JP5407066B2 - Vehicle headlamp - Google Patents

Description

  The present invention has a light distribution pattern, for example, a low beam light distribution pattern (passing light distribution pattern) having an oblique cut-off line on the traveling lane side and a horizontal cut-off line on the opposite lane side at the elbow point. The present invention relates to a vehicle headlamp that irradiates the front of the vehicle.

  This type of vehicle headlamp has been conventionally used (for example, Patent Document 1 and Patent Document 2). Hereinafter, a conventional vehicle headlamp will be described. A conventional vehicle headlamp is a projector-type lamp unit, and includes a light source, an elliptical (convergent) reflector, a shade, and a projection lens. Hereinafter, the operation of the conventional vehicle headlamp will be described. When the light source is turned on, the light from the light source is reflected by the reflector, and a part of the reflected light is cut off by the shade to form a light distribution pattern having an oblique cutoff line and a horizontal cutoff line, and an oblique cutoff line and a horizontal cut. A light distribution pattern having an off-line is inverted (vertically and horizontally) from the projection lens and irradiated (projected) in front of the vehicle.

JP 2007-109493 A JP 2007-172882 A

  However, since conventional vehicle headlamps include a light source, a reflector, a shade, and a projection lens, the number of parts is large, and accordingly, there is a problem in miniaturization, weight reduction, and cost reduction. There is. Moreover, in the conventional vehicle headlamp, the number-of-components relationship between the light source and the optical element is the number-of-component relationship between the reflector, shade, and projection lens of one component of the light source and three components of the optical element (1: 3). It becomes. For this reason, in the conventional vehicle headlamp, an error of a combination of variations occurs in the reflector, shade, and projection lens of the three components of the optical element, and the combination of the reflector, shade, and projection lens of the three components of the optical element There is a problem with accuracy.

  The problems to be solved by the present invention are that the conventional vehicle headlamps have problems in miniaturization, weight reduction, and cost reduction, and the reflectors, shades, and projection lenses of the three components of the optical element are problematic. There is a problem in assembly accuracy.

The present invention (invention according to claim 1) is provided with one reflector having a reflecting surface made of a parabolic free-form surface and one semiconductor light source having a planar rectangular light emitting chip, and the light emitting chip Is positioned at or near the reference focal point of the reflecting surface and on the reference optical axis of the reflecting surface, the light emitting surface of the light emitting chip is oriented in the vertical axis direction, and the long side of the light emitting chip is the reference optical axis In addition, the reflecting surface is composed of a reflecting surface at the center portion and a reflecting surface at the end portion, and is parallel to the horizontal axis orthogonal to the vertical axis. and provided on a predetermined range of the opposite lane side, the light emitting chip reflected image oblique cutoff line and the horizontal cutoff and so as not to jump out from the offline part of the reflected image of the light emitting chip is oblique cutoff line and the horizontal cutoff A reflecting surface made of a free curved surface with light distribution control a reflection image of the light emitting chip so as to substantially contact with the in-reflective surface of the end portion, the predetermined range of the driving lane side and the opposite lane side from the reflecting surface of the central portion And the density of the reflected image group of the light emitting chip is lower than the density of the reflected image group of the light emitting chip by the reflection surface at the center, so that the reflected image of the light emitting chip is substantially within the light distribution pattern, and The reflection image group of the light emitting chip is a reflection surface made of a free curved surface for controlling the light distribution of the reflection image of the light emission chip so that the reflection image group of the light emission chip by the reflection surface of the central portion is included.

  This invention (invention according to claim 2) is characterized in that the reflection surface at the center is provided within a range in which the longitude angle is within ± 40 ° from the center of the light emitting chip.

  According to the present invention (the invention according to claim 3), the reflection surface in the central portion has a reflection image whose inclination with respect to the screen horizontal line of the reflection image of the light emitting chip is within an angle obtained by adding about 5 ° to the inclination angle of the oblique cutoff line. It is provided in the range to be provided.

  The present invention (the invention according to claim 4) is characterized in that the central reflection surface is provided within a high energy range in the energy distribution of the light emitting chip.

  In the present invention (the invention according to claim 5), the reflector has a substantially parabolic shape, the size of the opening of the reflector is about 100 mm or less, and the reference focal point of the reflecting surface is the reference optical axis. It is located between the center of the light emitting chip and the long side on the rear side of the light emitting chip, and the reference focal length of the reflecting surface is about 10 to 18 mm.

  According to the present invention (the invention according to claim 6), the reflecting surface and the semiconductor-type light source are such that the light emitting surface of the light emitting chip is the upper unit in the vertical axis direction and the light emitting surface of the light emitting chip is the lower side in the vertical axis direction. These units are arranged so as to be point-symmetric with respect to the unit.

  According to the vehicle headlamp of the present invention (the invention according to claim 1), the light emitted from the light emitting chip is reflected when the light emitting chip of the semiconductor-type light source is turned on by the means for solving the above problems. The light distribution pattern having an oblique cut-off line on the traveling lane side and a horizontal cut-off line on the opposite lane side is irradiated in front of the vehicle with the elbow point as a boundary. In other words, the reflected image of the light distribution chip reflected by the reflection surface in the central part is almost the same as the oblique cutoff line and the horizontal cutoff line so that the reflected image of the light emitting chip does not jump out of the oblique cutoff line and the horizontal cutoff line. Irradiates in front of the vehicle in contact. In addition, the reflection image of the light emitting chip reflected by the reflection surface at the end is substantially within the light distribution pattern, and the density of the reflection image group of the light emitting chip is reflected by the reflection surface of the central portion. It is irradiated in front of the vehicle so as to be lower than the density of the vehicle. As described above, the vehicle headlamp according to the present invention (the invention according to claim 1) is located near the oblique cutoff line on the traveling lane side of the light distribution pattern and the horizontal cutoff line on the opposite lane side of the light distribution pattern by the reflection surface at the center. Since the high luminous intensity zone is light-distributed, visibility in the distance is improved and stray light is not given to oncoming vehicles or pedestrians, thereby contributing to traffic safety.

  In addition, since the vehicle headlamp of the present invention (the invention according to claim 1) is composed of one reflector and one semiconductor-type light source, the parts are compared with the conventional vehicle headlamp. The number of points is small, and accordingly, downsizing, weight reduction, and cost reduction can be achieved. Moreover, in the vehicle headlamp according to the present invention (the invention according to claim 1), the number of parts between the light source and the optical element is the number of parts of one component of the semiconductor light source and one component of the reflector of the optical element. Relationship (1: 1). As a result, in the vehicle headlamp of the present invention (the invention according to claim 1), the number of parts between the light source and the optical element is related to the reflector, shade, and projection lens of one component of the light source and three components of the optical element. Compared with a conventional vehicle headlamp that has a component number relationship (1: 3), there is no error in the combination of variations on the optical element side, and the assembly accuracy of the reflector on the optical element side can be improved. it can.

  The vehicle headlamp according to the present invention (the invention according to claims 2, 3, 4, and 5) controls the light distribution of the optimal light distribution pattern for the vehicle by means for solving the above-mentioned problems. This makes it possible to reliably achieve both a reduction in the size of the lamp unit.

  Furthermore, the vehicle headlamp according to the present invention (invention according to claim 6) includes a reflecting surface and a semiconductor-type light source, wherein the light emitting surface of the light emitting chip has an upward unit in the vertical axis direction and the light emitting surface of the light emitting chip. They are arranged so that they are point-symmetric with respect to the downward downward unit in the vertical axis direction. As a result, the vehicular headlamp according to the present invention (the invention according to claim 6) can provide a light distribution pattern with sufficient light intensity even when the reflector is miniaturized. It is possible to more reliably achieve both light control and downsizing of the lamp unit.

FIG. 1 is a perspective view of a main part showing an embodiment of a vehicle headlamp according to the present invention. FIG. 2 is a front view showing a main part. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is an explanatory perspective view showing the relative positional relationship between the center of the light emitting chip and the reference focal point of the reflecting surface. FIG. 5 is an explanatory plan view showing the relative positional relationship between the center of the light emitting chip and the reference focal point of the reflecting surface. FIG. 6 is an explanatory front view illustrating a range in which a first reflecting surface including a fourth segment and a second reflecting surface including a fifth segment are provided. FIG. 7 is an explanatory diagram showing a reflection image of the light emitting chip obtained at the point P1 on the reflection surface. FIG. 8 is an explanatory diagram showing a reflected image of the light emitting chip obtained at points P2 and P3 on the reflecting surface. FIG. 9 is an explanatory view showing a reflected image of the light emitting chip obtained at points P4 and P5 on the reflecting surface. FIG. 10 is an explanatory diagram showing a reflected image group of the light-emitting chip obtained on the first reflecting surface composed of the fourth segment. FIG. 11 is an explanatory diagram showing a reflected image group of the light emitting chip obtained by the second reflecting surface composed of the fifth segment. FIG. 12 is an explanatory diagram showing a low beam light distribution pattern having an oblique cutoff line and a horizontal cutoff line.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a vehicle headlamp according to the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments. In the drawing, reference sign “VU-VD” indicates vertical lines on the upper and lower sides of the screen. Reference sign “HL-HR” indicates horizontal lines on the left and right of the screen. FIG. 10 and FIG. 11 are explanatory diagrams showing the reflected image group of the light-emitting chip on the screen obtained by computer simulation. In this specification and claims, “up, down, front, back, left, right” means “the vehicle headlight when the vehicle headlamp according to the present invention is attached to the vehicle (automobile)”. Top, bottom, front, back, left, right ".

(Description of configuration of embodiment)
Hereinafter, the configuration of the vehicle headlamp in this embodiment will be described. In the figure, reference numeral 1 denotes a vehicle headlamp (automobile headlamp) in this embodiment. As shown in FIG. 12, the vehicle headlamp 1 has an oblique cut-off line CL1 on the traveling lane side (left side) with an elbow point E as a boundary, and a horizontal cut-off line on the opposite lane side (right side). A light distribution pattern having CL 2, for example, a low beam light distribution pattern (passing light distribution pattern) LP is irradiated in front of the vehicle. The angle formed between the oblique cut-off line CL1 and the horizontal line HL-HR of the screen is about 15 °.

  The vehicle headlamp 1 includes a reflector 3 having an upper reflecting surface 2U and a lower reflecting surface 2D made of a parabolic free curved surface (NURBS curved surface), and a light emitting chip having a planar rectangular shape (planar rectangular shape). 4, one upper semiconductor light source 5U and one lower semiconductor light source 5D, a holder 6, a heat sink member 7, a lamp housing (not shown) and a lamp lens (for example, a transparent outer lens), It is composed of

  The holder 6 has a plate shape having an upper fixing surface and a lower fixing surface. The holder 6 is made of, for example, a resin member or a metal member having a high thermal conductivity. The heat sink member 7 has a trapezoidal shape having an upper fixing surface in the upper part, and has a fin shape from the middle part to the lower part. The heat sink member 7 is made of, for example, a resin member or a metal member having a high thermal conductivity.

  The reflector 3, the upper semiconductor light source 5U, the lower semiconductor light source 5D, the holder 6, and the heat sink member 7 constitute a lamp unit. That is, the reflector 3 is fixedly held by the holder 6. The upper semiconductor light source 5U is fixedly held on the upper fixing surface of the holder 6. The lower semiconductor light source 5D is fixedly held on the lower fixing surface of the holder 6. The holder 6 is fixedly held on the upper fixing surface of the heat sink member 7.

  The lamp units 3, 5U, 5D, 6, and 7 are disposed in a lamp chamber defined by the lamp housing and the lamp lens via, for example, an optical axis adjusting mechanism. In addition to the lamp units 3, 5U, 5D, 6, and 7, other lamp units such as a fog lamp, a cornering lamp, a clearance lamp, and a turn signal lamp may be disposed in the lamp chamber.

  The upper reflective surface 2U and the upper semiconductor light source 5U constitute an upper unit in which the light emitting surface of the light emitting chip 4 is upward in the vertical axis Y direction. Further, the lower reflective surface 2D and the lower semiconductor light source 5D constitute a downward unit in which the light emitting surface of the light emitting chip 4 faces downward in the vertical axis Y direction. The upper units 2U and 5U and the lower units 2D and 5D are arranged so as to be in a point-symmetric state with respect to the point O as shown in FIG. The reflective surface design of the upper reflective surface 2U and the reflective surface design of the lower reflective surface 2D are not simply point-symmetric (inverted).

  The reflector 3 is made of, for example, a light impermeable resin member. The reflector 3 has a substantially paraboloidal shape with an axis passing through the point symmetry point O as a rotation axis. The front side of the reflector 3 is opened in a substantially circular shape. The size of the opening on the front side of the reflector 3 is about 100 mm or less, preferably about 50 mm or less. On the other hand, the rear side of the reflector 3 is closed. A horizontally elongated substantially rectangular window portion 8 is provided in the middle portion of the closed portion of the reflector 3. The holder 6 is inserted into the window portion 8 of the reflector 3. The reflector 3 is fixedly held by the holder 6 on the outer side (rear side) of the closed portion.

  The upper reflective surface 2U and the lower reflective surface 2D are provided on the upper side and the lower side of the window portion 8 on the inner side (front side) of the closed portion of the reflector 3, respectively. The upper reflecting surface 2U and the lower reflecting surface 2D, which are parabolic free curved surfaces (NURBS curved surfaces), have a reference focal point (pseudo focal point) F and a reference optical axis (pseudo optical axis) Z. Between the upper reflective surface 2U and the lower reflective surface 2D, non-reflective surfaces 9 are provided on both the left and right sides of the window portion 8 on the inner side (front side) of the closed portion of the reflector 3. Yes.

  The semiconductor-type light sources 5U and 5D include a substrate 10, the light-emitting chip 4 provided on the substrate 10, and a thin rectangular parallelepiped sealing resin member 11 that seals the light-emitting chip 4. Yes. As shown in FIGS. 4 and 5, the light emitting chip 4 is formed by arranging five square chips in the horizontal axis X direction. A single rectangular chip may be used.

  The center O1 of the light emitting chip 4 is located at or near the reference focal point F of the reflecting surfaces 2U and 2D and on the reference optical axis Z of the reflecting surfaces 2U and 2D. The light emitting surface of the light emitting chip 4 (the surface opposite to the surface facing the substrate 10) is oriented in the vertical axis Y direction. That is, the light emitting surface of the light emitting chip 4 of the upper semiconductor light source 5U faces upward in the vertical axis Y direction. On the other hand, the light emitting surface of the light emitting chip 4 of the lower semiconductor light source 5D faces downward in the vertical axis Y direction. Further, the long side of the light emitting chip 4 is parallel to the horizontal axis X orthogonal to the reference optical axis Z and the vertical axis Y.

  The horizontal axis X, the vertical axis Y, and the reference optical axis Z constitute an orthogonal coordinate (XYZ orthogonal coordinate system) with the center O1 of the light emitting chip 4 as the origin. In the horizontal axis X, in the case of the upper units 2U and 5U, the right side is the + direction, the left side is the-direction, and in the case of the lower units 2D and 5D, the left side is the + direction and the right side Is the-direction. In the vertical axis Y, in the case of the upper units 2U and 5U, the upper side is the + direction, the lower side is the − direction, and in the case of the lower units 2D and 5D, the lower side is the + direction, and the upper side is -Direction. In the reference optical axis Z, the upper units 2U and 5U and the lower units 2D and 5D have a front side in the + direction and a rear side in the-direction.

  The reflection surfaces 2U and 2D are configured by parabolic free-form surfaces (NURBS curved surfaces). The reference focal points F of the reflecting surfaces 2U and 2D are located on the reference optical axis Z and between the center O1 of the light emitting chip 4 and the long side on the rear side of the light emitting chip 4, in this example. , Located on the long side on the rear side of the light emitting chip 4. The reference focal length of the reflecting surfaces 2U and 2D is about 10 to 18 mm.

  The reflection surfaces 2U and 2D are composed of segments 21, 22, 23, 24, 25, 26, 27, and 28 divided into eight in the vertical axis Y direction. The fourth segment 24 in the central part constitutes the first reflecting surface. Further, the fifth segment 25 in the center portion constitutes a second reflecting surface. Furthermore, the first segment 21, the second segment 22, the third segment 23, the sixth segment 26, the seventh segment 27, and the eighth segment 28 at the end constitute a third reflecting surface. That is, the reflection surfaces 2U and 2D are composed of a central reflection surface and an end reflection surface that are divided in the vertical axis Y direction. The central reflective surface is composed of the fourth segment 24 of the central first reflective surface and the fifth segment 25 of the central second reflective surface. The reflection surface at the end is the first segment 21, the second segment 22, the third segment 23, the sixth segment 26, the seventh segment 27, the eighth segment of the third reflection surface at the end. 28.

  The fourth segment 24 of the first reflecting surface at the center and the fifth segment 25 of the second reflecting surface are in a range Z1 between two vertical thick solid lines in FIG. It is provided in the range Z1 where the diagonal lines are given, that is, the range Z1 within the longitude angle ± 40 ° (± θ ° in FIG. 5) from the center O1 of the light emitting chip 4. The first segment 21, the second segment 22, the third segment 23, the sixth segment 26, the seventh segment 27, and the eighth segment 28 of the third reflecting surface at the end are within the range Z1. 6 is provided in the range of the white background in FIG.

  Hereinafter, a reflection image (screen mapping) of the light emitting chip 4 having a planar rectangular shape obtained in each of the segments 21 to 28 of the reflection surfaces 2U and 2D will be described with reference to FIG. 7, FIG. 8, and FIG. That is, at the boundary P1 between the fourth segment 24 and the fifth segment 25, as shown in FIG. 7, the reflected image I1 of the light emitting chip 4 having an inclination of about 0 ° with respect to the horizontal line HL-HR of the screen is obtained. can get. Further, at the boundary P2 between the third segment 23 and the fourth segment 24, as shown in FIG. 8, the reflected image I2 of the light emitting chip 4 having an inclination of about 20 ° with respect to the horizontal line HL-HR of the screen is obtained. can get. Further, at the boundary P3 between the fifth segment 25 and the sixth segment 26, as shown in FIG. 8, the reflected image I3 of the light emitting chip 4 having an inclination of about 20 ° with respect to the horizontal line HL-HR of the screen is obtained. can get. Furthermore, at the boundary P4 between the second segment 22 and the third segment 23, as shown in FIG. 9, the reflected image I4 of the light emitting chip 4 having an inclination of about 40 ° with respect to the horizontal line HL-HR of the screen. Is obtained. Furthermore, at the boundary P5 between the sixth segment 26 and the seventh segment 27, as shown in FIG. 9, the reflected image I5 of the light emitting chip 4 having an inclination of about 40 ° with respect to the horizontal line HL-HR of the screen. Is obtained.

  As a result, in the fourth segment 24 of the reflecting surfaces 2U and 2D, reflected images from the reflected image I1 having the inclination of about 0 ° shown in FIG. 7 to the reflected image I2 having the inclination of about 20 ° shown in FIG. can get. Further, in the fifth segment 25 of the reflecting surfaces 2U and 2D, a reflected image from a reflected image I1 having an inclination of about 0 ° shown in FIG. 7 to a reflected image I3 having an inclination of about 20 ° shown in FIG. 8 is obtained. It is done. Further, in the third segment 23 of the reflecting surfaces 2U and 2D, a reflected image from a reflected image I2 having an inclination of about 20 ° shown in FIG. 8 to a reflected image I4 having an inclination of about 40 ° shown in FIG. 9 is obtained. It is done. Furthermore, in the sixth segment 26 of the reflecting surfaces 2U and 2D, reflected images from the reflected image I3 having an inclination of about 20 ° shown in FIG. 8 to the reflected image I5 having an inclination of about 40 ° shown in FIG. can get. Furthermore, in the first segment 21, the second segment 22, the seventh segment 27, and the eighth segment 28 on the reflective surfaces 2U and 2D, a reflected image having an inclination of about 40 ° or more is obtained.

  Here, the reflected images from the reflected image I1 having the inclination of about 0 ° shown in FIG. 7 to the reflected images I2 and I3 having the inclination of about 20 ° shown in FIG. 8 are the oblique cut-off line CL1 of the low beam light distribution pattern LP. It is an optimum reflection image for forming a light distribution including That is, it is easy to make the reflected images from the reflected image I1 having an inclination of about 0 ° to the reflected images I2 and I3 having an inclination of about 20 ° along the oblique cutoff line CL1 having an inclination of about 15 °. . On the other hand, the reflected image including the reflected images I4 and I5 having an inclination of about 40 ° shown in FIG. 9 and having an inclination of about 20 ° or more forms a light distribution including the oblique cut-off line CL1 of the low beam distribution pattern LP. It is an inappropriate reflection image. That is, when a reflected image having an inclination of about 20 ° or more is made to follow the oblique cut-off line CL1 having an inclination of about 15 °, the light distribution becomes thick in the vertical direction, and excessive near light distribution (that is, distant visibility) This is because it results in a lower light distribution).

  Further, the light distribution in the oblique cut-off line CL1 is responsible for the far visual distribution. For this reason, it is necessary to form a high luminous intensity band (high energy band) for light distribution in the oblique cutoff line CL1. Therefore, the fourth segment 24 of the first reflecting surface in the central portion and the fifth segment 25 of the second reflecting surface are in the energy distribution (Lambertian) Z2 of the light emitting chip 4 as shown in FIG. In the high energy range Z3. In FIG. 3, the energy distribution of the lower semiconductor light source 5D is not shown.

  From the above, the optimum reflection surface for forming the light distribution in the oblique cutoff line CL1 is the range in which the reflection images I1 and I2 having an inclination of 20 ° or less among the reflection surfaces of the parabolic free-form surface, and the semiconductor It is determined from the relative relationship with the energy distribution (Lambertian) of the mold light sources 5U, 5D. As a result, the reflective surface optimal for forming the light distribution in the oblique cutoff line CL1, that is, the fourth segment 24 and the fifth segment 25 are within a longitude angle of ± 40 ° from the center O1 of the light emitting chip 4. The range in which the reflected images I1 and I2 of the light-emitting chip 4 are obtained within the range Z1 and having an inclination within an angle (about 20 °) obtained by adding about 5 ° to the inclination angle (about 15 °) of the oblique cutoff line CL1. And is provided within a high energy range Z3 in the energy distribution (Lambertian) Z2 of the light emitting chip 4.

  As shown in FIGS. 10 and 12, the first reflecting surface formed of the fourth segment 24 prevents the reflected images I1 and I2 of the light emitting chip 4 from jumping out from the oblique cutoff line CL1 and the horizontal cutoff line CL2. In addition, the reflected images I1 and I2 of the light emitting chip 4 are used for the low beam so that a part of the reflected images I1 and I2 of the light emitting chip 4 is substantially in contact with the oblique cutoff line CL1 and the horizontal cutoff line CL2. It is a reflecting surface formed of a free-form curved surface that controls light distribution in a range Z4 in the light distribution pattern LP.

  In addition, as shown in FIGS. 11 and 12, the second reflecting surface composed of the fifth segment 5 has the reflected images I1 and I3 of the light emitting chip 4 jumping out from the oblique cut-off line CL1 and the horizontal cut-off line CL2. The reflection images I1 and I3 of the light-emitting chip 4 are partially in contact with the oblique cutoff line CL1 and the horizontal cutoff line CL2, and the reflection images I1 and I3 of the light-emitting chip 4 The density of the group is lower than the density of the reflected images I1 and I2 of the light emitting chip 4 by the first reflecting surface composed of the fourth segment 24, and the reflected images I1 and I3 of the light emitting chip 4 are The light-emitting chip includes the reflected images I1 and I2 of the light-emitting chip 4 by the first reflecting surface including the fourth segment 24. It is a reflecting surface made of the reflection images I1, I3 of a free curved surface with light distribution control in the range Z5 containing the range Z4 in the light distribution pattern LP for low beam. Note that the density of the reflected images I1 and I2 of the single light emitting chip 4 and the density of the reflected images I1 and I3 of the single light emitting chip 4 are the same or substantially the same.

  Further, the third reflecting surface including the first segment 21, the second segment 22, the third segment 23, the sixth segment 26, the seventh segment 27, and the eighth segment 28 corresponds to the light emitting chip 4. The reflection images I4 and I5 of the light-emitting chip 4 are substantially contained in the low-beam light distribution pattern LP, and the density of the reflection images I4 and I5 of the light-emitting chip 4 is determined by the first reflection surface including the fourth segment 24. Reflected images I1 and I2 of the light-emitting chip 4 are lower than the reflected images I1 and I3 of the light-emitting chip 4 by the second reflecting surface composed of the reflected images I1 and I2 of the light-emitting chip 4 and the fifth segment 25. , I5 group includes the fourth segment 24, and the reflected images I1 and I2 of the light emitting chip 4 and the fifth segment 25 are reflected by the first reflecting surface. The reflected images I4 and I5 of the light-emitting chip 4 are included in the ranges Z4 and Z5 in the low-beam light distribution pattern LP so as to contain the reflected images I1 and I3 of the light-emitting chip 4 by the second reflecting surface. It is a reflective surface which consists of a free-form surface which controls light distribution in the range Z6 containing.

(Description of the operation of the embodiment)
Hereinafter, the vehicle headlamp 1 according to this embodiment has the above-described configuration, and the operation thereof will be described below.

  First, the light emitting chips 4 of the upper semiconductor light source 5U and the lower semiconductor light source 5D of the vehicle headlamp 1 are turned on. Then, light is emitted from the light emitting chips 4 of the upper semiconductor light source 5U and the lower semiconductor light source 5D. This light is reflected by the upper reflecting surface 2U and the lower reflecting surface 2D of the reflector 3. This reflected light is irradiated in front of the vehicle as a low beam light distribution pattern LP shown in FIG.

  That is, the reflected light from the first reflecting surface composed of the fourth segments 24 of the reflecting surfaces 2U and 2D is such that the reflected images I1 and I2 of the light emitting chip 4 do not jump out of the oblique cutoff line CL1 and the horizontal cutoff line CL2. The light distribution is controlled in the range Z4 in the low beam light distribution pattern LP so that a part of the reflected images I1 and I2 of the light emitting chip 4 is substantially in contact with the oblique cutoff line CL1 and the horizontal cutoff line CL2.

  In addition, the reflected light from the second reflecting surface made up of the fifth segments 25 of the reflecting surfaces 2U and 2D prevents the reflected images I1 and I3 of the light-emitting chip 4 from jumping out from the oblique cutoff line CL1 and the horizontal cutoff line CL2, and The reflection images I1 and I3 of the light-emitting chip 4 are partially in contact with the oblique cutoff line CL1 and the horizontal cutoff line CL2, and the density of the reflection images I1 and I3 of the light-emitting chip 4 is changed from the fourth segment 24. The light emitting chip 4 by the first reflecting surface is lower than the density of the reflected images I1 and I2 of the light emitting chip 4 by the first reflecting surface and the group of reflected images I1 and I3 of the light emitting chip 4 is composed of the fourth segment 24. The light distribution is controlled to a range Z5 including the range Z4 in the low beam light distribution pattern LP so as to include the reflected images I1 and I2 of

  Further, the reflected light from the third reflecting surface composed of the first segment 21, the second segment 22, the third segment 23, the sixth segment 26, the seventh segment 27, and the eighth segment 28 of the reflecting surfaces 2U and 2D is emitted. The light-emitting chip 4 by the first reflecting surface in which the density of the reflected images I4 and I5 of the light-emitting chip 4 is composed of the fourth segments 24 so that the reflected images I4 and I5 of the chip 4 are substantially within the low-beam light distribution pattern LP. The reflected images I1 and I2 of the light emitting chip 4 and the reflected images I4 and I5 of the light emitting chip 4 are the fourth segment. Reflected images I1 and I2 of the light emitting chip 4 by the first reflecting surface composed of 24 and reflected images I1 and I3 of the light emitting chip 4 by the second reflecting surface composed of the fifth segment 25. So as to contain, are light distribution controlled in the range Z6 containing the ranges Z4, Z5 in the light distribution pattern LP for low beam.

  As described above, the low beam light distribution pattern LP shown in FIG. 12 is irradiated in front of the vehicle.

(Explanation of effect of embodiment)
The vehicle headlamp 1 according to this embodiment has the above-described configuration and operation, and the effects thereof will be described below.

  The vehicular headlamp 1 in this embodiment has an oblique cut-off line CL1 on the traveling lane side (left side) and the opposite lane side (right side) of the low beam light distribution pattern LP by the first reflecting surface composed of the fourth segment 24. Because the high light intensity zone (range Z4) is light-distributed near the horizontal cut-off line CL2, the visibility in the distance is improved and no stray light is given to oncoming vehicles or pedestrians, resulting in traffic safety. Can contribute. Moreover, the vehicle headlamp 1 according to this embodiment has a low beam in which the medium luminous intensity zone (range Z5) whose light distribution is controlled by the second reflecting surface composed of the fifth segment 25 is controlled by the first reflecting surface. Including a high luminous intensity zone (range Z4) in the vicinity of the oblique cutoff line CL1 and horizontal cutoff line CL2 of the light distribution pattern LP, the high luminous intensity zone (range Z4) controlled by the first reflective surface; Low luminous intensity zone of the low beam distribution pattern LP as a whole, the light distribution of which is controlled by the third reflecting surface including the segment 21, the second segment 22, the third segment 23, the sixth segment 26, the seventh segment 27, and the eighth segment 28. (Range Z6) is connected by a medium luminous intensity zone (range Z5) in which light distribution is controlled by the second reflecting surface, resulting in a smooth change in luminous intensity. As a result, the vehicle headlamp 1 in this embodiment is a low-beam light distribution pattern LP having an oblique cut-off line CL1 and a horizontal cut-off line CL2, and has a low-beam light distribution pattern LP that is optimal for a vehicle. The light can be controlled.

  In addition, the vehicle headlamp 1 according to this embodiment includes one reflector 3, one upper semiconductor light source 5U, and one lower semiconductor light source 5D. Compared to an illumination lamp, the number of parts can be reduced, and accordingly, downsizing, weight reduction, and cost reduction can be achieved. Moreover, in the vehicle headlamp 1 according to this embodiment, the relationship between the number of parts of the light source and the optical element is one component of the upper semiconductor light source 5U and the lower semiconductor light source 5D and one structure of the reflector 3 of the optical element. The number of components (1: 1) with the components is established. As a result, in the vehicle headlamp 1 according to this embodiment, the number of parts of the light source and the optical element is related to the number of parts of the reflector, the shade, and the projection lens of one component of the light source and three parts of the optical element. Compared to a conventional vehicle headlamp of (1: 3), there is no error in the combination of variations on the optical element side, and the assembly accuracy of the reflector 3 on the optical element side can be improved.

  Further, in the vehicle headlamp 1 in this embodiment, the reflector 3 has a substantially parabolic shape, the size of the opening of the reflector 3 is about 100 mm or less, and the reference of the reflecting surfaces 2U and 2D The focal point F is on the reference optical axis Z and located between the center O1 of the light emitting chip 4 and the long side on the rear side of the light emitting chip 4, and the reference focal lengths of the reflecting surfaces 2U and 2D are about 10 to 18 mm. The first reflecting surface consisting of the fourth segment 24 and the second reflecting surface consisting of the fifth segment 25 are within a range Z1 whose longitude angle is within ± about 40 ° from the center O1 of the light emitting chip 4, and The inclination of the reflected image with respect to the screen horizontal line HL-HR corresponds to a range in which a reflected image is obtained within an angle (about 20 °) obtained by adding about 5 ° to the inclination angle (about 15 °) of the oblique cutoff line CL1; D of light emitting chip 4 It is provided within a high energy range Z3 in the energy distribution Z2. As a result, the vehicle headlamp 1 according to this embodiment can reliably achieve both the light distribution control of the low beam light distribution pattern LP that is optimal for vehicles and the miniaturization of the lamp unit. .

  Further, in the vehicle headlamp 1 according to this embodiment, the light emitting surface of the light emitting chip 4 includes an upper unit composed of an upward reflecting surface 2U and an upper semiconductor light source 5U with the upward direction in the vertical axis Y direction. The light emitting surface is arranged so as to be point-symmetric with the lower reflecting surface 2D facing downward in the vertical axis Y direction and the lower unit comprising the lower semiconductor light source 5D. As a result, the vehicular headlamp 1 according to this embodiment can sufficiently obtain the light intensity of the low beam light distribution pattern LP even if the reflector 3 is miniaturized. The light distribution control of the lamp unit and the miniaturization of the lamp unit can be achieved more reliably.

  In the embodiment described above, the low beam light distribution pattern LP is described as the light distribution pattern. However, in the present invention, as the light distribution pattern, a light distribution pattern other than the low beam light distribution pattern LP, for example, an expressway light distribution pattern, a fog lamp light distribution pattern, etc. Any light distribution pattern having an oblique cut-off line and a horizontal cut-off line on the opposite lane side may be used.

  Moreover, in the said embodiment, the vehicle headlamp 1 for left side driving lanes is demonstrated. However, the present invention can also be applied to a vehicle headlamp for the right lane.

  Further, in the above embodiment, the upper unit composed of the upper reflective surface 2U and the upper semiconductor light source 5U and the lower unit composed of the lower reflective surface 2D and the lower semiconductor light source 5D are point-symmetric. The vehicle headlamp 1 arranged in the state will be described. However, in the present invention, the vehicle headlamp is composed of only the upper unit composed of the upper reflective surface 2U and the upper semiconductor light source 5U, or comprises the lower reflective surface 2D and the lower semiconductor light source 5D. It may be a vehicle headlamp composed of only the lower unit.

  Furthermore, in the above-described embodiment, the first segment 21 to the eighth segment 28 are used as reflecting surfaces for forming the low beam light distribution pattern LP. However, in this invention, you may use the 1st segment 21 and the 8th segment 28 as a non-light-emission surface or a reflective surface which forms another light distribution pattern. Further, the lower portion and the upper portion of the fourth segment 24 and the fifth segment 25 may also be used as a non-light emitting surface or a reflecting surface for forming another light distribution pattern. good.

DESCRIPTION OF SYMBOLS 1 Vehicle headlamp 2U Upper reflective surface 2D Lower reflective surface 3 Reflector 4 Light emitting chip 5U Upper semiconductor type light source 5D Lower semiconductor type light source 6 Holder 7 Heat sink member 8 Window part 9 Non-reflective surface 10 Substrate 11 Sealing member 21 1st segment (3rd reflective surface, reflective surface at the end)
22 Second segment (third reflective surface, reflective surface at the end)
23 Third segment (third reflective surface, reflective surface at the end)
24 4th segment (first reflective surface, central reflective surface)
25 Fifth segment (second reflective surface, central reflective surface)
26 6th segment (3rd reflective surface, reflective surface at the end)
27 7th segment (third reflective surface, reflective surface at the end)
28 8th segment (third reflective surface, reflective surface at the end)
E Elbow point CL1 Oblique cut-off line CL2 Horizontal cut-off line LP Low beam light distribution pattern HL-HR Horizontal line on the screen VU-VD Vertical line on the screen O Point Target center point O1 Center of light emitting chip F Reflection surface Reference focus X Horizontal axis Y Vertical axis Z Reference optical axis of reflecting surface P1 Boundary between fourth segment and fifth segment P2 Boundary between third segment and fourth segment P3 Boundary between fifth segment and sixth segment P4 First Boundary between the second segment and the third segment P5 Boundary between the sixth segment and the seventh segment I1 Reflected image of the light emitting chip at the boundary P1 I2 Reflected image of the light emitting chip at the boundary P2 I3 Reflected image of the light emitting chip at the boundary P3 I4 Boundary P4 Reflected image of light-emitting chip at I5 Light emission at boundary P5 Reflection image of chip Z1 Longitude angle within ± 40 ° from center of light emitting chip Z2 Energy distribution range of light emitting chip Z3 High energy range Z4 Light distribution range by first reflection surface Z5 Light distribution range by second reflection surface Z6 Light distribution range by the third reflecting surface

Claims (6)

In the vehicle headlamp that irradiates the front of the vehicle with a light distribution pattern having an oblique cutoff line on the traveling lane side and a horizontal cutoff line on the opposite lane side, with the elbow point as a boundary,
One reflector having a reflecting surface made of a parabolic free-form surface;
One semiconductor-type light source having a planar rectangular light emitting chip;
With
The center of the light emitting chip is located at or near the reference focal point of the reflecting surface, and located on the reference optical axis of the reflecting surface,
The light emitting surface of the light emitting chip is oriented in the vertical axis direction,
The long side of the light emitting chip is parallel to a horizontal axis orthogonal to the reference optical axis and the vertical axis,
The reflective surface is composed of a central reflective surface and an end reflective surface,
The reflection surface of the central portion is provided in a predetermined range on the traveling lane side and the opposite lane side across the vertical axis, and the reflected image of the light emitting chip is from the oblique cutoff line and the horizontal cutoff line. A reflecting surface formed of a free-form surface that controls light distribution of the reflected image of the light-emitting chip so that the reflected image of the light-emitting chip is substantially in contact with the oblique cut-off line and the horizontal cut-off line so as not to jump out. And
The reflection surface of the end portion is provided in a predetermined range from the reflection surface of the central portion to the traveling lane side and the opposite lane side so that the reflected image of the light emitting chip is substantially within the light distribution pattern. Thus, the density of the reflected image group of the light emitting chip is lower than the density of the reflected image group of the light emitting chip by the reflecting surface of the central portion, and the reflected image group of the light emitting chip is the reflecting surface of the central portion. A reflection surface composed of a free-form surface that controls the light distribution of the reflection image of the light-emitting chip so as to contain the reflection image group of the light-emitting chip according to
A vehicle headlamp characterized by that. The reflection surface of the central portion is provided within a range in which a longitude angle is within ± about 40 ° from the center of the light emitting chip,
The vehicle headlamp according to claim 1. The reflection surface of the central portion is provided within a range where a reflection image in which the inclination of the reflection image of the light emitting chip with respect to the screen horizontal line is within an angle obtained by adding about 5 ° to the inclination angle of the oblique cutoff line is obtained. ,
The vehicle headlamp according to claim 1 or 2, characterized in that The reflection surface of the central portion is provided in a high energy range in the energy distribution of the light emitting chip.
The vehicle headlamp according to any one of claims 1 to 3, wherein The reflector has a substantially parabolic shape,
The size of the opening of the reflector is about 100 mm or less in diameter,
The reference focal point of the reflecting surface is located on the reference optical axis and between the center of the light emitting chip and the long side on the rear side of the light emitting chip,
The reference focal length of the reflecting surface is about 10 to 18 mm.
The vehicle headlamp according to any one of claims 1 to 4, wherein In the reflecting surface and the semiconductor light source, the light emitting surface of the light emitting chip is point-symmetric with the unit on the upper side in the vertical axis direction and the light emitting surface of the light emitting chip on the lower side in the vertical axis direction. Arranged to be in the state of
The vehicular headlamp according to any one of claims 1 to 5, wherein

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