JP5106187B2 - Electrical connection structure - Google Patents

Description

  The present invention relates to an electrical connection structure. More particularly, the present invention relates to a technical field in which a lead terminal of an electronic component is welded to a predetermined portion of a wiring board to reduce the size.

  For example, in a vehicular lamp such as a vehicular headlamp, a portion having an electrical connection structure in which an electronic component is connected to a wiring board by welding is provided.

  Such an electrical connection structure is provided, for example, in a lighting control device for a discharge lamp used as a light source. The lighting control device includes required parts such as a lighting circuit unit inside the case body, for example, a power supply unit that has a switching element and supplies power to the discharge lamp, a control unit that controls power supplied to the discharge lamp, and a discharge unit. A high voltage generating unit called a starter for generating a high voltage in the electric lamp and lighting the discharge lamp is arranged.

  As a conventional electrical connection structure, for example, a pair of lead terminals connected to a component main body of an electronic component protrudes outward from the component main body, and the lead terminals are provided, for example, on a protruding portion provided on a wiring board. There is a structure welded by welding or the like (for example, see Patent Document 1).

JP 2004-6547 A

  However, in the electrical connection structure described in Patent Document 1, since a space a for welding is present on the side of the component body c of the electronic component b, as shown in FIG. For example, when the lead terminals e and e are welded to the wiring boards f and f by irradiating the laser beam d, the laser beam d is irradiated to the end portion (end portion g shown in FIG. 5) of the component main body c. There is a risk. Therefore, in order to prevent the occurrence of such a problem that the laser beam d is applied to the component main body c, it is considered to increase the outward protrusion amount of the protrusions h and h of the lead terminals e and e. However, if the protruding amount of the protrusions h, h is increased, the space a, a for welding is increased correspondingly, and the entire structure is increased to prevent downsizing. Problems arise.

  Accordingly, an object of the electrical connection structure of the present invention is to reduce the size of the entire structure.

In order to solve the above-described problems, the electrical connection structure of the present invention is formed by connecting an electronic component having a component main body and a lead terminal bonded to the component main body, and a lead terminal of the electronic component formed of a metal material. A wiring board formed by a resin material and attached to a portion excluding a part of the wiring board and having a bonding surface in contact with the wiring board and a component mounting surface on which the electronic component is mounted. The board includes a welding hole, and the wiring board is provided by being bent by approximately 90 ° with respect to a component mounting surface of the board in a region of the base surface portion attached by the board and the welding hole. The protruding portion and the lead terminal of the electronic component are welded by a laser beam irradiated through the welding hole .

Therefore, in the present invention , the laser beam is irradiated through the welding hole.

The electrical connection structure of the present invention is formed of an electronic component having a component body and lead terminals joined to the component body, a wiring board formed of a metal material and connected to the lead terminals of the electronic component, and a resin material. And an electrical connection structure comprising a substrate that is attached to a portion excluding a part of the wiring board and has a joint surface that contacts the wiring board and a component mounting surface on which the electronic component is mounted. The substrate includes a welding hole, and the wiring board is provided by being bent by approximately 90 ° with respect to a component mounting surface of the substrate in a region of the base surface portion attached by the substrate and the welding hole. The projecting portion and the lead terminal of the electronic component are welded by laser light irradiated through the welding hole .

Therefore, the laser beam is irradiated through the welding hole.

In the invention described in claim 2, the electronic component is formed with a pair of lead terminals connected to the left and right side surfaces of the component main body, and the pair of lead terminals are formed by the protrusions. In addition, since the wiring board is welded in contact with the mounting surface formed on the side opposite to the component mounting surface of the substrate, the protruding amount of the lead terminal is small. Therefore, the product can be reduced in size.

In the invention described in claim 3, since the laser beam is also irradiated to the tip surface side of the protruding portion, and the pair of lead terminals are welded to the protruding portion of the wiring board, the lower welding portion And it welds at two places of an upper side welding part. Therefore, the strength of joining can be increased.

In the invention described in claim 4, the distance between the tip end surface of the projecting portion and the component mounting surface of the substrate is the surface located farthest from the component mounting surface in the component main body of the electronic component, and the Since the distance to the component mounting surface is approximately the same as or greater than the distance, the laser light can be prevented from being irradiated onto the electronic component.

  The best mode for carrying out the electrical connection structure of the present invention will be described below with reference to the accompanying drawings.

  In the best mode shown below, the electrical connection structure of the present invention is applied to a structure arranged in a lighting control device that controls lighting of a discharge lamp provided in a vehicle headlamp among vehicle lamps. . The scope of application of the present invention is not limited to the structure disposed in the lighting control device for the vehicle headlamp, and is provided in, for example, an electrical connection structure or a vehicle disposed in each part of the vehicle lamp. The present invention can be widely applied to electrical connection structures arranged in other parts.

  The vehicle headlamps 1 and 1 are attached to the left and right ends of the front end of the vehicle body.

  As shown in FIG. 1, a vehicle headlamp 1 includes a lamp body 2 having a recessed portion opened forward and a front cover 3 that closes the front opening of the lamp body 2, and the lamp body 2 and the front cover An internal space defined by 3 is formed as a lamp chamber 4.

  A mounting opening 2 a penetrating in the front-rear direction is formed at the rear end of the lamp body 2.

  A lamp unit 5 is disposed in the lamp chamber 4. The lamp unit 5 is supported by a support mechanism (not shown) so as to be tiltable with respect to the lamp body 2 in the horizontal direction and the vertical direction.

  The lamp unit 5 includes a reflector 6, a socket 7 held at the rear end of the reflector 6, a discharge lamp 8 connected to the socket 7, a shade 9 attached to the front end of the reflector 6, and a front of the discharge lamp 8. It has a lens 10 arranged and a lens holder 11 that holds the lens 10 and is attached to the reflector 6.

  The socket 7 is held at the rear end of the reflector 6, and a discharge lamp 8 is connected to the front surface of the socket 7.

  An extension 12 for closing a part of the lamp unit 5 is disposed in the lamp chamber 4.

  A back cover 13 that closes the mounting opening 2 a is attached to the rear end of the lamp body 2.

  The rear end of the socket 7 is attached to a lighting control device 14 that controls the lighting of the discharge lamp 8. The lighting control device 14 includes a lighting circuit unit 16 for lighting the discharge lamp 8 inside the case body 15.

  As shown in FIG. 2, the lighting circuit unit 16 is configured by mounting various electronic components 18, 18,... On the base body 17 (only one electronic component 18 is shown in FIG. 2).

  In the following description of the lighting circuit section 16, the direction in which the base body 17 faces is the vertical direction. However, the following front, rear, up, down, left, and right directions are for convenience of explanation and are related to the implementation of the present invention. Is not limited to these directions.

  The base body 17 includes a wiring board 19 formed of a metal material and a substrate 20 attached to a portion excluding a part of the wiring board 19.

  The wiring board 19 is connected to a power supply unit (not shown) via a circuit pattern (not shown). The wiring board 19 has a base surface portion 21 facing in the up-down direction and protrusions 22, 22 provided by being bent approximately 90 ° upward with respect to the base surface portion 21. The base surface portion 21 is formed with welding holes 21a and 21a in portions after the protruding portions 22 and 22 are bent.

  The protrusion 22 is formed in, for example, a vertically long rectangular shape, and as shown in FIG. 3, a rearward facing surface is formed as an attachment surface 22a, and an upper end surface is formed as a tip surface 22b.

  A work hole 23 is formed at the lower end of the protrusion 22 (see FIGS. 3 and 4). A working surface 23a facing downward is formed in the upper portion of the working hole 23 in the protrusion 22 (see FIG. 4).

  The substrate 20 is formed of a resin material, the upper surface is formed as a component mounting surface 20a, and the surface in contact with the base surface portion 21 of the wiring board 19 is formed as a bonding surface 20b. The component mounting surface 20a is orthogonal to the mounting surfaces 22a and 22a of the protrusions 22 and 22 of the wiring board 19, and is parallel to the tip surfaces 22b and 22b of the protrusions 22 and 22 and the work surfaces 23a and 23a.

  In the substrate 20, welding holes 20 c and 20 c are formed corresponding to the welding holes 21 a and 21 a of the wiring board 19, respectively. Therefore, the base body 17 is vertically penetrated by the welding holes 21 a and 21 a of the wiring board 19 and the welding holes 20 c and 20 c of the substrate 20.

  The electronic component 18 includes a component main body 24 and lead terminals 25 and 25 connected to the component main body 24 (see FIG. 2).

  The component main body 24 is a capacitor, for example, and is formed in a rectangular parallelepiped shape, for example.

  The lead terminals 25 are connected to the left and right side surfaces of the component main body 24, respectively. The lead terminal 25 is formed of, for example, a metal plate, and includes a connection surface portion 26 connected to the side surface of the component main body 24 and a mounted surface portion 27 protruding outward (side) from the front edge of the connection surface portion 26. It is formed integrally. The upper and lower end edges of the attached surface portion 27 are formed as an upper welded portion 27a and a lower welded portion 27b, respectively.

  Below, the connection operation | work by welding to the wiring board 19 of the electronic component 18 is demonstrated.

  First, the electronic component 18 is placed on the component mounting surface 20a of the substrate 20 in a direction in which the lead terminals 25 and 25 are positioned on the left and right (see FIGS. 2 and 4). At this time, the electronic component 18 is placed between the welding holes 20c, 20c, and the attached surface portions 27, 27 of the lead terminals 25, 25 are pressed against the attachment surfaces 22a, 22a of the projecting portions 22, 22, respectively, to make surface contact ( (See FIG. 4).

  In the state in which the mounted surface portions 27, 27 of the lead terminals 25, 25 are in surface contact with the mounting surfaces 22a, 22a of the protruding portions 22, 22, respectively, the upper welded portions 27a, 27a of the mounted surface portions 27, 27 protrude. The lower end welded portions 27b and 27b of the mounting surface portions 27 and 27 are substantially aligned with the work surfaces 23a and 23a of the protruding portions 22 and 22, respectively.

  In the state where the electronic component 18 is placed on the component mounting surface 20a as described above, the distance L1 between the tip surfaces 22b, 22b of the protrusions 22, 22 and the component mounting surface 20a of the wiring board 19 is the component of the electronic component 18. The surface of the main body 24 that is located farthest from the component mounting surface 20a, that is, the distance L2 between the upper surface 24a of the component main body 24 and the component mounting surface 20a (see FIG. 4).

  Next, laser beams R1 and R1 are irradiated from above toward the upper welded portions 27a and 27a of the attached surface portions 27 and 27 and the distal end surfaces 22b and 22b of the projecting portions 22 and 22, respectively, thereby connecting the lead terminals 25 and 25 to each other. It welds to the wiring board 19.

  Further, laser beams R2 and R2 are applied from below to the welding holes 21a and 21a and the welding surfaces 27a and 27b of the attachment surface portions 27 and 27 and the work surfaces 23a and 23a of the protrusions 22 and 22, respectively. The lead terminals 25 and 25 are welded to the wiring board 19 by irradiation through the holes 20c and 20c.

  As described above, the laser beams R1 and R1 are irradiated from above toward the upper welded portions 27a and 27a of the attached surface portions 27 and 27 and the front end surfaces 22b and 22b of the projecting portions 22 and 22, respectively, to thereby lead the lead terminal 25. , 25 are welded to the wiring board 19, so that the laser beams R1, R1 are not irradiated below the front end surfaces 22b, 22b, and the laser beams R1, R1 are not irradiated to the component main body 24 of the electronic component 18. .

  Therefore, the amount of outward projection of the attached surface portions 27, 27 from the connection surface portions 26, 26 can be small, and the electronic component 18 and the base body 17 can be reduced accordingly, and the discharge lamp lighting device 14 Miniaturization can be achieved.

  Also, laser light R2 and R2 are irradiated from below toward the lower welded portions 27b and 27b of the attached surface portions 27 and 27 and the work surfaces 23a and 23a of the protruding portions 22 and 22, respectively, so that the lead terminals 25 and 25 are connected. Since it is welded to the wiring board 19, the laser beams R2 and R2 are not irradiated above the work surfaces 23a and 23a, and the laser beams R2 and R2 are not irradiated to the component main body 24 of the electronic component 18.

  Therefore, the amount of outward projection of the attached surface portions 27, 27 from the connection surface portions 26, 26 can be small, and the electronic component 18 and the base body 17 can be reduced accordingly, and the discharge lamp lighting device 14 Miniaturization can be achieved.

  Further, as described above, by welding the lead terminal 25 to the protruding portion 22 at the two locations of the upper welded portion 27a and the lower welded portion 27b, the bonding strength of the electronic component 18 to the protruding portion 22 can be improved. it can.

  Furthermore, since the irradiation directions of the laser beams R1 and R1 and the laser beams R2 and R2 are the vertical direction, the other laser beams R1 and R1 and the laser beams R2 and R2 are placed on the component mounting surface 20a of the substrate 20. .. Without interfering with the parts 18, 18,..., And the manufacturing cost can be reduced by improving workability in welding work.

  In addition, since the working holes 23 and 23 are formed in the projecting portions 22 and 22, respectively, and the work surfaces 23a and 23a are directed downward, the work surfaces 23a and 23a serving as welding parts and the lead terminals are formed. The welding work by the laser beams R2 and R2 can be performed with the lower welded portions 27b and 27b of 25 and 25 facing downward, so that the welding work can be performed reliably.

  In the above description, the example of laser welding as the welding means has been described. However, the welding means is not limited to laser welding. For example, arc welding by arc discharge or an electrode is pressed against the welded part as a welding means. It is possible to use spot welding or the like performed by flowing the gas.

  Moreover, although the lead terminal 25 formed of the metal plate is shown as an example in the above, the lead terminal is not limited to the metal plate, and is attached to the mounting surface 22a and the front end surface 22b or the work surface 23a of the protruding portion 22. For example, a wire-shaped or tongue-shaped terminal may be used as long as it is in contact with each other.

  In the above description, the distance L1 between the front end surfaces 22b and 22b and the component mounting surface 20a is set to be equal to or greater than the distance L2 between the upper surface 24a of the component main body 24 and the component mounting surface 20a. It may be substantially the same as the distance L2. That is, the distance L2 between the upper surface 24a of the component main body 24 and the component mounting surface 20a may be slightly longer than the distance L1 between the front end surfaces 22b and 22b and the component mounting surface 20a.

  In this way, even when the distance L2 is slightly longer than the distance L1, the laser beam R1, R1, R2, R2 is not irradiated to the component main body 24. Therefore, the attachment surface portions 27, 27 of the lead terminals 25, 25 The amount of outward projection from the connection surface portions 26 and 26 can be small, and the electronic component 18 and the base body 17 can be made smaller by that amount, and the discharge lamp lighting device 14 can be downsized.

  The shapes and structures of the respective parts shown in the above-described best mode are merely examples of implementations in carrying out the present invention, and the technical scope of the present invention is limitedly interpreted by these. It should not be done.

FIG. 2 to FIG. 4 show the best mode of the electrical connection structure of the present invention, and this figure is a schematic longitudinal sectional view of a vehicular lamp provided with a discharge lamp lighting device having the electrical connection structure. It is a perspective view which shows the state by which the lead terminal of the electronic component is welded. It is a perspective view of a base body. It is sectional drawing which shows the state by which the lead terminal of an electronic component is welded. It is a perspective view which shows the conventional problem.

Explanation of symbols

DESCRIPTION OF SYMBOLS 18 ... Electronic component, 19 ... Wiring board, 20 ... Board | substrate, 20a ... Component mounting surface, 20c ... Hole for welding, 21 ... Base surface part, 22 ... Projection part, 22a ... Mounting surface, 22b ... Tip surface, 24 ... Component main body 25 ... Lead terminal , R1 ... Laser beam, R2 ... Laser beam

Claims (4)

An electronic component having a component body and lead terminals joined to the component body;
A wiring board formed of a metal material and connected to the lead terminals of the electronic component;
An electrical connection comprising a substrate formed of a resin material and attached to a portion excluding a part of the wiring board and having a joint surface in contact with the wiring board and a component mounting surface on which the electronic component is mounted Structure,
The substrate includes a welding hole;
The wiring board has a base surface portion attached by the substrate, and a protrusion provided by being bent by approximately 90 ° with respect to the component mounting surface of the substrate in the region of the welding hole,
The electrical connection structure according to claim 1, wherein the protrusion and the lead terminal of the electronic component are welded by laser light irradiated through the welding hole . The electronic component is formed with a pair of lead terminals connected to the left and right side surfaces of the component body,
Each of the pair of lead terminals is welded in contact with a mounting surface formed on the opposite side of the wiring board from the component mounting surface of the wiring board.
The electrical connection structure according to claim 1. Laser light was also irradiated to the tip surface side of the protruding portion, and the pair of lead terminals were welded to the protruding portion of the wiring board.
The electrical connection structure according to claim 1, wherein the electrical connection structure is provided. The distance between the tip end surface of the protrusion and the component mounting surface of the substrate is substantially the same as the distance between the component mounting surface of the electronic component main body located farthest from the component mounting surface or the component mounting surface. Over distance
The electrical connection structure according to claim 3.

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