JP5332671B2 - Memory control apparatus and control signal output timing adjustment method - Google Patents

Description

  The present invention relates to a memory control device for writing data into a memory and a method for adjusting the control signal output timing.

  A DRAM (Dynamic Random Access Memory) used as a large-capacity memory is mainly a double data rate system such as a synchronous DDR1-SDRAM or a DDR2-SDRAM. In particular, in the DDR2-SDRAM, the specifications of 400 MHz to 800 MHz per clock rate are standardized by JEDEC (Joint Electron Engineering Engineering Council).

  In the future, the operating speed of DDR-SDRAM will become even faster, and DDR3-SDRAM is expected to become mainstream. In DDR3-SDRAM, specifications from 800 MHz (DDR3-800) to 1.6 GHz (DDR3-1600) are standardized by JEDEC. Even with a synchronous memory, especially a parallel bus with a plurality of data, the operating speed is increased as new standards come out. This flow of speeding up can be realized only by the evolution of the manufacturing process of the semiconductor device itself such as the memory and the memory control device.

  However, in a device in which the memory and the memory control device are arranged on one board, even if the operating frequency of the memory and the memory control device is increased, the transfer speed related to the wiring on the board of the interface between the memory and the memory control device is not. It is not faster. For this reason, with the increase in the speed of semiconductor devices such as memories and memory control devices, the influence of wiring delay on the board is becoming an operational bottleneck.

  In a parallel bus interface device, when the operating frequency is 100 MHz or less, a semiconductor device on which a memory control device is mounted is formed so as to satisfy AC timing using a value with a margin for wiring delay on the board. It was possible. In addition, after the operating frequency exceeds 100 MHz, a PLL is built in the memory controller, and by synchronizing with the timing on the board, or by wiring the wiring on the board to the same length, The operation between the memory and the memory controller has been guaranteed.

  The data rate of the DDR3-SDRAM is 1.6 GHz, that is, 625 ps maximum. When the wiring delay on the board is 1 ns, the data rate of 100 MHz is negligible, but for the DDR3-SDRAM, the delay is higher than the operating frequency. It is at a level that cannot be dealt with only by synchronization by PLL and equal length wiring on the board.

  As a new function of the DDR3-SDRAM standard (JEDEC Standard No. 79-3x), a function for controlling the timing between the memory and the memory control device is added. The write leveling function and the fixed value read data output function by MPR (Multi Purpose Register) correspond to this.

  The former is related to the timing adjustment of the clock input to the memory and the DQS (data strobe signal) output by the memory control device at the time of writing, and the latter is related to the timing adjustment for the memory control device to fetch correct read data. is there. The DDR3-SDRAM standard itself does not mention how to use these functions, and how to use them depends on the specifications of the memory control device.

  In order for the memory control device to make full use of the write leveling function and the fixed value read data output function by MPR, the memory control device is equipped with a function for adjusting at least the DQS output timing and the DQ (data) / DQS input timing. It is essential. However, if only the DQS output and DQ / DQS input timing can be adjusted, a memory control device corresponding to a high-speed DDR3-SDRAM cannot be configured, and all input / output terminals of the memory control device must have a timing adjustment function. It is obvious that it is difficult to guarantee the new function support and high-speed operation of the DDR3-SDRAM.

  There is a technique using DLL (Delay Locked Loop) as a method for adjusting the timing of input / output terminals. By setting a value corresponding to the period of the reference clock input to the DLL in the delay arithmetic circuit, a stable delay can be supplied. Note that the reference clock and the memory clock have an arbitrary relationship. For example, the relationship of reference clock = memory clock may be used, or the memory clock multiplied by 2 may be used as the reference clock.

  FIG. 1 is a block diagram illustrating the configuration of a conventional memory control device. Referring to FIG. 1, the memory control device 100 includes a control unit 101, delay circuits 102 (1) to 102 (i), buffers 103 (1) to 103 (i), and an input / output terminal 104 (1). ~ 104 (j). Note that i and j are natural numbers. The control unit 101 is connected to the delay circuits 102 (1) to 102 (i). The delay circuits 102 (1) to 102 (i) are connected to the buffers 103 (1) to 103 (i). The buffers 103 (1) to 103 (i) are connected to the input / output terminals 104 (1) to 104 (j).

  FIG. 2 is a block diagram illustrating the configuration of the periphery of the delay circuit of FIG. In the figure, the same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof may be omitted. Referring to FIG. 2, a reference clock is input to a DLL (Delay Locked Loop) circuit 105, and an output of the DLL circuit 105 is connected to a delay operation circuit 107. The DLL circuit 105 is a delay value generation circuit that generates a predetermined delay value based on the reference clock and outputs the predetermined delay value to the delay calculation circuit 107.

  A delay setting value is input to the delay calculation circuit 107, and the output of the delay calculation circuit 107 is connected to the delay circuit 102 (1). Here, it is assumed that the memory clock = the reference clock and the period thereof is tck. The configuration of the periphery of each delay circuit other than the delay circuit 102 (1) is the same as that in FIG.

  As shown in FIGS. 1 and 2, the memory control device 100 includes delay circuits 102 (1) to 102 (i) at input / output terminals 104 (1) to 104 (j). By inputting the output and the delay set value to the delay calculation circuit 107, the delay calculation circuit 107 can be set for delay. That is, the delay setting circuit 107 calculates a delay amount using the output of the DLL circuit 105 and a desired delay setting value, and outputs the calculated delay amount to the delay circuits 102 (1) to 102 (i). The delay circuits 102 (1) to 102 (i) determine the delay value based on the delay amount input from the delay setting circuit 107.

  For example, when the delay setting value input to the delay calculation circuit 107 is n, the delay calculation circuit 107 is set to have a delay amount of n / 32 tCK. With this configuration, the delay amount of the output signals of the delay circuits 102 (1) to 102 (i) can be individually set corresponding to the reference clock.

  In the case of a memory control device that controls the DDR3-SDRAM, CS, RAS, CAS, WE, address, bank address, and CKE are fetched in synchronization with the rising timing of the memory clock, and the command is determined by a combination of these signals. For example, in the case of DDR3-1600, since the memory clock is 800 MHz, it is necessary to satisfy the setup hold at a cycle of 1.25 ns. The timing of such a high-speed clock is 1.25 ns when the command and clock output from the memory controller reach the memory including the wiring delay on the board even if the setup hold is satisfied at a cycle of 1.25 ns. It is difficult to guarantee that the setup hold is satisfied in a cycle.

  FIG. 3 is a diagram illustrating a technique for relaxing the timing constraint. In FIG. 3, a clock CK indicates a memory clock (= reference clock; cycle tck), and a chip select CS indicates a chip select signal. In the method illustrated in FIG. 3, the timing constraint is relaxed by changing the change point of signals (other control signals) other than the chip select CS with respect to the change point of the chip select CS.

  However, in the method illustrated in FIG. 3, it is assumed that the chip select CS always guarantees the setup hold with the clock CK. In the memory control device that controls the DDR3-SDRAM, it is necessary to guarantee the setup hold with the clock CK when the chip select CS reliably reaches the memory.

  As described above, it is necessary to reliably guarantee the timing of the memory control signal related to at least one command. If the timing can be guaranteed with respect to one memory control signal, the timing of other signals can be sequentially guaranteed. Become. If it is guaranteed that the command is reliably transferred to the memory, the write leveling function, which is a new function of the DDR3-SDRAM, and the fixed data read function by MPR can be used effectively.

  However, in the conventional technique, it is difficult to guarantee that the memory control signal related to one command satisfies the setup hold at a cycle of 1.25 ns when it reaches the memory including the wiring delay on the board. was there.

  In view of the above points, a memory control device capable of easily grasping the relationship between a memory control signal and a clock and capable of expanding a margin for a setup hold between the memory control signal and the clock, and its control signal output It is an object to provide a timing adjustment method.

  The memory control device is a memory control device that writes data to a semiconductor memory device, delays a control signal for controlling the semiconductor memory device, and outputs the phase adjustment circuit to the semiconductor memory device. A data strobe monitoring circuit that monitors a data strobe signal input from the semiconductor memory device in response and outputs a response signal corresponding to a response time from when the control signal is output to when the data strobe signal is input And the delay amount of the phase adjustment circuit when the control signal is output to the semiconductor memory device while the delay amount is sequentially increased and the timing at which the response signal is output is monitored. The requirement is that the timing is set to a value shifted before or after the delay amount that has changed.

  The control method for adjusting the control signal output timing of the memory control device is a method for adjusting the control signal output timing of the memory control device for writing data to the semiconductor memory device, and is a first method for outputting a control signal to the semiconductor memory device. And a response signal corresponding to a response time from when the control signal is output to when the data strobe signal is input after monitoring the data strobe signal input from the semiconductor memory device in response to the control signal And outputting the control signal while sequentially increasing the delay amount to the semiconductor memory device, and inputting the control signal from the semiconductor memory device in response to the control signal increasing the delay amount sequentially. The data strobe signal is input after the control signal in which the delay amount is sequentially increased is output. A third step for sequentially outputting response signals corresponding to the response time until the response is performed, and a timing of the response signal sequentially output in the third step is a timing of the response signal output in the second step. In the fourth step for determining whether or not there has been a change, and in the fourth step, if it is determined that it has changed, the delay amount of the control signal is set to the delay amount when it has changed. And a fifth step for setting the value shifted before or after.

  According to the present invention, it is possible to easily grasp the relationship between the memory control signal and the clock, and to expand the margin for the setup hold between the memory control signal and the clock, and its control signal output timing. Can be provided.

It is a block diagram which illustrates the composition of the conventional memory control device. FIG. 2 is a block diagram illustrating a configuration of a peripheral portion of the delay circuit in FIG. 1. It is a figure which illustrates the method for relieving timing restrictions. It is a block diagram which illustrates the composition of the principal part of the memory control device concerning this embodiment. 6 is a timing chart (part 1) exemplified for explaining the operation of the memory control device; 6 is a timing chart (part 2) for illustrating the operation of the memory control device. 6 is a timing chart (part 3) for illustrating the operation of the memory control device; 12 is a timing chart (part 4) for illustrating the operation of the memory control device. It is an example of the flowchart regarding the phase adjustment method of the optimal memory control signal with respect to a clock. 10 is a timing chart (part 5) for illustrating the operation of the memory control device; 12 is a timing chart (No. 6) exemplified for explaining the operation of the memory control device;

  Hereinafter, embodiments will be described with reference to the drawings.

  FIG. 4 is a block diagram illustrating the configuration of the main part of the memory control device according to this embodiment. Referring to FIG. 4, the memory control device 10 includes a phase adjustment circuit 11 (1) to 11 (3), a data strobe monitoring circuit 12, a flip-flop 13, a control circuit 14, a signal control circuit 15, It has selection circuits 16 (1) and 16 (2), buffers 17 (1) to 17 (7), input / output terminals 18 (1) to 18 (3), and a CPU / I / F 19.

  When the data signal DQ is, for example, 8 bits, the memory control device 10 has eight input / output units having the same configuration as the input / output unit for the data signal DQ, but only one is shown in FIG. The others are omitted. In the DDR2 / DDR3-SDRAM, the data strobe signal is a differential signal, but for simplicity, it is shown as a single-ended signal in FIG.

  The phase adjustment circuits 11 (1) to 11 (3) have a function of delaying an input signal by a predetermined delay amount and outputting the delayed signal. The phase adjustment circuits 11 (1) to 11 (3) can be realized by, for example, the configuration shown in FIG. 2 (a DLL circuit that is a delay value generation circuit, a delay setting circuit, and a delay circuit).

  The data strobe monitoring circuit 12 has a function of outputting a response signal RES that is a value corresponding to a response time from the issuance of the data strobe signal DQS. A signal TPULSE is input from the control circuit 14 to the data strobe monitoring circuit 12. The signal TPULSE is an observation signal timing latch calculation pulse and indicates a timing at which the data strobe signal DQS should be observed. The signal TPULSE is a reference signal for accessing the memory, and the control circuit 14 generates the signal TPULSE before the fixed clock cycle, for example, 3 clocks, regardless of the latency setting.

  The data strobe monitoring circuit 12 observes the data strobe signal DQS which is an observation signal based on the signal TPULSE, and outputs a response signal RES at a predetermined rising or falling timing of the data strobe signal DQS. In this way, it is possible to purely observe the memory access delay amount regardless of the latency.

  The flip-flop 13 has a function of outputting an input signal at a predetermined timing. The control circuit 14 has a function of outputting a memory control signal COM. The memory control signal COM includes CS, RAS, CAS, WE, address, bank address, and CKE, and a command is determined by a combination of these signals. The control circuit 14 has a function of outputting a predetermined signal to the data strobe monitoring circuit 12, the signal control circuit 15, and the like. The signal control circuit 15 controls the selection circuits 16 (1) and 16 (2) that select signals according to a command from the control circuit 14.

  The data signal DQ, the data strobe signal DQS, and the memory control signal COM are input / output at the input / output terminals 18 (1) -18 (3) via the buffers 17 (1) -17 (5). The data signal DQ, the data strobe signal DQS, and the memory control signal COM are connected to a memory such as DDR3-1600.

  The phase adjustment circuits 11 (1) to 11 (3), the data strobe monitoring circuit 12, and the control circuit 14 are connected to the CPU / I / F 19. The CPU I / F 19 is a circuit that controls an interface with a CPU (not shown) arranged outside the memory control device 10, and a CPU bus (not shown) arranged outside the memory control device 10. Via a CPU (not shown).

  FIG. 5 is a first timing chart illustrating the operation of the memory control device. The clock CK is a memory clock, and its frequency is, for example, 800 MHz. As shown in FIG. 5, when the memory control device 10 issues a memory control signal COM to a memory such as DDR3-1600, for example, after waiting for a cycle corresponding to the read response latency RL (RL = 5 in the example of FIG. 5), The data signal DQ and the data strobe signal DQS are returned from the memory to the memory control device 10. Here, the timing chart illustrated in FIG. 5 is based on the assumption that there is no wiring delay in the connection between the memory control device 10 and the memory.

  FIG. 6 is a timing chart (part 2) for illustrating the operation of the memory control device. The timing chart illustrated in FIG. 6 is for a case where wiring delay in connection between the memory control device 10 and the memory is taken into consideration. As shown in FIG. 6, after the memory control device 10 actually issues the memory control signal COM, the data signal DQ and the data strobe signal DQS are actually received by the data signal DQ, the data strobe signal DQS, and the memory. It is after the time when the wiring delay α of the control signal COM is added. That is, the actual response time is not RL = 5 but RL = 5 + α.

  FIG. 7 is a timing chart (part 3) for illustrating the operation of the memory control device. The timing chart illustrated in FIG. 6 is based on the assumption that the wiring delay amount of the clock CK and the wiring delay amount of the command are the same, but the wiring delay amount of the clock CK and the wiring delay amount of the command are the same. Is not necessarily the same. As shown in FIGS. 7A to 7C, the phase relationship between the rising edge of the clock CK and the memory control signal COM can be in various states. On the memory side, it is not known what the phase relationship between the rising edge of the clock CK and the memory control signal COM is.

  Therefore, in order to know the phase relationship between the rising edge of the clock CK and the memory control signal COM, the change point of the response to the READ command (response signal RES) is observed by shifting the phase of the memory control signal COM with respect to the clock CK. The phase relationship of the optimal memory control signal COM with respect to the clock CK can be adjusted. Here, the response signal RES is merely a monitoring result output value in the data strobe monitoring circuit 12 of FIG. 4, and is not necessarily the actual number of cycles from the READ command.

  FIG. 8 is a timing chart (part 4) for illustrating the operation of the memory control device. The control circuit 14 generates the signal TPULSE before a fixed clock cycle (three clocks in the case of FIG. 8) for accessing the memory. The data strobe monitoring circuit 12 raises the signal VALUE with reference to the timing of the signal TPULSE, lowers the signal VALUE at the fourth fall of the data strobe signal DQS (when reaching the memory control device), and outputs a response signal RES. . In the example of FIG. 8, the response signal RES = N.

  Note that “the signal VALUE is lowered at the fourth fall and the response signal RES is output” is an example, and the signal VALUE is lowered at the 4 × n-th fall (n is a natural number) and the response signal RES is produced. Is preferably output. This is because, in an 8-burst type memory, the 4 × n-th falling timing is the timing at which the data of the DDR-SDRAM is determined, so that a circuit that generates a command originally used at normal time can be used as it is. Because.

  Alternatively, the signal VALUE may be lowered at the first rise of the data strobe signal DQS input to the memory control device 10 and the response signal RES may be output. This is because the response time can be measured earliest in this way.

  Here, each signal (CS, RAS, CAS, WE, address, bank address, CKE) for determining the memory control signal COM may also have a different wiring delay. First, as shown in FIG. It is preferable not to generate any other signal near the change point of the chip select CS.

  An optimum phase adjustment method for the memory control signal COM with respect to the clock CK will be described with reference to FIGS. FIG. 9 is an example of a flowchart relating to a phase adjustment method of an optimal memory control signal with respect to a clock. FIG. 10 is a timing chart (part 5) for illustrating the operation of the memory control device.

  First, in step 100, the control circuit 14 generates a memory control signal COM. The generated memory control signal COM is output to the memory via the phase adjustment circuit 11 (3), the buffer 17 (5), and the input / output terminal 18 (3) (S100). At this time, the phase adjustment circuit 11 (3) is set to a predetermined delay amount.

  Next, at step 110, the data strobe adjustment circuit 12 generates and outputs a response signal RES for the data strobe signal DQS input from the memory via the input / output terminal 18 (2) and the buffer 17 (4) (S110). ). FIG. 10A illustrates the waveform corresponding to the operations of Steps 100 and 110. FIG. However, in FIG. 10, it is assumed that the memory control signal COM is the chip select CS and signals other than the chip select CS are not generated near the change point of the chip select CS. Based on such a premise, in FIG. 10A, the change of the chip select CS becomes the change of the command as it is. The value of the response signal RES at this time is N.

  In FIG. 10A, the response signal RES is output at the fourth falling edge of the data strobe signal DQS. As described above, the response signal is output at the 4 × nth falling edge (n is a natural number). RES may be output, or the response signal RES may be output at the first rise of the data strobe signal DQS.

  Next, at step 120, the delay amount of the phase adjustment circuit 11 (3) is increased (S120). The delay amount of the phase adjustment circuit 11 (3) is increased by a command from a CPU disposed outside the memory control device 10 via, for example, the CPU • I / F 19. Note that the delay amount to be increased must be set shorter than the cycle of the clock CK.

  Next, at step 130, the control circuit 14 generates a memory control signal COM. The generated memory control signal COM is output to the memory via the phase adjustment circuit 11 (3), the buffer 17 (5), and the input / output terminal 18 (3) (S130).

  Next, at step 140, the data strobe adjustment circuit 12 generates and outputs a response signal RES for the data strobe signal DQS input from the memory via the input / output terminal 18 (2) and the buffer 17 (4) (S140). ). FIG. 10B illustrates a waveform corresponding to the operations in steps 120 to 140. The value of the response signal RES at this time is N.

  Next, in step 150, it is determined whether or not the value of the response signal RES in step 140 has changed from the value of the response signal RES in step 110 (S150). This determination is performed by a CPU disposed outside the memory control device 10 via, for example, the CPU / I / F 19.

  If it is not determined that the state has changed in step 150 (NO in FIG. 9), the process returns to step 120 and the above steps are repeated. In the example of FIGS. 10A and 10B, since the value (N) of the response signal RES has not changed, the process returns to step 120 and the above steps are repeated. Note that the value (N) of the response signal RES does not change in FIGS. 10 (1) and 10 (2) because the delay of the chip select CS changes in FIGS. 10 (1) and 10 (2). However, the chip select CS is latched at the rising edge of the clock CK at the same timing, and the data strobe signal DQS responds at the same timing.

  If it is determined in step 150 that it has changed (YES in FIG. 9), the process proceeds to step 160. In step 160, the delay amount of the phase adjustment circuit 11 (3) is fixed to a value shifted before or after the value when the value of the response signal RES changes. The value shifted before or after can be set to, for example, half of the time (one cycle of the clock CK) that the timing of outputting the response signal RES is delayed. Setting of the value shifted before or after or fixing of the delay amount of the phase adjustment circuit 11 (3) is performed by a command from a CPU arranged outside the memory control device 10 via, for example, the CPU • I / F 19.

  FIG. 10 (3) exemplifies waveforms corresponding to the operations in steps 150 (in the case of YES in FIG. 9) to 160. In FIG. 10 (3), since the chip select CS is latched at the rising edge of the clock CK after one cycle from FIGS. 10 (1) and 10 (2), the data strobe signal DQS is also delayed by one cycle. Is responding. In other words, the value of the response signal RES at this time is N + 1, which is larger than the value N of the previous response signal RES, so that it has been determined as “changed” in step 150.

  In step 160, the delay amount of the phase adjustment circuit 11 (3) is fixed to a value shifted before or after the value when the value of the response signal RES changes, for the following reason. That is, in the vicinity of the value when the value of the response signal RES changes (near the setting in FIG. 10 (3)), it can be determined that the chip select CS is near the changing point at the rising edge of the clock CK. It is difficult to ensure that the setup hold of the memory control signal COM and the clock CK is satisfied. By fixing the delay amount of the phase adjustment circuit 11 (3) to a value shifted before or after the value when the value of the response signal RES changes, a margin for the setup hold between the memory control signal COM and the clock CK. Can be expanded.

  As described above, since the value of the response signal RES can be read from the CPU, the optimum delay setting (previous value) is determined from the delay amount (delay setting value) of the phase adjustment circuit 11 (3) at the change point of the value of the response signal RES. (Or a value shifted later) can be fed back and set in the phase adjustment circuit 11 (3). If the timing of the chip select CS is assured in this way, the timing of other signals can be assured sequentially.

  FIG. 11 is a timing chart (No. 6) exemplified for explaining the operation of the memory control device. For example, consider the phase adjustment of 1 bit (A0) of the address after the chip select CS. As shown in FIG. 11, it is only necessary to hold the value of the memory control signal COM other than the address A0 for several cycles while the chip select CS is fixed and gradually move the delay setting of the address A0. Regarding the address bit, even if the data strobe monitoring circuit 12 monitors the data strobe signal DQS, a change point cannot be found. However, the change point of the address A0 can be found by finding the change point of the data DQ. The change point of the data DQ can be found by a predetermined method defined by the standard.

  As described above, according to the present embodiment, the relationship between the memory control signal and the clock can be easily grasped, and the margin for the setup hold between the memory control signal COM and the clock CK can be increased. Become.

  The preferred embodiment has been described in detail above. However, the present invention is not limited to the above-described embodiment, and various modifications and replacements are made to the above-described embodiment without departing from the scope described in the claims. Can be added.

  For example, the memory control device 10 shown in FIG. 4 is used by being connected to the CPU via the CPU / I / F 19. However, the memory control device according to the present invention is not limited to such a configuration. For example, the memory control device is not connected to an externally provided CPU, and the control circuit in the memory control device is optimized based on the delay amount (delay setting value) of the phase adjustment circuit at the change point of the value of the response signal RES. A function of feeding back the delay setting (value shifted before or after) may be provided. Further, a CPU may be built in the memory control device.

  The memory control device according to the present invention can be configured to be connected to a plurality of memories and memory modules.

DESCRIPTION OF SYMBOLS 10 Memory control apparatus 11 (1) -11 (3) Phase adjustment circuit 12 Data strobe monitoring circuit 13 Flip-flop 14 Control circuit 15 Signal control circuit 16 (1), 16 (2) Selection circuit 17 (1) -17 (7 ) Buffers 18 (1) to 18 (3) Input / output terminals 19 CPU / I / F

JP 2008-0667245 A JP 2007-226308 A JP 2005-141725 A

Claims (14)

A memory control device for writing data to a semiconductor storage device,
A phase adjustment circuit that delays a control signal for controlling the semiconductor memory device and outputs the delayed signal to the semiconductor memory device;
A data strobe signal input from the semiconductor memory device is monitored in response to the control signal, and a response signal corresponding to a response time from when the control signal is output to when the data strobe signal is input is output. A data strobe monitoring circuit, and
The delay amount of the phase adjustment circuit is a delay whose timing has changed when the control signal is output and the response signal is output to the semiconductor memory device while sequentially increasing the delay amount. A memory control device, wherein the memory control device is set to a value shifted before or after the quantity.   The memory control device according to claim 1, wherein the data strobe monitoring circuit outputs the response signal at a 4 × n-th (n is a natural number) falling timing of the data strobe signal.   2. The memory control device according to claim 1, wherein the data strobe monitoring circuit outputs the response signal at a first rising timing of the data strobe signal.   4. The memory control device according to claim 1, wherein the value shifted before or after corresponds to a half of a time when a timing at which the response signal is output changes. The response signal is configured to be output to a CPU disposed outside the memory control device,
5. The memory control device according to claim 1, wherein the value shifted before or after is configured to be set by the CPU. 6. When the phase adjustment of the predetermined control signal other than Ji Ppuserekuto signal, the advance control signal other than the chip select signal and the predetermined control signal to hold a predetermined time, moving the delay setting of the predetermined control signal The memory control device according to claim 1 , wherein the phase adjustment is performed by using the memory control device.   The memory control device according to claim 1, wherein the phase adjustment circuit includes a delay value generation circuit that generates a delay value based on a reference clock. A method for adjusting a control signal output timing of a memory control device for writing data to a semiconductor memory device,
A first step of outputting a control signal to the semiconductor memory device;
A data strobe signal input from the semiconductor memory device is monitored in response to the control signal, and a response signal corresponding to a response time from when the control signal is output to when the data strobe signal is input is output. The second step;
Outputting the control signal while sequentially increasing the delay amount to the semiconductor memory device, and monitoring the data strobe signal input from the semiconductor memory device in response to the control signal increasing the delay amount sequentially; A third step of sequentially outputting a response signal corresponding to a response time from when the control signal in which the delay amount is sequentially increased until the data strobe signal is input;
A fourth step of determining whether or not the timing of the response signal sequentially output in the third step has changed with respect to the timing of the response signal output in the second step;
In the fourth step, when it is determined that “changed”, the fifth step of setting the delay amount of the control signal to a value shifted before or after the delay amount when “changed”; A method for adjusting a control signal output timing of a memory control device including:   9. The method of adjusting a control signal output timing of a memory control device according to claim 8, wherein the response signal is output at a 4 × n-th (n is a natural number) falling timing of the data strobe signal.   9. The method of adjusting a control signal output timing of a memory control device according to claim 8, wherein the response signal is output at a first rising timing of the data strobe signal.   The control of the memory control device according to any one of claims 8 to 10, wherein the value shifted before or after corresponds to a half of a time when a timing at which the response signal is output changes. Signal output timing adjustment method. The response signal is output to a CPU disposed outside the memory control device,
12. The method of adjusting a control signal output timing of the memory control device according to claim 8, wherein the value shifted before or after is set by the CPU. When the phase adjustment of the predetermined control signal other than Ji Ppuserekuto signal, the advance control signal other than the chip select signal and the predetermined control signal to hold a predetermined time, moving the delay setting of the predetermined control signal The method of adjusting a control signal output timing of the memory control device according to claim 8 , further comprising a step of performing phase adjustment in step (a).   14. The adjustment of the control signal output timing of the memory control device according to claim 8, wherein the delay amount is set by a delay value generation circuit that generates a delay value based on a reference clock. Method.

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