JP5289218B2 - Manufacturing method of ceramic sintered body - Google Patents
Manufacturing method of ceramic sintered body Download PDFInfo
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- JP5289218B2 JP5289218B2 JP2009155831A JP2009155831A JP5289218B2 JP 5289218 B2 JP5289218 B2 JP 5289218B2 JP 2009155831 A JP2009155831 A JP 2009155831A JP 2009155831 A JP2009155831 A JP 2009155831A JP 5289218 B2 JP5289218 B2 JP 5289218B2
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本発明は、セラミックスの未焼結の成形体同士を突合せて接合体とした後に、焼結して一体化させるセラミックス焼結体の製造方法に関する。 The present invention relates to a method for manufacturing a ceramic sintered body in which ceramic unsintered compacts are brought into contact with each other to form a joined body, and then sintered and integrated.
従来、セラミックスの接合技術が提案されてきたが、近年の液晶パネルの大型化に伴いそれを製造する装置に用いられるセラミックス部品も大型化してきており、大型化に適用可能な接合技術が注目されている。接合技術を用いれば、大型であっても中空構造にできるので軽量化することも可能である。接合技術としては、次のようなものが開示されている。 Conventionally, ceramic bonding technology has been proposed, but with the recent increase in size of liquid crystal panels, ceramic parts used in equipment for manufacturing the liquid crystal panel have also increased in size. ing. If a joining technique is used, it is possible to reduce the weight because a hollow structure can be obtained even if it is large. The following is disclosed as a joining technique.
例えば、特許文献1には、セラミック部材の生成形体を複数形成し、この複数の生成形体を、生成形体と同一原料から成る泥漿物で接着し、その後前記複数の生成形体を焼結させるセラミック部材の接合方法において、前記複数の生成形体に水を含浸させた後、この生成形体と同一原料から成る泥漿物で接着することを特徴とするセラミック部材の接合方法が開示されている。 For example, Patent Document 1 discloses a ceramic member in which a plurality of generation shapes of ceramic members are formed, the plurality of generation shapes are bonded with a slurry made of the same raw material as the generation shapes, and then the plurality of generation shapes are sintered. In this joining method, there is disclosed a joining method for ceramic members, characterized in that the plurality of generated shapes are impregnated with water and then adhered with a slurry made of the same raw material as the generated shapes.
また、特許文献2には、セラミック粉末とバインダとを含む混練物を所定形状に成形して得られる基板成形体の表面に、前記バインダを溶解又は膨潤させる性質を有した粘着誘起液体を塗布することにより粘着層を形成する粘着層形成工程と、その状態で該表面に被接合物を接触させることにより、前記基板成形体と前記被接合物とを前記粘着層を介して接合して接合体を形成する接合工程と、前記粘着誘起液体の塗布に先立って、前記基板成形体の表面のうち前記被接合体との間に接合を生じさせたくない部分には、前記粘着誘起液体に対して不溶性又は難溶性の材料で構成された接合阻止層を予め形成する接合阻止層形成工程と、前記接合体を焼成する焼成工程とを含み、前記基板成形体表面の、前記接合阻止層の形成部分においては、前記バインダと前記粘着誘起液体との接触を該接合阻止層により阻止することにより、前記粘着層が形成されないようにしたことを特徴とするセラミック構造体の製造方法が開示されている。 In Patent Document 2, an adhesion-inducing liquid having a property of dissolving or swelling the binder is applied to the surface of a substrate molded body obtained by molding a kneaded material containing ceramic powder and a binder into a predetermined shape. A pressure-sensitive adhesive layer forming step for forming a pressure-sensitive adhesive layer, and bringing the object to be bonded into contact with the surface in that state, thereby bonding the substrate molded body and the material to be bonded to each other via the pressure-sensitive adhesive layer. Prior to the application of the adhesion-inducing liquid, a portion of the surface of the substrate molded body that is not desired to be bonded to the object to be bonded is applied to the adhesion-inducing liquid. A bonding blocking layer forming step for forming a bonding blocking layer made of an insoluble or hardly soluble material in advance; and a firing step for baking the bonded body. In By blocked by the bonding blocking layer serial and binder contact with the adhesive-induced liquid, method for manufacturing a ceramic structure, characterized in that as the adhesive layer is not formed is disclosed.
しかしながら、特許文献1に記載された発明のように、成形体と成形体とを泥漿物を介して接着する方法では、乾燥及び焼結の際に成形体と泥漿物との収縮率の違いによって接着不良を起こし、焼結体に隙間ができることがあった。 However, as in the invention described in Patent Document 1, in the method of bonding a molded body and a molded body via a slurry, due to the difference in shrinkage between the molded body and the slurry during drying and sintering. In some cases, adhesion failure occurred, and a gap was formed in the sintered body.
また、特許文献2に記載された発明では、バインダの溶解又は膨潤によって生じる粘着層が、上記の泥漿物と同様に接着不良を招き、焼結体に隙間を生じさせるおそれがあった。 Moreover, in the invention described in Patent Document 2, the adhesive layer produced by the dissolution or swelling of the binder may cause adhesion failure similarly to the above-mentioned mud, and may cause a gap in the sintered body.
本発明は、これらの問題に鑑みてなされたものであり、未焼結のセラミックス成形体の接合体を焼結一体化する方法において、接合部に隙間を有しないセラミックス焼結体の製造方法を提供するものである。 The present invention has been made in view of these problems, and in a method for sintering and integrating a joined body of an unsintered ceramic molded body, a method for producing a ceramic sintered body having no gap in a joint portion is provided. It is to provide.
本発明は、これらの問題を解決するため、以下に示す(1)〜(6)の発明を提供する。
(1)セラミックス粉末とバインダとを含むセラミックス成形体を用意する工程と、
前記セラミックス成形体の接合面に、水のみを含ませてセラミックス粉末及びバインダを分散させて分散層を形成する工程と、
前記分散層が形成された接合面同士を突合せて未焼結の接合体を得る工程と、
前記未焼結の接合体を焼結して一体化する工程と、
を含み、
前記セラミックス成形体の接合面には、凹凸が形成されており、凹凸の高さが5〜100μmであって、凹凸の間隔が0.05〜1.0mmであり、
前記セラミックス成形体は、前記セラミックス粉末を50.3〜94.7体積%、分散剤を0.8〜7.5体積%、前記バインダを3.8〜17.4体積%、水分を0.8〜24.8体積%含むセラミックス焼結体の製造方法。
(2)前記未焼結の接合体を得る工程は、前記分散層の一部を接合面から排除しながら、接合面同士を突合せる(1)記載のセラミックス焼結体の製造方法。
(3)前記セラミックス成形体は、アクリルエマルション系のバインダを含み、接合面に含ませる水は、アルカリ性である(1)又は(2)記載のセラミックス焼結体の製造方法。
(4)前記セラミックス成形体は鋳込み成形により得られる(1)〜(3)のいずれかに記載のセラミックス焼結体の製造方法。
In order to solve these problems, the present invention provides the following inventions (1) to (6).
(1) a step of preparing a ceramic molded body including a ceramic powder and a binder;
A step of forming a dispersion layer by dispersing ceramic powder and a binder by containing only water on a bonding surface of the ceramic molded body; and
A step of abutting the bonding surfaces on which the dispersion layer is formed to obtain an unsintered bonded body;
Sintering and integrating the unsintered joined body;
Only including,
Concavities and convexities are formed on the bonding surface of the ceramic molded body, the height of the concavities and convexities is 5 to 100 μm, and the spacing between the irregularities is 0.05 to 1.0 mm.
The ceramic molded body is composed of 50.3 to 94.7% by volume of the ceramic powder, 0.8 to 7.5% by volume of the dispersant, 3.8 to 17.4% by volume of the binder, and 0. The manufacturing method of the ceramic sintered compact containing 8-24.8 volume% .
(2) The method for producing a ceramic sintered body according to (1) , wherein the step of obtaining the unsintered joined body joins the joined surfaces together while excluding a part of the dispersion layer from the joined surface.
(3) The method for producing a ceramic sintered body according to (1) or (2) , wherein the ceramic molded body includes an acrylic emulsion binder, and water to be included in the joint surface is alkaline.
(4) The method for producing a ceramic sintered body according to any one of (1) to (3), wherein the ceramic formed body is obtained by casting.
未焼結のセラミックス成形体の接合体を焼結一体化する方法において、接合部に隙間を有しないセラミックス焼結体を得ることができる。 In the method of sintering and integrating the joined body of unsintered ceramic molded bodies, a ceramic sintered body having no gap at the joint can be obtained.
以下、発明をより詳細に説明する。本発明は、セラミックス粉末とバインダとを含むセラミックス成形体を用意する工程と、前記セラミックス成形体の接合面に、水を含ませてセラミックス粉末及びバインダを分散させて分散層を形成する工程と、前記分散層が形成された接合面同士を突合せて未焼結の接合体を得る工程と、前記未焼結の接合体を焼結して一体化する工程と、を含むセラミックス焼結体の製造方法である。 Hereinafter, the invention will be described in more detail. The present invention includes a step of preparing a ceramic molded body including ceramic powder and a binder, a step of forming a dispersion layer by dispersing the ceramic powder and the binder by adding water to the bonding surface of the ceramic molded body, Manufacturing a ceramic sintered body comprising: a step of abutting the joining surfaces on which the dispersion layers are formed to obtain an unsintered joined body; and a step of sintering and integrating the unsintered joined body Is the method.
セラミックス成形体の接合面に、水を含ませてセラミックス粉末及びバインダを分散させて分散層を形成することによって、成形体同士の密着が高まり、隙間無く一体化した焼結体を得ることが可能となる。なお、本発明の「一体化」したセラミックス焼結体は、極めて密着性が高く、浸透探傷試験において隙間が認められない。 By forming the dispersion layer by dispersing ceramic powder and binder with water on the joint surface of the ceramic molded body, the adhesion between the molded bodies is increased, and it is possible to obtain an integrated sintered body without gaps. It becomes. In addition, the “integrated” ceramic sintered body of the present invention has extremely high adhesion, and no gap is observed in the penetration flaw detection test.
セラミックス成形体の接合面には、凹凸が形成されていることが好ましい。接合面が凹凸を有することにより、水を含ませてセラミックス粉末及びバインダを分散させることが容易になる。図1は、セラミックス成形体の接合面1の拡大断面図である。接合面には、凸部2が形成され、凸部2の連続によって凹凸が形成されている。凸部2は、頂部2aと底部2bとを有する。接合面の凹凸は、凹凸の高さH、すなわち、底部2bから頂部2aまでの高さ及び凹凸の間隔L、すなわち隣り合う頂部間の距離について所定範囲に形成されている。 It is preferable that irregularities are formed on the joint surface of the ceramic molded body. When the bonding surface has irregularities, it becomes easy to disperse the ceramic powder and the binder by containing water . FIG. 1 is an enlarged cross-sectional view of a bonding surface 1 of a ceramic molded body. Convex portions 2 are formed on the joint surface, and irregularities are formed by the continuation of the convex portions 2. The convex part 2 has the top part 2a and the bottom part 2b. The unevenness of the joint surface is formed in a predetermined range with respect to the height H of the unevenness, that is, the height from the bottom 2b to the top 2a and the interval L between the unevenness, that is, the distance between adjacent tops.
その範囲については、接合面の凹凸の高さが5〜100μm、凹凸の間隔が0.05〜1.0mmであることが好ましい。凹凸の高さ及び間隔を適切に制御することによって、分散層の形成を均質化することができ、密着性を高めることができる。接合面の凹凸の高さを10〜50μm、凹凸の間隔を0.1〜1.0mmとすることがより好ましく、凹凸の高さを20〜40μm、凹凸の間隔を0.2〜0.8mmとすることがさらに好ましい。なお、等しい凹凸が形成された接合面同士を接合することが最も好ましいが、これに限定されるものではなく、上記範囲内であれば接合面の凹凸形状が異なっていても接合は可能である。なお、凹凸高さ及び凹凸間隔は、表面粗さ測定装置(測定長さ:4mm)でサンプルを10箇所以上測定し、その平均を算出した。 About the range, it is preferable that the height of the unevenness | corrugation of a joint surface is 5-100 micrometers, and the space | interval of an unevenness | corrugation is 0.05-1.0 mm. By appropriately controlling the height and interval of the unevenness, the formation of the dispersion layer can be homogenized and the adhesion can be enhanced. More preferably, the height of the unevenness of the joint surface is 10 to 50 μm, and the interval between the unevenness is 0.1 to 1.0 mm, the height of the unevenness is 20 to 40 μm, and the interval of the unevenness is 0.2 to 0.8 mm. More preferably. In addition, it is most preferable to join the joint surfaces having the same unevenness, but the present invention is not limited to this, and bonding is possible even if the uneven shape of the joint surface is different as long as it is within the above range. . In addition, the uneven | corrugated height and the uneven | corrugated space | interval measured the sample 10 places or more with the surface roughness measuring apparatus (measurement length: 4 mm), and computed the average.
接合面の凹凸は、フライス盤を用いたフェイスミル加工等の公知の方法により形成することができる。凹凸の形状に応じて所定のフライス刃を用い、切り込み量、送り速度等を制御することにより所定の凹凸形状を形成することができる。 The unevenness of the joint surface can be formed by a known method such as face milling using a milling machine. A predetermined uneven shape can be formed by using a predetermined milling blade according to the shape of the unevenness and controlling the cutting amount, the feed rate, and the like.
分散層の形成は、成形体の接合面に水を含ませることにより行う。水を含ませる方法としては、成形体に塗布する方法や、成形体を浸漬する方法を採用することができる。分散層の厚さは、凹凸の高さに対して0.5〜10倍の範囲で形成することが好ましい。このような範囲であれば凹凸の形状に起因して均質な分散層により接合することができる。より好ましい範囲は0.5〜2倍である。 The dispersion layer is formed by adding water to the joint surface of the molded body. As a method of including water , a method of applying to the molded body or a method of immersing the molded body can be employed. The thickness of the dispersion layer is preferably formed in a range of 0.5 to 10 times the height of the unevenness. If it is such a range, it can join by a homogeneous dispersion layer resulting from the uneven | corrugated shape. A more preferable range is 0.5 to 2 times.
複数の成形体について、その接合面に分散層を形成した後、それぞれの接合面同士を突合せて未焼結の接合体を得る。この際、分散層の一部を接合面から排除しながら、接合面同士を突合せることができる。これは、余剰な分散層を排除することによって、接合部に著しく固形分やバインダ量の異なる部分を形成することを回避することができる。上記のように、接合面の凹凸を所定形状に形成し、分散層を均質化することによって、分散層の一部の排除も均一に起こるので、接合体の密着性がさらに高められ、隙間の無い焼結体を得ることができる。 About a some molded object, after forming a dispersion layer in the joining surface, each joining surface is faced | matched and an unsintered joined body is obtained. At this time, it is possible to abut the joining surfaces while excluding a part of the dispersion layer from the joining surface. By eliminating the excessive dispersion layer, it is possible to avoid the formation of a portion with significantly different solid content or binder amount at the joint. As described above, the unevenness of the joint surface is formed in a predetermined shape and the dispersion layer is homogenized, so that part of the dispersion layer is evenly eliminated. It is possible to obtain a sintered body that does not exist.
成形体同士を付き合わせる際は、分散層の一部が接合面から排除されるように、必要に応じて荷重を加えても良い。また、分散層の排除を促すために、接合面同士を摺り合せても良い。 When the molded bodies are brought together, a load may be applied as necessary so that a part of the dispersion layer is excluded from the joint surface. Further, in order to promote the removal of the dispersion layer, the joining surfaces may be rubbed together.
接合に用意するセラミックス成形体には、セラミックス粉末50.3〜94.7体積%、分散剤0.8〜7.5体積%、バインダ3.8〜17.4体積%、水分0.8〜24.8体積%が含まれる。このような成形体を用いることによって、水分を含ませたときの分散層の形成が容易になる。また、セラミックス粉末量を上記範囲にすることによって、分散層の厚さを制御でき、成形体自体の形状を保持することが可能となる。バインダ量も同様に、分散層の厚さ及び成形体の形状を保持するうえで上記範囲とすることが好ましい。特にバインダ量が多いと接合部に隙間が生じ易いので好ましくない。バインダ量は、5.0〜13.5体積%がより好ましい。分散剤は、分散層中の分散を高めるために上記範囲とすることが好ましい。水分については、上記範囲を超えると水分を含ませたときに分散層が過剰に形成されたり、成形体の保形ができなくなったりするので好ましくなく、上記範囲に満たないと急激に吸水し分散層が均質に形成できなくなり好ましくない。成形体の構成が上記範囲であれば、成形体の形状を保持しつつ分散層を形成することが可能となる。 Ceramic compacts prepared for joining include ceramic powder 50.3-94.7% by volume, dispersant 0.8-7.5% by volume, binder 3.8-17.4% by volume, moisture 0.8- 24.8% by volume is included. By using such a molded body, it becomes easy to form a dispersion layer when moisture is included. Further, by setting the amount of ceramic powder within the above range, the thickness of the dispersion layer can be controlled, and the shape of the compact itself can be maintained. Similarly, the amount of the binder is preferably within the above range in order to maintain the thickness of the dispersion layer and the shape of the molded body. In particular, a large amount of the binder is not preferable because a gap is likely to be generated at the joint. The binder amount is more preferably 5.0 to 13.5% by volume. The dispersant is preferably in the above range in order to increase the dispersion in the dispersion layer. Regarding moisture, if the amount exceeds the above range, an excessive dispersion layer will be formed when moisture is included, or the molded product will not be able to retain its shape. The layer cannot be formed uniformly, which is not preferable. If the configuration of the molded body is in the above range, the dispersion layer can be formed while maintaining the shape of the molded body.
セラミックス粉末としては、アルミナ、マグネシア、スピネル、ジルコニア、イットリア等の酸化物、炭化珪素、炭化チタン等の炭化物、窒化珪素、窒化アルミニウム等の窒化物等種々のセラミックスが適用できる。これらを複数用いた混合物、または必要に応じて焼結助剤等の上記以外の成分を含ませることも可能である。これらは市販のセラミックス粉末を用いることができる。セラミックス粉末の平均粒径は、0.1〜2.0μmのものを用いることが好ましい。 Various ceramics such as oxides such as alumina, magnesia, spinel, zirconia and yttria, carbides such as silicon carbide and titanium carbide, and nitrides such as silicon nitride and aluminum nitride can be applied as the ceramic powder. It is also possible to include a mixture using a plurality of these, or, if necessary, other components such as a sintering aid. Commercially available ceramic powder can be used for these. The ceramic powder preferably has an average particle size of 0.1 to 2.0 μm.
バインダも特に限定されず、ポリビニルアルコールやアクリルエマルション等が使用できる。接合面に水を含ませる際には、バインダを分散させる必要があることから、必要に応じてpH調整等をすると良い。例えば、アクリルエマルションをバインダとして用いた場合には、接合面に含ませる水はアルカリ性に調整することが好ましい。また、分散剤としては、ポリカルボン酸アンモニウム等の公知のものを使用できる。 The binder is not particularly limited, and polyvinyl alcohol or acrylic emulsion can be used. Since it is necessary to disperse the binder when water is contained in the joint surface, pH adjustment or the like may be performed as necessary. For example, when an acrylic emulsion is used as a binder, it is preferable to adjust the water contained in the bonding surface to be alkaline. Moreover, as a dispersing agent, well-known things, such as ammonium polycarboxylate, can be used.
セラミックス成形体は、鋳込み成形によるものであることが好ましい。鋳込み成形によるセラミックス成形体であれば、セラミックス粉末量やバインダ量を上記範囲に調整でき、また本製造方法に適しているからである。鋳込み成形は、吸水性材料からなる成形型にセラミックス粉末を分散させたスラリーを注型し、スラリー中の水分の吸水と同時にセラミックス粉末が成形型に着肉していき成形体が得られるという成形方法である。したがって、セラミックス成形体に水分を含ませて分散させることは、セラミックス粉末とバインダを再分散させることを意味する。 The ceramic molded body is preferably formed by casting. This is because the amount of ceramic powder and the amount of binder can be adjusted to the above ranges in the case of a ceramic molded body by casting, and is suitable for the present manufacturing method. Casting molding involves casting a slurry in which ceramic powder is dispersed in a mold made of a water-absorbing material, and the ceramic powder is deposited on the mold simultaneously with the absorption of moisture in the slurry, resulting in a molded product. Is the method. Therefore, adding and dispersing moisture in the ceramic molded body means that the ceramic powder and the binder are redispersed.
以下、実施例及び比較例を示して、本発明を説明する。 Hereinafter, the present invention will be described with reference to examples and comparative examples.
所定配合の板形状のセラミックス成形体(500×250mm、厚さ20mm)をそれぞれ複数個用意した。板形状の一方の面(500×250mm)について、フェイスミル加工を行い所定の凹凸を形成した。各成形体について、水分を所定値となるように乾燥した後、接合を行った。得られた未焼結の接合体の焼成は、大気中、1500〜1600℃で行った。 A plurality of plate-shaped ceramic molded bodies (500 × 250 mm, thickness 20 mm) each having a predetermined composition were prepared. About one surface (500x250mm) of plate shape, the face mill process was performed and the predetermined unevenness | corrugation was formed. About each molded object, it dried so that a water | moisture content might become a predetermined value, Then, it joined. The obtained unsintered joined body was fired at 1500 to 1600 ° C. in the air.
代表例として試験No.1について、以下説明する。鋳込み成形用のスラリーは、セラミックス粉末として市販のアルミナ粉末(平均粒径0.55μm、純度99.7%)を用い、アルミナ粉末77.1質量%と、バインダ(日新化成株式会社製 Duramax B−1070)4質量%、分散剤(ポリカルボン酸アンモニウム)1.9質量%、およびイオン交換水17質量%を配合し、アルミナ粉末が分散されたスラリーを調整した。 As a representative example, test no. 1 will be described below. As a slurry for casting, a commercially available alumina powder (average particle size 0.55 μm, purity 99.7%) was used as a ceramic powder, and 77.1% by mass of alumina powder and a binder (Duramax B manufactured by Nisshin Kasei Co., Ltd.) -1070) 4% by mass, 1.9% by mass of a dispersant (ammonium polycarboxylate), and 17% by mass of ion-exchanged water were blended to prepare a slurry in which alumina powder was dispersed.
箱型の吸水性材料の石こうからなる成形型(内側寸法;幅700mm、奥行き700mm、高さ40mm)を用い、鋳込み口から上記スラリーを注型して、着肉させ成形体を得た。成形体について水分量が6.5体積%となるまで乾燥させた。成形体の接合面の加工はフライス盤を用いてフェイスミル加工を行った。得られた成形体の接合面には凹凸が形成され、凹凸の高さは30μm、凹凸の間隔は0.4mmであった。 Using a mold made of gypsum of a box-type water-absorbing material (inner dimensions; width 700 mm, depth 700 mm, height 40 mm), the slurry was cast from a casting port and was made to fill to obtain a molded body. The molded body was dried until the water content was 6.5% by volume. The joint surface of the molded body was processed by face milling using a milling machine. Concavities and convexities were formed on the joint surface of the obtained molded body, the height of the concavities and convexities was 30 μm, and the spacing between the irregularities was 0.4 mm.
つづいて接合面にアルカリ水溶液(5質量%アンモニア水)を塗布し、分散層を形成した。そして分散層が形成された接合面同士を摺り合せて、分散層を接合面から排除しながら接合し、未焼結の接合体を得た。 Subsequently, an alkaline aqueous solution (5% by mass ammonia water) was applied to the joint surface to form a dispersion layer. Then, the joining surfaces on which the dispersion layer was formed were slid together and joined together while removing the dispersion layer from the joining surface to obtain an unsintered joined body.
接合体の焼結は、大気中、1600℃で行った。得られた焼結体を切断し、接合部について浸透探傷試験を行った。浸透探傷試験はレッドチェック液(栄進化学社製)を吹き付けて5分後にふき取って隙間からの染み出しの有無を調べた。その結果、隙間は認められなかった。接合部の顕微鏡写真を図2に示す。図2中の矢印は接合部を示す。 The joined body was sintered at 1600 ° C. in the air. The obtained sintered body was cut, and a penetration inspection test was performed on the joint. In the penetrant flaw detection test, a red check solution (manufactured by Eishin Chemical Co., Ltd.) was sprayed and wiped off 5 minutes later to examine the presence or absence of exudation from the gap. As a result, no gap was observed. A photomicrograph of the joint is shown in FIG. The arrow in FIG. 2 shows a junction part.
試験結果の一覧を表1に示す。探傷試験の結果は、隙間がなかったものを○、隙間があったものを×とした。なお、セラミックス粉末の平均粒径は、レーザ回折式粒度分布測定装置(堀場製作所製 LA−920)を用いた。接合面形状の測定は、表面粗さ測定装置(株式会社ミツトヨ製 SV−3000C)を用いて測定した。成形体に含まれるセラミックス粉末量、分散剤量、バインダ量及び水分量は、それぞれの比重及び熱分解GC-MSにより測定した。 Table 1 shows a list of test results. As a result of the flaw detection test, a case where there was no gap was indicated as ◯, and a case where there was a gap was indicated as x. In addition, the average particle diameter of ceramic powder used the laser diffraction type particle size distribution measuring apparatus (LA-920 by Horiba, Ltd.). The joint surface shape was measured using a surface roughness measuring device (SV-3000C manufactured by Mitutoyo Corporation). The amount of ceramic powder, the amount of dispersant, the amount of binder, and the amount of water contained in the compact were measured by their specific gravity and pyrolysis GC-MS.
作製No.1〜5では、探傷試験の結果全て隙間が見られなかった。一方、作製No.6〜13では、隙間が生じた。作製No.10の接合部の顕微鏡写真を図3に示す。 Production No. In 1 to 5, no gap was found as a result of the flaw detection test. On the other hand, Production No. In 6-13, a gap occurred. Production No. A photomicrograph of 10 joints is shown in FIG.
1 成形体
2 凸部
2a 頂部
2b 底部
1 Molded body 2 Convex part 2a Top part 2b Bottom part
Claims (4)
前記セラミックス成形体の接合面に、水のみを含ませてセラミックス粉末及びバインダを分散させて分散層を形成する工程と、
前記分散層が形成された接合面同士を突合せて未焼結の接合体を得る工程と、
前記未焼結の接合体を焼結して一体化する工程と、
を含み、
前記セラミックス成形体の接合面には、凹凸が形成されており、凹凸の高さが5〜100μmであって、凹凸の間隔が0.05〜1.0mmであり、
前記セラミックス成形体は、前記セラミックス粉末を50.3〜94.7体積%、分散剤を0.8〜7.5体積%、前記バインダを3.8〜17.4体積%、水分を0.8〜24.8体積%含むセラミックス焼結体の製造方法。 Preparing a ceramic molded body containing ceramic powder and a binder;
A step of forming a dispersion layer by dispersing ceramic powder and a binder by containing only water on a bonding surface of the ceramic molded body; and
A step of abutting the bonding surfaces on which the dispersion layer is formed to obtain an unsintered bonded body;
Sintering and integrating the unsintered joined body;
Only including,
Concavities and convexities are formed on the bonding surface of the ceramic molded body, the height of the concavities and convexities is 5 to 100 μm, and the spacing between the irregularities is 0.05 to 1.0 mm.
The ceramic molded body is composed of 50.3 to 94.7% by volume of the ceramic powder, 0.8 to 7.5% by volume of the dispersant, 3.8 to 17.4% by volume of the binder, and 0. The manufacturing method of the ceramic sintered compact containing 8-24.8 volume% .
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