JP5364668B2 - Infrared imaging device - Google Patents

Description

 Embodiments described herein relate generally to an infrared imaging device.

  Up to now, an infrared imaging device has been developed in which infrared detection elements using MEMS (Micro Electro Mechanical Systems) technology are arranged in an array, and the detection element selection means and the signal reading means from the detection elements are provided. .

  In an uncooled infrared imaging device that can be miniaturized and on-chip, the infrared detector is thermally separated from the surroundings to improve the thermal insulation of the infrared detector or the thermoelectric conversion of the infrared detector Improving efficiency is important for improving the detection sensitivity of infrared rays.

  In general, as a measure to improve the resistance temperature coefficient indicating the sensitivity of the infrared detector while maintaining impedance matching between the infrared detector and the signal readout circuit, a plurality of Schottky junction diodes are connected in series as the infrared detector. In the detection section, the ohmic junction of the reverse bias state showing a high resistance and the high dose of the SOI high resistance semiconductor region are reduced in the detection section, and the detection element output resistance is lowered. Infrared detectors that can be realized have been developed. In the infrared detection element using this Schottky junction diode, the reverse saturation current is large because a Schottky junction that performs majority carrier operation is used, and in the infrared imaging device, as a means for deselecting the infrared detection element, When using the OFF state at the time of reverse bias of the diode in the infrared detection unit, there is a problem that the leakage current at the OFF time becomes large.

JP 09-166497 A

  An object of the present invention is to provide an infrared imaging device capable of reducing an offset amount and noise of a read signal by suppressing a leakage current at an off time.

  In order to achieve the above object, an infrared imaging device according to an embodiment is formed on a conductive substrate, absorbs infrared rays and converts them into heat, a plurality of Schottky junction diodes, and at least one or more pn. A junction diode is connected in series, and an infrared detector including a thermoelectric converter that converts the heat into an electric signal is provided. Moreover, the cavity part which thermally isolates this infrared rays detection part and the said board | substrate is provided. Furthermore, it has the infrared input / output from this thermoelectric conversion part and the support wiring which supports this infrared rays detection part, and the infrared rays detection element arrange | positioned at array form is provided. Further, an element selection unit that selects the infrared detection element, and a signal readout unit that applies a voltage to the infrared detection element and operates at a constant current are provided.

1 is a schematic diagram of an infrared imaging device according to an embodiment. The top view for one element of the infrared imaging device of an embodiment. FIG. 3 is a cross-sectional view taken along the line A-A ′ in FIG. 2 of the infrared imaging device according to the embodiment. The graph of the temperature dependence of the IV characteristic of the Si-pn junction diode of embodiment. The graph of the temperature dependence of the IV characteristic of the Ni-Schottky junction diode of embodiment. The circuit diagram of the infrared imaging device of an embodiment. The graph of the change of the IV characteristic rise voltage by the electrode material of the Schottky junction diode of embodiment. Sectional drawing showing the manufacturing process of the infrared imaging device of embodiment. Sectional drawing showing the manufacturing process of the infrared imaging device of embodiment. Sectional drawing showing the manufacturing process of the infrared imaging device of embodiment. Sectional drawing showing the manufacturing process of the infrared imaging device of embodiment. Sectional drawing showing the manufacturing process of the infrared imaging device of embodiment. Sectional drawing showing the manufacturing process of the infrared imaging device of embodiment. Sectional drawing showing the manufacturing process of the infrared imaging device of embodiment. Sectional drawing showing the manufacturing process of the infrared imaging device of embodiment. Sectional drawing showing the manufacturing process of the infrared imaging device of embodiment. Sectional drawing showing the manufacturing process of the infrared imaging device of embodiment.

  Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals.

 First, the configuration of the infrared imaging device of the embodiment will be described.

 FIG. 1 is a schematic diagram of an infrared imaging device according to an embodiment. As shown in FIG. 1, in the infrared imaging device 100, an infrared detection unit 106 that is an infrared detection layer is arranged at the center of an infrared detection element array that constitutes a pixel. A support wiring 103 that supports the infrared detection unit 106 is coupled to both ends of the infrared detection unit 106. Further, the infrared detection unit 106 is connected to the vertical signal line 102 and the horizontal signal line 101 at the outer peripheral part for processing a signal from the infrared detection unit 106 via the support wiring 103.

 Specifically, each of the vertical signal lines 102 on the outer peripheral portion is connected to one end of the infrared detection unit 106 arranged along the horizontal direction. Further, the vertical signal line 102 at the outer peripheral portion is connected to the other end of the infrared detection unit 106 arranged along the vertical direction.

 A cavity 104 is provided between the lower part of the infrared detection unit 106 and the support wiring 103 and the substrate 105, and the infrared thermal component detected by the infrared detection unit 106 is contained in the silicon substrate 7. However, the heat capacity is reduced.

 Note that the infrared imaging element 119 indicates a range including the infrared detection unit 106, the support wiring 103, the cavity 104, and the substrate 105.

 The infrared imaging device 100 is assumed to indicate a range including an infrared imaging element 119, an element selection unit 117 described later, and a signal readout unit 118.

  FIG. 2 is a top view of one element of the infrared imaging device according to the embodiment. As shown in FIG. 2, the infrared detection unit 106 of the infrared imaging element 119 includes a pn junction diode region 110 and a Schottky diode region 111. Further, the pn junction diode region 110 and the Schottky diode region 111 are connected by a metal wiring 112 described in a manufacturing method described later. Further, the pn junction diode region 110 is connected to the vertical signal line 102 via the support wiring 103. Similarly, the Schottky diode region 111 is connected to the horizontal signal line 101 via the support wiring 103.

 3 is a cross-sectional view taken along the line A-A ′ of FIG. 2 of the infrared imaging device according to the embodiment. As shown in FIG. 3, a cavity 104 is provided on the surface of the substrate 105. In the infrared detection unit 106, an infrared absorption unit 115 made of an insulating material is laminated in a region surrounding the cavity 104 of the substrate 105. Here, the infrared absorption part 115 plays the role of the absorption layer which absorbs infrared rays.

  A thermoelectric conversion unit 116 including a pn junction diode region 110 and a Schottky diode region 111 is provided below the infrared absorption unit 115. A metal wiring 112, which will be described later in a manufacturing method, is provided on the thermoelectric conversion unit 116, and is in contact with the pn junction diode region 110 and the Schottky diode region 111 of the thermoelectric conversion unit 116.

 Next, the principle of the infrared imaging device of the embodiment will be briefly described.

  In the infrared imaging device of the embodiment, when the infrared detector 106 is a temperature sensor and the device drop voltage change amount due to the device temperature change at the time of constant current application is read as a signal, the sensitivity (dV / dT) is expressed by the following formula 1. Indicated by Here, the case where the term of Eg / q in the case of the pn junction diode 110 is replaced with Φb corresponds to the Schottky junction diode 111.

  Φb represents a Schottky barrier potential difference. In the case of metal / silicon Schottky, assuming that the work function ΦM of the metal and the electron affinity χSi (= 4.34 eV) of silicon, Φb = ΦM−χSi. Eg is a silicon bandgap of 1.12 eV, Vf represents a voltage drop due to the device when a constant current is applied, q represents an electric charge, T represents an absolute temperature of the device, and n represents an infrared detecting element. Represents the number of serial devices to be connected.

Here, as shown in Equation 1, the sensitivity of the infrared detection unit 106 is proportional to the number n of series devices, and decreases as the device voltage drop increases.

  Here, since the Schottky junction diode 111 is dominated by electron conduction by majority carriers, it is generally known that the IV characteristic rises faster than the pn junction diode 110. Therefore, by using the Schottky junction diode 111, in the case of constant current reading, a forward bias voltage point for obtaining a current value necessary for noise reduction can be made low, so that a power supply voltage equivalent to that of the pn junction diode 110 can be applied. If the number of Schottky junction diodes 111 can be increased in series, the sensitivity of the infrared detection unit 106 is increased, and the sensitivity of the infrared detection unit 106 is equal, the power supply voltage can be lowered.

  Furthermore, the principle of the infrared imaging device according to the embodiment will be described in detail with reference to FIGS. 4 and 5.

  FIG. 4 is a graph for explaining the temperature dependence of the IV characteristics of the Si-pn junction diode of the embodiment. The vertical axis represents the logarithmic value of the current (Id) flowing through the diode, and the horizontal axis represents the applied voltage (Vf) to the diode. Further, the square plot represents the characteristic of the device temperature of 300K, and the triangular plot represents the characteristic of the device temperature of 385K. For Vf <0V, the logarithmic value of the absolute value of the reverse saturation current is plotted.

  As shown in FIG. 4, in the Si-pn junction diode which is one embodiment of the pn junction diode 110, Vf at the time of applying a 1 uA constant current at a device temperature of 300K is 0.8V. The reverse saturation current value is very low, 1e-20A. Here, from the characteristics of the device temperatures of 385K and 300K, dV / dT at Id = 1uA was -1.3 mV / K. That is, it can be seen that when the pn junction diode 110 is used, the power supply voltage increases because Vf is large, but the off-leak current can be reduced because the value of the reverse saturation current is small.

  Further, FIG. 5 is a graph for explaining the temperature dependence of the IV characteristic of the Ni-silicon Schottky junction diode of the embodiment. The vertical axis represents the current (Ids) flowing through the Ni-silicon Schottky junction diode, and the horizontal axis represents the applied voltage (Vfs) of the Ni-silicon Schottky junction diode. The square plot represents the characteristic at a device temperature of 300K, and the triangular plot represents the characteristic at a device temperature of 385K. Similarly to FIG. 1, when Vf <0 V, the logarithmic value of the absolute value of the reverse saturation current is plotted.

  Here, as shown in FIG. 5, in the Ni-silicon Schottky junction diode which is one embodiment of the Schottky junction diode 111, the Vf at the time of applying the 1 uA constant current at the device temperature of 300K was 0.4V. . Also, from the characteristics of the device temperatures of 385K and 300K, dV / dT at Id = 1uA was -1.2mV / K.

  Therefore, when a Ni-silicon Schottky junction diode which is one embodiment of the Schottky junction diode 111 is used, dV / dT which is a sensitivity index of the device is substantially equal, and Si− which is one embodiment of the pn junction diode is used. Vf can be reduced by 50% compared to a pn junction diode.

  However, as shown in FIG. 5, the Ni-silicon Schottky junction diode has a very high reverse saturation current value of about 1e-11A. This causes an off-leakage current and an accompanying increase in noise when the reverse characteristic of the diode is used as an unselected state of the device as an infrared detection element array.

  Therefore, the inventors, as shown in FIG. 6, in a thermoelectric conversion unit 116 of the infrared detection unit 106 in which a plurality of diodes are connected in series, a pn junction diode 110, which is a minority carrier device, is used to reduce the power supply voltage. It has been found that by inserting at least one Schottky junction diode 111 connected in series into a cell, the sensitivity can be improved and the leakage current at the off time can be suppressed.

  FIG. 6 is a circuit diagram relating to the infrared imaging device of the embodiment. As shown in FIG. 6, the thermoelectric conversion unit 116 includes an infrared detection unit 106 in which one pn junction diode 110 and three Schottky junction diodes 111 are connected in series as a 2 × 2 array. The infrared imaging device 100 can be operated.

 Although FIG. 6 shows an embodiment in which three Schottky junction diodes 111 and one pn junction diode 110 are used for the thermoelectric conversion unit 116 of the infrared detection unit 106 per element, the Schottky junction is shown. The number of diodes 111 is determined by the sensitivity and power supply voltage required for the infrared detector 106. The number of pn junction diodes 110 is more preferably reduced as much as possible in order to reduce the power supply voltage or improve the sensitivity. In the present embodiment, the number of pn junction diodes 110 is one.

 Furthermore, FIG. 6 is shown and the selection method of the infrared imaging device of embodiment is demonstrated below. FIG. 3 shows the operations of the element selection unit 117 and the signal readout unit 118 according to claim 1.

  First, as shown in FIG. 6, in order to select Pix12 and Pix22 by the element selection unit 117, Vdd is supplied from the vertical register 120, and the non-selected cells Pix11 and Pix21 are set to 0V. The current supplied from the vertical register 120 is adjusted to a desired current value by the constant current sources L1 and L2.

 Furthermore, the gate voltage of Amp 1123 and Amp 2124 which are amplifier transistors connected to the vertical signal line V1121 and the vertical signal V2122 by the signal reading unit 118 is determined according to the resistance of the thermoelectric conversion unit 116 by the constant current value described above from Vdd. The voltage of the value excluding the voltage drop generated in this way is given.

  Here, the reset level (mainly power supply voltage) is given to the storage capacitor Cs1125 and the storage capacitor Cs2126 by turning on the reset transistor Rst1127 and the reset transistor Rst2128 in advance by the signal reading unit 118.

 Further, when the reset transistor Rst1127 and the reset transistor Rst2128 are turned off and the selection transistor S1129 and the selection transistor S2130 are turned on by the signal reading unit 118, current values corresponding to the gate voltages of the amplifier transistors Amp1123 and Amp2124 are obtained. The signal is discharged from the storage capacitor Cs1125 and the storage capacitor Cs2126, and the integrated signal voltage is held in the storage capacitor.

  Therefore, if the selection transistors S1129 and S2130 are turned off by the signal reading unit 118 and the column selection transistors are sequentially turned on by the horizontal register 131, the signals Pix12 and Pix22 can be read as Sout.

  Here, for the non-selected cells Pix11 and Pix21, since the vertical signal line V1121 and the vertical signal line V2122 are applied to the positive voltage by the selected cell, a reverse bias is applied to the Schottky junction diode 111 and it is turned OFF.

  Here, in a general infrared imaging device, when the thermoelectric conversion unit 116 of the infrared detection unit 106 is configured only by the connection of the series Schottky junction diode 111, the reverse method current due to the majority carrier device is large, so Leakage current increases and affects the signal voltage of the selected cell.

  Here, in the infrared detection element of the embodiment, the inventors connected in series one pn junction diode 110 having a small reverse current in the cells of the plurality of series Schottky junction diodes 111 as the thermoelectric conversion unit 116. In addition to the above, it has been found that the leakage current when not selected can be reduced.

  FIG. 7 is a graph illustrating the change in the IV characteristic rising voltage depending on the electrode material of the Schottky junction diode of the embodiment. The vertical axis represents the current (Ids) flowing through each Schottky junction diode, and the horizontal axis represents the applied voltage (Vfs) of each Schottky junction diode. The square plot represents the characteristics of a Ni Schottky junction diode with a device temperature of 300K, and the triangular plot represents the characteristics of a Co Schottky junction diode with a device temperature of 300K. Similarly to FIG. 1, when Vf <0 V, the logarithmic value of the absolute value of the reverse saturation current is plotted.

  As shown in FIG. 7, when a material having a low Schottky barrier potential is used, such as a Co Schottky junction diode which is one embodiment of the Schottky junction diode 111, the device drop voltage Vf can be further reduced. Thus, by changing the Schottky electrode material, the value of Vf can be adjusted, and it can be confirmed that an infrared detection element meeting the system requirements of the power supply voltage can be realized.

  Next, the manufacturing process of the infrared imaging device according to the embodiment will be described.

  8-17 is sectional drawing which shows the manufacturing process of the infrared imaging device which concerns on embodiment of this invention.

  First, as shown in FIG. 8, a so-called SOI substrate 200 in which a buried silicon oxide film layer 202 and an SOI (Silicon on Insulator) layer 203 made of single crystal silicon are sequentially stacked on a single crystal silicon support substrate 201 as a semiconductor substrate. Prepare.

  Next, as illustrated in FIG. 9, element isolation is performed using an STI (Shallow-Trench-Isolation) structure. That is, an element isolation region is defined by a photolithography technique, the single crystal silicon layer 203 in the element isolation region is removed by etching by RIE (Reactive-Ion-Eching), and then the element isolation oxide film 204 is formed by CVD (Chemical-Vapor-). It is embedded by Deposition and planarized by CMP (Chemical-Mechanical-Polishing).

Next, as shown in FIG. 10, after forming the element isolation oxide film 204, a pn junction diode 110 (FIG. 10A) to be the thermoelectric conversion element 116 is formed. As the means, first, the p-type diffusion layer region 205 is defined by a photolithography technique, and, for example, boron is implanted at 100 keV and 1.4 × 10 ¹³ cm ⁻² by ion implantation to form the p-region type 205. . This step can be omitted by using the SOI layer 203 as a p-type substrate and using the substrate concentration.

Next, the bottom p + electrode region 207 is defined by a photolithography technique, and, for example, boron is implanted at 130 keV and 2 × 10 ¹⁴ cm ⁻² by ion implantation, and the bottom p ⁺ electrode region is formed in a deep region of the SOI layer 203. 207 is formed. Next, similarly, an n ⁺ electrode region 206 is defined in a shallow region of the SOI layer 203, and As is implanted, for example, at 40 keV and 5 × 10 ¹⁵ cm ⁻² to form the n ⁺ electrode region 206.

Next, similarly, a p ⁺ contact diffusion layer region 208 is formed on the substrate surface by implanting, for example, BF 2 at 20 keV and 4 × 10 ¹⁵ cm ⁻² . Next, in order to connect the p ⁺ contact diffusion layer region 208 and the bottom p ⁺ electrode region 207, in order to form a p ⁺ extraction electrode region 209 extending in the substrate depth direction, for example, B is set to 100 keV, 2.5 It is formed by ion implantation at × 10 ¹³ cm ⁻² and 75 keV, 6 × 10 ¹³ cm ⁻² and 40 keV, 1.5 × 10 ¹³ cm ⁻² .

Also, as shown in FIG. 10, as a means for forming the Schottky junction diode 111 (FIG. 10B) to be the thermoelectric conversion element 116, first, the n-type diffusion layer region 205B is defined by a photolithography technique, and by ion implantation, For example, phosphorus is formed at 240 keV and 1.0 × 10 ¹³ cm ⁻² . Next, in the same manner, an n ⁺ contact diffusion layer region 208B is formed on the substrate surface by, for example, implanting P at 5 keV and 5 × 10 ¹⁵ cm ⁻² .

  Next, as shown in FIG. 11, after depositing a polysilicon layer, the support layer 210 is formed by processing the polysilicon layer by photolithography and RIE. Thereafter, a silicon nitride film is formed on the entire surface of the substrate by CVD, and etched back by RIE, thereby forming a side wall 211 at the stepped portion by the support wiring 210. Note that the side wall 211 is formed by a whole surface etch-back process of leaving a side wall.

Next, as shown in FIG. 12, a silicon nitride film is deposited on the entire SOI layer 203 by CVD, and the n ⁺ electrode region 206 of the pn junction diode, the p ⁺ contact region 208, and the Schottky metal electrode region of the Schottky junction diode. 214, a photomask 300 is formed in a region other than the n ⁺ contact diffusion layer region 206B, RIE of the silicon nitride film is performed, and a silicide block film 217 is formed. As a result, the n ⁺ electrode region 206 and the p ⁺ contact diffusion layer region 208 of the pn junction diode, the Schottky metal electrode region 214 of the Schottky junction diode, and the n ⁺ contact diffusion layer region 206B are made conductive by the silicide. prevent.

Further, as shown in FIG. 12, thereafter, the insulating layer is etched with diluted hydrofluoric acid using the support wiring 210, the side wall 211, and the silicide block film 217 as a mask, so that the support wiring 210 and the n ⁺ electrode region 206 of the pn junction diode are used. And the p ⁺ contact diffusion layer region 208, the Schottky metal electrode region 214 of the Schottky junction diode, and the n ⁺ contact diffusion layer region 206B are exposed.

  Further, as shown in FIG. 13, a nickel film 218 for silicide formation is deposited on the entire surface. By performing an appropriate annealing process from this state, the exposed SOI layer 203 reacts with the nickel film 218 to form a nickel silicide layer 219. After the nickel silicide layer 219 is formed, the nickel film 218 in a region where no silicide reaction is performed is removed with a mixed solution of sulfuric acid and hydrogen peroxide.

  Here, the metal material of the Schottky junction is not limited to nickel silicide, and Ni, Co, MoSi, or the like having a relatively high junction barrier Φb can also be used. When the silicide electrode is not used, it may be formed as a dedicated layer after the thermal process of the silicide process. Alternatively, it can be formed by sputtering or the like after opening the contact and before filling tungsten.

  In the embodiment, a Schottky junction using an n-type substrate is employed, but it goes without saying that the same effect can be obtained with a Schottky junction using a p-type substrate.

  Next, as shown in FIG. 14, a silicon nitride film 220 and a first interlayer insulating film 221 made of a silicon oxide film are deposited on the entire surface of the SOI layer 203 by CVD, and planarized by CMP.

  Next, as shown in FIG. 15, contact holes 222 are formed in the first interlayer insulating film 221 by RIE, tungsten is deposited on the entire surface by CVD, and CMP is performed to bury the contact holes, and contact An electrode 222 is formed.

  Next, as shown in FIG. 16, an aluminum alloy is deposited on the entire surface by sputtering, and patterned by photolithography and RIE to form a metal wiring 223 that connects the contact electrodes 222. Thereafter, a silicon oxide film is deposited as the second interlayer insulating film 224, and finally a silicon nitride film is deposited as the passivation film 227. Note that the first interlayer insulating film 221, the second interlayer insulating film 224, and the passivation film 227 also function as an infrared absorber.

  Next, as shown in FIG. 17, an etching hole 229 is formed by RIE, and the silicon substrate 201 is exposed. Thereafter, a diaphragm 228 is formed inside the silicon substrate 201 by anisotropic wet etching for silicon by TMAH (Tetra-Methyl-Ammonium-Hydroxide).

  The infrared imaging device of the embodiment shown in FIG. 17 is created by the above process.

  According to the infrared imaging device of at least one embodiment described above, at least one pn junction diode 110, which is a minority carrier device, is inserted into a thermoelectric converter 116 in a cell in which a Schottky junction diode 111 is connected in series. As a result, the leakage current at the time of OFF can be suppressed.

  In addition, although some embodiment of this invention was described, these embodiment is illustrated as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  The Schottky junction diode 111 (FIG. 10B) described above can be replaced with a Ge-pn junction diode. Ge is a material with a lower band gap than Si and a high temperature dependency. However, like a Schottky junction diode, Ge has a high saturation current value, and when used as an array device, there is a problem of increased leakage current of an off element. Become. Therefore, the problem of the embodiment can be solved by inserting at least one Si-pn junction diode having good off characteristics into a cell in which Ge-pn junction diodes are joined in series as the thermoelectric converter 116.

  Further, the Ge pn junction diode described above can be formed by forming an oxide film on a semiconductor substrate, opening a region where the Ge pn junction diode is to be formed, and performing Ge epi growth on the opening. .

 The Ge pn junction diode described above forms an oxide film on a semiconductor substrate, opens the region where the Ge pn junction diode is to be formed, performs Ge ion implantation in the opening, and anneals to crystallize. It can also form by performing.

DESCRIPTION OF SYMBOLS 100 ... Infrared imaging device 101 ... Horizontal signal line 102 ... Vertical signal line 103 ... Support wiring 104 ... Cavity part 105 ... Substrate 106 ... Infrared detection part 110 ... Pn junction diode area 111 ... Schottky junction diode area 112 ... Metal wiring 115 ... Infrared absorber 116 ... thermoelectric converter 117 ... element selector 118 ... signal readout unit 119 ... infrared detector 120 ... vertical register 121 ... vertical signal line V1
122... Vertical signal line V2
123 ... Amp1
124 ... Amp2
125 ... Storage capacity Cs1
126 ... Storage capacity Cs2
127 ... Reset transistor Rst1
128 ... Reset transistor Rst2
129: Selection transistor S1
130: Selection transistor S2
131: horizontal register 200 ... SOI substrate 201 ... silicon substrate 202 ... buried silicon oxide layer 203 ... SOI layer 204 ... element isolation oxide film 205 ... pn junction diode region 206 ... n ⁺ electrode region 207 ... p ⁺ electrode region 208 ... p ⁺ Contact diffusion layer region 209 ... p ⁺ region 210 ... gate electrode 211 ... side wall 213 ... MOS transistor 217 ... silicide block film 218 ... titanium silicide layer 220 ... silicon nitride film 221 ... first interlayer insulating film 222 ... contact Hole 223 ... Metal wiring 224 ... Second interlayer insulating film 225 ... Visible light blocking layer 226 ... Silicon oxide film 227 ... Silicon nitride film 228 ... Diaphragm 229 ... Etching hole 230 ... Input signal line 231 ... Output signal line 234 ... Support structure 235 ... Infrared absorbing layer 300 ... Photo resist

Claims (2)

An infrared absorption portion that is formed on a semiconductor substrate and absorbs infrared rays to convert it into heat, a plurality of germanium pn junction diodes, and at least one silicon pn junction diode are connected in series, and the heat is An infrared detector including a thermoelectric converter that converts the electrical signal;
A cavity for performing thermal separation between the infrared detector and the substrate;
The input / output from the thermoelectric conversion unit and a support wiring for supporting the infrared detection unit, and an infrared detection element arranged in an array,
An element selection unit for selecting the infrared detection element;
A signal readout unit for applying a voltage to the infrared detection element and operating at a constant current;
An infrared imaging device comprising:   2. The infrared imaging device according to claim 1, wherein the semiconductor substrate is an SOI (Silicon on Insulator) substrate.

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