JP5050821B2 - Photosensitive resin printing plate precursor - Google Patents

Description

  The present invention relates to a photosensitive resin printing plate precursor, and more particularly to a photosensitive resin printing plate precursor used when a resin relief printing plate is produced by computer plate making technology.

  In recent years, computer plate making technology (computer-to-plate (CTP) technology) known as digital image forming technology has become common in various printing fields. As CTP technology in the field of relief printing plates such as photosensitive resin relief printing and flexographic printing, information processed on a computer is printed without using a conventional photomask (also called a photomask or negative film). The image is output directly on the original plate, and an image mask is formed on the photosensitive resin layer "in situ" from digital data, and then the entire surface is exposed to actinic rays, and in many cases ultraviolet rays, from the image mask side. A method for selectively curing only the non-covered portion of the mask to cure the photosensitive resin layer to obtain a printing plate has been actively proposed. The advantages of this method are: (1) no negative film manufacturing process is required, (2) the treatment of negative film development waste is unnecessary and environmentally friendly, and (3) the adhesion of the negative film. In addition to eliminating foreign matters, (4) a relief having a sharp structure can be obtained.

  Currently, there are two techniques as a specific method for forming a printing plate by forming an image mask on the photosensitive resin layer “in situ” from the digital data described above. One is a method of forming an image mask film on a photosensitive resin layer using an ink jet printer or an electrophotographic printer, and the other is a method of forming a thermal mask layer opaque to ultraviolet light on the photosensitive resin layer. This is a method of forming an image mask by providing an infrared laser to the thermal mask layer in advance and ablating the thermal mask layer.

  By the way, in the photosensitive resin printing plate precursor having the thermal mask layer, the thermal mask layer includes a composition containing carbon black in a polymer binder (see, for example, Patent Document 1), and IR absorption such as an aluminum vapor deposition film. Metal films (for example, Patent Document 2) are used. In addition, a cover film is usually provided on the thermal mask layer to protect the surface of the printing plate precursor during storage and handling, especially when the thermal mask layer is insoluble in water. In order to peel it off, it has been proposed to provide a peeling auxiliary layer between the thermal mask layer and the cover film (for example, Patent Document 3).

Further, when the above cover film having a surface roughness Ra of 0.1 to 0.6 [mu] m is used, the resin relief printing plate prepared from the photosensitive resin printing plate precursor has improved ink deposition property and the quality of the printed matter is improved. Improvement has been reported (for example, Patent Document 4). However, if the technique (1) is a small thickness of the peeling auxiliary layer described in Patent Document 4, the cover film is not cleanly peeled, torn heat sensitive mask layer, without flaws, the pinhole multi number shots, (2 ) When the film thickness of the peeling auxiliary layer is thick, the cover film peels cleanly, but there is a problem that the thermal mask layer is difficult to ablate when irradiated with infrared laser, and a high-quality resin relief printing plate can be produced. It was impossible.

  In view of the above problems, the object of the present invention is to provide a high-quality resin that does not cause tearing, scratching, or pinholes in the heat-sensitive mask layer when the cover film is peeled off, and that the heat-sensitive mask layer is rapidly ablated when irradiated with an infrared laser. It is an object of the present invention to provide a photosensitive resin printing plate precursor capable of making a computer and capable of producing a relief printing plate.

  In order to solve the above problems, according to the present invention, a photosensitive resin printing plate precursor mainly having the following configuration is provided.

That is,
“A photosensitive resin layer (A) containing a resin that can be dissolved or dispersed in water and a monomer curable by ultraviolet light, an adhesive force adjusting layer (B), and a thermal mask layer containing an infrared absorbing substance on the substrate. (C), peeling assist layer (D), the surface roughness Ra of the surface in contact with the peeling assist layer (D) is in the photosensitive resin printing BanHara plate having a cover film (E) is 0.1~0.6μm And an anion having at least one functional group selected from the group consisting of a carboxylic acid and / or a salt thereof, phosphoric acid and / or a salt thereof, a sulfonic acid and / or a salt thereof in the peeling auxiliary layer (D). A photosensitive resin printing plate precursor characterized by containing a surfactant.

  ADVANTAGE OF THE INVENTION According to this invention, the photosensitive resin printing plate precursor which can form a convex-shaped relief image without requiring an original image film can be provided easily. When the photosensitive resin printing plate precursor of the present invention is used, the thermal mask layer is not torn, scratched or pinholed when the cover film is peeled off, and the thermal mask layer is rapidly ablated when irradiated with infrared laser. A resin relief printing plate having excellent properties can be provided.

Embodiments of the present invention will be described below.

  The photosensitive resin printing plate precursor in the present invention has a photosensitive resin layer (A), an adhesive force adjusting layer (B), and a thermal mask layer (C) containing an infrared absorbing substance in this order on a substrate.

  The photosensitive resin layer (A) in the present invention contains a resin that can be dissolved or dispersed in water or alcohol and a monomer that can be cured by ultraviolet light. The photosensitive resin layer (A) is photocured by irradiation with ultraviolet light, preferably 300 to 400 nm. As a raw material of the photosensitive resin layer (A), a photosensitive resin composition is used, and it is preferably formed into a sheet having a thickness of 0.1 to 10 mm.

  The above-described photosensitive resin composition contains a resin that can be dissolved or dispersed in water or alcohol and a monomer that can be cured by ultraviolet light. Furthermore, a photopolymerization initiator is preferably contained.

  The resin that can be dissolved or dispersed in water or alcohol in the present invention has a function as a carrier resin for maintaining the form of the photosensitive resin composition in a solid state, and the water in the photosensitive resin layer (A) or Used to impart developability with alcohol. Examples of such resins include polyvinyl alcohol, polyvinyl acetate, partially saponified polyvinyl acetate (partially saponified polyvinyl alcohol), cellulose resin, acrylic resin, polyamide resin, polyamide resin into which a hydrophilic group such as polyethylene oxide is introduced, ethylene / Vinyl acetate copolymer, etc., and modified products of these resins. Of these, polyvinyl alcohol, partially saponified polyvinyl alcohol, polyamide resin having a hydrophilic group introduced therein, and modified products of these resins are preferably used.

  Monomers curable by ultraviolet light are generally substances that can be cross-linked by radical polymerization. Although it will not specifically limit if it is a substance which can be bridge | crosslinked by radical polymerization, For example, the following can be mentioned. 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, β-hydroxy-β ′-(meth) (Meth) acrylate having a hydroxyl group such as acryloyloxyethyl phthalate, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, isoamyl (meth) acrylate, 2-ethylhexyl (meth) Alkyl (meth) acrylates such as acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, cycloalkyl (meth) acrylates such as cyclohexyl (meth) acrylate, chloroethyl (meth) acrylate Relate, Alkyl halide (meth) acrylate such as chloropropyl (meth) acrylate, Alkoxyalkyl (meth) acrylate such as methoxyethyl (meth) acrylate, Ethoxyethyl (meth) acrylate, Butoxyethyl (meth) acrylate, Phenoxyethyl acrylate , Alkoxyalkylene glycol (meth) acrylates such as phenoxyalkyl (meth) acrylates such as nonylphenoxyethyl (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxytriethylene glycol (meth) acrylate, methoxydipropylene glycol (meth) acrylate , (Meth) acrylamide, diacetone (meth) acrylamide, N, N′-methylenebis (meth) acrylami (Meth) acrylamides such as 2,2-dimethylaminoethyl (meth) acrylate, 2,2-diethylaminoethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylamide, N, N-dimethylamino Compounds having only one ethylenically unsaturated bond such as propyl (meth) acrylamide, polyethylene glycol di (meth) acrylate such as diethylene glycol di (meth) acrylate, polypropylene such as dipropylene glycol di (meth) acrylate Glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, glycerol tri (meth) acrylate Polyhydric (meth) acrylates, glycidyl (meth) acrylates, etc. obtained by addition reaction of ethylenic unsaturated bonds such as unsaturated carboxylic acids and unsaturated alcohols and compounds with active hydrogen to ethylene glycol diglycidyl ether Multivalent (meth) acrylamides such as polyvalent (meth) acrylates and methylenebis (meth) acrylamides obtained by addition reaction of saturated epoxy compounds and compounds with active hydrogen such as carboxylic acids and amines, and polyvalents such as divinylbenzene Examples thereof include compounds having two or more ethylenically unsaturated bonds, such as vinyl compounds.

  The photopolymerization initiator preferably used in the present invention is not particularly limited as long as it can polymerize a polymerizable carbon-carbon unsaturated group by light. Among these, those having a function of generating radicals by self-cleavage or hydrogen abstraction are preferably used. Examples include benzoin alkyl ethers, benzophenones, anthraquinones, benzyls, acetophenones, diacetyls, and the like.

  The photosensitive resin composition has other components such as ethylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol, glycerin, trimethylolpropane, and trimethylolethane for the purpose of increasing compatibility and flexibility. Alcohols can be contained, and conventionally known polymerization inhibitors can also be contained in order to increase the thermal stability. Preferable polymerization inhibitors include phenols, hydroquinones, catechols and the like. Moreover, dye, a pigment, surfactant, a ultraviolet absorber, a fragrance | flavor, antioxidant, etc. can also be contained.

  The method for obtaining the photosensitive resin layer (A) from the photosensitive resin composition is not particularly limited. For example, after dissolving a resin that can be dissolved or dispersed in water or alcohol in a solvent, a monomer that can be cured by ultraviolet light, Add a photopolymerization initiator and other additives as necessary and stir well to obtain a photosensitive resin composition solution. After removing the solvent from this solution, preferably melt on the substrate coated with adhesive It can be obtained by extrusion. Alternatively, a solution in which a part of the solvent remains can be obtained by melt-extrusion onto a substrate coated with an adhesive, and the part of the solvent remaining in the solvent can be naturally dried over time.

  The material used for the substrate in the present invention is not particularly limited, but a dimensionally stable material is preferably used. For example, a metal plate such as steel, stainless steel or aluminum, a plastic sheet such as polyester, or a synthetic rubber sheet such as styrene-butadiene rubber. Is mentioned.

  The heat-sensitive mask layer (C) in the present invention (1) efficiently absorbs an infrared laser, and a part or all of the layer is instantaneously evaporated or ablated by the heat, and the irradiated portion of the laser and the unirradiated portion are not. A difference occurs in the optical density of the irradiated portion, that is, the optical density of the irradiated portion is lowered, and (2) the function of blocking ultraviolet light practically.

  The heat sensitive mask layer (C) is a heat sensitive layer containing an infrared absorbing material. The thermal mask layer (C) has a function of blocking ultraviolet light from a thermally decomposable compound having a function of evaporating and ablating by heat in addition to an infrared absorbing material having a function of absorbing infrared laser and converting it into heat. You may contain the ultraviolet absorber which has.

Here, having the function of blocking ultraviolet light means that the optical density of the thermal mask layer (C) is 2.5 or more, and more preferably 3.0 or more. The optical density is generally represented by D and is defined by the following equation.
D = log ₁₀ (100 / T) = log ₁₀ (I ₀ / I)
(Here, T is transmittance (unit:%), I ₀ is incident light intensity at the time of measuring transmittance, and I is transmitted light intensity).

  For optical density measurement, there are known methods of calculating from the measured value of transmitted light intensity with a constant incident light intensity and calculating from the measured value of incident light intensity required to reach a certain transmitted light intensity. However, the optical density in the present invention is a value calculated from the former transmitted light intensity.

  The optical density can be measured by using a Macbeth transmission densitometer “TR-927” (manufactured by Kollmorgen Instruments Corp.) using an orthochromatic filter.

  The infrared absorbing substance is not particularly limited as long as it is a substance that can absorb infrared light and convert it into heat. For example, black pigments such as carbon black, aniline black, cyanine black, phthalocyanine, naphthalocyanine green pigments, rhodamine dyes, naphthoquinone dyes, polymethine dyes, diimonium salts, azoimonium dyes, chalcogen dyes, carbon graphite, iron Powder, Diamine-based metal complex, Dithiol-based metal complex, Phenolthiol-based metal complex, Mercaptophenol-based metal complex, Aryl aluminum metal salts, Crystallized water-containing inorganic compound, Copper sulfate, Chromium sulfide, Silicate compound, Titanium oxide, Oxidation Examples thereof include metal oxides such as vanadium, manganese oxide, iron oxide, cobalt oxide, and tungsten oxide, hydroxides and sulfates of these metals, and metal powders of bismuth, tin, tellurium, iron, and aluminum.

  Among these, carbon black is particularly preferable from the viewpoints of the photothermal conversion rate, economy, handleability, and the ultraviolet absorbing function described later. Carbon black is classified into furnace black, channel black, thermal black, acetylene black, lamp black, etc. according to its manufacturing method, but various types of furnace black are commercially available in terms of particle size and other aspects. In view of its low cost, it is preferably used.

  Examples of the thermally decomposable compound preferably used for the thermal mask layer (C) include, for example, a polymer compound or nitro compound that easily undergoes thermal decomposition, an organic peroxide, an azo compound, a diazo compound, a hydrazine derivative, and an infrared absorbing substance. The metal or metal oxide enumerated in the section can be mentioned, and a polymer compound is preferable from the viewpoint of the coatability of the solution. For example, an acrylic resin is relatively easy to thermally decompose, and a general acrylic resin has a thermal decomposition temperature of 190 ° C. to 250 ° C. The acrylic resin refers to a polymer or copolymer of one or more monomers selected from the group consisting of acrylic acid, methacrylic acid, acrylic acid ester, and methacrylic acid ester. Among the acrylic resins, by selecting a grade that does not dissolve in water or alcohol, the mass transfer to the lower photosensitive resin layer (A) can be suppressed. Therefore, a water / alcohol insoluble acrylic resin is more preferable. Used.

  Although it does not specifically limit as an ultraviolet-absorbing substance preferably used for a heat sensitive mask layer (C), Preferably, it is a compound which has absorption in the area | region of 300 nm-400 nm. For example, benzotriazole-based compounds, triazine-based compounds, benzophenone-based compounds, carbon black, and metals or metal oxides listed in infrared absorbing materials can be used. Among these, carbon black is particularly preferably used because it has absorption characteristics not only in the ultraviolet light region but also in the infrared light region and functions as a photothermal conversion substance.

  The heat-sensitive mask layer (C) used in the present invention may be hydrophilic or hydrophobic, but is preferably hydrophobic. In the present invention, the hydrophilic property means that the layer itself can be developed with water, and the hydrophobic property means a so-called water-insoluble property that the layer cannot be developed with water. Say. When the heat-sensitive mask layer (C) has a hydrophilic composition, mass transfer occurs in the photosensitive resin layer (A) that can be dissolved or dispersed in water, thereby reducing the functions unique to each layer. For example, (1) when the monomer of the photosensitive resin layer (A) moves to the thermal mask layer (C), the laser ablation of the thermal mask layer (C) is impaired, and (2) the photosensitive resin. When an ultraviolet absorbing substance is mixed in the layer (A), curing by ultraviolet light is inhibited, but the above-described phenomenon hardly occurs when the thermal mask layer (C) is hydrophobic. The method for imparting water insolubility is not particularly limited, and can be achieved by, for example, a method in which the entire composition of the heat-sensitive mask layer (C) is composed of a hydrophobic component, or a method in which a layer is crosslinked using a curable resin as a binder. The latter method is preferable because an effect of making the inter-layer mass transfer less likely to occur by polymerizing the composition component and an effect of imparting scratch resistance to the surface of the thermal mask layer (C) are obtained. Specifically, the hydrophobicity referred to in the present invention means that a load of 500 g (of which the weight of the friction element is 200 g) is applied to a white cotton cloth wetted with water by a friction tester II for dyeing fastness test described in JIS standard L0823. In this test method, an additional weight of 300 g) is applied and the surface of the thermal mask layer (C) is rubbed. It means that no penetrating scratches are observed after 5 reciprocating rubs, and further penetrates after 10 reciprocating rubs. More preferably, no sexual scratches are attached.

  When a curable resin is used as a binder, the method for curing the resin is not particularly limited. However, since the thermal mask layer (C) has a function of absorbing ultraviolet light, photocuring is difficult or inefficient. Is preferred. Examples of the thermosetting resin used as the binder include at least one compound selected from the group consisting of polyfunctional isocyanates and polyfunctional epoxy compounds, urea resins, amine compounds, amide compounds, hydroxyl group-containing compounds, and carboxylic acids. The combination with the at least 1 sort (s) of compound chosen from the group which consists of a compound and a thiol type compound is mentioned.

  When a polyfunctional isocyanate compound is used, the reaction is not completed in a short time, so it is necessary to cure at a high temperature. However, when nitrocellulose is used as the thermally decomposable compound, the decomposition temperature is 180 ° C. There is a restriction that curing cannot be performed at the above temperature. Therefore, as a crosslinking method, a combination of a polyfunctional epoxy compound and at least one compound selected from the group consisting of a urea resin, an amine compound, an amide compound, a hydroxyl group-containing compound, a carboxylic acid compound, and a thiol compound is used. Are preferably used.

  Here, examples of the polyfunctional epoxy compound include bisphenol A type epoxy resin, bisphenol F type epoxy resin, and glycidyl ether type epoxy resin.

  Examples of urea resins include butylated urea resins, butylated melamine resins, butylated benzoguanamine resins, butylated urea melamine cocondensation resins, aminoalkyd resins, iso-butylated melamine resins, methylated meminine resins, hexamethoxymethylol. Examples include melamine, methylated benzoguanamine resin, butylated benzoguanamine resin and the like.

  Examples of amine compounds include diethylenetriamine, triethylenetriamine, tetraethylenepentamine, diethylaminopropylamine, N-aminoethylpiperazine, metaxylenediamine, metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, and isophoronediamine. .

  In addition, examples of amide compounds include polyamide curing agents and dicyandiamide used as epoxy resin curing agents. Examples of hydroxyl group-containing compounds include phenol resins and polyhydric alcohols. Examples of thiol compounds include polyvalent thiols. and so on.

  As the carboxylic acid, phthalic acid, hexahydrophthalic acid, tetrahydrophthalic acid, dodecinyl succinic acid, pyromellitic acid, chlorenic acid, maleic acid, fumaric acid and anhydrides thereof are preferably used.

  Apart from the method of using a curable resin with a plurality of components, a single component or a curable resin may be used. Resins that are curable even when used alone include melamine resins, urethane resins, crosslinkable polyester resins, crosslinkable polyamide resins, and the like in addition to epoxy resins. These resins can also be used in combination.

  The amount of these thermosetting resins used is preferably 10% by weight to 75% by weight or less, more preferably 30% by weight to 60% by weight, based on the total composition of the heat sensitive mask layer (C). If it is 10% by weight or more, a crosslinked structure sufficient to impart water insolubility is obtained, and if it is 75% by weight or less, laser ablation of the thermal mask layer (C) is efficiently performed.

  When a pigment such as carbon black is used as the infrared absorbing material, a plasticizer, a surfactant or a dispersion aid may be added to facilitate the dispersion.

  Further, the heat-sensitive mask layer (C) may be a metal thin film obtained by vapor deposition or sputtering of an infrared absorbing metal or metal oxide.

  The adhesive force adjusting layer (B) of the present invention preferably contains partially saponified polyvinyl acetate having a saponification degree of 60 mol% or more. More preferably, the degree of saponification is 70 mol% or more and 99 mol% or less. When the saponification degree is 60 mol% or more, the adhesive force between the layers (A) / (C) is sufficient, and the water developability is also good. The degree of polymerization is not particularly limited as long as it is a partially saponified polyvinyl acetate having a saponification degree of 60 mol% or more, and those modified with an acid or the like can also be used. The saponification degree was measured by the polyvinyl alcohol test method described in JIS K 6726 (1994) 3.5 Saponification degree.

  In addition to partially saponified polyvinyl acetate with a saponification degree of 60 mol% or more, the adhesive strength adjusting layer (B) adjusts resins and monomers for optimizing appropriate adhesive strength, coating properties and stability. It is optional to add an additive such as a surfactant or a plasticizer, but particularly when the heat-sensitive mask layer (C) is water-insoluble, sufficient adhesion is obtained by adding an amine compound. be able to. In addition, the sufficient adhesive force described here means that the photosensitive resin layer (A) / adhesive force adjusting layer (B) / thermal mask layer (C) / peeling auxiliary layer (D) / cover film (E) are sequentially laminated. In the prepared photosensitive resin printing plate precursor, the adhesive force between the cover film (E) and the peeling auxiliary layer (D) when peeling the cover film (E) from the peeling auxiliary layer (D), or the cover film (E ) And the peeling auxiliary layer (D) from the thermal mask layer (C), the adhesive force between the peeling auxiliary layer (D) and the thermal mask layer (C) makes the photosensitive resin layer (A) / adhesive strength adjusting layer ( The adhesive force at the interface between B) and the adhesive force adjusting layer (B) / thermosensitive mask layer (C) is large.

  This adhesive force is obtained by attaching a 1 cm wide cello tape (registered trademark) (manufactured by Nichiban Co., Ltd.) to the surface of the thermal mask layer (C) of the laminate, and peeling the thermal mask layer (C) from the laminate. Tensilon Universal Tensile Tester “UTM-4-100” is applied to the force necessary to peel the thermal mask layer (C) and the adhesive force adjusting layer (B) from the photosensitive resin layer (A). It can be measured by using (Toyo Baldwin Co., Ltd.).

  The method of forming the adhesive force adjusting layer (B) is not particularly limited, but for the convenience of thin film formation, the adhesive force adjusting layer (B) component is dissolved on a solvent and coated on the thermal mask layer (C). The method of removing the solvent from is preferably carried out. As a method for removing the solvent, for example, hot air drying, far-infrared drying, or natural drying is performed.

  When the heat-sensitive mask layer (C) is insoluble, the surface of the heat-sensitive mask layer (C) is subjected to corona discharge treatment to make the surface hydrophilic, and then the hydrophilic adhesion adjusting layer (B) is used as the heat-sensitive mask layer (C When the layers are laminated so as to be in contact with each other, the adhesive force between the layers (B) / (C) can be increased.

  The solvent used for coating the adhesion adjusting layer (B) is not particularly limited, but water, alcohol, or a mixture of water and alcohol is mainly used. When water or alcohol is used, it is preferable that the heat-sensitive mask layer (C) is water-insoluble because the heat-sensitive mask layer (C) is not eroded even if coated on the heat-sensitive mask layer (C).

  The film thickness of the adhesive force adjusting layer (B) is preferably 15 μm or less, more preferably 0.1 μm or more and 5 μm or less. If it is 15 μm or less, bending and scattering of light by the layer when exposed to ultraviolet light can be suppressed, and a sharp relief image can be obtained. Moreover, if it is 0.1 micrometer or more, formation of an adhesive force adjustment layer (B) will become easy. As a method of measuring the film thickness, a method of measuring by a film weight per unit area or a film thickness measurement by a micrometer is possible.

  After laminating the adhesive force adjusting layer (B) on the heat sensitive mask layer (C) in this way, the photosensitive resin layer (A) is further laminated so as to be in contact with the adhesive force adjusting layer (B), whereby the layer (A) A laminated body laminated with sufficient adhesive force in the order of / (B) / (C) is obtained.

In the present invention, a cover film (E) having a surface roughness Ra of 0.1 to 0.6 μm on the surface in contact with the peeling auxiliary layer (D) is used. The resin relief printing plate prepared from the photosensitive resin printing plate precursor using the cover film (E) described above improves the ink inking property and improves the quality of the printed matter. When layer (C) is water-insoluble, (1) if the auxiliary peeling layer (D) is thin, the cover film (E) will not be peeled cleanly and will be broken by the thermal mask layer (C), resulting in scratches and pinholes. No multi number shots, (2) when the film thickness of the peeling assist layer (D) is thick, but the cover film (E) is peeled cleanly, the heat-sensitive mask layer (C) is ablated at the irradiation with infrared laser The problem of being difficult occurred, and a high-quality resin relief printing plate could not be produced.

  Thus, as a result of intensive studies by the present inventors, the peeling assisting layer (D) is at least from the group consisting of carboxylic acid and / or salt thereof, phosphoric acid and / or salt thereof, and sulfonic acid and / or salt thereof in the molecule. It has been found that the above-mentioned problems can be solved by containing an anionic surfactant having at least one selected functional group.

  At least one selected from the group consisting of carboxylic acid and / or a salt thereof, phosphoric acid and / or a salt thereof, and sulfonic acid and / or a salt thereof in at least a molecule contained in the peeling assisting layer (D) of the present invention. Examples of the anionic surfactant having a functional group include alkyl sulfate ester salts, alkyl benzene sulfonates, polyoxyethylene alkyl ether sulfates, polyoxyethylene alkyl phenyl ether sulfates, alkylene disulfonates, and alkyl diphenyl ether disulfonates. , Β-naphthalenesulfonic acid soda formalin condensate, monoalkylsulfosuccinic acid ester salt, dialkylsulfosuccinic acid ester salt, methacryloyloxyethyl sulfonic acid salt, polyacrylic acid salt, polyoxyalkylene alkyl ether phosphoric acid ester Ether, polyoxyethylene alkyl phenyl ether phosphate and salts thereof, and the like although not limited thereto.

  Further, among the above compounds, when a release auxiliary layer (D) using an anionic surfactant containing at least a phosphorus element and / or a sulfur element in the molecule is formed, higher-quality resin relief printing A photosensitive resin printing plate precursor capable of producing a plate can be obtained, which is preferable.

  The anionic surfactant is usually used by being dispersed in a resin that can be dissolved or dispersed in water or alcohol and has little tackiness. For example, polyvinyl alcohol, polyvinyl acetate, partially saponified polyvinyl alcohol, hydroxyalkyl cellulose, alkyl cellulose, polyamide resin, etc., and the content of the anionic surfactant is based on the total composition of the release auxiliary layer (D). 0.1 to 30% by weight or less is preferable, and 0.5 to 20% by weight or less is more preferable. When the content is 30% by weight or less, a uniform film can be formed, and when the content is 0.1% by weight or more, defects such as repellency and missing of the coating are unlikely to occur during coating.

  The peeling auxiliary layer (D) may further contain an infrared absorbing substance and / or a thermally decomposable substance in order to facilitate removal by infrared rays. As the infrared absorbing material and the thermally decomposable material, those described above can be used. Moreover, you may contain surfactant for coating property and wettability improvement.

The thickness of the peeling assist layer (D) of the present invention is preferably 0.05 μm to 1 μm, and more preferably 0.2 μm or more and 0.7 μm or less. When the film thickness is 1 μm or less, the thermal mask layer (C) is prevented from being ablated by laser, and the thermal mask layer (C) component remains in the laser irradiated part, or the laser irradiated part and the non-irradiated part Problems such as an optical density difference that does not appear clearly are less likely to occur. Whether the heat-sensitive mask layer (C) component remains or not can be visually confirmed in the laser ablation portion, particularly the solid portion of the heat-sensitive mask layer (C). Further, when the film thickness is 0.05μm or more, the cover film (E) is not cleanly peeled, torn heat-sensitive mask layer (C), scratches, a problem that a pinhole to multi number shots production is unlikely to occur.

  As a method of measuring the film thickness, a method of measuring by a film weight per unit area or a film thickness measurement by a micrometer is possible.

  The method for forming the peeling assisting layer (D) is not particularly limited, but for ease of thin film formation, the solvent is applied after coating the cover assisting layer (E) in a state in which the component of the peeling assisting layer (D) is dissolved in the solvent. A method of removing is preferably performed. As a method for removing the solvent, for example, hot air drying, far-infrared drying, or natural drying is performed. In addition, after peeling a cover film (E), since a peeling auxiliary | assistant layer (D) may remain in the thermal mask layer (C) side and may become an outermost layer, it is not sticky from the surface of handling, or this layer It is preferable that it is substantially transparent because it is exposed to ultraviolet light through.

  The film thickness control method for forming such a thin film peeling auxiliary layer (D) is not particularly limited, but the absorbance of the peeling auxiliary layer (D) to visible light or ultraviolet light is measured. Thus, there is a method of managing the laminated film thickness. That is, by measuring the relationship between the film thickness of the peeling assisting layer (D) and the absorbance with respect to visible light or ultraviolet light in an appropriate number and range, and preparing a calibration curve, film thickness measurement and film weight measurement with a micrometer Even if it is a difficult thin film, the film thickness can be known accurately and the film thickness of the peeling auxiliary layer (D) of the present invention can be managed.

  In order to make the above-described film thickness management by absorbance more accurate, it is preferable that the peeling assisting layer (D) contains a substance having an ability to absorb light in the visible region or ultraviolet region.

  The substance having the ability to absorb light in the visible region or ultraviolet region is not particularly limited. For example, known ultraviolet absorbers such as benzotriazoles, triazines, and benzophenones, and tris (4 -Dimethylaminophenyl) methane, 1,3-dimethyl-6-diethylaminofluorane, and known dyes such as azo dyes.

  As for the cover film (E) used by this invention, surface roughness Ra of the surface which contact | connects a peeling auxiliary | assistant layer (D) is 0.1-0.6 micrometer, and it is preferable that it is 0.2-0.5 micrometer. The cover film (E) is used for the purpose of protecting the heat-sensitive mask layer (C) from injury. For the cover film (E), a polymer film that can be easily peeled off from the heat-sensitive mask layer (C) is preferably used. Examples of such a cover film (E) include films of polyester, polycarbonate, polyamide, fluoropolymer, polystyrene, polyethylene, polypropylene, and the like. Examples of a method for setting the surface roughness Ra of these polymer films to 0.1 to 0.6 μm include sand blasting and coating of a resin containing a matting agent. Further, it is also possible to use a mat that has been subjected to sand spraying and chemical etching to which a resin is thinly applied to adjust the mat degree.

  The film thickness of the cover film (E) is preferably 25 μm to 200 μm, more preferably 50 μm to 150 μm. If it is 25 μm or more, it is easy to handle, and the function of protecting the heat-sensitive mask layer (C) from external damage is expressed. If it is 200 μm or less, it is advantageous in that it is inexpensive and economical and easy to peel off. . The film thickness of the cover film can be measured by using a micrometer.

  When peeling the cover film (E) from the photosensitive resin printing plate precursor at a speed of 200 mm / min, the peel force per 1 cm is preferably 4.5 to 200 mN / cm, and 9 to 150 mN / cm. Further preferred. If it is 4.5 mN / cm or more, it is possible to work without peeling the cover film (E) during work, and if it is 200 mN / cm or less, the cover film (E) can be peeled without difficulty. Therefore, it is preferable.

  Next, the preferable manufacturing method of the photosensitive resin printing plate precursor of this invention is described.

  First, it is an original plate having a structure in which a photosensitive resin layer (A), an adhesive strength adjusting layer (B), a thermal mask layer (C), a peeling auxiliary layer (D), and a cover film (E) are sequentially laminated on a substrate. . A sheet having a thermal mask layer (C) in which a peeling auxiliary layer (D), a thermal mask layer (C), and an adhesive force adjustment layer (B) are laminated on the cover film (E) by a sequential coating method; It can obtain by laminating | stacking the photosensitive resin sheet which laminated | stacked the photosensitive resin layer (A). The laminating method is not particularly limited. For example, a method in which the surface of the photosensitive resin layer (A) or the adhesive force adjusting layer (B) is swollen with water and / or alcohol, and a heat-sensitive mask sheet is bonded, a photosensitive resin layer A method of pouring a high-viscosity liquid having the same or similar composition as (A) between a photosensitive resin sheet and a thermal mask sheet and bonding them together, a method of pressing with a press machine at room temperature or while heating, etc. is there.

  The method for producing a resin relief printing plate according to the present invention includes (1) using the above-described photosensitive resin printing plate precursor, and (2) image mask (C) by imagewise irradiating the thermal mask layer (C) with an infrared laser. ') Forming step, (3) forming the latent image on the photosensitive resin layer (A) by exposing the formed image mask (C') side using ultraviolet light, and (4) mainly using water. It consists of a step of developing with a liquid as a component to remove the image mask (C ′) and the photosensitive resin layer (A) in the ultraviolet light unexposed area.

  When the auxiliary peeling layer (D) and / or the cover film (E) is present, at least the cover film (E) is peeled off, and then the infrared mask is imagewise irradiated onto the thermal mask layer (C). Thus, it is preferable to form an image mask (C ′). More preferably, after the peeling auxiliary layer (D) and the cover film (E) are present, only the cover film (E) is peeled, and then the thermal mask layer (C) is imagewise irradiated with an infrared laser. Forming an image mask (C ′).

  (2) The step of forming an image mask (C ′) by imagewise irradiating the thermal mask layer (C) with an infrared laser is to turn on / off the infrared laser based on image data, This is a step of scanning irradiation with respect to C). When the thermal mask layer (C) is irradiated with an infrared laser, heat is generated by the action of the infrared absorbing material, and the thermal decomposable compound is decomposed by the action of the heat to remove the thermal mask layer (C). Laser ablation. The laser ablated portion has a greatly reduced optical density and is substantially transparent to ultraviolet light. An image mask (C ′) capable of forming a latent image on the photosensitive resin layer (A) is obtained by selectively laser ablating the thermal mask layer (C) based on the image data.

  For the infrared laser irradiation, one having an oscillation wavelength in the range of 750 nm to 3000 nm is used. Examples of such lasers include ruby lasers, alexandrite lasers, perovskite lasers, solid state lasers such as Nd-YAG lasers and emerald glass lasers, semiconductor lasers such as InGaAsP, InGaAs and GaAsAl, and dye lasers such as rhodamine dyes. Can be mentioned. A fiber laser that amplifies these light sources with a fiber can also be used. Among them, the semiconductor laser is preferable because it is downsized due to recent technological advances and is economically advantageous over other laser light sources. An Nd-YAG laser is also preferable because it has a high output, is widely used for dentistry and medical purposes, and is economically inexpensive.

  (3) The step of exposing from the image mask (C ′) side using ultraviolet light to form a latent image on the photosensitive resin layer (A) is a photosensitive resin printing plate material that has been laser-irradiated by the above method. In addition, ultraviolet light, preferably ultraviolet light having a wavelength of 300 to 400 nm, is exposed on the entire surface through an image mask (C ′) on which an image is formed by a laser, and the lower part of the laser ablation part in the image mask (C ′) This is a step of selectively photocuring the photosensitive resin layer (A).

  At the time of exposure, ultraviolet light also enters from the side surface of the photosensitive resin printing plate material. Therefore, it is preferable to cover the side surface with a cover that does not transmit ultraviolet light. As a light source capable of exposing a wavelength of 300 to 400 nm, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a metal halide lamp, a xenon lamp, a carbon arc lamp, a chemical lamp, or the like can be used. The portion of the photosensitive resin layer (A) exposed with ultraviolet light is changed into a substance that cannot be eluted and dispersed by the developer.

  (4) The step of developing with a liquid containing water as a main component to remove the image mask (C ′) and the photosensitive resin layer (A) in the ultraviolet light unexposed area is, for example, the photosensitive resin layer (A). It is achieved by developing using a brush type washing machine or a spray type washing machine having a developer mainly composed of water that can dissolve and disperse water. Through this step, a portion exposed to ultraviolet light remains, and a resin relief printing plate having a relief image is obtained.

  The developer containing water as a main component may contain tap water, distilled water, or water as a main component and an alcohol having 1 to 6 carbon atoms. Here, the main component means 70% by weight or more. Moreover, what mixed the component of the photosensitive resin layer (A), the adhesive force adjustment layer (B), the heat sensitive mask layer (C), and the peeling auxiliary layer (D) in these liquids can also be used.

  The image mask (C ′) can be physically removed by rubbing with a strong brush such as PBT (polybutylene terephthalate).

  Thereafter, if necessary, a treatment for drying the developer adhering to the plate surface, post-exposure of the photosensitive resin printing plate material, an adhesive removal treatment, and the like can be performed.

  The resin relief printing plate produced by the production method of the present invention is preferably used as a resin relief printing plate that can be mounted on a printing machine.

  Hereinafter, the present invention will be specifically described with reference to examples. However, the present invention is not limited to this.

<Measurement method of surface roughness Ra>
The measurement was performed using a laser microscope VK-9510 (manufactured by KYENCE) equipped with a standard objective lens (× 50). As the surface roughness Ra of the present invention, an average value of Ra values obtained by measuring the line roughness (1994 JIS) 10 times with the shape analysis application VK-H1A9 was used. Further, when measuring the Ra value, inclination correction was performed as necessary.

<Tear of heat-sensitive mask layer / 10 cm ² measurement method>
To break the mask layer, use a digital camera (NIKOON COOLPIX S8) to take a picture of the thermal mask layer within 10 cm ² of the screen, and then use a personal computer to make the digital image grayscale using the Adobe software photoshop, then SCION CORPORATION. The torn part and the normal part were binarized with the software SCION Image 4.03.2 manufactured by the company, and the torn part area was determined. Thereafter, the area of the torn part was divided by 10 cm ² to obtain the ratio of the torn part. The binarization was performed by scrolling the threshold button while looking at the image so that the torn part and the normal part could be clearly identified in the Threshold menu and the Density Slice menu.

<Measurement method of thermal mask layer pinhole number / 10 cm ² >
Using an optical microscope (OPTIPHOTO 300 manufactured by NIKON), observation was performed with a 10 × objective lens. The examination of the number of pinholes of 50 μm or more in the area of 10 cm ² was repeated twice, and the average value was set to the number of pinholes of 50 μm or more / 10 cm ² .

<Measurement method of solid portion burnt residue / cm ² (20 μm or more)>
Using an optical microscope (OPTIPHOTO 300 manufactured by NIKON), observation was performed with a 10 × objective lens. In the range of the solid portion area of 1 cm ^2, the number of black burned chips of 20 μm or more was examined twice, and the average value was set to the number of pinholes of 20 μm or more / cm ² .

<Synthesis of water-soluble polyamide resin 1>
ε-Caprolactam 10 parts by weight, N- (2-aminoethyl) piperazine and 90 parts by weight of adipic acid nylon salt and 100 parts by weight of water were placed in a stainless steel autoclave, and the air inside was replaced with nitrogen gas at 180 ° C. The mixture was heated for 1 hour, and then water was removed to obtain a water-soluble polyamide resin 1.

<Synthesis of modified polyvinyl alcohol 1>
In a flask equipped with a condenser tube, partially saponified polyvinyl alcohol “GOHSENOL” KL-05 (degree of saponification 78.5% -82.0%, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) 50 parts by weight, succinic anhydride 2% And 10 parts by weight of acetone were added and heated at 60 ° C. for 6 hours, and then the cooling tube was removed to volatilize acetone. Thereafter, the purification step of eluting unreacted succinic anhydride with 100 parts by weight of acetone was carried out twice, followed by drying under reduced pressure at 60 ° C. for 5 hours to obtain modified polyvinyl alcohol 1 in which succinic acid was ester-bonded to a hydroxyl group. Obtained.

<Preparation of coating liquid composition 1 for photosensitive resin layer (A1)>
In a three-necked flask equipped with a stirring spatula and a condenser tube, 7.5 parts by weight of water-soluble polyamide resin 1, 47.5 parts by weight of modified polyvinyl alcohol 1, 11 parts by weight of diethylene glycol, 38 parts by weight of water and ethanol 44 Part by weight was added, and the polymer was dissolved by stirring at 110 ° C. for 30 minutes and then at 70 ° C. for 90 minutes. Subsequently, 3 parts by weight of “Blemmer” G (glycidyl methacrylate, manufactured by Nippon Oil & Fats Co., Ltd.) was added and stirred at 70 ° C. for 30 minutes. Furthermore, 12 parts by weight of “Blenmer” GMR (methacrylic acid adduct of glycidyl methacrylate, manufactured by NOF Corporation), 5 parts by weight of “light ester” G201P (acrylic acid adduct of glycidyl methacrylate, manufactured by Kyoeisha Chemical Co., Ltd.), "Epoxy ester" 70PA (acrylic acid adduct of propylene glycol diglycidyl ether, manufactured by Kyoeisha Chemical Co., Ltd.), 6 parts by weight, "NK ester" A-200 (diacrylate of polyethylene glycol having an average molecular weight of 200, Shin-Nakamura Chemical Co., Ltd.) 5 parts by weight, “Irgacure” 651 (benzyldimethyl ketal, manufactured by Ciba-Geigy) 0.1 parts by weight, “Irgacure” 184 (α-hydroxyketone, manufactured by Ciba-Geigy) 1.5 parts by weight, “Suminol Fast Cyanine Green G conc.” Dex CI Acid Green 25, manufactured by Sumitomo Chemical Co., Ltd.) 0.01 parts by weight, “Direct Sky Blue 6B” (produced by Hamamoto Dye) 0.01 parts by weight, “Formaster” (antifoaming agent, San Nopco) (Manufactured by Co., Ltd.) 0.05 parts by weight, “Tinubin” 327 (UV absorber, manufactured by Ciba-Geigy Co., Ltd.) 0.015 parts by weight, “TTP-44” (bis- {2- (2-ethoxyethoxy) 0.2 parts by weight of carbonyl) ethylthio} octylthiophosphine (manufactured by Sakai Chemical Co., Ltd.) and 0.005 parts by weight of “Q-1300” (ammonium N-nitrosophenylhydroxylamine, manufactured by Wako Pure Chemical Industries, Ltd.) And it stirred for 30 minutes and obtained the coating liquid composition 1 of the photosensitive resin layer (A1) with fluidity | liquidity.

<Preparation of adhesive coated substrate 1>
A mixture of 260 parts by weight of “Byron 31SS” (toluene solution of unsaturated polyester resin, manufactured by Toyobo Co., Ltd.) and 2 parts by weight of “PS-8A” (benzoin ethyl ether, manufactured by Wako Pure Chemical Industries, Ltd.) The mixture was heated at 0 ° C. for 2 hours and then cooled to 30 ° C., and 7 parts by weight of ethylene glycol diglycidyl ether dimethacrylate was added and mixed for 2 hours. Further, 25 parts by weight of “Coronate” 3015E (ethyl acetate solution of polyvalent isocyanate resin, manufactured by Nippon Polyurethane Industry Co., Ltd.) and 14 parts by weight of “EC-1368” (industrial adhesive, manufactured by Sumitomo 3M Co., Ltd.) This was added to obtain an adhesive composition 1.

  50 parts by weight of “Gohsenol” KH-17 (polyvinyl alcohol having a saponification degree of 78.5% to 81.5%, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) is mixed with “Solmix” H-11 (alcohol mixture, Nippon Alcohol Co., Ltd.). )) After being dissolved in a mixed solvent of 200 parts by weight and 200 parts by weight of water at 70 ° C. for 2 hours, 1.5 parts by weight of “Blenmer” G (glycidyl methacrylate, manufactured by NOF Corporation) was added, and 1 After mixing for a while, 3 parts by weight of a copolymer (made by Kyoeisha Chemical Co., Ltd.) having a (dimethylaminoethyl methacrylate) / (2-hydroxyethyl methacrylate) weight ratio of 2/1, “Irgacure” 651 (benzyldimethyl ketal, Ciba・ Geigy Co., Ltd.) 5 parts by weight, "epoxy ester" 70PA (propylene glycol diglycidyl ether acrylic acid adduct) Kyoeisha Chemical Co., Ltd.) (21 parts by weight) and ethylene glycol diglycidyl ether dimethacrylate (20 parts by weight) were added and mixed for 90 minutes. 0.1 part by weight was added and mixed for 30 minutes to obtain an adhesive composition 2.

  The adhesive layer composition 1 is applied on a 250 μm-thick “Lumirror” T60 (polyester film, manufactured by Toray Industries, Inc.) with a bar coater so that the film thickness becomes 40 μm after drying, and placed in an oven at 180 ° C. for 3 minutes. After removing the solvent, the adhesive layer composition 2 was coated thereon with a bar coater so as to have a dry film thickness of 30 μm and dried in an oven at 160 ° C. for 3 minutes to obtain an adhesive coated substrate 1.

<Manufacture of photosensitive resin sheet 1>
After the adhesive coated substrate 1 is exposed at 1000 mJ / cm ² with an ultrahigh pressure mercury lamp from the adhesive coating side, the coating liquid composition 1 for the photosensitive resin layer (A1) is coated with the adhesive coated surface of the adhesive coated substrate 1. And dried in an oven at 60 ° C. for 5 hours to obtain a photosensitive resin sheet 1 having a thickness of about 900 μm including the substrate. The thickness of the photosensitive resin sheet 1 was controlled by installing a spacer having a predetermined thickness on the substrate and scraping out the coating liquid composition 1 in a portion protruding from the spacer with a horizontal metal scale.

<Preparation of coating liquid composition 2 for peeling auxiliary layer (D1)>
The coating liquid 2 for peeling auxiliary layer (D1) was adjusted as shown in Table 1. "Gosenol" KH-17 (polyvinyl alcohol having a saponification degree of 78.5% to 81.5%, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) 20 parts by weight water 40 parts by weight, ethanol 30 parts by weight, n-propanol 8 parts by weight The polymer solution was obtained. Add 2 parts by weight of “Perex SS-H” (sodium alkyldiphenyl ether disulfonate, Kao Co., Ltd.) to the solution and stir until a uniform solution is obtained, thereby forming a coating liquid composition for the auxiliary peeling layer (D1) Product 2 was obtained.

<Preparation of coating liquid composition 3 for peeling auxiliary layer (D2)>
Coating solution except for using PRISURF A212C (polyoxyalkylene alkyl ether / phosphate ester, Daiichi Kogyo Seiyaku Co., Ltd.) instead of “Perex SS-H” (sodium alkyldiphenyl ether disulfonate, Kao Corporation) It adjusted like the composition 2.

<Preparation of coating liquid composition 4 for peeling auxiliary layer (D3)>
“Porex SS-H” (sodium alkyldiphenyl ether disulfonate, Kao Corporation) is not used, “Gohsenol” KH-17 (polyvinyl alcohol having a saponification degree of 78.5% to 81.5%, Nippon Synthetic Chemical Industry Co., Ltd.) )) Was used in the same manner as in the coating liquid composition 2 except that 22 parts by weight was used.

<Preparation of Coating Liquid Composition 5 for Thermal Mask Layer (C1)>
“MA100” (carbon black, manufactured by Mitsubishi Chemical Corporation) 23 parts by weight, “Dianal” BR-95 (alcohol-insoluble acrylic resin, manufactured by Mitsubishi Rayon Co., Ltd.) 15 parts by weight, plasticizer ATBC (acetyl citrate) Carbon black dispersion 1 was prepared by kneading and dispersing 6 parts by weight of tributyl (manufactured by J Plus Co., Ltd.) and 30 parts by weight of methyl isobutyl ketone using a three-roll mill. In dispersion 1, 20 parts by weight of “Araldite” 6071 (epoxy resin, manufactured by Asahi Ciba), 27 parts by weight of “Uban” 2061 (melamine resin, manufactured by Mitsui Chemicals), “light ester” P-1M ( 0.7 parts by weight of phosphoric acid monomer (manufactured by Kyoeisha Chemical Co., Ltd.) and 140 parts by weight of methyl isobutyl ketone were added and stirred for 30 minutes. Thereafter, methyl isobutyl ketone was further added so that the solid content concentration was 33% by weight to obtain a coating liquid composition 5 for the thermal mask layer (C1).

<Preparation of Coating Solution Composition 6 for Adhesive Strength Adjustment Layer (B1)>
11 parts by weight of “GOHSENOL” AL-06 (polyvinyl alcohol having a saponification degree of 91% to 94%, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) 55 parts by weight of water, 14 parts by weight of methanol, 10 parts by weight of n-propanol and n- It melt | dissolved in 10 weight part of butanol, and obtained the coating liquid composition 6 for adhesive force adjustment layers (B1).

<Manufacture of thermal mask element 1>
On the 100 μm thick chemically matted polyester film (Ra 0.4 μm), the coating liquid composition 2 was applied using a bar coater so that the dry film thickness was 0.3 μm, and dried at 100 ° C. for 25 seconds. A laminate of peeling auxiliary layer (D1) / cover film (E) was obtained. On the peeling auxiliary layer (D1) side of the laminate thus obtained, the coating liquid composition 5 was applied to a dry film thickness of 2 μm using a bar coater, dried at 140 ° C. for 30 seconds, A laminate of thermal mask layer (C1) / peeling auxiliary layer (D1) / cover film (E) was obtained. On the thermal mask layer (C1) side of the laminate thus obtained, the coating liquid composition 6 was applied using a bar coater so that the dry film thickness was 0.5 μm, and dried at 140 ° C., to obtain a heat-sensitive mask element 1 shown in Table 2 is a laminate of the adhesive force adjusting layer (B1) / heat-sensitive mask layer (C1) / peel assist layer (D1) / cover film (E).

<Manufacture of thermal mask element 2>
It was manufactured in the same manner as the thermal mask element 1 except that the coating liquid composition 2 was applied so that the dry film thickness was 0.7 μm. Adhesive force adjusting layer (B1) / heat-sensitive mask layer (C1) / peel assist layer (D1) / heat-sensitive mask element 2 shown in Table 2 is a laminate of a cover film (E) was obtained.

<Manufacture of thermal mask element 3>
It was manufactured in the same manner as the thermal mask element 1 except that the coating liquid composition 2 was applied so that the dry film thickness was 0.9 μm. A thermal mask element 3 shown in Table 2, which is a laminate of an adhesive force adjusting layer (B1) / thermal mask layer (C1) / peeling auxiliary layer (D1) / cover film (E), was obtained.

<Manufacture of thermal mask element 4>
It was produced in the same manner as the thermal mask element 1 except that a 100 μm thick chemically matted polyester film (Ra 0.4 μm) was used instead of a 100 μm thick chemically matted polyester film (Ra 0.1 μm). Adhesive force adjusting layer (B1) / heat-sensitive mask layer (C1) / peel assist layer (D1) / heat-sensitive mask element 4 shown in Table 3 is a laminate of a cover film (E) was obtained.

<Manufacture of thermal mask element 5>
Instead of using a 100 μm thick chemically matted polyester film (Ra 0.4 μm), it was produced in the same manner as the thermal mask element 1 except that a 100 μm thick chemically matted polyester film (Ra 0.6 μm) was used. A thermal mask element 5 shown in Table 3, which is a laminate of an adhesive force adjusting layer (B1) / thermal mask layer (C1) / peeling auxiliary layer (D1) / cover film (E), was obtained.

<Manufacture of thermal mask element 6>
Instead of applying the coating liquid composition 2 to a dry film thickness of 0.3 μm, the thermal mask element 1 and the coating liquid composition 3 were applied except that the dry liquid film thickness was 0.5 μm. Produced in the same manner. A thermal mask element 6 shown in Table 3 as a laminate of adhesive strength adjusting layer (B1) / thermal mask layer (C1) / peeling auxiliary layer (D2) / cover film (E) was obtained.

<Manufacture of thermal mask element 7>
Instead of applying the coating liquid composition 2 to a dry film thickness of 0.3 μm, the thermal mask element 1 and the coating liquid composition 4 were applied except that the dry film thickness was applied to 0.7 μm. Produced in the same manner. A thermal mask element 7 shown in Table 4, which is a laminate of an adhesive force adjusting layer (B1) / thermal mask layer (C1) / peeling auxiliary layer (D3) / cover film (E), was obtained.

<Manufacture of thermal mask element 8>
Instead of applying the coating liquid composition 2 to a dry film thickness of 0.3 μm, the thermal mask element 1 and the coating liquid composition 4 were applied except that the dry film thickness was 1.0 μm. Produced in the same manner. A thermal mask element 8 shown in Table 4, which is a laminate of an adhesive strength adjusting layer (B1) / thermal mask layer (C1) / peeling auxiliary layer (D3) / cover film (E), was obtained.

Example 1
A calender roll heated to 80 ° C. with the heat-sensitive mask element 1 placed on the photosensitive resin layer (A1) of the photosensitive resin sheet 1 so that the adhesive force adjusting layer (B1) is in contact with the photosensitive resin layer (A1). Are laminated in the order of adhesive coated substrate 1 / photosensitive resin layer (A1) / adhesive strength adjusting layer (B1) / thermal mask layer (C1) / peeling auxiliary layer (D1) / cover film (E). A photosensitive resin printing plate precursor 1 was obtained. The clearance of the calender roll was adjusted so that the thickness of the laminate after peeling the cover film layer (E) from the original plate 1 was 950 μm. The developed coating liquid composition 1 is allowed to stand for 1 week after laminating, whereby the remaining solvent is naturally dried to form an additional photosensitive resin layer (A1).

After peeling the cover film (E) from the photosensitive resin printing plate precursor 1, the thermal mask layer (C1) was examined on a light table. The thermal mask layer was broken or the number of pinholes of thermal mask layer of 50 μm or more / 10 cm. ² was 0. After that, a test pattern with a resolution of 156 lines is mounted on an external drum type plate setter “CDI SPARK” (manufactured by Esco Graphics Co., Ltd.) equipped with a fiber laser having a light emitting region in the infrared so that the substrate side is in contact with the drum. (The solid part, 1% to 99% halftone dot, 1 to 8 points of fine lines, 1 to 8 points of white lines) are laser-drawn under the conditions of a laser output of 9 W and a drum rotation speed of 500 rpm, and a thermal mask layer ( An image mask (C1 ′) was formed from C1). At this time, the burned residue / cm ² (20 μm or more) of the solid portion was 0.

Subsequently, the entire surface was exposed from an image mask (C1 ′) side with an ultrahigh pressure mercury lamp (manufactured by Oak Co., Ltd.) having a light source in the ultraviolet region (exposure amount: 1000 mJ / cm ² ).

  Next, using a brush type developing machine FTW500II (manufactured by Toray Industries, Inc.) equipped with a brush made of PBT (polybutylene terephthalate), development was carried out with tap water at 35 ° C. for 1.5 minutes. D1), the image mask (C1 ′) and the portion of the photosensitive resin layer (A1) that is blocked by the image mask and not exposed to ultraviolet rays are selectively developed, and a negative relief is applied to the image mask (C1 ′). It was faithfully reproduced. The results are shown in Table 2.

(Example 2)
A photosensitive resin printing plate precursor 2 was prepared in the same manner as in Example 1 except that the thermal mask element 2 was used.

After peeling the cover film (E) from the photosensitive resin printing plate precursor 2 and examining the thermal mask layer (C1) on the light table, the thermal mask layer was broken or the number of pinholes having a thermal mask layer of 50 μm or more / 10 cm ^2. Was 0. Thereafter, laser drawing was performed to form an image mask (C1 ′) from the heat-sensitive mask layer (C1). At this time, the burned residue / cm ² (20 μm or more) of the solid portion was 0. Thereafter, the relief formed by exposure and development faithfully reproduced the image of the image mask (C1 ′). The results are shown in Table 2.

(Example 3)
A photosensitive resin printing plate precursor 3 was prepared in the same manner as in Example 1 except that the thermal mask element 3 was used.

After peeling the cover film (E) from the photosensitive resin printing plate precursor 3 and examining the thermal mask layer (C1) on the light table, the thermal mask layer was broken or the number of pinholes having a thermal mask layer of 50 μm or more / 10 cm ^2. Was 0. Thereafter, laser drawing was performed to form an image mask (C1 ′) from the heat-sensitive mask layer (C1). As a result, the solid portion burned residue / cm ² (20 μm or more) was 0. Thereafter, the relief formed by exposure and development faithfully reproduced the image of the image mask (C1 ′). The results are shown in Table 2.

Example 4
A photosensitive resin printing plate precursor 4 was produced in the same manner as in Example 1 except that the thermal mask element 4 was used.

After peeling the cover film (E) from the photosensitive resin printing plate precursor 4 and examining the thermal mask layer (C1) on the light table, the number of thermal mask layer pinholes of 50 μm or more / 10 cm ² was zero. . Thereafter, laser drawing was performed to form an image mask (C1 ′) from the heat-sensitive mask layer (C1). At this time, the burned residue / cm ² (20 μm or more) of the solid portion was 0. Thereafter, the relief formed by exposure and development faithfully reproduced the image of the image mask (C1 ′). The results are shown in Table 3.
(Example 5)
A photosensitive resin printing plate precursor 5 was prepared in the same manner as in Example 1 except that the thermal mask element 5 was used.

After peeling the cover film (E) from the photosensitive resin printing plate precursor 5 and examining the thermal mask layer (C1) on the light table, the thermal mask layer was broken or the number of pinholes of the thermal mask layer of 50 μm or more / 10 cm ^2. Was zero. Thereafter, laser drawing was performed to form an image mask (C1 ′) from the heat-sensitive mask layer (C1). At this time, the burned residue / cm ² (20 μm or more) of the solid portion was 0. Thereafter, the relief formed by exposure and development faithfully reproduced the image of the image mask (C1 ′). The results are shown in Table 3.
(Example 6)
A photosensitive resin printing plate precursor 6 was prepared in the same manner as in Example 1 except that the thermal mask element 6 was used.

After peeling the cover film (E) from the photosensitive resin printing plate precursor 6 and examining the thermal mask layer (C1) on the light table, the thermal mask layer was broken or the number of pinholes of 50 μm or more thermal mask layer / 10 cm ^2. Was zero. Thereafter, laser drawing was performed to form an image mask (C1 ′) from the heat-sensitive mask layer (C1). At this time, the burned residue / cm ² (20 μm or more) of the solid portion was 0. Thereafter, the relief formed by exposure and development faithfully reproduced the image of the image mask (C1 ′). The results are shown in 3.

(Comparative Example 1)
A photosensitive resin printing plate precursor 7 was prepared in the same manner as in Example 1 except that the thermal mask element 7 was used.

When peeling the cover film (E) from the photosensitive resin printing plate precursor 7, half of the heat-sensitive mask layer (C1) is peeled off together with the cover film (E) per 10 cm ² , and the heat-sensitive mask layer is broken by 50%. Met. Further, when the remaining thermal mask layer (C1) was examined on the light table, the number of thermal mask layer pinholes of 50 μm or more / 10 cm ² was 40. Thereafter, laser drawing was performed to form an image mask (C1 ′) from the heat-sensitive mask layer (C1). At this time, the burned residue / cm ² (20 μm or more) of the solid portion was 0. When the relief was formed, the part where the heat-sensitive mask layer (C1) was torn and peeled was a solid image on the entire surface. Further, the scratched pinhole part was also defective, and the desired relief could hardly be obtained. The results are shown in Table 4.

(Comparative Example 2)
A photosensitive resin printing plate precursor 8 was produced in the same manner as in Example 1 except that the thermal mask element 8 was used.

After peeling the cover film (E) from the photosensitive resin printing plate precursor 8 and examining the thermal mask layer (C1) on the light table, the thermal mask layer was not torn and the number of pinholes of thermal mask layer of 50 μm or more / 10 cm ² was zero. After that, when laser drawing was performed and an image mask (C1 ′) was formed from the thermal mask layer (C1), a large number of burned debris of the mask layer of about 100 μm was generated in the portion where the thermal mask layer was drawn, The solid portion burned residue / cm ² (20 μm or more) was insufficient. Thereafter, the relief formed by exposure and development reproduced the image of the image mask (C1 ′), but the surface had a dent of about 50 μm in depth and about 10 μm in depth. The results are shown in Table 4.

Claims (3)

On the substrate, a photosensitive resin layer (A) containing a resin that can be dissolved or dispersed in water and a monomer that can be cured by ultraviolet light, an adhesive force adjusting layer (B), and a thermal mask layer containing an infrared absorbing substance ( C), peeling assist layer (D), the surface roughness Ra of the surface in contact with the peeling assist layer (D) is in the photosensitive resin printing BanHara plate having a cover film (E) is 0.1 to 0.6 .mu.m, The peeling assisting layer (D) has at least one functional group selected from the group consisting of carboxylic acid and / or salt thereof, phosphoric acid and / or salt thereof, and sulfonic acid and / or salt thereof in at least the molecule. A photosensitive resin printing plate precursor comprising an ionic surfactant. The anionic surfactant, according to claim 1, characterized in that it contains a phosphorus element and / or elemental sulfur in at least the molecule a photosensitive resin printing BanHara plate.   3. The photosensitive resin printing plate precursor according to claim 1, wherein the heat-sensitive mask layer (C) is hydrophobic.