JP5218148B2 - Semiconductor manufacturing equipment - Google Patents

Description

  The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a semiconductor manufacturing apparatus including a susceptor that holds a processing target and can rotate.

  2. Description of the Related Art Conventionally, a semiconductor manufacturing apparatus such as a vapor phase growth apparatus including a rotatable susceptor that holds a substrate as a processing target is known (see, for example, Patent Document 1).

  In the semiconductor manufacturing apparatus disclosed in Patent Document 1, a support shaft is connected to the center of the lower surface of a disk-shaped susceptor, and the susceptor is rotatable by rotating the support shaft. A heater for heating the substrate held by the susceptor is disposed on the lower surface side of the susceptor. The susceptor is disposed in an opening formed in the bottom wall of the reaction chamber.

JP-A-2005-243766

  However, in the case of the semiconductor manufacturing apparatus disclosed in Patent Document 1, when the susceptor is enlarged in order to increase the size of the substrate to be processed or increase the number of substrates mounted on the susceptor, When the susceptor is supported by a support shaft connected to the central portion of the susceptor, it may be difficult to keep the susceptor surface horizontal when the susceptor rotates. This is because the susceptor is supported only by the support shaft arranged at the center of the susceptor, and when the susceptor is enlarged, the surface of the susceptor is caused by processing accuracy and bending at the joint between the support shaft and the susceptor. This is thought to be caused by a slight tilt from the horizontal.

  Therefore, in order to solve the above-described problem, as a type of the semiconductor manufacturing apparatus disclosed in Patent Document 1 described above, for example, a susceptor, a frame that is installed on the outer periphery of the susceptor and that can rotate together with the susceptor, and a frame are supported. It is conceivable to use a semiconductor manufacturing apparatus including a susceptor support portion that performs the above and a gantry that fixes the susceptor support portion. The semiconductor manufacturing apparatus can be configured to support the susceptor from the central portion and the outer peripheral portion by the susceptor support portion supporting the outer peripheral portion and the frame of the susceptor. For this reason, the said semiconductor manufacturing apparatus can keep the susceptor surface horizontal, and can suppress that the surface of a susceptor inclines slightly from horizontal like the semiconductor manufacturing apparatus disclosed by patent document 1. FIG. Therefore, the distance between the susceptor and the heater is locally different due to the inclination of the surface of the susceptor, and the occurrence of a local temperature difference in the susceptor heated by the heater can be suppressed. As a result, uniform processing can be performed on the substrate (for example, a film having a uniform film quality can be formed).

  In the semiconductor manufacturing apparatus described above, the frame rotates together with the susceptor, but a configuration in which the susceptor support portion is fixed together with the gantry is conceivable. In this case, in order to suppress a phenomenon in which the susceptor support portion rotates together with the susceptor and the frame, it is necessary to fix the susceptor support portion to a gantry fixed to the lower surface side of the susceptor support portion. For example, in order to fix the susceptor support part having an annular shape to the gantry when viewed from the direction perpendicular to the main surface of the susceptor support part, a notch shape is formed on a part of the outer peripheral part of the annular part of the susceptor support part Forming part. Then, a hook-shaped portion that can be fitted to the cutout shape is formed on a part of the gantry. And the method of fixing a susceptor support part with respect to a mount frame can be used by fitting (meshing) the said hook-shaped part and the said notch-shaped part. Here, the main surface means a main surface having the largest area among the surfaces.

  However, when the susceptor support part having the notch-shaped part formed on the outer peripheral part of the annular part as described above is used, the following problems may occur. This will be specifically described below.

  Here, consider the case where the susceptor is heated to a temperature of, for example, 1000 ° C. or higher by using a heater when the substrate is heated. At this time, due to heat conduction, the above-described heat propagation may also reach the frame, the susceptor support and the frame. As a result, thermal stress is applied to the susceptor support. At this time, since the thermal stress is distributed in the above-described cutout shape portion, the susceptor support portion may be deformed or broken in the cutout shape portion.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a semiconductor manufacturing apparatus capable of suppressing the concentration of thermal stress in a member that holds an object to be processed in heating in substrate processing. That is.

  A semiconductor manufacturing apparatus according to the present invention includes a rotatable susceptor that holds an object to be processed, a frame that is installed on an outer periphery of the susceptor and that can rotate together with the susceptor, a susceptor support that supports the frame, and a susceptor support. And a gantry for fixing. A recess is formed on one surface of the susceptor support and the gantry so as to fix the position of the susceptor support with respect to the gantry in a region where the susceptor support and the gantry are opposed to each other. On the other surface of the susceptor support portion and the gantry, a convex portion that is inserted and fixed in the concave portion is formed. The concave portion and the convex portion are formed to extend in a direction intersecting with a radial direction from the center of the susceptor toward the outer peripheral side.

  In the semiconductor manufacturing apparatus according to the present invention, the outer periphery of the susceptor and the susceptor support that supports the frame are fixed using a gantry. Here, for example, a concave portion is formed in a part of the surface where the susceptor support part faces the gantry, and a convex part is formed in a part of the surface where the gantry supports the susceptor support part. ing. Since the concave portion and the convex portion are fitted and interfere with each other, the rotation of the susceptor support portion is suppressed by the gantry.

  Here, the susceptor support portion and the gantry are extended so as to extend in the direction intersecting the radial direction from the center side to the outer peripheral side of the main surface, more preferably in the direction perpendicular to the radial direction. It is set as the structure by which the recessed part and the convex part are formed.

  If such a semiconductor manufacturing apparatus is used to heat the susceptor to heat the object to be processed held by the susceptor, the heat is also propagated to the susceptor support portion. In this case, if the concave portion formed in the susceptor support portion is shaped to extend in the direction along the radial direction, the joint portion (corner portion) between the surface of the concave portion along the radial direction and another adjacent surface. Will also extend along the radial direction. Then, the thermal stress resulting from the heat at the time of the heating is concentrated on the corner portion, and there is a high possibility that the susceptor support portion is deformed or broken. On the other hand, by forming the concave portion (and the convex portion) in a direction intersecting the radial direction with respect to the concave portion (and the convex portion) as in the present invention, more preferably in a direction perpendicular to the radial direction, The part is also formed to extend in a direction intersecting the radial direction (preferably a direction perpendicular to the radial direction). In this case, the inventor has found that the concentration of thermal stress at the corner can be reduced as a result. If it does in this way, it can control that a susceptor support part raise | generates a deformation | transformation and a damage in the area | region of the said junction part vicinity. In the semiconductor manufacturing apparatus according to the present invention, for example, the susceptor support portion has a convex portion formed on the surface facing the gantry, and the gantry has a concave portion formed on the surface facing the susceptor support portion. There may be.

  Preferably, in the semiconductor manufacturing apparatus described above, the concave portion is formed on the surface of the susceptor support portion, while the convex portion is formed on the surface of the gantry, and the surface of the susceptor support portion is in a region where the susceptor support portion and the gantry face each other. A groove is formed in. In the above region, a protrusion that can be inserted into the groove is formed on the surface of the gantry. The concave portion is formed in the groove so as to extend along the extending direction of the groove, and the convex portion is opposed to the concave portion formed in the groove, and the protrusion extends. It is formed in the surface of the said protrusion part so that it may extend along a present direction.

  As described above, a groove is formed on the surface of the susceptor support portion where the recess is formed, and a protrusion is formed on the surface of the mount on which the protrusion is formed, so that the positioning accuracy of the susceptor support portion with respect to the mount is further improved. Can be increased.

  Preferably, in the semiconductor manufacturing apparatus described above, the planar shape of the groove and the protruding portion when viewed from a direction perpendicular to the surface facing the gantry in the susceptor support portion is an annular shape. Furthermore, the susceptor support part and the gantry have a cavity in the central region in the direction along the surface facing the gantry in the susceptor support part. Furthermore, the shape of the susceptor support portion and the gantry viewed from a direction perpendicular to the surface facing the gantry in the susceptor support portion is an annular shape.

  In the semiconductor manufacturing apparatus, it is preferable to install a susceptor inside a reaction tube for processing. Here, it is preferable to narrow a gap formed between the susceptor and the reaction tube. For this reason, it is preferable that the main surface of the susceptor has a disk shape. Since the central portion of the susceptor is supported by the support shaft, the susceptor support portion supports the outer peripheral portion of the susceptor. Therefore, it is preferable that the susceptor support portion has an annular shape having a cavity in a central region in a direction along the surface facing the gantry, that is, a region where the susceptor is supported by the support shaft. Since the main surface of the susceptor support part has an annular shape, the planar shape of the groove formed on the main surface and the protrusion part formed on the main surface of the gantry facing the main surface of the susceptor support part is circular. A ring shape is preferred.

  In the semiconductor manufacturing apparatus described above, the cross-sectional shape of the recess in the direction perpendicular to the surface facing the gantry in the susceptor support and perpendicular to the direction in which the recess extends is rectangular, and the susceptor support in the susceptor support The cross-sectional shape of the convex portion in the direction perpendicular to the surface opposite to the direction in which the convex portion extends may be rectangular. Or the triangular shape may be sufficient as the cross-sectional shape of the said recessed part and a convex part, and an arch-shaped shape may be sufficient as it.

  ADVANTAGE OF THE INVENTION According to this invention, in the heating in the process of a board | substrate, the semiconductor manufacturing apparatus which can suppress the concentration of the thermal stress in the member holding a process target object can be provided.

It is a schematic sectional drawing which shows the aspect of the processing apparatus which is an example of the semiconductor manufacturing apparatus which concerns on Embodiment 1 of this invention. It is a schematic sectional drawing in line segment II-II of FIG. It is a schematic sectional drawing in line segment III-III of FIG. It is a schematic sectional drawing in line segment IV-IV of FIG. It is the schematic of the mount frame which comprises the processing apparatus in the semiconductor manufacturing apparatus which concerns on Embodiment 1 of this invention. It is a schematic sectional drawing in line segment VI-VI of FIG. It is a schematic sectional drawing which shows the aspect of the processing apparatus which is an example of the semiconductor manufacturing apparatus concerning Embodiment 2 of this invention. It is a schematic sectional drawing in line segment VIII-VIII of FIG. It is a schematic sectional drawing in line segment IX-IX of FIG. It is a schematic sectional drawing in the line segment XX of FIG. It is the schematic of the mount frame which comprises the processing apparatus in the semiconductor manufacturing apparatus which concerns on Embodiment 2 of this invention. It is a schematic sectional drawing which shows the modification of the susceptor support part in the semiconductor manufacturing apparatus concerning Embodiment 2 of this invention. It is a schematic sectional drawing which shows the modification of a mount frame in the semiconductor manufacturing apparatus which concerns on Embodiment 2 of this invention. It is a schematic sectional drawing which shows the aspect of the processing apparatus which is an example of the semiconductor manufacturing apparatus concerning Embodiment 3 of this invention. It is a schematic sectional drawing in line segment XV-XV of FIG. It is a schematic sectional drawing in line segment XVI-XVI of FIG. It is a schematic sectional drawing in line segment XVII-XVII of FIG. It is the schematic of the mount frame which comprises the processing apparatus in the semiconductor manufacturing apparatus which concerns on Embodiment 3 of this invention. It is a schematic sectional drawing which shows the aspect of the processing apparatus which is an example of the semiconductor manufacturing apparatus conventionally used. It is a schematic sectional drawing in line segment XX-XX of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present embodiment, elements having the same function are denoted by the same reference numerals, and the description thereof will not be repeated unless particularly necessary.

(Embodiment 1)
As shown in FIG. 1, the processing apparatus 1 according to the first embodiment includes a reaction tube 5, a rotatable susceptor 3 installed inside an opening formed in the bottom wall of the reaction tube 5, a reaction A reaction gas supply member 9 for supplying a reaction gas to the inside of the tube 5, and an exhaust member 11 for exhausting a reaction gas, an atmospheric gas, and the like after being used for the reaction process from the inside of the reaction tube 5 to the outside Is provided. Further, the processing apparatus 1 includes a heater 7 for heating the substrate 15 that is a processing target mounted on the susceptor 3, and a motor 20 that is a driving member for rotating the susceptor 3.

  The reaction tube 5 is made of a material such as quartz, and has a cross-sectional shape in a direction perpendicular to the direction in which the reaction gas flows, for example, a rectangular shape. The susceptor 3 has a circular planar shape, and a plurality of mounting recesses 13 for mounting the substrate 15 are formed on the upper surface of the susceptor 3. The number of mounting recesses 13 may be any number such as three, four, or five or more. Further, the mounting recesses 13 may be arranged so as to be symmetric with respect to the central portion of the susceptor 3, or arranged so that the distances between the plurality of mounting recesses 13 are equally spaced. It may be.

  A rotating shaft 17 is connected to the central portion on the back side of the susceptor 3. The lower end of the rotating shaft 17 is connected to the motor 20 via a joint 19. The driving force generated by the motor 20 is transmitted to the susceptor 3 through the joint 19 and the rotating shaft 17. The structure of the connecting portion between the susceptor 3 and the rotating shaft 17 can be an arbitrary structure. For example, the susceptor 3 and the rotating shaft 17 are joined by a brazing material or the like, or a convex portion is provided on one of the susceptor 3 and the rotating shaft 17 at a portion where the susceptor 3 and the rotating shaft 17 are opposed to each other. A convex portion corresponding to the convex portion or a convex portion (for example, a concave portion or a convex portion in which the rotation of the rotating shaft 17 is transmitted to the susceptor 3 by contacting the convex portion with the side surface); The rotation of the rotating shaft 17 may be transmitted to the susceptor 3 by engaging the recess and the recess or the protrusion and the protrusion. That is, the connecting portion between the susceptor 3 and the rotating shaft 17 only needs to be able to transmit the rotational force of the rotating shaft 17 to the susceptor 3, and the susceptor 3 and the rotating shaft 17 may not be fixed.

  A frame 23 that can rotate together with the susceptor is installed on the lower surface of the outer periphery of the susceptor 3. In order to support the rotatable frame 23, the surface where the frame 23 contacts the susceptor support 21 may be polished so that the friction with the susceptor support 21 is reduced. Or you may perform the process which makes the friction in the contact surface of the flame | frame 23 and the susceptor support part 21 small with powder or a particulate material. A gantry 22 for fixing the susceptor support 21 is installed below the susceptor support 21. The gantry 22 is connected and fixed to a base member of the processing apparatus 1 (not shown) or another fixed member. The frame 23, the susceptor support 21 and the gantry 22 are preferably formed using, for example, a ceramic material. If it does in this way, softening by the heat which heater 7 generates can be controlled.

  The susceptor 3 rotates about the rotation shaft 17. For example, a gap exists between the outer periphery of the frame 23 installed on the outer periphery of the susceptor 3 and the end of the opening of the reaction tube 5. When this gap becomes wider, the reaction gas flowing inside the reaction tube 5 may leak into the gap. For this reason, the reaction gas leaks to the wall surface of the end portion of the reaction tube 5 forming the gap and the region facing the outer peripheral side surface of the frame 23, and reacts with the wall surface of the end portion of the reaction tube 5 and the outer peripheral side surface of the frame 23. Products and decomposition products may adhere and grow abnormally. Therefore, it is preferable that the reaction product and the decomposition product are prevented from growing as much as possible by narrowing the gap as much as possible. Therefore, the planar shape of the susceptor 3 is preferably circular. If the planar shape of the susceptor 3 is circular, a gap between the outer peripheral surface of the susceptor 3 (frame 23) and the end of the opening of the reaction tube 5 even if the susceptor 3 rotates about the rotation shaft 17. Can be made substantially constant regardless of the position on the outer peripheral surface of the susceptor 3. For this reason, the said clearance gap can be made small.

  As described above, since the planar shape of the susceptor 3 is circular, for example, the susceptor support 21 and the gantry 22 are planar surfaces of the susceptor support 21 and the gantry 22 which are main surfaces, for example. Is preferably circular. However, since the susceptor support part 21 and the gantry 22 are members that support the frame 23 installed on the outer peripheral part of the susceptor 3, the susceptor support part 21 and the gantry 22 have a cavity in the central region in the planar shape. An annular shape is preferred. In other words, the planar shapes of the susceptor support 21 and the gantry 22 viewed from a direction perpendicular to the main surfaces of the susceptor support 21 and the gantry 22 are annular. In this way, it is possible to avoid the susceptor support portion 21 and the gantry 22 from interfering with the rotating shaft 17, the joint 19, and the motor 20.

  As shown in FIGS. 1 and 2, a groove 21 a is formed on the surface of the susceptor support portion 21 that faces the gantry 22. As shown in FIGS. 1 and 5, a protrusion 22 a is formed on the surface of the gantry 22 facing the susceptor support 21. A recess 21 b is formed on the surface of the susceptor support portion 21 that faces the gantry 22. The recess 21b is a recess formed in a part of the bottom wall of the groove 21a described above. Further, a convex portion 22 b is formed on the surface of the gantry 22 facing the susceptor support portion 21. This convex part 22b is a part from which a part of the upper surface of the protruding part 22a described above protrudes. As can be seen from FIG. 2, the recesses 21b formed in the susceptor support 21 are arranged at the same interval in the direction along the annular groove 21a in plan view. Moreover, the convex part 22b formed in the mount frame 22 is arrange | positioned at the same space | interval in the position which opposes the said recessed part 21b, ie, the direction along planar view, along the annular projection part 22a. However, if FIG. 1 and FIG. 2 are compared, it can be said that the convex portion 22b should be included in the cross-sectional view of FIG. 2 originally, but the convex portion 22b is not shown in FIG.

  The protruding portion 22 a formed on the gantry 22 can be inserted into the groove 21 a formed on the susceptor support portion 21. Further, the convex portion 22 b formed on the gantry 22 can be inserted into the concave portion 21 b formed on the susceptor support portion 21. As the number of the concave portions 21b and the convex portions 22b, an arbitrary number such as three, four, or five or more can be adopted. FIG. 1, FIG. 2, and FIG. 5 illustrate the case where there are three of these. Further, the concave portions 21b and the convex portions 22b may be arranged so as to be symmetric with respect to the central portion of the susceptor 3, or the distance between the plurality of concave portions 21b and the convex portions 22b may be as illustrated. You may arrange | position so that it may become equal intervals.

  As described above, the planar shape of the surface of the susceptor support 21 that faces the gantry 22 and the surface of the gantry 22 that faces the susceptor support 21 are, for example, annular. In this case, it is preferable that the planar shapes of the grooves 21a and the protrusions 22a formed on the main surfaces of the susceptor support 21 and the gantry 22 facing each other are annular as described above. In other words, the planar shape of the groove 21a and the protrusion 22a when viewed from the direction perpendicular to the main surfaces of the susceptor support 21 and the gantry 22 is an annular shape.

  The susceptor support 21 is originally configured not to rotate with the susceptor 3. However, when the susceptor 3 and the frame 23 rotate about the rotation shaft 17, the susceptor support 21 that is indirectly connected to the frame 23 is applied with a force in the direction in which the susceptor 3 rotates, and the position thereof is the susceptor 3. May move in the direction of rotation. Therefore, in order to suppress such a phenomenon and reduce the possibility that the susceptor support portion 21 moves as the susceptor 3 rotates, the susceptor support portion 21 is fixed to a pedestal 22 connected and fixed to a base member or the like. Is preferred. Therefore, the susceptor support portion 21 can be fixed to the gantry 22 by fitting the concave portion 21b and the convex portion 22b to each other. If the convex portion 22 b is inserted into the concave portion 21 b, the region inside the susceptor support portion 21 other than the region where the concave portion 21 b is formed is filled with the material that forms the susceptor support portion 21. Therefore, even if the susceptor support portion 21 is applied with a force to rotate about the rotation shaft 17 as in the outer peripheral portion of the susceptor 3, the convex portion 22b fitted into the concave portion 21b forms the concave portion 21b. Interfering with the surface (one surface of the concave portion 21b becomes a barrier against the movement of the convex portion 22b). For this reason, the susceptor support part 21 in which the recess 21b is formed does not cause a rotational movement, and can be kept fixed to the base member or the like in the same manner as the gantry 22. As described above, the concave portion 21 b and the convex portion 22 b have a role of fixing the position of the susceptor support portion 21 to the gantry 22.

  On the other hand, the groove 21a and the protruding portion 22a have a role of determining the position of the susceptor support portion 21 with respect to the gantry 22 by inserting the protruding portion 22a into the groove 21a, similarly to the recessed portion 21b and the protruding portion 22b. It also has a role of regulating movement of the susceptor support 21 in the radial direction from the center of the susceptor 3 toward the outside). However, since the planar shape of the groove 21a and the protruding portion 22a is annular, for example, the susceptor support portion 21 has the susceptor 3 in a state in which they are fitted (the concave portion 21b and the convex portion 22b are not formed). If a force to rotate about the rotating shaft 17 is applied as in the outer peripheral portion of the outer peripheral portion of the ring, the operation of the projecting portion 22a is not interfered by using one surface forming the groove 21a as a barrier, and the annular groove 21a. Start rotating along. For this reason, the rotation of the susceptor support portion 21 cannot be restricted only by the groove 21a and the protruding portion 22a, unlike the concave portion 21b and the convex portion 22b. Therefore, formation of the concave portion 21b and the convex portion 22b is important. Therefore, if the susceptor support 21 can be securely fixed to the gantry 22 by forming the recess 21b and the protrusion 22b, the configuration of the groove 21a and the protrusion 22a may be omitted.

  However, when processing the substrate 15 using the processing apparatus 1, the susceptor 3 is heated to a temperature of, for example, 1000 ° C. or more using the heater 7. Since heating is performed at a high temperature as described above, the heat of the susceptor 3 may propagate to the susceptor support 21 and the gantry 22 and may be heated to a high temperature. In this case, for example, due to heating of the susceptor support portion 21, thermal stress may concentrate on the recess 21b. However, by providing the annular groove 21 a along the main surface of the susceptor support portion 21, the generated thermal stress can be evenly distributed to the susceptor support portion 21. For this reason, by providing the groove 21a, for example, even if the thermal stress is concentrated on a part of the recess 21b, the concentration of the thermal stress can be suppressed as compared with the case where the groove 21a is not provided. Accordingly, it is possible to reduce the possibility of deformation or breakage of the member due to the concentration of thermal stress in a part of the recess 21b.

  However, as shown in FIG. 2, for example, the recess 21 b is formed so as to overlap the groove 21 a when the surface of the susceptor support 21 facing the mount 22 is viewed from a direction perpendicular to the surface. Therefore, the depth D2 of the recess 21b shown in FIG. 4 is preferably deeper than the depth D1 of the groove 21a shown in FIG. Here, the depth means a depth in a direction perpendicular to the surface of the susceptor support portion 21 that faces the mount 22. In this way, for example, the side surface 31e or the side surface 31f in the extending direction of the concave portion 21b shown in the cross-sectional view of FIG. 6 interferes with the side surface 22c (see FIG. 5) in the extending direction of the convex portion 22b inserted into the concave portion 21b. . For this reason, it becomes possible for the recessed part 21b and the convex part 22b to fix the susceptor support part 21 so as not to rotate with respect to the gantry 22.

  As shown in FIGS. 1, 2, and 5, the concave portion 21 b and the convex portion 22 b are formed so as to extend in a direction intersecting with a radial direction from the center of the susceptor 3 toward the outer peripheral side. That is, for example, as shown in FIG. 2, the concave portion 21b intersects in the radial direction from the center side having the cavity toward the outer peripheral portion of the annular ring (for example, perpendicular) on the surface of the susceptor support portion 21 that faces the mount 22. It is formed to extend in a direction (having a longitudinal direction). In other words, the recess 21b is formed on the surface of the susceptor support 21 that faces the mount 22 so as to extend in the direction along the annular extending direction of the groove 21a (having a longitudinal direction). For example, as shown in FIG. 5, the convex portion 22b extends in a direction intersecting (for example, perpendicular) to the radial direction from the center side having the cavity to the outer peripheral portion of the annular ring (longitudinal direction), like the concave portion 21b. It is formed so that it may have. In other words, the convex part 22b is formed so as to extend in a direction along the annular extending direction of the protruding part 22a (having a longitudinal direction), like the concave part 21b.

  As shown in FIGS. 2 and 6, the recess 21b is formed inside the groove 21a so as to extend in a direction along the ring-shaped extending direction of the groove 21a. Since the convex part 22b is inserted facing the concave part 21b, the convex part 22b is formed to extend in a direction along the annular extending direction of the protruding part 22a. As described above, when the depth D2 of the concave portion 21b is deeper than the depth D1 of the groove 21a, the convex portion 22b is inserted into the concave portion 21b, and the protruding portion 22a is inserted into the groove 21a. As described above, the height H2 of the convex portion 22b is preferably higher than the height H1 of the protruding portion 22a. Here, the height means a height in a direction perpendicular to the surface of the gantry 22 facing the susceptor support portion 21.

  Moreover, as shown in FIGS. 1-5, the side surface 31c which shows a direction perpendicular | vertical with respect to the direction (direction along the extending direction of the annular shape of the groove | channel 21a) of the recessed part 21b in this Embodiment 1, The shape of the side surface 31d and the cross-sectional shape of the recess 21b in the vertical direction are preferably rectangular. When the concave portion 21b is rectangular, the side surface 22c indicating a direction perpendicular to the extending direction (the direction along the annular extending direction of the protruding portion 22a) of the convex portion 22b inserted into the concave portion 21b. The cross-sectional shape of the convex portion 22b in the vertical direction is preferably rectangular. In this way, the convex portion 22b can be easily inserted into the concave portion 21b. Similarly, the cross-sectional shape of the groove 21a in the direction perpendicular to the extending direction of the groove 21a and the cross-sectional shape of the protruding portion 22a in the direction perpendicular to the extending direction of the protruding portion 22a are also rectangular. Is preferred.

  Here, operation | movement of the said processing apparatus 1 is demonstrated easily. In the processing apparatus 1, the substrate 15 is disposed in the mounting recess 13 of the susceptor 3. Then, after the susceptor 3 on which the substrate 15 is mounted is rotatably installed in an opening formed in the bottom wall of the reaction tube 5, the inside of the reaction tube 5 is set to a predetermined pressure. The setting of the pressure may be performed, for example, by exhausting the atmospheric gas from the reaction tube 5 by the exhaust member 11. Then, after the inside of the reaction tube 5 reaches a predetermined set pressure, the heater 7 is operated to heat the substrate 15 to a predetermined temperature (processing temperature) via the susceptor 3. At this time, the susceptor 3 is rotated via the joint 19 and the rotating shaft 17 by simultaneously driving the motor 20. In a state where the temperature of the substrate 15 reaches the processing temperature, a predetermined amount of reaction gas is supplied from the reaction gas supply member 9 into the reaction tube 5. In this state, the reaction gas is decomposed in a region facing the substrate 15, and a film (for example, a film made of gallium nitride (GaN)) using the reaction gas component as a raw material is formed on the surface of the substrate 15. The gas used for the film formation reaction is exhausted from the reaction tube 5 by the exhaust member 11. In this way, a predetermined film can be formed on the surface of the substrate 15.

  In the processing apparatus 1 described above, when the film forming process as described above is performed on the substrate 15, the susceptor 3 is heated to a high temperature of 1000 ° C. or more by the heater 7 as described above. For this reason, as the susceptor 3 is heated, the heat of the susceptor 3 is also propagated to the susceptor support 21, so that the susceptor support 21 is also heated. Here, the susceptor support portion 21 is heated substantially concentrically from, for example, the surface of the susceptor support portion 21 that faces the gantry 22 or a region having a cavity at the center of the susceptor support portion 21 in the cross-sectional view shown in FIG. A distribution is formed. That is, the region close to the cavity in the center of the susceptor support 21 is close to the susceptor 3 so that the region is close to the high temperature, and the region close to the outer periphery of the susceptor support 21 is remote from the susceptor 3 so that the region is low. The temperature distribution is such that an isotherm close to is formed.

  However, as shown in FIG. 1, the susceptor support portion 21 has an L-shaped shape composed of a region in contact with the outer peripheral portion of the frame 23 and a region near the surface facing the gantry 22. The temperature distribution described above is a temperature distribution in the vicinity of the area where the groove 21a and the recess 21b are formed, which is close to the surface facing the latter gantry 22.

  At this time, by forming the recess 21b in a shape extending in the direction along the annular shape in which the groove 21a extends, side surfaces 31c and 31d forming the recess 21b in the cross-sectional view of FIG. 4 and the ceiling of the recess 21b in FIG. The temperature difference between the joint part 31a and the joint part 31b with the surface that hits the part (bottom wall) becomes small. This is because the concave portion 21b extends in a direction intersecting the paper surface in the cross-sectional view of FIG. 4, so that the distance between the joint portion 31a and the joint portion 31b (when the concave portion 21b extends in the direction (radial direction) along the paper surface ( This is because the horizontal direction in FIG. The direction connecting the joint portion 31a and the joint portion 31b (the left-right direction in FIG. 4) is the radial direction from the center of the susceptor support portion 21 to the outer peripheral side in FIG. 2, and susceptor support when the processing apparatus 1 is operated. It almost coincides with the gradient direction of the temperature distribution of the portion 21. Therefore, if the distance between the junction 31a and the junction 31b is shortened, the temperature difference between the junction 31a and the junction 31b is reduced. Further, for example, the temperature difference between the side surface 31c and the side surface 31d of the recess 21b is reduced. Further, for example, the direction along the direction in which the groove 21 a extends, which is the longitudinal direction of the recess 21 b in FIG. 2, is substantially the direction along the isotherm of the susceptor support portion 21. For this reason, the temperature difference in the joint portion between one side surface of the recess 21b and the other side surface in the longitudinal direction is reduced. As described above, if the recess 21b is formed so as to extend in the direction along the direction in which the groove 21a extends, the temperature difference in the entire recess 21b can be reduced. Can be suppressed. As a result, it is possible to reduce the possibility of deformation or breakage of the recess 21b starting from, for example, a joint.

  By using the susceptor support 21 described above as the processing apparatus 1 and performing a heating process using the heater 7, the recess 21b has a susceptor support having the conventional notch shape described above. It was confirmed that about 1/3 of the maximum thermal stress in the notch shape was generated. From this, it can be said that if the susceptor support portion 21 in the present embodiment is used, the thermal stress applied to the concave portion 21b can be relieved significantly.

  In the above-described embodiment, the protrusion 22b is formed on the upper surface of the protrusion 22a. However, the protrusion 22b may be formed on the side wall of the protrusion 22a. Moreover, you may form the said convex part 22b in both the upper surface and side wall of the protrusion part 22a.

(Embodiment 2)
As shown in FIGS. 7 to 11, the processing apparatus 1 according to the second embodiment has basically the same structure as the processing apparatus 1 according to the first embodiment shown in FIGS. 1 to 5. However, the cross-sectional shape of the recess 21b in the direction perpendicular to the direction in which the recess 21b extends in the second embodiment (the direction along the ring-shaped extension direction of the groove 21a) is triangular. Similarly, when the concave portion 21b has a triangular shape, the convex portion 22b inserted into the concave portion 21b also has a direction perpendicular to the extending direction (the direction along the annular extending direction of the protruding portion 22a). It is preferable that the shape of the side surface 22c (see FIG. 11) and the cross-sectional shape of the convex portion 22b in the perpendicular direction are triangular. In this way, the convex portion 22b can be easily inserted into the concave portion 21b. Similarly, the cross-sectional shape of the groove 21a in the direction perpendicular to the extending direction of the groove 21a and the cross-sectional shape of the protruding portion 22a in the direction perpendicular to the extending direction of the protruding portion 22a are also triangular. Is preferred. As described above, the processing apparatus 1 according to the second embodiment is different from the processing apparatus 1 according to the first embodiment in that the recesses 21b, the protrusions 22b, the grooves 21a, and the protrusions 22a have triangular cross-sectional shapes. It differs in that it is a shape.

  The groove 21a and the recess 21b shown in FIGS. 7 to 10 each have a triangular shape that intersects the surface of the susceptor support portion 21 perpendicularly to the surface in a region having a certain depth from the surface facing the mount 22 of the susceptor support portion 21. It has a shape that is scraped off by parallel movement in a direction along the 21 annular shape. Similarly, with respect to the protrusion 22a and the protrusion 22b shown in FIG. 11, a triangle perpendicular to the surface is formed on the surface of the gantry 22 that faces the susceptor support portion 21. The shape which becomes the locus | trajectory of the said triangle by translating in the direction along is shown.

  Even in this case, the concave portion 21 b and the convex portion 22 b have a role of fixing the susceptor support portion 21 to the gantry 22. Therefore, the depth D4 of the recess 21b shown in FIG. 10 is preferably deeper than the depth D3 of the groove 21a shown in FIG. In this case, since the convex portion 22b is inserted into the concave portion 21b and the protruding portion 22a is inserted into the groove 21a, the height H4 of the convex portion 22b is higher than the height H3 of the protruding portion 22a as shown in FIG. Higher is preferred.

  Also in this case, the concave portion 21b and the convex portion 22b extend in the direction along the annular shape formed by the groove 21a of the susceptor support portion 21 and the direction along the annular shape formed by the protruding portion 22a of the gantry 22, respectively. Have Therefore, as in the first embodiment, for example, the distance between the side surface 33b and the side surface 33c forming the triangular shape of the recess 21b in FIG. The left-right direction in FIG. 10 is the gradient direction of the temperature distribution when the susceptor support 21 is heated. Further, the extending direction of the joint portion 33a between the side surface 33b and the side surface 33c extending in the direction intersecting the paper surface in FIG. 10 is along the direction in which the isothermal line extends when the susceptor support portion 21 is heated. Therefore, if the concave portion 21b is formed so as to extend in the direction along the direction in which the groove 21a extends, the temperature difference in the entire concave portion 21b can be reduced. Therefore, the concentration of thermal stress in the joint portion 33a of the concave portion 21b can be reduced. Can be suppressed. As a result, it is possible to reduce the possibility of deformation or breakage of the concave portion 21b starting from, for example, the joint portion 33a.

  In addition, the figure which combined the rectangular shape in this Embodiment 1, and the triangular shape in this Embodiment 2 as a shape of the recessed part 21b formed in the susceptor support part 21, and the convex part 22b formed in the mount frame 22 is the figure. 12 and the pentagonal shape shown in FIG. 13 may be used. Also in this case, if the direction in which the concave portion 21b and the convex portion 22b extend is the direction along the direction in which the groove 21a and the protruding portion 22a extend, the same as the concave portion 21b and the convex portion 22b in each of the embodiments described above. The effect of. In addition, any shape can be used as the cross-sectional shape of the concave portion 21b and the convex portion 22b. Moreover, in any case where any shape is used as the cross-sectional shape of the concave portion 21b and the convex portion 22b, either a rectangular shape or a triangular shape can be used as the cross-sectional shape of the groove 21a and the protruding portion 22a.

  The second embodiment of the present invention is different from the first embodiment of the present invention only in each point described above. That is, the configuration, conditions, procedures, effects, and the like that have not been described above for the second embodiment of the present invention are all in accordance with the first embodiment of the present invention.

(Embodiment 3)
As shown in FIGS. 14-18, the processing apparatus 1 which concerns on this Embodiment 3 is equipped with the structure fundamentally the same as the processing apparatus 1 which concerns on this Embodiment 1 shown in FIGS. However, the cross-sectional shape of the recess 21b in the direction perpendicular to the direction in which the recess 21b extends (the direction along the extending direction of the annular shape of the groove 21a) in the third embodiment is an arch shape. Here, the arch shape is defined as a curved shape such as a spherical shape or a parabolic shape. Similarly, when the concave portion 21b has an arch shape, the direction of the convex portion 22b inserted into the concave portion 21b is also perpendicular to the extending direction (the direction along the annular extending direction of the protruding portion 22a). The shape of the side surface 22c (see FIG. 18) and the cross-sectional shape of the convex portion 22b in the vertical direction are preferably arched. In this way, the convex portion 22b can be easily inserted into the concave portion 21b. Similarly, the cross-sectional shape of the groove 21a in the direction perpendicular to the extending direction of the groove 21a and the cross-sectional shape of the protruding portion 22a in the direction perpendicular to the extending direction of the protruding portion 22a are also arch-shaped. It is preferable. As described above, the processing device 1 according to the third embodiment has an arched cross-sectional shape of the concave portion 21b, the convex portion 22b, the groove 21a, and the protruding portion 22a compared to the processing device 1 according to the first embodiment. It differs in that it is a mold shape.

  The groove 21a and the recess 21b shown in FIGS. 14 to 17 are each an arch-shaped figure that intersects the surface perpendicularly to the surface of the susceptor support 21 in a region having a certain depth from the surface facing the gantry 22. The susceptor support 21 has a shape that is scraped off in parallel with the direction along the annular shape. Similarly, for the protrusions 22a and the protrusions 22b shown in FIG. 11, an arch-shaped figure perpendicular to the surface is formed on the surface of the gantry 22 facing the susceptor support 21. The shape which becomes the locus | trajectory of the said arch-shaped shape by translating in the direction along an annular shape of this is exhibited.

  Even in this case, the concave portion 21 b and the convex portion 22 b have a role of fixing the susceptor support portion 21 to the gantry 22. Accordingly, the depth D6 of the recess 21b shown in FIG. 17 is preferably deeper than the depth D5 of the groove 21a shown in FIG. In this case, since the convex portion 22b is inserted into the concave portion 21b and the protruding portion 22a is inserted into the groove 21a, the height H6 of the convex portion 22b is higher than the height H5 of the protruding portion 22a as shown in FIG. Higher is preferred.

  In the third embodiment, since the side surface 33b of the recess 21b is a curved surface, there is no region where concentration of thermal stress is likely to occur, such as the joint portion 33a. However, even in this case, by providing the annular groove 21 a along the main surface of the susceptor support portion 21, the generated thermal stress can be evenly distributed to the susceptor support portion 21. For this reason, by providing the groove 21a, for example, even if the thermal stress is concentrated on a part of the recess 21b, the concentration of the thermal stress can be suppressed as compared with the case where the groove 21a is not provided. Accordingly, it is possible to reduce the possibility of deformation or breakage of the member due to the concentration of thermal stress in a part of the recess 21b.

  The third embodiment of the present invention is different from the first embodiment of the present invention only in each point described above. That is, the configuration, conditions, procedures, effects, and the like that have not been described above for the third embodiment of the present invention are all in accordance with the first embodiment of the present invention.

(Comparative example)
As shown in FIGS. 19-20, the processing apparatus 2 which concerns on this comparative example is equipped with the structure fundamentally the same as the processing apparatus 1 which concerns on this Embodiment 1 shown in FIGS. 1-5. However, the recess 21b in the processing apparatus 2 is formed so as to partially overlap the groove 21a and to extend in a direction perpendicular to the extending direction, for example, intersecting the annular extending direction of the groove 21a. ing. Since the convex portion 22b is inserted so as to face the concave portion 21b, the convex portion 22b is formed to extend in a direction intersecting the annular extending direction of the protruding portion 22a. Only in the above points, the processing apparatus 2 is different from the processing apparatus 1 according to the first embodiment.

  When the processing similar to that of the processing apparatus 1 according to the first embodiment is performed on the processing apparatus 2, the susceptor support section 21 has the above-described conventional notch shape due to the heating of the susceptor support section 21. It can be confirmed that substantially the same thermal stress as the maximum thermal stress in the notch shape is generated. From this, it can be said that even if the susceptor support 21 in the form of this comparative example is used, the relaxation of the thermal stress applied to the recess 21b is insufficient.

  This is considered to be due to the following reason. In the processing apparatus 2, when the temperature of the susceptor support 21 is increased by heating the susceptor 3, a heat distribution is formed substantially concentrically like the susceptor support 21 of the processing apparatus 1.

  At this time, in the processing apparatus 2, the recess 21b is formed so as to extend in a direction intersecting with an annular shape in which the groove 21a extends, that is, in a direction intersecting with an isotherm. Therefore, the temperature difference between the pair of side surfaces facing each other in the extending direction of the recess 21b is increased. Moreover, since the recessed part 21b extends in the direction along the gradient direction of the temperature distribution, the temperature difference becomes large at the joint between one side surface extending in the extending direction of the recessed part 21b and the other side surface. For this reason, the temperature difference in the joint portion between one side surface of the recess 21b and the other side surface in the longitudinal direction becomes large. As described above, if the concave portion 21b is formed so as to extend in a direction intersecting with the extending direction of the groove 21a, the temperature difference in the entire concave portion 21b is increased, so that concentration of thermal stress in, for example, the joint portion of the concave portion 21b is suppressed. Will be difficult. Also from this, as shown in the embodiment of the phone invention described above, the concave portion 21b and the convex portion 22b are crossed with respect to the radial direction from the center of the susceptor toward the outer peripheral side (that is, along the isothermal line). It can be seen that it is preferably formed so as to extend in the direction).

  As described above, the embodiments of the present invention have been described. However, it should be considered that the embodiments disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  INDUSTRIAL APPLICABILITY The present invention is particularly excellent as a technique for suppressing concentration of thermal stress in a member that holds an object to be processed when performing heating in substrate processing in a semiconductor manufacturing apparatus that performs film formation.

  1, 2 treatment device, 3 susceptor, 5 reaction tube, 7 heater, 9 reaction gas supply member, 11 exhaust member, 13 mounting recess, 15 substrate, 17 rotating shaft, 19 joint, 20 motor, 21 susceptor support, 21a Groove, 21b concave portion, 22 mount, 22a protruding portion, 22b convex portion, 22c, 31c, 31d, 31e, 31f, 33b, 33c side surface, 23 frame, 31a, 31b, 33a joint portion.

Claims (8)

A rotatable susceptor for holding the object to be processed;
A frame installed on the outer periphery of the susceptor and rotatable with the susceptor;
A susceptor support for supporting the frame;
A gantry for fixing the susceptor support,
A recess is formed on one surface of the susceptor support and the gantry so as to fix a position of the susceptor support with respect to the gantry in a region where the susceptor support and the gantry are opposed to each other. A convex portion that is inserted and fixed in the concave portion is formed on the other surface of the support portion and the gantry,
The said recessed part and the said convex part are the semiconductor manufacturing apparatuses currently formed so that it may extend in the direction which cross | intersects with respect to the radial direction which goes to the outer peripheral side from the center of the said susceptor. The concave portion is formed on the surface of the susceptor support portion, while the convex portion is formed on the surface of the gantry,
In the region where the susceptor support part and the gantry are opposed to each other, a groove is formed on the surface of the susceptor support part,
In the region, a protrusion that can be inserted into the groove is formed on the surface of the gantry,
The recess is formed so as to extend along the extending direction of the groove inside the groove,
The said convex part is formed in the surface of the said protrusion part so that it may extend along the extension direction of the said protrusion part while facing the said recessed part formed in the inside of the said groove | channel. Semiconductor manufacturing equipment. 3. The semiconductor manufacturing apparatus according to claim 2 , wherein a planar shape of the groove and the protruding portion when viewed from a direction perpendicular to the surface facing the gantry in the susceptor support portion is an annular shape.   4. The semiconductor manufacturing apparatus according to claim 1, wherein the susceptor support part and the gantry have a cavity in a central region in a direction along a surface facing the gantry in the susceptor support part. .   The semiconductor manufacturing according to any one of claims 1 to 4, wherein a shape of the susceptor support portion and the gantry viewed from a direction perpendicular to a surface facing the gantry in the susceptor support portion is an annular shape. apparatus. In the susceptor support portion, the cross-sectional shape of the concave portion in a direction perpendicular to the surface facing the gantry and perpendicular to the extending direction of the concave portion is rectangular.
The cross-sectional shape of the convex portion in a direction perpendicular to the surface of the susceptor support portion facing the mount and perpendicular to the extending direction of the convex portion is a rectangular shape. The semiconductor manufacturing apparatus of any one of Claims. In the susceptor support portion, the cross-sectional shape of the concave portion in a direction perpendicular to the surface facing the gantry and perpendicular to the extending direction of the concave portion is a triangular shape,
The cross-sectional shape of the convex portion in a direction perpendicular to the surface of the susceptor support portion facing the gantry and perpendicular to the extending direction of the convex portion is a triangular shape. The semiconductor manufacturing apparatus of any one of Claims. A direction perpendicular to the surface of the susceptor support that faces the mount;
The cross-sectional shape of the concave portion in a direction perpendicular to the extending direction of the concave portion is an arch shape,
The cross-sectional shape of the convex portion in a direction perpendicular to the surface facing the gantry in the susceptor support portion and perpendicular to the extending direction of the convex portion is an arch shape. The semiconductor manufacturing apparatus according to any one of the above.

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