JP5333900B2 - Printed wiring board manufacturing method, printed wiring board manufacturing apparatus, and printed wiring board - Google Patents

Printed wiring board manufacturing method, printed wiring board manufacturing apparatus, and printed wiring board Download PDF

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JP5333900B2
JP5333900B2 JP2008244832A JP2008244832A JP5333900B2 JP 5333900 B2 JP5333900 B2 JP 5333900B2 JP 2008244832 A JP2008244832 A JP 2008244832A JP 2008244832 A JP2008244832 A JP 2008244832A JP 5333900 B2 JP5333900 B2 JP 5333900B2
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conductor
conductor plate
bump
insulating material
layer substrate
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澤 朝 彦 穴
島 正 幸 長
藤 峰 明 衛
村 正 太 木
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Dai Nippon Printing Co Ltd
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本発明は、多層基板を含むプリント配線基板製造方法、プリント配線基板製造装置およびプリント配線基板に関する。   The present invention relates to a printed wiring board manufacturing method including a multilayer board, a printed wiring board manufacturing apparatus, and a printed wiring board.

導体板（第一導体板）上に複数の略円錐状の導体バンプを形成する工程と、導体バンプ上に未硬化の絶縁材料基板（絶縁材料部材）を配設する工程と、絶縁材料基板が硬化しない温度において導体板及び絶縁材料基板を加圧し、導体バンプを貫通させる工程と、導体板をパターニングして所定の配線パターンを備えた、導体バンプが前記絶縁基板に貫通した基板ユニットを形成する工程と、未硬化の絶縁材料基板を有する基板ユニットを複数枚積層配置して多層板前駆体を形成する工程と、多層板前駆体を加圧下に加熱して前記多層前駆体を硬化させる工程と、を具備するプリント配線基板の製造方法が知られている（特許文献１参照）。
特開２００７−１３２０８号 A step of forming a plurality of substantially conical conductor bumps on the conductor plate (first conductor plate), a step of disposing an uncured insulating material substrate (insulating material member) on the conductor bump, and an insulating material substrate Pressing the conductor plate and the insulating material substrate at a temperature that does not cure to penetrate the conductor bump, and patterning the conductor plate to form a substrate unit having a predetermined wiring pattern and the conductor bump penetrating the insulating substrate A step, a step of forming a multilayer plate precursor by laminating a plurality of substrate units each having an uncured insulating material substrate, a step of curing the multilayer precursor by heating the multilayer plate precursor under pressure, and There is known a method of manufacturing a printed wiring board including the above (see Patent Document 1).
JP2007-13208

しかしながら、このような製造方法では、まだ硬化されていない絶縁材料基板が多数存在している（多層を構成している）状況の下で押圧されるので、基板ユニットを押圧して多層板前駆体を形成する際に絶縁材料基板の一部（特に、導体バンプが配置されていない部分）が加えられる押圧力によって逃げてしまい、水平方向および垂直方向にずれてしまうことがある。この結果、完成したプリント配線基板に、導通不良、短絡などの不良が生じることがある。   However, in such a manufacturing method, since a large number of insulating material substrates that have not yet been cured exist (which constitutes a multilayer), the substrate unit is pressed and the multilayer plate precursor is pressed. When a part of the insulating material substrate is formed, a part of the insulating material substrate (particularly, a part where the conductor bumps are not disposed) may escape due to a pressing force applied, and may shift in the horizontal direction and the vertical direction. As a result, defects such as poor conduction and short circuit may occur in the completed printed wiring board.

本発明は、このような点を考慮してなされたものであり、複数の導体板を積層して押圧する際に、まだ硬化されていない絶縁材料基板の一部（特に、導体バンプが配置されていない部分）が水平方向および垂直方向にずれることを防止することができ、ひいては、正常なプリント配線基板を効率よく製造することができるプリント配線基板製造方法およびプリント配線基板製造装置を提供することと、このようなプリント配線基板製造方法やプリント配線基板製造装置によって製造されたプリント配線基板を提供することを目的とする。   The present invention has been made in consideration of such points, and when a plurality of conductor plates are stacked and pressed, a part of an insulating material substrate that has not yet been cured (particularly, conductor bumps are disposed). A printed wiring board manufacturing method and a printed wiring board manufacturing apparatus capable of efficiently manufacturing a normal printed wiring board can be prevented. And it aims at providing the printed wiring board manufactured by such a printed wiring board manufacturing method and a printed wiring board manufacturing apparatus.

本発明によるプリント配線基板製造方法は、
第一導体板と第二導体板とを有する２層基板を生成する２層基板生成工程と、
一つ以上の前記２層基板と、底面導体板および頂面導体板とを準備して各々を重ね合わせる重畳工程と、を備え、
前記２層基板生成工程が、
前記第一導体板上に導電性材料からなる複数の導体バンプを形成する第一導体バンプ形成工程と、
前記第一導体板上であって前記導体バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第一絶縁材料部材配置工程と、
前記導体バンプ上に前記第二導体板を配置する第一配置工程と、
前記第一導体板と前記第二導体板の間に押圧力を加える第一押圧工程と、
前記第一導体板と前記第二導体板との間に配置された前記絶縁材料部材を硬化させる第一硬化工程と、を有し、
前記重畳工程が、
前記底面導体板および一の２層基板上に導電性材料からなる複数の導体バンプを形成する第二導体バンプ形成工程と、
前記底面導体板および前記一の２層基板上に構造支持用バンプを形成する構造支持用バンプ形成工程と、
前記底面導体板および前記一の２層基板上であって前記導体バンプおよび前記構造支持用バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第二絶縁材料部材配置工程と、
前記一の２層基板を、前記底面導体板上の前記導体バンプおよび前記構造支持用バンプ上に配置するとともに、前記頂面導体板を、前記一の２層基板上の前記導体バンプおよび前記構造支持用バンプ上に配置する第二配置工程と、
前記底面導体板、前記２層基板および前記頂面導体板の各々の間に押圧力を加える第二押圧工程と、
前記底面導体板、前記２層基板および前記頂面導体板の各々の間に配置された前記絶縁材料部材を硬化させる第二硬化工程と、を有している。 A printed wiring board manufacturing method according to the present invention includes:
A two-layer substrate generation step of generating a two-layer substrate having a first conductor plate and a second conductor plate;
A superposition step of preparing one or more of the two-layer substrates, a bottom conductor plate and a top conductor plate and superimposing each of them,
The two-layer substrate generation step includes
A first conductor bump forming step of forming a plurality of conductor bumps made of a conductive material on the first conductor plate;
A first insulating material member placement step of placing an uncured insulating material member on a location other than the location where the conductor bumps are located on the first conductor plate,
A first arrangement step of arranging the second conductor plate on the conductor bump;
A first pressing step of applying a pressing force between the first conductor plate and the second conductor plate;
A first curing step of curing the insulating material member disposed between the first conductor plate and the second conductor plate,
The superimposing step includes
A second conductor bump forming step of forming a plurality of conductor bumps made of a conductive material on the bottom conductor plate and the one two-layer substrate;
A structure supporting bump forming step of forming a structure supporting bump on the bottom conductor plate and the one two-layer substrate;
A second insulating material member arrangement in which an uncured insulating material member is arranged at a location other than the location where the conductor bump and the structure supporting bump are arranged on the bottom surface conductor plate and the one two-layer substrate. Process,
The one two-layer substrate is disposed on the conductor bump and the structure supporting bump on the bottom conductor plate, and the top conductor plate is disposed on the conductor bump and the structure on the two layer substrate. A second arrangement step of arranging on the supporting bump;
A second pressing step of applying a pressing force between each of the bottom conductor plate, the two-layer substrate and the top conductor plate;
A second curing step of curing the insulating material member disposed between the bottom conductor plate, the two-layer substrate, and the top conductor plate.

本発明によるプリント配線基板製造方法は、
第一導体板と第二導体板とを有する２層基板を生成する２層基板生成工程と、
二つ以上の前記２層基板と、底面導体板を準備して各々を重ね合わせる重畳工程と、を備え、
前記２層基板生成工程が、
前記第一導体板上に導電性材料からなる複数の導体バンプを形成する第一導体バンプ形成工程と、
前記第一導体板上であって前記導体バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第一絶縁材料部材配置工程と、
前記導体バンプ上に前記第二導体板を配置する第一配置工程と、
前記第一導体板と前記第二導体板の間に押圧力を加える第一押圧工程と、
前記第一導体板と前記第二導体板との間に配置された前記絶縁材料部材を硬化させる第一硬化工程と、を有し、
前記重畳工程が、
前記底面導体板および一の２層基板上に導電性材料からなる複数の導体バンプを形成する第二導体バンプ形成工程と、
前記底面導体板および前記一の２層基板上に構造支持用バンプを形成する構造支持用バンプ形成工程と、
前記底面導体板および前記一の２層基板上であって前記導体バンプおよび前記構造支持用バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第二絶縁材料部材配置工程と、
前記一の２層基板を、前記底面導体板上の記導体バンプおよび前記構造支持用バンプ上に配置するとともに、他の２層基板を、前記一の２層基板上の前記導体バンプおよび前記構造支持用バンプ上に配置する第二配置工程と、
前記底面導体板および前記２層基板の各々の間に押圧力を加える第二押圧工程と、
前記底面導体板および前記２層基板の各々の間に配置された前記絶縁材料部材を硬化させる第二硬化工程と、を有している。 A printed wiring board manufacturing method according to the present invention includes:
A two-layer substrate generation step of generating a two-layer substrate having a first conductor plate and a second conductor plate;
Two or more two-layer substrates, and a superimposing step of preparing each bottom conductor plate and superimposing each other,
The two-layer substrate generation step includes
A first conductor bump forming step of forming a plurality of conductor bumps made of a conductive material on the first conductor plate;
A first insulating material member placement step of placing an uncured insulating material member on a location other than the location where the conductor bumps are located on the first conductor plate,
A first arrangement step of arranging the second conductor plate on the conductor bump;
A first pressing step of applying a pressing force between the first conductor plate and the second conductor plate;
A first curing step of curing the insulating material member disposed between the first conductor plate and the second conductor plate,
The superimposing step includes
A second conductor bump forming step of forming a plurality of conductor bumps made of a conductive material on the bottom conductor plate and the one two-layer substrate;
A structure supporting bump forming step of forming a structure supporting bump on the bottom conductor plate and the one two-layer substrate;
A second insulating material member arrangement in which an uncured insulating material member is arranged at a location other than the location where the conductor bump and the structure supporting bump are arranged on the bottom surface conductor plate and the one two-layer substrate. Process,
The one two-layer substrate is disposed on the conductive bump and the structure supporting bump on the bottom conductor plate, and the other two-layer substrate is disposed on the two-layer substrate with the conductor bump and the structure. A second arrangement step of arranging on the supporting bump;
A second pressing step of applying a pressing force between each of the bottom conductor plate and the two-layer substrate;
A second curing step of curing the insulating material member disposed between the bottom conductor plate and the two-layer substrate.

本発明によるプリント配線基板製造方法は、
第一導体板と第二導体板とを有する２層基板を生成する２層基板生成工程と、
二つ以上の前記２層基板と、頂面導体板とを準備して各々を重ね合わせる重畳工程と、を備え、
前記２層基板生成工程が、
前記第一導体板上に導電性材料からなる複数の導体バンプを形成する第一導体バンプ形成工程と、
前記第一導体板上であって前記導体バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第一絶縁材料部材配置工程と、
前記導体バンプ上に前記第二導体板を配置する第一配置工程と、
前記第一導体板と前記第二導体板の間に押圧力を加える第一押圧工程と、
前記第一導体板と前記第二導体板との間に配置された前記絶縁材料部材を硬化させる第一硬化工程と、を有し、
前記重畳工程が、
一の２層基板および他の２層基板上に導電性材料からなる複数の導体バンプを形成する第二導体バンプ形成工程と、
前記一の２層基板および前記他の２層基板上に構造支持用バンプを形成する構造支持用バンプ形成工程と、
前記一の２層基板および前記他の２層基板上であって前記導体バンプおよび前記構造支持用バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第二絶縁材料部材配置工程と、
前記他の２層基板を、前記一の２層基板上の前記導体バンプおよび前記構造支持用バンプ上に配置するとともに、前記頂面導体板を、前記他の２層基板上の前記導体バンプおよび前記構造支持用バンプ上に配置する前記第二配置工程と、
前記２層基板および前記頂面導体板の各々の間に押圧力を加える第二押圧工程と、
前記２層基板および前記頂面導体板の各々の間に配置された前記絶縁材料部材を硬化させる第二硬化工程と、を有している。 A printed wiring board manufacturing method according to the present invention includes:
A two-layer substrate generation step of generating a two-layer substrate having a first conductor plate and a second conductor plate;
Providing two or more of the two-layer substrates and a top conductor plate and superimposing each other,
The two-layer substrate generation step includes
A first conductor bump forming step of forming a plurality of conductor bumps made of a conductive material on the first conductor plate;
A first insulating material member placement step of placing an uncured insulating material member on a location other than the location where the conductor bumps are located on the first conductor plate,
A first arrangement step of arranging the second conductor plate on the conductor bump;
A first pressing step of applying a pressing force between the first conductor plate and the second conductor plate;
A first curing step of curing the insulating material member disposed between the first conductor plate and the second conductor plate,
The superimposing step includes
A second conductor bump forming step of forming a plurality of conductor bumps made of a conductive material on one two-layer substrate and another two-layer substrate;
A structure supporting bump forming step of forming a structure supporting bump on the one two-layer substrate and the other two-layer substrate;
A second insulating material in which an uncured insulating material member is disposed on the one two-layer substrate and the other two-layer substrate other than the portion where the conductor bump and the structure supporting bump are disposed. A member placement step;
The other two-layer substrate is disposed on the conductor bump and the structure supporting bump on the one two-layer substrate, and the top conductor plate is disposed on the conductor bump on the other two-layer substrate. The second arrangement step of arranging on the structure supporting bump;
A second pressing step of applying a pressing force between each of the two-layer substrate and the top conductor plate;
A second curing step of curing the insulating material member disposed between the two-layer substrate and the top conductor plate.

本発明によるプリント配線基板製造方法において、
前記構造支持用バンプは絶縁性材料からなることが好ましい。 In the printed wiring board manufacturing method according to the present invention,
The structure supporting bump is preferably made of an insulating material.

本発明によるプリント配線基板製造方法において、
前記構造支持用バンプは前記導体バンプを構成する導電性材料からなり、
前記第二導体バンプ形成工程の間に、前記構造支持用バンプ形成工程が行われることが好ましい。 In the printed wiring board manufacturing method according to the present invention,
The structure support bump is made of a conductive material constituting the conductor bump,
It is preferable that the structure supporting bump forming step is performed during the second conductor bump forming step.

本発明によるプリント配線基板製造装置は、
第一導体板上に導電性材料からなる複数の導体バンプを形成する第一導体バンプ形成部と、
前記第一導体板上であって前記導体バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第一絶縁材料部材配置部と、
前記導体バンプ上に第二導体板を配置する第一配置部と、
前記第一導体板と前記第二導体板の間に押圧力を加える第一押圧部と、
前記第一導体板と前記第二導体板との間に配置された前記絶縁材料部材を硬化させて、２層基板を生成する第一硬化部と、
底面導体板または一の２層基板上に導電性材料からなる複数の導体バンプを形成する第二導体バンプ形成部と、
前記底面導体板または前記一の２層基板上に構造支持用バンプを形成する構造支持用バンプ形成部と、
前記底面導体板または前記一の２層基板上であって前記導体バンプおよび前記構造支持用バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第二絶縁材料部材配置部と、
他の２層基板または頂面導体板を、前記導体バンプおよび前記構造支持用バンプ上に配置する第二配置部と、
前記底面導体板、前記２層基板および前記頂面導体板のうち用いられている被利用部材の間に押圧力を加える第二押圧部と、
前記被利用部材の間に配置された前記絶縁材料部材を硬化させる第二硬化部と、
を備えている。 The printed wiring board manufacturing apparatus according to the present invention is
A first conductor bump forming portion for forming a plurality of conductor bumps made of a conductive material on the first conductor plate;
A first insulating material member disposition portion that disposes an uncured insulating material member on a portion other than the portion where the conductor bumps are disposed on the first conductor plate,
A first placement portion for placing a second conductor plate on the conductor bump;
A first pressing portion that applies a pressing force between the first conductor plate and the second conductor plate;
A first curing portion that cures the insulating material member disposed between the first conductor plate and the second conductor plate to generate a two-layer substrate;
A second conductor bump forming portion for forming a plurality of conductor bumps made of a conductive material on the bottom conductor plate or one two-layer substrate;
A structure supporting bump forming portion for forming a structure supporting bump on the bottom conductor plate or the one two-layer substrate;
A second insulating material member arrangement in which an uncured insulating material member is arranged at a location other than the location where the conductor bump and the structure supporting bump are arranged on the bottom conductor plate or the one two-layer substrate. And
A second arrangement part for arranging another two-layer substrate or a top conductor plate on the conductor bump and the structure supporting bump;
A second pressing portion that applies a pressing force between the member to be used used among the bottom conductor plate, the two-layer substrate, and the top conductor plate;
A second curing portion that cures the insulating material member disposed between the members to be used;
It has.

本発明によるプリント配線基板製造装置において、
前記第一導体バンプ形成部は、前記第二導体バンプ形成部としても機能することが好ましい。 In the printed wiring board manufacturing apparatus according to the present invention,
The first conductor bump forming portion preferably functions also as the second conductor bump forming portion.

本発明によるプリント配線基板製造装置において、
前記第一絶縁材料部材配置部は、前記第二絶縁材料部材配置部としても機能することが好ましい。 In the printed wiring board manufacturing apparatus according to the present invention,
It is preferable that the first insulating material member arrangement portion also functions as the second insulating material member arrangement portion.

本発明によるプリント配線基板製造装置において、
前記第一配置部は、前記第二配置部としても機能することが好ましい。 In the printed wiring board manufacturing apparatus according to the present invention,
It is preferable that the first placement portion also functions as the second placement portion.

本発明によるプリント配線基板製造装置において、
前記第一押圧部は、前記第二押圧部としても機能することが好ましい。 In the printed wiring board manufacturing apparatus according to the present invention,
It is preferable that the first pressing portion also functions as the second pressing portion.

本発明によるプリント配線基板製造装置において、
前記第一硬化部は、前記第二硬化部としても機能することが好ましい。 In the printed wiring board manufacturing apparatus according to the present invention,
The first hardened part preferably functions as the second hardened part.

本発明によるプリント配線基板製造装置において、
前記構造支持用バンプ形成部から供給される前記構造支持用バンプは、絶縁性材料からなり、
前記第二導体バンプ形成部は、前記構造支持用バンプ形成部と別体を構成することが好ましい。 In the printed wiring board manufacturing apparatus according to the present invention,
The structure support bump supplied from the structure support bump forming portion is made of an insulating material,
The second conductor bump forming portion preferably constitutes a separate body from the structure supporting bump forming portion.

本発明によるプリント配線基板製造装置において、
前記構造支持用バンプ形成部から供給される前記構造支持用バンプは、前記導体バンプを構成する導電性材料からなり、
前記第二導体バンプ形成部は前記構造支持用バンプ形成部としても機能することが好ましい。 In the printed wiring board manufacturing apparatus according to the present invention,
The structure support bump supplied from the structure support bump forming portion is made of a conductive material constituting the conductor bump,
It is preferable that the second conductor bump forming portion also functions as the structure supporting bump forming portion.

本発明によるプリント配線基板は、
第一導体板と、
前記第一導体板上に設けられた導電性材料からなる複数の導体バンプと、
前記第一導体板上であって前記導体バンプが配置されている箇所以外の箇所に配置された絶縁材料部材と、
前記導体バンプおよび前記絶縁材料部材上に配置された第二導体板と、
前記第二導体板上に設けられた導電性材料からなる複数の導体バンプと、
前記第二導体板上に設けられた構造支持用バンプと、
前記第一導体板上であって前記導体バンプおよび前記構造支持用バンプが配置されている箇所以外の箇所に配置された絶縁材料部材と、
を備えている。 The printed wiring board according to the present invention is
A first conductor plate;
A plurality of conductive bumps made of a conductive material provided on the first conductive plate;
An insulating material member disposed on a location other than the location where the conductor bumps are disposed on the first conductor plate;
A second conductor plate disposed on the conductor bump and the insulating material member;
A plurality of conductive bumps made of a conductive material provided on the second conductive plate;
A structural support bump provided on the second conductor plate;
An insulating material member disposed on a location other than the location where the conductor bump and the structure support bump are disposed on the first conductor plate;
It has.

本発明によるプリント配線基板において、
前記絶縁材料部材上に、頂面導体板が設けられたことが好ましい。 In the printed wiring board according to the present invention,
A top conductor plate is preferably provided on the insulating material member.

本発明によるプリント配線基板において、
前記絶縁材料部材上に、第一導体板と、該第一導体板上に設けられた導電性材料からなる複数の導体バンプと、該第一導体板上であって該導体バンプが配置されている箇所以外の箇所に配置された絶縁材料部材と、該導体バンプおよび該絶縁材料部材上に配置された第二導体板と、を有する２層基板が設けられたことが好ましい。 In the printed wiring board according to the present invention,
On the insulating material member, a first conductor plate, a plurality of conductor bumps made of a conductive material provided on the first conductor plate, and the conductor bumps are disposed on the first conductor plate. It is preferable that a two-layer substrate having an insulating material member disposed at a place other than the place where the conductive material is disposed and the conductive bump and the second conductive plate disposed on the insulating material member is provided.

本発明によれば、未硬化の絶縁材料部材内に構造支持用バンプが形成されている。このため、複数の導体板を積層して押圧する際に、まだ硬化されていない絶縁材料基板の一部（特に、導体バンプが配置されていない部分）が水平方向および垂直方向にずれることを防止することができる。この結果、正常なプリント配線基板を効率よく製造することができるプリント配線基板製造方法およびプリント配線基板製造装置を得ることができ、また、このようなプリント配線基板製造方法やプリント配線基板製造装置によって製造されたプリント配線基板も得ることができる。   According to the present invention, the structure supporting bumps are formed in the uncured insulating material member. For this reason, when a plurality of conductor plates are stacked and pressed, a portion of the insulating material substrate that has not yet been cured (particularly, the portion where the conductor bumps are not disposed) is prevented from shifting in the horizontal and vertical directions. can do. As a result, a printed wiring board manufacturing method and a printed wiring board manufacturing apparatus that can efficiently manufacture a normal printed wiring board can be obtained, and the printed wiring board manufacturing method and the printed wiring board manufacturing apparatus can be used. A manufactured printed wiring board can also be obtained.

発明を実施するための形態BEST MODE FOR CARRYING OUT THE INVENTION

第１の実施の形態
以下、本発明に係るプリント配線基板製造方法、プリント配線基板製造装置およびプリント配線基板の第１の実施の形態について、図面を参照して説明する。ここで、図１（ａ）−（ｆ）乃至図４（ａ）（ｂ）は本発明の第１の実施の形態を示す図である。なお、本実施の形態では、底面導体板６１ｌ、２層基板６０ｂおよび頂面導体板６１ｃを被利用部材として用いた態様によって説明する。 First Embodiment Hereinafter, a printed wiring board manufacturing method, a printed wiring board manufacturing apparatus, and a printed wiring board according to a first embodiment of the present invention will be described with reference to the drawings. Here, FIGS. 1A to 1F to FIGS. 4A and 4B are views showing a first embodiment of the present invention. In the present embodiment, a description will be given based on an aspect in which the bottom conductor plate 61l, the two-layer substrate 60b, and the top conductor plate 61c are used as members to be used.

図１（ａ）（ｂ）に示すように、プリント配線基板製造装置は、第一導体板６１ａを保持する保持部１と、第一導体板６１ａ上に導電性材料からなる複数の導体バンプ６２を形成するスキージ機構（第一導体バンプ形成部）１０（図２（ａ）（ｂ）参照）と、導体バンプ６２上に未硬化の絶縁材料基板（絶縁材料部材）６３を配置して押圧することによって、第一導体板６１ａ上に絶縁材料基板６３を位置づける絶縁材料基板押圧部（第一絶縁材料部材配置部）２０（図２（ｃ）（ｄ）参照）と、導体バンプ６２上に第二導体板６１ｂを配置して、第一導体板６１ａと第二導体板６１ｂの間に押圧力を加える配置押圧部３０（図２（ｅ）参照）と、を備えている。   As shown in FIGS. 1A and 1B, the printed wiring board manufacturing apparatus includes a holding portion 1 that holds a first conductor plate 61a and a plurality of conductor bumps 62 made of a conductive material on the first conductor plate 61a. A squeegee mechanism (first conductor bump forming portion) 10 (see FIGS. 2 (a) and 2 (b)) and an uncured insulating material substrate (insulating material member) 63 are placed on the conductor bump 62 and pressed. Thus, the insulating material substrate pressing portion (first insulating material member arrangement portion) 20 (see FIGS. 2C and 2D) for positioning the insulating material substrate 63 on the first conductor plate 61a and the conductor bump 62 on the first conductor plate 62a. The arrangement | positioning press part 30 (refer FIG.2 (e)) which arrange | positions the 2 conductor board 61b and applies a pressing force between the 1st conductor board 61a and the 2nd conductor board 61b is provided.

このうち、スキージ機構１０は、図１（ａ）に示すように、所定のパターンからなる貫通穴１５ａが設けられたスクリーン版１５と、スクリーン版１５上で走査し、このスクリーン版１５に載置された導電性ペースト６（図２（ａ）参照）を貫通穴１５ａを介して導体板６１ａ，６１ｂに転移させるスキージ１１と、を有している。   Among these, the squeegee mechanism 10 scans on the screen plate 15 provided with a through hole 15a having a predetermined pattern, as shown in FIG. And a squeegee 11 for transferring the conductive paste 6 (see FIG. 2A) to the conductor plates 61a and 61b through the through holes 15a.

なお、本実施の形態では、図１（ｂ）および図２（ｅ）に示すように、第一導体板６１ａと第二導体板６１ｂの間に押圧力を加える第一押圧部が、導体バンプ６２上に第二導体板６１ｂを配置する第一配置部としても機能している（配置押圧部３０が第一押圧部と第一配置部を兼ねている）態様を用いて説明するが、これに限られることなく、第一押圧部と第一配置部は別体を構成してもよい。   In the present embodiment, as shown in FIGS. 1B and 2E, the first pressing portion for applying a pressing force between the first conductor plate 61a and the second conductor plate 61b is a conductor bump. Although it demonstrates using the aspect (The arrangement | positioning press part 30 serves as a 1st press part and a 1st arrangement | positioning part) which is functioning also as a 1st arrangement | positioning part which arrange | positions the 2nd conductor board 61b on 62, this Without being limited thereto, the first pressing portion and the first arrangement portion may constitute separate bodies.

また、本実施の形態では、配置押圧部３０内にヒータ（第一硬化部）４０が設けられており、当該ヒータ４０によって付与される熱によって、第一導体板６１ａと第二導体板６１ｂとの間に配置された絶縁材料基板６３が硬化される。なお、このように絶縁材料基板６３を硬化させているときに、第一導体板６１ａ、絶縁材料基板６３および第二導体板６１ｂの周りを真空状態とする真空装置（図示せず）が設けられている。   Moreover, in this Embodiment, the heater (1st hardening part) 40 is provided in the arrangement | positioning press part 30, and with the heat | fever provided by the said heater 40, the 1st conductor board 61a and the 2nd conductor board 61b The insulating material substrate 63 disposed between the two is cured. In addition, when the insulating material substrate 63 is cured in this way, a vacuum device (not shown) is provided that evacuates the first conductor plate 61a, the insulating material substrate 63, and the second conductor plate 61b. ing.

また、プリント配線基板製造装置は、２層基板６０ｂの第二導体板６１ｂ上に構造支持用バンプ６７を形成するディスペンサ（構造支持用バンプ形成部）５０も備えている。なお、ディスペンサ５０から供給される構造支持用バンプ６７は、絶縁性材料からなっており、ディスペンサ５０とスキージ機構１０とは別体を構成している。   The printed wiring board manufacturing apparatus also includes a dispenser (structure support bump forming section) 50 that forms structure support bumps 67 on the second conductor plate 61b of the two-layer board 60b. The structure support bumps 67 supplied from the dispenser 50 are made of an insulating material, and the dispenser 50 and the squeegee mechanism 10 are separate.

また、本実施の形態では、図１（ｃ）に示すように、第一導体板６１ａ上に導電性材料からなる複数の導体バンプ６２を形成するスキージ機構（第一導体バンプ形成部）１０が、２層基板６０ｂの第二導体板６１ｂ上に導電性材料からなる複数の導体バンプ６２を形成する第二導体バンプ形成部としても機能する。なお、これに限られることなく、第一導体バンプ形成部と第二導体バンプ形成部は別体を構成してもよい。   Further, in the present embodiment, as shown in FIG. 1C, a squeegee mechanism (first conductor bump forming portion) 10 for forming a plurality of conductor bumps 62 made of a conductive material on the first conductor plate 61a is provided. It also functions as a second conductor bump forming portion for forming a plurality of conductor bumps 62 made of a conductive material on the second conductor plate 61b of the two-layer substrate 60b. In addition, it is not restricted to this, A 1st conductor bump formation part and a 2nd conductor bump formation part may comprise a different body.

また、本実施の形態では、図３（ｄ）（ｅ）に示すように、導体バンプ６２上に未硬化の絶縁材料基板６３を配置して押圧することによって、第一導体板６１ａ上に絶縁材料基板６３を位置づける絶縁材料基板押圧部（第一絶縁材料部材配置部）２０が、２層基板６０ｂの第二導体板６１ｂ上に未硬化の絶縁材料基板（絶縁材料部材）６３を配置して押圧することによって、第一導体板６１ａ上に絶縁材料基板６３を位置づける第二絶縁材料部材配置部として機能する。なお、これに限られることなく、第一絶縁材料部材配置部と第二絶縁材料部材配置部は別体を構成してもよい。   In this embodiment, as shown in FIGS. 3D and 3E, an uncured insulating material substrate 63 is placed on the conductor bump 62 and pressed to insulate the first conductor plate 61a. An insulating material substrate pressing portion (first insulating material member disposing portion) 20 for positioning the material substrate 63 disposes an uncured insulating material substrate (insulating material member) 63 on the second conductor plate 61b of the two-layer substrate 60b. By pressing, it functions as a second insulating material member placement portion for positioning the insulating material substrate 63 on the first conductor plate 61a. In addition, it is not restricted to this, A 1st insulating material member arrangement | positioning part and a 2nd insulating material member arrangement | positioning part may comprise a different body.

また、本実施の形態では、図１（ｅ）および図４（ａ）に示すように、導体バンプ６２上に第二導体板６１ｂを配置して、第一導体板６１ａと第二導体板６１ｂの間に押圧力を加える配置押圧部（第一配置部および第一押圧部）３０が、２層基板６０ｂ上に設けられた導体バンプ６２および構造支持用バンプ６７上に、別の２層基板６０ｂを配置する第二配置部として機能するとともに、底面導体板６１ｌおよび互いに重ね合わされた３つの２層基板６０ｂの各々の間に押圧力を加える第二押圧部としても機能する。なお、これに限られることなく、第一配置部と第二配置部は別体を構成してもよく、また、第一押圧部と第二押圧部は別体を構成してもよい。   In the present embodiment, as shown in FIGS. 1E and 4A, the second conductor plate 61b is disposed on the conductor bump 62, and the first conductor plate 61a and the second conductor plate 61b. An arrangement pressing portion (first arrangement portion and first pressing portion) 30 for applying a pressing force between the conductor bump 62 and the structure supporting bump 67 provided on the two-layer substrate 60b is another two-layer substrate. In addition to functioning as a second disposing portion for disposing 60b, it also functions as a second pressing portion for applying a pressing force between the bottom conductor plate 61l and each of the three two-layer substrates 60b superimposed on each other. In addition, it is not restricted to this, A 1st arrangement | positioning part and a 2nd arrangement | positioning part may comprise a separate body, and a 1st press part and a 2nd press part may comprise a separate body.

ところで、本実施の形態では、配置押圧部３０が、最上位に配置された頂面導体板６１ｃに押圧力を加えることによって、各２層基板６０ｂの間と、頂面導体板６１ｃと２層基板６０ｂの間と、底面導体板６１ｌと２層基板６０ｂの間に、押圧力が加えられるとともに、配置押圧部３０内のヒータ４０によって熱が付与されて絶縁材料基板６３が硬化される。また、このように絶縁材料基板６３を硬化させているときには、上述した真空装置（図示せず）によって、頂面導体板６１ｃ、２層基板６０ｂ、底面導体板６１ｌおよび絶縁材料基板６３の周りが真空状態とされるよう構成されている。   By the way, in this Embodiment, the arrangement | positioning press part 30 applies a pressing force to the top-surface conductor board 61c arrange | positioned at the top, between each 2 layer board | substrate 60b, and the top-surface conductor board 61c and 2 layers. A pressing force is applied between the substrates 60b and between the bottom conductor plate 61l and the two-layer substrate 60b, and heat is applied by the heater 40 in the arrangement pressing unit 30 to cure the insulating material substrate 63. Further, when the insulating material substrate 63 is cured in this way, the surroundings of the top conductor plate 61c, the two-layer substrate 60b, the bottom conductor plate 61l, and the insulating material substrate 63 are removed by the above-described vacuum apparatus (not shown). It is configured to be in a vacuum state.

なお、第一導体板６１ａ、第二導体板６１ｂ、頂面導体板６１ｃおよび底面導体板６１ｌの各々は、同一の導体板からなっていてもよいし、各々別の導体板からなっていてもよい。   Each of the first conductor plate 61a, the second conductor plate 61b, the top conductor plate 61c, and the bottom conductor plate 61l may be made of the same conductor plate, or may be made of different conductor plates. Good.

ところで、添付された各図面では、２層基板６０ｂになる前の基板を６０ａで示し、２層基板６０ｂ上に導体バンプ６２と、構造支持用バンプ６７と、絶縁材料基板６３が配置された基板を６０ｃで示している。   By the way, in each attached drawing, the board | substrate before becoming the two-layer board | substrate 60b is shown by 60a, The board | substrate with which the conductor bump 62, the bump 67 for structure support, and the insulating material board | substrate 63 are arrange | positioned on the two-layer board | substrate 60b. Is indicated by 60c.

次に、このような構成からなる本実施の形態の作用について述べる。   Next, the operation of the present embodiment having such a configuration will be described.

まず、スキージ機構１０のスキージ１１によって、スクリーン版１５に載置された導電性ペースト６が、貫通穴１５ａを介し第一導体板６１ａに転移され、保持部１によって保持された基板６０の第一導体板６１ａ上に導電性材料からなる複数の導体バンプ６２が形成される（第一導体バンプ形成工程）（図１（ａ）および図２（ａ）（ｂ）参照）。   First, the conductive paste 6 placed on the screen plate 15 is transferred to the first conductor plate 61a through the through hole 15a by the squeegee 11 of the squeegee mechanism 10, and the first of the substrate 60 held by the holding unit 1 is transferred. A plurality of conductor bumps 62 made of a conductive material are formed on the conductor plate 61a (first conductor bump forming step) (see FIGS. 1A, 2A, and 2B).

次に、絶縁材料基板押圧部２０によって、導体バンプ６２上に未硬化の絶縁材料基板６３が配置されて押圧される（第一絶縁材料部材配置工程）（図２（ｃ）（ｄ）参照）。このことによって、第一導体板６１ａ上に絶縁材料基板６３が位置づけられ、第一導体板６１ａ上であって導体バンプ６２が配置されている箇所以外の箇所に、未硬化の絶縁材料基板６３が配置されることとなる。   Next, the uncured insulating material substrate 63 is disposed and pressed on the conductor bumps 62 by the insulating material substrate pressing portion 20 (first insulating material member disposing step) (see FIGS. 2C and 2D). . As a result, the insulating material substrate 63 is positioned on the first conductor plate 61a, and the uncured insulating material substrate 63 is located on the first conductor plate 61a other than the portion where the conductor bumps 62 are disposed. Will be placed.

次に、配置押圧部３０によって、導体バンプ６２上に第二導体板６１ｂが配置され（第一配置工程）、その後、この第二導体板６１ｂが押圧されて第一導体板６１ａと第二導体板６１ｂの間に押圧力が加えられつつ（第一押圧工程）、熱が加えられて絶縁材料基板６３が硬化される（第一硬化工程）（図１（ｂ）および図２（ｅ）（ｆ）参照）。このとき、第一導体板６１ａ、絶縁材料基板６３および第二導体板６１ｂの周りは真空状態となっている。   Next, the placement conductor 30b places the second conductor plate 61b on the conductor bump 62 (first placement step), and then the second conductor plate 61b is pushed to form the first conductor plate 61a and the second conductor. While pressing force is applied between the plates 61b (first pressing step), heat is applied to cure the insulating material substrate 63 (first curing step) (FIGS. 1B and 2E). f)). At this time, the first conductor plate 61a, the insulating material substrate 63, and the second conductor plate 61b are in a vacuum state.

次に、第一導体板６１ａおよび第二導体板６１ｂのうち、ランド領域（所定の領域）がマスクされる。その後、エッチングなどによって、第一導体板６１ａおよび第二導体板６１ｂのうちランド領域以外が除去されて、回路が形成される（回路形成工程）。   Next, the land area (predetermined area) of the first conductor plate 61a and the second conductor plate 61b is masked. Thereafter, the first conductor plate 61a and the second conductor plate 61b other than the land region are removed by etching or the like to form a circuit (circuit formation step).

このようにして、第一導体板６１ａと、第一導体板６１ａ上に設けられた導電性材料からなる複数の導体バンプ６２と、第一導体板６１ａ上であって導体バンプ６２が配置されている箇所以外の箇所に配置された絶縁材料基板６３と、導体バンプ６２および絶縁材料基板６３上に配置された第二導体板６１ｂと、を有する２層基板６０ｂが生成される。なお、上述した、第一導体バンプ形成工程と、第一絶縁材料部材配置工程と、第一配置工程と、第一押圧工程と、第一硬化工程とから、２層基板生成工程が構成されている（第一押圧工程と第一硬化工程は同時に行われている）。   In this way, the first conductor plate 61a, the plurality of conductor bumps 62 made of a conductive material provided on the first conductor plate 61a, and the conductor bumps 62 on the first conductor plate 61a are arranged. A two-layer substrate 60b having an insulating material substrate 63 disposed at a place other than the place where the second conductive plate 61b is disposed on the conductive bump 62 and the insulating material substrate 63 is generated. In addition, the two-layer board | substrate production | generation process is comprised from the 1st conductor bump formation process mentioned above, the 1st insulating material member arrangement | positioning process, the 1st arrangement | positioning process, the 1st press process, and the 1st hardening process. (The first pressing step and the first curing step are performed simultaneously).

次に、スキージ機構１０のスキージ１１によって、スクリーン版１５に載置された導電性ペースト６が、貫通穴１５ａを介し２層基板６０ｂの第二導体板６１ｂに転移され、２層基板６０ｂの第二導体板６１ｂ上に導電性材料からなる複数の導体バンプ６２が形成される（第二導体バンプ形成工程）（図１（ｃ）および図３（ａ）（ｂ）参照）。   Next, by the squeegee 11 of the squeegee mechanism 10, the conductive paste 6 placed on the screen plate 15 is transferred to the second conductor plate 61b of the two-layer substrate 60b through the through hole 15a, and the second layer substrate 60b. A plurality of conductor bumps 62 made of a conductive material are formed on the two conductor plate 61b (second conductor bump forming step) (see FIGS. 1C and 3A and 3B).

次に、ディスペンサ５０によって、２層基板６０ｂの第二導体板６１ｂ上に絶縁材料からなる構造支持用バンプ６７が形成される（構造支持用バンプ形成工程）（図１（ｄ）および図３（ｃ）参照）。   Next, the structure support bump 67 made of an insulating material is formed on the second conductor plate 61b of the two-layer substrate 60b by the dispenser 50 (structure support bump forming step) (FIG. 1 (d) and FIG. c)).

次に、絶縁材料基板押圧部２０によって、２層基板６０ｂの第二導体板６１ｂ上に未硬化の絶縁材料基板６３が配置されて押圧されることによって、２層基板６０ｂの第二導体板６１ｂ上に絶縁材料基板６３が位置づけられる（第二絶縁材料部材配置工程）（図３（ｄ）（ｅ）参照）。なお、このように、２層基板６０ｂの第二導体板６１ｂ上に絶縁材料基板６３が位置づけられることによって、２層基板６０ｂの第二導体板６１ｂ上であって導体バンプ６２および構造支持用バンプ６７が配置されている箇所以外の箇所に、未硬化の絶縁材料基板６３が配置されることとなる。   Next, the uncured insulating material substrate 63 is disposed and pressed on the second conductor plate 61b of the two-layer substrate 60b by the insulating material substrate pressing portion 20, whereby the second conductor plate 61b of the two-layer substrate 60b. The insulating material substrate 63 is positioned above (second insulating material member arranging step) (see FIGS. 3D and 3E). As described above, the insulating material substrate 63 is positioned on the second conductor plate 61b of the two-layer substrate 60b, so that the conductor bumps 62 and the structure support bumps are formed on the second conductor plate 61b of the two-layer substrate 60b. The uncured insulating material substrate 63 is disposed at a place other than the place where 67 is disposed.

次に、配置押圧部３０によって、最下位に、導体バンプ６２、構造支持用バンプ６７および絶縁材料基板６３が設けられた底面導体板６１ｌが配置され、その上に二つ以上（本実施の形態では三つ）の２層基板６０ｂの各々が重ね合わされ（第二配置工程）、最上位に頂面導体板６１ｃが配置される。その後、配置押圧部３０によって、頂面導体板６１ｃが押圧され、各２層基板６０ｂの間に押圧力が加えられつつ（第二押圧工程）、熱が加えられて絶縁材料基板６３が硬化される（第二硬化工程）（図１（ｄ）および図４（ａ）（ｂ）参照）。なお、底面導体板６１ｌ上に、導体バンプ６２、構造支持用バンプ６７および絶縁材料基板６３を設ける方法は、上述した第二導体バンプ形成工程、構造支持用バンプ形成工程および第二絶縁材料部材配置工程と同様の方法で行われる。   Next, a bottom conductor plate 61l provided with a conductor bump 62, a structure support bump 67, and an insulating material substrate 63 is arranged at the lowest position by the arrangement pressing part 30, and two or more (this embodiment) Then, each of the three two-layer substrates 60b is overlaid (second arrangement step), and the top conductor plate 61c is arranged at the uppermost position. Thereafter, the top surface conductor plate 61c is pressed by the placement pressing portion 30 and heat is applied while the pressing force is applied between the two-layer substrates 60b (second pressing step), and the insulating material substrate 63 is cured. (Second curing step) (see FIG. 1D and FIGS. 4A and 4B). In addition, the method of providing the conductor bump 62, the structure support bump 67, and the insulating material substrate 63 on the bottom surface conductor plate 61l includes the above-described second conductor bump forming step, structure supporting bump forming step, and second insulating material member arrangement. It is performed by the same method as the process.

ここで、本実施の形態によれば、未硬化の絶縁材料基板６３内に構造支持用バンプ６７が配置されているので、この構造支持用バンプ６７によって、底面導体板６１ｌと２層基板６０ｂの第一導体板６１ａとの間と、２層基板６０ｂの第二導体板６１ｂと別の２層基板６０ｂの第一導体板６１ａとの間と、２層基板６０ｂの第二導体板６１ｂと頂面導体板６１ｃとの間を、支持することができる（図４（ａ）参照）。   Here, according to the present embodiment, the structure supporting bumps 67 are arranged in the uncured insulating material substrate 63, so that the bottom supporting plate 61l and the two-layer substrate 60b are formed by the structure supporting bumps 67. Between the first conductor plate 61a, between the second conductor plate 61b of the two-layer substrate 60b and the first conductor plate 61a of another two-layer substrate 60b, and with the second conductor plate 61b of the two-layer substrate 60b. The space between the surface conductor plate 61c can be supported (see FIG. 4A).

このため、積層された複数の導体板を押圧する際（第二押圧工程の際）に、まだ硬化されていない絶縁材料基板６３の一部（特に、導体バンプ６２が配置されていない部分）が加えられる押圧力によって逃げてしまい、水平方向および垂直方向にずれることを防止することができる。この結果、製造されたプリント配線基板６０（図１（ｆ）参照）は、導通不良や短絡などを起こすことのない正常なものとなっている。従って、本実施の形態によれば正常なプリント配線基板６０を効率よく製造することができる。   For this reason, when pressing a plurality of laminated conductor plates (in the second pressing step), a part of the insulating material substrate 63 that has not been cured yet (particularly, a portion where the conductor bumps 62 are not disposed) It is possible to prevent escape due to the applied pressing force and displacement in the horizontal and vertical directions. As a result, the manufactured printed wiring board 60 (see FIG. 1F) is normal without causing a conduction failure or a short circuit. Therefore, according to the present embodiment, a normal printed wiring board 60 can be efficiently manufactured.

ところで、正常なプリント配線基板６０を製造するために、２層基板６０ｂの間に位置する未硬化の絶縁材料基板６３を一層だけにする方法も考えられる。具体的には、例えば、８層の多層基板（８個の導体板を有する多層基板）を製造する場合を考えると、まず、２層基板６０ｂを製造する。次に、２層基板６０ｂの間に、導体バンプ６２と絶縁材料基板６３を配置し、その後、絶縁材料基板６３を真空状態下で加熱して硬化させ、４層基板を製造する。次に、４層基板の間に、導体バンプ６２と絶縁材料基板６３を配置し、その後、絶縁材料基板６３を真空状態下で加熱して硬化させ、８層基板を製造する。   By the way, in order to manufacture a normal printed wiring board 60, a method in which only one uncured insulating material substrate 63 is positioned between the two-layer substrates 60b is also conceivable. Specifically, for example, considering the case of manufacturing an eight-layer multilayer substrate (a multilayer substrate having eight conductor plates), the two-layer substrate 60b is first manufactured. Next, the conductor bumps 62 and the insulating material substrate 63 are disposed between the two-layer substrate 60b, and then the insulating material substrate 63 is heated and cured under vacuum to manufacture a four-layer substrate. Next, the conductor bumps 62 and the insulating material substrate 63 are arranged between the four-layer substrates, and then the insulating material substrate 63 is heated and cured under vacuum to manufacture an eight-layer substrate.

このような方法によれば、２層基板６０ｂ、４層基板および８層基板を製造する各々の際に、未硬化の絶縁材料基板６３が１層しかないので、絶縁材料基板６３の一部が押圧力によって水平方向および垂直方向にずれることはない。しかしながら、各絶縁材料基板６３を乾燥させて硬化するのにそれぞれ長時間（約３時間）かかってしまい（８層基板を製造する場合には絶縁材料基板６３を３回に分けて乾燥させなければならないので）、プリント配線基板６０を効率よく製造することができない。   According to such a method, in each of manufacturing the two-layer substrate 60b, the four-layer substrate, and the eight-layer substrate, the uncured insulating material substrate 63 has only one layer. There is no deviation in the horizontal and vertical directions due to the pressing force. However, it takes a long time (about 3 hours) to dry and cure each insulating material substrate 63 (in the case of manufacturing an eight-layer substrate, the insulating material substrate 63 must be dried in three steps. Therefore, the printed wiring board 60 cannot be manufactured efficiently.

これに対して、本実施の形態によれば、上述のように、８層基板を製造する場合であっても、絶縁材料基板６３を乾燥させて硬化する工程が２回しかないので、短い時間でプリント配線基板６０を製造することができ、プリント配線基板６０を効率よく製造することができる。   On the other hand, according to the present embodiment, as described above, even in the case of manufacturing an eight-layer substrate, the process of drying and curing the insulating material substrate 63 is only performed twice, so that it takes less time. The printed wiring board 60 can be manufactured, and the printed wiring board 60 can be manufactured efficiently.

なお、本実施の形態では、構造支持用バンプ６７が絶縁性材料からなっているので、２層基板６０ｂ間で短絡が発生することを気にすることなく、自由な位置に構造支持用バンプ６７を配置することができる。このため、適切な位置に構造支持用バンプ６７を配置することができ、積層された複数の導体板を押圧する際（第二押圧工程の際）に、まだ硬化されていない絶縁材料基板６３の一部が水平方向および垂直方向にずれることを、より確実に防止することができる。   In the present embodiment, since the structure support bump 67 is made of an insulating material, the structure support bump 67 can be freely positioned without worrying about a short circuit occurring between the two-layer substrates 60b. Can be arranged. For this reason, the structure supporting bumps 67 can be arranged at appropriate positions, and when the plurality of laminated conductor plates are pressed (during the second pressing step), the insulating material substrate 63 that has not yet been cured. It can prevent more reliably that one part shifts | deviates to a horizontal direction and a perpendicular direction.

なお、上述した、第二導体バンプ形成工程と、構造支持用バンプ形成工程と、第二絶縁材料部材配置工程と、第二配置工程と、第二押圧工程と、第二硬化工程とから、重畳工程が構成されている（第二押圧工程と第二硬化工程は同時に行われている）。   In addition, it overlaps from the 2nd conductor bump formation process mentioned above, the bump formation process for structure support, the 2nd insulating material member arrangement process, the 2nd arrangement process, the 2nd press process, and the 2nd hardening process. The process is comprised (the 2nd press process and the 2nd hardening process are performed simultaneously).

ところで、このようにして製造されたプリント配線基板６０は、図４（ｂ）に示すように、第一導体板６１ａと、第一導体板６１ａ上に設けられた導電性材料からなる複数の導体バンプ６２と、第一導体板６１ａ上であって導体バンプ６２が配置されている箇所以外の箇所に配置された絶縁材料基板６３と、導体バンプ６２および絶縁材料基板６３上に配置された第二導体板６１ｂと、第二導体板６１ｂ上に設けられた導電性材料からなる複数の導体バンプ６２と、第二導体板６１ｂ上に設けられた構造支持用バンプ６７と、第一導体板６１ａ上であって導体バンプ６２および構造支持用バンプ６７が配置されている箇所以外の箇所に配置された絶縁材料基板６３と、導体バンプ６２、構造支持用バンプ６７および絶縁材料基板６３上に配置された頂面導体板６１ｃと、を備えている。   By the way, the printed wiring board 60 manufactured in this way includes a first conductor plate 61a and a plurality of conductors made of a conductive material provided on the first conductor plate 61a, as shown in FIG. Bump 62, insulating material substrate 63 disposed on the first conductor plate 61a other than the portion where conductor bump 62 is disposed, and second disposed on conductor bump 62 and insulating material substrate 63. Conductor plate 61b, a plurality of conductor bumps 62 made of a conductive material provided on second conductor plate 61b, structure support bumps 67 provided on second conductor plate 61b, and first conductor plate 61a The insulating material substrate 63 is disposed at a place other than the place where the conductor bump 62 and the structure supporting bump 67 are disposed, and is disposed on the conductor bump 62, the structure supporting bump 67 and the insulating material substrate 63. A top surface conductor plate 61c which is provided with a.

ところで、本実施の形態では、底面導体板６１ｌ、２層基板６０ｂおよび頂面導体板６１ｃを被利用部材として用いた態様によって説明したが、これに限られることはない。   In the present embodiment, the bottom conductor plate 61l, the two-layer substrate 60b, and the top conductor plate 61c are described as the members to be used. However, the present invention is not limited to this.

例えば、被利用部材として２層基板６０ｂおよび頂面導体板６１ｃを用いた５層基板を生成してもよく、この場合には、生成されるプリント配線基板６０は、２層基板６０ｂ上に導体バンプ６２、構造支持用バンプ６７および絶縁材料基板６３が配置された基板６０ｃと、当該基板６０ｃ上に配置され、２層基板６０ｂ上に導体バンプ６２、構造支持用バンプ６７および絶縁材料基板６３が配置された基板６０ｃと、頂面導体板６１ｃと、を備えることとなる。   For example, a five-layer board using the two-layer board 60b and the top conductor plate 61c as a member to be used may be generated. In this case, the generated printed wiring board 60 is a conductor on the two-layer board 60b. The substrate 60c on which the bump 62, the structure supporting bump 67 and the insulating material substrate 63 are arranged, and the conductor bump 62, the structure supporting bump 67 and the insulating material substrate 63 on the two-layer substrate 60b are arranged on the substrate 60c. The board | substrate 60c arrange | positioned and the top surface conductor plate 61c will be provided.

また、例えば、被利用部材として底面導体板６１ｌおよび２層基板６０ｂを用いた５層基板を生成してもよく、この場合には、生成されるプリント配線基板６０は、底面導体板６１ｌ上に導体バンプ６２、構造支持用バンプ６７および絶縁材料基板６３が配置された基板と、当該基板上に配置され、２層基板６０ｂ上に導体バンプ６２、構造支持用バンプ６７および絶縁材料基板６３が配置された基板６０ｃと、当該基板６０ｃ上に配置された２層基板６０ｂと、を備えることとなる。   Further, for example, a five-layer board using the bottom conductor plate 61l and the two-layer board 60b as a member to be used may be generated. In this case, the generated printed wiring board 60 is placed on the bottom conductor board 61l. A substrate on which the conductor bump 62, the structure supporting bump 67 and the insulating material substrate 63 are disposed, and the conductor bump 62, the structure supporting bump 67 and the insulating material substrate 63 are disposed on the two-layer substrate 60b. And the two-layer substrate 60b disposed on the substrate 60c.

第２の実施の形態
次に、図５（ａ）−（ｅ）により、本発明の第２の実施の形態について説明する。図５（ａ）−（ｅ）に示す第２の実施の形態は、構造支持用バンプ形成部から供給される構造支持用バンプ６７が、導体バンプ６２を構成する導電性材料からなり、スキージ機構１０（第一導体バンプ形成部および第二導体バンプ形成部）が構造支持用バンプ形成部としても機能するものであり、その他の構成は、図１（ａ）−（ｆ）乃至図４（ａ）（ｂ）に示す第１の実施の形態と略同一である。 Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment shown in FIGS. 5A to 5E, the structure support bump 67 supplied from the structure support bump forming portion is made of a conductive material constituting the conductor bump 62, and the squeegee mechanism. 10 (first conductor bump forming portion and second conductor bump forming portion) also functions as a structure supporting bump forming portion, and other configurations are shown in FIGS. 1 (a)-(f) to 4 (a). ) Substantially the same as the first embodiment shown in (b).

図５（ａ）−（ｅ）に示す第２の実施の形態において、図１（ａ）−（ｆ）乃至図４（ａ）（ｂ）に示す第１の実施の形態と同一部分には同一符号を付して詳細な説明は省略する。   In the second embodiment shown in FIGS. 5 (a)-(e), the same parts as those in the first embodiment shown in FIGS. 1 (a)-(f) to FIGS. The same reference numerals are assigned and detailed description is omitted.

本実施の形態によれば、第１の実施の形態と同様の効果を奏することができる。   According to the present embodiment, the same effects as those of the first embodiment can be obtained.

より具体的には、本実施の形態によっても、未硬化の絶縁材料基板６３内に構造支持用バンプ６７が配置されるので、この構造支持用バンプ６７によって、２層基板６０ｂの第二導体板６１ｂと別の２層基板６０ｂの第一導体板６１ａとの間と、２層基板６０ｂの第二導体板６１ｂと頂面導体板６１ｃとの間を、支持することができる（図４（ａ）参照）。   More specifically, the structure support bumps 67 are arranged in the uncured insulating material substrate 63 also in the present embodiment, and the second conductor plate of the two-layer substrate 60b is formed by the structure support bumps 67. It is possible to support between 61b and the first conductor plate 61a of another two-layer substrate 60b, and between the second conductor plate 61b and the top conductor plate 61c of the two-layer substrate 60b (FIG. 4 (a). )reference).

このため、積層された複数の導体板を押圧する際（第二押圧工程の際）に、まだ硬化されていない絶縁材料基板６３の一部（特に、導体バンプ６２が配置されていない部分）が水平方向および垂直方向にずれることを防止することができる。この結果、第二硬化工程を経て製造されたプリント配線基板６０を、導通不良や短絡などを起こすことない正常なものにすることができる。従って、本実施の形態によれば正常なプリント配線基板６０を効率よく製造することができる。また、例え図４（ａ）（ｂ）に示すような８層基板を製造する場合であっても、絶縁材料基板６３を真空状態下で加熱して硬化する工程が２回しかないので、短い時間でプリント配線基板６０を製造することができ、プリント配線基板６０を効率よく製造することができる。   For this reason, when pressing a plurality of laminated conductor plates (in the second pressing step), a part of the insulating material substrate 63 that has not been cured yet (particularly, a portion where the conductor bumps 62 are not disposed) It is possible to prevent displacement in the horizontal direction and the vertical direction. As a result, the printed wiring board 60 manufactured through the second curing step can be made normal without causing a conduction failure or a short circuit. Therefore, according to the present embodiment, a normal printed wiring board 60 can be efficiently manufactured. Further, even in the case of manufacturing an eight-layer substrate as shown in FIGS. 4A and 4B, since the insulating material substrate 63 is heated and cured in a vacuum state only twice, a short time is required. Thus, the printed wiring board 60 can be manufactured, and the printed wiring board 60 can be manufactured efficiently.

さらに、本実施の形態によれば、上述した効果に加え、構造支持用バンプ形成部から供給される構造支持用バンプ６７が導体バンプ６２を構成する導電性材料からなっているので、スキージ機構１０によって、２層基板６０ｂの第二導体板６１ｂ上に導電性材料からなる複数の導体バンプ６２が形成される間（第二導体バンプ形成工程の間）に、構造支持用バンプ６７を形成すること（構造支持用バンプ形成工程を行うこと）ができる（図１（ｃ）（ｄ）および図５（ｃ）参照）。このため、より短い時間でプリント配線基板６０を製造することができ、プリント配線基板６０をより効率よく製造することができる。   Further, according to the present embodiment, in addition to the effects described above, the structure support bump 67 supplied from the structure support bump forming portion is made of the conductive material constituting the conductor bump 62. The structure supporting bumps 67 are formed while the plurality of conductive bumps 62 made of a conductive material are formed on the second conductive plate 61b of the two-layer substrate 60b (during the second conductive bump forming step). (The structure support bump forming step can be performed) (see FIGS. 1C and 1D and FIG. 5C). For this reason, the printed wiring board 60 can be manufactured in a shorter time, and the printed wiring board 60 can be manufactured more efficiently.

本発明の第１の実施の形態によるプリント配線基板製造装置を用いたプリント配線基板製造方法を説明した側方断面図。The side sectional view explaining the printed wiring board manufacturing method using the printed wiring board manufacturing apparatus by a 1st embodiment of the present invention. 本発明の第１の実施の形態によるプリント配線基板製造装置を用いたプリント配線基板製造方法を説明した拡大側方断面図。The expanded side sectional view explaining the printed wiring board manufacturing method using the printed wiring board manufacturing apparatus by the 1st Embodiment of this invention. 図２に示す工程の後のプリント配線基板製造方法を説明した拡大側方断面図。The expanded side sectional view explaining the printed wiring board manufacturing method after the process shown in FIG. 図３に示す工程の後のプリント配線基板製造方法を説明した拡大側方断面図。The expanded side sectional view explaining the printed wiring board manufacturing method after the process shown in FIG. 本発明の第２の実施の形態によるプリント配線基板製造装置を用いたプリント配線基板製造方法を説明した側方断面図。Side sectional drawing explaining the printed wiring board manufacturing method using the printed wiring board manufacturing apparatus by the 2nd Embodiment of this invention.

符号の説明Explanation of symbols

１ 保持部
１０ スキージ機構（第一導体バンプ形成部、第二導体バンプ形成部）
２０ 絶縁材料基板押圧部（第一絶縁材料部材配置部、第二絶縁材料部材配置部）
３０ 配置押圧部（第一配置部、第一押圧部、第二配置部、第二押圧部）
４０ ヒータ（第一硬化部、第二硬化部）
５０ ディスペンサ（構造支持用バンプ形成部）
６０ プリント配線基板
６０ｂ ２層基板
６１ａ 第一導体板
６１ｂ 第二導体板
６１ｃ 頂面導体板
６１ｌ 底面導体板
６２ 導体バンプ
６３ 絶縁材料基板（絶縁材料部材）
６７ 構造支持用バンプ 1 Holding part 10 Squeegee mechanism (first conductor bump forming part, second conductor bump forming part)
20 Insulating material substrate pressing part (first insulating material member arranging part, second insulating material member arranging part)
30 arrangement | positioning press part (1st arrangement | positioning part, 1st press part, 2nd arrangement | positioning part, 2nd press part)
40 Heater (first curing part, second curing part)
50 Dispenser (Bump forming part for structure support)
60 printed wiring board 60b two-layer board 61a first conductor board 61b second conductor board 61c top conductor board 61l bottom conductor board 62 conductor bump 63 insulating material board (insulating material member)
67 Bump for structure support

Claims (16)

第一導体板と第二導体板とを有する２層基板を生成する２層基板生成工程と、
一つ以上の前記２層基板と、底面導体板および頂面導体板とを準備して各々を重ね合わせる重畳工程と、を備え、
前記２層基板生成工程は、
前記第一導体板上に導電性材料からなる複数の導体バンプを形成する第一導体バンプ形成工程と、
前記第一導体板上であって前記導体バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第一絶縁材料部材配置工程と、
前記導体バンプ上に前記第二導体板を配置する第一配置工程と、
前記第一導体板と前記第二導体板の間に押圧力を加える第一押圧工程と、
前記第一導体板と前記第二導体板との間に配置された前記絶縁材料部材を硬化させる第一硬化工程と、を有し、
前記重畳工程は、
前記底面導体板および前記２層基板上に導電性材料からなる複数の導体バンプを形成する第二導体バンプ形成工程と、
前記底面導体板および前記２層基板上に構造支持用バンプを形成する構造支持用バンプ形成工程と、
前記底面導体板および前記２層基板上であって前記導体バンプおよび前記構造支持用バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第二絶縁材料部材配置工程と、
前記２層基板を、前記底面導体板上の前記導体バンプおよび前記構造支持用バンプ上に配置するとともに、前記２層基板が１つだけある場合には、前記頂面導体板を、前記底面導体板上に配置された前記２層基板上の前記導体バンプおよび前記構造支持用バンプ上に配置し、前記２層基板が２つ以上ある場合には、各２層基板を重ね合わせ、前記頂面導体板を、前記底面導体板上に配置された前記２層基板と異なり最も上方に位置する前記２層基板上の前記導体バンプおよび前記構造支持用バンプ上に配置する第二配置工程と、
前記底面導体板、前記２層基板および前記頂面導体板の各々の間に押圧力を加える第二押圧工程と、
前記底面導体板、前記２層基板および前記頂面導体板の各々の間に配置された前記絶縁材料部材を硬化させる第二硬化工程と、を有し、
前記第一導体板と前記第二導体板との間には前記構造支持用バンプを設けないことを特徴とするプリント配線基板製造方法。 A two-layer substrate generation step of generating a two-layer substrate having a first conductor plate and a second conductor plate;
A superposition step of preparing one or more of the two-layer substrates, a bottom conductor plate and a top conductor plate and superimposing each of them,
The two-layer substrate generation step includes
A first conductor bump forming step of forming a plurality of conductor bumps made of a conductive material on the first conductor plate;
A first insulating material member placement step of placing an uncured insulating material member on a location other than the location where the conductor bumps are located on the first conductor plate,
A first arrangement step of arranging the second conductor plate on the conductor bump;
A first pressing step of applying a pressing force between the first conductor plate and the second conductor plate;
A first curing step of curing the insulating material member disposed between the first conductor plate and the second conductor plate,
The superimposing step includes
A second conductor bump forming step of forming a plurality of conductor bumps made of a conductive material on the bottom surface conductor plate and the two-layer substrate;
A structure supporting bump forming step of forming a structure supporting bump on the bottom conductor plate and the two-layer substrate;
A second insulating material member disposing step of disposing an uncured insulating material member on the bottom surface conductor plate and the two-layer substrate other than the portion where the conductor bump and the structure supporting bump are disposed; ,
When the two-layer substrate is disposed on the conductor bump and the structure supporting bump on the bottom conductor plate, and there is only one two-layer substrate, the top conductor plate is replaced with the bottom conductor. When there are two or more two-layer substrates arranged on the conductor bumps and the structure supporting bumps on the two-layer substrate arranged on a plate , the two-layer substrates are overlapped, and the top surface A second disposing step of disposing a conductor plate on the conductor bump and the structure supporting bump on the two-layer substrate located at the uppermost position unlike the two-layer substrate disposed on the bottom surface conductor plate;
A second pressing step of applying a pressing force between each of the bottom conductor plate, the two-layer substrate and the top conductor plate;
The bottom conductive plate, have a, a second curing step of curing the insulating material member disposed between each of the 2-layer substrate and the top surface conductor plate,
A printed wiring board manufacturing method, wherein the structure supporting bumps are not provided between the first conductor plate and the second conductor plate . 第一導体板と第二導体板とを有する２層基板を生成する２層基板生成工程と、
二つ以上の前記２層基板と、底面導体板を準備して各々を重ね合わせる重畳工程と、を備え、
前記２層基板生成工程は、
前記第一導体板上に導電性材料からなる複数の導体バンプを形成する第一導体バンプ形成工程と、
前記第一導体板上であって前記導体バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第一絶縁材料部材配置工程と、
前記導体バンプ上に前記第二導体板を配置する第一配置工程と、
前記第一導体板と前記第二導体板の間に押圧力を加える第一押圧工程と、
前記第一導体板と前記第二導体板との間に配置された前記絶縁材料部材を硬化させる第一硬化工程と、を有し、
前記重畳工程は、
前記底面導体板および一の２層基板上に導電性材料からなる複数の導体バンプを形成する第二導体バンプ形成工程と、
前記底面導体板および前記一の２層基板上に構造支持用バンプを形成する構造支持用バンプ形成工程と、
前記底面導体板および前記一の２層基板上であって前記導体バンプおよび前記構造支持用バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第二絶縁材料部材配置工程と、
前記一の２層基板を、前記底面導体板上の前記導体バンプおよび前記構造支持用バンプ上に配置するとともに、他の２層基板を、前記一の２層基板上の前記導体バンプおよび前記構造支持用バンプ上に配置する第二配置工程と、
前記底面導体板および前記２層基板の各々の間に押圧力を加える第二押圧工程と、
前記底面導体板および前記２層基板の各々の間に配置された前記絶縁材料部材を硬化させる第二硬化工程と、を有し、
前記第一導体板と前記第二導体板との間には前記構造支持用バンプを設けないことを特徴とするプリント配線基板製造方法。 A two-layer substrate generation step of generating a two-layer substrate having a first conductor plate and a second conductor plate;
Two or more two-layer substrates, and a superimposing step of preparing each bottom conductor plate and superimposing each other,
The two-layer substrate generation step includes
A first conductor bump forming step of forming a plurality of conductor bumps made of a conductive material on the first conductor plate;
A first insulating material member placement step of placing an uncured insulating material member on a location other than the location where the conductor bumps are located on the first conductor plate,
A first arrangement step of arranging the second conductor plate on the conductor bump;
A first pressing step of applying a pressing force between the first conductor plate and the second conductor plate;
A first curing step of curing the insulating material member disposed between the first conductor plate and the second conductor plate,
The superimposing step includes
A second conductor bump forming step of forming a plurality of conductor bumps made of a conductive material on the bottom conductor plate and the one two-layer substrate;
A structure supporting bump forming step of forming a structure supporting bump on the bottom conductor plate and the one two-layer substrate;
A second insulating material member arrangement in which an uncured insulating material member is arranged at a location other than the location where the conductor bump and the structure supporting bump are arranged on the bottom surface conductor plate and the one two-layer substrate. Process,
Wherein one of the 2-layer substrate, wherein while disposed on the bottom surface conductive plate on said conductive bump and said structural support for the bumps, the other two-layer substrate, the conductor bump and said structure on a two-layer substrate of the one A second arrangement step of arranging on the supporting bump;
A second pressing step of applying a pressing force between each of the bottom conductor plate and the two-layer substrate;
Have a, a second curing step of curing the insulating material member disposed between each of said bottom conductive plate and the second layer substrate,
A printed wiring board manufacturing method, wherein the structure supporting bumps are not provided between the first conductor plate and the second conductor plate . 第一導体板と第二導体板とを有する２層基板を生成する２層基板生成工程と、
二つ以上の前記２層基板と、頂面導体板とを準備して各々を重ね合わせる重畳工程と、を備え、
前記２層基板生成工程は、
前記第一導体板上に導電性材料からなる複数の導体バンプを形成する第一導体バンプ形成工程と、
前記第一導体板上であって前記導体バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第一絶縁材料部材配置工程と、
前記導体バンプ上に前記第二導体板を配置する第一配置工程と、
前記第一導体板と前記第二導体板の間に押圧力を加える第一押圧工程と、
前記第一導体板と前記第二導体板との間に配置された前記絶縁材料部材を硬化させる第一硬化工程と、を有し、
前記重畳工程は、
一の２層基板および他の２層基板上に導電性材料からなる複数の導体バンプを形成する第二導体バンプ形成工程と、
前記一の２層基板および前記他の２層基板上に構造支持用バンプを形成する構造支持用バンプ形成工程と、
前記一の２層基板および前記他の２層基板上であって前記導体バンプおよび前記構造支持用バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第二絶縁材料部材配置工程と、
前記他の２層基板を、前記一の２層基板上の前記導体バンプおよび前記構造支持用バンプ上に配置するとともに、前記頂面導体板を、前記他の２層基板上の前記導体バンプおよび前記構造支持用バンプ上に配置する前記第二配置工程と、
前記２層基板および前記頂面導体板の各々の間に押圧力を加える第二押圧工程と、
前記２層基板および前記頂面導体板の各々の間に配置された前記絶縁材料部材を硬化させる第二硬化工程と、を有し、
前記第一導体板と前記第二導体板との間には前記構造支持用バンプを設けないことを特徴とするプリント配線基板製造方法。 A two-layer substrate generation step of generating a two-layer substrate having a first conductor plate and a second conductor plate;
Providing two or more of the two-layer substrates and a top conductor plate and superimposing each other,
The two-layer substrate generation step includes
A first conductor bump forming step of forming a plurality of conductor bumps made of a conductive material on the first conductor plate;
A first insulating material member placement step of placing an uncured insulating material member on a location other than the location where the conductor bumps are located on the first conductor plate,
A first arrangement step of arranging the second conductor plate on the conductor bump;
A first pressing step of applying a pressing force between the first conductor plate and the second conductor plate;
A first curing step of curing the insulating material member disposed between the first conductor plate and the second conductor plate,
The superimposing step includes
A second conductor bump forming step of forming a plurality of conductor bumps made of a conductive material on one two-layer substrate and another two-layer substrate;
A structure supporting bump forming step of forming a structure supporting bump on the one two-layer substrate and the other two-layer substrate;
A second insulating material in which an uncured insulating material member is disposed on the one two-layer substrate and the other two-layer substrate other than the portion where the conductor bump and the structure supporting bump are disposed. A member placement step;
The other two-layer substrate is disposed on the conductor bump and the structure supporting bump on the one two-layer substrate, and the top conductor plate is disposed on the conductor bump on the other two-layer substrate. The second arrangement step of arranging on the structure supporting bump;
A second pressing step of applying a pressing force between each of the two-layer substrate and the top conductor plate;
Have a, a second curing step of curing the insulating material member disposed between each of the 2-layer substrate and the top surface conductor plate,
A printed wiring board manufacturing method, wherein the structure supporting bumps are not provided between the first conductor plate and the second conductor plate . 前記構造支持用バンプは絶縁性材料からなることを特徴とする請求項１乃至３のいずれか１項に記載のプリント配線基板製造方法。   The printed wiring board manufacturing method according to claim 1, wherein the structural support bumps are made of an insulating material. 前記構造支持用バンプは前記導体バンプを構成する導電性材料からなり、
前記第二導体バンプ形成工程の間に、前記構造支持用バンプ形成工程が行われることを特徴とする請求項１乃至３のいずれか１項に記載のプリント配線基板製造方法。 The structure support bump is made of a conductive material constituting the conductor bump,
The printed wiring board manufacturing method according to any one of claims 1 to 3, wherein the structure supporting bump forming step is performed during the second conductor bump forming step. 第一導体板上に導電性材料からなる複数の導体バンプを形成する第一導体バンプ形成部と、
前記第一導体板上であって前記導体バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第一絶縁材料部材配置部と、
前記導体バンプ上に第二導体板を配置する第一配置部と、
前記第一導体板と前記第二導体板の間に押圧力を加える第一押圧部と、
前記第一導体板と前記第二導体板との間に配置された前記絶縁材料部材を硬化させて、２層基板を生成する第一硬化部と、
底面導体板または一の２層基板上に導電性材料からなる複数の導体バンプを形成する第二導体バンプ形成部と、
前記底面導体板または前記一の２層基板上に構造支持用バンプを形成する構造支持用バンプ形成部と、
前記底面導体板または前記一の２層基板上であって前記導体バンプおよび前記構造支持用バンプが配置されている箇所以外の箇所に、未硬化の絶縁材料部材を配置する第二絶縁材料部材配置部と、
他の２層基板または頂面導体板を、前記底面導体板または前記一の２層基板上の前記導体バンプおよび前記構造支持用バンプ上に配置する第二配置部と、
前記底面導体板、前記２層基板および前記頂面導体板のうち用いられている部材の間に押圧力を加える第二押圧部と、
前記底面導体板、前記２層基板および前記頂面導体板のうち用いられている部材の間に配置された前記絶縁材料部材を硬化させる第二硬化部と、
を備え、
前記第一導体板と前記第二導体板との間には前記構造支持用バンプを設けないたことを特徴とするプリント配線基板製造装置。 A first conductor bump forming portion for forming a plurality of conductor bumps made of a conductive material on the first conductor plate;
A first insulating material member disposition portion that disposes an uncured insulating material member on a portion other than the portion where the conductor bumps are disposed on the first conductor plate,
A first placement portion for placing a second conductor plate on the conductor bump;
A first pressing portion that applies a pressing force between the first conductor plate and the second conductor plate;
A first curing portion that cures the insulating material member disposed between the first conductor plate and the second conductor plate to generate a two-layer substrate;
A second conductor bump forming portion for forming a plurality of conductor bumps made of a conductive material on the bottom conductor plate or one two-layer substrate;
A structure supporting bump forming portion for forming a structure supporting bump on the bottom conductor plate or the one two-layer substrate;
A second insulating material member arrangement in which an uncured insulating material member is arranged at a location other than the location where the conductor bump and the structure supporting bump are arranged on the bottom conductor plate or the one two-layer substrate. And
A second arrangement portion for arranging another two-layer substrate or top conductor plate on the conductor bump and the structure supporting bump on the bottom conductor plate or the one two-layer substrate;
A second pressing portion that applies a pressing force between the bottom conductor plate, the two-layer substrate, and the member used among the top conductor plates;
A second curing portion that cures the insulating material member disposed between the bottom conductor plate, the two-layer substrate, and the member used among the top conductor plates ;
Equipped with a,
The printed wiring board manufacturing apparatus, wherein the structure supporting bump is not provided between the first conductor plate and the second conductor plate . 前記第一導体バンプ形成部は、前記第二導体バンプ形成部としても機能することを特徴とする請求項６に記載のプリント配線基板製造装置。   The printed wiring board manufacturing apparatus according to claim 6, wherein the first conductor bump forming portion also functions as the second conductor bump forming portion. 前記第一絶縁材料部材配置部は、前記第二絶縁材料部材配置部としても機能することを特徴とする請求項６に記載のプリント配線基板製造装置。   The printed wiring board manufacturing apparatus according to claim 6, wherein the first insulating material member arranging portion also functions as the second insulating material member arranging portion. 前記第一配置部は、前記第二配置部としても機能することを特徴とする請求項６に記載のプリント配線基板製造装置。   The printed wiring board manufacturing apparatus according to claim 6, wherein the first arrangement unit also functions as the second arrangement unit. 前記第一押圧部は、前記第二押圧部としても機能することを特徴とする請求項６に記載のプリント配線基板製造装置。   The printed wiring board manufacturing apparatus according to claim 6, wherein the first pressing portion also functions as the second pressing portion. 前記第一硬化部は、前記第二硬化部としても機能することを特徴とする請求項６に記載のプリント配線基板製造装置。   The printed wiring board manufacturing apparatus according to claim 6, wherein the first curing portion also functions as the second curing portion. 前記構造支持用バンプ形成部から供給される前記構造支持用バンプは、絶縁性材料からなり、
前記第二導体バンプ形成部は、前記構造支持用バンプ形成部と別体を構成することを特徴とする請求項６に記載のプリント配線基板製造装置。 The structure support bump supplied from the structure support bump forming portion is made of an insulating material,
The printed wiring board manufacturing apparatus according to claim 6, wherein the second conductor bump forming portion constitutes a separate body from the structure supporting bump forming portion. 前記構造支持用バンプ形成部から供給される前記構造支持用バンプは、前記導体バンプを構成する導電性材料からなり、
前記第二導体バンプ形成部は前記構造支持用バンプ形成部としても機能することを特徴とする請求項６に記載のプリント配線基板製造装置。 The structure support bump supplied from the structure support bump forming portion is made of a conductive material constituting the conductor bump,
The printed wiring board manufacturing apparatus according to claim 6, wherein the second conductor bump forming portion also functions as the structure supporting bump forming portion. 第一導体板と、
前記第一導体板上に設けられた導電性材料からなる複数の導体バンプと、
前記第一導体板上であって前記導体バンプが配置されている箇所以外の箇所に配置された絶縁材料部材と、
前記導体バンプおよび前記絶縁材料部材上に配置された第二導体板と、
前記第二導体板上に設けられた導電性材料からなる複数の導体バンプと、
前記第二導体板上に設けられた構造支持用バンプと、
前記第二導体板上であって前記導体バンプおよび前記構造支持用バンプが配置されている箇所以外の箇所に配置された絶縁材料部材と、
を備え、
前記第一導体板と前記第二導体板との間には前記構造支持用バンプが設けられていないことを特徴とするプリント配線基板。 A first conductor plate;
A plurality of conductive bumps made of a conductive material provided on the first conductive plate;
An insulating material member disposed on a location other than the location where the conductor bumps are disposed on the first conductor plate;
A second conductor plate disposed on the conductor bump and the insulating material member;
A plurality of conductive bumps made of a conductive material provided on the second conductive plate;
A structural support bump provided on the second conductor plate;
An insulating material member disposed on a location other than the location where the conductor bump and the structure supporting bump are disposed on the second conductor plate;
Equipped with a,
The printed wiring board, wherein the structure supporting bumps are not provided between the first conductor plate and the second conductor plate . 前記絶縁材料部材上に、頂面導体板が設けられたことを特徴とする請求項１４に記載のプリント配線基板。   The printed wiring board according to claim 14, wherein a top conductor plate is provided on the insulating material member. 前記絶縁材料部材上に、第一導体板と、該第一導体板上に設けられた導電性材料からなる複数の導体バンプと、該第一導体板上であって該導体バンプが配置されている箇所以外の箇所に配置された絶縁材料部材と、該導体バンプおよび該絶縁材料部材上に配置された第二導体板と、を有する２層基板が設けられたことを特徴とする請求項１４に記載のプリント配線基板。   On the insulating material member, a first conductor plate, a plurality of conductor bumps made of a conductive material provided on the first conductor plate, and the conductor bumps are disposed on the first conductor plate. 15. A two-layer board having an insulating material member disposed at a place other than the place where the conductive material is disposed and a second conductive plate disposed on the conductive bump and the insulating material member is provided. Printed wiring board as described in 1.
JP2008244832A 2008-09-24 2008-09-24 Printed wiring board manufacturing method, printed wiring board manufacturing apparatus, and printed wiring board Expired - Fee Related JP5333900B2 (en)

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