JP5007532B2 - Optical transceiver - Google Patents

Description

  The present invention relates to an optical transceiver in which a rigid board for an optical module and a rigid board for an electric circuit are connected via a flexible board, and relates to an optical transceiver excellent in the effect of reducing unnecessary radiation.

  An optical transceiver is used to interface an optical transmission line with a communication device that performs electrical processing of the optical transmission signal. For this purpose, the optical transceiver includes an optical module and an electric circuit board. An optical module is an integrated module comprising an optical fiber coupled to an optical transmission line, a lens that collects light from the optical fiber, and an optical element that receives (or conversely transmits) the collected light. . The lead for guiding electricity from the optical element is generally provided so as to protrude from the end opposite to the end facing the optical transmission line (end for emitting light). On the other hand, the electric circuit board is installed near the lead in order to shorten the distance from the optical element.

  In order to connect a large number of optical transmission lines to a single communication device, it is necessary to centrally arrange optical transceivers. In response to this requirement, optical transceivers have narrow vertical and horizontal widths and are formed into a long casing in the depth direction. A module and an electric circuit board are accommodated side by side in the longitudinal direction. Of course, the electric circuit board accommodated in such an elongated casing is also elongated, and if the lead from the optical module is directly soldered to the end of the electric circuit board, stress is applied to the solder part, the lead, or the optical element. It is easy to hang and the optical axis of the optical module is likely to shift.

  Therefore, conventionally, as shown in FIG. 5, the optical module rigid board 102 for soldering the leads of the optical module 101 and the electric circuit rigid board 103 on which the electric circuit is mounted are separately formed, Rigid substrates 102 and 103 are connected by a flexible substrate 104. A signal line conductor pattern that connects the optical module 101 and the electric circuit rigid substrate 103 is formed on the flexible substrate 104.

  By connecting both the rigid substrates 102 and 103 with the flexible substrate 104 in this way, the flexible substrate 104 is deformed even if different forces are applied to or displaced from one rigid substrate 102 and the other rigid substrate 103. Thus, stress can be absorbed, and lead distortion and optical axis misalignment can be reduced.

  In the illustrated example, the electric circuit rigid board 103 is attached to a housing (not shown) in a posture substantially parallel to the optical axis of the optical module 101, and the optical module rigid board 102 is attached to the optical axis of the optical module 101. Is attached to the optical module 101 at a right angle with respect to the flexible substrate 104, the flexible substrate 104 is bent at a predetermined bend radius when the extended surfaces of the two rigid substrates 102 and 103 intersect, and is bent at a right angle when viewed largely. It has been.

JP-A-8-136765

  By the way, in the optical transceiver that performs high-speed transmission (for example, Gbps), the frequency of the electric signal flowing between the optical module and the electric circuit becomes high. That is, a high-frequency signal flows through the signal line conductor pattern formed on the flexible substrate. For this reason, in addition to unwanted radiation from the electric circuit, unwanted radiation from the flexible substrate becomes a problem.

  Among the flexible substrates, the conductor pattern is bent at the bent portion, so that an antenna for unnecessary radiation can be easily formed. Further, since the signal for driving the optical module for light transmission has a relatively large energy, the radiation energy of electromagnetic noise is also large. On the other hand, since the received signal flowing through the light receiving optical module is very small and greatly amplified in the electric circuit, the influence of electromagnetic noise arriving at the light receiving optical module is serious.

  In general, as a countermeasure against unnecessary radiation of optical transceivers, the housing is made of a conductor to provide electromagnetic shielding. However, an optical connector of the optical transmission path is inserted into the housing in front of the optical module in the optical axis direction. Therefore, the electromagnetic shielding effect is weak only at that location.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an optical transceiver that solves the above-described problems and has an excellent effect of reducing unnecessary radiation.

In order to achieve the above object, the present invention provides a light transmitting optical module and a light receiving optical module which are accommodated in a casing with their optical axes parallel to each other, and the light transmitting light in a posture perpendicular to the optical axis. A rigid substrate for a light transmitting optical module attached to the optical module for light transmission, a rigid substrate for a light receiving optical module attached to the light receiving optical module in a posture perpendicular to the optical axis, and the optical axis An electric circuit board attached to the housing in a substantially parallel posture, between the rigid module for the optical module for light transmission and the electric circuit board, and for the optical module for the light receiving module and the electric circuit board A flexible printed circuit board for connecting between the two, wherein the flexible printed circuit board is formed on a surface close to the light transmitting optical module and the light receiving optical module on a substantially entire surface. The optical module for light transmission and the electric circuit board, and the optical module for light reception and the electric circuit board, which are formed on a surface far from the optical module for light transmission and the optical module for light reception, are connected. A signal line conductor pattern, and the light transmitting optical module rigid substrate is located behind the light receiving optical module rigid substrate in the optical axis direction, and is disposed on the light transmitting optical module of the flexible substrate. The ground conductor pattern on the near surface is located behind the ground conductor pattern on the surface of the flexible substrate near the light receiving optical module in the optical axis direction, and the rigid substrate for the light transmitting optical module and the above The flexible substrate is laminated, and the lead of the optical module for light transmission penetrates the rigid substrate for the optical module for optical transmission and the flexible substrate, and the optical module for light reception. The rigid substrate for the module and the flexible substrate are laminated, and the leads of the light receiving optical module pass through the rigid substrate for the light receiving optical module and the flexible substrate, and the light transmitting optical module and the light receiving optical module are This is an optical transceiver positioned in front of the ground conductor pattern in the optical axis direction .

  The present invention exhibits the following excellent effects.

  (1) Excellent in reducing unnecessary radiation.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  As shown in FIG. 1, the optical transceiver according to the present invention does not emit the light of the optical module 1 in a posture perpendicular to the optical axis C of the optical module 1 accommodated in a housing (not shown). An optical module rigid board 2 which is a first electric circuit board attached to the end face, and a bottom of the housing (not shown) in a posture substantially parallel to the optical axis C behind the light emitting direction of the optical module 1. The optical circuit rigid board 3 which is the second electric circuit board attached to the optical module 1 is connected to the optical module 1 of the flexible board 4 in an optical transceiver in which the flexible board 4 is bent. A conductor pattern 5 for ground is formed on the near surface A, and a conductor pattern for signal lines connecting the optical module 1 and the rigid circuit board 3 for electric circuit to the surface B far from the optical module 1 of the flexible substrate 4. It is obtained by forming a down (not shown).

  In order to connect the optical module rigid substrate 2 or the electric circuit rigid substrate 3 to the flexible substrate 4, backing substrates 6 and 7 each made of a rigid substrate are provided. The lead 8 of the optical module 1 passes through the backing substrate 6, the optical module rigid substrate 2, and the flexible substrate 4, and exits rearward in the light emitting direction.

  The ground conductor pattern 5 is a so-called solid ground covering the entire surface of the flexible substrate 4, preferably the entire surface of one surface. Therefore, the conductor pattern 5 continues from the surface A facing the optical module 1 to the surface facing the radially outward direction of the optical axis C through the bent portion. The conductor pattern 5 is formed on a surface of the flexible substrate 4 that is at least perpendicular to the optical axis C of the optical module 1.

  The optical module 1 is provided as an optical subassembly (OSA) integrated with a cylindrical receptacle. The housing is formed with an inlet (located on the left side in the drawing) into which the optical connector of the optical transmission path is inserted so that the optical axis of the OSA is aligned. An electric circuit rigid board 3 on which an electric circuit for driving or amplifying an electric signal of the optical module 1 is mounted is accommodated on the opposite side (right side in the drawing) of the housing.

  With this structure, electromagnetic noise radiated from the signal line conductor pattern of the flexible substrate 4 is shielded by the conductor pattern 5. Since the signal line conductor pattern is formed on the surface B of the flexible substrate 4 and the ground conductor pattern 5 is formed on the surface A, the surface A is shielded. Therefore, the unnecessary radiation received from the surface B and the electric circuit rigid board 3 is reduced in the optical module 1.

  Further, since the shielding is performed on the surface A, unnecessary radiation leaking to the outside of the housing via the entrance of the optical connector is reduced.

  In the next embodiment, as shown in FIG. 2, the optical transceiver includes a light transmitting optical module 21 and a light receiving optical module 22.

  The light transmitting optical module 21 and the light receiving optical module 22 are accommodated in a casing (not shown) with their optical axes C1 and C2 parallel to each other, and the light transmitting light attached to the light transmitting optical module 21 The module rigid board 23 is positioned behind the light receiving optical module rigid board 24 attached to the light receiving optical module 22, and the flexible board 25 includes the light transmitting optical module rigid board 23 and the light receiving light. By being connected to each of the module rigid boards 24, the ground conductor pattern 26 on the plane A1 of the flexible board 25 near the light transmitting optical module 21 is on the plane A2 of the flexible board 25 near the light receiving optical module 22. Located behind the ground conductor pattern 27 in the optical axis direction.

  According to this configuration, electromagnetic noise due to a signal for driving the light transmission optical module 21 is shielded by the conductor pattern 26. Further, the electromagnetic noise that is emitted from the light transmitting optical module 21 and the electric circuit rigid board (not shown) and arrives at the light receiving optical module 22 is shielded by the conductor pattern 27.

  In the optical transceiver shown in FIGS. 3 and 4, a ground conductor pattern is formed on the surface of the flexible substrate 35 close to the optical modules 31 and 32. The light transmitting optical module 31 and the light receiving optical module 32 are accommodated in a casing (not shown) with their optical axes C1 and C2 parallel to each other, and the light transmitting light attached to the light transmitting optical module 31 The module rigid board 33 is located behind the light receiving optical module rigid board 34 attached to the light receiving optical module 32 in the optical axis direction, and the flexible board 35 includes the light transmitting optical module rigid board 33 and the light receiving light. By being connected to each of the module rigid boards 34, the ground conductor pattern on the surface A1 of the flexible board 35 near the light transmitting optical module 31 is grounded on the face A2 of the flexible board 35 near the light receiving optical module 32. It is located behind the conductor pattern for the optical axis direction.

  The electric circuit rigid board is divided into a front rigid board 36a and a rear rigid board 36b. This is because, for example, the board area that can be accommodated in a housing (not shown) is increased, and the position of the rear rigid board 36b is adapted to the standard of the interface between the optical transceiver and the communication device that accommodates the optical transceiver. This is performed to incline the rigid substrate 36a. The rigid boards 36a and 36b may be mounted with electrical components only on the surface D, or may be mounted on the front and back surfaces D and E.

  In the optical transceiver of FIGS. 3 and 4, the rigid substrate 33 for the light transmitting optical module, the rigid substrate 34 for the light receiving optical module, and the rigid substrates 36a and 36b are not shown, but the flexible substrate is composed of two rigid substrates. It is formed by sandwiching the substrate 35. At this time, a ground conductor pattern (solid ground) is also provided in the portion where the flexible substrate 35 is sandwiched.

It is a block diagram (side view) of the optical transceiver which shows one Embodiment of this invention. It is a block diagram (plan view) of an optical transceiver showing another embodiment of the present invention. It is a block diagram (perspective view) of the optical transceiver which shows other embodiment of this invention. It is a block diagram (side view) of the optical transceiver which shows other embodiment of this invention. It is a block diagram (perspective view) of the conventional optical transceiver.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical module 2 Rigid board | substrate for optical modules (1st electric circuit board)
3 Rigid board for electric circuit (second electric circuit board)
4 Flexible substrate 5 Conductor pattern

Claims (1)

A light-transmitting optical module and a light-receiving optical module that are housed in a casing with their optical axes parallel to each other;
A rigid substrate for a light transmitting optical module attached to the light transmitting optical module in a posture perpendicular to the optical axis;
A rigid substrate for a light receiving optical module attached to the light receiving optical module in a posture perpendicular to the optical axis;
An electric circuit board attached to the housing in a posture substantially parallel to the optical axis;
A flexible substrate connecting between the rigid substrate for the light transmitting optical module and the electric circuit substrate, and between the rigid substrate for the light receiving optical module and the electric circuit substrate;
With
The flexible substrate is formed on a surface far from the light transmitting optical module and the light receiving optical module, and a ground conductor pattern formed almost entirely on the surface close to the light transmitting optical module and the light receiving optical module. A conductor pattern for signal lines connecting between the light transmitting optical module and the electric circuit board and between the light receiving optical module and the electric circuit board;
With
The rigid substrate for the light transmitting optical module is located behind the rigid substrate for the light receiving optical module in the optical axis direction, and the conductor pattern for ground on the surface of the flexible substrate close to the light transmitting optical module is Located behind the ground conductor pattern on the surface of the flexible substrate close to the light receiving optical module, in the optical axis direction ,
The rigid substrate for the light transmitting optical module and the flexible substrate are laminated, and the lead of the light transmitting optical module penetrates the rigid substrate for the light transmitting optical module and the flexible substrate,
The light receiving optical module rigid substrate and the flexible substrate are laminated, and the light receiving optical module lead penetrates the light receiving optical module rigid substrate and the flexible substrate,
The optical transceiver, wherein the light transmitting optical module and the light receiving optical module are located in front of the ground conductor pattern in the optical axis direction .

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