JP5451453B2 - Acid scavenger - Google Patents

Description

  The present invention relates to an acid scavenger. More specifically, the present invention relates to an acid scavenger capable of effectively capturing an acid contained in a resin and producing a stable resin.

  Currently, a wide variety of resins, especially those that are melt processed or melt molded, are used in a variety of applications. However, regarding thermoplastic resins to be melt processed or melt molded, the melt processing or melt molding apparatus may be corroded by an acidic compound generated by decomposition of the resin component, particularly a low molecular weight acidic compound, in the above process. The resin component itself may deteriorate.

  Such low molecular weight acidic components include, for example, acidic components that are decomposed and produced by the resin itself during thermal processing and melt molding, for example, formic acid produced by a resin having a polyacetal segment, polyvinyl acetate resin, or acetic acid produced by a chlorinated elastomer. , Or acidic components such as hydrogen chloride, or various additives applied to thermoplastic resins, such as phosphoric acid compounds, phosphorous acid stabilizers, sulfonates, phosphorus flame retardants, halogen flame retardants , Acidic impurities contained in antioxidants, antistatic agents, etc., acidic components that are decomposed and generated during thermal processing, and acidic components that are decomposed and generated over time when resin molded products are used Ingredients are exemplified.

  Many proposals have been made to capture and inactivate low molecular weight acidic components that are decomposed and generated by the resin itself during melt processing.For example, in a cellulose-based optical film, an epoxy compound or the like is used for stabilization during heat melting. Use (for example, see Patent Document 1), in a positive photoresist composition, 1,8-diazabicyclo [5.4.0] undec-7-ene, 1,5-diazabicyclo [4.3.0] nona Use of a strongly basic amino compound such as -5-ene (for example, see Patent Document 2), use of an epoxy-based additive (for example, see Patent Document 3) in an ester-based refrigerating machine oil, amino substitution in a polyacetal resin A polycondensate of triazine or amino-substituted triazine with formaldehyde, such as a melamine-formaldehyde polycondensate, is further added to an alkali gold. Or using alkaline earth metal hydroxide, inorganic acid salt, carboxylate or alkoxide (for example, see Patent Document 4), applying carbodiimide compound to ethylene vinyl acetate copolymer (for example, Patent Document) 5), and when using EVA resin for wire and cable materials for packaging, use magnesium oxide or the like having an average particle size of 5 μm or less (for example, see Patent Document 6), additional polymer layer or metal In a rubber elastic body containing a chlorinated ethylene-based polymer, for example, applying a molecular sieve containing sodium aminosilicate for a multilayer package structure including contact with a layer or a non-metallic layer (see, for example, Patent Document 7) In the vulcanization process, use of hydrotalcite stone group (for example, see Patent Document 8), halogen Metal oxides, metal hydroxides, hydrotalcite, which prevent deterioration of rubber properties and corrosion of the mirror plate of molding dies due to hydrogen fluoride generated during vulcanization in fluorine-containing elastomer compositions The use of a compound or the like has been proposed (for example, see Patent Document 9).

  However, with regard to the acid scavenger, when an inorganic compound is used, there is a drawback that its use is limited because it is not soluble in the resin and remains in the resin as a foreign substance, and further constitutes an inorganic compound. Metal ions may induce resin degradation.

  In the case of using strongly basic amino compounds such as 1,8-diazabicyclo [5.4.0] undec-7-ene and 1,5-diazabicyclo [4.3.0] non-5-ene, Although it is necessary to use a stoichiometric equivalent for acid capture, since this compound is strongly basic, such an operation is almost as difficult as possible industrially.

In addition, in the application of epoxy compounds, amino-substituted triazines, linear carbodiimide compounds, etc., there are cases where the acid scavenging ability is insufficient and the influence of acid cannot be eliminated.
Furthermore, regarding the resin composition containing various additives, no specific proposal has been made regarding a scavenger for low molecular weight acidic components produced by decomposition of the additive during melt processing.

JP 2006-106247 A JP 2003-066611 A JP 2002-129179 A JP 2000-159850 A JP 2007-314373 A JP 2005-029588 A Special table 2001-505951 Japanese Patent No. 3207949 JP-A-6-331040

  The object of the present invention is to solve the above-mentioned problems of the prior art, have high compatibility with the resin, have little adverse effect on the resin, and not only the acid component produced by the decomposition of the resin itself, but also the resin. An object of the present invention is to provide an acid scavenger having a scavenging ability of an acidic substance produced from the added additive.

  In order to solve the above problems, the present inventor has found that a carbodiimide compound having a specific structure effectively captures an acid component produced or contained in a resin as a result of intensive studies. completed.

（式中、Ｑは、脂肪族基、脂環族基、芳香族基またはこれらの組み合わせである２〜４価の結合基であり、ヘテロ原子、置換基を含んでいてもよい。）
That is, according to the present invention,
A ring structure you express by the following structural formula formula (i), the number of atoms constituting the ring structure directly is 8-50, acid scavengers are provided.

(In the formula, Q is a divalent to tetravalent linking group that is an aliphatic group, an alicyclic group, an aromatic group, or a combination thereof, and may contain a hetero atom or a substituent.)

Furthermore, according to the present invention,
Using the acid scavenger described above, contained in the resin, other than the resin, halogen acid, carboxylic acid group, sulfonic acid group, acidic sulfuric acid group, sulfinic acid group, acidic sulfite group, acidic phosphonic acid group, acidic Provided is a method for producing a stabilizing resin, which captures a compound having at least one acidic group selected from the group consisting of a phosphoric acid group and an acidic phosphinic acid group.

  The acid scavenger of the present invention has high compatibility with the resin and can efficiently capture the acid component generated in the resin or contained in the resin. A stabilizing resin can be produced.

（式中、Ｑは、脂肪族基、脂環族基、芳香族基またはこれらの組み合わせである２〜４価の結合基であり、ヘテロ原子、置換基を含んでいてもよい。）
Acid scavengers in the present invention is a ring structure you express by the following structural formula formula (i), the number of atoms constituting the ring structure directly is a compound which is 8 to 50.

(In the formula, Q is a divalent to tetravalent linking group that is an aliphatic group, an alicyclic group, an aromatic group, or a combination thereof, and may contain a hetero atom or a substituent.)

The acid scavenger of the present invention has a cyclic structure as described above (hereinafter, the compound (i) of the present invention may be abbreviated as “cyclic carbodiimide compound”). The cyclic carbodiimide compound has a plurality of cyclic structures. It may be.
The cyclic structure has one carbodiimide group (—N═C═N—), and the first nitrogen and the second nitrogen are bonded by a bonding group. One cyclic structure has only one carbodiimide group.

Since the acid scavenger of the present invention has the above-mentioned cyclic structure, it has an advantage that it can efficiently capture an acid component under milder conditions than a carbodiimide compound having a conventional linear structure.
The number of atoms in the cyclic structure is 8 to 50, more preferably 10 to 30, still more preferably 10 to 20, and particularly preferably 10 to 15.

  Here, the number of atoms in the ring structure means the number of atoms that directly constitute the ring structure, and is, for example, 8 for an 8-membered ring and 50 for a 50-membered ring. This is because if the number of atoms in the cyclic structure is smaller than 8, the stability of the cyclic carbodiimide compound is lowered, and it may be difficult to store and use. From the standpoint of reactivity, there is no particular limitation on the upper limit of the number of ring members, but cyclic carbodiimide compounds having more than 50 atoms are difficult to synthesize, and the cost may increase significantly. From this viewpoint, the number of atoms in the cyclic structure is preferably 10-30, more preferably 10-20, and particularly preferably 10-15.

  The molecular weight of the cyclic carbodiimide compound is preferably 100 to 1,000. If it is lower than 100, the structural stability and volatility of the cyclic carbodiimide compound may be problematic. On the other hand, if it is higher than 1,000, synthesis in a diluting system is required for the production of cyclic carbodiimide, and the yield may be lowered, which may cause a problem in cost. From this viewpoint, it is more preferably 100 to 750, and further preferably 250 to 750.

Hereinafter, the compound represented by the above formula (i) will be described in detail.
In the formula, Q is a divalent to tetravalent linking group that is an aliphatic group, an alicyclic group, an aromatic group, or a combination thereof, and may contain a hetero atom or a substituent.
Two of the valences of this linking group are used to form a cyclic structure. When Q is a trivalent or tetravalent linking group, it is bonded to a polymer or other cyclic structure via a single bond, a double bond, an atom, or an atomic group.

  The linking group is a divalent to tetravalent C 1-20 aliphatic group, a divalent to tetravalent C 3-20 alicyclic group, a divalent to tetravalent C 5-15 aromatic group, or A combination of these is preferred. As the linking group, one having the necessary number of carbon atoms for forming a cyclic structure is selected. Examples of combinations include structures such as an alkylene-arylene group in which an alkylene group and an arylene group are bonded.

The aliphatic group, alicyclic group, and aromatic group constituting the bonding group may each include a hetero atom and a substituent. A hetero atom refers to O, N, S, P. Examples of the substituent include an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogen atom, a nitro group, an amide group, a hydroxyl group, an ester group, an ether group, and an aldehyde group.
In the present invention, examples of the halogen atom include a chlorine atom, a bromine atom, and an iodine atom.

式中、Ａｒ^１およびＡｒ^２は各々独立に、２〜４価の炭素数５〜１５の芳香族基であり、ヘテロ原子、置換基を含んでいてもよい。 The linking group (Q) is preferably a divalent to tetravalent linking group represented by the following formula (i-1), (i-2) or (i-3).

In the formula, Ar ¹ and Ar ² are each independently a divalent to tetravalent aromatic group having 5 to 15 carbon atoms, and may contain a hetero atom or a substituent.

  Examples of the aromatic group include an arylene group having 5 to 15 carbon atoms, an arenetriyl group having 5 to 15 carbon atoms, and an arenetetrayl group having 5 to 15 carbon atoms. Examples of the arylene group (divalent) include a phenylene group and a naphthalenediyl group. Examples of the arenetriyl group (trivalent) include a benzenetriyl group and a naphthalenetriyl group. Examples of the arenetetrayl group (tetravalent) include a benzenetetrayl group and a naphthalenetetrayl group.

  These aromatic groups may be substituted. Examples of the substituent include an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogen atom, a nitro group, an amide group, a hydroxyl group, an ester group, an ether group, and an aldehyde group. These aromatic groups may contain a hetero atom and have a heterocyclic structure. Heteroatoms include O, N, S, and P.

R ¹ and R ² are each independently a divalent to tetravalent aliphatic group having 1 to 20 carbon atoms, a divalent to tetravalent carbon group having 3 to 20 alicyclic groups, a combination thereof, or an aliphatic group thereof. , A combination of an alicyclic group and a divalent to tetravalent aromatic group having 5 to 15 carbon atoms, and may contain a hetero atom or a substituent.

  Examples of the aliphatic group include an alkylene group having 1 to 20 carbon atoms, an alkanetriyl group having 1 to 20 carbon atoms, and an alkanetetrayl group having 1 to 20 carbon atoms. Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, a heptylene group, an octylene group, a nonylene group, a decylene group, a dodecylene group, and a hexadecylene group. As the alkanetriyl group, methanetriyl group, ethanetriyl group, propanetriyl group, butanetriyl group, pentanetriyl group, hexanetriyl group, heptanetriyl group, octanetriyl group, nonanetriyl group, decantriyl group, dodecantriyl group, Examples include a hexadecantriyl group. As alkanetetrayl group, methanetetrayl group, ethanetetrayl group, propanetetrayl group, butanetetrayl group, pentanetetrayl group, hexanetetrayl group, heptanetetrayl group, octanetetrayl group, nonanetetrayl group Decanetetrayl group, dodecanetetrayl group, hexadecanetetrayl group and the like.

  These aliphatic groups may be substituted. Examples of the substituent include an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogen atom, a nitro group, an amide group, a hydroxyl group, an ester group, an ether group, and an aldehyde group. Moreover, these aliphatic groups may contain a hetero atom. Heteroatoms include O, N, S, and P.

  Examples of the alicyclic group include a cycloalkylene group having 3 to 20 carbon atoms, a cycloalkanetriyl group having 3 to 20 carbon atoms, and a cycloalkanetetrayl group having 3 to 20 carbon atoms. Examples of the cycloalkylene group include a cyclopropylene group, a cyclobutylene group, a cyclopentylene group, a cyclohexylene group, a cycloheptylene group, a cyclooctylene group, a cyclononylene group, a cyclodecylene group, a cyclododecylene group, and a cyclohexadecylene group. As cycloalkanetriyl group, cyclopropanetriyl group, cyclobutanetriyl group, cyclopentanetriyl group, cyclohexanetriyl group, cycloheptanetriyl group, cyclooctanetriyl group, cyclononanetriyl group, cyclodecanetriyl group Group, cyclododecane triyl group, cyclohexadecane triyl group and the like. As cycloalkanetetrayl group, cyclopropanetetrayl group, cyclobutanetetrayl group, cyclopentanetetrayl group, cyclohexanetetrayl group, cycloheptanetetrayl group, cyclooctanetetrayl group, cyclononanetetrayl group, cyclodecanetetrayl group Yl group, cyclododecanetetrayl group, cyclohexadecanetetrayl group and the like.

  These alicyclic groups may be substituted. Examples of the substituent include an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogen atom, a nitro group, an amide group, a hydroxyl group, an ester group, an ether group, and an aldehyde group. Moreover, these alicyclic groups may include a hetero atom and have a heterocyclic structure. Heteroatoms include O, N, S, and P.

  Examples of the aromatic group include an arylene group having 5 to 15 carbon atoms, an arenetriyl group having 5 to 15 carbon atoms, and an arenetetrayl group having 5 to 15 carbon atoms. Examples of the arylene group include a phenylene group and a naphthalenediyl group. Examples of the arenetriyl group (trivalent) include a benzenetriyl group and a naphthalenetriyl group. Examples of the arenetetrayl group (tetravalent) include a benzenetetrayl group and a naphthalenetetrayl group.

These aromatic groups may be substituted. Examples of the substituent include an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogen atom, a nitro group, an amide group, a hydroxyl group, an ester group, an ether group, and an aldehyde group.
Moreover, these aromatic groups may include a hetero atom and have a heterocyclic structure. Heteroatoms include O, N, S, and P.

X ¹ and X ² are each independently a 2 to 4 valent aliphatic group having 1 to 20 carbon atoms, a 2 to 4 valent alicyclic group having 3 to 20 carbon atoms, and a 2 to 4 valent carbon number having 5 to 5 carbon atoms. 15 aromatic groups, or a combination thereof, which may contain heteroatoms and substituents.

  Examples of the aliphatic group include an alkylene group having 1 to 20 carbon atoms, an alkanetriyl group having 1 to 20 carbon atoms, and an alkanetetrayl group having 1 to 20 carbon atoms. Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, a heptylene group, an octylene group, a nonylene group, a decylene group, a dodecylene group, and a hexadecylene group. As the alkanetriyl group, methanetriyl group, ethanetriyl group, propanetriyl group, butanetriyl group, pentanetriyl group, hexanetriyl group, heptanetriyl group, octanetriyl group, nonanetriyl group, decantriyl group, dodecantriyl group, Examples include a hexadecantriyl group. As alkanetetrayl group, methanetetrayl group, ethanetetrayl group, propanetetrayl group, butanetetrayl group, pentanetetrayl group, hexanetetrayl group, heptanetetrayl group, octanetetrayl group, nonanetetrayl group Decanetetrayl group, dodecanetetrayl group, hexadecanetetrayl group and the like.

  These aliphatic groups may be substituted. Examples of the substituent include an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogen atom, a nitro group, an amide group, a hydroxyl group, an ester group, an ether group, and an aldehyde group. Moreover, these aliphatic groups may contain a hetero atom. Heteroatoms include O, N, S, and P.

  Examples of the alicyclic group include a cycloalkylene group having 3 to 20 carbon atoms, a cycloalkanetriyl group having 3 to 20 carbon atoms, and a cycloalkanetetrayl group having 3 to 20 carbon atoms. Examples of the cycloalkylene group include a cyclopropylene group, a cyclobutylene group, a cyclopentylene group, a cyclohexylene group, a cycloheptylene group, a cyclooctylene group, a cyclononylene group, a cyclodecylene group, a cyclododecylene group, and a cyclohexadecylene group. As the alkanetriyl group, cyclopropanetriyl group, cyclobutanetriyl group, cyclopentanetriyl group, cyclohexanetriyl group, cycloheptanetriyl group, cyclooctanetriyl group, cyclononanetriyl group, cyclodecanetriyl group , Cyclododecanetriyl group, cyclohexadecanetriyl group and the like. As the alkanetetrayl group, cyclopropanetetrayl group, cyclobutanetetrayl group, cyclopentanetetrayl group, cyclohexanetetrayl group, cycloheptanetetrayl group, cyclooctanetetrayl group, cyclononanetetrayl group, cyclodecanetetrayl group Group, cyclododecanetetrayl group, cyclohexadecanetetrayl group and the like.

  These alicyclic groups may be substituted. Examples of the substituent include an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogen atom, a nitro group, an amide group, a hydroxyl group, an ester group, an ether group, and an aldehyde group. Moreover, these alicyclic groups may include a hetero atom and have a heterocyclic structure. Heteroatoms include O, N, S, and P.

  Examples of the aromatic group include an arylene group having 5 to 15 carbon atoms, an arenetriyl group having 5 to 15 carbon atoms, and an arenetetrayl group having 5 to 15 carbon atoms. Examples of the arylene group include a phenylene group and a naphthalenediyl group. Examples of the arenetriyl group (trivalent) include a benzenetriyl group and a naphthalenetriyl group. Examples of the arenetetrayl group (tetravalent) include a benzenetetrayl group and a naphthalenetetrayl group.

  These aromatic groups may be substituted. Examples of the substituent include an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogen atom, a nitro group, an amide group, a hydroxyl group, an ester group, an ether group, and an aldehyde group. Moreover, these aromatic groups may include a hetero atom and have a heterocyclic structure. Heteroatoms include O, N, S, and P.

s and k are each independently an integer of 0 to 10, preferably an integer of 0 to 3, more preferably an integer of 0 to 1. When s and k exceed 10, the cyclic carbodiimide compound is difficult to synthesize, and the cost may increase significantly. From this viewpoint, the integer is preferably selected in the range of 0 to 3. When s or k is 2 or more, X ¹ or X ² as a repeating unit may be different from other X ¹ or X ² .

X ³ is a 2 to 4 valent aliphatic group having 1 to 20 carbon atoms, a 2 to 4 valent alicyclic group having 3 to 20 carbon atoms, a 2 to 4 valent aromatic group having 5 to 15 carbon atoms, Or it is a combination of these and may contain a hetero atom and a substituent.

  Examples of the aliphatic group include an alkylene group having 1 to 20 carbon atoms, an alkanetriyl group having 1 to 20 carbon atoms, and an alkanetetrayl group having 1 to 20 carbon atoms. Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, a heptylene group, an octylene group, a nonylene group, a decylene group, a dodecylene group, and a hexadecylene group. As the alkanetriyl group, methanetriyl group, ethanetriyl group, propanetriyl group, butanetriyl group, pentanetriyl group, hexanetriyl group, heptanetriyl group, octanetriyl group, nonanetriyl group, decantriyl group, dodecantriyl group, Examples include a hexadecantriyl group. As alkanetetrayl group, methanetetrayl group, ethanetetrayl group, propanetetrayl group, butanetetrayl group, pentanetetrayl group, hexanetetrayl group, heptanetetrayl group, octanetetrayl group, nonanetetrayl group Decanetetrayl group, dodecanetetrayl group, hexadecanetetrayl group and the like.

  These aliphatic groups may contain a substituent, such as an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogen atom, a nitro group, an amide group, a hydroxyl group, or an ester group. , Ether group, aldehyde group and the like. Moreover, these aliphatic groups may contain a hetero atom. Heteroatoms include O, N, S, and P.

  Examples of the alicyclic group include a cycloalkylene group having 3 to 20 carbon atoms, a cycloalkanetriyl group having 3 to 20 carbon atoms, and a cycloalkanetetrayl group having 3 to 20 carbon atoms. Examples of the cycloalkylene group include a cyclopropylene group, a cyclobutylene group, a cyclopentylene group, a cyclohexylene group, a cycloheptylene group, a cyclooctylene group, a cyclononylene group, a cyclodecylene group, a cyclododecylene group, and a cyclohexadecylene group. As the alkanetriyl group, cyclopropanetriyl group, cyclobutanetriyl group, cyclopentanetriyl group, cyclohexanetriyl group, cycloheptanetriyl group, cyclooctanetriyl group, cyclononanetriyl group, cyclodecanetriyl group , Cyclododecanetriyl group, cyclohexadecanetriyl group and the like. As the alkanetetrayl group, cyclopropanetetrayl group, cyclobutanetetrayl group, cyclopentanetetrayl group, cyclohexanetetrayl group, cycloheptanetetrayl group, cyclooctanetetrayl group, cyclononanetetrayl group, cyclodecanetetrayl group Group, cyclododecanetetrayl group, cyclohexadecanetetrayl group and the like.

  These alicyclic groups may contain a substituent, such as an alkyl group having 1 to 20 carbon atoms, an arylene group having 6 to 15 carbon atoms, a halogen atom, a nitro group, an amide group, a hydroxyl group, and an ester. Group, ether group, aldehyde group and the like. Moreover, these alicyclic groups may include a hetero atom and have a heterocyclic structure. Heteroatoms include O, N, S, and P.

  Examples of the aromatic group include an arylene group having 5 to 15 carbon atoms, an arenetriyl group having 5 to 15 carbon atoms, and an arenetetrayl group having 5 to 15 carbon atoms. Examples of the arylene group include a phenylene group and a naphthalenediyl group. Examples of the arenetriyl group (trivalent) include a benzenetriyl group and a naphthalenetriyl group. Examples of the arenetetrayl group (tetravalent) include a benzenetetrayl group and a naphthalenetetrayl group.

These aromatic groups may be substituted. Examples of the substituent include an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogen atom, a nitro group, an amide group, a hydroxyl group, an ester group, an ether group, and an aldehyde group. Moreover, these aromatic groups may include a hetero atom and have a heterocyclic structure. Heteroatoms include O, N, S, and P.
As described above, Ar ¹ , Ar ² , R ¹ , R ² , X ¹ , X ² and X ³ may contain a hetero atom.

When Q is a divalent linking group, Ar ¹ , Ar ² , R ¹ , R ² , X ¹ , X ² and X ³ are all divalent groups. When Q is a trivalent linking group, one of Ar ¹ , Ar ² , R ¹ , R ² , X ¹ , X ² and X ³ is a trivalent group. When Q is a tetravalent linking group, one of Ar ¹ , Ar ² , R ¹ , R ² , X ¹ , X ² and X ³ is a tetravalent group or two are trivalent It is a group.

  Examples of the cyclic carbodiimide compound that is the acid scavenger of the present invention include the following compounds.

The acid scavenger of the present invention can be applied singly or as a mixture of two or more.
The application amount of such an agent is selected such that the carbodiimide group contained in the cyclic carbodiimide compound is 0.5 to 100 equivalents per equivalent of acidic group. If the amount is less than 0.5 equivalent, there may be no significance in applying carbodiimide. On the other hand, if it exceeds 100 equivalents, the characteristics of the substrate may be altered. From this point of view, in the above criteria, a range of preferably 0.6 to 75 equivalents, more preferably 0.65 to 50 equivalents, more preferably 0.7 to 30 equivalents, and particularly preferably 0.7 to 20 equivalents is selected. Is done.

The production method of the cyclic carbodiimide compound of the present invention is not particularly limited, and is suitably produced by a conventionally known method.
As such a production method, a method for producing an amine body via an isocyanate body, a method for producing an amine body via an isothiocyanate body, a method for producing an amine body via a triphenylphosphine body, an amine body A method for producing from a urea body via a urea body, a method for producing from an amine body via a thiourea body, a process for producing a carboxylic acid body via an isocyanate body, a method for producing a lactam body by induction, etc. Can be mentioned.

  Depending on the compound to be produced, an appropriate production method may be employed. For example, (1) nitrophenols represented by the following formula (a-1), nitrophenols represented by the following formula (a-2) And a compound represented by the following formula (b) to obtain a nitro compound represented by the following formula (c),

(2) A step of reducing the obtained nitro body to obtain an amine body represented by the following formula (d);

(3) a step of reacting the obtained amine body with triphenylphosphine dibromide to obtain a triphenylphosphine body represented by the following formula (e); and

(4) After the obtained triphenylphosphine body is isocyanated in the reaction system and then directly decarboxylated, it can be suitably used as the cyclic carbodiimide compound used in the present invention.
(In the above formula, Ar ¹ and Ar ² are each independently an aromatic group optionally substituted with an alkyl group having 1 to 6 carbon atoms or a phenyl group. E ¹ and E ² are each independently a halogen atom. A group selected from the group consisting of an atom, a toluenesulfonyloxy group, a methanesulfonyloxy group, a benzenesulfonyloxy group, and a p-bromobenzenesulfonyloxy group, Ar ^a is a phenyl group, X is represented by the following formula (i -1) to (i-3).

（式中、ｎは１〜６の整数である。）

（式中、ｍおよびｎは各々独立に０〜３の整数である。）

（式中、Ｒ^１およびＲ^２は各々独立に、炭素数１〜６のアルキル基、フェニル基を表す。）

(In the formula, n is an integer of 1 to 6.)

(In the formula, m and n are each independently an integer of 0 to 3.)

(In the formula, R ¹ and R ² each independently represents an alkyl group having 1 to 6 carbon atoms or a phenyl group.)

  The acid to be captured by the acid scavenger of the present invention is not particularly limited with respect to its origin or chemical species, and includes a free acid component that is generated in the resin or contained in the resin. Possesses at least one acidic group selected from the group consisting of acids, carboxylic acid groups, sulfonic acid groups, acidic sulfuric acid groups, sulfinic acid groups, acidic sulfite groups, acidic phosphonic acid groups, acidic phosphoric acid groups and acidic phosphinic acid groups The compound is the target.

  Among these compounds, compounds having a relatively small molecular weight, particularly having a molecular weight of 1000 or less, have high mobility in the resin, and easily leached on the surface of the resin during thermal processing to contact the metal device. Since the ability to corrode the surface is high, the advantage of inactivation prior to melt processing is great, but the acid scavenger of the present invention is such a compound having a molecular weight of 1000 or less, more preferably 300 or less, In particular, it can be suitably applied to a highly corrosive acid of 200 or less. Although the lower limit of the molecular weight of the compound is not particularly limited, for example, 19 of hydrogen fluoride is exemplified.

  In the present invention, the acid scavenger of the present invention described above is contained in the resin, and other than the resin, halogen acid, carboxylic acid group, sulfonic acid group, acidic sulfate group, sulfinic acid group, acidic sulfite group There is provided a method for producing a stabilizing resin for capturing a compound having at least one acidic group selected from the group consisting of an acidic phosphonic acid group, an acidic phosphoric acid group and an acidic phosphinic acid group.

  Here, in the present invention, the amount ratio of the acid scavenger applied to the resin is in the range of 0.001 to 10 parts by weight per 100 parts by weight of the resin, although the effective amount varies depending on the type of resin. When the amount is less than 0.001 part by weight in the above standard, for example, the effect of suppressing the corrosiveness is not recognized, and when it is applied more than 10 parts by weight, the excessive agent is decomposed to induce deterioration of the resin. There is.

Accordingly, it is preferably 0.002 to 5 parts by weight, more preferably 0.005 to 3 parts by weight, and particularly preferably 0.01 to 1 part by weight based on the above criteria.
The acid scavenger of the present invention can be applied singly or as a mixture of two or more.

  The corrosiveness-inhibiting effect of the acid scavenger of the present invention is determined by, for example, corrosion marks generated on the surface of the edge part of the apparatus during melt processing of a resin containing an acid scavenger. Examples include an evaluation method in which the pH after hot water extraction is compared with a blank value, and a method in which an acidic component in the extract is quantified by ion chromatography.

The acid captured by the agent of the present invention is not particularly limited with respect to its origin or chemical species, for example,
(A) Decomposition component of resin during melt processing,
(A) Impurities in resin additives,
(C) Examples of decomposition components of additives during resin melt processing.

  Regarding the free acid that is the target of capture of the agent of the present invention, for example, the halogen acid is exemplified by hydrogen fluoride, hydrogen chloride, hydrogen bromide, hydrogen iodide, and selected from the group consisting of fluorine, chlorine, bromine and iodine. It may be generated when a thermoplastic resin containing at least one halogen element is melt processed, and such hydrogen halide is further corrosive due to the presence of moisture, and at the same time lowers the quality of the resin. By applying the agent of the present invention, the advantage of effectively capturing is great.

  Here, the thermoplastic resin containing at least one halogen element selected from the group consisting of fluorine, chlorine, bromine and iodine is a resin in which the halogen element is bonded to the molecule constituting the resin, Alternatively, a so-called resin composition in which a halogen-based flame retardant is present in the resin is included.

  Specific examples of the free acid having a carboxyl group include formic acid, acetic acid, oxalic acid, lactic acid, propionic acid, succinic acid, hexahydrophthalic acid, lactic acid, glycolic acid, myristic acid, stearic acid, oleic acid, Aliphatic carboxylic acids such as monoethyl succinate, monooctyl maleate, monooctyl hexahydrophthalate and derivatives thereof, benzoic acid, p-oxybenzoic acid, terephthalic acid, phthalic acid, diphenyldicarboxylic acid, monooctyl phthalate, Examples include aromatic carboxylic acids such as monodecyl terephthalate and derivatives thereof.

Such a free acid component may be generated by decomposition of EVA resin or polyacetal resin, and further by auto-oxidation of polycarbonate side chain, polyester resin or other resin.
Among them, low molecular weight acids such as formic acid, acetic acid, propionic acid, oxalic acid, and lactic acid are highly corrosive and there is a concern about the corrosion of the equipment, but by applying the acid scavenger of the present invention, the corrosivity is effective. Can be suppressed.

  The free acid having a sulfonic acid group is, for example, an antistatic agent or a dye. It may be contained or produced as impurities such as pigments or as decomposition components. Such a sulfonic acid compound depends on the type of additive used. Specifically, for example, methanesulfonic acid, ethanesulfonic acid, butanesulfonic acid, decanesulfonic acid, hexadecanesulfonic acid and other aliphatic sulfonic acids, benzenesulfonic acid And aromatic sulfonic acids such as dodecylbenzenesulfonic acid, hexadecylbenzenesulfonic acid, and 1,3-dicarboxybenzenesulfonic acid-5.

  Examples of the free acid having an acidic sulfate group include monomethyl sulfate, monobutyl sulfate, monodecyl sulfate, monohexadecyl sulfate, monophenyl sulfate, mono (octylphenyl) sulfate, mono (nonylphenyl) sulfate, and mono (p- Hexadecylphenyl) and the like.

  An acid having a sulfinic acid group may be generated, for example, by decomposition of an antistatic agent, a sulfone group, a thioether group, or the like. Specifically, for example, methanesulfinic acid, ethanesulfinic acid, decanesulfinic acid, hexadecanesulfin Examples include aliphatic sulfinic acids such as acids, aromatic sulfinic acids such as benzenesulfinic acid, dodecylbenzenesulfinic acid, hexadecylbenzenesulfinic acid, and 1,3-dicarboxybenzenesulfinic acid-5.

  The free acid having an acidic sulfate group is, for example, an antistatic agent or a dye. It may be contained or produced as impurities such as pigments or as decomposition components. The compound having an acidic sulfate group depends on the type of additive used. Specifically, for example, sulfuric acid, monomethyl sulfate, monobutyl sulfate, monodecyl sulfate, monohexadecyl sulfate, monophenyl sulfate, mono (p-octyl sulfate) Phenyl), mono (o-nonylphenyl) sulfate, mono (p-hexadecylphenyl) sulfate, etc., as the free acid having an acidic sulfite group, for example, sulfite, monomethyl sulfite, monobutyl sulfite, monodecyl sulfite, monosulfite Examples include hexadecyl, monophenyl sulfite, mono (n-octylphenyl) sulfite, mono (m-nonylphenyl) sulfite, and mono (p-hexadecylphenyl) sulfite.

  Examples of the free acid having an acidic phosphonic acid group include aliphatic phosphonic acids such as methanephosphonic acid, ethanephosphonic acid, butanephosphonic acid, decanephosphonic acid, and hexadecanephosphonic acid, benzenephosphonic acid, dodecylbenzenephosphonic acid, and hexadecyl. Benzenephosphonic acid, 1,3-dicarboxybenzenephosphonic acid-5, tris (2,4-di-tert-butylphenyl) -acidic biphenylene diphosphonite, bis (2,4-di-tert-butylphenyl)- Aromatic phosphonic acids such as acidic biphenylene diphosphonite and biphenylene diphosphonic acid include acid phosphinic acid groups such as methanephosphinic acid, ethanephosphinic acid, butanephosphinic acid, decanephosphinic acid, hexadecanephosphine. Fats such as acids Hosuhofin acid, benzene phosphinic acid, dodecyl benzene phosphinic acid, hexadecyl benzene phosphinic acid, 1,3-carboxymethyl aromatic phosphinic acids, such as benzene phosphinic acid -5, and the like are exemplified.

  The free acid having an acidic phosphoric acid group may be contained in the resin as an impurity of a phosphate ester additive such as a flame retardant or a decomposition component, for example, specifically, for example, phosphoric acid, monomethyl phosphate, phosphoric acid Dimethyl, monobutyl phosphate, dihexyl phosphate, monodecyl phosphate, ditridecyl phosphate, monohexadecyl phosphate, dioleyl phosphate, monophenyl phosphate, ditolyl phosphate, mono (n-octylphenyl) phosphate, mono (m-nonylphenyl) phosphate, phosphoric acid Examples thereof include mono (p-hexadecylphenyl) bis (p-hexadecylphenyl) phosphate, and the like.

  The free acid having an acidic phosphite group may be contained in the resin as an impurity or decomposition product of a phosphite ester compound added as an antioxidant. Specifically, for example, phosphorous acid , Monomethyl phosphite, dimethyl phosphite, monobutyl phosphite, dibutyl phosphite, monodecyl phosphite, didecyl phosphite, monohexadecyl phosphite, dihexadecyl phosphite, monophenyl phosphite, diphenyl phosphite, monophosphorous acid (n- Octylphenyl), mono (m-nonylphenyl) phosphite, mono (p-hexadecylphenyl) phosphite, bis (p-hexadecylphenyl) phosphate, (2,4-di-tert-butylphenyl) pentaerythritol acidic diphosphite And acidic pentaerythritol diphosphite.

The resin in the present invention is not particularly limited, but a thermoplastic resin to be melt processed is exemplified as a more suitable target from the viewpoint of suppressing corrosion of the melt processing apparatus.
Examples of the thermoplastic resin include a polyester resin, and examples of the aliphatic polyester whose component is composed of only an aliphatic component include polylactic acid, stereocomplex polylactic acid, polyglutaric acid, polycaprolactone, and the like including an aliphatic / aromatic component. Examples of the polymerized polyester include poly 1,4-butylene terephthalate, poly ε-caprolactone copolymer, poly 1,4-butylene terephthalate, poly 1,4-butylene adipate block copolymer, and the acid component is an aromatic acid. Examples of the aromatic polyester composed only of the components include polyethylene terephthalate, polyethylene (terephthalate / isophthalate), polyethylene naphthalate, poly 1,3-propylene terephthalate, poly 1,4-butylene terephthalate, poly (cyclohexahexane). Dimethylene / ethylene) terephthalate, poly (cyclohexane dimethylene / ethylene) (terephthalate / isophthalate), poly (cyclohexane dimethylene / cyclohexane dicarboxylate), all aromatics whose acid and hydroxy components are all aromatic components Examples of the polyester include bisphenol A (terephthalate / isophthalate) and bisphenol A (terephthalate / isophthalate / carbonate).

  As the polyamide resin, for example, nylon 6, nylon 46, nylon 66, nylon 610, nylon 612, nylon 116, nylon 11, nylon 12, polyterephthalamide (nylon 11T (H)) and their copolymerized polyamide, mixed Examples include polyamide.

  Further, examples of the condensation resin include polycarbonate resin, polyetherimide resin, polyamide-imide resin, polyimide resin, polyurethane resin, polyester alkyd resin, and polyolefin resin, such as polyethylene resin, polypropylene resin, and polystyrene resin. .

  Examples of the polyvinyl resin include a polyvinyl chloride resin, a polyvinylidene chloride resin, and a vinyl ester resin such as a vinyl acetate resin and a vinyl chloride / vinyl acetate copolymer.

  Further, as an acrylic resin, for example, polyacrylic acid resin, polymethacrylic acid resin, polyacrylic acid and / or polymethacrylic acid, methacrylic acid ester such as methyl methacrylate, cyclohexyl methacrylate, tert-butylcyclohexyl methacrylate, methyl acrylate, Copolymer of one or more monomers selected from acrylic acid esters such as ethyl acrylate, butyl acrylate, isopropyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, cyclohexyl methacrylate, tert-methacrylic acid One kind selected from acrylic acid esters such as methacrylic acid esters such as butylcyclohexyl, methyl acrylate, ethyl acrylate, butyl acrylate, isopropyl acrylate, and 2-ethylhexyl acrylate Such monomers of the polymer above is illustrated.

  Furthermore, examples of the halogen-containing resin include a chlorinated polyethylene resin, a chlorinated polypropylene resin, and a fluororesin.

  Examples of elastomers include isobutylene / isoprene rubber, styrene / butadiene rubber, ethylene / propylene rubber, acrylic elastomer, silicone rubber, polyester elastomer, polyamide elastomer, MBS rubber, MAS rubber, acrylonitrile / styrene copolymer (AS resin) ), Acrylonitrile / butadiene / styrene copolymer (ABS resin), acrylonitrile / PPDM / styrene copolymer (AES resin), chlorinated polyethylene / acrylonitrile / styrene copolymer (ACS resin), acrylonitrile / acrylate / styrene copolymer Examples include coalescence (AAS resin), methyl methacrylate / styrene copolymer (MS resin), and the like.

Examples of the natural resin include rosin resin, gilsonite resin, shellac resin, cellulose acetate resin, methyl cellulose resin, ethyl cellulose resin, and thermoplastic starch.
In addition, polybutyral resin, polyvinyl alcohol resin, aromatic and aliphatic polyketone resin, polyether ether ketone resin, polyphenylene sulfide resin, polysulfone resin, polyether sulfone resin, phenoxy resin, polyphenylene oxide resin, poly-4-methylpentene-1, etc. Can be illustrated.

  Furthermore, the acid scavenger of the present invention can be suitably applied to a photoresist resin. Here, the photoresist resin is changed from alkali-insoluble to alkali-soluble by an acid generated from a substance that generates acid when irradiated with light (hereinafter abbreviated as a photoacid generator), and developed with an alkali developer. Then, a positive photoresist resin that forms a positive resist pattern, or a cross-linking reaction with an acid generated from a photoacid generator, changes from alkali-soluble to alkali-insoluble. When developed with an alkali developer, a negative resist pattern is formed. Examples thereof include a negative photoresist resin to be formed.

The acid scavenger of the present invention can be added at the stage from resin polymerization to melt processing.
The method for blending the acid scavenger of the present invention into the resin is not particularly limited, and it is added using a conventionally known kneading apparatus as a solution, melt or applied polymer masterbatch by a conventionally known method. Can do.

In kneading, a kneading method in a solution state or a kneading method in a molten state is preferable from the viewpoint of uniform kneading properties. The kneading apparatus is not particularly limited, and a conventionally known vertical kneading tank or a uniaxial or multiaxial horizontal kneading apparatus such as a uniaxial or multiaxial ruder or kneader is exemplified.
The kneading time with the polymer is not particularly limited, and the conditions under which the acid scavenger of the present invention is uniformly dispersed in the resin are preferable. The kneading time is 0.5 minutes to 2 hours, preferably 0.5 minutes to 30 minutes, more preferably 1 minute to 10 minutes, although it depends on the reaction apparatus and the kneading temperature.

The aforementioned solvent must be inert to the resin and acid scavenger of the present invention, have an affinity for both, and at least partially dissolve both, or at least partially both. Solvents that dissolve are preferred.
Examples of such solvents include hydrocarbon solvents such as hexane, cyclohexane, benzene, toluene, xylene, heptane, decane, and ketone solvents such as acetone, methyl ethyl ketone, diethyl ketone, cyclohehexanone, and isophorone. As ethyl acetate, methyl acetate, ethyl succinate, methyl carbonate, ethyl benzoate, diethylene glycol diacetate, etc., ether solvents include diethyl ether, dibutyl ether, tetrahydrofuran, dioxane, diethylene glycol dimethyl ether, triethylene glycol diethyl ether, Examples thereof include diphenyl ether.
These solvents may be used alone or as a mixed solvent as desired.

In the present invention, such a solvent is applied in the range of 1 to 1000 parts by weight per 100 parts by weight of the resin.
If it is less than 1 part by weight, there is no significance in applying the solvent. Moreover, although there is no upper limit in particular of solvent usage, it is about 1000 weight part from a viewpoint of operativity and operation efficiency.
The acid scavenging reaction proceeds sufficiently rapidly without a catalyst, but a catalyst that accelerates the reaction can be used if desired. The catalyst is preferably a compound having an effect of accelerating the reaction when added in a small amount.

Examples of such compounds include alkali metal compounds, alkaline earth metal compounds, tertiary amine compounds, imidazole compounds, quaternary ammonium salts, phosphine compounds, and phosphonium salts.
The addition amount of the reaction catalyst is not particularly limited, but is preferably 0.001 to 1 part by weight, and 0.01 to 0 when the total of the acidic group-containing compound and the cyclic carbodiimide is 100 parts by weight. 0.1 part by weight is more preferable, and 0.02 to 0.1 part by weight is even more preferable.

Although the acid scavenger of the present invention can effectively capture an acid, a conventionally known acid scavenger or acid acceptor can be used in combination as desired within the range not departing from the gist of the present invention.
As such conventionally known acid scavengers or acid acceptors,
For example, nitrogen-containing basic compounds having the following structures (ii-1) to (ii-5) can be used.

（式中、Ｒ^２５０、Ｒ^２５１およびＲ^２５２は、同一または異なり、水素原子、炭素数１〜６のアルキル基、炭素数１〜６のアミノアルキル基、炭素数１〜６のヒドロキシアルキル基または炭素数６〜２０の置換もしくは非置換のアリール基であり、ここでＲ^２５１とＲ^２５２は互いに結合して環を形成してもよい）

(Wherein R ²⁵⁰ , R ²⁵¹ and R ²⁵² are the same or different and are a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an aminoalkyl group having 1 to 6 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, or A substituted or unsubstituted aryl group having 6 to 20 carbon atoms, wherein R ²⁵¹ and R ²⁵² may combine with each other to form a ring)

（式中、Ｒ^２５３、Ｒ^２５４、Ｒ^２５５およびＲ^２５６は、同一または異なり、炭素数１〜６のアルキル基を示す。）

(In the formula, R ²⁵³ , R ²⁵⁴ , R ²⁵⁵ and R ²⁵⁶ are the same or different and represent an alkyl group having 1 to 6 carbon atoms.)

Further, a nitrogen-containing cyclic compound or a nitrogen-containing basic compound having two or more nitrogen atoms having different chemical environments in one molecule can also be used.
Examples of the nitrogen-containing cyclic compound include compounds represented by the following general formula (iii).

  In the formula, Y and W each independently represent a linear, branched or cyclic alkylene group which may contain a hetero atom and may be substituted. Here, examples of the hetero atom include a nitrogen atom, a sulfur atom, and an oxygen atom. The alkylene group preferably has 2 to 10 carbon atoms, more preferably 2 to 5 carbon atoms. Examples of the substituent of the alkylene group include a halogen atom and a halogen-substituted alkyl group in addition to an alkyl group having 1 to 6 carbon atoms, an aryl group, and an alkenyl group.

  Furthermore, specific examples of the compound represented by the general formula (iii) include nitrogen-containing cyclic compounds having the following structures (iii-1) to (iii-8).

  Among these, 1,5-diazabicyclo [4.3.0] non-5-ene (the above formula (iii-1)), 1,8-diazabicyclo [5.4.0] undec-7-ene (above Formula (iii-2)) is particularly preferred.

  The basic nitrogen-containing compound having two or more nitrogen atoms having different chemical environments in one molecule is particularly preferably a compound containing both a substituted or unsubstituted amino group and a ring structure containing a nitrogen atom. A compound having an alkylamino group.

  Preferred examples include substituted or unsubstituted guanidine, substituted or unsubstituted aminopyridine, substituted or unsubstituted aminoalkylpyridine, substituted or unsubstituted aminopyrrolidine, substituted or unsubstituted indazole, substituted or unsubstituted Pyrazole, substituted or unsubstituted pyrazine, substituted or unsubstituted pyrimidine, substituted or unsubstituted purine, substituted or unsubstituted imidazoline, substituted or unsubstituted pyrazoline, substituted or unsubstituted piperazine, substituted or unsubstituted amino Examples include morpholine and substituted or unsubstituted aminoalkylmorpholine. Preferred substituents are amino group, aminoalkyl group, alkylamino group, aminoaryl group, arylamino group, alkyl group, alkoxy group, acyl group, acyloxy group, aryl group, aryloxy group, nitro group, hydroxyl group, cyano group It is.

  Particularly preferred compounds include guanidine, 1,1-dimethylguanidine, 1,1,3,3-tetramethylguanidine, 2-aminopyridine, 3-aminopyridine, 4-aminopyridine, 2-dimethylaminopyridine, 4- Dimethylaminopyridine, 2-diethylaminopyridine, 2- (aminomethyl) pyridine, 2-amino-3-methylpyridine, 2-amino-4-methylpyridine, 2-amino-5-methylpyridine, 2-amino-6- Methylpyridine, 3-aminoethylpyridine, 4-aminoethylpyridine, 3-aminopyrrolidine, piperazine, N- (2-aminoethyl) piperazine, N- (2-aminoethyl) piperidine, 4-amino-2,2, 6,6-tetramethylpiperidine, 4-piperidinopiperidine, 2-iminopiperidine 1- (2-aminoethyl) pyrrolidine, pyrazole, 3-amino-5-methylpyrazole, 5-amino-3-methyl-1-p-tolylpyrazole, pyrazine, 2- (aminomethyl) -5-methylpyrazine, Pyrimidine, 2,4-diaminopyrimidine, 4,6-dihydroxypyrimidine, 2-pyrazoline, 3-pyrazoline, N-aminomorpholine, N- (2-aminoethyl) morpholine, trimethylimidazole, triphenylimidazole, methyldiphenyl Examples include imidazole.

Further, epoxy compounds described in US Pat. No. 4,137,201, amino-substituted triazines, polycondensates of amino-substituted triazines and formaldehyde, alkali metal or alkaline earth metal hydroxides, inorganic acids Salt, carboxylate or alkoxide, metal oxide, metal hydroxide, such as magnesium oxide, calcium oxide, zinc oxide, lead oxide, magnesium hydroxide, calcium hydroxide, Mg _a M _b (OH) _c CO _3. nH ₂ O (where M is Al, Cr or Fe, a is an integer of 1 to 10, b is an integer of 1 to 5, c is an integer of 10 to 20, and n is an integer of 0 to 8) The hydrotalcite stone group indicated by

  Examples of the epoxy compound include diglycidyl ethers of various polyglycols, particularly polyglycols derived by condensation of about 8 to 40 moles of ethylene oxide per mole of polyglycol, epoxidized ethers such as diglycidyl ether of glycerol, etc. Condensation product, diglycidyl ether of bisphenol A (ie, 4,4′-dihydroxydiphenyldimethylmethane), epoxidized unsaturated fatty acid ester (especially 2 to 4 carbon atoms of a fatty acid having 2 to 22 carbon atoms) Esters of alkyls with a degree of carbon atoms (eg, butyl epoxy stearate), and various epoxidized long chain fatty acid triglycerides (eg, epoxidized vegetable oils such as epoxidized soybean oil and other unsaturated natural oils (these) Sometimes epoxidized natural glycerides Others called unsaturated fatty acids, these fatty acids are each contains 12 to 22 carbon atoms)) are included. Particularly preferred are commercially available epoxy group-containing epoxide resin compounds “EPON” 815c and other epoxidized ether oligomer condensation products represented by the following general formula (iv).

These agents are added in an amount of 0.001 to 5 parts by weight, preferably 0.005 to 3 parts by weight, more preferably 0.007 to 1 part by weight per 100 parts by weight of the resin.
These agents can be used alone or in combination of a plurality of types.
Hereinafter, the present invention will be described with reference to examples. However, the present invention is not limited to the examples as long as the gist of the present invention is not exceeded.

Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited thereto.
The various agents used in this example are as follows.
(resin)
Polyacetal resin; manufactured by Asahi Kasei Chemicals Corporation: “Tenac” HC450,
Polycarbonate resin; manufactured by Teijin Chemicals Ltd .; "Panlite" L-1225WS
Polybutylene terephthalate; manufactured by Wintech Polymer Co., Ltd., IV = 0.92, trade name C7000Z
ABS resin; “Clarastic” SXH-330 manufactured by Japan A & L Co., Ltd.
Graft copolymer; “Metablene” C-223A manufactured by Mitsubishi Rayon Co., Ltd.
Fluorine-containing anti-drip agent; “Polyflon” MPA FA-500C manufactured by Daikin Industries, Ltd .;
(Flame retardants)
Phosphate ester flame retardant; manufactured by Daihachi Chemical Industry Co., Ltd .: CR-741 (bisphenol A bis (diphenyl phosphate)),
Brominated flame retardant: (1) ECX-30 manufactured by DIC Corporation, (2) "Fireguard" 7500 manufactured by Teijin Chemicals Ltd.,
Flame retardant aid (antimony trioxide); manufactured by Nippon Seiko Co., Ltd., trade name “PATOX” -M
A mixture of an antistatic agent sodium dodecylbenzenesulfonate and a polyoxyethylene derivative); Takemoto Yushi Co., Ltd., trade name TPL-456,
Fatty acid ester release agent; “Riquemar” SL-900 manufactured by Riken Vitamin Co., Ltd.
Phenol stabilizers; Ciba Specialty Chemicals K. K. “IRGANOX” 1076,
Metal phosphate (sodium dihydrogen phosphate dihydrate): Wako Pure Chemical Industries, special reagent grade (acid scavenger)
The following cyclic carbodiimide compounds were produced and used as acid scavengers.

[Production Example 1] Cyclic carbodiimide (CC1):
Reaction in which 200 ml of o-nitrophenol (0.11 mol), 1,2-dibromoethane (0.05 mol), potassium carbonate (0.33 mol), and N, N-dimethylformamide (DMF) were installed with a stirrer and a heating device The apparatus was charged in an N ₂ atmosphere and reacted at 130 ° C. for 12 hours. After that, DMF was removed under reduced pressure, and the resulting solid was dissolved in 200 ml of dichloromethane and separated three times with 100 ml of water. The organic layer was dehydrated with 5 g of sodium sulfate, and dichloromethane was removed under reduced pressure to obtain an intermediate product A (nitro form).
Next, intermediate product A (0.1 mol), 5% palladium carbon (Pd / C) (1 g), and 200 ml of ethanol / dichloromethane (70/30) were charged into a reactor equipped with a stirrer, and 5 hydrogen substitution was performed. The reaction is performed in a state where hydrogen is constantly supplied at 25 ° C., and the reaction is terminated when there is no decrease in hydrogen. When Pd / C was recovered and the mixed solvent was removed, an intermediate product B (amine body) was obtained.

Next, triphenylphosphine dibromide (0.11 mol) and 150 ml of 1,2-dichloroethane were charged and stirred in a reactor equipped with a stirrer, a heating device, and a dropping funnel in an N ₂ atmosphere. A solution prepared by dissolving intermediate product B (0.05 mol) and triethylamine (0.25 mol) in 50 ml of 1,2-dichloroethane was gradually added dropwise thereto at 25 ° C.
After completion of dropping, the reaction was carried out at 70 ° C. for 5 hours. Thereafter, the reaction solution was filtered, and the filtrate was separated 5 times with 100 ml of water. The organic layer was dehydrated with 5 g of sodium sulfate, and 1,2-dichloroethane was removed under reduced pressure to obtain an intermediate product C (triphenylphosphine compound).

Next, in a reactor equipped with a stirrer and a dropping funnel, di-tert-butyl dicarbonate (0.11 mol), N, N-dimethyl-4-aminopyridine (0.055 mol), dichloromethane under N ₂ atmosphere. 150 ml was charged and stirred. Thereto, 100 ml of dichloromethane in which the intermediate product C (0.05 mol) was dissolved was slowly added dropwise at 25 ° C. After dropping, the reaction was allowed to proceed for 12 hours. Then, the cyclic carbodiimide compound (CC1: MW = 252) which has a structure shown to a following formula was obtained by refine | purifying the solid substance obtained by removing dichloromethane. The structure of CC1 was confirmed by NMR and IR.

[Production Example 2] Cyclic carbodiimide compound (CC2)
o- nitrophenol (0.11 mol) and pentaerythrityl tetra bromide (0.025 mol), potassium carbonate (0.33mol), N, N- dimethylformamide 200ml in reactor installed with a stirrer and a heating device _{N 2} After charging in an atmosphere and reacting at 130 ° C. for 12 hours, DMF was removed under reduced pressure, and the resulting solid was dissolved in 200 ml of dichloromethane and separated three times with 100 ml of water. The organic layer was dehydrated with 5 g of sodium sulfate, and dichloromethane was removed under reduced pressure to obtain an intermediate product D (nitro form).

  Next, intermediate product D (0.1 mol), 5% palladium carbon (Pd / C) (2 g), and 400 ml of ethanol / dichloromethane (70/30) were charged into a reactor equipped with a stirrer, and 5 hydrogen substitution was performed. The reaction was performed in a state where hydrogen was constantly supplied at 25 ° C., and the reaction was terminated when there was no decrease in hydrogen. When Pd / C was recovered and the mixed solvent was removed, an intermediate product E (amine body) was obtained.

Next, triphenylphosphine dibromide (0.11 mol) and 150 ml of 1,2-dichloroethane were charged and stirred in a reactor equipped with a stirrer, a heating device, and a dropping funnel in an N ₂ atmosphere. A solution prepared by dissolving the intermediate product E (0.025 mol) and triethylamine (0.25 mol) in 50 ml of 1,2-dichloroethane was gradually added dropwise thereto at 25 ° C. After completion of dropping, the reaction is carried out at 70 ° C. for 5 hours. Thereafter, the reaction solution was filtered, and the filtrate was separated 5 times with 100 ml of water. The organic layer was dehydrated with 5 g of sodium sulfate, and 1,2-dichloroethane was removed under reduced pressure to obtain an intermediate product F (triphenylphosphine compound).

Next, in a reactor equipped with a stirrer and a dropping funnel, di-tert-butyl dicarbonate (0.11 mol), N, N-dimethyl-4-aminopyridine (0.055 mol), dichloromethane under N ₂ atmosphere. 150 ml was charged and stirred. Thereto, 100 ml of dichloromethane in which the intermediate product F (0.025 mol) was dissolved was slowly added dropwise at 25 ° C. After dropping, react for 12 hours. Then, the solid substance obtained by removing dichloromethane was purified to obtain a cyclic carbodiimide compound (CC2) having the following structure. The structure of CC2 was confirmed by NMR and IR.

  As other acid scavengers for comparison, linear carbodiimide, “Nisshinbo Chemical Co., Ltd.”, “Carbodilite” LA-1, Rhein Chemie Japan, “Stabakuzol” I was used.

[Example 1]
After 100 parts by weight of polyacetal resin, 0.1 part by weight of acid scavenger (CC1) is mixed with a blender, melt-kneaded with a twin screw extruder at a cylinder temperature of 210 ° C., a vent pressure of 3 kPa, and a residence time of 3 minutes, More extruded pellets.
On the mirror-polished aluminum test piece, the pellet was melted and held at 200 ° C. for 24 hours, no change in the specular color tone of the test piece due to corrosion by formic acid was observed, and the acid scavenger worked effectively, It was confirmed that a stable resin was obtained.

[Comparative Examples 1-3]
In Example 1, the acid scavenger was calcium stearate (Comparative Example 1) or linear polycarbodiimide (Comparative Example 2: “Carbodilite” LA-1 manufactured by Nisshinbo Chemical Co., Ltd.) (Comparative Example 3: Rhein Chemie Japan Co., Ltd.) “Stabuxol” I): The same corrosion test as in Example 1 was carried out except that the amount was changed to 0.1 parts by weight. Clouding due to corrosion by formic acid occurred.

[Example 2]
Polycarbonate: 82 parts by weight, fluorine-containing drip inhibitor: 0.45 parts by weight, graft copolymer: 4 parts by weight, phenol-based heat stabilizer: 0.1 parts by weight, and cyclic carbodiimide compound (CC2) 0.2 parts by weight Is mixed with a V-type blender, 18 parts by weight of ABS resin from the first supply port, and the phosphate ester flame retardant is heated to 80 ° C. from the side feeder (second supply port). A vent-type twin screw extruder (Japan Co., Ltd.) with a diameter of 30 mmφ is supplied from the third supply port in the middle (positioned between the second supply port and the vent exhaust port) to a predetermined ratio. Steelworks TEX30α-38.5BW-3V) were used to obtain pellets melt-kneaded at a vent vacuum of 3 kPa. In addition, about extrusion temperature, it was 260 degreeC from the 1st supply port to the die part.
When the obtained pellets were held on a metal aluminum test piece at 260 ° C. for 24 hours, no change in gloss of the test piece was observed. It was confirmed that the acid scavenger worked effectively and a stable resin was obtained.

[Comparative Example 4]
In the operation of Example 2, instead of the cyclic carbodiimide compound, an equal weight of 1,8-diazabicyclo [5.4.0] undec-7-ene, 1,5-diazabicyclo [4.3.0] non-5- En was used to make pellets.
When a corrosion test was performed on the test piece, the resin changed to blackish brown and decomposed, and the gloss of the test piece surface decreased.

[Example 3]
Polybutylene terephthalate resin: 74.4 parts by weight, bromo-based flame retardant (DICX ECX-30 manufactured by DIC Corporation): 15 parts by weight, bromo-based flame retardant (manufactured by Teijin Chemicals Ltd., “Fireguard” 7500): 4 Parts by weight, flame retardant aid (manufactured by Nippon Seiko Co., Ltd., “PATOX” -M): 4 parts by weight, phenol-based stabilizer: 0.2 parts by weight, and cyclic carbodiimide compound (CC2) as an acid scavenger 1 part by weight was mixed with a blender and melt-kneaded at a cylinder temperature of 260 ° C. using the apparatus of Example 2 and then extruded from a die and pelletized. When the pellet was melted on an aluminum test piece and kept at 260 ° C. for 24 hours, no change in gloss of the test piece was observed. It was confirmed that the acid scavenger worked effectively and a stable resin was obtained.

[Comparative Example 5]
In Example 3, the same operation was performed except that no acid scavenger was used. When the corrosivity of the test piece was evaluated, the surface gloss was greatly reduced, and corrosion considered to be due to hydrogen bromide was observed.

  According to the acid scavenger of the present invention, the low molecular weight acidic component contained in the resin can be efficiently captured, and the resin can be melt processed while suppressing the corrosive concern of the apparatus.

Claims (9)

A ring structure you express by the following structural formula formula (i), the number of atoms constituting the ring structure directly is 8-50, acid scavengers.

(In the formula, Q is a divalent to tetravalent linking group that is an aliphatic group, an alicyclic group, an aromatic group, or a combination thereof, and may contain a hetero atom or a substituent.)   The acid to be captured is at least one selected from the group consisting of halogen acids, carboxylic acid groups, sulfonic acid groups, acidic sulfuric acid groups, sulfinic acid groups, acidic sulfite groups, acidic phosphonic acid groups, acidic phosphoric acid groups, and acidic phosphinic acid groups. The acid scavenger according to claim 1, which is a compound having an acidic group.   The acid scavenger according to claim 2, wherein the compound has a molecular weight of 1000 or less.   A halogen acid, carboxylic acid group, sulfonic acid group, acidic sulfuric acid group, sulfinic acid group, acidic sulfite group, acidic phosphonic acid group other than the resin contained in the resin using the acid scavenger according to claim 1. A method for producing a stabilizing resin, wherein a free acid having at least one acidic group selected from the group consisting of an acidic phosphoric acid group and an acidic phosphinic acid group is captured.   The manufacturing method of Claim 4 whose resin is a thermoplastic resin.   The production method according to claim 5, wherein the thermoplastic resin contains at least one halogen element selected from the group consisting of fluorine, chlorine, bromine and iodine.   The thermoplastic resin is at least one selected from the group consisting of polyester, polycarbonate, polyacetal, polyamide, polyamide-imide, polyimide, polyurethane resin, graft copolymer, styrene resin, epoxy resin, phenol resin, and vinyl ester resin. The manufacturing method of Claim 5 containing resin.   The production method according to claim 5, wherein the thermoplastic resin contains at least one compound selected from a phosphorous acid compound, a phosphoric acid compound, a phosphinic acid compound, a phosphonic acid compound, and a sulfonic acid compound.   The manufacturing method according to claim 4, wherein the resin is a photoresist resin.