JP5069148B2 - Composition for imprint molding and molded product using the same - Google Patents

Description

  The present invention relates to an imprint molding composition and a molded article using the same, and in particular, it has excellent adhesion to a metal oxide, and is easy to be removed from a mold after curing, and the number of times a release agent is applied to the mold. The present invention relates to an imprint molding composition capable of reducing the above and a molded article using the same.

  Recently, an imprint molding technique has been vigorously studied as a technique for forming a fine pattern at a low cost. The imprint molding technique is a technique for forming a desired pattern on a substrate by pressing a mold having desired irregularities on a resin material layer disposed on the substrate. In the imprint molding technique, a method of forming a pattern by heat using a thermoplastic resin or a thermosetting resin and a method of forming a pattern by ultraviolet irradiation using an ultraviolet curable resin are known. Yes.

  When a thermoplastic resin or a thermosetting resin is used, a large amount of energy must be consumed for heating and pressing, and there is a problem that the molding time becomes long and the productivity is lowered. On the other hand, when a normal ultraviolet curable resin is used, the shrinkage at the time of curing is large, so the adhesion between the formed pattern and the substrate is poor, and metal oxides, especially transparent metal oxides such as IZO and ITO. There is a problem of poor adhesion to objects. Also, in general, in imprint molding using an ultraviolet curable resin, a fluorine-based release agent is applied to the mold in order to facilitate the removal of the molded product from the mold. Even when a mold release agent is applied to the mold, the resin has poor demoldability, and when a film coated with a metal oxide is used as a substrate, there is a problem that peeling occurs at the interface between the molded product and the film. there were.

JP 2006-272947 A "Development and application of nanoimprint", Shinji Matsui, supervised by Masanori Furumuro, CM Publishing, (2005)

  As a result of diligent study on the above problems, the present inventor used an ultraviolet curable composition containing a hydroxyl group-containing (meth) acrylate monomer as an imprint molding material, so that the molded product and the metal oxide were used. It has been found that the adhesion between the two is improved. However, as a result of further intensive studies by the present inventors, when using an ultraviolet curable composition containing a hydroxyl group-containing (meth) acrylate monomer, even if imprint molding is performed by applying a release agent to the mold, It was found that after several demolds, the release agent was removed from the mold and the effect of the release agent was lost. Here, since the release agent is expensive, an increase in the number of times the release agent is applied directly leads to an increase in manufacturing cost.

  Accordingly, an object of the present invention is to provide an imprint molding composition that has excellent adhesion to metal oxides, is easy to be removed from the mold after curing, and can reduce the number of times the release agent is applied to the mold. It is to provide.

  As a result of intensive investigations to achieve the above object, the present inventors have found that a specific (meth) acrylate oligomer, a specific hydroxyl group-containing (meth) acrylate monomer, and a specific (having a hydrophobic long-chain alkyl group ( The composition containing a (meth) acrylate monomer or a reactive silicone having a (meth) acryloyl group has excellent adhesion to metal oxides, and is easy to release from the mold after curing, and the number of times the release agent is applied to the mold The present invention has been completed.

［式中、Ｒ¹は水素又はアルキル基であり、Ｒ²は水素又はメチル基である］で表わされるヒドロキシル基含有(メタ)アクリレートモノマー（Ｂ）と、
・下記一般式(II)：

［式中、Ｒ³は炭素数４〜１４のアルキル基であり、Ｒ⁴は水素又はメチル基である］で表わされるアルキル基含有(メタ)アクリレートモノマー（Ｃ１）又は(メタ)アクリロイル基含有反応性シリコーン（Ｃ２）と、
・光重合開始剤（Ｄ）と
を含むことを特徴とする。 That is, the imprint molding composition of the present invention is
-At least one (meth) acrylate oligomer (A) selected from the group consisting of urethane (meth) acrylate oligomers and epoxy (meth) acrylate oligomers;
-The following general formula (I):

A hydroxyl group-containing (meth) acrylate monomer (B) represented by the formula: wherein R ¹ is hydrogen or an alkyl group, and R ² is hydrogen or a methyl group;
-The following general formula (II):

[Wherein R ³ is an alkyl group having 4 to 14 carbon atoms and R ⁴ is hydrogen or a methyl group] an alkyl group-containing (meth) acrylate monomer (C1) or (meth) acryloyl group-containing reaction Silicone (C2),
-A photoinitiator (D) is included, It is characterized by the above-mentioned.

In a preferred example of the imprint molding composition of the present invention, R ¹ in the general formula (I) is hydrogen, a methyl group or an ethyl group.

  In another preferred embodiment of the imprint molding composition of the present invention, the (meth) acrylate oligomer (A), the hydroxyl group-containing (meth) acrylate monomer (B), and the hydroxyl group-containing (meth) acrylate monomer ( The ratio of the hydroxyl group-containing (meth) acrylate monomer (B) in the total blending amount with the (meth) acrylate monomer other than B) is 40 to 60% by mass.

  In another preferable example of the imprint molding composition of the present invention, the content of the alkyl group-containing (meth) acrylate monomer (C1) is 5 to 20% by mass of the entire composition.

  In another preferred embodiment of the imprint molding composition of the present invention, the amount of the (meth) acryloyl group-containing reactive silicone (C2) is such that the (meth) acrylate oligomer (A) and the hydroxyl group-containing ( It is 5 to 20 parts by mass with respect to 100 parts by mass in total of the (meth) acrylate monomer (B) and the (meth) acrylate monomer other than the hydroxyl group-containing (meth) acrylate monomer (B).

  The molded product of the present invention is preferably obtained by curing the above-described imprint molding composition by ultraviolet irradiation, and has a surface free energy of 35 mN / m or less.

  According to the present invention, a specific (meth) acrylate oligomer, a specific hydroxyl group-containing (meth) acrylate monomer, a specific (meth) acrylate monomer having a hydrophobic long-chain alkyl group or a (meth) acryloyl group Reactive silicone has low energy consumption, short molding time, excellent adhesion to metal oxides, easy to remove from the mold after curing, and reduce the number of times the release agent is applied to the mold It is possible to provide an imprint molding composition that can be used.

  The present invention is described in detail below. The imprint molding composition of the present invention comprises at least one (meth) acrylate oligomer (A) selected from the group consisting of urethane (meth) acrylate oligomers and epoxy (meth) acrylate oligomers, and the above general formula (I) A hydroxyl group-containing (meth) acrylate monomer represented by formula (B), an alkyl group-containing (meth) acrylate monomer represented by the general formula (II) (C1) or a (meth) acryloyl group-containing reactive silicone (C2); And a photopolymerization initiator (D). The imprint molding composition of the present invention may further contain a (meth) acrylate monomer other than the hydroxyl group-containing (meth) acrylate monomer (B) and the alkyl group-containing (meth) acrylate monomer (C1). .

  The imprint molding composition of the present invention contains a urethane (meth) acrylate oligomer and / or an epoxy (meth) acrylate oligomer having a molecular weight larger than that of the monomer (B). High strength. In the imprint molding composition of the present invention, since the hydroxyl group of the hydroxyl group-containing (meth) acrylate monomer (B) is hydrogen-bonded to a metal oxide such as IZO or ITO, adhesion to these metal oxides Is greatly improved, and pattern peeling at the time of demolding can be prevented. Furthermore, in the imprint molding composition of the present invention, the alkyl group-containing (meth) acrylate monomer (C1) or the (meth) acryloyl group-containing reactive silicone (C2) is subjected to the surface tension (surface free energy) of the ultraviolet curable resin surface. ) Can be easily removed from the mold after curing, and transfer of the release agent to the UV curable resin during release is suppressed, leaving the release agent in the mold, resulting in release to the mold. It is possible to reduce the number of times the mold is applied.

  The (meth) acrylate oligomer (A) used in the imprint molding composition of the present invention is a urethane (meth) acrylate oligomer and / or an epoxy (meth) acrylate oligomer, and is a urethane acrylate oligomer and / or an epoxy acrylate oligomer. It is preferable. These (meth) acrylate oligomers (A) may be used alone or in combination of two or more. When the composition for imprint molding does not contain these (meth) acrylate oligomers (A), the strength of the molded product formed by ultraviolet irradiation is lowered.

The urethane (meth) acrylate oligomer has at least one (meth) acryloyloxy group (CH ₂ ═CHCOO— or CH ₂ ═C (CH ₃ ) COO—) and a plurality of urethane bonds (—NHCOO—). A compound. The urethane (meth) acrylate oligomer can be produced, for example, by synthesizing a urethane prepolymer from a polyol and polyisocyanate, and adding a (meth) acrylate having a hydroxyl group to the urethane prepolymer.

  The polyol used for the synthesis of the urethane prepolymer is a compound having a plurality of hydroxyl groups (OH groups). Specific examples of the polyol include polyether polyol, polyester polyol, polytetramethylene glycol, polybutadiene polyol, and alkylene oxide modification. Examples include polybutadiene polyol and polyisoprene polyol. The polyether polyol is obtained, for example, by adding an alkylene oxide such as ethylene oxide or propylene oxide to a polyhydric alcohol such as ethylene glycol, propylene glycol, or glycerin. The polyester polyol is, for example, ethylene glycol. , Diethylene glycol, 1,4-butanediol, 1,6-hexanediol, propylene glycol, trimethylolethane, trimethylolpropane and other polyhydric alcohols and adipic acid, glutaric acid, succinic acid, sebacic acid, pimelic acid, suberin It is obtained from a polyvalent carboxylic acid such as an acid.

  The polyisocyanate is a compound having a plurality of isocyanate groups (NCO groups). Specifically, as the polyisocyanate, tolylene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), crude diphenylmethane diisocyanate (crude MDI), Examples include isophorone diisocyanate (IPDI), hydrogenated diphenylmethane diisocyanate, hydrogenated tolylene diisocyanate, hexamethylene diisocyanate (HDI), these isocyanurate-modified products, carbodiimide-modified products, and glycol-modified products.

  In the synthesis of the urethane prepolymer, it is preferable to use a catalyst for urethanization reaction. Examples of the catalyst for urethanization reaction include organic tin compounds, inorganic tin compounds, organic lead compounds, monoamines, diamines, triamines, cyclic amines, alcohol amines, ether amines, organic sulfonic acids, inorganic acids, titanium A compound, a bismuth compound, a quaternary ammonium salt, etc. are mentioned, Among these, an organotin compound is preferable. Suitable organic tin compounds include dibutyltin dilaurate, dibutyltin diacetate, dibutyltin thiocarboxylate, dibutyltin dimaleate, dioctyltin thiocarboxylate, tin octenoate, monobutyltin oxide, and the like.

  The (meth) acrylate having a hydroxyl group to be added to the urethane prepolymer is a compound having one or more hydroxyl groups and one or more (meth) acryloyloxy groups. The (meth) acrylate having a hydroxyl group can be added to the isocyanate group of the urethane prepolymer. Examples of the (meth) acrylate having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and pentaerythritol tri (meth) acrylate.

  The epoxy (meth) acrylate oligomer is a compound having a glycidyl group, preferably a compound having a glycidyl group and a cyclic structure such as a benzene ring, a naphthalene ring, a spiro ring, dicyclopentadiene, or tricyclodecane. It can be produced by reacting with (meth) acrylic acid.

  Examples of the compound having a glycidyl group include a bisphenol type epoxy resin, a phenol novolak type epoxy resin, a cresol novolak type epoxy resin, an alicyclic epoxy resin, and the like obtained by a reaction between bisphenol A or bisphenol F and epichlorohydrin. It is done.

  In the imprint molding composition of the present invention, the content of the (meth) acrylate oligomer (A) is preferably in the range of 20 to 60% by mass of the entire composition. If the content of the (meth) acrylate oligomer (A) is 20% by mass or more, a molded product having sufficient strength can be obtained, and the content of the (meth) acrylate oligomer (A) is 60% by mass. If it is below, the viscosity of the composition is sufficiently low, and it is easy to flow into the mold.

The hydroxyl group-containing (meth) acrylate monomer (B) used in the imprint molding composition of the present invention is represented by the above general formula (I). In the formula (I), R ¹ is hydrogen or an alkyl group, preferably hydrogen, methyl group or ethyl group, more preferably hydrogen, and R ² is hydrogen or methyl group, preferably hydrogen. It is. When the imprint molding composition does not contain the hydroxyl group-containing (meth) acrylate monomer (B) of the formula (I), the adhesion to metal oxides such as IZO and ITO is insufficient, and the substrate is removed from the substrate at the time of demolding. The molded product is easily peeled off.

  Specific examples of the hydroxyl group-containing (meth) acrylate monomer of the above formula (I) include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth) acrylate. Of these, 2-hydroxyethyl acrylate is preferred. In addition, these hydroxyl group containing (meth) acrylate monomers (B) may be used individually by 1 type, and may be used in combination of 2 or more type.

  In the imprint molding composition of the present invention, the (meth) acrylate oligomer (A), the hydroxyl group-containing (meth) acrylate monomer (B) and the hydroxyl group-containing (meth) acrylate monomer (B) other than (meta) The ratio of the hydroxyl group-containing (meth) acrylate monomer (B) in the total blending amount with the acrylate monomer is preferably in the range of 40 to 60% by mass. When the proportion of the hydroxyl group-containing (meth) acrylate monomer (B) is 40% by mass or more, the adhesion of the imprint molding composition to the metal oxide can be sufficiently improved, while the hydroxyl group-containing ( When the proportion of the (meth) acrylate monomer (B) is 60% by mass or less, the strength of the molded product formed by ultraviolet irradiation is sufficiently high.

The alkyl group-containing (meth) acrylate monomer (C1) used in the imprint molding composition of the present invention is represented by the general formula (II). Since the alkyl group-containing (meth) acrylate monomer (C1) of the formula (II) has a hydrophobic long-chain alkyl group having 4 to 14 carbon atoms as R ³ , the mold can be easily removed from the mold. Has an effect. When R ³ is a lower alkyl group having 3 or less carbon atoms, the hydrophobicity of the (meth) acrylate monomer is insufficient, and the mold release property from the mold is poor. From the viewpoint of mold release from the mold, R ³ is preferably an alkyl group having 12 or more carbon atoms. On the other hand, when R ³ is a long-chain alkyl group having 15 or more carbon atoms, the handleability of the (meth) acrylate monomer (C1) is poor and the compatibility with the (meth) acrylate oligomer (A) is also poor.

In the general formula (II), R ³ is an alkyl group having 4 to 14 carbon atoms and may be linear or branched, and R ⁴ is hydrogen or a methyl group. In R ³ , specific examples of the alkyl group having 4 to 14 carbon atoms include various butyl groups, various pentyl groups, various hexyl groups, various heptyl groups, various octyl groups, various nonyl groups, various decyl groups, and various undecyl groups. , Various dodecyl groups (for example, lauryl group), various tridecyl groups, various tetradecyl groups (for example, myristyl group, isomyristyl group, etc.). Among these, lauryl group and isomyristyl group are preferable.

  As the (meth) acrylate monomer (C1) of the above formula (II), specifically, lauryl (meth) acrylate, isomyristyl (meth) acrylate, myristyl (meth) acrylate, isobutyl (meth) acrylate, n-butyl ( Examples thereof include meth) acrylate, isoamyl (meth) acrylate, isooctyl (meth) acrylate and the like. Among these, isomyristyl (meth) acrylate and lauryl (meth) acrylate are preferable. These (meth) acrylate monomers (C1) of the formula (II) may be used singly or in combination of two or more.

  When the imprint molding composition of the present invention contains an alkyl group-containing (meth) acrylate monomer (C1), the content of the alkyl group-containing (meth) acrylate monomer (C1) is 5 to 20 mass of the entire composition. % Range is preferred. If the ratio of the alkyl group-containing (meth) acrylate monomer (C1) of the formula (II) is 5% by mass or more, it is possible to sufficiently improve the demoldability of the molded product from the mold, while the formula (II) If the proportion of the alkyl group-containing (meth) acrylate monomer (C1) is 20% by mass or less, the curing rate can be maintained and the cured product will not be sticky.

The reactive silicone (C2) used in the imprint molding composition of the present invention has one or more (meth) acryloyl groups [CH ₂ ═CHCO— or CH ₂ ═C (CH ₃ ) CO—], It has a plurality of siloxane units [—SiR ⁵ ₂ —O—, wherein R ⁵ is each independently an alkyl group such as hydrogen, a methyl group, or an aryl group such as a phenyl group]. The reactive silicone (C2) is not particularly limited, and a known reactive silicone (C2) can be used.

  When the imprint molding composition of the present invention contains the (meth) acryloyl group-containing reactive silicone (C2), the amount of the (meth) acryloyl group-containing reactive silicone (C2) is the above-mentioned (meth) acrylate oligomer. 5 to 20 parts by mass with respect to a total of 100 parts by mass of (A), the hydroxyl group-containing (meth) acrylate monomer (B) and (meth) acrylate monomers other than the hydroxyl group-containing (meth) acrylate monomer (B) The range of is preferable. If the amount of the (meth) acryloyl group-containing reactive silicone (C2) added is 5 parts by mass or more, the mold release from the mold can be sufficiently improved, while the (meth) acryloyl group-containing If the addition amount of the reactive silicone (C2) is 20 parts by mass or less, the curing rate can be maintained and the cured product will not be sticky.

  The photopolymerization initiator (D) used in the imprint molding composition of the present invention is the above-described (meth) acrylate oligomer (A) and hydroxyl group-containing (meth) acrylate monomer (B) when irradiated with ultraviolet rays. , Having an action of initiating polymerization of the alkyl group-containing (meth) acrylate monomer (C1) and the (meth) acryloyl group-containing reactive silicone (C2). Examples of the photopolymerization initiator (D) include 4-dimethylaminobenzoic acid, 4-dimethylaminobenzoic acid ester, 2,2-dimethoxy-2-phenylacetophenone, acetophenone diethyl ketal, alkoxyacetophenone, benzyldimethyl ketal, benzophenone and 3,3-dimethyl-4-methoxybenzophenone, benzophenone derivatives such as 4,4-dimethoxybenzophenone, 4,4-diaminobenzophenone, alkyl benzoylbenzoate, bis (4-dialkylaminophenyl) ketone, benzyl, benzylmethyl ketal, etc. Benzyl derivatives, benzoin derivatives such as benzoin and benzoin isobutyl ether, benzoin isopropyl ether, 2-hydroxy-2-methylpropiophenone, 1-hydroxy-cyclohexyl-phenyl-ketone, Thiolene, thioxanthone and thioxanthone derivatives, fluorene, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide, bis (2,4,6- Trimethylbenzoyl) -phenylphosphine oxide, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (morpholinophenyl) -butanone-1, etc. Is mentioned. These photoinitiators (D) may be used individually by 1 type, and may be used in combination of 2 or more type.

  The content of the photopolymerization initiator (D) in the imprint molding composition of the present invention is preferably in the range of 0.1 to 10% by mass of the entire composition. If the content of the photopolymerization initiator (D) is 0.1% by mass or more, the ultraviolet curing of the imprint molding composition can be sufficiently started. On the other hand, if the content exceeds 10% by mass, the ultraviolet curing starts. On the other hand, the raw material cost of the imprint molding composition increases.

  As described above, the imprint molding composition of the present invention can be easily removed from the mold after being cured by ultraviolet irradiation, and the number of times of application of the release agent to the mold can be reduced. In addition, the irradiation condition of the ultraviolet-ray at the time of hardening the imprint molding composition of this invention is not specifically limited, It can set suitably. In imprint molding, it is preferable to apply a fluorine-based mold release agent or the like to the mold.

  The molded product obtained by curing the above imprint molding composition preferably has a surface free energy of 35 mN / m or less. If the surface free energy is 35 mN / m or less, it is particularly easy to remove the mold from the mold, and the number of times the mold release agent is applied to the mold can be greatly reduced.

  Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to the following examples.

  The composition for imprint molding of the composition shown in Table 1 was prepared, and the following methods were used to determine the surface free energy, the number of repeated peelings on the Ni electroformed plate, and the number of repeated demolding times on the Ni electroformed mold. It was measured. The results are shown in Table 1.

(1) Surface free energy For measurement, Drop Master (manufactured by Kyowa Interface Science Co., Ltd.) is used, and water, diiodomethane, and 1-bromonaphthalene with known surface free energy are dropped into a target UV resin cured film with a syringe. Each contact angle was substituted into the theoretical formula of Kitaki-Hata, and the surface free energy was calculated.

(2) The number of times of repeated peeling with respect to the Ni electroformed plate The fluorine-based release agent is applied to the plate of the Ni electroformed plate, and the ultraviolet curable compounded liquid is applied to the base film with a bar coater. A nickel electroformed plate that has been subjected to a mold release treatment is applied, UV irradiation is applied to the substrate film, cured, cut to a predetermined size, and then the molded product is peeled off from the Ni electroformed plate. The test was repeated until the peel force exceeded 100 N / m, counting the number of peels that could be peeled off with a peel force of 100 N / m or less.

(3) Number of times of repeated demolding for Ni electroformed molds Fluorine-based mold release agent is applied to the mold of Ni electroformed plates, and an imprint molding machine is used for the target UV curable resin. After pressing with a constant pressure and irradiating with ultraviolet light, try to demold the molded product after curing from the Ni electroformed mold, the molded product is not destroyed, and the molded product is peeled off from the transparent metal oxide coated film The case where demolding was possible was counted as the number of demolding, and the test was repeated until the molded product was destroyed or the molded product was peeled off from the transparent metal oxide coated film.

* 1 Kyoeisha Chemical Co., Ltd., trade name “3002A”, epoxy acrylate oligomer, weight average molecular weight (Mw) = 600, bisphenol A skeleton
* 2 Kyoeisha Chemical Co., Ltd., trade name “HO-A”, 2-hydroxyethyl acrylate
* 3 Shin-Nakamura Chemical Co., Ltd., trade name “A-MO”, acryloylmorpholine
* 4 Kyoeisha Chemical Co., Ltd., trade name “LA”, lauryl acrylate
* 5 Made by Kyoeisha Chemical Co., Ltd., trade name “IM-A”, Isomyristyl acrylate
* 6 Kyoeisha Chemical Co., Ltd., trade name "1,9ND-A", 1,9-nonanediol diacrylate
* 7 Shin-Etsu Silicone, trade name “X-22-1602”, silicone acrylate, functional group equivalent = 1600
* 8 Shin-Etsu Silicone, trade name “X-22-1603”, silicone acrylate, functional group equivalent = 930
* 9 Made by Osaka Organic Chemical Industry, trade name "Biscoat 4F", 2,2,3,3-tetrafluoropropyl acrylate
* 10 Made by Osaka Organic Chemical Industry, trade name "Biscoat 8F", 1H, 1H, 5H-octafluoropentyl acrylate
* 11 Product name “IRGACURE 184”, 1-hydroxy-cyclohexyl-phenyl-ketone, manufactured by Ciba Specialty Chemicals

  From Table 1, (meth) acrylate oligomer (A), hydroxyl group-containing (meth) acrylate monomer (B) of formula (I), and alkyl group-containing (meth) acrylate monomer (C1) of formula (II) or ( It can be seen that the imprint molding compositions of the examples containing the (meth) acryloyl group-containing reactive silicone (C2) have a low surface free energy of the cured product and are excellent in mold release properties.

  On the other hand, the imprint molding composition of Comparative Example 1 which does not contain the hydroxyl group-containing (meth) acrylate monomer (B) of the formula (I) has poor adhesion to the metal oxide coated film, so that it can be removed from the mold. Upon molding, the molded product was peeled off from the metal oxide coated film.

  Moreover, although it contains the hydroxyl group-containing (meth) acrylate monomer (B) of the formula (I), the alkyl group-containing (meth) acrylate monomer (C1) and the (meth) acryloyl group-containing reactive silicone (C2) of the formula (II) The imprint molding compositions of Comparative Examples 2 to 5 that do not contain any of the above) have a high surface free energy of the cured product and are poorly demoldable with respect to the mold. This suggests that the frequency of applying the release agent is increased.

Claims (7)

At least one (meth) acrylate oligomer (A) selected from the group consisting of urethane (meth) acrylate oligomers and epoxy (meth) acrylate oligomers;
The following general formula (I):

A hydroxyl group-containing (meth) acrylate monomer (B) represented by the formula: wherein R ¹ is hydrogen or an alkyl group, and R ² is hydrogen or a methyl group;
The following general formula (II):

[Wherein R ³ is an alkyl group having 4 to 14 carbon atoms and R ⁴ is hydrogen or a methyl group] an alkyl group-containing (meth) acrylate monomer (C1) or (meth) acryloyl group-containing reaction Silicone (C2),
An imprint molding composition comprising: a photopolymerization initiator (D). 2. The imprint molding composition according to claim 1, wherein R ¹ in the general formula (I) is hydrogen, a methyl group, or an ethyl group.   In the total amount of the (meth) acrylate oligomer (A), the hydroxyl group-containing (meth) acrylate monomer (B), and the (meth) acrylate monomer other than the hydroxyl group-containing (meth) acrylate monomer (B) The composition for imprint molding according to claim 1, wherein the proportion of the hydroxyl group-containing (meth) acrylate monomer (B) is 40 to 60% by mass.   2. The imprint molding composition according to claim 1, wherein the content of the alkyl group-containing (meth) acrylate monomer (C1) is 5 to 20 mass% of the entire composition.   The added amount of the (meth) acryloyl group-containing reactive silicone (C2) includes the (meth) acrylate oligomer (A), the hydroxyl group-containing (meth) acrylate monomer (B), and the hydroxyl group-containing (meth) acrylate monomer. 2. The imprint molding composition according to claim 1, wherein the composition is 5 to 20 parts by mass with respect to 100 parts by mass in total with the (meth) acrylate monomer other than (B).   A molded product obtained by curing the imprint molding composition according to claim 1 by ultraviolet irradiation.   The molded product according to claim 6, wherein the surface free energy is 35 mN / m or less.