JP5088534B2 - Canned linear motor armature and canned linear motor using epoxy resin composition - Google Patents

Description

  The present invention relates to a canned / linear motor armature and a canned / linear motor which are used for stage driving of a semiconductor manufacturing apparatus and table feed of a machine tool, and which are required to reduce temperature rise and improve insulation reliability of a linear motor body.

  Conventional canned and linear motor armatures and canned and linear motors have armature windings generated by covering the armature windings with cans and allowing the coolant to flow through the refrigerant path between the armature windings and the cans. The heat to be recovered is recovered with a refrigerant to reduce the temperature rise on the surface of the linear motor (see, for example, Patent Documents 1 and 2).

  FIG. 1 is a perspective view showing the overall configuration of a canned linear motor. In the figure, 100 is a stator, 101 is a housing, 102 is a can, 103 is a can fixing bolt, 104 is a retainer plate, 105 is an armature winding, 106 is a terminal block, 107 is a refrigerant supply port, and 108 is a refrigerant. The discharge port, 111 is a wiring board, 112 is a winding housing frame, 200 is a mover, 201 is a field yoke support member, 202 is a field yoke, and 203 is a permanent magnet. The canned linear motor is configured by inserting the stator 100 into the hollow space of the mover 200 so that the permanent magnet 203 and the armature winding 105 face each other. The mover 200 is supported by a linear rolling guide (not shown), a hydrostatic bearing guide, or the like so that it can move relative to the stator 100 in the direction of the arrow. The refrigerant is supplied from a refrigerant supply port 107 provided in the housing 101 and discharged from a refrigerant discharge port 108.

  FIG. 3 is a partial side sectional view taken along line A-A ′ of FIG. 1. In the figure, 120 is a lead wire, 121 is a land, 122 is a lead wire cover, and 130 is a resin. The wiring board 111 is provided with a copper foil pattern (not shown) that connects the armature winding 105 and the lead wire 120, and a land 121 is provided at the end thereof. One end of the lead wire 120 is soldered to the land 121, and the other end is connected to the terminal block 106. In addition, a recess corresponding to the upper portion of the land 121 is filled with a resin 130, and a lead wire cover 122 is installed at the boundary with the coolant passage 110.

  The canned linear motor configured as described above has a magnetic field and action generated by the permanent magnet 203 by flowing a three-phase alternating current through the armature winding 105 according to the electrical relative position of the mover 200 and the stator 100. Thus, thrust is generated in the mover 200. At this time, the armature winding 105 that has generated heat due to copper loss is cooled by the refrigerant flowing through the refrigerant passage 110, so that an increase in the surface temperature of the can 102 can be suppressed. Furthermore, water (including pure water and ultrapure water) having a large thermal conductivity and specific heat and high heat recovery can be used, and the surface temperature rise of the can 102 can be suppressed to an extremely low level.

On the other hand, in order to develop the water resistance of the wiring board 111, an epoxy resin composition excellent in moisture resistance, heat resistance, and solder resistance has been considered as a general substrate coating resin (see, for example, Patent Document 3). . Since this epoxy resin composition exhibits solder resistance at 250 ° C., the epoxy resin main component has a very rigid chemical structure, and the curing temperature at the time of molding is as high as 150 to 200 ° C.
WO2005-112233 gazette Japanese Patent Laying-Open No. 2004-312877 (pages 4-5, FIG. 2) Japanese Unexamined Patent Publication No. 7-10961 (page 5)

  The conventional canned / linear motor armature and canned / linear motor have the following problems due to the flow of water through the refrigerant passage near the lead wires.

In conventional canned linear motor armatures and canned linear motors, adhesion peeling occurs between the wiring board and the resin, and water penetrates into the peeling part, resulting in a decrease in insulation resistance at the joint between the lead wire and the wiring board. There was a risk of dielectric breakdown. The mechanism by which this problem occurs is as follows.
(1) When an electric current is applied, the armature windings generate heat, the temperature of the wiring board and the winding housing frame, which are the surrounding constituent members, rises, and the temperature of the resin covering the lead wires also increases due to heat conduction. Since the resin was in contact with the coolant water at the outer periphery of the lead wire cover, the coolant was absorbed from that portion. The increase in the temperature of the resin and the water absorption occurred at the same time, and the adhesive force between the wiring board and the filling resin was extremely reduced.
(2) Since the thermal expansion coefficient of the resin is larger than that of the connection board, an internal stress (hereinafter referred to as a peeling force) that causes the resin to peel off from the connection board is generated.
(3) Adhesive peeling occurred between the wiring board and the resin due to the decrease in the adhesive strength due to (1) and the generation of the tearing force due to (2).

  Also, a measure to prevent the above-described adhesion peeling by changing the resin to one having a strong adhesive force can be considered. However, even when the resin is changed to a resin having a strong adhesive force, since the resin is thick, the peeling force that increases in proportion to the volume has not been reduced. Therefore, due to the generation of the peeling force accompanying the temperature rise, the adhesion peeling occurs between the wiring board and the resin, and there is a possibility that the insulation resistance is reduced or the insulation breaks down due to the penetration of water. Furthermore, due to the problem caused by this thermal stress, the curing temperature of the adhesive resin cannot be raised above 80 ° C., and the heat resistance temperature of the adhesive resin is required to be 80 ° C. or higher.

  The present invention has been made to solve the above problems, and provides a canned linear motor armature and a canned linear motor that improve the insulation reliability of a canned linear motor armature with water cooling specifications. Objective.

  In order to solve the above problem, the present invention is configured as follows.

According to the first aspect of the present invention, there is provided an armature winding made of a coil formed in a flat plate shape, a winding housing frame having a hollowed portion for housing the armature winding, and the winding housing. A flat connection board that seals the opening of the frame and connects the armature windings, a metal housing that surrounds the winding housing frame like a frame, and both openings of the housing A can that seals a portion, a refrigerant passage formed between the can and the winding housing frame and between the can and the connection board, a terminal block that supplies power from the outside, and the connection board, In a canned linear motor armature having a lead wire connecting the terminal block, an epoxy resin main component having a circular chemical structure so as to include a connection portion of the connection board and the lead wire is a catalytic curing agent. In Between the coating resin for coating the epoxy resin composition resin to be cured, and filling a resin surrounding said coating resin, so as to isolate the said filling resin and the refrigerant passage, and the connection board and the housing And a clogging resin that clogs a gap between the winding housing frame and the housing.

  In the invention according to claim 2, the epoxy resin main component constituting the epoxy resin composition having a cyclic chemical structure is an aromatic ring, a five-membered ring, an aliphatic six-membered ring, a dicyclopentadiene structure, or a novolac structure. , A benzoxazine structure, one selected from a cyclic chemical structure containing a mesogenic group, or a mixture thereof.

  In the invention of claim 3, the catalyst-type curing agent constituting the epoxy resin composition is an imidazole compound or a boron trifluoride amine complex, and the blending ratio thereof is the epoxy resin main component and the reactive diluent. The catalyst-type curing agent was used in an amount of 1 part by weight to 7 parts by weight with respect to a total of 100 parts by weight.

  According to a fourth aspect of the present invention, the imidazole compound comprises 2 methyl imidazole, 2 ethyl 4 methyl imidazole, nundecyl imidazole, 1 benzyl 2 methyl imidazole, 1 cyanoethyl 2 methyl imidazole, 1 cyanoethyl 2 ethyl 4 methyl imidazole, 1 One selected from cyanoethyl 2-undecylimidazole or a mixture thereof was used.

  In the invention described in claim 5, the boron trifluoride amine complex is a boron trifluoride aniline complex, a boron trifluoride chlorophenylamine complex, or a mixture thereof.

  In the invention described in claim 6, the chemical structure of the reactive diluent may be monofunctional type such as butyl glycidyl ether or phenyl glycidyl ether, or bifunctional type such as linear aliphatic, polyglycol, polyether, polythiol or the like. A mold, or a mixture thereof.

  In the invention according to claim 7, the filling resin is a silicone resin or an epoxy-impregnated resin composition.

  According to an eighth aspect of the present invention, there is provided the armature according to any one of the first to seventh aspects, and a plurality of permanent magnets that are arranged opposite to each other via the magnetic gap and have different polarities alternately. A field element arranged side by side, and either the armature or the field element as a stator and the other as a mover so that the field and the armature travel relatively.

  According to the first aspect of the present invention, since the epoxy resin composition is coated so as to include the connection portion between the wiring board and the lead wire, the adhesive force between the adhesive resin and the wiring board when the temperature rises is enhanced. . In this epoxy resin composition, an epoxy resin main component having a cyclic chemical structure is cured with a catalyst-type curing agent, so that the hydrophilicity is low and the decrease in insulation resistance due to water absorption is small. Further, since the periphery of the adhesive resin is filled with the filling resin, the adhesive resin does not directly contact the coolant water, and a decrease in the adhesive force due to water absorption is suppressed. Furthermore, since the adhesive resin is thinly coated, the peeling force proportional to the volume is reduced. By increasing the adhesive strength when the temperature rises as described above, suppressing the decrease in the adhesive strength due to water absorption, and reducing the peeling force, it is possible to prevent adhesion peeling that has occurred in the prior art. The problem can be solved and the insulation reliability can be dramatically improved.

  According to the second aspect of the present invention, since the epoxy resin base material having low hydrophilicity and rigidity is used, a coating having a high heat resistance temperature can be obtained with a small decrease in insulation resistance due to water absorption.

  According to the third aspect of the present invention, since it is cured with the catalyst-type curing agent, a coating having low hydrophilicity and small decrease in insulation resistance due to water absorption can be obtained. Further, it can be cured at a low temperature of 80 ° C. or less, and a balanced coating with small heat generation and shrinkage during the curing reaction can be obtained.

  According to the invention described in claim 4, since the active temperature of the catalyst type curing agent is low, it is cured even at a low temperature of 80 ° C. or less.

  According to the invention described in claim 5, since the activation temperature of the catalyst type curing agent is low, it is cured even at a low temperature of 80 ° C. or lower.

  According to the invention described in claim 6, since the thin coating is achieved by reducing the viscosity of the epoxy resin composition, the peeling force proportional to the volume is reduced.

  According to the seventh aspect of the present invention, the adhesive resin having a strong adhesive force even when the temperature rises is an epoxy resin, and the cured filling resin is a silicone resin or an epoxy-impregnated resin. The force can be increased, and the filling resin can reduce the peeling force from the peripheral member due to thermal expansion. As a result, adhesion peeling between members can be prevented, and problems of insulation resistance reduction and dielectric breakdown due to water intrusion into the peeled portion can be solved, and insulation reliability can be improved.

  According to the invention of claim 8, the armature according to any one of claims 1 to 3 is made to face a field having a permanent magnet, and either one of the armature or the field is a stator and the other is a mover. Since it comprises, the canned linear motor which has the effect of Claims 1-7 can be provided.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view of a canned linear motor showing Embodiment 1 of the present invention, and FIG. 2 is a partial side sectional view taken along the line A-A 'of FIG. The overall appearance is the same as before. Constituent elements of the present invention that are the same as those of the prior art will be described with the same reference numerals.

  In FIG. 2, 131 is a coating resin and 132 is a filling resin. The structure of the mover 200 of the present invention is exactly the same as that of the prior art.

  The difference between the present invention and Patent Document 1 is the structure of the stator 100.

  Hereinafter, the structure of the stator 100 will be described.

The stator 100 includes a metal casing 101 having a hollow shape with a hollow inside, a plate-like can 102 shaped like the outer shape of the casing 101 to seal the hollow portion of the casing 101, and the can 102. A can fixing bolt 103 for fixing the can 102 to the housing 101, a holding plate 104 having a through hole for the can fixing bolt 103 and pressing the can 102 with an equal load, and a hollow in the housing 101. The armature winding 105, the connection board 111, the winding housing frame 112, the O-ring 109 that is slightly larger than the hollow portion of the casing 101, and between the connection board 111 and the casing 101 and between the windings. is composed of clogging resin 133 plugged the gap between the line housing frame 112 and the housing 101. The outer shapes of the wiring board 111 and the winding housing frame 112 are slightly smaller than the hollow portion of the housing 101. The wiring board 111 is a thin plate, and the winding housing frame 112 is a thick plate and has a concave portion slightly thicker than the outer shape of the armature winding 105. The armature winding 105 is housed in the recess of the winding housing frame 112, sealed with the connection substrate 111, and the inside thereof is molded with the mold resin 113. The armature winding 105 is electrically connected to the connection board 111. The armature winding 105 configured in this manner is fixed to the casing 101 and bolts (not shown) via the connection board 111 or the winding housing frame 112. Circumferential grooves are provided on the front and back edges of the casing 101, and an O-ring 109 is disposed in the grooves. Then, the can 102 is arranged on the front and back of the housing 101. A holding plate 104 is laid from the top of the can 102 along the edge of the casing 101, and is clamped by a can fixing bolt 103 to fix the can 102 and the casing 101. At this time, a certain gap is formed between the can 102 and the wiring board 111 and between the can 102 and the winding housing frame 112, and this gap becomes the refrigerant passage 110. The refrigerant is supplied from a refrigerant supply port 107 provided in the housing 101 and discharged from a refrigerant discharge port 108. In the meantime, the refrigerant flows through the refrigerant passage 110 and cools the armature winding 105 that generates heat due to copper loss. In addition, water (including pure water and ultrapure water) having a large thermal conductivity and specific heat and a very high heat recovery capability is used as the refrigerant.

  On the other hand, the wiring board 111 is provided with a copper foil pattern (not shown) for connecting the armature winding 105 and the lead wire 120, and a land 121 is provided at the end thereof. One end of the lead wire 120 is soldered to the land 121, and the other end is connected to the terminal block 106. Further, the concave portion corresponding to the upper portion of the land 121 is first coated with the coating resin 131 so as to include the connection portion, and then the upper portion of the coating resin 131 is filled with the filling resin 132. A lead wire cover 122 is installed at the boundary with the refrigerant passage 110. Here, as the coating resin 131, an epoxy resin having extremely high adhesive force with the connection substrate 111 and having low hydrophilicity is used. The filling resin 132 is elastic even after curing so that the thermal expansion of the coating resin 131, the surrounding casing 101, the winding housing frame 112, and the like can be absorbed. In addition, a low-viscosity silicone resin excellent in fluidity and defoaming property is used. In addition, the filling resin 132 is thin so as to protect the coating resin 131 and not to generate thermal stress with the surrounding casing 101, the winding housing frame 112, and the like. In some cases, a low-viscosity epoxy-impregnated resin having excellent fluidity and defoaming property is used.

  With such a configuration, the thermal expansion of the adhesive resin can be reduced, so that the tensile force due to the difference in thermal expansion with the connection board can be reduced, adhesion peeling can be prevented, and the decrease in insulation resistance during water absorption can be reduced. be able to.

  In addition, when the adhesive resin is an epoxy resin and the filling resin is a silicone resin having elasticity after curing, the adhesive resin can increase the adhesive force between members and absorb the thermal expansion of peripheral members. it can. Further, when the filling resin is an epoxy-impregnated resin, the residual stress resulting from the thermal stress can be reduced because the volume of the filling resin is small.

A sample for confirming the effect of the present invention, a manufacturing method thereof, and an evaluation method were as follows. The catalyst was selected so that it can sufficiently cure at 80 ° C. or lower.
(1) Sample / epoxy resin having a cyclic chemical structure: dicyclopentadiene type (DCPD), naphthalene bifunctional type (NAP), cresol novolak type (CN)
-General epoxy resin: bisphenol A type (BPA), bisphenol F type (BPF)
Lopentadiene type (DCPD), Cresol novolac type (CN)
Catalyst: 2-ethyl 4-methylimidazole (2E4MZ, liquid), nundecylimidazole (C11Z, solid, melting point 70 ° C.), boron trifluoride aniline complex (BF3, liquid)
Curing agents: triethyltetraamine (TTA, liquid, room temperature curing type), 4,4′diaminodiphenylmethane (DDM, solid, melting point 89 ° C., heat curing type)
-Reactive diluent with cyclic chemical structure: Phenylglycidyl ether (PGE)
In addition, the compounding ratio of an epoxy resin composition is shown in a table | surface with hardening temperature. Table 1 shows this embodiment, and Table 2 shows a conventional example.
(2) Sample The sample was a model of the part shown in FIG.
(3) Evaluation method The change of the insulation resistance between the ground by the submergence test in 80 degreeC and 50 days was measured.
(4) Evaluation result The evaluation result of the insulation resistance is indicated by the following mark in Tables 1 and 2. When it was 1 MΩ or less, it was marked with “X”, when it exceeded 1 MΩ and was 1000 MΩ or less, it was marked with ◯, and when it was 1000 MΩ or more, it was marked with “◎”.

  No. of the Example which uses the epoxy resin main ingredient which has a cyclic | annular chemical structure, and a catalyst hardening epoxy resin composition, and the curing temperature is 80 degrees C or less. Nos. 1 to 7 had extremely high insulation resistance of 1000 MΩ or more. On the other hand, no. In Nos. 9 and 10, the higher the curing temperature, the greater the decrease in insulation resistance, confirming the effectiveness of the epoxy resin composition capable of low-temperature curing according to the present invention. In addition, No. which is a general amine-cured epoxy resin composition. Nos. 10 to 12 were levels that could be used for the linear motor of the present invention when the curing temperature was 100 ° C. or less, but the insulation resistance was greatly reduced as compared with the catalyst curing type (No. 1 to 7). It was. If the curing temperature exceeds 100 ° C., No. As shown in FIG. 13, the insulation resistance decreased to a level where it could not be used.

  When the catalyst blending ratio is 1 part by weight or less, a cured product cannot be obtained due to insufficient curing reaction. When the catalyst blending ratio is 7 parts by weight or more, a good evaluation sample is obtained due to thermal stress caused by heat generated by curing. I couldn't.

  From the above results, insulation reliability can be obtained even when the curing temperature of a general amine curable epoxy resin composition is 80 ° C. or lower, but the epoxy resin main component having a cyclic chemical structure and a catalyst type curing agent are used. In the present invention, the reliability can be further improved. This is because an acid-cured epoxy resin composition not used in amine curing or in this example has a carbonyl group or a hydroxyl group having a very strong affinity for water in the chemical structure of the cured product, and therefore has a water absorption amount. It is considered large. In order to solve this problem, the curing agent is required not to generate a polar group in the curing reaction, which is satisfied by the catalytic curing agent. This is because the curing mechanism of the catalyst is self-crosslinking of the epoxy resin, so that only a weakly polar ether bond is generated. From the above, it is expected that the catalyst-cured epoxy resin composition has a lower water absorption than the amine-cured epoxy resin composition, and the decrease in insulation resistance is also smaller.

よって、熱膨張にともなう部材間の接着剥離を防ぐことができ、剥離部分への水浸入による絶縁抵抗低下や絶縁破壊の問題を解消し、絶縁信頼性を向上できる。

Therefore, it is possible to prevent the adhesion peeling between the members due to thermal expansion, to solve the problem of insulation resistance reduction and dielectric breakdown due to water intrusion into the peeling portion, and to improve the insulation reliability.

  Furthermore, the armature and the field having a permanent magnet are opposed to each other, and either the armature or the field is configured as a stator and the other is configured as a mover. A motor can be provided.

  In the first embodiment, the stator has an armature winding and the mover has a field permanent magnet. However, the structure may be reversed. In the first embodiment, the shape of the mover is a mouth shape, but it goes without saying that the present invention can also be realized by a concave shape or a structure in which permanent magnets are simply arranged on one side. Further, although the armature winding has been described as a three-phase AC linear motor composed of a plurality of concentrated winding coils, a voice coil motor (VCM) provided with one concentrated winding coil, or a plurality of concentrated winding coils May be provided in one armature, and a VCM in which a plurality of movers can be driven may be used.

  In addition to those used in this example, the catalyst-type curing agent is 2 methyl imidazole, 1 benzyl 2 methyl imidazole, 1 cyanoethyl 2 methyl imidazole, 1 cyanoethyl 2 ethyl 4 methyl imidazole, 1 cyanoethyl 2 undecyl imidazole, 3 It goes without saying that any material that undergoes a curing reaction at 80 ° C. or less, such as a boron fluoride chlorophenylamine complex, may be used. Needless to say, any epoxy resin main component or reactive diluent having a cyclic chemical structure may be used as long as it undergoes a curing reaction with a catalytic curing agent at 80 ° C. or lower.

  In addition, it goes without saying that the effect of the present invention is further enhanced when an inorganic filler is added to the epoxy resin composition used for the coating resin in order to reduce thermal stress, improve mechanical properties, adjust fluidity, and the like.

1 is an overall perspective view of a canned linear motor showing Embodiment 1 of the present invention. Partial side sectional view taken along line A-A 'in FIG. 1 is a partial cross-sectional view taken along line A-A 'of a conventional canned linear motor stator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Stator 101 Case 102 Can 103 Can fixing bolt 104 Holding plate 105 Armature winding 106 Terminal block 107 Refrigerant supply port 108 Refrigerant discharge port 109 O-ring 110 Refrigerant passage 111 Connection substrate 112 Winding housing frame 113 Mold resin 120 Lead wire 121 Land 122 Lead wire cover 130 Resin 131 Coating resin 132 Filling resin 200 Movable element 201 Field yoke support member 202 Field yoke 203 Permanent magnet

Claims (8)

The armature winding formed of a coil formed in a flat plate shape, the winding storage frame having a hollowed portion for storing the armature winding, and the opening of the winding storage frame are hermetically sealed. A flat wiring board for connecting the armature windings, a metal housing provided to surround the winding housing frame in a frame shape, a can for sealing both openings of the housing, and the can And a refrigerant passage formed between the winding housing frame and between the can and the connection board, a terminal block for supplying electric power from the outside, and a lead wire connecting the connection board and the terminal block, In the canned linear motor armature,
A coating resin coated with an epoxy resin composition in which an epoxy resin main component having a cyclic chemical structure is cured with a catalyst-type curing agent so as to include a connection portion between the connection substrate and the lead wire ;
A filling resin surrounding the periphery of the coating resin ;
A clogging resin that clogs a gap between the wiring board and the casing and between the winding housing frame and the casing so as to isolate the filling resin from the refrigerant passage; A canned linear motor armature using an epoxy resin composition characterized by comprising:   The epoxy resin main component constituting the epoxy resin composition having a cyclic chemical structure is any one of an aromatic ring, a five-membered ring, an aliphatic six-membered ring, a dicyclopentadiene structure, a novolak structure, a benzoxazine structure, and a mesogenic group. The canned linear motor armature using the epoxy resin composition according to claim 1, wherein the canned linear motor armature is one selected from a cyclic chemical structure containing   The catalyst-type curing agent constituting the epoxy resin composition is an imidazole compound or a boron trifluoride amine complex, and the blending ratio thereof is 100 parts by weight in total of the epoxy resin main agent and the reactive diluent. The canned linear motor armature using the epoxy resin composition according to claim 1, wherein the catalyst-type curing agent is 1 to 7 parts by weight.   The imidazole compound is one selected from 2 methyl imidazole, 2 ethyl 4 methyl imidazole, nundecyl imidazole, 1 benzyl 2 methyl imidazole, 1 cyanoethyl 2 methyl imidazole, 1 cyanoethyl 2 ethyl 4 methyl imidazole, 1 cyanoethyl 2 undecyl imidazole. A canned linear motor armature using the epoxy resin composition according to claim 3, wherein the canned linear motor armature is a mixture thereof.   4. The canned linear motor using an epoxy resin composition according to claim 3, wherein the boron trifluoride amine complex is a boron trifluoride aniline complex, a boron trifluoride chlorophenylamine complex, or a mixture thereof. Armature.   The chemical structure of the reactive diluent may be a monofunctional type such as butyl glycidyl ether or phenyl glycidyl ether, or a bifunctional type such as linear aliphatic, polyglycol, polyether or polythiol, or a mixture thereof. A canned linear motor armature using the epoxy resin composition according to claim 3.   The canned linear motor armature according to any one of claims 1 to 6, wherein the filling resin is a silicone resin or an epoxy-impregnated resin composition. An armature according to any one of claims 1 to 7, and a field magnet that is arranged so as to face the armature through a magnetic gap and alternately arrange a plurality of permanent magnets having different polarities next to each other. A canned linear motor characterized in that either one of the armature or the field is used as a stator and the other is used as a mover, so that the field and the armature travel relatively.

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