JP5486537B2 - Polyamine compound, process for producing the polyamine compound, and epoxy curing agent - Google Patents
Polyamine compound, process for producing the polyamine compound, and epoxy curing agent Download PDFInfo
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- JP5486537B2 JP5486537B2 JP2011074663A JP2011074663A JP5486537B2 JP 5486537 B2 JP5486537 B2 JP 5486537B2 JP 2011074663 A JP2011074663 A JP 2011074663A JP 2011074663 A JP2011074663 A JP 2011074663A JP 5486537 B2 JP5486537 B2 JP 5486537B2
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- 150000001875 compounds Chemical class 0.000 title claims description 55
- 229920000768 polyamine Polymers 0.000 title claims description 50
- 239000004593 Epoxy Substances 0.000 title claims description 38
- 239000003795 chemical substances by application Substances 0.000 title claims description 28
- 238000000034 method Methods 0.000 title claims description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 9
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 claims description 9
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 description 25
- 239000002904 solvent Substances 0.000 description 15
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 9
- 229940125904 compound 1 Drugs 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 239000000523 sample Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 7
- -1 norbornenediamine Chemical compound 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- MFRIHAYPQRLWNB-UHFFFAOYSA-N sodium tert-butoxide Chemical compound [Na+].CC(C)(C)[O-] MFRIHAYPQRLWNB-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 239000007868 Raney catalyst Substances 0.000 description 4
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 239000012488 sample solution Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 238000001460 carbon-13 nuclear magnetic resonance spectrum Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- 229940117900 2,2-bis(4-glycidyloxyphenyl)propane Drugs 0.000 description 2
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- 238000006845 Michael addition reaction Methods 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 2
- 229910000564 Raney nickel Inorganic materials 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000006184 cosolvent Substances 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 239000000706 filtrate Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000009904 heterogeneous catalytic hydrogenation reaction Methods 0.000 description 2
- 238000005984 hydrogenation reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- LPNYRYFBWFDTMA-UHFFFAOYSA-N potassium tert-butoxide Chemical compound [K+].CC(C)(C)[O-] LPNYRYFBWFDTMA-UHFFFAOYSA-N 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 238000012552 review Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 2
- 235000017557 sodium bicarbonate Nutrition 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 1
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 150000001559 benzoic acids Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229940125782 compound 2 Drugs 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- SSJXIUAHEKJCMH-UHFFFAOYSA-N cyclohexane-1,2-diamine Chemical compound NC1CCCCC1N SSJXIUAHEKJCMH-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052987 metal hydride Inorganic materials 0.000 description 1
- 150000004681 metal hydrides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- 125000002560 nitrile group Chemical group 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- WBHQBSYUUJJSRZ-UHFFFAOYSA-M sodium bisulfate Chemical compound [Na+].OS([O-])(=O)=O WBHQBSYUUJJSRZ-UHFFFAOYSA-M 0.000 description 1
- 229910000342 sodium bisulfate Inorganic materials 0.000 description 1
- 239000012312 sodium hydride Substances 0.000 description 1
- 229910000104 sodium hydride Inorganic materials 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 150000003509 tertiary alcohols Chemical class 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
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- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Epoxy Resins (AREA)
Description
本発明は、新規なポリアミン化合物、該ポリアミン化合物の製造方法およびエポキシ硬化剤に関する。 The present invention relates to a novel polyamine compound, a method for producing the polyamine compound, and an epoxy curing agent.
エポキシ樹脂は、エポキシ化合物と硬化剤との反応によって生成する熱硬化性樹脂であり、その優れた特性と多様性から、土木建築用接着剤、半導体用封止剤、プリント回路基板や高圧電力用モールド機器用等の絶縁材、缶用や自動車用等の塗料など、様々な分野で利用されている。
エポキシ樹脂に用いられる硬化剤は、用途に応じて多種多様であるが、重付加型の硬化剤としては、脂肪族ポリアミン、脂環式ポリアミン、芳香族ポリアミン等のポリアミン化合物が代表的である(非特許文献1参照)。
Epoxy resin is a thermosetting resin produced by the reaction between an epoxy compound and a curing agent. Due to its excellent characteristics and versatility, adhesives for civil engineering and construction, sealing agents for semiconductors, printed circuit boards and high-voltage power It is used in various fields such as insulating materials for molding equipment and paints for cans and automobiles.
Curing agents used for epoxy resins vary widely depending on the application, but polyaddition type curing agents are typically polyamine compounds such as aliphatic polyamines, alicyclic polyamines, and aromatic polyamines ( Non-patent document 1).
特に脂肪族ポリアミンは、硬化性が高く常温硬化型の硬化剤として用いられる。その硬化物は機械物性に優れ、接着性や耐薬品性にも優れる。このような脂肪族ポリアミンとしては、ジエチレントリアミン、トリエチレンテトラミン、トリメチルヘキサメチレンジアミン、2−メチルペンタメチレンジアミンなどが挙げられる。
一方、新規な化合物による新たなエポキシ硬化剤の開発が望まれている。
In particular, aliphatic polyamines have high curability and are used as room temperature curing type curing agents. The cured product is excellent in mechanical properties and excellent in adhesion and chemical resistance. Examples of such aliphatic polyamines include diethylenetriamine, triethylenetetramine, trimethylhexamethylenediamine, and 2-methylpentamethylenediamine.
On the other hand, development of a new epoxy curing agent using a new compound is desired.
本発明は、新規なポリアミン化合物、該ポリアミン化合物の製造方法、および土木建築用接着剤、半導体用封止剤、プリント回路基板や高圧電力用モールド機器用等の絶縁材、缶用や自動車用等の塗料などに有用な優れた硬化性能を有するエポキシ硬化剤を提供することを課題とする。 The present invention relates to a novel polyamine compound, a method for producing the polyamine compound, and an adhesive for civil engineering and construction, a sealing agent for semiconductor, an insulating material for a printed circuit board, a molded device for high voltage power, a can, an automobile, etc. It is an object of the present invention to provide an epoxy curing agent having excellent curing performance that is useful for various coating materials.
本発明者らは鋭意検討の結果、下記手段で、上記課題を達成した。 As a result of intensive studies, the present inventors have achieved the above-mentioned problem by the following means.
(1)下記一般式(1)で表されるポリアミン化合物。 (1) A polyamine compound represented by the following general formula (1).
一般式(1)において、Rは水素原子またはメチル基を表す。
(2)下記一般式(1)で表されるエポキシ硬化剤。
In general formula (1), R represents a hydrogen atom or a methyl group.
(2) An epoxy curing agent represented by the following general formula (1).
一般式(1)において、Rは水素原子またはメチル基を表す。 In general formula (1), R represents a hydrogen atom or a methyl group.
(3)トリス(ヒドロキシメチル)アミノメタンをアクリロニトリルまたはメタアクリロニトリルと反応させて下記一般式(2)で表される化合物を得る工程および該一般式(2)で表される化合物を還元する工程からなる下記一般式(1)で表されるポリアミン化合物の製造方法。 (3) From the step of reacting tris (hydroxymethyl) aminomethane with acrylonitrile or methacrylonitrile to obtain a compound represented by the following general formula (2) and the step of reducing the compound represented by the general formula (2) The manufacturing method of the polyamine compound represented by following General formula (1).
一般式(1)、(2)において、Rは水素原子またはメチル基を表す。 In the general formulas (1) and (2), R represents a hydrogen atom or a methyl group.
本発明により、新規なポリアミン化合物、該ポリアミン化合物の製造方法、および土木建築用接着剤、半導体用封止剤、プリント回路基板や高圧電力用モールド機器用等の絶縁材、缶用や自動車用等の塗料などに有用な優れた硬化性能を有するエポキシ硬化剤を提供することができる。 According to the present invention, a novel polyamine compound, a method for producing the polyamine compound, and an adhesive for civil engineering and construction, a sealing agent for semiconductor, an insulating material for a printed circuit board, a molded device for high voltage power, a can, an automobile, etc. It is possible to provide an epoxy curing agent having excellent curing performance that is useful for various coating materials.
本発明者らは、新規なポリアミン化合物を見出し、しかも該ポリアミン化合物が、エポキシ樹脂の硬化剤として優れた効果を示すことを見出した。 The present inventors have found a novel polyamine compound and have found that the polyamine compound exhibits an excellent effect as a curing agent for an epoxy resin.
(新規なポリアミン化合物)
本発明の一般式(1)で表される化合物を説明する。
(New polyamine compound)
The compound represented by the general formula (1) of the present invention will be described.
一般式(1)において、Rは水素原子またはメチル基を表す。ここで、Rは水素原子が好ましい。 In general formula (1), R represents a hydrogen atom or a methyl group. Here, R is preferably a hydrogen atom.
(ポリアミン化合物の製造方法)
本発明の一般式(1)で表されるポリアミン化合物の製造方法を説明する。
本発明の一般式(1)で表されるポリアミン化合物の製造方法は、トリス(ヒドロキシメチル)アミノメタンをアクリロニトリルまたはメタクリロニトリルと反応させて下記一般式(2)で表される化合物を得る工程(第一工程)および該一般式(2)で表される化合物を還元する工程(第二工程)からなる。
(Method for producing polyamine compound)
The manufacturing method of the polyamine compound represented by General formula (1) of this invention is demonstrated.
The process for producing a polyamine compound represented by the general formula (1) of the present invention is a step of reacting tris (hydroxymethyl) aminomethane with acrylonitrile or methacrylonitrile to obtain a compound represented by the following general formula (2). (First step) and a step of reducing the compound represented by the general formula (2) (second step).
一般式(1)、(2)において、Rは水素原子またはメチル基を表す。 In the general formulas (1) and (2), R represents a hydrogen atom or a methyl group.
第一工程では、塩基の存在下にトリス(ヒドロキシメチル)アミノメタンの水酸基をアクリロニトリルまたはメタアクリロニトリルに対してマイケル付加反応させて中間体の一般式(2)で表される化合物を得る。マイケル付加反応は、均一系反応または二層系反応で行うことができるが、副生成物の抑制の観点から均一系反応が好ましい。
均一系反応では、アクリロニトリルを大過剰に用いて無溶媒で反応を行う方法、または溶媒を用いて反応を行う方法のいずれでも良いが、反応温度を制御するために溶媒を用いた方法が好ましい。
In the first step, the hydroxyl group of tris (hydroxymethyl) aminomethane is subjected to a Michael addition reaction with acrylonitrile or methacrylonitrile in the presence of a base to obtain a compound represented by the general formula (2) as an intermediate. The Michael addition reaction can be carried out by a homogeneous reaction or a two-layer reaction, but a homogeneous reaction is preferred from the viewpoint of suppressing by-products.
In the homogeneous reaction, either a method in which acrylonitrile is used in a large excess and a reaction is carried out without a solvent or a method in which a reaction is carried out using a solvent may be used.
好ましい溶媒としては、トルエンなどの芳香族系溶媒、アセトニトリルなどのニトリル系溶媒、テトラヒドロフランなどのエーテル溶媒、N,N−ジメチルアセトアミドなどのアミド系溶媒、ジメチルスルホキシドなどのスルホキシド系溶媒が挙げられる。これらのなかでも、原料であるトリス(ヒドロキシメチル)アミノメタンの溶解性および反応後の溶媒溜去の観点から、ニトリル系溶媒またはエーテル系溶媒がより好ましく、アセトニトリルまたはテトラヒドロフランが更に好ましく、アセトニトリルが特に好ましい。
塩基は、共役酸のpKaが13以上である強塩基を用いることができる。このような強塩基としては、水酸化ナトリウム、水酸化カリウムなどの水酸化物、ナトリウムメトキシド、ナトリウムt−ブトキシド、カリウムt−ブトキシドなどの金属アルコキシド、水素化ナトリウムなどの金属水素化物、グアニジン、DBUなどの有機強塩基などが挙げられる。これらのなかでも、副生成物を抑制するという観点から、ナトリウムt−ブトキシドまたはカリウムt−ブトキシドなどの第3級アルコールの共役塩基であることが好ましい。塩基の添加量としては、トリス(ヒドロキシメチル)アミノメタン1モルに対して、0.00001〜0.1モルの範囲が好ましく、0.0001〜0.01モルが更に好ましく、0.0005〜0.002モルが特に好ましい。
Preferable solvents include aromatic solvents such as toluene, nitrile solvents such as acetonitrile, ether solvents such as tetrahydrofuran, amide solvents such as N, N-dimethylacetamide, and sulfoxide solvents such as dimethyl sulfoxide. Among these, from the viewpoint of solubility of tris (hydroxymethyl) aminomethane as a raw material and solvent distillation after the reaction, a nitrile solvent or an ether solvent is more preferable, acetonitrile or tetrahydrofuran is more preferable, and acetonitrile is particularly preferable. preferable.
As the base, a strong base having a pKa of a conjugate acid of 13 or more can be used. Examples of such strong bases include hydroxides such as sodium hydroxide and potassium hydroxide, metal alkoxides such as sodium methoxide, sodium t-butoxide, and potassium t-butoxide, metal hydrides such as sodium hydride, guanidine, Examples include organic strong bases such as DBU. Among these, from the viewpoint of suppressing by-products, a conjugated base of a tertiary alcohol such as sodium t-butoxide or potassium t-butoxide is preferable. The amount of base added is preferably in the range of 0.00001 to 0.1 mol, more preferably 0.0001 to 0.01 mol, and more preferably 0.0005 to 0, per 1 mol of tris (hydroxymethyl) aminomethane. 0.002 mol is particularly preferred.
アクリロニトリルまたはメタアクリロニトリルの添加量は、無溶媒で反応を行う場合では、トリス(ヒドロキシメチル)アミノメタン1モルに対して、3〜30モルの範囲が好ましく、4〜10モルが更に好ましく、5〜8モルが特に好ましい。溶媒を用いて反応を行う場合には、トリス(ヒドロキシメチル)アミノメタン1モルに対して、3〜10モルの範囲が好ましく、3.3〜7モルが更に好ましく、3.6〜6モルが特に好ましい。
反応温度は、反応時間の短縮と副反応の抑制の観点から、−20℃〜90℃の範囲が好ましく、0℃〜80℃が更に好ましく、20℃〜70℃が特に好ましい。
反応雰囲気は、大気でも不活性ガスでもよいが、大気中の二酸化炭素によって塩基が失活することを避けるために、不活性ガスであることが好ましい。不活性ガスとしては、窒素、アルゴンなどが挙げられる。
The amount of acrylonitrile or methacrylonitrile added is preferably in the range of 3 to 30 mol, more preferably 4 to 10 mol, with respect to 1 mol of tris (hydroxymethyl) aminomethane, when the reaction is carried out without solvent. 8 moles are particularly preferred. When performing reaction using a solvent, the range of 3-10 mol is preferable with respect to 1 mol of tris (hydroxymethyl) aminomethane, 3.3-7 mol is still more preferable, 3.6-6 mol is Particularly preferred.
The reaction temperature is preferably in the range of −20 ° C. to 90 ° C., more preferably 0 ° C. to 80 ° C., and particularly preferably 20 ° C. to 70 ° C. from the viewpoint of shortening the reaction time and suppressing side reactions.
The reaction atmosphere may be air or an inert gas, but is preferably an inert gas in order to avoid deactivation of the base by carbon dioxide in the air. Examples of the inert gas include nitrogen and argon.
反応終了後は、pKaが12以下の化合物を加えて反応を停止させることが好ましい。pKaが12以下の化合物であれば特に制限はないが、炭酸水素ナトリウムや、硫酸水素ナトリウムなどの無機化合物は後処理が簡便であるために好ましい。反応の停止は、30℃以下冷却した後に行うことが好ましく、20℃以下で行うことが更に好ましく、10℃以下で行うことが特に好ましい。 After completion of the reaction, it is preferable to stop the reaction by adding a compound having a pKa of 12 or less. There is no particular limitation as long as the compound has a pKa of 12 or less, but inorganic compounds such as sodium hydrogen carbonate and sodium hydrogen sulfate are preferred because the post-treatment is simple. The reaction is preferably stopped after cooling at 30 ° C. or less, more preferably at 20 ° C. or less, and particularly preferably at 10 ° C. or less.
第二工程では、前記一般式(2)で表される中間体のニトリル基をアミノ基に還元する。この還元反応はどのような還元反応でも構わないが、本発明においては水素添加反応が好ましい。
水素添加反応は、公知の方法であれば特に制限はないが、例えば、不均一系接触水素化反応で行うことができる。
不均一系接触水素化反応で用いる触媒としては、ラネーニッケル、ラネーコバルトなどのラネー触媒や、パラジウム、白金、ロジウム、ルテニウムなどの触媒金属を炭素等の担体に担持した担持触媒が挙げられる。なかでも、反応選択性の観点から、ラネー触媒が好ましい。
溶媒は、水およびアルコール系溶媒であることが好ましく、水とアルコールとの共溶媒であることが更に好ましく、水とメタノールとの共溶媒であることが特に好ましい。
反応溶液には、副反応を抑制するために、アンモニアを共存させることが好ましい。アンモニアの添加方法は、アンモニア水を溶媒として加える方法であっても、アンモニアガスを導入する方法であってもよい。アンモニアの添加量は、反応溶液に対して、1モル/kg以上であることが好ましく、3モル/kg以上が更に好ましく、5モル/kg以上が特に好ましい。
水素圧は、特に制限はなく、0.1〜10MPaで行うことができる。
反応温度は、反応時間の短縮と副生成物の抑制の観点から、0〜100℃の範囲が好ましく、10〜50℃が更に好ましく、20〜35℃が特に好ましい。
In the second step, the nitrile group of the intermediate represented by the general formula (2) is reduced to an amino group. This reduction reaction may be any reduction reaction, but a hydrogenation reaction is preferred in the present invention.
The hydrogenation reaction is not particularly limited as long as it is a known method, but can be performed, for example, by a heterogeneous catalytic hydrogenation reaction.
Examples of the catalyst used in the heterogeneous catalytic hydrogenation reaction include Raney catalysts such as Raney nickel and Raney cobalt, and supported catalysts in which a catalytic metal such as palladium, platinum, rhodium, and ruthenium is supported on a carrier such as carbon. Of these, Raney catalysts are preferred from the viewpoint of reaction selectivity.
The solvent is preferably water and an alcohol solvent, more preferably a cosolvent of water and alcohol, and particularly preferably a cosolvent of water and methanol.
In order to suppress a side reaction, it is preferable to make ammonia coexist in the reaction solution. The method of adding ammonia may be a method of adding aqueous ammonia as a solvent or a method of introducing ammonia gas. The amount of ammonia added is preferably 1 mol / kg or more, more preferably 3 mol / kg or more, and particularly preferably 5 mol / kg or more with respect to the reaction solution.
The hydrogen pressure is not particularly limited and can be 0.1 to 10 MPa.
The reaction temperature is preferably in the range of 0 to 100 ° C, more preferably 10 to 50 ° C, and particularly preferably 20 to 35 ° C from the viewpoint of shortening the reaction time and suppressing by-products.
(エポキシ硬化剤)
本発明の一般式(1)で表されるポリアミン化合物は、分子内にアミノ基、特に反応性の高い第一級のアミノ基(−NH2)を4つ有する。しかも分子構造において立体的にこれらのアミノ基が特定の距離で分布するため、エポキシ硬化剤としての性能に優れる。
本発明の一般式(1)で表されるエポキシ硬化剤は、エポキシ化合物と混合することで重付加型の反応によって硬化して、いわゆるエポキシ樹脂を生成する。この硬化に際して、本発明の一般式(1)で表されるポリアミン化合物を単独で含有しても、本発明の一般式(1)で表されるポリアミン化合物と少なくとも1種の公知の硬化剤または硬化促進剤を併用してもよく、本発明のエポキシ硬化剤中にこれらの公知の硬化剤または硬化促進剤を含有させてもよい。
(Epoxy curing agent)
The polyamine compound represented by the general formula (1) of the present invention has four amino groups, particularly, a highly reactive primary amino group (—NH 2 ) in the molecule. Moreover, since these amino groups are sterically distributed at a specific distance in the molecular structure, the performance as an epoxy curing agent is excellent.
The epoxy curing agent represented by the general formula (1) of the present invention is cured by a polyaddition reaction by mixing with an epoxy compound to produce a so-called epoxy resin. In this curing, even if the polyamine compound represented by the general formula (1) of the present invention is contained alone, the polyamine compound represented by the general formula (1) of the present invention and at least one known curing agent or A curing accelerator may be used in combination, and these known curing agents or curing accelerators may be contained in the epoxy curing agent of the present invention.
併用してもよい公知の硬化剤としては、脂肪族ポリアミン、脂環式ポリアミン、芳香族ポリアミン、特殊ポリアミンを用いることができる。脂肪族ポリアミンとしては、ジエチレントリアミン、トリエチレンテトラミン、テトラエチレンペンタミン、m−キシレンジアミン、トリメチルヘキサメチレンジアミン、2−メチルペンタメチレンジアミン、ジエチルアミノプロピルアミンなどが挙げられる。脂環式ポリアミンとしては、イソフォロンジアミン、1,3−ビスアミノメチルシクロヘキサン、ビス(4−アミノシクロヘキシル)メタン、ノルボルネンジアミン、1,2−ジアミノシクロヘキサン、ビス(4−アミノ−3−メチルシクロヘキシル)メタンなどが挙げられる。芳香族ポリアミンとしては、ジアミノジフェニルメタン、m−フェニレンジアミン、ジアミノジフェニルスルホンなどが挙げられる。特殊ポリアミンとしては、ポリオキシプロピレンジアミン、ポリオキシプロピレントリアミン、ポリシクロヘキシルポリアミン混合物、3,9−ビス(3−アミノプロピル)−2,4,5,10−テトラスピロ[5.5]ウンデカン、N−アミノエチルピペラジン等が挙げられる。 As known curing agents that may be used in combination, aliphatic polyamines, alicyclic polyamines, aromatic polyamines, and special polyamines can be used. Examples of the aliphatic polyamine include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, m-xylenediamine, trimethylhexamethylenediamine, 2-methylpentamethylenediamine, and diethylaminopropylamine. Alicyclic polyamines include isophorone diamine, 1,3-bisaminomethylcyclohexane, bis (4-aminocyclohexyl) methane, norbornenediamine, 1,2-diaminocyclohexane, bis (4-amino-3-methylcyclohexyl). Examples include methane. Examples of the aromatic polyamine include diaminodiphenylmethane, m-phenylenediamine, and diaminodiphenylsulfone. Special polyamines include polyoxypropylene diamine, polyoxypropylene triamine, polycyclohexyl polyamine mixture, 3,9-bis (3-aminopropyl) -2,4,5,10-tetraspiro [5.5] undecane, N- Aminoethylpiperazine etc. are mentioned.
併用してもよい公知の硬化促進剤としては、脂肪酸類、安息香酸類、アルコール類、フェノール類、メルカプト類等を用いることができ、具体的には、エポキシ樹脂技術協会編,総説 エポキシ樹脂 第1巻 基礎編I,エポキシ樹脂技術協会(2003年)の第3章2項の表5に記載の化合物が挙げられる。
本発明の一般式(1)で表されるエポキシ硬化剤とこれらの公知の硬化剤や硬化促進剤を併用する場合、使用する目的や使用するエポキシ化合物によっても異なるが、公知の硬化剤や硬化促進剤は、本発明の一般式(1)で表されるエポキシ硬化剤100質量に対し、50質量未満が好ましく、25質量未満がより好ましく、本発明一般式(1)で表されるエポキシ硬化剤を単独で使用するのがさらに好ましい。
As known curing accelerators that may be used in combination, fatty acids, benzoic acids, alcohols, phenols, mercaptos, and the like can be used. Specifically, Epoxy Resin Technical Association,
When the epoxy curing agent represented by the general formula (1) of the present invention and these known curing agents and accelerators are used in combination, the known curing agent and curing are different depending on the purpose of use and the epoxy compound used. The accelerator is preferably less than 50 mass, more preferably less than 25 mass relative to 100 mass of the epoxy curing agent represented by the general formula (1) of the present invention, and epoxy curing represented by the general formula (1) of the present invention. More preferably, the agent is used alone.
前記エポキシ化合物としては、グリシジルエーテル型、グリシジルエステル型、グリシジルアミン型、酸化型などの公知のエポキシ化合物を用いることができる。
グリシジルエーテル型としては、Bis−A型エポキシ化合物、Bis−F型エポキシ化合物、High−Br型エポキシ化合物、ノボラック型エポキシ化合物、アルコール型エポキシ化合物が挙げられる。グリシジルエステル型としては、ヒドロフタル酸型エポキシ化合物、ダイマー酸型エポキシ化合物が挙げられる。グリシジルアミン型としては、芳香族アミン型エポキシ化合物、アミノフェノール型エポキシ化合物が挙げられる。酸化型としては、脂環型エポキシ化合物が挙げられる。
本発明の一般式(1)で表されるポリアミン化合物とエポキシ化合物との配合量比は、A=(ポリアミン配合量/活性水素当量)/(エポキシ配合量/エポキシ当量)とすると、0.1<A<10の範囲が好ましく、0.5<A<2が更に好ましく、0.8<A<1.2が特に好ましい。
ここで、活性水素当量とは、ポリアミン化合物の分子量をアミノ基の水素原子数で除した値である。また、エポキシ当量とは、エポキシ化合物の分子量をエポキシ基の数で除した値である。
本発明のエポキシ硬化剤は、土木建築用接着剤、半導体用封止剤、プリント回路基板や高圧電力用モールド機器用等の絶縁材、缶用や自動車用等の塗料などに好ましく使用できる。
As the epoxy compound, known epoxy compounds such as glycidyl ether type, glycidyl ester type, glycidyl amine type, and oxidized type can be used.
Examples of the glycidyl ether type include a Bis-A type epoxy compound, a Bis-F type epoxy compound, a High-Br type epoxy compound, a novolac type epoxy compound, and an alcohol type epoxy compound. Examples of the glycidyl ester type include hydrophthalic acid type epoxy compounds and dimer acid type epoxy compounds. Examples of the glycidylamine type include aromatic amine type epoxy compounds and aminophenol type epoxy compounds. An alicyclic epoxy compound is mentioned as an oxidation type.
The blending ratio of the polyamine compound represented by the general formula (1) of the present invention and the epoxy compound is 0.1, assuming that A = (polyamine blending amount / active hydrogen equivalent) / (epoxy blending amount / epoxy equivalent). The range of <A <10 is preferable, 0.5 <A <2 is more preferable, and 0.8 <A <1.2 is particularly preferable.
Here, the active hydrogen equivalent is a value obtained by dividing the molecular weight of the polyamine compound by the number of hydrogen atoms of the amino group. The epoxy equivalent is a value obtained by dividing the molecular weight of the epoxy compound by the number of epoxy groups.
The epoxy curing agent of the present invention can be preferably used for civil engineering and building adhesives, semiconductor encapsulants, insulating materials for printed circuit boards and high-voltage power molding equipment, paints for cans and automobiles, and the like.
以下、本発明を実施例に基づきさらに詳細に説明するが、本発明はこれによって限定されるものではない。 EXAMPLES Hereinafter, although this invention is demonstrated in detail based on an Example, this invention is not limited by this.
実施例1
−本発明のポリアミン化合物の合成−
下記スキームにしたがって、本発明の下記ポリアミン化合物1(Rが水素原子)を合成した。
Example 1
-Synthesis of polyamine compound of the present invention-
According to the following scheme, the following polyamine compound 1 (R is a hydrogen atom) of the present invention was synthesized.
3L容の三口フラスコにトリス(ヒドロキシメチル)アミノメタン145.3g(1.2モル)、ナトリウムt−ブトキシド115mg(1.2ミリモル)、アセトニトリル1.2Lを加えて攪拌、窒素をフローしながら55℃に加熱した。次に、アクリロニトリル286.7g(5.4モル)を30分かけて滴下した後、反応溶液が均一になるまで55℃で1時間攪拌をした。その後、20℃に冷却して1時間攪拌、さらに0℃で4時間攪拌した。0℃で攪拌しながら、炭酸水素ナトリウム6.0gを添加して反応を停止させた後、濾過して無機塩を除いた。濾液を減圧濃縮することで中間体343.3gを得た。
1L容のオートクレーブに、先に得た中間体24.0g、Ni触媒48.0g(ラネーニッケル2400、W.R.Grace&Co.社製)、メタノール300ml、および25%アンモニア水300mlを入れて密閉した。オートクレーブ内を窒素で2回置換した後、10Mpaの水素を導入して、25℃で16時間反応させた。反応終了後、オートクレーブ内を窒素で置換した後、反応液を取り出した。反応液中のNi触媒をセライト濾過で濾別した後、濾液を減圧濃縮することで本発明のポリアミン化合物23.8gを得た。
To a 3 L three-necked flask, 145.3 g (1.2 mol) of tris (hydroxymethyl) aminomethane, 115 mg (1.2 mmol) of sodium t-butoxide and 1.2 L of acetonitrile were added and stirred. Heated to ° C. Next, 286.7 g (5.4 mol) of acrylonitrile was added dropwise over 30 minutes, and then stirred at 55 ° C. for 1 hour until the reaction solution became uniform. Then, it cooled to 20 degreeC and stirred for 1 hour, and also stirred at 0 degreeC for 4 hours. While stirring at 0 ° C., 6.0 g of sodium bicarbonate was added to stop the reaction, followed by filtration to remove inorganic salts. The filtrate was concentrated under reduced pressure, yielding 343.3 g of intermediate.
A 1 L autoclave was sealed with 24.0 g of the intermediate obtained above, 48.0 g of Ni catalyst (Raney nickel 2400, manufactured by WR Grace & Co.), 300 ml of methanol, and 300 ml of 25% aqueous ammonia. After the inside of the autoclave was replaced twice with nitrogen, 10 Mpa of hydrogen was introduced and reacted at 25 ° C. for 16 hours. After completion of the reaction, the inside of the autoclave was replaced with nitrogen, and then the reaction solution was taken out. The Ni catalyst in the reaction solution was filtered off through Celite filtration, and then the filtrate was concentrated under reduced pressure to obtain 23.8 g of the polyamine compound of the present invention.
得られたポリアミン化合物1は、1H−NMRスペクトル、13C−NMRスペクトル、赤外吸収スペクトルにより同定した。同定データのチャートを図1〜3に示す。
ここで、1H−NMRスペクトルと13C−NMRスペクトルはともに、内部標準がTMSで測定溶媒が重クロロホルムである。
The resulting
Here, both 1 H-NMR spectrum and 13 C-NMR spectrum have TMS as the internal standard and deuterated chloroform as the measurement solvent.
実施例2
−エポキシ硬化性の評価−
本発明のポリアミン化合物1を0.37gおよび2,2−ビス(4−グリシジルオキシフェニル)プロパン(東京化成)1.70gとを攪拌して十分に混合し、サンプル液Aを調製した。サンプル液Aを25℃で3日間静置した後、サンプル液Aが硬化していることを、目視および触感によって確認した。
Example 2
-Evaluation of epoxy curability-
A sample solution A was prepared by mixing 0.37 g of the
実施例3
−エポキシ硬化性の評価−
本発明のポリアミン化合物1を0.37g、1,4−ブタンジグリシジルエーテル(和光純薬)1.01gとを攪拌して十分に混合し、サンプル液Bを調製した。サンプル液Bを25℃で3日間静置した後、サンプル液Bが硬化していることを、目視および触感によって確認した。
Example 3
-Evaluation of epoxy curability-
Sample solution B was prepared by stirring 0.37 g of
実施例4
−エポキシ硬化性の評価−
本発明のポリアミン化合物1を0.37g、1,2−シクロヘキサンジカルボン酸ジグリシジル(東京化成)1.42gとを攪拌して十分に混合し、サンプル液Cを調製した。サンプル液Cを25℃で3日間静置した後、サンプル液Cが硬化していることを、目視および触感によって確認した。
Example 4
-Evaluation of epoxy curability-
A sample solution C was prepared by stirring 0.37 g of the
実施例5
本発明のポリアミン化合物2(Rがメチル基)を0.426gおよび2,2−ビス(4−グリシジルオキシフェニル)プロパン(東京化成)1.70gとを攪拌して十分に混合し、サンプル液Dを調製した。サンプル液Dを25℃で3日間静置した後、サンプル液Dが硬化していることを、目視および触感によって確認した。
Example 5
0.426 g of the
Claims (3)
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JP2011074663A JP5486537B2 (en) | 2011-03-30 | 2011-03-30 | Polyamine compound, process for producing the polyamine compound, and epoxy curing agent |
PCT/JP2012/057506 WO2012133182A1 (en) | 2011-03-30 | 2012-03-23 | Polyether compound, curing agent using polyether compound, and method for producing polyether compound |
RU2013148099/04A RU2538209C1 (en) | 2011-03-30 | 2012-03-23 | Polyether compound, curing agent using polyether compound, and method of producing polyether compound |
BR112013024223-0A BR112013024223B1 (en) | 2011-03-30 | 2012-03-23 | Polyester Compound, Curing Agent Using Polyester Compound, and Polyester Compound Production Method |
KR1020137025199A KR101386312B1 (en) | 2011-03-30 | 2012-03-23 | Polyether compound, curing agent using polyether compound, and method for producing polyether compound |
EP12765724.5A EP2698364B1 (en) | 2011-03-30 | 2012-03-23 | Polyether compound, curing agent using the polyether compound, and producing method of the polyether compound |
CN201280015689.4A CN103459366B (en) | 2011-03-30 | 2012-03-23 | Polyether compound, curing agent using polyether compound, and method for producing polyether compound |
AU2012234102A AU2012234102B2 (en) | 2011-03-30 | 2012-03-23 | Polyether compound, curing agent using polyether compound, and method for producing polyether compound |
US14/042,357 US8802896B2 (en) | 2011-03-30 | 2013-09-30 | Polyether compound, curing agent using the polyether compound, and producing method of the polyether compound |
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WO2019230692A1 (en) | 2018-05-31 | 2019-12-05 | 三菱瓦斯化学株式会社 | Method for producing compound, compound, epoxy curing agent, and method for producing amine composition |
KR20210018268A (en) | 2018-05-31 | 2021-02-17 | 미츠비시 가스 가가쿠 가부시키가이샤 | Method for producing compound, method for producing compound, epoxy curing agent and amine composition |
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WO2019230692A1 (en) | 2018-05-31 | 2019-12-05 | 三菱瓦斯化学株式会社 | Method for producing compound, compound, epoxy curing agent, and method for producing amine composition |
KR20210018268A (en) | 2018-05-31 | 2021-02-17 | 미츠비시 가스 가가쿠 가부시키가이샤 | Method for producing compound, method for producing compound, epoxy curing agent and amine composition |
US11186537B2 (en) | 2018-05-31 | 2021-11-30 | Mitsubishi Gas Chemical Company, Inc. | Method for producing compound, compound, epoxy curing agent, and method for producing amine composition |
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