JP5369293B2 - Chip inductor and manufacturing method thereof - Google Patents

Chip inductor and manufacturing method thereof Download PDF

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JP5369293B2
JP5369293B2 JP2008244422A JP2008244422A JP5369293B2 JP 5369293 B2 JP5369293 B2 JP 5369293B2 JP 2008244422 A JP2008244422 A JP 2008244422A JP 2008244422 A JP2008244422 A JP 2008244422A JP 5369293 B2 JP5369293 B2 JP 5369293B2
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adhesive
winding
ferrite core
internal electrode
flange
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JP2010080516A (en
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正樹 北川
由希子 大田
美穂 川▲崎▼
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Koa Corp
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Priority to PCT/JP2009/060126 priority patent/WO2009148072A1/en
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Description

本発明は、フェライトコアに巻線を施した比較的大きなインダクタンス値を有する巻線型のインダクタ素子に係り、特に面実装が可能なチップインダクタに関する。   The present invention relates to a winding type inductor element having a relatively large inductance value obtained by winding a ferrite core, and more particularly to a chip inductor capable of surface mounting.

従来から、フェライトコアに巻線を施した比較的大きなインダクタンス値を有する巻線型のインダクタ素子が知られている。これらの素子は、円柱状または角柱状の軸部と、その両端に配設した鍔部とを備えたフェライトコアを準備し、フェライトコアの軸部に巻線を巻回し、鍔部に設けた電極に巻線の両端部を固定して面実装可能な電極としたものである(特許文献1参照)。また、フェライトコアの軸部に巻線を巻回し、鍔部に設けた内部電極に巻線の両端を固定し、全体を外装樹脂(モールド樹脂体)で封止し、内部電極に接続した外部電極をモールド樹脂体の側面下部から延出し、底面に沿って折り曲げて配置し、面実装可能としたインダクタ素子が知られている(特許文献2参照)。
特開平9−213198号公報 特開2005−223147号公報
Conventionally, a winding type inductor element having a relatively large inductance value obtained by winding a ferrite core is known. These elements were prepared by providing a ferrite core having a cylindrical or prismatic shaft portion and flange portions disposed at both ends thereof, winding a winding around the ferrite core shaft portion, and providing the flange portion on the flange portion. An electrode that can be surface-mounted by fixing both ends of the winding to the electrode (see Patent Document 1). In addition, the winding is wound around the shaft part of the ferrite core, both ends of the winding are fixed to the internal electrode provided in the collar part, the whole is sealed with an exterior resin (mold resin body), and the external connected to the internal electrode There is known an inductor element in which an electrode is extended from a lower side of a side surface of a mold resin body and bent along a bottom surface to be surface-mounted (see Patent Document 2).
JP-A-9-213198 JP 2005-223147 A

これらのインダクタ素子では、フェライトコア鍔部への電極形成は、フェライトコア鍔部へ直接メタライズ又は金属板の電極を接着剤により貼り付けることにより行われ、フェライトコア鍔部に設けた内部電極に、巻線の端部を熱圧着又ははんだ接合にて固定している。巻線の端部をフェライトコア鍔部上に設けた内部電極へ熱圧着により接合する際、450℃前後の熱が印加される。また、外部電極となるリードフレームを搭載する際に、さらに350℃程度の熱が印加される。このような熱印加による負荷により、フェライトコア鍔部上に設けた内部電極は、高耐熱性のエポキシ樹脂で接合されているが、その熱により接合強度が劣化し、剥がれてしまうという問題があった。   In these inductor elements, the electrode formation on the ferrite core collar is performed by directly bonding the metalized or metal plate electrode to the ferrite core collar with an adhesive, and the internal electrode provided on the ferrite core collar is The end of the winding is fixed by thermocompression bonding or soldering. When the end of the winding is joined to the internal electrode provided on the ferrite core collar by thermocompression bonding, heat of around 450 ° C. is applied. Further, when a lead frame serving as an external electrode is mounted, heat of about 350 ° C. is further applied. The internal electrode provided on the ferrite core collar is bonded with a high heat-resistant epoxy resin due to such a load due to heat application, but there is a problem in that the bonding strength deteriorates due to the heat and is peeled off. It was.

また、これらのインダクタ素子が例えば車載用途の場合等には、極寒から高温の状態に曝される場合があり、また激しい振動・衝撃状態に曝される場合があり、これらの環境に耐えて所要の動作をする高い安定性・信頼性が要求される。   In addition, for example, when these inductor elements are used in vehicles, they may be exposed to extremely cold to high temperature conditions, and may be exposed to severe vibration / impact conditions. High stability and reliability are required.

本発明は、上述の事情に基づいてなされたもので、インダクタ素子のフェライトコア鍔部上面に接着剤により固定された内部電極の接合強度を向上させ、且つ高い信頼性が得られるチップインダクタを提供することを目的とする。   The present invention has been made based on the above-described circumstances, and provides a chip inductor that improves the bonding strength of an internal electrode fixed by an adhesive on the top surface of a ferrite core flange of an inductor element and that can obtain high reliability. The purpose is to do.

本発明のチップインダクタは、軸部とその両端に配設した鍔部とを備えたフェライトコアと、軸部に巻回し鍔部の上面に設けた内部電極に両端を熱圧着により固定した巻線と、フェライトコアと巻線とを封止したモールド樹脂体と、内部電極に接続し、前記モールド樹脂体から延出した金属板からなる外部電極とを備え、フェライトコアの鍔部の上面には軸部の方向へ向けて開放された凹部を設け、該鍔部の上面に金属板からなる内部電極が接着剤により固定されている。そして、凹部には接着剤の一部が充填され、鍔部の上面の接着剤と、凹部内の接着剤とにより、金属板からなる内部電極が、接着剤の厚さが薄い箇所と厚い箇所を介して鍔部に固定されている。 The chip inductor of the present invention includes a ferrite core having a shaft portion and flanges disposed at both ends thereof, and a winding wound around the shaft portion and fixed to the internal electrode provided on the upper surface of the flange portion by thermocompression bonding . When a molded resin body sealing the ferrite core and the winding, connected to the internal electrode, and an external electrode composed of the molded resin body or al extending metal plate, the upper surface of the flange portion of the ferrite core Is provided with a concave portion opened toward the shaft portion, and an internal electrode made of a metal plate is fixed to the upper surface of the flange portion with an adhesive. Then, the recess is filled with a part of the adhesive, and the internal electrode made of a metal plate has a thin portion and a thick portion of the adhesive due to the adhesive on the upper surface of the collar and the adhesive in the recess. It is fixed to the buttocks through .

また、本発明のチップインダクタの製造方法は、軸部とその両端に配設した鍔部と鍔部の少なくとも一面に軸部の方向へ向けて開放された凹部を設けたフェライトコアを準備し、鍔部の上面に接着剤を塗布し、凹部に接着剤を充填し、鍔部に、接着剤の厚さが薄い箇所と厚い箇所を介して、金属板からなる内部電極を固定し、フェライトコアの軸部に巻線を巻回し、鍔部に固定した内部電極に巻線の端部を熱圧着し、リードフレームを準備し該リードフレームの一端部を内部電極の上面に固定して該リードフレームを巻線の上方に配置し、フェライトコアと該フェライトコアの軸部に巻回した巻線とリードフレームの一部とをモールド樹脂体に封止しモールド樹脂体の側面の上部からリードフレームの端子部分が延出し、リードフレームをリードカットしモールド樹脂体から延出した端子部分をモールド樹脂体の側面および底面に沿って折り曲げることを特徴とする。
Further, the chip inductor manufacturing method of the present invention provides a ferrite core provided with a shaft portion and a flange portion provided at both ends thereof, and a recess opened toward the direction of the shaft portion on at least one surface of the flange portion, Apply an adhesive on the upper surface of the buttock, fill the recess with an adhesive, and fix an internal electrode made of a metal plate to the buttock through a thin portion and a thick portion of the adhesive. Winding the winding around the shaft part, and thermocompression bonding the end of the winding to the internal electrode fixed to the collar, preparing a lead frame, fixing one end of the lead frame to the upper surface of the internal electrode A frame is arranged above the winding, and the ferrite core, the winding wound around the shaft portion of the ferrite core and a part of the lead frame are sealed in the mold resin body, and the lead frame is started from the upper part of the side surface of the mold resin body. The terminal part of the Dokatto and wherein the bent along the terminal portion extending from the molded resin body on the sides and bottom of the molded resin body.

本発明のチップインダクタによれば、内部電極が接着剤により接合されるフェライトコア鍔部上面に凹部を設けることで、接着剤の厚い箇所と薄い箇所を設け、熱伝導性の良い場所と悪い場所を設けることができる。これにより、内部電極に巻線の端部を熱圧着により接合するに際して、熱印加による接着剤の強度劣化を低減し、内部電極がフェライトコア鍔部上面に対して十分な接合強度を保持することが可能となる。従って、車載用途等で要求される高い信頼性が得られる。   According to the chip inductor of the present invention, the concave portion is provided on the upper surface of the ferrite core collar portion to which the internal electrode is bonded by the adhesive, so that the thick portion and the thin portion of the adhesive are provided. Can be provided. As a result, when joining the end of the winding to the internal electrode by thermocompression bonding, the strength deterioration of the adhesive due to heat application is reduced, and the internal electrode retains sufficient bonding strength with respect to the upper surface of the ferrite core collar Is possible. Therefore, high reliability required for in-vehicle use and the like can be obtained.

以下、本発明のチップインダクタの実施形態について、図1乃至図4を参照して説明する。なお、各図中、同一または相当する部材または要素には、同一の符号を付して説明する。   Hereinafter, embodiments of the chip inductor according to the present invention will be described with reference to FIGS. In addition, in each figure, the same code | symbol is attached | subjected and demonstrated to the same or equivalent member or element.

図1は、本発明の一実施形態のチップインダクタの全体的な構成例を示す。このチップインダクタは、外装樹脂(モールド樹脂体)25の内部に、円柱状または角柱状の軸部11aとその両端に配設した鍔部11b,11bとを備えたフェライトコア11と、軸部11aに巻回し鍔部11bの上面に設けた内部電極13に両端を固定した巻線12とを備えている。内部電極13は銅板に錫メッキ等を施したもので、鍔部11bの上面に接着剤により固定され、巻線12の両端が熱圧着により接合されている。   FIG. 1 shows an overall configuration example of a chip inductor according to an embodiment of the present invention. This chip inductor includes a ferrite core 11 having a cylindrical or prismatic shaft portion 11a and flanges 11b and 11b disposed at both ends thereof inside an exterior resin (molded resin body) 25, and a shaft portion 11a. And a winding 12 having both ends fixed to an internal electrode 13 provided on the upper surface of the flange portion 11b. The internal electrode 13 is a copper plate plated with tin or the like, and is fixed to the upper surface of the flange portion 11b with an adhesive, and both ends of the winding 12 are joined by thermocompression bonding.

内部電極13には、T字型の銅等の金属板(外部電極)21の一端が固定され、金属板21の両他端はモールド樹脂体25の側面の上部から延出し、モールド樹脂体の側面および底面に沿って折り曲げて配置した端子部21bとなっている。端子部21bの表面には必要に応じてハンダまたは錫メッキが施され、面実装用の電極端子部分となっている。この電極端子部分は、モールド樹脂体の側面に沿ってその上部(巻線コア部の上方位置)まで延びるので、バネ材・クッション材としての役割を果たし、実装基板に印加される振動・衝撃・膨張・収縮に伴う応力を吸収し、巻線コア部分への応力の印加を低減できる。   One end of a T-shaped copper or other metal plate (external electrode) 21 is fixed to the internal electrode 13, and the other end of the metal plate 21 extends from the upper part of the side surface of the mold resin body 25. The terminal portion 21b is arranged by being bent along the side surface and the bottom surface. The surface of the terminal portion 21b is soldered or tin-plated as necessary to form an electrode terminal portion for surface mounting. Since this electrode terminal part extends to the upper part (above the winding core part) along the side surface of the molded resin body, it plays a role as a spring material / cushion material, and vibration / impact / The stress accompanying expansion and contraction can be absorbed, and the application of stress to the winding core can be reduced.

フェライトコア11の内部電極13を含む鍔部11bと、軸部11aに巻回した巻線12と、金属板21の一部は柔らかいシリコン樹脂からなるゴム状樹脂23により被覆されている。モールド樹脂体25は、エポキシ樹脂等の熱硬化性樹脂または液晶ポリマー等の熱可塑性樹脂からなる硬い外装樹脂であり、T字型の金属板21の一部を封止するとともに、フェライトコア11、巻線12、およびこれらを被覆するゴム状樹脂23の全体を封止する。従って、硬い外装樹脂により外部電極端子部分を安定に保持することができ、内部に柔らかい樹脂により被覆された巻線コア部分を備えることで、外部から印加される振動・衝撃或いは温度変化に伴う応力を柔らかい樹脂により吸収することができ、巻線コア部分への応力の印加を低減できる。   The flange portion 11b including the internal electrode 13 of the ferrite core 11, the winding 12 wound around the shaft portion 11a, and a part of the metal plate 21 are covered with a rubber-like resin 23 made of soft silicon resin. The mold resin body 25 is a hard exterior resin made of a thermosetting resin such as an epoxy resin or a thermoplastic resin such as a liquid crystal polymer. The mold resin body 25 seals a part of the T-shaped metal plate 21, and the ferrite core 11. The winding 12 and the entire rubber-like resin 23 covering these are sealed. Therefore, the external electrode terminal portion can be stably held by the hard exterior resin, and the stress accompanying the vibration / impact applied from the outside or the temperature change is provided by providing the winding core portion covered with the soft resin inside. Can be absorbed by a soft resin, and the application of stress to the winding core portion can be reduced.

図2(a)はフェライトコアと巻線と内部電極の部分の詳細を示す上面図であり、図2(b)はフェライトコアの鍔部において図2(a)のAA線に沿った断面を示す図である。このインダクタ素子においては、フェライトコア11の鍔部11bの上面に、軸部11aの方向へ向けて開放された凹部11cを設け、鍔部11bの上面に、銅等の金属板からなる内部電極13が接着剤14により固定されている。内部電極13には、円弧状の切欠部13aを備え、切欠部に巻線が懸架した状態で、巻線の端部12aが熱圧着により内部電極13に固定されている。   FIG. 2A is a top view showing details of the ferrite core, the winding, and the internal electrode, and FIG. 2B is a cross-sectional view taken along the line AA in FIG. FIG. In this inductor element, a concave portion 11c opened toward the shaft portion 11a is provided on the upper surface of the flange portion 11b of the ferrite core 11, and the internal electrode 13 made of a metal plate such as copper is provided on the upper surface of the flange portion 11b. Is fixed by an adhesive 14. The internal electrode 13 includes an arc-shaped cutout portion 13a, and the winding end portion 12a is fixed to the internal electrode 13 by thermocompression bonding with the winding suspended in the cutout portion.

凹部11cには、接着剤14の一部が充填され、鍔部11bの上面は接着剤14により金属板からなる内部電極13と接合されているので、内部電極13は接着剤の薄い面と厚い面を介して鍔部11bの上面に固定されている。これにより、図3(a)のハッチングで示す部分Aは接着剤の厚さが薄いことで、熱伝導性の良い部分となり、図3(b)のハッチングで示す部分Bは接着剤の厚さが厚いことで、熱伝導性の悪い部分となる。この例では、接着剤の薄い部分の厚さは10μm程度であり、接着剤の厚い部分の厚さ(凹部の深さ)は220μm程度である。また、内部電極の厚さは0.1mm程度である。   The concave portion 11c is filled with a part of the adhesive 14, and the upper surface of the flange portion 11b is joined to the internal electrode 13 made of a metal plate by the adhesive 14, so that the internal electrode 13 is thick with the thin surface of the adhesive. It is being fixed to the upper surface of the collar part 11b through the surface. Accordingly, the portion A indicated by hatching in FIG. 3A is a portion having good thermal conductivity due to the thin thickness of the adhesive, and the portion B indicated by hatching in FIG. 3B is the thickness of the adhesive. Since the thickness is thick, it becomes a part with poor thermal conductivity. In this example, the thickness of the thin part of the adhesive is about 10 μm, and the thickness of the thick part of the adhesive (depth of the recess) is about 220 μm. The thickness of the internal electrode is about 0.1 mm.

本発明者等の内部電極の剥離試験(破壊試験)結果では、接着剤の薄いところは熱集中が起き界面剥離(接着剤と被接着面との界面で剥離していて、接着機能を果たしていない)が起こっているが、厚いところは、凝集破壊(接着剤中での剥離)になっている。従って、内部電極接合面のフェライトコア鍔部11bに凹部11cを設けることで、接着剤14の厚い箇所と薄い箇所を設け、熱伝導性の良い場所と悪い場所を設けることで、巻線端部12aの接合時の熱による接着剤の強度劣化を低減し、外部電極となる金属板搭載後でも十分な強度を保持することが可能になる。   According to the results of the peel test (destructive test) of the internal electrodes of the present inventors, heat concentration occurs in the thin part of the adhesive, peeling at the interface between the adhesive and the adherend surface, and the adhesive function is not achieved. ) Has occurred, but the thick part is cohesive failure (peeling in the adhesive). Therefore, by providing the concave portion 11c in the ferrite core flange portion 11b of the internal electrode joint surface, a thick portion and a thin portion of the adhesive 14 are provided, and a place having a good thermal conductivity and a place having a bad heat conductivity are provided. It is possible to reduce the strength deterioration of the adhesive due to heat at the time of joining 12a, and to maintain a sufficient strength even after mounting a metal plate serving as an external electrode.

次に、上記チップインダクタの製造方法について、図4を参照して説明する。まず、(a)に示すように、円柱状または角柱状の軸部11aと、その両端に配設した鍔部11b,11bと、鍔部の少なくとも一面に軸部11aの方向へ向けて開放された凹部11cを設けたフェライトコア11を準備する。図示のフェライトコア11には、鍔部11b,11bの上下両面に軸部11aの方向へ向けて開放された凹部11c,11cを設けているので、製造段階で鍔部の上面となる面に内部電極13を配置することができる。   Next, a method for manufacturing the chip inductor will be described with reference to FIG. First, as shown to (a), it is open | released toward the direction of the axial part 11a in the cylindrical part or the prismatic axial part 11a, the collar parts 11b and 11b arrange | positioned at the both ends, and at least one surface of the collar part. A ferrite core 11 provided with a concave portion 11c is prepared. The illustrated ferrite core 11 is provided with concave portions 11c and 11c that are open toward the shaft portion 11a on both upper and lower surfaces of the flange portions 11b and 11b. An electrode 13 can be arranged.

次に、(b)に示すように、鍔部11b,11bのそれぞれの上面に内部電極13を接着剤により固定する。内部電極13は、この実施形態では銅板に錫メッキを施したものである。接着剤は高耐熱性のエポキシ樹脂を用い、凹部11cに充填すると共に、鍔部の上面に塗布し、金属板からなる内部電極13を固定し、加温・乾燥することで内部電極13を鍔部11bの上面に接合する。これにより、金属板からなる内部電極13が、鍔部上面の接着剤の薄い面と凹部上面の接着剤の厚い面を介して鍔部11bの上面に固定される。   Next, as shown in (b), the internal electrodes 13 are fixed to the upper surfaces of the flange portions 11b and 11b with an adhesive. In this embodiment, the internal electrode 13 is a copper plate plated with tin. The adhesive is made of a highly heat-resistant epoxy resin, filled in the recess 11c, applied to the upper surface of the collar, the internal electrode 13 made of a metal plate is fixed, and the internal electrode 13 is secured by heating and drying. It joins to the upper surface of the part 11b. As a result, the internal electrode 13 made of a metal plate is fixed to the upper surface of the flange portion 11b via the thin surface of the adhesive on the upper surface of the collar portion and the thick surface of the adhesive on the upper surface of the recess.

次に、フェライトコア11の軸部11aに巻線12を巻回し、鍔部11bの上面に接合した内部電極13に巻線の端部を熱圧着により固定する。巻線の端部の固定は、(c)に示すように、ワイヤ引っ張り治具31を用い、巻線の端部を引っ張りつつ、ヒーターチップ(熱源)32により圧力を加えつつ、450℃前後の熱を0.3秒程度パルス状に加えることで行われる。この際、(d)に示すように、内部電極13は円弧状の切欠部13aを有するので、巻線の端部12aが円弧の頂部を通るように容易に位置決めすることができ、これによりバラツキのない巻線の固定が行える。   Next, the winding 12 is wound around the shaft portion 11a of the ferrite core 11, and the end of the winding is fixed to the internal electrode 13 joined to the upper surface of the flange portion 11b by thermocompression bonding. As shown in (c), the end of the winding is fixed at about 450 ° C. while applying a pressure by the heater chip (heat source) 32 while pulling the end of the winding using a wire pulling jig 31. This is done by applying heat in pulses for about 0.3 seconds. At this time, as shown in (d), since the internal electrode 13 has the arc-shaped cutout portion 13a, the end portion 12a of the winding can be easily positioned so as to pass through the top portion of the arc. Winding can be fixed without any.

巻線端部の熱圧着による固定は450℃前後の熱を印加して行われるが、上述のように、フェライトコア鍔部の凹部11cには接着剤14の一部が充填され、金属板からなる内部電極13が、接着剤の薄い面と厚い面を介して鍔部11bに固定されているので、熱による接着剤の強度劣化を低減できることは上述したとおりである。   Fixing of the winding end portion by thermocompression bonding is performed by applying a heat of around 450 ° C. As described above, the concave portion 11c of the ferrite core collar portion is filled with a part of the adhesive 14, and from the metal plate Since the internal electrode 13 is fixed to the flange 11b via the thin and thick surfaces of the adhesive, as described above, the strength deterioration of the adhesive due to heat can be reduced.

次に、(e)に示すように、外部電極となるリードフレーム(金属板)21を準備し、該リードフレーム(金属板)21の一端部を内部電極13の上面にハンダ接合等により固定して、該リードフレーム(金属板)21を巻線12の上方位置に配置する。この時にも、350℃程度の熱が内部電極13に印加されるが、内部電極13を鍔部11bに固定する接着剤14の劣化は生じない。リードフレーム(金属板)21は、一端が内部電極と接続する棒状部21aと、棒状部21aの他端と交差接続する端子部21bとを備える。なお、端子部21bの中央部のT字型接合部近傍に設けられた円弧状切り欠きSは、実質的に外部電極の幅を狭くしてハンダ接合に際して、熱の逃げを防止するためのものである。   Next, as shown in (e), a lead frame (metal plate) 21 to be an external electrode is prepared, and one end of the lead frame (metal plate) 21 is fixed to the upper surface of the internal electrode 13 by soldering or the like. Thus, the lead frame (metal plate) 21 is disposed above the winding 12. At this time as well, heat of about 350 ° C. is applied to the internal electrode 13, but the adhesive 14 that fixes the internal electrode 13 to the flange 11b does not deteriorate. The lead frame (metal plate) 21 includes a rod-shaped portion 21a whose one end is connected to the internal electrode, and a terminal portion 21b that is cross-connected to the other end of the rod-shaped portion 21a. The arc-shaped notch S provided in the vicinity of the T-shaped joint at the center of the terminal portion 21b is for substantially reducing the width of the external electrode to prevent escape of heat during solder joining. It is.

次に、(f)に示すように、フェライトコア11と、フェライトコアに巻回した巻線12と、リードフレーム(金属板)21の一部分をゴム状樹脂で被覆する。そして、ゴム状樹脂で被覆した部分23と、さらにリードフレーム(金属板)21の一部分とをインサート成形等によりモールド樹脂体25に封止する。この状態で、モールド樹脂体25の側面上部からリードフレーム(金属板)21の封止されていない端子部分21bが延出する。そして、リードフレームの不要部をリードカットし、リード端子となる金属板21のモールド樹脂体25から延出した端子部分21bを、モールド樹脂体25の側面および底面に沿って折り曲げて、さらにハンダまたは錫メッキ等を施すことで、図1に示すインダクタ素子が完成する。   Next, as shown in (f), the ferrite core 11, the winding 12 wound around the ferrite core, and a part of the lead frame (metal plate) 21 are covered with a rubber-like resin. Then, the portion 23 covered with the rubber-like resin and a part of the lead frame (metal plate) 21 are sealed in the mold resin body 25 by insert molding or the like. In this state, an unsealed terminal portion 21 b of the lead frame (metal plate) 21 extends from the upper part of the side surface of the mold resin body 25. Then, unnecessary portions of the lead frame are lead-cut, and the terminal portion 21b extending from the mold resin body 25 of the metal plate 21 to be the lead terminal is bent along the side surface and the bottom surface of the mold resin body 25, and further solder or By applying tin plating or the like, the inductor element shown in FIG. 1 is completed.

なお、上記実施形態では、内部電極13をフェライトコア鍔部11bに固定後、巻線12を形成する例について説明したが、巻線12を形成した後で、内部電極13をフェライトコア鍔部11bに固定し、巻線12の端部12aを内部電極13に固定するようにしてもよい。   In the above embodiment, the example in which the winding 12 is formed after the internal electrode 13 is fixed to the ferrite core flange 11b has been described. However, after the winding 12 is formed, the internal electrode 13 is connected to the ferrite core flange 11b. The end 12a of the winding 12 may be fixed to the internal electrode 13.

これまで本発明の一実施形態について説明したが、本発明は上述の実施形態に限定されず、その技術的思想の範囲内において種々異なる形態にて実施されてよいことは言うまでもない。   Although one embodiment of the present invention has been described so far, it is needless to say that the present invention is not limited to the above-described embodiment, and may be implemented in various forms within the scope of the technical idea.

本発明の一実施形態のチップインダクタの全体的な構成例を示す内部を透視した斜視図である。It is the perspective view which saw through the inside which shows the example of a whole structure of the chip inductor of one Embodiment of this invention. 上記チップインダクタの、(a)はフェライトコアと巻線と内部電極の部分を示す上面図であり、(b)はフェライトコアの鍔部において(a)のAA線に沿った断面図である。(A) of the said chip inductor is a top view which shows the part of a ferrite core, a coil | winding, and an internal electrode, (b) is sectional drawing along the AA line of (a) in the collar part of a ferrite core. (a)(b)はフェライトコア鍔部近傍の上面図である。(A) and (b) are top views of the ferrite core collar vicinity. 本発明のチップインダクタの製造工程を示す図である。It is a figure which shows the manufacturing process of the chip inductor of this invention.

符号の説明Explanation of symbols

11 フェライトコア
11a 軸部
11b 鍔部
11c 凹部
12 巻線
12a 巻線端部
13 内部電極
13a 円弧状切欠
14 接着剤
21 金属板(リードフレーム)
21a 金属板の棒状部
21b 金属板の端子部
23 ゴム状樹脂
25 モールド樹脂体(外装樹脂)
DESCRIPTION OF SYMBOLS 11 Ferrite core 11a Shaft part 11b Eaves part 11c Recessed part 12 Winding 12a Winding end part 13 Internal electrode 13a Arc-shaped notch 14 Adhesive 21 Metal plate (lead frame)
21a Metal plate rod portion 21b Metal plate terminal portion 23 Rubber-like resin 25 Mold resin body (exterior resin)

Claims (4)

軸部と、その両端に配設した鍔部とを備えたフェライトコアと、
前記軸部に巻回し、前記鍔部の上面に設けた内部電極に両端を熱圧着により固定した巻線と、
前記フェライトコアと、前記巻線とを封止したモールド樹脂体と、
前記内部電極に接続し、前記モールド樹脂体から延出した金属板からなる外部電極とを備え、
前記フェライトコアの鍔部の上面には、前記軸部の方向へ向けて開放された凹部を設け、該鍔部の上面に、金属板からなる前記内部電極が接着剤により固定され
前記鍔部の上面の接着剤と、前記凹部内の接着剤とにより、金属板からなる内部電極が、前記接着剤の厚さが薄い箇所と厚い箇所を介して前記鍔部に固定されていることを特徴とするチップインダクタ。
A ferrite core having a shaft portion and flanges disposed at both ends thereof;
Winding wound around the shaft part, both ends fixed to the internal electrode provided on the upper surface of the collar part by thermocompression bonding ,
A molded resin body that seals the ferrite core and the winding;
Wherein connected to the internal electrode, and an external electrode composed of the molded resin body or al extending metal plate,
The upper surface of the flange portion of the ferrite core is provided with a recess opened toward the shaft portion, and the inner electrode made of a metal plate is fixed to the upper surface of the flange portion with an adhesive ,
An internal electrode made of a metal plate is fixed to the flange through a thin portion and a thick portion of the adhesive by the adhesive on the upper surface of the flange and the adhesive in the recess . A chip inductor characterized by that.
前記凹部内の接着剤は、前記軸部の方向へ厚みが減少していることを特徴とする請求項1に記載のチップインダクタ。 2. The chip inductor according to claim 1 , wherein the thickness of the adhesive in the concave portion decreases in the direction of the shaft portion . 軸部と、その両端に配設した鍔部と、前記鍔部の少なくとも一面に前記軸部の方向へ向けて開放された凹部を設けたフェライトコアを準備し、
前記鍔部の上面に接着剤を塗布し、前記凹部に接着剤を充填し、記鍔部に、前記接着剤の厚さが薄い箇所と厚い箇所を介して、金属板からなる内部電極を固定し、
前記フェライトコアの軸部に巻線を巻回し、前記鍔部に固定した内部電極に巻線の端部を熱圧着し、
リードフレームを準備し、該リードフレームの一端部を前記内部電極の上面に固定して、該リードフレームを前記巻線の上方に配置し、
前記フェライトコアと、該フェライトコアの軸部に巻回した巻線と、前記リードフレームの一部とをモールド樹脂体に封止し、前記モールド樹脂体の側面上部から前記リードフレームの端子部分が延出し、
前記リードフレームをリードカットし、前記モールド樹脂体から延出した端子部分を、前記モールド樹脂体の側面および底面に沿って折り曲げることを特徴とするチップインダクタの製造方法。
Prepare a ferrite core provided with a shaft portion, a flange portion disposed at both ends thereof, and a recess opened toward the direction of the shaft portion on at least one surface of the flange portion,
An adhesive is applied to the upper surface of the flange portion, an adhesive is filled in the recess, prior Kitsuba portion, through said reduced thickness portion and a thick portion of the adhesive, the internal electrode made of a metal plate Fixed,
Winding a winding around the shaft portion of the ferrite core, thermocompression bonding the end of the winding to the internal electrode fixed to the flange,
Preparing a lead frame, fixing one end of the lead frame to the upper surface of the internal electrode, and arranging the lead frame above the winding;
The ferrite core, the winding wound around the shaft portion of the ferrite core, and a part of the lead frame are sealed in a mold resin body, and the terminal portion of the lead frame is formed from the upper side surface of the mold resin body. Extension,
A method of manufacturing a chip inductor, wherein the lead frame is lead-cut and a terminal portion extending from the mold resin body is bent along a side surface and a bottom surface of the mold resin body.
前記凹部内の接着剤は、前記軸部の方向へ厚みが減少していることを特徴とする請求項に記載のチップインダクタの製造方法。 The method for manufacturing a chip inductor according to claim 3 , wherein the thickness of the adhesive in the concave portion decreases in the direction of the shaft portion .
JP2008244422A 2008-06-05 2008-09-24 Chip inductor and manufacturing method thereof Expired - Fee Related JP5369293B2 (en)

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PCT/JP2009/060126 WO2009148072A1 (en) 2008-06-05 2009-06-03 Chip inductor and manufacturing method thereof
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