JP5474035B2 - Wireless LAN access point - Google Patents

Description

  The present invention relates to a wireless LAN access point that includes a LAN terminal and serves as a wireless radio wave relay unit.

  The wireless LAN access point is required to have various power supply modes depending on its use, use place, use form, and the like. Accordingly, the external terminal configuration of the wireless LAN access point is diverse. The external terminal configuration includes, for example, a configuration including a LAN terminal and a DC power supply terminal, a proprietary LAN terminal that supplies power from a predetermined pin, and the like.

  In order to avoid the inefficiency of individually manufacturing a wireless LAN access point according to various power supply modes required, a conventional wireless LAN access point has a proprietary LAN terminal on one board. In addition to the DC power supply terminal, other various power supply standard LAN terminals are provided, and the original LAN terminal, DC power supply terminal, and other power supply standard LAN terminals are used as external terminals of the wireless LAN access point. Arranged and ensured versatility.

JP 2010-153669 A

  However, in a conventional wireless LAN access point in which a plurality of external terminal configurations are arranged in accordance with a plurality of power supply modes, a large number of external terminals are arranged on a predetermined surface on which the external terminals in the wireless LAN access point housing are arranged. A terminal is provided, and there is a problem in that the appearance size of the wireless LAN access point is increased.

  In order to solve the above problems, an object of the present invention is to provide a wireless LAN access point that is reduced in size and weight while allowing a versatile product to be easily manufactured.

In order to achieve the above-described object, the wireless LAN access point of the present invention is arranged when necessary according to the standard, a case composed of an upper cover and a lower cover, a standard board arranged in the case, and the standard. A unique board, a first LAN terminal formed on the standard board and corresponding to an arbitrary first power supply standard, a wireless module formed on the standard board for transmitting and receiving wireless LAN radio waves, and formed on the standard board And a CPU for controlling the operation of the standard board, preparing one or a plurality of the unique boards in advance, and supporting any second power standard different from the first power standard for each unique board second to form a LAN terminal, in the case of the first power supply standard as an external terminal exposed from the first LAN terminal is the casing with only the standard substrate is disposed in the housing to In the case of the second power supply standard, the standard board and the unique board corresponding to the selected second power supply standard are arranged in the casing, and only the second LAN terminal is removed from the casing. The second LAN terminal is exposed and becomes an external terminal, and the second LAN terminal is electrically connected to the first LAN terminal in the housing.
The standard board is a PoE original board, the first LAN terminal is a unique LAN terminal in which power pins are uniquely arranged, a DC power terminal is further provided on the standard board, and the first power supply standard In some cases, the first LAN terminal and the DC power supply terminal may be exposed from the housing and serve as external terminals .
The second LAN terminal formed on one of the unique substrates may be a power supply standard LAN terminal compliant with the PoE standard.
One of the unique boards may be an in-vehicle unique board, and the second LAN terminal may include a LAN terminal and a DC power supply terminal.

  Also, there are provided at least three claws formed at different intervals on one of the upper cover and the lower cover and provided with projections, and a recess formed at a position corresponding to the other claw, and the claw and the recess are fitted. It is preferable to attach the upper cover and the lower cover, and to open the housing with a dedicated jig provided with blades arranged at intervals corresponding to the intervals between the claws.

Also, a plurality of front substrate mounting pins formed on the lower cover and a plurality of rear substrate mounting pins formed at positions away from the front substrate mounting pins from a position where the external terminals of the lower cover are exposed. In the case of the first power supply standard, the first power supply standard has a placement pin, a first step formed on the front substrate placement pin, and a second step formed on the rear substrate placement pin. The standard substrate is placed on the first step of the front substrate placement pin, and in the case of the second power supply standard, the unique substrate is placed on the first step of the front substrate placement pin. And the standard substrate is placed on the second step of the rear substrate mounting pin, and the height from the bottom of the lower cover to the second step is the second from the bottom of the lower cover. It is preferable that the height is higher than one step.

Further, a plurality of front substrate mounting pins formed on the lower cover, and a plurality of unique substrate mounting pins formed on the lower cover, the front substrate mounting from a position where the external terminals are exposed in the lower cover A plurality of rear substrate placement pins formed at positions away from the placement pins and the unique substrate placement pins; a first step formed on the front substrate placement pins; and the rear substrate placement. And a third step formed on the unique substrate mounting pin. In the case of the first power supply standard, the front substrate mounting pin The standard substrate is placed on the first step, and in the case of the second power standard, the unique substrate is placed on the third step of the unique substrate placement pin and the rear substrate is placed. The standard substrate is placed on the second step of the mounting pin, and is moved forward from the bottom of the lower cover. It is preferable that the height up to the second stepped and said third step is higher than the height of the first step from the lower cover bottom.

  The difference between the height from the bottom of the lower cover to the first step and the height from the bottom of the lower cover to the second step is preferably larger than the thickness of the unique substrate.

  Moreover, the concave heat dissipation portion formed on the outer surface of the upper cover and the lower cover, and the concave side surface opposite to the exposure direction of the external terminal, the closer to the concave bottom portion It is preferable to have an inclined surface inclined in the exposure direction of the external terminal and a heat radiation window opened in the inclined surface.

  Moreover, it is preferable to have the hole formed in the outer surface of the said lower cover, and the waterproof structure formed in convex shape in the vicinity of the direction opposite to the exposure direction of the said external terminal of the said hole of the outer surface of the said lower cover.

  The wireless LAN access point of the present invention has an effect that it can be reduced in size and weight while making it possible to easily manufacture a versatile product.

1 is an exploded perspective view showing a configuration of a standard wireless LAN access point according to Embodiment 1. FIG. 1 is an exploded perspective view showing a configuration of a wireless LAN access point of a proprietary standard according to Embodiment 1. FIG. The figure which shows the structure of the housing | casing fitting part in the wireless LAN access point of Embodiment 2 FIG. 10 is a diagram for explaining a method of opening a housing in the wireless LAN access point according to the second embodiment. FIG. 7 is a perspective view showing a board arrangement structure of a standard wireless LAN access point according to a third embodiment. Sectional drawing which shows the board | substrate arrangement | positioning structure of the wireless LAN access point of the original specification in Embodiment 3 The figure which shows the structure of the thermal radiation hole of the wireless LAN access point in Embodiment 4 The figure which shows the waterproof structure of the wireless LAN access point in Embodiment 4

  The wireless LAN access point is composed of a housing and a substrate disposed in the housing. The board includes a wireless module that controls transmission / reception of wireless LAN radio waves, a signal control circuit that analyzes and controls a signal input from an external terminal, a power supply circuit that controls power supplied from the external terminal, and a wireless LAN access A CPU for controlling the operation of the point is formed.

A feature of the present invention is that a substrate on which a control circuit and an external terminal of an arbitrary power supply terminal specification are formed, and a plurality of substrates that are configured according to the power supply terminal specification and that have only an external terminal without a control circuit. It is prepared in advance and used in combination with one or two substrates depending on the required power supply configuration specifications.
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, the wireless LAN access point in the first embodiment will be described with reference to FIGS.

  FIG. 1 is an exploded perspective view showing the configuration of a standard wireless LAN access point according to the first embodiment, and FIG. 2 is an exploded perspective view showing the configuration of a proprietary wireless LAN access point according to the first embodiment.

  In FIG. 1, reference numeral 1 denotes a standard substrate, which is a substrate on which all functional circuits necessary for a wireless LAN access point are formed. For example, as an external terminal, a unique LAN terminal 2 and a DC power supply terminal 3 in which the power pin arrangement of the PoE standard (IEEE802.3af) is modified are provided at the end of the standard board 1, and the wireless module 6, A LAN circuit 7 connected to the unique LAN terminal 2 for analyzing and controlling signals, a DC power supply terminal 3 and a power supply circuit 8 connected to the power supply pin of the unique LAN terminal 2 for controlling the supply of power and these functions. CPU 9 is formed. Furthermore, as other external terminals, one or a plurality of terminal portions 10 composed of operation display LEDs, setting switches, and the like can be provided. Reference numeral 4 denotes a lower cover, reference numeral 5 denotes an upper cover, and reference numeral 14 denotes a front cover, which constitutes a housing of the wireless LAN access point. The standard substrate 1 is arranged in the lower cover 4 so that the end of the lower cover 4 on the side where the front cover 14 is mounted is aligned with the end of the standard substrate 1 where the external terminals are formed. Further, the front cover 14 is attached to the lower cover 4 so that the external terminals are exposed from the holes formed in the front cover 14, and the upper cover 5 is attached to the lower cover 4. The standard substrate 1 is included by the front cover 14. Further, the necessary number of LEDs 12 for displaying the operation state are provided on the standard substrate 1, the light emitting unit 11 is provided on the upper cover 5, and the LED 12 and the light emitting unit 11 are connected by the LED pipe 13, so that the operation state is externally provided. I can grasp it. Furthermore, in order to ensure heat dissipation, it is preferable to provide a heat dissipation window 15 in the upper cover 5 and the lower cover 4.

  In FIG. 2, reference numeral 21 denotes a unique substrate, which is a substrate on which only external terminals and control circuits necessary for the external terminals are formed. For example, as an external terminal, a standard LAN terminal 22 is provided at the end of the unique substrate 21 with a unique power supply pin array conforming to the PoE standard. Further, one or a plurality of terminal portions 10 may be provided as in the case of FIG. Then, the unique substrate 21 is arranged in the lower cover 4 so that the end portion of the lower cover 4 on the side where the front cover 24 is mounted is aligned with the end portion where the external terminals of the unique substrate 21 are formed. Further, the standard substrate 1 is disposed on the back side of the unique substrate 21 when viewed from the front cover 24 in the lower cover 4. The signal and power input from the standard LAN terminal 22 are input to the PoE circuit 27 formed on the unique substrate 21 and divided into the signal line 16 and the power supply line 17. The divided signal line 16 and power line 17 are connected to the unique LAN terminal 2 of the standard board 1 according to the pin arrangement of the unique LAN terminal 2. Other configurations are the same as those in FIG.

  As described with reference to FIGS. 1 and 2, in the wireless LAN access point of the present invention, first, two types of substrates, the standard substrate 1 and the unique substrate 21, are prepared, and the substrate is mounted in the housing as required. The wireless LAN access point of the external terminal specification conforming to the required power supply terminal specification is manufactured using a common casing. For example, when a power supply terminal specification in which PoE is changed is required, a wireless LAN access point on which only the standard board 1 is mounted is manufactured as shown in FIG. Further, when a power terminal specification of a predetermined standard such as a standard LAN terminal conforming to PoE is required, a wireless LAN access point having the original board 21 and the standard board 1 is manufactured as shown in FIG. . In this way, the standard board 1 on which an external terminal having an arbitrary power terminal configuration such as a power terminal structure of PoE original standard and a functional circuit necessary for a wireless LAN and a power terminal having a unique power terminal specification are mounted. By preparing the original board 21 in advance, a wireless LAN access point corresponding to demand can be easily manufactured simply by selecting a board to be mounted. At the same time, since only the external terminals corresponding to the required specifications are arranged outside the wireless LAN access point, a wireless LAN access point corresponding to the required specifications is provided while reducing the arrangement area of the external terminals. Can do. In particular, in the case of a wireless LAN access point, since the ratio of the control system circuit such as a wireless module or CPU in the board is large, even if an extra board provided with only external terminals is arranged in the wireless LAN access point, Since the proportion of the total size of wireless LAN access points is small and the size penalty can be minimized, the size of the wireless LAN access points can be reduced while easily satisfying the power supply terminal specifications that meet demand. Can be achieved.

  In the above description, the case where an external terminal conforming to the PoE standard is provided as the unique substrate 21 has been described. However, a unique substrate provided with terminals of various power supply terminal specifications can be formed. For example, it is possible to form a unique substrate provided with a LAN terminal conforming to the PoE standard and a DC power source for in-vehicle use. Similarly, in the above description, the case where an external terminal whose PoE standard is changed is provided as the standard substrate 1 is described as an example. However, an external terminal of various standards such as an external terminal conforming to the PoE standard can be provided. In other words, an external terminal having the highest demand, such as an external terminal conforming to the PoE standard or an external terminal modified from the PoE standard, is formed on the standard board 1, and a unique board 21 on which external terminals having other configurations are mounted is prepared. Therefore, it is possible to easily manufacture a wireless LAN access point according to demand.

  In this way, by using a unique substrate having terminals with various power supply terminal specifications such as those for in-vehicle use, it is possible to reduce the size while easily meeting a wider range of demands.

Furthermore, in the above description, the case where the standard substrate 1 and the unique substrate 21 are prepared one by one has been described. However, as the unique substrate 21, any other than the unique substrate 21 having the standard LAN terminal 22 compliant with the PoE standard described above is optional. A plurality of unique substrates 21 having external terminals different from the unique LAN terminal 2 such as a unique substrate having a LAN power source and a DC power source for in-vehicle use are provided. By selecting an object, a wireless LAN access point meeting a wider range of requirements can be easily manufactured. As an arbitrary LAN terminal, it is possible to prepare a unique substrate 21 having various terminal configurations such as a LAN terminal compliant with PoE, a LAN terminal with a unique power supply arrangement, or a LAN terminal that does not supply power. Further, not only the LAN terminal but also a network terminal such as a USB can be used.
Next, the wireless LAN access point in the second embodiment will be described with reference to FIGS.

  3A and 3B are diagrams showing the structure of the housing fitting part in the wireless LAN access point of the second embodiment, FIG. 3A is a perspective view, and FIG. 3B is a cross-sectional view of the main part showing the fitting state. FIG. FIG. 4 is a diagram for explaining a method of opening the housing in the wireless LAN access point according to the second embodiment.

  As shown in FIGS. 3 and 4, the housing of the present embodiment has a claw 18 for fixing the upper cover 5 and the lower cover 4 without using screws or the like in the wireless LAN access point of the first embodiment. And the recess 19 are fitted to each other. The claw 18 is formed on the inner side surface of the upper cover 5 or the lower cover 4, and the concave portion 19 is formed on the inner side surface of the upper cover 5 or the lower cover 4 where the claw 18 is not formed. Here, the side surface is a surface on which a joint portion between the upper cover 5 and the lower cover 4 is formed among surfaces orthogonal to the front covers 14 and 24 (see FIGS. 1 and 2). 3 and 4 exemplify the case where the claw 18 is formed on the upper cover 5 and the concave portion 19 is formed on the lower cover 4, and the following description will be given along this example.

  The claw 18 is formed on the inner surface of the upper cover 5, and has a structure in which the tip protrudes toward the lower cover 4 in a state where the upper cover 5 and the lower cover 4 are mounted. A protrusion 20 is formed at the tip of the claw 18 so as to protrude toward the side surface of the lower cover 4. On the other hand, the concave portion 19 is formed on the inner surface of the lower cover 4, and when the upper cover 5 and the lower cover 4 are attached, the projection 20 of the claw 18 is fitted into the concave portion 19, whereby the upper cover 5 and the lower cover 4 are fitted. 4 is fixed.

  The pair of the claw 18 and the recess 19 is formed at three places on each side, and six places as a whole. On each side, the distance X between the pair of the claw 18 and the recess 19 at the center and the pair of the claw 18 and the recess 19 closest to the front covers 14 and 24 (see FIGS. 1 and 2), the claw 18 and the recess at the center If the distance Y between the pair of 19 and the pair of the claw 18 and the recess 19 farthest from the front covers 14 and 24 (see FIGS. 1 and 2) is set, X and Y are arranged differently. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  In addition, when opening a housing | casing, the exclusive jig | tool 23 shown in FIG. 4 is used. Blades 35 are formed on the dedicated jig 23 at intervals corresponding to the interval between the pair of the claw 18 and the recess 19. Further, the thickness a of the tip portion of the blade 35 is thinner than the gap t between the upper cover 5 and the lower cover 4 of the housing.

  As described above, according to the present embodiment, it is possible to easily manufacture a versatile product, and to reduce the size and weight, and to fit the claw 18 and the recess 19 without using screws or the like. By doing so, the upper cover 5 and the lower cover 4 can be attached, and further downsizing can be achieved. Further, by using the dedicated jig 23 corresponding to the arrangement of the pair of the claw 18 and the recess 19, the cover can be easily removed, and workability such as repair can be improved. Conversely, there are three pairs of claws 18 and recesses 19 on each side, and the interval X and interval Y are different. Therefore, it is difficult to open the housing without using the special jig 23, and the internal circuit is modified. Contributes to prevention. In particular, it is prohibited by law to modify wireless modules, which also contributes to compliance with laws and regulations. For example, by increasing the elasticity of the claw 18, even if one pair of the claw 18 and the concave portion 19 is removed one by one, it is fitted again while the other pair of the claw 18 and the concave portion 19 is removed. If this is the case, it is difficult to remove all the pairs of the claws 18 and the recesses 19 without using the dedicated jig 23, and it becomes more difficult to open the housing. Further, it is preferable to make the gap t small because it becomes difficult to remove the pair of the claw 18 and the recess 19 itself. By setting the distance t to 0.1 mm or less, it is more preferable because it becomes difficult to remove the pair of the claw 18 and the recess 19.

In the above description, the case where the pair of the claw 18 and the concave portion 19 is formed at three positions on each side surface has been described as an example. However, the structure may be arranged at three or more positions at different intervals.
Next, a wireless LAN access point according to Embodiment 3 will be described with reference to FIGS.

  FIG. 5 is a perspective view showing a board arrangement structure of a standard wireless LAN access point according to the third embodiment, and FIG. 6 is a cross-sectional view showing a board arrangement structure of the original standard wireless LAN access point according to the third embodiment. It is sectional drawing of the part corresponded to XX 'of FIG.

  In the wireless LAN access point of the first embodiment or the second embodiment, as shown in FIG. 5, the front cover 14 (see FIG. 1) is installed on the inner bottom surface of the lower cover 4 in the front stage. Four front substrate mounting pins 25 for fixing the substrate are formed, and four rear substrate mounting pins 27 for fixing the standard substrate 1 are formed in the subsequent stage. A step 28 and a step 29 are respectively formed on the front substrate mounting pin 25 and the rear substrate mounting pin 27, and the substrate is mounted on the step 28 and the step 29. A hole 26 is formed in the standard substrate 1 and the original substrate 21 (see FIG. 2). By inserting the front substrate mounting pin 25 or the rear substrate mounting pin 27 into the hole 26, the step 28 or the step In this structure, a substrate is placed on the substrate 29. In the case of a wireless LAN access point of the standard power supply standard, only the standard board 1 is arranged so that the external terminals of the standard board 1 are exposed from the front cover 14 (see FIG. 1). 25 is inserted into the hole 26 of the standard substrate 1, and the standard substrate 1 is placed using the front substrate placement pins 25.

  In the case of a wireless LAN access point of an original power supply standard, as shown in FIG. 6, the original board 21 is arranged at the front stage and the standard board 1 is arranged at the rear stage. In other words, the front substrate mounting pin 25 is inserted into the hole 26 of the original substrate 21, the original substrate 21 is held by the step 28, and the rear substrate mounting pin 27 is inserted into the hole 26 of the standard substrate 1. The standard substrate 1 is held and arranged at the step 29.

  The feature of this embodiment is that the height H from the inner bottom surface of the lower cover 4 to the step 29 is higher than the height h from the inner bottom surface of the lower cover 4 to the step 28. 5 and 6 show a configuration in which holes 26 are provided in four corners of the standard substrate 1 and the original substrate 21 and each substrate is held by four pins. The number of the rear substrate mounting pins 27 is arbitrary, and it may be provided in a number and position where the substrate can be held. The positional relationship between the holes 26 of the standard substrate 1 and all the unique substrates 21, the relative arrangement of the front substrate placement pins 25, and the relative arrangement of the rear substrate placement pins 27 are matched. Further, when the outer peripheral shapes of all the unique substrates 21 are matched, selection and arrangement of the unique substrates 21 are facilitated.

  According to the present embodiment, it is possible to easily manufacture a versatile product, while reducing the size and weight, and by making the height of the step 28 and the step 29 different, Since the original substrate 21 and the subsequent standard substrate 1 can be arranged with steps, the standard substrate 1 can be arranged easily, the arrangement interval between the original substrate 21 and the standard substrate 1 can be reduced, and the size can be further reduced. Is feasible. For example, the size of the entire wireless LAN access point can be reduced by contacting the unique substrate 21 and the standard substrate 1. In particular, by making the difference in height between the step 28 and the step 29 larger than the thickness of the unique substrate 21, the unique substrate 21 and the standard substrate 1 can be arranged in an overlapping manner, and the size can be further reduced. it can.

  Here, when comparing the standard substrate 1 and the unique substrate 21, the standard substrate 1 has a larger amount of heat generation because the functional circuit such as the wireless module 6 or the CPU 9 is mounted. In the case of a standard wireless LAN access point, there is a space for heat dissipation because only the standard substrate 1 is arranged in the housing, but in the case of a proprietary wireless LAN access point, the standard substrate 1 and the unique substrate 21 are arranged, the space in the housing is reduced and the thermal efficiency is lowered. Even in this case, in the wireless LAN access point of the present embodiment, even in the case of the original standard, the step 29 can secure a space under the standard board 1 where the heat generation amount is large, so that the heat dissipation efficiency can be improved. it can. In particular, as will be described later, when it is placed vertically, the heat efficiency is reduced because heat is not radiated from the top, but air can circulate in the space and heat is easily released from the heat radiating holes in the lateral direction. improves. Furthermore, it is preferable to install a heat sink under the standard substrate 1 because the heat dissipation efficiency is further improved.

  In addition to the front substrate placement pin 25, a unique substrate placement pin dedicated to the unique substrate 21 can be provided in the previous stage. Also, a step is provided on the unique substrate mounting pin. In this case, the standard wireless LAN access point places the standard substrate 1 on the front substrate placement pin 25, and the standard wireless LAN access point places the unique substrate 21 on the unique substrate placement pin. The standard substrate 1 is placed on the rear substrate placement pins 27. At this time, the step of the unique substrate mounting pin is made lower than the step 29 of the rear substrate mounting pin 27, and the height of the step 28 in the front substrate mounting pin 25 is set to the step 29 of the rear substrate mounting pin 27. Or at least higher than the step of the original substrate mounting pin. As a result, even in a standard wireless LAN access point, a space can be provided below the standard board 1 and heat dissipation can be further improved.

Further, since the unique substrate 21 can be placed with a dedicated unique substrate placement pin, the placement of the unique substrate placement pin can be matched to the unique substrate 21, and the unique substrate 21 can be arranged regardless of the size of the standard substrate 1. Therefore, the wireless LAN access point can be further reduced in size.
Next, a wireless LAN access point in the fourth embodiment will be described with reference to FIGS.

  7A and 7B are diagrams showing the structure of the heat radiation hole of the wireless LAN access point according to the fourth embodiment. FIG. 7A is a plan view, and FIG. 7B is a cross-sectional view taken along line YY ′ in FIG. It is. 8A and 8B are diagrams showing a waterproof structure of a wireless LAN access point according to the fourth embodiment. FIG. 8A is a plan view, and FIG. 8B is a cross-sectional view taken along the line ZZ ′ of FIG. .

  Wireless LAN access points are used in various usage forms. For example, the LED may be placed flat so that the external terminal is exposed sideways with the LED facing upward, or used vertically on a wall or the like so that the external terminal is exposed downward.

  In the wireless LAN access point according to the first to third embodiments, the fourth embodiment is provided with a heat radiation hole formed in the housing and used for heat radiation in order to improve the drip-proof property particularly when used vertically. It is characterized by being formed downward when placed vertically.

  As shown in FIGS. 7 and 8, the upper cover 5 and the lower cover 4 are formed with a plurality of concave heat radiating portions 31 and a plurality of heat radiating windows 32 having openings inside the heat radiating portions 31. The heat radiating window 32 is for releasing the heat inside the housing to the outside. The heat radiating window 32 is formed inside the concave heat radiating portion 31 to ensure a certain degree of drip-proof property. In the present embodiment, an inclination is provided on the upper surface of the recess of the heat radiating portion 31, and the heat radiating window 32 is opened downward by opening the inclined upper surface.

  In the present embodiment, a versatile product can be easily manufactured, and the size and weight can be reduced. In addition, the heat radiation window 32 is formed downward so that the external terminals are exposed. The drip-proof property when placed can be improved.

  Further, a screw fixing hole, a jig installing hole 34 and the like are formed in the lower cover 4 for use over the wall. In order to prevent moisture from entering through the hole 34 when placed vertically, a convex waterproof structure 33 can be provided above the hole 34 when the direction in which the external terminal is exposed is downward. By forming the waterproof structure 33, the moisture flowing along the lower cover 4 flows out of the hole 34 along the waterproof structure 33. Therefore, the moisture is prevented from entering the hole 34 and the drip-proof property is improved. Can do. The end of the waterproof structure 33 is preferably formed along the outer periphery of the hole 34 and downward so that moisture easily flows on the side part outside the hole 34.

DESCRIPTION OF SYMBOLS 1 Standard board | substrate 2 Original LAN terminal 4 Lower cover 5 Upper cover 14 Front cover 21 Original board 22 Standard LAN terminal 25 Front board mounting pin 27 Rear board mounting pin

Claims (10)

A housing composed of an upper cover and a lower cover;
A standard board placed in the housing;
A unique board that is arranged when necessary according to the standard,
A first LAN terminal formed on the standard substrate and corresponding to an arbitrary first power supply standard;
A wireless module that is formed on the standard substrate and transmits and receives wireless LAN radio waves;
A CPU that is formed on the standard substrate and controls the operation of the standard substrate, prepares one or a plurality of the unique substrates in advance, and each of the unique substrates differs from the first power supply standard by any second A second LAN terminal corresponding to the power supply standard is formed, and in the case of the first power supply standard, only the standard board is disposed in the casing, and the first LAN terminal is exposed from the casing. to become the external terminals, the second of the second LAN terminal with the unique substrate corresponding to said standard substrate and selected the second power supply standard is arranged in the housing in the case of a power supply standard Only the wireless LAN access point is exposed from the housing and becomes an external terminal, and the second LAN terminal is electrically connected to the first LAN terminal in the housing. In the case of the first power supply standard, the standard board is a PoE original board, the first LAN terminal is a unique LAN terminal in which power pins are uniquely arranged, a DC power terminal is further provided on the standard board, and 2. The wireless LAN access point according to claim 1, wherein the first LAN terminal and the DC power supply terminal are exposed from the casing to serve as external terminals .   3. The wireless LAN according to claim 1, wherein the second LAN terminal formed on one of the unique substrates is a LAN terminal of a power supply standard compliant with the PoE standard. access point.   3. The wireless LAN access point according to claim 1, wherein one of the unique boards is an in-vehicle unique board, and the second LAN terminal includes a LAN terminal and a DC power supply terminal. . Three or more claws provided with protrusions at different intervals on one of the upper cover and the lower cover;
A concave portion formed at a position corresponding to the other claw, and by fitting the claw and the concave portion, the upper cover and the lower cover are attached, and at an interval matching the interval of the claw. The wireless LAN access point according to any one of claims 1 to 4, wherein the housing is opened by a dedicated jig having a lined blade. A plurality of front substrate mounting pins formed on the lower cover;
A plurality of rear substrate mounting pins formed at positions away from the front substrate mounting pins from the position where the external terminals of the lower cover are exposed;
A first step formed on the front substrate mounting pin;
A second step formed on the rear substrate mounting pin, and in the case of the first power supply standard, the standard substrate is mounted on the first step of the front substrate mounting pin. In the case of the second power supply standard, the unique substrate is placed on the first step of the front substrate placement pin and the second step of the rear substrate placement pin is placed on the second step. 6. The standard substrate is placed, and a height from the bottom portion of the lower cover to the second step is higher than a height from the bottom portion of the lower cover to the first step. The wireless LAN access point according to any one of the above.   The wireless communication according to claim 6, wherein a difference between a height from the bottom of the lower cover to the first step and a height from the bottom of the lower cover to the second step is larger than a thickness of the unique substrate. LAN access point. A plurality of front substrate mounting pins formed on the lower cover;
A plurality of unique substrate mounting pins formed on the lower cover;
A substrate mounting pin after multiple formed at a position wherein the external terminal is away from置用pins and the unique substrate mounting pin the front substrate mounting from a position which exposes the lower cover,
A first step formed on the front substrate mounting pin;
A second step formed on the rear substrate mounting pin;
A third step formed on the unique substrate placement pin, and in the case of the first power supply standard, the standard substrate is placed on the first step of the front substrate placement pin. In the case of the second power supply standard, the unique substrate is placed on the third step of the unique substrate mounting pin and the second step of the rear substrate placing pin is placed on the second step. The standard substrate is placed, and the height from the bottom of the lower cover to the second step and the third step is higher than the height from the bottom of the lower cover to the first step. The wireless LAN access point according to claim 1. A concave heat dissipation portion formed on the outer surface of the upper cover and the lower cover;
An inclined surface that is formed on the side surface of the concave shape opposite to the exposure direction of the external terminal and is inclined in the exposure direction of the external terminal toward the bottom of the concave shape;
The wireless LAN access point according to any one of claims 1 to 8, further comprising a heat radiating window opened in the inclined surface. A hole formed in the outer surface of the lower cover;
The wireless LAN access point according to claim 9, further comprising a waterproof structure formed in a convex shape in the vicinity of a direction opposite to an exposure direction of the external terminal of the hole on the outer surface of the lower cover.

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