JP5317200B2 - Slide pad film, slide pad, housing, information processing terminal, and manufacturing method of slide pad - Google Patents

Description

  The present invention relates to a slide pad film, a slide pad, a housing, an information processing terminal, and a slide pad manufacturing method.

  In recent years, with the progress of IT (Information Technology) technology, various information processing terminals have been developed, and a notebook personal computer is one of them. Some laptops have a touchpad. The touch pad includes a pointing area for inputting information, a left button corresponding to a mouse click button, and a right button.

  In general, when using this touchpad in addition to the keyboard and mouse, the user moves the pointer on the screen of the display unit or scrolls by touching and moving the finger to the pointing area. It has become. In addition, the user can click or double-click by tapping the pointing area or pressing the left button or the right button.

By the way, since this touchpad is smaller than a palm, when moving the pointer on the screen, it is necessary to move the finger back and forth several times. Especially, in recent years, a mini-notebook computer (also called a netbook) smaller in size than a laptop computer. Then, since the range in which the finger can be moved is small, there is room for improvement in operability.
Therefore, an information processing terminal having a slide pad with a touch pad spread laterally has been developed (see, for example, Patent Document 1).

  The invention described in Patent Document 1 relates to a “portable computer”, specifically, “a display assembly connected to a base assembly having a palm rest area arranged to support the palm of a user. And a touchpad disposed on the base assembly, the palm rest area being formed by the touchpad.

  According to the invention described in Japanese Patent Application Laid-Open No. H10-260260, the aspect of whether the sensor recognizes the position of the user's hand and whether to accept or reject the contact patch on the touchpad is at least partially It can be realized in.

Special table 2008-511077 gazette

By the way, in the invention described in Patent Document 1 described above, since the operation area is narrow, there is a problem that it is small and difficult to operate.
However, when trying to increase the width of the slide pad, the width of the information processing terminal could not be increased due to structural problems. This will be described below.

6 is an external view of a general information processing terminal equipped with a slide pad, and FIG. 7 is a sectional view taken along line VII-VII in FIG.
In FIG. 6, BD is an information processing terminal body, SP is a slide pad, 31 is a keyboard, and 32 is a display unit.
As shown in FIG. 7, the housing 13 has ribs 12 and bosses 14, and there is a portion where the slide pad 15 cannot be mounted or cannot be sensed even if it can be mounted. there were.

  Therefore, an object of the present invention is to provide a slide pad film, a slide pad, a housing, an information processing terminal, and a method for manufacturing the slide pad that can make the most of the area of the slide pad mounted on the information processing terminal. There is.

Slide pad film of the present invention, for being integrated by injection-molding a resin composed of a supporting substrate of a slide pad for inputting information to the information processing terminal, in a sliding pad film printed with at least the circuit pattern layer on the film The size of the resin is the size of the slide pad, the size of the slide pad film is larger than the slide pad, and the excess after the injection molding of the slide pad film with the resin is performed. The circuit pattern layer is bent so as to be exposed to form a terminal .

  According to the present invention, the area of the slide pad mounted on the information processing terminal can be reduced by integrating the resin serving as the support substrate of the slide pad and the slide pad film printed with at least the circuit pattern layer by injection molding. It can be used to the fullest.

[BRIEF DESCRIPTION OF THE DRAWINGS] It is an external view which shows one Embodiment of the information processing terminal using the slide pad based on this invention. (A) is sectional drawing which shows one Embodiment of the slide pad based on this invention, (b) is the Ib-Ib sectional view taken on the line of (a). It is explanatory drawing of insert molding. (A)-(e) is process drawing which shows one Embodiment of the manufacturing method of the slide pad which concerns on this invention. It is an example of the external view which shows other embodiment of the information processing terminal using the slide pad which concerns on this invention. It is an external view of a general information processing terminal equipped with a slide pad, It is the VII-VII sectional view taken on the line of FIG.

<Embodiment 1>
Next, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is an external view showing an embodiment of an information processing terminal using a slide pad according to the present invention.
In the information processing terminal shown in the figure, BD indicates an information processing terminal body, 31 indicates a keyboard, 32 indicates a display unit, and SP indicates a slide pad.
The slide pad SP has a pointing area that extends to the left end, right end, and front end (lower end in the figure) of the information processing terminal main body BD. That is, the pointing area is formed up to the corner of the information processing terminal main body BD.

2A is a cross-sectional view showing an embodiment of a slide pad according to the present invention, and FIG. 2B is a cross-sectional view taken along the line Ib-Ib in FIG.
The slide pads shown in FIGS. 2A and 2B are, for example, electrostatic capacity type slide pads for inputting information to the information processing terminal, and are used as a support substrate 11 for the slide pads and at least a circuit pattern. The slide pad film 10 on which the layer 20 is printed is integrated by injection molding (insert molding: IMF (Insert Mold Forming)).

Here, the slide pad film 10 is obtained by sequentially laminating a circuit pattern layer 20, a decorative layer (ink layer) 21, a film 22, a decorative layer (ink layer) 23, and a self-healing layer 24. Reference numeral 25 denotes an adhesive layer for bonding the support substrate 11 and the slide pad film 10 together.
The circuit pattern layer 20 is obtained by applying a silver paste by silk screen printing and applying a carbon electrode on the silver paste. Since the material bends freely, a touch sensor circuit can be created by curved surfaces or three-dimensional modeling.
Examples of the film 22 include PET (polyethylene terephthalate), PP (polypropylene), and PMMA (polymethyl methacrylate).

  As shown in FIG. 2A, the slide pad film 10 can be directly provided by being integrated with or bonded to the housing 13 as well as the support substrate 11 as well as the ribs 12 and the bosses 14. Since it is not affected, the area where the slide pad SP can be formed can be expanded as shown in FIG. 1, and the area of the slide pad mounted on the information processing terminal can be utilized to the maximum.

Here, the concept of manufacturing the slide pad according to the present invention will be described.
FIG. 3 is an explanatory diagram of insert molding.
First, a capacitive pad pattern is printed on a film (for example, a PET film having a thickness of 0.1 mm, but not limited) to prepare a slide pad film.
A member M that is integrated with the resin is disposed between the mold Ka and the mold Kb. The member M is sandwiched between the mold Ka and the mold Kb, and the mold resin P is injected from the gate from the outside. When the injection is completed and the mold Ma and the mold Mb are separated, a final product in which the member M and the resin P are integrated is obtained.
A slide pad is formed by using these slide pad films and insert molding.

4A to 4E are process diagrams showing an embodiment of a method for manufacturing a slide pad according to the present invention.
A film is prepared (not shown), and at least a circuit pattern layer is printed on the film (FIG. 4A).
The film (slide pad film) 10 on which at least the circuit pattern layer is printed and the resin 11 for the slide pad are integrated by injection molding (FIG. 4B).
The size of the resin 11 is the size of the slide pad, the size of the slide pad film 10 is larger than the slide pad, and the circuit pattern is cut off after surplus after the slide pad film 10 is injection molded with the resin 11. The layer is bent so that the layer is exposed to form a terminal (FIGS. 4C to 4E).
A slide pad is formed by these steps.

  The above-described embodiment shows an example of a preferred embodiment of the present invention, and the present invention is not limited thereto, and various modifications can be made without departing from the scope of the invention. is there.

<Embodiment 2>
FIG. 5 is an example of an external view showing another embodiment of the information processing terminal using the slide pad according to the present invention.
The difference between the information processing terminal shown in FIG. 5 and the information processing terminal shown in FIG. 1 is that the touch panel 40 is used for the display screen of the display unit 32.
Since the touch panel film and the resin are integrated with the display unit 32 of the information processing terminal by injection molding, the area of the touch panel 40 can be maximized without considering the ribs and bosses of the housing. , Operability is improved.

By the way, as a technique similar to the present invention, there is a device described in Japanese Utility Model Registration No. 3139922.
The present invention relates to an “in-mold molded touch module”. Specifically, “a transparent conductive mounting plate and a mold housing are provided, and the mounting plate has an inner surface and an outer surface. The inner surface is provided with a capacitance type electrode layer which is a touch sensor circuit made of indium tin oxide, and the outer surface is provided so as to be able to touch the sensor circuit. It is said that it is integrally coated and bonded to the end portion around the conductive mounting plate.

  According to this device, the method of making the touch mounting plate coated and bonded in the mold housing by in-mold injection reduces the thickness of the module, and is easy to implement on an injection molding machine with an art foot-in or foot-out arrangement. For this reason, the manufacturing process is simplified.

  However, the present invention can be freely arranged on the curved surface and corners compared to the technology described in this utility model registration No. 3139922 and can be reduced in price because it does not use rare metals such as indium. It is. In addition, since the film material is bent, the present invention has a special effect that the surface side can be coated on the circuit pattern layer at the same time by applying gravure printing to the surface of the circuit pattern layer. It is different from this device in that it plays.

  The present invention can be used for an information processing terminal such as a notebook computer or a desktop personal computer, a game machine, a slide pad or a touch panel such as a medical device.

DESCRIPTION OF SYMBOLS 10 Slide pad film 11 Support substrate 12 Rib 13 Case 14 Boss 15, SP Slide pad 20 Circuit pattern layer 21, 23 Decorating layer 24 Self-healing layer 25 Adhesive layer 31 Keyboard 32 Display part BD Information processing terminal main body

Claims (5)

For the support substrate of the sliding pad for inputting information to the information processing terminal the resin is integrated by injection molding, a scan for slide pad film printed with at least the circuit pattern layer on the film,
The size of the resin is the size of the slide pad, the size of the film for the slide pad is larger than the size of the slide pad, and the excess after the slide pad film is injection molded with the resin is used as the circuit pattern. A film for a slide pad, wherein the film is bent so that the layer is exposed to form a terminal. A resin as a supporting substrate of a slide pad for inputting information to the information processing terminal, and a slide pad film printed with at least the circuit pattern layer, a slide pad integrally by injection molding,
The size of the resin is the size of the slide pad, the size of the film for the slide pad is larger than the size of the slide pad, and the excess after the slide pad film is injection molded with the resin is used as the circuit pattern. A slide pad, wherein the terminal is folded so that the layer is exposed . A housing of an information processing terminal integrated by injection molding with a film for a slide pad on which a circuit pattern layer is printed on a film ,
The size of the resin serving as the support substrate of the slide pad is the size of the slide pad, the size of the slide pad film is larger than the slide pad, and after the slide pad film is injection molded with the resin And a terminal is formed by bending the excess part of the circuit pattern layer so that the circuit pattern layer is exposed . A resin as a supporting substrate of a slide pad for inputting information, and a slide pad film printed with at least the circuit pattern layer, an information processing terminal that is integrated by injection molding,
The size of the resin is the size of the slide pad, the size of the film for the slide pad is larger than the size of the slide pad, and the excess after the slide pad film is injection molded with the resin is used as the circuit pattern. An information processing terminal, wherein the terminal is folded so that the layer is exposed . Preparing a slide pad films, integrated by at least a step of printing a circuit pattern layer, injection molding resin of at least the circuit pattern layer is a film and a slide pad slide pad printed on the film for the sliding pad a method of manufacturing a slide pad having a step,
The size of the resin serving as the support substrate of the slide pad is the size of the slide pad, the size of the slide pad film is larger than the slide pad, and after the slide pad film is injection molded with the resin A method of manufacturing a slide pad, comprising the step of bending the surplus portion of the circuit pattern layer so that the circuit pattern layer is exposed to form a terminal .

Images