JP5306239B2 - Solid electrolytic capacitor - Google Patents

Description

  The present invention relates to a solid electrolytic capacitor. Specifically, the present invention relates to a high-capacity solid electrolytic capacitor excellent in mass productivity that hardly increases leakage current even when subjected to heat shock caused by soldering heat.

  The solid electrolytic capacitor is a solid electrolytic capacitor element sealed with a resin or the like. This solid electrolytic capacitor element usually has a structure in which an anode body, a dielectric layer, a semiconductor layer, and a conductor layer are laminated in this order. The anode body is formed of, for example, a porous body obtained by molding and sintering a valve action metal powder. And a dielectric material layer is comprised by the dielectric material film obtained by anodizing the surface of this porous body, for example. The anode lead is connected to the anode body in a state where electricity can be passed, and the anode lead is exposed to the outside of the exterior of the solid electrolytic capacitor and becomes an anode terminal. On the other hand, a cathode is formed by a conductor layer laminated on the semiconductor layer, and the cathode lead is connected to the cathode in a state where electricity can be passed, and the cathode lead is exposed to the outside of the exterior of the solid electrolytic capacitor and exposed to the cathode. It becomes a terminal.

  By the way, a solid electrolytic capacitor having a high capacity and excellent high frequency characteristics, in which a plurality of solid electrolytic capacitor elements are mounted in parallel on a lead frame having a pair of opposing lead portions extending toward the inside of the frame. And proposed in Patent Document 1. In this solid electrolytic capacitor, a plurality of solid electrolytic capacitor elements are arranged so as to be adjacent in parallel. In this solid electrolytic capacitor, a gap is inevitably generated between the solid electrolytic capacitor elements even if the solid electrolytic capacitor elements are arranged adjacent to each other. This is because industrially produced solid electrolytic capacitor elements have a small variation in surface irregularities that cannot be overlooked.

  Patent Document 2 proposes to provide a fixed layer that straddles a plurality of solid electrolytic capacitor elements placed so as to be adjacent in parallel. If this fixed layer is provided so as to straddle between the solid electrolytic capacitor elements, it is possible to prevent the resin sealing material when the solid electrolytic capacitor elements are sealed from flowing into the gap. As a result, a chip-shaped solid electrolytic capacitor having a low equivalent series resistance and a low leakage current can be obtained.

  On the other hand, in Patent Document 3, the solid electrolytic capacitor elements are not arranged so as to be adjacent to each other, but the solid electrolytic capacitor elements are intentionally arranged with a wide gap intentionally, and the resin sealing material is positively disposed in the gap. A solid electrolytic capacitor intended to flow is disclosed. In Patent Document 3, ESR (equivalent series resistance) is used in a durability test in which a resin sealing material that has been actively poured serves as a cushion and is left in an environment maintained at a temperature of 60 ° C. and a relative humidity of 90 to 95% for a long time. ) And LC (leakage current) can be prevented.

Prior art documents

Japanese Patent Laid-Open No. 05-234829 JP 2005-93994 A JP 2006-310809 A

However, when mass production of the solid electrolytic capacitors disclosed in Patent Documents 1 to 3 is carried out using industrially produced solid electrolytic capacitor elements, heat shock caused by soldering heat during mounting (rapid temperature rise and fall) ), Etc., the leakage current increased frequently. Further, the solid electrolytic capacitor disclosed in Patent Document 3 has a difficulty in increasing the capacity per volume because the volume of the sealing material used is increased.
An object of the present invention is to provide a high-capacity solid electrolytic capacitor excellent in mass productivity that hardly increases leakage current even when subjected to heat shock or the like due to solder heat.

  As a result of diligent investigations to achieve the above object, the present inventor inevitably generates gaps between adjacent solid electrolytic capacitor elements (that is, due to uneven surface irregularities of the solid electrolytic capacitor elements even if they are arranged in close contact with each other). Resin paste is filled in the gap) using capillary action, etc., and air is expelled from the gap between the solid electrolytic capacitor elements. It has been found that a large-capacity solid electrolytic capacitor with little increase in leakage current (LC) can be stably produced in large quantities even when subjected to a heat shock caused by. The present invention has been completed by further studies based on this finding.

That is, the present invention includes the following.
[1] A pair of an anode lead and a cathode lead facing each other at a distance,
A solid electrolytic capacitor comprising two or more solid electrolytic capacitor elements having an anode body and a cathode, and a sealing material for sealing the anode lead, the cathode lead and the solid electrolytic capacitor element,
The anode body includes a sintered body,
Two or more solid electrolytic capacitor elements are arranged to be adjacent in parallel,
The anode body of the element is connected to the tip of the anode lead so as to be energized, and the cathode of the element is connected to the tip of the cathode lead so as to be energized,
A solid electrolytic capacitor in which a gap between adjacent solid electrolytic capacitor elements is such that the air ratio is 60% by volume or less.

[2] The solid electrolytic capacitor according to [1], wherein the surface of the tip of the anode lead to which the anode body is connected and the surface of the tip of the cathode lead to which the cathode is connected are substantially parallel.
[3] The solid electrolytic capacitor according to [1] or [2], wherein a resin is filled in a gap between adjacent solid electrolytic capacitor elements.
[4] The solid electrolytic capacitor according to [1] or [2], wherein an oily substance is filled in a gap between adjacent solid electrolytic capacitor elements.
[5] The solid electrolytic capacitor according to any one of [1] to [4], wherein the solid electrolytic capacitor element is formed by laminating an anode body, a dielectric layer, a semiconductor layer, and a conductor layer in this order. Capacitor.
[6] The solid electrolytic capacitor according to any one of [1] to [5], wherein the anode body includes a sintered body of a metal material having a valve action.
[7] The solid electrolytic capacitor according to [6], wherein the metal material having a valve action is at least one material selected from the group consisting of aluminum, tantalum, niobium, titanium, zirconium and alloys containing any of them. .

[8] Arranging two or more solid electrolytic capacitor elements having an anode body and a cathode so as to be adjacent in parallel;
The cathode lead of the solid electrolytic capacitor element is connected to the cathode lead, and the anode body of the solid electrolytic capacitor element is connected to the anode lead so that energization is possible, and the air ratio in the gap between adjacent solid electrolytic capacitor elements is 60% by volume or less. A solid including filling the gap with a resin or an oily substance to expel the air in the gap, and then sealing the anode lead, the cathode lead, and the solid electrolytic capacitor element with a sealing material Manufacturing method of electrolytic capacitor.
[9] The method for producing a solid electrolytic capacitor according to [8], wherein the resin or oily substance is liquid.
[10] The method for producing a solid electrolytic capacitor according to [8] or [9], wherein a resin or an oily substance is sucked into the gap using a capillary phenomenon.

According to the present invention, a high-capacity chip-type solid electrolytic capacitor that hardly increases leakage current even when subjected to heat shock due to soldering heat, etc., even when using solid electrolytic capacitor elements that are industrially produced in large quantities, It can be provided stably in large quantities.
The reason why it is difficult to increase the leakage current after mounting the solid electrolytic capacitor by setting the ratio of the air in the gap between the adjacent solid electrolytic capacitor elements to 60 volume% or less, preferably 50 volume% or less is not clear. However, it is considered as follows.
If transfer molding is performed with air remaining in the gap, it is considered that the molten resin sealing material does not enter all the gaps between the solid electrolytic capacitor elements, and there is a possibility that gaps may remain in the gaps. In addition, it is considered that the gap remaining in the transfer molding occurs even when the gap is provided as wide as about 0.3 mm as described in Patent Document 3. The air remaining in the gap repeats rapid expansion and cooling due to soldering heat during mounting. It is presumed that the stress generated at that time is applied to the dielectric layer of the solid electrolytic capacitor element to cause deterioration of the dielectric layer, and as a result, the leakage current increases after mounting.
If the air in the gap is expelled to a specific ratio according to the present invention, it is assumed that the stress due to the rapid expansion and contraction of air is not applied to the dielectric layer, so that an increase in leakage current will be suppressed.

It is a conceptual diagram which shows the inside of the solid electrolytic capacitor of this invention. It is a figure for demonstrating the clearance gap between adjacent solid electrolytic capacitor elements.

BEST MODE FOR CARRYING OUT THE INVENTION

The present invention will be described in detail below.
The solid electrolytic capacitor of the present invention includes a pair of anode leads 5 and cathode leads 3 facing each other, two or more solid electrolytic capacitor elements 1 having an anode body and a cathode, and anode leads, cathode leads, and solid electrolytic capacitor elements. It contains the sealing material for sealing.

(Solid electrolytic capacitor element)
The solid electrolytic capacitor element used in the present invention is not particularly limited as long as the anode body includes a sintered body. A preferable solid electrolytic capacitor element has a structure in which an anode body, a dielectric layer, a semiconductor layer, and a conductor layer are laminated in this order.

(Anode body)
The anode body of the solid electrolytic capacitor element 1 includes a sintered body. The sintered body is preferably a sintered body of a metal material having a valve action. Examples of the metal material having a valve action include aluminum, tantalum, niobium, titanium, zirconium, and alloys containing any of them. The sintered body is preferably porous. In order to facilitate connection with the anode lead described later, the lead wire 4 may be drawn out of the anode body from the anode body. The size of the anode body can be appropriately selected according to the required size of the solid electrolytic capacitor.

(Dielectric layer, semiconductor layer, conductor layer)
In the solid electrolytic capacitor element, a dielectric layer is laminated on the surface of the anode body. The dielectric layer is usually formed by subjecting the surface of the anode body to chemical conversion treatment.
The semiconductor layer of the solid electrolytic capacitor element is composed of an organic semiconductor or an inorganic semiconductor.
The solid electrolytic capacitor element is preferably one in which one or more conductor layers are laminated on a semiconductor layer.
Examples of the conductor layer include a conductive carbon layer and a conductive metal layer. The conductor layer is preferably a laminate of a conductive carbon layer and a conductive metal layer. Further, the conductor layer in contact with the semiconductor layer is preferably a conductive carbon layer.

  In the solid electrolytic capacitor of the present invention, two or more solid electrolytic capacitor elements are used, and are arranged so as to be adjacent in parallel. Note that “adjacent” means contacting next to each other.

  There is a gap AG between adjacent solid electrolytic capacitor elements. Even if the solid electrolytic capacitor elements are arranged adjacent to each other, the gap is inevitably generated due to variations in surface irregularities of the elements. In order to facilitate the understanding of this gap, description will be made with reference to a drawing (FIG. 2) simply drawn with emphasis on the surface irregularities. As shown in FIG. 2, for example, when two solid electrolytic capacitor elements 1 swell like a barrel, when the elements are arranged adjacent to each other in parallel, the most swelled surfaces of the elements are They touch each other, but the other surfaces cannot touch each other. For this reason, even if the solid electrolytic capacitor elements are arranged adjacent to each other, a gap AG is inevitably generated between the elements. The gap is preferably at most 0.5 mm.

The gap between adjacent solid electrolytic capacitor elements is such that the ratio of air is 60% by volume or less, preferably 50% by volume or less, and more preferably 41% by volume or less. As a method for reducing the ratio of air, there is a method in which a gap between adjacent solid electrolytic capacitor elements is filled with a resin or an oily substance to expel air.
In addition, the ratio of the air in this invention is the value which represented the ratio of the air volume with respect to the clearance volume between the solid electrolytic capacitor elements before filling resin etc. which are mentioned later with a percentage.
The average volume of the gap before being filled with resin or the like is, for example, by using a plurality of adjacent capacitor elements (for example, 100 sets) manufactured in the same manner as the capacitor element, and the gap between the capacitor elements is liquid. It is obtained by measuring the mass of the filled liquid and calculating the average of its volume. The liquid used for volume measurement is not particularly limited as long as it is a liquid that easily penetrates into the gap by capillary action and is held in the gap, such as ethylene glycol.

  The resin used to expel air is not particularly limited, and for example, insulating resins such as alkyd resin, acrylic resin, epoxy resin, phenol resin, imide resin, fluororesin, ester resin, imidoamide resin, amide resin, styrene resin Is mentioned. Examples of the oily substance include wax, grease, and oil. Resins or oily substances include various solvents and conductive powders (silver, copper, aluminum, gold, carbon, nickel, conductive polymer powders and powders of alloys containing these metals as a main component and powders thereof) However, it is necessary to devise measures to prevent the filling resin or oily material from turning to the anode and causing a short circuit by adding conductive powder, which increases costs, so use only with insulating resin or oily material. Is preferred.

  The resin or oily substance used to expel air is preferably one that is liquid when the air is expelled. A liquid having such a fluidity that it can be sucked into the gap using the capillary phenomenon is particularly preferable. In order to expel air from the gap using a resin or oily substance, a method of sucking in the resin or oily substance by depressurizing the atmosphere around the solid electrolytic capacitor element, or a method of pressurizing and pushing in the resin or oily substance can be adopted. However, it should be noted that an undesired force may be applied to the solid electrolytic capacitor element due to reduced pressure or increased pressure.

The anode lead of the solid electrolytic capacitor element to be sealed is connected in a state where an anode lead can be energized, and the anode lead is exposed to the outside of the exterior of the solid electrolytic capacitor and becomes an anode terminal.
On the other hand, the conductor layer laminated on the semiconductor layer becomes the cathode. The cathode lead is connected to the cathode in a state where electricity can be passed, and the cathode lead is exposed to the outside of the exterior of the solid electrolytic capacitor to become a cathode terminal.

(Anode lead and cathode lead)
For the anode lead and cathode lead, a part of the lead frame and the solid electrolytic capacitor element are sealed to form an exterior by a method as described later, and then the frame portion of the lead frame protruding outside the exterior is cut off. It is a lead part obtained by doing. The unsealed portions of the anode lead and the cathode lead serve as external terminals of the solid electrolytic capacitor. The unsealed portions of the anode lead and the cathode lead can be bent.

The lead frame used in the production of the solid electrolytic capacitor of the present invention is appropriately selected from known ones used in the production of solid electrolytic capacitors.
The shape of the lead frame is a foil or a flat plate, and there are a pair of opposing lead portions facing the inside of the frame, and there is a gap between the tips of the lead portions. As the material of the lead frame, iron, copper, aluminum, or an alloy mainly composed of these metals is used. A part or the whole of the lead frame may be plated with solder, tin, titanium, gold, silver or the like. There may be a base plating such as nickel, palladium or copper between the lead frame and the plating.

  The lead frame can be subjected to the various types of plating after the cutting and bending process or before the process. Further, plating can be performed before the solid electrolytic capacitor element is placed and connected, and re-plating can be performed at any time after sealing.

(Encapsulant)
The sealing material for sealing the anode lead, the cathode lead, and the solid electrolytic capacitor element is not particularly limited. For example, resin, a metal case, a resin case, a resin film, etc. are mentioned. Of these, resins are preferred. For example, an epoxy resin, a phenol resin, an alkyd resin, etc. are mentioned. It is preferable to use a low-stress resin as the sealing resin because the generation of stress on the solid electrolytic capacitor element that occurs during sealing can be reduced. Also, a transfer machine is preferably used as a manufacturing machine for resin sealing. Silica particles and the like may be blended in the resin used for the exterior.

The solid electrolytic capacitor of the present invention can be obtained, for example, as follows.
One lead portion of a lead frame in which two or more solid electrolytic capacitor elements are arranged so as to be adjacent in parallel in the same direction, and a part of each solid electrolytic capacitor element in which a conductor layer is formed is separately prepared ( A part of the anode body (lead wire if the anode body has a lead wire. In this case, the tip of the lead wire may be cut to match the dimensions). .) Is placed on the tip of the other lead part (anode lead) of the lead frame, for example, the former is solidified by conductive metal paste and the latter is joined electrically and mechanically by welding.

  Fill the gaps between the solid electrolytic capacitor elements with resin or oily substance, and expel air from the gaps. The ratio of the air in the gap is reduced to 60% by volume or less, preferably 50% by volume or less, by this air purge. Next, the solid electrolytic capacitor element is sealed with a sealing material, leaving the frame portion of the lead frame and a part of the lead portion. Cut the lead frame outside the encapsulant and bend the remaining lead (Lead frame is on the bottom of the seal, leaving only the bottom or bottom and sides of the lead frame. If it is sealed, it may be cut only).

  The sealing method is not particularly limited. Examples include a resin mold exterior, a resin case exterior, a metal case exterior, a resin dipping exterior, and a laminate film exterior. Among these, a resin mold exterior is preferable because it can be easily reduced in size and cost.

The solid electrolytic capacitor thus produced may be aged. By this aging, it is possible to repair the dielectric layer subjected to thermal and / or mechanical load in the manufacturing process. The aging method is performed by applying a predetermined voltage (usually within twice the rated voltage) to the solid electrolytic capacitor.
The optimum value of the aging time and temperature is determined in advance by experiments because the optimum value varies depending on the size, capacity, and rated voltage of the solid electrolytic capacitor. The aging time is usually several minutes to several days, and the aging temperature is usually 300 ° C. or less in consideration of thermal degradation of the voltage application jig.

Aging may be performed in air or in a gas such as argon, nitrogen, helium, or the like. Moreover, although it may be performed under any conditions of reduced pressure, normal pressure, and increased pressure, stabilization of the dielectric layer may progress if aging is performed while supplying water vapor or after supplying water vapor. It is also possible to perform the aging by leaving the water vapor at a high temperature of 150 to 250 [deg.] C. for several minutes to several hours to remove excess water.
As a voltage application method in aging, it can be designed to flow an arbitrary current such as a direct current, an alternating current (having an arbitrary waveform), an alternating current superimposed on the direct current, or a pulse current. It is also possible to stop the voltage application once during the aging and apply the voltage again.

The solid electrolytic capacitor of the present invention can be preferably used for a circuit that requires a high-capacity capacitor such as a CPU or a power supply circuit. These circuits can be used for various digital devices such as personal computers, servers, cameras, game machines, DVD devices, AV devices, mobile phones, and electronic devices such as various power sources.
Since the solid electrolytic capacitor of the present invention has a good ESR value, it is possible to obtain an electronic circuit and an electronic device with good high-speed response by mounting the solid electrolytic capacitor.

  Examples of the present invention will be shown to describe the present invention more specifically. These are merely examples for explaining the present invention, and the present invention is not limited by these. “%” Is based on mass unless otherwise specified.

Examples 1-9, Comparative Examples 1-4
Solid electrolytic capacitor element (the anode body is a sintered body of CV 150,000 μF · V / g tantalum powder, the dielectric layer is a chemical conversion treatment of the surface of the sintered body, the semiconductor layer is polyethylene dioxythiophene, the conductor layer The conductive carbon layer and the silver paste layer are laminated in this order.The average size of the element is 4.51 mm × 1.61 mm × 1.12 mm.) Two pieces are 4.51 mm × 1.12 mm With silver paste so that the surfaces face each other in parallel in the same direction and the 4.51 mm x 1.61 mm surface faces the cathode lead surface (length 4.58 mm, width 3.4 mm) of the lead frame prepared separately Connected. The lead wire pulled out from the anode body was welded to the anode lead surface of the lead frame. As a result, two capacitor elements were placed adjacent to each other in parallel at a portion of the lead frame having a width of 3.4 mm.

  A gap is unavoidably present between adjacent solid electrolytic capacitor elements due to uneven surface irregularities. The clearance gap between 100 sets of adjacent solid electrolytic capacitor elements manufactured by the above method was 0.42 mm at the maximum and 0.05 mm at the minimum.

The resin shown in Table 1 was filled in the gaps between the solid electrolytic capacitor elements, and air was expelled.
The gap was occupied by the resin having the filling rate shown in Table 1, and air remained in the remainder of the gap. In addition, the filling rate and air ratio in Table 1 are average values in 100 sets of adjacent solid electrolytic capacitor elements manufactured by the above method.

  The resin shown in Table 1 is a liquid when filling between the solid electrolytic capacitor elements, and the resin droplets are sucked into the gap simply by bringing the resin droplets into contact with the gap between the solid electrolytic capacitor elements. It was.

  A chip-type solid electrolytic capacitor called a V size having a size of 7.3 mm × 4.3 mm × 1.8 mm was obtained by transfer molding with an epoxy resin sealing material. Further, aging was performed to obtain a product having a rated voltage of 2.5 V and a capacity of 1000 μF. LC value average before mounting test for 100 products (in the table, “product LC value average”) and LC value average after mounting test (in the table, “mounting LC value average”) Are shown in Table 1.

Examples 10-19, Comparative Examples 5-8
Solid electrolytic capacitor element (the anode body is a sintered body of CV 70,000 μF · V / g tantalum powder, the dielectric layer is obtained by chemical conversion of the surface of the sintered body, the semiconductor layer is polypyrrole, and the conductor layer is known) Conductive carbon layer and silver paste layer (average element size is 4.53mm x 1.63mm x 1.08mm) 3 pieces 4.53mm x 1.63mm face to face in parallel in the same direction In addition, the paste was connected with a silver paste so that the 4.53 mm × 1.08 mm surface was opposed to the cathode lead surface (length 4.58 mm, width 3.4 mm) of the lead frame separately prepared. The lead wire pulled out from the anode body was welded to the anode lead surface of the lead frame. As a result, three capacitor elements were placed adjacent to each other in parallel in the portion of the lead frame having a width of 3.4 mm (see FIG. 1).

  A gap is unavoidably present between adjacent solid electrolytic capacitor elements due to uneven surface irregularities (in FIG. 1, the solid electrolytic capacitor elements are wider than actual in order to emphasize the existence of the gap. It is drawn like this.) The gap between the 100 sets of adjacent solid electrolytic capacitor elements manufactured by the above method was 0.23 mm at the maximum and 0.04 mm at the minimum.

The resin shown in Table 2 was filled in the gaps between the solid electrolytic capacitor elements, and air was expelled.
The gap was occupied by the resin having the filling rate shown in Table 2, and air remained in the remainder of the gap. In addition, the filling rate and air ratio in Table 2 are average values in 100 sets of adjacent solid electrolytic capacitor elements manufactured by the above method.

  The resin shown in Table 2 is a liquid when filled between the solid electrolytic capacitor elements, and the resin droplets are sucked into the gaps by simply bringing the resin droplets into contact with the gaps between the solid electrolytic capacitor elements. It was.

  A chip type solid electrolytic capacitor called size D having a size of 7.3 mm × 4.3 mm × 2.8 mm was obtained by transfer molding with an epoxy resin sealing material. Further, aging was performed to obtain a product having a rated voltage of 2.5 V and a capacity of 680 μF. LC value average before mounting test for 100 products (in the table, “product LC value average”) and LC value average after mounting test (in the table, “mounting LC value average”) Is shown in Table 2.

The mounting tests conducted in Examples 1 to 19 and Comparative Examples 1 to 8 are as follows.
First, the leakage current (LC) value of the solid electrolytic capacitor was measured. The solid electrolytic capacitor was passed through a reflow furnace at a peak temperature of 260 ° C. for 5 seconds (at 230 ° C. or higher for 30 seconds) three times in total, and abrupt heating and cooling were performed. The leakage current (LC) value of the solid electrolytic capacitor after passing through the reflow furnace three times was measured. The LC value was measured under the condition of applying a voltage of 2.5 V for 30 seconds at room temperature.
The filling rate of the resin filled in the gaps between the solid electrolytic capacitor elements was obtained by calculation from the size of the gaps, the density of each resin, and the mass difference before and after the resin filling.

  From the results of Tables 1 and 2, the solid electrolytic capacitor (Example) in which the air ratio in the gap between adjacent solid electrolytic capacitor elements was 60% by volume or less was subjected to heat shock or the like due to solder heat. However, it can be seen that there is almost no increase in leakage current, in particular, the solid electrolytic capacitor that is made to be 50% by volume or less rather reduces the leakage current. On the other hand, it can be seen that a solid electrolytic capacitor (comparative example) in which the air ratio in the gap between adjacent solid electrolytic capacitor elements is not less than 60% by volume has a large leakage current due to heat shock caused by solder heat.

  According to the solid electrolytic capacitor of the present invention, according to the manufacturing method of the present invention, a gap between adjacent solid electrolytic capacitor elements is filled with a resin or an oily substance to expel air in the gap, and then a sealing material is used. It can be easily obtained by sealing the anode lead, the cathode lead, and the solid electrolytic capacitor element. In the production method of the present invention, it is particularly preferable to employ a method in which a resin or an oily substance is sucked into the gap by utilizing a capillary phenomenon when air is expelled.

Explanation of symbols

1: Solid electrolytic capacitor element 2: Resin filled in gap between elements 3: Cathode lead 4: Lead wire drawn out from anode body 5: Anode lead 6: Welded portion 7: Silver paste AG: Between adjacent elements Gap

Claims (10)

A pair of anode and cathode leads facing away from each other;
A solid electrolytic capacitor comprising two or more solid electrolytic capacitor elements having an anode body and a cathode, and a sealing material for sealing the anode lead, the cathode lead and the solid electrolytic capacitor element,
The anode body includes a sintered body,
Two or more solid electrolytic capacitor elements are arranged to be adjacent in parallel,
The anode body of the element is connected to the tip of the anode lead so as to be energized, and the cathode of the element is connected to the tip of the cathode lead so as to be energized,
A solid electrolytic capacitor in which a gap between adjacent solid electrolytic capacitor elements is such that the air ratio is 60% by volume or less. And the surface of the tip portion of the anode lead anode body is connected, the surface of the tip portion of the cathode lead cathode connected a line flat, solid electrolytic capacitor according to claim 1.
  The solid electrolytic capacitor according to claim 1 or 2, wherein a resin is filled in a gap between adjacent solid electrolytic capacitor elements.   The solid electrolytic capacitor according to claim 1, wherein an oily substance is filled in a gap between adjacent solid electrolytic capacitor elements.   The solid electrolytic capacitor according to any one of claims 1 to 4, wherein the solid electrolytic capacitor element is formed by laminating an anode body, a dielectric layer, a semiconductor layer, and a conductor layer in this order.   The solid electrolytic capacitor according to claim 1, wherein the anode body includes a sintered body of a metal material having a valve action.   The solid electrolytic capacitor according to claim 6, wherein the metal material having a valve action is at least one material selected from the group consisting of aluminum, tantalum, niobium, titanium, zirconium, and an alloy containing any of them. Disposing two or more solid electrolytic capacitor elements having an anode body and a cathode so as to be adjacent in parallel;
The cathode lead of the solid electrolytic capacitor element is connected to the cathode lead, and the anode body of the solid electrolytic capacitor element is connected to the anode lead so that energization is possible, and the air ratio in the gap between adjacent solid electrolytic capacitor elements is 60% by volume or less. A solid including filling the gap with a resin or an oily substance to expel the air in the gap, and then sealing the anode lead, the cathode lead, and the solid electrolytic capacitor element with a sealing material Manufacturing method of electrolytic capacitor.   The method for producing a solid electrolytic capacitor according to claim 8, wherein the resin or oily substance is liquid.   The method for producing a solid electrolytic capacitor according to claim 8 or 9, wherein a resin or an oily substance is sucked into the gap using a capillary phenomenon.

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