JP5141896B2 - Bonded optical component and manufacturing method thereof - Google Patents

Description

  The present invention relates to a bonded optical component that transmits two or more optical materials and a dielectric multilayer film provided between the optical materials and transmits a specific wavelength range. In particular, the two or more optical materials are adhesives. The present invention relates to a bonded optical component that is bonded without using any of the above and a manufacturing method thereof.

  In many optical parts such as a laser printer, a barcode reader, a camera, a telescope, and a microscope, an antireflection film or a mirror is used. Among them, the antireflection film is most commonly used and is often composed of a dielectric multilayer film in order to reduce reflection in a specific wavelength region.

  By the way, in an optical component, there are two or more optical materials (an optical material composed of a single unit such as a lens and an optical crystal), and an optical material composed of a crystal substrate and another crystal epitaxially grown on the substrate surface. There are many bonding optical components that are used by bonding them.

  Examples of typical cemented optical components include a cemented lens, a laser crystal (YAG), and a second harmonic crystal formed by bonding a plurality of lenses having different wavelength dispersions of refractive index to correct chromatic aberration of a camera lens. (KTP) bonded joint green laser element, bonded wavelength plate formed by bonding two quartz plates that separate light rays to remove the moire of the CCD image sensor, and temperature characteristics of Faraday rotation angle A temperature-stable optical isolator configured by bonding two different Faraday rotators is known.

  In addition, two or more optical materials may be bonded in the same optical material or in different optical materials. These optical materials can be used to improve optical functions or be completely new. It can have functions.

  By the way, when two or more optical materials are bonded, it is necessary to consider a method for reducing the reflection loss at the optical material interface.

  For example, if the refractive indices at the wavelengths used of the two optical materials to be joined are equal, the reflection loss can be reduced by bonding them using an adhesive having the same refractive index as these optical materials.

  In addition, when optical materials having different refractive indexes at the used wavelengths of the two optical materials are bonded, there is a method of using an adhesive having an intermediate refractive index of the optical materials to be bonded. However, in this method, a difference in refractive index occurs at the interface between the optical material and the adhesive, so that the reflection loss cannot be reduced extremely. Another method is a method in which an antireflection film for the refractive index of the adhesive used for bonding is formed on the bonding side surface of the optical material and then bonded using the adhesive. With this method, reflection loss can be extremely reduced by the action of the antireflection film.

  The bonding method most frequently used among the above is a method in which an adhesive is used and an antireflection film for the adhesive is applied to the optical material (the ordinary antireflection film is an antireflection film for air) and is adhered. is there.

  As described above, the antireflection film applied to these optical materials is often composed of a dielectric multilayer film, and the multilayer film is formed by vacuum deposition, ion-assisted deposition, or sputtering. Is common. Usually, the multilayer film is applied to one surface of the optical material (substrate), but in recent years, the multilayer film is often applied to both surfaces of the substrate.

Patent Document 1 and Patent Document 2 describe that an optical filter can be manufactured by an ALD (Atomic Layer Deposition) method. In this ALD method, a multilayer film is formed on both sides of a substrate simultaneously. It is described that a film can be formed.
JP 2002-277628 A JP 2004-176081 A

  By the way, in a bonded optical component that transmits two or more optical materials and a dielectric multilayer film as an antireflection film and transmits a specific wavelength region, the two or more optical materials provided with the dielectric multilayer film are described above. When bonding with an adhesive as described above, there is a problem in that the resin material (organic material) used as the adhesive is denatured when the obtained bonded optical component is subjected to severe environmental conditions such as high temperature and high humidity. It was. Furthermore, when the bonded optical component is a laser optical component, it may be damaged by slight absorption of the adhesive. Under such circumstances, development of a bonded optical component that does not use an adhesive is desired.

  Accordingly, an object of the present invention is to provide a bonded optical component in which two or more optical materials are bonded without using an adhesive, and a manufacturing method thereof.

  Therefore, in order to solve the above problems, the present inventor described in Patent Document 1 and Patent Document 2 instead of film forming methods such as vacuum vapor deposition, ion-assisted vapor deposition, and sputtering that are widely used. Two or more dielectric multilayer structures in which a pair of dielectric multilayer films having a double-sided symmetrical structure are formed on both sides of an optical material, while adopting an atomic layer deposition (ALD) method. When pressure bonding is performed through a dielectric multilayer film without using an adhesive, it has been found that a bonded optical component can be easily obtained by bonding. The present invention has been completed by such technical discovery.

That is, the invention according to claim 1
In a bonded optical component that transmits a specific wavelength range, comprising two or more optical materials to be bonded and a dielectric multilayer film that is provided between these optical materials and prevents reflection between the materials,
Two or more dielectric multilayer structures comprising an optical material and a pair of dielectric multilayer films having a double-sided symmetrical structure formed by atomic layer deposition (ALD) on both sides thereof, It is characterized by being directly joined through the dielectric multilayer film.

The invention according to claim 2
In the manufacturing method of the joined optical component according to claim 1,
Two or more dielectric multilayer structures are manufactured by simultaneously forming a pair of dielectric multilayer films having a symmetric structure on both surfaces of an optical material by atomic layer deposition (ALD) method. Further, it is characterized in that a bonded optical component is manufactured by directly bonding two or more dielectric multilayer film structures through the dielectric multilayer film.

Next, the invention according to claim 3 is
In the method for manufacturing a bonded optical component according to claim 2,
The material of the optical material is glass, ceramic, quartz, or crystal,
The invention according to claim 4
In the manufacturing method of the joining optical component which concerns on invention of Claim 2 or 3,
In the ALD apparatus, two or more dielectric multilayer film structures are bonded immediately after the formation of the dielectric multilayer film.

  According to the bonded optical component of the present invention, since the dielectric multilayer film having a double-sided symmetrical structure provided on both surfaces of the optical material is formed by the ALD method, the surface of the formed dielectric multilayer film is smooth. The nature is extremely high.

  Therefore, by pressing two or more dielectric multilayer structures having dielectric multilayer films with excellent surface smoothness on both sides of the optical material, these dielectric multilayer structures can be easily made without using an adhesive. It becomes possible to make it join.

  Hereinafter, embodiments of the present invention will be described in detail.

  The bonded optical component according to the present invention that transmits a specific wavelength region including an optical material and a dielectric multilayer film is a dielectric in which a pair of dielectric multilayer films having a double-sided symmetrical structure are formed on both surfaces of the optical material by an ALD method. Two or more body multilayer film structures are joined directly through the dielectric multilayer film.

  In order to obtain this bonded optical component, a pair of dielectric multilayer films having a symmetric structure on both sides are simultaneously formed on both surfaces of the optical material by the ALD method to produce a dielectric multilayer film structure. The above dielectric multilayer film structure can be manufactured by directly joining the dielectric multilayer film.

In the film formation by the ALD method, simultaneous film formation on both surfaces of the optical material is possible. That is, the ALD method is a method of depositing single atomic (monomolecular) layers, and can form a uniform film on both surfaces of the optical material.
1. ALD method Atomic Layer Deposition (ALD) method is an optical material placed in a vacuum vessel (film formation device), and the source gas containing the elements constituting the molecular layer is alternately introduced into the vacuum vessel. Thus, the molecular layer is formed by the reaction between the molecules adsorbed on the optical material surface side and the next introduced source gas, and the film thickness of the molecular layer can be controlled at the atomic layer level. Therefore, in the film forming apparatus (atomic layer deposition apparatus) used in the ALD method, an expensive component unit, a high-speed rotation mechanism, and the like necessary for the film forming apparatus used in the PVD method and the CVD method are not required. The film formation cost can be reduced as compared with the film formation method.

  In the method for producing an optical multilayer film by the ALD method, a thin film having a desired composite physical property value is formed by laminating molecular layers of a plurality of kinds of substances having different physical property values related to optical properties on an optical material. By repeating this basic process a plurality of times, an optical multilayer film composed of a plurality of thin films is formed. In forming each thin film, a raw material gas containing each of the elements constituting the molecular layer is alternately introduced into a vacuum vessel (film formation apparatus), and the number of replacements of the raw material gas is adjusted to adjust the composite of each thin film. The physical property value is continuously changed.

In the ALD method, many oxide layers and nitride layers such as SiO ₂ , Al ₂ O ₅ , Ta ₂ O ₅ , and TiO ₂ can be formed. It is also possible to deposit several atomic layers of different materials to create a layer with new optical properties (refractive index, extinction coefficient).

For example, when forming a monoatomic (monomolecular) layer of Al ₂ O ₃ by using the ALD method, it is completed in the following four steps.
(1) Introduce water molecules to adsorb OH groups on the surface of the optical material or on the surface on which film formation has already been performed.

(Reaction after the first layer)
2H ₂ O +: O—Al (CH ₃ ) ₂ →: Al—O—Al (OH) ₂ + 2CH ₄
(2) Purge exhausting excess water molecules.
(3) TMA [Trimethyl Aluminum: Al (CH ₃ ) ₃ ] gas, which is a raw material gas for the Al ₂ O ₃ film, is introduced. TMA molecules react with OH groups to generate CH ₄ gas.

(First layer reaction)
Al (CH ₃ ) ₃ +: O—H →: O—Al (CH ₃ ) ₂ + CH ₄
(Reaction after the first layer)
Al (CH ₃ ) ₃ +: Al—O—H →: Al—O—Al (CH ₃ ) ₂ + CH ₄
(4) Purge and exhaust CH ₄ gas.

Since an Al ₂ O ₃ film of about 0.1 nm is formed in these four steps, the above four steps are repeated until the required film thickness is reached, and the film thickness is increased.

In addition, in order to form a TiO ₂ monoatomic (monomolecular) layer by the ALD method, Ti (OC ₂ H ₅ ) ₄ (Ti-ethaoxide) gas is used in the same manner as the raw material gas of the TiO ₂ film. be able to. Since a TiO ₂ film of about 0.04 nm is formed in the above four steps, the above four steps are repeated until the desired film thickness is reached, and the film thickness is increased.

Next, in order to form a single atom (monomolecular) layer of SiO ₂ by the ALD method, it can be formed similarly by using SiCl ₄ gas as a raw material gas for the SiO ₂ film. In this case, the reaction can be promoted by the catalytic action of C ₅ H ₅ N by introducing C ₅ H ₅ N (Pyridine) after introduction of the SiCl ₄ gas and after introduction of water molecules. . Then, since the SiO ₂ film having a thickness of about 0.05 nm is formed in the six steps in which these two steps are added, this step is repeated until the desired film thickness is reached, and the film thickness is increased.

Next, for example, a case where an optical multilayer film is composed of a molecular layer made of TiO ₂ and a molecular layer made of Al ₂ O ₃ will be described. When these two types of molecular layers are formed, for example, a TiCl ₄ gas containing Ti and a H ₂ O gas containing O are used as a raw material gas for TiO ₂ , and the TMA containing Al as a raw material gas for Al ₂ O ₃ is used. (Trimethylaluminum) gas can be used. As source gases for forming other types of molecular layers, commercially available gases for ALD or CVD can be used, and since there is a self-purifying effect by atomic layer deposition, it is not necessary to use a particularly high-purity source gas. . In order to obtain an optical multilayer film with few defects, it is desirable to use a liquid source gas rather than a source gas obtained by heating a solid source.

Here, in the ALD film forming apparatus, the valve disposed in the TiCl ₄ gas supply path is provided in LV1, the valve provided in the H ₂ O gas supply path is provided in LV2, and the TMA gas supply path. If the valve is LV3 and the gate valve disposed in the exhaust path of the vacuum pump for evacuating the film forming apparatus (vacuum container) is GV, first, the inside of the film forming apparatus (vacuum container) is predetermined by the vacuum pump. The gate valve GV is closed in a state where the pressure is reduced to a pressure (for example, 10 ⁻³ Pa) or less, and then the valve LV2 is opened to introduce H ₂ O gas into the film forming apparatus (vacuum container) in which the optical material is arranged. After adsorbing only one layer of OH groups on both surfaces of the optical material, the gate valve GV is opened to exhaust the H ₂ O gas remaining in the film forming apparatus (vacuum vessel) and reach a predetermined pressure or lower. To adjust Next, the gate valve GV is closed and the valve LV1 is opened to introduce a TiCl ₄ gas into the film forming apparatus (vacuum vessel), thereby causing a decomposition reaction with the adsorbed Ti to form one TiO ₂ layer. Thereafter, the gate valve GV is opened, the TiCl ₄ remaining in the film forming apparatus (vacuum vessel) is exhausted, and the gate valve GV is closed by adjusting so as to reach a predetermined pressure or less. These steps constitute one cycle for forming one atomic layer (one molecular layer) of TiO ₂ , and the film thickness is determined by the number of cycles. In this film forming apparatus (vacuum container), the number of times of replacement of the source gas is counted.

Next, as for the molecular layer made of Al ₂ O ₃ , as in the case of the molecular layer made of TiO ₂ , the valves LV3 and LV2 in the film forming apparatus (vacuum vessel) are opened and closed to open the TMA gas and H ₂ O. The film thickness can be controlled at the atomic layer level by alternately supplying the gas and adjusting the number of times of replacing the source gas. However, the deposition rate differs depending on the type of each molecular layer, and it is necessary to set conditions after confirming the deposition rate in advance.

Meanwhile, since the high-temperature film formation in some cases TiO ₂ layer is scattered due to crystallization, the crystallization of the TiO ₂ layer by sandwiching the TiO ₂ layer with a layer of such hard Al ₂ O ₃ which crystallize at high temperatures Can be prevented. Moreover, in order to accelerate | stimulate reaction, a substrate heating is required and in the case of an oxide film, it is preferable to heat an optical material at 200-400 degreeC. Further, when the optical material is held in the film forming apparatus (vacuum container) so that the orientation of the optical material is horizontal, the optical material may be warped (dented in the center) due to its own weight. In order to reduce such warpage, film formation may be performed in a state where the orientation of the optical material is held in the vertical direction (that is, in a state where the optical material is held in the vertical direction).

2. Method for Manufacturing Bonded Optical Component To obtain a bonded optical component according to the present invention, a pair of dielectric multilayer films having a double-sided symmetric structure as described above are formed on both surfaces of an optical material by an atomic layer deposition (ALD) method. A dielectric multilayer film structure can be manufactured by forming films simultaneously, and two or more obtained dielectric multilayer film structures can be manufactured by directly joining the dielectric multilayer films.

  That is, a plurality of dielectric multilayer films 10 are manufactured by simultaneously forming a pair of dielectric multilayer films 2 on both surfaces of the optical material 1 by the ALD method in the ALD apparatus, as shown in FIG. In the ALD apparatus, for example, two dielectric multilayer structures 10 are held by the substrate holder 3, and the substrate holder 3 is moved as shown in FIG. The body 10 is brought into contact, and further, as shown in FIG. 4C, pressure is applied from above and below by the pressing jig 4 to join the two dielectric multilayer film structures 10 together. Then, the upper press jig 4 is moved upward as shown in FIG. 5 (A) to release the pressure, and the lower press jig 4 is also moved upward as shown in FIG. 5 (B). The bonded optical component can be taken out and removed to obtain the bonded optical component according to the present invention.

  Since the dielectric multilayer film 2 formed by the ALD method has a high surface smoothness because it is deposited for each atomic layer, it can be easily obtained by pressing the two dielectric multilayer film structures 10 together. It is possible to paste. Therefore, it is desirable that the dielectric multilayer structure 10 is continuously joined in the ALD apparatus immediately after the formation of the dielectric multilayer film 2 whose surface is in an active state. However, if the optical material 1 has irregularities, the dielectric multilayer film 2 reflecting the irregularities of the optical material 1 is formed in the film formation by the ALD method, so that the surface of the dielectric multilayer structure 10 is also irregular. It becomes difficult to join. Therefore, it is preferable to apply an optical material having no unevenness.

  For example, in the bonded optical component shown in FIG. 5B obtained by bonding two dielectric multilayer film structures 10, the optical material is obtained by bonding the dielectric multilayer films 2 provided on both surfaces of each optical material 1. Since the number of dielectric multilayer films existing between the layers is doubled, the number of dielectric multilayer films acting as an antireflection film can be easily formed. Further, the dielectric multilayer film 2 existing inside the dielectric multilayer film structure 10 has a structure that is difficult to deteriorate because it is surrounded by each optical material 1.

  As a material of the optical material applicable to the bonded optical component according to the present invention, it is possible to withstand temperature changes during film formation by the ALD method, and a glass having a thermal expansion coefficient substantially equal to that of the dielectric multilayer film to be formed, It is preferably any one selected from ceramic, quartz, and crystals. The optical material is not limited to a single material as described above, and examples thereof include an optical material obtained by epitaxially growing another crystal on a crystal substrate.

  In addition, in order to reduce the warp (dent at the center) due to the weight of the optical material, it is possible to adopt a method of holding the optical material vertically in the ALD apparatus.

  However, in the present invention, since the dielectric multilayer film is simultaneously formed on all surfaces of two or more optical materials by the ALD method, the same applies when the refractive indices for the wavelengths used of the optical materials to be bonded are extremely different from each other. It is conceivable that the dielectric multilayer film does not function as an antireflection film for each optical material. For this reason, in the present invention, it is desirable that the refractive indexes of the optical materials to be bonded are close to each other at the wavelength used.

  Then, an integrated junction green laser element in which a laser crystal (YAG) and a second harmonic crystal (KTP) are bonded together, and two quartz plates for separating light rays are bonded to remove the moire of the CCD image sensor. Whether the temperature-stable optical isolator configured by bonding two Faraday rotators with different Faraday rotation angle temperature characteristics is equal in refractive index to the wavelength used for each optical material to be bonded. Especially suitable because it is very close.

  Examples of the present invention will be specifically described below.

  The Nd: YAG crystal (optical material), which is a solid-state laser element, and an undoped YAG crystal (optical material) were joined. By joining a YAG crystal excellent in heat conduction to an Nd: YAG crystal that contributes to laser oscillation, a solid-state laser element with a heat sink excellent in beam quality can be manufactured. The refractive indexes of both crystals are about 1.82 at the oscillation wavelength of the Nd: YAG laser at 1064 nm.

  First, a dielectric multilayer film functioning as an antireflection film was designed. As described above, the film formation by the ALD method is a double-sided simultaneous film formation (precisely, all surfaces are simultaneously formed), and thus has a double-sided symmetrical film structure.

  When designing a dielectric multilayer film structure that functions as an antireflection film, set the required optical characteristics, increase or decrease the number of film layers, or increase or decrease the film thickness so that the optical thin film calculation results will be the required optical characteristics. Perform optimization. For this, many optimization methods such as Simplex method and Needle method are used. However, since film formation by the ALD method applied in the present invention must have a double-sided target structure, it is necessary to set a restriction that the n-th layer on both sides has the same film thickness during optimization ( Called coupling or pairing). Furthermore, it is necessary to design a film structure that functions as an antireflection film even when the dielectric multilayer films are joined together.

In this example, SiO ₂ was used for the low refractive index layer and TiO ₂ was used for the high refractive index layer to design a dielectric multilayer film structure that functions as an antireflection film.

  Table 1 below shows the configuration of the dielectric multilayer structure according to the example having the double-sided target structure. However, the optical film thickness (nd) is refractive index (n) × physical film thickness (d), and λ is the design center wavelength of 1064 nm (Nd: oscillation wavelength of YAG laser). Further, the A plane has a double-sided symmetrical structure with three layers and the B plane also has three layers.

接合するための上記誘電体多層膜構造体における分光透過特性のシミュレーション結果を図１に示す。波長１０６４ｎｍにおける透過率は約９９．９％以上に達している。反射防止膜として機能する誘電体多層膜を有する誘電体多層膜構造体（Ｎｄ：ＹＡＧ結晶とＹＡＧ結晶）を２個接合すると、以下の表２に示すような膜構成になる。

FIG. 1 shows a simulation result of spectral transmission characteristics in the dielectric multilayer structure for bonding. The transmittance at a wavelength of 1064 nm reaches about 99.9% or more. When two dielectric multilayer structures (Nd: YAG crystal and YAG crystal) having a dielectric multilayer film functioning as an antireflection film are joined, a film configuration as shown in Table 2 below is obtained.

２個の誘電体多層膜構造体（光学材料がＮｄ：ＹＡＧ結晶とＹＡＧ結晶）を接合して得られる実施例に係る接合光学部品における分光透過特性のシミュレーション結果を図２に示す。波長１０６４ｎｍにおける透過率は約９９．９％以上を維持している。

FIG. 2 shows a simulation result of spectral transmission characteristics in a bonded optical component according to an example obtained by bonding two dielectric multilayer structures (optical materials are Nd: YAG crystal and YAG crystal). The transmittance at a wavelength of 1064 nm is maintained at about 99.9% or more.

  Both the Nd: YAG crystal (optical material) and YAG crystal used in this example have a diameter of 1 inch (about 25.4 mm) and a thickness of 5 mm.

  As shown in FIG. 4A, two optical materials (Nd: YAG crystal and YAG crystal) 1 are horizontally fixed to the substrate holder 3 and set in the ALD apparatus, and then the chamber (vacuum container) is set. The air was exhausted to 133 Pa (1 Torr), and the optical material 1 was heated to 300 ° C.

Then, according to the film configuration shown in Table 1, the atomic layer deposition cycle described above is performed until the required thickness of the first SiO ₂ layer is reached, and then the required thickness of the second TiO ₂ layer is reached. The dielectric layer structure 10 having a double-sided symmetrical structure with three layers on one side was manufactured by alternately repeating these deposition cycles.

Then, in the ALD apparatus, the substrate holder 3 is moved to bring the two dielectric multilayer film structures 10 into contact with each other as shown in FIG. As shown in the drawing, a pressure of about 100 g / cm ² was applied from above and below to bond the two dielectric multilayer film structures 10 to manufacture a bonded optical component according to the example.

As shown in FIG. 5A, the upper pressing jig 4 is moved upward to release the pressure, the optical material 1 of the joining optical component is cooled to near room temperature, and the chamber (vacuum container) is vented. After opening to the atmosphere, the lower pressing jig 4 was moved upward as shown in FIG. 5B, and the bonded optical component was taken out to obtain the bonded optical component according to the example.

[Comparative example]
Two optical materials (Nd: YAG crystal and YGA crystal) were set in the ALD apparatus, and then the chamber (vacuum vessel) was evacuated to 133 Pa (1 Torr), and the optical material 1 was heated to 300.degree.

Then, according to the film configuration shown in Table 1, the atomic layer deposition cycle described above is performed until the required thickness of the first SiO ₂ layer is reached, and then the required thickness of the second TiO ₂ layer is reached. In the same manner, atomic layer deposition cycles were carried out until then, and thereafter, by repeating these deposition cycles alternately, two dielectric multilayer structures having a double-sided symmetrical structure of one side and three layers were manufactured.

  Next, the obtained two dielectric multilayer structures are cooled to near room temperature without bonding, and the chamber (vacuum container) is vented (open to the atmosphere), and then these dielectric multilayer structures are assembled. I took it out.

  Then, two dielectric multilayer film structures in which a dielectric multilayer film having a double-sided symmetrical structure with three layers on one side is formed on both surfaces of an optical material (Nd: YAG crystal and YGA crystal) are spaced at an interval of 0.1 mm (air An optical component according to a comparative example was obtained by arranging and fixing in parallel with a gap). Of course, since the Nd: YAG crystal and the YGA crystal are not joined, the YAG crystal does not function as a heat sink.

"Evaluation"
Spectral transmission characteristics of the joined optical component according to the example obtained by joining the dielectric multilayer structure according to the example and the two dielectric multilayer structures, and an interval (air gap) of 0.1 mm Spectral transmission characteristics of the optical parts according to the comparative example that were arranged and fixed in parallel with each other were measured with a self-recording spectrophotometer.

  The measurement results are summarized in FIG.

  And each spectral transmission characteristic of the dielectric multilayer film structure according to the example before bonding and the bonded optical component according to the example after bonding, and a comparison in which they are arranged and fixed in parallel at an interval (air gap) of 0.1 mm As shown in FIG. 3, the spectral transmission characteristics of the optical component according to the example show characteristics that hardly change in the vicinity of the design center wavelength of 1064 nm.

  From the spectral transmission characteristics of the bonded optical component according to the embodiment after bonding shown in FIG. 3, a dielectric multilayer film that acts as an antireflection layer without using an adhesive composed of a resin material (organic material) is used. It is confirmed that the two optical materials (Nd: YAG crystal and YAG crystal) provided can be joined together by a simple operation.

  As a result, the problem that the resin material (organic material) used as an adhesive is altered when the bonding optical component is subjected to severe environmental conditions such as high temperature and high humidity is solved. In the case of parts, the problem of damage due to slight absorption of the adhesive can be solved.

  By dicing this bonded optical component into several mm square, it can be used in a laser processing machine or the like as a small laser element having a heat sink.

  In addition, by using the same method, the moire of the integrated junction green laser element and CCD image sensor obtained by joining the laser crystal (YAG) and the second harmonic crystal (KTP) having almost the same refractive index of the two optical materials is removed. Therefore, it is also possible to manufacture a bonded wavelength plate in which two quartz plates for separating light beams are bonded, and a temperature-stable optical isolator in which two Faraday rotators having different temperature characteristics of Faraday rotation angles are bonded.

  According to the bonded optical component according to the present invention, since two or more optical materials each having a dielectric multilayer film that acts as an antireflection layer are bonded without using an adhesive, the conventional adhesive caused by the adhesive is used. It becomes possible to solve the problem. Therefore, it has industrial applicability used as a joining optical component incorporated in a laser printer, a barcode reader, a camera, a telescope, a microscope and the like.

The graph figure which shows the simulation result of the spectral transmission characteristic in the dielectric multilayer film structure which is a component of the joining optical component which concerns on an Example. The graph figure which shows the simulation result of the spectral transmission characteristic in the joining optical component which concerns on an Example. Each of the dielectric multilayered film structure according to the example (before bonding of the example) and the bonded optical component according to the example (after bonding of the example) obtained by bonding two dielectric multilayered film structures The graph which shows the result of having measured the spectral transmission characteristic and the spectral transmission characteristic of the optical component which concerns on the comparative example arrange | positioned and fixed in parallel with the space | interval (air gap) of 0.1 mm, respectively with the self-recording spectrophotometer. 4A to 4C are process explanatory views showing the manufacturing process of the bonded optical component according to the present invention. 5 (A) to 5 (B) are process explanatory views showing the manufacturing process of the bonded optical component according to the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Dielectric multilayer 3 Substrate holder 4 Press jig 10 Dielectric multilayer structure

Claims (4)

In a bonded optical component that transmits a specific wavelength range, comprising two or more optical materials to be bonded and a dielectric multilayer film that is provided between these optical materials and prevents reflection between the materials,
Two or more dielectric multilayer structures comprising an optical material and a pair of dielectric multilayer films having a double-sided symmetrical structure formed by atomic layer deposition (ALD) on both sides thereof, A bonded optical component which is directly bonded through the dielectric multilayer film. In the manufacturing method of the joined optical component according to claim 1,
Two or more dielectric multilayer structures are manufactured by simultaneously forming a pair of dielectric multilayer films having a symmetric structure on both surfaces of an optical material by atomic layer deposition (ALD) method. A method of manufacturing a bonded optical component, wherein a bonded optical component is manufactured by directly bonding two or more dielectric multilayer film structures through the dielectric multilayer film.   3. The method of manufacturing a bonded optical component according to claim 2, wherein the optical material is any one of glass, ceramic, quartz, and crystal.   4. The method for manufacturing a bonded optical component according to claim 2, wherein two or more dielectric multilayer film structures are bonded immediately after the formation of the dielectric multilayer film in the ALD apparatus.

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