JP5128793B2 - Double-side polishing apparatus and double-side polishing method - Google Patents

Double-side polishing apparatus and double-side polishing method Download PDF

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JP5128793B2
JP5128793B2 JP2006237830A JP2006237830A JP5128793B2 JP 5128793 B2 JP5128793 B2 JP 5128793B2 JP 2006237830 A JP2006237830 A JP 2006237830A JP 2006237830 A JP2006237830 A JP 2006237830A JP 5128793 B2 JP5128793 B2 JP 5128793B2
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slurry
surface plate
ring
polishing
shaped
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JP2008055577A (en
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智樹 神田
晴道 小山
正博 竹内
洋一 両角
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FUJIKOSHI MACHINE INDUSTRY CO.,LTD.
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FUJIKOSHI MACHINE INDUSTRY CO.,LTD.
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Priority to JP2006237830A priority Critical patent/JP5128793B2/en
Priority to US11/882,999 priority patent/US7485029B2/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Description

本発明は、シリコンウエーハ等のワークを研磨する両面研磨装置および両面研磨方法に関する。 The present invention relates to a double-side polishing apparatus and a double-side polishing method for polishing a workpiece such as a silicon wafer.

キャリアの透孔内に保持されたウェーハを上下定盤で挟み、上下定盤を回転させるとともに、下定盤の研磨面にスラリーを供給することによって、ワークの両面を機械的、化学的に研磨する両面研磨装置が知られている（特許文献１）。
図６は、この種の両面研磨装置であり、上面が研磨面とされた下定盤１０と、下定盤の上方に上下動自在に支持装置（シリンダ装置）１２により支持され、下面が研磨面とされた上定盤１４を具備する。上下定盤１０、１４は駆動装置により軸線を中心として互いに反対方向に回転される。 The wafer held in the through hole of the carrier is sandwiched between the upper and lower surface plates, the upper and lower surface plates are rotated, and the slurry is supplied to the polishing surface of the lower surface plate to mechanically and chemically polish both surfaces of the workpiece. A double-side polishing apparatus is known (Patent Document 1).
FIG. 6 shows a double-side polishing apparatus of this type, which is supported by a lower surface plate 10 whose upper surface is a polishing surface, and a support device (cylinder device) 12 that is movable up and down above the lower surface plate, and whose lower surface is a polishing surface. The upper surface plate 14 is provided. The upper and lower surface plates 10 and 14 are rotated in directions opposite to each other around the axis by a driving device.

下定盤１０と上定盤１４との間に、ワークを保持する透孔を有するキャリアが配置される。キャリアは図示しないサンギアとインターナルギアとにより、自転、かつ公転するように回転駆動される。上定盤１４上には、スラリー供給源１６からスラリーが供給されるリング状の樋１８が配置されている。このリング状樋１８と上定盤とに設けられた流下孔を供給パイプ２０で連絡し、この供給パイプ２０を通じてスラリーが下定盤１０上に供給されるようになっている。
特開平１１−２６２８６２号公報 A carrier having a through hole for holding a workpiece is disposed between the lower surface plate 10 and the upper surface plate 14. The carrier is driven to rotate and revolve by a sun gear and an internal gear (not shown). On the upper platen 14, a ring-shaped ridge 18 to which slurry is supplied from a slurry supply source 16 is disposed. Flowing holes provided in the ring-shaped bowl 18 and the upper surface plate are connected by a supply pipe 20, and slurry is supplied onto the lower surface plate 10 through the supply pipe 20.
JP-A-11-262862

上記のようにスラリーを下定盤１０の研磨面に供給することによって、ワークは機械的、化学的に研磨される。したがって、スラリーは下定盤１０上に均一に供給されることが好ましい。従来においては、上定盤１４に形成されるスラリーの流下孔２２は、放射線上に位置するように設けられている。
内周側に設けられた流下孔２２から下定盤１０上に供給されたスラリーは、下定盤１０の回転による遠心力により、下定盤１０の外周側に移動する。流下孔２２は下定盤１０の外周側に疎となっているが、内周側からスラリーが移動するので、これによりスラリーは比較的均一に下定盤１０上に供給されることになる。 By supplying the slurry to the polishing surface of the lower surface plate 10 as described above, the work is polished mechanically and chemically. Therefore, the slurry is preferably supplied uniformly on the lower surface plate 10. Conventionally, the flow down hole 22 of the slurry formed in the upper surface plate 14 is provided so as to be positioned on the radiation.
The slurry supplied onto the lower platen 10 from the flow hole 22 provided on the inner peripheral side moves to the outer peripheral side of the lower platen 10 due to the centrifugal force generated by the rotation of the lower platen 10. The flow-down holes 22 are sparse on the outer peripheral side of the lower platen 10, but the slurry moves from the inner peripheral side, so that the slurry is supplied onto the lower platen 10 relatively uniformly.

しかしながら、上記従来の両面研磨装置では、スラリーの供給量をコントロールすることまではできない。すなわち、図６のように、各供給パイプ２０はその長さにばらつきがあり、長い供給パイプ２０の場合には管路抵抗が大きく、また中途部が垂れ下がるなどすることによってスラリー溜りが生じやすく、スラリーのスムーズな供給が行えない。一方、短い供給パイプ２０の場合には、管路抵抗が小さく、またスラリー溜りも生じにくいので、スラリーは流下しやすくなる。このように、供給パイプ２０ごとに条件が異なるので、スラリーの供給量のコントロールは困難である。   However, the conventional double-side polishing apparatus cannot control the supply amount of slurry. That is, as shown in FIG. 6, the length of each supply pipe 20 varies, and in the case of a long supply pipe 20, the pipeline resistance is large, and the slurry is liable to occur due to the middle part hanging down, Slurry cannot be supplied smoothly. On the other hand, in the case of the short supply pipe 20, the pipe resistance is small and the slurry accumulation hardly occurs, so that the slurry easily flows down. Thus, since conditions differ for every supply pipe 20, control of the supply amount of a slurry is difficult.

なお、各供給パイプ２０に電磁弁を設けて、各供給パイプ２０ごとに供給量をコントロールするようにすることが考えられるが、制御が厄介であり、またコスト高となる課題がある。
そこで、本発明は上記課題を解決すべくなされたものであり、その目的とするところは、下定盤へのスラリーの供給量を簡易な機構でコントロールすることが可能な両面研磨装置および両面研磨方法を提供するにある。 Although it is conceivable that an electromagnetic valve is provided in each supply pipe 20 to control the supply amount for each supply pipe 20, there is a problem that the control is troublesome and the cost is increased.
Accordingly, the present invention has been made to solve the above-mentioned problems, and its object is to provide a double-side polishing apparatus and a double-side polishing method capable of controlling the amount of slurry supplied to the lower surface plate with a simple mechanism. To provide.

本発明に係る両面研磨装置は、上面が研磨面とされた下定盤と、該下定盤の上方に上下動自在に支持され、下面が研磨面とされた上定盤と、該下定盤と上定盤との間に配置され、ワークを保持する透孔を有するキャリアと、前記上下定盤を軸線を中心として回転駆動する駆動装置と、前記キャリアを回転駆動するキャリア駆動装置と、スラリー供給源と、前記上定盤上に配置され、前記スラリー供給源からスラリーが供給されるリング状の樋と、該リング状樋と前記上定盤とに設けられた複数の流下孔を連絡し、該流下孔を通じてスラリーを前記下定盤の研磨面上に流下させる供給パイプとを具備し、スラリーを前記下定盤上に供給しつつ、上下定盤を回転させ、かつキャリアを回転させることにより、上下定盤間に挟まれたワークの両面を研磨する両面研磨装置において、前記リング状樋から、前記供給パイプを通じて、前記下定盤の同心状の研磨ゾーンの対応する各研磨ゾーンにスラリーを供給すべく、前記リング状樋が、前記上定盤上に同心状に複数個配置され、前記複数のリング状樋の各リング状樋に、異なるスラリー供給源からそれぞれスラリーを供給すべく、前記リング状樋と同数の複数の前記スラリー供給源が設けられ、前記リング状樋から、前記供給パイプを通じて、前記下定盤の同心状の研磨ゾーンの対応する各研磨ゾーンにスラリーを供給する際、前記複数のスラリー供給源のうちの少なくとも１つのスラリー供給源におけるスラリーの温度を調節して前記各研磨ゾーンにおけるワークの研磨速度の均一化を図る温度調節部が設けられていることを特徴とする。
また、前記スラリー供給源から、前記複数のリング状樋に供給するスラリー量を調整する流量調整弁が設けられていることを特徴とする。 The double-side polishing apparatus according to the present invention includes a lower surface plate having an upper surface as a polishing surface, an upper surface plate supported above and below the lower surface plate, and having a lower surface as a polishing surface, and the lower surface plate and the upper surface plate. A carrier disposed between the surface plate and having a through hole for holding a workpiece; a drive device that rotationally drives the upper and lower surface plates around an axis; a carrier drive device that rotationally drives the carrier; and a slurry supply source And a ring-shaped ridge disposed on the upper surface plate and supplied with slurry from the slurry supply source, and a plurality of flow holes provided in the ring-shaped ridge and the upper surface plate, A supply pipe that causes the slurry to flow down onto the polishing surface of the lower surface plate through the flow hole, and rotates the upper and lower surface plates while rotating the carrier while rotating the upper and lower surface plates while supplying the slurry onto the lower surface plate. Both sides of the work sandwiched between the boards In the double-side polishing apparatus for polishing, in order to supply slurry from the ring-shaped scissors through the supply pipe to each corresponding polishing zone of the concentric polishing zone of the lower surface plate, the ring-shaped scissors are provided on the upper surface plate A plurality of slurry supply sources equal to the number of the ring-shaped scissors are provided in order to supply slurry from different slurry supply sources to each of the plurality of ring-shaped scissors. When supplying slurry from the ring-shaped trough to each polishing zone corresponding to the concentric polishing zone of the lower surface plate through the supply pipe, at least one slurry supply source of the plurality of slurry supply sources wherein the temperature adjusting unit made uniform polishing rate of the workpiece in each of the polishing zone by adjusting the temperature of the slurry is provided in
In addition, a flow rate adjusting valve is provided for adjusting the amount of slurry supplied from the slurry supply source to the plurality of ring-shaped bowls.

また本発明に係る両面研磨方法は、上面が研磨面とされた下定盤と、該下定盤の上方に上下動自在に支持され、下面が研磨面とされた上定盤と、該下定盤と上定盤との間に配置され、ワークを保持する透孔を有するキャリアと、前記上下定盤を軸線を中心として回転駆動する駆動装置と、前記キャリアを回転駆動するキャリア駆動装置と、スラリー供給源と、前記上定盤上に配置され、前記スラリー供給源からスラリーが供給されるリング状の樋と、該リング状樋と前記上定盤とに設けられた複数の流下孔を連絡し、該流下孔を通じてスラリーを前記下定盤の研磨面上に流下させる供給パイプとを具備し、スラリーを前記下定盤上に供給しつつ、上下定盤を回転させ、かつキャリアを回転させることにより、上下定盤間に挟まれたワークの両面を研磨する両面研磨装置であって、前記リング状樋から、前記供給パイプを通じて、前記下定盤の同心状の研磨ゾーンの対応する各研磨ゾーンにスラリーを供給すべく、前記リング状樋が、前記上定盤上に同心状に複数個配置され、前記複数のリング状樋の各リング状樋に、異なるスラリー供給源からそれぞれスラリーを供給すべく、前記リング状樋と同数の複数の前記スラリー供給源が設けられ、前記複数のスラリー供給源のうちの少なくとも１つのスラリー供給源におけるスラリーの温度を調節する温度調節部が設けられた両面研磨装置を用い、前記温度調節部によりスラリーの温度を調節すると共に、前記リング状樋から、前記供給パイプを通じて、前記下定盤の同心状の研磨ゾーンの対応する各研磨ゾーンにスラリーを供給して、前記各研磨ゾーンにおけるワークの研磨速度の均一化を図ることを特徴とする。 The double-side polishing method according to the present invention includes a lower surface plate whose upper surface is a polished surface, an upper surface plate whose upper surface is supported above and below the lower surface plate and whose lower surface is a polished surface, and the lower surface plate, A carrier disposed between the upper surface plate and having a through hole for holding a work, a driving device for rotating the upper and lower surface plate around an axis, a carrier driving device for rotating the carrier, and slurry supply A ring-shaped ridge disposed on the upper platen and supplied with slurry from the slurry supply source, and a plurality of flow holes provided in the ring-shaped ridge and the upper platen, A supply pipe that causes the slurry to flow down onto the polishing surface of the lower surface plate through the flow hole, and rotates the upper and lower surface plates while rotating the carrier while rotating the upper and lower surface plates while supplying the slurry onto the lower surface plate. Both workpieces sandwiched between surface plates A double-side polishing apparatus for polishing the ring-shaped scissors to supply slurry from the ring-shaped scissors to the corresponding polishing zones of the concentric polishing zone of the lower surface plate through the supply pipe. A plurality of the slurry supply units arranged in a concentric manner on the upper platen, and the same number of the slurry supply units as the ring-shaped reeds , so that the slurry is supplied to each of the ring reeds from the different slurry supply sources And a double-side polishing apparatus provided with a temperature adjusting unit for adjusting the temperature of the slurry in at least one of the plurality of slurry supply sources. The temperature adjusting unit adjusts the temperature of the slurry. And supplying slurry from the ring-shaped trough to each polishing zone corresponding to the concentric polishing zone of the lower surface plate through the supply pipe, Serial, characterized in that achieve uniform polishing rate of the workpiece in each grinding zone.

本発明に係る両面研磨装置および両面研磨方法によれば、リング状樋を、上定盤上に同心状に複数個配置し、該複数の同心状のリング状樋の各リング状樋から、前記供給パイプを通じて、前記下定盤の同心状の研磨ゾーンの対応する各研磨ゾーンにスラリーを供給するようにしたから、供給パイプを短く、かつ長さのばらつきも小さなものとすることができ、管路抵抗が小さく、またスラリー溜りも生じにくいので、スラリーの供給量のコントロールを行いやすくなる。またスラリーの温度を調整することによって、各研磨ゾーンにおける研磨速度の均一化が行える。 According to the double- side polishing apparatus and the double-side polishing method according to the present invention, a plurality of ring-shaped ridges are arranged concentrically on the upper surface plate, and each of the ring-shaped ridges of the plurality of concentric ring-shaped ridges, Since the slurry is supplied to each polishing zone corresponding to the concentric polishing zone of the lower surface plate through the supply pipe, the supply pipe can be shortened and the variation in length can be reduced. Since the resistance is small and the slurry does not easily accumulate, it becomes easy to control the supply amount of the slurry. Further, by adjusting the temperature of the slurry, the polishing rate in each polishing zone can be made uniform.

以下本発明の好適な実施例を添付図面に基づいて詳細に説明する。
図１は両面研磨装置３０の正面説明図である。両面研磨装置３０の基本的な構造は公知のものを採用しうるので、以下簡単に説明する。
両面研磨装置３０は、上面が研磨面とされた下定盤３２と、下定盤３２の上方に上下動自在に支持され、下面が研磨面とされた上定盤３６を具備する。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an explanatory front view of the double-side polishing apparatus 30. Since the basic structure of the double-side polishing apparatus 30 can employ a known structure, it will be briefly described below.
The double-side polishing apparatus 30 includes a lower surface plate 32 whose upper surface is a polishing surface, and an upper surface plate 36 supported above the lower surface plate 32 so as to be vertically movable and whose lower surface is a polishing surface.

上下定盤３２、３６は駆動装置により軸線を中心として互いに反対方向に回転される。すなわち、上定盤３６は、基台３８に配設された駆動装置４０によって、軸線を中心に回転自在、かつ上下動自在に設けられている。駆動装置４０は、上下動機構として例えばシリンダ装置（図示せず）を有し、また回転機構としてモータ（図示せず）を有している。
４２は下定盤３２を回転駆動するモータである。 The upper and lower surface plates 32 and 36 are rotated in directions opposite to each other around the axis by a driving device. That is, the upper surface plate 36 is provided so as to be rotatable about an axis and movable up and down by a drive device 40 disposed on the base 38. The drive device 40 has, for example, a cylinder device (not shown) as a vertical movement mechanism, and a motor (not shown) as a rotation mechanism.
Reference numeral 42 denotes a motor that rotationally drives the lower surface plate 32.

下定盤３２と上定盤３６との間に、ワークを保持する透孔を有するキャリア４４が配置される。キャリア４４は、下定盤３２の中心孔に配置されたサンギア（内側ピン歯車）４６とインターナルギア（外側ピン歯車）４８とにより、自転、かつ公転するように回転駆動される（図２）。サンギア４６、インターナルギア４８も公知の機構により回転される。   A carrier 44 having a through hole for holding a work is disposed between the lower surface plate 32 and the upper surface plate 36. The carrier 44 is rotationally driven to rotate and revolve by a sun gear (inner pin gear) 46 and an internal gear (outer pin gear) 48 disposed in the center hole of the lower surface plate 32 (FIG. 2). The sun gear 46 and the internal gear 48 are also rotated by a known mechanism.

上定盤３６上には、複数本の支持ロッド５０を介して上定盤３６に取付けられ、上定盤３６とともに回転する回転円板５２が配設されている。
回転円板５２上には、複数（図示の場合２個）のリング状樋５４、５６が同心状に固定されている。
リング状樋５４、５６の底面には、スラリーの流下孔６０が設けられている。 A rotating disk 52 that is attached to the upper surface plate 36 via a plurality of support rods 50 and rotates together with the upper surface plate 36 is disposed on the upper surface plate 36.
On the rotating disk 52, a plurality (two in the illustrated case) of ring-shaped flanges 54 and 56 are fixed concentrically.
Slurry flow-down holes 60 are provided on the bottom surfaces of the ring-shaped rods 54 and 56.

リング状樋５４、５６には、配管６２を介してスラリー供給源６４からスラリーが供給される。配管６２中には流量調整弁６６が配設されている。
配管６２から、まず、アーム６８上に立設された受けパイプ７０、７０内にスラリーが供給される。この受けパイプ７０、７０からは図示しない分配チューブを介して、図３に示されるように、放射状に配設された４本の支持アーム７２に設けた流下口７３、７４から、スラリーがそれぞれリング状樋５４、５６に流下される。
これらアーム６８、支持アーム７２は、図示しない支持部により基台３８に支持されている。 Slurry is supplied to the ring-shaped troughs 54 and 56 from a slurry supply source 64 via a pipe 62. A flow rate adjustment valve 66 is disposed in the pipe 62.
First, slurry is supplied from the pipe 62 into receiving pipes 70, 70 erected on the arm 68. As shown in FIG. 3, the receiving pipes 70, 70, through a distribution tube (not shown), the slurry is respectively ringed from the flow-down ports 73, 74 provided in the four support arms 72 arranged radially. It flows down into the ridges 54 and 56.
The arm 68 and the support arm 72 are supported on the base 38 by a support portion (not shown).

図４に示すように、上定盤３６には、放射状にスラリーの流下孔７６が形成され、この上定盤３６の流下孔７６と、リング状樋５４、５６に設けられた流下孔６０とが供給パイプ７８により連絡されている。この供給パイプ７８を通じて、下定盤３２の研磨面上にスラリーが供給される。   As shown in FIG. 4, the upper platen 36 is formed with slurry flow-down holes 76 in a radial pattern. Are communicated by a supply pipe 78. The slurry is supplied onto the polishing surface of the lower surface plate 32 through the supply pipe 78.

そして、同心状のリング状樋のうち、内側のリング状樋５４からは、上定盤３６に設けた流下孔７６のうち、内周側の３つの流下孔７６にスラリーを供給するようにして、下定盤３２の研磨面の内周側のゾーンにスラリーを供給するようにする。
外側のリング状樋５６からは、上定盤３６に設けた流下孔７６のうち、外周側の３つの流下孔７６にスラリーを供給するようにして、下定盤３２の研磨面の外周側のゾーンにスラリーを供給するようにする。
下定盤３２から流下したスラリーは回収樋８０、戻しパイプ８２によりスラリー供給源６４に戻され、循環して用いられる。 Of the concentric ring-shaped ridges, slurry is supplied from the inner ring-shaped ridge 54 to the three flow-down holes 76 on the inner peripheral side among the flow-down holes 76 provided in the upper surface plate 36. The slurry is supplied to a zone on the inner peripheral side of the polishing surface of the lower surface plate 32.
From the outer ring-shaped ridge 56, the slurry is supplied to the three flow-down holes 76 on the outer peripheral side among the flow-down holes 76 provided in the upper surface plate 36, so that the outer peripheral zone of the polishing surface of the lower surface plate 32 The slurry is fed into the container.
The slurry flowing down from the lower platen 32 is returned to the slurry supply source 64 by the recovery rod 80 and the return pipe 82 and circulated for use.

本実施の形態は上記のように形成されている。
したがって、スラリーを供給パイプ７８を通じて下定盤３２上に供給しつつ、上下定盤３２、３６を回転させ、かつキャリア４４を回転させることにより、上下定盤３２、３６間に挟まれたワークの両面を研磨することができる。 The present embodiment is formed as described above.
Therefore, both surfaces of the workpiece sandwiched between the upper and lower surface plates 32 and 36 are rotated by rotating the upper and lower surface plates 32 and 36 and rotating the carrier 44 while supplying the slurry onto the lower surface plate 32 through the supply pipe 78. Can be polished.

その際、下定盤３２の内周側ゾーンには、内側のリング状樋５４から供給パイプ７８を通じてスラリーが供給され、外周側ゾーンには、外側のリング状樋５６から供給パイプ７８を通じてスラリーを供給される。これにより、従来のように、１つのリング状樋から供給パイプを通じてスラリーを供給するのに比して、供給パイプを短く、かつ長さのばらつきも小さなものとすることができ、管路抵抗が小さく、またスラリー溜りも生じにくいので、スラリーの供給量のコントロールを行いやすくなる。
すなわち、各供給パイプ７８にほぼ均一な量のスラリーを供給することができ、流量調整弁６６で流量を調整することによって、流量のコントロールがし易いくなるのである。 At that time, slurry is supplied from the inner ring-shaped ridge 54 to the inner peripheral zone of the lower surface plate 32 through the supply pipe 78, and slurry is supplied to the outer peripheral zone from the outer ring-shaped ridge 56 through the supply pipe 78. Is done. As a result, the supply pipe can be made shorter and the variation in length can be made smaller than when the slurry is supplied from one ring-shaped ridge through the supply pipe as in the conventional case, and the pipe resistance is reduced. Since it is small and does not easily cause slurry accumulation, it becomes easy to control the supply amount of slurry.
That is, a substantially uniform amount of slurry can be supplied to each supply pipe 78, and the flow rate can be easily controlled by adjusting the flow rate with the flow rate adjustment valve 66.

なお、上記実施の形態では２つのリング状樋を設けたが、３つ以上の複数のリング状樋を同心状に配設するようにしてもよい。
この場合、下定盤３２の、リング状樋と同数の複数の同心状ゾーンに、対応するリング状樋から供給パイプを通じてスラリーを供給するのである。
また、上記実施の形態では流下孔７６を内周側ゾーンに３つ、外周側ゾーンに３つそれぞれ設けたが、これに限定されないことはもちろんである。 In the above embodiment, two ring-shaped ridges are provided, but three or more ring-shaped ridges may be arranged concentrically.
In this case, the slurry is supplied from the corresponding ring-shaped ridges to the plurality of concentric zones as many as the ring-shaped ridges of the lower surface plate 32 through the supply pipe.
In the above embodiment, three flow down holes 76 are provided in the inner circumferential zone and three in the outer circumferential zone, but it is needless to say that the present invention is not limited to this.

図５は他の実施の形態を示す説明図である。
本実施の形態では、リング状樋の数と同数のスラリー供給源（図示の例では２個）６５、６７を設け、スラリー供給源６５から配管５９を通じてリング状樋５４にスラリーを供給し、スラリー供給源６７から配管６１を通じてリング状樋５６にスラリーを供給するようにしている。また、各配管５９、６１中のそれぞれ流量調整弁５５、５７を設けている。
本実施の形態によれば、各流量調整弁５５、５７によって、各リング状樋５４、５６に個別にスラリーの供給量を調整して供給できるので、下定盤３２の各ゾーンへのスラリーの供給量のコントロールをより容易に行える。 FIG. 5 is an explanatory view showing another embodiment.
In the present embodiment, the same number of slurry supply sources (two in the illustrated example) 65 and 67 as the number of ring-shaped ridges are provided, and the slurry is supplied from the slurry supply source 65 to the ring-shaped ridge 54 through the pipe 59. The slurry is supplied from the supply source 67 through the pipe 61 to the ring-shaped bowl 56. Further, flow control valves 55 and 57 in the pipes 59 and 61 are provided.
According to the present embodiment, the supply amount of slurry can be individually adjusted and supplied to each of the ring-shaped rods 54 and 56 by the flow rate adjusting valves 55 and 57, so that the slurry is supplied to each zone of the lower surface plate 32. The amount can be controlled more easily.

また、複数のスラリー供給源６５、６７のうちの少なくとも１つのスラリー供給源に、スラリーの温度を調節する温度調節部（図示せず）を設けるようにすると好適である。
ワークの研磨により、スラリーの温度が上昇する傾向にある。スラリーの温度が上昇すると、機械的、化学的研磨による研磨速度が上昇し、各ゾーンにおける研磨速度にばらつきが生じる可能性がある。本実施の形態では、スラリーの温度を調整することによって、各研磨ゾーンにおける研磨速度の均一化が行える。 In addition, it is preferable that a temperature adjusting unit (not shown) for adjusting the temperature of the slurry is provided in at least one slurry supply source among the plurality of slurry supply sources 65 and 67.
Due to the polishing of the workpiece, the temperature of the slurry tends to increase. When the temperature of the slurry rises, the polishing rate by mechanical and chemical polishing increases, and the polishing rate in each zone may vary. In this embodiment, the polishing rate in each polishing zone can be made uniform by adjusting the temperature of the slurry.

なお、上記実施の形態では、キャリア４４は、サンギア４６、インターナルギア４８により、自転かつ公転するようにしたが、キャリアをキャリアホルダー（図示せず）に連結し、このキャリアホルダーを介してキャリアを、クランク機構等の旋回駆動装置により、自転しない旋回運動をさせるようにしてもよい。   In the above embodiment, the carrier 44 is rotated and revolved by the sun gear 46 and the internal gear 48. However, the carrier is connected to a carrier holder (not shown), and the carrier is connected via the carrier holder. A turning drive device such as a crank mechanism may be used to make a turning motion that does not rotate.

研磨装置の説明図である。It is explanatory drawing of a grinding | polishing apparatus. キャリアの説明図である。It is explanatory drawing of a carrier. リング状樋の説明図である。It is explanatory drawing of a ring-shaped ridge. 上定盤に設けた流下孔配列を示す説明図である。It is explanatory drawing which shows the flow hole arrangement | positioning provided in the upper surface plate. 他の実施の形態を示す説明図である。It is explanatory drawing which shows other embodiment. 従来例の説明図である。It is explanatory drawing of a prior art example.

符号の説明Explanation of symbols

３０ 両面研磨装置
３２ 下定盤
３６ 上定盤
３８ 基台
４０ 駆動装置
４２ モータ
４４ キャリア
４６ サンギア
４８ インターナルギア
５２ 回転円板
５４ リング状樋
５５ 流量調整弁
５６ リング状樋
５７ 流量調整弁
５９ 配管
６０ 流下孔
６１ 配管
６２ 配管
６４ スラリー供給源
６６ 流量調整弁
７６ 流下孔
７８ 供給パイプ 30 Double-side polishing device 32 Lower surface plate 36 Upper surface plate 38 Base 40 Drive device 42 Motor 44 Carrier 46 Sun gear 48 Internal gear 52 Rotating disk 54 Ring-shaped rod 55 Flow rate adjusting valve 56 Ring-shaped rod 57 Flow rate adjusting valve 59 Piping 60 Downstream Hole 61 Piping 62 Piping 64 Slurry supply source 66 Flow rate adjusting valve 76 Downflow hole 78 Supply pipe

Claims (4)

上面が研磨面とされた下定盤と、該下定盤の上方に上下動自在に支持され、下面が研磨面とされた上定盤と、該下定盤と上定盤との間に配置され、ワークを保持する透孔を有するキャリアと、前記上下定盤を軸線を中心として回転駆動する駆動装置と、前記キャリアを回転駆動するキャリア駆動装置と、スラリー供給源と、前記上定盤上に配置され、前記スラリー供給源からスラリーが供給されるリング状の樋と、該リング状樋と前記上定盤とに設けられた複数の流下孔を連絡し、該流下孔を通じてスラリーを前記下定盤の研磨面上に流下させる供給パイプとを具備し、スラリーを前記下定盤上に供給しつつ、上下定盤を回転させ、かつキャリアを回転させることにより、上下定盤間に挟まれたワークの両面を研磨する両面研磨装置において、
前記リング状樋から、前記供給パイプを通じて、前記下定盤の同心状の研磨ゾーンの対応する各研磨ゾーンにスラリーを供給すべく、前記リング状樋が、前記上定盤上に同心状に複数個配置され、
前記複数のリング状樋の各リング状樋に、異なるスラリー供給源からそれぞれスラリーを供給すべく、前記リング状樋と同数の複数の前記スラリー供給源が設けられ、
前記リング状樋から、前記供給パイプを通じて、前記下定盤の同心状の研磨ゾーンの対応する各研磨ゾーンにスラリーを供給する際、前記複数のスラリー供給源のうちの少なくとも１つのスラリー供給源におけるスラリーの温度を調節して前記各研磨ゾーンにおけるワークの研磨速度の均一化を図る温度調節部が設けられていることを特徴とする両面研磨装置。 A lower surface plate whose upper surface is a polishing surface, and an upper surface plate whose lower surface is a polishing surface, which is supported above and below the lower surface plate so as to freely move up and down, and is disposed between the lower surface plate and the upper surface plate, A carrier having a through-hole for holding a workpiece, a driving device that rotationally drives the upper and lower surface plates around an axis, a carrier driving device that rotationally drives the carrier, a slurry supply source, and an arrangement on the upper surface plate A ring-shaped ridge to which slurry is supplied from the slurry supply source, and a plurality of flow holes provided in the ring-shaped ridge and the upper surface plate, and the slurry is passed through the flow hole to the slurry of the lower surface plate. Both sides of the workpiece sandwiched between the upper and lower surface plates by rotating the upper and lower surface plates and rotating the carrier while supplying the slurry onto the lower surface plate. In double-side polishing machine
A plurality of the ring-shaped scissors are concentrically arranged on the upper surface plate so as to supply slurry from the ring-shaped scissors through the supply pipe to each corresponding polishing zone of the concentric polishing zone of the lower surface plate. Arranged,
Each of the plurality of ring-shaped ridges is provided with the same number of slurry supply sources as the ring-shaped ridges in order to supply slurry from different slurry supply sources,
Slurry in at least one slurry supply source among the plurality of slurry supply sources when supplying the slurry from the ring-shaped trough to each polishing zone corresponding to the concentric polishing zone of the lower surface plate through the supply pipe A double-side polishing apparatus characterized in that a temperature adjusting unit is provided to adjust the temperature of the workpiece to make the polishing rate of the workpiece uniform in each polishing zone . 前記スラリー供給源から、前記複数のリング状樋に供給するスラリー量を調整する流量制御弁が設けられていることを特徴とする請求項１記載の両面研磨装置。   The double-side polishing apparatus according to claim 1, further comprising a flow rate control valve that adjusts an amount of slurry supplied from the slurry supply source to the plurality of ring-shaped ridges. 上面が研磨面とされた下定盤と、該下定盤の上方に上下動自在に支持され、下面が研磨面とされた上定盤と、該下定盤と上定盤との間に配置され、ワークを保持する透孔を有するキャリアと、前記上下定盤を軸線を中心として回転駆動する駆動装置と、前記キャリアを回転駆動するキャリア駆動装置と、スラリー供給源と、前記上定盤上に配置され、前記スラリー供給源からスラリーが供給されるリング状の樋と、該リング状樋と前記上定盤とに設けられた複数の流下孔を連絡し、該流下孔を通じてスラリーを前記下定盤の研磨面上に流下させる供給パイプとを具備し、スラリーを前記下定盤上に供給しつつ、上下定盤を回転させ、かつキャリアを回転させることにより、上下定盤間に挟まれたワークの両面を研磨する両面研磨装置であって、前記リング状樋から、前記供給パイプを通じて、前記下定盤の同心状の研磨ゾーンの対応する各研磨ゾーンにスラリーを供給すべく、前記リング状樋が、前記上定盤上に同心状に複数個配置され、前記複数のリング状樋の各リング状樋に、異なるスラリー供給源からそれぞれスラリーを供給すべく、前記リング状樋と同数の複数の前記スラリー供給源が設けられ、前記複数のスラリー供給源のうちの少なくとも１つのスラリー供給源におけるスラリーの温度を調節する温度調節部が設けられた両面研磨装置を用い、
前記温度調節部によりスラリーの温度を調節すると共に、前記リング状樋から、前記供給パイプを通じて、前記下定盤の同心状の研磨ゾーンの対応する各研磨ゾーンにスラリーを供給して、前記各研磨ゾーンにおけるワークの研磨速度の均一化を図ることを特徴とする両面研磨方法。 A lower surface plate whose upper surface is a polishing surface, and an upper surface plate whose lower surface is a polishing surface, which is supported above and below the lower surface plate so as to freely move up and down, and is disposed between the lower surface plate and the upper surface plate, A carrier having a through-hole for holding a workpiece, a driving device that rotationally drives the upper and lower surface plates around an axis, a carrier driving device that rotationally drives the carrier, a slurry supply source, and an arrangement on the upper surface plate A ring-shaped ridge to which slurry is supplied from the slurry supply source, and a plurality of flow holes provided in the ring-shaped ridge and the upper surface plate, and the slurry is passed through the flow hole to the slurry of the lower surface plate. Both sides of the workpiece sandwiched between the upper and lower surface plates by rotating the upper and lower surface plates and rotating the carrier while supplying the slurry onto the lower surface plate. A double-side polishing machine for polishing A plurality of the ring-shaped scissors are concentrically arranged on the upper surface plate so as to supply slurry from the ring-shaped scissors through the supply pipe to each corresponding polishing zone of the concentric polishing zone of the lower surface plate. A plurality of slurry supply sources equal to the number of the ring-shaped scissors are provided to supply the slurry to each of the ring-shaped scissors of the plurality of ring-shaped scissors. Using a double-side polishing apparatus provided with a temperature adjustment unit for adjusting the temperature of the slurry in at least one slurry supply source of the sources,
The temperature adjusting unit adjusts the temperature of the slurry, and supplies the slurry to each polishing zone corresponding to the concentric polishing zone of the lower surface plate from the ring-shaped trough through the supply pipe, A double-side polishing method characterized in that the polishing rate of the workpiece is uniformized. 前記スラリー供給源から、前記複数のリング状樋に供給するスラリー量を調整する流量制御弁が設けられた両面研磨装置を用いることを特徴とする請求項３記載の両面研磨方法。   4. The double-side polishing method according to claim 3, wherein a double-side polishing apparatus provided with a flow rate control valve for adjusting the amount of slurry supplied from the slurry supply source to the plurality of ring-shaped ridges is used.
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