JP5382323B2 - Liquid ejecting head and liquid ejecting apparatus - Google Patents

Description

  The present invention relates to a liquid ejecting head and a liquid ejecting apparatus that eject liquid, and more particularly, to an ink jet recording head and an ink jet recording apparatus that eject ink.

  As a typical example of a liquid ejecting head, for example, a part of a pressure generating chamber communicating with a nozzle opening for ejecting ink droplets is constituted by a diaphragm, and the diaphragm is deformed by a piezoelectric element having a lower electrode and an upper electrode. For example, there is an ink jet recording head that pressurizes ink in a pressure generating chamber and ejects ink droplets from nozzle openings.

  In addition, as a piezoelectric element mounted on the ink jet recording head, for example, a uniform piezoelectric material layer is formed over the entire surface of the diaphragm by a film forming technique, and this piezoelectric material layer is formed into a pressure generating chamber by a lithography method. There is one in which a piezoelectric element is formed so as to be separated into a corresponding shape and independent for each pressure generation chamber (see Patent Document 1).

JP 2003-163387 A JP 2003-347615A

  In recent years, with the miniaturization of liquid ejecting heads, piezoelectric elements having higher displacement characteristics are required.

  In addition, in the piezoelectric element as described in Patent Document 1, destruction due to moisture in the atmosphere is a problem. Specifically, when moisture adheres to the side surface of the piezoelectric layer, the upper electrode and the lower electrode located at a very close distance to the upper electrode are brought into conduction and short-circuited. Even when the lower electrode is covered with the piezoelectric layer, moisture may penetrate into the piezoelectric layer and induce conduction between the lower electrode and the upper electrode. In order to solve such a problem, it is conceivable to prevent a short circuit by covering the piezoelectric layer with a protective film made of a member different from the member constituting the piezoelectric element, but the displacement characteristic of the piezoelectric element is deteriorated. Resulting in.

  Such a problem exists not only in the ink jet recording head but also in a liquid ejecting head that ejects liquid other than ink.

  In addition, an actuator device in which a piezoelectric element is formed on a diaphragm by a relatively simple process of applying a piezoelectric material green sheet in accordance with the shape of the pressure generating chamber, or applying a piezoelectric material by printing and firing it. Is disclosed (see Patent Document 2). In Patent Document 2, the piezoelectric layer has a two-layer structure, and the amount of deformation of the piezoelectric element is increased. However, this is not directly applicable to the thin film forming method.

  In view of such circumstances, it is an object of the present invention to provide a liquid ejecting head and a liquid ejecting apparatus that suppress destruction of a piezoelectric element and have excellent displacement characteristics.

According to a first aspect of the present invention for solving the above problem, a flow path forming substrate provided with a pressure generating chamber communicating with a nozzle opening for ejecting a liquid, and a piezoelectric element provided above the flow path forming substrate; In the liquid ejecting head that discharges liquid from the nozzle opening by deformation of the piezoelectric element, the piezoelectric element includes a first common electrode, a first piezoelectric layer, an individual electrode, and a second piezoelectric layer from the flow path forming substrate. And the second common electrode are sequentially laminated, and in the juxtaposition direction of the pressure generation chambers, the first piezoelectric layer and the individual electrodes are provided so as to correspond to the pressure generation chambers, In the piezoelectric active part that is a substantial driving part of the piezoelectric element, the upper surface of the first piezoelectric layer and the side surface in the direction in which the pressure generating chambers are arranged are covered with the individual electrodes and the second piezoelectric layer. The second piezoelectric layer is formed of the first piezoelectric layer. Covered with a common electrode, the first common electrode and the second common electrode are continuously provided across the juxtaposed direction of the pressure generating chambers, and the first common electrode and the second common electrode are In the liquid ejecting head, the pressure generating chambers are connected above partition walls that divide the pressure generating chambers in the juxtaposed direction.
In the first aspect, the piezoelectric layer is composed of two layers of the first piezoelectric layer and the second piezoelectric layer, so that the displacement characteristics are improved. Further, since the second common electrode is continuously provided in the direction in which the pressure generating chambers are arranged side by side, the piezoelectric layers (the first piezoelectric layer and the second piezoelectric body) are not degraded without deteriorating the displacement characteristics. Layer) can be protected, and destruction of the piezoelectric element due to moisture in the atmosphere can be suppressed. Furthermore, since the first common electrode and the second common electrode are connected above the partition walls that divide the pressure generating chambers in the juxtaposed direction, crosstalk can be suppressed and the liquid discharge characteristics are excellent. It will be a thing.

  Moreover, it is preferable that the thickness of each of the first piezoelectric layer and the second piezoelectric layer is 1 μm or less. By forming the piezoelectric layer by a thin film process, the displacement characteristics of the piezoelectric element are further improved.

According to still another aspect of the invention, there is provided a liquid ejecting apparatus including the liquid ejecting head according to the above aspect.
In this aspect, a liquid ejecting apparatus with improved reliability can be realized.

FIG. 2 is an exploded perspective view illustrating a schematic configuration of the recording head according to the first embodiment. FIG. 3 is a cross-sectional view of the recording head according to the first embodiment. FIG. 3 is an enlarged cross-sectional view of a main part of the recording head according to the first embodiment. FIG. 4 is a cross-sectional view illustrating the recording head manufacturing method according to the first embodiment. FIG. 4 is a cross-sectional view illustrating the recording head manufacturing method according to the first embodiment. 1 is a perspective view illustrating a schematic configuration of a recording apparatus according to Embodiment 1. FIG. FIG. 6 is a cross-sectional view of a recording head according to another embodiment.

Hereinafter, the present invention will be described in detail based on embodiments.
(Embodiment 1)
FIG. 1 is an exploded perspective view showing a schematic configuration of an ink jet recording head which is an example of a liquid jet head according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view of the ink jet recording head. These are sectional drawings which expanded the principal part of FIG.

  As shown in the figure, the flow path forming substrate 10 is made of a silicon single crystal substrate having a plane orientation (110) in this embodiment, and an elastic film 50 made of an oxide film is formed on one surface thereof.

  A plurality of pressure generating chambers 12 are arranged in parallel in the width direction of the flow path forming substrate 10. In addition, a communication portion 13 is formed in a region outside the longitudinal direction of the pressure generation chamber 12 of the flow path forming substrate 10, and the communication portion 13 and each pressure generation chamber 12 are provided for each pressure generation chamber 12. Communication is made via a supply path 14 and a communication path 15. The communication part 13 communicates with a reservoir part 31 of a protective substrate, which will be described later, and constitutes a part of a reservoir that becomes a common ink chamber of each pressure generating chamber 12. The ink supply path 14 is formed with a narrower width than the pressure generation chamber 12, and maintains a constant flow path resistance of ink flowing into the pressure generation chamber 12 from the communication portion 13. In this embodiment, the ink supply path 14 is formed by narrowing the width of the flow path from one side. However, the ink supply path may be formed by narrowing the width of the flow path from both sides. Further, the ink supply path may be formed by narrowing from the thickness direction instead of narrowing the width of the flow path. Further, each communication passage 15 is formed by extending the partition walls 11 on both sides in the width direction of the pressure generating chamber 12 to the communication portion 13 side to partition the space between the ink supply path 14 and the communication portion 13. Yes. That is, the flow path forming substrate 10 has an ink supply path 14 having a cross-sectional area smaller than the cross-sectional area of the pressure generating chamber 12 in the width direction, and communicates with the ink supply path 14 and disconnects the ink supply path 14 in the width direction. An individual flow path including a communication passage 15 having a cross-sectional area smaller than the area is provided by being partitioned by a plurality of partition walls 11.

  Further, on the opening surface side of the flow path forming substrate 10, a nozzle plate 20 having a nozzle opening 21 communicating with the vicinity of the end of each pressure generating chamber 12 on the side opposite to the ink supply path 14 is provided with an adhesive. Or a heat-welded film or the like. The nozzle plate 20 is made of, for example, glass ceramics, a silicon single crystal substrate, or stainless steel.

  On the other hand, the elastic film 50 is formed on the side opposite to the opening surface of the flow path forming substrate 10 as described above, and the insulator film 55 is formed on the elastic film 50.

  On the insulator film 55, the first common electrode 60, the first piezoelectric layer 65, the individual electrode 70, the second piezoelectric layer 75, and the second common electrode 80 are stacked by a process described later. Thus, the piezoelectric element 300 is configured. In other words, each piezoelectric element 300 includes a piezoelectric layer composed of the stacked first piezoelectric layer 65 and the second piezoelectric layer 75, the first common electrode 60 and the first common electrode 60 common to the plurality of piezoelectric elements 300. 2 common electrodes 80 and individual electrodes 70 provided for each piezoelectric element 300.

  Here, a portion where piezoelectric distortion occurs due to application of a voltage to the electrode, that is, a substantial drive portion of the piezoelectric element 300 is referred to as a piezoelectric active portion 320. In this embodiment, a region where the piezoelectric layer is sandwiched between the first common electrode 60, the individual electrode 70, and the second common electrode 80 is the piezoelectric active portion 320. In addition, here, a device that provides the piezoelectric element 300 on a predetermined substrate and drives the piezoelectric element 300 is referred to as an actuator device. In other words, the piezoelectric element 300 and the diaphragm that is displaced by driving the piezoelectric element 300 are collectively referred to as an actuator device. In the present embodiment, the elastic film 50, the insulator film 55, and the first common electrode 60 function as a vibration plate. However, the present invention is not limited to this, and for example, the elastic film 50 and the insulator film 55 are provided. Without providing, only the first common electrode 60 may act as a diaphragm.

  Each layer which comprises the piezoelectric element 300 is demonstrated using FIG.2 and FIG.3.

  The first common electrode 60 is continuously provided across the direction in which the pressure generation chambers 12 are arranged. The first common electrode 60 has one end in the longitudinal direction of the pressure generation chamber 12 (the side opposite to the ink supply path 14) extending to the outside of the pressure generation chamber 12, and the other end is the pressure generation chamber 12. It is provided inside.

  A first piezoelectric layer 65 and an individual electrode 70 are sequentially stacked on the first common electrode 60, and the short direction of the pressure generation chamber 12 (the direction in which the pressure generation chambers 12 are arranged in parallel) is a pressure generation chamber. 12 is provided. The first piezoelectric layer 65 has an upper surface covered with the individual electrode 70 and a side surface covered with a second piezoelectric layer 75 described later.

  In the present embodiment, the first piezoelectric layer 65 and the individual electrode 70 have a narrow width on the individual electrode 70 side, and the side surfaces thereof are inclined surfaces.

  In the present embodiment, the longitudinal ends of the pressure generation chambers 12 of the first piezoelectric layer 65 and the individual electrodes 70 are provided on the inner side of the pressure generation chamber 12 and the other end (the ink supply path 14 side). Is extended to the outside of the pressure generation chamber 12, that is, to the ink supply path 14.

  A second piezoelectric layer 75 is provided on the individual electrode 70. The second piezoelectric layer 75 is provided so as to cover the first piezoelectric layer 65 and the individual electrode 70, that is, to cover the upper surface and the side surface of the individual electrode 70 and the side surface of the first piezoelectric layer 65. . The second piezoelectric layer 75 is provided so as to correspond to the pressure generation chamber 12 in the short direction. In the present embodiment, the second piezoelectric layer 75 covers one end of the individual electrode 70 and the first piezoelectric layer 65 in the longitudinal direction of the pressure generating chamber 12. Thereby, the individual electrode 70 and the first piezoelectric layer 65 are protected, and the breakage of the piezoelectric element 300 due to stress or the like can be suppressed.

  In addition, the second common electrode 80 covers a region to be the piezoelectric active portion 320, that is, the second piezoelectric layer 75 constituting the piezoelectric active portion 320 and is continuous over the parallel direction of the pressure generating chambers 12. Is provided. As described above, the second common electrode 80 covers the second piezoelectric layer 75 (and the first piezoelectric layer 65) constituting the piezoelectric active part 320, so that the piezoelectric element caused by moisture in the atmosphere. 300 destruction can be suppressed. That is, in this embodiment, the piezoelectric element 300 can be prevented from being destroyed due to moisture in the atmosphere without providing a protective film on the piezoelectric active portion 320. Displacement characteristics are deteriorated when a protective film is provided on the piezoelectric active part 320 as in the prior art, but in this embodiment, the piezoelectric element 300 is destroyed due to moisture in the atmosphere without degrading the displacement characteristics. Can be suppressed.

  In the present embodiment, the piezoelectric element 300 is destroyed due to moisture in the atmosphere without providing a protective film on the other longitudinal end of the pressure generating chamber 12 of the piezoelectric element 300 (on the ink supply path 14 side). Can be suppressed. In other words, as shown in FIG. 2, the ink supply path 14 side ends of the individual electrode 70, the first piezoelectric layer 65, and the second piezoelectric layer 75 are not covered by the second common electrode 80, but are protected. There is no need to provide a membrane. The other end in the longitudinal direction of the pressure generation chamber 12 of the second piezoelectric layer 75 extends to the ink supply path 14 side from the end of the second common electrode 80, and thus the second common electrode 80 and the individual This is because the distance from the electrode 70 is large and there is no possibility of conduction due to moisture in the atmosphere.

  In the present embodiment, the second common electrode 80 is extended so that one end in the longitudinal direction of the pressure generating chamber 12 covers the first piezoelectric layer 65 and the second piezoelectric layer 75. The first common electrode 60 and the second common electrode 80 are connected above the partition wall 11 that partitions the pressure generation chamber 12 in the juxtaposition direction. Thereby, a voltage can be uniformly applied to each piezoelectric element 300, and crosstalk generated between the pressure generation chambers 12 can be suppressed. Therefore, the ink jet recording head of the present invention has excellent liquid discharge characteristics. Further, the first common electrode 60 and the second common electrode 80 are connected at a plurality of locations, and a contact area is ensured, so that a voltage drop of the piezoelectric element 300 at the center in the column direction is suppressed, and each piezoelectric layer is transferred to each piezoelectric layer. Variation in voltage application is reduced.

  Here, in the piezoelectric element 300, the piezoelectric layer is composed of two layers, a first piezoelectric layer 65 and a second piezoelectric layer 75. Thereby, the displacement characteristic is improved. The first piezoelectric layer 65 and the second piezoelectric layer 75 are made of a piezoelectric material exhibiting an electromechanical conversion action, and are preferably made of a ferroelectric material having a perovskite structure among the piezoelectric materials. The first piezoelectric layer 65 and the second piezoelectric layer 75 are preferably made of a perovskite crystal film. For example, a ferroelectric material such as lead zirconate titanate (PZT), niobium oxide, oxide What added metal oxides, such as nickel or magnesium oxide, etc. are suitable. The first piezoelectric layer 65 and the second piezoelectric layer 75 are formed by a sol-gel method, a MOD method, or the like, as will be described in detail later. By forming the piezoelectric layer by a thin film process, the displacement efficiency is increased and the displacement characteristics are further improved. In addition, the liquid ejecting head can be reduced in size.

  The thicknesses of the first piezoelectric layer 65 and the second piezoelectric layer 75 are set such that the thickness is suppressed to such an extent that cracks do not occur in the manufacturing process and sufficient displacement characteristics are exhibited. For example, each is preferably 0.2 to 1 μm. The first piezoelectric layer 65 and the second piezoelectric layer 75 may have the same thickness, but the thickness of the first piezoelectric layer may be smaller than the thickness of the second piezoelectric layer. In the present embodiment, the first piezoelectric layer 65 is 0.5 μm, and the second piezoelectric layer 75 is 1.0 μm.

  In the present embodiment, the first common electrode 60, the individual electrode 70, and the second common electrode 80 are all made of platinum and iridium. The material of the first common electrode 60, the individual electrode 70, and the second common electrode 80 is not particularly limited, and may be platinum or iridium alone, or other metal material may be used. Different compositions may be used.

  In the present embodiment, both end portions in the longitudinal direction of the pressure generating chamber 12 of the piezoelectric active part 320 are formed to be regions inside the both end portions in the longitudinal direction of the pressure generating chamber 12. Stress concentration at the end of the substrate is alleviated. Moreover, there is no possibility that the displacement characteristic is deteriorated.

  In addition, the individual electrode 70 of each piezoelectric element 300 is made of, for example, gold (Au) or the like which is drawn from the vicinity of the end on the ink supply path 14 side and extends to the insulator film 55. A lead electrode 90 is connected.

  On the flow path forming substrate 10 on which such a piezoelectric element 300 is formed, that is, on the second common electrode 80, the insulator film 55, and the lead electrode 90, a reservoir portion 31 constituting at least a part of the reservoir 100 is provided. The protective substrate 30 having the same is bonded via an adhesive 35. In the present embodiment, the reservoir portion 31 is formed across the protective substrate 30 in the thickness direction and across the width direction of the pressure generating chamber 12, and as described above, the communication portion 13 of the flow path forming substrate 10 is formed. The reservoir 100 is configured as a common ink chamber for the pressure generating chambers 12. Alternatively, the communication portion 13 of the flow path forming substrate 10 may be divided into a plurality of pressure generation chambers 12 and only the reservoir portion 31 may be used as the reservoir. Further, for example, only the pressure generating chamber 12 is provided in the flow path forming substrate 10, and a reservoir is provided on a member (for example, the elastic film 50, the insulator film 55, etc.) interposed between the flow path forming substrate 10 and the protective substrate 30. An ink supply path 14 that communicates with each pressure generating chamber 12 may be provided.

  A piezoelectric element holding portion 32 having a space that does not hinder the movement of the piezoelectric element 300 is provided in a region of the protective substrate 30 that faces the piezoelectric element 300. The piezoelectric element holding part 32 only needs to have a space that does not hinder the movement of the piezoelectric element 300, and the space may be sealed or unsealed.

  As such a protective substrate 30, it is preferable to use substantially the same material as the coefficient of thermal expansion of the flow path forming substrate 10, for example, glass, ceramic material, etc. In this embodiment, the same material as the flow path forming substrate 10 is used. The silicon single crystal substrate was used.

  The protective substrate 30 is provided with a through hole 33 that penetrates the protective substrate 30 in the thickness direction. The vicinity of the end portion of the lead electrode 90 drawn from each piezoelectric element 300 is provided so as to be exposed in the through hole 33.

  A drive circuit 120 for driving the piezoelectric elements 300 arranged in parallel is fixed on the protective substrate 30. For example, a circuit board or a semiconductor integrated circuit (IC) can be used as the drive circuit 120. The drive circuit 120 and the lead electrode 90 are electrically connected via a connection wiring 121 made of a conductive wire such as a bonding wire.

  In addition, a compliance substrate 40 including a sealing film 41 and a fixing plate 42 is bonded onto the protective substrate 30. Here, the sealing film 41 is made of a material having low rigidity and flexibility, and one surface of the reservoir portion 31 is sealed by the sealing film 41. The fixing plate 42 is formed of a relatively hard material. Since the region of the fixing plate 42 facing the reservoir 100 is an opening 43 that is completely removed in the thickness direction, one surface of the reservoir 100 is sealed only with a flexible sealing film 41. Has been.

  In such an ink jet recording head of this embodiment, after taking ink from an external ink supply means (not shown) and filling the interior from the reservoir 100 to the nozzle opening 21, according to the recording signal from the drive circuit 120, By simultaneously applying a voltage between each drive electrode corresponding to the pressure generating chamber 12 and each of the first common electrode 60 and the second common electrode 80, the piezoelectric element 300 and the diaphragm are bent and deformed. The pressure in the pressure generation chamber 12 increases and ink is ejected from the nozzle opening 21.

  Hereinafter, a method for manufacturing such an ink jet recording head will be described with reference to FIGS.

First, as shown in FIG. 4A, silicon dioxide (SiO ₂₎ constituting an elastic film 50 on the surface of a flow path forming substrate wafer 110, which is a silicon wafer in which a plurality of flow path forming substrates 10 are integrally formed. ) Is formed. Next, as shown in FIG. 4B, an insulator film 55 made of, for example, zirconium oxide is formed on the elastic film 50 (silicon dioxide film 51).

  Next, as shown in FIG. 4C, for example, after the first common electrode 60 is formed by laminating platinum (Pt) and iridium (Ir) on the insulator film 55, the first common electrode is formed. 60 is patterned into a predetermined shape. Specifically, one end portion of the first common electrode 60 in the longitudinal direction extends to the outside of the longitudinal end portion of the pressure generating chamber 12, and the other end portion is located on the inner side of the pressure generating chamber 12. (See FIG. 2). The first common electrode 60 is formed by, for example, a sputtering method, a PVD method (physical vapor deposition method), or the like, and ion milling or the like via a resist formed in a predetermined shape on the first common electrode 60 by a photolithography method. Patterning is performed by dry etching.

  Next, as shown in FIG. 4D, for example, a first piezoelectric layer 65 made of lead zirconate titanate (PZT) or the like and an individual electrode 70 made of platinum and iridium are sequentially formed.

  The material of the first piezoelectric layer 65 constituting the piezoelectric element 300 is, for example, a ferroelectric piezoelectric material such as lead zirconate titanate (PZT), niobium, nickel, magnesium, bismuth or yttrium. A relaxor ferroelectric or the like to which a metal such as the above is added is used. The composition may be appropriately selected in consideration of the characteristics, usage, etc. of the piezoelectric element 300. In addition, the method for forming the first piezoelectric layer 65 is not particularly limited. For example, in the present embodiment, a so-called sol in which a metal organic material is dissolved and dispersed in a solvent is applied, dried, gelled, and further baked at a high temperature. The first piezoelectric layer 65 was formed by using a so-called sol-gel method to obtain a first piezoelectric layer 65 made of a metal oxide. The method for forming the first piezoelectric layer 65 is not limited to the sol-gel method. For example, the first piezoelectric layer 65 is formed using a thin film forming method such as a MOD method, a sputtering method, or a laser ablation method. You may make it do. Actually, the first piezoelectric layer 65 is formed by repeating the above-described process of forming a thin piezoelectric film by the sol-gel method a plurality of times, thereby forming a first piezoelectric layer made of a plurality of piezoelectric films. 65 is formed.

  Next, as shown in FIG. 5A, the first piezoelectric layer 65 and the individual electrode 70 are simultaneously patterned into a predetermined shape. Specifically, the first piezoelectric layer 65 and the individual electrode 70 remove the portion corresponding to the partition wall 11 in the longitudinal direction to expose the first common electrode 60. Thereby, the short direction of the pressure generation chamber 12 is provided in a region corresponding to the pressure generation chamber 12. Note that one end in the longitudinal direction of the pressure generation chamber 12 is provided inside the pressure generation chamber 12, and the other end extends to a region corresponding to the ink supply path 14 side (see FIG. 2).

  As described above, after the individual electrode 70 is formed on the first piezoelectric layer 65, the first piezoelectric layer 65 (and the individual electrode 70) is patterned into a predetermined shape, so that the upper surface of the first piezoelectric layer 65 is formed. There is no risk of process damage. That is, the deterioration of the first piezoelectric layer 65 due to patterning is suppressed, and the displacement characteristics of the piezoelectric element 300 are further improved.

  Next, as shown in FIG. 5B, a second piezoelectric layer 75 is formed on the individual electrode 70 and patterned into a predetermined shape. Specifically, the second piezoelectric layer 75 removes the portion corresponding to the partition wall 11 in the longitudinal direction to expose the first common electrode 60. Thus, the second piezoelectric layer 75 is provided in a region corresponding to the pressure generation chamber 12 in the short direction of the pressure generation chamber 12. In the second piezoelectric layer 75, one end in the longitudinal direction of the pressure generating chamber 12 extends from the individual electrode 70 and the first piezoelectric layer 65 so as to cover them. The other end in the longitudinal direction of the pressure generating chamber 12 extends toward the ink supply path 14 and is shorter than the individual electrode 70. The second piezoelectric layer 75 may be formed by the same method as that for the first piezoelectric layer 65.

  Next, as shown in FIG. 5C, the second common electrode 80 is formed over the entire surface of the flow path forming substrate wafer 110 and patterned into a predetermined shape. Specifically, the second common electrode 80 is continuously provided over the juxtaposed direction of the pressure generating chambers 12 and extends to the outside of the longitudinal end portion of the pressure generating chambers 12 (see FIG. 2).

  Then, although not shown, after forming the lead electrode 90 made of, for example, gold (Au) over the entire surface of the flow path forming substrate wafer 110, each piezoelectric element 300 is passed through a mask pattern made of, for example, a resist. Pattern every time.

  Next, a protective substrate wafer, which is a silicon wafer and becomes a plurality of protective substrates 30, is bonded to the piezoelectric element 300 side of the flow path forming substrate wafer 110 by the adhesive 35. The protective substrate 30 is preliminarily formed with a reservoir portion 31, a piezoelectric element holding portion 32, and the like. Further, the protective substrate 30 is made of, for example, a silicon single crystal substrate having a thickness of about 400 μm, and the rigidity of the flow path forming substrate 10 is remarkably improved by bonding the protective substrate 30. Thereafter, the flow path forming substrate wafer 110 is set to a predetermined thickness.

  Next, a mask film is newly formed on the flow path forming substrate wafer 110 and patterned into a predetermined shape. Then, by performing anisotropic etching (wet etching) using an alkaline solution such as KOH on the flow path forming substrate wafer 110 through the mask film, the pressure generating chamber 12 corresponding to the piezoelectric element 300, the communication portion 13, An ink supply path 14 and a communication path 15 are formed.

  Thereafter, the drive circuit 120 is mounted on the protective substrate wafer, and the drive circuit 120 and the lead electrode 90 are connected by the connection wiring 121 (see FIG. 2). Then, the mask film on the surface side where the pressure generating chamber 12 of the flow path forming substrate wafer 110 is opened is removed, and unnecessary portions of the outer peripheral edge portions of the flow path forming substrate wafer 110 and the protective substrate wafer are diced, for example. It is removed by cutting with, for example. Then, the nozzle plate 20 having the nozzle openings 21 formed on the surface of the flow path forming substrate wafer 110 opposite to the protective substrate wafer is bonded, and the compliance substrate 40 is bonded to the protective substrate wafer. The ink jet recording head having the above-described structure is manufactured by dividing the flow path forming substrate wafer 110 and the like into a single chip size flow path forming substrate 10 as shown in FIG.

  Further, these ink jet recording heads 1 constitute a part of a recording head unit having an ink flow path communicating with an ink cartridge or the like, and are mounted on an ink jet recording apparatus. FIG. 6 is a perspective view showing a schematic configuration of the ink jet recording apparatus.

  As shown in FIG. 6, the ink jet recording apparatus which is the liquid ejecting apparatus of the present embodiment has a plurality of different colors such as black (B), cyan (C), magenta (M), and yellow (Y). An ink jet recording head 1 (hereinafter referred to as a recording head) equipped with an ink cartridge (liquid storing means) 2 having a storage chamber for storing ink is provided. The recording head 1 is mounted on a carriage 3, and the carriage 3 on which the recording head 1 is mounted is provided on a carriage shaft 5 attached to the apparatus body 4 so as to be movable in the axial direction. Then, the driving force of the driving motor 6 is transmitted to the carriage 3 through a plurality of gears and a timing belt 7 (not shown), so that the carriage 3 is moved along the carriage shaft 5. On the other hand, the apparatus body 4 is provided with a platen 8 along the carriage shaft 5, so that a recording medium S such as paper fed by a paper feeding device (not shown) is conveyed on the platen 8. ing.

(Other embodiments)
As mentioned above, although embodiment of this invention was described, this invention is not limited to the above-mentioned embodiment.

  In the first embodiment, the first piezoelectric layer 65 and the individual electrode 70 are patterned simultaneously, but of course, they may be patterned separately to have different shapes. For example, only the individual electrode 70 may be extended to the ink supply path 14 side and connected to the lead electrode 90. Further, as shown in FIG. 7, one end of the first piezoelectric layer 65 and the second piezoelectric layer 75 in the longitudinal direction of the pressure generating chamber 12 (on the side opposite to the ink supply path 14) is extended to form the first piezoelectric layer 65 and the second piezoelectric layer 75. The piezoelectric layer 65 and the second piezoelectric layer 75 may be brought into contact with each other and their end faces may be covered with the second common electrode 80.

  In the above-described embodiment, the first common electrode 60 and the second common electrode 80 are connected over the partition wall 11 in the longitudinal direction. However, the present invention is not limited to this. For example, the piezoelectric layer is intermittently opened at a plurality of locations above the partition wall 11, and the first common electrode 60 and the second common electrode 80 are intermittently connected at a plurality of locations above the partition wall 11. Also good.

Further, a protective film made of an insulating material having moisture resistance may be formed in a portion other than the region corresponding to the pressure generating chamber 12 of the piezoelectric element 300. As the protective film, it is preferable to use an inorganic insulating material such as silicon oxide (SiO _x ), tantalum oxide (TaO _x ), or aluminum oxide (AlO _x ). In particular, aluminum oxide (AlO _x which is an inorganic amorphous material) is used. ), For example, it is preferable to use alumina (Al ₂ O ₃ ).

  In the above-described embodiment, the silicon single crystal substrate is exemplified as the flow path forming substrate 10, but the present invention is not particularly limited thereto, and the present invention is also effective for an SOI substrate, a glass substrate, an MgO substrate, and the like. Further, the elastic film 50 made of silicon dioxide is provided in the lowermost layer of the diaphragm, but the structure of the diaphragm is not particularly limited to this.

  In the above-described ink jet recording apparatus, the ink jet recording head 1 is mounted on the carriage 3 and moves in the main scanning direction. However, the present invention is not particularly limited thereto. For example, the ink jet recording head 1 is fixed. Thus, the present invention can also be applied to a so-called line type recording apparatus that performs printing only by moving the recording medium S such as paper in the sub-scanning direction.

  In the above-described embodiment, the ink jet recording head has been described as an example of the liquid ejecting head. However, the present invention is widely applied to all liquid ejecting heads, and the liquid ejecting ejects liquids other than ink. Of course, it can also be applied to the head. Other liquid ejecting heads include, for example, various recording heads used in image recording apparatuses such as printers, color material ejecting heads used in the manufacture of color filters such as liquid crystal displays, organic EL displays, and FEDs (field emission displays). Examples thereof include an electrode material ejection head used for electrode formation, a bioorganic matter ejection head used for biochip production, and the like.

  The present invention is not limited to a piezoelectric element mounted on a liquid jet head typified by an ink jet recording head, and can also be applied to a piezoelectric element mounted on another apparatus.

DESCRIPTION OF SYMBOLS 10 Flow path formation board | substrate, 12 Pressure generation chamber, 13 Communication part, 14 Ink supply path, 15 Communication path, 20 Nozzle plate, 21 Nozzle opening, 30 Protection board, 31 Reservoir part, 40 Compliance board, 50 Elastic film, 55 Insulation Body film, 60 first common electrode, 65 first piezoelectric layer, 70 individual electrode, 75 second piezoelectric layer, 80 second common electrode, 90 lead electrode, 100 reservoir, 110 wafer for flow path forming substrate, 120 driving Circuit, 121 connection wiring, 300 piezoelectric element

Claims (3)

A flow path forming substrate provided with a pressure generating chamber communicating with a nozzle opening for ejecting liquid, and a piezoelectric element provided above the flow path forming substrate, and discharging liquid from the nozzle opening by deformation of the piezoelectric element In the liquid jet head
The piezoelectric element is formed by sequentially laminating a first common electrode, a first piezoelectric layer, an individual electrode, a second piezoelectric layer, and a second common electrode from the flow path forming substrate,
In the juxtaposition direction of the pressure generation chambers, the first piezoelectric layer and the individual electrodes are provided so as to correspond to the pressure generation chambers,
In the piezoelectric active part that is a substantial driving part of the piezoelectric element, the upper surface of the first piezoelectric layer and the side surface in the direction in which the pressure generating chambers are arranged are covered with the individual electrode and the second piezoelectric layer. I,
The second piezoelectric layer is covered with the second common electrode,
The first common electrode and the second common electrode are continuously provided across the juxtaposed direction of the pressure generating chambers,
The liquid ejecting head, wherein the first common electrode and the second common electrode are connected above a partition that divides the pressure generating chamber in a juxtaposed direction. 2. The liquid jet head according to claim 1, wherein the first piezoelectric layer and the second piezoelectric layer each have a thickness of 1 μm or less. A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1.

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