JP5394891B2 - Manufacturing method for manufacturing coaxial connector for substrate - Google Patents

Manufacturing method for manufacturing coaxial connector for substrate Download PDF

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JP5394891B2
JP5394891B2 JP2009255277A JP2009255277A JP5394891B2 JP 5394891 B2 JP5394891 B2 JP 5394891B2 JP 2009255277 A JP2009255277 A JP 2009255277A JP 2009255277 A JP2009255277 A JP 2009255277A JP 5394891 B2 JP5394891 B2 JP 5394891B2
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carrier
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cylindrical portion
coaxial connector
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JP2011100660A (en
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秀典 神田
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Yazaki Corp
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本発明は、プリント基板に取り付けられる基板用同軸コネクタを製造する製造方法に関するものである。   The present invention relates to a manufacturing method for manufacturing a coaxial connector for a board to be attached to a printed board.

プリント基板に取り付けられる従来の基板用シールドコネクタとして、図17に示すものが知られている。この基板用シールドコネクタ10は、プリント基板上の信号パターンと半田接続される内導体端子11を誘電体12の内部に保持しこの誘電体12を外導体端子13が収容してなるコネクタ端子14が、樹脂製のコネクタハウジング15に収容されたもので構成されている。内導体端子11には、図示しないシールド電線の信号線が接続され、高周波信号が伝達されるようになっており、外導体端子13は、シールド電線のシールド線と接続され、内導体端子11の周囲を覆って電磁的に遮蔽する。   As a conventional board shield connector attached to a printed circuit board, one shown in FIG. 17 is known. The board shield connector 10 includes an inner conductor terminal 11 soldered to a signal pattern on a printed board, and a connector terminal 14 in which the outer conductor terminal 13 accommodates the dielectric 12. The connector housing 15 is made of resin. A signal line of a shielded wire (not shown) is connected to the inner conductor terminal 11 so that a high frequency signal is transmitted. The outer conductor terminal 13 is connected to the shielded wire of the shielded wire, and the inner conductor terminal 11 Cover the surroundings and shield electromagnetically.

内導体端子11は、導電性板材を打ち抜き加工することにより、ピン状の水平部16の基端から垂下部17が下方に垂下された略逆L字形状に形成されている。ピン状の水平部16の基端側は、その先端側よりやや太径に形成されており、係止突起18を備えている。そして、水平部16の先端側が図示しない相手側シールドコネクタの内導体端子と接続され、垂下部17の先端側がプリント基板の所望の信号パターンと接続されることで、シールド電線とプリント基板との間の電気信号の受け渡しが行なわれる。   The inner conductor terminal 11 is formed in a substantially inverted L shape in which a drooping portion 17 hangs downward from the base end of the pin-like horizontal portion 16 by punching a conductive plate material. The proximal end side of the pin-shaped horizontal portion 16 is formed to have a slightly larger diameter than the distal end side, and includes a locking projection 18. And the front end side of the horizontal part 16 is connected with the inner conductor terminal of the other party shield connector which is not shown in figure, and the front end side of the drooping part 17 is connected with the desired signal pattern of a printed circuit board, between a shield electric wire and a printed circuit board. The electrical signal is transferred.

内導体端子11が収容される誘電体12は、所定の誘電率を有する樹脂製の絶縁性材料で成形されており、内導体端子11と外導体端子13との間に組付けられて、これらの間を絶縁状態にする。誘電体12は、縦長の開口面19を有する収容室20が内部に形成されており、収容室20の前方側には、水平筒部21が延設形成されている。   The dielectric 12 in which the inner conductor terminal 11 is accommodated is formed of a resin insulating material having a predetermined dielectric constant, and is assembled between the inner conductor terminal 11 and the outer conductor terminal 13. Between the two. In the dielectric 12, a storage chamber 20 having a vertically long opening surface 19 is formed inside, and a horizontal cylindrical portion 21 is formed to extend in front of the storage chamber 20.

水平筒部21の内部には、内導体端子11のピン状の水平部16が挿入される挿入孔22が前後方向に開口形成されており、後方側が収容室20に連通している。この挿入孔22に内導体端子11の水平部16を挿入すると、先端側よりやや太径の基端側に膨出形成された係止突起18により圧入されて、内導体端子11が誘電体12に保持されるようになっている。   An insertion hole 22 into which the pin-like horizontal portion 16 of the inner conductor terminal 11 is inserted is formed in the horizontal cylinder portion 21 in the front-rear direction, and the rear side communicates with the storage chamber 20. When the horizontal portion 16 of the inner conductor terminal 11 is inserted into the insertion hole 22, the inner conductor terminal 11 is press-fitted by the locking protrusion 18 that is formed to bulge from the distal end side to the proximal end side having a slightly larger diameter. Is supposed to be retained.

外導体端子13は、導電性板材を型抜きした後、プレス等による折り曲げ加工によって円筒状に形成されており、内部の収容室23に誘電体12が収容可能になっている。前方の先端部分は、相手側シールドコネクタの外導体端子と嵌合される嵌合部24となっており、収容室23に収容された誘電体12の挿入孔に挿入された内導体端子11の水平部16の先端が誘電体12から突出されて嵌合部24内に配置されている。   The outer conductor terminal 13 is formed in a cylindrical shape by punching a conductive plate material and then bent by a press or the like, and the dielectric 12 can be accommodated in the internal accommodation chamber 23. The front tip portion is a fitting portion 24 to be fitted with the outer conductor terminal of the mating shield connector, and the inner conductor terminal 11 inserted into the insertion hole of the dielectric 12 accommodated in the accommodation chamber 23. The tip of the horizontal portion 16 protrudes from the dielectric 12 and is disposed in the fitting portion 24.

外導体端子13の中央部分上面には、係止片25が上方に向けて撓み変形可能に突設されている。外導体端子13の上面後端には、後方の開口部26を覆う大きさとなる折り曲げ片27が延設形成されており、下方に折り曲げることで、外導体端子13の収容室23に収容された誘電体12を後方から覆って後方の開口部26を塞いで、基板用シールドコネクタ10のシールド性能の低下を防止することが可能となっている。   On the upper surface of the central portion of the outer conductor terminal 13, a locking piece 25 is provided so as to project upward and bendable. A bent piece 27 having a size covering the rear opening 26 is extended and formed at the rear end of the upper surface of the outer conductor terminal 13, and is accommodated in the accommodation chamber 23 of the outer conductor terminal 13 by bending downward. The dielectric 12 is covered from behind and the rear opening 26 is closed to prevent the shield performance of the board shield connector 10 from being deteriorated.

外導体端子13の後部には、プリント基板のグランドパターンと電気的に接続される接続部28が2箇所、下方に延設形成されている。接続部28は、スリット状の空隙部が形成されて基端から先端に向けて分岐する一対の弾性接続片30、30を有している。一対の弾性接続片30、30の先端には、係止部31が膨出形成されており、プリント基板のグランドパターンと電気的に接続される貫通孔の開口縁に係止可能になっている(例えば、特許文献1参照)。   At the rear portion of the outer conductor terminal 13, two connection portions 28 that are electrically connected to the ground pattern of the printed circuit board are formed extending downward. The connection portion 28 has a pair of elastic connection pieces 30 and 30 which are formed with slit-like voids and branch from the proximal end toward the distal end. A locking portion 31 is formed to bulge at the tip of the pair of elastic connection pieces 30 and 30 and can be locked to the opening edge of the through hole that is electrically connected to the ground pattern of the printed circuit board. (For example, refer to Patent Document 1).

このように、前記基板用シールドコネクタ10は、内導体端子11が導電性板材を打ち抜いて形成され、外導体端子13は導電性板材を型抜きした後、プレスにより折り曲げ加工して形成されている。そして、内導体端子11を誘電体12に保持し、外導体端子13の収容室23に誘電体12を収容し、この誘電体12の挿入孔22に、前記内導体端子11の水平部16を挿入しかつ突出させるようにして、基板用シールドコネクタ10が組み付けられる。   Thus, the board shield connector 10 is formed by punching the conductive plate material with the inner conductor terminal 11, and the outer conductor terminal 13 is formed by punching the conductive plate material and then bending it with a press. . The inner conductor terminal 11 is held by the dielectric 12, the dielectric 12 is accommodated in the accommodation chamber 23 of the outer conductor terminal 13, and the horizontal portion 16 of the inner conductor terminal 11 is inserted into the insertion hole 22 of the dielectric 12. The board shield connector 10 is assembled so as to be inserted and protruded.

特開2008‐59761号公報JP 2008-59761 A

上述した従来の基板用シールドコネクタは、解決すべき以下の問題を有している。
即ち、内導体端子11と外導体端子13のプレス成形が各1回(合計2回)、誘電体12とコネクタハウジング15の樹脂成形が各1回(合計2回)、内導体端子11の誘電体12に対する圧入、誘電体12の外導体端子13に対する圧入、外導体端子13のコネクタハウジング15に対する圧入が各1回(合計3回)の作業工程を要し、結果的に工数増加によるコネクタ製造の効率が悪く、組立コストおよび製品コストの上昇を免れ得ないという不都合がある。
The conventional board shield connector described above has the following problems to be solved.
That is, the inner conductor terminal 11 and the outer conductor terminal 13 are press-molded once (total two times), the resin 12 and the connector housing 15 are resin-molded once (total two times), and the inner conductor terminal 11 dielectric The press-fitting to the body 12, the press-fitting of the dielectric 12 to the outer conductor terminal 13, and the press-fitting of the outer conductor terminal 13 to the connector housing 15 each require one work process (total of three times), resulting in connector manufacturing due to increased man-hours Inefficiency is inferior, and there is an inconvenience that an increase in assembly cost and product cost cannot be avoided.

本発明は、上述した事情に鑑みてなされたものであり、その目的は、コネクタの製造効率を改善可能にして、以って組立コストおよび製品コストの低減を図ることができる基板用同軸コネクタを製造する製造方法を提供することにある。   The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a coaxial connector for a board that can improve the manufacturing efficiency of the connector, thereby reducing assembly cost and product cost. It is in providing the manufacturing method to manufacture.

前述した目的を達成するために、本発明に係る基板用同軸コネクタを製造する製造方法は、下記(1)を特徴としている。
(1) 下側の一部が除かれ開口が形成された、第1のキャリアのうちの半円筒状に成形された半円筒状部に連設された半円筒部を有するアウター端子が前記第1のキャリアから連鎖状に延設された第1の連鎖端子と、前記アウター端子の前記半円筒部にその下側の一部から収容可能な、前記第2のキャリアに連設された本体部を有するインナー端子が前記第2のキャリアから連鎖状に延設された第2の連鎖端子と、から、プリント基板に取り付けられる基板用同軸コネクタを製造する製造方法であって、
前記第2のキャリアの前記本体部が連設された側とは反対側に前記第1のキャリアを並べて配置することによって、前記インナー端子の前記本体部を前記アウター端子の前記半円筒部に収容するとともに、前記第2のキャリアを前記アウター端子に接触しないように該半円筒部の前記開口に臨ませ、
前記アウター端子の前記半円筒部の内部の空間を、前記第2のキャリアから前記本体部に向けてスライドする型で埋めるとともに、前記アウター端子の前記半円筒部および前記インナー端子の本体部の周囲を囲うように、金型内に前記第1の連鎖端子と前記第2の連鎖端子を収納し、
前記第1の連鎖端子と前記第2の連鎖端子が収納された前記金型内に絶縁物を注入してフープ成形し、
前記第1のキャリアの前記半円筒状部の両側を切断するとともに、前記本体部に連設された箇所を残すように前記第2のキャリアを切断する、
こと。
In order to achieve the above-described object, a manufacturing method for manufacturing a coaxial connector for a substrate according to the present invention is characterized by the following (1).
(1) An outer terminal having a semi-cylindrical portion connected to a semi-cylindrical portion formed in a semi-cylindrical shape of the first carrier, in which a part of the lower side is removed and an opening is formed. A first chain terminal extending in a chain from one carrier, and a main body part connected to the second carrier that can be accommodated in the semi-cylindrical part of the outer terminal from a part of the lower side thereof A manufacturing method for manufacturing a coaxial connector for a board to be attached to a printed circuit board from an inner terminal having a second chain terminal extending in a chain form from the second carrier,
The main body portion of the inner terminal is accommodated in the semi-cylindrical portion of the outer terminal by arranging the first carrier side by side on the side opposite to the side where the main body portion of the second carrier is continuously provided. And facing the opening of the semi-cylindrical portion so that the second carrier does not contact the outer terminal,
The space inside the semi-cylindrical portion of the outer terminal is filled with a mold that slides from the second carrier toward the main body portion, and around the semi-cylindrical portion of the outer terminal and the main body portion of the inner terminal. Enclosing the first chain terminal and the second chain terminal in a mold,
Injecting an insulator into the mold containing the first chain terminal and the second chain terminal to form a hoop,
Cutting both sides of the semi-cylindrical portion of the first carrier, and cutting the second carrier so as to leave a portion connected to the main body portion;
about.

上記(1)の構成の基板用同軸コネクタを製造する製造方法によれば、キャリア付きインナー端子とキャリア付きアウター端子の1回のフープ成形によってキャリア付き同軸コネクタが効率的かつ簡単に得られ、従来のような端子およびハウジングの複数回の圧入作業を要することなく、簡単にしかもローコストに同軸コネクタを製造することができる。   According to the manufacturing method for manufacturing a coaxial connector for a substrate having the configuration of (1) above, a coaxial connector with a carrier can be obtained efficiently and easily by one hoop molding of an inner terminal with a carrier and an outer terminal with a carrier. Thus, the coaxial connector can be manufactured easily and at low cost without requiring multiple press-fitting operations of the terminal and the housing.

本発明によれば、1回の成形工程および1回のキャリアカット工程で、同軸コネクタを効率よく製造することができ、従来品に比べて組立コストおよび製品コストを大幅に低減できる。   According to the present invention, the coaxial connector can be efficiently manufactured by one molding step and one carrier cutting step, and the assembly cost and product cost can be greatly reduced as compared with the conventional product.

以上、本発明について簡潔に説明した。更に、以下に説明される発明を実施するための形態を添付の図面を参照して通読することにより、本発明の詳細は更に明確化されるであろう。   The present invention has been briefly described above. Further, details of the present invention will be further clarified by reading through the modes for carrying out the invention described below with reference to the accompanying drawings.

本発明の実施形態にかかる基板用同軸コネクタを示す斜視図である。It is a perspective view showing a coaxial connector for substrates concerning an embodiment of the present invention. 図1に示す基板用同軸コネクタを下方から見た斜視図である。It is the perspective view which looked at the coaxial connector for substrates shown in Drawing 1 from the lower part. 図1に示す基板用同軸コネクタの縦断面斜視図である。It is a longitudinal cross-sectional perspective view of the coaxial connector for board | substrates shown in FIG. 本発明の実施形態にかかる基板用同軸コネクタに用いられるアウター端子(キャリア付き)の斜視図である。It is a perspective view of the outer terminal (with a carrier) used for the coaxial connector for substrates concerning the embodiment of the present invention. 本発明の実施形態にかかる基板用同軸コネクタに用いられるインナー端子(キャリア付き)の斜視図である。It is a perspective view of the inner terminal (with a carrier) used for the coaxial connector for substrates concerning the embodiment of the present invention. 図4および図5にそれぞれ示すアウター端子とインナー端子を上下に重ねた状態の斜視図である。FIG. 6 is a perspective view of an outer terminal and an inner terminal shown in FIG. 4 and FIG. 図6に示すように重ねたアウター端子とインナー端子の平面図である。It is a top view of the outer terminal and inner terminal which were accumulated as shown in FIG. 図6に示すように重ねたアウター端子とインナー端子の下面図である。It is a bottom view of the outer terminal and inner terminal which were accumulated as shown in FIG. 本発明の実施形態にかかる基板用同軸コネクタの製造に用いる金型を示す分解斜視図である。It is a disassembled perspective view which shows the metal mold | die used for manufacture of the coaxial connector for boards concerning embodiment of this invention. 図9に示す金型の型閉め状態の斜視図である。FIG. 10 is a perspective view of the mold shown in FIG. 9 in a closed state. 図10に示す金型の型閉め状態の縦断面斜視図である。It is a longitudinal cross-sectional perspective view of the mold closing state of the metal mold | die shown in FIG. 図10に示す金型を斜め下方から見た斜視図である。It is the perspective view which looked at the metal mold | die shown in FIG. 10 from diagonally downward. 型開きされたキャリア付きの基板用同軸コネクタを示す斜視図である。It is a perspective view which shows the coaxial connector for board | substrates with the carrier opened the mold. 図13に示すキャリア付きの基板用同軸コネクタの縦断面斜視図である。It is a longitudinal cross-sectional perspective view of the coaxial connector for substrates with a carrier shown in FIG. 図13に示すキャリア付きの基板用同軸コネクタに対するキャリアカット型の配置状況を示す斜視図である。It is a perspective view which shows the arrangement | positioning condition of the carrier cut type | mold with respect to the coaxial connector for substrates with a carrier shown in FIG. 図15に示すキャリアカット型を矢印U方向から見た斜視図である。It is the perspective view which looked at the carrier cut type | mold shown in FIG. 15 from the arrow U direction. 従来の基板用シールドコネクタを示す縦断面図である。It is a longitudinal cross-sectional view which shows the conventional shield connector for substrates.

以下、本発明の一実施の形態にかかる基板用同軸コネクタの製造方法を図面を参照して説明する。本実施形態により製造される基板用同軸コネクタPは、図1〜図3に示すように、アウターハウジング(コネクタハウジング)41と、アウター端子(外導体端子)42と、インナー端子(内導体端子)43と、インナーハウジングEと、を備える。   Hereinafter, a method for manufacturing a coaxial connector for a substrate according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 3, the coaxial connector P for board manufactured according to this embodiment includes an outer housing (connector housing) 41, an outer terminal (outer conductor terminal) 42, and an inner terminal (inner conductor terminal). 43 and an inner housing E.

アウターハウジング41は、アウター端子42およびインナー端子43のうち相手側コネクタのアウター端子およびインナー端子と接続される部分を所定間隔おいて内部に収納している。ここで、アウターハウジング41はアウター端子42およびインナー端子43の外部を被い、アウター端子42はインナー端子43を所定間隔おいて被っている。アウター端子42およびインナー端子43は後述の金型C内に収容され、アウターハウジング41の合成樹脂(絶縁物、誘電体)によるフープ成形によって、上述の形状に形成される。   The outer housing 41 accommodates portions of the outer terminal 42 and the inner terminal 43 that are connected to the outer terminal and the inner terminal of the mating connector inside at a predetermined interval. Here, the outer housing 41 covers the outer terminals 42 and the inner terminals 43, and the outer terminals 42 cover the inner terminals 43 at a predetermined interval. The outer terminal 42 and the inner terminal 43 are accommodated in a mold C which will be described later, and are formed into the above-described shape by hoop molding of the outer housing 41 with a synthetic resin (insulator, dielectric).

前記アウター端子42はインナー端子43に対し幾分長目であり、アウターハウジング41とアウター端子42との間には、相手側コネクタのアウターハウジング41が挿入可能な間隙G1が設けられ、アウター端子42とインナー端子43との間には、相手側コネクタのインナーハウジングの一部が挿入される間隙G3が設けられている。   The outer terminal 42 is somewhat longer than the inner terminal 43, and a gap G 1 into which the outer housing 41 of the mating connector can be inserted is provided between the outer housing 41 and the outer terminal 42. A gap G3 into which a part of the inner housing of the mating connector is inserted is provided between the inner terminal 43 and the inner terminal 43.

更に、インナー端子43とアウターハウジング41の間には、相手側コネクタのアウターハウジングが挿入される間隙G2が形成されている。また、必要に応じて、アウターハウジング41の天部および底部には、相手側コネクタの係止部を嵌合する嵌合孔やガイドなどが形成される。なお、図3に示すように、アウターハウジング41の成形時にインナー端子43の回りに合成樹脂が注入された部分Eが、インナー端子43とアウター端子42とを絶縁するインナーハウジングEとして機能する。   Further, a gap G2 into which the outer housing of the mating connector is inserted is formed between the inner terminal 43 and the outer housing 41. Further, if necessary, fitting holes, guides, and the like are formed in the top and bottom portions of the outer housing 41 to fit the locking portions of the mating connector. As shown in FIG. 3, the portion E into which the synthetic resin is injected around the inner terminal 43 when the outer housing 41 is molded functions as the inner housing E that insulates the inner terminal 43 from the outer terminal 42.

次に、かかる構成の基板用同軸コネクタPの詳細を、基板用同軸コネクタPを製造する製造方法とともに、図4〜図16を参照しながら説明する。この基板用同軸コネクタPの製造方法に当たっては、図4〜図8に示すように、導電性金属板のプレス成形によって得られたキャリア付きアウター端子Aおよびキャリア付きインナー端子Bが用意され、これらが重ね合わせるように用いられる。尚、図4〜図8では、一つのアウター端子Aまたはインナー端子Bがキャリアに延設されている場合を示しているが、キャリアには複数個のアウター端子Aまたは複数個のインナー端子Bが該キャリアの一方側に連鎖状に延設されている。このように、複数個のアウター端子Aまたは複数個のインナー端子Bが連鎖状に延設されたものを連鎖端子と称する。また、キャリアに連設された状態にあるアウター端子Aまたはインナー端子Bを、以後、キャリア付きアウター端子Aまたはキャリア付きインナー端子Bと称することがある。   Next, details of the board coaxial connector P having such a configuration will be described with reference to FIGS. In the manufacturing method of the coaxial connector P for a board, as shown in FIGS. 4 to 8, an outer terminal A with a carrier and an inner terminal B with a carrier obtained by press forming a conductive metal plate are prepared, Used to overlap. 4 to 8 show the case where one outer terminal A or inner terminal B is extended to the carrier, the carrier has a plurality of outer terminals A or a plurality of inner terminals B. A chain is extended on one side of the carrier. In this way, a plurality of outer terminals A or a plurality of inner terminals B extended in a chain form is called a chain terminal. In addition, the outer terminal A or the inner terminal B that is connected to the carrier may be hereinafter referred to as an outer terminal A with a carrier or an inner terminal B with a carrier.

前記キャリア付きアウター端子Aは、図4に示すように、所定の間隔で半円筒状に成形された半円筒状部44aを持った帯状のキャリア44と、このキャリア44の一側縁から切欠部45aを介して半円筒状部44aに連続する半円筒部45とから形成する。なお、キャリア44の半円筒状部44aと半円筒部45とは同一径であり、切欠部45aを介して、一体に連続している。切欠部45aは、連設された半円筒状部44aと半円筒部45からなる半円筒の一部(キャリア44に隣接する箇所)を切除して形成されたものであり、切欠部45aもまた半円筒部45の一部を構成しているといえる。半円筒状部44aを除く一平面内のキャリア44には、複数の位置決め孔46が所定間隔おいて穿設されている。半円筒部45は、本発明の一実施の形態にかかる基板用同軸コネクタと相手方の同軸コネクタとを嵌合した際、その相手方の同軸コネクタのアウター端子に接触する。さらに、本発明の一実施の形態にかかる基板用同軸コネクタがプリント基板に装着された際、キャリア44の半円筒状部44aの端部(キャリア44の半円筒部45が設けられた端部とは反対側の端部)がプリント基板のGND線に半田付けされる。   As shown in FIG. 4, the outer terminal A with a carrier includes a band-shaped carrier 44 having a semicylindrical portion 44 a formed into a semicylindrical shape at a predetermined interval, and a notch portion from one side edge of the carrier 44. And a semi-cylindrical portion 45 continuous with the semi-cylindrical portion 44a through 45a. Note that the semi-cylindrical portion 44a and the semi-cylindrical portion 45 of the carrier 44 have the same diameter, and are continuous continuously through the notch 45a. The notch 45a is formed by cutting out a part of a semi-cylinder made up of the semi-cylindrical part 44a and the semi-cylindrical part 45 (a part adjacent to the carrier 44). It can be said that it constitutes a part of the semi-cylindrical portion 45. A plurality of positioning holes 46 are formed at predetermined intervals in the carrier 44 in one plane excluding the semi-cylindrical portion 44a. The semi-cylindrical portion 45 contacts the outer terminal of the counterpart coaxial connector when the board coaxial connector according to the embodiment of the present invention and the counterpart coaxial connector are fitted. Furthermore, when the coaxial connector for a board according to one embodiment of the present invention is mounted on a printed circuit board, the end of the semi-cylindrical part 44a of the carrier 44 (the end provided with the semi-cylindrical part 45 of the carrier 44) (The end on the opposite side) is soldered to the GND line of the printed circuit board.

一方、キャリア付きインナー端子Bは、図5に示すように、帯状のキャリア47の一側縁から突出する突出片48と、この突出片48に連続しこれより幅が狭い(細い)連結片49と、この連結片49に連続し、丸軸状に丸められた本体部50と、キャリア47の他側縁に連結された幅が狭い突出片51と、この突出片51から斜め下方に連続する傾斜片52と、この傾斜片52に対し水平方向に連続する端子片53とを備えるように構成される。このキャリア47にも位置決め孔54が所定間隔おいて穿設されている。本体部50は、本発明の一実施の形態にかかる基板用同軸コネクタと相手方の同軸コネクタとを嵌合した際、その相手方の同軸コネクタのインナー端子に接触する。さらに、本発明の一実施の形態にかかる基板用同軸コネクタがプリント基板に装着された際、端子片53がプリント基板の信号線に半田付けされる。   On the other hand, the carrier-equipped inner terminal B has, as shown in FIG. 5, a projecting piece 48 projecting from one side edge of the belt-like carrier 47 and a connecting piece 49 that is continuous with the projecting piece 48 and narrower (thin). The main body 50 rounded into a round shaft shape, the narrow projecting piece 51 coupled to the other side edge of the carrier 47, and the projecting piece 51 obliquely downward. It is comprised so that the inclined piece 52 and the terminal piece 53 which continues in a horizontal direction with respect to this inclined piece 52 may be provided. The carrier 47 is also provided with positioning holes 54 at predetermined intervals. When the board coaxial connector according to one embodiment of the present invention and the counterpart coaxial connector are fitted, the main body 50 contacts the inner terminal of the counterpart coaxial connector. Furthermore, when the coaxial connector for board according to the embodiment of the present invention is mounted on the printed board, the terminal piece 53 is soldered to the signal line of the printed board.

前記突出片48は、アウターハウジング41に埋設される広幅部分であるが、その幅は前記半円筒部45の内径よりも小さい。このため、半円筒部45の下側の開口に突出片48を配置した場合、突出片48が半円筒部45に接触することは無い。更に、キャリア47の幅Nは、キャリア付きアウター端子Aの切欠部45aの幅Mよりも狭い寸法である。このため、切欠部45aの下側にキャリア付きインナー端子Bを配置した場合、キャリア47がキャリア付きアウター端子Aに接触することがない。   The protruding piece 48 is a wide portion embedded in the outer housing 41, but its width is smaller than the inner diameter of the semi-cylindrical portion 45. For this reason, when the protruding piece 48 is disposed in the lower opening of the semi-cylindrical portion 45, the protruding piece 48 does not contact the semi-cylindrical portion 45. Furthermore, the width N of the carrier 47 is smaller than the width M of the notch 45a of the outer terminal A with a carrier. For this reason, when the inner terminal B with a carrier is disposed below the notch 45a, the carrier 47 does not contact the outer terminal A with a carrier.

図6、図7および図8は、キャリア付きアウター端子Aのキャリア44とキャリア付きインナー端子Bのキャリア47とを前後方向に隣接させて、これらを同一平面内に設置した状態を示す斜視図、平面図および下面図である。図6、図7および図8に示すように、キャリア付きインナー端子Bのキャリア47の突出片48が連設された側とは反対側にキャリア付きアウター端子Aのキャリア44が並べて配置される。つまり、キャリア付きアウター端子Aの切欠部45aの下側にキャリア付きインナー端子Bのキャリア47が位置するように、キャリア付きアウター端子Aおよびキャリア付きインナー端子Bが並べて配設される。このように並べた際、突出片48が半円筒部45に接触することは無い。また、キャリア44とキャリア47とは所定の間隙G4をおいて同一平面内に並び、キャリア付きインナー端子Bのキャリア47がキャリア付きアウター端子Aのキャリア44に接触することがない。   6, 7, and 8 are perspective views showing a state in which the carrier 44 of the outer terminal A with carrier and the carrier 47 of the inner terminal B with carrier are adjacent to each other in the front-rear direction and are installed in the same plane. It is a top view and a bottom view. As shown in FIGS. 6, 7, and 8, the carrier 44 of the outer terminal A with the carrier is arranged side by side on the side opposite to the side where the protruding piece 48 of the carrier 47 of the inner terminal B with the carrier is connected. That is, the outer terminal A with the carrier and the inner terminal B with the carrier are arranged side by side so that the carrier 47 of the inner terminal B with the carrier is positioned below the notch 45a of the outer terminal A with the carrier. When arranged in this manner, the protruding piece 48 does not contact the semi-cylindrical portion 45. Further, the carrier 44 and the carrier 47 are arranged in the same plane with a predetermined gap G4, and the carrier 47 of the inner terminal B with the carrier does not contact the carrier 44 of the outer terminal A with the carrier.

また、キャリア付きインナー端子Bの突出片48、連結片49および本体部50はキャリア付きアウター端子Aの半円筒部45内の中心部にあって、これらの間に、図8に示すような間隙G5を保つようにする。この間隙G5のうち突出片48付近は、インナーハウジングEとして機能させる絶縁物が注入される箇所(図8の突出片48における図面上側)と、後述する第1のスライド型63がキャリア47側から進入する箇所(図8の突出片48における図面下側)と、に分かれる。   Further, the protruding piece 48, the connecting piece 49, and the main body 50 of the inner terminal B with the carrier are located in the center part in the semi-cylindrical part 45 of the outer terminal A with the carrier, and a gap as shown in FIG. Keep G5. In the gap G5, in the vicinity of the protruding piece 48, a place where an insulator functioning as the inner housing E is injected (upper side of the protruding piece 48 in FIG. 8), and a first slide die 63 described later from the carrier 47 side. It is divided into a place to enter (the lower side in the drawing in the protruding piece 48 in FIG. 8).

従って、キャリア付きアウター端子Aとキャリア付きインナー端子Bとを前述のように同一平面内に設置したとき、接触する部分は生じない。そこで、かかるキャリア付きアウター端子Aとキャリア付きインナー端子Bを金型C内に設置し、この金型C内に合成樹脂(絶縁物)を注入してフープ成形を行う。この成形工程を、図9〜図11を参照して説明する。   Therefore, when the outer terminal A with a carrier and the inner terminal B with a carrier are installed in the same plane as described above, there is no contact portion. Therefore, the outer terminal A with a carrier and the inner terminal B with a carrier are installed in a mold C, and a synthetic resin (insulator) is injected into the mold C to perform hoop molding. This forming process will be described with reference to FIGS.

この金型Cは、図9に示すように、下型61、上型62、第1のスライド型63および第2のスライド型64とからなる。下型61は、上方および下方に開放された略直方容器形をなす。コ字状壁65の上面は上型62に対する当接面となるため、平滑面とされる。コ字状壁65のうちの前方の前壁65aの上面中央は、キャリア付きアウター端子Aの半円筒部45の端部およびキャリア付きインナー端子Bの突出片48の底面を下側から支持する。   As shown in FIG. 9, the mold C includes a lower mold 61, an upper mold 62, a first slide mold 63, and a second slide mold 64. The lower mold 61 has a substantially rectangular container shape opened upward and downward. Since the upper surface of the U-shaped wall 65 is a contact surface with the upper mold 62, it is a smooth surface. The center of the upper surface of the front wall 65a in front of the U-shaped wall 65 supports the end of the semi-cylindrical portion 45 of the outer terminal A with carrier and the bottom surface of the protruding piece 48 of the inner terminal B with carrier from the lower side.

一方、上型62は下方および後方に開放された略直方容器形をなし、コ字状壁67のうち前壁67aにはこれの前後面および下面に抜ける半円形孔(半円形切欠)68が形成されている。この半円形孔68の形状、サイズはキャリア付きアウター端子Aの半円筒部45の形状、サイズと等しい。コ字状壁67のうち前壁67aの半円形孔(半円形切欠)68の下面は、キャリア付きアウター端子Aの半円筒部45の上面を上側から支持する。このようにして、上型62の内部にキャリア付きアウター端子Aの半円筒部45およびキャリア付きインナー端子Bの突出片48から本体部50にかけての部位が収納される。   On the other hand, the upper mold 62 is formed in a substantially rectangular container shape opened downward and rearward, and the front wall 67a of the U-shaped wall 67 has semicircular holes (semicircular cutouts) 68 extending through the front and rear surfaces and the lower surface thereof. Is formed. The shape and size of the semicircular hole 68 are equal to the shape and size of the semicylindrical portion 45 of the outer terminal A with a carrier. The lower surface of the semicircular hole (semicircular cutout) 68 in the front wall 67a of the U-shaped wall 67 supports the upper surface of the semicylindrical portion 45 of the outer terminal A with a carrier from the upper side. In this way, the upper mold 62 accommodates the part from the semi-cylindrical part 45 of the outer terminal A with carrier and the protruding piece 48 of the inner terminal B with carrier to the main body part 50.

また、第1のスライド型63は、図11に示すように、断面がキャリア付きアウター端子Aの半円筒状部44aおよび半円筒部45の内面と同一の半円である半円柱の形状である。この第1のスライド型63は、キャリア付きアウター端子Aの半円筒状部44aの開口から半円筒部45に向う矢印cの方向に進入する。このとき、第1のスライド型63は、半円筒状部44aの内面、キャリア47の上面、半円筒部45の内面、および突出片48の上面に沿って、その先端面がコ字状壁67の前壁67aの内側面と面一となる位置まで進入する(つまり、先端面が突出片48の上面上に位置するまで進入する)。   Further, as shown in FIG. 11, the first slide die 63 has a semi-cylindrical shape whose cross section is the same semicircle as the inner surface of the semi-cylindrical portion 44 a and the semi-cylindrical portion 45 of the outer terminal A with a carrier. . The first slide die 63 enters in the direction of the arrow c from the opening of the semicylindrical portion 44a of the outer terminal A with a carrier toward the semicylindrical portion 45. At this time, the first slide mold 63 has a U-shaped wall 67 with a tip end surface along the inner surface of the semicylindrical portion 44 a, the upper surface of the carrier 47, the inner surface of the semicylindrical portion 45, and the upper surface of the protruding piece 48. To the position where it is flush with the inner side surface of the front wall 67a (that is, the tip surface enters until the top surface is located on the upper surface of the protruding piece 48).

第2のスライド型64は、略矩形の塞板部69と、この塞板部69の前面側に連設された直方形部70とを備える。塞板部69は下型61および上型62が閉じられた際に下型61および上型62の後部の開放端を塞ぐように機能する。直方形部70は矩形断面を持ち、これの中心部に、前面から所定の深さに亘って略丸形の長孔71を設ける。さらに、この長孔71を中心とする半円筒状孔72を形成する。長孔71にはキャリア付きインナー端子Bの本体部50が収納され、半円筒状孔72にはキャリア付きアウター端子Aの半円筒部45が収納される。   The second slide mold 64 includes a substantially rectangular closing plate portion 69 and a rectangular portion 70 connected to the front side of the closing plate portion 69. The closing plate portion 69 functions to close the open ends of the rear portions of the lower die 61 and the upper die 62 when the lower die 61 and the upper die 62 are closed. The rectangular portion 70 has a rectangular cross section, and a substantially circular long hole 71 is provided at the center of the rectangular portion 70 from the front surface to a predetermined depth. Further, a semi-cylindrical hole 72 centering on the long hole 71 is formed. The main body 50 of the inner terminal B with a carrier is accommodated in the long hole 71, and the semicylindrical part 45 of the outer terminal A with a carrier is accommodated in the semicylindrical hole 72.

第2のスライド型64についてさらに説明する。直方形部70の上部外周面から半円筒状孔72に至る、図11に示す肉厚部73は、図3に示したアウターハウジング41の間隙G1相当の厚みおよび形状とする。また、半円筒状孔72から長孔71に至るまでの肉厚部74は、図3に示した間隙G3相当の厚みおよび形状とする。更に、長孔71から直方形部70の下部外周面までの肉厚75は、間隙G2相当の厚みおよび形状とする。   The second slide mold 64 will be further described. A thick portion 73 shown in FIG. 11 extending from the upper outer peripheral surface of the rectangular portion 70 to the semi-cylindrical hole 72 has a thickness and a shape corresponding to the gap G1 of the outer housing 41 shown in FIG. Further, the thick portion 74 from the semi-cylindrical hole 72 to the long hole 71 has a thickness and shape corresponding to the gap G3 shown in FIG. Furthermore, the thickness 75 from the long hole 71 to the lower outer peripheral surface of the rectangular portion 70 is set to a thickness and shape corresponding to the gap G2.

従って、キャリア付きアウター端子Aとキャリア付きインナー端子Bを、図9に示すように下型61および上型62間に配置し、これらを矢印a方向、b方向にそれぞれ移動させる。また、これらの下型61および上型62の前後に配置された第1スライド型63および第2スライド型64をそれぞれ矢印c方向、d方向に移動させる。これにより、キャリア付きアウター端子Aの半円筒部45およびキャリア付きインナー端子Bの突出片48は、上型62の半円形孔68の下面と、第1スライド型63の上面および下面と、下型61の前壁65aの上面により支持される。同時に、キャリア付きアウター端子Aの半円筒部45およびキャリア付きインナー端子Bの本体部50が、第2のスライド型64の半円筒状孔72および長孔71のそれぞれに挿し込まれ、図11に示すように、キャリア付きアウター端子Aおよびキャリア付きインナー端子Bが金型C内に収納される。   Therefore, the outer terminal A with a carrier and the inner terminal B with a carrier are arranged between the lower mold 61 and the upper mold 62 as shown in FIG. 9 and are moved in the directions of arrows a and b, respectively. Further, the first slide mold 63 and the second slide mold 64 arranged before and after the lower mold 61 and the upper mold 62 are moved in the directions of the arrows c and d, respectively. Thus, the semi-cylindrical portion 45 of the outer terminal A with carrier and the protruding piece 48 of the inner terminal B with carrier are the lower surface of the semicircular hole 68 of the upper die 62, the upper and lower surfaces of the first slide die 63, and the lower die. 61 is supported by the upper surface of the front wall 65a. At the same time, the semi-cylindrical portion 45 of the outer terminal A with carrier and the main body portion 50 of the inner terminal B with carrier are inserted into the semi-cylindrical hole 72 and the long hole 71 of the second slide die 64, respectively. As shown, an outer terminal A with a carrier and an inner terminal B with a carrier are housed in a mold C.

この後、これらの各型61〜64によって囲まれた前記間隙G1〜G3内に周知の方法で絶縁材(合成樹脂)の注入を行う。この型閉め状態で合成樹脂を注入すると、前記キャリア付きアウター端子Aおよびキャリア付きインナー端子Bと、各型61〜64とが密接しているため、注入された合成樹脂がこれらの型61〜64の外へ漏れ出すことはない。   Thereafter, an insulating material (synthetic resin) is injected into the gaps G1 to G3 surrounded by the molds 61 to 64 by a known method. When the synthetic resin is injected in the closed state, the outer terminal A with carrier and the inner terminal B with carrier are in close contact with the respective molds 61 to 64, and therefore the injected synthetic resin is the molds 61 to 64. There is no leakage outside.

そして、この合成樹脂の固化後に各型61〜64を矢印a〜d方向とは逆方向に移動させることで、型開きを行う。この型開きによって、図13および図14に示すようなキャリア付き基板用同軸コネクタDが形成される。キャリア付き基板用同軸コネクタDは、キャリアが残っている点を除いて、図1〜図3を参照して説明した基板用同軸コネクタPと同じであるため説明を省略する。   Then, after the synthetic resin is solidified, the molds 61 to 64 are moved in the direction opposite to the directions of the arrows a to d to perform mold opening. By this mold opening, a coaxial connector D with a carrier as shown in FIGS. 13 and 14 is formed. The coaxial connector D for substrates with a carrier is the same as the coaxial connector P for substrates described with reference to FIGS. 1 to 3 except that the carrier remains, and thus the description thereof is omitted.

次に、上述のキャリア付き基板用同軸コネクタDに対して、図15および図16に示すように、3基のキャリアカット下型81〜83および4基のキャリアカット上型84〜87を用いて、キャリア付きアウター端子Aおよびキャリア付きインナー端子Bのキャリア44、47を切断する。これらのうち、キャリアカット下型81、82は、鋼材により直方形に形成され、これらの刃がキャリア付きアウター端子Aのキャリア44の各一箇所、具体的には半円筒状部44a付近の平坦部に刃が位置するように設置する。   Next, as shown in FIGS. 15 and 16, for the above-described coaxial connector D for a substrate with a carrier, three carrier-cut lower dies 81 to 83 and four carrier-cut upper dies 84 to 87 are used. Then, the carriers 44 and 47 of the outer terminal A with carrier and the inner terminal B with carrier are cut. Of these, the carrier-cut lower dies 81 and 82 are formed in a rectangular shape with a steel material, and these blades are flat in one place of the carrier 44 of the outer terminal A with a carrier, specifically, in the vicinity of the semicylindrical portion 44a. Install so that the blade is positioned at the part.

また、キャリアカット下型83は直方形に形成され、キャリア付きインナー端子Bのキャリア47の突出片48に連設された箇所を所定の範囲に亘って支える位置に配置する。このとき、このキャリア47の半円筒部45の内面より僅かに内側となる位置に刃を配置する。これらの刃はキャリア付きアウター端子Aおよびキャリア付きインナー端子Bに対するキャリアカット位置L1、L2となる。キャリアカット位置L1とL2は、同一直線状にはなく、キャリアカット位置L2がL1の内側に位置する。これは、キャリアカット位置L1とL2が同一直線状にあると、キャリアが切断された箇所でアウター端子とインナー端子が接触する可能性があるためである。   Moreover, the carrier cut lower mold | type 83 is formed in a rectangular shape, and arrange | positions in the position which supports the location connected with the protrusion piece 48 of the carrier 47 of the inner terminal B with a carrier over a predetermined range. At this time, the blade is disposed at a position slightly inside the inner surface of the semi-cylindrical portion 45 of the carrier 47. These blades become carrier cut positions L1 and L2 with respect to the outer terminal A with a carrier and the inner terminal B with a carrier. The carrier cut positions L1 and L2 are not in the same straight line, and the carrier cut position L2 is located inside L1. This is because if the carrier cut positions L1 and L2 are on the same straight line, the outer terminal and the inner terminal may come into contact with each other at the location where the carrier is cut.

キャリアカット上型84、85も直方形をなし、キャリア付きアウター端子Aのキャリア44上に臨み、その各刃は前記キャリアカット位置L1に対向する。また、キャリアカット型86、87も直方形をなし、キャリア付きインナー端子Bのキャリア47上に臨んで、その刃は前記キャリアカット位置L2に対向する。   The carrier cut upper molds 84 and 85 are also rectangular, facing the carrier 44 of the outer terminal A with a carrier, and each blade thereof faces the carrier cut position L1. Further, the carrier cut dies 86 and 87 are also rectangular, facing the carrier 47 of the inner terminal B with the carrier, and the blade thereof faces the carrier cut position L2.

そこで、前記のように重ね合わせたキャリア付きアウター端子Aおよびキャリア付きインナー端子Bを介在したキャリアカット下型81〜83およびキャリアカット上型84〜87のうち、キャリアカット上型84〜87を矢印Q方向に打ち下ろす。これにより、キャリア付きアウター端子Aのキャリア44およびキャリア付きインナー端子Bのキャリア47はそれぞれキャリアカット位置L1、L2で切断され、結果として、図1〜図3の示すような基板用同軸コネクタPが得られることとなる。尚、矢印Q方向への打ち下ろしの際、キャリアカット型86、87の各刃は、キャリア付きアウター端子Aの切欠部45aを通過して、キャリアカット位置L2に向うため、キャリアカット型86、87がキャリア付きアウター端子Aの半円筒状部44aおよび半円筒部45を破壊することがない。   Therefore, among the carrier-cut lower dies 81 to 83 and the carrier-cut upper dies 84 to 87 interposing the outer terminal A with a carrier and the inner terminal B with a carrier that are overlapped as described above, the carrier-cut upper dies 84 to 87 are indicated by arrows. Down in the Q direction. As a result, the carrier 44 of the outer terminal A with carrier and the carrier 47 of the inner terminal B with carrier are cut at the carrier cut positions L1 and L2, respectively. As a result, the coaxial connector P for a board as shown in FIGS. Will be obtained. In addition, since each blade of the carrier cut molds 86 and 87 passes through the cutout portion 45a of the outer terminal A with a carrier and moves toward the carrier cut position L2 when down in the direction of the arrow Q, the carrier cut mold 86, 87 does not destroy the semi-cylindrical portion 44a and the semi-cylindrical portion 45 of the outer terminal A with a carrier.

以上、本発明の実施形態にかかる基板用同軸コネクタによれば、キャリア付きアウター端子Aとキャリア付きインナー端子Bの1回のフープ成形によってキャリア付き基板用同軸コネクタDが効率的かつ簡単に得られ、従来のような端子およびハウジングの複数回の圧入作業を要することなく、簡単にしかもローコストに基板用同軸コネクタPを製造することができる。   As described above, according to the coaxial connector for substrates according to the embodiment of the present invention, the coaxial connector D for substrates with carrier can be obtained efficiently and easily by one hoop molding of the outer terminal A with carrier and the inner terminal B with carrier. Thus, the board coaxial connector P can be manufactured easily and at low cost without requiring a plurality of press-fitting operations of the terminal and the housing as in the prior art.

41 アウターハウジング
42 アウター端子
43 インナー端子
44、47 キャリア
44a 半円筒状部
46、54 位置決め孔
48 突出片
49 連結片
50 本体部
51 突出片
52 傾斜片
53 端子片
61 下型
62 上型
63 第1スライド型
64 第2スライド型
65、67 コ字状壁
65a、67a 前壁
68 半円形孔
69 塞板部
70 直方形部
71 長孔
72 半円筒状孔
81〜83 キャリアカット下型
84〜87 キャリアカット上型
A キャリア付きアウター端子
B キャリア付きインナー端子
C 金型
D キャリア付き基板用同軸コネクタ
G1〜G5 間隙
P 基板用同軸コネクタ
41 Outer housing 42 Outer terminal
43 Inner terminal 44, 47 Carrier 44a Semi-cylindrical part 46, 54 Positioning hole 48 Projection piece 49 Connection piece 50 Main part 51 Projection piece 52 Inclination piece 53 Terminal piece 61 Lower mold 62 Upper mold 63 First slide mold 64 Second slide Type 65, 67 U-shaped wall 65a, 67a Front wall 68 Semi-circular hole 69 Blocking plate part 70 Rectangular part 71 Long hole 72 Semi-cylindrical hole 81-83 Carrier cut lower mold 84-87 Carrier cut upper mold A With carrier Outer terminal B Inner terminal with carrier C Mold D Coaxial connector for substrate with carrier G1-G5 Gap P Coaxial connector for substrate

Claims (1)

下側の一部が除かれ開口が形成された、第1のキャリアのうちの半円筒状に成形された半円筒状部に連設された半円筒部を有するアウター端子が前記第1のキャリアから連鎖状に延設された第1の連鎖端子と、前記アウター端子の前記半円筒部にその下側の一部から収容可能な、前記第2のキャリアに連設された本体部を有するインナー端子が前記第2のキャリアから連鎖状に延設された第2の連鎖端子と、から、プリント基板に取り付けられる基板用同軸コネクタを製造する製造方法であって、
前記第2のキャリアの前記本体部が連設された側とは反対側に前記第1のキャリアを並べて配置することによって、前記インナー端子の前記本体部を前記アウター端子の前記半円筒部に収容するとともに、前記第2のキャリアを前記アウター端子に接触しないように該半円筒部の前記開口に臨ませ、
前記アウター端子の前記半円筒部の内部の空間を、前記第2のキャリアから前記本体部に向けてスライドする型で埋めるとともに、前記アウター端子の前記半円筒部および前記インナー端子の本体部の周囲を囲うように、金型内に前記第1の連鎖端子と前記第2の連鎖端子を収納し、
前記第1の連鎖端子と前記第2の連鎖端子が収納された前記金型内に絶縁物を注入してフープ成形し、
前記第1のキャリアの前記半円筒状部の両側を切断するとともに、前記本体部に連設された箇所を残すように前記第2のキャリアを切断する、
ことを特徴とする基板用同軸コネクタを製造する製造方法。
An outer terminal having a semi-cylindrical portion connected to a semi-cylindrical portion formed in a semi-cylindrical shape of the first carrier from which a part of the lower side is removed and the opening is formed is the first carrier. A first chain terminal extending in a chain from the inner terminal, and an inner body having a body portion connected to the second carrier, which can be accommodated in the semi-cylindrical portion of the outer terminal from a part of the lower side thereof A manufacturing method for manufacturing a coaxial connector for a board to be attached to a printed circuit board from a second chain terminal in which terminals extend from the second carrier in a chain shape,
The main body portion of the inner terminal is accommodated in the semi-cylindrical portion of the outer terminal by arranging the first carrier side by side on the side opposite to the side where the main body portion of the second carrier is continuously provided. And facing the opening of the semi-cylindrical portion so that the second carrier does not contact the outer terminal,
The space inside the semi-cylindrical portion of the outer terminal is filled with a mold that slides from the second carrier toward the main body portion, and around the semi-cylindrical portion of the outer terminal and the main body portion of the inner terminal. Enclosing the first chain terminal and the second chain terminal in a mold,
Injecting an insulator into the mold containing the first chain terminal and the second chain terminal to form a hoop,
Cutting both sides of the semi-cylindrical portion of the first carrier, and cutting the second carrier so as to leave a portion connected to the main body portion;
The manufacturing method which manufactures the coaxial connector for boards characterized by the above-mentioned.
JP2009255277A 2009-11-06 2009-11-06 Manufacturing method for manufacturing coaxial connector for substrate Expired - Fee Related JP5394891B2 (en)

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