JP5104920B2 - レーザー加工装置、被加工物の加工方法および被加工物の分割方法 - Google Patents

レーザー加工装置、被加工物の加工方法および被加工物の分割方法 Download PDF

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Publication number
JP5104920B2
JP5104920B2 JP2010166230A JP2010166230A JP5104920B2 JP 5104920 B2 JP5104920 B2 JP 5104920B2 JP 2010166230 A JP2010166230 A JP 2010166230A JP 2010166230 A JP2010166230 A JP 2010166230A JP 5104920 B2 JP5104920 B2 JP 5104920B2
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JP
Japan
Prior art keywords
workpiece
cleavage
processing
irradiated
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010166230A
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English (en)
Japanese (ja)
Other versions
JP2012024816A (ja
Inventor
正平 長友
郁祥 中谷
充 菅田
良吾 堀井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2010166230A priority Critical patent/JP5104920B2/ja
Priority to TW100111697A priority patent/TWI428195B/zh
Priority to KR1020110045006A priority patent/KR101330608B1/ko
Priority to CN201110176186.2A priority patent/CN102343481B/zh
Publication of JP2012024816A publication Critical patent/JP2012024816A/ja
Application granted granted Critical
Publication of JP5104920B2 publication Critical patent/JP5104920B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
JP2010166230A 2010-07-23 2010-07-23 レーザー加工装置、被加工物の加工方法および被加工物の分割方法 Expired - Fee Related JP5104920B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010166230A JP5104920B2 (ja) 2010-07-23 2010-07-23 レーザー加工装置、被加工物の加工方法および被加工物の分割方法
TW100111697A TWI428195B (zh) 2010-07-23 2011-04-01 雷射加工裝置、被加工物之加工方法及被加工物之分割方法
KR1020110045006A KR101330608B1 (ko) 2010-07-23 2011-05-13 레이저 가공 장치, 피가공물의 가공 방법 및 피가공물의 분할 방법
CN201110176186.2A CN102343481B (zh) 2010-07-23 2011-06-21 激光加工装置、被加工物的加工方法及被加工物的分割方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010166230A JP5104920B2 (ja) 2010-07-23 2010-07-23 レーザー加工装置、被加工物の加工方法および被加工物の分割方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012135320A Division JP5360266B2 (ja) 2012-06-15 2012-06-15 レーザー加工装置、被加工物の加工方法および被加工物の分割方法

Publications (2)

Publication Number Publication Date
JP2012024816A JP2012024816A (ja) 2012-02-09
JP5104920B2 true JP5104920B2 (ja) 2012-12-19

Family

ID=45542753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010166230A Expired - Fee Related JP5104920B2 (ja) 2010-07-23 2010-07-23 レーザー加工装置、被加工物の加工方法および被加工物の分割方法

Country Status (4)

Country Link
JP (1) JP5104920B2 (zh)
KR (1) KR101330608B1 (zh)
CN (1) CN102343481B (zh)
TW (1) TWI428195B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7014536B2 (ja) 2016-07-08 2022-02-01 コーニック ソシエタ ペル アチオニ 滑り止め機構

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5966468B2 (ja) * 2012-03-15 2016-08-10 三星ダイヤモンド工業株式会社 レーザー加工装置
JP5940906B2 (ja) * 2012-06-19 2016-06-29 株式会社ディスコ レーザー加工装置
JP5902281B2 (ja) * 2014-11-19 2016-04-13 三星ダイヤモンド工業株式会社 レーザー加工装置
JP6594699B2 (ja) * 2015-08-18 2019-10-23 浜松ホトニクス株式会社 加工対象物切断方法及び加工対象物切断装置
DE102018124208B4 (de) * 2018-10-01 2021-08-12 Precitec Gmbh & Co. Kg Verfahren und Vorrichtung zur Überwachung eines Laserbearbeitungsprozesses an einem Werkstück sowie dazugehöriges Laserbearbeitungssystem
JP7153851B2 (ja) * 2020-10-27 2022-10-17 株式会社東京精密 レーザ加工装置及びレーザ加工方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1071483A (ja) * 1996-08-29 1998-03-17 Hitachi Constr Mach Co Ltd 脆性材料の割断方法
JP2000270833A (ja) * 1999-03-19 2000-10-03 Japan Tobacco Inc レーザ開孔装置
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP2003220489A (ja) * 2002-01-23 2003-08-05 Fine Device:Kk レーザ加工装置及びレーザ加工方法
ATE493226T1 (de) * 2002-03-12 2011-01-15 Hamamatsu Photonics Kk Verfahren zum schneiden eines bearbeiteten objekts
CN1929978A (zh) * 2004-04-27 2007-03-14 三星钻石工业股份有限公司 脆性基板的垂直裂痕形成方法及垂直裂痕形成装置
JP4909657B2 (ja) * 2006-06-30 2012-04-04 株式会社ディスコ サファイア基板の加工方法
JP2009107301A (ja) * 2007-10-31 2009-05-21 Lemi Ltd 脆性材料のフルボディ割断方法
JP5380986B2 (ja) * 2008-09-30 2014-01-08 アイシン精機株式会社 レーザスクライブ方法及びレーザスクライブ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7014536B2 (ja) 2016-07-08 2022-02-01 コーニック ソシエタ ペル アチオニ 滑り止め機構

Also Published As

Publication number Publication date
CN102343481A (zh) 2012-02-08
KR101330608B1 (ko) 2013-11-18
CN102343481B (zh) 2015-11-25
TWI428195B (zh) 2014-03-01
TW201213033A (en) 2012-04-01
JP2012024816A (ja) 2012-02-09
KR20120010109A (ko) 2012-02-02

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