JP5201977B2 - Vehicle power equipment - Google Patents

Description

The present invention relates to a vehicle power converter.

  A conventional mounting structure for a railway vehicle power converter will be described in detail with reference to the drawings. FIG. 5 is a top view of a semiconductor element (IGBT element). FIG. 6 is a front view of the semiconductor element.

FIG. 7 is a cross-sectional view of the power converter. FIG. 8 is a side view of a connection portion between a semiconductor element and a conductor (A
(Arrow view). In the present specification, even when the same device is required to be distinguished from each other in the description, the description will be made by adding a Roman letter after the arithmetic number.

  As shown in FIGS. 5 and 6, on the upper surface of the semiconductor element 4, the connector terminals 1a, 1b, 1c provided in the longitudinal direction and the emitter terminals 2a in parallel with the connector terminals 1a, 1b, 1c are provided. 2b and 2c are provided in the longitudinal direction.

As shown in FIG. 7, the semiconductor element 4 configured in this way is connected to one side surface of the heat receiving unit 8, and one end of the plurality of heat pipes 7 is connected to the other side (opposite side) of the heat receiving unit 8. Embedded. The heat receiving portion 8a and the heat receiving portion 8b are fixed to a plate 6 having a U-shaped cross section, and the plate 6 is fixed to a casing of the power converter. A plurality of heat radiation fins 9 are connected to the heat pipe 7, and each heat radiation fin penetrates and is connected to the plurality of heat pipes 7. The terminals 2 a to 2 c of the semiconductor element 4 a and the terminals 2 a to 2 c of the semiconductor element 4 b are electrically connected by a substantially rectangular conductor 5. The conductor 5 has a shape bent at a right angle (α = 90 degrees) as shown in FIG.

The vehicular power conversion device configured as described above is configured by the heat receiving portion 8, the heat pipe 7, and the heat radiating fins 9 that convert electric power by switching the semiconductor element 4 and generate heat generated from the semiconductor element 4. It was possible to drive safely by cooling with a cooler.
JP 2006-280191 A

However, even if the terminals of the same semiconductor element 4 (for example, 2a and 2b) are not uniform in height (FIG. 6), there is some variation in the height of the terminals.

Further, since the variation between the semiconductor elements 4 is larger than the variation between the terminals, for example, the difference in height between the terminal 2a of the element 4a and the terminal 2a of the element 4b may be further increased.

  For this reason, when the plurality of terminals of the semiconductor element 4 are connected to the conductor 5 by the flat plate-like conductor 5 having a stepped and rectangular cross section as in the conventional power converter, the terminal having a low height is connected to the conductor 5. In some cases, the semiconductor element may be broken due to being pulled (stress is generated).

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a vehicular power conversion device that can reduce the stress generated at the terminals of the semiconductor elements even when there is a variation in height between the semiconductor elements and the terminals of the semiconductor elements. And

In the vehicle power conversion device including a plurality of semiconductor elements that convert power by switching and a conductor that connects the semiconductor elements, the conductor is a first provided between terminals of the semiconductor elements. And a second slit larger than the first slit provided between the semiconductor elements, and the conductor is composed of a contact portion and a bent portion of the semiconductor element, and the semiconductor element contact portion, This can be achieved when the angle α between the bent portions is an acute angle .

  According to the present invention, it is possible to provide a vehicular power conversion device that can reduce the stress generated in the terminals of the semiconductor elements even when there is a variation in height between the semiconductor elements and the terminals of the semiconductor elements.

(First embodiment)
A vehicle power converter according to a first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a cross-sectional view of a vehicle power converter according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of a conductor of the vehicle power converter according to the first embodiment of the present invention. FIG. 3 is a modification of FIG. The same components as those described in FIGS. 5 to 8 are denoted by the same reference numerals and description thereof is omitted.

  The vehicular power conversion device according to the first embodiment of the present invention includes semiconductor elements 4 a and 4 b, a heat receiving portion 8, a heat pipe 7, a heat radiating fin 9, and a conductor 12. As shown in FIG. 1, the semiconductor element 4 is connected to one side surface of the heat receiving unit 8, and one end of a plurality of heat pipes 7 is embedded on the other side (opposite side) of the heat receiving unit 8. A plurality of heat radiating fins 9 are connected to the heat pipe 7, and each heat radiating fin 9 penetrates and is connected to the plurality of heat pipes 7. The terminals 2 a to 2 c of the semiconductor element 4 a and the terminals 2 a to 2 c of the semiconductor element 4 b are electrically connected by a conductor 12.

  In the vehicular power converter configured as described above, the conductor 12 is provided with a slit 10 having a small width and a slit 11 having a width wider than the slit 10. The slit 10a having a small width is provided between the terminal 2a and the terminal 2b of the semiconductor element 4a, the slit 10b is provided between the terminal 2b and the terminal 2c of the semiconductor element 4a, and the slit 10c is provided on the semiconductor element 4b. The slit 10d is opened between the terminals 2a and 2b, and the slit 10d is opened between the terminals 2b and 2c of the semiconductor element 4b. The slit 11 having a large width is provided between the semiconductor element 4a and the semiconductor element 4b. Also, as shown in FIG. 2, the conductor 12 has an acute angle (α <90 °) between the element contact portion and the bent portion, unlike the conventional conductor.

  The vehicular power converter configured as described above reduces the tensile stress due to the height difference between the terminals by the small slit 10 between the terminals having a relatively small height variation, and between the semiconductor elements having a large height variation. By providing a large slit, it is possible to reduce the tensile stress caused by the height difference between the semiconductor elements. In addition, since the angle α between the element contact portion and the bent portion of the conductor 12 is an acute angle, even when stress is generated due to a height difference between terminals or between elements, the conductor itself serves as a spring, The stress applied to the terminal can be further reduced.

  The vehicular power converter configured as described above can reduce the stress generated at the terminals of the semiconductor element even when there is a variation in height between the semiconductor elements and the terminals of the semiconductor elements.

  As a modification of the conductor of the present embodiment, as shown in FIG. 3, a configuration in which the angle α between the element contact portion and the bent portion is an obtuse angle (α> 90 °) is conceivable. Even when the angle α is an obtuse angle, the conductor 12 acts as a spring, and the stress applied to the terminal can be reduced.

(Second Embodiment)
A vehicle power converter according to a second embodiment of the present invention will be described in detail with reference to the drawings. FIG. 4 is a cross-sectional view of the vehicle power converter according to the second embodiment of the present invention.

In the vehicular power conversion device of the present embodiment, the semiconductor element 4a and the semiconductor element 4b are connected to a first cooling unit including the heat pipe 7, the heat radiating fins 9, and the heat receiving unit 8a, and the semiconductor element 4c. The semiconductor element 4d is connected to a second cooling unit including a heat receiving unit 8b, a heat pipe 7, and a heat radiating fin 9. The heat receiving unit 8a of the first cooling unit and the heat receiving unit 8b of the second cooling unit are attached to a U-shaped sheet metal 6, and the sheet metal 6 is fixed to the housing of the vehicle power converter.

  The conductor 13 of the vehicular power conversion device configured as described above has small slits 10a to 10e between the semiconductor elements 4a and 4b and between the terminals. A large slit 11 is provided between the semiconductor elements 4b and 4c, which are likely to be large, and small slits 10f to 10j are provided between the semiconductor elements 4c and 4d and between the terminals.

  Since the vehicular power conversion device configured as described above is provided with a large slit between the heat receiving portions that are connected to the sheet metal 6 and are likely to have a difference in height in manufacturing, the stress applied to the terminals of the semiconductor element is reduced. I can do it.

  The vehicular power converter configured as described above can reduce the stress generated at the terminals of the semiconductor element even when there is a variation in height between the semiconductor elements and the terminals of the semiconductor elements.

It is sectional drawing of the power converter device for vehicles of 1st Embodiment based on this invention. It is sectional drawing of the conductor of the power converter device for vehicles of 1st Embodiment based on this invention. It is a modification of FIG. It is sectional drawing of the power converter device for vehicles of 2nd Embodiment based on this invention. It is a top view of a semiconductor element (IGBT element). It is a front view of a semiconductor element. It is sectional drawing of a power converter device. It is a side view (A arrow line view) of the connection part of a semiconductor element and a conductor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Connector 2 Emitter 3 Connector 4 Semiconductor element 5 Conductor 6 Sheet metal 7 Heat pipe 8 Heat receiving part 9 Radiation fin 10 Small slit 11 Large slit 12 Conductor 13 Conductor

Claims (2)

In a vehicle power conversion device including a plurality of semiconductor elements that convert power by switching and a conductor that connects the semiconductor elements, the conductor includes a first slit provided between terminals of the semiconductor element; A second slit larger than the first slit provided between the semiconductor elements , and the conductor is composed of a contact portion and a bent portion of the semiconductor element, and between the semiconductor element contact portion and the bent portion The vehicle power converter characterized in that the angle α is an acute angle . In the vehicle power converter according to claim 1 ,
The semiconductor elements are a first semiconductor element, a second semiconductor element, a third semiconductor element, and a fourth semiconductor element, wherein the first semiconductor element and the second semiconductor element are 1 is connected to the first cooling unit, the third semiconductor element and the fourth semiconductor element are connected to the second cooling unit, and the second slit is connected to the first cooling unit and the second cooling unit. A power converter for a vehicle, characterized in that it is provided between the parts.

Images