JP5012048B2 - Detection method and detection system - Google Patents
Detection method and detection system Download PDFInfo
- Publication number
- JP5012048B2 JP5012048B2 JP2007017692A JP2007017692A JP5012048B2 JP 5012048 B2 JP5012048 B2 JP 5012048B2 JP 2007017692 A JP2007017692 A JP 2007017692A JP 2007017692 A JP2007017692 A JP 2007017692A JP 5012048 B2 JP5012048 B2 JP 5012048B2
- Authority
- JP
- Japan
- Prior art keywords
- reinforcing plate
- circuit board
- flexible circuit
- hole
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
本発明は、補強板付フレキシブル回路板の補強板が所定の厚さであるかどうかを検出する検出方法および検出システムに関する。 The present invention relates to a detection method and a detection system for detecting whether a reinforcing plate of a flexible circuit board with a reinforcing plate has a predetermined thickness.
薄型軽量という特長を生かして、電子機器内にはフレキシブル回路板が多用されている。フレキシブル回路板は、一般には以下のようにして作成される。まず、基材としてポリイミド樹脂フィルムと、金属箔として一般的に銅箔とを貼り合せた、フレキシブル回路板用積層板を用意する。次に、銅箔をエッチング等によりパターンニングし導体回路を形成する。 Taking advantage of the thin and lightweight features, flexible circuit boards are frequently used in electronic devices. The flexible circuit board is generally produced as follows. First, a laminate for a flexible circuit board is prepared, in which a polyimide resin film is bonded as a base material and a copper foil is generally bonded as a metal foil. Next, the copper foil is patterned by etching or the like to form a conductor circuit.
次に、絶縁被覆層として、予め導体回路露出個所を打抜き金型等を用いて取り除いた、ポリイミド樹脂フィルムの一方の面に熱硬化性接着剤が塗布されたカバーレイフィルムを導体回路側に貼り合せる。最後に、必要により露出した部分にめっきを施したり、強度が必要な部分に補強板を貼着したりして完成となる(例えば特許文献1)。 Next, a coverlay film with a thermosetting adhesive applied to one side of the polyimide resin film, where the exposed portions of the conductor circuit were previously removed using a punching die or the like, was applied to the conductor circuit side as an insulating coating layer. Match. Finally, the exposed portion is plated if necessary, or a reinforcing plate is attached to a portion requiring strength (for example, Patent Document 1).
しかし、近年、実装の高密度化が促進し、加工精度の向上は行われているものの、強度が必要な個所に貼着する補強板は、依然として人的作業によっている。そのため、補強板を間違って複数枚貼着するなどの問題があったが、これまでは作業者自信が確認したりしていたため、時折次工程に流出し、例えば部品に組み込むときに発見されることがあった。
本発明は、上記事情に鑑みてなされたものであり、その目的は、補強板付フレキシブル回路板の補強板が所定の厚さであるかどうかを迅速かつ確実にチェックできる検出方法および検出システムを提供することである。 The present invention has been made in view of the above circumstances, and an object thereof is to provide a detection method and a detection system capable of quickly and surely checking whether or not the reinforcing plate of the flexible circuit board with the reinforcing plate has a predetermined thickness. It is to be.
本発明の検出方法は、補強板付フレキシブル回路板に、センサーを当接して、前記補強板の厚さが適切であるかを検出する検出方法であって;
前記補強板付フレキシブル回路板は、導体パッドを有するフレキシブル回路板と、前記導体パッドを覆うように、一面が前記フレキシブル回路板に貼着された前記補強板と、を備え、前記補強板には貫通孔が少なくとも一つ設けられ、前記貫通孔を通して前記導体パッドが露出した形状を有し、前記センサーは、電極を備え、前記電極は、前記貫通孔よりも径が大きい基端部と、前記基端部の一面に設けられ、かつ前記貫通孔に挿入可能な棒状体と、を有し、
前記棒状体を前記貫通孔の内部に挿入しつつ、前記基端部の一面を、前記補強板の一面とは反対の他面に当接させるステップと、前記棒状体が前記導体パッドと接触したとき、前記補強板が所定の厚さであると判断し、前記棒状体が前記導体パッドと離間したとき、前記補強板が所定の厚さより厚いと判断するステップと、を含む検出方法である。
The detection method of the present invention is a detection method in which a sensor is brought into contact with a flexible circuit board with a reinforcing plate to detect whether the thickness of the reinforcing plate is appropriate;
The flexible circuit board with a reinforcing plate includes: a flexible circuit board having a conductor pad; and the reinforcing board having one surface attached to the flexible circuit board so as to cover the conductor pad, and the reinforcing plate penetrates the flexible circuit board. At least one hole is provided, and the conductor pad is exposed through the through hole. The sensor includes an electrode, and the electrode includes a base end having a diameter larger than the through hole, and the base. provided on one surface of the end portion, or one prior SL has, and the rod-shaped body can be inserted into the through hole,
While inserting the rod-like body inside the front SL through hole, contacting one surface of said proximal portion, and a step of contact with the other surface opposite to the one surface of the reinforcing plate, the rod-shaped body and the conductor pad when said reinforcing plate is determined to be a predetermined thickness, when the rod-shaped body is spaced apart from the conductor pad is the detection method comprising the steps of the reinforcing plate is determined to greater than the predetermined thickness .
また、本発明の検出方法は、補強板付フレキシブル回路板に、センサーを当接して、前記補強板の厚さが適切であるかを検出する検出方法であって;
前記補強板付フレキシブル回路板は、フレキシブル回路板と、前記フレキシブル回路板の少なくとも一方の面に貼着された前記補強板と、を備え、前記補強板は、一面が前記フレキシブル回路板に貼着されており、前記補強板には少なくとも一つの第一の貫通孔が設けられるとともに、前記フレキシブル回路板には、前記第一の貫通孔に対応するように第二の貫通孔が設けられ、前記センサーは、前記補強板付フレキシブル回路板を挟んで、前記補強板付フレキシブル回路板の一方の面側と他方の面側とにそれぞれ配置される第一の電極と第二の電極を備え、前記第一の電極は、前記第一の貫通孔よりも径が大きい基端部と、前記基端部の一面に設けられ、かつ前記貫通孔に挿入可能な棒状体と、を有し、
前記棒状体を前記第一の貫通孔および前記第二の貫通孔の内部に挿入しつつ、前記基端部の一面を、前記補強板の一面とは反対の他面に当接させるステップと、前記棒状体が前記第二の電極に接触したとき、前記補強板が所定の厚さであると判断し、前記棒状体が前記第二の電極と離間したとき、前記補強板が所定の厚さより厚いと判断するステップと、を含む検出方法である。
The detection method of the present invention is a detection method for detecting whether the thickness of the reinforcing plate is appropriate by contacting a sensor with the flexible circuit board with the reinforcing plate;
The reinforcing fitted with flexible circuit board includes a flexible circuit board, and a said reinforcing plate is adhered on at least one surface of the flexible circuit board, wherein the reinforcing plate, one side is attached to the flexible circuit board The reinforcing plate is provided with at least one first through-hole, and the flexible circuit board is provided with a second through-hole corresponding to the first through-hole, and the sensor is across the reinforcing fitted with flexible circuit board, comprising a first electrode and a second electrode respectively disposed on the one surface and the other surface side of the reinforcement fitted with flexible circuit board, said first electrode has a diameter larger proximal end portion than the first through-hole, provided on one surface of the proximal end, or one prior Symbol insertable rod-like body into the through hole, and
A step of abutting the other surface opposite to the said while inserting the rod-like body inside the first through-hole and the second through hole, one side of the base end portion, a surface of the reinforcing plate, When the rod-shaped body comes into contact with the second electrode, the reinforcing plate is determined to have a predetermined thickness, and when the rod-shaped body is separated from the second electrode, the reinforcing plate has a predetermined thickness. determining that thick, the detection method comprising.
また、本発明の検出システムは、補強板付フレキシブル回路板に、センサーを当接して、前記補強板の厚さが適切であるかを検出する検出システムであって;
前記補強板付フレキシブル回路板は、導体パッドを有するフレキシブル回路板と、前記導体パッドを覆うように、一面が前記フレキシブル回路板に貼着された前記補強板と、を備え、前記補強板には貫通孔が少なくとも一つ設けられ、前記貫通孔を通して前記導体パッドが露出した形状を有し、前記センサーは、電極を備え、前記電極は、前記貫通孔よりも径が大きい基端部と、前記基端部の一面に設けられ、かつ前記貫通孔に挿入可能な棒状体と、を有し、
前記棒状体は、前記棒状体を前記貫通孔の内部に挿入しつつ、前記基端部の一面を前記補強板の一面とは反対の他面に当接させた状態において、前記補強板が所定の厚さであるときに前記導体パッドに接触し、前記補強板が所定の厚さより厚いときに前記導体パッドと離間する長さを有しており、前記センサーには、前記棒状体が前記導体パッドに接触したときに接触したことを報知する報知部が設けられ、前記フレキシブル回路板に貼着された前記補強板が所定の厚さであるかどうかを検出する検出システムである。
The detection system of the present invention is a detection system for detecting whether the thickness of the reinforcing plate is appropriate by contacting a sensor with the flexible circuit board with the reinforcing plate;
The flexible circuit board with a reinforcing plate includes: a flexible circuit board having a conductor pad; and the reinforcing board having one surface attached to the flexible circuit board so as to cover the conductor pad, and the reinforcing plate penetrates the flexible circuit board. At least one hole is provided, and the conductor pad is exposed through the through hole. The sensor includes an electrode, and the electrode includes a base end having a diameter larger than the through hole, and the base. provided on one surface of the end, and have a, a rod-like body which can be inserted into the through hole,
The rod-shaped body, while inserting the rod-like body inside the through-hole, in a state of being abutted against the other surface opposite to the one surface of the reinforcing plate one surface of said proximal portion, said reinforcing plate is predetermined of contact before Symbol conductor pads when the thickness has a length that the reinforcing plate is separated from the previous SL conductor pads when thicker than the predetermined thickness, the sensor, the rod-shaped body said notification unit is provided to notify that in contact when in contact with the conductor pad, wherein the reinforcing plate is adhered to the flexible circuit board is a detection system for detecting whether a predetermined thickness.
また、本発明の検出システムは、補強板付フレキシブル回路板に、センサーを当接して、前記補強板の厚さが適切であるかを検出する検出システムであって;
前記補強板付フレキシブル回路板は、フレキシブル回路板と、前記フレキシブル回路板の少なくとも一方の面に貼着された前記補強板と、を備え、前記補強板は、一面が前記フレキシブル回路板に貼着されており、前記補強板には少なくとも一つの第一の貫通孔が設けられるとともに、前記フレキシブル回路板には、前記第一の貫通孔に対応するように第二の貫通孔が設けられ、前記センサーは、前記補強板付フレキシブル回路板を挟んで、前記補強板付フレキシブル回路板の一方の面側と他方の面側とにそれぞれ配置される第一の電極と第二の電極を備え、前記第一の電極は、前記第一の貫通孔よりも径が大きい基端部と、前記基端部の一面に設けられ、かつ前記貫通孔に挿入可能な棒状体と、を有し、
前記棒状体は、前記棒状体を前記第一の貫通孔および前記第二の貫通孔の内部に挿入しつつ、前記基端部の一面を前記補強板の一面とは反対の他面に当接させた状態において、前記補強板が所定の厚さであるときに前記第二の電極に接触し、前記補強板が所定の厚さより厚いときに前記第二の電極と離間する長さを有しており、前記センサーには、前記棒状体が前記第二の電極に接触したときに接触したことを報知する報知部が設けられ、前記フレキシブル回路板に貼着された前記補強板が所定の厚さであるかどうかを検出する検出システムである。
The detection system of the present invention is a detection system for detecting whether the thickness of the reinforcing plate is appropriate by contacting a sensor with the flexible circuit board with the reinforcing plate;
The reinforcing fitted with flexible circuit board includes a flexible circuit board, and a said reinforcing plate is adhered on at least one surface of the flexible circuit board, wherein the reinforcing plate, one side is attached to the flexible circuit board The reinforcing plate is provided with at least one first through-hole, and the flexible circuit board is provided with a second through-hole corresponding to the first through-hole, and the sensor is across the reinforcing fitted with flexible circuit board, comprising a first electrode and a second electrode respectively disposed on the one surface and the other surface side of the reinforcement fitted with flexible circuit board, said first electrode has a diameter larger proximal end portion than the first through-hole, provided on one surface of the proximal end, or one prior Symbol insertable rod-like body into the through hole, and
The rod-shaped body, while inserting the rod-like body inside the first through-hole and the second through-hole, abuts on the other surface opposite to the one surface of the reinforcing plate one side of the base end portion in a state of being, the length the reinforcing plate is in contact with the second electrode before SL when a predetermined thickness, the reinforcing plate is to be separated from the previous SL second electrode when thicker than the predetermined thickness has, on the sensor, the rod-shaped body notification unit is provided to notify that in contact when in contact with said second electrode, said reinforcing plate is adhered to the flexible circuit board is given It is a detection system which detects whether it is the thickness of.
本発明においては、補強板付フレキシブル回路板に貼着された補強板が所定の厚さかどうかを検出することができる。これにより、所定より厚い補強板が貼着されたフレキシブル回路板を迅速かつ確実に検出することがでる。 In the present invention, it is possible to detect whether or not the reinforcing plate attached to the flexible circuit board with the reinforcing plate has a predetermined thickness. As a result, it is possible to quickly and reliably detect the flexible circuit board to which the reinforcing plate thicker than the predetermined thickness is attached.
本発明によれば、補強板付フレキシブル回路板の補強板が所定の厚さであるかどうかを迅速かつ確実にチェックできる検出方法および検出システムを提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the detection method and detection system which can check quickly and reliably whether the reinforcement board of a flexible circuit board with a reinforcement board is predetermined thickness can be provided.
以下、本発明の実施の形態について、図面を用いて説明する。なお、図面の説明においては、同一要素には同一符号を付し、重複する説明を省略する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the description of the drawings, the same reference numerals are assigned to the same elements, and duplicate descriptions are omitted.
図1は、本発明による検出方法の第一の実施形態を示す断面図であり、図1(a)は、補強板の厚さが適切である場合を、図1(b)は、補強板の厚さが適切でない場合を示す図である。補強板付フレキシブル回路板120に、センサー300を当接して、補強板200の厚さが適切であるかを検出する検出方法である。 FIG. 1 is a cross-sectional view showing a first embodiment of a detection method according to the present invention. FIG. 1 (a) shows a case where the thickness of the reinforcing plate is appropriate, and FIG. 1 (b) shows a reinforcing plate. It is a figure which shows the case where the thickness of is not appropriate. In this detection method, the sensor 300 is brought into contact with the flexible circuit board 120 with the reinforcing plate to detect whether the thickness of the reinforcing plate 200 is appropriate.
補強板付フレキシブル回路板120は、導体パッド132を有するフレキシブル回路板100と、導体パッド132を覆うように貼着された補強板200とを備え、補強板200には貫通孔202が少なくとも一つ設けられ、貫通孔202を通して導体パッド132が露出した形状を有している。 The flexible circuit board 120 with the reinforcing plate includes the flexible circuit board 100 having the conductive pads 132 and the reinforcing plate 200 attached so as to cover the conductive pads 132, and the reinforcing plate 200 is provided with at least one through hole 202. The conductive pad 132 is exposed through the through hole 202.
センサー300は、進退自在に形成され、かつ、先端側は、貫通孔202に挿入可能な棒状体323を備える電極303を有している。 The sensor 300 is formed so as to be able to advance and retreat, and has an electrode 303 provided with a rod-like body 323 that can be inserted into the through hole 202 on the distal end side.
棒状体323を、貫通孔202の内部に挿入しつつ、棒状体323の基端側327を補強板面に当接させるステップと、補強板200が所定の厚さであるとき、電極303の先端部3231が導体パッド132に接触し、補強板200が所定の厚さより厚いとき、電極303の先端部3231は導体パッド132と離間しているかどうかを検出するステップと、を有することにより、貼着された補強板200が所定の厚さであるかどうかを検出する検出方法である。 Inserting the rod-shaped body 323 into the through-hole 202 and bringing the proximal end 327 of the rod-shaped body 323 into contact with the reinforcing plate surface; and when the reinforcing plate 200 has a predetermined thickness, the tip of the electrode 303 A step of detecting whether or not the tip 3231 of the electrode 303 is separated from the conductor pad 132 when the portion 3231 contacts the conductor pad 132 and the reinforcing plate 200 is thicker than a predetermined thickness. This is a detection method for detecting whether or not the reinforced reinforcing plate 200 has a predetermined thickness.
以下、補強板付フレキシブル回路板120を構成する各部について説明する。 Hereinafter, each part which comprises the flexible circuit board 120 with a reinforcement board is demonstrated.
補強板付フレキシブル回路板120は、補強板200とフレキシブル回路板100とから構成されている。補強板200としては、特に限定されるものではないが、例えば、ポリイミド樹脂フィルム、ポリエーテルイミド樹脂フィルム、ポリアミドイミド樹脂フィルム等のポリイミド樹脂系樹脂フィルム、ポリアミド樹脂フィルム等のポリアミド樹脂系フィルム、ポリエステル樹脂フィルム等のポリエステル樹脂系フィルムなどの樹脂フィルムが挙げられる。また、ガラス織布、ガラス不織布などにエポキシ系樹脂を含浸硬化させたガラスエポキシ基板や、紙基材に、エポキシ樹脂やフェノール樹脂などを含浸硬化させた紙エポキシ基板や紙フェノール基板などを用いることもできる。補強板200の厚さは、特に限定はされないが、0.025mm〜1.6mmが好ましく用いられる。 The flexible circuit board 120 with the reinforcing plate is composed of the reinforcing plate 200 and the flexible circuit board 100. The reinforcing plate 200 is not particularly limited. For example, a polyimide resin film such as a polyimide resin film, a polyetherimide resin film, a polyamideimide resin film, a polyamide resin film such as a polyamide resin film, a polyester, etc. A resin film such as a polyester resin film such as a resin film may be used. Also, use glass epoxy substrates impregnated and cured with epoxy resin in glass woven fabric, glass nonwoven fabric, etc., and paper epoxy substrates and paper phenol substrates in which epoxy resin or phenol resin is impregnated and cured for paper base materials. You can also. The thickness of the reinforcing plate 200 is not particularly limited, but 0.025 mm to 1.6 mm is preferably used.
フレキシブル回路板100は、基材150と、基材150の面に導体回路130が形成されている。導体回路130のうち、検出に用いる導体パッド132は、導体回路130の一部を利用したものである。また、導体回路130と導体パッド132は、一部を残して表面被覆材で覆われている。 The flexible circuit board 100 has a base 150 and a conductor circuit 130 formed on the surface of the base 150. Of the conductor circuit 130, the conductor pad 132 used for detection uses a part of the conductor circuit 130. Further, the conductor circuit 130 and the conductor pad 132 are covered with a surface covering material, leaving a part.
基材150を構成する材料としては、例えば樹脂フィルム基材等が挙げられる。樹脂フィルム基材としては、例えばポリイミド樹脂フィルム、ポリエーテルイミド樹脂フィルム、ポリアミドイミド樹脂フィルム等のポリイミド樹脂系樹脂フィルム、ポリアミド樹脂フィルム等のポリアミド樹脂系フィルム、ポリエステル樹脂フィルム等のポリエステル樹脂系フィルムが挙げられる。このうち、弾性率と耐熱性を向上させる観点から、特にポリイミド樹脂系フィルムが好ましく用いられる。 Examples of the material constituting the substrate 150 include a resin film substrate. Examples of the resin film substrate include polyimide resin films such as polyimide resin films, polyetherimide resin films, polyamideimide resin films, polyamide resin films such as polyamide resin films, and polyester resin films such as polyester resin films. Can be mentioned. Of these, a polyimide resin film is particularly preferably used from the viewpoint of improving the elastic modulus and heat resistance.
基材150の厚さは、特に限定されないが、5〜50μmが好ましく、特に12.5〜25
μmが好ましい。厚さがこの範囲内であると、特に屈曲性に優れる。
Although the thickness of the base material 150 is not specifically limited, 5-50 micrometers is preferable and especially 12.5-25.
μm is preferred. When the thickness is within this range, the flexibility is particularly excellent.
表面被覆材は、樹脂フィルム110と接着剤170で構成されたカバーレイフィルムでもよいし、熱硬化性樹脂を含む液状体の樹脂組成物をスクリーン印刷法などにより形成し加熱硬化してもよい。曲げ特性の面からカバーレイフィルムを用いることが好ましい。図1では、表面被覆材として、カバーレイフィルムを例示として挙げている。また、図示はしていないがフレキシブル回路板100と補強板200の間には接着層が設けられこの接着層を介して接着されている。 The surface covering material may be a cover lay film composed of the resin film 110 and the adhesive 170, or a liquid resin composition containing a thermosetting resin may be formed by screen printing or the like and cured by heating. It is preferable to use a coverlay film from the viewpoint of bending characteristics. In FIG. 1, a coverlay film is exemplified as the surface covering material. Further, although not shown, an adhesive layer is provided between the flexible circuit board 100 and the reinforcing board 200 and is bonded via this adhesive layer.
次に、センサー300を構成する各部について説明する。 Next, each part which comprises the sensor 300 is demonstrated.
センサー300は、進退自在に形成され、かつ、先端側は、貫通孔202に挿入可能な棒状体323を備える電極303を有している。センサー300は、一般にプリント回路板の導体回路間の断線、短絡の確認用に用いられる電気検査治具と特に変わることころはない。センサーの基端側327は、補強板200に設けられた貫通孔202よりも径が大きく、先端側は棒状体323になっており、基端側327が、補強板200と当接した状態で、補強板200が所定の厚さの時は先端部3231が導体パッド132と接触し、補強板200が所定の厚さより厚いときは接触しないような長さになっている。また、棒状体323の基端側には弾性体325が設けられ、一定の圧力で導体パッド132と接触することによりより確実に導通確認ができるようにしてもよい。弾性体としては、特に限定はされないが、バネやゴムなど反復使用可能な部材を使用することが好ましい。 The sensor 300 is formed so as to be able to advance and retreat, and has an electrode 303 provided with a rod-like body 323 that can be inserted into the through hole 202 on the distal end side. The sensor 300 is not particularly different from an electric inspection jig generally used for confirming disconnection or short circuit between conductor circuits of a printed circuit board. The base end side 327 of the sensor is larger in diameter than the through hole 202 provided in the reinforcing plate 200, the tip end side is a rod-shaped body 323, and the base end side 327 is in contact with the reinforcing plate 200. When the reinforcing plate 200 has a predetermined thickness, the distal end portion 3231 is in contact with the conductor pad 132, and when the reinforcing plate 200 is thicker than the predetermined thickness, the length is such that it does not contact. Further, an elastic body 325 may be provided on the base end side of the rod-shaped body 323 so that the conduction can be confirmed more reliably by contacting the conductor pad 132 with a constant pressure. The elastic body is not particularly limited, but it is preferable to use a reusable member such as a spring or rubber.
また、電極303も基端側327が膨らんだ形状でなく、電極303が装着されている治具板が補強板200と当接するように棒状体323の長さを調整してもよい。治具板を補強板200と当接するようにすることで、基端側327の径が大きい電極303を用いなくとも済むという効果がある。電極303には、電線310が接続してあり、検出器によって電気的な接続を確認できるようになっている。また、棒状体323の先端部3231は、特に限定はされないが、針状になっていることが好ましい。 Further, the length of the rod-shaped body 323 may be adjusted so that the base plate 327 is not swelled in the electrode 303 and the jig plate on which the electrode 303 is mounted comes into contact with the reinforcing plate 200. By bringing the jig plate into contact with the reinforcing plate 200, there is an effect that it is not necessary to use the electrode 303 having a large diameter on the base end side 327. An electric wire 310 is connected to the electrode 303 so that the electrical connection can be confirmed by a detector. Further, the distal end portion 3231 of the rod-shaped body 323 is not particularly limited, but preferably has a needle shape.
次に、検出する方法について説明する。 Next, a detection method will be described.
検出方法は、以下の2つのステップに分けることができる。 The detection method can be divided into the following two steps.
第一のステップは、棒状体323を、貫通孔202の内部に挿入しつつ、棒状体323の基端側327を補強板200面に当接させるステップである。 The first step is a step of bringing the proximal end 327 of the rod-shaped body 323 into contact with the reinforcing plate 200 surface while inserting the rod-shaped body 323 into the through hole 202.
第二のステップは、棒状体323の基端側327を補強板200面に当接させたとき、補強板200が所定の厚さであるとき、電極303の先端部3231が導体パッド132に接触し、接触したことを報知する。例えば、補強板200が所定の厚さより厚いとき、電極303の先端部3231と導体パッド132は離間したままとなり報知することがない。 In the second step, when the proximal end 327 of the rod-shaped body 323 is brought into contact with the surface of the reinforcing plate 200, the distal end portion 3231 of the electrode 303 contacts the conductor pad 132 when the reinforcing plate 200 has a predetermined thickness. Then, the contact is notified. For example, when the reinforcing plate 200 is thicker than a predetermined thickness, the tip end portion 3231 of the electrode 303 and the conductor pad 132 remain separated from each other and no notification is given.
図2は、本発明による検出方法の他の実施形態を示す断面図であり、図2(a)は、補強板の厚さが適切である場合を、図2(b)は、補強板の厚さが適切でない場合を示す図である。。この場合の検出方法は、上述の実施形態とは異なり、フレキシブル回路板100に設けられた導体パッド132とセンサー300を当接して、補強板200の厚さが適切であるかを検出するのではなく、フレキシブル回路板100と補強板200とを貫通する貫通孔102、202と対向するように検出部分が設けられている。 FIG. 2 is a cross-sectional view showing another embodiment of the detection method according to the present invention. FIG. 2A shows a case where the thickness of the reinforcing plate is appropriate, and FIG. It is a figure which shows the case where thickness is not appropriate. . Unlike the above-described embodiment, the detection method in this case is to contact the conductor pads 132 provided on the flexible circuit board 100 and the sensor 300 to detect whether the thickness of the reinforcing plate 200 is appropriate. The detection portion is provided so as to face the through holes 102 and 202 that penetrate the flexible circuit board 100 and the reinforcing plate 200.
フレキシブル回路板100と、フレキシブル回路板100の少なくとも一方の面側に補強板200とを貼着してなり、補強板200には少なくとも一つの第一の貫通孔202が設けられるとともに、フレキシブル回路板100には、第一の貫通孔202に対応するように第二の貫通孔102が設けられている。 The flexible circuit board 100 and a reinforcing board 200 are attached to at least one surface side of the flexible circuit board 100. The reinforcing board 200 is provided with at least one first through hole 202, and the flexible circuit board. A second through hole 102 is provided in 100 so as to correspond to the first through hole 202.
センサー300は、補強板付フレキシブル回路板120を挟んで、一方の面と他方の面とに第一と第二の電極303、321が設けられ、第一の電極303は、進退自在に形成され、かつ、先端側は、貫通孔102、202を挿入可能な棒状体323を有し、第一の電極303が、第一および第二の貫通孔102、202の内部に挿入しつつ、棒状体323の基端側327を補強板面に当接させるステップと、補強板200が所定の厚さであるとき、棒状体323の先端部3231が第二の電極321に接触し、補強板200が所定の厚さより厚いとき、棒状体323の先端部3231は第二の電極321と離間しているかどうかを検出するステップと、を有することにより、貼着された補強板200が所定の厚さであるかどうかを検出する検出方法である。 The sensor 300 is provided with first and second electrodes 303 and 321 on one side and the other side of the flexible circuit board 120 with a reinforcing plate, and the first electrode 303 is formed so as to freely advance and retract. In addition, the distal end side has a rod-like body 323 into which the through holes 102 and 202 can be inserted. The rod-like body 323 is inserted while the first electrode 303 is inserted into the first and second through holes 102 and 202. When the reinforcing plate 200 has a predetermined thickness, the distal end portion 3231 of the rod-shaped body 323 contacts the second electrode 321 and the reinforcing plate 200 is predetermined. And detecting whether the tip 3231 of the rod-shaped body 323 is separated from the second electrode 321 when the thickness of the reinforcing plate 200 is larger than the thickness of the sticking reinforcing plate 200 having a predetermined thickness. Detect if It is out method.
以下、補強板付フレキシブル回路板120を構成する各部について説明する。 Hereinafter, each part which comprises the flexible circuit board 120 with a reinforcement board is demonstrated.
補強板付フレキシブル回路板120は、補強板200とフレキシブル回路板100とから構成されている。補強板200としては、特に限定されるものではないが、例えば、ポリイミド樹脂フィルム、ポリエーテルイミド樹脂フィルム、ポリアミドイミド樹脂フィルム等のポリイミド樹脂系樹脂フィルム、ポリアミド樹脂フィルム等のポリアミド樹脂系フィルム、ポリエステル樹脂フィルム等のポリエステル樹脂系フィルムなどの樹脂フィルムが挙げられる。また、ガラス織布、ガラス不織布などにエポキシ系樹脂を含浸硬化させたガラスエポキシ基板や、紙基材に、エポキシ樹脂やフェノール樹脂などを含浸硬化させた紙エポキシ基板や紙フェノール基板などを用いることもできる。補強板200の厚さは、特に限定はされないが、0.025mm〜1.6mmが好ましく用いられる。 The flexible circuit board 120 with the reinforcing plate is composed of the reinforcing plate 200 and the flexible circuit board 100. The reinforcing plate 200 is not particularly limited. For example, a polyimide resin film such as a polyimide resin film, a polyetherimide resin film, a polyamideimide resin film, a polyamide resin film such as a polyamide resin film, a polyester, etc. A resin film such as a polyester resin film such as a resin film may be used. Also, use glass epoxy substrates impregnated and cured with epoxy resin in glass woven fabric, glass nonwoven fabric, etc., and paper epoxy substrates and paper phenol substrates in which epoxy resin or phenol resin is impregnated and cured for paper base materials. You can also. The thickness of the reinforcing plate 200 is not particularly limited, but 0.025 mm to 1.6 mm is preferably used.
次に、センサー300を構成する各部について説明する。 Next, each part which comprises the sensor 300 is demonstrated.
センサー300は、固定されている第二の電極321と、進退自在に形成され、かつ、先端側は、貫通孔102、202に挿入可能な棒状体323を備える第二の電極303を有している。センサー300は、一般にプリント回路板の導体回路間の断線、短絡の確認用に用いられる電気検査治具と特に変わることころはない。センサーの基端側327は、補強板200およびフレキシブル回路板100に設けられた貫通孔202よりも径が大きく、先端側は棒状体323になっており、基端側327が、補強板200と当接した状態で、補強板200が所定の厚さの時は棒状体3231が導体パッド132と接触し、補強板200が所定の厚さより厚いときは接触しないような長さになっている。また、棒状体323の基端側には弾性体325が設けられ、一定の圧力で第二の電極321と接触することによりより確実に導通確認ができるようにしてもよい。弾性体としては、特に限定はされないが、バネやゴムなど反復使用可能な部材を使用することが好ましい。 The sensor 300 includes a second electrode 321 that is fixed, and a second electrode 303 that is formed so as to be able to advance and retreat, and has a rod-like body 323 that can be inserted into the through holes 102 and 202 on the distal end side. Yes. The sensor 300 is not particularly different from an electric inspection jig generally used for confirming disconnection or short circuit between conductor circuits of a printed circuit board. The base end side 327 of the sensor is larger in diameter than the through hole 202 provided in the reinforcing plate 200 and the flexible circuit board 100, the tip end side is a rod-shaped body 323, and the base end side 327 is connected to the reinforcing plate 200. When the reinforcing plate 200 has a predetermined thickness in the abutting state, the rod-shaped body 3231 is in contact with the conductor pad 132, and when the reinforcing plate 200 is thicker than the predetermined thickness, the length is such that it does not contact. Further, an elastic body 325 may be provided on the base end side of the rod-shaped body 323 so that the conduction can be confirmed more reliably by contacting the second electrode 321 with a constant pressure. The elastic body is not particularly limited, but it is preferable to use a reusable member such as a spring or rubber.
また、第一の電極303も基端側327が膨らんだ形状でなく、電極303が装着されている治具板が補強板200と当接するように棒状体323の長さを調整してもよい。治具板を補強板200と当接するようにすることで、基端側327の径が大きい第一の電極303を用いなくとも済むという効果がある。第一および第二の電極303、321には、それぞれ電線310が接続し、検出器につながっており、検出器によって電気的な接続を確認できるようになっている。また、棒状体323の先端部3231は、特に限定はされないが、針状になっていることが好ましい。 Also, the length of the rod-shaped body 323 may be adjusted so that the first electrode 303 does not have a shape in which the proximal end side 327 swells, and the jig plate on which the electrode 303 is mounted contacts the reinforcing plate 200. . By bringing the jig plate into contact with the reinforcing plate 200, there is an effect that it is not necessary to use the first electrode 303 having a large diameter on the base end side 327. An electric wire 310 is connected to each of the first and second electrodes 303 and 321 and is connected to a detector so that the electrical connection can be confirmed by the detector. Further, the distal end portion 3231 of the rod-shaped body 323 is not particularly limited, but preferably has a needle shape.
次に、検出する方法について説明する。 Next, a detection method will be described.
検出方法は、以下の2つのステップに分けることができる。 The detection method can be divided into the following two steps.
第一のステップは、棒状体323を、貫通孔102、202の内部に挿入しつつ、棒状体323の基端側327を補強板200面に当接させるステップである。 The first step is a step of bringing the base end side 327 of the rod-shaped body 323 into contact with the reinforcing plate 200 surface while inserting the rod-shaped body 323 into the through holes 102 and 202.
第二のステップは、棒状体323の基端側327を補強板200面に当接させたとき、補強板200が所定の厚さであるとき、電極303の先端部が第二の電極321に接触し、接触したことを報知する。例えば、補強板200が所定の厚さより厚いとき、第一の電極303の先端部3231と第二の電極321は離間したままとなり報知することがない。 In the second step, when the proximal end 327 of the rod-shaped body 323 is brought into contact with the surface of the reinforcing plate 200, the distal end portion of the electrode 303 becomes the second electrode 321 when the reinforcing plate 200 has a predetermined thickness. It contacts and it notifies that it contacted. For example, when the reinforcing plate 200 is thicker than a predetermined thickness, the distal end portion 3231 of the first electrode 303 and the second electrode 321 remain separated from each other and no notification is given.
100 フレキシブル回路板
102 第二の貫通孔
110 樹脂フィルム
120 補強板付フレキシブル回路板
130 導体回路
132 導体パッド
150 基材
170 接着剤
202 貫通孔、第一の貫通孔
200 補強板
300 センサー
310 電線
303 電極、第一の電極
321 第二の電極
323 棒状体
3231 先端部
325 弾性体
327 基端側
DESCRIPTION OF SYMBOLS 100 Flexible circuit board 102 2nd through-hole 110 Resin film 120 Flexible circuit board 130 with a reinforcement board Conductor circuit 132 Conductor pad 150 Base material 170 Adhesive 202 Through-hole, 1st through-hole 200 Reinforcement board 300 Sensor 310 Electric wire 303 Electrode, First electrode 321 Second electrode 323 Bar-shaped body 3231 Tip portion 325 Elastic body 327 Base end side
Claims (7)
前記補強板付フレキシブル回路板は、
導体パッドを有するフレキシブル回路板と、
前記導体パッドを覆うように、一面が前記フレキシブル回路板に貼着された前記補強板と、を備え、
前記補強板には貫通孔が少なくとも一つ設けられ、
前記貫通孔を通して前記導体パッドが露出した形状を有し、
前記センサーは、電極を備え、
前記電極は、前記貫通孔よりも径が大きい基端部と、前記基端部の一面に設けられ、かつ前記貫通孔に挿入可能な棒状体と、を有し、
前記棒状体を前記貫通孔の内部に挿入しつつ、前記基端部の一面を、前記補強板の一面とは反対の他面に当接させるステップと、
前記棒状体が前記導体パッドと接触したとき、前記補強板が所定の厚さであると判断し、前記棒状体が前記導体パッドと離間したとき、前記補強板が所定の厚さより厚いと判断するステップと、を含む検出方法。 A detection method for detecting whether a thickness of the reinforcing plate is appropriate by contacting a sensor with a flexible circuit board with a reinforcing plate;
The flexible circuit board with the reinforcing plate is
A flexible circuit board having conductor pads;
The so as to cover the contact pads, comprising said reinforcing plate which one surface is adhered to the flexible circuit board, a
The reinforcing plate is provided with at least one through hole,
The conductor pad has a shape exposed through the through hole,
The sensor comprises an electrode;
The electrode has a proximal end diameter is larger than the through-hole, provided on one surface of the proximal end, or One before Symbol insertable rod-like body into the through hole, and
While inserting the rod-like body inside the front SL through hole, a step of contact with a surface of the base end portion, the other surface opposite to the one surface of the reinforcing plate,
When the rod-shaped body comes into contact with the conductor pad, the reinforcing plate is determined to have a predetermined thickness. When the rod-shaped body is separated from the conductor pad, the reinforcing plate is determined to be thicker than the predetermined thickness. And a detection method comprising:
前記補強板付フレキシブル回路板は、
フレキシブル回路板と、
前記フレキシブル回路板の少なくとも一方の面に貼着された前記補強板と、を備え、
前記補強板は、一面が前記フレキシブル回路板に貼着されており、
前記補強板には少なくとも一つの第一の貫通孔が設けられるとともに、
前記フレキシブル回路板には、前記第一の貫通孔に対応するように第二の貫通孔が設けられ、
前記センサーは、前記補強板付フレキシブル回路板を挟んで、前記補強板付フレキシブル回路板の一方の面側と他方の面側とにそれぞれ配置される第一の電極と第二の電極を備え、
前記第一の電極は、前記第一の貫通孔よりも径が大きい基端部と、前記基端部の一面に設けられ、かつ前記貫通孔に挿入可能な棒状体と、を有し、
前記棒状体を前記第一の貫通孔および前記第二の貫通孔の内部に挿入しつつ、前記基端部の一面を、前記補強板の一面とは反対の他面に当接させるステップと、
前記棒状体が前記第二の電極に接触したとき、前記補強板が所定の厚さであると判断し、前記棒状体が前記第二の電極と離間したとき、前記補強板が所定の厚さより厚いと判断するステップと、を含む検出方法。 A detection method for detecting whether a thickness of the reinforcing plate is appropriate by contacting a sensor with a flexible circuit board with a reinforcing plate;
The flexible circuit board with the reinforcing plate is
A flexible circuit board;
And a said reinforcing plate is adhered on at least one surface of the flexible circuit board,
One side of the reinforcing plate is attached to the flexible circuit board,
The reinforcing plate is provided with at least one first through hole,
The flexible circuit board is provided with a second through hole so as to correspond to the first through hole,
The sensor, across the reinforcing fitted with flexible circuit board, comprising a first electrode and a second electrode respectively disposed on the one surface and the other surface side of the reinforcement fitted with flexible circuit board,
Wherein the first electrode has a diameter larger proximal end portion than the first through-hole, provided on one surface of the proximal end, or One before Symbol insertable rod-like body into the through hole, the ,
A step of abutting the other surface opposite to the said while inserting the rod-like body inside the first through-hole and the second through hole, one side of the base end portion, a surface of the reinforcing plate,
When the rod-shaped body comes into contact with the second electrode, the reinforcing plate is determined to have a predetermined thickness, and when the rod-shaped body is separated from the second electrode, the reinforcing plate has a predetermined thickness. detection method comprising the steps of: determining a thick.
前記補強板付フレキシブル回路板は、
導体パッドを有するフレキシブル回路板と、
前記導体パッドを覆うように、一面が前記フレキシブル回路板に貼着された前記補強板と、を備え、
前記補強板には貫通孔が少なくとも一つ設けられ、
前記貫通孔を通して前記導体パッドが露出した形状を有し、
前記センサーは、電極を備え、
前記電極は、前記貫通孔よりも径が大きい基端部と、前記基端部の一面に設けられ、かつ前記貫通孔に挿入可能な棒状体と、を有し、
前記棒状体は、前記棒状体を前記貫通孔の内部に挿入しつつ、前記基端部の一面を前記補強板の一面とは反対の他面に当接させた状態において、前記補強板が所定の厚さであるときに前記導体パッドに接触し、前記補強板が所定の厚さより厚いときに前記導体パッドと離間する長さを有しており、
前記センサーには、前記棒状体が前記導体パッドに接触したときに接触したことを報知する報知部が設けられ、前記フレキシブル回路板に貼着された前記補強板が所定の厚さであるかどうかを検出する検出システム。 A detection system for detecting whether a thickness of the reinforcing plate is appropriate by contacting a sensor with a flexible circuit board with a reinforcing plate;
The flexible circuit board with the reinforcing plate is
A flexible circuit board having conductor pads;
The so as to cover the contact pads, comprising said reinforcing plate which one surface is adhered to the flexible circuit board, a
The reinforcing plate is provided with at least one through hole,
The conductor pad has a shape exposed through the through hole,
The sensor comprises an electrode;
The electrodes, possess a diameter larger proximal end portion than the through-hole, provided on one surface of said proximal portion, and a bar-shaped body which can be inserted into the through hole,
The rod-shaped body, while inserting the rod-like body inside the through-hole, in a state of being abutted against the other surface opposite to the one surface of the reinforcing plate one surface of said proximal portion, said reinforcing plate is predetermined of contact before Symbol conductor pads when the thickness has a length that the reinforcing plate is separated from the previous SL conductor pads when thicker than a predetermined thickness,
The sensor, the notification unit is provided for informing that said rod-like body is in contact when in contact with the conductor pad, wherein the reinforcing plate is adhered to the flexible circuit board is whether predetermined thickness Detecting system.
前記補強板付フレキシブル回路板は、
フレキシブル回路板と、
前記フレキシブル回路板の少なくとも一方の面に貼着された前記補強板と、を備え、
前記補強板は、一面が前記フレキシブル回路板に貼着されており、
前記補強板には少なくとも一つの第一の貫通孔が設けられるとともに、
前記フレキシブル回路板には、前記第一の貫通孔に対応するように第二の貫通孔が設けられ、
前記センサーは、前記補強板付フレキシブル回路板を挟んで、前記補強板付フレキシブル回路板の一方の面側と他方の面側とにそれぞれ配置される第一の電極と第二の電極を備え、
前記第一の電極は、前記第一の貫通孔よりも径が大きい基端部と、前記基端部の一面に設けられ、かつ前記貫通孔に挿入可能な棒状体と、を有し、
前記棒状体は、前記棒状体を前記第一の貫通孔および前記第二の貫通孔の内部に挿入しつつ、前記基端部の一面を前記補強板の一面とは反対の他面に当接させた状態において、前記補強板が所定の厚さであるときに前記第二の電極に接触し、前記補強板が所定の厚さより厚いときに前記第二の電極と離間する長さを有しており、
前記センサーには、前記棒状体が前記第二の電極に接触したときに接触したことを報知する報知部が設けられ、前記フレキシブル回路板に貼着された前記補強板が所定の厚さであるかどうかを検出する検出システム。 A detection system for detecting whether a thickness of the reinforcing plate is appropriate by contacting a sensor with a flexible circuit board with a reinforcing plate;
The flexible circuit board with the reinforcing plate is
A flexible circuit board;
And a said reinforcing plate is adhered on at least one surface of the flexible circuit board,
One side of the reinforcing plate is attached to the flexible circuit board,
The reinforcing plate is provided with at least one first through hole,
The flexible circuit board is provided with a second through hole so as to correspond to the first through hole,
The sensor, across the reinforcing fitted with flexible circuit board, comprising a first electrode and a second electrode respectively disposed on the one surface and the other surface side of the reinforcement fitted with flexible circuit board,
Wherein the first electrode has a diameter larger proximal end portion than the first through-hole, provided on one surface of the proximal end, or One before Symbol insertable rod-like body into the through hole, the ,
The rod-shaped body, while inserting the rod-like body inside the first through-hole and the second through-hole, abuts on the other surface opposite to the one surface of the reinforcing plate one side of the base end portion in a state of being, the length the reinforcing plate is in contact with the second electrode before SL when a predetermined thickness, the reinforcing plate is to be separated from the previous SL second electrode when thicker than the predetermined thickness Have
The sensor, the notification unit is provided for informing that said rod-like body is in contact when in contact with the second electrode, wherein the reinforcing plate is adhered to the flexible circuit board is at a predetermined thickness Detection system to detect whether or not.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007017692A JP5012048B2 (en) | 2007-01-29 | 2007-01-29 | Detection method and detection system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007017692A JP5012048B2 (en) | 2007-01-29 | 2007-01-29 | Detection method and detection system |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008186901A JP2008186901A (en) | 2008-08-14 |
JP5012048B2 true JP5012048B2 (en) | 2012-08-29 |
Family
ID=39729752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007017692A Active JP5012048B2 (en) | 2007-01-29 | 2007-01-29 | Detection method and detection system |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5012048B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5270401B2 (en) * | 2009-02-26 | 2013-08-21 | 株式会社フジクラ | Flexible printed circuit board |
KR101352526B1 (en) | 2012-11-13 | 2014-01-16 | 주식회사 서일에프에이씨스템 | Test apparatus for fpcb |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3248266B2 (en) * | 1992-11-05 | 2002-01-21 | ソニー株式会社 | Flexible circuit board |
JPH0921841A (en) * | 1995-07-07 | 1997-01-21 | Toyota Motor Corp | Method of inspecting soldering |
-
2007
- 2007-01-29 JP JP2007017692A patent/JP5012048B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2008186901A (en) | 2008-08-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10034370B2 (en) | Stretchable circuit board and method for manufacturing stretchable circuit board | |
KR101156751B1 (en) | Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board | |
US20080191174A1 (en) | Use Of Heat-Activated Adhesive For Manufacture And A Device So Manufactured | |
KR102545904B1 (en) | Electrical connector and its manufacturing method | |
KR102516925B1 (en) | Electrical connector and its manufacturing method | |
US10398024B2 (en) | Stretchable circuit board and method for manufacturing stretchable circuit board | |
JP2009200113A (en) | Shield wiring circuit board | |
KR20110126604A (en) | Capacitance-type input switch | |
TW200819024A (en) | Printed circuit board and method for manufacturing a solderless electrical connection | |
JP4351129B2 (en) | Printed circuit board | |
KR102325435B1 (en) | Method for bonding flexible sensor on fpcb, and fpcb bonded flexible sensor | |
JP5012048B2 (en) | Detection method and detection system | |
JP5184335B2 (en) | Printed wiring board, manufacturing method thereof, and connection method of printed wiring board | |
EP3430643B1 (en) | Component carrier with integrated strain gauge | |
KR20040023776A (en) | Contact sheet for inspecting an electric device and manufacturing method of the same | |
JPH08335759A (en) | Printed wiring board and its production | |
WO2021100825A1 (en) | Sheet connector, sheet set, electrical inspection device, and electrical inspection method | |
TWI412313B (en) | Multilayer printing wire board and method for producting the same | |
CN112449488A (en) | Circuit board and electronic equipment | |
KR20210064212A (en) | Flexible Printed Wiring Boards, Bonds, Pressure Sensors and Mass Flow Control Units | |
JP3348004B2 (en) | Multilayer wiring board and method of manufacturing the same | |
CN113966076B (en) | Flexible printed circuit board and method of manufacturing the same | |
WO2007057321A1 (en) | Method for producing an electric circuit on a flexible substrate | |
WO2014049721A1 (en) | Component-embedded substrate manufacturing method and component-embedded substrate manufactured with said method | |
JP2009141129A (en) | Flexible printed wiring board and method of manufacturing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090930 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110805 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110816 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20110930 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111014 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120508 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120521 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150615 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5012048 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |