JP5484268B2 - Capacitor - Google Patents

Description

  The present invention relates to a capacitor, and more particularly to improvement of a case mold type capacitor in which a capacitor element is housed in a case.

  Conventionally, as a film capacitor used in an electronic device, a laminated type or a wound type film capacitor is known. A multilayer type film capacitor is obtained by further laminating a plurality of basic elements having a structure in which at least one dielectric including a resin film and at least one metal vapor deposition film are alternately stacked. An element is configured, and a pair of metallicon electrodes is formed on the multilayer capacitor element, and an external connection terminal is connected to each metallicon electrode. In addition, a winding type film capacitor is formed by winding one of the basic elements having the above structure, or in a state where a plurality of such basic elements are overlapped with each other, or such a basic element and a dielectric are overlapped with each other. In a combined state, it is wound to form a wound capacitor element, and like a laminated film capacitor, a pair of metallicon electrodes with external connection terminals connected to the wound capacitor element It is comprised by forming.

  By the way, in recent years, the usage environment of electronic devices has been diversified and specialized, and in order to cope with this, film capacitors used in electronic devices have the performance that can withstand various usage environments. It is required to be. Since the capacitor element constituting such a film capacitor has a dielectric made of a resin film, the dielectric properties of the dielectric deteriorate when touched by moisture in the outside air. When this happens, the electrical characteristics of the capacitor are significantly reduced. Therefore, it is strongly desired that the film capacitor has a particularly high moisture resistance among the environmental resistance.

  Therefore, recently, for example, in Japanese Patent Application Laid-Open No. 2006-294788 (Patent Document 1) and the like, a wound type or multilayer type capacitor element in which a pair of metallicon electrodes to which external connection terminals are connected is formed is synthesized. A so-called case mold type capacitor having a structure in which a nonconductor made of a synthetic resin is filled in a gap between the capacitor element and the case and a space on the opening side of the case while being accommodated in a resin case has been proposed. . In such a capacitor, the resin case and the resin non-conductor covering the periphery of the capacitor element prevent moisture from entering the capacitor, and the capacitor element is cut off from the moisture of the outside air. It is.

  However, according to the study by the present inventors, in the conventional capacitor in which the capacitor element is housed in the resin case, no matter how the type of the resin material that forms the case is changed, the improvement in moisture resistance is limited. Therefore, it has been found that it is difficult to stably maintain the moisture resistance under the use environment under more severe conditions.

JP 2006-294788 A

  Here, the present invention has been made in the background as described above, and a problem to be solved is to provide a case mold type capacitor having higher moisture resistance. .

  The present invention can be suitably implemented in various aspects listed below in order to solve the problems described above or the problems grasped from the description and drawings of the entire specification. Moreover, each aspect described below can be employed in any combination. It should be noted that aspects or technical features of the present invention are not limited to those described below, and can be recognized based on the description of the entire specification and the inventive concept disclosed in the drawings. Should be understood.

(1) A pair of metallicon electrodes configured using a basic element having a structure in which at least one dielectric and at least one metal vapor deposition film are alternately laminated, and one end of a terminal for external connection being connected A capacitor element provided with a non-conductive filler in the gap between the capacitor element and the case and the opening side space of the case, and the other end of the terminal A capacitor configured to protrude outside the case through the opening of the case, wherein the case is formed using a metal material.

(2) The opening of the case is covered with a lid, and the other end of the terminal penetrates the lid in a non-conductive state with the lid, and the outside of the case The capacitor according to the above aspect (1), wherein

(3) The lid is made of metal, and the other end of the terminal protrudes outside the case through a through-hole provided in the lid, and the other end of the terminal. The capacitor according to the aspect (2), wherein a non-conductor is interposed between the outer peripheral surface of the through hole and the inner peripheral surface of the through hole.

(4) The capacitor according to any one of the above aspects (1) to (3), wherein the non-conductive filler is formed using an elastic material.

(5) The non-conductive filler is composed of a gap between the case and the capacitor element and an opening-side space of the case, and a divided space in which the space to be filled with the non-conductive filler is divided into a plurality of spaces. And a plurality of filling members independent of each other having a shape larger than each of the divided spaces, and the plurality of filling members have a shape corresponding to the filling space in the case. The capacitor according to the above aspect (4), which is assembled and filled in an elastically deformed state.

(6) The filled space is a first divided space formed of a cylindrical gap formed between the capacitor element and the inner peripheral surface of the case, and the bottom surface side of the case with respect to the first divided space In the above, the plurality of filling members are composed of a second divided space formed by a gap formed between the capacitor element and the bottom surface of the case, and a third divided space formed by the opening side space of the case. A first filling member corresponding to the first divided space and having a larger shape, a second filling member corresponding to the second divided space and having a larger shape, The capacitor according to the aspect (5), including the third filling member corresponding to the three-divided space and having a larger shape.

(7) The capacitor according to any one of the above aspects (4) to (6), wherein the elastic material forming the non-conductive filler is a rubber material.

(8) The above aspects (1) to (7) in which the capacitor element is accommodated in the case in a state where the outer surface of the minimum area among the outer surfaces of the capacitor element is positioned corresponding to the opening of the case. ).

(9) A pair of metallicon electrodes configured using a basic element having a structure in which at least one dielectric and at least one metal vapor deposition film are alternately laminated, and one end of a terminal for external connection being connected. The capacitor element is provided in the case with the terminal projecting outside the case, and the gap between the capacitor element and the case and the opening side space of the case are non-conductive. Capacitor element sealing structure filled and filled with a filler, wherein the case is made of metal, the gap between the case and the capacitor element, and the opening side space of the case Each of the filled spaces to be filled with the non-conductive filler is divided into a plurality of divided spaces and each has a shape larger than each of the divided spaces and is independent of each other. A plurality of elastic members are used as the non-conductive filler, and the capacitor element is accommodated in the case, while the plurality of elastic members have a shape corresponding to the filled space in the case. A capacitor element sealing structure characterized in that the capacitor element is sealed by being assembled and filled in an elastically deformed state.

  That is, in the capacitor according to the present invention, the case housing the capacitor element is made of a metal that does not allow moisture to permeate more than resin. In addition, the metal case is filled with a non-conductive filler so as to cover the entire capacitor element, and insulation between the capacitor element and the metal case is ensured. Thus, in such a capacitor, the capacitor element is sealed with the metal case and the non-conductive filler in a state in which a short circuit between the internal electrode, the metallicon electrode, the terminal, etc. of the capacitor element and the case is prevented. Intrusion of moisture into the inside and contact with the capacitor element of such moisture can be prevented more reliably.

  Therefore, in the capacitor according to the present invention as described above, it is possible to effectively exhibit superior moisture resistance, thereby stably maintaining moisture resistance under the use environment under severe conditions. it can. As a result, it is possible to dramatically improve the environmental resistance performance and electrical characteristics of the electronic device in which the capacitor is used.

  In addition, if the above-described capacitor element sealing structure is adopted, when the capacitor element is sealed, for example, it is advantageous from the troublesome work of repeatedly injecting the uncured resin material into the case and curing it. Can be opened. Therefore, simplification of the capacitor element sealing operation, and consequently the capacitor manufacturing operation, and the shortening of the manufacturing cycle can be achieved very advantageously.

It is longitudinal cross-sectional explanatory drawing including a partially notch figure which shows an example of the capacitor | condenser which has a structure according to this invention. It is a figure corresponding to FIG. 1 which shows another example of the capacitor | condenser which has a structure according to this invention. It is a figure corresponding to FIG. 1 which shows another example of the capacitor | condenser which has a structure according to this invention. It is longitudinal cross-sectional explanatory drawing which shows the other example of the capacitor | condenser which has a structure according to this invention.

  Hereinafter, in order to clarify the present invention more specifically, embodiments of the present invention will be described in detail with reference to the drawings.

  First, FIG. 1 shows an embodiment of a capacitor having a structure according to the present invention in the form of a longitudinal section. As is apparent from FIG. 1, the capacitor 10 of this embodiment has one capacitor element 12. The capacitor element 12 has a conventionally known laminated structure.

  More specifically, the capacitor element 12 includes a plurality of basic elements 18 having a structure in which a metal vapor deposition film 16 is laminated on one surface (left surface in FIG. 1) of a resin film 14 as a dielectric. Yes. Here, the resin film 14 constituting the basic element 18 is made of a stretched film made of polypropylene and has a moderately thin thickness of about 1 to 10 μm. In addition, the forming material of the resin film 14 is not limited to polypropylene at all. For example, an insulating material used as a forming material of a resin film of a conventional film capacitor, such as polyethylene terephthalate, polyphenylene sulfide, and polyethylene naphthalate. Resin material can be used appropriately instead of polypropylene.

Moreover, the metal vapor deposition film 16 which comprises the basic element 18 with the resin film 14 is laminated | stacked and formed on one surface of the resin film 14 as an internal electrode film | membrane of the capacitor | condenser element 10 according to a well-known method. That is, the metal vapor deposition film 16 belongs to the category of PVD and CVD using a known metal material (for example, aluminum, zinc, etc.) that forms the internal electrode film of the film capacitor as a vapor deposition material, as in the conventional product. By performing a conventionally known vacuum deposition method, a film is formed on one surface of the resin film 14. In addition, a margin portion 20 on which the metal vapor deposition film 16 is not laminated is provided at one end portion in the length direction (vertical direction in FIG. 1) on one surface of the resin film 14. The film resistance value of such a metal vapor deposition film 16 is about 1 to 50 Ω / cm ² , and the film thickness is appropriately determined depending on the film resistance value and the like.

  A plurality of basic elements 18 having the resin film 14 and the metal vapor deposition film 16 as described above are overlapped with each other so that the resin films 14 and the metal vapor deposition films 16 are alternately positioned one by one. Thus, the capacitor element 12 has a rectangular parallelepiped shape. In the capacitor element 12, each margin portion 20 of the plurality of basic elements 18 has a minimum area among the six outer surfaces (four side surfaces and two end surfaces) of the capacitor element 12, and has a minimum area. The first outer surface 22a and the second outer surface 22b are opposed to each other so as to be alternately positioned.

  A first metallicon electrode 24a is formed on the first outer surface 22a of the capacitor element 12 and a second metallicon electrode 24b is formed on the second outer surface 22b as external electrodes. The first and second metallicon electrodes 24a and 24b are subjected to thermal spraying on the first and second outer surfaces 22a and 22b of the capacitor element 12 by a known method using, for example, a conductive metal material such as zinc. Thus, each of the first and second outer surfaces 22a and 22b is constituted by a metal coating layer formed so as to cover the entire surface.

  Of the plurality of basic elements 18, the metal vapor deposition film 16 of the basic element 18 provided with the margin 20 on the first outer surface 22 a side of the capacitor element 12 is formed on the second outer surface 22 b on the end surface on the second outer surface 22 b side. It is electrically connected to the second metallicon electrode 24b above. On the other hand, among the plurality of basic elements 18, the metal vapor deposition film 16 of the basic element 18 provided with the margin portion 20 on the second outer surface 22b side of the capacitor element 12 has the first outer surface 22a on the end surface on the first outer surface 22a side. The first metallicon electrode 24a is electrically connected.

  The first metal bar electrode 26a is formed with a first bus bar 26a, and the second metal bar electrode electrode 24b is formed with a second bus bar 26b as an external connection terminal. Each of the first and second bus bars 26a, 26b is made of a highly conductive copper plate or the like, and the longitudinal plate-like lead portions 28a, 28b and one end portion in the length direction of the lead portions 28a, 28b are approximately. It has integrally connecting portions 30a and 30b bent at a right angle.

  Then, the first bus bar 26a extends the lead portion 28a in a direction (vertical direction in FIG. 1) perpendicular to the first metallicon electrode 24a, and in the connection portion 30a, It is fixed by soldering or the like. The second bus bar 26b is formed on the side of the basic element 18 with the lead portion 28b extending in the same direction as the extending direction of the lead portion 28a of the first bus bar 26a. It is fixed to the electrode 24b by soldering or the like.

  Thus, the capacitor element 12 has a laminated structure in which a plurality of basic elements 18 formed by laminating the metal vapor deposition film 16 on the resin film 14 are further laminated. In addition, one end portions of the first and second bus bars 26a and 26b are connected to the first and second pair of outer surfaces 22a and 22b facing each other in a direction perpendicular to the stacking direction of the plurality of basic elements 18. The first and second pair of metallicon electrodes 24a and 24b are formed, and one of the first and second metallicon electric strengths 24a and 24b is used as the anode, while the other of them is the other. The cathode is used.

  In this embodiment, the capacitor element 12 having the above structure is accommodated in a special case 32, and a non-conductive filler 34 is provided between the capacitor element 12 and the case 32. It is filled and sealed with a special structure, whereby the capacitor 10 is constructed with a case mold type structure.

  That is, the case 32 is formed of a rectangular housing having a size that is slightly larger than the capacitor element 12 and an opening 36 that opens upward. Here, in particular, the case 32 is formed using a metal material such as aluminum. In the case 32 made of aluminum, intrusion of moisture in the outside air through the side wall portion and the bottom wall portion can be prevented more sufficiently than, for example, a case made of resin.

  The material for forming the case 32 is not limited to aluminum, and any type of material can be used as long as it is a metal material. However, aluminum is preferably used in terms of light weight and cost. Is done. Further, the thickness of the case 32 is also determined as appropriate to the extent that necessary strength can be ensured.

  And the capacitor | condenser element 12 positions the 1st metallicon electrode 24a formed in the 1st outer surface 22a of the minimum area on the upper side (opening 36 side of the case 32), and the 2nd outer surface of the same area as the 1st outer surface 22a The second metallicon electrode 24b formed on 22b is accommodated in the case 32 in an orientation in which it is positioned on the lower side (the bottom surface side of the case 32). In addition, the capacitor element 12 accommodated in the case 32 positions the first metallicon electrode 24a at a position that is biased to the bottom surface side of the case 32 with respect to the height position of the peripheral portion of the opening 36 of the case 32, and Four outer surfaces 22c, 22d, and 22e (only three are shown in FIG. 1) excluding the formation surface of the second metallicon electrode 24b and the first and second metallicon electrodes 24a and 24b, It arrange | positions in the state made non-contact with respect to a surrounding surface. That is, the capacitor element 12 is accommodated in the case 32 in a state where a gap is formed between the inner peripheral surface and the bottom surface of the case 32 and an opening-side space is formed above the case 32.

  And in the accommodation state in the case 32 of such a capacitor | condenser element 12, it consists of the clearance gap formed between the capacitor | condenser element 12 and the bottom face and inner peripheral surface of the case 32, and the opening side space of the case 32. A filling material 34 is filled in the filling space 37.

  More specifically, the filler 34 is formed using a non-conductive rubber material. Thereby, elasticity is given to the filler 34. The type of rubber material forming the filler 34 is not particularly limited as long as it is non-conductive, but, for example, rubber having excellent moisture resistance (water resistance) such as silicon rubber and fluorine rubber. Materials are preferably used.

  Further, such a filler 34 corresponds to a filling space 37 formed in the case 32 by accommodating the capacitor element 12 in the case 32 and has an overall shape slightly larger than that. . Here, such a filler 34 has a divided structure including a first filler member 38, a second filler member 40, and a third filler member 42. These first to third filling members 38, 40, 42 are constituted by separate members independent from each other, and each shape is formed by dividing the filling space 37 in the case 32 into three, The shapes correspond to the second and third divided spaces 44, 46, and 48, respectively, and have a slightly larger shape.

  That is, the first filling member 38 corresponds to the first divided space 44 formed by a gap formed between the four outer surfaces 22c, 22d, and 22e of the capacitor element 12 and the inner peripheral surface of the case 32, and It has a square cylinder shape slightly larger than that. The first filling member 38 is provided with an inner hole 50 at a position biased to the outer peripheral side with respect to the axis, and the inner hole 50 is a rectangle that is substantially the same as or slightly smaller than the capacitor element 12. It has a shape. In addition, a through-hole 52 extending in the height direction is formed in the cylindrical wall portion that is thicker than the other portion due to such a bias toward the outer peripheral side of the inner hole 50.

  The second filling member 40 corresponds to the second divided space 46 formed by a gap formed between the second metallicon electrode 24b of the capacitor element 12 and the bottom surface of the case 32, and has a substantially flat plate shape slightly larger than that. Presents. A concave groove 54 is formed on the upper surface of the second filling member 40 and extends from the central portion toward the end portion.

  The third filling member 42 corresponds to the third divided space 48 formed by the opening side space of the case 32 and has a substantially flat plate shape slightly larger than that. A first through hole 56 and a second through hole 58 are formed in the substantially central portion and the outer peripheral portion of the third filling member 42, respectively. Further, a concave groove 60 extending at a shorter length than the concave groove 54 of the second filling member 40 is provided at a substantially central portion of the lower surface of the third filling member 42 at one end in the extending direction thereof. 56 is formed in communication with the lower opening.

  Then, the second filling member 40 is press-fitted into the bottom portion of the case 32 and filled in the second divided space 46 in an elastically deformed state. Accordingly, the second filling member 40 is in close contact with the inner bottom surface of the case 32 and the inner peripheral surface portion on the bottom surface side based on the restoring force from the elastic deformation.

  In addition, the capacitor element 12 is accommodated in the inner hole 50 of the first filling member 38 in such a direction that the first and second metallicon electrodes 24 a and 24 b are exposed to the outside from both side openings of the inner hole 50. Then, the first filling member 38 is press-fitted into the intermediate portion in the height direction of the case 32 and is elastically deformed so as to be placed on the second filling member 40 while being assembled. 44 is filled. Thereby, the 1st filling member 38 is closely_contact | adhered to the internal peripheral surface part located in the height direction intermediate part of case 32 based on the restoring force from the elastic deformation. In addition, the four outer surfaces 22c, 22d, and 22e that are the non-formation surfaces of the first and second metallicon electrodes 24a and 24b in the capacitor element 12 are in close contact with the inner peripheral surface of the inner hole 50 of the first filling member 38. . Furthermore, based on the restoring force from the elastic deformation of the first filling member 38 and the second filling member 40, the lower surface of the first filling member 38 and the upper surface of the second filling member 40 are in close contact with each other.

  Then, under such filling of the first filling member 38 into the first divided space 44, the connection portion 30 b of the second bus bar 26 b of the capacitor element 12 is fitted into the concave groove 54 of the second filling member 40. In addition, the lead portion 28b is inserted through the through hole 52 of the first filling member 38 in a press-fit state.

  In addition, the third filling member 42 is press-fitted into the opening 36 side portion of the case 32 and is elastically deformed so that the third filling member 42 is mounted on the first filling member 38, and the third divided space 48. It is filled inside. Thereby, the 3rd filling member 42 is closely_contact | adhered to the internal peripheral surface part located in the opening part 36 side of case 32 based on the restoring force from the elastic deformation. Further, based on the restoring force from the elastic deformation of the first filling member 38 and the third filling member 42, the upper surface of the first filling member 38 and the upper surface of the third filling member 42 are in close contact with each other.

  Further, under such filling of the third filling member 42 into the third divided space 48, the connection portion 30 a of the first bus bar 26 a of the capacitor element 12 is fitted into the concave groove 60 of the third filling member 42. In addition, the lead portion 28a is inserted through the first through hole 56 in a press-fit state. In addition, the tip side portion of the lead portion 28b of the second bus bar 26b inserted through the through hole 52 of the first filling member 38 passes through the second through hole 58 of the third filling member 42 in a press-fitted state.

  Then, the leading end of the lead portion 28a of the first bus bar 26a inserted through the first through hole 56 in a state where the first, second, and third filling members 38, 40, 42 are filled into the case 32 as described above. And the leading end portion of the lead portion 28 b of the second bus bar 26 b inserted through the second through hole 58 protrude through the opening 36 of the case 32 to the outside of the case 32. Further, the caulking portion 62 composed of the end portion on the side of the opening portion 36 of the side wall portion of the case 32 is bent and deformed inward, and the first, second, and third filling members 38, 40, 42 are placed inside the case 32. It is fixed by caulking. As a result, the first, second, and third filling members 38, 40, 42 are compressed in the height direction between the caulking portion 62 and the bottom portion of the case 32, so that the second filling member 40 and The third filling member 42 and the first filling member 38 are in closer contact with each other.

  Thus, the first, second, and third filling members 38, 40, 42 are filled in the case 32 so as to be in a shape corresponding to the filling space 37. Also, between the first, second, and third filling members 38, 40, 42, between each of the filling members 38, 40, 42 and the case 32, each of the filling members 38, 40, 42 and the capacitor element. 12, between the respective lead portions 28 a, 28 b of the first and second bus bars 26 a, 26 b and the inner peripheral surfaces of the first and second through holes 56, 58 of the third filling member 42, and the second Sealing performance is sufficiently exerted between the lead portion 28b of the bus bar 26b and the inner peripheral surface of the through hole 52 of the first filling member 38. In such a state, the capacitor element 12 ensures insulation from the case 32 by the filler 34 including the first, second, and third filler members 38, 40, 42 in the case 32. However, it is sealed.

  Thus, in the capacitor 10 of the present embodiment, in addition to the case 32 being made of aluminum, between the first, second, and third filling members 38, 40, 42 assembled in the case 32, Since the sealing property between each of the filling members 38, 40, 42 and the case 32, and between the filling members 38, 40, 42 and the capacitor element 12 is sufficiently secured, It is possible to more reliably prevent moisture from entering the case 32 and further contact such moisture with the capacitor element 12 sealed with the filler 34.

  Therefore, in the capacitor 10 according to the present embodiment as described above, the moisture resistance can be dramatically improved. Accordingly, moisture resistance can be stably exhibited under a use environment under more severe conditions. As a result, it is possible to advantageously realize environmental resistance performance and effective improvement of electrical characteristics of the electronic device in which the capacitor 10 is used.

  Further, in the capacitor 10, since the case 32 is made of aluminum having excellent heat transfer performance, the heat generated when the capacitor element 12 is energized is effectively released through the case 32. As a result, excellent heat dissipation performance is exhibited, and a stable use state can be secured.

  Furthermore, in the capacitor 10 of the present embodiment, the capacitor element 12 is accommodated in the case 32 in a state in which the periphery is covered with a rubber filler 34. Therefore, when the capacitor element 12 vibrates due to energization, such vibration of the capacitor element 12 can be advantageously absorbed by the elastic deformation of the filler 34. As a result, the occurrence of “sounding” due to the vibration of the capacitor element 12 can be effectively prevented.

  In the present embodiment, among the plurality of outer surfaces of the capacitor element 12, the capacitor element 12 is disposed in the case 32 such that the first outer surface 22 a having the smallest area is positioned corresponding to the opening 36 of the case 32. Is housed in. Thus, the area of the capacitor element 12 portion that is blocked from the outside air by the wall portion of the case 32 is made as small as possible. This also improves the moisture resistance of the capacitor 10.

  Here, in a conventional case mold type capacitor, the filler for sealing the capacitor element is made of a resin material such as an epoxy resin. And when sealing the capacitor element in the case with such a filler, uncured resin material is poured into the case little by little and the work of curing is repeatedly performed several times. It was. Therefore, the sealing operation of the capacitor element in the case has been extremely troublesome and time consuming.

  On the other hand, in the capacitor 10 of the present embodiment, the filler 34 is made of rubber and includes first, second, and third filler members 38, 40, and 42 that are independent of each other. The capacitor element 12 is sealed in the case 32 by filling the case 32 while assembling the first, second, and third filling members 38, 40, 42 to each other. ing. For this reason, in the capacitor 10, when the capacitor element 12 is sealed, the capacitor element 12 can be advantageously freed from troublesome work of repeatedly injecting an uncured resin material into the case 32 and curing it.

  Therefore, in such a capacitor 10 of this embodiment, simplification of the manufacturing process and shortening of the manufacturing cycle can be achieved extremely advantageously.

  Next, FIG. 2 shows another embodiment of a capacitor having a structure according to the present invention. 2 and the embodiment shown in FIGS. 3 and 4 to be described later, the same reference numerals as those in FIG. 1 are given to members and parts having the same structure as in the first embodiment. Detailed description thereof will be omitted.

  That is, the capacitor 64 shown in FIG. 2 has a lid 66 that covers the opening 36 of the case 32. The lid 66 is made of a resin material having excellent moisture resistance (water resistance) such as an epoxy resin, and has a rectangular flat plate shape having a size that can be accommodated in the case 32 through the opening 36 of the case 32. ing.

  Such a lid 66 is in close contact with the upper surface of the third filling member 42 of the filler 34 filled in the filled space 37 in the case 32 that houses the capacitor element 12. Contained. Further, the tip end portion of each lead portion 28a, 28b of the first and second bus bars 26a, 26b of the capacitor element 12 passes through the lid 66. The lid body 66 is caulked and fixed together with the filler 34 at the caulking portion 62 of the case 32 at the outer peripheral portion thereof. The lid 66 is preferably manufactured by insert molding using the first and second bus bars 26a and 26b as inserts.

  Thus, the opening 36 of the case 32 is covered with the lid 66. Further, under such a cover state, a sufficient sealing property is ensured between the cover body 66 and the third filling member 42 and between the cover body 66 and the inner peripheral surface of the case 32 and the caulking portion 62. .

  Thus, in the capacitor 64 of this embodiment, the third filling member 42 exposed to the outside of the case 32 is covered with the lid 66 through the opening 36 without being covered with the case 32. Yes. As a result, the capacitor element 12 is blocked from the outside air, so that moisture in the outside air can be prevented from entering the case 32 and further contact of the moisture with the capacitor element 12 can be effectively prevented. As a result, the moisture resistance of the capacitor 10 can be increased more advantageously.

  Moreover, in this embodiment, since the cover body 66 is resin, what kind of special insulation process is performed between such a cover body 66 and the 1st and 2nd bus-bar 26a, 26b which penetrates it. In addition, there is an advantage that the first and second bus bars 26a and 26b, and thus the insulation of the first and second metallicon electrodes 24a and 24b with respect to the lid 66 are advantageously ensured.

  Next, FIG. 3 shows still another embodiment different from the first and second embodiments. Similarly to the second embodiment, the capacitor 68 of the present embodiment also has a lid 70 that covers the opening 36 of the case 32. However, the lid 70 of the capacitor 68 has an overall shape of a rectangular flat plate larger than the opening 36 of the case 32, unlike the lid 66 of the capacitor 64 of the second embodiment. The case 32 is formed using the same aluminum material. The material for forming the lid 70 is not limited to aluminum, and any material can be used as long as it is a metal material, but aluminum is preferably used in terms of light weight and the like.

  Such a lid 70 is caulked and fixed to the end portion of the cylindrical wall portion 72 of the case 32 on the side of the opening portion 36 while covering the opening portion 36 of the case 32. In other words, the outer flange portion 74 is integrally provided around the end portion of the cylindrical wall portion 72 of the case 32 on the opening 36 side. The lid body 70 is placed on the case 32 in a state where the outer peripheral portion thereof is superposed on the outer flange portion 74 of the cylindrical wall portion 72 of the case 32 over the entire circumference. A distal end portion of the outer peripheral portion is bent and deformed so as to involve the outer flange portion 74. As a result, a caulking portion 76 is formed on the outer peripheral portion of the lid body 70, and the lid body 70 is caulked and fixed to the outer flange portion 74 of the case 32 by the caulking portion 76.

  Further, here, under such a state that the lid 70 is fixed to the case 32, the filler 34 composed of the first, second, and third filling members 38, 40, 42 is formed between the lid 70 and the bottom of the case 32. Compressed between. Thereby, the upper surface of the 3rd filling member 42 is closely_contact | adhered to the lower surface of the cover body 70, Therefore, the sealing performance between these 3rd filling members 42 and the cover body 70 is fully ensured. Further, since the caulking portion 76 is also caulked with respect to the outer flange portion 74 by a winding method, the sealing performance between the lid 70 and the outer flange portion 74 of the case 32 is sufficiently ensured.

  Furthermore, a first insertion hole 78 and a second insertion hole 80 penetrating those portions are formed in the substantially central portion and the outer peripheral portion of the lid body 70 fixed to the case 32 as described above. ing. The leading end portions of the lead portions 28a and 28b of the first and second bus bars 26a and 26b formed in the capacitor element 12 are loosely inserted into the first and second insertion holes 78 and 80. .

  In addition, a rubber as a non-conductor is provided in a portion where the lead portion 28a of the first bus bar 26a is inserted into the first insertion hole 78 and a portion where the lead portion 28b of the second bus bar 26b is inserted into the second insertion hole 80. Sleeves 82 and 82 are respectively extrapolated. And these rubber sleeves 82 and 82 are between the inner peripheral surfaces of the first and second insertion holes 78 and 80 and the outer peripheral surfaces of the lead portions 28a and 28b of the first and second bus bars 26a and 26b. It is filled so as to be interposed under elastic deformation. As a result, the lead portions 28a and 28b of the first and second bus bars 26a and 26b and the metal lid 70 are in a non-conductive state, and moisture in the outside air is transferred to the first and second insertion holes. Intrusion into the case 32 is prevented through 78 and 80.

  As described above, in the capacitor 68 of the present embodiment, the opening 36 of the case 32 is covered with a sufficient sealing property by the lid 70 made of a metal plate that has a better barrier against moisture than the resin plate. Yes. Therefore, in the capacitor 68 according to this embodiment as described above, it is possible to sufficiently ensure a further excellent moisture resistance.

  The specific configuration of the present invention has been described in detail above. However, this is merely an example, and the present invention is not limited by the above description.

  For example, in the first to third embodiments, the capacitor element 12 accommodated in the case 32 further includes a plurality of basic elements 18 formed by laminating the metal vapor deposition film 16 on one surface of the resin film 14. It had a laminated structure. However, the capacitor element 12 may be configured with a winding structure in which a plurality of such basic elements 18 are wound together while being superposed on each other. In other words, in the present invention, any of a laminated type and a wound type can be used as the capacitor element accommodated in the case.

  The basic element 18 also has, for example, a structure in which the metal vapor deposition film 16 is laminated on one surface of the resin film 14 and a structure in which the metal vapor deposition film 16 is laminated on both surfaces of the resin film 14. , A structure in which a metal vapor deposition film 16 is interposed between the resin film 14 and the resin film 14, and a plurality of resin films 14 and a plurality of metal vapor deposition films 16 are alternately positioned one by one. Thus, it is possible to select one type from among those having a laminated structure, or to use two or more types in various combinations.

  Furthermore, the direction of the capacitor element 12 accommodated in the case 32 can be changed as appropriate.

  In the first to third embodiments, only one capacitor element 12 is accommodated in the case 32. However, for example, a plurality (in the case of the capacitor 84 shown in FIG. The capacitor 10 can be configured by accommodating five capacitor elements 12 in this case. In this case, generally, the plurality of capacitor elements 12 are arranged in parallel and are connected to each other by the first metallicon electrode 24a and the second metallicon electrode 24b. Note that the number of capacitor elements 12 accommodated in the case 32 is appropriately determined according to the overall size of the capacitor 10, the capacitance required for the capacitor 10, and the like.

  Further, when the opening portion 36 of the case 32 is covered with the lid bodies 66 and 70 like the capacitors 64 and 68 of the second and third embodiments, the case 32 of the lid bodies 66 and 70 is covered. Needless to say, the fixing structure is not limited to the illustrated caulking and fixing.

  Further, when a metal lid 70 is used as in the capacitor 68 of the third embodiment, the inner peripheral surfaces of the first and second insertion holes 78 and 80 of the lid 70 and the first Of course, a non-conductive material other than rubber can be used as the non-conductive material interposed between the outer peripheral surfaces of the lead portions 28a and 28b of the second bus bars 26a and 26b. For example, a resin sleeve is externally inserted as a non-conductive material, an insulating paper is wound, or an insulating film or the like is inserted into the first and second insertion holes 78 and 80 of the lead portions 28a and 28b. It may be formed.

  Furthermore, in the first to third embodiments, the filler 34 is made of rubber and has a divided structure including the first, second, and third filler members 38, 40, 42. The filler 34 may be an integral product made of a nonconductive material such as resin or rubber, or may be a divided structure made of a nonconductive material other than rubber.

  When the filler 34 has a divided structure, the filler 34 may have a two-divided structure or a divided structure of four or more. In addition, the shape of the divided body of the filler 34 having the divided structure can be appropriately changed according to the shape of the capacitor element 12 and the case 32, the shape of the first and second bus bars 26a and 26b, or the like.

  In addition, although not enumerated one by one, the present invention can be carried out in a mode to which various changes, modifications, improvements, etc. are added based on the knowledge of those skilled in the art. It goes without saying that all are included in the scope of the present invention without departing from the spirit of the present invention.

10, 64, 68 Capacitor 12 Capacitor element 14 Resin film 16 Metal vapor deposition film 18 Basic element 24a First metallicon electrode 24b Second metallicon electrode 26a First bus bar 26b Second bus bar 32 Case 34 Filler 36 Opening 37 Filled space 38 First filling member 40 Second filling member 42 Third filling member 70 Lid 82 Rubber sleeve

Claims (5)

A pair of metallicon electrodes is provided, which is configured using a basic element having a structure in which at least one dielectric and at least one metal deposition film are alternately laminated, and one end of a terminal for external connection is connected. The capacitor element is accommodated in a case, while the gap between the capacitor element and the case and the opening side space of the case are filled with a non-conductive filler, and the other end of the terminal is connected to the case. The capacitor is configured to protrude to the outside of the case through the opening, and the case is formed using a metal material, and the non-conductive filler includes a gap between the case and the capacitor element. Each of the space to be filled with the non-conductive filler is divided into a plurality of divided spaces, and each space is larger than each of the divided spaces. In a state where the plurality of filling members are assembled in the case so as to have a shape corresponding to the filling space and elastically deformed. A capacitor characterized by being filled .   The opening of the case is covered with a lid, and the other end of the terminal penetrates the lid and protrudes outside the case in a non-conductive state with the lid. The capacitor according to claim 1.   The lid is made of metal, and the other end of the terminal is projected outside the case through a through hole provided in the lid, and the outer peripheral surface of the other end of the terminal The capacitor according to claim 2, wherein a non-conductor is interposed between the through hole and the inner peripheral surface of the through hole.   The capacitor according to claim 1, wherein the non-conductive filler is formed using an elastic material. The filled space is a first divided space formed of a cylindrical gap formed between the capacitor element and the inner peripheral surface of the case, and on the bottom surface side of the case with respect to the first divided space, The plurality of filling members include a second divided space formed by a gap formed between the capacitor element and the bottom surface of the case, and a third divided space formed by the opening side space of the case. A first filling member corresponding to the first divided space and having a larger shape, a second filling member corresponding to the second divided space and having a larger shape, and the third divided space 5. The capacitor according to claim 1, wherein the capacitor is configured with a third filling member having a shape larger than that of the third filling member.

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