JP5264086B2 - Resin composition for laser decomposition and pattern forming material using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin composition for a laser resolution utilizable for a thick film and highly sensitive to engraving which enables efficient engraving and a favorable resolution at low laser energy, and to provide a pattern forming material using the resin composition. <P>SOLUTION: The pattern forming material is comprised of: (A) a polymer compound including urethane bonds presented in a general formula 1 in its molecules; (B) a resin compound for a laser resolution including a binder polymer; and a layer comprised of the resin compound. R<SB>1</SB>and R<SB>2</SB>of the formula 1 are divalent organic groups, and at least one of them is an aromatic group. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a resin composition for laser decomposition and a pattern forming material using the same, and can be used particularly for thick films, has high engraving sensitivity, can be efficiently engraved with low laser energy, and has good resolution. The present invention relates to a resin composition for laser decomposition and a pattern forming material using the composition.

  Degradable resin, degradable resin composition is, for example, a resin that decomposes in response to external factors such as thermal factors, mechanical factors, photochemical factors, radiochemical factors, chemical factors, Widely known. Properties and characteristics such as changes in shape (liquefaction, vaporization) before and after the decomposition of the resin or composition, molecular weight, hardness, viscoelasticity, glass transition point (Tg), solubility, and adhesiveness caused by the decomposition of the resin It is used in various fields.

  Examples of such degradable resins and degradable resin compositions include, for example, biodegradable plastics (polylactic acid, etc.) for reducing the environmental impact of plastic materials, drugs, perfumes, etc. in the fields of medicine, cosmetics, life science, etc. And a sustained release material for gradually releasing the components. However, they are gradually decomposed in oxygen, light, enzymes, living organisms, soil, etc. in a natural environment, and the initial state is kept stable and does not cause a great change in properties at a stretch by external stimulation.

  In addition, in order to simplify recyclability and disposal, a resin that decomposes by light and heat, an adhesive that reduces adhesiveness, and the like have been developed. Furthermore, it is also known to form a porous material by mixing ceramics, carbon fiber, and the like with a decomposable resin and removing the decomposable resin by firing or the like. However, these process and process the entire material, and do not form a necessary pattern only in a necessary portion. In addition, a large amount of energy is required for the decomposition treatment.

  For example, a toner containing a thermally decomposable resin is used for image formation, and a change in properties due to heat at the time of heat fixing is used to achieve both storage stability and image fixability as a toner. ing. However, the resin itself does not have sufficient responsiveness to patterned stimuli.

  On the other hand, as a pattern forming material, for example, as a photoresist, a composition containing a photoacid generator and an acid-decomposable resin is exposed to a pattern, and if necessary, the resin is decomposed into a pattern by heat treatment, What forms a pattern by development processing is widely known as a so-called chemically amplified resist. Although this composition has both storage stability and pattern formability at a practical level, a development process in which processing conditions are sufficiently controlled is essential for pattern formation, and is applicable to thin films. For example, it is difficult to form a pattern with a thick film of several tens of μm or more.

  There is also known a method of forming an image by using a process of irradiating a laser beam imagewise to remove a part of a thin film (ablation) (Patent Document 1). However, the compounds taken up as the thermally decomposable resin are merely exemplified as ordinary general-purpose resins such as polyester, polycarbonate and polyurethane, and the film thickness is only about 1 to 2 μm. In addition, an example using a compound that defines thermal decomposability is also known (Patent Document 2). However, even in this case, the film thickness remains at about 1 to 2 μm.

  Moreover, as a mask material for paste printing on a printed wiring board, a mask that forms a pattern of about 100 to 200 μm using a photodegradable resin sheet and a manufacturing method thereof are disclosed (Patent Document 3). . However, this publication does not disclose specific compounds, and a controlled development process is essential to adjust the degree of exposure and development to form a pattern.

On the other hand, as a method for forming a pattern with a simple process on a thick film, for example, pattern formation by laser processing is known, and the substrate itself is removed or deformed by irradiating laser light like an image. It will change color. For example, as a laser marker, information such as a lot number is written on a product made of various base materials (for example, a video tape or a household electrical appliance). However, in this case, the base material itself uses ordinary resin as it is.
In pattern formation by laser processing, it is desirable that a laser engraving portion (concave portion) be formed promptly. For this purpose, a highly sensitive patterning material for laser decomposition is required.
In particular, flexographic printing plate precursors of the type that draw directly with lasers (so-called flexographic printing plate precursors for laser engraving) are highly sensitive for laser decomposition because the ease of engraving with laser light (engraving sensitivity) affects the plate making speed. A flexographic printing plate precursor for laser engraving using a resin composition is desired.
Japanese Patent Laid-Open No. 10-119436 Japanese Patent Laid-Open No. 10-244751 JP-A-8-258442

  The object of the present invention is also applicable to thick films, has high engraving sensitivity, can be efficiently engraved with low laser energy, and has a good resolution for laser decomposition and uses the composition. It is to provide a pattern forming material.

The present invention is as follows.
[1]
(A) A resin composition for laser decomposition containing a polymerizable compound having a molecular weight of 100 to 3000 having a urethane bond represented by the following general formula (1) in the molecule, and (B) a binder polymer.

In General Formula (1), R ₁ and R ₂ each independently represent a divalent organic group. However, at least one of R ₁ and R ₂ is an aromatic group.
[2]
The resin composition for laser decomposition according to [1], wherein the binder polymer (B) is a polyurethane resin and / or an acrylic resin.
[3]
The resin composition for laser decomposition according to [1], wherein the binder polymer (B) is a polyurethane resin.
[4]
The resin composition for laser decomposition according to [2], wherein the binder polymer (B) is a polyurethane resin and / or an acrylic resin having a urethane bond represented by the following general formula (1) in the molecule. object.

In General Formula (1), R ₁ and R ₂ each independently represent a divalent organic group. However, at least one of R ₁ and R ₂ is an aromatic group.
[5]
The resin composition for laser decomposition according to any one of [1] to [4], wherein the resin composition for laser decomposition further contains a polymerizable compound other than the component (A).
[6]
[1] A resin composition for laser decomposition, which is obtained by crosslinking the resin composition for laser decomposition according to any one of [5] with light or heat.
[7]
A pattern forming material comprising a layer made of the resin composition for laser decomposition according to any one of [1] to [6] on a support.
[8]
The pattern forming material according to [7], wherein the pattern forming material is a laser engraving type flexographic printing plate precursor.
Although this invention is invention which concerns on said [1]-[8], below, other matters (for example, following (1)-(8)) are also described below.
(1) A resin composition for laser decomposition containing (A) a polymerizable compound having a urethane bond represented by the following general formula (1) in the molecule, and (B) a binder polymer.

In General Formula (1), R ₁ and R ₂ each independently represent a divalent organic group. However, at least one of R ₁ and R ₂ is an aromatic group.
(2) The resin composition for laser decomposition according to (1), wherein the binder polymer (B) is a polyurethane resin and / or an acrylic resin.
(3) The resin composition for laser decomposition according to (1), wherein the binder polymer (B) is a polyurethane resin.
(4) The laser as described in (2) above, wherein the binder polymer (B) is a polyurethane resin and / or an acrylic resin having a urethane bond represented by the following general formula (1) in the molecule. A resin composition for decomposition.

In General Formula (1), R ₁ and R ₂ each independently represent a divalent organic group. However, at least one of R ₁ and R ₂ is an aromatic group.

(5) The resin composition for laser decomposition according to any one of (1) to (4), wherein the resin composition for laser decomposition further contains a polymerizable compound other than the component (A). object.
(6) A resin composition for laser decomposition, which is obtained by crosslinking the resin composition for laser decomposition according to any one of (1) to (5) with light or heat.
(7) A pattern forming material comprising a layer made of the resin composition for laser decomposition according to any one of (1) to (6) above on a support.
(8) The pattern forming material as described in (7) above, wherein the pattern forming material is a laser engraving type flexographic printing plate precursor.

The specific polymerizable compound which is the component (A) of the present invention is thermally decomposed at a relatively low temperature (less than 300 ° C.), and a gas (such as nitrogen) generated when the component (A) is thermally decomposed and vaporized is generated. Assist the scattering of the thermal decomposition product of the component (B). As a result, it is presumed that the film made of the composition of the present invention has improved laser decomposability and engraving sensitivity compared to the film made of the conventional composition not containing the component (A).
In particular, when the (B) binder polymer is a resin having a urethane bond represented by the general formula (1) in the molecule, the above effect is synergistically improved, and the laser decomposition sensitivity is dramatically increased. Presumed.
Further, regarding the point that the engraving shape is sharp (good resolution), which is another effect of the present invention, a three-dimensional network is formed in which the urethane bond represented by the general formula (1) is connected. It is estimated to be. When it is uncrosslinked, the laser exposure part becomes very high temperature, so that the resin is softened, and it is difficult to obtain the engraved recess as a sharp pattern shape. On the other hand, when the component (A) is cross-linked in advance, it is difficult to soften even when the temperature becomes high by laser exposure, and the engraved concave portion has a sharp pattern shape.

  As described above, according to the present invention, the resin composition for laser decomposition, which can be used for thick films, has high engraving sensitivity, can be efficiently engraved with low laser energy, and has good resolution, and A pattern forming material using the composition is provided.

  The resin composition for laser decomposition of the present invention comprises (A) a polymerizable compound having in its molecule a urethane bond represented by the following general formula (1), and (B) a binder polymer.

  First, the component (A), that is, a polymerizable compound having a urethane bond represented by the following general formula (1) in the molecule (hereinafter sometimes referred to as a specific polymerizable compound) will be described.

In General Formula (1), R ₁ and R ₂ each independently represent a divalent organic group. However, at least one of R ₁ and R ₂ is an aromatic group. In the present invention, R ₂ is preferably an aromatic group, and particularly preferred is a case where both R ₁ and R ₂ are aromatic groups.

The aromatic group for R ₁ and R ₂ is not particularly limited as long as it has aromaticity, but has a substituent from the viewpoint of maintaining good film strength and appropriate flexibility during pattern formation. Preferred is a group selected from a benzene ring, naphthalene ring, anthracene ring, pyrene ring, coronene ring, pyridine ring, pyrrole ring, bipyridyl ring, imidazole ring and 1,10-phenanthroline ring. More preferably, it is the case of a benzene ring, naphthalene ring, pyridine ring, pyrrole ring or imidazole ring which may have a substituent. Examples of the substituent include an alkyl group, an aralkyl group, an aryl group, an alkoxy group, an aryloxy group, and a halogen atom (—F, —Cl, —Br, —I).

  The specific polymerizable compound preferably has 1 to 6 urethane bonds represented by the general formula (1) in the molecule from the viewpoint of laser decomposition sensitivity and ease of compound synthesis. More preferably 2 to 4, particularly preferably 2 or 3.

The polymerizable group in the specific polymerizable compound is not particularly limited as long as it is a group capable of causing any one of radical polymerization, cationic polymerization, anionic polymerization, and living polymerization. When used as a pattern forming material, it is preferably a radical polymerizable group in that the polymerization is hardly affected by the surrounding environment such as humidity.
Preferred radical polymerizable groups include (meth) acryloyl group, (meth) acrylamide group, styryl group, vinyl ether group and the like. A (meth) acryloyl group, a (meth) acrylamide group, and a styryl group are more preferable from the viewpoint of ease of compound synthesis, and a (meth) acryloyl group and a (meth) acrylamide group are more preferable in terms of imparting appropriate flexibility.
The number of polymerizable groups in the specific polymerizable compound is preferably 1 to 10 in the same molecule from the viewpoint of causing efficient polymerization, more preferably 2 to 6, and further preferably 2 to 4 This is the case.
In particular, in the same molecule, the number of radically polymerizable groups ≦ the number of urethane bonds represented by the general formula (1) is preferable in terms of easy thermal decomposition, and particularly preferably in the same molecule, the number of radically polymerizable groups < This is a case where the number of urethane bonds is represented by the general formula (1).
The molecular weight of the specific polymerizable compound is preferably 100 to 3000, more preferably 150 to 2000, and particularly preferably 200 to 2000 in terms of maintaining good compatibility between the film property and the binder polymer and expressing a better effect. 1000.

  Examples of preferred specific polymerizable compounds are shown below.

  A commercially available compound may be used as the polymerizable compound, or a compound synthesized by a known method may be used.

  The preferable content of the component (A) in the composition is 1 to 95% by mass when the total amount of the composition is 100% by mass from the viewpoint of combining the laser decomposition sensitivity and the film property at the time of pattern formation. Is preferable, more preferably 5 to 85% by mass, and particularly preferably 20 to 75% by mass.

  (B) Binder polymer The binder polymer contained in the resin composition for laser decomposition of the present invention is preferably a binder polymer having a carbon-carbon unsaturated bond in at least one of the main chain and the side chain. A polymer containing at least one of an olefin (carbon-carbon double bond) and a carbon-carbon triple bond in the main chain is more preferable in terms of high mechanical strength of the formed film, and a polymer containing an olefin in the main chain is more preferable. Particularly preferred.

  Examples of the polymer containing at least one of an olefin and a carbon-carbon triple bond in the main chain include SB (polystyrene-polybutadiene), SBS (polystyrene-polybutadiene-polystyrene), SIS (polystyrene-polyisoprene-polystyrene), SEBS (polystyrene). -Polyethylene / polybutylene-polystyrene) and the like.

  When a polymer having a highly reactive polymerizable unsaturated group such as a methacryloyl group is used as the polymer having a carbon-carbon unsaturated bond in the side chain, a film having extremely high mechanical strength can be produced. In particular, in polyurethane-based and polyester-based thermoplastic elastomers, it is possible to introduce a highly reactive polymerizable unsaturated group into the molecule relatively easily. The term “intramolecular” as used herein includes the case where a polymerizable unsaturated group is directly attached to both ends or one end of the polymer main chain, the end of the polymer side chain, the polymer main chain, or the side chain. It is. For example, it is possible to directly use a polymerizable unsaturated group introduced at the molecular end. Alternatively, a hydroxyl group, amino group, epoxy group, carboxyl group, acid anhydride group, ketone group, hydrazine residue can be used. , An isocyanate group, an isothiocyanate group, a cyclic carbonate group, a compound having a molecular weight of about several thousand having a plurality of reactive groups such as an ester group and a binder having a plurality of groups capable of binding to the reactive group (for example, a hydroxyl group or an amino group) Polyisocyanate, etc.) in the case of (2), reacting with an organic compound having a polymerizable unsaturated group and a group that reacts with the terminal binding group after the molecular weight is adjusted and converted to the terminal binding group. And a method such as a method of introducing a polymerizable unsaturated group at the terminal.

  The binder polymer contained in the resin composition for laser decomposition of the present invention is preferably a polymer having a carbon-carbon unsaturated bond as described above, but may be a polymer having no carbon-carbon unsaturated bond. Examples of the polymer having no carbon-carbon unsaturated bond include, for example, a raw material in which hydrogen is added to the olefin part of the polymer having the carbon-carbon unsaturated bond or hydrogenation is previously applied to the olefin part (for example, butadiene And a resin that can be easily synthesized by polymerization using a compound obtained by hydrogenating isoprene or the like.

  The weight average molecular weight of the binder polymer is preferably in the range of 10,000 to 1,000,000. A more preferable range is from 50,000 to 500,000. When the weight average molecular weight is in the range of 0.1 million to 1,000,000, the mechanical strength of the formed film can be ensured. The weight average molecular weight is measured using gel permeation chromatography (GPC) and is evaluated with respect to a polystyrene sample having a known molecular weight.

  The total amount of the binder polymer is generally 5 to 99% by mass, preferably 15 to 95% by mass, and 25 to 80% by mass in the total solid content of the composition.

The polymer having the carbon-carbon unsaturated bond and the following general resin may be used in combination.
The addition amount of the combined resin is generally 1 to 90% by mass, preferably 5 to 80% by mass with respect to the polymer having a carbon-carbon unsaturated bond.

The type of the combination resin may be an elastomer or a non-elastomer.
The weight average molecular weight of the combination resin is preferably in the range of 10,000 to 1,000,000. A more preferable range is from 50,000 to 500,000. When the weight average molecular weight is in the range of 0.1 million to 1,000,000, the mechanical strength of the formed film can be ensured. The weight average molecular weight is measured using gel permeation chromatography (GPC) and is evaluated with respect to a polystyrene sample having a known molecular weight.

  As the resin, a resin that is easily liquefied or a resin that is easily decomposed is preferable. Examples of resins that are easily decomposed include styrene, α-methylstyrene, α-methoxystyrene, acrylic esters, methacrylic esters, ester compounds, ether compounds, nitro compounds, carbonates as monomer units that are easily decomposed in the molecular chain. Preferably, compounds, carbamoyl compounds, hemiacetal ester compounds, oxyethylene compounds, aliphatic cyclic compounds, and the like are included. Especially polyethers such as polyethylene glycol, polypropylene glycol, polytetraethylene glycol, aliphatic polycarbonates, aliphatic carbamates, polymethyl methacrylate, polystyrene, nitrocellulose, polyoxyethylene, polynorbornene, polycyclohexadiene hydrogenated product Alternatively, a polymer having a molecular structure such as a dendrimer having many branched structures is a representative example of those that are easily decomposed. A polymer containing a large number of oxygen atoms in the molecular chain is preferred from the viewpoint of degradability. Among these, a compound having a carbonate group, a carbamate group, and a methacryl group in the polymer main chain is preferable because of its high thermal decomposability. For example, polyesters and polyurethanes synthesized from (poly) carbonate diol and (poly) carbonate dicarboxylic acid as raw materials, polyamides synthesized from (poly) carbonate diamine as raw materials, and the like can be cited as examples of polymers having good thermal decomposability. . These polymers may contain a polymerizable unsaturated group in the main chain and side chain. In particular, when it has a reactive functional group such as a hydroxyl group, an amino group, or a carboxyl group, it is easy to introduce a polymerizable unsaturated group.

  Although it does not specifically limit as a thermoplastic elastomer, Urethane type thermoplastic elastomer, ester type thermoplastic elastomer, amide type thermoplastic elastomer, silicone type thermoplastic elastomer, etc. can be mentioned. In order to further improve the thermal decomposability, it is also possible to use a polymer in which an easily decomposable functional group such as a carbamoyl group or a carbonate group having a high decomposability is introduced into the main chain. Further, it may be used by mixing with a polymer having higher thermal decomposability. Since the thermoplastic elastomer is fluidized by heating, it can be mixed well with the composite used in the present invention. The thermoplastic elastomer is a material that can be fluidized by heating and can be molded like a normal thermoplastic, and exhibits rubber elasticity at room temperature. The molecular structure consists of soft segments such as polyether or rubber molecules, and hard segments that prevent plastic deformation at around room temperature, as with vulcanized rubber. The hard segments include frozen phase, crystalline phase, hydrogen bonding, and ionic crosslinking. There are various types.

Depending on the use of the composition, the type of thermoplastic elastomer can be selected. For example, urethane, ester, amide, and fluorine thermoplastic elastomers are preferred in fields where solvent resistance is required, and urethane, olefin, ester, and fluorine heat are required in fields where heat resistance is required. A plastic elastomer is preferred. Moreover, hardness can be changed greatly with the kind of thermoplastic elastomer.
The thermoplastic resin is not particularly limited as non-elastomeric, but is not limited to polyester resin, unsaturated polyester resin, polyamide resin, polyamideimide resin, polyurethane resin, unsaturated polyurethane resin, polysulfone resin, polyethersulfone resin, Polyimide resin, polycarbonate resin, wholly aromatic polyester resin and the like can be mentioned.

  Moreover, you may use a hydrophilic polymer as combined use resin. Examples of the hydrophilic polymer include a hydrophilic polymer containing hydroxyethylene as a structural unit. Specific examples include polyvinyl alcohol, vinyl alcohol / vinyl acetate copolymer (partially saponified polyvinyl alcohol), and modified products thereof. As the hydrophilic polymer, a single polymer may be used, or a plurality of types may be mixed and used. Examples of modified products include polymers in which at least some of the hydroxyl groups have been modified to carboxyl groups, polymers in which some of the hydroxyl groups have been modified to (meth) acryloyl groups, polymers in which at least some of the hydroxyl groups have been modified to amino groups, and side chains. Examples thereof include ethylene glycol, propylene glycol, and polymers introduced with these dimers.

  A polymer in which at least a part of the hydroxyl group is modified to a carboxyl group can be obtained by esterification with polyvinyl alcohol or partially saponified polyvinyl alcohol and a polyfunctional carboxylic acid such as succinic acid, maleic acid or adipic acid. .

  A polymer in which at least a part of the hydroxyl group is modified to a (meth) acryloyl group can be obtained by adding a glycidyl group-containing ethylenically unsaturated monomer to the carboxyl group-modified polymer, or polyvinyl alcohol or partially saponified polyvinyl alcohol and (meth) acrylic. It can be obtained by esterification with an acid.

  A polymer in which at least a part of the hydroxyl group is modified with an amino group can be obtained by esterification with polyvinyl alcohol or partially saponified polyvinyl alcohol and a carboxylic acid containing an amino group such as carbamic acid.

  Polymers with ethylene glycol, propylene glycol, and their multimers introduced in the side chain are heated with polyvinyl alcohol or partially saponified polyvinyl alcohol and glycols under sulfuric acid catalyst, and by-product water is removed from the reaction system. It can be obtained by removing.

  Among these polymers, a polymer in which at least a part of the hydroxyl group is modified to a (meth) acryloyl group is particularly preferably used. This is because, by directly introducing an unreacted crosslinkable functional group into the polymer component, the strength of the formed film can be increased, and both the flexibility and strength of the formed film can be achieved.

  The mass average molecular weight (polystyrene conversion by GPC measurement) of the hydrophilic polymer is preferably 10,000 to 500,000. If the mass average molecular weight is 10,000 or more, the form retainability as a single resin is excellent, and if it is 500,000 or less, it is easy to dissolve in a solvent such as water, which is convenient for preparing a crosslinkable resin composition.

  Further, the combination resin may be a solvent-soluble resin. Specific examples include polysulfone resins, polyether sulfone resins, epoxy resins, alkyd resins, polyolefin resins, polyester resins, and the like.

  The combined resin usually does not have a highly reactive polymerizable unsaturated group, but may have a highly reactive polymerizable unsaturated group at the end or side chain of the molecular chain. When a polymer having a highly reactive polymerizable unsaturated group such as a methacryloyl group is used, a film having extremely high mechanical strength can be produced. In particular, in polyurethane-based and polyester-based thermoplastic elastomers, it is possible to introduce a highly reactive polymerizable unsaturated group into the molecule relatively easily. The term “intramolecular” as used herein includes the case where a polymerizable unsaturated group is directly attached to both ends or one end of the polymer main chain, the end of the polymer side chain, the polymer main chain, or the side chain. It is. For example, it is possible to directly use a polymerizable unsaturated group introduced at the molecular end. Alternatively, a hydroxyl group, amino group, epoxy group, carboxyl group, acid anhydride group, ketone group, hydrazine residue can be used. , An isocyanate group, an isothiocyanate group, a cyclic carbonate group, a compound having a molecular weight of about several thousand having a plurality of reactive groups such as an ester group and a binder having a plurality of groups capable of binding to the reactive group (for example, a hydroxyl group or an amino group) Polyisocyanate, etc. in the case of (1), reacting with the organic compound having a polymerizable unsaturated group and a group that reacts with the terminal binding group after the molecular weight is adjusted and converted to the terminal binding group. And a method such as a method of introducing a polymerizable unsaturated group at the terminal.

Apart from this, the (B) binder polymer in the present invention is particularly preferably a polyurethane resin or an acrylic resin. These resins can be used in combination.
Polyurethane resins such as those described in JP-A-2005-250438 are preferred in terms of good film properties.

  On the other hand, as acrylic resins, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, β-hydroxy -Β '-(meth) acryloyloxyethyl phthalate and other hydroxyl group-containing (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, isoamyl (meth) acrylate , 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, alkyl (meth) acrylate such as stearyl (meth) acrylate, cycloalkyl (meth) acrylate such as cyclohexyl (meth) acrylate Rate, alkoxyalkyl (meth) acrylates such as chloroethyl (meth) acrylate, halogenated alkyl (meth) acrylates such as chloropropyl (meth) acrylate, methoxyethyl (meth) acrylate, ethoxyethyl (meth) acrylate, butoxyethyl (meth) acrylate, etc. ) Acrylate, phenoxyethyl acrylate, phenoxyalkyl (meth) acrylate such as nonylphenoxyethyl (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxytriethylene glycol (meth) acrylate, methoxydipropylene glycol (meth) acrylate, etc. Alkoxyalkylene glycol (meth) acrylate, (meth) acrylamide, diacetone (meth) acrylamide, N, N (Meth) acrylamides such as methylenebis (meth) acrylamide, 2,2-dimethylaminoethyl (meth) acrylate, 2,2-diethylaminoethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylamide, A linear acrylic resin obtained by polymerizing a polymerizable compound having one ethylenically unsaturated bond in a molecule such as N, N-dimethylaminopropyl (meth) acrylamide is preferable.

  As an acrylic resin containing a urethane bond represented by the general formula (1), an isocyanate group such as Karenz MOI (Showa Denko), Karenz AOI (Showa Denko) or Karenz MOI-BM (Showa Denko) or a potential Radical polymerization of a (meth) acrylic acid derivative having an isocyanate group (generally called a form of block isocyanate) (copolymerization with a general-purpose radical polymerizable monomer is also possible if necessary), and isocyanate in the side chain A polymer obtained by obtaining an acrylic resin having a group or a latent isocyanate group and then adding an aromatic alcohol by a polymer reaction is preferably used.

Among these, (B) the binder polymer in the present invention is preferably a polyurethane resin.
In the present invention, as described above, (B) the binder polymer contains a polyurethane resin having a urethane bond represented by the following general formula (1) in the molecule (hereinafter sometimes referred to as a specific polyurethane resin). It is particularly preferable to do this.

In General Formula (1), R ₁ and R ₂ each independently represent a divalent organic group. However, at least one of R ₁ and R ₂ is an aromatic group.

The specific polyurethane resin will be described.
The aromatic group in the general formula (1) is not particularly limited, but a phenylene group which may have a substituent or a naphthylene group which may have a substituent is preferable from the viewpoint of ease of synthesis. Particularly preferred is a phenylene group which may have a substituent. In particular, an electron-withdrawing substituent such as a phenylene group substituted with a carbonyl group, a halogen atom, a nitro group or the like is preferable.

Next, the basic skeleton of the polyurethane resin according to the present invention will be described.
The polyurethane resin according to the present invention is a structural unit that is a reaction product of at least one diisocyanate compound represented by the following general formula (4) and at least one diol compound represented by the following general formula (5). Is a polyurethane resin having a basic skeleton.
OCN-X ⁰ -NCO (4)
HO-Y ⁰ -OH (5)

In general formulas (4) and (5), X ⁰ and Y ⁰ each independently represent a divalent organic residue. However, at least one of the organic residues represented by X ⁰ and Y ⁰ is bonded to the NCO group or OH group with an aromatic group.

(1) Diisocyanate Compound As the diisocyanate compound represented by the general formula (4), it is preferable that the organic residue represented by X ⁰ has an aromatic group directly bonded to the NCO group.
A preferred diisocyanate compound is a diisocyanate compound represented by the following general formula (6).

OCN-L ¹ -NCO (6)

In General Formula (6), L ¹ represents a divalent aromatic hydrocarbon group which may have a substituent. Examples of the substituent include an alkyl group, an aralkyl group, an aryl group, an alkoxy group, an aryloxy group, and a halogen atom (—F, —Cl, —Br, —I). If necessary, L ¹ may have another functional group that does not react with an isocyanate group, such as an ester, urethane, amide, or ureido group.

Specific examples of the diisocyanate compound represented by the general formula (6) include those shown below. That is, 2,4-tolylene diisocyanate, 2,4-tolylene diisocyanate dimer, 2,6-tolylene diisocyanate, p-xylylene diisocyanate, m-xylylene diisocyanate, 4,4′-diphenylmethane diisocyanate Aromatic diisocyanate compounds such as 1,5-naphthylene diisocyanate, 3,3′-dimethylbiphenyl-4,4′-diisocyanate, and the like.
In particular, 4,4′-diphenylmethane diisocyanate and 1,5-naphthylene diisocyanate are preferable from the viewpoint of thermal decomposability.

The specific polyurethane resin used in the present invention uses, for example, a diisocyanate compound other than the above from the viewpoint of improving the compatibility with other components in the resin composition for laser decomposition and improving the storage stability. be able to.
Aliphatic diisocyanate compounds such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, dimer diisocyanate, etc .; isophorone diisocyanate, 4,4′-methylenebis (cyclohexyl isocyanate), methylcyclohexane-2,4 (or 2,6 ) Alicyclic diisocyanate compounds such as diisocyanate and 1,3- (isocyanatomethyl) cyclohexane; reaction of diol and diisocyanate such as an adduct of 1 mol of 1,3-butylene glycol and 2 mol of tolylene diisocyanate The diisocyanate compound which is a product;
Further, diisocyanate obtained by adding a monofunctional alcohol to one of the three NCOs of triisocyanate can also be used.

(2) Diol compound The diol compound preferably has an aromatic group in which the organic residue represented by Y ⁰ is directly bonded to the OH group.
Specifically, diol compounds represented by the following general formulas (A-1) to (A-3) are preferable.

HO—Ar ¹ —OH general formula (A-1)
HO— (Ar ¹ —Ar ² ) m—OH General formula (A-2)
HO—Ar ¹ —X—Ar ² —OH General Formula (A-3)

In the formula, Ar ¹ and Ar ² may be the same or different and each represents an aromatic ring. Examples of such an aromatic ring include a benzene ring, a naphthalene ring, an anthracene ring, a pyrene ring, and a heterocyclic ring. These aromatic rings may have a substituent. Examples of the substituent include an alkyl group, an aralkyl group, an aryl group, an alkoxy group, an aryloxy group, and a halogen atom (—F, —Cl, —Br, —I).
From the viewpoint of easy availability of raw materials, a benzene ring and a naphthalene ring are preferable. A benzene ring is particularly preferable in consideration of film formability.
X is a divalent organic residue. m is preferably 1 to 3 from the viewpoint of film formation. Particularly preferred is 1.

Preferable examples of the diol compound represented by the general formula (A-1) include 1,4-dihydroxybenzene and 1,8-dihydroxynaphthalene.
Preferable examples of the diol compound represented by the general formula (A-2) include 4,4′-dihydroxybiphenyl and 2,2′-hydroxybinaphthyl.
Preferable examples of the diol compound represented by the general formula (A-3) include bisphenol A and 4,4′-bis (hydroxyphenyl) methane.

The specific polyurethane resin used in the present invention is used in combination with a diol compound other than those described above from the viewpoint of improving compatibility with other components in the resin composition for laser decomposition and improving storage stability, for example. be able to.
Examples of such diol compounds include polyether diol compounds, polyester diol compounds, and polycarbonate diol compounds.
Examples of the polyether diol compound include compounds represented by the following formulas (7), (8), (9), (10) and (11), and random copolymerization of ethylene oxide and propylene oxide having a hydroxyl group at the terminal. Coalescence is mentioned.

In formulas (7) to (11), R ¹⁴ represents a hydrogen atom or a methyl group, and X ¹ represents the following group. Moreover, a, b, c, d, e, f, and g each represent an integer of 2 or more, and preferably an integer of 2 to 100.

  Specific examples of the polyether diol compound represented by the above formulas (7) and (8) include the following. That is, diethylene glycol, triethylene glycol, tetraethylene glycol, pentaethylene glycol, hexaethylene glycol, heptaethylene glycol, octaethylene glycol, di-1,2-propylene glycol, tri-1,2-propylene glycol, tetra-1, 2-propylene glycol, hexa-1,2-propylene glycol, di-1,3-propylene glycol, tri-1,3-propylene glycol, tetra-1,3-propylene glycol, di-1,3-butylene glycol, Tri-1,3-butylene glycol, hexa-1,3-butylene glycol, polyethylene glycol having a weight average molecular weight of 1000, polyethylene glycol having a weight average molecular weight of 1500, poly having a weight average molecular weight of 2,000 Tylene glycol, polyethylene glycol having a weight average molecular weight of 3000, polyethylene glycol having a weight average molecular weight of 7500, polypropylene glycol having a weight average molecular weight of 400, polypropylene glycol having a weight average molecular weight of 700, polypropylene glycol having a weight average molecular weight of 1000, polypropylene glycol having a weight average molecular weight of 2000 , Polypropylene glycol having a weight average molecular weight of 3000, polypropylene glycol having a weight average molecular weight of 4000, and the like.

  Specific examples of the polyether diol compound represented by the formula (9) include those shown below. That is, Sanyo Chemical Industries, Ltd. (trade name) PTMG650, PTMG1000, PTMG2000, PTMG3000, and the like.

  Specific examples of the polyether diol compound represented by the formula (10) include those shown below. That is, Sanyo Chemical Industries, Ltd. (trade name) New Pole PE-61, New Pole PE-62, New Pole PE-64, New Pole PE-68, New Pole PE-71, New Pole PE-74, New Pole PE-75, New Pole PE-78, New Pole PE-108, New Pole PE-128, New Pole PE-61, and the like.

  Specific examples of the polyether diol compound represented by the formula (11) include those shown below. That is, Sanyo Chemical Industries, Ltd. (trade name) New Pole BPE-20, New Pole BPE-20F, New Pole BPE-20NK, New Pole BPE-20T, New Pole BPE-20G, New Pole BPE-40, New Pole BPE-60, New Pole BPE-100, New Pole BPE-180, New Pole BPE-2P, New Pole BPE-23P, New Pole BPE-3P, New Pole BPE-5P, and the like.

  Specific examples of the random copolymer of ethylene oxide and propylene oxide having a hydroxyl group at the terminal include the following. That is, Sanyo Chemical Industries, Ltd. (trade name) New Pole 50HB-100, New Pole 50HB-260, New Pole 50HB-400, New Pole 50HB-660, New Pole 50HB-2000, New Pole 50HB-5100, etc. It is.

  Examples of the polyester diol compound include compounds represented by formulas (12) and (13).

In formulas (12) and (13), L ² , L ³ and L ⁴ may be the same or different and each represents a divalent aliphatic or aromatic hydrocarbon group, and L ⁵ represents a divalent fat. Represents a group hydrocarbon group. Preferably, L ^{2 to} L ⁴ each represent an alkylene group, an alkenylene group, an alkynylene group, or an arylene group, and L ⁵ represents an alkylene group. In addition, other functional groups that do not react with the isocyanate group, such as ether, carbonyl, ester, cyano, olefin, urethane, amide, ureido group or halogen atom may be present in L ^{2 to} L ⁵ . n1 and n2 are each an integer of 2 or more, preferably an integer of 2 to 100.

  Examples of the polycarbonate diol compound include a compound represented by the formula (14).

In the formula (14), L ⁶ may be the same or different and each represents a divalent aliphatic or aromatic hydrocarbon group. Preferably, L ⁶ represents an alkylene group, an alkenylene group, an alkynylene group or an arylene group. In addition, other functional groups that do not react with the isocyanate group, such as ether, carbonyl, ester, cyano, olefin, urethane, amide, ureido group or halogen atom may be present in L ⁶ . n3 is an integer of 2 or more, and preferably represents an integer of 2 to 100.
Specific examples of the diol compound represented by the above formula (12), (13) or (14) include (Exemplary Compound No. 1) to (Exemplary Compound No. 18) shown below. N in the specific examples represents an integer of 2 or more.

  Moreover, in the synthesis | combination of specific polyurethane resin, the diol compound which has a substituent which does not react with an isocyanate group other than the said diol compound can also be used together. Examples of such diol compounds include those shown below.

^{HO-L 7 -O-CO-} L 8 -CO-O-L 7 -OH (15)
^{HO-L 8 -CO-O-} L 7 -OH (16)

In formulas (15) and (16), L ⁷ and L ⁸ may be the same or different, and are each a substituent (for example, an alkyl group, an aralkyl group, an aryl group, an alkoxy group, an aryloxy group, a halogen atom ( -F, -Cl, -Br, -I) and the like, which may have a divalent aliphatic hydrocarbon group, aromatic hydrocarbon group or heterocyclic group. If necessary, L ⁷ and L ⁸ may have another functional group that does not react with an isocyanate group, such as a carbonyl group, an ester group, a urethane group, an amide group, or a ureido group. Note that L ⁷ and L ⁸ may form a ring.

  Furthermore, for the synthesis of the specific polyurethane resin, a diol compound having an acid group such as a carboxyl group, a sulfone group or a phosphoric acid group may be used in combination. In particular, a diol compound having a carboxyl group is preferable from the viewpoint of improving the film strength by hydrogen bonding and water resistance. Examples of the diol compound having a carboxyl group include those represented by the following formulas (17) to (19).

In the formulas (17) to (19), R ¹⁵ is a hydrogen atom, a substituent (for example, a halogen atom such as a cyano group, a nitro group, —F, —Cl, —Br, —I, etc.), —CONH ₂ , —COOR ^16. , -OR ¹⁶ , -NHCONHR ¹⁶ , -NHCONOR ¹⁶ , -NHCOR ¹⁶ , -OCONHR ¹⁶ (wherein R ¹⁶ represents an alkyl group having 1 to 10 carbon atoms and an aralkyl group having 7 to 15 carbon atoms). Represents an alkyl group, an aralkyl group, an aryl group, an alkoxy group or an aryloxy group, which may have a hydrogen atom, preferably a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an aryl group having 6 to 15 carbon atoms. . L ⁹ , L ¹⁰ and L ¹¹ may be the same or different from each other, and may have a single bond or a substituent (for example, alkyl, aralkyl, aryl, alkoxy and halogeno groups are preferred). Represents a divalent aliphatic or aromatic hydrocarbon group, preferably an alkylene group having 1 to 20 carbon atoms, an arylene group having 6 to 15 carbon atoms, more preferably an alkylene group having 1 to 8 carbon atoms. . If necessary, L ^{9 to} L ¹¹ may have other functional groups that do not react with isocyanate groups, such as carbonyl, ester, urethane, amide, ureido, and ether groups. A ring may be formed by 2 or 3 of R ¹⁵ , L ⁷ , L ⁸ and L ⁹ .

Ar represents a trivalent aromatic hydrocarbon group which may have a substituent, and preferably represents an aromatic group having 6 to 15 carbon atoms.
Specific examples of the diol compound having a carboxyl group represented by the above formulas (17) to (19) include those shown below. 3,5-dihydroxybenzoic acid, 2,2-bis (hydroxymethyl) propionic acid, 2,2-bis (2-hydroxyethyl) propionic acid, 2,2-bis (3-hydroxypropyl) propionic acid, Bis (hydroxymethyl) acetic acid, bis (4-hydroxyphenyl) acetic acid, 2,2-bis (hydroxymethyl) butyric acid, 4,4-bis (4-hydroxyphenyl) pentanoic acid, tartaric acid, N, N-dihydroxyethylglycine N, N-bis (2-hydroxyethyl) -3-carboxy-propionamide and the like.

  For the synthesis of the specific polyurethane resin, a compound obtained by ring-opening a tetracarboxylic dianhydride represented by the following formulas (20) to (22) with a diol compound may be used in combination.

In formulas (20) to (22), L ¹² is a divalent fat which may have a single bond or a substituent (eg, alkyl, aralkyl, aryl, alkoxy, halogeno, ester, amide, etc. are preferred). Represents an aromatic or aromatic hydrocarbon group, —CO—, —SO—, —SO ₂ —, —O— or —S—, preferably a single bond and a divalent aliphatic hydrocarbon having 1 to 15 carbon atoms Represents a group, —CO—, —SO ₂ —, —O— or S—. R ¹⁷ and R ¹⁸ may be the same or different and each represents a hydrogen atom, an alkyl group, an aralkyl group, an aryl group, an alkoxy group, or a halogeno group, preferably a hydrogen atom or 1 to 8 carbon atoms. An alkyl group, an aryl group having 6 to 15 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, or a halogeno group. Two of L ¹² , R ¹⁷ and R ¹⁸ may be bonded to form a ring. R ¹⁹ and R ²⁰ may be the same or different and each represents a hydrogen atom, an alkyl group, an aralkyl group, an aryl group or a halogeno group, preferably a hydrogen atom, alkyl having 1 to 8 carbon atoms, or carbon Represents several 6 to 15 aryl groups. Two of L ¹² , R ¹⁹ and R ²⁰ may be bonded to form a ring. L ¹³ and L ¹⁴ may be the same or different and each represents a single bond, a double bond, or a divalent aliphatic hydrocarbon group, preferably a single bond, a double bond, or a methylene group. . A represents a mononuclear or polynuclear aromatic ring. Preferably, it represents an aromatic ring having 6 to 18 carbon atoms.

Specific examples of the compound represented by the above formula (20), (21) or (22) include those shown below. That is, pyromellitic dianhydride, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, 3,3 ′, 4,4′-diphenyltetracarboxylic dianhydride, 2, 3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 4,4′-sulfonyldiphthalic dianhydride, 2,2-bis (3 , 4-Dicarboxyphenyl) propane dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, 4,4 ′-[3,3 ′-(alkylphosphoryldiphenylene) -bis (iminocarbonyl) Aromatic tetracarboxylic dianhydrides such as diphthalic dianhydride, adducts of hydroquinone diacetate and trimetic anhydride, diacetyldiamine and trimetic anhydride; 5- (2,5-dioxote Trahydrofuryl) -3-methyl-3-cyclohexsi-1,2-dicarboxylic anhydride (Dainippon Ink Chemical Co., Ltd., Epicron B-4400), 1,2,3,4-cyclopentanetetra Alicyclic tetracarboxylic dianhydrides such as carboxylic dianhydride, 1,2,4,5-cyclohexanetetracarboxylic dianhydride, tetrahydrofuran tetracarboxylic dianhydride; 1,2,3,4-butane Aliphatic tetracarboxylic dianhydrides such as tetracarboxylic dianhydride and 1,2,4,5-pentanetetracarboxylic dianhydride are listed.

Examples of a method for introducing a compound obtained by ring-opening these tetracarboxylic dianhydrides with a diol compound into a polyurethane resin include the following methods.
a) A method of reacting an alcohol-terminated compound obtained by ring-opening tetracarboxylic dianhydride with a diol compound and a diisocyanate compound.
b) A method of reacting an alcohol-terminated urethane compound obtained by reacting a diisocyanate compound under an excess of a diol compound with tetracarboxylic dianhydride.

  Specific examples of the diol compound used for the ring-opening reaction include those shown below. That is, ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, propylene glycol, dipropylene glycol, polyethylene glycol, polypropylene glycol, neopentyl glycol, 1,3-butylene glycol, 1,6-hexanediol, 2-butene- 1,4-diol, 2,2,4-trimethyl-1,3-pentanediol, 1,4-bis-β-hydroxyethoxycyclohexane, cyclohexanedimethanol, tricyclodecane dimethanol, hydrogenated bisphenol A, hydrogenated Bisphenol F, bisphenol A ethylene oxide adduct, bisphenol A propylene oxide adduct, bisphenol F ethylene oxide adduct, bisphenol F pro Renoxide adduct, hydrogenated bisphenol A ethylene oxide adduct, hydrogenated bisphenol A propylene oxide adduct, hydroquinone dihydroxyethyl ether, p-xylylene glycol, dihydroxyethyl sulfone, bis (2-hydroxyethyl) -2, Examples include 4-tolylene dicarbamate, 2,4-tolylene-bis (2-hydroxyethylcarbamide), bis (2-hydroxyethyl) -m-xylylenedicarbamate, and bis (2-hydroxyethyl) isophthalate.

(3) Other copolymerization components In addition to the urethane bond represented by the formula (1), the specific polyurethane resin of the present invention includes, as a functional group, an ether bond, an amide bond, a urea bond, an ester bond, a urethane bond, and a biuret bond. And an organic group comprising at least one allophanate bond.
The specific polyurethane resin used in the present invention preferably further has a unit having an ethylenically unsaturated bond. The polyurethane resin having a unit having an ethylenically unsaturated bond preferably has at least one of functional groups represented by the following general formulas (1) to (3) in the side chain of the resin. First, the functional groups represented by the following general formulas (1) to (3) will be described.

In the general formula (1), R ^{1 to} R ³ each independently represent a hydrogen atom or a monovalent organic group. R ¹ preferably includes a hydrogen atom or an alkyl group which may have a substituent. Among them, a hydrogen atom and a methyl group are preferable because of high radical reactivity. R ² and R ³ are each independently a hydrogen atom, a halogen atom, an amino group, a carboxyl group, an alkoxycarbonyl group, a sulfo group, a nitro group, a cyano group, an optionally substituted alkyl group, or a substituted group. An aryl group that may have a group, an alkoxy group that may have a substituent, an aryloxy group that may have a substituent, an alkylamino group that may have a substituent, and a substituent An arylamino group which may have a substituent, an alkylsulfonyl group which may have a substituent, an arylsulfonyl group which may have a substituent, and the like. Among them, a hydrogen atom, a carboxyl group, an alkoxycarbonyl group, a substituent An alkyl group which may have a substituent and an aryl group which may have a substituent are preferable because of high radical reactivity.

X represents an oxygen atom, a sulfur atom, or —N (R ¹² ) —, and R ¹² represents a hydrogen atom or a monovalent organic group. Here, examples of the monovalent organic group include an alkyl group which may have a substituent. Among them, R ¹² is preferably a hydrogen atom, a methyl group, an ethyl group, or an isopropyl group because of high radical reactivity.
Here, examples of the substituent that can be introduced include an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an alkoxy group, an aryloxy group, a halogen atom, an amino group, an alkylamino group, an arylamino group, a carboxyl group, an alkoxycarbonyl group, A sulfo group, a nitro group, a cyano group, an amide group, an alkylsulfonyl group, an arylsulfonyl group and the like can be mentioned.

In the general formula (2), R ^{4 to} R ⁸ each independently represent a hydrogen atom or a monovalent organic group. R ^{4 to} R ⁸ are preferably a hydrogen atom, a halogen atom, an amino group, a dialkylamino group, a carboxyl group, an alkoxycarbonyl group, a sulfo group, a nitro group, a cyano group, an alkyl group which may have a substituent, An aryl group that may have a substituent, an alkoxy group that may have a substituent, an aryloxy group that may have a substituent, an alkylamino group that may have a substituent, and a substituent. An arylamino group which may have a substituent, an alkylsulfonyl group which may have a substituent, an arylsulfonyl group which may have a substituent, and the like. Among them, a hydrogen atom, a carboxyl group, an alkoxycarbonyl group, a substituent An alkyl group which may have a group and an aryl group which may have a substituent are preferable.
Examples of the substituent that can be introduced are the same as those in the general formula (1). Y represents an oxygen atom, a sulfur atom, or —N (R ¹² ) —. R ¹² has the same meaning as R ¹² in general formula (1), and preferred examples are also the same.

In the general formula (3), R ^{9 to} R ¹¹ each independently represent a hydrogen atom or a monovalent organic group. R ⁹ preferably includes a hydrogen atom or an alkyl group which may have a substituent. Among them, a hydrogen atom or a methyl group is preferable because of high radical reactivity. R ¹⁰ and R ¹¹ are each independently a hydrogen atom, a halogen atom, an amino group, a dialkylamino group, a carboxyl group, an alkoxycarbonyl group, a sulfo group, a nitro group, a cyano group, or an alkyl group which may have a substituent. An aryl group which may have a substituent, an alkoxy group which may have a substituent, an aryloxy group which may have a substituent, an alkylamino group which may have a substituent, a substituent An arylamino group that may have, an alkylsulfonyl group that may have a substituent, an arylsulfonyl group that may have a substituent, and the like, among them, a hydrogen atom, a carboxyl group, an alkoxycarbonyl group, An alkyl group which may have a substituent and an aryl group which may have a substituent are preferable because of high radical reactivity.
Here, examples of the substituent that can be introduced are the same as those in the general formula (1). Further, Z is an oxygen atom, a sulfur atom, -N (R ¹³⁾ -, or a phenylene group which may have a substituent. Examples of R ¹³ include an alkyl group which may have a substituent. Among them, a methyl group, an ethyl group, and an isopropyl group are preferable because of high radical reactivity.

  As a method for introducing an ethylenically unsaturated bond into the side chain of the polyurethane resin, a method using a diol compound containing an ethylenically unsaturated bond in the side chain as a raw material for producing the polyurethane resin is also suitable. Such a diol compound may be a commercially available one such as trimethylolpropane monoallyl ether, or a carboxylic acid containing a halogenated diol compound, a triol compound, an aminodiol compound, and an ethylenically unsaturated bond. , An acid chloride, an isocyanate, an alcohol, an amine, a thiol, or a compound easily produced by a reaction with an alkyl halide compound. Specific examples of these compounds include, but are not limited to, the compounds shown below.

  Further, as a more preferable polyurethane resin in the present invention, it was obtained by using a diol compound represented by the following general formula (G) as at least one diol compound having an ethylenically unsaturated bond group in the synthesis of polyurethane. Mention may be made of polyurethane resins.

In the general formula (G), R ^{1 to} R ³ each independently represents a hydrogen atom or a monovalent organic group, A represents a divalent organic residue, X represents an oxygen atom, a sulfur atom, or — N (R ¹² ) — is represented, and R ¹² represents a hydrogen atom or a monovalent organic group.
Incidentally, R ¹ to R ³ and X in the general formula (G) has the same meaning as R ¹ to R ³ and X in the general formula (1), preferred embodiments versa.

  By using a polyurethane resin derived from such a diol compound, the effect of suppressing the excessive molecular motion of the polymer main chain caused by the secondary alcohol having a large steric hindrance can improve the coating strength of the layer. Conceivable.

  Hereinafter, specific examples of the diol compound represented by the general formula (G) which are suitably used for the synthesis of the specific polyurethane resin will be shown.

  In addition, when the NCO / OH ratio is 1 or more and the NCO group is excessive, the main chain end becomes an NCO group, so an alcohol having an ethylenically unsaturated bond (2-hydroxyethyl (meth) acrylate, blemmer) An ethylenically unsaturated bond can be introduced at the end of the main chain by adding and adding PME200 (made by NOF Corporation etc.) separately. In the present application, the main chain terminal may have an ethylenically unsaturated group in addition to the side chain.

The specific polyurethane resin that can be used in the present invention is synthesized by adding the above-mentioned diisocyanate compound and diol compound to an aprotic solvent and adding a known catalyst having an activity corresponding to the respective reactivity, and heating. The molar ratio (M _a : M _b ) of the diisocyanate and diol compound used in the synthesis is preferably 1: 1 to 1.2: 1, and the molecular weight or viscosity is desired by treating with alcohols or amines. The product having the physical properties is finally synthesized in a form in which no isocyanate group remains.
Among them, the synthesis using a bismuth catalyst is preferable from the viewpoint of the environment and the polymerization rate than the tin catalyst that has been conventionally used. As such a bismuth catalyst, Neostan U-600 (trade name) (manufactured by Nitto Kasei) is particularly preferred.

Moreover, what has an ethylenically unsaturated bond in a polymer terminal and / or a polymer principal chain is also used suitably for the specific polyurethane resin which concerns on this invention.
As a method for introducing an unsaturated group into the polymer terminal, there are the following methods. That is, in the step of treating with the residual isocyanate group at the polymer end and the alcohols or amines in the above-mentioned polyurethane resin synthesis step, an alcohol or amine having an unsaturated group may be used.

As a method for introducing an unsaturated group into a polymer main chain, there is a method of using a diol compound having an unsaturated group in the main chain direction for the synthesis of a polyurethane resin. Specific examples of the diol compound having an unsaturated group in the main chain direction include the following compounds.
That is, cis-2-butene-1,4-diol, trans-2-butene-1,4-diol, polybutadiene diol, and the like.

The ethylenically unsaturated bond is preferably introduced into the polymer side chain rather than the polymer end from the viewpoint that the introduction amount can be easily controlled and the introduction amount can be increased, and the crosslinking reaction efficiency is improved.
The ethylenically unsaturated bond group to be introduced is preferably a methacryloyl group, an acryloyl group or a styryl group, more preferably a methacryloyl group or an acryloyl group, from the viewpoint of forming a crosslinked cured film. From the viewpoint of coexistence of the formability of the crosslinked cured film and the raw storage stability, a methacryloyl group is more preferable.

As an introduction amount of the ethylenically unsaturated bond contained in the specific polyurethane resin according to the present invention, in terms of equivalent, 0.3 meq / g or more of an ethylenically unsaturated bond group in the side chain, and further 0.35 to It is preferable to contain 1.50 meq / g. That is, a polyurethane resin containing 0.35 to 1.50 meq / g of methacryloyl group in the side chain is most preferable.
The molecular weight of the specific polyurethane resin according to the present invention is preferably 10,000 or more in terms of mass average molecular weight, and more preferably in the range of 40,000 to 200,000. In particular, when the resin composition for laser decomposition of the present invention is used for the recording layer of the pattern forming material, the mass average molecular weight is within this range and the strength of the image portion is excellent.

  Specific examples of the specific polyurethane resin used in the present invention are shown below, but the present invention is not limited thereto.

The specific polyurethane resin according to the present invention has a relatively low temperature (in the case of a commercially available general-purpose resin, most of which is thermally decomposed at a high temperature of 300 ° C. to 400 ° C.). It is characterized by thermal decomposition at less than 250 ° C. Therefore, the resin composition for laser decomposition containing the specific polyurethane resin can be decomposed with high sensitivity. In addition, even in a system using a specific polyurethane resin and a binder polymer in combination (particularly in a phase-separated state), the specific polyurethane resin is first decomposed by the heat generated by the laser irradiation. As a result, the specific polyurethane resin is thermally decomposed. Gases generated during vaporization (nitrogen, etc.) assist and promote vaporization of the coexisting binder polymer. For this reason, it is considered that the resin composition for laser decomposition containing the specific polyurethane resin and the binder polymer has improved laser decomposability as compared with the case where the specific polyurethane resin is not included, and high sensitivity is achieved.

  In the present invention, when a specific polyurethane resin is used, the urethane bond represented by the general formula (1) contained in the specific polyurethane resin is represented by the general formula (1) in the specific polymerizable compound of the component (A). The urethane bond is particularly preferably the same.

  (B) In the binder polymer, the use ratio of the specific polyurethane resin or the specific acrylic resin is preferably 20 to 90% by mass, more preferably 30 to 80 in terms of keeping the film property flexible and expressing a better effect. It is 35 mass%, Most preferably, it is 35-70 mass%.

  In addition to the components (A) and (B), the composition of the present invention may contain a polymerizable compound (monomer), an initiator, and various other components as necessary. Hereinafter, the polymerizable compound (monomer), the initiator, and other components will be described.

(C) Polymerizable compound other than component (A) Along with the polymerizable compound of component (A), another polymerizable compound (component (C)) having no urethane bond represented by formula (1) is used in combination. can do.
Examples of other polymerizable compounds include addition polymerizable compounds having at least one ethylenically unsaturated double bond, and compounds having at least one terminal ethylenically unsaturated bond, preferably two or more. Chosen from. Such a compound group is widely known in this industrial field, and in the present invention, these can be used without particular limitation. These have chemical forms such as monomers, prepolymers, ie dimers, trimers and oligomers, or copolymers thereof, and mixtures thereof. Examples of monomers include unsaturated carboxylic acids (for example, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, etc.), esters and amides thereof, preferably unsaturated carboxylic acids. An ester of an acid and an aliphatic polyhydric alcohol compound and an amide of an unsaturated carboxylic acid and an aliphatic polyamine compound are used. In addition, unsaturated carboxylic acid ester having a nucleophilic substituent such as hydroxyl group, amino group, mercapto group, amide and monofunctional or polyfunctional isocyanate, addition reaction product of epoxy, monofunctional or polyfunctional A dehydration condensation reaction product with a functional carboxylic acid is also preferably used. In addition, an unsaturated carboxylic acid ester having an electrophilic substituent such as an isocyanato group or an epoxy group, an addition reaction product of an amide with a monofunctional or polyfunctional alcohol, an amine or a thiol, a halogen group Also suitable are substitution reaction products of unsaturated carboxylic acid esters, amides with monofunctional or polyfunctional alcohols, amines, and thiols having a leaving substituent such as a tosyloxy group. As another example, it is also possible to use a group of compounds substituted with unsaturated phosphonic acid, styrene, vinyl ether or the like instead of the unsaturated carboxylic acid.

  Specific examples of the monomer of an ester of an aliphatic polyhydric alcohol compound and an unsaturated carboxylic acid include acrylic acid esters such as ethylene glycol diacrylate, triethylene glycol diacrylate, 1,3-butanediol diacrylate, and tetramethylene glycol. Diacrylate, propylene glycol diacrylate, neopentyl glycol diacrylate, trimethylolpropane triacrylate, trimethylolpropane tri (acryloyloxypropyl) ether, trimethylolethane triacrylate, hexanediol diacrylate, 1,4-cyclohexanediol diacrylate , Tetraethylene glycol diacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate , Pentaerythritol tetraacrylate, dipentaerythritol diacrylate, dipentaerythritol hexaacrylate, sorbitol triacrylate, sorbitol tetraacrylate, sorbitol pentaacrylate, sorbitol hexaacrylate, tri (acryloyloxyethyl) isocyanurate, polyester acrylate oligomer.

  Methacrylic acid esters include tetramethylene glycol dimethacrylate, triethylene glycol dimethacrylate, neopentyl glycol dimethacrylate, trimethylolpropane trimethacrylate, trimethylolethane trimethacrylate, ethylene glycol dimethacrylate, 1,3-butanediol dimethacrylate, Hexanediol dimethacrylate, pentaerythritol dimethacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol dimethacrylate, dipentaerythritol hexamethacrylate, sorbitol trimethacrylate, sorbitol tetramethacrylate, bis [p- (3-methacryloxy- 2-hydroxypro ) Phenyl] dimethyl methane, bis - [p- (methacryloxyethoxy) phenyl] dimethyl methane.

  Itaconic acid esters include ethylene glycol diitaconate, propylene glycol diitaconate, 1,3-butanediol diitaconate, 1,4-butanediol diitaconate, tetramethylene glycol diitaconate, pentaerythritol diitaconate And sorbitol tetritaconate.

  Examples of crotonic acid esters include ethylene glycol dicrotonate, tetramethylene glycol dicrotonate, pentaerythritol dicrotonate, and sorbitol tetradicrotonate.

  Examples of isocrotonic acid esters include ethylene glycol diisocrotonate, pentaerythritol diisocrotonate, and sorbitol tetraisocrotonate.

  Examples of maleic acid esters include ethylene glycol dimaleate, triethylene glycol dimaleate, pentaerythritol dimaleate, and sorbitol tetramaleate.

  Examples of other esters include aliphatic alcohol esters described in JP-B-46-27926, JP-B-51-47334, JP-A-57-196231, JP-A-59-5240, Those having an aromatic skeleton described in JP-A-59-5241 and JP-A-2-226149 and those containing an amino group described in JP-A-1-165613 are also preferably used.

  The ester monomers can also be used as a mixture.

  Specific examples of amide monomers of aliphatic polyvalent amine compounds and unsaturated carboxylic acids include methylene bis-acrylamide, methylene bis-methacrylamide, 1,6-hexamethylene bis-acrylamide, 1,6-hexamethylene bis. -Methacrylamide, diethylenetriamine trisacrylamide, xylylene bisacrylamide, xylylene bismethacrylamide and the like.

  Examples of other preferable amide monomers include those having a cyclohexylene structure described in JP-B No. 54-21726.

  In addition, urethane-based addition polymerizable compounds produced by using an addition reaction of isocyanate and hydroxyl group are also suitable, and specific examples thereof include, for example, one molecule described in JP-B-48-41708. A vinyl urethane containing two or more polymerizable vinyl groups in one molecule obtained by adding a vinyl monomer containing a hydroxyl group represented by the following general formula (V) to a polyisocyanate compound having two or more isocyanate groups. Compounds and the like.

_{CH 2 = C (R) COOCH} 2 CH (R ') OH (V)
(However, R and R ′ represent H or CH _3. )
Further, urethane acrylates such as those described in JP-A-51-37193, JP-B-2-32293, JP-B-2-16765, JP-B-58-49860, JP-B-56-17654 Urethane compounds having an ethylene oxide skeleton described in JP-B-62-39417 and JP-B-62-39418 are also suitable.

  Further, by using addition polymerizable compounds having an amino structure or a sulfide structure in the molecule described in JP-A-63-277653, JP-A-63-260909, JP-A-1-105238 Can obtain a cured composition in a short time.

  Other examples include reacting polyester acrylates, epoxy resins and (meth) acrylic acid as described in JP-A-48-64183, JP-B-49-43191 and JP-B-52-30490. And polyfunctional acrylates and methacrylates such as epoxy acrylates. Further, specific unsaturated compounds described in JP-B-46-43946, JP-B-1-40337, JP-B-1-40336, and vinylphosphonic acid compounds described in JP-A-2-25493 are also included. be able to. In some cases, a structure containing a perfluoroalkyl group described in JP-A-61-22048 is preferably used. Furthermore, Journal of Japan Adhesion Association vol. 20, no. 7, pages 300 to 308 (1984), which are introduced as photocurable monomers and oligomers, can also be used.

From the viewpoint of photosensitive speed, a structure having a high unsaturated group content per molecule is preferable, and in many cases, a bifunctional or higher functionality is preferable. Further, in order to increase the strength of the image area, that is, the cured film, those having three or more functionalities are preferable. Further, different functional numbers and different polymerizable groups (for example, acrylic acid ester, methacrylic acid ester, styrenic compound, vinyl ether type). A method of adjusting both photosensitivity and intensity by using a compound) is also effective.
The addition amount of the other polymerizable compound is preferably 70% by mass or less, more preferably 50% by mass or less, and particularly preferably 30% by mass or less with respect to the polymerizable compound of the component (A).

  Before and / or after laser decomposition, the resin composition for laser decomposition containing a polymerizable compound can be polymerized and cured by energy such as light and heat.

<Initiator>
As the initiator, those known to those skilled in the art can be used without limitation. Specifically, for example, Bruce M. Monroe et al., Chemical Revue, 93, 435 (1993) and RSD Davidson, Journal of Photochemistry and Biology A: Chemistry, 73.81 (1993); JPFaussier, "Photoinitiated Polymerization-Theory and Applications ": Rapra Review vol. 9, Report, Rapra Technology (1998); M. Tsunooka et al., Prog. Polym. Sci., 21, 1 (1996). FDSaeva, Topics in Current Chemistry, 156, 59 (1990); GGMaslak, Topics in Current Chemistry, 168, 1 (1993); HBShuster et al, JACS, 112, 6329 (1990); IDFEaton et al, JACS, 102 , 3298 (1980) and the like, a group of compounds that cause oxidative or reductive bond cleavage is also known.

  Hereinafter, a specific example of a preferable initiator will be described in detail with respect to a radical initiator which is a compound that generates radicals by light and / or heat energy and initiates and accelerates the above-described polymerizable compound and polymerization reaction. Are not limited by these statements.

  In the present invention, preferred radical initiators include (a) aromatic ketones, (b) onium salt compounds, (c) organic peroxides, (d) thio compounds, (e) hexaarylbiimidazole compounds, f) ketoxime ester compounds, (g) borate compounds, (h) azinium compounds, (i) metallocene compounds, (j) active ester compounds, (k) compounds having a carbon halogen bond, (l) azo compounds, etc. Can be mentioned. Specific examples of the above (a) to (l) are given below, but the present invention is not limited to these.

(A) Aromatic ketones (a) Aromatic ketones preferred as the radical initiator used in the present invention include “RADIATION CURING IN POLYMER SCIENCE AND TECHNOLOGY” P. Fouassier, J. et al. F. Examples include compounds having a benzophenone skeleton or a thioxanthone skeleton described in Rabek (1993), p77-117. For example, the following compounds are mentioned.

  Among these, examples of particularly preferable (a) aromatic ketones include the following compounds.

(B) Onium salt compound As the radical initiator (b) preferable as the radical initiator used in the present invention, compounds represented by the following general formulas (1) to (3) are exemplified.

In formula (1), Ar ¹ and Ar ² each independently represent an aryl group having 20 or less carbon atoms, which may have a substituent. (Z ² ) ⁻ represents a counter ion selected from the group consisting of halogen ion, perchlorate ion, carboxylate ion, tetrafluoroborate ion, hexafluorophosphate ion, and sulfonate ion, preferably perchloric acid Ions, hexafluorophosphate ions, and aryl sulfonate ions.

In Formula (2), Ar ³ represents an aryl group having 20 or less carbon atoms, which may have a substituent. (Z ³ ) ⁻ represents a counter ion having the same meaning as (Z ² ) ⁻ .

In formula (3), R ²³ , R ²⁴ and R ²⁵ may be the same or different and each represents a hydrocarbon group having 20 or less carbon atoms which may have a substituent. (Z ⁴ ) ⁻ represents a counter ion having the same meaning as (Z ² ) ⁻ .

  Specific examples of onium salts that can be suitably used in the present invention include those described in paragraphs [0030] to [0033] of JP-A-2001-133969 previously proposed by the present applicant, Those described in paragraph numbers [0015] to [0046] of JP-A No. 2001-343742, JP-A No. 2002-148790, JP-A No. 2001-343742, JP-A No. 2002-6482, JP-A No. 2002-116539, Specific aromatic sulfonium salt compounds described in JP-A No. 2004-102031 can be exemplified.

(C) Organic peroxide Preferred as the radical initiator used in the present invention (c) The organic peroxide includes almost all organic compounds having one or more oxygen-oxygen bonds in the molecule. Examples include methyl ethyl ketone peroxide, cyclohexanone peroxide, 3,3,5-trimethylcyclohexanone peroxide, methylcyclohexanone peroxide, acetylacetone peroxide, 1,1-bis (tertiarybutylperoxy) -3,3,5. -Trimethylcyclohexane, 1,1-bis (tertiarybutylperoxy) cyclohexane, 2,2-bis (tertiarybutylperoxy) butane, tertiarybutyl hydroperoxide, cumene hydroperoxide, diisopropylbenzene Idroperoxide, paraffin hydroperoxide, 2,5-dimethylhexane-2,5-dihydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, ditertiary butyl peroxide, tertiary butyl Cumyl peroxide, dicumyl peroxide, bis (tertiarybutylperoxyisopropyl) benzene, 2,5-dimethyl-2,5-di (tertiarybutylperoxy) hexane, 2,5-xanoyl peroxide, peroxy Succinic oxide, benzoyl peroxide, 2,4-dichlorobenzoyl peroxide, meta-toluoyl peroxide, diisopropyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, di-2-ethoxyethyl peroxydi -Bonate, dimethoxyisopropyl peroxycarbonate, di (3-methyl-3-methoxybutyl) peroxydicarbonate, tertiary butyl peroxyacetate, tertiary butyl peroxypivalate, tertiary butyl peroxyneodecanoate, tarsha Tributyl peroxyoctanoate, tertiary butyl peroxy-3,5,5-trimethylhexanoate, tertiary butyl peroxylaurate, tertiary carbonate, 3,3'4,4'-tetra- (t -Butylperoxycarbonyl) benzophenone, 3,3'4,4'-tetra- (t-amylperoxycarbonyl) benzophenone, 3,3'4,4'-tetra- (t-hexylperoxycarbonyl) benzophenone, 3, 3'4 4'-tetra- (t-octylperoxycarbonyl) benzophenone, 3,3'4,4'-tetra- (cumylperoxycarbonyl) benzophenone, 3,3'4,4'-tetra- (p-isopropylcumi Ruperoxycarbonyl) benzophenone, carbonyldi (t-butylperoxydihydrogen diphthalate), carbonyldi (t-hexylperoxydihydrogen diphthalate), and the like.

  Among them, 3,3'4,4'-tetra- (t-butylperoxycarbonyl) benzophenone, 3,3'4,4'-tetra- (t-amylperoxycarbonyl) benzophenone, 3,3'4 4'-tetra- (t-hexylperoxycarbonyl) benzophenone, 3,3'4,4'-tetra- (t-octylperoxycarbonyl) benzophenone, 3,3'4,4'-tetra- (cumylper) Peroxyesters such as (oxycarbonyl) benzophenone, 3,3'4,4'-tetra- (p-isopropylcumylperoxycarbonyl) benzophenone, di-t-butyldiperoxyisophthalate are preferred.

(D) Thio compound (d) Thio compound preferable as the radical initiator used in the present invention includes a compound having a structure represented by the following general formula (4).

(Wherein R ²⁶ represents an alkyl group, an aryl group or a substituted aryl group, R ²⁷ represents a hydrogen atom or an alkyl group, and R ²⁶ and R ²⁷ are bonded to each other to form an oxygen, sulfur and nitrogen atom. (A group of nonmetallic atoms necessary to form a 5-membered to 7-membered ring which may contain a selected heteroatom.)
Specific examples of the thio compound represented by the general formula (4) include the following compounds.

(E) Hexaarylbiimidazole compounds (e) Hexaarylbiimidazole compounds preferred as the radical initiator used in the present invention include lophine dimers described in JP-B Nos. 45-37377 and 44-86516, such as 2 , 2'-bis (o-chlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis (o-bromophenyl) -4,4', 5,5'-tetra Phenylbiimidazole, 2,2'-bis (o, p-dichlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis (o-chlorophenyl) -4,4', 5,5'-tetra (m-methoxyphenyl) biimidazole, 2,2'-bis (o, o'-dichlorophenyl) -4,4 ', 5,5'-tetraf Phenylbiimidazole, 2,2'-bis (o-nitrophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis (o-methylphenyl) -4,4', Examples include 5,5′-tetraphenylbiimidazole, 2,2′-bis (o-trifluorophenyl) -4,4 ′, 5,5′-tetraphenylbiimidazole, and the like.

(F) Ketoxime ester compound (f) Ketoxime ester compounds preferable as the radical initiator used in the present invention include 3-benzoyloxyiminobutan-2-one, 3-acetoxyiminobutane-2-one, 3 -Propionyloxyiminobutan-2-one, 2-acetoxyiminopentan-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino-1-phenylpropan-1-one, Examples include 3-p-toluenesulfonyloxyiminobutan-2-one and 2-ethoxycarbonyloxyimino-1-phenylpropan-1-one.

(G) Borate compound As an example of the (g) borate compound preferable as a radical initiator used for this invention, the compound represented by following General formula (5) can be mentioned.

(Wherein R ²⁸ , R ²⁹ , R ³⁰ and R ³¹ may be the same or different from each other, and each represents a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted alkenyl group, A substituted or unsubstituted alkynyl group or a substituted or unsubstituted heterocyclic group, R ²⁸ , R ²⁹ , R ³⁰ and R ³¹ may be combined with each other to form a cyclic structure; Provided that at least one of R ²⁸ , R ²⁹ , R ³⁰ and R ³¹ is a substituted or unsubstituted alkyl group (Z ⁵ ) ⁺ represents an alkali metal cation or a quaternary ammonium cation.)
Specific examples of the compound represented by the general formula (5) are described in US Pat. Nos. 3,567,453 and 4,343,891, European Patents 109,772 and 109,773. Examples include compounds and those shown below.

(H) Azinium compounds Preferred (h) azinium salt compounds as radical initiators used in the present invention include those disclosed in JP-A-63-138345, JP-A-63-142345, JP-A-63-142346, and JP-A-63-142346. Examples include compounds having an N—O bond described in JP-A-63-143537 and JP-B-46-42363.

(I) Metallocene Compound (i) Metallocene compounds preferred as the radical initiator used in the present invention include those disclosed in JP-A Nos. 59-152396, 61-151197, 63-41484, and JP-A-2. And titanocene compounds described in JP-A No.-249 and JP-A-2-4705, and iron-arene complexes described in JP-A-1-304453 and JP-A-1-152109.

Specific examples of the titanocene compound include di-cyclopentadienyl-Ti-di-chloride, di-cyclopentadienyl-Ti-bis-phenyl, and di-cyclopentadienyl-Ti-bis-2,3. 4,5,6-pentafluorophen-1-yl, di-cyclopentadienyl-Ti-bis-2,3,5,6-tetrafluorophen-1-yl, di-cyclopentadienyl-Ti- Bis-2,4,6-trifluorophen-1-yl, di-cyclopentadienyl-Ti-2,6-difluorophen-1-yl, di-cyclopentadienyl-Ti-bis-2,4 -Difluorophen-1-yl, di-methylcyclopentadienyl-Ti-bis-2,3,4,5,6-pentafluorophen-1-yl, di-methylcyclopentadienyl-Ti- -2,3,5,6-tetrafluorophen-1-yl, di-methylcyclopentadienyl-Ti-bis-2,4-difluorophen-1-yl, bis (cyclopentadienyl) -bis (2,6-difluoro-3- (pyridin-1-yl) phenyl) titanium bis (cyclopentadienyl) bis [2,6-difluoro-3- (methylsulfonamido) phenyl] titanium, bis (cyclopentadi Enyl) bis [2,6-difluoro-3- (N-butylbialoyl-amino) phenyl] titanium, bis (cyclopentadienyl) bis [2,6-difluoro-3- (N-butyl- (4-chlorobenzoyl) ) Amino) phenyl] titanium, bis (cyclopentadienyl) bis [2,6-difluoro-3- (N-benzyl-2,2-dimethylpentanoyla) ) Phenyl] titanium, bis (cyclopentadienyl) bis [2,6-difluoro-3- (N- (2-ethylhexyl) -4-tolyl-sulfonyl) amino] phenyl] titanium, bis (cyclopentadienyl ) Bis [2,6-difluoro-3- (N- (3-oxaheptyl) benzoylamino) phenyl] titanium, bis (cyclopentadienyl) bis [2,6-difluoro-3- (N- (3 6-dioxadecyl) benzoylamino) phenyl] titanium, bis (cyclopentadienyl) bis [2,6-difluoro-3- (trifluoromethylsulfonyl) amino] phenyl] titanium, bis (cyclopentadienyl) bis [2 , 6-Difluoro-3- (trifluoroacetylamino) phenyl] titanium, bis (cyclopentadienyl) bis [2 , 6-Difluoro-3- (2-chlorobenzoyl) amino] phenyl] titanium, bis (cyclopentadienyl) bis [2,6-difluoro-3- (4-chlorobenzoyl) amino] phenyl] titanium, bis ( Cyclopentadienyl) bis [2,6-difluoro-3- (N- (3,6-dioxadecyl) -2,2-dimethylpentanoylamino) phenyl] titanium, bis (cyclopentadienyl) bis [2, 6-difluoro-3- (N- (3,7-dimethyl-7-methoxyoctyl) benzoylamino) phenyl] titanium, bis (cyclopentadienyl) bis [2,6-difluoro-3- (N-cyclohexylbenzoyl) Amino) phenyl] titanium, and the like.

(J) Active ester compound Preferred as the radical initiator used in the present invention (j) is an imide sulfonate compound described in JP-B-62-2223, JP-B-63-14340, JP-A-59-174831. Mention may be made of the active sulfonates described.

(K) Compound Having Carbon Halogen Bond Preferred examples of the compound (k) having a carbon halogen bond as the radical initiator used in the present invention include those represented by the following general formulas (6) to (12).

(Wherein, X ² represents a halogen atom, Y ¹ is _{^{-C (X 2) 3, -NH}} 2, -NHR 38, -NR 38, represent -OR ^38. Wherein R ³⁸ represents an alkyl group, a substituted An alkyl group, an aryl group, or a substituted aryl group, and R ³⁷ represents —C (X ² ) ₃ , an alkyl group, a substituted alkyl group, an aryl group, a substituted aryl group, or a substituted alkenyl group.

(However, R ³⁹ is an alkyl group, a substituted alkyl group, an alkenyl group, a substituted alkenyl group, an aryl group, a substituted aryl group, a halogen atom, an alkoxy group, a substituted alkoxyl group, a nitro group, or a cyano group, and X ³ is a halogen atom. And n is an integer of 1 to 3.)

(However, R ⁴⁰ is an aryl group or a substituted aryl group, R ⁴¹ is a group or halogen shown below, and Z ⁶ is —C (═O) —, —C (═S) — or —SO _2- , X ³ is a halogen atom, and m is 1 or 2.)

(R ⁴² and R ⁴³ are an alkyl group, a substituted alkyl group, an alkenyl group, a substituted alkenyl group, an aryl group or a substituted aryl group, and R ⁴⁴ is the same as R ³⁸ in the general formula (6).)

Wherein R ⁴⁵ is an optionally substituted aryl group or heterocyclic group, R ⁴⁶ is a trihaloalkyl group or trihaloalkenyl group having 1 to 3 carbon atoms, p is 1, 2 or 3.)

(Equation (10), .L ⁷ which represents a carbonylmethylene heterocyclic compound having a trihalogenomethyl group is a hydrogen atom or the ^{formula: CO- (R 47) q (} C (X 4) 3) at r substituent Q ² is a sulfur, selenium or oxygen atom, dialkylmethylene group, alkene-1,2-ylene group, 1,2-phenylene group or N—R group, and M ⁴ is a substituted or unsubstituted alkylene group or An alkenylene group or a 1,2-arylene group; R ⁴⁸ is an alkyl group, an aralkyl group or an alkoxyalkyl group; and R ⁴⁷ is a carbocyclic or heterocyclic divalent aromatic group. And X ⁴ is a chlorine, bromine or iodine atom and q = 0 and r = 1 or q = 1 and r = 1 or 2.)

(Formula (11) represents a 4-halogeno-5- (halogenomethylphenyl) oxazole derivative. X ⁵ is a halogen atom, t is an integer of 1 to 3, and s is an integer of 1 to 4. , R ⁴⁹ is a hydrogen atom or a CH _3-t X ⁵ _t group, R ⁵⁰ is s-valent optionally substituted unsaturated organic group.)

(Formula (12) represents a 2- (halogenomethylphenyl) -4-halogenoxazole derivative. X ⁶ is a halogen atom, v is an integer of 1 to 3, and u is an integer of 1 to 4. , R ⁵¹ is a hydrogen atom or a CH _3-v X ⁶ _v group, R ⁵² is an unsaturated organic group which may be substituted for u-valent.)
Specific examples of such a compound having a carbon-halogen bond include those described in Wakabayashi et al., Bull. Chem. Soc. Japan, 42, 2924 (1969), such as 2-phenyl 4,6-bis (trichloromethyl) -S-triazine, 2- (p-chlorophenyl) -4,6-bis (trichloromethyl)- S-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) -S-triazine, 2- (p-methoxyphenyl) -4,6-bis (trichloromethyl) -S-triazine, 2 -(2 ', 4'-dichlorophenyl) -4,6-bis (trichloromethyl) -S-triazine, 2,4,6-tris (trichloromethyl) -S-triazine, 2-methyl-4,6 -Bis (trichloromethyl) -S-triazine, 2-n-nonyl-4,6-bis (trichloromethyl) -S-triazine, 2- (α, α, β-trichloroethyl) -4,6 Bis (trichloromethyl) -S- triazine. In addition, compounds described in British Patent 1388492, for example, 2-styryl-4,6-bis (trichloromethyl) -S-triazine, 2- (p-methylstyryl) -4,6-bis (trichloromethyl) -S-triazine,
2- (p-methoxystyryl) -4,6-bis (trichloromethyl) -S-triazine, 2- (p-methoxystyryl) -4-amino-6-trichloromethyl-S-triazine, etc. -133428 compounds such as 2- (4-methoxy-naphth-1-yl) -4,6-bis-trichloromethyl-S-triazine, 2- (4-ethoxy-naphth-1-yl)- 4,6-bis-trichloromethyl-S-triazine, 2- [4- (2-ethoxyethyl) -naphth-1-yl] -4,6-bis-trichloromethyl-S-triazine, 2- (4 7-dimethoxy-naphth-1-yl) -4,6-bis-trichloromethyl-S-triazine), 2- (acenaphtho-5-yl) -4,6-bis-trichloromethyl-S-triazine, etc. Compounds countries Patent 3337024 Pat described, for example, may include the following compounds and the like. Or even more P. Hutt, E .; F. Elslager and L.L. M.M. The following compounds that can be easily synthesized by those skilled in the art according to the synthesis method described in “Journalof Heterocyclic Chemistry”, Volume 7 (No. 3) by Herbel, page 511 et seq. (1970) Examples of the group include the following compounds.

(L) Azo-based compound Preferred as the radical initiator used in the present invention (l) As the azo-based compound, 2,2′-azobisisobutyronitrile, 2,2′-azobispropionitrile, 1, 1'-azobis (cyclohexane-1-carbonitrile), 2,2'-azobis (2-methylbutyronitrile), 2,2'-azobis (2,4-dimethylvaleronitrile), 2,2'-azobis (4-methoxy-2,4-dimethylvaleronitrile), 4,4′-azobis (4-cyanovaleric acid), dimethyl 2,2′-azobisisobutyrate, 2,2′-azobis (2-methylpropionamide oxime) ), 2,2′-azobis [2- (2-imidazolin-2-yl) propane], 2,2′-azobis {2-methyl-N- [1,1-bis (hydroxymethyl) -2-hydroxy Til] propionamide}, 2,2′-azobis [2-methyl-N- (2-hydroxyethyl) propionamide], 2,2′-azobis (N-butyl-2-methylpropionamide), 2,2 '-Azobis (N-cyclohexyl-2-methylpropionamide), 2,2'-azobis [N- (2-propenyl) -2-methylpropionamide], 2,2'-azobis (2,4,4- Trimethylpentane) and the like.

  Still more preferred examples of the radical initiator in the present invention include the above-mentioned (a) aromatic ketones, (b) onium salt compounds, (c) organic peroxides, (e) hexaarylbiimidazole compounds, (i) ) Metallocene compounds, (k) compounds having a carbon halogen bond, and the most preferred examples include aromatic iodonium salts, aromatic sulfonium salts, titanocene compounds, and trihalomethyl represented by the general formula (6) -S-triazine compounds can be mentioned.

The initiator is generally added in a proportion of 0.1 to 50% by mass, preferably 0.5 to 30% by mass, particularly preferably 5 to 20% by mass, based on the total solid content of the composition. Can do.
The initiator in the present invention is preferably used alone or in combination of two or more.

Other components The resin composition for laser decomposition of the present invention may further contain other components suitable for its use, production method and the like. Hereinafter, preferred additives will be exemplified.

<Sensitizing dye>
In the present invention, when a laser (YAG laser, semiconductor laser, etc.) emitting infrared rays of 760 to 1,200 nm is used as a light source, an infrared absorber is usually used. The infrared absorber absorbs laser light and generates heat to promote thermal decomposition. The infrared absorber used in the present invention is a dye or pigment having an absorption maximum at a wavelength of 760 nm to 1200 nm.

  As the dye, commercially available dyes and known dyes described in documents such as “Dye Handbook” (edited by the Society for Synthetic Organic Chemistry, published in 1970) can be used. Specifically, dyes such as azo dyes, metal complex azo dyes, pyrazolone azo dyes, naphthoquinone dyes, anthraquinone dyes, phthalocyanine dyes, carbonium dyes, quinoneimine dyes, methine dyes, cyanine dyes, squarylium dyes, pyrylium salts, metal thiolate complexes Is mentioned.

Preferred dyes include, for example, cyanine dyes described in JP-A-58-125246, JP-A-59-84356, JP-A-59-202829, JP-A-60-78787, and the like. Methine dyes described in 58-173696, JP-A-58-181690, JP-A-58-194595, etc., JP-A-58-11
2793, JP-A 58-224793, JP-A 59-48187, JP-A 59-73996, JP-A 60-52940, JP-A 60-63744, etc. And squarylium dyes described in JP-A-58-112792, and cyanine dyes described in British Patent 434,875.

Also, a near infrared absorption sensitizer described in US Pat. No. 5,156,938 is preferably used, and a substituted arylbenzo (thio) pyrylium salt described in US Pat. No. 3,881,924, Trimethine thiapyrylium salts described in JP-A-57-142645 (US Pat. No. 4,327,169), JP-A-58-181051, 58-220143, 59-41363, 59-84248 Nos. 59-84249, 59-146063, 59-146061, pyranlium compounds, cyanine dyes described in JP-A-59-216146, US Pat. No. 4,283,475 The pentamethine thiopyrylium salts described above and the pyrylium compounds disclosed in Japanese Patent Publication Nos. 5-13514 and 5-19702 are also preferably used. . Moreover, as another example preferable as a dye, the near-infrared absorptive dye described as the formula (I) and (II) in US Patent 4,756,993 can be mentioned.

  Other preferable examples of the infrared absorbing dye of the present invention include specific indolenine cyanine dyes described in JP-A-2002-278057.

  Particularly preferred among these dyes are cyanine dyes, squarylium dyes, pyrylium salts, nickel thiolate complexes, and indolenine cyanine dyes. Furthermore, cyanine dyes and indolenine cyanine dyes are preferred.

  Specific examples of cyanine dyes that can be suitably used in the present invention include paragraph numbers [0017] to [0019] of JP-A No. 2001-133969 and paragraph numbers [0012] to [0038] of JP-A No. 2002-40638. And those described in paragraph numbers [0012] to [0023] of JP-A No. 2002-23360.

  The dye represented by the following general formula (d) or general formula (e) is preferable from the viewpoint of photothermal conversion.

In general formula (d), R ²⁹ to R ³¹ each independently represents a hydrogen atom, an alkyl group, or an aryl group. R ³³ and R ³⁴ each independently represents an alkyl group, a substituted oxy group, or a halogen atom. n and m each independently represents an integer of 0 to 4. R ²⁹ and R ³⁰ , or R ³¹ and R ³² may be bonded to each other to form a ring, and R ²⁹ and / or R ³⁰ is R ³³ and R ³¹ and / or R ³² is R ³⁴ taken together, may form a ring, further, when R ³³ or R ³⁴ there are a plurality, R ³³ or between R ³⁴ each other may be bonded to each other to form a ring. X ² and X ³ each independently represent a hydrogen atom, an alkyl group, or an aryl group, and at least one of X ² and X ³ represents a hydrogen atom or an alkyl group. Q is a trimethine group or a pentamethine group which may have a substituent, and may form a ring structure together with a divalent organic group. Zc ⁻ represents a counter anion. However, Za ⁻ is not necessary when the dye represented by formula (d) has an anionic substituent in its structure and neutralization of charge is not necessary. Preferred Za ⁻ is a halogen ion, a perchlorate ion, a tetrafluoroborate ion, a hexafluorophosphate ion, and a sulfonate ion, particularly preferably a perchlorate ion, a hexagonal salt, in view of storage stability of the photosensitive layer coating solution. Fluorophosphate ions and aryl sulfonate ions.

  In the present invention, specific examples of the dye represented by the general formula (d) that can be suitably used include those exemplified below.

In the general formula (e), R ³⁵ ~R ⁵⁰ are each independently a hydrogen atom, a halogen atom, a cyano group, an alkyl group, an aryl group, an alkenyl group, an alkynyl group, a hydroxyl group, a carbonyl group, thio group, sulfonyl group, sulfinyl When a group, an oxy group, an amino group, or an onium salt structure is shown and a substituent can be introduced into these groups, it may have a substituent. M represents two hydrogen atoms or metal atoms, a halometal group, and an oxymetal group, and the metal atoms contained therein are IA, IIA, IIIB, IVB group atoms of the periodic table, first, second, second Three-period transition metals and lanthanoid elements can be mentioned, among which copper, magnesium, iron, zinc, cobalt, aluminum, titanium, and vanadium are preferable.

  In the present invention, specific examples of the dye represented by formula (e) that can be suitably used include those exemplified below.

  Examples of the pigment used in the present invention include commercially available pigments and color index (CI) manual, “Latest Pigment Handbook” (edited by Japan Pigment Technology Association, published in 1977), “Latest Pigment Application Technology” (CMC Publishing, 1986), “Printing Ink Technology”, CMC Publishing, 1984) can be used.

  Examples of the pigment include black pigments, yellow pigments, orange pigments, brown pigments, red pigments, purple pigments, blue pigments, green pigments, fluorescent pigments, metal powder pigments, and other polymer-bonded dyes. Specifically, insoluble azo pigments, azo lake pigments, condensed azo pigments, chelate azo pigments, phthalocyanine pigments, anthraquinone pigments, perylene and perinone pigments, thioindigo pigments, quinacridone pigments, dioxazine pigments, isoindolinone pigments In addition, quinophthalone pigments, dyed lake pigments, azine pigments, nitroso pigments, nitro pigments, natural pigments, fluorescent pigments, inorganic pigments, carbon black, and the like can be used. Among these pigments, carbon black is preferable.

  These pigments may be used without surface treatment, or may be used after surface treatment. The surface treatment method includes a method of surface coating with a resin or wax, a method of attaching a surfactant, a method of bonding a reactive substance (eg, silane coupling agent, epoxy compound, polyisocyanate, etc.) to the pigment surface, etc. Can be considered. The above-mentioned surface treatment methods are described in “Characteristics and Applications of Metal Soap” (Shobobo), “Printing Ink Technology” (CMC Publishing, 1984) and “Latest Pigment Application Technology” (CMC Publishing, 1986). Yes.

  The particle diameter of the pigment is preferably in the range of 0.01 μm to 10 μm, more preferably in the range of 0.05 μm to 1 μm, and particularly preferably in the range of 0.1 μm to 1 μm. When the particle size of the pigment is 0.01 μm or more, the stability of the dispersion in the coating solution is increased, and when it is 10 μm or less, the uniformity of the composition layer is improved.

  As a method for dispersing the pigment, a known dispersion technique used in ink production, toner production, or the like can be used. Examples of the disperser include an ultrasonic disperser, a sand mill, an attritor, a pearl mill, a super mill, a ball mill, an impeller, a disperser, a KD mill, a colloid mill, a dynatron, a three-roll mill, and a pressure kneader. Details are described in "Latest Pigment Applied Technology" (CMC Publishing, 1986).

<Co-sensitizer>
By using a certain kind of additive (hereinafter referred to as a co-sensitizer), the sensitivity at the time of photocuring the composition layer can be further improved. These mechanisms of action are not clear, but many are thought to be based on the following chemical processes. That is, a co-sensitizer reacts with various intermediate active species (radicals and cations) generated in the process of a photoreaction initiated by a photopolymerization initiator and a subsequent addition polymerization reaction to generate new active radicals. It is estimated to be. These can be broadly divided into (a) those that can be reduced to generate active radicals, (b) those that can be oxidized to generate active radicals, and (c) radicals that are more active by reacting with less active radicals. Can be categorized as those that act as chain transfer agents, but often there is no generality as to which of these individual compounds belong.

(A) Compound which is reduced to produce an active radical Compound having a carbon-halogen bond: It is considered that an active radical is generated by reductive cleavage of the carbon-halogen bond. Specifically, for example, trihalomethyl-s-triazines and trihalomethyloxadiazoles can be preferably used.

  Compound having nitrogen-nitrogen bond: It is considered that the nitrogen-nitrogen bond is reductively cleaved to generate an active radical. Specifically, hexaarylbiimidazoles and the like are preferably used.

  Compound having oxygen-oxygen bond: It is considered that an oxygen-oxygen bond is reductively cleaved to generate an active radical. Specifically, for example, organic peroxides are preferably used.

Onium compound: An active radical is considered to be generated by reductive cleavage of a carbon-hetero bond or oxygen-nitrogen bond. Specifically, for example, diaryliodonium salts, triarylsulfonium salts, N-alkoxypyridinium (azinium) salts and the like are preferably used. Ferrocene and iron arene complexes: An active radical can be reductively generated.
(B) Compound which is oxidized to produce an active radical Alkylate complex: It is considered that a carbon-hetero bond is oxidatively cleaved to produce an active radical. Specifically, for example, triarylalkyl borates are preferably used.

  Alkylamine compound: It is considered that the C—X bond on carbon adjacent to nitrogen is cleaved by oxidation to generate an active radical. X is preferably a hydrogen atom, a carboxyl group, a trimethylsilyl group, a benzyl group or the like. Specific examples include ethanolamines, N-phenylglycines, N-trimethylsilylmethylanilines, and the like.

  Sulfur-containing and tin-containing compounds: Compounds in which the nitrogen atoms of the above-described amines are replaced with sulfur atoms and tin atoms can generate active radicals by the same action. Further, a compound having an SS bond is also known to be sensitized by SS cleavage.

  α-Substituted methylcarbonyl compound: An active radical can be generated by oxidative cleavage of the carbonyl-α carbon bond. Moreover, what converted carbonyl into the oxime ether also shows the same effect | action. Specifically, after reacting 2-alkyl-1- [4- (alkylthio) phenyl] -2-morpholinopronone-1 and these with a hydroxyamine, N-OH was etherified. Oxime ethers can be listed.

Sulfinic acid salts: An active radical can be reductively generated. Specific examples include arylsulfin sodium.
(C) Compounds that react with radicals to convert to highly active radicals or act as chain transfer agents: For example, compounds having SH, PH, SiH, GeH in the molecule are used. These can generate hydrogen by donating hydrogen to a low-activity radical species to generate radicals, or after being oxidized and deprotonated. Specific examples include 2-mercaptobenzthiazoles, 2-mercaptobenzoxazoles, 2-mercaptobenzimidazoles and the like.

  More specific examples of these co-sensitizers are described, for example, in JP-A-9-236913 as additives for the purpose of improving sensitivity, and these are also applied in the present invention. be able to. Some examples are shown below, but the present invention is not limited thereto. In the following formulae, -TMS represents a trimethylsilyl group.

  Regarding the co-sensitizer, similarly to the above-described sensitizing dye, various chemical modifications for improving the properties of the composition layer can be performed. For example, bonds with sensitizing dyes, initiator compounds, addition polymerizable unsaturated compounds and other parts, introduction of hydrophilic sites, compatibility improvement, introduction of substituents for suppressing crystal precipitation, substituents for improving adhesion Methods such as introduction and polymerization can be used.

  A co-sensitizer can be used individually or in combination of 2 or more types. The addition amount is generally 0.05 to 100 parts by mass, preferably 1 to 80 parts by mass, and more preferably 3 to 50 parts by mass with respect to 100 parts by mass of the polymerizable compound.

<Polymerization inhibitor>
In the present invention, in addition to the above components, a small amount of a thermal polymerization inhibitor is used to prevent unnecessary thermal polymerization of a compound having an ethylenically unsaturated double bond that can be polymerized during production or storage of the composition. It is desirable to add. Suitable thermal polymerization inhibitors include hydroquinone, p-methoxyphenol, di-t-butyl-p-cresol, pyrogallol, t-butylcatechol, benzoquinone, 4,4'-thiobis (3-methyl-6-t-butylphenol ), 2,2'-methylenebis (4-methyl-6-tert-butylphenol), N-nitrosophenylhydroxyamine primary cerium salt and the like. The addition amount of the thermal polymerization inhibitor is preferably about 0.01% by mass to about 5% by mass with respect to the mass of the entire composition. If necessary, higher fatty acid derivatives such as behenic acid and behenic acid amide are added to prevent polymerization inhibition due to oxygen, and the layer surface is coated in the drying process after application to a support. It may be unevenly distributed. The amount of the higher fatty acid derivative added is preferably about 0.5% by mass to about 10% by mass of the total composition.

<Colorant>
Furthermore, a coloring agent such as a dye or a pigment may be added for the purpose of coloring the composition layer. Thereby, properties such as the visibility of the image portion and the suitability of the image density measuring device can be improved. As the colorant, it is particularly preferable to use a pigment. Specific examples include pigments such as phthalocyanine pigments, azo pigments, carbon black and titanium oxide, and dyes such as ethyl violet, crystal violet, azo dyes, anthraquinone dyes, and cyanine dyes. The amount of the colorant added is preferably about 0.5% to about 5% by weight of the total composition.

<Other additives>
Furthermore, known additives such as fillers and plasticizers may be added to improve the physical properties of the cured film.

  The filler may be an organic compound, an inorganic compound, or a mixture thereof. For example, examples of the organic compound include carbon black, carbon nanotube, fullerene, and graphite. Examples of the inorganic compound include silica, alumina, aluminum, and calcium carbonate.

  Examples of plasticizers include dioctyl phthalate, didodecyl phthalate, triethylene glycol dicaprylate, dimethyl glycol phthalate, tricresyl phosphate, dioctyl adipate, dibutyl sebacate, and triacetyl glycerin. 10 mass% or less can be added with respect to the total mass of the compound which has an ionic unsaturated double bond, and a binder.

<Pattern forming material>
The pattern forming material of the present invention has a thermally decomposable resin layer (pattern forming layer) comprising at least one composition of the present invention on a support. Here, the pattern forming material means a pattern forming material that becomes an uneven pattern when the exposed portion forms a recess compared to the non-exposed portion due to laser exposure. Therefore, not only a pattern forming material that forms a recess directly by laser exposure (for example, by ablation), but also a pattern that forms a recess by performing a heat treatment or a development treatment with an alkaline aqueous solution after laser exposure. Also includes forming materials. The pattern forming material of the present invention can be suitably used particularly as the former type of pattern forming material.
The pattern forming material suitably used in the present invention is not particularly limited as long as it has the above-mentioned properties, and printing plate precursors such as lithographic plates, gravure plates, letterpress plates and screens, printed wiring boards, semiconductors It can be used in a wide variety of fields, such as photoresist materials for optical disks and recording materials for optical disks. In the present invention, a direct engraving plate making using a laser, that is, a printing plate used for so-called “laser engraving” is preferably used. In particular, a flexographic printing plate is preferably used, and a flexographic printing plate precursor for laser engraving is most suitable as the pattern forming material of the present invention.

  In the formation of the pattern forming layer of the present invention, the components of each layer are once dissolved in a solvent, the lower layer is applied and dried on a support, the upper layer is applied and dried, or the components of each layer are kneaded with a kneader, A method such as sequential casting on a support is preferably used. The layer containing a specific polymerizable compound has an effect of physically assisting other layers to be laser-decomposed or laser-engraved (because it is a low-temperature decomposable lower layer, scattering of the lower-layer decomposition product is The layer containing the specific polymerizable compound is preferably a lower layer in order to develop the effect of assisting the decomposition / scattering.

(Support)
In the present invention, the support for the pattern forming material is preferably a flexible material having excellent dimensional stability. For example, a polyethylene terephthalate film, a polyethylene naphthalate film, a polybutylene terephthalate film, or A polycarbonate film can be mentioned. The thickness of the support is preferably from 50 to 350 μm, more preferably from 100 to 250 μm, from the mechanical properties, shape stability, handleability, etc. of the pattern forming material. If necessary, a known adhesive layer conventionally used for this kind of purpose may be provided on the surface of the support in order to improve the adhesion between the support and the pattern forming layer.
Further, by performing physical and chemical treatment on the surface of the support used in the present invention, the adhesion with the pattern forming layer or the adhesive layer can be improved. Examples of the physical treatment method include a sand blast method, a wet blast method in which a liquid containing fine particles is jetted, a corona discharge treatment method, a plasma treatment method, an ultraviolet ray or vacuum ultraviolet ray irradiation treatment method, and the like. Examples of the chemical treatment method include a strong acid treatment method, a strong alkali treatment method, an oxidant treatment method, and a coupling agent treatment method.

(Formation of film)
In order to form the composition of the present invention into a sheet, roll or cylinder, existing resin molding methods can be used. For example, a casting method, a method of extruding the resin composition from a nozzle or a die with a machine such as a pump or an extruder, adjusting the thickness with a blade, and adjusting the thickness by calendering with a roll can be exemplified. In that case, it is also possible to perform the molding while heating the resin composition within a range that does not deteriorate the performance. Moreover, you may perform a rolling process, a grinding process, etc. as needed. Usually, it is often formed on an underlay called a back film made of a material such as PET or nickel. A cylindrical substrate made of fiber reinforced plastic (FRP), plastic, or metal can also be used. The cylindrical substrate can be hollow with a constant thickness for weight reduction. The role of the back film or the cylindrical substrate is to ensure the dimensional stability of the pattern forming material. Therefore, it is necessary to select one having high dimensional stability. Specific examples of materials include polyester resin, polyimide resin, polyamide resin, polyamideimide resin, polyetherimide resin, polybismaleimide resin, polysulfone resin, polycarbonate resin, polyphenylene ether resin, polyphenylene thioether resin, polyethersulfone resin, all Examples thereof include liquid crystal resins composed of aromatic polyester resins, wholly aromatic polyamide resins, and epoxy resins. Further, these resins can be laminated and used. For example, a sheet or the like in which layers of polyethylene terephthalate having a thickness of 50 μm are laminated on both surfaces of a 4.5 μm thick wholly aromatic polyamide film may be used. In addition, a porous sheet, for example, a cloth formed by knitting fibers, a nonwoven fabric, a film in which pores are formed, or the like can be used as a back film. When a porous sheet is used as the back film, the photosensitive resin cured product layer is integrated with the back film by photocuring after impregnating the photosensitive resin composition into the pores, so that high adhesion is obtained. be able to. The fibers forming the cloth or nonwoven fabric include glass fibers, alumina fibers, carbon fibers, alumina / silica fibers, boron fibers, high silicon fibers, potassium titanate fibers, inorganic fibers such as sapphire fibers, natural materials such as cotton and hemp Examples thereof include semi-synthetic fibers such as fibers, rayon and acetate, and synthetic fibers such as nylon, polyester, acrylic, vinylon, polyvinyl chloride, polyolefin, polyurethane, polyimide, and aramid. Further, cellulose produced by bacteria is a highly crystalline nanofiber, and is a material capable of producing a thin nonwoven fabric with high dimensional stability.

The pattern forming layer of the present invention is preferably cured by crosslinking (polymerization) before being decomposed by a laser from the viewpoint of improving the strength of the layer. In order to cure the layer, it is preferable to contain the polymerizable compound as described above in the layer. This is generally used as a technique for increasing the strength of a film in a negative (polymerization type) photosensitive material, and it is considered that the same effect is exhibited in the present invention.
This method is particularly effective when the pattern forming material is a flexographic printing plate precursor for laser engraving. By curing before laser engraving, there is an advantage that the relief formed after laser engraving becomes sharp and the sticking of engraving residue generated during laser engraving is suppressed.

The method of curing the layer is a means for causing a polymerization reaction of the polymerizable compound, such as heating the layer, irradiating with light, adding light or a thermal polymerization initiator to the layer and irradiating or heating the layer. It can be used without any particular restrictions.
Among them, as a method for curing, heating of the layer is preferable from the convenience of work. Any heating method such as an oven, a thermal head, a heating roll, or a laser beam can be applied for heating to cause crosslinking (polymerization) on the layer before laser decomposition. When temperature control is necessary, it can be carried out by controlling the temperature of an oven, a thermal head, a heating roll, or the like, or adjusting the intensity of the laser beam or the spot diameter. The heating temperature is preferably 40 to 250 ° C., more preferably 60 to 220 ° C., and still more preferably 80 to 200 ° C. from the viewpoint of the thermal stability of the coexisting organic compound.

The thickness of the pattern forming layer (the sum of the lower layer and the upper layer) is generally 0.0005 to 10 mm, preferably 0.005 to 7 mm.
The thickness when used for laser engraving (especially a flexographic printing plate precursor for laser engraving) can be arbitrarily set according to the purpose of use, but is preferably in the range of 0.05 to 10 mm, more preferably 0.1 to 7 mm. Range.
The ratio of the lower layer / upper layer in the layer thickness is preferably in the range of 30/70 to 95/5, more preferably in the range of 50/50 to 95/5, from the viewpoint of easy (high sensitivity) pattern formation. ~ 90/10 is particularly preferred.

  In some cases, a plurality of layers having different compositions may be stacked. As a combination of a plurality of layers, for example, a layer that can be engraved using a laser having an oscillation wavelength in the near-infrared region such as a YAG laser, a fiber laser, or a semiconductor laser is formed on the outermost surface. It is also possible to form a layer capable of laser engraving using an infrared laser such as a carbon dioxide laser or a visible / ultraviolet laser. When laser engraving is performed in this way, engraving can be performed using separate laser engraving equipment equipped with infrared laser and near infrared laser, and laser engraving equipment equipped with both infrared laser and near infrared laser can be used. It is also possible to use.

  In the present invention, a cushion layer made of a resin or rubber having cushioning properties can be formed between the support and the pattern forming layer, between the pattern forming layer, or between the pattern forming layer and the adhesive layer. When a cushion layer is formed between the support and the pattern forming layer, a method of attaching a cushion layer with an adhesive layer on one side with the adhesive layer side facing the support is simple. After the cushion layer is applied, the surface can be cut and polished for shaping. A simpler method is a method in which a liquid adhesive composition is applied on a support with a constant thickness and cured using light to form a cushion layer. In order to have cushioning properties, the hardness of the photocured cured product is preferably low. Moreover, you may contain a bubble in the photosensitive resin hardened | cured material layer which has cushioning properties.

<Laser engraving>
In laser engraving, an image to be formed is converted into digital data, and a laser device is operated using a computer to create a relief image on the pattern forming material.
As described above, the pattern forming material used for laser engraving is not particularly limited, but a flexographic printing plate precursor for laser engraving is particularly preferably used.
As the laser used for laser engraving, any material can be used as long as the pattern forming material can be patterned by laser ablation. A laser having an oscillation wavelength in the infrared or near-infrared region, such as a carbon dioxide laser, a YAG laser, a semiconductor laser, or a fiber laser, is preferable. In addition, ultraviolet lasers having an oscillation wavelength in the ultraviolet region, such as excimer lasers, YAG lasers converted to the third or fourth harmonic, and copper vapor lasers, can also be ablated to break the bonds of organic compound molecules. Yes, suitable for fine processing. A laser having an extremely high peak output such as a femtosecond laser can also be used. The laser may be continuous irradiation or pulse irradiation. In the flexographic printing plate precursor for laser engraving, a carbon dioxide laser and a YAG laser are preferably used.

  Laser engraving is carried out in an oxygen-containing gas, generally in the presence of air or an air stream, but can also be carried out in the presence of carbon dioxide or nitrogen gas. After engraving, the powdered or liquid substance (scum) generated on the relief image surface is irradiated with an aqueous cleaning agent by an appropriate method, for example, a method of washing with water containing a solvent or a surfactant, or a high pressure spray. It can be removed using a method, a method of irradiating with high-pressure steam, a method of wiping with a cloth or the like.

  The composition of the present invention is a relief image, a stamp / stamp, a design roll for embossing, a relief image for patterning insulators, resistors and conductor pastes used for creating electronic parts, a relief image for molds of ceramic products It can be used for various applications such as relief images for displays such as advertisements and display boards, prototypes and mother molds of various molded products.

  In addition, the surface tack can be reduced by forming a modified layer on the surface of the pattern image after laser engraving. Examples of the modified layer include a film treated with a compound that reacts with the surface hydroxyl group of a pattern image such as a silane coupling agent or a titanium coupling agent, or a polymer film containing porous inorganic particles. A widely used silane coupling agent is a compound having in its molecule a functional group highly reactive with the hydroxyl group on the surface of the pattern image. Examples of such a functional group include a trimethoxysilyl group and a triethoxysilyl group. Group, trichlorosilyl group, diethoxysilyl group, dimethoxysilyl group, dimonochlorosilyl group, monoethoxysilyl group, monomethoxysilyl group, monochlorosilyl group. Further, at least one of these functional groups exists in the molecule and is immobilized on the surface by reacting with the surface hydroxyl group of the pattern image. Further, the compound constituting the silane coupling agent of the present invention includes, as a reactive functional group in the molecule, an acryloyl group, a methacryloyl group, an active hydrogen-containing amino group, an epoxy group, a vinyl group, a perfluoroalkyl group, and a mercapto group. Those having at least one selected functional group or those having a long-chain alkyl group can also be used. When the coupling agent molecule immobilized on the surface has a polymerizable reactive group, the film should be made stronger by immobilizing on the surface and then irradiating with light, heat or electron beam to crosslink. You can also.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples.

<Synthesis of Specific Polymerizable Compound M-1>
In a 2 L three-necked flask equipped with a condenser, bisphenol A (manufactured by Tokyo Chemical Industry, 228.3 g), Karenz MOI (manufactured by Showa Denko, 2-methacryloyloxyethyl isocyanate, 313.5 g) and tetrahydrofuran (manufactured by Wako Pure Chemical Industries, 700 g) And heated and stirred at 50 ° C. under a nitrogen stream to dissolve uniformly. Then, after cooling to 30 ° C., Neostan U-600 (manufactured by Nitto Kasei, bismuth catalyst, 0.1 g) was added to the place where the previous solution was being stirred, and heated and stirred at 60 ° C. for 6 hours. After allowing to cool to room temperature, tetrahydrofuran was distilled off from the reaction solution under reduced pressure to obtain a slightly viscous white solid. The resulting viscous white solid was mixed with 1 L of hexane to wash the solid. Thereafter, the mixture was filtered and dried under reduced pressure at room temperature for 5 hours to obtain 486.5 g of the target polymerizable compound M-1 as a white solid. Identification of the target product was performed by ¹ H-NMR spectrum, HPLC (purity of the target product was 99.5%), IR
Performed in the spectrum.

<Synthesis of Specific Polymerizable Compound M-2>
To a 2 L three-necked flask equipped with a condenser, bis (4-isocyanatophenyl) methane (Wako Pure Chemical Industries, 250.3 g), 2-hydroxyethyl methacrylate (Wako Pure Chemical Industries, 262.9 g) and tetrahydrofuran ( 750 g) manufactured by Wako Pure Chemical Industries, Ltd. was added and dissolved uniformly by heating and stirring at 50 ° C. under a nitrogen stream. Then, after cooling to 30 ° C., Neostan U-600 (manufactured by Nitto Kasei Co., Ltd., 0.05 g) was added to the stirring solution, and the mixture was heated and stirred at 60 ° C. for 5 hours. After allowing to cool to room temperature, tetrahydrofuran was distilled off from the reaction solution under reduced pressure to obtain a slightly viscous white solid. The resulting viscous white solid was mixed with 1.2 L of hexane to wash the solid. Thereafter, the mixture was filtered and dried under reduced pressure at room temperature for 3 hours to obtain 475.5 g of the target polymerizable compound M-2 as a white solid. Identification of the desired product was performed by ¹ H-NMR spectrum, HPLC (purity of the desired product was 99.2%), and IR spectrum.
Other specific polymerizable compounds used in Examples were also synthesized in the same manner as described above.

[Examples 1 to 10 and Comparative Examples 1 and 2]
<Evaluation of thermophysical properties>
After heating and stirring 10 g of each polymerizable compound in 100 ml of tetrahydrofuran at 60 ° C. for 1 hour, the solution was poured into a glass petri dish and tetrahydrofuran was naturally evaporated to obtain a composition sample.
If necessary, the solution was subjected to ultrasonic irradiation (15 minutes at room temperature) before heating and stirring at 60 ° C. for 1 hour.
<Measurement of thermophysical properties>
The thermal decomposition start temperature was measured under the following conditions. Here, the “thermal decomposition start temperature” is a temperature at which mass reduction due to thermal decomposition of a sample starts when the sample is heated.
<Equipment>
・ Thermal mass measuring device (manufactured by TA Instruments Japan Co., Ltd.)
<Measurement conditions>
-10 mg of a sample was weighed and heated from 30 ° C to 500 ° C at a temperature rising rate of 20 ° C / min.

  The results are shown in Table 1.

  The structures of the polymerizable compounds CM-1 and CM-2 used in Comparative Examples 1 and 2 are as follows.

  As compared with the comparative example, it was found that the example had a lower thermal decomposition starting temperature and was excellent in thermal decomposability.

[Examples 11 to 27 and Comparative Examples 3 to 5]
<Evaluation of laser degradability>

  In forming the relief layer shown in Table 2 on the support, first, the film obtained in the previous example was cut into small pieces with scissors, a polymerizable compound and an initiator were tested at a material temperature of 100 ° C. Mix in a room kneader and cast onto uncoated 125 μm thick PET film. After drying in air at room temperature for 48 hours and then at 90 ° C. for 1.5 hours, the resulting relief layer (layer thickness 1000 μm) was coated with a mixture of adhesion-forming components, a second 125 μm thick PET film The sample was prepared by laminating (peeling) the uncoated 125 μm thick PET film.

<Light irradiation for crosslinking specific polymerizable compound>
The entire surface was exposed (exposure amount: 4000 mJ / cm ² ) with an ultrahigh pressure mercury lamp (manufactured by Oak Co., Ltd.) having a light source in the ultraviolet region.

The depth when the above relief layer was laser engraved was used as an index of laser decomposability. When laser irradiation is performed with the same energy, the deeper the sculpture, the higher the laser decomposability. In the case of a carbonic acid (CO ₂ ) laser, an evaluation experiment of the engraving depth with a laser was performed using a “high-quality CO ₂ laser marker ML-9100 series (manufactured by KEYENCE)” at 12 W and a line speed of 10 cm / sec. In the case of the Nd-YAG laser, 10 squares of 1 cm × 1 cm were engraved using “MARKER ENGINE 3000 (Laser Front Technologies Co., Ltd.)” at 10 W and a line speed of 10 cm / sec. The laser decomposition sensitivity was measured by engraving depth using a high-speed, high-precision CCD laser displacement meter: LK-G35 manufactured by Keyence Corporation. The measurement was performed on all 10 engraved pieces, and the average value was adopted. Similarly, the resolution (edge shape of the engraving portion) was also observed using a high-speed, high-precision CCD laser displacement meter: LK-G35 manufactured by Keyence Corporation.

  The results are shown in Table 3.

  From Table 3, the sculpture depth was deeper in the example than in the comparative example due to the effect of improving thermal decomposition. This means that the engraving sensitivity has been improved.

Claims (8)

(A) A resin composition for laser decomposition containing a polymerizable compound having a molecular weight of 100 to 3000 having a urethane bond represented by the following general formula (1) in the molecule, and (B) a binder polymer.

In General Formula (1), R ₁ and R ₂ each independently represent a divalent organic group. However, at least one of R ₁ and R ₂ is an aromatic group.   The resin composition for laser decomposition according to claim 1, wherein the binder polymer (B) is a polyurethane resin and / or an acrylic resin.   The resin composition for laser decomposition according to claim 1, wherein the (B) binder polymer is a polyurethane resin. 3. The resin composition for laser decomposition according to claim 2, wherein the binder polymer (B) is a polyurethane resin and / or an acrylic resin having a urethane bond represented by the following general formula (1) in the molecule. object.

In General Formula (1), R ₁ and R ₂ each independently represent a divalent organic group. However, at least one of R ₁ and R ₂ is an aromatic group.   The resin composition for laser decomposition according to any one of claims 1 to 4, wherein the resin composition for laser decomposition further contains a polymerizable compound other than the component (A).   A resin composition for laser decomposition, wherein the resin composition for laser decomposition according to any one of claims 1 to 5 is crosslinked with light or heat.   A pattern forming material comprising a layer made of the resin composition for laser decomposition according to claim 1 on a support.   The pattern forming material according to claim 7, wherein the pattern forming material is a laser engraving type flexographic printing plate precursor.