JP5209432B2 - Method and apparatus for determining chip component suction posture - Google Patents

Description

  The present invention relates to a chip component suction posture determination method and apparatus that can easily determine the suction posture of a chip component that is suctioned to the tip of a nozzle and mounted on a printed circuit board.

  Chip components such as resistors and capacitors mounted on a printed circuit board are becoming increasingly smaller. Incidentally, the chip component called “0402” has a substantially rectangular parallelepiped shape having a long side of about 400 μm and a short side of about 200 μm, and has a structure in which a pair of electrode portions are formed on the lower surface portions of both ends in the longitudinal direction. The mounting of the chip component on the printed circuit board is performed exclusively using a mounting machine provided with a nozzle that is driven up and down by adsorbing the top surface of the chip component to its tip (see, for example, Patent Document 1). . It has also been proposed to use an edge sensor to detect whether or not a chip component is sucked by the nozzle and to detect an abnormality in the sucking posture to prevent mounting errors on a printed circuit board (see, for example, Patent Document 2).

On the other hand, the present inventor proposed a technique for detecting the edge of the detection object with high accuracy by analyzing the diffraction pattern of the monochrome parallel light by the detection object that has previously entered the optical path of the monochrome parallel light. (For example, refer to Patent Document 3). Furthermore, the present inventor applies this edge detection technique to detect edges on both sides of a minute detection object having a width smaller than the diffraction width of monochromatic parallel light, for example, 200 μm or less. Proposed a method for detecting the width of the detection object with high accuracy (see, for example, Patent Document 4).
JP 2000-59099 A JP 2007-43076 A Japanese Patent No. 4085409 JP 2005-227153 A

  By the way, in a chip mounter (component mounting machine) configured to include a plurality of suction nozzles and to selectively drive these suction nozzles as shown in Patent Document 2 described above, for example, as shown in FIG. Thus, it is desirable to set the optical path formed between the projector 1 and the light receiver 2 in the arrangement direction of the plurality of suction nozzles 3a to 3n. Then, the light receiving pattern in the light receiver 2 is analyzed in conjunction with the selective raising and lowering operations of the suction nozzles 3a to 3n, and the presence or absence of suction of the chip components 4 sucked by the suction nozzles 3a to 3n, respectively. What is necessary is just to comprise so that abnormality of an adsorption | suction attitude | position may be detected.

  However, since the detection distance (WD) of the light receiving pattern by the light receiver 2 differs depending on the suction nozzles 3a to 3n, the width of the chip component T (the light blocking width of the parallel light flux) is detected by the method disclosed in Patent Document 4 described above. In this case, there is a problem that the detection width of the chip component T varies depending on the detection distance (WD). Further, the suction position of the chip component by the suction nozzle is not necessarily guaranteed to be the center, and the orientation of the chip component is not necessarily aligned in a certain direction. Therefore, if the chip component is normally attracted to the tip of the suction nozzle, it is desirable to be able to measure the orientation of the chip component and the amount of deviation from the normal suction position.

  The present invention has been made in consideration of such circumstances, and its purpose is to use an edge sensor composed of a light projecting unit and a light receiving unit to shift the suction position of the chip component sucked to the tip of the suction nozzle. An object of the present invention is to provide a chip component suction posture determination method and apparatus capable of measuring a deviation angle of an amount and a direction.

  According to the present invention, when the upper surface of a chip part having a substantially rectangular parallelepiped shape is sucked by the suction head, the light shielding width W by the chip part is minimized because the short side of the chip part is orthogonal to the optical axis of the parallel light flux. The light shielding width W is maximized when one of the diagonal directions on the upper surface of the chip component is orthogonal to the optical axis of the parallel light beam, and the long side of the chip component is a parallel light beam. It is noted that the light shielding width W is slightly narrower than the maximum light shielding width when orthogonal to the optical axis.

Therefore, in order to achieve the above-described object, the chip component suction posture determination method according to the present invention includes a light projecting unit and a light receiving unit that form an optical path that traverses a substantially rectangular parallelepiped chip component sucked at the tip of a nozzle in the width direction. When determining the suction posture of the chip component with respect to the nozzle from the output of the light receiving unit using
<a> Analyzing the light receiving pattern in the light receiving unit to detect the edge positions on both sides of the projection surface of the chip component, and shielding the chip component from the detected edge positions on both sides of the chip component Find the width,
<b> Further, the edge positions of both side edges of the chip component when the nozzle is rotated 90 ° and 180 °, respectively,
<c> The positional deviation amount ΔX in the short side direction and the positional deviation amount ΔY in the long side direction of the chip part are obtained from the edge positions on both ends of the chip part at the respective rotational angle positions.

Further, another chip component suction posture determination method according to the present invention includes a first light projecting unit and a second light receiving unit that form an optical path that crosses a substantially rectangular parallelepiped chip component sucked at the tip of a nozzle in the width direction. And a second light projecting unit and a second light receiving unit that form an optical path that crosses the chip component in the axial direction of the nozzle, and outputs the chip component from the outputs of the first and second light receiving units. In determining the suction posture with respect to the nozzle,
<a> Analyzing the light receiving pattern in the second light receiving part to detect the position of the tip part of the nozzle and the position of the tip part of the chip component,
<b> The height dimension of the chip component is obtained from the detected position of the tip of the nozzle and the position of the tip of the chip component, and the tip of the nozzle when the nozzle is rotated by 90 ° Obtain the height dimension of the chip component from the position and the position of the tip of the chip component,
<c> After determining that the suction posture of the chip component is appropriate when it can be considered that the height of the chip component is the height dimension obtained in advance of the chip component to be sucked. ,
<d> Analyzing the light receiving pattern in the first light receiving unit to detect both side edge positions of the chip component, and obtaining the light shielding width of the chip component from the detected side edge positions of the chip component ,
<e> Further, the respective edge positions on both sides of the chip component when the nozzle is rotated 90 ° and 180 ° are obtained,
<f> A positional deviation amount ΔX in the short side direction and a positional deviation amount ΔY in the long side direction of the chip component are obtained from the left and right edge positions at the respective rotation angle positions.

  Preferably, the rotation angle of the nozzle when the light shielding width is minimized and the edge positions on both sides of the chip component are respectively determined from the change pattern of the light shielding width when the nozzle is rotated about its axis. Then, the nozzle is rotated by 90 ° and 180 ° on the basis of the rotation angle, and the rotation angle of the nozzle when the light shielding width is minimized is obtained as a deviation angle Δθ of the orientation of the chip component. May be.

Incidentally, the positional deviation amounts ΔX and ΔY are the positions when the edge positions on both sides of the chip component when the light shielding width is minimum are [L ₀ , R ₀ ], and when the nozzle is rotated by 90 ° and 180 °. When the edge positions on both side edges of the chip component are [L ₉₀ , R ₉₀ ] and [L ₁₈₀ , R ₁₈₀ ], the amount of deviation ΔF between the optical center of the light receiving portion and the rotation center of the nozzle is ΔF = (L ₀ + R ₁₈₀ ) / 2
Or ΔF = (L ₁₈₀ + R ₀ ) / 2
Then, the positional deviation amount ΔX from the rotation center of the nozzle in the short side direction of the chip component is expressed as ΔX = (L ₀ + R ₀ ) / 2 + ΔF
Or ΔX = (L ₁₈₀ + R ₁₈₀ ) / 2 + ΔF
And a positional deviation amount ΔY from the rotation center of the nozzle in the long side direction of the chip component is expressed as ΔY = (L ₉₀ + R ₉₀ ) 2 + ΔF
Is made by asking.

The chip component suction posture determination device according to the present invention is provided in a chip mounter provided with a nozzle for sucking a substantially rectangular parallelepiped chip component at its tip so as to be able to move up and down in the axial direction and rotatably about the axis. An adsorption posture determination device for a chip component to be incorporated,
<A> a light projecting unit and a light receiving unit that form an optical path across the chip part adsorbed on the tip of the nozzle in the width direction;
<B> Edge detection means for analyzing the light receiving pattern at the light receiving portion and detecting the edge positions on both sides of the chip component,
<C> A light-shielding width detecting means for obtaining a light-shielding width of the chip component from the edge positions on both sides of the chip component detected by the edge detecting means;
<D> The rotation angle of the nozzle when the light shielding width is minimized and the edge positions on both side edges of the chip component from the change pattern of the light shielding width when the nozzle is rotated about its axis. Measurement control means for rotating the nozzle 90 ° and 180 ° with reference to the rotation angle,
<E> Shortening of the chip component based on the positions of both side edges of the chip component when the light shielding width is minimized, and the positions of both side edges of the chip component when the nozzle is rotated 90 ° and 180 ° It is characterized by comprising a calculating means for obtaining a positional deviation amount ΔX in the side direction and a positional deviation amount ΔY in the long side direction.

In addition to the configuration described above, another chip component suction posture determination device according to the present invention includes:
<F> a second light projecting unit and a second light receiving unit that form an optical path crossing the chip component in the axial direction of the nozzle;
<G> Second edge detection means for analyzing the light receiving pattern at the second light receiving portion and detecting the position of the tip portion of the nozzle and the position of the tip portion of the chip component,
<H> The height dimension of the chip component is obtained from the position of the tip portion of the nozzle and the position of the tip portion of the chip component detected by the second edge detection means, and the nozzle is rotated by 90 °. The height dimension of the chip component is obtained from the position of the tip portion of the nozzle and the position of the tip portion of the chip component, and the height dimension of these chip components is obtained in advance of the chip component to be sucked. It is further characterized by further comprising a height judging means for judging that the suction posture of the chip component is appropriate when it can be considered that the height is a certain height.

By the way, the calculation means is [L ₀ , R ₀ ] on both side edge positions of the chip component when the light shielding width is minimum, and both sides of the chip component when the nozzle is rotated 90 ° and 180 °. When the end edge positions are [L ₉₀ , R ₉₀ ] and [L ₁₈₀ , R ₁₈₀ ], the shift amount ΔF between the optical center of the light receiving unit and the rotation center of the nozzle is ΔF = (L ₀ + R ₁₈₀ ). / 2
Or ΔF = (L ₁₈₀ + R ₀ ) / 2
Then, the positional deviation amount ΔX from the rotation center of the nozzle in the short side direction of the chip component is expressed as ΔX = (L ₀ + R ₀ ) / 2 + ΔF
Or ΔX = (L ₁₈₀ + R ₁₈₀ ) / 2 + ΔF
And a positional deviation amount ΔY from the rotation center of the nozzle in the long side direction of the chip component is expressed as ΔY = (L ₉₀ + R ₉₀ ) / 2 + ΔF
Configured to ask for.

  According to the chip component suction posture determination method and apparatus having the above-described configuration, it is possible to measure the orientation of the chip component sucked at the tip of the nozzle and the amount of displacement thereof. It is possible to control the orientation and the mounting position with high accuracy. Further, it is possible to easily determine an abnormality in the suction posture of the chip component by the nozzle. Therefore, if the above-mentioned misalignment amount is measured only for the normally sucked chip parts after the determination of the suction posture abnormality, the measurement process is simplified and the measurement reliability is improved. Can be improved.

Hereinafter, a chip component suction posture determination method and apparatus according to an embodiment of the present invention will be described with reference to the drawings.
The chip component adsorption posture determination device according to the present invention is used by being mounted on a chip mounter (component mounter) for mounting a chip component on a printed circuit board, and FIG. Yes. In particular, this suction posture determination device determines whether or not the suction posture of the chip component T sucked to the tip of the suction nozzle 3 in the chip mounter is good and measures the orientation of the chip component T and the amount of displacement of the suction position. The first edge sensor 4 including the first light projecting unit 1 and the first light receiving unit 2 that form an optical path that crosses the lifting / lowering region of the suction nozzle 3, and the axial direction of the suction nozzle 3. And a second edge sensor 7 including a second light projecting unit 5 and a second light receiving unit 6 that form an optical path.

  The component mounting apparatus incorporates the suction nozzle 3 in a vertically movable XY table mechanism 10 movably in a horizontal plane, and the suction nozzle 3 is rotatable about its axis. It is provided and configured. This component mounting apparatus controls the movement of the XY table mechanism 10 in the XY direction under the control of the table control unit 12 in the mounting control unit 11, for example, with respect to the printed circuit board placed on the XY table mechanism 10. The suction nozzle 3 is positioned. Further, under the control of the nozzle control unit 13 in the mounting control unit 11, the Z-axis drive mechanism 14 and the θ drive mechanism 15 are respectively driven to drive the suction nozzle 3 up and down and rotate the suction nozzle 3. Move. Then, while controlling the operation of the suction nozzle 3 by a suction device (not shown), the chip component T sucked to the tip of the suction nozzle 3 is surface-mounted on a printed board (not shown). Although only one suction nozzle 3 is shown in FIG. 1, as described above, the component mounting apparatus may include a plurality of suction nozzles 3 that are alternatively driven. The Z-axis drive mechanism 14 and the θ-axis drive mechanism 15 may be position / angle control using the mounting controller 11 as a control computer, or may be capable of determining the position / angle by a mechanical structure. Those skilled in the art may appropriately determine and provide them.

  1st edge sensor 4 (1st light projection part 1 and 1st light-receiving part 2) and 2nd edge sensor 7 (2nd light projection part 5 and 2nd in the adsorption posture determination apparatus which concerns on this invention. The light receiving unit 6) is integrally incorporated in the above-described XY table mechanism 10 of the above-described component mounting apparatus. In particular, the first light projecting unit 1 is provided so as to project a parallel light flux (a bundle of light beams in geometric optics) having a predetermined width in the horizontal direction in a direction crossing the lifting region of the suction nozzle 3. The second light projecting unit 5 is provided so as to project a parallel light beam (a bundle of light beams in geometric optics) having a predetermined width in the vertical direction in a direction crossing the axis of the suction nozzle 3. The light projecting units 1 and 5 are configured using a light source such as a light emitting diode (LED) or a semiconductor laser element (LD) and an optical system such as an optical fiber or a collimator / lens.

  The first and second light receiving portions 2 and 6 are provided at positions facing the light projecting portions 1 and 5 with the lifting / lowering region of the suction nozzle 3 interposed therebetween, and are emitted from the light projecting portions 1 and 5. The light receiving light is received, and a change in the amount of light received by the suction nozzle 3 entering the optical path or the tip part T adsorbed to the tip portion thereof is detected. In particular, the first and second light receiving units 2 and 6 are mainly composed of, for example, a line sensor capable of receiving the parallel light beam over the entire width thereof, and the amount of light received at each position of the line sensor is an electric signal. By detecting the change in the received light amount in the width direction of the line sensor (light receiving pattern) that has changed due to the suction nozzle 3 that has entered the optical path or the chip component that has been sucked to the tip of the suction nozzle 3 is detected. Configured to do.

  In this way, the suction posture determination device constructed by incorporating the first and second edge sensors 4 and 7 into the component mounting device basically enters the optical path as the suction nozzle 3 moves up and down. By analyzing the light receiving pattern at the first light receiving portion 2 that changes due to the chip component T or the suction nozzle 3, the edge positions of the both ends of the chip component T or the suction nozzle 3, that is, the line sensor The first edge detecting means 21 for detecting the left and right edges in the width direction is provided.

  The first edge detection means 21 is configured such that the parallel light flux is partially blocked by the chip part T or the suction nozzle 3 existing in the optical path, and both sides of the chip part T or the suction nozzle 3 in the width direction of the sane sensor. Note that the parallel light beam generates Fresnel diffraction at the end, that is, the left and right edges of the chip part T or the suction nozzle 3, and the light receiving pattern at the light receiving unit 3 changes as shown in FIG. Then, the right and left edge positions are detected by analyzing the light receiving pattern in the light receiving unit 3. The edge detection method is as described in Patent Documents 3 and 4 described above, for example.

  The edge detection by the first edge detecting means 21 will be briefly described. The normalized received light amount in each light receiving cell of the line sensor when there is no light blocking object such as the chip part T or the suction nozzle 3 is [1]. In this case, basically, as illustrated in FIG. 3, the position where the light receiving amount in the light receiving pattern in which Fresnel diffraction is caused by the presence of the light shielding object is [0.25] corresponds to the edge position of the light shielding object. The edge position is detected by paying attention to.

  Further, if the light quantity does not decrease to [0.25] because the light shielding width of the parallel light flux by the light shielding object is narrow, it is considered that the change of the light receiving pattern by the light shielding object occurs symmetrically. Paying attention to only the light receiving pattern on one side, the deviation amount Δx between the position where the light amount has decreased to a predetermined value Yth, for example, [0.75], and the edge position where the light receiving amount is [0.25] is The edge position is detected using the fact that the change of the light receiving pattern is determined by an approximate function. The first edge detecting means 21 basically analyzes the light receiving pattern in the first light receiving unit 2 in this way, and thereby the left and right edges (both sides of the chip component T or the suction nozzle 3). Each edge is detected.

  The second edge detecting means 31 for analyzing the output from the second light receiving unit 6 also detects the edge position of the light shielding object in the same manner as the first edge detecting means 21. In particular, the second edge detecting means 31 detects the tip position of the suction nozzle 3 in a state in which the chip component T is not sucked, and uses the detected tip position of the suction nozzle 3 as a reference. The tip position of the chip component T adsorbed on the tip portion is detected. In the height determination means 32, the difference between the tip position of the suction nozzle 3 detected by the second edge detection means 31 and the tip position of the chip component T sucked by the tip portion of the suction nozzle 3 is obtained. The height H of the chip part T is detected.

  By the way, when the first edge detecting means 21 described above measures the width of the chip part T, the amount of received light is reduced to [0.25] due to the diffraction waveforms from the right and left edges of the chip part T interfering with each other. The situation of not doing can occur. However, in the second edge detection means 31, diffraction occurs only at the lower edge of the chip part T, and the upper side is shielded by the suction nozzle 3, so that the above-mentioned interference problem does not occur. Therefore, it is possible to detect the edge position (the lower edge of the chip component) as the position where the amount of received light is [0.25]. The role of the height determination unit 32 will be described later.

  Here, the detection of the suction state of the chip component T based on the left and right edge positions of the chip component T detected by the first edge detection means 21, particularly the detection of the orientation of the chip component T and the amount of deviation of the suction position. explain. When the suction nozzle 3 that sucks the chip component T at the tip is rotated about its axis, the chip component T rotates with this, and the direction of the parallel light with respect to the optical axis changes. Therefore, since the light receiving pattern at the first light receiving portion 2 changes, the left and right edge positions L and R of the chip part T obtained by analyzing the light receiving pattern by the first edge detecting means change. .

  FIG. 4 shows how the left and right edge positions L and R of the chip component T change when the suction nozzle 3 is rotated through 360 °, and the chip component obtained as the difference between the edge positions L and R. The state of change of the light shielding width W with respect to the parallel light due to T is shown. Focusing on this change in the light shielding width W, sharp valleys A where the light shielding width W becomes narrow are generated at two positions having a difference of 180 ° in the rotation angle, and an angular difference of 90 ° from these valleys A is obtained. A relatively loose valley B is produced at a certain rotational position.

  Incidentally, the chip part T has a substantially rectangular parallelepiped shape, and its upper surface is sucked by the suction head 3. Therefore, the light shielding width W by the chip part T is minimized. This is when it is orthogonal to the optical axis. The light shielding width W is maximized when the diagonal direction of the chip part T is orthogonal to the optical axis of the parallel light flux, and the long side of the chip part T is relative to the optical axis of the parallel light flux. The light shielding width W is slightly narrower than the maximum light shielding width.

  Therefore, the rotation angle θ of the suction head 3 when the valley A where the light shielding width W obtained as described above is minimum is obtained, the short side of the chip part T is orthogonal to the optical axis of the parallel light bundle. It can be said that the light shielding width W indicates the light shielding width at the short side of the chip part T. The light shielding width W at a position rotated by 90 ° from this position is such that the long side of the chip part T is positioned in a direction perpendicular to the optical axis of the parallel light bundle, that is, the long side of the chip part T. It can be said that the shading width is shown.

By the way, if the axis (rotation center) of the suction head 3 and the optical center position of the first edge sensor 4 coincide with each other, for example, the left and right of the chip component T detected in the valleys A and B, respectively. The edge positions L and R are simply replaced with the left and right edge positions L and R when the chip part T is rotated 180 °. In spite of this, for example, the left edge position L _{0 of} the chip component T detected in the valley A and the chip component T at the position A ′ obtained by rotating the suction head 3 by 180 ° from the valley A. When the right edge position R ₁₈₀ is different, it means that the axial center of the suction head 3 and the optical center position of the first edge sensor 4 are shifted. The deviation amount (offset amount) ΔF is, for example, ΔF = (L ₀ + R ₁₈₀ ) / 2 or ΔF = (L ₁₈₀ + R ₀ ) / 2.
Can be obtained as

On the other hand, there is no deviation between the axis of the suction head 3 and the optical center position of the first edge sensor 4 (offset amount ΔF = 0), and there is a deviation in the suction position of the chip component T with respect to the suction head 3. In some cases, the left and right edge positions L and R of the chip part T when the suction head 3 is rotated 180 ° are basically simply switched as shown in FIG. The same applies when the suction head 3 is rotated 90 ° and 270 °. The center position of the chip component T is the center position between the left and right edge positions L and R. Accordingly, the amount of deviation ΔX between the axis of the suction head 3 and the center position in the short side direction of the chip part T is calculated from the left and right edge positions L and R of the chip part T in the direction in which the light shielding width W is minimized. (L ₀ + R ₀ ) / 2 or ΔX = (L ₁₈₀ + R ₁₈₀ ) / 2
Can be obtained as Further, regarding the deviation amount ΔY between the axis of the suction head 3 and the center position in the long side direction of the chip part T, when the suction head 3 is rotated by 90 ° and 270 ° from the direction in which the light shielding width W is minimized. ΔY = (L ₉₀ + R ₉₀ ) / 2 or ΔY = (L ₂₇₀ + R ₂₇₀ ) / 2 from the left and right edge positions L ₉₀ , R ₉₀ , L ₂₇₀ and R _{270 of}
Can be obtained as

Therefore, in consideration of the deviation amount (offset amount) ΔF between the axis (rotation center) of the suction head 3 and the optical center position of the first edge sensor 4 described above, the axis of the suction head 3 and the chip part T are arranged. The amount of deviation ΔX from the center position in the short side direction is
ΔX = (L ₀ + R ₀ ) / 2 + ΔF or ΔX = (L ₁₈₀ + R ₁₈₀ ) / 2 + ΔF
As for the amount of deviation ΔY between the axis of the suction head 3 and the center position of the chip part T in the long side direction,
ΔY = (L ₉₀ + R ₉₀ ) / 2 + ΔF or ΔY = (L ₂₇₀ + R ₂₇₀ ) / 2 + ΔF
Can be obtained as

  The chip component suction posture determination method and apparatus according to the present invention is based on the above-described consideration, and the light shielding width based on the left and right edge positions L and R of the chip component T obtained by the first edge detection means 21. Focusing on the light shielding width W by the chip part T obtained by the detecting means 22, the minimum width detecting means 23 obtains the rotation angle θ of the suction head 3 at which the light shielding width W is minimized, and the deviation angle detecting means 24 performs the above. The angle θ is detected as a deviation angle Δθ of the chip component T sucked to the tip of the suction head 3 with respect to the reference method of the suction head 3.

Then, the measurement control means 25 rotates the suction nozzle 3 by 90 ° and 180 ° around its axis center with the angle θ detected as described above as a reference [0 °], and these 0 °, 90 °, 180 Left and right edge positions [L ₀ , R ₀ ], [L ₉₀ , R ₉₀ ], [L ₁₈₀ , R ₁₈₀ ] of the chip component T at each angular position of ° are detected by the first edge detection means 21, respectively. doing.

In the offset amount detection means 26, the left and right edge positions [L ₀ , R ₀ ], [L ₁₈₀ , R _{180 of the} chip part T at the rotation positions of the reference positions [0 °] and [180 °] as described above _. ], The shift amount (offset amount) ΔF between the axis of the suction head 3 and the optical center position of the first edge sensor 4 is ΔF = (L ₀ + R ₁₈₀ ) / 2 or ΔF = (L ₁₈₀ + R ₀ ) / 2
Asking.

Further, in the positional deviation amount detection means 27, the deviation amount (offset amount) ΔF obtained as described above and the left and right edge positions of the chip component T at the rotation positions of the reference positions [0 °] and [90 °]. Based on [L ₀ , R ₀ ], [L ₉₀ , R ₉₀ ], the amount of displacement ΔX in the X direction of the chip part T with respect to the suction head 3 is expressed as ΔX = (L ₀ + R ₀ ) / 2 + ΔF or ΔX = (L ₁₈₀ + R ₁₈₀ ) / 2 + ΔF
Further, the positional deviation amount ΔY in the Y direction is calculated as ΔY = (L ₉₀ + R ₉₀ ) / 2 + ΔF or ΔY = (L ₂₇₀ + R ₂₇₀ ) / 2 + ΔF.
Asking.

  These positional deviation amounts ΔX and ΔY are output together with the deviation angle Δθ indicating the direction of the chip component T obtained by the deviation angle detecting means 24 described above, and the component mounting apparatus described above applies the chip component T to the printed board. It is used for mounting control. Specifically, the mounting control of the chip component in the component mounting apparatus is performed by correcting the displacement of the mounting position of the chip component T attracted to the tip of the suction head 3 with respect to the printed circuit board according to the displacement amounts ΔX and ΔY, and the displacement. This is done by correcting the deviation of the mounting direction of the chip component T sucked at the tip of the suction head 3 with respect to the printed board according to the angle Δθ.

  By the way, the detection of the positional deviation amounts ΔX and ΔY and the deviation angle Δθ of the chip component T described above is executed on the assumption that the upper surface of the chip component T is correctly attracted to the tip of the suction head 3. However, in the case of a small chip component T referred to as [0402], the suction head 3 is not always capable of sucking the upper surface of the chip component T. Therefore, in this apparatus, since the dimensional specification of the chip component T to be mounted (sucked) can be obtained in advance, the suction failure state is determined by paying attention to the height of the chip component T, and is attached to the tip of the suction head 3. The above-described suction posture determination process, specifically, the measurement of the positional deviation amounts ΔX and ΔY and the deviation angle Δθ is performed only for those that can be considered to be sucked in a normal posture.

  In order to measure the height H of the chip component T adsorbed to the tip of the adsorption head 3, the present apparatus includes the second edge sensor 7 described above. Incidentally, as for the second edge sensor 7, for example, as shown in FIG. 6, the light receiving section is connected to the center position of the light receiving section 2 of the first edge sensor 4 described above in a direction orthogonal to the first edge sensor 4. 6 may be used. By using an edge sensor in which the light receiving portions 2 and 6 are arranged in a T shape in this way, it is possible to detect the height H while detecting the left and right edge positions L and R of the chip component T.

  However, at present, it is difficult to inexpensively integrally form two line sensors having different pixel cell arrangement directions, and it is generally necessary to use an expensive area sensor in which pixel cells are two-dimensionally arranged. It becomes. Therefore, practically, as shown in FIG. 7, the second edge sensor 7 having the pixel cell arrangement direction perpendicular to the first edge sensor 4 having the pixel cell arrangement direction horizontal has a predetermined distance. It suffices if they are separated from each other. In particular, the first edge sensor 4 is provided so that its optical center coincides with the axis of the suction head 3, and the second edge sensor 7 is provided so as to overlap the axis of the suction head 3. It ’s fine.

  Then, the suction head 3 is lowered in advance to a position where the pixel cell at the tip of the second edge sensor 7 is shielded from light at the tip of the suction head 3, and the lowered position is used as a reference position for height measurement. Remember it. Thereafter, when the height of the chip component T is measured, the suction head 3 is lowered to the reference position, and in this state, the light receiving pattern of the second edge sensor 7 is analyzed while rotating the suction head 3. The tip position of T may be obtained, and the difference between the tip position of the chip component T and the tip position of the suction nozzle 3 may be obtained as the height h of the chip component T.

  Here, the quality determination of the suction posture based on the height h of the chip component T measured as described above will be described. When the upper surface of the chip component T is correctly sucked by the tip of the suction head 3, FIG. Even if the suction head 3 is rotated and the direction of height detection is changed as shown in (a) and (b), the detection heights h1 and h2 hardly change. The detected heights h1 and h2 are basically substantially equal to the height H of the chip component T obtained in advance.

  On the other hand, when the end face or side surface of the chip component T is sucked by the tip of the suction head 3, the suction head 3 is rotated to change the height detection direction as shown in FIGS. Even if it is changed, the detected heights h1 and h2 hardly change, but the detected heights h1 and h2 themselves are greatly different from the height H of the chip component T that is obtained in advance. Therefore, by comparing the heights h1 and h2 of the chip component T detected as described above with the height H of the chip component T obtained in advance, the chip component T is correctly adsorbed on its upper surface. Or whether the side surface or the end surface is adsorbed.

  In addition, when the chip part T has a substantially rectangular parallelepiped shape, the side portion may rarely be adsorbed as shown in FIG. 8 (e), for example. In some cases, the height h of the chip component T detected in a certain direction is approximately equal to the height H of the chip component T that is accidentally obtained in advance. However, even in such a suction state, when the height of the chip part T is measured from different directions by rotating the suction head 3, the height generally changes. That is, when the suction head 3 is rotated, the detection height h of the chip component T sucked to the tip of the suction head 3 changes. Therefore, it is determined whether or not the detected height h of the chip part T changes with the rotation, and if the detected height h changes, it is determined that the suction state of the chip part T is defective. It becomes possible.

  The height determination means 32 described above detects the height h of the chip component T adsorbed on the tip of the adsorption nozzle 3 while rotating the adsorption nozzle 3 based on such a viewpoint, and the height h is determined in advance. By determining whether or not the required height of the chip component is obtained, whether the suction posture is good or not is determined. Here, the detected height h and the height dimension of the chip component do not have to be completely the same. For example, even when the height h is in a range in which the noise of the sensor is added to or subtracted from the height dimension of the chip part, the height dimension of the chip part is the height dimension obtained in advance of the chip part to be attracted, That is, it goes without saying that the suction posture of the chip component may be regarded as appropriate. Only when it can be considered that the suction posture is normal, the determination processing of the suction posture of the chip component T based on the output of the first edge sensor 4 described above is executed.

FIG. 9 shows an example of a determination processing procedure (a suction posture determination method) in the chip component suction posture determination apparatus configured as described above.
This process is started by first sucking the chip component T onto the tip of the suction nozzle 3 <Step S1>. Thereafter, the suction nozzle 3 is lowered to a position where the tip pixel cell in the second edge sensor 7 is shielded from light at the tip, and in this state, the suction head 3 is output from the output of the second edge sensor 7. The tip position of the chip part T adsorbed on the tip of the chip is detected <step S2>. Then, it is determined whether or not the height H of the chip component T is [0] from the detected tip position of the chip component T and the tip position of the suction nozzle 3 <step S3>. Specifically, it is determined whether or not the detected tip position of the chip component T is the same as the tip position of the suction nozzle 3. If the height h of the chip component T is [0] by this determination, it is determined that the chip component T is not attracted to the tip of the suction head 3. In this case, after the suction head 3 is raised to the original height position <Step S4>, the chip component T is picked up again.

  On the other hand, when the height h of the chip component T is not [0], the height h of the chip component T detected at that time is obtained in advance as a dimensional specification of the chip component T to be measured. It is determined whether or not it exceeds a reference set based on the height H, for example, [1/2] of the height H plus a predetermined allowable value α <step S5>. If this determination condition (detection criterion) is exceeded, it is highly likely that the end surface or side surface of the chip part T is sucked, and the chip part T is discarded <step S6>, and the suction head 3 is moved. The position is raised to the lower height position <Step S4>, and the chip component T suction processing is restarted from the beginning.

  Thereafter, when the height h of the chip component T detected as described above satisfies the detection criterion described above, the light shielding width W detected from the output of the first edge sensor 4 described above is minimized. Then, the suction nozzle 3 is rotated <Steps S7, S8>. If the position where the light shielding width W is minimum is detected, the rotation of the suction nozzle 3 is stopped <Step S9>, and whether or not the output of the second edge sensor 7 at that time has changed, that is, the edge sensor. 7 determines whether or not the height h of the chip part T detected from the output of 7 has changed (step S10). If no change in the height h of the chip component T is recognized, it is considered that the upper surface of the chip component T is sucked by the tip of the suction nozzle 3, and the suction posture determination processing of the chip component T is performed. Migrate to When the height h of the chip part T changes, it is determined that the chip part T is sucked in an inclined state, and after discarding the chip part T <step S6>, the suction head 3 is moved down. To the height position <step S4>, and the chip component T is picked up again from the beginning.

When the determination of the basic suction posture of the chip component T to the suction head 3 is finished as described above, the suction posture of the chip component T determined to have no abnormality in the suction posture is then selected. The displacement amount of the suction position of the chip component T by the head 3 and the displacement angle of the direction of the chip component T are detected by analyzing the output of the first edge sensor 4. Specifically, first, the output of the first edge sensor 4 is analyzed to determine the left and right edge positions L and R of the chip component T <step S11>. At this time, the rotation angle (orientation) that minimizes the light-shielding width by the chip component T is obtained by the above-described steps and 8 and the rotation of the suction nozzle 3 is stopped at the rotation angle position. The obtained left and right edge positions L, R of the chip part T are set as edge positions L ₀ , R ₀ at a reference position [0 °] where the parallel light beam is blocked by the short side of the chip part T.

Thereafter, the suction head 3 is rotated by 90 ° <step S12>, and the edge position L ₉₀ at the position where the parallel light beam is blocked by the long side of the chip part T from the output of the first edge sensor 4 at that time. _R90 is obtained <Step S13>. Similarly, by further rotating the suction head 3 by 90 °, the suction head 3 is rotated by 180 ° <step S14>, and at the short side on the opposite side of the chip component T from the output of the first edge sensor 4 at that time. The edge positions L ₁₈₀ and R ₁₈₀ at the position where the parallel light beam is blocked are obtained <step S15>. The light shielding widths W ₀ obtained from the left and right edge positions L ₀ , R ₀ , L ₉₀ , R ₉₀ , L ₁₈₀ , and R ₁₈₀ obtained at the respective rotation angles 0 °, 90 °, and 180 °, respectively. , W ₉₀ , W ₁₈₀ to calculate the conversion magnification M in order to convert the actual chip part T to the short side and long side dimensions (step S16).

Regarding the conversion magnification M, the light receiving pattern on the first light receiving part 2 of the Fresnel diffraction generated in the chip part T depends on the distance (working distance) WD between the chip part T and the light receiving part 2, and For example, M = L _L / W ₉₀ or M = L _S using the fact that the lengths L _S and L _L of the short side and the long side can be obtained in advance from the dimensional specification of the chip part T to be measured. / W ₀ = L _S / W ₁₈₀
Can be calculated as

  In this way, by obtaining the conversion magnification M, the edge sensor 4 detects the suction state of the chip component T by the plurality of suction nozzles 3 that are alternatively driven up and down as shown in FIG. Even when the distance (working distance) WD between the light receiving unit 2 and the suction head 3 changes, the dimensions and displacement amounts of the chip component T are correctly measured as shown below. It becomes possible to do.

Thereafter, the deviation amount (offset amount) ΔF between the optical center position of the first edge sensor 4 and the axis of the suction head 3 is used by using the conversion magnification M described above, whereby ΔF = M · (L ₀ + R ₁₈₀ ) / 2
Or ΔF = M · (L ₁₈₀ + R ₀ ) / 2
As the actual size, <Step S17>.

Based on the offset amount ΔF calculated as described above, the positional deviation amounts ΔX, ΔY of the chip part T in the short side direction and the long side direction are set to ΔX = M · (L ₀ + R ₀ ) / 2 + ΔF
Or ΔX = M · (L ₁₈₀ + R ₁₈₀ ) / 2 + ΔF
Further, a positional deviation amount ΔY in the Y direction is obtained as follows: ΔY = (L ₉₀ + R ₉₀ ) / 2 + ΔF
Or ΔY = (L ₂₇₀ + R ₂₇₀ ) / 2 + ΔF
<Step S18>.

  The deviation amounts ΔX and ΔY obtained as described above and the rotation angle at which the light shielding width W is minimized are output as the deviation angle Δθ indicating the direction of the chip component T, and this is output as the deviation of the chip component T in the component mounting apparatus. Provided as mounting control data <Step S19>. As a result, the component mounting apparatus corrects the mounting position of the chip component T on the printed circuit board according to the shift amounts ΔX and ΔY, and corrects the orientation of the chip component T according to the shift angle Δθ. The component T is mounted at the correct position in the correct orientation with respect to the printed circuit board. Thereafter, the suction head 3 on which the chip component T is mounted on the printed board is raised <step S20>, and the processing from step S1 described above is repeatedly performed on the next chip component T.

  Thus, as described above, the output of the edge sensor 4 is analyzed to determine the suction posture of the chip component T attracted to the tip of the suction head 3, and in particular, the axis of the suction head 3 at the suction position of the chip component T. According to the suction posture determination method and determination apparatus for obtaining the shift amounts ΔX, ΔY from the head and the shift angle Δθ indicating the direction of the chip component T, the mounting position and mounting of the chip component T with respect to the printed circuit board using the detection result Can be controlled easily and with high accuracy. In addition, by analyzing the light receiving pattern on the light receiving portion 2 caused by Fresnel diffraction generated at the edge of the minute chip component T, the left and right edge positions L and R are obtained, and from these edge positions L and R While obtaining the light shielding width W and rotating the suction head 3, the direction of edge position detection is changed, and the orientation of the chip component T is determined by paying attention to the change in the light shielding width W at that time. An effect is obtained such that the amount of displacement ΔX, ΔY of the suction position can be easily obtained with high accuracy.

  In addition, this invention is not limited to embodiment mentioned above. For example, if the distance (working distance) WD between the suction nozzle 3 and the light receiving unit 2 is known, the offset amount ΔF and the positional deviation amount ΔX, directly from the left and right edge positions L, R detected by the edge detection means 21. ΔY may be obtained. Further, when the suction head 3 is rotated to detect the left and right edge positions L, R of the chip component T, for example, the tip position of the top component T is detected while the suction head 3 is lowered, The suction head 3 may be rotated at a position where the suction nozzle 3 is lowered by half the height H of the chip part T from the detection position.

  In the embodiment described above, the rotation angle at which the light shielding width by the chip component T is minimized is defined as the reference position [0 °]. However, it is not necessary to obtain the deviation angle Δθ, and the chip component T is a rectangular parallelepiped. In some cases or when high measurement accuracy is not required, the present invention is not necessarily limited to this, and the subsequent processing may be performed by regarding the angle at the time of suction as the reference position [0 °]. This is because the chip part T is usually not a perfect rectangular parallelepiped, and therefore it is difficult to accurately measure the short side or the length other than the long side of the chip part T with the edge sensor 7 when rotating the suction head 3. It is. Further, as shown in FIG. 4, since the output value of the edge sensor 7 before and after the rotation angle is larger than the long side of the chip part T, the output value of the edge sensor 7 shows a large amount of change. Also, there is an advantage that it is possible to obtain the aforementioned deviation angle Δθ. In addition, the present invention can be variously modified and implemented without departing from the scope of the invention.

The principal part schematic block diagram of the adsorption | suction attitude | position determination apparatus of the chip component which concerns on one Embodiment of this invention integrated in a component mounting apparatus. The figure which shows the example of the light reception pattern in a light-receiving part when a chip component or a suction nozzle exists in an optical path. The figure which shows the relationship between the light reception pattern which produced the Fresnel diffraction with the edge of the light-shielding object, and an edge. The figure which shows the change of the edge position detected with rotation of the suction nozzle which attracted | sucked chip components correctly at the front-end | tip, and the change of the light-shielding width. The figure which shows the relationship between the left and right edge positions L and R according to the rotation angle of a chip component, and the light-shielding width W. The figure which shows the ideal relationship between the 1st edge sensor which detects the edge positions L and R of the left and right of chip components, and the 2nd edge sensor which detects the height of chip components. The figure which shows the relationship between the 1st edge sensor which detects the left and right edge positions L and R of a chip component, and the 2nd edge sensor which detects the height of a chip component. The figure which shows the mode of the chip component's adsorption | suction state, and the detection height h of a chip component accompanying rotation of an adsorption | suction head. The figure which shows an example of the determination processing procedure which shows the adsorption | suction attitude | position determination method of the chip component which concerns on one Embodiment of this invention. The figure which shows the example of arrangement | positioning of the edge sensor for an adsorption | suction attitude | position test | inspection with respect to the component mounting machine provided with the several adsorption nozzle.

Explanation of symbols

T chip component 1,5 light projecting unit 2,6 light receiving unit 3 suction nozzle 4 first edge sensor 7 second edge sensor 21 edge detection unit 22 light shielding width detection unit 23 minimum width detection unit 24 deviation angle detection unit 25 measurement Control means 26 Offset amount detection means 27 Position shift amount detection means 31 Edge detection means 32 Height determination means

Claims (5)

A first light projecting unit and a first light receiving unit that form an optical path that traverses a substantially rectangular parallelepiped chip component adsorbed on the tip of the nozzle in the width direction; and an optical path that traverses the chip component in the axial direction of the nozzle. When determining the suction posture of the chip component with respect to the nozzle from the outputs of the first and second light receiving units using the formed second light projecting unit and second light receiving unit.
Analyzing the light receiving pattern in the second light receiving part to detect the position of the tip part of the nozzle and the position of the tip part of the chip component,
The height of the chip component is determined from the detected position of the tip of the nozzle and the position of the tip of the chip component, and the position of the tip of the nozzle when the nozzle is rotated by 90 ° and the position of the tip Obtain the height dimension of the chip part from the position of the tip part of the chip part,
After determining that the height orientation of these chip components is appropriate when it can be considered that the height dimensions of these chip components are the height dimensions determined in advance of the chip components to be suctioned,
The light receiving pattern at the first light receiving unit is analyzed to detect both side edge positions of the chip component, and the light shielding width of the chip component is obtained from the detected side edge positions of the chip component, Obtaining both edge positions of the chip parts when the nozzle is rotated 90 ° and 180 °,
A chip component suction posture, wherein a position shift amount ΔX in the short side direction and a position shift amount ΔY in the long side direction of the chip component are obtained from edge positions on both ends of the chip component at the respective rotation angle positions. Judgment method. The rotation angle of the nozzle when the light shielding width is minimized and the edge positions on both sides of the chip component were obtained from the change pattern of the light shielding width when the nozzle was rotated about its axis. Thereafter, the nozzle is rotated by 90 ° and 180 ° with respect to the rotation angle, and the rotation angle of the nozzle when the light shielding width is minimized is obtained as a deviation angle Δθ of the orientation of the chip component. The chip component suction posture determination method according to claim 1 . The positional deviation amounts ΔX, ΔY are the positions of the side edges of the chip component when the light shielding width is minimum [L0, R0], and the chip component when the nozzle is rotated 90 ° and 180 °. When the side edge positions are [L90, R90] and [L180, R180], the amount of deviation ΔF between the optical center of the light receiving unit and the rotation center of the nozzle is ΔF = (L0 + R180) / 2
Or ΔF = (L180 + R0) / 2
Then, the positional deviation amount ΔX from the rotation center of the nozzle in the short side direction of the chip component is expressed as ΔX = (L0 + R0) / 2 + ΔF
Or ΔX = (L180 + R180) / 2 + ΔF
And a positional deviation amount ΔY from the rotation center of the nozzle in the long side direction of the chip component is expressed as ΔY = (L90 + R90) / 2 + ΔF
The chip component suction posture determination method according to claim 1 , wherein the chip component suction posture determination method is used. A chip component suction posture determination device incorporated in a chip mounter that is provided at a tip so as to be able to move up and down in the axial direction and sucks a chip component having a substantially rectangular parallelepiped shape, and is rotatable about an axis.
A light projecting unit and a light receiving unit that form an optical path across the chip part adsorbed on the tip of the nozzle in the width direction;
Edge detecting means for detecting the left and right edge positions of the chip component by analyzing the light receiving pattern in the light receiving unit;
A light-shielding width detecting means for obtaining a light-shielding width of the chip component from both side edge positions of the chip component detected by the edge detecting means;
Obtaining the rotation angle of the nozzle and the edge positions on both sides of the chip component when the light shielding width is minimized from the change pattern of the light shielding width when the nozzle is rotated about its axis, Measurement control means for rotating the nozzle by 90 ° and 180 ° on the basis of the rotation angle;
The positional deviation amount ΔX in the short side direction of the chip component based on the edge position on both sides when the light shielding width is minimized, the edge position on both sides when the nozzle is rotated 90 ° and 180 °, and A calculation means for obtaining a positional deviation amount ΔY in the long side direction ;
Furthermore, a second light projecting unit and a second light receiving unit that form an optical path crossing the chip component in the axial direction of the nozzle,
Second edge detection means for detecting the position of the tip of the nozzle and the position of the tip of the chip component by analyzing the light-receiving pattern at the second light-receiving unit;
The height dimension of the chip component is obtained from the position of the tip portion of the nozzle and the position of the tip portion of the chip component detected by the second edge detection means, and the nozzle is rotated by 90 ° The height dimension of the chip component is obtained from the position of the tip portion of the nozzle and the position of the tip portion of the chip component, and the height dimension of these chip components is the height obtained in advance of the chip component to be sucked. A chip component suction posture determination apparatus, comprising: a height determination unit that determines that the suction posture of the chip component is appropriate when it can be regarded as a size . The calculating means sets [L0, R0] on both side edge positions of the chip component when the light shielding width is minimum, and both edge positions of the chip component when the nozzle is rotated by 90 ° and 180 °. Is [L90, R90] and [L180, R180], the amount of deviation ΔF between the optical center of the light receiving unit and the rotation center of the nozzle is ΔF = (L0 + R180) / 2.
Or ΔF = (L180 + R0) / 2
Then, the positional deviation amount ΔX from the rotation center of the nozzle in the short side direction of the chip component is expressed as ΔX = (L0 + R0) / 2 + ΔF
Or ΔX = (L180 + R180) / 2 + ΔF
And a positional deviation amount ΔY from the rotation center of the nozzle in the long side direction of the chip component is expressed as ΔY = (L90 + R90) / 2 + ΔF
The chip component suction posture determination device according to claim 4 , which is obtained as follows.

Images