material is used. This is to contribute to the broadening of the optical waveguide device.

光導波路素子と接続基板とを繋ぐ配線は、金線や幅広の金リボンが利用可能であり、特に、金線をワイヤーボンディングする方法が、両者の配線方法としては好ましい。また、配線は、1本に限らず、同じ場所の近傍を複数本の金線で接続することも、図3のように、接地電極と接地線路とを複数の接地用配線で接続することも可能である。   For the wiring connecting the optical waveguide element and the connection substrate, a gold wire or a wide gold ribbon can be used. In particular, the method of wire bonding the gold wire is preferable as the wiring method of both. Also, the number of wirings is not limited to one, and the vicinity of the same place can be connected by a plurality of gold wires, or the ground electrode and the ground line can be connected by a plurality of grounding wires as shown in FIG. Is possible.

図3に示すように、光導波路素子の接地電極の間隔W1と接続基板の接地線路の間隔W2とが異なり、特に、間隔W1が間隔W2より大きい場合には、接続基板と光導波路素子と電気的に接続する配線3の間隔Wを、間隔W1より小さくする。これにより、光導波路素子の信号電極と接地電極との間の電界強度と、接続基板の信号線路と接地線路との間の電界強度との差が小さくなり光周波数応答が改善する。   As shown in FIG. 3, the distance W1 between the ground electrodes of the optical waveguide element is different from the distance W2 between the ground lines of the connection substrate. In particular, when the distance W1 is larger than the distance W2, the connection substrate, the optical waveguide element, The interval W between the wirings 3 to be connected is made smaller than the interval W1. As a result, the difference between the electric field strength between the signal electrode and the ground electrode of the optical waveguide element and the electric field strength between the signal line and the ground line of the connection substrate is reduced, and the optical frequency response is improved.

また、接地用の配線3の光導波路素子側の端部の接続位置は、間隔W2よりも小さい部分に接続することも可能である。このような場合には、接続基板側から光導波路素子側への電界強度の変化をより連続的に変化させることができるため、電気特性の劣化をより一層抑制することが可能となる。   Further, the connection position of the end portion on the optical waveguide element side of the grounding wiring 3 can be connected to a portion smaller than the interval W2. In such a case, the change in the electric field strength from the connection substrate side to the optical waveguide element side can be changed more continuously, so that it is possible to further suppress the deterioration of the electrical characteristics.

図3に示すように、光導波路素子と接続基板を繋ぐ接地用の配線を挟むように配置され、配線間隔が間隔W1よりも大きい他の配線2を設けることも可能である。このような配線2は、図2に示す配線2と同様である。接地電極を配線2及び3で接続することにより、接地部分の電気的接続をより確実に行うことが可能となる。   As shown in FIG. 3, it is also possible to provide another wiring 2 that is arranged so as to sandwich a grounding wiring that connects the optical waveguide element and the connection substrate, and whose wiring interval is larger than the interval W1. Such a wiring 2 is the same as the wiring 2 shown in FIG. By connecting the ground electrode with the wirings 2 and 3, the ground portion can be more reliably electrically connected.

図3では、制御電極の入力端部又は出力端部における信号電極の幅と、光導波路素子側の信号線路の幅とが異なる大きさであるため、通常は、接続部による電気的不連続性が発生するが、本発明のように、光導波路素子と接続基板とを繋ぐ接地用の配線間隔Wを、間隔W1よりも小さく設定することで、電気強度の不連続性を抑制し、電気特性の劣化を防止することが可能となる。   In FIG. 3, since the width of the signal electrode at the input end or the output end of the control electrode is different from the width of the signal line on the optical waveguide element side, the electrical discontinuity due to the connecting portion is usually used. However, as in the present invention, by setting the grounding wiring interval W connecting the optical waveguide element and the connection substrate to be smaller than the interval W1, the electrical strength discontinuity is suppressed and the electrical characteristics are reduced. It is possible to prevent the deterioration of the material.

接続基板の信号線路の幅は0.1mm〜1mm、より望ましいのは0.2mm〜0.5mmの範囲である。また、接続基板の厚さは0.1mm〜1mm、より望ましいのは0.2mm〜0.5mmの範囲である。   The width of the signal line of the connection substrate is in the range of 0.1 mm to 1 mm, more preferably 0.2 mm to 0.5 mm. Further, the thickness of the connection substrate is 0.1 mm to 1 mm, and more preferably 0.2 mm to 0.5 mm.

光導波路素子を構成する信号電極の端部の幅は0.03mm〜0.5mm、より望ましいのは0.05mm〜0.25mmである。   The width of the end portion of the signal electrode constituting the optical waveguide element is 0.03 mm to 0.5 mm, more preferably 0.05 mm to 0.25 mm.

図5に示すように、接地電極の幅が急激に変化する場合などでも、本発明のように配線3を設けることで、電界強度の急激な変化を緩和させることが可能である。   As shown in FIG. 5, even when the width of the ground electrode changes abruptly, by providing the wiring 3 as in the present invention, it is possible to alleviate the abrupt change in electric field strength.

また、図6に示すように、接続基板の信号線路の幅と、光導波路素子の信号電極の幅とを同じ程度に構成し、複数の金線、あるいは幅広の金リボンが利用して接続することで、高周波特性が向上させることが可能である。このような場合には、インピーダンス整合の関係から、接地線路の間隔と接地電極の間隔とが異なる可能性が高くなるため、本発明のような配線の接続方法が、より効果的に適用することが可能となる。   Further, as shown in FIG. 6, the width of the signal line of the connection substrate and the width of the signal electrode of the optical waveguide element are configured to be approximately the same, and a plurality of gold wires or wide gold ribbons are used for connection. As a result, the high-frequency characteristics can be improved. In such a case, there is a high possibility that the distance between the ground lines is different from the distance between the ground electrodes due to impedance matching, and therefore the wiring connection method as in the present invention is more effectively applied. Is possible.

図2に示す本発明の第一の実施例の光導波路素子モジュール(本発明1)及び図3に示す本発明の第二の実施例の光導波路素子モジュール(本発明2)の光周波数応答結果を、図4に示す。図4のグラフにより、全体的な周波数帯域に渡って、本発明の光導波路素子モジュールの特性が向上していることが、容易に理解される。   Optical frequency response results of the optical waveguide device module (present invention 1) of the first embodiment of the present invention shown in FIG. 2 and the optical waveguide device module (present invention 2) of the second embodiment of the present invention shown in FIG. Is shown in FIG. It can be easily understood from the graph of FIG. 4 that the characteristics of the optical waveguide device module of the present invention are improved over the entire frequency band.

以上説明したように、本発明によれば、外部からの入力線と中継基板及び光導波路素子のインピーダンスを整合させ、さらに光導波路素子と接続基板との電気的接続の不連続性を減少させ、電気特性の劣化を防止した光導波路素子モジュールを提供することが可能となる。しかも、異なる種類の光導波路素子に対し共通の接続基板を利用することを可能とし、製造コストを低減した光導波路素子モジュールを提供することも可能となる。   As described above, according to the present invention, the impedance of the input line from the outside and the impedance of the relay substrate and the optical waveguide element are matched, and further, the discontinuity of the electrical connection between the optical waveguide element and the connection substrate is reduced, It becomes possible to provide an optical waveguide device module in which deterioration of electrical characteristics is prevented. In addition, a common connection substrate can be used for different types of optical waveguide elements, and an optical waveguide element module with reduced manufacturing costs can be provided.

Claims (6)

電気光学効果を有する基板と、該基板に形成された光導波路と、該光導波路を伝搬する光波を制御するための制御電極とを有する光導波路素子と、該光導波路素子の外部に設けられ、該制御電極と電気的に接続された配線を有する接続基板と、該光導波路素子と該接続基板とを筐体内に収容する光導波路素子モジュールにおいて、
該制御電極は、信号電極と該信号電極を挟むように配置された接地電極とから構成され、
該接続基板は、信号線路と該信号線路を挟むように配置された接地線路とが設けられ、
該接続基板の誘電率は、該光導波路素子を構成する前記基板の誘電率より低く、
該制御電極の入力端部又は出力端部における該信号電極の幅S1は、該光導波路素子側の該信号線路の幅S2以下であって、
該入力端部又は該出力端部における該接地電極の間隔W1が、該接続基板の該光導波路素子側の該接地線路の間隔W2よりも大きく、
該制御電極は、該入力端部又は該出力端部から離れた部分に、該接地電極の間隔が該間隔W2よりも小さい部分を有し、
該光導波路素子と該接続基板とを繋ぐ接地用の配線を有することを特徴とする光導波路素子モジュール。
A substrate having an electro-optic effect, an optical waveguide formed on the substrate, an optical waveguide element having a control electrode for controlling a light wave propagating through the optical waveguide, and provided outside the optical waveguide element, In a connection substrate having a wiring electrically connected to the control electrode, and an optical waveguide device module housing the optical waveguide device and the connection substrate in a housing,
The control electrode is composed of a signal electrode and a ground electrode arranged so as to sandwich the signal electrode,
The connection board is provided with a signal line and a ground line arranged so as to sandwich the signal line,
The dielectric constant of the connection substrate is lower than the dielectric constant of the substrate constituting the optical waveguide element,
The width S1 of the signal electrode at the input end or output end of the control electrode is equal to or smaller than the width S2 of the signal line on the optical waveguide element side,
The interval W1 between the ground electrodes at the input end or the output end is larger than the interval W2 between the ground lines on the optical waveguide element side of the connection substrate,
The control electrode has a portion where the distance between the ground electrodes is smaller than the distance W2 at a portion away from the input end or the output end.
An optical waveguide device module comprising a grounding wiring connecting the optical waveguide device and the connection substrate.
請求項1に記載の光導波路素子モジュールにおいて、該接地電極と該接地線路とは複数の接地用配線で接続されていることを特徴とする光導波路素子モジュール。   2. The optical waveguide element module according to claim 1, wherein the ground electrode and the ground line are connected by a plurality of ground wirings. 請求項1又は2に記載の光導波路素子モジュールにおいて、該接地用の配線間隔Wが、該間隔W1よりも小さい配線を有することを特徴とする光導波路素子モジュール。   3. The optical waveguide element module according to claim 1, wherein the ground wiring interval W is smaller than the interval W <b> 1. 4. 請求項1乃至3のいずれかに記載の光導波路素子モジュールにおいて、該接地用の配線の該光導波路素子側の端部の接続位置が、該間隔W2よりも小さい部分に接続されている配線を有することを特徴とする光導波路素子モジュール。   4. The optical waveguide element module according to claim 1, wherein a connection position of an end portion of the grounding wiring on the optical waveguide element side is connected to a portion smaller than the interval W <b> 2. An optical waveguide device module comprising: 請求項1乃至4のいずれかに記載の光導波路素子モジュールにおいて、該光導波路素子と該接続基板を繋ぐ前記接地用の配線を挟むように配置され、配線間隔が該間隔W1よりも大きい他の配線を有することを特徴とする光導波路素子モジュール。   5. The optical waveguide element module according to claim 1, wherein the grounding wiring that connects the optical waveguide element and the connection substrate is sandwiched therebetween, and the wiring interval is larger than the interval W <b> 1. An optical waveguide device module comprising wiring. 請求項1乃至5のいずれかに記載の光導波路素子モジュールにおいて、該光導波路素子と該接続基板とを繋ぐ配線は、ワイヤーボンディングであることを特徴とする光導波路素子モジュール。   6. The optical waveguide element module according to claim 1, wherein the wiring connecting the optical waveguide element and the connection substrate is wire bonding.
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