JP5223983B1 - Rotating body manufacturing apparatus and rotating body manufacturing method - Google Patents

Abstract

An object of the present invention is to suppress defective application when starting application of a coating liquid.
A photoreceptor manufacturing apparatus 10 includes a slit die 26 for discharging the coating liquid L _T from the discharge port 26A on the outer circumferential surface of the base body 14, a lid member which forms a cleaning chamber 64 when cover at least the discharge port 26A and 62, an introduction unit 60 to discharge while introducing a cleaning liquid L _S into the cleaning chamber 64, and a control unit 50, a. Here, the control unit 50 performs control to introduction unit 60 to discharge the application liquid L _T from the discharge opening 26A prior to stopping the cleaning chamber 64 to eject the application liquid L _T into the washing chamber 64 . Thus, the application liquid L _T that generate dilute the cleaning liquid L _S in the vicinity of the discharge port 26A is ejected, the concentration decrease of the coating solution L _T in the discharge port 26A is suppressed, the application of the next coating liquid L _T Application failure when starting can be suppressed.
[Selection] Figure 1

Description

  The present invention relates to a rotating body manufacturing apparatus and a rotating body manufacturing method.

  The liquid ejecting apparatus disclosed in Patent Document 1 is in contact with an ejection head having a first ejection nozzle array that ejects ink containing a colorant and a second ejection nozzle array that ejects cleaning liquid, and a nozzle formation surface of the ejection head. A cap that forms a sealed space, a suction unit that performs suction from a suction port of the sealed space, and an atmosphere release unit that opens the atmosphere from the atmosphere communication port of the sealed space. In the liquid ejecting apparatus disclosed in Patent Document 1, the second ejection nozzle row is closer to the atmosphere communication port than the first ejection nozzle row.

  The coating apparatus of Patent Document 2 includes a pump, a flow meter that measures the flow rate of the coating liquid sent by the pump, and a die head that coats the coating liquid whose flow rate is actually measured by the flow meter. And in the coating apparatus of patent document 2, while setting the upper limit and the lower limit which can obtain the stable coating film thickness about the flow volume of a coating liquid, the measured flow volume by a flowmeter is set to the upper limit and the lower limit. If the value is within the range, the feedback control of the pump drive amount is stopped.

JP 2011-148132 A JP 2003-62513 A

  An object of the present invention is to obtain a rotating body manufacturing apparatus and a rotating body manufacturing method capable of suppressing application failure when starting application of a coating liquid.

The rotating body manufacturing apparatus according to claim 1 of the present invention is provided on the outer peripheral surface of a rotating cylindrical base body, and is provided with a discharge means for discharging the coating liquid from the discharge port, and is movable relative to the discharge port. A lid member that forms a cleaning chamber by covering the discharge port when the discharge means is not performing the discharge operation of the coating liquid; and a cleaning liquid that is introduced into the cleaning chamber when the lid member covers the discharge port Introducing means for discharging the cleaning liquid from the cleaning chamber and introducing the cleaning liquid into the cleaning chamber by operating the introducing means without operating the discharge means, and then the introducing means stops the introduction of the cleaning liquid. Control means for controlling the discharge means to discharge the coating liquid from the discharge port into the cleaning chamber prior to the operation.

According to a second aspect of the present invention, there is provided a rotating body manufacturing apparatus that discharges a coating liquid from a discharge port onto an outer peripheral surface of a rotating cylindrical substrate, and finishes discharging the coating liquid from the discharge port to the substrate. It was aspirated, and discharge means is not performed aspiration after the coating liquid is discharged to the discharge port or we wash chamber, relatively movable provided for the discharge port, the discharge the discharge means of the coating liquid a lid member forming the cleaning chamber with the cover the discharge ports when not performing an operation, from the washing chamber as well as introducing the cleaning solution into the cleaning chamber when said lid member covers the discharge port Introduction means for discharging the cleaning liquid; control means for controlling the discharge means to operate and discharge the coating liquid from the discharge port before the introduction means stops the introduction of the cleaning liquid; and The coating liquid supplied to the discharge means Provided the flow path, having a suction means for sucking the coating liquid from said discharging means.

According to a third aspect of the present invention, there is provided a method of manufacturing a rotating body, the mounting step of mounting the lid member on the discharge port using the rotating body manufacturing apparatus according to claim 1 or 2, and the mounting step. An introduction step of operating the introduction unit later to introduce and discharge the cleaning liquid into the cleaning chamber, and applying the discharge unit to the cleaning chamber by operating the discharge unit before the introduction unit stops operating. A discharge step for discharging the liquid; a retraction step for removing the cleaning liquid from the cleaning chamber and retracting the lid member from the discharge port; and a film formation step for forming a film by discharging the coating liquid onto the rotating substrate. Have.

  According to the first aspect of the present invention, compared to a configuration in which the application liquid is not discharged from the discharge port into the cleaning chamber, it is possible to suppress a defective application when the application of the application liquid is started.

  According to the second aspect of the present invention, it is possible to suppress the thinning of the coating liquid by sucking the cleaning liquid, as compared with the configuration in which the suction is performed after the coating liquid is discharged from the discharge port into the cleaning chamber.

  According to the third aspect of the present invention, compared to a method in which the application liquid is not discharged into the cleaning chamber before the introduction unit stops its operation, it is possible to suppress application failure when the application of the application liquid is started.

1 is an overall configuration diagram schematically showing a photoconductor manufacturing apparatus according to a first embodiment of the present invention. It is a block diagram which shows typically the moving unit which moves the slit die which concerns on 1st Embodiment of this invention. It is a lineblock diagram showing typically the lid moving unit which moves the lid member concerning a 1st embodiment of the present invention. It is a setting screen of each item in the control unit which concerns on 1st Embodiment of this invention. It is a timing chart of each item concerning a 1st embodiment of the present invention. (A), (B), (C) It is process drawing which shows the movement of the slit die which concerns on 1st Embodiment of this invention, and the application | coating operation | movement of a coating liquid. (A) As a comparative example, it is a development view showing an ideal state of the undercoat layer of the photoreceptor formed on the substrate. (B), (C) As a comparative example, it is a development view showing a state in which irregularities are formed at the coating start end and coating end of the undercoat layer of the photoreceptor formed on the substrate. (A) and (B) are development views showing an ideal state of the undercoat layer of the photoreceptor formed on the substrate as a comparative example. (C), (D) As a comparative example, it is a developed view showing a state in which the coating start end and coating end of the undercoat layer formed on the substrate are thinner than the central portion. (A) It is a schematic diagram which shows the space | interval of the base | substrate which concerns on 1st Embodiment of this invention, and the discharge port of a slit die, and the film thickness of an undercoat layer. (B) It is a schematic diagram which shows the state which piled up the application | coating start end and application | coating end of the undercoat layer of the photoconductor which concern on 1st Embodiment of this invention. (A), (B), (C), (D), (E) It is process drawing which shows the movement of the cover member which concerns on 1st Embodiment of this invention, and application | coating operation | movement of a coating liquid. (A), (B), (C), (D), (E), (F), (G), (H) The cleaning operation of the discharge port of the slit die according to the first embodiment of the present invention is shown. It is process drawing. FIG. 2 is a cross-sectional view illustrating a layer configuration of the photoreceptor according to the first embodiment of the present invention. It is a whole block diagram which shows typically the manufacturing apparatus of the photoreceptor which concerns on 2nd Embodiment of this invention. (A), (B), (C) It is process drawing which shows the movement of the base | substrate which concerns on 2nd Embodiment of this invention, and the application | coating operation | movement of a coating liquid.

(First embodiment)
An example of a rotating body manufacturing apparatus and a rotating body manufacturing method according to the first embodiment of the present invention will be described.

(overall structure)
FIG. 1 shows a photoconductor manufacturing apparatus 10 that manufactures a photoconductor 12 (see FIG. 12) as an example of a rotary body, which will be described later, as an example of a rotary body manufacturing apparatus according to the first embodiment. Photoreceptor manufacturing apparatus 10 includes a coating unit 20 for applying a coating liquid L _T on the outer circumferential surface of the cylindrical body 14, an example of a controller that controls the application (discharge) of the coating solution from the coating unit 20 to the base 14 a control unit 50 as has the introduction unit 60 as an example of means for introducing into the cleaning chamber 64 to be described later cleaning liquid L _S, a. The control unit 50 also controls the introduction operation of the cleaning liquid L _S by the introduction unit 60.

Coating unit 20 includes a rotating unit 22 for rotating the substrate 14, the slits and the discharge unit 24 as an example of a discharge portion for discharging the coating liquid L _T that is applied to the outer circumferential surface of the base 14, described later, of the discharge unit 24 Die 26 and a moving unit 40 as an example of a moving means that moves the base 14 in a direction approaching and separating relatively, and the outer peripheral surface of the base 14 while the base 14 makes one turn (not limited to 360 °). and it is configured so as to circumferentially coating a coating liquid L _T.

  The rotating portion 22 includes a support portion 22A that is attached to a pedestal (not shown) and rotatably supports the base body 14, and a motor 22B that rotates the base body 14 in the circumferential direction. The motor 22B is connected to a power source (not shown) and the control unit 50, and rotates by energization from the power source. The rotation operation (ON, OFF) of the motor 22B is controlled by the control unit 50. In the control unit 50, the rotation speed (set rotation speed) and rotation time (set time) of the motor 22B are set. .

Discharge unit 24 includes a slit die 26 as an example of a discharging means for discharging the coating liquid L _T on the outer circumferential surface of the base body 14, a reservoir tank 28 which coating liquid L _T is stored inside, and the bottom of the storage tank 28 a supply pipe 32 as an example of the connected flow path and the slit die 26, a supply pump 30 for supplying (feeding) a coating liquid L _T in the feed pipe 32 to the slit die 26, the reservoir from the supply pipe 32 the tank 28 a return pipe 34 for returning the coating liquid to a three-way valve 36 for switching between supply pipe 32 and return pipe 34, suction means for sucking the coating liquid L _T when stopping the discharge of the coating liquid L _T from the discharge unit 24 A suction part 38 as an example.

  Here, in FIG. 1, when the base body 14 is viewed in the rotational axis direction, the X direction is the right direction, the −X direction is the left direction, the Y direction is the upward direction, the −Y direction is the downward direction, the Z direction is the depth direction, − The Z direction corresponds to the front direction. And “x” in “○” in the figure means an arrow (depth direction) from the front to the back, and “•” is written in “○” in the figure. Tana means an arrow from the back to the front (front direction).

  The slit die 26 has a Z-direction as a longitudinal direction and a plurality of discharge ports 26 </ b> A opened on the X-direction side (side facing the outer peripheral surface of the substrate 14), and a plurality of slit dies 26 are arranged at intervals in the Z-direction and the X-direction A branch pipe 26B connected to the discharge port 26A as an axial direction, a manifold 26C connected to the opposite side to the discharge port 26A side of the plurality of branch pipes 26B and having the Z direction as an axial direction, a manifold 26C and a supply pipe 32 And a connecting pipe 26D for connecting the two. The length of the discharge port 26A in the Z direction is substantially the same as the length of the undercoat layer 12A (see FIG. 12) of the photoreceptor 12 in the Z direction.

The storage tank 28 has a return pipe 34 connected to the upper part in the Y direction, and one end of the supply pipe 32 connected to the lower part in the Y direction. Thus, the storage tank 28, together with the application liquid L _T flowing through the return pipe 34 is stored inside, so the coating liquid L _T to the supply pipe 32 is supplied from the bottom (Y direction bottom) Yes.

Feed pump 30, supply line 32 is attached to (the side closer to the storage tank 28), the power supply actuated by energization from (not shown) (ON), the application of the supply pipe 32 liquid L _T a slit die 26 Supply (pumping). In addition, ON / OFF of the supply pump 30 is switched by the control unit 50. The supply pump 30 is capable of changing the discharge pressure of the coating liquid _{L T 0, P1, P2,} P3 and (P1>P2>P3> 0 ) ( see FIG. 5). Here, the coating liquid L _T are three-way valve 36 continues to flow is circulated in a closed state of the downstream side of the supply pipe 32. This is because when the supply pump 30 is stopped, the set pressure is not reached immediately even when the operation is started.

The three-way valve 36 is adapted to be switched destination of flow of the application liquid L _T by the control unit 50, the supply pipe 32 side together with the back closes the pipe 34 side when applying the coating solution L _T to the substrate 14 ( downstream) opening and closing the supply pipe 32 side (downstream side) with the return opens the pipe 34 side when not applying a coating solution L _T to the substrate 14.

As shown in FIG. 6A, the suction portion 38 has a main body 38A provided in the supply pipe 32, and a piston cylinder 38B (single-axis robot cylinder) provided movably in the main body 38A. . A partition wall 38C for partitioning the internal space is provided in the main body 38A, and a through hole 38D is formed in the partition wall 38C. The operation of the piston cylinder 38B is controlled by the control unit 50. Incidentally, the suction unit 38, the application liquid _{L T} is aspirated after the ejection operation of the application liquid _{L T} to the substrate 14 from the discharge port 26A, the cleaning chamber 64 to the coating liquid _{L T} is described later from the discharge port 26A (see FIG. 1) It is controlled by the control unit 50 so as not to perform suction after being discharged into the inside.

Further, at one end of the piston cylinder 38B, a widened portion 38E that is widened in the radial direction with a size capable of closing the through hole 38D is formed. Then, the through-hole 38D to move the widening section 38E at the start of coating is opened, the coating liquid L _T becomes possible to supply to the slit die 26 side, the piston cylinder 38B is in the closed direction of the through hole 38D at the coating end by moving the coating liquid L _T is sucked into the suction unit 38 side. As an example, the cylinder stroke of the piston cylinder 38B is not less than 5 mm and not more than 30 mm, and the suction amount (suck back amount) by the suction portion 38 is not less than 0.5 ml (milliliter) / times and not more than 3.0 ml / times. . The liquid feed pressure acting on the coating liquid _{L T} in the supply pipe 32 is a 0.1MPa or 0.5MPa or less, contains discharge pressure within the range P1, P2, P3 (see FIG. 5) It is.

  As shown in FIG. 2, the moving unit 40 includes an X stage 44 that moves in the X direction or −X direction by the first motor 42, and a Y direction or −Y direction by the second motor 46 that is fixed on the X stage 44. And a Y stage 48 that moves to the center. A slit die 26 is fixed on the Y stage 48. Since the height of the Y stage 48 is adjusted in advance, only the X stage 44 is basically moved when the photosensitive member 12 (see FIG. 12) is manufactured.

  As an example, the X stage 44 has a configuration in which a ball screw 43 is arranged between two shafts (not shown) arranged at intervals, and the first motor 42 rotates the ball screw 43 forward and backward. It can move in the X and -X directions by rotating. Similarly, as an example, the Y stage 48 has a configuration in which a ball screw 47 is disposed between two shafts (not shown) arranged at intervals, and the second motor 46 rotates the ball screw 47. By doing so, it is possible to move in the Y direction and the -Y direction. The first motor 42 and the second motor 46 are connected to the control unit 50 and operate according to instructions from the control unit 50.

As shown in FIG. 3, the photosensitive member manufacturing apparatus 10 includes a lid member 62 which forms a cleaning chamber 64 covers the discharge port 26A when the slit die 26 is not performing ejection operation of the application liquid L _T, a lid member And a lid moving unit 70 as an example of a lid moving means for moving 62 in the direction of approaching and separating from the slit die 26.

  The lid moving unit 70 includes a Y stage 74 that moves in the Y direction or the −Y direction by the third motor 72, and an X stage 78 that moves in the X direction or the −X direction by the fourth motor 76 fixed on the Y stage 74. And have. A lid member 62 is fixed on the X stage 78. Thereby, the lid member 62 can be moved relative to the discharge port 26A of the slit die 26, and forms a cleaning chamber 64 at least when covering the discharge port 26A.

  As an example, the Y stage 74 has a configuration in which a ball screw 73 is arranged between two shafts (not shown) arranged at intervals, and the third motor 72 rotates the ball screw 73. It is movable in the Y direction and -Y direction. Similarly, the X stage 78 has, for example, a configuration in which a ball screw 77 is disposed between two shafts (not shown) arranged at intervals, and the fourth motor 76 rotates the ball screw 77. By doing so, it is possible to move in the X direction and the -X direction. The third motor 72 and the fourth motor 76 are connected to the control unit 50 (see FIGS. 1 and 2) and operate according to instructions from the control unit 50.

  As shown in FIG. 1, the lid member 62 is a box-shaped member whose longitudinal direction is the Z direction. When viewed in the Z direction, the lid wall 62 </ b> A extends in the X direction, and the X direction end of the bottom wall 62 </ b> A. The side wall 62B stands upright in the Y direction, and the upper wall 62C extends in the −X direction from the Y direction end of the side wall 62B. The lid member 62 is open on the −X direction side to form an opening 62D. In addition, a closing member 63 that contacts the slit die 26 and seals the cleaning chamber 64 is attached to the peripheral portion of the opening 62D. The closing member 63 is made of rubber, and is deformed when the slit die 26 and the lid member 62 come into contact with each other so as to close the gap between the slit die 26 and the lid member 62.

  Further, a plurality of lid members 62 are formed at intervals in the Z direction at the center in the X direction of the bottom wall 62A, and a plurality of through holes 62E penetrating in the Y direction (only one portion is shown and the rest are not shown), The upper wall 62C has a plurality of through holes 62F (only one is shown and the rest are not shown) that are formed at intervals in the Z direction at the center in the X direction and penetrate in the Y direction.

Introduction unit 60 includes a storage tank 61 for cleaning liquid L _S is stored inside, bottom and feed pipe 65 is connected to the through-hole 62F of the cover member 62 of the storage tank 61 (the same number as the through-hole 62F), supplied switching a supply pump 66 for supplying the cleaning liquid _{L S} in the tube 65 into the cleaning chamber 64 (pumped), a return pipe 67 for returning the cleaning liquid _{L S} from the supply pipe 65 to the storage tank 61, and a return pipe 67 and the supply pipe 65 It has a three-way valve 68 and a return pipe 69 (the same number as the through-hole 62E) connected to the through-hole 62E and the storage tank 61. A manifold (not shown) having a longitudinal direction in the Z direction is provided at the end of the supply pipe 65 on the lid member 62 side and the end of the return pipe 69 on the lid member 62 side. A plurality of supply pipes 65 and return pipes 69 are branched by this manifold at intervals in the Z direction.

Storage tank 61, together with the cleaning liquid L _S flowing through the return tube or return tube 69 67 is stored inside, so the cleaning liquid L _S is supplied to the supply pipe 65 from the bottom (Y direction bottom) Yes.

Feed pump 66 is attached to the storage tank 61 side of the supply pipe 65, a power supply actuated by energization from (not shown) (ON), fed (pumped cleaning liquid L _S in the supply pipe 65 to the lid member 62 ) In addition, ON / OFF of the supply pump 66 is switched by the control unit 50.

The three-way valve 68 is adapted to be switched destination of flow of the cleaning liquid L _S by the control unit 50, the supply pipe 65 side (downstream with the closes the return pipe 67 side when supplying cleaning liquid L _S to closure member 62 opening the side), and closes the supply pipe 65 side while opening the return tube 67 side when not supplying the cleaning liquid L _S to closure member 62 (the downstream side).

Introducing unit 60, when the lid member 62 covers the discharge port 26A, is introduced a cleaning liquid L _S in the cleaning chamber 64 via the supply pipe 65 by the supply pump 66, via a return pipe 69 from the cleaning chamber 64 It is adapted to discharge the cleaning liquid L _S to the storage tank 61 Te. The through-hole 62F in the lid member 62, 62E are arranged in the -Y direction (vertically downward direction), the washing liquid _{L S} has become the cleaning chamber 64 to flow in the -Y direction. This, in passing a cleaning liquid L _S in the -X direction, is because the cleaning liquid L _S becomes easy to enter the discharge port 26A of the slit die 26.

(Configuration of control unit)
As shown in FIG. 1, the control unit 50 has a CPU (not shown) that controls the entire photoreceptor manufacturing apparatus 10, a memory (not shown) used for storing programs and works (not shown), and various parameters are set. And a liquid crystal panel 52 (see FIG. 4) as an example of the setting means. Then, the control unit 50 controls the rotation unit 22 and the discharge unit 24, the slit die 26 of the discharge unit 24 to start the discharge of the coating liquid L _T from close to the substrate 14, the coating liquid from a slit die 26 L _The program setting is such that the slit die 26 is moved away from the substrate 14 when the discharge of _T is stopped.

Further, the control unit 50, the discharge unit 24 while rotating the substrate 14 at the rotating portion 22 by ejecting the coating liquid L _T is applying a coating solution L _T to the substrate 14, discharged by the discharge unit 24 coating liquid L _The discharge unit 24 is based on either the elapsed time from the start of discharge (application) or the rotation angle of the substrate 14 so that the application start end EA of _T and the application end EB (see FIG. 9B) overlap. the discharge of the coating liquid L _T from stop, and has a program set to rotate the substrate 14 at a plurality of times with the coating solution L set time or setting rotational speed discharge after stopping the _T from the discharge unit 24.

Further, the control unit 50, at the start of coating, middle coating, in order of time of application termination, the discharge pressure of the coating solution L _T from the slit die 26 by the supply pump 30 is in the program set to be low. As an example, the control unit 50, the discharge pressure of the coating liquid _{L T} has been at the start of the coating P1, the middle coating P2, and the coating at the end P3 (P1>P2> P3) and lower program settings (Figure 5 reference).

In addition, the control unit 50 has a program set for sucking the coating liquid L _T the suction portion 38 of the discharge unit 24 when the discharge stop condition of the application liquid L _T is satisfied. That is, the control unit 50, to suck the application liquid _{L T} from the discharge opening 26A of the slit die 26 after the ejection operation of the application liquid _{L T} to a substrate 14.

The conditions of the discharge halt of the application liquid L _T and is set such that the coating start end EA of the applied coating liquid L _T by the coating unit 20 and coating finish end EB (see FIG. 9 (B)) overlaps Further, it depends on one of the elapsed time Δt from the discharge start time point and the rotation angle Δθ of the substrate 14 from the discharge start position. The elapsed time Δt is set in consideration of the error α, and the rotation angle Δθ is set in consideration of the error β. Here as an example, the coating solution L _T is adapted to be stopped supplied upon elapse of the elapsed time Δt from the coating start time.

Further, the control unit 50 operates the slit die 26 (supply pump 30) prior to the introduction unit 60 stops the supply of the cleaning liquid L _S, the application liquid L _T from the discharge opening 26A into the cleaning chamber 64 It is a program setting for controlling the ejection. Further, the control unit 50, the coating liquid L _T is then discharged into the cleaning chamber 64 is a suction unit 38 has a program set to perform control so as not to perform suction from the discharge port 26A.

  As shown in FIG. 4, a parameter setting screen is displayed on the liquid crystal panel 52. As an example, the liquid crystal panel 52 includes a workpiece diameter [mm] of the substrate 14 shown in FIG. 1, a vertical position [mm] of the slit die 26 (distance in the Y direction from the reference position), and a longitudinal position [mm] of the slit die 26. (X-direction distance from reference position), coating start angle [°] of substrate 14 (rotation start angle), coating stop angle [°] of substrate 14 (rotation stop angle), separation angle of slit die 26 with respect to substrate 14 [ [°] (angle in the moving direction with respect to the X direction) and options of the operation delay time [second (sec)] of the three-way valve 36 (valve) are displayed in a matrix. Specifically, five values are displayed for each parameter, and the selected value is displayed in a color different from the other values. Note that the display of specific numerical values is omitted.

  In addition, as shown in FIG. 5, a timing chart for various controls is set in the control unit 50. Note that the times t1 to t12 shown in the drawing are described as an example, and may be set at different times. The timing chart of the introduction unit 60 (see FIG. 1) is not shown.

  The apparatus operation of the photoconductor manufacturing apparatus 10 (see FIG. 1) is set to be activated (ON) at time t1, held (continued) until time t2, and stopped (OFF) at time t12. . In addition, it represents that it is the later time, so that the number of t is large.

  The height position of the slit die 26 (see FIG. 1) is moved from the reference position P0 to the position PH from the time point t1 to the time point t2, held at the position PH from the time point t2 to the time point t8, and from the time point t8 to the time point t10. The position is set to move from the position PH to the reference position P0. The front and rear positions of the slit die 26 move from the reference position P0 to the position PF from time t1 to time t2, hold at the position PF from time t2 to time t7, and from the position PF from time t7 to time t8. It is set to move to position P0.

  The number of rotations (corresponding to the rotation speed) of the motor 22B (see FIG. 1) increases from 0 to NH from time t1 to time t3, and is held at NH from time t3 to time t7. It decreases from NH to NL until time t9. Further, the rotational speed per unit time of the motor 22B is held at NL from time t9 to time t11, and is set to decrease from NL to 0 from time t11 to time t12. Note that the base body 14 (see FIG. 1) rotates at one rotation + Nα (Nα <1) from time t3 to time t7, and the base body 14 rotates a plurality of times from time t9 to time t11.

  The rotation angle of the base 14 increases from 0 ° to 360 ° from time t4 to time t7. That is, the base 14 is set to rotate once from the time t4 to the time t7.

The supply pump 30 (see FIG. 1) operates continuously regardless of the time point t. In addition, the three-way valve 36 opens (ON) the downstream side of the supply pipe 32 at time t4, maintains (continues) the open state until time t7, and closes (OFF) the downstream side of the supply pipe 32 at time t7. It is set. Then, the discharge pressure of the coating solution _{L T} from the discharge port 26A by the supply pump 30 (see FIG. 1) is 0 to time t4, from time t4 to time t5, P1, from time point t5 to time point t6 P2, the time point t6 To time t7 is set to P3, and after time t7 is set to 0. As described above, P1>P2> P3. Further, when the film thickness d (see FIG. 9A) before drying of the undercoat layer 12A (see FIG. 12) is obtained, the (normal) discharge pressure is P2.

(Configuration of photoconductor)
Next, the configuration of the photoconductor 12 manufactured by the photoconductor manufacturing apparatus 10 will be described.

  As shown in FIG. 12, the photoreceptor 12 includes a substrate 14, an undercoat layer 12A formed on the outer peripheral surface of the substrate 14, a charge generation layer 12B formed on the outer peripheral surface of the undercoat layer 12A, And a charge transport layer 12C formed on the outer peripheral surface of the charge generation layer 12B. Although illustration and description are omitted in the present embodiment, a protective layer may be formed on the outer peripheral surface of the charge transport layer 12C.

  The base 14 has conductivity. As an example of the material of the substrate 14, a metal such as aluminum, stainless steel, or nickel can be used, and a suitable material is selected according to the application. As the substrate 14 of the photoreceptor 12, aluminum is generally used. However, in the case of aluminum, the surface is easily scratched, so that the surface is preferably plated with nickel or the like.

  The undercoat layer 12A is made of, for example, vinyl acetate resin, urethane resin, polyvinyl acetal resin, alcohol-soluble nylon resin, and copolymers thereof, or curable metal organic compounds (for example, zirconium alkoxide compound, titanium alkoxide compound, silane coupling). A layer formed by coating a single agent or a mixture of a plurality of agents. You may disperse | distribute powder, such as a zinc oxide and a titanium oxide, as needed. Zinc oxide and titanium oxide are dispersed for the purpose of improving electrical characteristics and light scattering properties. As an example, 30% by weight is added to the solid content of the undercoat layer 12A. Moreover, the particle diameter of zinc oxide is 4 micrometers as an example.

The coating liquid L _T (see FIG. 1) constituting the undercoat layer 12A is obtained by adding a fine powder (including zinc oxide) to a dispersion medium in which a resin component is dissolved and performing a dispersion treatment. As a method for dispersing the added fine powder in the resin, methods such as a roll mill, a ball mill, a vibration ball mill, an attritor, a sand mill, a colloid mill, and a paint shaker can be used. In this way, using a coating liquid L _T obtained, will form an undercoat layer 12A of the photosensitive member 12, the thickness of the undercoat layer is preferably 0.1μm or more 10μm or less.

  The charge generation layer 12B (CGL (Carrier Generation Layer)) is formed by coating a charge generation agent (CGM (Carrier Generation Material)) in a binder resin (for example, polyvinyl butyral). Examples of CGM include bisazo pigments, azurenium, squalium, copper phthalocyanine, gallium phthalocyanine, and hydroxygallium phthalocyanine. The thickness of CGL is usually 0.1 μm or more and 1 μm or less.

  The charge transport layer 12C (CTL (Carrier Transport Layer)) is formed by coating a charge transport agent (CTM (Carrier Transport Material)) with a binder resin (for example, polycarbonate, polyarylate, polymethyl methacrylate, polyester, etc.). Is done. Examples of CTM include benzidine compounds and triphenylamine compounds. The thickness of the CTL is preferably 10 μm or more and 50 μm or less.

  Here, examples of the solvent (dispersion medium) in each coating solution for forming the undercoat layer 12A, the charge generation layer 12B, and the charge transport layer 12C include aromatic hydrocarbons such as benzene, toluene, chlorobenzene, and acetone. , Ketones such as 2-butanone, halogenated aliphatic hydrocarbons such as methylene chloride, chloroform and ethylene chloride, cyclic or linear ethers such as tetrahydrofuran, dioxane, ethylene glycol and diethyl ether, or mixed solvents thereof Is used. The solvent is preferably slower than one that dries quickly, and preferably has a solvent dry amount of 5% or less even when left at room temperature for 1 minute to 5 minutes.

In this embodiment, as an example, the application of the coating liquid L _T (see FIG. 1) by the photoreceptor manufacturing apparatus 10 (see FIG. 1) when forming the undercoat layer 12A on the outer peripheral surface of the substrate 14 will be described. However, it may be used for coating when forming the charge generation layer 12B or the charge transport layer 12C.

(Undercoat layer formed by comparative example)
Next, the undercoat layer 12A formed by the comparative example will be described. In addition, about the member and site | part similar to this embodiment, description is abbreviate | omitted using the same code | symbol as this embodiment.

From a slit die 26 shown in Figure 1 of the comparative example in which the substrate 14 was coated by rotating 360 ° while discharging the coating liquid L _T, as shown in exploded view in FIG. 7 (A), undercoat layer formed It is desirable that the coating film 12A has a well-formed rectangle in which the coating start end EA and the coating end end EB are straight in the width direction (Z direction) and the circumferential direction (R direction).

However, depending on the discharge conditions of the coating solution L _T from the slit die 26, the coating starting end EA as shown in FIG. 7 (B) or wavy jagged, Z-direction central portion of the coating end edge EB is rounded like , It may not be rectangular. Further, as shown in FIG. 7C, the coating start end EA and the coating end end EB may wave. This time of discharging the coating liquid L _T at the start of the coating, or flow out gradually the coating solution up pressure L _T, occurs when the ejection of the application liquid L _T at the coating end gradually stops. It also depends on the nature of the application liquid L _T, and when the coating liquid L _T is Newtonian fluid, likely to occur when the viscosity at ambient temperature during coating is less than 1 Pa · s.

On the other hand, the thickness of the coating liquid L _T coating start end EA and coating end edge EB of the better is the same as the thickness of the R center section d as shown in FIG. 8 (A), 1 rotation of the base 14 When the coating start end EA and the coating end end EB are connected, it is desirable because there is no change in the film thickness of the joint as shown in FIG.

However, if the viscosity tends to flow less of the coating liquid L _T is the coating starting end EA and coating end edge EB as shown in FIG. 8 (C) becomes gently (thin). In this case, when the application start end EA and the application end end EB are connected, as shown in FIG.

(Function)
Next, the operation of the first embodiment will be described.

(Operation of application unit)
As shown in FIG. 9A, in the initial state, the distance between the outer peripheral surface of the base 14 and the end of the discharge port 26A of the slit die 26 is 2d, which is larger than the set film thickness d as an example.

  Subsequently, as shown in FIG. 6A, in the coating unit 20, the X stage 44 moves in the X direction from the reference position in accordance with an instruction from the control unit 50 (see FIG. 1). Thereby, the position where the slit die 26 faces the outer peripheral surface of the base 14 (as an example, the position where the distance between the outer peripheral surface of the base 14 and the end of the discharge port 26A of the slit die 26 is d (see FIG. 9A)). ). The discharge port 26A is arranged toward the center of rotation (not shown) of the base 14. In FIGS. 6A, 6B, and 6C, the second motor 46 and the Y stage 48 (see FIG. 1) are not shown.

Subsequently, as shown in FIG. 6 (B), the widened portion 38E of the suction unit 38 opens the through-hole 38D, a coating liquid L _T becomes ready supply. As shown in FIG. 1, the three-way valve 36 opens the supply pipe 32 from the supply pump 30 to the slit die 26, and the return pipe 34 side is closed. Operating the supply pump 30 in this state, and the piston cylinder 38B (see FIG. 6 (B)) is by extruding the coating liquid L _T, as shown in FIG. 6 (B), the coating liquid on the outer peripheral surface of the base body 14 L _T is started discharge (coating start). The motor 22B starts rotating of the substrate 14 in accordance with the application starting of the application liquid L _T. Then, while the rotation of the substrate 14 is 1 rotates a little (360.5 ° only around the time as an example Delta] t), the discharge pressure of the coating liquid _{L T} is decompressed as P1, P2, P3 (see FIG. 5). In this way, the application liquid L _T is applied to the outer peripheral surface of the rotating body 14 (an example of a coating step).

Application liquid L _T is the discharge (coating) at the beginning, is discharged at a high discharge pressure P1 than the normal discharge pressure P2. Accordingly, even when the amount of the application liquid L _T that is supplied to the vicinity of the discharge port 26A of the slit die 26, be insufficient amount of the coating solution L _T to be applied to the substrate 14 is suppressed. The coating liquid L _T is the discharge (coating) at the end, is discharged at a low discharge pressure P3 than normal discharge pressure P2. Accordingly, when superimposing the coating end edge EB on application start end EA, extra (sets or more) application liquid L _T on the outer circumferential surface of the base body 14 is prevented from remaining, when moving the slit die 26 such as stringing of the application liquid L _T is suppressed.

Subsequently, as shown in FIG. 6 (C), as (an example when the supply stop condition is satisfied in the coating liquid L _T, the time elapsed since the application start time Delta] t (360.5 ° time to rotate) has elapsed point), three-way valve 36 (see FIG. 1) is switched so as to close the supply pipe 32 of the slit die 26 side, with the supply of the coating liquid L _T is stopped, the suction unit 38 sucks the application liquid L _T To do. Accordingly, the coating liquid L _T overlap (lead) an excess of coating liquid L _T is prevented from remaining in the region, it is prevented that too thin or too thick thickness of the coating liquid L _T.

Further, when the suction unit 38 sucks the application liquid _{L T,} and the X stage 44 is moved in the -X direction, away by a distance 2d slit die 26 from the substrate 14 (see FIG. 9 (A)). Thus, contact with the slit die 26 and the coating liquid L _T is prevented. The distance 2d (spacing 2d) is desirably dried at earlier than the thickness of the coating liquid L _T, it is preferable to 1mm or more. The distance between the slit die 26 and the substrate 14 in the coating liquid _{L T} applied, depending on the thickness of the coating liquid _{L T,} it is desirable to 0.1mm or 0.5mm or less. Furthermore, it is desirable that the moving time of the slit die 26 (the time from the time point t7 to the time point t8 in FIG. 5) be 0.1 seconds or less.

Here, as shown in FIG. 9 (B), by the substrate 14 is rotated 360.5 °, coating start end EA and coating end edge EB of the coating solution _{L T} overlap. Thereby, the application start end EA and the application end end EB are reliably connected. Then, the thickness of the portion where the coating start end EA and the coating end end EB overlap is larger than d (as an example, 1.2d). In addition, since the coating start end EA and the coating end end EB are tapered, even if the coating start end EA and the coating end end EB overlap, the film thickness of this overlapping portion is smaller than 2d.

Subsequently, as shown in FIG. 6 (C), the motor 22B, along with reducing the number of revolutions per unit time from NH to NL (see FIG. 5), the application liquid L base _{14 T} is applied, set Rotate at time (time from time t9 to time t12 in FIG. 5) (an example of a rotation process). Accordingly, the coating liquid L _T is overlapping portion shown in FIG. 9 (B) is not gradually (are leveled) becomes smooth. Then, the coating liquid L _T is a film thickness variation was suppressed in the direction R shown in FIG. 9 (A). That is, the difference between the thickness of the connecting portion when the photoconductor 12 (see FIG. 12) is manufactured by connecting the coating start end EA and the coating end end EB and the thickness of other portions in the R direction is reduced. Incidentally, depending on the thickness of the coating liquid L _T, the time of the leveling of the coating liquid LT is preferably 5 minutes or less than 30 seconds. The environmental temperature during leveling is preferably about 25 ° C. (normal temperature).

In this way, the undercoat layer 12A is formed on the outer peripheral surface of the base 14 as shown in FIG. In the drying process of the undercoat layer 12A, the substrate 14 is heated to dry the solvent. As a drying method, any known method such as a method of putting the substrate 14 in a drying furnace, a method of blowing hot air on the substrate 14, and an infrared heating method may be used. It is desirable to continue rotating the substrate 14 so that the coating liquid L _T (coating film) does not drip even during drying. Then, the charge generation layer 12B, the charge transport layer 12C, and the protective layer (not shown) are formed on the undercoat layer 12A using another coating apparatus, whereby the photoconductor 12 is formed.

(Operation of the introduction unit)
As shown in FIG. 10 (A), when not the application of the application liquid _{L T} to the substrate 14, the discharge unit 24, the three-way valve 36 is in the OFF state (supply pipe 32 is the closed state of the slit die 26 side) it is, the coating liquid L _T that is fed by feed pump 30, back through the return pipe 34 to the reservoir tank 28 is circulated back to the supply pump 30. At this time, the lid member 62 covers the discharge port 26 </ b> A of the slit die 26.

  Subsequently, as shown in FIG. 10B, in the lid moving unit 70, the Y stage 74 (see FIG. 3) moves in the −Y direction, and the X stage 78 (see FIG. 3) moves in the −X direction. To do. Thereby, the lid member 62 is disposed on the −Y direction side (downward side) of the slit die 26, and the slit die 26 can be moved in the X direction. Then, the slit die 26 is moved in the X direction by the moving unit 40 (see FIG. 1), and is disposed to face the base 14.

Subsequently, as shown in FIGS. 10C and 10D, the three-way valve 36 is in an ON state (the supply pipe 32 on the slit die 26 side is open), and as shown in FIG. application liquid _{L T} is applied from 26 to the substrate 14.

Subsequently, as shown in FIG. 10 (E), when the coating end of the application liquid _{L T} to base 14, and moved in the -X slit die 26 by the mobile unit 40 (see FIG. 1), three-way valve 36 is OFF It becomes a state. At this time, the suction by the suction unit 38 is performed, as shown in FIG. 11 (B), the slit die 26, the state in which the amount of the coating solution L _T in the discharge port 26A is reduced (the shortage state) It has become.

  10E, in the lid moving unit 70, the X stage 78 (see FIG. 3) moves in the X direction, and the Y stage 74 (see FIG. 3) moves in the Y direction. The X stage 78 moves in the −X direction. Accordingly, as shown in FIGS. 11C and 11D, the lid member 62 is attached to the discharge port 26A of the slit die 26 (or the peripheral portion of the discharge port 26A) (an example of an attachment process). A cleaning chamber 64 surrounded by the slit die 26 and the lid member 62 is formed.

Subsequently, in FIG. 1, the control unit 50 closes the return pipe 67 side by the three-way valve 68 and opens the supply pipe 65 side to operate the introduction unit 60 (supply pump 66). Thus, as shown in FIG. 11 (E), the washing liquid L _S is discharged while being introduced into the cleaning chamber 64, cleaning liquid L _S is circulated supply pipe 65 and return pipe 69 (an example of the introduction step).

Subsequently, as shown in FIG. 11F, the control unit 50 (see FIG. 1) operates the supply pump 30 (see FIG. 1) before the introduction unit 60 (see FIG. 1) stops the introduction operation. , the cleaning chamber 64 to eject the application liquid L _T (an example of a discharge step). Incidentally, the suction unit 38 (see FIG. 1), after the application liquid L _T is discharged from the discharge port 26A into the cleaning chamber 64 does not perform the suction of the coating liquid L _T.

Subsequently, in FIG. 1, by closing the three-way valve 68, the supply of the cleaning liquid L _S to the cleaning chamber 64 cleaning liquid L _S is discharged from the return pipe 69 while being stopped to the storage tank 61. As a result, the cleaning liquid L _S is extracted from the cleaning chamber 64 as shown in FIG. Along with this extraction operation, the X stage 78 (see FIG. 3) moves in the X direction, the Y stage 74 (see FIG. 3) moves in the −Y direction, and the X stage 78 further moves in the −X direction. Accordingly, as shown in FIGS. 10B and 11H, the lid member 62 is retracted from the discharge port 26A of the slit die 26 (an example of the retracting process).

Subsequently, as shown in FIGS. 10B, 10 </ b> C, 10 </ b> D, and 10 </ b> E, the slit die 26 is formed on the rotating base 14 (the base 14 of the photoreceptor 12 to be manufactured next (see FIG. 12)). ) by discharging a coating liquid L _T in forming the undercoat layer 12A (an example of a deposition step). Then, as shown in FIG. 12, the charge generation layer 12B, the charge transport layer 12C, and the protective layer (not shown) are formed on the formed undercoat layer 12A using another coating apparatus. The next photoconductor 12 is formed.

Thus, the photosensitive member manufacturing apparatus 10 shown in FIG. 1, when the slit die 26 is not performing ejection operation of the application liquid L _T, the discharge port 26A and its peripheral portions are washed with the washing liquid L _S. Here, the control unit 50, introduction unit 60 operates the slit die 26 prior to stopping the introduction of the cleaning liquid L _S, and discharging the coating liquid L _T from the discharge opening 26A into the cleaning chamber 64. Thus, the application liquid L _T that generate dilute the cleaning liquid L _S in the vicinity of the discharge port 26A is ejected, the concentration decrease of the coating solution L _T in the discharge port 26A is suppressed, the application of the next coating liquid L _T Application failure when starting is suppressed.

On the other hand, the suction unit 38, as described above, but sucking the coating liquid _{L T} from the discharge port 26A after the ejection operation of the application liquid _{L T} to the substrate 14, the cleaning chamber from a coating liquid _{L T} is the discharge port 26A 64 after being discharged to the inner it does not perform the suction of the coating liquid L _T. Accordingly, the coating liquid L _T slit die 26 by sucking the cleaning liquid L _S that is Usumaru is suppressed.

  Next, examples of the photoreceptor 12 will be described.

(Example)
As an example, the photoreceptor 12 is manufactured using an aluminum base 14 having an outer diameter of 30 mm, a thickness of 1 mm, and a length in the Z direction of 340 mm. The surface of the substrate 14 was roughened to an arithmetic average roughness Ra of 0.2 μm by a honing process using spherical alumina particles. Next, a methanol solution of a copolymerized nylon resin (trade name: CM8000, manufactured by Toray) was applied on the surface by spraying to form an undercoat layer 12A having a thickness of 0.5 μm.

On the other hand, a photosensitive layer solution was prepared by the method described in JP-A-2004-348092. That is, in the X-ray diffraction spectrum using Cukα rays as the charge generation material, at least 7.5 °, 9.9 °, 12.5 °, 16.3 °, 18 at the Bragg angle (2θ ± 0.2 °), 18 3 parts by weight of hydroxygallium phthalocyanine that gives clear diffraction peaks at .6 °, 25.1 °, and 28.1 °, and 3,5-dimethyl-3 ′, 5′-di-t-butyl- as an electron transport material 40 parts by weight of 4,4′-diphenoquinone, N, N′-diphenyl-N, N′-bis (3-methylphenyl)-[1,1′-biphenyl] -4,4′- as a hole transport material 80 parts by weight of diamine, 150 parts by weight of bisphenol Z-type polycarbonate resin (viscosity average molecular weight 50,000) as binder resin, 10 parts by weight of tetrafluoroethylene resin particles are added, and cyclopenta is used as a solvent. With emissions 1000 parts by weight for 24 hours dispersed or dissolved in a ball mill to prepare a coating liquid L _T for single-layer type photosensitive layer. The solid content concentration is 22% by weight and the viscosity is 0.4 Pa · s.

This liquid is sent to the manifold (not shown) of the slit die 26 at 0.72 cm ³ / sec by a supply pump 30 (Mono pump). In the middle of the supply pipe 32 by the operation of the piston cylinder 38B which is driven by air, instantly extrusion coating liquid _{L T} of 0.3 cm ³ / sec at the start of the coating, instantly of 0.5 cm ³ / sec at the coating end a suction unit 38 for sucking the coating liquid L _T installed. Its front three-way valve 36 provided in the not sent to the slit die 26 a coating liquid L _T when not applied, and returns from the return pipe 34 to the storage tank 28.

  As the slit die 26, a slit die having a slit width of 0.3 mm, a slit length of 20 mm, a lip of 1 mm, a manifold diameter of 15 mm, and a coating width (width in the Z direction) of 320 mm was used.

The substrate 14 was rotated at 12 rpm. The distance between the slit die 26 and the outer peripheral surface of the substrate 14 is 2 mm. At coating start is a slit die 26 is brought close to 0.2mm on the outer peripheral surface of the base body 14, and starts the liquid feeding switch the three-way valve 36, the coating liquid _{L T} Press piston cylinder 38B is the ejection port 26A (slit) It was made to discharge immediately from. When the base body 14 made one revolution after 5 seconds, the piston cylinder 38B was sucked and the three-way valve 36 was switched to stop liquid feeding, and the slit die 26 was pulled away from the outer peripheral surface of the base body 14 to a position of 2 mm. As a result, a coating film having a thickness of about 120 μm was formed on the surface of the substrate 14, but streaks were still observed at the joint.

  Subsequently, by continuously rotating the substrate 14 for 30 seconds, the joint streaks seen on the coating film surface disappeared.

  Subsequently, while rotating the substrate 14 at 10 rpm, it was placed in a drying furnace (not shown) set at 150 ° C. and dried for 20 minutes. As a result, a photoreceptor 12 having a single-layer photosensitive layer having a film thickness of 26 μm was obtained.

  Next, a comparative example of the photoreceptor 12 will be described.

(Comparative example)
The solvent for the coating liquid L _T of the present embodiment instead of tetrahydrofuran 800 parts by weight, the other was preparing the coating solution in the same manner. The solid content concentration is 26% by weight, and the viscosity is 0.5 Pa · s. Using this solution, a coating solution was applied to the substrate 14 by a conventionally known dip coating method. Specifically, the substrate 14 was immersed in the coating solution at a speed of 0.6 m / min with the axial direction of the substrate 14 vertical, stopped for 2 seconds, and then pulled up from the coating solution at a speed of 0.18 m / min. In this case, the time required for the coating operation was about 150 seconds, which was much longer than the time of 5 seconds in this example.

(Second Embodiment)
Next, an example of a rotating body manufacturing apparatus and a rotating body manufacturing method according to a second embodiment of the present invention will be described. Note that the same reference numerals as those in the first embodiment are given to the same members and parts as those in the first embodiment described above, and the description thereof is omitted.

  FIG. 13 shows a photoreceptor manufacturing apparatus 100 as an example of a rotating body manufacturing apparatus according to the second embodiment. In the photoconductor manufacturing apparatus 100, the position of the slit die 26 of the photoconductor manufacturing apparatus 10 (see FIG. 1) is fixed, and a moving unit 110 that moves the rotating unit 22 instead of the moving unit 40 (see FIG. 1) is provided. It has a provided configuration. Since the introduction unit 60 (see FIG. 1) has the same configuration, illustration and description are omitted.

  The moving unit 110 includes an X stage 114 that moves in the X direction or the −X direction by the first motor 112 fixed on the pedestal 111, and a Y direction or −Y direction that is driven by the second motor 116 fixed on the X stage 114. And a Y stage 118 that moves to the center. On the Y stage 118, a support portion 22A is rotatably supported by a support column 119 standing upright in the Y direction. Since the height of the Y stage 118 is adjusted in advance, only the X stage 114 is basically moved when the photosensitive member 12 (see FIG. 12) is manufactured.

  As an example, the X stage 114 has a configuration in which a ball screw 113 is arranged between two shafts (not shown) arranged at intervals, and the first motor 112 rotates the ball screw 113. It is movable in the X direction and -X direction. Similarly, as an example, the Y stage 118 has a configuration in which a ball screw 117 is arranged between two shafts (not shown) arranged at intervals, and the second motor 116 rotates the ball screw 117. By doing so, it is possible to move in the Y direction and the -Y direction. The first motor 112 and the second motor 116 are connected to the control unit 50 and operate according to instructions from the control unit 50.

(Function)
Next, the operation of the second embodiment will be described.

  As shown in FIG. 14A, in the photoreceptor manufacturing apparatus 100, the X stage 114 moves in the −X direction in response to an instruction from the control unit 50 (see FIG. 13). Thereby, the outer peripheral surface of the base 14 is disposed at a position facing the discharge port 26 </ b> A of the slit die 26. The discharge port 26A is arranged toward the center of rotation (not shown) of the base 14. At this time, as shown in FIG. 9A, as an example, the distance between the outer peripheral surface of the base 14 and the end of the discharge port 26A of the slit die 26 is 2d, which is larger than the set film thickness d.

Subsequently, as shown in FIG. 14 (B), the widened portion 38E of the suction unit 38 opens the through-hole 38D, a coating liquid _{L T} becomes ready supply. As shown in FIG. 13, the three-way valve 36 opens the supply pipe 32 from the supply pump 30 to the slit die 26, and the return pipe 34 side is closed. Operating the supply pump 30 in this state, and the piston cylinder 38B (see FIG. 14 (B)) is by extruding the coating liquid _{L T,} as shown in FIG. 14 (B), the coating liquid on the outer peripheral surface of the base body 14 L _T is started discharge (coating start). The motor 22B starts rotating of the substrate 14 in accordance with the application starting of the application liquid L _T. Then, while the rotation of the substrate 14 is 1 rotates a little (360.5 ° as an example), the discharge pressure of the coating liquid _{L T} is decompressed as P1, P2, P3 (see FIG. 5). In this way, the application liquid L _T is applied to the outer peripheral surface of the rotating body 14 (an example of a coating step).

Subsequently, as shown in FIG. 14 (C), when the supply stop condition of the application liquid L _T is satisfied (time point As an example, the time elapsed since the application start time Δt has elapsed), the three-way valve 36 (FIG. 13 see) is switched so as to close the supply pipe 32 of the slit die 26 side, with the supply of the coating liquid L _T is stopped, the suction unit 38 sucks the application liquid L _T. Accordingly, the coating liquid L _T overlap (lead) an excess of coating liquid L _T is prevented from remaining in the region, it is prevented that too thin or too thick thickness of the coating liquid L _T.

Further, when the suction unit 38 sucks the application liquid _{L T,} and the X stage 114 is moved in the X direction, away substrate 14 from a slit die 26 by a distance 2d (see FIG. 9 (A)). Thus, contact with the slit die 26 and the coating liquid L _T is prevented.

Here, as shown in FIG. 9 (B), by the substrate 14 is rotated 360.5 °, coating start end EA and coating end edge EB of the coating solution _{L T} overlap. Thereby, the film thickness of the portion where the coating start end EA and the coating end end EB overlap is larger than d (as an example, 1.2d). In addition, since the coating start end EA and the coating end end EB are tapered, even if the coating start end EA and the coating end end EB overlap, the film thickness of this overlapping portion is smaller than 2d.

Subsequently, the motor 22B, along with reducing the number of revolutions per unit time from NH to NL (see FIG. 5), the application liquid _L base _{14 T} is applied, the time t12 from the time point t9 of the setting time (FIG. 5 Until it is rotated several times (an example of a rotation process). Accordingly, the coating liquid L _T is the overlapping portion shown in FIG. 9 (B) (a leveling) gradually become to the centrifugal force, with a uniform thickness in the R direction shown in FIG. 9 (A), the inner The composition becomes uniform. That is, the difference between the thickness of the connecting portion when the photoconductor 12 (see FIG. 12) is manufactured by connecting the coating start end EA and the coating end end EB and the thickness of other portions in the R direction is reduced.

Through these manufacturing steps, an undercoat layer 12A is formed on the outer peripheral surface of the base 14 as shown in FIG. In the drying process of the undercoat layer 12A, the substrate 14 is heated to dry the solvent. It is desirable to continue rotating the substrate 14 so that the coating liquid L _T (coating film) does not drip even during drying. Then, the charge generation layer 12B, the charge transport layer 12C, and the protective layer (not shown) are formed on the undercoat layer 12A using another coating apparatus, whereby the photoconductor 12 is formed.

  In this way, by moving the base 14 side by the moving unit 110, the space around the slit die 26 (empty space) is expanded, so that the introduction unit 60 can be easily arranged.

  In addition, this invention is not limited to said embodiment.

  The rotating body manufacturing apparatus is not limited to the photoconductor manufacturing apparatuses 10 and 100, and may be used as an endless belt manufacturing apparatus as another example.

  In order to manufacture an endless belt, a solution of a film-forming resin such as polyimide resin (PI) or polyamideimide resin (PAI) is applied on the base 14 and the film is peeled off from the base 14 after the film is formed. In the case of PI, its precursor may be used. As these solvents, aprotic polar solvents such as N-methylpyrrolidone, N, N-dimethylacetamide, and acetamide are used. The concentration, viscosity, and the like of the solution are appropriately selected, and the solid content concentration of the desired solution is 10% by mass to 40% by mass, and the viscosity is 1 Pa · s to 100 Pa · s.

  When forming a semiconductive endless belt, conductive particles are dispersed in a resin solution. For example, carbon-based materials such as carbon black, carbon fiber, carbon nanotube, and graphite, metals or alloys such as copper, silver, and aluminum, conductive metal oxides such as tin oxide, indium oxide, and antimony oxide, potassium titanate, etc. Whisker, barium sulfate, titanium oxide, zinc oxide and the like. Among these, carbon black is particularly desirable from the viewpoints of dispersion stability in liquid, semi-conductivity, price, and the like.

  In the case of an endless belt, the imidization reaction takes place by heating the PI precursor film for 20 minutes or more and 60 minutes or less, preferably at 250 ° C. or more and 450 ° C. or less, more preferably 300 ° C. or more and 350 ° C. or less after drying. A PI resin film is formed. During the heating reaction, it is desirable to heat the temperature stepwise or gradually at a constant rate before reaching the final heating temperature. When the film forming resin is PAI, the film is formed only by drying the solvent. In this heating process, the substrate 14 (core body) is put into a heating furnace. However, since it is not necessary to rotate the substrate 14 as in the drying process, it is preferable to put the substrate 14 in the heating furnace with the axis direction of the substrate 14 being vertical. .

  After the heating is completed, the substrate 14 is removed from the heating furnace, and the formed resin film is extracted from the substrate 14. Unnecessary portions of the end portion of the obtained film are cut to form an endless belt. The endless belt may be subjected to drilling or ribbing as necessary.

(Example of endless belt)
As an example, an endless belt is manufactured using a cylindrical body (core body) made of SUS304 having an outer diameter of 30 mm, a thickness of 0.5 mm, and a length of 350 mm. The surface of the core was roughened to Ra 0.4 μm by blasting with spherical alumina particles. Subsequently, a silicone release agent (trade name: Sepacoat, manufactured by Shin-Etsu Chemical Co., Ltd.) was applied to the surface, and a baking treatment was performed at 300 ° C. for 1 hour.

As a coating solution, a PI precursor solution (trade name: U varnish S, manufactured by Ube Industries, solid concentration 18%, solvent N-methylpyrrolidone, viscosity 5 Pa · s) was used. This coating solution is sent to the manifold of the slit die 26 at a rate of 3.0 cm ³ / sec by a Mono pump. In the middle of the piping, a piston cylinder 38B driven by air is used to push out 0.5 cm ³ / sec of liquid instantly at the start of application and to suck 0.5 cm ³ / sec of liquid instantly at the end of application 38 was installed. Further, a three-way valve 36 is provided in front of the suction unit 38, and when not applied, the liquid is not sent to the slit die 26 and returned to the storage tank 28 from the return pipe 34.

  A slit die 26 having a slit width of 0.5 mm, a slit length of 20 mm, a lip of 1 mm, a manifold diameter of 15 mm and a coating width of 320 mm was used. The core was placed in a manufacturing apparatus and rotated at 12 rpm. The distance between the slit die 26 and the core surface is 2 mm. At the start of coating, the slit die 26 was brought close to the surface of the core body to 0.4 mm, the three-way valve 36 was switched to start liquid feeding, and the piston cylinder 38B was pushed so that the coating liquid was immediately discharged from the slit. When the core body made one rotation after 5 seconds, suction was performed by the suction unit 38, and the three-way valve 36 was switched to stop liquid feeding, and the slit die 26 was pulled away from the core body surface to a position of 2 mm. As a result, a 500 μm-thick coating film was formed on the surface of the core, and the joint streaks seen on the coating film surface disappeared by continuing to rotate the core for 1 minute.

  Subsequently, while rotating the core at 10 rpm, the core was placed in a drying furnace set at 150 ° C. and dried for 20 minutes. Thereafter, the core was taken out of the drying furnace and placed vertically into a heating furnace, and reacted by heating at 200 ° C. for 30 minutes and at 300 ° C. for 30 minutes to simultaneously dry the residual solvent and imidize the resin. And after cooling to room temperature, the resin film was extracted from the core and the endless belt was obtained. When the film thickness was measured, it was 90 μm, and no streak was found at the seam. This endless belt can be used as a fixing belt.

(Comparative Example 1)
In the above-described example, the suction part 38 was not used, and spin coating was performed in the same manner as the others. A coating film having a thickness of about 500 μm was formed on the surface of the core, but the coating start and end ends were smooth, and streaks in a state where the film thickness was insufficient were observed at the joints. This streak did not disappear even if the core was kept rotating after application. The obtained endless belt had a film thickness of 90 μm at portions other than the muscles, but the film thickness was only about 60 μm at the muscle portions, and it was easy to bend because of its low strength.

(Comparative Example 2)
In the above example, the slit die 26 was not moved before and after coating, but was fixed at a position of 0.4 mm from the surface of the core body, and spin coating was performed in the same manner. Although the coating film was formed normally at the start of coating, the tip of the slit die 26 was still in contact with the coating film surface even after the coating liquid was stopped and the rotation of the core body was stopped. When the body was removed, the tip of the slit die 26 and the coating liquid were connected to each other, resulting in swelling, and a so-called liquid separation line was formed. The obtained endless belt had a film thickness of 90 μm at portions other than the separation line, but the film thickness at the separation line portion was about 120 μm, which was inconvenient for use as a fixing belt.

  The moving units 40 and 110 are not limited to those using ball screws, and linear servo motors may be used. Further, the assembly order of the X stage and the Y stage in the moving units 40 and 110 may be switched.

  Furthermore, when the coating start end EA and the coating end end EB of the coating liquid LT are overlapped, the rotation angle of the substrate 14 per unit time does not have to be 360 ° or more. For example, depending on other conditions, 359.5 ° (Value smaller than 360 °) may be used.

In addition, stopping the application of the application liquid L _T from the discharge unit 24 is not limited to the elapsed time from the application start may be based on the rotation angle of the base 14.

10 Photoconductor manufacturing apparatus (an example of a rotating body manufacturing apparatus)
12 Photoconductor (example of rotating body)
14 Substrate 26 Slit die (an example of discharge means)
26A Discharge port 32 Supply piping (an example of a flow path)
38 Suction unit (an example of suction means)
50 control unit (an example of control means)
60 Introduction unit (an example of introduction means)
62 Lid member 64 Cleaning chamber 100 Photoconductor manufacturing apparatus (an example of a rotating body manufacturing apparatus)
L _S cleaning solution _{L T} coating solution

Claims (3)

A discharge means for discharging the coating liquid from the discharge port to the outer peripheral surface of the rotating cylindrical substrate;
A lid member provided so as to be movable relative to the discharge port, and forming a cleaning chamber by covering the discharge port when the discharge means is not performing a discharge operation of the coating liquid;
Introducing means for introducing the cleaning liquid into the cleaning chamber and discharging the cleaning liquid from the cleaning chamber when the lid member covers the discharge port;
After introducing the cleaning liquid into the cleaning chamber by operating the introducing means without operating the discharging means, the introducing means operates the discharging means before stopping the introduction of the cleaning liquid from the discharge port. Control means for controlling the discharge of the coating liquid into the cleaning chamber;
An apparatus for manufacturing a rotating body. Discharging a coating liquid from the discharge port on the outer peripheral surface of a cylindrical body which rotates, the sucked coating liquid from the discharge port after the completion of the discharge of the coating solution to the substrate, the coating liquid is the discharge port or we wash chamber Discharge means that does not perform suction after being discharged to
Are relatively movable with respect to the discharge opening, and a lid member to which the discharge means to form the cleaning chamber with the cover the discharge ports when not performing ejection operation of the coating liquid,
Introducing means for introducing the cleaning liquid into the cleaning chamber and discharging the cleaning liquid from the cleaning chamber when the lid member covers the discharge port;
Control means for controlling the operation of discharging the coating liquid from the discharge port into the cleaning chamber by operating the discharge means before the introduction means stops the introduction of the cleaning liquid;
A suction unit that is provided in a flow path through which the coating liquid supplied to the discharge unit flows, and sucks the coating liquid from the discharge unit;
An apparatus for manufacturing a rotating body. Using the rotating body manufacturing apparatus according to claim 1 or 2, an attachment step of attaching the lid member to the discharge port;
An introduction step of operating the introduction means after the attachment step to introduce and discharge a cleaning solution into the cleaning chamber;
A discharge step of operating the discharge means to discharge the coating liquid from the discharge port into the cleaning chamber before the introduction means stops operating;
Withdrawing the cleaning liquid from the cleaning chamber and retracting the lid member from the discharge port,
A film forming step of forming a film by discharging a coating liquid onto the rotating substrate;
The manufacturing method of the rotary body which has this.