JP5471388B2 - Cylinder block plating apparatus and cylinder block plating method - Google Patents

Description

  The present invention relates to a cylinder block plating apparatus and a cylinder block plating method for plating a cylinder inner peripheral surface of a cylinder block.

  Known is a cylinder block plating apparatus and a cylinder block plating method that includes an electrode disposed in a cylinder bore and causes a plating treatment liquid to flow between the electrode and the cylinder to perform plating on the inner peripheral surface of the cylinder. Yes.

  The cylinder block plating apparatus includes a seal member that seals the opening end of the cylinder bore in order to prevent the plating solution flowing between the electrode and the cylinder from leaking to the outside of the cylinder bore (for example, Patent Document 1). To 2).

JP-A-7-188990 JP 2000-96289 A

  When the cylinder bore's open end is made liquid-tight using a seal member having an opening that is approximately the same diameter as the cylinder's inner periphery, and the cylinder inner peripheral surface is plated, the cylinder bore's open end is in contact with the seal member. An electric current concentrates and the plating layer locally enlarges, so that a plating defect called “flower bloom” occurs.

  Therefore, in the plating method described in Patent Document 1, a conductive member having an opening substantially the same diameter as the inner peripheral surface of the cylinder is sandwiched between the opening end of the cylinder bore and the seal member, and the conductive member is energized together with the cylinder block. Thus, the current concentrated at the opening end of the cylinder bore is dispersed to suppress the occurrence of flowering. However, this plating method has a problem that the conductive member needs to be replaced every time the plating treatment is performed, and the productivity is lowered.

  In addition, the plating apparatus described in Patent Document 2 uses a seal member having an opening smaller in diameter than the cylinder inner peripheral surface to make the opening end of the cylinder bore liquid-tight and perform plating on the cylinder inner peripheral surface. At this time, the plating apparatus described in Patent Literature 2 applies a plating process to the inner peripheral surface of the cylinder by causing the plating solution to flow radially from the outer peripheral surface of the hollow cylindrical electrode toward the inner peripheral surface of the cylinder bore. The plating apparatus described in Patent Document 2 having such a configuration causes unevenness of the plating layer due to unevenness in the flow rate of the plating solution in the circumferential direction at the opening end of the cylinder bore where current is concentrated.

  Accordingly, the present invention proposes a cylinder block plating apparatus and a cylinder block plating method capable of suppressing flower bloom at the opening end of a cylinder bore where current is concentrated and forming a uniform plating layer.

In order to solve the above-described problems, a plating apparatus according to the present invention includes a mounting table on which a cylinder block having a cylindrical inner peripheral surface forming a cylinder bore can be mounted, and an inner periphery of the cylinder disposed in the cylinder bore. An electrode that forms an annular processing liquid channel between the surface and an opening edge on one side of the cylinder bore that has a smaller diameter than the inner circumferential surface of the cylinder, An annular seal member for reducing the area, and a plating solution supply apparatus for feeding the plating solution to the other side of the cylinder bore and causing the plating solution to flow from the other side of the processing solution flow path to the one side. The sealing member is chamfered on the cylinder bore side .

In the plating method according to the present invention, a cylinder block having a cylindrical cylinder inner peripheral surface forming a cylinder bore is mounted on a mounting table, an electrode is disposed in the cylinder bore, and the cylinder inner peripheral surface and the electrode an annular treatment liquid flow path is formed, the cylinder have a smaller diameter opening than the circumferential surface, and one side of the opening of the seal member bore is chamfered on the cylinder bore side between the Abutting against the edge, the cross-sectional area of one end of the processing liquid flow path is reduced, the plating processing liquid is flowed from the other side of the processing liquid flow path to the one side, and the electrode and the cylinder block A potential difference is applied between the two and an inner peripheral surface of the cylinder is plated.

  ADVANTAGE OF THE INVENTION According to this invention, while suppressing the flower bloom in the opening edge part of the cylinder bore where an electric current concentrates, the plating process apparatus of a cylinder block and the plating process method of a cylinder block which can form a uniform plating layer can be provided.

Sectional drawing which showed the plating processing apparatus of the cylinder block which concerns on embodiment of this invention. Sectional drawing which showed the plating processing apparatus of the cylinder block which concerns on embodiment of this invention. Sectional drawing which showed the sealing jig and electrode of the plating processing apparatus of the cylinder block which concerns on embodiment of this invention. Sectional drawing which showed the sealing state by the side of the electrically-conductive board of the plating processing apparatus of the cylinder block which concerns on embodiment of this invention. Sectional drawing which showed the sealing state by the side of the electrically-conductive board of the plating processing apparatus of the cylinder block which concerns on embodiment of this invention. Sectional drawing which showed the other example of the sealing state by the side of the electrically-conductive board of the plating processing apparatus of the cylinder block which concerns on embodiment of this invention. Sectional drawing which showed the other example of the sealing state by the side of the electrically-conductive board of the plating processing apparatus of the cylinder block which concerns on embodiment of this invention. The flowchart which showed the plating processing method of the cylinder block which concerns on embodiment of this invention. Schematic which showed the state of the flow of the plating processing liquid of the seal member vicinity in the plating processing apparatus and plating processing method of the cylinder block which concerns on embodiment of this invention. Schematic which showed the state of the flow of the plating processing liquid of the seal member vicinity in the plating processing apparatus and plating processing method of the cylinder block which concerns on embodiment of this invention. Schematic which showed the state of the flow of the plating processing liquid of the seal member vicinity in the plating processing apparatus and plating processing method of the cylinder block which concerns on embodiment of this invention. Schematic which showed the state of the flow of the plating processing liquid of the seal member vicinity in the plating processing apparatus and plating processing method of the cylinder block which concerns on embodiment of this invention. The table | surface which showed the metal-plating process condition and the metal-plating process result corresponding to this in the metal-plating processing apparatus and the metal-plating-processing method of the cylinder block which concern on embodiment of this invention.

  Embodiments of a cylinder block plating apparatus and a cylinder block plating method according to the present invention will be described below with reference to FIGS.

  1 and 2 are cross-sectional views illustrating a cylinder block plating apparatus according to an embodiment of the present invention. 1 is a diagram showing a state during the plating process of the plating apparatus 1 of the cylinder block 101 (hereinafter, simply referred to as “plating apparatus 1”). FIG. It is a figure which shows the state in the middle of preparation.

  As shown in FIGS. 1 and 2, the plating apparatus 1 includes an annular processing liquid flow path between a mounting table 3 on which a cylinder block 101 can be freely mounted and a cylinder inner peripheral surface 103 disposed in a cylinder bore 102. 4, the cylindrical electrode 6 (electrode), the sealing jig 7 provided at the free end of the cylindrical electrode 6, the upper jig 8 that sandwiches and holds the cylinder block 101 together with the mounting table 3, and the seal An air joint 9 that supplies a working fluid as a driving source for the jig 7, a processing liquid circulation device 12 (plating processing liquid supply device) that supplies a plating processing liquid 11 to the processing liquid flow path 4, a cylinder block 101 and a cylinder And a power supply device 13 that generates a potential difference with the electrode 6.

  The plating apparatus 1 is configured such that the plating block 11 and the cylindrical electrode 6 are circulated through the processing liquid flow path 4 formed by a gap between the cylinder inner peripheral surface 103 and the cylindrical electrode outer peripheral surface 6a. A potential difference is generated between them, and a plating layer is formed on the inner circumferential surface 103 of the cylinder.

  The cylinder block 101 is made of a casting made of, for example, an aluminum alloy, and is a part of a member constituting an internal combustion engine (not shown) such as a parallel multi-cylinder engine. The cylinder block 101 includes a cylindrical inner peripheral surface 103 that forms a hollow cylinder bore 102, a mating surface 105 for a cylinder head (not shown), and a mating surface 106 for a crankcase (not shown). . The cylinder block 101 is plated on the cylinder inner peripheral surface 103 by the plating apparatus 1.

  1 and 2 show the plating apparatus 1 in one cylinder bore 102 among a plurality of cylinder bores 102 included in the cylinder block 101. FIG. The plating apparatus 1 includes the same configuration in parallel for the other cylinder bores 102.

  The mounting table 3 of the plating apparatus 1 includes a lower jig 15 that supports its own weight, a thick insulating member 16 that is detachably disposed on the upper surface of the lower jig 15, and an upper surface of the insulating member 16. A thick plate-like conductive plate 17 provided, a cylindrical seal cradle 18 penetrating the insulating member 16, and an annular seal member 21 provided on the top of the seal cradle 18 are provided.

  The lower jig 15 includes a lower jig collection hole 23 having substantially the same diameter as the cylinder inner peripheral surface 103 and includes an electrode support 24 that extends into the lower jig collection hole 23. The electrode support 24 is a hollow tube.

  The conductive plate 17 is configured by combining a plurality of stainless steel flat plates in layers, and has a smooth mounting surface 25. The cylinder block 101 is mounted on the mounting table 3 with the mating surface 105 excluding the cylinder head side opening edge of the cylinder bore 102 being in contact with the mounting surface 25. The conductive plate 17 and the cylinder block 101 are electrically connected by the mounting surface 25 and the mating surface 105 that are in contact with each other. The conductive plate 17 is configured to be movable along the center line of the cylinder bore 102 by an elevating device (not shown) such as a hydraulic cylinder. Further, the conductive plate 17 holds the seal cradle 18 and the seal member 21 so as to be sandwiched between a plurality of stainless steel flat plates combined in layers.

  The insulating member 16 is an insulator formed of, for example, silicon rubber. The insulating member 16 maintains liquid tightness between the lower jig 15 and the conductive plate 17 and electrically insulates the lower jig 15 and the cylinder block 101 from each other. Thus, the plating apparatus 1 can efficiently form the plating layer on the cylinder inner peripheral surface 103 by energizing the cylindrical electrode 6 and the cylinder block 101 via the plating treatment liquid 11 flowing in the treatment liquid flow path 4. .

  The seal cradle 18 is an insulator formed of, for example, silicon rubber, and the seal member 21 is positioned on the cylinder head side opening edge of the cylinder bore 102. Further, the hollow portion of the seal cradle 18 forms a recovery hole 27.

  The seal member 21 is an insulator formed of, for example, silicon rubber, and is provided at the free end of the seal cradle 18. Further, when the cylinder block 101 is placed on the conductive plate 17, the seal member 21 is sandwiched between the mating surface 105 and the seal cradle 18 while contacting the cylinder head side opening edge of the cylinder bore 102. The liquid tightness between 102 and the recovery hole 27 is maintained.

  The conductive plate 17, the seal cradle 18, and the seal member 21 can be attached and detached integrally from the lower jig 15. In the plating apparatus 1, first, the cylinder block 101 is disposed on the mounting surface 25 of the conductive plate 17, and then the cylinder block 101 and the conductive plate 17 are collectively mounted on the insulating member 16. 3, the cylinder block 101 is placed.

  The cylindrical electrode 6 is supported by the free end of the electrode support 24 of the lower jig 15 and protrudes upward from the collection hole 27 toward the mounting table 3. Further, the cylindrical electrode 6 is electrically connected to the power supply device 13 via the electrode support 24. Further, the cylindrical electrode 6 is disposed in the cylinder bore 102 when the cylinder block 101 is mounted on the mounting table 3, and the annular processing liquid channel is disposed between the cylindrical electrode outer peripheral surface 6 a and the cylinder inner peripheral surface 103. 4 is formed. Furthermore, the cylindrical electrode 6 has a cylindrical cylindrical electrode inner peripheral surface 6 b that forms the in-electrode processing liquid supply channel 29.

  The seal jig 7 closes the vicinity of the opening on the crankcase side of the cylinder bore 102 when the plating solution 11 is introduced into the treatment solution flow path 4. Further, the sealing jig 7 is disposed in the cylinder bore 102 together with the cylindrical electrode 6 when the cylinder block 101 is placed on the mounting table 3. Further, the seal jig 7 is provided with an expansion seal member 31 that is operated by the air supplied from the air joint 9 and maintains liquid tightness in the vicinity of the opening of the cylinder bore 102 on the crankcase side.

  The upper jig 8 is brought into contact with the mating surface 106 of the cylinder block 101 and sandwiches and holds the cylinder block 101 between the upper jig 8 and the mounting table 3. Further, the upper jig 8 is configured to be movable in a direction approaching the mounting table 3 by an elevating device (not shown) such as a hydraulic cylinder, and presses the mating surface 106 of the cylinder block 101. Further, the upper jig 8 includes a cylindrical air joint holding member 32 that slidably holds the air joint 9 along the moving direction of the upper jig 8, and the air joint 9 can be moved to the upper jig 8. A coil spring 33 that biases in the direction of the mounting table 3 while holding and adjusts the position of the air joint 9 when the air joint 9 and the sealing jig 7 are connected to each other is provided.

  The air joint 9 includes a working fluid supply path 34 that supplies air as a working fluid for operating the expansion seal member 31 to the sealing jig 7. In addition, the air joint 9 is connected to the sealing jig 7 in accordance with the operation of the upper jig 8 pressing the mating surface 106 of the cylinder block 101, and can be supplied with a working fluid.

  The processing liquid circulation device 12 includes a tank 36 that stores the plating processing liquid 11, a supply path 37 that guides the plating processing liquid 11 from the tank 36 to the mounting table 3, a pump 38 provided in the supply path 37, and the mounting table 3. A recovery path 39 for recovering the plating solution 11 from the tank 36 and a flow meter 41 provided in the recovery path 39 are provided. Further, the processing liquid circulation device 12 adjusts the operation output of the pump 38 by feedback control from the measured value of the flow meter 41 to control the flow rate of the plating processing liquid 11. Specifically, the treatment liquid circulation device 12 adjusts the operation output of the pump 38 so that the average flow velocity of the plating treatment liquid 11 in the treatment liquid flow path 4 is about 40 cm / second to about 160 cm / second. Further, the treatment liquid circulation device 12 more preferably adjusts the operation output of the pump 38 so that the average flow rate of the plating treatment liquid 11 in the treatment liquid flow path 4 is about 70 cm / second to about 130 cm / second.

  The power supply device 13 is electrically connected to the electrode support 24 and the conductive plate 17, respectively, and generates a potential difference between the cylinder block 101 and the cylindrical electrode 6. In addition, when the cylinder inner peripheral surface 103 is plated, the power supply device 13 supplies electricity so that the cylindrical electrode 6 serves as an anode and the cylinder block 101 serves as a cathode.

  With such a configuration, the plating apparatus 1 passes from the tank 36 to the treatment liquid flow path 4 through the supply path 37 of the treatment liquid circulation apparatus 12, the tube of the electrode support 24, and the in-electrode treatment liquid supply flow path 29 in order. The plating treatment liquid 11 is fed, and the gap formed between the collection hole 27 of the seal cradle 18 and the cylindrical electrode 6 from the treatment liquid flow path 4, the lower jig collection hole 23 and the electrode of the lower jig 15. The plating solution 11 is collected in the tank 36 sequentially through the gap formed between the support 24 and the collection path 39 of the treatment solution circulation device 12.

  FIG. 3 is a cross-sectional view showing a sealing jig and electrodes of a cylinder block plating apparatus according to an embodiment of the present invention.

  As shown in FIG. 3, the sealing jig 7 of the plating apparatus 1 is attached to the free end of the cylindrical electrode 6.

  The seal jig 7 includes an expansion seal member 31 that can be expanded and contracted into a storage state in which it can be inserted into the cylinder bore 102 and an expansion state in which the opening end on the crankcase side of the cylinder inner peripheral surface 103 can be liquid-tightly sealed. A lower seal plate 42 and a seal base 43 that sandwich and hold the member 31 and a bolt 44 that fixes the lower seal plate 42 and the seal base 43 to the free end of the cylindrical electrode 6 are provided.

  The expansion seal member 31 is formed in a floating ring shape using a stretchable material (for example, an elastic member such as silicon rubber or fluororubber). The inner peripheral side portion of the expansion seal member 31 has an opening 31a and includes engagement protrusions 46 formed on both sides in the vicinity of the opening 31a. The outer peripheral side portion of the expansion seal member 31 is a seal surface 31 b that can contact the cylinder inner peripheral surface 103. The outer diameter dimension of the expansion seal member 31 is set to a value slightly smaller than the inner diameter dimension of the cylinder inner peripheral surface 103 in a state where the working fluid is not supplied (contracted state).

  The lower seal plate 42 includes a lower disc portion 47 formed in a disc shape, a lower bulging portion 48 that protrudes toward the seal base 43 and is integrally formed at the center of the lower disc portion 47, and a cylindrical shape. A frustoconical bulging portion 49 integrally formed at the center of the lower disk portion 47 so as to protrude toward the electrode 6 side. The seal lower plate 42 is formed using an insulator, and insulates the seal base 43 formed using metal from the cylindrical electrode 6.

  The lower disk portion 47 has an engagement groove 52 that is recessed in a ring shape at a boundary portion with the lower bulging portion 48.

  The frustoconical bulge 49 has a recess 53 into which the free end of the cylindrical electrode 6 is fitted.

  The seal base 43 includes an upper disk part 55 formed in a disk shape and an upper bulging part 56 formed integrally in the center of the upper disk part 55.

  The upper disk portion 55 has a recess 58 in which the lower bulging portion 48 of the seal lower plate 42 is fitted, and an engagement groove 59 that is recessed in a ring shape on the outer edge of the recess 58.

  The lower seal plate 42 and the seal base 43 restrain the inner peripheral side of the expansion seal member 31 by engaging the engagement protrusion 46 with the engagement groove 52 and the engagement groove 59. Further, the lower seal plate 42 and the seal base 43 are deformed so that the expansion seal member 31 is sandwiched between the upper disc portion 55 and the lower disc portion 47 so that the outer diameter of the expansion seal member 31 into which the working fluid flows is increased. The expansion in the direction along the center line of the cylinder bore 102 of the expansion seal member 31 is restricted.

  The sealing jig 7 includes a ring member 64 that is fitted into the outer periphery of the lower bulging portion 48 of the lower seal plate 42 and is inserted inside the expansion seal member 31.

  The ring member 64 has a circumferential groove 66 continuously opened on the inner circumferential surface thereof, and a working fluid ejection hole 67 that communicates the circumferential groove 66 with the inside of the expansion seal member 31. The working fluid ejection holes 67 are opened at a plurality of locations (for example, three locations) in the circumferential direction of the ring member 64.

  Further, the sealing jig 7 has a working fluid introduction path 68 that passes through the upper bulging portion 56 of the seal base 43 and reaches the lower bulging portion 48 of the seal lower plate 42. The working fluid introduction path 68 is connected to the working fluid supply path 34 of the air joint 9 and communicates with the inside of the expansion seal member 31 via the circumferential groove 66 of the ring member 64.

  The free end of the cylindrical electrode 6 has a plurality of slit holes 69 that allow the in-electrode processing liquid supply channel 29 and the processing liquid channel 4 formed in the cylindrical electrode 6 to communicate with each other. The slit hole 69 allows the plating treatment liquid 11 supplied from the treatment liquid circulation device 12 to flow into the treatment liquid passage 4 from the in-electrode treatment liquid supply passage 29. Thereby, the plating treatment liquid 11 flows in the treatment liquid flow path 4 from the crankcase side toward the cylinder head side.

  4 and 5 are cross-sectional views showing a sealing state of the conductive plate side of the cylinder block plating apparatus according to the embodiment of the present invention.

  As shown in FIGS. 4 and 5, the seal member 21 of the plating apparatus 1 is crushed by the mating surface 105 of the cylinder block 101 to form the open end of the processing liquid flow path 4.

  The seal member 21 has an opening that is smaller in diameter than the cylinder inner peripheral surface 103, and restricts the flow path cross-sectional area of the open end of the processing liquid flow path 4. Specifically, the seal member 21 has an inner diameter that protrudes from about 0.5 mm to about 3 mm toward the processing liquid flow path 4 with respect to the cylinder inner peripheral surface 103, and the flow at the open end of the processing liquid flow path 4. Reduce the road cross-sectional area.

  Further, as shown in FIG. 5, the sealing member 21 is chamfered 71 on the cylinder bore 102 side. Specifically, the sealing member 21 is chamfered at a chamfering angle of 60 ° or less, more preferably chamfered at a chamfering angle of about 10 ° to about 45 °.

  6 and 7 are cross-sectional views showing other examples of the sealing state of the conductive plate side of the cylinder block plating apparatus according to the embodiment of the present invention.

  As shown in FIGS. 6 and 7, in the sealing member 21 </ b> A of the plating apparatus 1, the plating layer is not formed on part of the tapered surface of the opening edge of the cylinder inner peripheral surface 103 together with the mating surface 105 of the cylinder block 101. To protect.

  Next, a method for plating the cylinder inner peripheral surface 103 of the cylinder block 101 using the plating apparatus 1 will be described.

  FIG. 8 is a flowchart showing a cylinder block plating method according to an embodiment of the present invention.

  As shown in FIG. 8, the cylinder block 101 plating method (hereinafter simply referred to as “plating method”) includes a step S1 of placing the cylinder block 101 on the mounting table 3 and a cylinder bore 102 of the cylinder block 101. The cylindrical electrode 6 is disposed therein, and the process liquid flow path 4 is formed between the cylinder inner peripheral surface 103 and the cylindrical electrode 6, and the seal member 21 is applied to the cylinder head side opening edge of the cylinder bore 102. Step S3 for maintaining the liquid tightness between the mounting table 3 and the cylinder block 101 and reducing the cross-sectional area of the end of the processing liquid flow path 4 on the cylinder head side, and the crankcase of the processing liquid flow path 4 Step S4 in which the plating solution 11 is flowed from the side toward the cylinder head side, and a potential difference is generated between the cylindrical electrode 6 and the cylinder block 101, and the cylinder inner peripheral surface 103 is plated. A step S5, performing, with a.

  First, in step S <b> 1, the plating method places the mating surface 105 of the cylinder block 101 on the conductive plate 17. At this time, the cylinder block 101 and the conductive plate 17 are electrically connected. At this time, in step S3, the plating process method places the cylinder block 101 on the conductive plate 17, and simultaneously abuts and crushes the seal member 21 against the cylinder head side opening edge of the cylinder bore 102, so that the conductive plate 17 and the cylinder block 101 are crushed. Keep liquid tight between.

  Next, in step S2, the plating process method moves the conductive plate 17, the seal cradle 18 and the seal member 21 together with the cylinder block 101 along the center line of the cylinder bore 102 by an elevating device (not shown). It is placed on the insulating member 16. Accordingly, the plating method places the cylinder block 101 on the mounting table 3. At this time, in the plating method, the cylindrical electrode 6 and the sealing jig 7 are arranged in the cylinder bore 102 as the cylinder block 101 moves.

  In the plating method, the upper jig 8 is moved by an elevating device (not shown), and the cylinder block 101 is sandwiched and held between the upper jig 8 and the mounting table 3. At this time, in the plating method, the air joint 9 is moved together with the upper jig 8 and connected to the sealing jig 7. Thereafter, in the plating method, the working fluid (air) is supplied from the air joint 9 to the sealing jig 7 to expand the diameter of the expansion seal member 31 to maintain the fluid tightness in the vicinity of the opening of the cylinder bore 102 on the crankcase side. Thus, in the plating method, the processing liquid flow path 4 is formed between the cylindrical electrode outer peripheral surface 6 a and the cylinder inner peripheral surface 103.

  Next, in step S4, the plating processing method operates the pump 38 of the processing liquid circulating device 12, and sets the tank 36, the supply path 37, the in-electrode processing liquid supply path 29, the processing liquid path 4 and the recovery path 39. The plating solution 11 is circulated sequentially. In the plating method, the plating solution 11 is caused to flow from the crankcase side to the cylinder head side of the processing solution flow path 4 by this circulation flow.

  Next, in step S5, in the plating method, electricity is supplied by the power supply device 13 so that the cylindrical electrode 6 becomes an anode and the cylinder block 101 becomes a cathode.

  FIG. 9 to FIG. 12 are schematic views showing the state of the plating solution flow in the vicinity of the seal member in the cylinder block plating apparatus and plating method according to the embodiment of the present invention.

  As shown in FIGS. 9 to 12, in the plating apparatus 1 and the plating method, the plating treatment liquid 11 is caused to flow in the treatment liquid flow path 4 (solid arrow), and the opening on the cylinder head side of the cylinder inner peripheral surface 103 is opened. Circulating flow A (solid arrow A) is generated near the end. The circulating flow A is generated because the opening on the cylinder head side of the processing liquid flow path 4 is restricted by the seal member 21. By this circulating flow A, the supply amount of nickel ions to the plating treatment liquid 11 decreases in the vicinity of the portion, and the nickel ion concentration of the plating treatment solution 11 in the portion decreases. Thereby, abnormal growth (flower bloom) of the plating layer at the opening end of the cylinder bore 102 where current concentrates can be suppressed.

  FIG. 13 is a table showing the plating process conditions and the corresponding plating process result in the cylinder block plating apparatus and plating method according to the embodiment of the present invention.

  As shown in FIG. 13, the inventor sets the flow rate of the plating treatment liquid 11 flowing in the treatment liquid flow path 4 and the projecting dimension toward the treatment liquid flow path 4 with respect to the cylinder inner peripheral surface 103 of the seal member 21. The plating layer formation status by the plating apparatus 1 and the plating process method was confirmed under the plating process conditions in which the chamfering angles of the chamfers 71 of the seal member 21 were combined.

  Specifically, the flow rate of the plating treatment liquid 11 is set to 40 cm / second, 70 cm / second, 100 cm / second, 130 cm / second, and 160 cm / second, and the protruding dimension of the seal member 21 is 3.0 mm, 2.5 mm, Set to 2.0 mm, 1.5 mm, 1.0 mm, 0.5 mm and 0 mm, and set the chamfer angle of chamfer 71 to 0 °, 10 °, 15 °, 30 °, 45 °, 60 ° and 75 °. The cylinder block 101 was plated using the plating apparatus 1. The evaluation of the result is that the plating layer does not have unevenness or flower bloom is the best, the one that has occurred is bad, and the unevenness or flower bloom has occurred but there is no problem in the quality of the cylinder bore 102. Evaluated as good.

  First, the results when the projecting dimension of the seal member 21 is changed will be described.

  In order to improve the deposition efficiency of the plating layer, the distance between the outer peripheral surface of the cylindrical electrode 6 and the cylinder inner peripheral surface 103 should be close to the extent that it does not contact. In the plating apparatus 1, the distance between the cylindrical electrode outer peripheral surface 6a and the cylinder inner peripheral surface 103 was set to about 5 mm. Since the seal member 21 cannot be protruded into the treatment liquid flow path 4 beyond the distance between the cylindrical electrode outer peripheral surface 6a and the cylinder inner peripheral surface 103, the protruding dimension of the seal member 21 is set to about 3 mm or less.

  When the protruding dimension of the seal member 21 is 0 mm (that is, when it does not protrude), flowering occurs in the plating layer regardless of the flow rate of the plating solution 11. Therefore, the protruding dimension of the seal member 21 is preferably about 0.5 mm to about 3.0 mm. In addition, when the protrusion dimension of the sealing member 21 is about 3.0 mm, the treatment liquid flow path 4 is excessively narrowed, and the flow rate of the plating treatment liquid 11 is extremely reduced. For this reason, the protrusion dimension of the seal member 21 is better from about 0.5 mm to about 2.5 mm.

  Next, the results when the chamfer angle of the seal member 21 is changed will be described.

  When the chamfering angle of the sealing member 21 is 75 °, the plating layer blooms regardless of the protruding dimension of the sealing member 21 and the flow rate of the plating treatment liquid 11. Therefore, the chamfer angle of the seal member 21 is preferably about 0 ° (that is, when there is no chamfer) to about 60 °. However, when the chamfering angle of the seal member 21 is about 0 ° (no chamfering), a non-uniform plating layer occurs in a combination in which the protruding dimension of the seal member 21 is large and the plating solution 11 has a low flow rate. This is considered to be because the circulating flow A of the plating solution 11 is generated in a wide range. On the other hand, when the chamfering angle of the sealing member 21 is about 60 °, the combination of a small protruding dimension of the sealing member 21 and a high flow rate of the plating solution 11 tends to cause the flowering of the plating layer. This is considered due to the fact that the circulating flow A of the plating treatment liquid 11 is hardly generated. As described above, the chamfer angle of the seal member 21 is better from about 10 ° to 45 °.

  Next, the results when the flow rate of the plating treatment liquid 11 is changed will be described.

  When the flow rate of the plating solution 11 is slower than about 40 cm / sec, the supply amount of nickel ions to the plating solution 11 is insufficient, and the voltage between the cylindrical electrode 6 and the cylinder inner peripheral surface 103 is extremely increased. As a result, the cylinder inner peripheral surface 103 is burnt, or SiC particles contained in the plating solution 11 are excessively precipitated, resulting in a defective plating layer. Further, when the flow rate of the plating treatment liquid 11 is faster than about 160 cm / second, the deposited amount of SiC particles is insufficient, the plating layer becomes defective due to the occurrence of cavitation, the pressure of the plating treatment liquid 11 becomes high, and the sealing member Since the plating solution 11 leaks from the sealing portion 21 or the sealing jig 7 or the like, the flow rate of the plating solution 11 is preferably about 40 cm / second to about 160 cm / second. However, when the flow rate of the plating treatment liquid 11 is about 40 cm / sec, a combination of a large protruding dimension of the sealing member 21 and a small chamfer angle tends to cause a low supply amount of nickel ions and uneven plating layers. There is. In addition, when the flow rate of the plating solution 11 is about 160 cm / second, the combination of a small protrusion size of the seal member 21 and a large chamfer angle tends to cause the flowering of the plating layer. This is considered due to the fact that the circulating flow A of the plating treatment liquid 11 is hardly generated. From the above, the flow rate of the plating treatment liquid 11 is better from about 70 cm / second to about 130 cm / second.

  Thus, in the plating apparatus 1 and the plating method, the protruding dimension of the sealing member 21 is about 0.5 mm to about 3.0 mm, and the chamfering angle of the chamfer 71 of the sealing member 21 is 0 ° (no chamfering) to 60 °. By setting the flow rate of the plating treatment liquid 11 from about 40 cm / second to about 160 cm / second, it is possible to simultaneously suppress flowering and non-uniformity of the plating layer. Further, the plating processing apparatus 1 and the plating processing method are such that the protruding dimension of the sealing member 21 is about 0.5 mm to about 2.5 mm, the chamfering angle of the chamfer 71 of the sealing member 21 is 10 ° to 45 °, and the plating processing liquid 11 By setting the flow rate from about 70 cm / second to about 130 cm / second, it is possible to reliably suppress the flowering and non-uniformity of the plating layer at the same time.

  Therefore, according to the plating apparatus 1 and the plating method according to the present invention, it is possible to suppress flower bloom at the opening end portion of the cylinder bore 102 where current is concentrated and to form a uniform plating layer.

DESCRIPTION OF SYMBOLS 101 Cylinder block 102 Cylinder bore 103 Cylinder inner peripheral surface 105 Mating surface 106 Mating surface 1 Plating processing apparatus 3 Mounting table 4 Process liquid flow path 6 Tubular electrode 6a Tubular electrode outer peripheral surface 6b Tubular electrode inner peripheral surface 7 Seal jig 8 Upper jig 9 Air joint 11 Plating treatment liquid 12 Treatment liquid circulation device 13 Power supply device 15 Lower jig 16 Insulating member 17 Conductive plate 18 Seal receiving base 21 Seal member 23 Lower jig recovery hole 24 Electrode support base 25 Mounting surface 27 Recovery hole 29 In-electrode treatment liquid supply channel 31 Expansion seal member 31a Opening 31b Seal surface 32 Air joint holding member 33 Coil spring 34 Working fluid supply channel 36 Tank 37 Supply channel 38 Pump 39 Recovery channel 41 Flow meter 42 Seal lower plate 43 Seal base 44 Bolt 46 Engagement protrusion 47 Lower disk part 48 Lower bulge part 49 Frustum-shaped bulge 52 engaging groove 53 recess 55 upper disk portion 56 on the bulging portion 58 recess 59 engaging groove 64 the ring member 66 peripheral groove 67 working fluid jet holes 68 working fluid introduction path 69 slits 71 chamfered

Claims (13)

A mounting table on which a cylinder block having a cylindrical inner peripheral surface forming a cylinder bore can be mounted;
An electrode that is disposed in the cylinder bore and forms an annular processing liquid flow path between the cylinder inner peripheral surface;
An annular seal member that is in contact with an opening edge on one side of the cylinder bore and has an opening having a smaller diameter than the inner circumferential surface of the cylinder, and narrows the cross-sectional area of the processing liquid channel;
A plating treatment liquid supply device that feeds a plating treatment liquid to the other side of the cylinder bore and causes the plating treatment liquid to flow from the other side of the treatment liquid flow path toward the one side ;
The cylinder block plating apparatus , wherein the seal member is chamfered on the cylinder bore side . The seal member is formed from the inner peripheral surface of the cylinder toward the treatment liquid flow path by 0 . Plating apparatus for a cylinder block according to claim 1, characterized in that it has an inner diameter of 5mm or et 3 mm protruding. 2. The cylinder block plating apparatus according to claim 1 , wherein the sealing member is chamfered at a chamfering angle greater than 0 ° and not more than 60 °. The sealing member, the plating apparatus of a cylinder block according to claim 1, characterized in that it is chamfered in the chamfer angle of 1 0 ° or et 4 5 °. Plating apparatus for a cylinder block according to any one of claims 1 to 4, wherein the average flow velocity of the plating treatment liquid in the treatment liquid flow channel is 4 0 cm / sec or al 1 60cm / sec . Plating apparatus for a cylinder block according to any one of claims 1 to 4, wherein the average flow velocity of the plating treatment liquid in the treatment liquid flow path is 7 0 cm / sec or al 1 30 cm / sec . A cylinder block having a cylindrical cylinder inner peripheral surface forming a cylinder bore is placed on a mounting table,
An electrode is disposed in the cylinder bore, and an annular treatment liquid flow path is formed between the cylinder inner peripheral surface and the electrode,
It has a smaller diameter opening than that of the cylinder inner peripheral surface, and contact with the sealing member is chamfered on the cylinder bore side on one side of the opening edge of the cylinder bore of one side of the treatment liquid flow path Squeeze the cross-sectional area of the end,
Flowing the plating treatment liquid from the other side of the treatment liquid flow path toward one side,
A method of plating a cylinder block, wherein a potential difference is generated between the electrode and the cylinder block, and the inner peripheral surface of the cylinder is plated. The seal member is formed from the inner peripheral surface of the cylinder toward the treatment liquid flow path by 0 . Plating method of a cylinder block according to claim 7, characterized in that it has an inner diameter of 5mm or et 3 mm protruding. The seal member is formed from the inner peripheral surface of the cylinder toward the treatment liquid flow path by 0 . 5mm or et al. 2. The cylinder block plating method according to claim 7 , wherein the cylinder block has an inner diameter protruding by 5 mm. The cylinder block plating method according to claim 7 , wherein the sealing member is chamfered at a chamfering angle greater than 0 ° and not more than 60 °. The sealing member, plating method of a cylinder block according to claim 7, characterized in that it is chamfered in the chamfer angle of 1 0 ° or et 4 5 °. Plating method of a cylinder block according to any one of claims 7 to 11, characterized in that the average flow velocity of the plating treatment liquid in the treatment liquid flow channel is 4 0 cm / sec or al 1 60cm / sec . Plating method of a cylinder block according to any one of claims 7 to 11, characterized in that the average flow velocity of the plating treatment liquid in the treatment liquid flow path is 7 0 cm / sec or al 1 30 cm / sec .

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