JP5267723B2 - panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a panel that mitigates the problem of accumulation of heat generated as a panel body absorbs light in the panel having the panel body of light-absorbing/heat-storing properties. <P>SOLUTION: The panel 51A has the panel body 52A that is made of a translucent thermoplastic resin which has light-absorbing/heat-storing properties, that is, the properties of absorbing light, converting the light into heat, and storing the heat internally. The panel body 52A includes a translucent first layer 2a and a translucent second layer 2b that is laminated with the first layer 2a and exhibits more pronounced light-absorbing/heat-storing properties than the first layer 2a. The light-absorbing/heat-storing panel body 52A has a multilayer structure comprising at least two layers, that is, the layer 2b for IR absorption and the layer 2b serving as a heat-insulating layer. The heat-insulating layer 2a blocks the radiation of heat generated by IR absorption by the IR-absorbing layer 2b, thereby enabling prevention of a temperature increase caused by the heat radiated from the panel body 52A. <P>COPYRIGHT: (C)2013,JPO&amp;INPIT

Description

The present invention relates to a panel suitably used as a window material for automobiles and the like, and in particular, a panel using a transparent panel main body having near infrared to infrared absorption, and accompanying the near infrared to infrared absorption of the panel main body. It is related with the panel which reduced the problem of heat storage.
The invention also relates to a vehicle comprising this panel.

  In recent years, in the field of automobiles and the like, various studies have been made on resin substitutes (glazing) instead of glass for the purpose of weight reduction.

  Glazing is usually composed of a transparent window (panel body according to the present invention) and a window frame (frame member according to the present invention) at the periphery thereof, and is generally manufactured by integral molding by injection molding, including the window frame. Has been.

  FIG. 3 is a view showing a glazing panel used for a panoramic roof of an automobile, and FIG. 3 (a) is a rear view (a rear face or a rear face, a face on the side of a passenger compartment when attached to an automobile), and FIG. 3 (b). (A) BB sectional drawing of a figure, (c) figure is a fragmentary sectional view which shows the attachment structure to the automobile roof of this glazing.

  The panel 21 is composed of a panel main body 22 and a frame member 23 provided at the peripheral edge of the rear surface of the panel main body 22. When the panel 21 is attached to the automobile roof, as shown in FIG. The frame member 23 is bonded to the frame 24 with an adhesive 25 such as urethane, and a rubber seal member (weather strip) 26 is fitted and fixed in the gap between the panel 21 and the vehicle body frame 24.

  Conventionally, the visible light transmittance of a glazing panel body is appropriately adjusted in accordance with the location of attachment to an automobile for the purpose of privacy protection. In addition, near-infrared to infrared rays (hereinafter abbreviated as “IR”) that transmit glazing cause an increase in the temperature in the passenger compartment, so it is desirable to reduce the total solar transmittance of the glazing panel body. Many polycarbonate resin compositions that have been used for such applications have been proposed in which the total solar transmittance is lowered and the heat ray shielding ability is imparted (for example, Patent Documents 1 to 3).

JP 2007-211121 A JP 2007-326939 A JP 2008-63402 A

  By using the polycarbonate resin composition proposed in Patent Documents 1 to 3 as a molding material for the glazing panel body with a low total solar transmittance and excellent heat ray shielding properties, the glazing penetrates into the vehicle interior. The amount of IR generated can be reduced to prevent the temperature from rising due to the entry of IR into the passenger compartment, but the conventional IR-absorbing resin composition converts light energy into heat and accumulates it inside. Since the permeation is prevented, the glazing itself rises in temperature due to heat storage. For this reason, although the direct temperature rise by IR permeation is prevented, the temperature in the passenger compartment rises due to the radiant heat from the glazing that has become high temperature due to heat storage by IR absorption. If the glass has excellent thermal conductivity, the heat dissipation effect toward the outside of the vehicle is great, but since the resin has poor thermal conductivity, the heat accumulated in the interior due to IR absorption does not radiate for a long time. The rise in the passenger compartment temperature due to radiant heat from high-temperature glazing becomes a serious problem.

  The present invention provides a panel having a light-absorbing and heat-storing panel body so as to prevent an increase in vehicle interior temperature due to radiant heat from heat ray-shielding glazing that has risen in temperature due to IR absorption. It aims at providing the panel which reduced the problem of the thermal storage accompanying light absorption.

As a result of intensive studies to solve the above-mentioned problems, the present inventor has made the absorption heat storage panel body a laminated structure of at least two layers of a layer responsible for IR absorption and a layer serving as a heat insulating layer, and absorbs IR absorption. It has been found that the heat buildup by IR absorption in the supporting layer is blocked by the heat insulating layer, so that the temperature rise due to the radiant heat from the panel body can be prevented.
In addition, by using a material with excellent thermal conductivity for the frame member of the panel, the heat stored by IR absorption in the layer responsible for IR absorption is dissipated through this thermal conductive frame member, thereby making the panel body It was found that the temperature increase due to radiant heat can be prevented by lowering the amount of heat storage.

  The present invention has been achieved on the basis of such findings, and the gist thereof is as follows.

[1] A panel having a panel body made of a thermoplastic resin that has translucency and absorbs and stores light by absorbing light and converting it into heat, the panel body comprising an aromatic polycarbonate resin a first layer of manufacturing the light-laminated to the first layer, the high extinction heat storage than the first layer and a second layer of translucent made of aromatic polycarbonate resins possess, the thickness of the panel body 10mm or less, a panel thickness of the first layer is characterized in der Rukoto than 0.75 mm.

[2] In [1], the constituent material of the second layer satisfies the following characteristics (1) and (2), and the constituent material of the first layer has the following characteristics (1) and (3): A panel characterized by satisfying
(1) Visible light transmittance T _VIS having a thickness of 5 mm measured by ISO-9050 is 5% to 98% (2) Visible light transmittance T _VIS having a thickness of 5 mm measured by ISO-9050 and ISO-13837 the difference from the total solar transmittance _{T SUN} of 5mm thickness measured, converted and the total solar transmittance _{T S / V} calculated by the following formula (i), and the total solar transmittance _{T SUN} by _{(T S / V} - (T _SUN ) is greater than 0%. (3) From the visible light transmittance T _{VIS of} 5 mm thickness measured by ISO-9050 and the total solar transmittance T _{SUN of} 5 mm thickness measured by ISO-13837, the following formula ( i) conversion and the total solar transmittance _{T S / V} calculated by the difference between the total solar transmittance _{T SUN (T S / V -T} SUN) is 5% or less, and, above (2) in terms of the total solar transmittance _{T S / V} of the difference between the total solar transmittance _{T SUN (T S / V -T} SUN) less than _{T S / V = (0.56 ×} T VIS) +38. 8 (i)

[3] In [1], the constituent material of the second layer satisfies the following characteristics (1) and (2), and the constituent material of the first layer has the following characteristics (1) and (3): A panel characterized by satisfying
(1) Visible light transmittance T _VIS having a thickness of 5 mm measured by ISO-9050 is 5% to 98% (2) Visible light transmittance T _VIS having a thickness of 5 mm measured by ISO-9050 and ISO-13837 the difference from the total solar transmittance _{T SUN} of 5mm thickness measured, converted and the total solar transmittance _{T S / V} calculated by the following formula (i), and the total solar transmittance _{T SUN} by _{(T S / V} - (T _SUN ) is greater than 0%. (3) From the visible light transmittance T _{VIS of} 5 mm thickness measured by ISO-9050 and the total solar transmittance T _{SUN of} 5 mm thickness measured by ISO-13837, the following formula ( i) conversion and the total solar transmittance _{T S / V} calculated by the difference between the total solar transmittance _{T SUN (T S / V -T} SUN) or less _{0% T S / V = (} 0 _{56 × T VIS) +38.8 ... (} i)

[4] In [2] or [3], the visible light transmittance T _VIS having a thickness of 5 mm measured by ISO-9050 of the constituent material of the first layer is 70% or more and 98% or less. panel.

[5] In any one of [2] to [4], the visible light transmittance _TVIS1 having a thickness of 5 mm measured by ISO-9050 of the constituent material of the first layer, and the ISO of the constituent material of the second layer A panel characterized in that the difference (T _VIS1 −T _VIS2 ) from the visible light transmittance T _{VIS2 of} 5 mm thickness measured by ₋₉₀₅₀ is 20 to 90%.

[6] The panel according to any one of [1] to [5], wherein a color difference ΔE between the second layer and the panel body is 5 or less.

[7] In any one of [1] to [6], a ratio (D ₂ / D) of the thickness D ₂ of the second layer to the thickness D of the panel body is 0.01 to 0.9. A panel characterized by that.

[8] In any one of [1] to [7], the ratio (T ₂ / T ₁ ) of the thermal conductivity T ₂ of the second layer to the thermal conductivity T ₁ of the first layer is 0.5 to Panel characterized by being 1.5.

[9] The panel according to any one of [1] to [8], wherein the panel body is curved so that the second layer side is convex.

[ 10 ] The panel according to any one of [1] to [ 9 ], wherein the first layer and / or the second layer are formed by injection molding.

[ 11 ] In any one of [1] to [ 9 ], any one of the first layer and the second layer is a sheet-like material formed by extrusion molding, and the first layer is added to the sheet-like material. And a panel formed by injection molding one of the other of the second layers.

[ 12 ] The panel according to any one of [1] to [ 11 ], wherein at least a part of a peripheral portion on the second layer side of the panel body is formed of the first layer.

[ 13 ] The panel according to any one of [1] to [ 12 ], further comprising a frame member provided on a peripheral portion of the surface of the panel body on the first layer side.

[14] Oite to [13], the outer edge portion of the frame member, the panel the panel than the outer edge portion of the main body, characterized in that it is retracted ItaHisashi side of the panel body.

[15] [13] or Oite to [14], marginal portions of ItaHisashi side of at least the panel body of the frame member, the panel, characterized in that the thickness toward the plate central side is smaller .

[ 16 ] The panel according to any one of [ 13 ] to [ 15 ], wherein the panel body and the frame member are integrally formed by injection molding.

[ 17 ] In any one of [ 13 ] to [ 16 ], one of the surface on the second layer side of the panel body and the inner region of the frame member on the surface on the first layer side of the panel body. Or the hard film is formed in both, The panel characterized by the above-mentioned.

[ 18 ] In any one of [ 13 ] to [ 17 ], the frame member is one or more thermoplastics selected from the group consisting of an aromatic polycarbonate resin, a polyester resin, an aromatic polyamide resin, and an ABS resin. A panel formed of resin.

[ 19 ] The panel according to any one of [1] to [ 18 ], which is used for a window member of a vehicle.

[ 20 ] A panel installation structure, wherein the panel according to any one of [ 14 ] to [ 19 ] is supported on a panel support via the frame member.

[ 21 ] In [ 20 ], the frame member and the panel support are supported by engagement between a protrusion projecting from the frame member and an attachment hole formed in the panel support. Characteristic panel installation structure.

[ 22 ] In [ 20 ], the frame member and the panel support are supported by fitting a protrusion protruding from the panel support and a recess formed in the frame member. Panel installation structure.

[ 23 ] [ 20 ] In the panel installation structure, the frame member is fixed to the panel support by a bolt.

[ 24 ] In any one of [ 20 ] to [ 23 ], an adhesive layer is provided between the frame member and the panel support.

[ 25 ] The panel installation structure according to any one of [ 20 ] to [ 24 ], wherein one end is inserted into the frame member and the other end has a metal member in contact with the panel support.

[ 26 ] A vehicle comprising the panel according to any one of [1] to [ 19 ].

[ 27 ] A vehicle comprising the panel installation structure according to any one of [ 20 ] to [ 25 ].

  In the following, the light-transmitting first layer constituting the panel body according to the present invention is referred to as a “heat insulating layer”, and the light-absorbing heat storage property is higher than the first layer of the heat insulating layer, and the light-transmitting second layer. May be referred to as an “IR absorption layer”.

  Since the panel body of the panel of the present invention is a laminate of at least a light-transmitting and light-absorbing and heat-storing IR absorbing layer and a light-transmitting heat insulating layer, the heat stored by IR absorption in the IR absorbing layer is stored. Radiation can be blocked by the heat insulating layer. Therefore, for example, in an application for glazing of an automobile, the heat of the IR absorbing layer whose temperature has been increased by IR absorption is radiated to the vehicle interior side by attaching the IR absorbing layer to the outside of the vehicle and the heat insulating layer to the inside of the vehicle. This can be blocked by a heat insulating layer to prevent temperature rise in the passenger compartment.

  Thus, according to the panel of the present invention, IR is absorbed and temperature rise due to transmission of IR is prevented, and temperature rise due to radiation of heat stored by IR absorption is also effectively prevented, Since the amount of energy required for cooling can be reduced, it is advantageous for energy saving.

  Moreover, the panel of the present invention has the following effects.

(1) The thermoplastic resin composition that is a constituent material of the IR absorbing layer needs to contain an IR absorbent such as metal boride fine particles, and in a molded body formed by molding this thermoplastic resin composition, The composition of the IR absorber is inferior in properties such as impact strength and heat-and-moisture resistance compared to a molded product obtained by molding a thermoplastic resin composition not blended with this, but in the panel of the present invention, The problem of deterioration of the above characteristics of the IR absorbing layer can be compensated by the heat insulating layer, and the characteristics as the panel body are superior to those of the panel body having only the IR absorbing layer.

(2) When the panel body is composed only of an IR absorption layer, the elongation (linear expansion) due to heat generation due to IR absorption is large, and there is a problem that cracking occurs due to the restraint stress and the linear expansion stress at the panel mounting portion. However, in the panel of the present invention, the heat insulating layer serves as a buffer layer to relieve the stress at the constraining point, so that cracking due to linear expansion can be prevented.

(3) In order to improve the IR absorption performance in the IR absorption layer, it is necessary to contain an expensive IR absorber in a high concentration in the IR absorption layer, but in the panel of the present invention, the thickness of the IR absorption layer The IR absorber concentration in the IR absorption layer can be increased compared with a thick IR absorption layer even with the same amount of IR absorber used, while the thermal insulation layer has IR absorption. An agent is unnecessary, and the material cost as a whole can be reduced.

(4) Thermoplastic resins, particularly aromatic polycarbonate resins, have the problem of weathering discoloration (yellowing), but the IR absorption layer can be made thin and dark, and this yellowing can be made inconspicuous. it can.

(5) As the thermoplastic resin material constituting the IR absorbing layer, a resin composition containing an IR absorber is used, but the thermoplastic resin material not containing this is blended by the IR absorber. Compared to a molded body formed by molding, the residence heat stability at the time of injection molding is inferior. However, since the thickness of the IR absorption layer can be reduced in the panel of the present invention, the cycle during molding can be shortened, and the deterioration of the mechanical properties of the panel and the appearance defects are suppressed. Therefore, the characteristics as a panel are superior to those of a panel composed only of an IR absorption layer.

  In addition, the IR absorption layer and the heat insulation layer can be made of the same kind of thermoplastic resin so that there is no problem of delamination and it can be made into a laminated molded body with excellent adhesion, for example, adopting two-color molding or insert molding Since the panel main body can be efficiently manufactured by the injection molding, there is almost no disadvantage in the manufacturing process of making the panel main body a laminated structure.

  Furthermore, in a panel configured such that a material having excellent thermal conductivity is used for the frame member so that the frame member and the IR absorption layer are in contact with each other, the heat stored in the IR absorption layer is transferred to the heat conductive material. Heat can be radiated to the panel support through the frame member. That is, for example, in the case of glazing of an automobile, the temperature of the IR absorption layer is lowered by releasing the heat accumulated in the IR absorption layer to the vehicle body frame which is a panel support through a thermally conductive frame member, and the IR absorption layer The radiant heat from the vehicle to the passenger compartment side can be more reliably prevented.

It is sectional drawing of the panel edge part which shows embodiment of the panel of this invention. It is sectional drawing of the panel edge part which shows other embodiment of the panel of this invention. It is a figure which shows the panel for glazing currently used for the panorama roof of the motor vehicle, (a) A figure is a rear view, (b) A figure is the BB sectional drawing of (a) figure, (c) A figure is It is a fragmentary sectional view which shows the attachment structure to the automobile roof of this glazing. A variety of graphs showing the relationship between the visible light transmittance T _VIS and total solar transmittance T _SUN of the polycarbonate resin composition. It is a schematic perspective view which shows the test apparatus which simulated the panoramic roof of the motor vehicle used in the Example. It is sectional drawing which follows the aa line of FIG. It is sectional drawing of the panel edge part which shows an example of embodiment of the panel of this invention. It is sectional drawing of the panel edge part which shows another example of embodiment of the panel of this invention. It is sectional drawing of the panel edge part which shows another example of embodiment of the panel of this invention. It is sectional drawing of the panel edge part which shows another example of embodiment of the panel of this invention. It is sectional drawing of the panel edge part which shows another example of embodiment of the panel of this invention. It is sectional drawing of the panel edge part which shows another example of embodiment of the panel of this invention. It is sectional drawing of the panel edge part which shows another example of embodiment of the panel of this invention. It is sectional drawing which shows an example of embodiment of the panel installation structure of this invention. It is sectional drawing which shows another example of embodiment of the panel installation structure of this invention. It is sectional drawing which shows another example of embodiment of the panel installation structure of this invention. It is sectional drawing which shows another example of embodiment of the panel installation structure of this invention. It is sectional drawing which shows another example of embodiment of the panel installation structure of this invention. It is sectional drawing which shows another example of embodiment of the panel installation structure of this invention. It is sectional drawing which shows another example of embodiment of the panel installation structure of this invention. It is sectional drawing which shows another example of embodiment of the panel installation structure of this invention. It is sectional drawing which shows another example of embodiment of the panel installation structure of this invention. It is sectional drawing which shows another example of embodiment of the panel installation structure of this invention. It is sectional drawing which shows another example of embodiment of the panel installation structure of this invention. It is a schematic perspective view which shows the test apparatus used in the Example. It is sectional drawing which follows the aa line or bb line of FIG. It is an expanded sectional view which shows the metal plate attachment part to the panel in the testing apparatus of FIG.

  Hereinafter, embodiments of the panel of the present invention will be described with reference to the drawings.

  1 and 2 are cross-sectional views of a panel end portion showing an embodiment of the panel of the present invention, and show a state of being attached to an automobile roof in the same manner as FIG. However, in FIGS. 1 and 2, members corresponding to the seal member 26 shown in FIG. 3C are not shown.

  In the following, the panel body of the present invention will be described by exemplifying a panel body having a two-layer laminated structure of a first heat insulating layer and a second IR absorption layer. Is not limited to a two-layer structure, and other layers may be interposed between the first layer and the second layer, and more layers may be stacked on the first layer side. It may be. However, in the laminated structure as the panel body, the IR absorption layer of the second layer is preferably the outermost layer, and the panel of the present invention is used in various applications such that the IR absorption layer side is the side on which sunlight is incident. Used for.

  The panel 51A shown in FIG. 1 is composed of a panel main body 52A and a frame member 3 provided on the peripheral edge of the rear surface of the panel main body 52A. The panel 51A supports the frame member 3 with respect to a support body 8 such as a vehicle body frame. Bonded with an adhesive 55 such as urethane.

  In the panel 51A of FIG. 1, the panel body 52A has a two-layer laminated structure of a first heat insulating layer 2a and a second IR absorbing layer 2b.

The panel 51B shown in FIG. 2 (a) is different from the panel 51A shown in FIG. 1 in that the entire peripheral edge portion on the IR absorption layer 2b side of the second layer of the panel body 52B is also composed of the first heat insulating layer 2a. Unlike the others, the configuration is the same.
In addition, in the panel 51C shown in FIG. 2B, the entire peripheral edge of the first heat insulating layer 2a side of the panel main body 52C is also composed of the second IR absorbing layer 2b so as to be in contact with the IR absorbing layer 2b. 1 is different from the panel 51A shown in FIG. 1 in that the frame member 3 is provided.

[Panel body]
The composition of the thermoplastic resin composition constituting the IR absorption layer and the heat insulation layer of the panel body according to the present invention will be described later, but the IR absorption layer, the heat insulation layer and the panel body constituting the panel body of the panel of the present invention are: It preferably has the following characteristics or physical properties.

{Optical characteristics}
The constituent material of the IR absorbing layer preferably satisfies the following characteristics (1) and (2), and the constituent material of the heat insulating layer preferably satisfies the following characteristics (1) and (3).

(1) Visible light transmittance T _VIS having a thickness of 5 mm measured by ISO-9050 (hereinafter simply referred to as “visible light transmittance T _VIS ”) is 5% or more and 98% or less. (2) Visible light transmittance T The total solar transmittance T _{SUN of} 5 mm thickness measured by _VIS and ISO-13837 (hereinafter simply referred to as “total solar transmittance T _SUN ”) is calculated by the following formula (i). The difference between the rate T _{S / V} and the total solar transmittance T _SUN (T _{S / V} −T _SUN ) is greater than 0% (3) From the visible light transmittance T _VIS and the total solar transmittance T _SUN , The difference (T _{S / V} −T _SUN ) between the converted total solar transmittance T _{S / V} calculated by the formula (i) and the total solar transmittance T _SUN is 5% or less, and the above (2) conversion and the total solar transmittance T _{S / V,} all solar radiation Toru The difference between the rate _{T SUN (T S / V -T} SUN) less than _{T S / V = (0.56 ×} T VIS) +38.8 ... (i)
In the present invention, the difference (T _{S / V} −T _SUN ) between the converted total solar transmittance T _{S / V of} (3) and the total solar transmittance T _SUN is more preferably 0% or less. .

<Visible light transmittance T _VIS >
The visible light transmittance T _VIS is an index of translucency, and the visible light transmittance T _VIS having a thickness of 5 mm measured by ISO-9050 of the constituent material of the IR absorbing layer and the heat insulating layer according to the present invention is It is preferable that it is 5-98%. If the visible light transmittance T _VIS of the constituent material of the IR absorbing layer and the heat insulating layer is less than 5%, sufficient visibility cannot be ensured. The higher the visible light transmittance T _VIS is, the better the visibility is, but it is usually 98% or less. Also in the panel body, from the viewpoint of visibility, the visible light transmittance T _VIS is preferably 5 to 98%, and more preferably 10 to 90%.

Among these, the visible light transmittance T _VIS of the constituent material of the IR absorbing layer varies depending on the required IR absorptivity and privacy protection effect, but the visible light transmittance T _VIS is 5 to 85%, particularly 10 to 70. % Is preferred.

On the other hand, for the heat insulating layer, it is possible to add a coloring pigment or the like to the thermoplastic resin composition that is a constituent material of the heat insulating layer, but it is colorless and transparent without adding a coloring pigment or the like, or an extremely light coloring It is preferable to make it transparent and to increase the mechanical strength and heat-and-moisture resistance of this heat insulating layer. Therefore, it is preferable to use a colorless and transparent layer with high translucency, so that the visible light transmittance T _VIS of the constituent material of the heat insulating layer Is preferably 10 to 98%, more preferably 70 to 98%, and particularly preferably 80 to 98%.

In the present invention, the IR absorption layer is provided with the IR absorption and coloring required for the panel body, and the heat insulating layer is preferably colorless and transparent or light blue transparent. the difference between visible light transmittance _{T VIS2} of the constituent material of the visible light transmittance _{T VIS1} and IR absorption layer _{(T VIS1 -T VIS2)} 20 to 90% and especially 40% to 90%, the difference is relatively large, It is preferable to distinguish the functions of the layers.

<Relationship between Visible Light Transmittance T _VIS and Total Solar Transmittance T _SUN >
The IR absorbing layer has translucency and absorbs and stores heat by absorbing light (IR) into heat and storing heat inside. The degree of translucency and IR absorption can be expressed by visible light transmittance T _VIS and total solar radiation transmittance T _SUN, and the IR absorption layer according to the present invention is preferably (1) and ( It is comprised with the material which satisfies the characteristic of 2).

  In the characteristic (2), the formula (i) is obtained as follows and is an index of the degree of IR absorption.

{(I) Formula Determination Method}
As a colored translucent resin composition not imparted with light absorption heat storage property, the polycarbonate resin composition No. 1 having the formulation shown in Table 1 below. 1-8 were prepared, and about each polycarbonate resin composition, the following injection molding machine was used and the test piece of 150 mm x 100 mm x thickness 5mm was manufactured on the following molding conditions.
Injection molding machine: “J220EVP” manufactured by Nippon Steel Works (clamping force 220t)
Molding conditions: Resin temperature during molding: 300 ° C
Mold temperature: 80 ℃
Filling time: 2.5 seconds
Holding pressure: 50% of the peak pressure during injection for 15 seconds
Cooling time: 20 seconds The polycarbonate resin composition pellets were used after being subjected to a hot-air drying treatment at 120 ° C. for 5 hours before injection molding. The molded product was measured for visible light transmittance T _VIS and total solar radiation transmittance T _SUN according to ISO-9050. The results are shown in Table 1.

  In addition, the specification of the resin composition raw material used by the compounding prescription described in Table 1 is as follows.

Polycarbonate resin 1: manufactured by Mitsubishi Engineering Plastics, trade name “Iupilon (registered trademark) E-2000FN” (viscosity average molecular weight 28,000)
Polycarbonate resin 2: manufactured by Mitsubishi Engineering Plastics Co., Ltd., trade name “Iupilon (registered trademark) S-3000FN” (viscosity average molecular weight 21,500)
Thermal stabilizer 1: manufactured by ADEKA, trade name “ADK STAB AS2112” (Tris (2,4-di-tert-butylphenyl) phosphite)
Thermal stabilizer 2: Product name “Irganox 1010” pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] manufactured by BASF
Mold release agent: Cognis Japan, trade name “VPG861” (pentaerythritol tetrastearate)
Ultraviolet absorber: manufactured by Sipro Kasei Co., Ltd., trade name “Seesorb 709” (2- (2′-hydroxy-5′-tert-octylphenyl) -2H-benzotriazole)
Red dye 1: manufactured by Arimoto Chemical Industry Co., Ltd., trade name “Plast Red 8370” (perinone series)
Red dye 2: Nippon Kayaku Co., Ltd., trade name “Kayaset Red A-2G” (perinone series)
Blue dye 1: manufactured by Arimoto Chemical Industry Co., Ltd., trade name “Plast Blue 8580” (Anthraquinone)
Blue Dye 2: Product name “Macrolex Blue RR” (Anthraquinone) manufactured by LANXESS
Green dye: Sumika Chemtex Co., Ltd., trade name “Sumiplast Green G” (Anthraquinone)
Yellow dye: manufactured by Kiwa Chemical Industry Co., Ltd., trade name “KP Past Yellow MK” (Anthraquinone)
Carbon Black: Product name “Monarch 800” manufactured by Cabot

In Table 1, the unit of numerical values of the polycarbonate resin 1, the polycarbonate resin 2, the heat stabilizer 1, the heat stabilizer 2, the mold release agent, and the ultraviolet absorber is “mass%”, and the total of these is 100 mass%. .
The unit of numerical values of other dyes and carbon black is “part by mass”, and the total of the above-mentioned polycarbonate resin 1, polycarbonate resin 2, thermal stabilizer 1, thermal stabilizer 2, release agent and ultraviolet absorber is 100 mass. The compounding mass part with respect to part is shown.

FIG. 4 shows a graph of the measurement results of the visible light transmittance T _VIS and the total solar transmittance T _SUN in Table 1.
No. 4 in FIG. From the 1 to 8 plots, select two plots with low T _SUN , and from the line segment connecting them,
T _SUN = (0.56 × T _VIS ) +38.8
Is obtained by calculation.

From the above, polycarbonate resin composition No. 1 to 8 are colored translucent polycarbonate resin compositions used for general glazing not imparting IR absorption (absorption heat storage), and such colored translucent polycarbonate resin compositions are visible. It can be seen that there is a relationship of T _SUN = (0.56 × T _VIS ) +38.8 between the light transmittance T _VIS and the total solar transmittance T _SUN .

Therefore, the value of T _SUN calculated by this T _SUN = (0.56 × T _VIS ) +38.8 is defined as the converted total solar transmittance T _{S / V,} and the measured total solar radiation is calculated from the T _{S / V.} If the transmittance T _SUN is small, it can be said that it has IR absorptivity. In the present invention, as the IR absorptivity of the translucent / absorptive heat storage resin composition, the converted total solar transmittance T _{S / V} calculated by the formula (i), and the measured total solar transmittance T _SUN A material having a difference (T _{S / V} −T _SUN ) greater than 0% is defined as a material having IR absorption and absorption heat storage properties.

Although the difference (T _{S / V} −T _SUN ) between the converted total solar transmittance T _{S / V} calculated by the equation (i) and the total solar transmittance T _SUN is larger, the IR absorption is better. In general, the difference (TS _{/ V−} T _SUN ) is 0.1 to 25% as a limit of the blending design of the resin composition when the visible light transmittance is kept equivalent, preferably 0.5%. ~ 25%.

On the other hand, the heat insulating layer has almost no IR absorbability, and the constituent material of the heat insulating layer is the difference between the converted total solar transmittance T _{S / V} calculated by the equation (i) and the total solar transmittance T _SUN. (T _{S / V} −T _SUN ) is 5% or less, and the difference between the converted total solar transmittance T _{S / V of the} IR absorbing layer and the total solar transmittance T _SUN (T _{S / V} −T _SUN ) It is smaller, preferably 0% or less, more preferably −25 to 0%, and further preferably −10 to 0%.

<Color difference ΔE>
In the panel body according to the present invention, the heat insulating layer can be a colored transparent layer, but is preferably a colorless transparent or light blue transparent layer, and therefore the degree of coloring of the panel body according to the present invention is Preferably, it is determined by the coloring of the IR absorbing layer. For this reason, it is preferable that the color difference ΔE between the IR absorption layer and the whole panel body according to the present invention is 10 or less, particularly 5 or less. When ΔE exceeds 10, it tends to be difficult for the panel body to obtain the required color tone. In the present invention, the color difference ΔE between the IR absorbing layer and the panel main body is measured by the method described in the section of Examples described later.

<Thickness>
In the panel body according to the present invention, it is possible to reduce the thickness of the IR absorption layer and increase the thickness of the heat insulation layer while ensuring the required IR absorption, thereby increasing the strength and moisture resistance of the panel body. The thermal properties are supplemented by a heat insulating layer, the heat insulating property by the heat insulating layer is enhanced, cracks due to linear expansion and appearance defects are suppressed, and the amount of resin material used for the IR absorbing layer to which the IR absorber is added is reduced. It is preferable in terms of the material cost of the panel body, the physical properties of the panel body, and the like.

Therefore, the ratio of the thickness _{D 2} of the IR-absorbing layer to the thickness D of the panel body according to the present invention _(D 2 / D) is preferably from 0.9 or less, for example 0.01 to 0.9. The thickness _{D 2} of the IR-absorbing layer is preferably 0.01 to 5 mm, more preferably 0.1 to 5 mm. If the thickness of the IR absorbing layer is thicker than the above upper limit, sufficient heat insulation cannot be obtained, and the effect of improving the heat and moisture resistance by the heat insulation layer, the effect of reducing cracks and material costs due to linear expansion, etc. It tends to be difficult to obtain. If the thickness of the IR absorbing layer is thinner than the above lower limit, the required IR absorbability cannot be satisfied, the smoothness of the surface required for glass parts, the uniformity of the fluoroscopic performance, the design, etc. In some cases, the secured panel body cannot be obtained.

<Thermal conductivity>
In the panel body according to the present invention, the heat insulating property of the heat insulating layer is high, but it is preferable that its thermal conductivity is not significantly different from that of the IR absorbing layer. For this reason, the ratio T ₂ / T ₁ of the thermal conductivity T ₂ of the IR absorbing layer to the thermal conductivity T ₁ of the heat insulating layer may be 0.5 to 1.5, particularly 0.7 to 1.4. preferable. If the thermal conductivity ratio T ₂ / T ₁ is larger than the upper limit, it becomes difficult to maintain the transparency of the panel body. There is a case. Thermal conductivity _{T 2} of the IR-absorbing layer is preferably 0.1~0.4W / m · K, and more preferably 0.2~0.35W / m · K. The thermal conductivity _{T 1} of the heat-insulating layer is preferably 0.1~0.4W / m · K, and more preferably 0.2~0.35W / m · K.

  In addition, the heat conductivity of a heat insulation layer and IR absorption layer is measured by the method described in the term of the below-mentioned Example.

<Dimensions, shapes, etc.>
In the panel body of the present invention, when at least a part of the peripheral edge of the IR absorption layer is composed of the heat insulating layer as shown in FIG. 2A, the amount of heat absorbed and stored by the IR absorption layer is reduced. Radiation can be more reliably suppressed by the heat insulating layer. In this case, the thickness of the heat insulating layer covering the peripheral edge of the IR absorbing layer, that is, the thickness from the peripheral edge of the IR absorbing layer to the peripheral edge of the panel body is preferably 0.5 to 3 mm, more preferably 0.5. ~ 2mm. When the thickness of the heat insulation layer is thinner than the above lower limit, the effect of heat insulation due to the provision of the heat insulation layer is small, and when thicker than the above upper limit, the IR absorption at the peripheral edge is impaired and the appearance of the whole panel Tend to get worse.

  On the other hand, as shown in FIG. 2B, at least a part of the peripheral portion of the heat insulating layer is constituted by the IR absorbing layer, and a high thermal conductivity frame member described later is provided in contact with the IR absorbing layer. If it is, the heat absorbed and stored by the IR absorption layer can be radiated through the highly heat conductive frame member. In this case, the thickness of the IR absorbing layer covering the peripheral edge of the heat insulating layer, that is, the thickness from the peripheral edge of the heat insulating layer to the peripheral edge of the panel body is preferably 5 to 160 mm, more preferably 30 to 150 mm, and still more preferably. Is 50 to 100 mm. When the thickness of the IR absorbing layer is thinner than the above lower limit, the contact area between the IR absorbing layer and the high thermal conductivity window frame is reduced, and the heat of the IR absorbing layer tends to be difficult to be transmitted to the frame member, If it is thicker, a difference in linear expansion deformation occurs between the IR absorbing layer and the heat insulating layer, which may lead to deformation of the panel body and stress concentration.

  In the panel body of the present invention, a frame member is usually formed on the peripheral edge of the surface on the heat insulation layer forming side.

  In the panel of the present invention, the dimensions and shapes of the frame member and the panel body are appropriately designed according to the application.

  Generally, the thickness of the panel body is about 2 to 10 mm, preferably 3 to 8 mm, and the thickness of the frame member is about 0.5 to 5 mm, preferably 1 to 4 mm. Further, the ratio of the thickness of the panel body to the thickness of the frame member is preferably 0.75 to 5.0, particularly preferably about 1.5 to 4.0.

Usually, the outer edge part of this frame member is set back from the outer edge part of the panel body toward the center of the panel body. As described above, when the outer edge portion of the frame member is retracted to the center side of the panel body from the outer edge portion of the panel body, the back of the resin tends to be prevented when the frame member is molded. However, since the designability and solvent resistance are impaired when the retreat width is too large, the retreat width from the outer edge of the panel body of the frame member (d ₁ in FIG. 1 and FIG. 7a described later) is 0.1 to 10 mm. The degree, in particular 0.5 to 5 mm, especially 0.5 to 2 mm is preferred.

In addition, as shown in FIG. 2B, when the peripheral portion of the heat insulating layer is formed of an IR absorbing layer, there is no overlap between the frame member and the heat insulating layer, and the exposed portion of the IR absorbing layer is formed. Then, since the heat absorbed and stored in the IR absorption layer leaks from that portion, the frame member preferably overlaps with the heat insulation layer side, and this overlap allowance (d _{2 in} FIG. 1B) ) Is preferably 0.1 to 50 mm, more preferably 1 to 40 mm, particularly 3 to 30 mm, and particularly preferably 5 to 20 mm. If there is no overlap allowance, the heat insulating property is impaired as described above, which is not preferable, but if the overlap allowance is too large, heat from the IR absorption layer is difficult to be transmitted to the frame member.

  As shown in FIG. 7b described later, a groove may be provided on the frame member forming surface of the panel body, and the frame member may be provided so as to be fitted into the groove. In this case, the depth of the groove is preferably about 1 to 50% of the thickness of the frame member, more preferably 10 to 50%, and still more preferably 10 to 40%.

  The panel body may be flat and may be curved so that the surface side opposite to the frame member forming surface (IR absorption layer forming side) is convex as shown in FIG.

  Moreover, although a panel is a substantially rectangular shape normally, it is not limited to a substantially rectangular shape at all.

For example, when the panel has a substantially rectangular shape, the size is not particularly limited and is appropriately selected and determined according to the application. Usually, when the panel is used as an automobile window material, the panel is used. The area inside the frame member of the main body is about 400 cm ^{2 to 2} m ² , and the width of the frame member is about 30 to 200 mm. Among them, the area inside of the frame member of the panel body is preferably 800 cm ² to 1 m ^2, the width of the frame member is 30 to 150 mm.

  When the panel body is substantially rectangular and is curved so as to be convex on the front side, the curve height of the most convex part on the front side may be appropriately selected and determined according to the application, Usually, R in the long side length direction (longitudinal direction) of the panel body is 5000R to 20000R, particularly about 10000R to 20000R, and R in the short side length direction (short direction) is about 1000R to 15000R, especially about 5000R to 10,000R. It is preferable that the value be such that

  In addition, an uneven part may be formed in the boundary part (joint surface) between the rear surface of the panel main body and the frame member, and the coupling strength between the panel main body and the frame member may be increased by an uneven fitting structure. Moreover, you may project the attachment piece for attaching other components to a frame member.

  Further, as will be described later, the frame member may be configured such that at least the edge portion on the center side of the panel main body decreases in thickness toward the center side.

The panel of the present invention is manufactured, for example, by the following method.
(1) The IR absorbing layer, the heat insulating layer and the frame member are integrally formed by multicolor injection molding.
(2) One or two of the IR absorbing layer, the heat insulating layer and the frame member of the panel main body are previously molded by injection molding and integrally molded by insert injection molding.
(3) As one of the IR absorption layer and the heat insulation layer of the panel body, a sheet-like thing previously molded by extrusion molding is used, and the panel body is molded by insert injection molding. The frame member is integrally formed.
In particular, when any one of the IR absorbing layer and the heat insulating layer constituting the panel main body is a sheet, for example, a thickness of 0.05 to 2 mm, preferably 0.1 to 1 mm, The method (3) is preferably used.

[Component material of IR absorbing layer]
The constituent material of the IR absorption layer of the panel main body according to the present invention is preferably not particularly limited as long as it satisfies the conditions (1) and (2). For example, a fragrance having a water content of 500 ppm or more At least one selected from the group consisting of La, Ce, Pr, Nd, Tb, Dy, Ho, Y, Sm, Eu, Er, Tm, Yb, Lu, Sr and Ca with respect to 100 parts by mass of the polycarbonate resin And a light-transmitting / absorbing heat-storing polycarbonate resin composition (Japanese Patent Laid-Open No. 2007-211213) obtained by adding 0.0001 to 0.5 parts by mass of metal boride fine particles.

  The light-transmitting / absorbing / heat-accumulating polycarbonate resin composition (hereinafter sometimes referred to as “translucent / absorbing / heat-accumulating polycarbonate resin composition of the present invention”) will be described below.

(1) Aromatic polycarbonate resin An aromatic polycarbonate resin is an aromatic polycarbonate polymer obtained by reacting an aromatic hydroxy compound with phosgene or a carbonic acid diester. The method for producing the aromatic polycarbonate resin is not particularly limited, and may be a conventional method such as a phosgene method (interfacial polymerization method) or a melting method (transesterification method).

  Typical examples of the aromatic dihydroxy compound that is one of the raw materials of the aromatic polycarbonate resin include bis (4-hydroxyphenyl) methane, 2,2-bis (4-hydroxyphenyl) propane, 2,2- Bis (4-hydroxy-3-methylphenyl) propane, 2,2-bis (4-hydroxy-3-tert-butylphenyl) propane, 2,2-bis (4-hydroxy-3,5-dimethylphenyl) propane 2,2-bis (4-hydroxy-3,5-dibromophenyl) propane, 4,4-bis (4-hydroxyphenyl) heptane, 1,1-bis (4-hydroxyphenyl) cyclohexane, 4,4 ′ -Dihydroxybiphenyl, 3,3 ', 5,5'-tetramethyl-4,4'-dihydroxybiphenyl, bis (4-hydro Shifeniru) sulfone, bis (4-hydroxyphenyl) sulfide, bis (4-hydroxyphenyl) ether, bis (4-hydroxyphenyl) ketone. These aromatic dihydroxy compounds can be used alone or in admixture of two or more. Furthermore, polyvalent phenols having three or more hydroxy groups in the molecule such as 1,1,1-tris (4-hydroxylphenyl) ethane (THPE), 1,3,5-tris (4-hydroxyphenyl) benzene Etc. can be used together in small amounts as a branching agent. Among these aromatic dihydroxy compounds, 2,2-bis (4-hydroxyphenyl) propane (hereinafter also referred to as “bisphenol A” and sometimes abbreviated as “BPA”) is preferable.

  In the polymerization by the transesterification method, a carbonic acid diester is used as a monomer instead of phosgene. Representative examples of carbonic acid diesters include diaryl carbonates typified by diphenyl carbonate, ditolyl carbonate and the like, dialkyl carbonates typified by dimethyl carbonate, diethyl carbonate, di-tert-butyl carbonate and the like. These carbonic acid diesters can be used alone or in admixture of two or more. Among these, diphenyl carbonate (hereinafter sometimes abbreviated as “DPC”) and substituted diphenyl carbonate are preferable.

  Moreover, said carbonic acid diester may substitute the quantity of the 50 mol% or less preferably 30 mol% or less with the dicarboxylic acid or dicarboxylic acid ester preferably. Representative dicarboxylic acids or dicarboxylic acid esters include terephthalic acid, isophthalic acid, diphenyl terephthalate, and diphenyl isophthalate. When substituted with such a dicarboxylic acid or dicarboxylic acid ester, a polyester carbonate is obtained.

  When an aromatic polycarbonate resin is produced by a transesterification method, a catalyst is usually used. Although there is no limitation on the catalyst species, generally basic compounds such as alkali metal compounds, alkaline earth metal compounds, basic boron compounds, basic phosphorus compounds, basic ammonium compounds, and amine compounds are used. Of these, alkali metal compounds and / or alkaline earth metal compounds are particularly preferred. These may be used alone or in combination of two or more. In the transesterification method, the polymerization catalyst is generally deactivated with p-toluenesulfonic acid ester or the like.

  Preferred aromatic polycarbonate resins are those derived from 2,2-bis (4-hydroxyphenyl) propane or from 2,2-bis (4-hydroxyphenyl) propane and other aromatic dihydroxy compounds. And a polycarbonate copolymer. Further, for the purpose of imparting flame retardancy and the like, a polymer or oligomer having a siloxane structure can be copolymerized. The aromatic polycarbonate resin may be a mixture of two or more polymers and / or copolymers of different raw materials, and may have a branched structure up to 0.5 mol%. The terminal OH group content of the aromatic polycarbonate resin is usually 10 to 2,000 ppm, preferably 10 to 1,500 ppm, more preferably 20 to 1,000 ppm on a mass basis, and p-tert- What was sealed with butylphenol, phenol, cumylphenol, p-long chain alkyl-substituted phenol, or the like can be used. The terminal hydroxyl group concentration is the ratio of the mass of the terminal hydroxyl group to the mass of the aromatic polycarbonate resin, and the measurement method is described in the colorimetric determination (Macromol. Chem. 88 215 (1965) by the titanium tetrachloride / acetic acid method. Method). As the amount of residual monomer in the aromatic polycarbonate resin, the aromatic dihydroxy compound is 150 ppm or less, preferably 100 ppm or less, more preferably 50 ppm or less, based on mass. When synthesized by the transesterification method, the residual amount of carbonic acid diester is 300 ppm or less, preferably 200 ppm or less, more preferably 150 ppm or less on a mass basis.

The molecular weight of the aromatic polycarbonate resin is not particularly limited, but the viscosity average molecular weight converted from the solution viscosity is in the range of 10,000 to 50,000, preferably 11,000 to 40,000. Particularly preferred are those in the range of 14,000 to 30,000. If the viscosity average molecular weight is less than 10,000, the mechanical strength may be insufficient, and if it exceeds 50,000, moldability tends to be difficult.
Here, the viscosity average molecular weight (Mv) is methylene chloride as a solvent, the intrinsic viscosity [η] (unit dl / g) at a temperature of 20 ° C. is obtained with an Ubbelohde viscometer, and the Schnell viscosity equation ([η ] = 1.23 × 10 ⁻⁴ Mv ^0.83 ).

  Usually, the moisture content of the aromatic polycarbonate resin in the air at room temperature is about 1,500 to 2,000 ppm on a mass basis as the amount of water in the resin, but changes depending on the humidity in the air, so that the actual aromatic The moisture content of the polycarbonate resin is determined by the influence of the ambient temperature and humidity environment including regional differences and seasonal effects. For example, in the case of BPA polycarbonate resin, it is about 1,500 ppm when the relative humidity is 50% at room temperature, but the water content decreases to about 500 ppm under the condition that the relative humidity is less than 30%.

In general, when molding a BPA polycarbonate resin, it is necessary to reduce the water content to 200 ppm or less on a mass basis in order to suppress a decrease in molecular weight due to hydrolysis. Therefore, drying is performed at 120 ° C. for 4 hours or more. When the resin and metal boride fine particles are melt-kneaded with an extruder or the like, it is effective to use an aromatic polycarbonate resin having a water content of 500 ppm or more to improve the dispersibility of the metal boride fine particles and reduce haze. Is.
When using an aromatic polycarbonate resin stored under a dry condition with a relative humidity of 30% or less, in order to obtain the effects of the present invention, the moisture content of the aromatic polycarbonate resin is 500 ppm or more, preferably 1,000 ppm or more. More preferably, the humidity needs to be adjusted to 1,500 ppm or more.

  In order to set the moisture content of the aromatic polycarbonate resin to 500 ppm by mass or more, it should be stored in an environment that maintains a relative humidity of 50% or more at room temperature, and the humidity should be adjusted by immersion in water or steam treatment. However, contact with water at a high temperature for a longer time than necessary is not preferable because it causes a decrease in molecular weight due to hydrolysis of the aromatic polycarbonate resin. In general, when the immersion time exceeds 200 hours, the moisture content of the aromatic polycarbonate resin has reached a saturated state, and therefore, the treatment time when performing immersion in water, water vapor treatment or the like is preferably 200 hours or less.

(2) Metal boride fine particles The metal boride used in the translucent / absorbing heat storage polycarbonate resin composition of the present invention is La, Ce, Pr, Nd, Tb, Dy, Ho, Y, Sm, Eu, Er. , A boride of at least one metal selected from the group consisting of Tm, Yb, Lu, Sr and Ca, and must be in the form of fine particles. The metal boride fine particles are preferably those whose surfaces are not oxidized, but even if they are somewhat oxidized, the effectiveness of the heat ray shielding effect can be used without change. These metal boride fine particles are colored powder such as gray black, brown black, green black, etc., but if the particle size is sufficiently small compared to the visible light wavelength and dispersed in the resin molded body, Visible light permeability is generated in the obtained resin molded body having a heat ray shielding ability, and the infrared light shielding ability can be sufficiently strong. The particle size of the metal boride fine particles is 1,000 nm or less, preferably 200 nm or less. A resin molded article having fine particles having a particle diameter larger than 1,000 nm or coarse particles formed by agglomeration of fine particles is not preferable because haze increases and transparency decreases.
In the light-transmitting / absorbing heat-storing polycarbonate resin composition of the present invention, the metal boride fine particles whose surface is coated with a silane compound, a titanium compound, a zirconia compound or the like can be used. By coating the surface of the fine particles with a compound, the water resistance of the metal boride fine particles can be improved.

  Moreover, in the translucent / light-absorbing heat storage polycarbonate resin composition of the present invention, the metal boride fine particles are preferably dispersed in a polymer dispersant in order to improve uniform dispersibility and workability. As such a polymeric dispersant, one having high transparency and high light transmittance in the visible light region can be used. Specific polymer dispersants include polyacrylate dispersants, polyurethane dispersants, polyether dispersants, polyester dispersants, polyester urethane dispersants, and preferably polyacrylate dispersants. , Polyether dispersants and polyester dispersants. The blending ratio of the polymeric dispersant to the metal boride fine particles is usually 0.3 parts by weight or more and less than 50 parts by weight, preferably 1 part by weight or more and less than 15 parts by weight with respect to 1 part by weight of the metal boride fine particles. It is.

  A method for dispersing metal boride fine particles in a polymer-based dispersant is, for example, mixing an appropriate amount of boride fine particles, an organic solvent, and a polymer-based dispersant, and using a zirconia bead having a diameter of 0.3 mm for 5 hours. Then, a metal boride fine particle dispersion (boride fine particle concentration: 6.5% by mass) is prepared. Furthermore, a metal borate fine particle dispersion can be obtained by adding an appropriate amount of a polymeric dispersant to the above dispersion and removing the organic solvent under reduced pressure at 60 ° C. while stirring.

  The blending ratio of the aromatic polycarbonate resin and the metal boride fine particles is usually 0.0001 to 0.5 parts by mass of metal boride fine particles, more preferably 0.0005 to 0 parts per 100 parts by mass of the aromatic polycarbonate resin. 0.1 parts by mass, more preferably 0.001 to 0.05 parts by mass. If the compounding ratio of the metal boride fine particles is less than 0.0001 parts by mass, the heat ray shielding effect is small, and if it exceeds 0.5 parts by mass, the haze increases and the transparency decreases, which is disadvantageous in terms of cost. .

(3) Other additives In the light-transmitting / absorbing heat-storing polycarbonate resin composition of the present invention, in addition to the aromatic polycarbonate resin and metal boride fine particles, a weather resistance improver, a heat stabilizer, an antioxidant, Mixing a release agent and a dye / pigment is preferable at the time of molding or when used as a window or window part, since the hue stability is improved.

(3-1) Weather resistance improver Examples of the weather resistance improver include organic ultraviolet absorbers such as benzotriazole compounds, benzophenone compounds, and triazine compounds in addition to inorganic ultraviolet absorbers such as titanium oxide, cerium oxide, and zinc oxide. . In the present invention, among these, organic ultraviolet absorbers are preferred, and in particular, benzotriazole compounds, 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5-[(hexyl) oxy]- Phenol, 2- [4,6-bis (2,4-dimethylphenyl) -1,3,5-triazin-2-yl] -5- (octyloxy) phenol, 2,2 ′-(1,4-phenylene) It is preferably at least one selected from bis [4H-3,1-benzoxazin-4-one], [(4-methoxyphenyl) -methylene] -propanedioic acid-dimethyl ester.

  Examples of the benzotriazole compound include 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2- (2′-hydroxy-3 ′, 5′-di-tert-butylphenyl) benzotriazole, 2- ( 2'-hydroxy-3 ', 5'-di-tert-butylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3'-tert-butyl-5'-methylphenyl) -5-chloro Benzotriazole, 2- (2′-hydroxy-5′-tert-octylphenyl) -2H-benzotriazole, 2- (2′-hydroxy-5′-tert-butylphenyl) benzotriazole, 2- (2′- Hydroxy-5'-methacryloxyphenyl) -2H-benzotriazole, 2- (2'-hydroxy-3 ', 5' Di-tert-amylphenyl) benzotriazole, 2- [2′-hydroxy-3 ′, 5′-bis (α, α-dimethylbenzyl) phenyl] -2H-benzotriazole, 2- [2′-hydroxy-3 '-(3 ″, 4 ″, 5 ″, 6 ″ -tetrahydrophthalimidomethyl) -5′-methylphenyl] benzotriazole, 2,2′-methylenebis [4- (1,1,3,3 -Tetramethylbutyl) -6- (2H-benzotriazol-2-yl) phenol], methyl-3- [3-tert-butyl-5- (2H-benzotriazol-2-yl) -4-hydroxyphenyl] Examples thereof include condensates of propionate and polyethylene glycol.

  Among these, 2- (2′-hydroxy-5′-tert-octylphenyl) -2H-benzotriazole, 2- [2′-hydroxy-3 ′, 5′-bis (α, α) are preferable. -Dimethylbenzyl) phenyl] -2H-benzotriazole, 2,2'-methylenebis [4- (1,1,3,3-tetramethylbutyl) -6- (2H-benzotriazol-2-yl) phenol], It is a condensate of methyl-3- [3-tert-butyl-5- (2H-benzotriazol-2-yl) -4-hydroxyphenyl] propionate and polyethylene glycol.

  The blending ratio of the weather resistance improver such as the organic ultraviolet absorber is usually 0.01 to 5 parts by mass with respect to 100 parts by mass of the aromatic polycarbonate resin. If this blending ratio exceeds 5 parts by mass, problems such as mold debossing may occur, and if it is less than 0.01 parts by mass, the effect of improving weather resistance tends to be insufficient. Although one type of weather resistance improver can be used, a plurality of types can also be used in combination.

(3-2) Heat stabilizer As the heat stabilizer, at least one ester in the molecule is a phosphite esterified with phenol and / or phenol having at least one alkyl group having 1 to 25 carbon atoms. And at least one selected from a compound, phosphorous acid, and tetrakis (2,4-di-tert-butylphenyl) -4,4′-biphenylene-di-phosphonite.

  Specific examples of the phosphite compound include trioctyl phosphite, tridecyl phosphite, trilauryl phosphite, tristearyl phosphite, triisooctyl phosphite, tris (nonylphenyl) phosphite, tris (2,4 -Dinolylphenyl) phosphite, tris (2,4-di-tert-butylphenyl) phosphite, triphenylphosphite, tris (octylphenyl) phosphite, diphenylisooctylphosphite, diphenylisodecylphosphite, octyl Diphenyl phosphite, dilauryl phenyl phosphite, diisodecyl phenyl phosphite, bis (nonylphenyl) phenyl phosphite, diisooctylphenyl phosphite, diisodecyl pentaerythritol Diphosphite, dilauryl pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, (phenyl) (1,3-propanediol) phosphite, (4-methylphenyl) (1,3-propanediol) phosphite, ( 2,6-dimethylphenyl) (1,3-propanediol) phosphite, (4-tert-butylphenyl) (1,3-propanediol) phosphite, (2,4-di-tert-butylphenyl) ( 1,3-propanediol) phosphite, (2,6-di-tert-butylphenyl) (1,3-propanediol) phosphite, (2,6-di-tert-butyl-4-methylphenyl) ( 1,3-propanediol) phosphite, (phenyl) (1,2-ethanedioe ) Phosphite, (4-methylphenyl) (1,2-ethanediol) phosphite, (2,6-dimethylphenyl) (1,2-ethanediol) phosphite, (4-tert-butylphenyl) (1 , 2-ethanediol) phosphite, (2,4-di-tert-butylphenyl) (1,2-ethanediol) phosphite, (2,6-di-tert-butylphenyl) (1,2-ethane Diol) phosphite, (2,6-di-tert-butyl-4-methylphenyl) (1,2-ethanediol) phosphite, (2,6-di-tert-butyl-4-methylphenyl) (1 , 4-butanediol) phosphite, diphenylpentaerythritol diphosphite, bis (2-methylphenyl) pentaerythritol diphosphite Bis (3-methylphenyl) pentaerythritol diphosphite, bis (4-methylphenyl) pentaerythritol diphosphite, bis (2,4-dimethylphenyl) pentaerythritol diphosphite, bis (2,6-dimethyl) Phenyl) pentaerythritol diphosphite, bis (2,3,6-trimethylphenyl) pentaerythritol diphosphite, bis (2-tert-butylphenyl) pentaerythritol diphosphite, bis (3-tert-butylphenyl) penta Erythritol diphosphite, bis (4-tert-butylphenyl) pentaerythritol diphosphite, bis (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, bis (2,6-di-tert-butyl) Phenyl) pentaerythritol diphosphite, bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, bis (2,6-di-tert-butyl-4-ethylphenyl) pentaerythritol Examples thereof include diphosphite, bis (nonylphenyl) pentaerythritol diphosphite, bis (biphenyl) pentaerythritol diphosphite, and dinaphthyl pentaerythritol diphosphite.

  In the present invention, phosphine compounds can also be used as heat stabilizers. The phosphine compound is not particularly limited, and includes all organic derivatives of phosphine and salts thereof. Examples thereof include various phosphine compounds, phosphine oxides, phosphonium salts with halogen ions, and diphosphine. In particular, an aliphatic or aromatic phosphine compound can be preferably used. Any of primary, secondary, and tertiary phosphine compounds can be used, with tertiary phosphine compounds being particularly preferred, and tertiary aromatic phosphine compounds being more preferred.

The tertiary phosphine compound is represented by the general formula R ₃ P (wherein R is an aliphatic or aromatic hydrocarbon group which may have a substituent and may be different from each other). R is preferably a phenyl group. Examples of the substituent for R include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, n-amyl group, isoamyl group, n-hexyl group, isohexyl group, Examples thereof include alkyl groups such as cyclopentyl group and cyclohexyl group, and alkoxy groups such as methoxy group and ethoxy group.

  Specific examples of the tertiary aromatic phosphine compound include triphenylphosphine, tri-m-tolylphosphine, tri-o-tolylphosphine, tri-p-tolylphosphine, tris-p-methoxyphenylphosphine, and the like. Specifically, triphenylphosphine is preferably used, but other phosphine compounds may be used in combination.

  Furthermore, phosphate compounds and phosphonate compounds can also be used as heat stabilizers. Specifically, trimethyl phosphate, triethyl phosphate, tributyl phosphate, triphenyl phosphate, dioctyl phosphate, di (2-ethylhexyl) phosphate, diisooctyl phosphate, dinonyl phosphate, diisononyl phosphate, didecyl phosphate, diisodecyl phosphate, dilauryl Examples include phosphate, ditridecyl phosphate, dimethylphenyl phosphate, 1,3-phenylene-bis (dixylenyl) phosphate, and the like.

  The blending ratio of the heat stabilizer is usually 0.001 to 1 part by mass, preferably 0.4 parts by mass or less, with respect to 100 parts by mass of the aromatic polycarbonate resin. When the blending ratio of the heat stabilizer exceeds 1 part by mass, problems such as deterioration of hydrolysis resistance may occur.

(3-3) Antioxidant As the antioxidant, a hindered phenol antioxidant is preferable.

  Specific examples include pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], octadecyl-3- (3,5-di-tert-butyl-4-hydroxy Phenyl) propionate, thiodiethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], N, N′-hexane-1,6-diylbis [3- (3,5-di -Tert-butyl-4-hydroxyphenylpropionamide), 2,4-dimethyl-6- (1-methylpentadecyl) phenol, diethyl [[3,5-bis (1,1-dimethylethyl) -4-hydroxy Phenyl] methyl] phosphoate, 3,3 ′, 3 ″, 5,5 ′, 5 ″ -hexa-tert-butyl-a, a ′, a ″-(mesitile -2,4,6-triyl) tri-p-cresol, 4,6-bis (octylthiomethyl) -o-cresol, ethylenebis (oxyethylene) bis [3- (5-tert-butyl-4- Hydroxy-m-tolyl) propionate], hexamethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 1,3,5-tris (3,5-di-tert- Butyl-4-hydroxybenzyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, 2,6-di-tert-butyl-4- (4,6-bis ( Octylthio) -1,3,5-triazin-2-ylamino) phenol and the like. Of the above, in particular pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], octadecyl-3- (3,5-di-tert-butyl-4- Hydroxyphenyl) propionate is preferred. These two phenolic antioxidants are commercially available from BASF under the names Irganox 1010 and Irganox 1076.

  The blending ratio of the antioxidant is preferably 0.01 to 1 part by mass with respect to 100 parts by mass of the aromatic polycarbonate resin. If the blending ratio of the antioxidant is less than 0.01 parts by mass, the effect as an antioxidant tends to be insufficient, and even if it exceeds 1 part by mass, no further effect can be obtained as an antioxidant. There are many cases.

(3-4) Release Agent As the release agent, aliphatic carboxylic acid, ester of aliphatic carboxylic acid and alcohol, aliphatic hydrocarbon compound having a number average molecular weight of 200 to 15,000 and polysiloxane silicone oil. There may be mentioned at least one compound selected.

  Examples of the aliphatic carboxylic acid include saturated or unsaturated aliphatic monovalent, divalent or trivalent carboxylic acid. Here, the aliphatic carboxylic acid includes alicyclic carboxylic acid. Among these, preferable aliphatic carboxylic acids are monovalent or divalent carboxylic acids having 6 to 36 carbon atoms, and aliphatic saturated monovalent carboxylic acids having 6 to 36 carbon atoms are more preferable. Specific examples of such aliphatic carboxylic acids include palmitic acid, stearic acid, caproic acid, capric acid, lauric acid, arachidic acid, behenic acid, lignoceric acid, serotic acid, melissic acid, tetrariacontanoic acid, montanic acid , Adipic acid, azelaic acid and the like.

  As the aliphatic carboxylic acid in the ester of an aliphatic carboxylic acid and an alcohol, the same one as the aliphatic carboxylic acid can be used. Examples of the alcohol that reacts with the aliphatic carboxylic acid to form an ester include saturated or unsaturated monohydric alcohols and saturated or unsaturated polyhydric alcohols. These alcohols may have a substituent such as a fluorine atom or an aryl group. Among these alcohols, monovalent or polyvalent saturated alcohols having 30 or less carbon atoms are preferable, and aliphatic saturated monohydric alcohols or polyhydric alcohols having 30 or less carbon atoms are more preferable. Here, aliphatic includes alicyclic compounds. Specific examples of these alcohols include octanol, decanol, dodecanol, stearyl alcohol, behenyl alcohol, ethylene glycol, diethylene glycol, glycerin, pentaerythritol, 2,2-dihydroxyperfluoropropanol, neopentylene glycol, ditrimethylolpropane, dipentaerythritol. Etc. These ester compounds of aliphatic carboxylic acids and alcohols may contain aliphatic carboxylic acids and / or alcohols as impurities, or may be a mixture of a plurality of compounds.

  Specific examples of esters of aliphatic carboxylic acids and alcohols include beeswax (a mixture based on myricyl palmitate), stearyl stearate, behenyl behenate, stearyl behenate, glycerin monopalmitate, glycerin monostearate Mention may be made of rate, glycerol distearate, glycerol tristearate, pentaerythritol monopalmitate, pentaerythritol monostearate, pentaerythritol distearate, pentaerythritol tristearate, pentaerythritol tetrastearate.

  Examples of the aliphatic hydrocarbon having a number average molecular weight of 200 to 15,000 include liquid paraffin, paraffin wax, microwax, polyethylene wax, Fischer-Tropsch wax, and α-olefin oligomer having 3 to 12 carbon atoms. Here, as the aliphatic hydrocarbon, an alicyclic hydrocarbon is also included. Moreover, these hydrocarbon compounds may be partially oxidized. Among these, paraffin wax, polyethylene wax, and partial oxides of polyethylene wax are preferable, and paraffin wax and polyethylene wax are more preferable. These aliphatic hydrocarbons have a number average molecular weight of 200 to 15,000, preferably 200 to 5,000. These aliphatic hydrocarbons may be a single substance, or a mixture of various constituent components and molecular weights, as long as the main component is within the above range.

  Examples of the polysiloxane silicone oil include dimethyl silicone oil, phenylmethyl silicone oil, diphenyl silicone oil, and fluorinated alkyl silicone. These may be used alone or in combination of two or more.

  The compounding ratio of the release agent is usually 0.01 to 1 part by mass with respect to 100 parts by mass of the aromatic polycarbonate resin. If the blending ratio of the release agent exceeds 1 part by mass, problems such as degradation of hydrolysis resistance and mold contamination during injection molding may occur. One type of release agent can be used, but a plurality of release agents can be used in combination.

(3-5) Dye / pigment Examples of the dye / pigment include inorganic pigments, organic pigments, and organic dyes.

  Examples of inorganic pigments include sulfide pigments such as carbon black, cadmium red, and cadmium yellow, silicate pigments such as ultramarine blue, titanium oxide, zinc white, petal, chromium oxide, iron black, titanium yellow, and zinc-iron. -Based brown, titanium-cobalt green, cobalt-green, cobalt-blue, oxide-based pigments such as copper-chromium black, copper-iron-based black, chromic pigments such as yellow lead, molybdate orange, ferrocyans such as bitumen And the like.

  As organic pigments and organic dyes, phthalocyanine dyes such as copper phthalocyanine blue and copper phthalocyanine green, azo series such as nickel azo yellow, thioindigo series, perinone series, perylene series, quinacridone series, dioxazine series, isoindolinone series, Examples thereof include condensed polycyclic dyes such as quinophthalone, anthraquinone, heterocyclic, and methyl dyes.

  Of these, titanium oxide, carbon black, cyanine, quinoline, anthraquinone, phthalocyanine, perinone, and the like are preferable from the viewpoint of thermal stability, and carbon black, anthraquinone, phthalocyanine, and perinone are more preferable. .

  Specific examples of these include: MACROLEX Blue RR, MACROLEX Violet 3R, MACROLEX Violet B, Macrolex Red 5B (manufactured by Bayer), Sumiplast Violet RR, Sumiplast Violet B, SumiPlast Chemical Co., Ltd. Green G, Sumiplast RED HL5B (manufactured by Sumika Chemtex), Diaresin Violet D, Diaresin Blue G, Diaresin Blue N, D-RED-HS (Mitsubishi Chemical Corporation), Plas Red 8370, Pla 85 Lu Chemical Industry), Kayset Red A-2G (Nippon Kayaku), P Plast Yellow MK (manufactured by Kiwa Chemical Industry Co., Ltd.), and the like.

  The blending ratio of the dye / pigment is usually 1 part by mass or less, preferably 0.3 parts by mass or less, more preferably 0.1 parts by mass or less with respect to 100 parts by mass of the aromatic polycarbonate resin. One type of dyeing pigment can be used, but a plurality of types can also be used in combination.

  In the present invention, the dye / pigment is originally blended for the purpose of adjusting the visibility by transmitted light. That is, when the compounding amount of the metal boride fine particles is increased, the hue of the molded body is changed and the visibility is lowered (specifically, the L value is lowered and the absolute values of the a value and the b value are increased). Therefore, the visibility by the transmitted light is improved by selecting the type and / or blending ratio of the dye / pigment to be blended to obtain an appropriate hue. Of course, depending on the use of the panel of the present invention, for example, in a sunroof or the like, a black pigment such as carbon black can be blended and the L value can be intentionally lowered within a range that does not impair the heat ray shielding property.

(3-6) Infrared Absorber The light-transmitting / absorbing heat-storing polycarbonate resin composition of the present invention may further include antimony-doped tin oxide fine particles, In, Ga, for the purpose of further improving the heat ray shielding performance. Zinc oxide fine particles containing at least one element selected from the group consisting of Al and Sb, tin-doped indium oxide fine particles, phthalocyanine-based, naphthalocyanine-based, copper sulfide, copper ions and other organic and inorganic infrared rays An absorbent can also be blended. In particular, when it is necessary to provide absorption characteristics up to the wavelength length side region, it is preferable to use the metal boride fine particles and the metal oxide semiconductor in combination.

(3-7) Other Additives The light-transmitting / absorbing heat-storing polycarbonate resin composition of the present invention further includes ABS, PMMA, polystyrene, polyethylene, polypropylene, polyester, etc. as long as the object of the present invention is not impaired. Other thermoplastic resins, phosphorus-based, metal salt-based, silicone-based flame retardants, impact resistance improvers, antistatic agents, slip agents, antiblocking agents, lubricants, mold release agents, antifogging agents, natural oils , Synthetic oils, waxes, organic fillers, fibrous reinforcements such as glass fibers and carbon fibers, plate reinforcements such as mica, talc and glass flakes, or whiskers such as potassium titanate, aluminum borate and wollastonite Additives such as an inorganic filler can be blended.

[Constituent material of heat insulation layer]
The constituent material of the heat insulating layer of the panel main body according to the present invention is not particularly limited as long as it preferably satisfies the conditions (1) and (3), and the following transparent thermoplastic resin composition is used. Is mentioned.

  Here, the term “transparent” is generally 10% or more, preferably 15% or more, more preferably 20%, as a total light transmittance in a plate-shaped molded article having a smooth surface thickness of 3 mm measured according to JIS K7105. This means that the Haze value is usually 10% or less, preferably 5% or less, and more preferably 3% or less. In the transparent thermoplastic resin composition containing a dye or a pigment, the content of the dye or pigment is usually 0.001 to 2 parts by mass, preferably 0.005 to 1 with respect to 100 parts by mass of the transparent thermoplastic resin. Part by mass, more preferably 0.005 to 0.5 part by mass.

  Examples of the transparent thermoplastic resin as described above include polystyrene resin, high impact polystyrene resin, hydrogenated polystyrene resin, polyacryl styrene resin, transparent ABS resin, AS resin, AES resin, ASA resin, SMA resin, and polyalkyl methacrylate. Resin, polymethacryl methacrylate resin, polyphenyl ether resin, polycarbonate resin, amorphous polyalkylene terephthalate resin, polyester resin, amorphous polyamide resin, poly-4-methylpentene-1, amorphous polyarylate resin, polyether Sulphone is listed. Among these, from the viewpoint of impact resistance and heat resistance, a polycarbonate resin, particularly, an aromatic polycarbonate resin as a main constituent resin is preferable. The main constituent resin means that the ratio of the aromatic polycarbonate resin in all resin components is usually 50% by mass or more, preferably 60% by mass or more, and more preferably 70% by mass or more.

  Examples of the resin used in combination with the polycarbonate resin as the main constituent resin include polystyrene resin, ABS resin, AS resin, AES resin, ASA resin, polyphenylene ether resin, polymethyl methacrylate resin, and polyester resin. Any alloy or copolymer may be used as long as it maintains transparency.

  Hereinafter, a transparent polycarbonate resin composition (hereinafter sometimes referred to as “the transparent polycarbonate resin composition of the present invention”) suitable as a constituent material of the heat insulating layer according to the present invention will be described.

  The polycarbonate resin is, for example, a linear or branched thermoplastic polymer or copolymer obtained by reacting an aromatic dihydroxy compound and a carbonate precursor, or a small amount of a polyhydroxy compound in combination therewith. It is. The polycarbonate resin can be produced by a known method, and examples of the production method include an interfacial polymerization method, a melt transesterification method, a pyridine method, a ring-opening polymerization method of a cyclic carbonate compound, and a solid-phase transesterification method of a prepolymer. It is done.

  Examples of aromatic dihydroxy compounds used as raw materials include 2,2-bis (4-hydroxyphenyl) propane (also known as bisphenol A), 2,2-bis (3,5-dibromo-4-hydroxyphenyl) propane ( Also known as: tetrabromobisphenol A), bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 2,2-bis (4-hydroxyphenyl) butane, 2,2-bis (4 -Hydroxyphenyl) octane, 2,2-bis (4-hydroxy-3-methylphenyl) propane, 1,1-bis (3-tert-butyl-4-hydroxyphenyl) propane, 2,2-bis (4- Hydroxy-3,5-dimethylphenyl) propane, 2,2-bis (3-bromo-4-hydroxyphenyl) propane, , 2-bis (3,5-dichloro-4-hydroxyphenyl) propane, 2,2-bis (3-phenyl-4-hydroxyphenyl) propane, 2,2-bis (3-cyclohexyl-4-hydroxyphenyl) Propane, 1,1-bis (4-hydroxyphenyl) -1-phenylethane, bis (4-hydroxyphenyl) diphenylmethane, 2,2-bis (4-hydroxyphenyl) -1,1,1-trichloropropane, 2 , 2-bis (4-hydroxyphenyl) -1,1,1,3,3,3-hexachloropropane, 2,2-bis (4-hydroxyphenyl) -1,1,1,3,3,3- Bis (hydroxyaryl) alkanes such as hexafluoropropane; 1,1-bis (4-hydroxyphenyl) cyclopentane, 1,1-bis (4-hydride) Bis (hydroxyaryl) cycloalkanes such as xylphenyl) cyclohexane and 1,1-bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane; 9,9-bis (4-hydroxyphenyl) fluorene; Cardiostructure-containing bisphenols such as 9,9-bis (4-hydroxy-3-methylphenyl) fluorene; dihydroxy diphenyls such as 4,4′-dihydroxydiphenyl ether and 4,4′-dihydroxy-3,3′-dimethyldiphenyl ether Aryl ethers; dihydroxydiaryl sulfides such as 4,4′-dihydroxydiphenyl sulfide, 4,4′-dihydroxy-3,3′-dimethyldiphenyl sulfide; 4,4′-dihydroxydiphenyl sulfoxide, 4,4 '-Dihydroxy-3,3'-dimethyl Dihydroxydiaryl sulfoxides such as diphenyl sulfoxide; dihydroxydiaryl sulfones such as 4,4′-dihydroxydiphenylsulfone and 4,4′-dihydroxy-3,3′-dimethyldiphenylsulfone; hydroquinone, resorcin, 4 , 4'-dihydroxydiphenyl and the like.

  Among the above, bis (4-hydroxyphenyl) alkanes are preferable, and 2,2-bis (4-hydroxyphenyl) propane (also known as bisphenol A) is particularly preferable from the viewpoint of impact resistance. Two or more kinds of these aromatic dihydroxy compounds may be used in combination.

  As the carbonate precursor to be reacted with the aromatic dihydroxy compound, carbonyl halide, carbonate ester, haloformate and the like are used. Specifically, phosgene; diaryl carbonates such as diphenyl carbonate and ditolyl carbonate; dimethyl carbonate And dialkyl carbonates such as diethyl carbonate; and dihaloformates of dihydric phenols. Two or more of these carbonate precursors may be used in combination.

  The polycarbonate resin may be a branched aromatic polycarbonate resin obtained by copolymerizing a trifunctional or higher polyfunctional aromatic compound. Examples of the trifunctional or higher polyfunctional aromatic compound include phloroglucin, 4,6-dimethyl-2,4,6-tri (4-hydroxyphenyl) heptene-2, 4,6-dimethyl-2,4,6- Tri (4-hydroxyphenyl) heptane, 2,6-dimethyl-2,4,6-tri (4-hydroxyphenyl) heptene-3, 1,3,5-tri (4-hydroxyphenyl) benzene, 1, In addition to polyhydroxy compounds such as 1,1-tri (4-hydroxyphenyl) ethane, 3,3-bis (4-hydroxyaryl) oxyindole (also known as isatin bisphenol), 5-chloroisatin, Examples include 5,7-dichloroisatin and 5-bromoisatin. Among these, 1,1,1-tri (4-hydroxyphenyl) ethane is preferable. The polyfunctional aromatic compound is used by substituting a part of the aromatic dihydroxy compound, and the amount used is usually 0.01 to 10 mol%, preferably 0.1%, based on the aromatic dihydroxy compound. ~ 2 mol%.

  The molecular weight of the polycarbonate resin is not particularly limited, but the viscosity average molecular weight (Mv) calculated by measuring intrinsic viscosity at a temperature of 20 ° C. using an Ubbelohde viscometer using methylene chloride as a solvent is calculated. When used, it is usually 10,000 to 40,000. By setting the viscosity average molecular weight to 10,000 or more, the mechanical strength is improved and it is suitable for applications requiring high mechanical strength. On the other hand, when the viscosity average molecular weight is 40,000 or less, the fluidity is lowered and the molding process becomes easy. In addition, when forming hardened | cured films, such as a hard coat, in a post process, Preferably a viscosity average molecular weight is 18,000-35,000, More preferably, it is 20,000-30,000. By setting the viscosity average molecular weight to 18,000 or more, it is possible to suppress a decrease in impact strength when a cured coating is formed on the surface. By setting the viscosity average molecular weight to 35,000 or less, the moldability is hardly lowered, which is preferable. Further, two or more kinds of polycarbonate resins having different viscosity average molecular weights may be mixed.

Here, the viscosity average molecular weight (Mv) is methylene chloride as a solvent, the intrinsic viscosity [η] (unit dl / g) at a temperature of 20 ° C. is obtained with an Ubbelohde viscometer, and the Schnell viscosity equation ([η ] = 1.23 × 10 ⁻⁴ Mv ^0.83 ).

  The terminal hydroxyl group concentration of the polycarbonate resin is usually 2,000 mass ppm or less, preferably 1,500 mass ppm or less, more preferably 1,000 mass ppm or less, and particularly preferably 600 mass ppm or less. In addition, the lower limit is usually 10 ppm by mass, particularly in a polycarbonate resin produced by a transesterification method.

  By setting the terminal hydroxyl group concentration to 10 mass ppm or more, a decrease in molecular weight can be suppressed, and the mechanical properties of the resin composition tend to be further improved. Moreover, it exists in the tendency which the residence heat stability and color tone of a resin composition improve more by making terminal hydroxyl group density | concentration into 2,000 mass ppm or less. When forming a hard coating such as a hard coat, the terminal hydroxyl group concentration is 10 to 2,000 mass ppm, preferably 10 to 1,000 mass ppm, more preferably 10 to 1,000 mass ppm, and the terminal hydroxyl group concentration is high. By applying, its adhesion and durability are improved. The terminal hydroxyl group concentration is the ratio of the mass of the terminal hydroxyl group to the mass of the polycarbonate resin, and the measuring method is colorimetric determination by the titanium tetrachloride / acetic acid method (the method described in Macromol. Chem. 88 215 (1965)). It is.

  Moreover, in order to improve the appearance of the molded product and improve the fluidity, the transparent polycarbonate resin composition of the present invention may contain a polycarbonate oligomer. The viscosity average molecular weight of the polycarbonate oligomer is usually 1,500 to 9,500, preferably 2,000 to 9,000. The usage-amount of a polycarbonate oligomer is 30 mass% or less normally with respect to polycarbonate resin.

  Furthermore, the polycarbonate resin used in the transparent polycarbonate resin composition of the present invention may contain not only virgin polycarbonate resin but also polycarbonate resin regenerated from used products, so-called material recycled polycarbonate resin. Used products include optical recording media such as optical discs, light guide plates, vehicle transparent parts such as automobile window glass, automobile headlamp lenses, and windshields, containers such as water bottles, eyeglass lenses, soundproof walls, glass windows, and waves. Examples include building members such as plates. Also, non-conforming products, pulverized products obtained from sprues, runners, etc., or pellets obtained by melting them can be used. The used proportion of the regenerated polycarbonate resin is usually 80% by mass or less, preferably 50% by mass or less, based on the virgin polycarbonate resin.

  In addition to dyes or pigments, conventionally known arbitrary additives can be added to the transparent polycarbonate resin composition of the present invention. Examples thereof include mold release agents, heat stabilizers, antioxidants, and weather resistance. Examples include improvers, alkali soaps, metal soaps, plasticizers, fluidity improvers, nucleating agents, flame retardants, and anti-dripping agents. The amount of these additives used is appropriately selected from a known range.

[Constituent materials of frame members]
The constituent material of the frame member is not particularly limited, and is usually a thermoplastic resin mainly composed of a thermoplastic resin selected from the group consisting of polycarbonate resins such as aromatic polycarbonate resins, polyester resins, aromatic polyamide resins, and ABS resins. Although a resin composition is used, specifically, the following polycarbonate / polyethylene terephthalate composite resin composition is exemplified.

  To 100 parts by mass of a resin component consisting of 95 to 30% by mass of a polycarbonate resin and 5 to 70% by mass of a polyethylene terephthalate resin, 0.01 to 0.5 parts by mass of a phosphorus-based heat stabilizer and / or a hindered phenol-based heat stabilizer. A polyethylene terephthalate resin in which 0.01 to 1 part by mass, 1 to 10 parts by mass of an elastomer and 1 to 20 parts by mass of an inorganic filler are blended, and the polyethylene terephthalate resin has been subjected to a deactivation treatment of a polycondensation catalyst. A polycarbonate / polyethylene terephthalate composite resin composition (Japanese Patent Laid-Open No. 2010-261018).

  The polycarbonate / polyethylene terephthalate composite resin composition (hereinafter sometimes referred to as “the PC / PET composite resin composition of the present invention”) will be described below.

<Polycarbonate resin>
Examples of the polycarbonate resin used in the PC / PET composite resin composition of the present invention include aromatic polycarbonate resins, aliphatic polycarbonate resins, and aromatic-aliphatic polycarbonate resins, and aromatic polycarbonate resins are preferred.

  As aromatic polycarbonate resin, what was mentioned above as aromatic polycarbonate resin contained in the translucent and absorptive heat storage polycarbonate resin composition of this invention can be used.

  Preferred aromatic polycarbonate resins are polycarbonate resins derived from 2,2-bis (4-hydroxyphenyl) propane or derived from 2,2-bis (4-hydroxyphenyl) propane and other aromatic dihydroxy compounds. And polycarbonate copolymers. Further, for the purpose of imparting flame retardancy and the like, a polymer or oligomer having a siloxane structure can be copolymerized. The aromatic polycarbonate resin may be a mixture of two or more polymers and / or copolymers of different raw materials, and may have a branched structure up to 0.5 mol%.

  The terminal hydroxyl group content of the polycarbonate resin has a great influence on the thermal stability, hydrolysis stability, color tone and the like of the molded product. In order to give practical physical properties, it is usually 10 to 2,000 mass ppm, preferably 10 to 1,500 mass ppm, more preferably 20 to 1,000 mass ppm, and the terminal hydroxyl group content is adjusted. As the end-capping agent to be used, p-tert-butylphenol, phenol, cumylphenol, p-long chain alkyl-substituted phenol or the like can be used.

  As the amount of residual monomer in the polycarbonate resin, the aromatic dihydroxy compound is 150 ppm by mass or less, preferably 100 ppm by mass or less, and more preferably 50 ppm by mass or less. When synthesized by the transesterification method, the residual amount of carbonic acid diester is 300 ppm by mass or less, preferably 200 ppm by mass or less, more preferably 150 ppm by mass or less.

  The molecular weight of the polycarbonate resin is not particularly limited, but using a viscosity average molecular weight (Mv) calculated by measuring intrinsic viscosity at a temperature of 20 ° C. using an Ubbelohde viscometer using methylene chloride as a solvent, It is usually in the range of 10,000 to 50,000, preferably in the range of 11,000 to 40,000, more preferably in the range of 14,000 to 30,000. By setting the viscosity average molecular weight to 10,000 or more, the mechanical properties are more effectively exhibited, and by setting the viscosity average molecular weight to 50,000 or less, the molding process becomes easier. Further, two or more kinds of polycarbonate resins having different viscosity average molecular weights may be mixed, or a polycarbonate resin having a viscosity average molecular weight outside the above preferred range may be mixed to be within the above molecular weight range.

<Polyethylene terephthalate resin>
Polyethylene terephthalate resin is the ratio of oxyethylene oxyterephthaloyl units consisting of terephthalic acid and ethylene glycol (hereinafter sometimes referred to as “ET units”) to all the repeating units (hereinafter sometimes referred to as “ET ratio”). Is preferably a polyethylene terephthalate resin of 90 equivalent% or more, and the polyethylene terephthalate resin in the PC / PET composite resin composition of the present invention contains constituent repeating units other than ET units in a range of less than 10 equivalent%. May be. The polyethylene terephthalate resin is produced using terephthalic acid or a lower alkyl ester thereof and ethylene glycol as main raw materials, but other acid components and / or other glycol components may be used together as raw materials.

  Acid components other than terephthalic acid include phthalic acid, isophthalic acid, naphthalenedicarboxylic acid, 4,4′-diphenylsulfone dicarboxylic acid, 4,4′-biphenyldicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 1,3- Examples thereof include phenylenedioxydiacetic acid and structural isomers thereof, dicarboxylic acids such as malonic acid, succinic acid and adipic acid and derivatives thereof, and oxyacids such as p-hydroxybenzoic acid and glycolic acid or derivatives thereof.

  Examples of diol components other than ethylene glycol include 1,2-propanediol, 1,3-propanediol, 1,4-butanediol, aliphatic glycols such as pentamethylene glycol, hexamethylene glycol, and neopentyl glycol, cyclohexane Examples include alicyclic glycols such as dimethanol, and aromatic dihydroxy compound derivatives such as bisphenol A and bisphenol S.

  The raw material containing terephthalic acid or an ester-forming derivative thereof and ethylene glycol as described above is subjected to esterification or transesterification in the presence of an esterification catalyst or transesterification catalyst, and bis (β-hydroxyethyl) terephthalate and Then, an oligomer thereof is formed, and then a melt polycondensation is performed under high temperature and reduced pressure in the presence of a polycondensation catalyst and a stabilizer to obtain a polymer.

  The esterification catalyst is not particularly required because terephthalic acid serves as an autocatalyst for the esterification reaction. The esterification reaction can be carried out in the presence of an esterification catalyst and a polycondensation catalyst described later, and can be carried out in the presence of a small amount of an inorganic acid or the like. As the transesterification catalyst, alkali metal salts such as sodium and lithium, alkaline earth metal salts such as magnesium and calcium, and metal compounds such as zinc and manganese are preferably used. Above all, on the appearance of the obtained polyethylene terephthalate resin, Manganese compounds are particularly preferred.

  As the polycondensation catalyst, compounds soluble in a reaction system such as a germanium compound, an antimony compound, a titanium compound, a cobalt compound, and a tin compound are used alone or in combination. As the polycondensation catalyst, germanium dioxide is particularly preferable from the viewpoints of color tone and transparency. These polycondensation catalysts may be used in combination with a stabilizer in order to suppress the decomposition reaction during polymerization. Examples of the stabilizer include phosphate esters such as trimethyl phosphate, triethyl phosphate and triphenyl phosphate, and triphenyl phosphate. Phosphites such as phyto, trisdodecyl phosphite, methyl acid phosphate, dibutyl phosphate, monobutyl phosphate acidic phosphate, phosphorous compounds such as phosphoric acid, phosphorous acid, hypophosphorous acid, polyphosphoric acid Or 2 or more types are preferable.

  The use ratio of the above catalyst is generally in the range of 1 to 2,000 ppm, preferably 3 to 500 ppm, as the mass of the metal in the catalyst in the total polymerization raw material, and the use ratio of the stabilizer is in the total polymerization raw material, The mass of phosphorus atoms in the stabilizer is usually 10 to 1,000 ppm, preferably 20 to 200 ppm. The catalyst and the stabilizer can be supplied at any stage of the esterification reaction or transesterification reaction in addition to the preparation of the raw slurry. Further, it can be supplied at the beginning of the polycondensation reaction step.

The reaction temperature during the esterification reaction or transesterification reaction is usually 240 to 280 ° C., and the reaction pressure is usually 0.2 to 3 kg / cm ² G (20 to 300 kPa) as a relative pressure to the atmosphere. The reaction temperature during polycondensation is usually 250 to 300 ° C., and the reaction pressure is usually 500 to 0.1 mmHg (67 to 0.013 kPa) as an absolute pressure. Such esterification or transesterification reaction and polycondensation reaction may be performed in one step or in multiple steps. The polyethylene terephthalate resin thus obtained has an intrinsic viscosity of usually 0.45 to 0.70 dl / g, and is chipped by a conventional method. The average particle diameter of this chip is usually in the range of 2.0 to 5.5 mm, preferably 2.2 to 4.0 mm.

  Next, the polymer obtained by melt polycondensation as described above is usually subjected to solid phase polymerization. A polymer chip subjected to solid phase polymerization may be subjected to solid phase polymerization after preliminarily crystallizing by heating to a temperature lower than the temperature at which solid phase polymerization is performed in advance. Such precrystallization includes (a) a method in which a dry polymer chip is heated at a temperature of usually 120 to 200 ° C., preferably 130 to 180 ° C. for 1 minute to 4 hours, and (b) a dry polymer chip. A method of heating the water in an atmosphere of water vapor or water vapor-containing inert gas at a temperature of usually 120 to 200 ° C. for 1 minute or longer, (c) a polymer chip that absorbs moisture in a water, water vapor or water vapor-containing inert gas atmosphere and adjusts the humidity Can be performed by a method of heating at a temperature of usually 120 to 200 ° C. for 1 minute or more. The humidity control of the polymer chip is carried out so that the moisture content is usually in the range of 100 to 10,000 mass ppm, preferably 1,000 to 5,000 mass ppm. By subjecting the conditioned polymer chip to crystallization or solid phase polymerization, it is possible to further reduce the amount of acetaldehyde contained in PET and impurities contained in a trace amount.

The solid phase polymerization step consists of at least one stage, and usually has a polymerization temperature of 190 to 230 ° C., preferably 195 to 225 ° C., usually 1 kg / cm ² G to 10 mmHg (absolute pressure 200 to 1.3 kPa), preferably 0. The reaction is carried out under a flow of inert gas such as nitrogen, argon, carbon dioxide or the like under conditions of a polymerization pressure of 5 kg / cm ² G to 100 mmHg (150 to 13 kPa as an absolute pressure). The solid phase polymerization time may be shorter as the temperature is higher, but is usually 1 to 50 hours, preferably 5 to 30 hours, and more preferably 10 to 25 hours. The intrinsic viscosity of the polymer obtained by solid phase polymerization is usually in the range of 0.70 to 1.2 dl / g, preferably 0.70 to 1 dl / g.

  The intrinsic viscosity of the polyethylene terephthalate resin may be appropriately selected and determined, but is usually 0.5 to 2 dl / g, particularly 0.6 to 1.5 dl / g, particularly 0.7 to 1.0 dl / g. Preferably there is. By limiting the intrinsic viscosity to 0.5 dl / g or more, particularly 0.7 dl / g or more, mechanical properties, residence heat stability, chemical resistance, and heat and humidity resistance in the PC / PET composite resin composition of the present invention are achieved. Tends to be improved. Conversely, it is preferable that the intrinsic viscosity be less than 2 dl / g, particularly less than 1.0 dl / g, because the fluidity of the resin composition tends to be improved.

  Here, the intrinsic viscosity of the polyethylene terephthalate resin is a value measured at 30 ° C. using a mixed solvent of phenol / tetrachloroethane (mass ratio 1/1).

  The concentration of the terminal carboxyl group of the polyethylene terephthalate resin is usually 1 to 60 μeq / g, preferably 3 to 50 μeq / g, more preferably 5 to 40 μeq / g. When the terminal carboxyl group concentration is 60 μeq / g or less, the mechanical properties of the resin composition tend to be improved. Conversely, when the terminal carboxyl group concentration is 1 μeq / g or more, the heat resistance of the resin composition is increased. It is preferable because the thermal stability and hue tend to be improved.

  The terminal carboxyl group concentration of the polyethylene terephthalate resin can be determined by dissolving 0.5 g of polyethylene terephthalate resin in 25 mL of benzyl alcohol and titrating with a 0.01 mol / L benzyl alcohol solution of sodium hydroxide. it can.

  The polyethylene terephthalate resin used in the PC / PET composite resin composition of the present invention is obtained by subjecting the above-described polyethylene terephthalate resin to a polycondensation catalyst deactivation treatment. There is no restriction | limiting in particular as a deactivation processing method of the polycondensation catalyst of a polyethylene terephthalate resin, A conventionally well-known deactivation process can be given according to the polycondensation catalyst used. Examples of the deactivation treatment method include the following methods.

Deactivation treatment method of polycondensation catalyst 1: Hot water (steam) treatment of germanium catalyst A method of deactivating the germanium catalyst in the polyethylene terephthalate resin by treating the polyethylene terephthalate resin with hot water (steam).
Specifically, the container is filled with polyethylene terephthalate resin, and steam at 70 to 150 ° C., for example, about 100 ° C. is steamed through the polyethylene terephthalate resin in an amount of 1 to 100% by mass per hour for 5 to 6000 minutes. Dry after treatment.
The polyethylene terephthalate resin is immersed in 0.3 to 10 mass times distilled water of the polyethylene terephthalate resin in the container, and then the container containing the polyethylene terephthalate resin and distilled water is heated from the outside, and the internal temperature is set to 70 to 110. The temperature is controlled at 3 ° C. and the hot water treatment is performed for 3 to 3,000 minutes, followed by dehydration and drying.
The said drying is normally performed for 3 to 8 hours at 120-180 degreeC in inert gas, such as nitrogen.

Deactivation treatment method 2 of polycondensation catalyst: Addition of phosphorus compound to titanium catalyst A phosphorus compound is added to a polyethylene terephthalate resin to deactivate the titanium catalyst in the polyethylene terephthalate resin. In this case, the addition amount of phosphorus atoms is preferably in the range of 7 to 145 ppm based on the mass of the polyethylene terephthalate resin. When the addition amount of the phosphorus compound is less than 7 ppm, the deactivation of the catalyst is insufficient, and the intended effect of the present invention may not be obtained. When the addition amount of phosphorus atoms exceeds 145 ppm, the phosphorus compound itself becomes coarse aggregated particles, causing problems such as poor appearance and reduced impact resistance.

  In addition, as a phosphorus compound to add, conventionally well-known phosphate ester compounds, phosphite ester compounds, phosphonate compounds, etc. are mentioned. Among these, phosphonate compounds represented by the following general formula (a) are preferable.

R ¹¹ OC (O) ZP (O) (OR ¹² ) ₂ (a)
Wherein R ¹¹ and R ¹² are alkyl groups having 1 to 4 carbon atoms, Z is —CH ₂ — or —CH (Y) — (Y represents a phenyl group), and R ¹¹ and R ¹² are Each may be the same or different.)

  Among the phosphonate compounds represented by the above formula (a), an alkyl phosphonate compound is preferably exemplified, and among these, triethylphosphonoacetic acid is particularly preferable. These may be used alone or in combination of two or more.

  The deactivation treatment method of the polycondensation catalyst of the polyethylene terephthalate resin is an example of a deactivation treatment that can be adopted, and the deactivation treatment according to the present invention is not limited to the above method.

  Hereinafter, the polyethylene terephthalate resin subjected to the deactivation treatment of the polycondensation catalyst is referred to as “deactivated PET”, and the untreated polyethylene terephthalate resin is referred to as “untreated PET”.

The deactivated PET used in the PC / PET composite resin composition of the present invention is subjected to the deactivation treatment of the polycondensation catalyst in the polyethylene terephthalate resin as described above, whereby the solid PET calculated by the following general formula (b) is used. Phase polymerization rate Ks of 0.006 (dl / g · hr) or less, especially 0.005 (dl / g · hr) or less, especially about 0.001 to 0.004 (dl / g · hr) Is preferred.
Solid-phase polymerization rate Ks = ([η] s− [η] m) / T (b)
Here, [η] s is the intrinsic viscosity (dl / g) of the polyethylene terephthalate resin after the polyethylene terephthalate resin is held at 210 ° C. for 3 hours under a nitrogen stream, and [η] m is the polyethylene terephthalate. It is the intrinsic viscosity (dl / g) of the polyethylene terephthalate resin after holding the resin at 210 ° C. for 2 hours under a nitrogen stream. T is 1 (hour). That is, the intrinsic viscosity after being held at 210 ° C. for 3 hours under a nitrogen stream as [η] s, and the intrinsic viscosity after being held for 2 hours under the same conditions as [η] m, and using these values, The solid phase polymerization rate Ks calculated by the above equation (2) was defined as the solid phase polymerization rate Ks.

  When the solid phase polymerization rate Ks of the deactivated PET exceeds 0.006 (dl / g · hr), the deactivation treatment of the polycondensation catalyst is insufficient, and the residence heat deterioration is suppressed by using the deactivated PET. The effect cannot be obtained sufficiently. However, it is difficult to make the solid phase polymerization rate Ks excessively small, and it is usually 0.001 (dl / g · hr) or more.

<Resin component>
The resin component of the PC / PET composite resin composition of the present invention is 95% to 30% by mass of one or more of the above polycarbonate resins, and 5 to 70 of one or more of the above deactivated PETs. It consists of mass%.

  If the proportion of polycarbonate resin in the resin component is greater than the above upper limit and the proportion of deactivated PET is less than the above lower limit, the effect of improving chemical resistance by using PET cannot be sufficiently obtained, and conversely If the proportion of the polycarbonate resin is less than the above lower limit and the proportion of the deactivated PET is larger than the above upper limit, the original properties of the polycarbonate resin are impaired, and the impact resistance, heat resistance, etc. are lowered, which is not preferable.

  A preferable ratio is polycarbonate resin 90-40 mass%, deactivated PET 10-60 mass%, More preferably, polycarbonate resin 85-60 mass% and deactivated PET 15-40 mass%.

<Heat stabilizer>
The PC / PET composite resin composition of the present invention essentially contains a phosphorus-based heat stabilizer and / or a hindered phenol-based heat stabilizer with respect to the above-described resin component, and includes these specific heat stabilizers. Thereby, the inhibitory effect of staying heat deterioration by using inactivated PET as a polyethylene terephthalate resin can be further remarkably enhanced, and a resin composition excellent in staying heat deterioration resistance can be realized. That is, the thermal degradation can be suppressed by the phosphorus thermal stabilizer by the decomposition of the peroxide and the hindered phenol thermal stabilizer by capturing the peroxide radical.

  Examples of phosphorus heat stabilizers include phosphorus heat stabilizers such as phosphites and phosphates.

  Examples of phosphites include triphenyl phosphite, trisnonylphenyl phosphite, tris (2,4-di-tert-butylphenyl) phosphite, trinonyl phosphite, tridecyl phosphite, and trioctyl phosphite. , Trioctadecyl phosphite, distearyl pentaerythritol diphosphite, tricyclohexyl phosphite, monobutyl diphenyl phosphite, monooctyl diphenyl phosphite, distearyl pentaerythritol diphosphite, bis (2,4-di-tert-butyl Phenyl) pentaerythritol phosphite, bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol phosphite, 2,2-methylenebis (4,6-di-tert) Butylphenyl) triesters of phosphorous acid such as octyl phosphite, diesters, monoesters, and the like.

  Examples of the phosphate ester include trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, triphenyl phosphate, tricresyl phosphate, tris (nonylphenyl) phosphate, 2-ethylphenyl diphenyl phosphate, and the like.

  Further, phosphonite compounds such as tetrakis (2,4-di-tert-butylphenyl) -4,4-diphenylphosphonite are also preferable examples.

  Among the above phosphorus-based heat stabilizers, distearyl pentaerythritol diphosphite, bis (2,4-di-tert-butylphenyl) pentaerythritol phosphite, bis (2,6-di-tert-butyl-4) -Methylphenyl) pentaerythritol phosphite, phosphite compounds such as tris (2,4-di-tert-butylphenyl) phosphite are preferred, and among them bis (2,6-di-tert-butyl-4-methylphenyl) Pentaerythritol phosphite and tris (2,4-di-t-butylphenyl) phosphite are particularly preferred.

  As the hindered phenol heat stabilizer, pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], octadecyl-3- (3,5-di-tert-butyl- 4-hydroxyphenyl) propionate, thiodiethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], N, N′-hexane-1,6-diylbis [3- (3 5-di-tert-butyl-4-hydroxyphenylpropionamide), 2,4-dimethyl-6- (1-methylpentadecyl) phenol, diethyl [[3,5-bis (1,1-dimethylethyl)- 4-hydroxyphenyl] methyl] phosphoate, 3,3 ′, 3 ″, 5,5 ′, 5 ″ -hexa-tert-butyl Ru-a, a ′, a ″-(mesitylene-2,4,6-triyl) tri-p-cresol, 4,6-bis (octylthiomethyl) -o-cresol, ethylenebis (oxyethylene) bis [3- (5-tert-butyl-4-hydroxy-m-tolyl) propionate], hexamethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 1,3 5-tris (3,5-di-tert-butyl-4-hydroxybenzyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, 2,6-di-tert -Butyl-4- (4,6-bis (octylthio) -1,3,5-triazin-2-ylamino) phenol and the like.

  Among the above, pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) Propionate is preferred. These two phenolic heat stabilizers are commercially available from BASF under the names “Irganox 1010” and “Irganox 1076”.

  A phosphorus heat stabilizer may be used individually by 1 type, and may use 2 or more types together. Moreover, about a hindered phenol-type heat stabilizer, 1 type may be used independently and 2 or more types may be used together. Moreover, you may use together a phosphorus thermal stabilizer and a hindered phenol thermal stabilizer.

  The phosphorus-based heat stabilizer is used in an amount of 0.01 to 0.5 parts by weight, preferably 0.02 to 0.2 parts by weight, based on 100 parts by weight of the resin component composed of polycarbonate resin and deactivated PET. The hindered phenol heat stabilizer is used in an amount of 0.01 to 1 part by mass, preferably 0.05 to 0.2 part by mass, based on 100 parts by mass of the resin component composed of polycarbonate resin and deactivated PET. If the blending amount of these heat stabilizers is too small, it is not possible to sufficiently obtain the effect of suppressing the thermal deterioration due to the blending of the heat stabilizer, and if it is too much, the effect reaches a peak and is not economical. In addition, when using together a phosphorus heat stabilizer and a hindered phenol heat stabilizer, after making each heat stabilizer into the said mixing | blending range, a total compounding ratio is polycarbonate resin, deactivated PET resin, and It is preferable to use it so that it may become 0.07-0.4 mass part with respect to 100 mass parts of resin components which consist of.

<Elastomer>
The PC / PET composite resin composition of the present invention contains 1 to 10 parts by mass of an elastomer and 1 to 20 parts by mass of an inorganic filler with respect to 100 parts by mass of a resin component composed of a polycarbonate resin and deactivated PET. One of the characteristics is to suppress the thickening of the resin composition at the time of heat retention by blending an amount of elastomer. That is, by using the amount of elastomer, and preferably a specific elastomer, the aggregation of the elastomer during heat retention is suppressed, and the thickening due to the aggregation of the elastomer is suppressed, whereby the PC / PET composite resin composition Molding stability can be improved.

  The elastomer used in the PC / PET composite resin composition of the present invention is a copolymer obtained by copolymerizing a rubbery polymer having a glass transition temperature of 0 ° C. or lower, particularly −20 ° C. or lower, or a monomer component copolymerizable therewith. Any conventionally known one that is a coalescence and generally blended in a polycarbonate resin composition or the like and can improve its mechanical properties can be used.

  Examples of elastomers include polybutadiene, polyisoprene, diene copolymers (styrene / butadiene copolymers, acrylonitrile / butadiene copolymers, acrylic / butadiene rubber, etc.), copolymers of ethylene and α-olefin (ethylene).・ Propylene copolymers, ethylene / butene copolymers, ethylene / octene copolymers, etc., copolymers of ethylene and unsaturated carboxylic acid esters (ethylene / methacrylate copolymers, ethylene / butyl acrylate copolymers, etc.) ), Copolymers of ethylene and aliphatic vinyl compounds, terpolymers of ethylene, propylene and non-conjugated dienes, acrylic rubber (polybutyl acrylate, poly (2-ethylhexyl acrylate), butyl acrylate / 2-ethylhexyl acrylate copolymer Union) Corn-based rubber (a polyorganosiloxane rubber, a polyorganosiloxane rubber and a polyalkyl (meth) consisting of acrylate rubber-IPN composite rubber etc.) and the like. These may be used alone or in combination of two or more. “(Meth) acrylate” means “acrylate” and “methacrylate”, and “(meth) acrylic acid” described later means “acrylic acid” and “methacrylic acid”.

  Such an elastomer may be copolymerized with other monomer components as required. Preferred examples of the monomer component copolymerized as necessary include aromatic vinyl compounds, vinyl cyanide compounds, (meth) acrylic acid ester compounds, (meth) acrylic acid compounds, and the like. Other monomer components include epoxy group-containing (meth) acrylic acid ester compounds such as glycidyl (meth) acrylate; maleimide compounds such as maleimide, N-methylmaleimide, N-phenylmaleimide; maleic acid, phthalic acid, itacon Examples thereof include α, β-unsaturated carboxylic acid compounds such as acids and anhydrides thereof, such as maleic anhydride. These monomer components may be used alone or in combination of two or more.

  In order to improve the molding stability of the PC / PET composite resin composition of the present invention, it is particularly preferable to use a core / shell type graft copolymer type elastomer as the elastomer. In particular, at least one rubber polymer selected from butadiene-containing rubber, butyl acrylate-containing rubber, 2-ethylhexyl acrylate-containing rubber, and silicone-based rubber is used as a core layer, and an acrylic ester, a methacrylic ester, and a fragrance around the core layer. A core / shell type graft copolymer comprising a shell layer formed by copolymerizing at least one monomer component selected from an aromatic vinyl compound is particularly preferred. More specifically, methyl methacrylate-butadiene-styrene polymer (MBS), methyl methacrylate-acrylonitrile-butadiene-styrene polymer (MABS), methyl methacrylate-butadiene polymer (MB), methyl methacrylate-acrylic rubber polymer ( MA), methyl methacrylate-acrylic butadiene rubber copolymer, methyl methacrylate-acrylic butadiene rubber-styrene copolymer, methyl methacrylate- (acrylic silicone IPN (interpenetrating polymer network) rubber) polymer, etc. Mention may be made of a core / shell type elastomer comprising a polymethyl methacrylate (PMMA) -based polymerization or copolymer block.

  Examples of such core / shell type elastomers include, for example, EXL series such as Paraloid EXL2315, EXL2602, and EXL2603 manufactured by Rohm & Haas Japan, KM series such as KM330 and KM336P, KCZ series such as KCZ201, and Mitsubishi Rayon. Examples include Metablene S-2001 and SRK-200 manufactured by the company.

  Other specific examples of the rubbery polymer obtained by copolymerizing a rubbery polymer with a monomer component copolymerizable therewith include polybutadiene rubber, styrene-butadiene copolymer (SBR), and styrene-butadiene-styrene. Block copolymer (SBS), styrene-ethylene / butylene-styrene block copolymer (SEBS), styrene-ethylene / propylene-styrene block copolymer (SEPS), ethylene-ethyl acrylate copolymer (EEA), ethylene -A methyl acrylate copolymer (EMA) etc. are mentioned.

  These elastomers may be used individually by 1 type, and may use 2 or more types together.

The content ratio of the elastomer in the PC / PET composite resin composition of the present invention is 1 to 10 parts by mass, preferably 2 to 9 parts by mass, more preferably 100 parts by mass of the resin component composed of polycarbonate resin and deactivated PET. Is 3-8 parts by mass.
If the elastomer content is less than the above lower limit value, the impact strength improvement effect and molding stability improvement effect due to the blending of the elastomer cannot be sufficiently obtained, and if the above upper limit value is exceeded, thermal stability and rigidity are not obtained. Inferior.

<Inorganic filler>
The PC / PET composite resin composition of the present invention contains 1 to 10 parts by mass of an elastomer and 1 to 20 parts by mass of an inorganic filler with respect to 100 parts by mass of a resin component composed of a polycarbonate resin and deactivated PET. One of the characteristics is to suppress the thickening of the resin composition during heat retention by blending a specific amount of inorganic filler. Further, as the inorganic filler used in the present invention, by using a surface treatment that has been improved in adhesion with the resin component, poor dispersion of the inorganic filler during heat retention is suppressed, resulting in aggregation. It is more preferable because it can suppress thickening and improve the molding stability of the PC / PET composite resin composition.

  Examples of the inorganic filler include glass fiber, carbon fiber, metal fiber, ceramic fiber, milled fiber thereof, slag fiber, rock wool, wollastonite, zonotlite, potassium titanate whisker, aluminum borate whisker, and boron whisker. , Fibrous inorganic fillers such as basic magnesium sulfate whiskers, glass flakes, glass beads, graphite, talc, mica, kaolinite, sepiolite, attabargite, montmorillonite, bentonite, smectite and other silicate compounds, silica, alumina, carbonic acid An inorganic filler such as calcium may be used. These inorganic fillers may have a surface coated with a different material such as metal-coated glass fiber or metal-coated carbon fiber. These inorganic fillers may be used alone or in combination of two or more.

  Among these, glass fiber, carbon fiber, and these milled fibers are advantageous in terms of improving molding stability. In particular, the glass fiber and the milled fiber are stronger than the resin component composed of polycarbonate resin and deactivated PET. This is advantageous in that good adhesion is achieved. As the inorganic filler, glass fiber is particularly preferable.

As glass fiber, glass compositions, such as A glass, C glass, and E glass, are not specifically limited, In some cases, components such as TiO ₂ , SO ₃ , and P ₂ O ₅ may be contained. However, E glass (non-alkali glass) is more preferable.

  Moreover, although it does not specifically limit as an average fiber diameter of glass fiber, A 1-25 micrometers thing is used normally, Preferably it is 3-17 micrometers. Glass fibers having an average fiber diameter in this range are good in terms of both the thermal expansion coefficient and the resistance to peeling force. When the fiber diameter is reduced, the area of the interface with the resin component is increased, so that the effect of improving the molding stability is good. However, the unfavorable influence on the peeling force by the interface increases. Where interfacial adhesion is a priority, the use of larger diameter glass fibers can be a prescription.

  The preferred fiber length of the glass fiber is 50 to 1,000 μm, preferably 100 to 500 μm, particularly preferably 120 to 300 μm, as the number average fiber length in the resin composition pellet or molded product. The number average fiber length of the glass fibers is determined by observing the glass fiber residue collected after dissolving the molded product in a solvent or decomposing the resin with a basic compound with an optical microscope, and analyzing the image from the obtained image. It is a value calculated by the device. In calculating the number average fiber length, fibers having a length equal to or less than the fiber diameter are not counted. In other fibrous fillers, the number average fiber length is suitably 1,000 μm or less.

  The inorganic filler such as glass fiber is preferably surface-treated with a silane coupling agent or the like in order to achieve stronger adhesion between the polycarbonate resin and the resin component made of deactivated PET. Examples of reactive groups in such silane coupling agents include epoxy groups, amino groups, vinyl groups, and methacryloxy groups, with epoxy groups and amino groups being particularly preferred.

  Further, glass fibers and carbon fibers are usually coated with a surface for bundling the fibers. Since the adhesion to the resin component is greatly affected by the surface coating agent, the selection of the surface coating agent is important. A surface coating agent made of an epoxy group-containing compound is preferred from the viewpoint of securing a strong bond with the resin component and improving molding stability. The epoxy group-containing compound is rich in reactivity with a resin component composed of a polycarbonate resin and deactivated PET, has good adhesion, and is excellent in adhesion moisture and heat resistance.

  Although various epoxy group-containing compounds can be used as the surface treatment agent for inorganic fillers such as glass fibers, the epoxy group-containing compound preferably has a polymer structure having a molecular weight of 500 or more. Preferably, it contains a plurality of epoxy groups in one molecule. Moreover, the structure mainly comprised from an aromatic ring from a heat resistant viewpoint is preferable.

  More specifically, suitable epoxy group-containing compounds include epoxy resins, especially phenol novolac type epoxy resins and linear cresol novolac type epoxy resins, with phenol novolac type epoxy resins being particularly preferred.

  The glass fiber preferably used as the inorganic filler may have a glycidyl group on the surface by being treated with the above-described silane coupling agent having an epoxy group or a surface coating agent composed of an epoxy group-containing compound. In view of making the effect of the present invention remarkable, it is preferable.

The content ratio of the inorganic filler in the PC / PET composite resin composition of the present invention is 1 to 20 parts by mass, preferably 2 to 15 parts by mass, with respect to 100 parts by mass of the resin component composed of polycarbonate resin and deactivated PET. More preferably, it is 3-10 mass parts.
If the content of the inorganic filler is less than the lower limit, the effect of improving the dimensional stability and rigidity due to the blending of the inorganic filler cannot be obtained sufficiently, and if the upper limit is exceeded, the impact strength is inferior.

<Combination of elastomer and inorganic filler>
In the PC / PET composite resin composition of the present invention, as described above, 1 to 10 parts by mass of an elastomer and 1 to 20 parts by mass of an inorganic filler with respect to 100 parts by mass of a resin component composed of a polycarbonate resin and deactivated PET. In order to obtain the effect of improving the molding stability more effectively, the elastomer and the inorganic filler should be elastomer: inorganic filler = 1: 0.1-20, particularly 1: 0.2-10. It is preferable to use it in a proportion by mass, and it is preferable to use 2 to 30 parts by mass, particularly 5 to 20 parts by mass with respect to 100 parts by mass of the resin component consisting of the polycarbonate resin and deactivated PET in total of the elastomer and the inorganic filler. .

<Other ingredients>
In the PC / PET composite resin composition of the present invention, in addition to the above-mentioned polycarbonate resin and deactivated PET, a heat stabilizer, an elastomer, and an inorganic filler, an ordinary polycarbonate resin composition, as long as the effects of the present invention are not impaired. Various other additives contained in the product may be contained.

  As various additives that can be contained, antioxidants, mold release agents, ultraviolet absorbers, dyes and pigments, reinforcing agents, flame retardants, impact modifiers, antistatic agents, antifogging agents, lubricants, antiblocking agents, Examples thereof include a fluidity improver, a plasticizer, a dispersant, and a fungicide. Two or more of these may be used in combination. Hereinafter, an example of an additive suitable for the PC / PET composite resin composition will be specifically described.

  The release agent is at least one selected from the group consisting of aliphatic carboxylic acids, esters of aliphatic carboxylic acids and alcohols, aliphatic hydrocarbon compounds having a number average molecular weight of 200 to 15,000, and polysiloxane silicone oils. Compounds.

  Examples of the aliphatic carboxylic acid include saturated or unsaturated aliphatic monovalent, divalent or trivalent carboxylic acid. Here, the aliphatic carboxylic acid includes alicyclic carboxylic acid. Among these, preferable aliphatic carboxylic acids are monovalent or divalent carboxylic acids having 6 to 36 carbon atoms, and aliphatic saturated monovalent carboxylic acids having 6 to 36 carbon atoms are more preferable. Specific examples of such aliphatic carboxylic acids include palmitic acid, stearic acid, caproic acid, capric acid, lauric acid, arachidic acid, behenic acid, lignoceric acid, serotic acid, melissic acid, tetrariacontanoic acid, montanic acid, adipine Examples include acids and azelaic acid.

  As the aliphatic carboxylic acid in the ester of an aliphatic carboxylic acid and an alcohol, the same one as the aliphatic carboxylic acid can be used. On the other hand, examples of the alcohol include saturated or unsaturated monovalent or polyhydric alcohols. These alcohols may have a substituent such as a fluorine atom or an aryl group. Among these, a monovalent or polyvalent saturated alcohol having 30 or less carbon atoms is preferable, and an aliphatic saturated monohydric alcohol or polyhydric alcohol having 30 or less carbon atoms is more preferable. Here, aliphatic includes alicyclic compounds. Specific examples of such alcohols include octanol, decanol, dodecanol, stearyl alcohol, behenyl alcohol, ethylene glycol, diethylene glycol, glycerin, pentaerythritol, 2,2-dihydroxyperfluoropropanol, neopentylene glycol, ditrimethylolpropane, dipentaerythritol and the like. Is mentioned.

  In addition, said ester compound may contain aliphatic carboxylic acid and / or alcohol as an impurity, and may be a mixture of a some compound.

  Specific examples of esters of aliphatic carboxylic acids and alcohols include beeswax (a mixture based on myricyl palmitate), stearyl stearate, behenyl behenate, stearyl behenate, glycerin monopalmitate, glycerin monostearate Examples thereof include rate, glycerol distearate, glycerol tristearate, pentaerythritol monopalmitate, pentaerythritol monostearate, pentaerythritol distearate, pentaerythritol tristearate, pentaerythritol tetrastearate and the like.

  Examples of the aliphatic hydrocarbon having a number average molecular weight of 200 to 15,000 include liquid paraffin, paraffin wax, microwax, polyethylene wax, Fischer-Tropsch wax, and α-olefin oligomer having 3 to 12 carbon atoms. Here, as the aliphatic hydrocarbon, alicyclic hydrocarbon is also included. Moreover, these hydrocarbon compounds may be partially oxidized. Among these, paraffin wax, polyethylene wax, or a partial oxide of polyethylene wax is preferable, and paraffin wax and polyethylene wax are more preferable. The number average molecular weight is preferably 200 to 5,000. These aliphatic hydrocarbons may be a single substance, or may be a mixture of various constituent components and molecular weights, as long as the main component is within the above range.

  Examples of the polysiloxane silicone oil include dimethyl silicone oil, phenylmethyl silicone oil, diphenyl silicone oil, and fluorinated alkyl silicone. Two or more of these may be used in combination.

  Content of a mold release agent is 0.001-2 mass parts normally with respect to a total of 100 mass parts of polycarbonate resin and deactivated PET, Preferably it is 0.01-1 mass part. When the content of the release agent is less than 0.001 part by mass, the effect of releasability may not be sufficient. When the content exceeds 2 parts by mass, the hydrolysis resistance is deteriorated and the mold is contaminated during injection molding. Such problems may occur.

  Specific examples of the ultraviolet absorber include organic ultraviolet absorbers such as benzotriazole compounds, benzophenone compounds, and triazine compounds in addition to inorganic ultraviolet absorbers such as cerium oxide and zinc oxide. Of these, organic ultraviolet absorbers are preferred. In particular, benzotriazole compounds, 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5-[(hexyl) oxy] -phenol, 2- [4,6-bis (2, 4-Dimethylphenyl) -1,3,5-triazin-2-yl] -5- (octyloxy) phenol, 2,2 ′-(1,4-phenylene) bis [4H-3,1-benzoxazine-4- ON], [(4-methoxyphenyl) -methylene] -propanedioic acid-dimethyl ester is preferred.

  Specific examples of the benzotriazole compound include condensates of methyl-3- [3-tert-butyl-5- (2H-benzotriazol-2-yl) -4-hydroxyphenyl] propionate-polyethylene glycol. Specific examples of other benzotriazole compounds include 2-bis (5-methyl-2-hydroxyphenyl) benzotriazole, 2- (3,5-di-tert-butyl-2-hydroxyphenyl) benzotriazole, 2- (3 ′, 5′-di-tert-butyl-2′-hydroxyphenyl) -5-chlorobenzotriazole, 2- (3-tert-butyl-5-methyl-2-hydroxyphenyl) -5-chloro Benzotriazole, 2- (2′-hydroxy-5′-tert-octylphenyl) benzotriazole, 2- (3,5-di-tert-amyl-2-hydroxyphenyl) benzotriazole, 2- [2-hydroxy- 3,5-bis (α, α-dimethylbenzyl) phenyl] -2H-benzotriazole, 2,2′-methyl Ren-bis [4- (1,1,3,3-tetramethylbutyl) -6- (2N-benzotriazol-2-yl) phenol] [methyl-3- [3-tert-butyl-5- (2H- Benzotriazol-2-yl) -4-hydroxyphenyl] propionate-polyethylene glycol] condensate. Two or more of these may be used in combination.

  Of the above, preferably 2- (2′-hydroxy-5′-tert-octylphenyl) benzotriazole, 2- [2-hydroxy-3,5-bis (α, α-dimethylbenzyl) phenyl]- 2H-benzotriazole, 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5-[(hexyl) oxy] -phenol, 2- [4,6-bis (2,4 -Dimethylphenyl) -1,3,5-triazin-2-yl] -5- (octyloxy) phenol, 2,2'-methylene-bis [4- (1,1,3,3-tetramethylbutyl)- 6- (2N-benzotriazol-2-yl) phenol].

  Content of a ultraviolet absorber is 0.01-3 mass parts normally with respect to a total of 100 mass parts of polycarbonate resin and deactivated PET, Preferably it is 0.1-1 mass part. When the content of the ultraviolet absorber is less than 0.01 parts by mass, the effect of improving the weather resistance may be insufficient, and when it exceeds 3 parts by mass, a problem such as mold deposit may occur.

  Examples of the dye / pigment include inorganic pigments, organic pigments, and organic dyes. Examples of inorganic pigments include, for example, sulfide pigments such as carbon black, cadmium red, and cadmium yellow; silicate pigments such as ultramarine blue; zinc white, petal, chromium oxide, titanium oxide, iron black, titanium yellow, and zinc- Oxide pigments such as iron brown, titanium cobalt green, cobalt green, cobalt blue, copper-chromium black and copper-iron black; chromic pigments such as chrome lead and molybdate orange; Examples include Russian pigments. Organic pigments and organic dyes include phthalocyanine dyes such as copper phthalocyanine blue and copper phthalocyanine green; azo dyes such as nickel azo yellow; thioindigo, perinone, perylene, quinacridone, dioxazine, and isoindolinone. And condensed polycyclic dyes such as quinophthalone; anthraquinone, heterocyclic, and methyl dyes and the like. Two or more of these may be used in combination. Among these, carbon black, titanium oxide, cyanine-based, quinoline-based, anthraquinone-based, and phthalocyanine-based compounds are preferable from the viewpoint of thermal stability.

  The content of the dye / pigment is usually 5 parts by mass or less, preferably 3 parts by mass or less, and more preferably 2 parts by mass or less with respect to 100 parts by mass in total of the polycarbonate resin and deactivated PET. When the content of the dye / pigment exceeds 5 parts by mass, the impact resistance may not be sufficient.

  Examples of the flame retardant include halogenated bisphenol A polycarbonate, brominated bisphenol epoxy resin, brominated bisphenol phenoxy resin, halogenated flame retardant such as brominated polystyrene, phosphate ester flame retardant, diphenylsulfone-3,3 ′. -Organic metal salt flame retardants such as dipotassium disulfonate, potassium diphenylsulfone-3-sulfonate, potassium perfluorobutanesulfonate, and polyorganosiloxane flame retardants are preferable, but phosphate ester flame retardants are particularly preferable. .

  Specific examples of the phosphate ester flame retardant include triphenyl phosphate, resorcinol bis (dixylenyl phosphate), hydroquinone bis (dixylenyl phosphate), 4,4′-biphenol bis (dixylenyl phosphate), bisphenol A Examples thereof include bis (dixylenyl phosphate), resorcinol bis (diphenyl phosphate), hydroquinone bis (diphenyl phosphate), 4,4′-biphenol bis (diphenyl phosphate), bisphenol A bis (diphenyl phosphate), and the like. Two or more of these may be used in combination. In these, resorcinol bis (dixylenyl phosphate) and bisphenol A bis (diphenyl phosphate) are preferable.

  Content of a flame retardant is 1-30 mass parts normally with respect to a total of 100 mass parts of polycarbonate resin and deactivated PET, Preferably it is 3-25 mass parts, More preferably, it is 5-20 mass parts. When the content of the flame retardant is less than 1 part by mass, the flame retardancy may not be sufficient, and when it exceeds 30 parts by mass, the heat resistance may decrease.

  Examples of the anti-dripping agent include fluorinated polyolefins such as polyfluoroethylene, and polytetrafluoroethylene having fibril forming ability is particularly preferable. This shows the tendency to disperse | distribute easily in a polymer and to couple | bond together polymers and to make a fibrous material. Polytetrafluoroethylene having fibril-forming ability is classified as type 3 according to the ASTM standard. Polytetrafluoroethylene can be used in solid form or in the form of an aqueous dispersion. Examples of polytetrafluoroethylene having fibril-forming ability include “Teflon (registered trademark) 6J” or “Teflon (registered trademark) 30J” from Mitsui DuPont Fluorochemical Co., Ltd. and “Polyflon (trade name) from Daikin Industries, Ltd. Is commercially available.

  Content of a dripping inhibitor is 0.02-4 mass parts normally with respect to a total of 100 mass parts of polycarbonate resin and deactivated PET, Preferably it is 0.03-3 mass parts. When the content of the dripping inhibitor exceeds 5 parts by mass, the appearance of the molded product may be deteriorated.

  The PC / PET composite resin composition of the present invention may contain a resin component and a rubber component other than the polycarbonate resin and the deactivated PET and the aforementioned elastomer. In this case, as other resin or rubber component, for example, acrylonitrile-styrene copolymer, acrylonitrile-butadiene-styrene copolymer, styrene resin such as polystyrene resin, polyolefin resin such as polyethylene resin and polypropylene resin, polyamide resin , Polyimide resin, polyetherimide resin, polyurethane resin, polyphenylene ether resin, polyphenylene sulfide resin, polysulfone resin, polymethacrylate resin, phenol resin, epoxy resin, etc., but the content of these other resins or rubber components is In order to sufficiently secure the effect of the combined use of the polycarbonate resin and the deactivated PET, it is preferably 20 parts by mass or less with respect to 100 parts by mass in total of the polycarbonate resin and the deactivated PET.

  Moreover, it is also preferable to mix | blend the high heat conductive filler with the constituent material of the frame member of this invention in the range which does not impair the effect of this invention, and to provide the performance of high heat conductivity. When heat is stored in the panel body, it is possible to dissipate the heat efficiently.

  Specific examples of the high thermal conductive filler include carbon fiber, thermal conductive powder such as graphite and boron nitride, plate-like graphite, metal-coated carbon fiber, metal-coated graphite, metal-coated glass, aluminum oxide, aluminum nitride, Examples thereof include boron carbide, silicon nitride, silicon carbide, zinc oxide, magnesium oxide, metal fiber, and metal powder.

  The content of these high thermal conductive fillers is preferably 5 to 40 parts by mass, and more preferably 5 to 30 parts by mass with respect to 100 parts by mass in total of the polycarbonate resin and deactivated PET. If the content of the high thermal conductive filler is less than 5 parts by mass, sufficient thermal conductivity may not be imparted, and if it exceeds 40 parts by mass, moldability and impact resistance may be deteriorated.

  When imparting high thermal conductivity to the constituent material of the frame member, it is preferable that the thermal conductivity is high, preferably 0.5 W / m · K or more, more preferably 1 W / m · K or more, and even more preferably 3 W / m. · K or more, particularly preferably 5 W / m · K or more. If the thermal conductivity is less than 0.5 W / m · K, the heat of the panel body cannot be efficiently radiated, and sufficient heat radiation efficiency may not be obtained. The upper limit of the thermal conductivity is preferably 50 W / m · K, more preferably 40 W / m · K, and particularly preferably 30 W / m · K. When the thermal conductivity is higher than 50 W / m · K, a large amount of a high thermal conductive filler is added to the resin composition, which is not preferable because the resin composition is likely to solidify during injection molding and easily cause poor filling. .

In addition, in this invention, the heat conductivity of the structural material of a frame member is measured by the method described in the term of the below-mentioned Example.

  Even when high thermal conductivity is imparted to the frame member, the frame member can be disposed on the peripheral edge of the surface of the heat insulating layer of the panel body. However, as shown in FIG. Or it is preferable to arrange the whole so as to communicate with the IR absorption layer in terms of efficient heat dissipation. This configuration will be described later.

<Method for producing PC / PET composite resin composition>
The PC / PET composite resin composition of the present invention is a polycarbonate resin, deactivated PET, elastomer, inorganic filler, phosphorus-based heat stabilizer and / or hindered phenol-based heat stabilizer, and others added as necessary. Using any of these additives, any conventionally known method can be appropriately selected for production.

  Specifically, polycarbonate resins, deactivated PET, elastomers, inorganic fillers, phosphorus-based heat stabilizers and / or hindered phenol-based heat stabilizers, and additives that are blended as necessary are added to tumblers and Henschel mixers. The resin composition can be produced by premixing using various mixers such as a banbury mixer, roll, brabender, single-screw kneading extruder, twin-screw kneading extruder, kneader and the like. Moreover, it is also possible to produce a resin composition without mixing each component in advance, or by mixing only some components in advance and supplying them to an extruder using a feeder and melt-kneading them.

[Panel using high thermal conductivity frame member (exhaust heat panel)]
In the following, as shown in FIG. 2B, the IR absorption layer 2b is provided so as to constitute the peripheral portion of the heat insulating layer 2a, and the highly heat conductive frame member 3 is provided in contact with the IR absorption layer 2b. As a result, heat transfer from the heat absorbed and stored in the IR absorbing layer 2b is blocked by the heat insulating layer 2a and transmitted to the highly heat conductive frame member 3 side to be radiated to the panel support side through the frame member 3. The panel of the present invention configured as described above (hereinafter sometimes referred to as “exhaust heat type panel”) will be described.
Note that the contents described in the above-mentioned panel are applied as they are to the shape and dimensions of the panel main body and the frame member also in the exhaust heat type panel.

  7a to 7g are cross-sectional views of an end portion of the panel showing an embodiment of the exhaust heat type panel of the present invention, and FIGS. 8 to 18 show an embodiment of the installation structure of the exhaust heat type panel of the present invention. It is sectional drawing shown. 8 to 18, members corresponding to the seal member 26 shown in FIG. 3C are not shown. In these drawings, the interface between the IR absorption layer and the heat insulating layer of the panel body is indicated by a one-dot chain line.

  The panel 1 in FIG. 7a corresponds to the panel 51C shown in FIG. 2B, and the entire peripheral edge of the panel body 2 and one panel surface (rear surface) of the panel body 2 (corresponding to the panel body 52C). And a frame member 3 provided in the section. Since the frame member 3 is made of a highly heat conductive material, the heat stored in the IR absorption layer of the panel body 2 can be radiated through the frame member 3.

  In FIG. 7a, the surface of the panel body 2 on which the frame member 3 is formed is flat, and no groove is provided.

  In the panel 1A of FIG. 7b, the groove 4 is provided in the frame member forming portion at the entire peripheral edge of one panel surface of the panel body 2A, and the frame member 3 is provided so as to be fitted in the groove 4. ing. The depth of the groove 4 is preferably about 1 to 50% of the thickness of the frame member 3, more preferably 10 to 50%, and still more preferably 10 to 40%. When the mating depth is shallow, the effect of improving the heat transfer effect due to mating may be low. When the mating depth is deep, stress concentration is caused by the difference in the dimensional change between the panel body and the frame member due to changes in the thermal environment. Or stress concentration at the time of deformation due to the difference in rigidity occurs, and it becomes easy to cause defects such as breakage and deformation. The frame member 3 protrudes from the rear surface of the panel body 2. The entire inner surface of the groove 4 is in contact with the frame member 3 without a gap. Other configurations of the panel 1A are the same as those of the panel 1.

  In the panel 1B of FIG. 7c, the recess 5 is provided on each of the outer side surface and the inner side surface of the frame member 3A, whereby the side surface of the frame member 3A has a radiating fin shape with an increased surface area. . In this embodiment, a plurality of strips 5 (three strips in the drawing) are provided in the thickness direction of the frame member 3A. The recess 5 desirably extends continuously in the circumferential direction of the panel 1B, but may be provided so as to be interrupted in the extending direction. Further, a plurality of protrusions (convex portions) may be provided instead of the concave stripes. In this panel 1B, the peripheral edge portion of the frame member forming surface of the panel body 2 is the same flat as in FIG. 7a, but a groove 4 may be provided as in the panel 1A in FIG. 7b. Other configurations of the panel 1B are the same as those of the panel 1.

  In the panel 1 </ b> B ′ of FIG. 7 d, a high thermal conductivity attachment 6 such as a metal is attached to the side surface of the frame member 3. A leg piece 6 a fitted in the groove 5 is provided on the back surface of the attachment 6. By mounting the high thermal conductivity attachment 6, heat dissipation from the frame member 3A is promoted. Other configurations of the panel 1B 'are the same as those of the panel 1B.

  In the panel 1C of FIG. 7e, the convex portion 2x is provided on the frame member forming portion on the entire peripheral edge of one panel surface of the panel body 2B, while the frame member 3M is fitted to the convex portion 2x. A recess 3x is provided. The other configuration of the panel 1C is the same as that of the panel 1. In the panel 1C ′ of FIG. 7f, a recess 2x ′ is provided in the frame member forming portion at the entire peripheral edge of one panel surface of the panel body 2B ′, while the recess 2x ′ is provided in the frame member 3M ′. Convex part 3x 'which fits in is provided. The other configuration of the panel 1C 'is the same as that of the panel 1. In these panels 1C and 1C ', heat transfer efficiency is improved by the concavo-convex structure of the contact surfaces of the panel bodies 2B and 2B' and the frame members 3M and 3M '. The fitting depths of the concavo-convex portions on the contact surfaces of the panel bodies 2B and 2B ′ of the panels 1C and 1C ′ and the frame members 3M and 3M ′ are the same as the fitting structure of the panel body 1A of FIG. For the reason, the height of the convex portion 2x of the panel body 2B of the panel 1C and the depth of the concave portion 3x of the frame member 3M are preferably 1 to 50% of the thickness of the frame member 3M, more preferably 10 to 10%. 50%, more preferably 10 to 40%. Similarly, the depth of the concave portion 2x ′ of the panel body 2B ′ of the panel 1C ′ and the height of the convex portion 3x ′ of the frame member 3M ′ are 1 to 1 of the thickness including the convex portion 3x ′ of the frame member 3M ′. It is preferably 50%, more preferably 10 to 50%, still more preferably 10 to 40%.

  An attachment piece for attaching another component may be further provided on the frame member. Moreover, as shown in the panel installation structure of FIGS. 8 and 9 to be described later, a snap fit may be provided so as to be a resin rivet structure. Furthermore, a recess for fitting a bolt or metal piece may be provided.

  The dimensions and shapes of the frame member and the panel body are as described above.

  When the groove 4 is provided in the panel main body 2A and the frame member 3 is provided so as to be fitted in the groove 4 as shown in FIG. 7b, the groove is fitted in the inside of the panel main body, although not shown. The corner portion of the frame member is preferably R-shaped in order to relieve stress concentration due to the difference in coefficient of linear expansion between the panel body and the frame member. The R shape is preferably 0.5R to 10R, more preferably 0.5R to 5R, and still more preferably 1R to 3R. If this R shape is small, the effect may not be exerted in alleviating stress concentration. If the R shape is large, the contact area between the panel main body and the frame member becomes small, and the adhesion strength between them and the durability of the adhesion strength may decrease.

  As described above, an uneven portion is formed at the boundary portion (joint surface) between the rear surface of the panel body and the frame member, and the coupling strength between the panel body and the frame member can be increased by the uneven fitting structure. Good. Moreover, you may project the attachment piece for attaching other components to a frame member.

Further, the frame member is not limited to a rectangular section having the same thickness in the width direction (inner side from the outer edge of the panel (center side of the panel main body)), and the inner side (the plate of the panel main body 2). The thickness may decrease continuously or stepwise toward the center side.
Examples of such a panel include a panel 1 ′ provided with a trapezoidal frame member 3 ′ shown in FIG. 7g. The thickness of the frame members of the panels shown in FIGS. 1 and 2 and FIGS. 7a to 7f and FIGS. 8 to 18 to be described later may also be changed.
Thus, by thinning the thickness of the frame member toward the center of the panel body, the panel body and the frame member are integrally formed by injection molding, in particular, the panel body is first injection molded, When the frame member is injection-molded, the shrinkage stress of the frame member is relieved, and the distortion of the panel body is easily prevented. In order to make this relaxation stress relaxation effect good, in the panel 1 ′ having the frame member 3 ′ as shown in FIG. 7g, the thickness t ₂ of the frame member 3 ′ and the total width L _{1 of the} frame member. and it is preferably in the following relationship with the width L ₂ of the portion where the thickness is reduced.
L ₂ / t ₂ ≧ 1.75
1> L ₂ / L ₁ ≧ 0.25

[Panel installation structure]
Next, with reference to FIGS. 8-18, embodiment of the installation structure of the exhaust heat type panel of this invention is described.

  8 to 18 show a structure in which the exhaust heat type panel of the present invention is attached to a support body such as a vehicle body window frame frame. It is not limited.

A panel 1D in FIG. 8 includes a panel main body 2 and a frame member 3B provided on the entire peripheral edge of one panel surface (rear surface) of the panel main body 2. A snap fit 7 is provided on the surface of the frame member 3B opposite to the panel main body 2, and the snap fit 7 is engaged with a mounting hole 9 provided in the support 8, so that the panel 1D is engaged. Attached to the support 8. The snap fit 7 is a pair of L-shaped cross-sectional projecting pieces and faces the direction in which the flanges provided at the front ends of the pair of snap fits 7 are separated from each other. By engaging the flange with the edge of the attachment hole 9, the panel 1 </ b> D is fixed to the support 8 via the snap fit 7.
The frame member 3B may be connected to the support body 8 not only by the engagement between the snap fit 7 and the mounting hole 9, but also by adhesion using an adhesive. When using an adhesive, it is preferable to give the adhesive thermal conductivity so that heat transfer from the frame member 3B having thermal conductivity to the support 8 is not hindered. The thermal conductivity of the adhesive is preferably greater than that of the frame member. Therefore, it is preferable to select and use an adhesive having a higher thermal conductivity than that of the frame member.

  In FIG. 9, the frame member 3 </ b> C of the panel 1 </ b> E is attached to the support 8 via the resin rivet 10. The resin rivet 10 has a mushroom shape having a substantially T-shaped cross section with an enlarged tip. In general, the resin rivet 10 is provided with a protruding boss shape on the frame member 3C, and a portion protruding from the mounting hole 9 is melted and caulked by heat or ultrasonic waves to form a substantially T-shaped cross section. It is. In FIG. 9, other configurations are the same as those in FIG.

In FIG. 10, a protrusion 11 is provided so as to project from the support 8A toward the panel 1F. The protrusion 11 may be pin-shaped or plate-shaped. In the case of a plate shape, it may extend long in the circumferential direction of the panel 1F. The panel 1 </ b> F includes a panel body 2 and a frame member 3 </ b> D provided on the entire peripheral edge of one panel surface of the panel body 2. The frame member 3D is provided with a recess 12 that engages with the protrusion 11. The panel 1F is attached to the support 8A by fitting the protrusions 11 into the recesses 12, but an adhesive may also be used in combination. When an adhesive is used, it is preferable to give the adhesive thermal conductivity so as not to hinder heat transfer from the frame member 3D having thermal conductivity to the support 8A. The thermal conductivity of the adhesive is preferably greater than that of the frame member. Therefore, it is preferable to select and use an adhesive having a higher thermal conductivity than that of the frame member.
In FIG. 10, since the protrusion 11 is in contact with the inner surface of the recess 12, the contact area between the frame member 3D and the support 8A is large, and the amount of heat transfer from the frame member 3D to the support 8A is large. .

  In FIG. 11, the panel 1 </ b> G is attached to the support 8 with bolts 14. The panel 1G is provided with a frame member 3E on the entire peripheral edge of one panel surface of the panel body 2. The frame member 3 </ b> E is provided with a boss portion 13, and the boss portion 13 is inserted into the attachment hole 9 of the support 8. The protruding height of the boss portion 13 is substantially the same as or slightly smaller than the thickness of the support 8. The boss portion 13 is provided with a circular concave hole, and the panel 1G is fixed to the support body 8 by screwing the bolt 14 with a hook into the circular concave hole. A female screw may be provided on the inner peripheral surface of the circular concave hole.

  An insert nut 15 is provided on the frame member 3F of the panel 1H in FIG. The panel 1H is attached to the support body 8 by screwing the bolt 14 into the insert nut 15. Other configurations in FIG. 12 are the same as those in FIG.

  11 and 12, the frame members 3E and 3F may be attached to the support 8 only by the bolts 14, and an adhesive may be used in combination. An example in which an adhesive is used in combination is shown in FIG. In FIG. 13, the auxiliary adhesive 16 is interposed between the frame member 3 </ b> F and the support 8. Other configurations in FIG. 13 are the same as those in FIG.

  In FIG. 14, the panel 1 </ b> I has a panel main body 2 and a frame member 3 </ b> G, and the frame member 3 </ b> G is bonded to the support body 8 with an auxiliary adhesive 16. A metal piece 17 is inserted into the frame member 3G. The metal piece 17 protrudes laterally outward from the frame member 3 </ b> G and abuts on the rib portion 8 a of the support 8. Since the metal piece 17 is in contact with the rib portion 8a, the amount of heat transfer from the frame member 3G to the support body 8 is increased.

  A panel 1J in FIG. 15 includes a panel body 2 and a frame member 3I. The frame member 3I is bonded to the support 8 with an auxiliary adhesive 16. A metal piece 18 is inserted so as to protrude from the surface of the frame member 3I opposite to the panel body 2. The tip of the metal piece 18 is in contact with the support body 8, and the amount of heat transfer from the frame member 3I to the support body 8 is large.

  A panel 1K in FIG. 16 includes a panel body 2 and a frame member 3J. The frame member 3J is bonded to the support 8 with an auxiliary adhesive 16. A pair of metal pieces 19 having an L-shaped cross-sectional shape is inserted into the frame member 3J. The metal piece 19 extends along the opposite surface of the panel body 2 of the frame member 3J. The metal piece 19 on the outer peripheral side of the frame member 3J protrudes outside the frame member 3J, and the metal piece 19 on the inner peripheral side protrudes inside the frame member 3J. A small hole 19 a is provided in the metal piece 19, and a pin 20 protruding from the support 8 is inserted into the small hole 19 a.

  In the case of the structure illustrated in FIG. 14 to FIG. 16, the metal portion extending from the frame member communicates with the support and a high heat transfer amount is obtained, so that the auxiliary adhesive 16 has thermal conductivity. Although not always necessary, for the purpose of further improving the heat transfer from the frame member to the support, it is preferable to give the auxiliary adhesive thermal conductivity. In this case, it is preferable that the thermal conductivity of the auxiliary adhesive is larger than that of the frame member. Therefore, it is preferable to select and use an auxiliary adhesive having a higher thermal conductivity than that of the frame member.

The frame members 3B to 3J in FIGS. 8 to 16 are not provided with a concave line like the frame member 3A in FIG. 7c, but may be provided with a concave line similar to the frame member 3A. FIG. 17 shows an example thereof, and the frame member 3K of the panel 1L shown in FIG. 17 has a configuration in which the concave strip 5 is provided on the side surface of the frame member 3F of the panel 1H shown in FIG. Other configurations in FIG. 17 are the same as those in FIG. Although illustration is omitted, the attachment 6 may be mounted as shown in FIG.
Moreover, you may make the metal part extended from the attachment 6 shown to FIG. 7 d contact | abut with the panel support body 8 similarly to in FIGS.

  8 to 17, the panel surface on the frame member side of the panel main body 2 is flat, but the groove 4 may be provided as shown in FIG. 7b. FIG. 18 shows an example. A panel 1M in FIG. 18 is obtained by combining the frame member 3L by using the panel body 2A with the grooves 4 instead of the panel body 2 in the panel 1E shown in FIG. Other configurations in FIG. 18 are the same as those in FIG.

  In any of the panel installation structures of FIGS. 8 to 18, the heat of the panel main body is radiated to the support side directly or further via a metal piece, an auxiliary adhesive, or the like via the thermally conductive frame member. Further, although not shown, it is also possible to impart heat conductivity to the seal member 26 shown in FIG. 3 to dissipate heat to the support via the seal member. In this case, since heat can be directly radiated from the panel body to the support, the efficiency of the heat radiating effect is increased, which is more preferable. In the case where the support is made of a highly thermally conductive material such as metal, the heat transferred is further transferred to the entire support for efficient heat dissipation.

[Forming material for frame member with high thermal conductivity]
The high thermal conductive resin composition suitable as a molding material for the high thermal conductive frame member used in the exhaust heat type panel of the present invention will be described below.

  The frame member of the exhaust heat type panel of the present invention has a thermal conductivity of 0.5 W / m · K or more. If the thermal conductivity of this frame member is less than 0.5 W / m · K, the heat storage of the IR absorption layer of the panel body cannot be efficiently radiated, and sufficient heat radiation efficiency cannot be obtained.

  In the present invention, the thermal conductivity is a value measured by the method described in the Examples section below.

  The frame member preferably has a higher thermal conductivity, preferably 1 W / m · K or more, more preferably 3 W / m · K or more, and particularly preferably 5 W / m · K or more. However, as described later, as the high thermal conductive resin composition prepared by blending a high thermal conductive filler in the resin, the thermal conductivity is preferably 50 W / m · K or less, more preferably 40 W / m. · K or less, particularly preferably 30 W / m · K or less. When the thermal conductivity is higher than 50 W / m · K, a large amount of a high thermal conductive filler is added to the resin composition, which is not preferable because the resin composition is likely to solidify during injection molding and easily cause poor filling. .

  Although there is no restriction | limiting in particular as a resin seed | species of the highly heat conductive resin composition as a molding material of the frame member based on this invention, Polycarbonate resin, such as aromatic polycarbonate resin, Polyester resin, Aromatic polyamide resin, ABS resin, AS resin , PMMA resin, polyethylene resin and the like, and may include two or more of these. The high heat conductive resin composition according to the present invention is preferably a polycarbonate resin composition containing at least a polycarbonate resin as a main component and blending a high heat conductive filler. The content of the polycarbonate resin in the case of containing two or more kinds of thermoplastic resin components is at least 5 parts by mass, preferably 10 parts by mass or more, more preferably 15 parts by mass when the thermoplastic resin component is 100 parts by mass. More than a part. When the content of the polycarbonate resin is less than 5 parts by mass, the adhesion between the panel main body and the frame member is lowered, and the product may not be established. The upper limit of the polycarbonate resin content is preferably 90 parts by mass, more preferably 80 parts by mass.

{High thermal conductivity polycarbonate resin composition}
Below, the high heat conductive polycarbonate resin composition which mix | blends a high heat conductive filler suitable as a molding material of the frame member of this invention is demonstrated.

  As the polycarbonate resin, an aromatic polycarbonate resin, an aliphatic polycarbonate resin, and an aromatic-aliphatic polycarbonate resin can be used, and among them, an aromatic polycarbonate resin is preferable. The aromatic polycarbonate resin is a thermoplastic aromatic polycarbonate polymer or copolymer obtained by reacting an aromatic dihydroxy compound with phosgene or a diester of carbonic acid.

  Examples of the aromatic dihydroxy compound include 2,2-bis (4-hydroxyphenyl) propane (= bisphenol A), tetramethylbisphenol A, bis (4-hydroxyphenyl) -P-diisopropylbenzene, hydroquinone, resorcinol, 4, 4-dihydroxybiphenyl etc. are mentioned, Preferably bisphenol A is mentioned. Further, for the purpose of further enhancing the flame retardancy, a compound in which one or more tetraalkylphosphonium sulfonates are bonded to the above aromatic dihydroxy compound, or a polymer or oligomer having a siloxane structure and containing both terminal phenolic OH groups is used. Can do.

  The aromatic polycarbonate resin used in the present invention is preferably a polycarbonate resin derived from 2,2-bis (4-hydroxyphenyl) propane, or 2,2-bis (4-hydroxyphenyl) propane and other fragrances. And a polycarbonate copolymer derived from an aromatic dihydroxy compound. Further, two or more kinds of polycarbonate resins may be used in combination.

  The molecular weight of the polycarbonate resin is a viscosity average molecular weight converted from the solution viscosity measured at a temperature of 25 ° C. using methylene chloride as a solvent, and is in the range of 14,000 to 30,000, preferably 15,000 to 28. 16,000, more preferably 16,000-26,000. If the viscosity average molecular weight is less than 14,000, the mechanical strength is insufficient, and if it exceeds 30,000, the moldability tends to be difficult, which is not preferable.

  The method for producing such an aromatic polycarbonate resin is not limited, and the aromatic polycarbonate resin can be produced by a phosgene method (interfacial polymerization method), a melting method (transesterification method), or the like. Furthermore, the aromatic polycarbonate resin which adjusted the amount of OH groups of the terminal group manufactured by the melting method can be used.

  As the aromatic polycarbonate resin, not only a virgin raw material but also an aromatic polycarbonate resin regenerated from a used product, that is, a so-called material recycled aromatic polycarbonate resin can be used. Used products include optical recording media such as optical disks, light guide plates, automobile window glass and automobile headlamp lenses, vehicle transparent members such as windshields, containers such as water bottles, glasses lenses, soundproof walls and glass windows, waves A building member such as a plate is preferred. In addition, as the recycled aromatic polycarbonate resin, non-conforming product, pulverized product obtained from sprue or runner or pellets obtained by melting them can be used.

  On the other hand, examples of the high thermal conductive filler include carbon fibers, thermal conductive powders such as graphite and boron nitride, and plate-like graphite.

  The polycarbonate resin composition blended with the high thermal conductive filler is not particularly limited as long as it satisfies the above-described thermal conductivity. For example, the following patent application was filed prior to the present applicant. Things.

<High thermal conductive polycarbonate resin composition 1>
(A) Carbon fiber that is graphitized carbon fiber (B) with respect to 100 parts by mass of polycarbonate-based resin, and has a thermal conductivity in the length direction of 100 W / m · K or more and an average fiber diameter of 5 to 20 μm. A resin composition containing 5 parts by mass or more and less than 40 parts by mass of fibers and (C) 5 to 100 parts by mass of graphite powder having an average particle diameter of 1 to 500 μm (Japanese Patent Laid-Open No. 2007-91985).

  Here, the (B) graphitized carbon fiber preferably has a thermal conductivity in the length direction of 400 W / m · K or more.

  (B) When the thermal conductivity of the graphitized carbon fiber is out of the above range, sufficient thermal conductivity cannot be obtained at a low filling rate. The carbon fiber is formed by, for example, converging carbon short fibers (chopped strands) usually cut to 2 to 20 mm at a bulk density of 450 to 800 g / l, as described in JP-A No. 2000-143826. A carbon short fiber converging body obtained by graphitization is preferable. The carbon short fiber converging body is obtained by converging carbon fibers with a sizing agent, cutting to a predetermined length, and graphitizing to reduce the content of the sizing agent to 0.1% by mass or less. It is. Examples of the conditions for the graphitization treatment include a method of heating at 2800 to 3300 ° C. in an inert gas atmosphere. As another method, continuous fibers (rovings) can be graphitized and then cut into a predetermined length for use. The average fiber diameter of the carbon fiber can be measured with an image analyzer (for example, image processing R & D system TOSPIX-i manufactured by Toshiba Corporation), and is 5 to 20 μm. If it is less than 5 μm, it tends to cause problems such as a decrease in thermal conductivity when the polycarbonate resin is mixed and filled, and warpage of the molded product becomes large. Hateful. Moreover, when there is more content of a sizing agent than 0.1 mass%, it will be easy to cause the fall of heat conductivity. The compounding amount of the carbon fiber is less than 40 parts by mass with respect to 100 parts by mass of the polycarbonate resin, and if it exceeds this, molding processability and dimensional stability are lowered, and warpage is increased. Furthermore, sufficient heat conductivity is not obtained as this compounding quantity is less than 5 mass parts. The blending amount is preferably 10 parts by mass or more and less than 40 parts by mass, and more preferably 15 parts by mass or more and 35 parts by mass or less.

  Further, (B) a carbon fiber is preferably used as the carbon fiber. For example, a fiber length of 1 to 30 mm, preferably 2 to 20 mm is used. The use of a long fiber is effective in terms of improving thermal conductivity and reducing warpage of the molded product.

  In this highly heat-conductive polycarbonate resin composition 1, in order to improve heat conductivity and molding processability and reduce warpage of the molded product, (C) 5 parts by mass or more of graphite powder having an average particle diameter of 1 to 500 μm 100 parts by mass or less are used in combination. (C) The average particle diameter of the graphite powder is a value obtained by measuring the average particle diameter in accordance with JIS Z8819-2 by measuring with a laser diffraction method in accordance with JIS Z8825-1. When this value exceeds 500 μm, or when the content exceeds 100 parts by mass, the moldability deteriorates. (C) Even if the average particle diameter of the graphite powder is less than 1 μm, it is difficult to handle such as being scattered at the time of blending, and it is difficult to uniformly disperse it in the resin composition. Furthermore, sufficient heat conductivity is not acquired as content is less than 5 mass parts. (C) It is preferable that the average particle diameter of graphite powder is 5-100 micrometers. Further, when the amount of the carbon fiber (B) is small, the amount of (C) the graphite powder is relatively large, and is adjusted as appropriate so as to obtain a predetermined thermal conductivity. For example, when the amount of (B) carbon fiber is 5 parts by mass or more and 25 parts by mass or less, the amount of (C) graphite powder is preferably 20 parts by mass or more and 100 parts by mass or less, more preferably 20 parts by mass or more and 80 parts by mass. It is below mass parts. (B) When the amount of carbon fiber is 25 parts by mass or more and less than 40 parts by mass, the amount of (C) graphite powder is preferably 5 parts by mass or more and 40 parts by mass or less, more preferably 5 parts by mass or more. It is preferably 20 parts by mass or less.

<High thermal conductive polycarbonate resin composition 2>
(A) 1 part by mass or more and 40 parts by mass or less of (B) aromatic polycarbonate oligomer, and (C) graphitized carbon fiber with respect to 100 parts by mass of polycarbonate-based resin, and the thermal conductivity in the length direction is Heat of 100 W / m · K or more and 5 to 20 μm carbon fiber having an average fiber diameter of 5 to 20 μm and (D) heat conductivity of 10 W / m · K or more and an average particle diameter of 1 to 500 μm Resin composition containing 5 to 100 parts by mass of conductive powder (excluding boron nitride) (Japanese Patent Laid-Open No. 2007-99798).

  Here, (C) graphitized carbon fiber is the same as (B) graphitized carbon fiber in the above-described high thermal conductive polycarbonate resin composition 1, and the preferable blending amount thereof is also the same.

  (B) The aromatic polycarbonate oligomer is obtained by reacting bisphenol A (BPA) with phosgene or a carbonic acid diester using an appropriate terminal terminator or molecular weight regulator. Further, a copolymer type in which a part of bisphenol A is replaced with another divalent phenol may be used, and the divalent phenol described in the above aromatic polycarbonate resin is used as the other divalent phenol.

  Examples of the terminal terminator or molecular weight regulator include compounds having a monovalent phenolic hydroxyl group and compounds having an aromatic carboxylic acid group, such as ordinary phenol, pt-butylphenol, 2,3,6-trimethyl. In addition to bromophenol and the like, long-chain alkylphenols, aliphatic carboxylic acid chlorides, aliphatic carboxylic acids, hydroxybenzoic acid, and the like can be mentioned. Aromatic polycarbonate oligomers may be used singly or as a mixture of two kinds. Such an aromatic polycarbonate oligomer tends to bleed out from a molded product at the time of molding at a degree of polymerization of 1, while it becomes difficult to obtain satisfactory fluidity and surface smoothness when the degree of polymerization becomes large. is there. The compounding quantity of an aromatic polycarbonate oligomer is 1 mass part or more and 40 mass parts or less with respect to 100 mass parts of (A) polycarbonate-type resin in the highly heat conductive polycarbonate resin composition 2. As shown in FIG. When the amount is less than 1 part by mass, sufficient fluidity and surface smoothness are hardly obtained, and when it exceeds 40 parts by mass, the mechanical properties are deteriorated. A more preferable blending amount is 2 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the (A) polycarbonate resin.

  In the high thermal conductivity polycarbonate resin composition 2, in order to improve thermal conductivity and molding processability and reduce warpage of the molded product, (D) the thermal conductivity is 10 W / m · K or more and the average particle size is 1 to 1. A heat conductive powder of 500 μm (excluding boron nitride) is used in an amount of 5 to 100 parts by mass. Examples of the component (D) include carbon-based powder, silicon-based powder, boron-based powder (excluding boron nitride), at least one carbide, oxide, and nitride of a metal element, and a simple metal Of powders and fibers. More preferably, the component (D) is carbon fiber (not included in the category of the component (C)), graphite, metal-coated carbon fiber, metal-coated graphite, metal-coated glass, aluminum oxide, aluminum nitride, boron carbide, Examples thereof include thermally conductive powders composed of one or more of the group consisting of silicon nitride, silicon carbide, zinc oxide, magnesium oxide, metal fibers and metal powders. Among these, graphite powder is preferable. Other preferable powders are at least one carbide, oxide, and nitride selected from silicon, magnesium, aluminum, and boron. The average particle size of the component (D) is a value obtained by measuring according to JIS Z8825-1, measuring by a laser diffraction method, and complying with JIS Z8819-2. When this value exceeds 500 μm, or when the content exceeds 100 parts by mass, the moldability deteriorates. Even if the average particle size of the component (D) is less than 1 μm, it is difficult to handle such as being scattered at the time of blending, and it is difficult to uniformly disperse it in the resin composition. Furthermore, sufficient heat conductivity is not acquired as content is less than 5 mass parts. When the amount of the carbon fiber (C) is small, the amount of the heat conductive powder (D) is relatively large, and is adjusted as appropriate so as to obtain a predetermined thermal conductivity. For example, when the amount of the carbon fiber (C) is 5 parts by mass or more and 25 parts by mass or less, the amount of the thermally conductive powder (D) is preferably 20 parts by mass or more and 100 parts by mass or less, more preferably 20 parts. It is not less than 80 parts by mass. When the amount of the carbon fiber (C) is 25 parts by mass or more and less than 40 parts by mass, the amount of the thermally conductive powder (D) is preferably 5 parts by mass or more and 40 parts by mass or less, more preferably. The amount is preferably 5 parts by mass or more and 20 parts by mass or less.

<High thermal conductive polycarbonate resin composition 3>
(A) 1 part by mass or more and 40 parts by mass or less of (B) aromatic polycarbonate oligomer, and (C) graphitized carbon fiber with respect to 100 parts by mass of polycarbonate-based resin, and the thermal conductivity in the length direction is 100 W / m · K or more and 5 mass parts or more and less than 40 mass parts of carbon fibers having an average fiber diameter of 5 to 20 μm, and (D) 5 mass parts or more and 100 mass parts or less of boron nitride having an average particle diameter of 1 to 500 μm. Resin composition (Japanese Patent Laid-Open No. 2007-99799).

Here, as (B) aromatic polycarbonate oligomer, the thing similar to (B) aromatic polycarbonate oligomer in the highly heat conductive polycarbonate resin composition 2 can be used, The suitable compounding quantity is also equivalent.
Further, (C) graphitized carbon fiber is the same as (B) graphitized carbon fiber in the above-described high thermal conductive polycarbonate resin composition 1, and a preferable blending amount thereof is also the same.

  In the highly heat conductive polycarbonate resin composition 3, in order to provide insulation, enhance heat conductivity and molding processability, and reduce warpage of the molded product, (A) with respect to 100 parts by weight of the polycarbonate resin, (D) 5 to 100 parts by mass of boron nitride having an average particle size of 1 to 500 μm is used. The average particle size of the component (D) is a value obtained by measuring according to JIS Z8825-1, measuring by a laser diffraction method, and complying with JIS Z8819-2. If this value exceeds 500 μm, or if the content exceeds 100 parts by mass, the moldability is lowered. Even if the average particle size of the component (D) is less than 1 μm, it is difficult to handle such as being scattered during compounding, and it is difficult to uniformly disperse it in the resin. Furthermore, sufficient heat conductivity and insulation are not acquired as content is less than 5 mass parts. Moreover, the preferable range of content of (D) component changes with content of (C) component to use together, and it is preferable to set it as an equal mass part or more with (C) component. When the content is less than the component (C), sufficient thermal conductivity and insulation may not be obtained. In addition, when the content of the carbon fiber as the component (C) is small, the content of boron nitride as the component (D) is made relatively large so that the predetermined thermal conductivity is appropriately adjusted. It is also preferable. For example, when the amount of carbon fiber (C) is 5 parts by mass or more and 25 parts by mass or less, the amount of boron nitride (D) is preferably 20 parts by mass or more and 100 parts by mass or less, more preferably 20 parts by mass or more. 80 parts by mass or less. When the amount of carbon fiber (C) is 25 parts by mass or more and less than 40 parts by mass, the amount of boron nitride (D) is preferably 5 parts by mass or more and 40 parts by mass or less, more preferably 5 parts by mass. The amount is preferably 20 parts by mass or less.

Boron nitride has a plurality of stable structures such as c-BN (zinc blende structure), w-BN (wurtzite structure), h-BN (hexagonal crystal structure), and r-BN (rhombohedral crystal structure). It has been known. In the present invention, any boron nitride may be used. Among them, hexagonal structure boron nitride is preferably used. Boron nitride can be either spherical or scaly, and any of these can be used, but when a scaly one is used, a molded product with better insulation can be obtained and mechanical properties can be obtained. Is preferable. Further, the average particle diameter of the scaly boron nitride powder is generally 1 to 50 μm, and it is also preferable to use a powder having an average particle diameter in such a range. However, the specific gravity and average particle diameter of boron nitride are not limited to this range.
The thermal conductivity of the boron nitride is preferably 10 W / m · K or more.

<High thermal conductive polycarbonate resin composition 4>
(A) A thermoplastic resin, preferably a thermoplastic resin composition comprising a polycarbonate resin and (B) graphite, wherein the (B) graphite has an aspect ratio of 20 to 50 and an average particle diameter of 10 to 200 μm. A resin composition having a fixed carbon content of 98% by mass or more (Japanese Patent Laid-Open No. 2011-16937).

  The average particle diameter referred to here is the particle diameter of 100 samples in SEM (scanning electron microscope) observation (here, the particle diameter is the parallel plate when graphite is sandwiched between two parallel plates). Is the average value of the values obtained by measuring the diameter (the length of the interval between the plates) of the portion where the interval is the largest. If the average particle size is too small, air pollution problems such as flying in the air during melt-kneading may occur, or the melt viscosity of the resin composition may be significantly increased and fluidity may be lowered. However, if the average particle size is too large, supply failure such as bridging of the graphite-containing powder in the hopper may occur during melting and kneading, or the appearance of the molded product may be deteriorated. It is difficult to produce or obtain excessively large graphite. More preferably, the average particle diameter of (B) graphite is 20 to 200 μm.

  Further, when the aspect ratio calculated by the ratio of the particle diameter and the thickness of graphite is smaller than 20, the graphite is so formed that the thickness direction of the molded product matches the thickness direction of the graphite in the molded product in the injection molding process. Although oriented, in that case, the contribution to the thermal conductivity of graphite in the plane direction perpendicular to the thickness direction of the molded product is reduced, and higher thermal conductivity cannot be obtained. For this reason, this aspect ratio is larger than 20, in particular 25 or more, and particularly preferably 30 or more. However, if the aspect ratio is too large, a dispersion failure may occur due to the entanglement of graphite, and therefore the aspect ratio is 50 or less, preferably 45 or less.

  Here, the aspect ratio of graphite is the thickness of 100 samples in SEM (scanning electron microscope) observation (here, the thickness is the interval between the parallel plates when graphite is sandwiched between two parallel plates). The average value of the values obtained by measuring the diameter of the part where the diameter is smallest (the length of the interval between the plates) is the average thickness, and the average particle diameter / average thickness of the above average particle diameter It is obtained by calculating the ratio.

  In addition, the graphite (B) used in the high thermal conductive polycarbonate resin composition 4 has a fixed carbon amount measured in accordance with JIS M8511 of 98% by mass or more, preferably 98.5% by mass or more, more preferably 99% by mass. By being above, excellent thermal conductivity can be obtained.

  In the high thermal conductive polycarbonate resin composition 4, it is preferable to use pyrolytic graphite obtained by heat-treating powder coke at 1000 ° C. or higher among graphite having the above-described physical properties. Here, when heat treatment is insufficient, high thermal conductivity may not be obtained. The heat treatment conditions are preferably those obtained by treatment in an inert gas at a temperature of 1000 to 3500 ° C.

  Pyrolytic graphite subjected to such heat treatment is preferable because it has few impurities, has high thermal conductivity, and suppresses decomposition of the resin.

The content of (B) graphite in the high thermal conductive polycarbonate resin composition 4 is preferably 1 to 50% by mass, more preferably 1 to 40% by mass, still more preferably 5 to 40% by mass, and particularly preferably 10 to 10% by mass. 40% by mass.
(B) If the graphite content is too low, the required thermal conductivity may not be obtained, and if it is too high, the resin composition may be difficult to knead and the composition may not be prepared.

  In addition, (B) 2 or more types of graphites having different materials, shapes, physical properties, etc. may be used in combination.

<Highly heat conductive polycarbonate resin composition 5>
(A) thermoplastic resin, preferably polycarbonate resin 20% by mass to 85% by mass, (B) plate graphite having an apparent density of 0.16 g / cm ³ or more, 5% by mass to 30% by mass, and (C) A resin composition containing 10% by mass or more and 60% by mass or less of an electrically insulating filler (hereinafter referred to as “insulating filler”) (Japanese Patent Laid-Open No. 2011-16936).
).

The (B) graphite used here is plate-like graphite having an apparent density of 0.16 g / cm ³ or more, and preferably selected from natural scaly graphite, natural scaly graphite, pyrolytic graphite, and quiche graphite. Can be mentioned.

If the apparent density of (B) graphite is less than 0.16 g / cm ³ , the difference in apparent density between (A) thermoplastic resin and (C) insulating filler is too large, and it is easy to separate during resin composition production. This is not preferable because the productivity is lowered and the quality of the obtained resin composition varies greatly. (B) The apparent density of graphite is preferably 0.18 g / cm ³ or more, more preferably 0.20 g / cm ³ or more. The upper limit of the apparent density is usually about 0.5 g / cm ³ . The apparent density can be obtained by filling a graduated cylinder with 30 ml of graphite in a naturally falling state and measuring its mass.

  The fixed carbon content of (B) graphite used in the high thermal conductive polycarbonate resin composition 5 is preferably 97% by mass or more, and more preferably 98% by mass or more. (B) The ash content of graphite is preferably 2% by mass or less, more preferably 1% by mass or less. Moreover, the volatile matter content rate of (B) graphite becomes like this. Preferably it is 1.5 mass% or less, More preferably, it is 1.0 mass% or less. When the fixed carbon, ash content, and volatile content of graphite deviate from the above ranges, the thermal conductivity and heat stability of the resin composition may be lowered.

  The average particle diameter of the (B) graphite used in the high thermal conductive polycarbonate resin composition 5 is preferably 3 to 100 μm, more preferably 5 to 80 μm, and more preferably 5 to 60 μm in terms of mass average. Further preferred. When the graphite having an average particle size of less than 3 μm is melt-kneaded using an extruder or the like, the graphite does not easily bite into the screw, becomes unstable in measurement, and decreases in productivity. When the average particle diameter of graphite exceeds 100 μm, the surface smoothness and dispersibility of the molded product are inferior.

  The (B) graphite used in the high thermal conductive polycarbonate resin composition 5 is graphite having a plate shape. Here, the plate shape is a flaky or scaly shape having a small thickness with respect to the area of the plate surface. Preferably, the average thickness / average particle size is 2-20.

  The average particle diameter and average thickness of this (B) graphite are the average particle diameter and average thickness before melt-kneading, and usually use catalog values, but when not disclosed, the median measured by the ISO 13320 laser method The value obtained by the particle size (sometimes expressed as D50 value) was used as the average particle size. After the graphite was hardened with an epoxy resin and polished, the polished surface was observed with an SEM (scanning electron microscope). Let the average value of thickness be an average thickness.

  As long as the (B) graphite used in the high thermal conductive polycarbonate resin composition 5 does not impair its properties, (A) surface treatment such as epoxy treatment, urethane treatment, An oxidation treatment or the like may be performed.

  The high thermal conductivity polycarbonate resin composition 5 includes (B) graphite and (C) an insulating filler, thereby having both excellent thermal conductivity and insulating properties.

  That is, in the high thermal conductivity polycarbonate resin composition 5, thermal conductivity can be obtained by including (B) graphite. This (B) graphite is plate-like graphite, and (C) an insulating filler. Coexisting with (C) the insulating filler during the molding promotes the orientation of the plate-like (B) graphite, and as a result, the thermal conductivity of the plate-like graphite is enhanced. Moreover, insulation is also provided by including an insulating (C) insulating filler. Furthermore, the inclusion of (C) an insulating filler improves surface smoothness and dimensional stability, and increases the hardness of the resulting molded product, thereby improving the choke resistance. The

  The (C) insulating filler used in the high thermal conductive polycarbonate resin composition 5 may be in the form of particles, plates, or fibers, preferably in the form of plates or fibers, particularly preferably. It is plate-shaped.

Examples of the plate-like (C) insulating filler include flaky and scaly talc, mica, clay, kaolin, and glass flakes, with glass flakes being particularly preferred.
Examples of the fibrous (C) insulating filler include glass fiber and wallast fiber, and glass fiber is preferable.
These insulating fillers may be used alone or in combination of two or more.

Glass flake is a plate-shaped amorphous glass having a thickness of 3 to 7 μm and a particle diameter of 10 to 4000 μm, and exhibits unique effects depending on the properties of glass as an inorganic material and the properties obtained from the shape. The glass used includes C glass and E glass. Since E glass has less Na ₂ O or K ₂ O or the like than C glass, glass flakes using E glass are preferably used. As the glass flake, for example, REFG-101 of Nippon Electric Glass Co., Ltd., which is a commercial product, is used, and the average particle diameter is 600 μm and the average thickness is 3 to 7 μm. Glass flakes having a larger average particle size than other additives cause an appearance defect when the amount added is increased, so the amount to be blended must be adjusted.

  As the glass fiber, those having an average fiber diameter of about 5 to 20 μm and an average fiber length of about 30 to 200 μm in the molded product are preferable.

  The (C) insulating filler used in the high thermal conductive polycarbonate resin composition 5 is surface-treated, for example, epoxy-treated, urethane, in order to increase the affinity with the (A) thermoplastic resin as long as the properties are not impaired. Treatment, oxidation treatment, etc. may be performed.

  The blending ratios of the above components (A) to (C) of the high thermal conductive polycarbonate resin composition 5 are: (A) 20% by mass to 85% by mass of the thermoplastic resin, and (B) 5% by mass to 30% by mass of the graphite. % Or less, and (C) the insulating filler is 10% by mass or more and 60% by mass or less.

  When the component (A) is less than 20% by mass, surface smoothness and molding processability are deteriorated, and when it exceeds 85% by mass, thermal conductivity and dimensional stability are deteriorated. When the component (B) is less than 5% by mass, the thermal conductivity is lowered, and when it exceeds 40% by mass, the moldability and the insulation are lowered. When the component (C) is less than 10% by mass, the dimensional stability and thermal conductivity are lowered, and when it exceeds 60% by mass, the moldability and the surface smoothness are lowered.

A more preferable blending ratio is
(A) Thermoplastic resin 55-85 mass%
(B) Graphite 10-30% by mass
(C) Insulating filler 10-30% by mass
It is.

  The blending ratio of the (B) component and the (C) component is such that when the relationship between the content C of the (C) component and the content B of the (B) component in the composition is represented by C = aB, a Is preferably 1 or more and 2 or less. When the blending ratio is such that the value of a is less than 1, the insulation properties may decrease, and when it exceeds 2, the thermal conductivity tends to decrease. a is more preferably 1.2 to 1.8.

  In addition, in highly heat conductive polycarbonate resin composition 5, in order to obtain the effect by including the above-mentioned (A) ingredient, (B) ingredient, and (C) ingredient certainly, (A) ingredient in a resin composition, The total amount of the component (B) and the component (C) is preferably 80% by mass or more.

  Further, in the high thermal conductive polycarbonate resin composition 5, when the relationship between the average particle diameter R1 of (B) graphite and the average particle diameter R2 of (C) the insulating filler is represented by R2 = bR1, The value is preferably 0.1 or more and less than 15. When the particle size ratio is such that the value of b is less than 0.1, the effect of promoting the orientation of the component (B) by the component (C) is weak, and the thermal conductivity is lowered. Even if b exceeds 15, (C) component becomes a barrier and thermal conductivity falls. b is more preferably 0.5-15.

Here, (C) the average particle diameter of the insulating filler is, for example, (C) when the insulating filler is a fibrous filler, a residue obtained by burning the resin composition or its molded product at a high temperature (for example, polycarbonate The resin was obtained by separating the residue obtained by dissolving and removing the resin with an organic solvent (for example, chloroform for polycarbonate) or the like using a difference in specific gravity (for example, at 600 ° C. for 4 hours). C) The insulating filler is dispersed on the preparation and then observed with an optical microscope, and the length of the filler is randomly measured for about 100 fillers and averaged. .
In addition, in the case where (C) the insulating filler is a granular or plate-like filler, a residue obtained by burning the resin composition or a molded product thereof at a high temperature (for example, 4 hours at 600 ° C. for a polycarbonate resin), (C) Insulating filler obtained by, for example, separating the residue obtained by dissolving and removing the resin with an organic solvent (for example, chloroform in the case of polycarbonate) using a difference in specific gravity, etc. is dispersed on the preparation. It is observed with an optical microscope, and the diameter of the minimum circumscribed circle of the filler is measured and averaged for about 100 of the fillers at random.

<Other ingredients>
The high thermal conductivity polycarbonate resin composition used in the present invention (hereinafter sometimes referred to as “the high thermal conductivity polycarbonate resin composition of the present invention”) is within the range not impairing the object of the present invention. It may contain components.

(1) Flame retardant A flame retardant can be mix | blended with the highly heat conductive polycarbonate resin composition of this invention in order to provide a flame retardance.
In applications such as glazing and the like, in many cases, flame retardancy is also required, so it is preferable to add a flame retardant.

  The flame retardant is not particularly limited as long as it improves the flame retardancy of the resin composition. For example, polycarbonate of halogenated bisphenol A, brominated bisphenol epoxy resin, brominated bisphenol phenoxy resin, brominated polystyrene And halogenated flame retardants such as phosphoric acid ester flame retardants, organic sulfonic acid metal salt flame retardants, and silicone flame retardants.

These may be used alone or in combination of two or more at any ratio.
As the flame retardant, a phosphate ester flame retardant is preferable because it has a high flame retardant effect, has a fluidity improving effect, and hardly causes mold corrosion.

  In particular, the phosphate ester flame retardant is preferably a phosphate ester compound represented by the following general formula (1).

(Wherein R ¹ , R ² , R ³ and R ⁴ each independently represents an alkyl group having 1 to 6 carbon atoms or an aryl group having 6 to 20 carbon atoms which may be substituted with an alkyl group, p, q, r and s are each independently 0 or 1, t is an integer of 0 to 5, and X represents an arylene group.)

In the general formula ^(1), the aryl group of R 1 to R ^4, a phenyl group, a naphthyl group, and the like. Examples of the arylene group for X include a phenylene group and a naphthylene group.
When t is 0, the compound represented by the general formula (1) is a phosphate ester, and when t is greater than 0, it is a condensed phosphate ester (including a mixture). For this purpose, condensed phosphate esters are preferably used.

  Specific examples of the phosphate ester flame retardant represented by the general formula (1) include trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, tributoxyethyl phosphate, triphenyl phosphate. Fate, tricresyl phosphate, tricresyl phenyl phosphate, octyl diphenyl phosphate, diisopropyl phenyl phosphate, tris (chloroethyl) phosphate, tris (dichloropropyl) phosphate, tris (chloropropyl) phosphate, bis (2,3-dibromopropyl) phosphate, bis (2,3-dibromopropyl) -2,3-dichlorophosphate, bis (chloropropyl) monooctylphosphate, bisfete Various types such as diol A tetraphenyl phosphate, bisphenol A tetracresyl diphosphate, bisphenol A tetraxylyl diphosphate, hydroquinone tetraphenyl diphosphate, hydroquinone tetracresyl phosphate, hydroquinone tetraxyl diphosphate Illustrated. Of these, triphenyl phosphate, bisphenol A tetraphenyl phosphate, resorcinol tetraphenyl phosphate, resorcinol tetra-2,6-xylenol phosphate, and the like are preferable.

  These phosphate ester flame retardants improve the flame retardancy of the composition and reduce the viscosity by blending the phosphoric ester ester flame retardant, for example, in the kneading step at the time of preparing the above-described high thermal conductive polycarbonate resin composition 4 ( B) It is possible to prevent the effect of imparting the original thermal conductivity of graphite (B) due to the aspect ratio and particle size of the graphite being crushed and being changed, which is preferable.

  The blending amount of the flame retardant may be appropriately selected and determined. However, if the amount is too small, the flame retardant effect becomes insufficient. Conversely, if the amount is too large, the heat resistance and mechanical properties may decrease. The content of the flame retardant in the highly heat-conductive polycarbonate resin composition of the invention is, for example, 5 to 20% by mass for phosphate ester flame retardants, and 0.02 to 2 for organic sulfonic acid metal salt flame retardants. If it is 0.2 mass% and a silicone compound flame retardant, it is 0.3-3 mass%.

  In addition, these flame retardants may be used in combination with inorganic compound flame retardant aids, and examples of inorganic compound flame retardant aids include talc, mica, kaolin, clay, silica powder, fumed silica, glass flakes, and the like. 1 type (s) or 2 or more types.

  When these flame retardants are used in combination with inorganic compound flame retardant aids, if the amount of inorganic compound flame retardant aid is too small, a sufficient blending effect cannot be obtained, and if too much, heat resistance and mechanical properties are reduced. Therefore, the content of the inorganic compound flame retardant aid in the highly thermally conductive polycarbonate resin composition of the present invention is preferably 1 to 20% by mass, more preferably 3 to 10% by mass.

(2) Anti-dripping agent The anti-drip agent can be blended with the highly heat conductive polycarbonate resin composition of the present invention for the purpose of preventing dripping during combustion. As the anti-dripping agent, a fluororesin can be preferably used.

  Here, the fluororesin is a polymer or copolymer containing a fluoroethylene structure. For example, a difluoroethylene polymer, a tetrafluoroethylene polymer, a tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene and fluorine. And a copolymer with an ethylene-based monomer that does not contain polytetrafluoroethylene (PTFE), preferably having an average molecular weight of 500,000 or more, particularly preferably 500,000 to 10,000,000.

  As the polytetrafluoroethylene that can be used in the present invention, all types of polytetrafluoroethylene that are currently known can be used. However, when polytetrafluoroethylene having a fibril-forming ability is used, it is even higher. Melting dripping prevention property can be provided. Although there is no restriction | limiting in particular in the polytetrafluoroethylene (PTFE) which has a fibril formation ability, For example, what is classified into the type 3 in ASTM standard is mentioned. Specific examples thereof include, for example, Teflon (registered trademark) 6-J (manufactured by Mitsui DuPont Fluorochemical Co., Ltd.), Polyflon D-1, Polyflon F-103, Polyflon F201 (Daikin Industries, Ltd.), CD076 ( Asahi IC Fluoropolymers Co., Ltd.). Other than those classified as type 3, for example, Argoflon F5 (manufactured by Montefluos Co., Ltd.), polyflon MPA, polyflon FA-100 (manufactured by Daikin Industries, Ltd.) and the like can be mentioned. These polytetrafluoroethylene (PTFE) may be used independently and may combine 2 or more types. Polytetrafluoroethylene (PTFE) having the fibril-forming ability as described above is prepared by, for example, using tetrafluoroethylene in an aqueous solvent in the presence of sodium, potassium, ammonium peroxydisulfide, at a pressure of 1 to 100 psi, at a temperature of 0. It is obtained by polymerizing at ˜200 ° C., preferably 20˜100 ° C. Alternatively, Teflon (registered trademark) 30-J (Mitsui / Dupont Fluorochemical Co., Ltd.) dispersed in a solvent may be used.

  The anti-dripping agent may be a polytetrafluoroethylene-containing mixed powder composed of polytetrafluoroethylene particles and organic polymer particles. Specific examples of monomers for producing organic polymer particles include styrene, p-methylstyrene, o-methylstyrene, p-chlorostyrene, o-chlorostyrene, p-methoxystyrene, o-methoxystyrene. Styrene monomers such as 2,4-dimethylstyrene, α-methylstyrene, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate (Meth) acrylic acid ester-based single quantities such as 2-ethylhexyl methacrylate, dodecyl acrylate, dodecyl methacrylate, tridodecyl acrylate, tridodecyl methacrylate, octadecyl acrylate, octadecyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate , Vinyl cyanide monomers such as acrylonitrile and methacrylonitrile, vinyl ether monomers such as vinyl methyl ether and vinyl ethyl ether, vinyl carboxylate monomers such as vinyl acetate and vinyl butyrate, ethylene, propylene, isobutylene Examples thereof include, but are not limited to, olefin monomers such as diene monomers such as butadiene, isoprene and dimethylbutadiene. Preferably, two or more kinds of polymers or copolymers of these monomers can be used to obtain organic polymer particles.

  As a compounding quantity of a dripping inhibitor, Preferably it is 0.01-1 mass% as content in the highly heat conductive polycarbonate resin composition of this invention, More preferably, it is 0.1-0.5 mass%. .

(3) Impact resistance improver The high thermal conductivity polycarbonate resin composition of the present invention can be blended with an elastomer as an impact resistance improver in order to improve impact strength.

  The elastomer is not particularly limited, but a multilayer structure polymer is preferable. Examples of the multilayer structure polymer include those containing an alkyl (meth) acrylate polymer. These multi-layered polymers include, for example, polymers produced by continuous multi-stage seed polymerization in which a polymer in a previous stage is sequentially coated with a polymer in a subsequent stage, and a basic polymer. As a structure, it is a polymer having an outermost core layer made of a polymer compound that improves the adhesion between the inner core layer, which is a crosslinking component having a low glass transition temperature, and the matrix of the composition. A rubber component having a glass transition temperature of 0 ° C. or lower is selected as a component that forms the innermost core layer of these multilayer polymers. These rubber components include rubber components such as butadiene, rubber components such as styrene / butadiene, rubber components of alkyl (meth) acrylate polymers, polyorganosiloxane polymers and alkyl (meth) acrylate polymers. Or a rubber component using these in combination. Furthermore, examples of the component forming the outermost core layer include an aromatic vinyl monomer, a non-aromatic monomer, or a copolymer of two or more thereof. Examples of the aromatic vinyl monomer include styrene, vinyl toluene, α-methyl styrene, monochloro styrene, dichloro styrene, bromo styrene, and the like. Of these, styrene is particularly preferably used. Examples of non-aromatic monomers include alkyl (meth) acrylates such as ethyl (meth) acrylate and butyl (meth) acrylate, vinyl cyanide such as acrylonitrile and methacrylonitrile, and vinylidene cyanide. These may be used alone or in combination of two or more.

  As a compounding quantity of an impact resistance improving agent, Preferably it is 1-10 mass% as content in the highly heat conductive polycarbonate resin composition of this invention, More preferably, it is 2-5 mass%.

(4) Reinforcing Material A reinforcing material can be added to the highly thermally conductive polycarbonate resin composition of the present invention in order to improve the elastic modulus, strength, and deflection temperature under load.

  Here, as a reinforcing material, silica, diatomaceous earth, pumice powder, pumice balloon, aluminum hydroxide, magnesium hydroxide, basic magnesium carbonate, calcium sulfate, potassium titanate, barium sulfate, calcium sulfite, talc, clay, mica, Examples thereof include glass fiber, glass flake, glass bead, calcium silicate, montmorillonite, bentonite, molybdenum sulfide, boron fiber, silicon carbide fiber, polyester fiber, polyamide fiber, and aluminum borate. These may be used alone or in combination of two or more. Although not particularly limited, the reinforcing material is preferably glass fiber, glass flake, talc, or mica.

  As a compounding quantity of a reinforcing material, Preferably it is 1-100 mass parts with respect to 100 mass parts of resin components in the highly heat conductive polycarbonate resin composition of this invention, More preferably, it is 10-80 mass parts.

(5) Release agent The high thermal conductivity polycarbonate resin composition of the present invention may contain a release agent in order to improve the mold release property during injection molding.

  Examples of the release agent include aliphatic carboxylic acids and alcohol esters thereof, aliphatic hydrocarbon compounds having a number average molecular weight of 200 to 15000, polysiloxane silicone oil, and the like.

  Examples of the aliphatic carboxylic acid include saturated or unsaturated, linear or cyclic, aliphatic 1 to 3 carboxylic acids. Among these, monovalent or divalent carboxylic acids having 6 to 36 carbon atoms are preferable, and aliphatic saturated monovalent carboxylic acids having 6 to 36 carbon atoms are particularly preferable. Specific examples of such aliphatic carboxylic acids include palmitic acid, stearic acid, caproic acid, capric acid, lauric acid, arachidic acid, behenic acid, lignoceric acid, serotic acid, melissic acid, tetrariacontanoic acid, Examples include montanic acid, adipic acid, and azelaic acid.

  The aliphatic carboxylic acid component in the aliphatic carboxylic acid ester has the same meaning as the above-mentioned aliphatic carboxylic acid. On the other hand, the alcohol component of the aliphatic carboxylic acid ester includes a saturated or unsaturated, linear or cyclic monovalent or polyhydric alcohol. These may have a substituent such as a fluorine atom or an aryl group, and among them, a monovalent or polyvalent saturated alcohol having 30 or less carbon atoms is preferable, particularly 30 or less carbon atoms, a saturated aliphatic monovalent or Polyhydric alcohols are preferred.

  Specific examples of such alcohol components include octanol, decanol, dodecanol, stearyl alcohol, behenyl alcohol, ethylene glycol, diethylene glycol, glycerin, pentaerythritol, 2,2-dihydroxyperfluoropropanol, neopentylene glycol, ditrimethylolpropane. And dipentaerythritol. The aliphatic carboxylic acid ester may contain an aliphatic carboxylic acid and / or alcohol as an impurity, and may be a mixture of a plurality of aliphatic carboxylic acid esters.

  Specific examples of the aliphatic carboxylic acid ester include beeswax (a mixture based on myricyl palmitate), stearyl stearate, behenyl behenate, stearyl behenate, glycerin monopalmitate, glycerin monostearate, glycerin diester. Examples thereof include stearate, glycerin tristearate, pentaerythritol monopalmitate, pentaerythritol monostearate, pentaerythritol distearate, pentaerythritol tristearate, pentaerythritol tetrastearate and the like.

  Examples of the aliphatic hydrocarbon having a number average molecular weight of 200 to 15000 include liquid paraffin, paraffin wax, microwax, polyethylene wax, Fischer-Tropsch wax, and α-olefin oligomer having 3 to 12 carbon atoms. Here, the aliphatic hydrocarbon includes alicyclic hydrocarbons. Moreover, these hydrocarbon compounds may be partially oxidized.

  Among these aliphatic hydrocarbons, paraffin wax, polyethylene wax, or partial oxides of polyethylene wax are preferable, and paraffin wax and polyethylene wax are particularly preferable. The number average molecular weight is preferably 200 to 5,000. These aliphatic hydrocarbons may be used alone or in combination of two or more at any ratio as long as the main component is within the above range.

  Examples of the polysiloxane silicone oil include dimethyl silicone oil, phenylmethyl silicone oil, diphenyl silicone oil, fluorinated alkyl silicone, and the like. These may be used alone or in combination of two or more.

  The content of the release agent in the highly heat-conductive polycarbonate resin composition of the present invention may be determined by appropriate selection. However, if the amount is too small, the release effect is not sufficiently exhibited. In some cases, degradation of hydrolyzability or mold contamination during injection molding may occur. Therefore, the compounding quantity of a mold release agent is 0.001-2 mass parts with respect to 100 mass parts of resin components in the highly heat conductive polycarbonate resin composition of this invention, and is 0.01-1 mass part especially. Is preferred.

(6) Others In addition to the above components, the highly heat-conductive polycarbonate resin composition of the present invention contains additives such as ultraviolet absorbers, antioxidants, and other additives, pigments, dyes, lubricants, and the like as necessary. You may mix | blend required amount respectively.

{High thermal conductive polyester resin composition}
The high thermal conductivity polyester resin composition suitable as a molding material for the frame member according to the present invention will be described below.

As this highly heat conductive polyester resin composition, the following (A), (B) and (C) components are included as specific components in specific amounts, and if flame retardancy is required according to the required characteristics of the product, A thermally conductive polyalkylene terephthalate resin composition (hereinafter referred to as “high thermal conductivity of the present invention” which contains the following components (D) and (E) in a specific amount and may contain (F) a white pigment, magnesium silicate and the like. It may be referred to as “polyalkylene terephthalate resin composition”.
(A) Polyalkylene terephthalate resin: 100 parts by mass (B) Boron nitride: 10-120 parts by mass (C) Glass fiber: 20-100 parts by mass (D) Halogenated phthalimide flame retardant: 0-40 parts by mass, For example, 5-40 mass parts (E) antimony compound: 0-20 mass parts, for example, 2-20 mass parts

  Hereinafter, these components will be described in detail.

(A) Polyalkylene terephthalate resin Polyalkylene terephthalate resin means that terephthalic acid accounts for 50 mol% or more of all dicarboxylic acid components, and ethylene glycol or 1,4-butanediol accounts for 50 mass% or more of all diols. Refers to resin. The terephthalic acid preferably accounts for 70 mol% or more of the total dicarboxylic acid component, and more preferably 95 mol% or more. More preferably, ethylene glycol or 1,4-butanediol accounts for 70 mol% or more of the total diol component, and more preferably 95 mol% or more. The polyalkylene terephthalate resin is preferably a polybutylene terephthalate resin.

(A-1) Polyalkylene terephthalate resin (A-1) The polyalkylene terephthalate resin is a so-called homopolymer, in which terephthalic acid accounts for 50 mol% or more of all dicarboxylic acid components, and ethylene glycol or 1,4- A resin in which butanediol accounts for 50% by mass or more of the total diol. Terephthalic acid preferably accounts for 80 mol% or more of the total dicarboxylic acid component, more preferably 95 mol% or more. Ethylene glycol or 1,4-butanediol preferably accounts for 80 mol% or more of the total diol component, and more preferably 95 mol% or more.

  (A-1) As the polyalkylene terephthalate resin, terephthalic acid accounts for 95 mol% of the total dicarboxylic acid component, particularly 98 mol% or more, and ethylene glycol or 1,4-butanediol is 95 mass% of the total diol. Polyethylene terephthalate resin (PET resin), polybutylene terephthalate resin (PBT resin) or a mixture thereof, which occupies the above, is preferably used, and polybutylene terephthalate resin is more preferable.

  (A-1) The intrinsic viscosity of the polyalkylene terephthalate resin is arbitrary, but in general, using a mixed solvent of 1,1,2,2-tetrachloroethane / phenol = 1/1 (mass ratio), It is 0.5 dl / g or more when measured at a temperature of 30 ° C., preferably 0.6 dl / g or more, and 3 dl / g or less, especially 2 dl / g or less, more preferably 1.5 dl / g or less. In particular, it is preferably 1 dl / g or less. If the intrinsic viscosity is less than 0.5 dl / g, the resulting resin composition has low mechanical strength. Conversely, if it is greater than 3 dl / g, the moldability of the resin composition may be significantly reduced. In addition, as (A-1) polyalkylene terephthalate resin, what made desired intrinsic viscosity by using together 2 or more types of (A-1) polyalkylene terephthalate resin from which intrinsic viscosity differs may be used. .

  (A-1) As dicarboxylic acid components other than terephthalic acid constituting the polyalkylene terephthalate resin, phthalic acid, isophthalic acid, 4,4′-diphenyldicarboxylic acid, 4,4′-diphenylether dicarboxylic acid, 4,4 ′ -Aromatic dicarboxylic acids such as benzophenone dicarboxylic acid, 4,4'-diphenoxyethanedicarboxylic acid, 4,4'-diphenylsulfone dicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, Alicyclic dicarboxylic acids such as 3-cyclohexanedicarboxylic acid and 1,4-cyclohexanedicarboxylic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid and sebacic acid Commonly used ones can be used.

  Examples of diol components other than ethylene glycol or 1,4-butanediol include diethylene glycol, polyethylene glycol, 1,2-propanediol, 1,3-propanediol, polypropylene glycol, polytetramethylene glycol, dibutylene glycol, 1,5 -Aliphatic diols such as pentanediol, neopentyl glycol, 1,6-hexanediol, 1,8-octanediol, 1,2-cyclohexanediol, 1,4-cyclohexanediol, 1,1-cyclohexanedimethylol, 1 , 4-cyclohexane dimethylol and other alicyclic diols, xylylene glycol, 4,4′-dihydroxybiphenyl, 2,2-bis (4-hydroxyphenyl) propane, bis (4-hydroxyphenyl) sulfone, etc. Aromatic diols are used. Even when ethylene glycol or butylene glycol is used, diethylene glycol or dibutylene glycol may be by-produced during the reaction and incorporated into the polyalkylene terephthalate resin.

  Further, hydroxycarboxylic acids such as lactic acid, glycolic acid, m-hydroxybenzoic acid, p-hydroxybenzoic acid, 6-hydroxy-2-naphthalenecarboxylic acid, p-β-hydroxyethoxybenzoic acid, alkoxycarboxylic acid, stearyl Monofunctional components such as alcohol, benzyl alcohol, stearic acid, benzoic acid, t-butylbenzoic acid, benzoylbenzoic acid, tricarballylic acid, trimellitic acid, trimesic acid, pyromellitic acid, gallic acid, trimethylolethane, trimethylol Trifunctional or higher polyfunctional components such as propane, glycerol, pentaerythritol and the like can also be used as the copolymerization component. These copolymer components are preferably used in an amount of 5% by mass, particularly 3% by mass or less of the polyalkylene terephthalate resin to be produced.

  The production method of the (A-1) polyalkylene terephthalate resin from dicarboxylic acid or its derivative and diol is arbitrary. Specifically, any of a direct polymerization method in which terephthalic acid and glycol are directly esterified and a transesterification method in which dimethyl terephthalate is used as a main raw material can be used. The former is different in that water is produced in the initial esterification reaction, and the latter is produced in the initial transesterification reaction. The direct polymerization method is advantageous from the viewpoint of raw material costs.

  Either a batch method or a continuous method can be used. The initial esterification reaction or transesterification reaction is performed in a continuous operation, and the subsequent polycondensation is performed in a batch operation, or conversely, the initial esterification reaction or The transesterification reaction can be carried out by a batch operation, and the subsequent polycondensation can be carried out by a continuous operation.

  (A-1) In the polyalkylene terephthalate resin, a PBT resin alone having a terminal carboxyl group amount of 30 eq / t or less and a residual tetrahydrofuran amount of 300 ppm (mass ratio) or less, or a mixture of this PBT resin and PET resin is used. preferable.

  When a PBT resin having a terminal carboxyl group content of 30 eq / t or less is used, the hydrolysis resistance of the resulting resin composition can be improved. That is, since the carboxyl group acts as an autocatalyst for the hydrolysis of the PBT resin, if a terminal carboxyl group exceeding 30 eq / t exists, the hydrolysis starts at an early stage, and further, the generated carboxyl group becomes the autocatalyst and becomes a chain. In some cases, the hydrolysis proceeds and the degree of polymerization of the PBT resin rapidly decreases.

  However, if the amount of terminal carboxyl groups is 30 eq / t or less, early hydrolysis can be suppressed even under conditions of high temperature and high humidity. The amount of terminal carboxyl groups of the PBT resin can be determined by dissolving the PBT resin in an organic solvent and titrating with an alkali hydroxide solution.

  The amount of residual tetrahydrofuran in the PBT resin is preferably 300 ppm (mass ratio) or less, particularly 200 ppm (mass ratio) or less. A resin composition using a PBT resin having a large amount of residual tetrahydrofuran generates a large amount of organic gas at a high temperature. However, a resin molded body obtained from a resin composition using a PBT resin having a residual tetrahydrofuran amount of 300 ppm (mass ratio) or less generates little gas even when used at a high temperature, and therefore there is little risk of corrosion of electrical contacts. There are advantages.

  The lower limit of the residual tetrahydrofuran amount is not particularly limited, but is usually about 50 ppm (mass ratio). A smaller amount of residual tetrahydrofuran tends to reduce the generation of organic gas, but the residual amount and the amount of gas generated are not necessarily proportional, and the presence of about 50 ppm of tetrahydrofuran does not pose a problem for normal use. Rather, the presence of a small amount of diol is known to suppress corrosion of electrical contacts (Japanese Patent Laid-Open No. 8-20900), and similar effects are expected for tetrahydrofuran. The amount of residual tetrahydrofuran can be determined by immersing PBT resin pellets in water and holding at 120 ° C. for 6 hours, and quantifying the amount of tetrahydrofuran eluted in water by gas chromatography.

  (A) The polyalkylene terephthalate resin is obtained by copolymerizing other monomer components other than the above-mentioned homopolymer containing 5 to 50% by mass of components other than terephthalic acid and 1,4-butanediol. A copolymer (copolyester resin) may be used, and a copolymer polybutylene terephthalate resin is more preferable. Among these, the following copolymer polyester resins (A-2) to (A-4) are preferable. Such a copolymerized polybutylene terephthalate resin is preferably contained in a proportion of 20 to 100% by mass of the resin component.

(A-2) Polytetramethylene ether glycol copolymer polyester resin (A-2) The polytetramethylene ether glycol copolymer polyester resin (hereinafter sometimes referred to as “polyester ether resin”) is mainly composed of terephthalic acid. A polyester ether resin obtained by copolymerizing a dicarboxylic acid as a component and a diol mainly composed of 1,4-butanediol and polytetramethylene ether glycol (hereinafter sometimes referred to as PTMG); The ratio of the component derived from PTMG is preferably 2 to 30% by mass. If the ratio of this component is less than 2% by mass, the desired toughness tends to be difficult to develop, and if it exceeds 30% by mass, the moldability is lowered, and the strength and heat resistance of the resin molded product may be insufficient. is there. The proportion of the component derived from PTMG is preferably 3 to 25% by mass, particularly 5 to 20% by mass.

  The number average molecular weight of PTMG is arbitrary and may be selected and determined as appropriate. Among them, it is preferably 3,00 to 6,000, more preferably 500 to 5,000, particularly 500 to 3,000. It is preferable. If the number average molecular weight is too small, the effect of improving toughness is not sufficiently exhibited. On the contrary, if the number average molecular weight is too large, not only the strength and heat resistance are likely to be insufficient, but also low compatibility when used as a mixture with other polyalkylene terephthalate resins, specifically PBT resins. In some cases, the effect of improving the toughness of the obtained resin composition is not exhibited.

  The number average molecular weight of PTMG can be determined by reacting excess acetic anhydride with this, decomposing the remaining acetic anhydride with water to give an acid, and quantifying this acid by alkali titration.

  The intrinsic viscosity of the polyester ether resin is arbitrary, but usually, the value measured at 30 ° C. using a mixed solvent of tetrachloroethane and phenol in a mass ratio of 1/1 is preferably 0.7 to 2 dl / g. Among these, 0.8 to 1.6 dl / g is preferable.

  When the intrinsic viscosity of the polyester ether resin is too low or too high, the moldability of the resin composition using the polyester ether resin and the toughness of the resin molded body are lowered. The melting point of the polyester ether resin is usually 200 to 225 ° C, and preferably 205 to 222 ° C.

(A-3) Dimer acid copolymerized polyester resin The dimer acid copolymerized polyester resin is a copolymerized polyester resin obtained by copolymerizing glycol mainly composed of 1,4-butanediol, terephthalic acid, and dimer acid.

  The ratio of the dimer acid component to the total carboxylic acid component is preferably 0.5 to 30 mol% as the carboxylic acid group. If the proportion of the dimer acid is too large, the long-term heat resistance of the resin composition using the dimer acid is significantly reduced. On the other hand, if the amount is too small, the toughness is significantly reduced. Therefore, the ratio of the dimer acid component to the total carboxylic acid component is preferably 1 to 20 mol%, particularly preferably 3 to 15 mol%, as the carboxylic acid group.

  The dimer acid is usually obtained by dimerizing an unsaturated fatty acid having 18 carbon atoms, specifically oleic acid, linoleic acid, linolenic acid, elaidic acid, etc. with a clay catalyst such as montmorillonite. Can be mentioned. The reaction product of the dimerization reaction is a mixture mainly containing a dimer acid having 36 carbon atoms, and further containing a trimer acid having 54 carbon atoms, a monomer acid having 18 carbon atoms, and the like. This mixture is purified by vacuum distillation, molecular distillation, hydrogenation reaction or the like to obtain dimer acid.

  Dimer acid is not a single compound, but is generally a mixture of compounds having a chain, aromatic ring, alicyclic monocyclic and alicyclic polycyclic structures. For example, when a material having a large amount of linoleic acid is used as a dimer acid raw material, a compound having a chain structure is reduced and a compound having a cyclic structure is increased in the obtained dimer acid.

  As the dimer acid used for the production of the copolyester resin, it is preferable to use one containing 10% by mass or more of the chain dimer acid represented by the following general formula (2).

（式中、Ｒ^ｍ、Ｒ^ｎ、Ｒ^ｐ及びＲ^ｑは、それぞれ、アルキル基を示し、Ｒ^ｍ、Ｒ^ｎ、Ｒ^ｐ及びＲ^ｑの炭素数の和は３１である。）

(In the formula, R ^m , R ⁿ , R ^p and R ^q each represents an alkyl group, and the sum of the carbon numbers of R ^m , R ⁿ , R ^p and R ^q is 31.)

  When the chain dimer acid is used in an amount of 10% by mass or more, the tensile elongation of the resulting copolyester resin itself is improved, and the tensile elongation of the resin composition using this is also preferable.

  The proportion of the monomer acid contained in the dimer acid is preferably 1% by mass or less. The monomer acid inhibits the polymerization of the resin produced during the copolymerization, but if it is 1% by mass, the condensation polymerization proceeds sufficiently during the copolymerization, so that a high molecular weight copolymer can be obtained and the resulting resin composition The toughness of objects is improved.

  Preferred examples of the dimer acid include PRIIPOL 1008 and PRIPOL 1009 manufactured by Unikema, and PRIPLAST 3008 and PRIPLAST 1899 manufactured by Unikema as ester-forming derivatives of PRIPOL 1008, and PRIPLAST 1899. In addition, it does not restrict | limit especially as a manufacturing method of copolyester resin using a dimer acid, It can carry out in accordance with the conventionally well-known arbitrary methods, for example, the method disclosed by Unexamined-Japanese-Patent No. 2001-064576.

(A-4) Isophthalic acid copolymerized polyester resin The isophthalic acid copolymerized polyester resin is a copolymer obtained by copolymerizing glycol mainly composed of 1,4-butanediol and dicarboxylic acid mainly composed of terephthalic acid and isophthalic acid. Polyester resin.

  The proportion of the isophthalic acid component in the total carboxylic acid component is preferably 1 to 30 mol% as the carboxylic acid group. When the proportion of the isophthalic acid component is too large, the heat resistance of the resin composition using the isophthalic acid component is lowered, and the injection moldability is also lowered. On the other hand, if the amount is too small, the effect of improving toughness is insufficient. Therefore, the ratio of the isophthalic acid component to the total carboxylic acid component is preferably 1 to 20 mol%, particularly preferably 3 to 15 mol%, as the carboxylic acid group.

  The polyalkylene terephthalate resin component is preferably substantially composed of only a polyalkylene terephthalate resin and / or a copolyester resin, of which 60% by mass or more is a polybutylene terephthalate resin (that is, a polybutylene terephthalate resin). And / or a copolymerized polybutylene terephthalate resin), and more preferably substantially only a polybutylene terephthalate resin. Here, “substantially” means, for example, that it is added to such an extent that it does not affect various performances of the resin composition, and the other resin components are usually 3% by mass or less of the total resin components. .

  The intrinsic viscosity of the polyalkylene terephthalate-based resin may be appropriately selected and determined, but is usually preferably 0.5 to 2 dl / g, and in particular, 0.6 from the viewpoint of moldability and mechanical properties of the resin composition. It is preferable that it is -1.5dl / g. If a material having an intrinsic viscosity of less than 0.5 dl / g is used, the mechanical strength of the molded product obtained from the resin composition tends to be low, and conversely if it is greater than 2 dl / g, the fluidity of the resin composition decreases. However, moldability may be reduced.

  Here, the intrinsic viscosity of the polyalkylene terephthalate resin is a value measured at 30 ° C. in a 1: 1 (mass ratio) mixed solvent of tetrachloroethane and phenol.

  The (A) polyalkylene terephthalate resin preferably further contains a polycarbonate resin. The polycarbonate resin is the same as the polycarbonate resin in the above-described high thermal conductive polycarbonate resin composition. The content of the polycarbonate resin is preferably 5 to 50% by mass, and more preferably 10 to 30% by mass in the (A) polyalkylene terephthalate resin. If the content of the polycarbonate resin is less than 5% by mass, the adhesion to the panel member tends to be reduced, and if it exceeds 50% by mass, the mechanical properties may be reduced.

(B) Boron nitride The high thermal conductivity polyalkylene terephthalate resin composition of the present invention contains boron nitride in a proportion of 10 to 120 parts by mass, preferably 20 to 100 parts per 100 parts by mass of the polyalkylene terephthalate resin. It is a mass part, More preferably, it contains in the ratio of 30-90 mass parts. By using boron nitride, the thermal conductivity of the resulting polyalkylene terephthalate resin composition can be greatly improved. If the boron nitride content is too large, the moldability, impact resistance, and bending strain characteristics may be deteriorated. Conversely, if the content is too small, the thermal conductivity may be insufficient.

  The shape of boron nitride used in the present invention is not particularly limited, and any conventionally known shape can be used. Specific examples include a spherical shape, a linear shape (fiber shape), a flat plate shape (scale shape), a curved plate shape, and a needle shape. And it may be used as a single particle or as a granule (single particle aggregate). In the present invention, it is preferable to use a scale-like material because a resin composition excellent in thermal conductivity can be obtained and the mechanical properties become good.

  The average particle diameter of boron nitride used in the present invention is preferably 1 to 300 μm, more preferably 2 to 200 μm.

  As boron nitride, conventionally known boron nitride having an arbitrary crystal structure can be used. Specifically, a plurality of stable structures such as c-BN (zinc blende structure), w-BN (wurtzite structure), h-BN (hexagonal crystal structure), r-BN (rhombohedral crystal structure) and the like can be mentioned. It is done. As boron nitride, the thermal conductivity at 25 ° C. is preferably 30 W / (m · K) or more, and more preferably 50 W / (m · K) or more. As the boron nitride crystal structure, it is preferable to use hexagonal boron nitride because thermal conductivity is sufficient and wear of a molding machine or a mold used for obtaining a resin molded body can be reduced.

Magnesium silicate The high thermal conductivity polyalkylene terephthalate resin composition of the present invention may further contain magnesium silicate. By including magnesium silicate, thermal conductivity and tracking resistance tend to be more effectively improved. The total amount of the magnesium silicate salt is preferably 200 parts by mass or less, more preferably 150 parts by mass or less, with respect to 100 parts by mass of the polyalkylene terephthalate resin, based on the total amount of boron nitride. More preferably, it is at most part by mass. By including a magnesium silicate salt in such a blending amount, thermal conductivity and anti-tracking performance tend to be improved.

  Examples of the magnesium silicate salt include synthetic materials, minerals mainly composed of magnesium silicate, specifically, talc, sepiolite, and apatalite containing an aluminum component. Although it is possible, talc is particularly preferable from the viewpoint of thermal conductivity.

Talc is a kind of natural mineral, and its chemical formula is represented by 3MgO.4SiO ₂ .H ₂ O or Mg ₃ Si ₄ O ₁₀ (OH) ₂ . Talc usually contains impurities according to the production area, etc. The talc to be used is not particularly limited with respect to the production area, the type of impurities, and the amount thereof, but purified talc may be used if necessary.

  Although there is no restriction | limiting in particular about the average particle diameter of the talc to be used, Usually, a mass median particle diameter (D50) is 1-50 micrometers, and it is preferable that it is 3-40 micrometers especially. Here, the mass median particle diameter is a value measured by a laser diffraction method or the like. In addition, talc may be used that has been subjected to a treatment such as coating its surface with an organic compound for the purpose of increasing the affinity with the component resin and enhancing the dispersibility in the resin composition.

  The bulk specific gravity of the talc to be used may be appropriately selected and determined, but is preferably 0.4 g / ml or more from the viewpoint of productivity. Here, the bulk specific gravity value is a method in which 10 g of a sample is weighed, and this is gently put into a test tube with a 50 ml scale and calculated from the numerical value of the volume. Bulk specific gravity (g / ml) = 10 g / ml It is a value expressed in volume (ml).

  Among them, it is preferable to use compressed fine powder talc as the talc used in the present invention because it has high uniform dispersibility, can improve kneading workability and mechanical characteristics, and can greatly improve electrical characteristics such as tracking resistance. In this case, the bulk specific gravity of talc is preferably 0.4 g / ml or more, and more preferably 0.6 g / ml or more. In addition, when using talc with such high bulk specific gravity, as long as it is more than this numerical value, you may use combining talc with different bulk specific gravity. Although the upper limit of the bulk specific gravity is not particularly defined, it is usually 1.0 g / ml or less.

  Magnesium silicate salt is a resin that maintains various physical properties such as thermal conductivity by using together with a high bulk density magnesium silicate salt such as granular talc with a bulk density of 0.4 g / ml or more. The meterability at the time of manufacturing the composition is stable, and the highly heat conductive polyalkylene terephthalate resin composition of the present invention can be manufactured industrially.

Since boron nitride and magnesium silicate used in the present invention are excellent in insulation, they can be installed in places close to or in contact with electronic equipment, which is difficult with a heat conductive member such as metal. It becomes possible. The surface specific resistance of the molded body of the highly heat-conductive polyalkylene terephthalate resin composition of the present invention is usually 1 × 10 ¹³ Ω or more, preferably 1 × 10 ¹⁴ Ω or more.

  In addition to these, additives having excellent insulating properties, specifically, aluminum silicate, aluminum nitride, silicon nitride, zinc oxide, aluminum oxide, magnesium oxide, calcium titanate and the like may be used in combination. These may be combined and used as a composite filler having a core-shell structure.

(C) Glass fiber The high thermal conductivity polyalkylene terephthalate resin composition of the present invention contains (C) glass fiber. The content of (C) glass fiber is preferably 20 to 100 parts by mass and more preferably 30 to 90 parts by mass with respect to 100 parts by mass of (A) polyalkylene terephthalate resin.

  (C) The glass fiber is preferably composed of a composition such as A glass, C glass, E glass, and in particular, E glass (non-alkali glass) does not adversely affect the thermal stability of the polyalkylene terephthalate resin. preferable. In general, it is preferable to use short fiber type (chopped strand) glass fibers from the viewpoint of easy handling, and a molded article having high strength, rigidity and heat resistance. In particular, in the case of a resin molded product that requires impact resistance, it is preferable to use a long fiber type in order to keep the fiber length of the glass fiber in the resin molded product longer. These can be used alone or in combination of two or more.

  (C) The glass fiber may be treated with a sizing agent and / or a surface treating agent. Examples of such a sizing agent or surface treatment agent include compounds having a functional group such as an epoxy compound, a silane compound, and a titanate compound.

(C) As a glass fiber, when the major axis of the cross section perpendicular to the length direction of the fiber is D2 and the minor axis is D1, the so-called irregular cross section having a D2 / D1 ratio (flatness) of 1.5 to 10 You may use what has a shape. This irregular cross-sectional shape means that the flatness indicated by the major axis / minor axis ratio (D2 / D1) when the major axis of the cross section perpendicular to the longitudinal direction of the fiber is D2 and the minor axis is D1 is 1.5 to 10. Among these, 2.5 to 10, more preferably 2.5 to 8, and particularly preferably 2.5 to 5.
When glass fibers having such an irregular cross-sectional shape are used, the thermal conductivity is particularly good as compared with the case of using so-called normal glass fibers whose normal cross-sectional shape is round (the flatness is 1). This is preferable. This is because the glass fiber having an irregular cross-sectional shape is in the resin molded body, particularly in the resin molded body obtained by injection molding, in a wide range from the surface to the inside of the resin molded body, the molten resin at the time of resin molding This is considered to be due to the orientation in the flow direction and the orientation of the plate-like inorganic compounds such as boron nitride and magnesium silicate along the orientation of the glass fibers.

  Further, as the glass fiber having an irregular cross-sectional shape, when the average fiber length is L, the (L × 2) / (D2 + D1) ratio (aspect ratio) is preferably 10 or more, especially 50 to 10. Is preferred.

  The flatness of the glass fiber can be easily calculated from the measured values of the major axis and the minor axis by microscopic observation of the cross section of the fiber. If the flatness is described in the catalog for a commercially available glass fiber, this value may be used. The fiber length of the glass fiber in the resin molded body is, for example, about 5 g of a sample cut out from the resin molded body and left to stand in an electric furnace at 600 ° C. for 2 hours to be ashed. Can be measured. Specifically, the glass fiber is dispersed in a neutral surfactant aqueous solution so as not to break the glass fiber, and the dispersed aqueous solution is transferred onto a slide glass with a pipette and photographed with a microscope. About this photographic image, image analysis software may be used to measure 1000 to 2000 reinforcing fibers and calculate the number average fiber length.

  Specifically, the cross-sectional shape of the glass fiber having an irregular cross-sectional shape is a rectangular shape, an oval shape, an elliptical shape, or a narrowed central portion in the longitudinal direction when cut at right angles to the length direction of the fiber. There is a type. Examples of the cross-sectional shape of these glass fibers are described in JP-A No. 2000-265046.

  The fiber-shaped reinforcing material having a saddle-shaped cross-section has a constricted central part, the strength of the part is low, and the central part may crack, and the constricted part may have poor adhesion to the base resin. Therefore, in order to improve mechanical properties, it is preferable to use a cross-sectional shape that is rectangular, oval, or elliptical, and it is more preferable that the cross-sectional shape is rectangular or oval. The term “oval” is intended to include a shape formed of a smooth curve having different lengths and widths and rounded as a whole, and a shape formed of two arcs and two straight lines connecting these arcs.

  For example, Japanese Patent Publication No. 3-59019, Japanese Patent Publication No. 4-13300, Japanese Patent Publication No. 4 can be used as the glass fiber having a modified cross section which can be suitably used as the glass fiber used in the high thermal conductivity polyalkylene terephthalate resin composition of the present invention. -32775 and the like. In particular, in an orifice plate having a large number of orifices on the bottom surface, an outer periphery of an orifice plate surrounding a plurality of orifice outlets and having a convex edge extending downward from the bottom surface of the orifice plate, or a nozzle tip having one or more orifice holes A glass fiber having a flat cross section produced using a nozzle chip for deformed cross section glass fiber spinning provided with a plurality of convex edges extending downward from the tip of the section is preferred.

  Further, a general circular (or round) cross-section glass fiber (flatness 1) may be used in combination with the above-mentioned irregular cross-section glass fiber, but the flatness and aspect ratio at that time are calculated by mass average. It is only necessary that the calculated numerical value falls within the range of the flatness ratio and aspect ratio.

(D) Halogenated phthalimide flame retardant The highly heat-conductive polyalkylene terephthalate resin composition of the present invention may contain a halogenated phthalimide flame retardant as necessary. When the halogenated phthalimide flame retardant is included, the halogenated phthalimide flame retardant is contained in an amount of 40 parts by mass or less, preferably 5 to 40 parts by mass with respect to 100 parts by mass of the polyalkylene terephthalate resin. Content of a system flame retardant is 10-35 mass parts, More preferably, it is 15-30 mass parts. In the present invention, thermal conductivity can be improved by using boron nitride and a halogenated phthalimide flame retardant in combination.
Here, examples of the halogen atom contained in the halogenated phthalimide flame retardant include a fluorine atom, a chlorine atom, and a bromine atom, and a bromine atom is preferable.
The halogenated phthalimide flame retardant may be synthesized by a known method, or a commercially available product may be used.

(E) Antimony compound The highly heat-conductive polyalkylene terephthalate resin composition of the present invention may contain an antimony compound as necessary. When the antimony compound is contained, the content of the antimony compound is 20 parts by mass or less, preferably 2 to 20 parts by mass with respect to 100 parts by mass of the polyalkylene terephthalate resin, and the more preferable content of the antimony compound is It is 3-15 mass parts, More preferably, it is 5-12 mass parts.
Examples of the antimony compound include antimony trioxide (Sb ₂ O ₃ ), antimony pentoxide (Sb ₂ O ₅ ), sodium antimonate and the like, and antimony trioxide is preferable. By using antimony trioxide, a high flame retardant effect can be obtained.

(F) White pigment The high thermal conductivity polyalkylene terephthalate resin composition of the present invention may contain a white pigment. The white pigment is preferably contained in a proportion of 10 parts by mass or less, more preferably 1 to 10 parts by mass, and further preferably 3 to 10 parts by mass with respect to 100 parts by mass of the polyalkylene terephthalate resin. Included as a percentage.
As a white pigment, you may synthesize | combine by a well-known method and may use a commercial item.

  Furthermore, various additives commonly used in thermoplastic resin compositions can be added to the highly heat-conductive polyalkylene terephthalate resin composition of the present invention within a range not to impair the object of the present invention. Examples of such additives include stabilizers such as antioxidants, ultraviolet absorbers, light stabilizers, hydrolysis inhibitors (epoxy compounds, carbodiimide compounds, etc.), antistatic agents, lubricants, mold release agents, dyes, Colorants such as pigments, plasticizers and the like can be mentioned. In particular, the addition of a stabilizer and a release agent is effective. The addition amount of these additives is usually 10 parts by mass or less, preferably 5 parts by mass or less, with respect to 100 parts by mass of the polyalkylene terephthalate resin.

  An anti-dripping agent may be further added to the high thermal conductivity polyalkylene terephthalate resin composition of the present invention. As the anti-dripping agent, a fluororesin is preferred, and specifically, polytetrafluoroethylene, tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer, tetrafluoroethylene / hexafluoropropylene copolymer, tetrafluoroethylene / ethylene copolymer. Examples include coalescence. However, the highly heat-conductive polyalkylene terephthalate resin composition of the present invention can achieve high flame retardancy even when substantially free of such an anti-dripping agent. “Substantially not contained” means that it is not added in an addition amount that functions as an anti-dripping agent, and is usually 0.1% by mass or less based on the resin component.

  The highly heat-conductive polyalkylene terephthalate resin composition of the present invention preferably contains substantially no flame retardant other than the halogen flame retardant. “Substantially not contained” means that it is not added in an addition amount that functions as a flame retardant, and is usually 0.1% by mass or less based on the resin component. Non-halogen flame retardants include phosphoric flame retardants such as phosphates, polyphosphates and red phosphorus, inorganic flame retardants such as aluminum hydroxide and magnesium hydroxide, other silicone flame retardants, and triazine flame retardants. Etc.

  The high thermal conductivity polyalkylene terephthalate resin composition of the present invention may be supplemented with other thermoplastic resins other than polycarbonate resin, and can be used as long as the resin is stable at high temperatures. Examples include polyamide, polyphenylene oxide, polystyrene resin, polyphenylene sulfide ethylene, polysulfone, polyethersulfone, polyetherimide, polyetherketone, and fluororesin.

  The highly heat-conductive polyalkylene terephthalate resin composition of the present invention can be prepared according to a conventional method for preparing a resin composition. Usually, the components and various additives added as desired are mixed together and then melt-kneaded in a single-screw or twin-screw extruder. In addition, each component is not mixed in advance or only a part thereof is mixed in advance, supplied to an extruder using a feeder, and melt kneaded to prepare the highly heat-conductive polyalkylene terephthalate resin composition of the present invention. You can also. In addition, a master batch is prepared by melting and kneading a part of the polyalkylene terephthalate resin and a part of other components, and then melt-kneading the remaining polyester resin and other ingredients. May be.

[Panel support]
The panel support body on which the panel of the present invention is supported via a frame member is usually made of metal.
When the panel of the present invention is a window member such as a building, the panel support is a metal frame of a window part, and is made of various steel materials or non-ferrous materials, such as steel materials (steel plates), aluminum alloys, magnesium alloys, A titanium alloy etc. are illustrated. Of these, steel materials and aluminum alloys are preferred. The surface of the metal frame may have a coating of other materials on the frame member joint surface of the panel. For example, a coating such as hot dipping, electroplating, or other coating may be formed.

  When the panel of the present invention is a glazing of a vehicle, the body frame serves as a panel support and is usually made of steel or aluminum alloy.

[Seal materials and adhesives]
The frame member of the panel of the present invention may transfer heat from the panel body by directly contacting the panel support as described above, and between the frame member and the panel support. In addition, an adhesive, a seal member, or the like may be interposed. When a seal member is interposed between the frame member and the panel support, the seal member does not need to have particularly high thermal conductivity when the gap between the frame member and the panel support is extremely narrow. Therefore, it is not preferable to cover the entire surface of the high heat conduction frame member. As the sealing member, a double-sided tape, a normal adhesive, grease, rubber or the like can be used. When the gap between the frame member and the panel support is wide (for example, 1 mm or more), the sealing member preferably has a high thermal conductivity with a thermal conductivity of 0.5 W / m · K or more. Resins, rubbers, polyurethanes, greases, and the like containing high thermal conductive fillers such as metal powder, graphite, alumina, boron nitride, silicon nitride, and aluminum nitride are used.
These may be used individually by 1 type and may be used in combination of 2 or more type.

  As the adhesive, one having high thermal conductivity is preferable. Examples of preferable high heat conductive adhesives include urethane adhesives that form a rubbery buffer layer (C) disclosed in, for example, JP-A-2009-270121, and prior to the application of the urethane adhesives. The primer described in the publication may be applied. In particular, when adhesion between the panel support and the panel of the present invention or durability of adhesion is required, a primer is applied between the urethane adhesive and the frame member and between the urethane adhesive and the panel support. It is preferable to work.

[Hard coating]
In the present invention, a hard coat (hard coating) may be provided as a protective film in order to mainly prevent damage and deterioration of the panel body. Such a hard coating is formed on one or both of the front surface side of the panel body opposite to the frame member and the inner region of the frame member on the rear surface of the panel body, but at least on the front surface of the panel body. Preferably it is formed.
The thickness of the hard coating is preferably 1/100 or less of the thickness of the panel body, and is usually preferably 1 to 50 μm, particularly preferably 5 to 20 μm. When the thickness of the hard coating is too thin, the function as the protective layer of the panel body may be impaired in terms of weather resistance and scratch resistance. Moreover, when thickness is too thick, there exists a tendency for the possibility of aging fracture | rupture to become high by the linear expansion difference with a panel main body.

  The hard coating may be a single layer, but may have a multilayer structure of at least two layers in order to enhance the protective function or weather resistance. In the multilayer structure, it is preferable to set the hardness of the outermost layer to the maximum. As the hard coating having a multilayer structure, for example, it has at least one function among a functional layer of each of heat ray shielding, ultraviolet absorption, thermochromic, photochromic, electrochromic, primer layer, colored decoration layer, etc. Preferably it is.

  A transparent resin is suitable for the constituent material of the hard coating. As such a transparent resin, a known material known as a hard coating agent can be used as appropriate. For example, various hard coating agents such as silicone, acrylic, silazane, and urethane can be used. I can do it. In these, in order to improve adhesiveness and a weather resistance, the 2-coat type hard coat which provides a primer layer before apply | coating a hard-coat agent is preferable. Examples of the coating method include spray coating, dip coating, flow coating, spin coating, and bar coating. Moreover, the method by a film insert, the method of apply | coating and transferring the chemical | medical agent suitable for a transfer film, etc. can be employ | adopted.

  Moreover, as a hard film, the surface protective layer of Unexamined-Japanese-Patent No. 2011-121304 is also effective.

  Chemical films having various functions (heat ray shielding, ultraviolet absorption, thermochromic, photochromic, and electrochromic functions) may be formed on the outermost layer of the hard coating.

  Moreover, a transparent resin layer may be provided between the surface of the panel body and the hard coating.

  In addition, when the panel of the present invention is used as a back door panel, it is necessary to have a function of anti-fogging and removing frost on the rear glass, so that a conductive film or an anti-fogging film can be formed on the frame member forming surface side of the panel body. preferable. The conductive film may further be provided with a hard film as a hard coat function on the outer surface side, but the antifogging film is preferably the outermost layer of the film attached to the panel body.

[Usage]
The panel and panel installation structure of the present invention are useful as windows for buildings, glazing for vehicles, and the like.
As glazing for vehicles, it can be applied to side doors, back doors, slide doors, hoods, roofs, and the like.
For example, when the panel of the present invention is used for a back door panel, the thermally conductive frame member can be used for heat exchange of a defocking function provided on the back door glass.
For example, when a highly heat conductive frame member is used on the heat transfer side, a heat source is arranged in the frame member to transmit heat to the entire periphery of the window through the frame member, thereby improving the clearness of the glass. Can be raised.
Conversely, excessive heat storage can be suppressed by releasing the heat generated by the surface heating element and the heat conduction wire disposed in the glass to the outside through the highly heat conductive frame member of the panel of the present invention. Is possible.
In any case, in order to prevent an electrical short circuit from the heat source, it is preferable that the highly heat-conductive frame member is insulative.

Hereinafter, the present invention will be described more specifically with reference to Examples , Reference Examples and Comparative Examples.

[Materials used]
In the following examples , reference examples, and comparative examples, the composition and physical properties of the resin compositions used for preparing the panel bodies of the test samples are as follows.

[Polycarbonate resin composition I (resin composition for heat insulation layer, hereinafter referred to as "PCI")
Polycarbonate resin (Mitsubishi Engineering Plastics, trade name “Iupilon (registered trademark) S-2000UR / 5355”, light blue, viscosity average molecular weight 25,000)
<Optical characteristics>
Visible light transmittance T _VIS : 89.64%
Total solar transmittance T _SUN : 89.01%
Converted total solar transmittance T _{S / V} : 89.00%
_{T S / V -T SUN: -0.01} %
The visible light transmittance T _VIS and total solar radiation transmittance T _SUN of the PCI are indicated by “●” in FIG.
<Thermal conductivity>
Thermal conductivity: 0.3 W / m · K

[Polycarbonate resin composition II (resin composition for IR absorbing layer, hereinafter referred to as “PCII”)]
<Resin composition formulation>
Polycarbonate resin 1 (Mitsubishi Engineering Plastics, trade name “Iupilon (registered trademark) E-2000FN”, viscosity average molecular weight 28,000): 44.47 parts by mass Polycarbonate resin 2 (Mitsubishi Engineering Plastics, trade name) "Iupilon (registered trademark) S-3000FN", viscosity average molecular weight 21,500): 55.53 parts by mass Lanthanum hexaboride fine particle dispersion (manufactured by Sumitomo Metal Mining Co., Ltd., trade names "KHDS-02", 6-ho Lanthanum fluoride fine particle content 10.5% by mass, zirconium oxide content 10.6% by mass, polymer dispersant content 78.9% by mass, particle size 20-100 nm): 0.05 part by mass Weatherability improver (Cipro Chemical) Product name “Seesorb 709”, 2- (2′-hydroxy-5′-tert-octylpheny) ) -2H-benzotriazole): 0.3 part by mass Thermal stabilizer (manufactured by ADEKA, trade name “ADEKA STAB AS2112”, tris (2,4-di-tert-butylphenyl) phosphite): 0.02 part by mass Antioxidant (trade name “Irganox 1010” manufactured by BASF Corporation, pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate]): 0.1 part by mass Release agent (Riken Vitamin Co., Ltd., trade name “Riquemar S-100A”, glycerin monostearate): 0.1 part by weight Blue dye (Bayer, trade name “MACROLEX Blue RR” (Anthraquinone series)): 0.0034 Part by weight Red dye (Mitsubishi Chemical Co., Ltd., trade name “D-RED-HS” (perinone series)): 0.003 part by mass <light Characteristics>
Visible light transmittance T _VIS : 18.40%
Total solar radiation transmittance T _SUN : 34.70%
Converted total solar transmittance T _{S / V} : 49.10%
T _{S / V} −T _SUN : 14.40%
The visible light transmittance T _VIS and total solar radiation transmittance T _SUN of the PCII are indicated by “●” in FIG.
<Thermal conductivity>
Thermal conductivity: 0.3 W / m · K

[Polycarbonate Resin Composition III (IR Absorbing Layer Resin Composition; hereinafter referred to as “PCIII”)]
<Resin composition formulation>
Resin composition in which PCI and PCI are mixed at a mass ratio of 1: 1: <optical properties>
Visible light transmittance T _VIS : 44.27%
Total solar radiation transmittance T _SUN : 46.26%
Converted total solar transmittance T _{S / V} : 63.59%
_{T S / V -T SUN: 17.33} %
The visible light transmittance T _VIS and total solar radiation transmittance T _SUN of PCIII are indicated by “●” in FIG.
<Thermal conductivity>
Thermal conductivity: 0.3 W / m · K

[Polycarbonate resin composition IV (resin composition for IR absorbing layer, hereinafter referred to as “PCIV”)]
<Resin composition formulation>
Resin composition in which PCI and PCI are mixed at a mass ratio of 3 to 2 <Optical characteristics>
Visible light transmittance T _VIS : 45.71%
Total solar transmittance T _SUN : 50.68%
Converted total solar transmittance T _{S / V} : 64.40%
T _{S / V} −T _SUN : 13.72%
The visible light transmittance T _VIS and total solar radiation transmittance T _SUN of the PCIV are indicated by “●” in FIG.
<Thermal conductivity>
Thermal conductivity: 0.3 W / m · K

[Polycarbonate resin composition V (resin composition for IR absorption layer, hereinafter referred to as “PCV”)
<Resin composition formulation>
Polycarbonate resin 1 (Mitsubishi Engineering Plastics, trade name “Iupilon (registered trademark) E-2000FN”, viscosity average molecular weight 28,000): 59.8 parts by weight Polycarbonate resin 2 (Mitsubishi Engineering Plastics, trade name) “Iupilon (registered trademark) S-3000FN”, viscosity average molecular weight 21,500): 40.2 parts by mass Lanthanum hexaboride fine particle dispersion (manufactured by Sumitomo Metal Mining Co., Ltd., trade name “KHDS-02”, 6 H Lanthanum fluoride fine particle content 10.5% by mass, zirconium oxide content 10.6% by mass, polymer dispersant content 78.9% by mass, particle size 20-100 nm): 0.03 parts by mass 6 lanthanum boride fine particle dispersion (Product name “KHDS-06” manufactured by Sumitomo Metal Mining Co., Ltd., lanthanum hexaboride fine particle content 0.25% by mass Starbatch): 1.80 parts by mass Thermal stabilizer 1 (manufactured by ADEKA, trade name “ADEKA STAB AS2112” (Tris (2,4-di-tert-butylphenyl) phosphite)): 0.04 parts by mass Agent 2 (trade name “Adeka Stub AO50” (stearyl-β- (3.5-di-t-butyl-4-hydroxyphenyl) propionate) propionate) manufactured by ADEKA): 0.03 part by weight Release agent: Cognis Product name “VPG861” (pentaerythritol tetrastearate): 0.15 parts by mass UV absorber: manufactured by Cypro Kasei Co., Ltd., product name “Seesorb 709” (2- (2′-hydroxy-5 ′) -Tert-octylphenyl) -2H-benzotriazole): 0.05 part by mass Purple dye (manufactured by Sumitomo Chemical Co., Ltd., trade name “MACROL”) X Violet 3R "(Anthraquinone series)): 0.0012 parts by mass Blue dye (manufactured by Sumitomo Chemical Co., Ltd., trade name" MACROLEX Blue RR "(Anthraquinone series)): 0.0025 parts by mass Red dye (Mitsubishi Chemical Co., Ltd.) , Trade name “D-RED-HS” (perinone-based)): 0.0015 parts by mass <Optical properties>
Visible light transmittance T _VIS : 13.39%
Total solar transmittance T _SUN : 31.87%
Converted total solar transmittance T _{S / V} : 46.30%
TS _{/ V} - _TSUN : 14.43%
The visible light transmittance T _VIS and total solar radiation transmittance T _SUN of the PCV are indicated by “●” in FIG.
<Thermal conductivity>
Thermal conductivity: 0.3 W / m · K

[Polycarbonate resin composition VI (resin composition for IR absorbing layer, hereinafter referred to as “PCVI”)

<Resin composition formulation>
Polycarbonate resin 1 (Mitsubishi Engineering Plastics, trade name “Iupilon (registered trademark) E-2000FN”, viscosity average molecular weight 28,000): 67.4 parts by weight Polycarbonate resin 2 (Mitsubishi Engineering Plastics, trade name) "Iupilon (registered trademark) S-3000FN", viscosity average molecular weight 21,500): 32.6 parts by mass Lanthanum hexaboride fine particle dispersion (manufactured by Sumitomo Metal Mining Co., Ltd., trade names "KHDS-06", 6 Lanthanum fluoride fine particle content 0.25 mass% master batch): 2.0 parts by mass Thermal stabilizer 1 (manufactured by ADEKA, trade name “ADK STAB AS2112” (Tris (2,4-di-tert-butylphenyl) phosphite)) ): 0.05 part by mass Thermal stabilizer 2 (manufactured by ADEKA, trade name “ADK STAB AO50”) (Stearyl-β- (3.5-di-t-butyl-4-hydroxyphenyl) propionate) propionate): 0.05 part by weight Release agent: Cognis Japan, trade name “VPG861” (pentaerythritol tetra) Stearate): 0.3 part by mass Ultraviolet absorber: manufactured by Cypro Kasei Co., Ltd., trade name “Seesorb 709” (2- (2′-hydroxy-5′-tert-octylphenyl) -2H-benzotriazole): 0.1 part by mass Purple dye (manufactured by Sumitomo Chemical Co., Ltd., trade name “MACROLEX Violet 3R” (Anthraquinone series)): 0.0003 part by mass Blue dye (manufactured by Sumitomo Chemical Co., Ltd., trade name “MACROLEX Blue RR” (Anthraquinone) System)): 0.0002 parts by mass Green dye (manufactured by Sumika Chemtex Co., Ltd., trade name “Sumiplast Gre”) n G "(anthraquinone): 0.0004 parts by weight of yellow dye: Kiwa Chemical Industry Co., Ltd., trade name" KP Plast Yellow MK "(anthraquinone): 0.0001 parts by weight of <optical properties>
Visible light transmittance T _VIS : 58.43%
Total solar radiation transmittance T _SUN : 54.81%
Converted total solar transmittance T _{S / V} : 71.52%
T _{S / V} −T _SUN : 16.71%
The visible light transmittance T _VIS and total solar radiation transmittance T _SUN of the PCVI are shown by “●” in FIG.
<Thermal conductivity>
Thermal conductivity: 0.3 W / m · K

[Polycarbonate resin composition VII (resin composition for IR absorbing layer, hereinafter referred to as “PCVII”)
<Resin composition formulation>
Polycarbonate resin 1 (Mitsubishi Engineering Plastics, trade name “Iupilon (registered trademark) E-2000FN”, viscosity average molecular weight 28,000): 74.9 parts by weight Polycarbonate resin 2 (Mitsubishi Engineering Plastics, trade name “Iupilon (registered trademark) S-3000FN”, viscosity average molecular weight 21,500): 25.1 parts by mass 6 lanthanum boride fine particle dispersion (manufactured by Sumitomo Metal Mining Co., Ltd., trade names “KHDS-06”, 6 Lanthanum fluoride fine particle content 0.25% by mass master batch): 3.2 parts by mass Thermal stabilizer 1 (manufactured by ADEKA, trade name “ADK STAB AS2112” (Tris (2,4-di-tert-butylphenyl) phosphite)) ): 0.05 part by mass Thermal stabilizer 2 (manufactured by ADEKA, trade name “ADK STAB AO50”) (Stearyl-β- (3.5-di-t-butyl-4-hydroxyphenyl) propionate) propionate): 0.05 part by weight Release agent: Cognis Japan, trade name “VPG861” (pentaerythritol tetra) Stearate): 0.3 part by mass Ultraviolet absorber: manufactured by Cypro Kasei Co., Ltd., trade name “Seesorb 709” (2- (2′-hydroxy-5′-tert-octylphenyl) -2H-benzotriazole): 0.1 part by mass Purple dye (manufactured by Sumitomo Chemical Co., Ltd., trade name “MACROLEX Violet 3R” (Anthraquinone)): 0.0022 parts by mass Blue dye (manufactured by Sumitomo Chemical Co., Ltd., trade name “MACROLEX Blue RR” (Anthraquinone) System)): 0.0018 parts by mass Red dye (manufactured by Sumika Chemtex Co., Ltd., trade name “Sumiplast RED”) HL5B "(perinone non-based): 0.0002 parts by mass <Optical characteristics>
Visible light transmittance T _VIS : 4.86%
Total solar radiation transmittance T _SUN : 28.29%
Converted total solar transmittance T _{S / V} : 41.52%
T _{S / V} −T _SUN : 13.23%
The visible light transmittance T _VIS and total solar radiation transmittance T _SUN of the PCVII are indicated by “●” in FIG.
<Thermal conductivity>
Thermal conductivity: 0.3 W / m · K

[Polycarbonate resin composition VIII (resin composition for IR absorbing layer, hereinafter referred to as “PCVIII”)
<Resin composition formulation>
Resin composition in which PCI and PCI are mixed at a mass ratio of 63 to 37 <Optical characteristics>
Visible light transmittance T _VIS : 42.82%
Total solar radiation transmittance T _SUN : 48.40%
Converted total solar transmittance T _{S / V} : 62.78%
T _{S / V} −T _SUN : 14.38%
The visible light transmittance T _VIS and total solar radiation transmittance T _SUN of the PCVIII are indicated by “●” in FIG.
<Thermal conductivity>
Thermal conductivity: 0.3 W / m · K

[Polycarbonate resin composition IX (resin composition for IR absorbing layer, hereinafter referred to as “PCIX”)
<Resin composition formulation>
Resin composition in which PCI and PCI are mixed at a mass ratio of 2 to 3 <Optical characteristics>
Visible light transmittance T _VIS : 30.61%
Total solar transmittance T _SUN : 41.55%
Converted total solar transmittance T _{S / V} : 55.94%
T _{S / V} −T _SUN : 14.39%
The visible light transmittance T _VIS and total solar radiation transmittance T _SUN of the PCIX are indicated by “●” in FIG.
<Thermal conductivity>
Thermal conductivity: 0.3 W / m · K

[Polycarbonate resin composition X (resin composition for heat insulation layer, hereinafter referred to as “PCX”)
Polycarbonate resin (Mitsubishi Engineering Plastics, trade name “NOVAREX (registered trademark) 7022R / HRR1953”, fluorescent red, viscosity average molecular weight 21,500)
<Optical characteristics>
Visible light transmittance T _VIS : 11.83%
Total solar transmittance T _SUN : 66.41%
Converted total solar transmittance T _{S / V} : 45.42%
_{T S / V -T SUN: -20.99} %
The visible light transmittance T _VIS and total solar radiation transmittance T _SUN of the PCX are indicated by “●” in FIG.
<Thermal conductivity>
Thermal conductivity: 0.3 W / m · K

  In the following examples and comparative examples, the composition and physical properties of the resin composition used for preparing the frame member of the test sample are as follows.

[Polycarbonate resin composition α (highly thermally conductive polycarbonate resin composition, hereinafter referred to as “PCα”)]
<Resin composition formulation>
Polycarbonate resin (Mitsubishi Engineering Plastics, trade name “Iupilon (registered trademark) S-3000FN”, viscosity average molecular weight 21,500): 100 parts by mass Graphitized carbon fiber (pitch system) (Mitsubishi Plastics, Product name “Dialead K223GM”, thermal conductivity 20 W / m · K in the length direction, fiber average diameter 10 μm, fiber average length 6 mm): 15 parts by mass Scale graphite (product name “PB90” manufactured by Nishimura Graphite Industries Co., Ltd.) , Average particle diameter 26 μm): 20 parts by mass <thermal conductivity>
Thermal conductivity: 6W / m · K

[Polycarbonate resin composition β (low thermal conductive polycarbonate resin composition, hereinafter referred to as “PCβ”)]
<Resin composition formulation>
Polycarbonate resin 1 (Mitsubishi Engineering Plastics, trade name "Iupilon (registered trademark) S-3000FN", viscosity average molecular weight 21,500): 76 parts by weight Polycarbonate resin 2 (Mitsubishi Engineering Plastics, trade name "Iupilon (Registered trademark) H-4000FN ”, viscosity average molecular weight 14,500): 4 parts by mass Polyethylene terephthalate resin (manufactured by Mitsubishi Chemical Corporation, trade name“ Novapex GG501H ”): 20 parts by mass Glass fiber (manufactured by Nippon Electric Glass Co., Ltd., commodity Name “Chopped Strand ECS-03T-187”): 9.1 parts by mass Thermal Stabilizer 1 (manufactured by ADEKA, trade name “ADK STAB AS2112” (Tris (2,4-di-tert-butylphenyl) phosphite)) : 0.1 part by mass Thermal stabilizer 2 (ADEKA) , Trade name "Adekastab AO50" (stearyl-β- (3.5-di-t-butyl-4-hydroxyphenyl) propionate) propionate): 0.2 parts by mass Elastomer (manufactured by Ganz Kasei Co., Ltd., trade name "STAFFY") Lloyd MG1011 "(styrene-based core-shell graft copolymer)): 3.4 parts by mass Black pigment (manufactured by Koshigaya Kasei Kogyo Co., Ltd., trade name" Royal Black 904G "): 1.1 parts by mass <thermal conductivity>
Thermal conductivity: 0.3 W / m · K

[Measurement method of each physical property]
The measuring method of the physical property of the used resin composition is as follows.

[Visible light transmittance T _VIS , total solar radiation transmittance T _SUN ]
About the resin composition of said PCI-PCX, the following injection molding machine was used and the test piece of 150 mm x 100 mm x thickness 5mm was manufactured on the following molding conditions.
Injection molding machine: “J220EVP” manufactured by Nippon Steel Works (clamping force 220t)
Molding conditions: Resin temperature during molding: 300 ° C
Mold temperature: 80 ℃
Filling time: 2.5 seconds
Holding pressure: 50% of the peak pressure during injection for 15 seconds
Cooling time: 20 seconds The obtained polycarbonate resin composition pellets were used after being subjected to hot air drying treatment at 120 ° C. for 5 hours before injection molding. The molded product was measured for visible light transmittance T _VIS and total solar radiation transmittance T _SUN according to ISO-9050.
Further, the visible light transmittance T _VIS and the total solar transmittance T _SUN of the panel main body were obtained by cutting out a molded product having a size of 150 mm × 100 mm × thickness 5 mm from the center of the panel main body obtained by the method described below. The body was determined by measuring according to ISO-9050.

[Thermal conductivity]
Using each resin composition, by injection molding machine (manufactured by Sumitomo Heavy Industries, Ltd., SH100, mold clamping force 100T), cylinder temperature: 300 ° C., mold temperature: 80 ° C., mold: 100 mm length, 100 mm width Then, a molded product having a thickness of 3 mm was injection molded under the condition of injection pressure: 147 MPa, and the obtained three injection molded products were stacked, and a rapid thermal conductivity measuring device (Ketherm QTM-D3, manufactured by Kyoto Electronics Industry Co., Ltd.) was used. the direction of the heating wire of the probe used, by pressing to match the flow direction of the 3-ply top of the molded article was measured for thermal conductivity, this value and lambda _X. Similarly the flow direction and perpendicular direction by pressing so as to match the direction of the heating wire of the probe to measure the thermal conductivity, this value and lambda _Y. In addition, after the 10 injection molded products obtained were bonded together with methylene chloride, they were cut into 5 equal parts at intervals of 20 mm in the direction perpendicular to the flow direction, so that all the obtained cut products could be observed in cross section. Bond together using methylene chloride. Then, after smoothly processed the bonded surface of the cutting article in a belt sander, by pressing a heating wire of the probe on the processed surface by measuring the thermal conductivity, this value and lambda _Z. Calculated from the measured thermal conductivity in the xyz-axis direction, introduced in “Thermophysical Property Measurement Method, Progress and Engineering Applications” (edited by the Japan Society of Mechanical Engineers, published by Yokendo). Λ _M is calculated using the following equation with reference to the method.
λ _M = λ _Y × λ _Z / λ _X
In the present invention, the thermal conductivity λ _M in the flow direction is defined as a thermal conductivity value.

[Color difference ΔE between panel body and IR absorption layer]
Using a spectral color difference meter “SE6000” manufactured by Nippon Denshoku Industries Co., Ltd., the color tone of only the IR absorbing layer was measured, and then the color tone of the panel body was measured to calculate the color difference ΔE. The color tone was measured based on JIS Z8722, and the color difference was calculated based on JIS Z8730. In addition, for the measurement of the color tone of the IR absorbing layer, a molded body having a size of 100 mm × 50 mm cut out from a molded body having only the IR absorbing layer obtained by the method described below was used. In addition, for measuring the color tone of the panel main body, a molded body having a size of 100 mm × 50 mm cut out from the panel main body obtained by the method described below was used.

[Thermal insulation of the laminated panel body]
In Examples 1 to 9 and Comparative Example 1 below, a heat insulation test was performed using a test apparatus shown in FIGS. 5 and 6 simulating a panorama roof of an automobile. FIG. 5 is a schematic perspective view showing the entire test apparatus, and FIG. 6 is a cross-sectional view taken along the line aa in FIG.

  5 and 6, reference numeral 60 denotes a test sample panel (panel main body), which is a flat plate having a thickness of 500 mm × 500 mm and a thickness of 5 mm.

Reference numeral 61 denotes a test wooden hundred-leaf box that also serves as a mounting table for the panel (panel main body) 60, and is a bottomed box-type hundred-leaf box that has two side surfaces 61A and two side surfaces 61B facing each other, and the upper part is open. . The size of the bottom surface of the test hundred-leaf box 61 is 300 mm × 300 mm, the height of the side surface 61A is 150 mm, and the height of the side surface 61B is 250 mm.
The sample panel main body 60 is placed on the test leaflet box 61, and an opening 61C is formed above the side surface 61A.

An artificial sunlight lamp 70 is provided above the panel main body 60 on the test hundreds box 61 so that the surface of the panel main body 60 can be irradiated with light by turning on the artificial sunlight lamp 70. It is configured. The artificial solar light 70 is provided at a position 900 mm above the central surface portion of the panel main body 60. When the artificial solar light 70 is turned on, the amount of light irradiated on the central surface of the panel main body 60 is 1,500 W. / M ² . This irradiation light quantity is a value measured by installing an illuminometer at the same height position as the center surface position of the panel body 60.

  In FIGS. 5 and 6, No. marked with a double circle: ◎. 1 to 4 are temperature measurement points, each of which is equipped with a temperature sensor, and temperature measurement is performed. Each measurement point No. The positions 1 to 4 are as follows.

Measurement point No. 1: Panel body 60 surface side, center of second layer surface (see FIGS. 5 and 6)
Measurement point No. 2: Panel body 60 back side, center of first layer surface (see FIG. 6)
Measurement point No. 3: Panel main body 60 surface side, on the diagonal line of the second layer surface, 1/4 position of the diagonal line from the end (see FIGS. 5 and 6)
Measurement point No. 4: Panel body 60 rear surface side, on the diagonal line of the first layer surface, 1/4 position of the diagonal line from the end (see FIG. 6)

[Example 1]
As shown in Tables 2 and 3, using PCII as the molding material for the IR absorbing layer and using PCI as the molding material for the heat insulation layer, the panel body of the test sample having the thickness configuration shown in Table 2 by the following method Was molded.
First, an IR absorption layer (second layer) was formed by injection-molding PCII (cylinder temperature 300 ° C.) into a cavity formed between a fixed mold and a movable mold whose temperature was controlled at 80 ° C. . The injection speed was a single speed of 50 mm / sec, and the injection holding pressure switching position was 2 mm. Molding was performed with a valve gate type hot runner. Injection compression molding was performed, the mold was opened by 2 mm before injection, and 700 t was re-clamped at the injection holding pressure switching position. The holding time for re-clamping at this time was 15 seconds. Next, after cooling for 60 seconds, the movable mold was opened, and the molded article of the IR absorbing layer was removed.
Next, the removed IR absorbing layer is mounted in a movable mold adjusted to the thickness of the final panel body, and covers the entire anti-mold surface of the IR absorbing layer and the periphery of the IR absorbing layer for 1.5 mm. PCI was injection-molded (cylinder temperature 300 ° C.) so as to be in a state. At this time, the mold temperature was 80 ° C., the injection speed was a single speed of 50 mm / sec, and the injection holding pressure switching position was 2 mm. Molding was performed with a valve gate type hot runner. Injection compression molding was performed, the mold was opened by 2 mm before injection, and 700 t was re-clamped at the injection holding pressure switching position. The holding time for re-clamping at this time was 15 seconds. Next, after cooling for 60 seconds, the movable mold was opened, and the panel body in which the IR absorption layer and the heat insulating layer were laminated and integrated was removed.

[Example 2]
As shown in Tables 2 and 3, IR absorption was performed in the same manner as in Example 1 except that PCIII was used as the molding material for the IR absorbing layer, PCI was used as the molding material for the heat insulating layer, and molding was performed at a cylinder temperature of 320 ° C. A panel body of a test sample in which the layer and the heat insulating layer were laminated and integrated was molded.

[Example 3]
As shown in Tables 2 and 3, PCV is used as the molding material for the IR absorbing layer, PCI is used as the molding material for the heat insulating layer, and the panel body of the test sample having the thickness configuration shown in Table 2 is formed by the following method. Molded.
First, PCI was injection-molded (cylinder temperature 300 ° C.) into a cavity formed between a fixed mold and a movable mold whose temperature was controlled at 80 ° C. to form a heat insulating layer (first layer). The injection speed was a single speed of 50 mm / sec, and the injection holding pressure switching position was 2 mm. Molding was performed with a valve gate type hot runner. Injection compression molding was performed, the mold was opened by 2 mm before injection, and 700 t was re-clamped at the injection holding pressure switching position. The holding time for re-clamping at this time was 15 seconds. Next, after cooling for 60 seconds, the movable mold was opened, and the molded body of the heat insulating layer was removed.
Next, the removed heat insulation layer is mounted in a movable mold adjusted to the thickness of the final panel body so that the peripheral edge of the IR absorption layer and the heat insulation layer form the same surface, and PCV is injection molded (cylinder Temperature 300 ° C.). At this time, the mold temperature was 80 ° C., the injection speed was a single speed of 50 mm / sec, and the injection holding pressure switching position was 2 mm. Molding was performed with a valve gate type hot runner. Injection compression molding was performed, the mold was opened by 2 mm before injection, and 700 t was re-clamped at the injection holding pressure switching position. The holding time for re-clamping at this time was 15 seconds. Next, after cooling for 60 seconds, the movable mold was opened, and the panel body in which the IR absorption layer and the heat insulating layer were laminated and integrated was removed.

[Example 4]
As shown in Tables 2 and 3, the IR absorbing layer and the heat insulating layer are laminated and integrated in the same manner as in Example 3 except that PCVI is used as the molding material for the IR absorbing layer and PCI is used as the molding material for the heat insulating layer. A panel body of the test sample was molded.

[Example 5]
As shown in Tables 2 and 3, the IR absorption layer and the heat insulation layer were laminated and integrated in the same manner as in Example 3 except that PCII was used as the molding material for the IR absorption layer and PCX was used as the molding material for the heat insulation layer. A panel body of the test sample was molded.

[ Reference Example 6]
As described in Tables 2 and 3, PCV was used as the molding material for the IR absorbing layer, and PCI was used as the molding material for the heat insulating layer.
First, a PCI sheet having a thickness of 0.1 mm was manufactured by using an extruder manufactured by Souken Co., Ltd. (screw diameter φ30 mm, L / D = 38, full flight screw). At this time, the resin temperature was 280 ° C., the rotation speed of the extruder was 20 rpm, and the temperature of the take-up roll was 140 ° C.
Next, in a movable mold adjusted to the thickness of the final panel body, a PCI sheet is mounted so that the peripheral edge portions of the IR absorption layer and the heat insulation layer form the same surface, and PCV is injection molded (cylinder Temperature 300 ° C.). At this time, the mold temperature was 80 ° C., the injection speed was a single speed of 50 mm / sec, and the injection holding pressure switching position was 2 mm. Molding was performed with a valve gate type hot runner. Injection compression molding was performed, the mold was opened by 2 mm before injection, and 700 t was re-clamped at the injection holding pressure switching position. The holding time for re-clamping at this time was 15 seconds. Next, after cooling for 60 seconds, the movable mold was opened, and the panel body in which the IR absorption layer and the heat insulating layer were laminated and integrated was removed.

[Example 7]
As described in Tables 2 and 3, PCVIII was used as the molding material for the IR absorbing layer, and PCI was used as the molding material for the heat insulating layer. The IR absorbing layer and the heat insulating layer were laminated and integrated in the same manner as in Reference Example 6 except that a extruder sheet manufactured by Souken Co., Ltd. was used and the rotational speed of the extruder was 80 rpm and a PCI sheet having a thickness of 0.75 mm was manufactured. A panel body of a test sample was molded.

[Example 8]
As described in Tables 2 and 3, PCVII was used as the molding material for the IR absorbing layer, and PCI was used as the molding material for the heat insulating layer.
First, a PCVII sheet having a thickness of 0.5 mm was produced using an extruder manufactured by Souken Co., Ltd. (screw diameter φ30 mm, L / D = 38, full flight screw). At this time, the resin temperature was 280 ° C., the rotation speed of the extruder was 80 rpm, and the temperature of the take-up roll was 140 ° C.
Next, in the movable mold adjusted to the thickness of the final panel body, the PCVII sheet is mounted so that the peripheral edge of the IR absorbing layer and the heat insulating layer form the same surface, and the PCI is injection molded (cylinder Temperature 300 ° C.). At this time, the mold temperature was 80 ° C., the injection speed was a single speed of 50 mm / sec, and the injection holding pressure switching position was 2 mm. Molding was performed with a valve gate type hot runner. Injection compression molding was performed, the mold was opened by 2 mm before injection, and 700 t was re-clamped at the injection holding pressure switching position. The holding time for re-clamping at this time was 15 seconds. Next, after cooling for 60 seconds, the movable mold was opened, and the panel body in which the IR absorption layer and the heat insulating layer were laminated and integrated was removed.

[Example 9]
As shown in Tables 2 and 3, PCVII was used as the molding material for the IR absorbing layer, PCI was used as the molding material for the heat insulation layer, and the thickness of the PCI heat insulation layer molded by injection molding was 3.5 mm. In the same manner as in Example 8, a panel body of a test sample in which an IR absorption layer and a heat insulating layer were laminated and integrated was molded.

[Comparative Example 1]
As shown in Tables 2 and 3, a panel body (single layer body) of a test sample having the same thickness as in Examples 1 and 2 was molded (cylinder temperature 300 ° C.) using PCIV as a molding material. At this time, the mold temperature was 80 ° C., the injection speed was a single speed of 50 mm / sec, and the injection holding pressure switching position was 2 mm. Molding was performed with a valve gate type hot runner. Injection compression molding was performed, the mold was opened by 2 mm before injection, and 700 t was re-clamped at the injection holding pressure switching position. The holding time for re-clamping at this time was 15 seconds. Subsequently, after cooling for 60 seconds, the movable mold was opened and the single-layer panel molded body was demolded.

  Each panel body was subjected to a heat insulation test using a test apparatus shown in FIGS. After the artificial solar light was turned on and a stable state was obtained, each panel body was placed on a test hundred-leaf box, the temperature change at each measurement point with the passage of time was examined, and the results are shown in Table 4.

The following can be seen from Tables 2-4.
It turns out that Examples 1-5 and 7-9 have a temperature difference between the surface temperature (surface side temperature) of IR absorption layer, and the surface temperature (back surface side temperature) of a heat insulation layer. This is because the heat absorption and heat storage by the IR absorption layer is suppressed from being transmitted to the back side of the panel body by the heat insulation layer because the IR absorption layer and the heat insulation layer are laminated.
On the other hand, Comparative Example 1, which has visible light transmittance and total solar transmittance equivalent to those of Examples 1, 2, and 7, but has no laminated structure, has a temperature difference between the front and back surfaces of the panel body. Has not occurred. This indicates that the heat quantity absorbed and stored is transmitted to the entire panel body because Comparative Example 1 is a single-layer structure of a material having an IR absorption function. In addition, since the evaluation 100-leaf box is a closed space on the back side of the panel body, heat is accumulated, and on the contrary, the temperature on the back side is higher.
Furthermore, even if it sees the temperature on the back side of the panel body after lighting the artificial solar light at the 1/4 position (measurement point No. 4) of the diagonal line from the end on the diagonal line, it has sufficient heat insulation and is equivalent. The back side temperatures of Examples 1, 2, and 7 having visible light transmittance and total solar transmittance are lower than those of Comparative Example 1, and the transfer of heat absorbed and stored by the IR absorption layer to the back side of the panel body is as follows. It turns out that it is suppressed by the heat insulation layer.
Therefore, for example, in applications such as glazing for automobiles, by attaching the IR absorbing layer to the outside of the vehicle and the heat insulating layer to the inside of the vehicle, the heat of the IR absorbing layer whose temperature has increased due to IR absorption is radiated to the inside of the vehicle. This can be shielded by the heat insulating layer, and the temperature rise in the vehicle compartment can be suppressed.

[Evaluation of heat dissipation of exhaust heat panel]
In the following examples and comparative examples, a heat dissipation test was performed using the test apparatus shown in FIGS. 19 to 21 simulating a panoramic roof of an automobile. 19 is a schematic perspective view showing the entire test apparatus, FIG. 20 is a cross-sectional view taken along line aa or bb in FIG. 19, and FIG. 21 is a metal plate attachment portion to the panel. FIG.

  19-21, 100 is a panel of the sample for a test, and is provided with the panel main body 101 and the frame member 102 provided in the peripheral part. The panel body 101 has an outer dimension of 750 mm × 465 mm and a thickness of 5 mm. The frame member 102 has a short side width of 97 mm, a long side boss part 102A installation side width of 75 mm, a long side anti-boss part 102A installation side width of 90 mm, and a boss. The thickness other than the portion 102A is 3 mm, the inner peripheral portion on the short side is 20 mm wide, the inner peripheral portion on the long side boss portion 102A side is 15 mm wide, and the inner peripheral portion on the long side anti-boss portion 102A is 25 mm wide Is provided with an inclined shape portion 102B that gradually decreases from 3 mm to 1 mm in thickness, and at a position 3 mm inside from the outer edge of the panel body 101 (that is, d = 3 mm in FIG. 21). The panel body 101 is curved so that the surface (front surface) opposite to the surface on which the frame member 102 is formed is convex toward the front surface, and the longitudinal direction (long side) is 10,000 R, short. The hand direction (short side) is a curved surface of 5,000R.

Reference numeral 103 denotes a test hundred-leaf box that also serves as a mounting table for the panel 100, and has an opening 103A in the upper part and openings 103B on the four side surfaces. A blind (not shown) made of an aluminum plate is attached to the opening 103B on the side surface.
The sample panel 100 is placed on the test hundred-leaf box 103 so as to close the upper opening 103A.
In addition, a black panel thermometer 104 for measuring the temperature of the bottom surface portion of the hundred leaf box 103 is provided at the bottom of the test hundred leaf box 103.
Further, a long metal (made by S55C) plate (thickness 1 mm) 105 for evaluating the thermal conductivity from the frame member 102 of the panel 100 is fixed to the frame member 102. As shown in FIG. 21, the metal plate 105 has an opening 105A for screwing on one end side, and the boss portion 102A of the frame member 102 of the panel 100 is inserted into the opening 105A and the washer 106 is interposed. Are fixed with bolts 107. Reference numeral 108 denotes a heat transfer paste (molybdenum disulfide paste).

An artificial sunlight lamp 120 is provided above the panel 100 on the test hundreds box 103, and is configured so that the surface of the panel 100 can be irradiated with light by turning on the artificial sunlight lamp 120. ing. The artificial sunlight 120 is provided at a position 730 mm above the surface of the panel 100, and the amount of light irradiated on the surface of the panel 100 when the artificial sunlight 120 is turned on is 1850 W / m ² . The amount of irradiation light is the surface No. of the panel 100. It is a value measured by installing an illuminometer at the same height position as 1.

  19 to 21, a double circle: No. The points 1 to 7 are temperature measurement points, each of which is equipped with a temperature sensor to measure temperature. Each measurement point No. The positions 1 to 7 are as follows.

Measurement point No. 1: Center portion of panel 100 surface (see FIGS. 19 and 20)
This measurement location measured the temperature difference (No. 1-2) of front and back both surfaces of the IR absorption layer side surface (No. 1-1) and heat insulation layer side surface of a panel main body.
Measurement point No. 2: The surface position of the panel 100 corresponding to the position along the edge of the frame member 102 on the center side of the panel 100, and the central portion in the longitudinal direction of the panel 100 (see FIGS. 19 and 20).
This measurement location measured the temperature difference (No. 2-2) of front and back both surfaces of the IR absorption layer side surface (No. 2-1) and heat insulation layer side surface of a panel main body.
Measurement point No. 3: The surface of the frame member 102 at the center in the width direction of the frame member 102 and in the center of the panel 100 in the longitudinal direction (the upper surface contact surface of the test leaflet box 103) (see FIG. 20)
Measurement point No. 4: The surface position of the panel 100 corresponding to the position along the edge of the frame member 102 on the center side of the panel 100, and the central portion in the short direction of the panel 100 (see FIGS. 19 and 20).
This measurement location measured the temperature difference (No. 4-2) of front and back both surfaces of the IR absorption layer side surface (No. 4-1) and heat insulation layer side surface of a panel main body.
Measurement point No. 5: The surface of the frame member 102 at the center in the width direction of the frame member 102 and in the center in the short direction of the panel 100 (the upper surface contact surface of the test leaflet box 103) (see FIG. 20)
Measurement point No. 6: The end of the long metal plate 105 opposite to the attachment side to the frame member 102 (see FIG. 21)
The outer edge of the frame member 102 and the measurement point No. The distance to 6 is 150 mm.
Measurement point No. 7: Center position of the bottom of the evaluation hundred-leaf box 103 (see FIG. 19)
This measurement point No. 7 and the artificial solar light 120 is 1050 mm.

[Comparative Example 2]
Using only PCIX as the molding material for the single-layer panel main body and PCβ as the molding material for the frame member, a panel of a test sample was molded by the following method.
First, PCIX was injection-molded (injection temperature 300 ° C.) into a cavity formed between a fixed mold whose temperature was controlled at a mold temperature of 90 ° C. and the first movable mold to form a panel body. The injection speed was a single speed of 50 mm / sec, and the injection holding pressure switching position was 2 mm. Molding was performed with a valve gate type hot runner. Injection compression molding was performed, the mold was opened by 2 mm before injection, and 700 t was re-clamped at the injection holding pressure switching position. The holding time for re-clamping at this time was 15 seconds. Next, after the panel body is cooled for 60 seconds, the first movable mold is opened, and the second movable mold that is controlled to a mold temperature of 90 ° C. is held with the panel body held in the first movable mold. The molds were matched, and PCβ was filled into the cavity formed between the second movable mold and the panel main body at a single speed of injection speed of 40 mm / sec (injection resin temperature: 275 ° C.). The injection holding pressure switching position was set to 35 mm. A holding pressure of 25 MPa was applied for 5 seconds to form a frame member. After the cooling time of 60 seconds, the second movable mold was opened, and the panel in which the molded panel body and the frame member were integrated was removed.

[Example 10]
PCII was used as the molding material for the IR absorption layer of the panel body, PCI was used as the molding material for the heat insulation layer, and PCβ was used as the molding material for the frame member.
First, a 1 mm-thick PCI sheet was manufactured using a Sokensha extruder (screw diameter φ30 mm, L / D = 38, full flight screw). At this time, the resin temperature was 280 ° C., the rotation speed of the extruder was 80 rpm, and the temperature of the take-up roll was 140 ° C.
Next, a PCI sheet was mounted in a movable mold adjusted to the thickness of the final panel body, and PCII was injection molded (cylinder temperature 320 ° C.). At this time, the mold temperature was 90 ° C., the injection speed was a single speed of 50 mm / sec, and the injection holding pressure switching position was 2 mm. Molding was performed with a valve gate type hot runner. Injection compression molding was performed, the mold was opened by 2 mm before injection, and 700 t was re-clamped at the injection holding pressure switching position. The holding time for re-clamping at this time was 15 seconds. Next, after cooling for 60 seconds, the first movable mold is opened, and the second movable mold whose temperature is adjusted to a mold temperature of 90 ° C. is matched with the panel body held in the first movable mold. The cavity formed between the second movable mold and the panel main body was filled with PCβ at a single speed of injection speed of 40 mm / sec (injection resin temperature 275 ° C.). The injection holding pressure switching position was set to 35 mm. A holding pressure of 25 MPa was applied for 5 seconds to form a frame member. After the cooling time of 60 seconds, the second movable mold was opened, and the panel in which the molded panel body and the frame member were integrated was removed.
In the panel body of this test sample, as shown in FIG. 2B, the peripheral portion of the heat insulating layer is formed of an IR absorbing layer, and the frame member is bonded to the IR absorbing layer. Further, _{(d 2} in FIG. 2 (b)) overlapping margin between the frame member and the heat insulating layer is 3 mm.

[Example 11]
As described in Tables 5 and 6, IR was used in the same manner as in Example 10 except that PCI was used as the molding material for the IR absorbing layer, PCI was used as the molding material for the heat insulating layer, and the thickness of the PCI sheet was 2 mm. The panel main body and the frame member in which the absorption layer and the heat insulating layer were laminated and integrated were integrally formed to form a test sample.

[Example 12]
As shown in Tables 5 and 6, except that PCα is used as the molding material for the frame member, the panel main body and the frame member in which the IR absorption layer and the heat insulating layer are laminated and integrated are integrally molded in the same manner as in Example 10. Then, a test sample was formed.

About each panel, the heat dissipation test was done with the test apparatus shown in FIGS. After each panel was placed in the test box and stabilized, the artificial sunlight was turned on, and each measurement point No. The temperatures of 1-6 were examined and the results are shown in Table 7.
In addition, the time until the temperature of the black panel temperature (measurement point No. 7) in the test leaf box reached 52 ° C. after turning on the artificial solar light (52 ° C. arrival time) was examined. It was shown to.

Table 7 shows the following.
In Examples 10 and 11, a high thermal conductivity molding material is not used for the frame member. However, since the panel body has a laminated structure of an IR absorption layer and a heat insulating layer, an increase in temperature in the passenger compartment is suppressed.
In Example 12 using a highly heat-conductive molding material as a frame member for the same panel body as in Example 10, the heat of the panel body was effectively radiated through the frame member, so that The temperature rise can be further suppressed.
On the other hand, in the comparative example 2 in which the panel body has a single-layer structure and does not use a high thermal conductivity material as a molding material for the frame member, the temperature rise in the vehicle compartment is significant.

1, 1 ', 1A, 1B, 1B', 1C, 1C ', 1D, 1E, 1F, 1G, 1H, 1I, 1J, 1K, 1L, 1M, 51A, 51B, 51C Panel 2, 2A, 2B, 2B ', 52A, 52B, 52C Panel body 2a Heat insulation layer (first layer)
2b IR absorption layer (second layer)
2x Convex 2x 'Concave 3, 3', 3A, 3B, 3C, 3D, 3E, 3F, 3G, 3I, 3J, 3K, 3L, 3M, 3M 'Frame member 3x Concave 3x' Convex 4 Groove 5 Concave 6 Attachment 6a Leg piece 7 Snap fit 8, 8A Support (body frame)
DESCRIPTION OF SYMBOLS 9 Mounting hole 10 Resin rivet 11 Protrusion 12 Recess 13 Boss part 14 Bolt 15 Insert nut 16 Auxiliary adhesive 17, 18, 19 Metal piece 19a Small hole 20 Pin 55 Adhesive 60 Panel (panel main body)
61 Test Leaf Box 61A, 61B Side 61C Opening 70 Artificial Sunlight 100 Panel 101 Panel Body 102 Frame Member 102A Boss 102B Inclined Shape 103 Test Leaf Box 103A, 103B Opening 104 Black Panel Thermometer 105 Metal Plate 105A Opening 106 Washer 107 Bolt 108 Heat transfer paste 120 Artificial sunlight 21 Panel 22 Panel body 23 Frame member 24 Body frame 25 Adhesive 26 Seal member

Claims (27)

A panel having a panel body made of a thermoplastic resin that has translucency and absorbs and stores heat by absorbing light and converting it into heat, and the panel body is made of an aromatic polycarbonate resin. a first layer of light resistance, laminated on the first layer, the high extinction heat storage than the first layer, have a second layer of translucent made of aromatic polycarbonate resin, the panel body the thickness at 10mm or less, a panel thickness of the first layer is characterized in der Rukoto than 0.75 mm. The constituent material of the second layer according to claim 1 satisfies the following characteristics (1) and (2), and the constituent material of the first layer satisfies the following characteristics (1) and (3): A panel characterized by that.
(1) Visible light transmittance T _VIS having a thickness of 5 mm measured by ISO-9050 is 5% to 98% (2) Visible light transmittance T _VIS having a thickness of 5 mm measured by ISO-9050 and ISO-13837 the difference from the total solar transmittance _{T SUN} of 5mm thickness measured, converted and the total solar transmittance _{T S / V} calculated by the following formula (i), and the total solar transmittance _{T SUN} by _{(T S / V} - (T _SUN ) is greater than 0%. (3) From the visible light transmittance T _{VIS of} 5 mm thickness measured by ISO-9050 and the total solar transmittance T _{SUN of} 5 mm thickness measured by ISO-13837, the following formula ( i) conversion and the total solar transmittance _{T S / V} calculated by the difference between the total solar transmittance _{T SUN (T S / V -T} SUN) is 5% or less, and, above (2) in terms of the total solar transmittance _{T S / V} of the difference between the total solar transmittance _{T SUN (T S / V -T} SUN) less than _{T S / V = (0.56 ×} T VIS) +38. 8 (i) The constituent material of the second layer according to claim 1 satisfies the following characteristics (1) and (2), and the constituent material of the first layer satisfies the following characteristics (1) and (3): A panel characterized by that.
(1) Visible light transmittance T _VIS having a thickness of 5 mm measured by ISO-9050 is 5% to 98% (2) Visible light transmittance T _VIS having a thickness of 5 mm measured by ISO-9050 and ISO-13837 the difference from the total solar transmittance _{T SUN} of 5mm thickness measured, converted and the total solar transmittance _{T S / V} calculated by the following formula (i), and the total solar transmittance _{T SUN} by _{(T S / V} - (T _SUN ) is greater than 0%. (3) From the visible light transmittance T _{VIS of} 5 mm thickness measured by ISO-9050 and the total solar transmittance T _{SUN of} 5 mm thickness measured by ISO-13837, the following formula ( i) conversion and the total solar transmittance _{T S / V} calculated by the difference between the total solar transmittance _{T SUN (T S / V -T} SUN) or less _{0% T S / V = (} 0 _{56 × T VIS) +38.8 ... (} i) 4. The panel according to claim 2, wherein a visible light transmittance T _VIS having a thickness of 5 mm measured by ISO-9050 of the constituent material of the first layer is 70% or more and 98% or less. 5. The visible light transmittance T _VIS1 having a thickness of 5 mm measured by ISO-9050 of the constituent material of the first layer and the ISO-9050 of the constituent material of the second layer according to claim 2. A panel characterized in that a difference (T _VIS1 −T _VIS2 ) with a measured visible light transmittance T _VIS2 having a thickness of 5 mm is 20 to 90%.   6. The panel according to claim 1, wherein a color difference ΔE between the second layer and the panel body is 5 or less. 7. The ratio (D ₂ / D) of the thickness D ₂ of the second layer to the thickness D of the panel body is 0.01 to 0.9 according to claim 1. A panel. 8. The ratio (T ₂ / T ₁ ) of the thermal conductivity T ₂ of the second layer to the thermal conductivity T ₁ of the first layer is 0.5 to 1.5 according to claim _1. A panel characterized by being.   9. The panel according to claim 1, wherein the panel body is curved so that the second layer side is convex.   The panel according to any one of claims 1 to 9, wherein the first layer and / or the second layer are formed by injection molding.   10. The method according to claim 1, wherein one of the first layer and the second layer is a sheet-like material formed by extrusion molding, and the first layer and the second layer are formed on the sheet-like material. A panel formed by injection molding one of the other layers.   12. The panel according to claim 1, wherein at least a part of a peripheral portion on the second layer side of the panel main body is formed of the first layer.   The panel according to any one of claims 1 to 12, further comprising a frame member provided at a peripheral edge portion of the surface of the panel body on the first layer side.   The panel according to claim 13, wherein an outer edge portion of the frame member is retracted to a center side of the panel body from an outer edge portion of the panel body.   The panel according to claim 13 or 14, wherein at least a side edge portion of the frame member on the center side of the panel main body has a thickness that decreases toward the center of the plate.   16. The panel according to claim 13, wherein the panel body and the frame member are integrally formed by injection molding.   17. The method according to claim 13, wherein one or both of the surface on the second layer side of the panel body and the inner region of the frame member on the surface on the first layer side of the panel body. A panel characterized in that a hard coating is formed.   18. The frame member according to claim 13, wherein the frame member is formed of one or more thermoplastic resins selected from the group consisting of an aromatic polycarbonate resin, a polyester resin, an aromatic polyamide resin, and an ABS resin. Panel characterized by being made.   The panel according to any one of claims 1 to 18, wherein the panel is used for a window member of a vehicle.   The panel installation structure characterized by supporting the panel of any one of Claim 14 thru | or 19 on a panel support body through the said frame member.   The frame member and the panel support body according to claim 20, wherein the frame member and the panel support body are supported by engagement of a protrusion projecting from the frame member and an attachment hole formed in the panel support body. Panel installation structure.   21. The panel according to claim 20, wherein the frame member and the panel support are supported by fitting a protrusion projecting from the panel support and a recess formed in the frame member. Installation structure.   21. The panel installation structure according to claim 20, wherein the frame member is fixed to the panel support with bolts.   The panel installation structure according to any one of claims 20 to 23, wherein an adhesive layer is provided between the frame member and the panel support.   25. The panel installation structure according to any one of claims 20 to 24, further comprising a metal member having one end inserted into the frame member and the other end contacting the panel support.   A vehicle comprising the panel according to any one of claims 1 to 19.   A vehicle comprising the panel installation structure according to any one of claims 20 to 25.

Images