JP5458725B2 - Coating apparatus, liquid filling method, and organic layer manufacturing method - Google Patents

Description

  The present invention relates to a coating apparatus, a liquid filling method, and an organic layer manufacturing method.

For example, in the manufacturing process of an EL element used for an EL (Electro Luminescence) panel, a liquid EL material liquid is continuously discharged from a nozzle of a coating device toward the substrate, and the nozzle and the substrate are relatively moved. Thus, a carrier transport layer having a predetermined shape is formed on a substrate (see, for example, Patent Document 1).
The EL material liquid is stored in a tank, and a supply pipe is provided from the tank to a nozzle head having a nozzle. The EL material liquid in the tank is supplied to the nozzle head by a pump or the like (see, for example, Patent Document 1). ).

JP 2002-75640 A

By the way, before applying the EL material liquid using the coating apparatus, the coating apparatus must be initially set. Specifically, since the inside of the supply pipe is initially empty, the EL material liquid needs to be sent from the tank to the supply pipe by a pump or the like, and the EL material liquid needs to be filled in the supply pipe and the nozzle head.
However, it took time to fill the entire supply pipe with the EL material liquid.
Further, when the EL material liquid is filled in the supply pipe, bubbles may be generated in the filled liquid.

  Accordingly, an object of the present invention is to reduce the time for filling a supply pipe with a liquid such as an EL material liquid, and to prevent bubbles from being generated in the liquid filled in the supply pipe.

In order to solve the above-described problems, according to the present invention, a coating apparatus includes a liquid storage section in which liquid is stored, a discharge section having a nozzle hole for discharging the liquid, and the liquid storage section to the discharge section. A supply pipe that is connected to the supply pipe or the discharge section, a first pressure reduction device that is connected to the switch section and depressurizes the supply pipe, and the discharge section is on standby A drain pipe provided so that one end communicates with the nozzle hole when in position, and a second decompression device connected to the other end of the drain pipe, and the switching unit includes the discharge unit when there is in said waiting position, the switch the supply pipe to the state in which communication with the first pressure reducing device, the when the discharge unit is not in the standby position, the first pressure reducing device the supply pipe It switched to a state of being cut off from the discharge Is in the standby position, and before the liquid is filled in the supply pipe and the discharge part, the first pressure reducing device reduces the pressure in the supply pipe via the switching unit, and the second pressure reducing device The pressure in the supply pipe and the discharge section is reduced through the nozzle hole and the drain pipe .

Preferably, when the liquid is filled in the vicinity of the switching unit in the supply pipe , the switching unit is switched to a state in which the supply pipe is blocked from the first pressure reducing device.
Preferably, the coating device includes a supply device that sends the liquid in the liquid storage unit to the supply pipe, and when the discharge unit is in the standby position, the switching unit controls the supply pipe to the first pressure reduction. The supply device , the first pressure reducing device, and the second pressure reducing device are activated by switching to a state where they are communicated with the device .
Preferably, the coating device further includes a control unit that controls the feeder , the first decompression device , the second decompression device, and the switching unit, and when the discharge unit is in the standby position, A control unit causing the switching unit to communicate the supply pipe with the first pressure reducing device and operating the supply unit , the first pressure reducing device, and the second pressure reducing device ; did.
Preferably, the coating apparatus further comprises a detector for detecting that the liquid existing in the supply tube in the vicinity of the switching section, the control section, upon detecting the liquid by said detector, said switching unit The supply pipe is switched to a state where it is cut off from the first pressure reducing device.
Preferably, a plurality of the switching units are provided from the liquid storage unit to the discharge unit.

In the liquid filling method according to the present invention, while supplying the liquid from the liquid storage section to the supply pipe that is piped from the liquid storage section in which the liquid is stored to the discharge section having the nozzle holes for discharging the liquid. The pressure in the region not filled with the liquid in the supply pipe is reduced at a portion closer to the discharge part than the liquid storage part, and the liquid in the supply pipe and the discharge part is filled through the nozzle hole. It was decided to depressurize the area that was not .

In the liquid filling method according to the present invention, the liquid is delivered from the liquid reservoir to a supply pipe that is piped from a liquid reservoir where the liquid is stored to a discharge portion having a nozzle hole for discharging the liquid. while, the row of vacuum of the area where the liquid is not filled in the supply pipe at a plurality of locations of the portion of the discharge portion nearer the liquid reservoir Utotomoni, the supply pipe and the discharge through the nozzle aperture There line decompression of region where the liquid portion is not filled, in accordance with the liquid fed to the supply pipe from the liquid storing portion is gradually filled with the supply pipe to the discharge side, pressure reduction of the supply pipe The depressurization of each of the plurality of locations that are being performed is sequentially performed from the liquid storage portion side.

In the method for producing an organic layer according to the present invention, the supply pipe that is piped from a liquid storage part in which a liquid containing an organic material is stored to a discharge part having a nozzle hole for discharging the liquid is provided by a feeder. while the liquid storage portion feeding the liquid, said line decompression of region in which the liquid is not filled in the liquid storing portion and the supply pipe in the portion of the discharge portion nearer Utotomoni, the supply through the nozzle hole There line vacuum region where the liquid in the pipe and in the discharge section is not filled, after filling the liquid from the liquid reservoir to the part that the decompression stops the vacuum, the to said discharge portion When the liquid is filled, the liquid continuously discharged from the discharge unit is moved to the substrate while moving the discharge unit relative to the substrate without stopping the supply unit. It was decided to cloth.

In the method for producing an organic layer according to the present invention, the supply pipe that is piped from a liquid storage part in which a liquid containing an organic material is stored to a discharge part having a nozzle hole for discharging the liquid is provided by a feeder. while feeding the liquid from the liquid reservoir portion, the row reduced pressure of the area where the liquid is not filled in the supply pipe at a plurality of locations of the portion of the discharge portion nearer the liquid reservoir Utotomoni, the nozzle hole the have rows decompression of the region in which the liquid is not filled in the supply pipe and in the discharge portion, the liquid fed to the supply pipe from the liquid reservoir is filled with the supply pipe to the discharge side via toward Once the decompression stop of each of the plurality of locations has a reduced pressure of the supply pipe is sequentially performed from the liquid reservoir closer, filling the liquid to said discharge portion, said test Without stopping the vessel, while moving relatively the substrate the discharge portion to the substrate, the liquid was continuously discharged from the discharge portion was be applied to the substrate.

According to the present invention, it is possible to fill the supply pipe with the liquid in a short time, and it is possible to suppress the generation of bubbles in the liquid filled in the supply pipe. Also it is possible to remove water from the feed tube prior to filling of the liquid, that Ki out to prevent contamination of water into the liquid.

It is drawing which shows a coating device roughly. It is a longitudinal cross-sectional view of a nozzle head. It is sectional drawing which shows schematically the connection part of a supply pipe and an exhaust pipe. It is sectional drawing which shows schematically the connection part of a supply pipe and an exhaust pipe. It is sectional drawing which shows schematically the connection part of a supply pipe and an exhaust pipe. It is sectional drawing which shows schematically the connection part of a supply pipe and an exhaust pipe. It is sectional drawing which shows schematically the connection part of a supply pipe and an exhaust pipe. It is drawing which shows the coating device of a modification schematically. It is drawing which shows the coating device of a modification schematically. It is drawing which shows the state which connected the vacuum pump to the nozzle head. It is drawing which shows the coating device of a modification schematically. It is drawing which shows the coating device of a modification schematically. It is drawing which shows the coating device of a modification schematically. It is drawing which shows the coating device of a modification schematically. It is the flowchart which showed the flow of the process of a control part. It is drawing which shows the coating device of a modification schematically. It is a top view which shows the arrangement configuration of the pixel of an EL panel. It is a top view which shows schematic structure of EL panel. It is a circuit diagram showing a circuit corresponding to one pixel of an EL panel. It is the top view which showed 1 pixel of EL panel. It is arrow sectional drawing of the surface along the XXI-XXI line of FIG. It is sectional drawing which shows the pixel electrode exposed between the banks of EL panel. It is a front view of a mobile phone using an EL panel as a display unit. It is a perspective view of a digital camera using an EL panel as a display unit. It is a perspective view of a digital camera using an EL panel as a display unit. It is a perspective view of a personal computer using an EL panel as a display unit.

  EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated using drawing. However, although various technically preferable limitations for implementing the present invention are given to the embodiments described below, the scope of the invention is not limited to the following embodiments and illustrated examples.

[1] Configuration of Coating Device FIG. 1 is a drawing showing a coating device 100. The coating apparatus 100 includes an organic layer (for example, a hole injection layer, a light emitting layer, an electron injection layer) of an organic electroluminescence display panel which is a light emitting panel, an organic layer of an organic transistor, and an organic color forming layer of a color filter of a liquid crystal display. (For example, RGB coloring layer containing organic material, black matrix containing organic material and barrier rib material, etc.) Organic conductive layer of various electronic devices (for example, conductive wiring containing organic material) Other organic layers, or in solution It is used for forming a functional layer containing a material in which an inorganic material such as metal fine particles is dispersed or dissolved.

  The work table 101 is mounted on the moving device 102 and is slidable in a straight line along the horizontal plane with respect to the moving device 102. A substrate 121 is placed on the work table 101. The moving direction of the work table 101 is referred to as a sub-scanning direction.

  The moving device 102 moves the work table 101 and the substrate 121 placed thereon in a straight line. For example, the moving device 102 includes a rail that guides the work table 101 and a drive mechanism that drives the work table 101 along the rail. The moving device 102 is controlled by the control unit 119. The control unit 119 drives the moving device 102 intermittently, and the moving device 102 moves the work table 101 and the substrate 121 intermittently. That is, the moving device 102 operates to repeat the movement of the work table 101 and the substrate 121 and the stop of the movement under the control of the control unit 119.

  Above the work table 101, a rail 103 is provided as a guide. The rail 103 is provided so as to be orthogonal to the moving direction of the work table 101 when viewed from above. The rail 103 is attached to the machine casing 104 and supported by the machine casing 104.

A carriage 105 as a nozzle moving mechanism is mounted on the rail 103. The carriage 105 is guided along the rail 103. The carriage 105 is provided so as to be movable along the rail 103. Hereinafter, the moving direction of the carriage 105 is referred to as a main scanning direction.
The carriage 105 incorporates a drive source such as a motor, and the carriage 105 moves along the rail 103 by the drive source. The carriage 105 is controlled by the control unit 119. The control unit 119 drives the carriage 105 in accordance with the intermittent stop of the moving device 102, and the carriage 105 moves in the main scanning direction while the moving device 102 is stopped.

  A nozzle head (ejection unit) 106 is mounted on the carriage 105. The nozzle head 106 is mounted on the carriage 105 with the tip thereof facing downward. FIG. 2 is a cross-sectional view of the nozzle head 106. As shown in FIG. 2, in the nozzle head 106, a supply pipe 107 is connected to an inlet 162 provided at the upper end of a substantially cylindrical nozzle head main body 161. A bottom surface 165 is provided at the lower end of the nozzle head main body 161, and an opening 166 is formed at the center of the bottom surface 165. A nozzle plate 167 is disposed in the lower part of the hollow 163, and the opening 166 is closed by the nozzle plate 167. A minute nozzle hole (nozzle) 168 is formed in the center of the nozzle plate 167. The diameter of the nozzle hole 168 is 10 to 20 μm. The liquid 120 is discharged from the nozzle hole 168. A filter 164 is disposed in the hollow 163 of the nozzle head main body 161. The hollow 163 of the nozzle head main body 161 is partitioned by the filter 164 into a region on the inlet 162 side and a region on the nozzle hole 168 side.

  As shown in FIG. 1, a supply pipe 107 is piped from a nozzle head 106 to a liquid tank 108, one end of the supply pipe 107 is connected to the nozzle head 106, and the other end of the supply pipe 107 is connected to the liquid tank 108. ing. As the supply pipe 107, a tube made of a material resistant to the liquid 120 stored in the liquid tank 108 is used. Specifically, the supply pipe 107 is a tube made of silicone resin. The inner diameter of the supply pipe 107 is 1 to 7 mm. The inner diameter of the supply pipe 107 may be uniform from the liquid tank 108 to the nozzle head 106 or may be non-uniform. For example, the inner diameter of the supply pipe 107 is large near the liquid tank 108 and small near the nozzle head 106.

  A liquid 120 is stored in a liquid tank 108 as a liquid storage unit. The liquid 120 includes, for example, an organic material. The liquid 120 is appropriately selected according to the application of the coating apparatus 100.

  The liquid tank 108 is provided with a supply device 116. The supplier 116 sends out the liquid 120 in the liquid tank 108 to the supply pipe 107. More preferably, the supply unit 116 supplies the liquid 120 to the supply pipe 107 in a state where the pressure of the liquid 120 to be sent out is kept constant. The supply device 116 is a pump, specifically, a piston-type pump or a gas-type pump. The piston-type pressure feed pump has a movable piston housed in a syringe-like liquid tank 108, and the movable piston is pushed by a driving source such as a motor, an air cylinder, or a solenoid, so that the liquid 120 in the liquid tank 108 is discharged. It pushes out to the supply pipe 107. The gas pressure pump is a gas (mainly inert gas (for example, nitrogen gas)) that is fed into a sealed liquid tank 108 to pressurize the liquid surface in the liquid tank 108, and the liquid in the liquid tank 108. 120 is pushed out to the supply pipe 107. Of course, a pump other than the piston-type pump and the gas-type pump may be used for the feeder 116.

  The feeder 116 is controlled by the control unit 119. The control unit 119 drives the supply device 116 in accordance with the movement of the carriage 105, and the supply device 116 performs a supply operation while the carriage 105 is moving.

A mass flow controller 109 is provided in the middle of the supply pipe 107. The mass flow controller 109 measures the flow rate of the liquid 120 flowing through the supply pipe 107 and controls the flow rate of the liquid 120 flowing through the supply pipe 107. The flow rate measured by the mass flow controller 109 is output to the control unit 119.
Further, the control unit 119 sets a flow rate by the mass flow controller 109 (hereinafter, the set flow rate is referred to as a set flow rate). The mass flow controller 109 performs constant flow control so as to maintain the flow rate of the liquid 120 flowing through the supply pipe 107 at the set flow rate.

  Further, one end of the exhaust pipe 114 is connected to the middle part of the supply pipe 107 via a valve 110 as a switching part. The other end of the exhaust pipe 114 is connected to the inlet of the trap 112. An outlet of the trap 112 is connected to one end of the exhaust pipe 115, and the other end of the exhaust pipe 115 is connected to a vacuum pump (decompression device) 113.

The valve 110 opens and closes a connection portion between the exhaust pipe 114 and the supply pipe 107. When the valve 110 is open, the exhaust pipe 114 communicates with the supply pipe 107, and the supply pipe 107 communicates with the vacuum pump 113 via the exhaust pipes 114 and 115 and the trap 112. When the valve 110 is closed, the supply pipe 107 is disconnected from the vacuum pump 113 and the exhaust pipe 114. The valve 110 may be a mechanical valve or a manual valve.
When the valve 110 is a mechanical valve, for example, the valve 110 is a normally closed valve that is normally closed. When the pressure in the exhaust pipe 114 becomes negative, the valve 110 is opened.

  FIG. 3 is a view showing an example of a connection portion between the supply pipe 107 and the exhaust pipe 114. As shown in FIG. 3, when the valve 110 is closed, the valve body 110 f of the valve 110 closes the opening at the end of the exhaust pipe 114. When the end opening of the exhaust pipe 114 is closed by the valve body 110f, the surface 110g of the valve body 110f in the supply pipe 107 is flush with the inner surface 107a of the supply pipe 107, and the surface 110g of the valve body 110f. And no step is formed between the inner surface 107a of the supply pipe 107. When the valve 110 is opened, the valve body 110f opens or opens the end portion of the exhaust pipe 114 by rotating or sliding.

  The connecting portion between the supply pipe 107 and the exhaust pipe 114 may be as shown in FIG. A conical surface 107 b is formed on the inner surface 107 a of the supply pipe 107. The conical surface 107 b is a surface provided in a recessed state when viewed from the inside of the supply pipe 107. The conical surface 107 b is inclined with respect to the inner surface of the supply pipe 107. The outer angle formed by the conical surface 107b and the inner surface 107a of the supply pipe 107 is 90 ° or more. The end opening of the exhaust pipe 114 is connected to the top side opening of the conical surface 107b. When the valve 110 is closed, the valve body 110f of the valve 110 closes the opening at the end of the exhaust pipe 114. When the end opening of the exhaust pipe 114 is closed by the valve body 110f, the surface 110g of the valve body 110f in the supply pipe 107 is aligned with the boundary between the conical surface 107b and the exhaust pipe 114. When the valve 110 is opened, the valve body 110f opens or opens the end portion of the exhaust pipe 114 by rotating or sliding.

  The connecting portion between the supply pipe 107 and the exhaust pipe 114 may be as shown in FIG. Also in the case shown in FIG. 5, the conical surface 107 b is formed on the inner surface 107 a of the supply pipe 107 as in the case shown in FIG. 4. A protrusion 107 c is provided on the inner surface of the supply pipe 107 and facing the end opening of the exhaust pipe 114. The protrusion 107c is provided in a cone shape, and the cross-sectional shape of the protrusion 107c is a triangle. As shown in FIG. 6, the protrusion 107c may be provided in a frustum shape, and the cross-sectional shape thereof may be a trapezoid. Moreover, as shown in FIG. 7, the conical surface 107d of the protrusion 107c may be provided in parallel to the conical surface 107b.

  As shown in FIG. 1, the vacuum pump 113 is, for example, a vacuum pump or a decompression pump, and sucks the gas in the supply pipe 107 through the exhaust pipe 115, the trap 112, the exhaust pipe 114, and the valve 110, thereby supplying the supply pipe The pressure inside 107 is reduced.

  The trap 112 is, for example, a cold trap, and traps impurities such as water and volatile components contained in the liquid 120 contained in the gas sucked by the vacuum pump 113. For example, when the moisture contained in the air in the supply pipe 107 and the volatile components of the liquid 120 in the liquid tank 108 or the supply pipe 107 are vaporized into the trap 112 by suction by the vacuum pump 113, the volatilization occurs. The component is cooled by trap 112. Therefore, the volatile component is liquefied and captured by the trap 112. As a result, the moisture contained in the air in the supply pipe 107 is removed, thereby preventing the moisture from entering the liquid 120.

In FIG. 1, a valve 110 is provided between the liquid tank 108 and the mass flow controller 109.
On the other hand, as shown in FIG. 8, the valve 110 may be provided between the mass flow controller 109 and the nozzle head 106. Further, when the valve 110 is provided in the supply pipe 107, it is desirable to provide it as close to the nozzle head 106 as possible.
Further, as shown in FIG. 9, the valve 110 may be provided in the nozzle head 106.

  1, 8, and 9, the number of nozzle heads 106 mounted on the carriage 105 is one, but a plurality of nozzle heads 106 may be mounted on the carriage 105. In this case, these nozzle heads 106 are mounted on the carriage 105 in a state of being arranged along the sub-scanning direction. When a plurality of nozzle heads 106 are mounted on the carriage 105, the supply pipe 107, the liquid tank 108, the mass flow controller 109, the valve 110, the trap 112, the vacuum pump 113, and the exhaust pipes 114 and 115 It is provided for the head 106.

  Further, although the carriage 105 is moved in the main scanning direction, it may be moved in the main scanning direction and the sub scanning direction. Further, the nozzle head 106 may rotate around its center line. Although the work table 101 is moved in the sub-scanning direction by the moving device 102, it may be moved in the main scanning direction and the sub-scanning direction by the moving device 102. Further, the work table 101 may be rotated around its center by the moving device 102. That is, the nozzle head 106 may be moved relative to the work table 101 by a moving unit including both or one of the moving device 102 and the carriage 105.

  Further, although the valve 110 is an open / close valve, it may be a three-way valve. When the valve 110 is a three-way valve, the valve 110 is selected between a state in which the outlet side of the liquid tank 108 is in communication with the vacuum pump 113 side and a state in which the outlet side of the liquid tank 108 is in communication with the nozzle head 106 side. It is configured to switch automatically.

[2] Operation of Coating Apparatus and Coating Method Hereinafter, the operation of the coating apparatus 100 and the coating method using the coating apparatus 100 will be described.

[2-1] Initial operation of coating apparatus, setting process of coating apparatus, and liquid filling process First, the liquid 120 is filled in the liquid tank 108. When the liquid tank 108 is replaceable, the liquid tank 108 filled with the liquid 120 is assembled to the supply pipe 107, and the supply device 116 is assembled to the liquid tank 108. At this time, the supply pipe 107 is empty, and the liquid 120 is not filled in the supply pipe 107.

Next, the carriage 105 is moved to a predetermined standby position.
Here, as shown in FIG. 10, a sealing cap 150 is disposed at the standby position. When the carriage 105 moves to the standby position, the lower end of the nozzle head 106 is closed with the sealing cap 150. As a result, the nozzle hole 168 of the nozzle head 106 is connected to the vacuum pump 140 via the cooling trap 130. The end of the drain tube 151 is attached to the sealing cap 150. By closing the lower end of the nozzle head 106 with the sealing cap 150, the nozzle hole 168 of the nozzle head 106 communicates with the drain pipe 151. The other end of the drain pipe 151 is connected to the cooling trap 130. The cooling trap 130 and the vacuum pump 140 are connected by a drain pipe 152. The cooling trap 130 includes an outer container 131, a sealed container 132, and a refrigerant 133. A sealed container 132 is accommodated in the outer container 131. The refrigerant 133 is stored outside the sealed container 132 and inside the outer container 131. The drain pipe 151 and the drain pipe 152 penetrate the upper surface of the sealed container 132. In the sealed container 132, the end of the drain tube 152 is located higher than the end of the drain tube 151.
In addition, when the trap 112 shown in FIGS. 1, 8, and 9 is a cold trap, the trap 112 is provided in the same manner as the cold trap 130 shown in FIG.
Further, the trap 112 shown in FIGS. 1, 8, and 9 may be shared with the cooling trap 130 shown in FIG. Further, the vacuum pump 113 shown in FIGS. 1, 8, and 9 may be shared with the vacuum pump 140 shown in FIG. That is, the drain pipe 151 shown in FIG. 10 may be connected to the exhaust pipe 114 instead of being connected to the cooling trap 130.

The vacuum pump 113 and the vacuum pump 140 are operated. By operating the vacuum pump 113, the vacuum in the exhaust pipe 114 and the exhaust pipe 115 is reduced by the vacuum pump 113, and the exhaust pipe 114 and the exhaust pipe 115 become negative pressure. Therefore, when the valve 110 is a normally closed on-off valve, the valve 110 is opened. Then, the pressure in the supply pipe 107 is reduced by the vacuum pump 113.
When the valve 110 is a manual open / close valve, the valve 110 is manually opened. Then, the pressure in the supply pipe 107 is reduced by the vacuum pump 113.
When the valve 110 is a three-way valve, the valve 110 is brought into a state where the outlet side of the liquid tank 108 is communicated with the vacuum pump 113 side. Then, the pressure in the supply pipe 107 is reduced by the vacuum pump 113.

  Thereafter, the feeder 116 is operated by the control unit 119. The liquid 120 in the liquid tank 108 is sent out into the supply pipe 107. As a result, the liquid 120 is gradually filled into the supply pipe 107 from the liquid tank 108 side. At this time, since the vacuum in the supply pipe 107 is performed by the vacuum pumps 113 and 140, the liquid 120 is quickly filled. Further, since the pressure in the supply pipe 107 is reduced, it is possible to prevent bubbles from being generated in the liquid 120 filled in the supply pipe 107. Further, bubbles generated in the liquid 120 filled in the supply pipe 107 can be sucked to the vacuum pump 113 side. Thereby, bubbles can be removed. Even if a part of the liquid 120 flows to the exhaust pipe 114 side due to suction by the vacuum pump 113, the liquid 120 is captured by the trap 112, thereby preventing adverse effects on the vacuum pump 113. Can do.

  Then, when it is visually confirmed that the liquid level of the liquid 120 near the nozzle head 106 reaches the valve 110 in the supply pipe 107, the valve 110 is operated. That is, when the valve 110 is an on-off valve, the valve 110 is closed. On the other hand, when the valve 110 is a three-way valve, the valve 110 is brought into a state where the outlet side of the liquid tank 108 is communicated with the nozzle head 106 side. Thereby, the pressure reduction in the supply pipe 107 via the valve 110 is stopped. Therefore, the liquid 120 filled in the supply pipe 107 can be prevented from flowing to the vacuum pump 113 side.

Thereafter, the operation of the supply device 116 continues, and when the liquid surface in the supply pipe 107 near the nozzle head 106 reaches the nozzle head 106, the entire supply pipe 107 is filled with the liquid 120. Thereafter, the liquid 120 is supplied into the hollow 163 of the nozzle head main body 161 through the inlet 162 of the nozzle head 106, and further supplied by the control unit 119 when the liquid 120 is filled into the hollow 163 of the nozzle head main body 161. The instrument 116 is stopped.
Then, the vacuum pump 140 is stopped and the sealing cap 150 is removed from the nozzle head 106.
In addition, the supply device 116 may be shifted to a coating process described later without being stopped by the control unit 119.

As described above, the liquid 120 in the liquid tank 108 is sent out to the supply pipe 107 by the supply device 116 while the gas in the supply pipe 107 is sucked by the vacuum pump 113. The time required to fill the liquid 120 inside can be shortened.
In addition, since the inside of the supply pipe 107 is in a reduced pressure state or a vacuum, it is possible to prevent bubbles from being generated in the liquid 120 filling the supply pipe 107.
Even if bubbles are generated in the liquid 120 filled in the supply pipe 107, the bubbles can be removed because they are sucked to the vacuum pump 113 side.

[2-2] Application Operation and Application Process of Application Apparatus The application operation of the application apparatus 100 set as described above and the organic layer patterning method based on the application operation will be described.
First, the substrate 121 is placed on the work table 101.
Next, the control unit 119 operates the carriage 105, and the carriage 105 moves to the end of the movement range.
Next, the control unit 119 sets the set flow rate of the mass flow controller 109.
Next, the control unit 119 operates the supply device 116 and the carriage 105. In the setting step, if the supply device 116 is not stopped, the supply device 116 continues to operate.
When the carriage 105 operates, the carriage 105 moves in the main scanning direction. At this time, since the supply device 116 is operating, the liquid 120 in the liquid tank 108 is sent out to the nozzle head 106, and the flow rate of the liquid 120 flowing through the supply pipe 107 is controlled to a constant set flow rate by the mass flow controller 109. The Therefore, the liquid 120 is continuously discharged from the nozzle holes 168 of the nozzle head 106 during the movement of the carriage 105. Therefore, the discharged liquid 120 is applied linearly on the substrate 121, and a linear organic layer pattern along the main scanning direction is formed on the substrate 121.
Here, when the liquid 120 is filled into the supply pipe 107 or the nozzle head 106, bubbles are not generated in the liquid 120, so that the liquid 120 discharged from the nozzle hole 168 can be prevented from being interrupted. In particular, if the supply unit 116 is not stopped in the process of filling the liquid 120 in the supply pipe 107 or the nozzle head 106 and the process proceeds to this application process, the liquid 120 discharged in the application process is reliably prevented from being interrupted. can do.

When the carriage 105 moves to the opposite end of the movement range, the control unit 119 stops the carriage 105.
Next, the control unit 119 controls the moving device 102, and the work table 101 and the substrate 121 are moved by a predetermined distance in the sub-scanning direction by the moving device 102. Also at this time, the liquid 120 is continuously discharged from the nozzle holes 168 of the nozzle head 106. Therefore, a linear organic layer pattern along the sub-scanning direction is formed on the substrate 121. Thereafter, the moving device 102 stops.
Next, the control unit 119 operates the carriage 105. As a result, the carriage 105 moves in the reverse direction. Also at this time, the liquid 120 is continuously discharged from the nozzle holes 168 of the nozzle head 106. Therefore, a linear organic layer pattern along the main scanning direction is formed on the substrate 121.
When the carriage 105 moves to the opposite end of the movement range, the control unit 119 stops the carriage 105.
Next, the control unit 119 controls the moving device 102, and the work table 101 and the substrate 121 are moved by a predetermined distance in the sub-scanning direction by the moving device 102. Also at this time, the liquid 120 is continuously discharged from the nozzle holes 168 of the nozzle head 106. Therefore, a linear organic layer pattern along the main scanning direction is formed on the substrate 121.

  Thereafter, the control unit 119 repeats the above control. Therefore, the carriage 105 is repeatedly moved from end to end in the movement range while the liquid 120 is continuously ejected from the nozzle holes 168 of the nozzle head 106, and when the carriage 105 moves to the end, the moving device 102 The work table 101 and the substrate 121 are moved in the sub-scanning direction by a predetermined distance. As a result, a twisted organic layer pattern is formed on the substrate 121.

  When the liquid 120 is flowing through the supply pipe 107, the connection portion between the supply pipe 107 and the exhaust pipe 114 is configured as shown in FIGS. Yes (see arrow). Therefore, the occurrence of cavitation in the liquid 120 can be suppressed. Therefore, bubbles are unlikely to occur at the connection portion between the supply pipe 107 and the exhaust pipe 114. Therefore, the liquid 120 ejected from the nozzle hole 168 of the nozzle head 106 is not interrupted. Therefore, the liquid 120 can be continuously discharged from the nozzle hole 168.

[3] Modification 1 of coating apparatus
[3-1] Configuration FIGS. 11, 12, and 13 are drawings of modifications in which a partial configuration of the coating apparatus 100 shown in FIG. 1 is changed.
In the coating apparatus 100A, the valve 110 is an electromagnetically driven valve. Since the valve 110 is an electromagnetically driven valve, the valve 110 includes a solenoid, a motor, and other driving sources. The drive source drives the valve body 110f shown in FIGS. 3, 4, 5, 6, and 7, thereby opening and closing the valve body 110f. The operation of the valve 110 is controlled by the control unit 119. Specifically, the control unit 119 controls the drive source of the valve 110.
A detector 111 is provided in the middle of the supply pipe 107. The detector 111 is provided near the valve 110 and slightly closer to the liquid tank 108 than the valve 110. This detector 111 detects whether or not the liquid 120 exists in the supply pipe 107 in the vicinity of the valve 110. A detection result by the detector 111 is output to the control unit 119.
The operations of the vacuum pump 113 and the vacuum pump 140 are controlled by the control unit 119.
Except as described above, the coating apparatus 100A is provided in the same manner as the coating apparatus 100 shown in FIG.

In FIG. 11, the valve 110 and the detector 111 are provided between the liquid tank 108 and the mass flow controller 109.
On the other hand, as shown in FIG. 12, the valve 110 and the detector 111 may be provided between the mass flow controller 109 and the nozzle head 106.
Further, as shown in FIG. 13, a valve 110 and a detector 111 may be provided in the nozzle head 106.

[3-2] Initial Operation of Coating Apparatus, Setting Process of Coating Apparatus, and Liquid Filling Process An initial operation of the coating apparatus 100A and a setting process of the coating apparatus 100A will be described.
First, the liquid 120 is filled in the liquid tank 108. At this time, the supply pipe 107 is empty, and the liquid 120 is not filled in the supply pipe 107.
The control unit 119 controls the carriage 105, and the carriage 105 moves to a predetermined standby position. Then, as shown in FIG. 10, the lower end of the nozzle head 106 is closed by the sealing cap 150, and the nozzle hole 168 of the nozzle head 106 is connected to the vacuum pump 140 via the cooling trap 130.

  Thereafter, the vacuum pumps 113 and 140 and the feeder 116 are operated by the control unit 119. At this time, when the valve 110 is an on-off valve, the valve 110 is opened by the control of the valve 110 by the control unit 119. On the other hand, when the valve 110 is a three-way valve, the valve 110 is controlled by the control unit 119 so that the valve 110 communicates the outlet side of the liquid tank 108 to the vacuum pump 113 side.

  Since the supply device 116 is operating, the liquid 120 in the liquid tank 108 is sent out to the supply pipe 107. At this time, since the vacuum in the supply pipe 107 is performed by the vacuum pumps 113 and 140, the liquid 120 is quickly filled. It is possible to prevent bubbles from being generated in the liquid 120 filled in the supply pipe 107.

  Then, when the liquid level of the liquid 120 near the nozzle head 106 reaches the detector 111 in the supply pipe 107, the liquid 120 is detected by the detector 111. At that time, the liquid 120 is filled between the liquid tank 108 and the valve 110 in the supply pipe 107.

When the liquid 111 is detected by the detector 111, a detection signal to that effect is output to the control unit 119. The control unit 119 that has input the detection signal controls the valve 110. That is, when the valve 110 is an on-off valve, the control unit 119 controls the valve 110 to close the valve 110. On the other hand, when the valve 110 is a three-way valve, the control unit 119 controls the valve 110 so that the valve 110 communicates the outlet side of the liquid tank 108 with the nozzle head 106 side.
After that, when the operation of the supply device 116 continues and the liquid 120 is filled in the hollow 163 of the supply pipe 107 and the nozzle head main body portion 161, the supply device 116 is stopped by the control unit 119. Note that the liquid 120 may be supplied to the nozzle head 106 as it is without stopping the supply device 116, and the liquid 120 may be continuously discharged from the nozzle hole 168 of the nozzle head 106.

  Note that the coating operation of the coating apparatus 100A in the subsequent coating process is the same as the coating operation of the coating apparatus 100 shown in FIG. 1, FIG. 8, and FIG.

[4] Modification 2 of coating apparatus
[4-1] Configuration FIG. 14 is a view showing a coating apparatus 100B according to a modification.
As shown in FIG. 14, a plurality of valves 110 a and 110 b and detectors 111 a and 111 b are provided in the supply pipe 107, and a valve 110 c and a detector 111 c are provided in the nozzle head 106. The valve 110 a and the detector 111 a are provided between the liquid tank 108 and the mass flow controller 109. The valve 110 b and the detector 111 b are provided between the mass flow controller 109 and the nozzle head 106.
A valve 110 c and a detector 111 c are provided in the nozzle head 106. The valves 110a, 110b, and 110c are electromagnetic valves. These valves 110a, 110b, and 110c are controlled by the control unit 119.
The detectors 111a, 111b, and 111c detect whether or not the liquid 120 exists in the supply pipe 107 in the vicinity of the valves 110a, 110b, and 110c.

  These valves 110a, 110b, and 110c are connected to the trap 112 through the exhaust pipe 114a. Except as described above, the coating apparatus 100B shown in FIG. 14 is provided in the same manner as the coating apparatus 100 shown in FIG.

[4-2] Initial Operation of Coating Apparatus, Setting Process of Coating Apparatus, and Liquid Filling Process An initial operation of the coating apparatus 100B and a setting process of the coating apparatus 100B will be described with reference to FIG. FIG. 15 is a flowchart showing a sequence control flow of the control unit 119.

  First, the liquid 120 is filled in the liquid tank 108. At this time, the supply pipe 107 is empty, and the liquid 120 is not filled in the supply pipe 107.

  Then, the control unit 119 controls the carriage 105, and the carriage 105 moves to a predetermined standby position (step S1). Then, as shown in FIG. 10, the lower end of the nozzle head 106 is closed by the sealing cap 150, and the nozzle hole 168 of the nozzle head 106 is connected to the vacuum pump 140 via the cooling trap 130.

Next, the coating apparatus 100 is started. Next, the control unit 119 controls the valves 110a, 110b, and 110c, and the valves 110a, 110b, and 110c are opened (step S2).
Thereafter, the vacuum pumps 113 and 140 and the feeder 116 are operated by the control unit 119 (step S3).

  Since the supply device 116 is operating, the liquid 120 in the liquid tank 108 is sent out to the supply pipe 107. As a result, the liquid 120 is gradually filled into the supply pipe 107 from the liquid tank 108 side. At this time, since the vacuum pump 113 is operating, the pressure in the supply pipe 107 is reduced through the valves 110a, 110b, and 110c, so that the liquid 120 is quickly filled. When the liquid level in the supply pipe 107 near the nozzle head 106 reaches the detector 111a, the detector 111a detects the liquid 120 (step S4: Yes). At that time, the liquid 120 is filled in the supply pipe 107 between the liquid tank 108 and the valve 110a.

  When the liquid 111 is detected by the detector 111a, a detection signal to that effect is output to the control unit 119. When receiving the detection signal from the detector 111a, the control unit 119 closes the valve 110a (step S5). Thereby, the pressure reduction in the supply pipe 107 via the valve 110a is stopped.

  Thereafter, the operation of the feeder 116 and the vacuum pump 113 continues. When the liquid level in the supply pipe 107 near the nozzle head 106 reaches the detector 111b, the detector 111b detects the liquid 120 (step S6: Yes). When the liquid 111 is detected by the detector 111b, a detection signal to that effect is output to the control unit 119. When receiving the detection signal from the detector 111b, the control unit 119 closes the valve 110b (step S7). Thereby, the pressure reduction in the supply pipe 107 via the valve 110b is stopped.

  Thereafter, the operation of the feeder 116 and the vacuum pump 113 continues. When the liquid level of the liquid 120 in the supply pipe 107 close to the nozzle head 106 reaches the detector 111c, the liquid 111 is detected by the detector 111c (Step S8: Yes). When the liquid 111 is detected by the detector 111c, a detection signal to that effect is output to the control unit 119. When receiving the detection signal from the detector 111c, the control unit 119 closes the valve 110c (step S9). Thereby, the decompression in the supply pipe 107 via the valve 110c is stopped.

  Thereafter, the operation of the feeder 116 continues. When the liquid 120 is filled into the hollow 163 of the nozzle head 106, the supply unit 116 is stopped by the control unit 119. Note that the liquid 120 may be supplied to the nozzle head 106 as it is without stopping the supply device 116, and the liquid 120 may be continuously discharged from the nozzle hole 168 of the nozzle head 106.

  In the above description, the valves 110a, 110b, and 110c, the vacuum pump 113, and the feeder 116 are automatically operated by the sequence control of the control unit 119. On the other hand, an operator may manually operate the valves 110a, 110b, and 110c, the vacuum pumps 113 and 140, and the feeder 116. Further, as shown in FIG. 16, the detectors 111a, 111b, and 111c may not be provided. Hereinafter, a case where the setting of the coating apparatus 100B is manually performed will be specifically described.

The carriage 105 is moved to a predetermined standby position. As shown in FIG. 10, the nozzle hole 168 of the nozzle head 106 is connected to the vacuum pump 140 via the cooling trap 130.
Next, the liquid 120 is filled in the liquid tank 108. Next, the valves 110a, 110b, and 110c are manually opened.
Next, the vacuum pumps 113 and 140 and the feeder 116 are operated. As a result, the liquid 120 in the liquid tank 108 is sent out to the supply pipe 107, and the liquid in the supply pipe 107 is drawn by the vacuum pump 113. Thus, when it is visually confirmed that the liquid level of the liquid 120 in the supply pipe 107 close to the nozzle head 106 has reached just before the valve 110a, the valve 110a is closed.
Thereafter, when it is visually confirmed that the liquid level of the liquid 120 near the nozzle head 106 in the supply pipe 107 has reached just before the valve 110b, the valve 110b is closed.
Thereafter, when it is visually confirmed that the liquid level of the liquid 120 near the nozzle head 106 in the supply pipe 107 has reached just before the valve 110c, the valve 110c is closed.
Thereafter, the supply device 116 is continuously operated, and when the liquid 120 is filled in the hollow 163 of the nozzle head 106, the supply device 116 is stopped.

  Note that the coating operation of the coating apparatus 100B in the subsequent coating process is the same as the coating operation of the coating apparatus 100 shown in FIG. 1, FIG. 8, and FIG.

  As described above, since the valves 110a, 110b, and 110c are sequentially closed as the liquid 120 is filled into the supply pipe 107, the inside of the supply pipe 107 is immediately before the liquid 120 is supplied into the nozzle head 106. It can be a reduced pressure state or a vacuum.

[5] Configuration of Organic Electroluminescence Display Panel Manufactured Using Coating Apparatus Manufactured using coating apparatuses 100, 100A, and 100B shown in FIGS. 1, 8 to 9, 11 to 14, and 16. The EL panel 1 to be performed will be described with reference to FIGS.

  FIG. 17 is a plan view showing an arrangement configuration of a plurality of pixels P in the EL panel 1 which is a light emitting panel. FIG. 18 is a plan view showing a schematic configuration of the EL panel 1. FIG. 19 is a circuit diagram showing a circuit corresponding to one pixel of the EL panel 1 operating in the active matrix driving method. 20 is a plan view corresponding to one pixel P of the EL panel 1, and FIG. 21 is a cross-sectional view taken along the line XXI-XXI in FIG.

As shown in FIGS. 17 and 18, on the EL panel 1, a plurality of pixels P that respectively emit R (red), G (green), and B (blue) are arranged in a matrix with a predetermined pattern. .
The EL panel 1 is provided with a plurality of scanning lines 2 and a plurality of signal lines 3. These scanning lines 2 are arranged so as to be substantially parallel to each other along the row direction. These signal lines 3 are arranged so as to be substantially parallel to each other along the column direction. The scanning line 2 and the signal line 3 are substantially orthogonal to the scanning line 2 in plan view. The EL panel 1 is provided with a plurality of voltage supply lines 4. The voltage supply line 4 is provided in parallel to the scanning line 2 in plan view. The voltage supply line 4 is provided along the scanning line 2 between the adjacent scanning lines 2. The pixel P corresponds to a range surrounded by a pair of scanning lines 2 and voltage supply lines 4 and two adjacent signal lines 3. Pixels P are arranged in a matrix. Here, a plurality of pixels P that emit R (red) are arranged along the signal line 3. A plurality of pixels P that emit G (green) are also arranged along the signal line 3. A plurality of pixels P that emit B (blue) are also arranged along the signal line 3. A plurality of columns of pixels P in the direction along the scanning line 2 are arranged in the order of a pixel P that emits R (red), a pixel P that emits G (green), and a pixel P that emits B (blue). ing.

  Further, the EL panel 1 is provided with a bank 13 which is a partition wall. The bank 13 extends in a direction along the signal line 3. Predetermined carrier transport layers (a hole injection layer 8b and a light emitting layer 8c, which will be described later) are provided in a range sandwiched between the banks 13, and the range becomes a light emitting region of the pixel P. That is, the bank 13 partitions the pixel P for each color of R (red), G (green), and B (blue). The carrier transport layer is a layer that transports holes or electrons when a voltage is applied.

  As shown in FIGS. 18 and 19, for each pixel P of the EL panel 1, a switch transistor 5, which is a thin film transistor, a driving transistor 6, which is a thin film transistor, a capacitor 7, and an EL element 8 are provided.

  In each pixel P, the gate of the switch transistor 5 is connected to the scanning line 2. One of the drain and the source of the switch transistor 5 is connected to the signal line 3. The other of the drain and source of the switch transistor 5 is connected to one electrode of the capacitor 7 and the gate of the driving transistor 6. One of the source and drain of the driving transistor 6 is connected to the voltage supply line 4. The other of the source and drain of the driving transistor 6 is connected to the other electrode of the capacitor 7 and the anode of the EL element 8. Note that the cathodes of the EL elements 8 of all the pixels P are kept at a constant voltage Vcom (for example, grounded).

  In addition, each scanning line 2 is connected to a scanning driver around the EL panel 1. Each voltage supply line 4 is connected to a constant voltage source or a driver that outputs a voltage signal as appropriate. Each signal line 3 is connected to a data driver. The EL panel 1 is driven by these drivers by an active matrix driving method. The voltage supply line 4 is supplied with predetermined power by a constant voltage source or a driver.

  Next, the circuit structure of the EL panel 1 and the pixel P will be described with reference to FIGS. As shown in FIG. 20, the switch transistor 5 and the drive transistor 6 are arranged along the signal line 3. A capacitor 7 is disposed in the vicinity of the switch transistor 5. An EL element 8 is disposed in the vicinity of the drive transistor 6. Further, the switch transistor 5, the drive transistor 6, the capacitor 7, and the EL element 8 are disposed between the scanning line 2 and the voltage supply line 4.

As shown in FIG. 21, the drive transistor 6 includes a gate electrode 6a, a semiconductor film 6b, a channel protective film 6d, impurity semiconductor films 6f and 6g, a drain electrode 6h, a source electrode 6i, and the like.
The switch transistor 5 is a thin film transistor similar to the drive transistor 6 described in detail below, and includes a gate electrode 5a, a semiconductor film, a channel protective film, an impurity semiconductor film, a drain electrode 5h, a source electrode 5i, and the like. Details are omitted here.
As shown in FIGS. 20 and 21, an interlayer insulating film 11 to be a gate insulating film is formed on one surface of the substrate 10. An interlayer insulating film 12 is formed on the interlayer insulating film 11. The signal line 3 is formed between the interlayer insulating film 11 and the substrate 10. The scanning line 2 and the voltage supply line 4 are formed between the interlayer insulating film 11 and the interlayer insulating film 12.

The gate electrode 6 a is formed between the substrate 10 and the interlayer insulating film 11. The gate electrode 6a is made of, for example, a Cr film, an Al film, a Cr / Al laminated film, an AlTi alloy film, or an AlTiNd alloy film. An insulating interlayer insulating film 11 is formed on the gate electrode 6a. Gate electrode 6 a is covered with interlayer insulating film 11.
The interlayer insulating film 11 is made of, for example, silicon nitride or silicon oxide. An intrinsic semiconductor film 6b is formed on the interlayer insulating film 11 at a position corresponding to the gate electrode 6a. The semiconductor film 6b is opposed to the gate electrode 6a with the interlayer insulating film 11 interposed therebetween.
The semiconductor film 6b is made of, for example, amorphous silicon or polycrystalline silicon. A channel is formed in the semiconductor film 6b. An insulating channel protective film 6d is formed on the central portion of the semiconductor film 6b. The channel protective film 6d is made of, for example, silicon nitride or silicon oxide.
Further, an impurity semiconductor film 6f is formed on one end portion of the semiconductor film 6b so as to partially overlap the channel protective film 6d. Over the other end of the semiconductor film 6b, an impurity semiconductor film 6g is formed so as to partially overlap the channel protective film 6d. The impurity semiconductor films 6f and 6g are formed on both ends of the semiconductor film 6b so as to be separated from each other. Here, the impurity semiconductor films 6f and 6g are n-type semiconductors, but the present invention is not limited thereto, and may be p-type semiconductors.
A drain electrode 6h is formed on the impurity semiconductor film 6f. A source electrode 6i is formed on the impurity semiconductor film 6g. The drain electrode 6h and the source electrode 6i are made of, for example, a Cr film, an Al film, a Cr / Al laminated film, an AlTi alloy film, or an AlTiNd alloy film.
An insulating interlayer insulating film 12 serving as a protective film is formed on the channel protective film 6d, the drain electrode 6h, and the source electrode 6i. The channel protective film 6d, the drain electrode 6h, and the source electrode 6i are covered with the interlayer insulating film 12. The drive transistor 6 is covered with an interlayer insulating film 12. The interlayer insulating film 12 is made of, for example, silicon nitride or silicon oxide having a thickness of 100 nm to 200 nm.

  The capacitor 7 is connected between the gate electrode 6 a and the source electrode 6 i of the driving transistor 6. As shown in FIG. 21, one electrode 7 a of the capacitor 7 is formed between the substrate 10 and the interlayer insulating film 11. The other electrode 7 b of the capacitor 7 is formed between the interlayer insulating film 11 and the interlayer insulating film 12. The electrodes 7a and 7b are opposed to each other with the interlayer insulating film 11 that is a dielectric interposed therebetween. Thereby, the capacitor 7 is configured.

The signal line 3, the electrode 7a of the capacitor 7, the gate electrode 5a of the switch transistor 5, and the gate electrode 6a of the driving transistor 6 are formed by processing the conductive film formed on the entire surface of the substrate 10 by a photolithography method, an etching method, or the like. It is formed in a lump.
The scanning line 2, the voltage supply line 4, the electrode 7 b of the capacitor 7, the drain electrode 5 h and source electrode 5 i of the switch transistor 5, and the drain electrode 6 h and source electrode 6 i of the driving transistor 6 are formed on the interlayer insulating film 11. The formed conductive film is formed by shape processing by a photolithography method, an etching method, or the like.

In the interlayer insulating film 11, a contact hole 11a is formed in a region where the gate electrode 5a and the scanning line 2 overlap. A contact hole 11b is formed in a region where the drain electrode 5h and the signal line 3 overlap. A contact hole 11c is formed in a region where the gate electrode 6a and the source electrode 5i overlap. Contact plugs 20a to 20c are embedded in the contact holes 11a to 11c, respectively. The gate electrode 5a of the switch transistor 5 and the scanning line 2 are electrically connected by the contact plug 20a. The contact plug 20b electrically connects the drain electrode 5h of the switch transistor 5 and the signal line 3. The contact plug 20c electrically connects the source electrode 5i of the switch transistor 5 and the electrode 7a of the capacitor 7, and electrically connects the source electrode 5i of the switch transistor 5 and the gate electrode 6a of the drive transistor 6. The scanning line 2 may be in direct contact with the gate electrode 5a, the drain electrode 5h may be in contact with the signal line 3, and the source electrode 5i may be in contact with the gate electrode 6a without using the contact plugs 20a to 20c.
The gate electrode 6 a of the driving transistor 6 is integrally connected to the electrode 7 a of the capacitor 7. A drain electrode 6 h of the drive transistor 6 is integrally connected to the voltage supply line 4. A source electrode 6 i of the driving transistor 6 is integrally connected to an electrode 7 b of the capacitor 7.

The pixel electrode 8 a is provided on the substrate 10 via the interlayer insulating film 11. The pixel electrode 8a is formed independently for each pixel P. The pixel electrode 8a is a transparent electrode, for example, tin-doped indium oxide (ITO), zinc-doped indium oxide, indium oxide (In ₂ O ₃ ), tin oxide (SnO ₂ ), zinc oxide (ZnO), or cadmium − It consists of tin oxide (CTO). The pixel electrode 8a partially overlaps the source electrode 6i of the drive transistor 6, and the pixel electrode 8a and the source electrode 6i are connected.
20 and 21, the interlayer insulating film 12 includes the scanning line 2, the signal line 3, the voltage supply line 4, the switch transistor 5, the driving transistor 6, the peripheral portion of the pixel electrode 8a, and the electrode of the capacitor 7. 7b and the interlayer insulating film 11 are formed.
An opening 12a is formed in the interlayer insulating film 12 so that the center of each pixel electrode 8a is exposed. The interlayer insulating film 12 is formed in a lattice shape in plan view.

As shown in FIGS. 20 and 21, the bank 13 extends in the direction along the signal line 3 and is provided in parallel to each other. Therefore, these banks 13 are striped. The bank 13 is formed at a position covering the switch transistor 5 and the drive transistor 6 with the interlayer insulating film 12 interposed therebetween. The side wall 13 a of the bank 13 is located inside the opening 12 a of the interlayer insulating film 12. Further, between the adjacent banks 13, the center side of the pixel electrode 8 a is exposed. A plurality of pixel electrodes 8 a between adjacent banks 13 are arranged along the banks 13.
In the bank 13, when a hole injection layer 8b or a light emitting layer 8c described later is formed by a wet method, a liquid material in which a material for forming the hole injection layer 8b or the light emitting layer 8c is dissolved or dispersed in a solvent is adjacent. It functions as a partition wall that prevents the pixel P from bleeding.

  As shown in FIGS. 20 and 21, the EL element 8 includes a pixel electrode 8a as a first electrode serving as an anode, a hole injection layer 8b that is a compound film formed on the pixel electrode 8a, and a hole. A light emitting layer 8c, which is a compound film formed on the injection layer 8b, and a counter electrode 8d as a second electrode formed on the light emitting layer 8c are provided. The counter electrode 8d is a single electrode common to all the pixels P, and is continuously formed in all the pixels P.

The hole injection layer 8b is a carrier transport layer made of, for example, PEDOT (poly (ethylenedioxy) thiophene) that is a conductive polymer and PSS (polystyrene sulfonate) that is a dopant. The hole injection layer 8b is a layer that injects holes from the pixel electrode 8a toward the light emitting layer 8c.
The light emitting layer 8c includes a material that emits one of R (red), G (green), and B (blue) for each pixel P. The light emitting layer 8c is a carrier transport layer made of, for example, a polyfluorene light emitting material or a polyphenylene vinylene light emitting material. The light emitting layer 8c is a layer that emits light in association with recombination of electrons supplied from the counter electrode 8d and holes injected from the hole injection layer 8b. For this reason, the pixel P that emits R (red), the pixel P that emits G (green), and the pixel P that emits B (blue) have different light emitting materials for the light emitting layer 8c. The R (red), G (green), and B (blue) pattern of the pixel P is a stripe pattern in which the same color pixels are arranged in the vertical direction.

The counter electrode 8d is formed of a material having a work function lower than that of the pixel electrode 8a. The counter electrode 8d is made of, for example, a simple substance or an alloy containing at least one of indium, magnesium, calcium, lithium, barium, and a rare earth metal.
The counter electrode 8d is an electrode common to all the pixels P, and covers the bank 13 together with the compound film such as the light emitting layer 8c.

Further, the hole injection layer 8 b and the light emitting layer 8 c are provided in a band shape in the direction along the bank 13 between the adjacent banks 13, and are provided continuously in the direction along the bank 13. Therefore, the hole injection layer 8 b and the light emitting layer 8 c are not divided for each pixel P in the direction along the bank 13. That is, the hole injection layer 8 b and the light emitting layer 8 c are provided in common to the plurality of pixel electrodes 8 a arranged between the adjacent banks 13. On the other hand, the hole injection layer 8 b and the light emitting layer 8 c are partitioned by the bank 13 in the direction orthogonal to the bank 13.
A hole injection layer 8b and a light emitting layer 8c as a carrier transport layer are stacked on the pixel electrode 8a between the sidewalls 13a of the bank 13 in the opening 12a of the interlayer insulating film 12 (see FIG. 21). . That is, when a voltage is applied between the pixel electrode 8a and the counter electrode 8d, the hole injection layer 8b and the light emitting layer 8c function as a carrier transport layer in a portion overlapping the pixel electrode 8a, and light emission occurs in the light emitting layer 8c in that portion. To do.
Specifically, the sidewall 13 a of the bank 13 provided on the interlayer insulating film 12 is formed inside the opening 12 a of the interlayer insulating film 12.
Then, a liquid material containing a material to be the hole injection layer 8b is applied on the pixel electrode 8a surrounded by the opening 12a and sandwiched between the side walls 13a, and the substrate 10 is heated to dry the liquid material. The compound film thus formed becomes the hole injection layer 8b which is the first carrier transport layer.
Further, a liquid material containing a material to be the light emitting layer 8c is applied on the hole injection layer 8b surrounded by the opening 12a and sandwiched by the side walls 13a, and the substrate 10 is heated to dry the liquid material. The compound film thus formed becomes the light emitting layer 8c which is the second carrier transport layer.
A counter electrode 8d is provided so as to cover the light emitting layer 8c and the bank 13 (see FIG. 21).

In this EL panel 1, the pixel electrode 8a, the substrate 10 and the interlayer insulating film 11 are transparent, and the light emitted from the light emitting layer 8c is transmitted through the pixel electrode 8a, the interlayer insulating film 11 and the substrate 10 and emitted. . Therefore, the back surface of the substrate 10 becomes a display surface.
The display surface may be the opposite side instead of the substrate 10 side. In this case, the counter electrode 8d is a transparent electrode, the pixel electrode 8a is a reflective electrode, and light emitted from the light emitting layer 8c is transmitted through the counter electrode 8d and emitted.

  In the EL panel 1 shown in FIG. 17, a region where a plurality of pixels P are arranged in a grid shape between the banks 13 arranged side by side on the center side of one surface of the substrate 10 is a light emission as a first region. The region that is the region R1 and surrounds the light emitting region R1 is a non-light emitting region R2 as a second region.

The EL panel 1 is driven as follows to emit light.
In a state where a predetermined level of voltage is applied to all the voltage supply lines 4, the scanning driver sequentially applies voltages to the scanning lines 2, thereby sequentially selecting the scanning lines 2.
When each scanning line 2 is selected, a voltage of a level corresponding to the gradation is applied to all the signal lines 3 by the data driver. Then, since the switch transistor 5 corresponding to the selected scanning line 2 is turned on, a voltage having a level corresponding to the gradation is applied to the gate electrode 6a of the drive transistor 6.
The potential difference between the gate electrode 6a and the source electrode 6i of the drive transistor 6 is determined according to the voltage applied to the gate electrode 6a of the drive transistor 6, and the magnitude of the drain-source current in the drive transistor 6 is determined. The EL element 8 emits light with brightness according to the drain-source current.
Thereafter, when the selection of the scanning line 2 is released, the switch transistor 5 is turned off. Therefore, the electric charge according to the voltage applied to the gate electrode 6a of the drive transistor 6 is stored in the capacitor 7, and the potential difference between the gate electrode 6a and the source electrode 6i of the drive transistor 6 is maintained. For this reason, the drive transistor 6 keeps flowing the drain-source current having the same current value as that at the time of selection, and maintains the luminance of the EL element 8.

[6] Method for Manufacturing Organic Electroluminescence Display Panel Using Coating Device Next, a method for manufacturing the EL panel 1 will be described.

[6-1] Step Before Using Coating Device First, a gate metal layer is deposited on the substrate 10 by sputtering. Then, the gate metal layer is patterned by photolithography and etching. Thus, the signal line 3, the electrode 7a of the capacitor 7, the gate electrode 5a of the switch transistor 5 and the gate electrode 6a of the drive transistor 6 are formed from the gate metal layer.
Next, an interlayer insulating film 11 to be a gate insulating film such as silicon nitride is deposited by plasma CVD. A contact hole (not shown) opened on the external connection terminal (for example, the end of the scanning line 2) of each scanning line 2 for connecting to a scanning driver located on one side of the EL panel 1 is formed in the interlayer insulating film 11. Form.
Next, a semiconductor layer such as amorphous silicon to be the semiconductor film 6b (5b) and an insulating layer such as silicon nitride to be the channel protective film 6d (5d) are successively deposited. Thereafter, the insulating layer is patterned by photolithography and etching. Thereby, a channel protective film 6d (5d) is formed from the insulating film.
Thereafter, an impurity layer to be the impurity semiconductor films 6f and 6g (5f and 5g) is deposited, and then the impurity layer and the semiconductor layer are successively patterned by photolithography and etching. Thereby, impurity semiconductor films 6f and 6g (5f and 5g) are formed from the impurity layer, and a semiconductor film 6b (5b) is formed from the semiconductor layer.
Then, contact holes 11a to 11c are formed by photolithography and etching. Next, contact plugs 20a to 20c are formed in the contact holes 11a to 11c. This step may be omitted.
A source / drain metal layer to be the drain electrode 5h and source electrode 5i of the switch transistor 5 and the drain electrode 6h and source electrode 6i of the driving transistor 6 is deposited, and the source / drain metal layer is patterned. Thus, the scanning line 2, the voltage supply line 4, the electrode 7b of the capacitor 7, the drain electrode 5h of the switch transistor 5, the source electrode 5i, the drain electrode 6h of the driving transistor 6, and the source electrode 6i are formed from the source / drain metal layer. To do. Thus, the switch transistor 5 and the drive transistor 6 are formed. Then, after depositing an ITO film, the ITO film is patterned to form a pixel electrode 8a from the ITO film.

  Then, an insulating film is formed by vapor deposition so as to cover the switch transistor 5, the drive transistor 6, and the like. Thereafter, the insulating film is patterned by photolithography and etching. Thus, a plurality of openings 12a are formed in the insulating film, and the interlayer insulating film 12 is formed. The opening 12a is formed at the center of each pixel electrode 8a, and the center of the pixel electrode 8a is exposed in each opening 12a. In addition to these openings 12a, the external connection terminals of the scanning lines 2 (not shown) and the external connection terminals of the signal lines 3 for connection to the data driver located on one side of the EL panel 1 (for example, the end portions of the signal lines 3) And a plurality of contact holes opened on the external connection terminals of the voltage supply line 4 (for example, end portions of the voltage supply line 4).

  Next, after depositing a photosensitive resin such as polyimide, the photosensitive resin is exposed to form striped banks 13 parallel to each other. At this time, the bank 13 is formed so that the side wall 13a of the bank 13 is positioned on the pixel electrode 8a. The bank 13 exposes a contact hole (not shown) that opens the external connection terminal.

  Through the above steps, each pixel electrode 8a is exposed in each opening 12a of the interlayer insulating film 12, as shown in FIG. A plurality of pixel electrodes 8 a are exposed in the recesses between the striped banks 13, and the pixel electrodes 8 a are arranged along the banks 13.

[6-2] Coating Step As described in [2-1], [3-2], and [4-2] above, four coating apparatuses 100, coating apparatuses 100A, or coating apparatuses 100B are set. At this time, the material of the hole injection layer 8b is used for the liquid 120 in the liquid tank 108 of the first coating apparatus 100, the coating apparatus 100A, or the coating apparatus 100B. The material of the red light emitting layer 8c is used for the liquid 120 in the liquid tank 108 of the second coating apparatus 100, the coating apparatus 100A, or the coating apparatus 100B. The material of the green light emitting layer 8c is used for the liquid 120 in the liquid tank 108 of the third coating apparatus 100, the coating apparatus 100A, or the coating apparatus 100B. The material of the blue light emitting layer 8c is used for the liquid 120 in the liquid tank 108 of the fourth coating apparatus 100, the coating apparatus 100A, or the coating apparatus 100B.

  Next, the substrate 10 obtained by the above process is placed on the work table 101 of the first coating apparatus 100, the coating apparatus 100A, or the coating apparatus 100B. At this time, the substrate 10 is placed on the work table 101 so that the bank 13 is along the main scanning direction.

  Next, under the control of the control unit 119, the carriage 105 moves to the end of the movement range. Next, the set flow rate of the mass flow controller 109 is set by the control unit 119. Next, the supply device 116 and the carriage 105 are operated by the control unit 119, the carriage 105 moves in the main scanning direction, and the liquid 120 is continuously discharged from the nozzle holes 168 of the nozzle head 106. Therefore, the discharged liquid 120 is applied between the adjacent banks 13. As a result, a band-shaped hole injection layer 8b is formed between the adjacent banks 13, and the pixel electrodes 8a arranged between the adjacent banks 13 are covered with the hole injection layer 8b.

When the carriage 105 moves to the opposite end of the movement range, the carriage 105 is stopped by the control unit 119. Then, the control unit 119 controls the moving device 102, the work table 101 and the substrate 10 are moved by one pixel in the sub-scanning direction by the moving device 102, and then the moving device 102 is stopped by the control unit 119.
Next, the control unit 119 operates the carriage 105. As a result, the carriage 105 moves in the reverse direction, and the liquid 120 is continuously discharged from the nozzle holes 168 of the nozzle head 106. Thereby, the strip-shaped hole injection layer 8b is formed.
When the carriage 105 moves to the opposite end of the movement range, the carriage 105, the mass flow controller 109, and the feeder 116 are stopped.

  Thereafter, by repeating the above operation, the band-shaped hole injection layer 8b is sequentially formed, and all the pixel electrodes 8a are covered with the hole injection layer 8b.

  Then, after the hole injection layer 8b is dried, the substrate 10 is placed on the work table 101 of the second coating apparatus 100, the coating apparatus 100A, or the coating apparatus 100B. Then, the second coating apparatus 100, the coating apparatus 100A, or the coating apparatus 100B operates in the same manner, whereby a strip-shaped red light emitting layer 8c is formed on the hole injection layer 8b. Here, the work table 101 and the substrate 10 are intermittently moved in the sub-scanning direction by the moving device 102, and the moving distance is three pixels.

  Next, the substrate 10 is placed on the work table 101 of the third coating apparatus 100, the coating apparatus 100A, or the coating apparatus 100B. Then, the third coating apparatus 100, the coating apparatus 100A, or the coating apparatus 100B operates in the same manner, whereby a strip-shaped green light emitting layer 8c is formed on the hole injection layer 8b. Here, the work table 101 and the substrate 10 are intermittently moved in the sub-scanning direction by the moving device 102, and the moving distance is three pixels.

  Next, the substrate 10 is placed on the work table 101 of the fourth coating apparatus 100, the coating apparatus 100A, or the coating apparatus 100B. Then, the fourth coating device 100, the coating device 100A, or the coating device 100B operates in the same manner, so that a belt-like blue light emitting layer 8c is formed on the hole injection layer 8b. Here, the work table 101 and the substrate 10 are intermittently moved in the sub-scanning direction by the moving device 102, and the moving distance is three pixels.

  As described above, the light emitting layer 8c is formed on all the hole injection layers 8b. Similarly, the mono-color panel can be applied, but the moving distance in the sub-scanning direction when applying the light emitting layer is one pixel, and only the second coating device 110 is necessary for the application of the light emitting layer.

[6-3] Step after Using Coating Device Subsequently, the counter electrode 8d is formed, and the light emitting layer 8c and the bank 13 are covered with the counter electrode 8d.
Thus, the EL panel 1 is completed.

[7] Use of EL Panel The EL panel 1 formed and manufactured as described above by the light emitting panel coating apparatus 100 is used as a display panel of various electronic devices.
For example, the EL panel 1 can be applied to the display panel 1a of the mobile phone 200 shown in FIG. In addition, the EL panel 1 can be applied to the display panel 1b of the digital camera 300 shown in FIGS. Further, the EL panel 1 can be applied to the display panel 1c of the personal computer 400 shown in FIG.

100, 100A, 100B Coating device 106 Nozzle head (ejection unit)
107 Supply pipe 108 Liquid tank (liquid storage part)
110, 110a, 110b, 110c Valve (switching unit)
111, 111a, 111b, 111c Detector 113 Vacuum pump (pressure reduction device)
116 Supply Unit 119 Control Unit 120 Liquid 121 Substrate

Claims (10)

A liquid reservoir in which liquid is stored;
A discharge portion having a nozzle hole for discharging the liquid;
A supply pipe piped from the liquid storage part to the discharge part;
A switching unit provided in the supply pipe or the discharge unit;
A first decompression device connected to the switching unit for decompressing the inside of the supply pipe;
A drain pipe provided so that one end communicates with the nozzle hole when the discharge unit is in the standby position;
A second decompression device connected to the other end of the drain pipe ,
The switching unit, when the discharge unit is in the standby position, to switch the supply pipe to the state in which communication with the first pressure reducing device, when the discharge unit is not in the standby position, said feed Switched to a state where the tube is disconnected from the first pressure reducing device ;
Before the discharge unit is in the standby position and the liquid is filled in the supply pipe and the discharge unit, the first decompression device decompresses the supply pipe via the switching unit, and the second The depressurizing apparatus depressurizes the inside of the supply pipe and the inside of the discharge section through the nozzle hole and the drain pipe . The switching unit can be switched to a state in which the supply pipe is shut off from the first decompression device when a liquid is filled in the vicinity of the switching unit in the supply pipe. The coating apparatus as described. A feeder for feeding the liquid in the liquid reservoir to the supply pipe;
When the discharge unit is in the standby position, is switched to a state in which the switching portion is communicated with the supply pipe to the first pressure reducing device, said feeder, said first pressure reducing device and the second pressure reduction The coating apparatus according to claim 1, wherein the apparatus operates. A controller for controlling the feeder , the first decompressor , the second decompressor, and the switching unit;
When it said discharge unit is in the standby position, the control unit, the switching unit, while in a state of communicated with the said feed pipe the first pressure reducing device, said feeder, said first decompressor The coating apparatus according to claim 3, wherein the second decompression device is operated. A detector for detecting the presence of liquid in the supply pipe in the vicinity of the switching unit;
Wherein the control unit, the When the detector detects the liquid, the switching unit, coating apparatus according to the supply pipe to claim 4, characterized in that switching to the state of being cut off from the first pressure reducing device.   6. The coating apparatus according to claim 1, wherein a plurality of the switching units are provided from the liquid storage unit to the discharge unit. With respect to a supply pipe piped from a liquid storage part in which liquid is stored to a discharge part having a nozzle hole for discharging the liquid, the discharge part is more than the liquid storage part while sending the liquid from the liquid storage part The pressure in the area not filled with the liquid in the supply pipe is reduced at a near portion, and the pressure in the supply pipe and the discharge section not filled with the liquid is reduced through the nozzle hole. Liquid filling method. With respect to a supply pipe piped from a liquid storage part in which liquid is stored to a discharge part having a nozzle hole for discharging the liquid, the liquid is supplied from the liquid storage part, and the discharge is performed more than the liquid storage part. part closer line decompression of the said liquid in the supply pipe is not filled region at a plurality of locations of partial Utotomoni, a region where the liquid is not filled in the nozzle hole of the supply pipe and in the discharge part via There line of vacuum,
As the liquid sent out from the liquid storage part to the supply pipe is filled in the supply pipe toward the discharge part, the decompression is stopped at each of the plurality of places where the pressure in the supply pipe is reduced. A liquid filling method, which is performed sequentially from the liquid reservoir. While supplying the liquid from the liquid storage part by a feeder to the supply pipe piped from the liquid storage part in which the liquid containing the organic material is stored to the discharge part having a nozzle hole for discharging the liquid, line decompression of region in which the liquid is not filled in the supply pipe at a portion of the discharge portion nearer the liquid reservoir Utotomoni, through the nozzle hole is the liquid in the supply pipe and the discharge portion is filled There line under reduced pressure of not area,
Once the liquid is filled from the liquid reservoir to the portion where the pressure is reduced, the pressure reduction is stopped,
When the liquid is filled into the discharge part, the liquid continuously discharged from the discharge part is moved while moving the discharge part relative to the substrate without stopping the supply unit. A method for producing an organic layer, which is applied to the substrate. While supplying the liquid from the liquid storage part by a feeder to the supply pipe piped from the liquid storage part in which the liquid containing the organic material is stored to the discharge part having a nozzle hole for discharging the liquid, line decompression of the region where liquid is not filled in the supply pipe at a plurality of locations of the portion of the discharge portion nearer the liquid reservoir Utotomoni, the of the supply pipe and in the discharge portion through the nozzle hole liquid have rows vacuum in the region not filled,
As the liquid sent out from the liquid storage part to the supply pipe is filled in the supply pipe toward the discharge part, the decompression is stopped at each of the plurality of places where the pressure in the supply pipe is reduced. Sequentially from the liquid storage part,
When the liquid is filled into the discharge unit, the liquid continuously discharged from the discharge unit while moving the discharge unit relative to the substrate without stopping the supply unit. Is applied to the substrate.

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