JP5139763B2 - Manufacturing method of heat storage material microcapsule - Google Patents

Description

  The present invention relates to a method for manufacturing a heat storage material microcapsule capable of storing latent heat.

  As a heat storage material capable of storing a large amount of cold energy or heat, there are a sensible heat storage material using only a temperature difference and a latent heat storage material using melting heat or solidification heat generated during phase change. Inexpensive solid sensible heat storage materials such as brick, gravel, concrete and metal are used as heat storage materials particularly suitable for use in high temperature regions. Mineral oils, synthetic oils, and glycol compounds are used as liquid sensible heat storage materials. Examples of the latent heat storage material include inorganic heat storage materials that are hydrated salts of various inorganic compounds and organic heat storage materials such as normal paraffins, higher alcohols, higher fatty acids, and higher fatty acid esters.

  As a latent heat storage material in the high temperature range of 80 ° C or more for the purpose of heating and hot water supply, hydration of organic heat storage materials such as paraffin wax and higher fatty acids and inorganic compounds from the heat storage effect and cost aspect An inorganic heat storage material such as salt is a practical one. However, inorganic heat storage materials have been put to practical use mainly due to disadvantages such as poor thermal conductivity, large volume change, flammability, and low latent heat.

  In order to compensate for the above disadvantages of organic heat storage materials, heat storage material microcapsules have been put into practical use. By microencapsulating the organic heat storage material, it can be handled as a liquid slurry containing latent heat, and the latent heat can be transported in a fluid state and used for air conditioning. Further, by drying the liquid slurry of the heat storage material microcapsules, it can be used as a solid, and can be used by being kneaded or coated on metal, resin, fiber or the like.

  As a method for microencapsulating an organic heat storage material, an encapsulation method by a composite emulsion method (for example, see Patent Document 1), a method of spraying a thermoplastic resin on the surface of organic heat storage material particles (for example, Patent Document 2) See), a method of forming a thermoplastic resin in a liquid on the surface of organic heat storage material particles (see, for example, Patent Document 3), a method of polymerizing and coating monomers on the surface of organic heat storage material particles (for example, Patent Document) 4), and a method for producing a polyamide-coated microcapsule by an interfacial polycondensation reaction (for example, see Patent Document 5).

  Many of the above microencapsulation methods require a step of emulsifying and dispersing in an oil-in-water droplet form, that is, an emulsification step, in order to make the organic heat storage material into fine droplets to a desired size. In the emulsification step, emulsification is easy if the organic heat storage material in the form of microdroplets is in a liquid state, but in the solid state, it is necessary to carry out emulsification by heating it above the temperature at which the organic heat storage material melts. . However, under oil-in-water type emulsification conditions, since the dispersion medium is water, when the melting point of the organic heat storage material reaches a high temperature of 80 ° C. or higher, it becomes difficult to always maintain the entire emulsion at a temperature higher than the melting point. If there is a part in the container that reaches a temperature lower than the melting point of the organic heat storage material, the organic heat storage material in that part will harden, making it difficult to produce an emulsion with a uniform particle size. Met.

  As a solid state dispersion method, it is possible to atomize by using a physical pulverizer, but the pulverized material obtained as a result is spherical in shape, unlike those obtained through an emulsification step in a liquid state. Instead, it is indefinite. Even if it is an irregular pulverized product, it is possible to supply a reactive monomer that can be copolymerized from the surroundings to form a film, but it is difficult to form a dense film with fine details on the concavo-convex of the pulverized product. Therefore, it was difficult to obtain high density and fastness as microcapsules obtained by emulsifying and dispersing an organic heat storage material in a liquid state.

  As a method for solving this problem, a method of obtaining a microcapsule having a spherical and dense film by emulsifying at a temperature higher than the melting point of an organic heat storage material using a pressurizable apparatus is disclosed ( For example, refer to Patent Document 6), it is difficult to perform microencapsulation following emulsification in a pressurizable emulsification apparatus, and microcapsulation is performed after cooling the heat storage material emulsion to a temperature capable of microencapsulation. It was necessary.

However, organic heat storage materials are in an expanded state at high temperatures, and a supercooled state occurs at the cooling stage, which tends to coexist in a liquid phase and a solid phase. It was difficult to do. Furthermore, since the emulsified state of the heat storage material emulsion may be broken in the cooling step, and it is difficult to stably obtain microcapsules of the organic heat storage material, it has not been put into practical use.
Japanese Patent Laid-Open No. 62-1452 JP-A 62-45680 Japanese Patent Laid-Open No. 62-149334 JP-A-62-2225241 Japanese Patent Laid-Open No. 2-258052 Japanese Patent Laid-Open No. 2002-80835

  An object of the present invention is to provide a method capable of stably producing a microcapsule containing an organic heat storage material having a spherical shape and excellent physical and chemical strength of a film and having a melting point of 80 ° C. or higher.

  As a result of researches to solve this problem, the present inventor has (1) heating a nonpolar organic heat storage material having a melting point of 80 to 130 ° C. to the melting point or higher, and emulsifying it in the aqueous dispersion in a pressurized state. A step of dispersing and preparing a heat storage material emulsion, (2) a step of cooling the heat storage material emulsion to 50 ° C. or less, and (3) an in-situ polymerization method by reheating the heat storage material emulsion to 60 to 95 ° C. Thus, the inventors have found a method for producing a heat storage material microcapsule comprising a step of microencapsulation using a melamine-formaldehyde resin or a urea-formaldehyde resin as a film.

  A nonpolar organic heat storage material is used as the organic heat storage material, and in the process of emulsifying and dispersing the organic heat storage material in the form of fine droplets in the aqueous dispersant solution, the organic heat storage material is heated above the melting point of the organic heat storage material to be in a pressurized state. Prepare the emulsion with the organic heat storage material in the molten state, and after cooling it down to a temperature at which the organic heat storage material is completely solid, reheat it and place it around the microdroplet organic heat storage material. By forming a film and producing a microcapsule, it became possible to stably obtain a heat storage material microcapsule having a spherical and dense film.

  Below, the manufacturing method of the thermal storage material microcapsule of this invention is demonstrated in detail. The method for producing the heat storage material microcapsule of the present invention is as follows: (1) A nonpolar organic heat storage material having a melting point of 80 to 130 ° C. is heated to the melting point or higher, and emulsified and dispersed in a dispersant aqueous solution in a pressurized state. A step of preparing an emulsion, (2) a step of cooling the heat storage material emulsion to 50 ° C. or lower, and (3) a melamine-formaldehyde by reheating the heat storage material emulsion to 60 to 95 ° C. and in-situ polymerization. It includes a step of microencapsulation using a resin or urea-formaldehyde resin as a film.

  In step (1), the heat storage material emulsified liquid is a pressure-resistant container that can be sealed with pressure after adding an organic heat storage material in an aqueous solution containing a dispersant, and is strong in strength, and has a heat resistance as a heating device. Using an emulsifying device that is capable of applying a strong shearing force, it is heated to the melting point of the organic heat storage material or higher and emulsified in a pressurized state. The temperature of the heat storage material emulsion using water as a dispersion medium cannot exceed 100 ° C. in an open system of 1013 mbar (0.1013 MPa) under atmospheric pressure, but the pressure exceeds 1013 mbar with the container sealed. By emulsifying by pressurizing until the temperature inside the container becomes 100-150 ° C., the organic heat storage material is also in a molten state. The upper limit of the pressure in the container is preferably 0.6 MPa or less from a practical point of view.

  Examples of organic heat storage materials having a melting point of 80 to 130 ° C. include hydrocarbon compounds such as natural paraffin wax, synthetic paraffin wax, polyethylene wax, and ethylene-propylene copolymer wax, higher alcohols and higher fatty acids and metal salts thereof, higher Examples include long-chain esters of fatty acids. In the present invention, nonpolar organic heat storage materials such as hydrocarbon compounds such as paraffin wax and polyethylene wax can be suitably used. Compounds containing polar groups or polar bonds such as higher alcohols, higher fatty acids and their metal salts, higher fatty acid long-chain esters, etc. are easily broken when used in the stage of cooling from a high temperature emulsified state. Can not do it.

  As the dispersant used in the present invention, any dispersant that is thermally stable and suitable for microencapsulation can be used, and any of cationic, anionic, and nonionic types can be used. Anionic dispersants are suitable in the -situ polymerization method. Specifically, fatty acid soap, metal soap, alkyl sulfate ester salt, polyoxyethylene alkyl ether sulfate ester, alkylbenzene sulfonate, dialkyl sulfosuccinate , Poly (meth) acrylic acid, styrene maleic anhydride copolymer hydrolyzate, α-alkylstyrene maleic anhydride copolymer hydrolyzate, methyl vinyl ether maleic anhydride copolymer hydrolyzate, vinyl toluene maleic anhydride Copolymer hydrolyzate, styrene benzyl methacrylate maleic anhydride Polymer hydrolyzate, ethylene-maleic anhydride copolymer hydrolyzate, isobutylene-maleic anhydride copolymer hydrolyzate, vinyl acetate-maleic anhydride copolymer hydrolyzate and the like.

  Among the dispersants, a maleic anhydride copolymer hydrolyzate is preferable in terms of the stability of the heat storage material emulsion. Usually, a maleic anhydride copolymer hydrolyzate is used for emulsification of an organic heat storage material as a maleic anhydride copolymer sodium salt. As the maleic anhydride copolymer hydrolyzate, a styrene maleic anhydride copolymer hydrolyzate and an α-alkylstyrene maleic anhydride copolymer hydrolyzate are particularly preferable.

  In step (2), the heat storage material emulsion is once cooled to 50 ° C. or lower. This is to make the organic heat storage material in a molten state into a solid fine particle dispersed state, thereby avoiding the extreme expansion state of the organic heat storage material, and reheating to 60 to 95 ° C. in the next step. It can be set as the heat storage material emulsion of the stable and uniform particle diameter required for the microencapsulation performed. The lower limit of the cooling temperature in the step (2) is not particularly limited as long as it is equal to or higher than the freezing point at which water that is the medium of the heat storage material emulsion is solidified. Usually, a room temperature of about 20 to 30 ° C. is preferable, and it is not necessary to excessively cool to room temperature or lower.

  In step (3), the heat storage material emulsion once cooled is reheated to 60 to 95 ° C., and an initial condensate of melamine-formaldehyde resin or urea-formaldehyde resin is added, and heat storage is performed by stirring under heating. A material microcapsule can be obtained. Microcapsule coatings include polystyrene, polyacrylonitrile, polyamide, polyacrylamide, ethyl cellulose, polyurethane, aminoplast resin, and coacervation of gelatin and carboxymethyl cellulose or gum arabic by interfacial polymerization, in-situ method, etc. Synthetic or natural resins using the law are known. In the present invention, in order to form a film that can withstand high temperatures by encapsulating an organic heat storage material having a high melting point, microencapsulation using a melamine-formaldehyde resin or urea-formaldehyde resin as a film is performed by an in-situ method. Do. As a microencapsulation method using a melamine-formaldehyde resin or urea-formaldehyde resin as a film by an in-situ method, a known method is used.

  In the present invention, a non-cooling organic heat storage material can be added with a supercooling inhibitor, a specific gravity adjusting material, a deterioration preventing agent, etc., if necessary. The supercooling preventive agent suitably used in the present invention is compatible with a nonpolar organic heat storage material in a molten state, and has a melting point of 10 ° C. or higher and 140 ° C. or lower than the melting point of the nonpolar organic heat storage material. The compound which has is preferable. When the difference in melting point from the nonpolar organic heat storage material is within 10 ° C., the effect of preventing overcooling may be small. When the melting point exceeds 140 ° C., it is necessary to heat to a higher temperature for melting, which may cause deterioration of organic compounds such as a microcapsule film and a dispersant. Specifically, the supercooling inhibitor can be used by selecting a compound having an appropriate melting point from hydrocarbon compounds such as natural paraffin wax, synthetic paraffin wax and polyethylene wax. The amount used is preferably 0.5 to 10% by mass with respect to the nonpolar organic heat storage material.

  The average particle size of the heat storage material microcapsules of the present invention is preferably set in the range of 1 to 50 μm, and more preferably in the range of 2 to 10 μm. If the average particle size is smaller than 1 μm, the physical strength increases and the destruction can be suppressed, but the film thickness becomes thin and the heat resistance may decrease. On the other hand, if the average particle diameter exceeds 50 μm, the physical strength may be lowered, and it may be extremely weak against mechanical shearing force. The control of the average particle size of the heat storage material microcapsules is referred to as the type and concentration of the dispersant, the temperature and time during the dispersion process, the emulsification ratio (volume ratio of water phase to oil phase), emulsifier, disperser, etc. It is adjusted by factors such as the operating conditions of the emulsifier (stirring speed, time, etc.). The average particle diameter of the microcapsules described in the present invention means a volume average particle diameter, and specifically represents a volume average particle diameter measured using a Coulter Multisizer manufactured by Coulter, USA.

  The heat storage material microcapsules obtained by the production method of the present invention are usually obtained in the form of an aqueous dispersion and can be used as a liquid slurry. Moreover, it is possible to make it a solid substance by drying or dehydrating water as a dispersion medium. The solid material is not limited to a completely solid material having no water content, and there is a cake-like form having no fluidity at room temperature. For example, a filter press, a screw press, a centrifugal separation method, an evaporation drying method, and a spray drying method. A wet cake dehydrated to 40% by mass or less obtained using an apparatus such as the above is also included. Before performing the solidification treatment, a metal powder, a colorant, a specific gravity adjusting agent, a dispersion aid, an adhesive, a wetting agent and the like can be added to the microcapsule dispersion.

  EXAMPLES Hereinafter, although an Example demonstrates this invention in more detail, this invention is not limited to this Example. In addition, the number of parts and percentage in an Example are based on solid mass.

"Preparation of aqueous solution of melamine-formaldehyde precondensate"
After adding 13.5 parts of 37% formaldehyde aqueous solution and 30 parts of water to 7 parts of melamine powder and adjusting the pH to 8, the mixture was heated to 70 ° C. to obtain a melamine-formaldehyde initial condensate aqueous solution.

Example 1
80 parts of paraffin wax (trade name: FT-105; manufactured by Nippon Seiwa Co., Ltd.) having a melting point of 104 ° C. in 100 parts of an aqueous sodium salt solution of 10% styrene maleic anhydride copolymer adjusted to pH 4.5. In addition, a heat storage material emulsified liquid having an average particle diameter of 3 μm was produced by an emulsifying apparatus capable of heating and pressurizing under conditions of 130 ° C. and 0.40 MPa. After cooling to 30 ° C., the mixture was reheated to 60 ° C., 50.5 parts of the melamine-formaldehyde initial condensate aqueous solution was added, and the mixture was stirred for 2 hours. After standing to cool, the pH was adjusted to 9 to obtain a heat storage material microcapsule dispersion 1 having a solid content concentration of 45% and an average particle diameter of 3 μm.

(Example 2)
Instead of 80 parts of paraffin wax having a melting point of 104 ° C., 80 parts of polyethylene wax having a melting point of 86 ° C. (trade name: Polywax 500; Baker Petrolite) and paraffin wax having a melting point of 100 ° C. (trade name: FT-100) A heat storage material microcapsule dispersion liquid 2 having an average particle size of 3 μm, except that 5 parts of Nippon Seiwa Co., Ltd. (supercooling inhibitor) were used.

(Example 3)
Instead of 80 parts of paraffin wax having a melting point of 104 ° C., 80 parts of polyethylene wax having a melting point of 125 ° C. (trade name: Polywax 2000; manufactured by Baker Petrolite Co., Ltd.) is used. The heat storage material microcapsule dispersion 3 having an average particle diameter of 3 μm was obtained in the same manner as in Example 1 except that the cooling temperature of the heat storage material emulsion was 50 ° C. and the reheating temperature was 90 ° C. .

Example 4
In addition to 80 parts of paraffin wax having a melting point of 104 ° C., an emulsion having an average particle size of 6 μm using 3 parts of polyethylene wax having a melting point of 136 ° C. (trade name: High Wax 400P; manufactured by Mitsui Chemicals, supercooling inhibitor) A heat storage material microcapsule dispersion 4 having an average particle diameter of 6 μm was obtained in the same manner as in Example 1 except that the reheating temperature was 80 ° C.

(Example 5)
Instead of 80 parts of paraffin wax having a melting point of 104 ° C., 80 parts of paraffin wax having a melting point of 90 ° C. (trade name: FNP-0090; manufactured by Nippon Seiwa Co., Ltd.) and paraffin wax having a melting point of 115 ° C. (FT-115; Japan) A heat storage material microcapsule dispersion 5 having an average particle diameter of 3 μm was obtained in the same manner as in Example 1 except that 2 parts of Super Wax Co., Ltd. (supercooling inhibitor) were used and the reheating temperature was 80 ° C.

(Example 6)
A heat storage material microcapsule dispersion 6 having an average particle diameter of 10 μm was obtained in the same manner as in Example 5 except that the average particle diameter of the heat storage material emulsion was 10 μm.

(Example 7)
Similar to Example 2 except that 2 parts of amide wax (trade name: Amide AP-1; Nippon Kasei Co., Ltd., supercooling inhibitor) having a melting point of 101 ° C. was used instead of 5 parts of paraffin wax having a melting point of 100 ° C. Thus, the heat storage material microcapsule dispersion 7 having an average particle diameter of 3 μm was obtained. However, when the heat storage material emulsion was cooled, it was necessary to perform strong stirring to prevent aggregation.

(Example 8)
80 parts of a polyethylene wax having a melting point of 86 ° C. (trade name: Polywax 500; manufactured by Baker Petrolite Co., Ltd.) in 100 parts of a sodium salt aqueous solution of 10% ethylene maleic anhydride copolymer adjusted to pH 3.6 Add 3 parts of paraffin wax (trade name: FT-105; supercooling preventive material) with a melting point of 104 ° C., heat to 110 ° C. and 0.3 MPa, and use a pressurization emulsifier that sets the pressurization conditions. A heat storage material emulsion having a diameter of 3 μm was prepared. After cooling to 30 ° C., the mixture was reheated to 60 ° C., 10 parts of urea, 1 part of resorcin, 22 parts of 37% formaldehyde aqueous solution, and 40 parts of water were added and stirred for 3 hours. After cooling, the pH was adjusted to 8 to obtain a heat storage material microcapsule dispersion 8 having a solid content concentration of 42% and an average particle diameter of 5 μm.

Example 9
Average particles were obtained in the same manner as in Example 8, except that 100 parts of a 7% acrylic acid-styrenesulfonic acid-ethyl acrylate copolymer aqueous solution was used instead of 100 parts of a sodium salt aqueous solution of 10% ethylene maleic anhydride copolymer. A heat storage material microcapsule dispersion 9 having a diameter of 5 μm was obtained.

(Example 10)
Instead of 80 parts of paraffin wax having a melting point of 104 ° C., 80 parts of paraffin wax having a melting point of 100 ° C. (trade name: FT-100; manufactured by Nippon Seiwa Co., Ltd.) and paraffin wax having a melting point of 104 ° C. (trade name: FT-) 105; Supercooling preventive material) A heat storage material microcapsule dispersion 10 having an average particle diameter of 3 μm was obtained in the same manner as in Example 1 except that 3 parts were used.

(Example 11)
Instead of 80 parts of paraffin wax having a melting point of 104 ° C., 80 parts of paraffin wax having a melting point of 100 ° C. (trade name: FT-100; manufactured by Nippon Seiwa Co., Ltd.) and paraffin wax having a melting point of 115 ° C. (FT-115; Japan) A heat storage material microcapsule dispersion 11 having an average particle diameter of 3 μm was obtained in the same manner as in Example 1 except that 3 parts of Super Wax Co., Ltd. (supercooling inhibitor) were used.

(Comparative Example 1)
The same procedure as in Example 1 was performed except that 80 parts of behenic acid having a melting point of 81 ° C. was used instead of 80 parts of the paraffin wax having a melting point of 104 ° C., but the heat storage material emulsion coagulated during cooling and the heat storage A material microcapsule dispersion could not be obtained.

(Comparative Example 2)
Hexamethylene diisocyanate trimer (product) with 80 parts of paraffin wax (trade name: FT-105; manufactured by Nippon Seiwa Co., Ltd.) having a melting point of 104 ° C for microencapsulation by the interfacial polymerization method by reaction of isocyanate and amine (Name: Sumidur N-3200; manufactured by Sumika Bayer Urethane Co., Ltd.) 8 parts are dissolved and emulsified in an emulsifying apparatus capable of heating and pressing together with 100 parts of an aqueous sodium salt solution of a styrene maleic anhydride copolymer. However, it was agglomerated by the reaction of hexamethylene diisocyanate and water and could not be microencapsulated.

(Comparative Example 3)
Heat storage material micro having an average particle diameter of 6 μm was the same as in Example 4 except that cooling of the heat storage material emulsion was stopped at 80 ° C., and 50.5 parts of the melamine-formaldehyde initial condensate aqueous solution was added and stirred for 2 hours. A capsule dispersion 12 was obtained.

(Comparative Example 4)
Instead of 80 parts of paraffin wax having a melting point of 104 ° C., 80 parts of polyethylene wax having a melting point of 86 ° C. (Polywax 500; Baker Petrolite Co., Ltd.) was used, and cooling of the heat storage material emulsion was stopped at 60 ° C. A heat storage material microcapsule dispersion 13 having an average particle diameter of 3 μm was obtained in the same manner as in Example 1 except that the above procedure was the same as in Example 1.

(Comparative Example 5)
80 parts of paraffin wax having a melting point of 90 ° C. (trade name: FNP-0090; manufactured by Nippon Seiwa Co., Ltd.) and paraffin wax having a melting point of 115 ° C. (trade name: FT-115; manufactured by Nippon Seiwa Co., Ltd., an overcooling inhibitor) Two parts were pulverized at room temperature using a wet pulverizer using ceramic balls until the average particle size became 10 μm to obtain a heat storage material emulsion. The heat storage material emulsion was heated to 60 ° C., the whole amount of the melamine-formaldehyde initial condensate aqueous solution was added, and the mixture was stirred for 2 hours to obtain a heat storage material microcapsule dispersion 14 having an average particle size of 10 μm.

"Evaluation of heat storage material microcapsules (1)"
As a result of passing the heat storage material microcapsule dispersions obtained in Examples and Comparative Examples through a 150-mesh sieve and comparing the amount of coarse particles, the heat storage material microcapsule dispersions 1 to 6 and 8 to 11 are coarse particles. I couldn't see it. In the heat storage material microcapsule dispersion 7, there was a slight amount of coarse particles, and in the heat storage material microcapsule dispersions 12 and 14, a large amount of coarse particles was observed. Further, in the heat storage material microcapsule dispersion 13, a slightly larger amount of coarse particles was observed. According to the comparison between the heat storage material microcapsule dispersions 4 and 12, when the heat storage material emulsion is once cooled to 50 ° C. or less and then reheated to form microcapsules, the generation of coarse particles is small, and the uniform average particle size is reduced. Although microcapsules can be obtained, if microencapsulation is performed without cooling, a large amount of coarse particles that may be caused by the uneven state of the heat storage material particles are generated, which is insufficient in quality. I knew it would be something. Moreover, from the result of Comparative Example 4 (heat storage material microcapsule dispersion 13), it was found that the generation of coarse particles increased even when the temperature was not lowered to a sufficient cooling temperature after emulsification.

"Evaluation of heat storage material microcapsules (2)"
The heat storage material microcapsule dispersions obtained in Examples and Comparative Examples were dried in a dryer at 105 ° C. for 1 hour and measured for mass, and then left in a dryer at 200 ° C. for 3 hours to change the mass change. As a result, the heat storage material microcapsule dispersions 1 to 6 and 10 to 11 are 3% or less, and a good heat storage material microcapsule is obtained. I found out. In the heat storage material microcapsule dispersion liquids 7 to 9, the results were slightly bad at 6%, 4%, and 6%, respectively, but were at a practical level. In the heat storage material microcapsule dispersion liquids 12 and 13, the mass reduction rate was 20%, which was bad. For the heat storage material microcapsule dispersion liquid 14, the mass reduction rate exceeded 90% and most of the heat storage material was volatilized. It was found that the microcapsule film was insufficient.

"Evaluation of heat storage material microcapsules (3)"
Heat storage material obtained by drying the heat storage material microcapsule dispersions 1, 4, 10 and 11 obtained in Examples 1, 4, 10 and 11 in a dryer at 105 ° C. for 1 hour to remove moisture. About the microcapsule, the difference of the main peak temperature of the heat capacity curve at the time of temperature rising at the time of temperature rising was measured using the differential scanning calorimeter (USA DSC-7 type | mold by USA). The measurement was performed at a sample amount of 2 ± 0.2 mg, a temperature increase rate of 10 ° C./min, and a temperature decrease rate of 10 ° C./min. Since the heat capacity curve of the heat storage material itself is broad, the quality of the supercooling state is judged by looking at the difference in the main peak temperature, and the smaller the numerical value, the greater the effect of preventing overcooling and the preferable state. Example 1 is 9.8 ° C., Example 4 is −4.0 ° C., Example 10 is 3.2 ° C., and Example 11 is −5.0 ° C. In Examples 4 and 11, where the melting point was higher by 10 ° C. or more than the melting point of the heat storage material, a good effect of preventing overcooling was confirmed.

  The heat storage material microcapsules obtained by the production method of the present invention can be used as a liquid slurry in the form of a dispersion, and examples of its use include heating for utilizing waste heat and solar heat from boilers and various combustion kettles. Examples include a heat storage device for hot water supply. Further, it can be handled as a sheet having heat storage properties by coating or impregnating a sheet-like support, for example, a paper made of cellulose fiber, a synthetic fiber sheet made of nylon fiber, polyester fiber, polyethylene fiber, polyurethane fiber or the like. . The heat storage material microcapsules in solid form can be kneaded with silicon rubber or polyolefin rubber to form a sheet. These sheets having heat storage properties can be used as a heat generation suppressing sheet having a function of a temperature barrier that absorbs an abnormal temperature rise of a precision electronic component or the like and prevents damage to equipment.

Claims (3)

  (1) A step of heating a nonpolar organic heat storage material having a melting point of 80 to 130 ° C. to a temperature equal to or higher than the melting point and emulsifying and dispersing it in a dispersing agent aqueous solution in a pressurized state, and (2) a heat storage material. A step of cooling the emulsion to 50 ° C. or lower, (3) a microcapsule having a film of melamine-formaldehyde resin or urea-formaldehyde resin by reheating the heat storage material emulsion to 60-95 ° C. and in-situ polymerization method The manufacturing method of the thermal storage material microcapsule characterized by including the process of making it.   As the supercooling preventive agent, at least one hydrocarbon compound selected from paraffin wax and polyethylene wax having a melting point of 10 ° C. or higher and 140 ° C. or lower than the melting point of the nonpolar organic heat storage material is nonpolar organic heat storage. The manufacturing method of the thermal storage material microcapsule of Claim 1 contained in the material.   The method for producing a heat storage material microcapsule according to claim 1, wherein the dispersant is a maleic anhydride polymer sodium salt.