JP5003735B2 - Electronic components - Google Patents

Description

  The present invention relates to an electronic component in which a chip-type component such as a multilayer capacitor is accommodated in a housing.

  Conventionally, a dielectric element body having first and second internal electrodes facing each other disposed therein, and first and second external electrodes disposed on an outer surface of the dielectric element body, The inner electrode is drawn out to the outer surface of the dielectric element body and connected to the first outer electrode, and the second inner electrode is drawn to the outer surface of the dielectric element body and connected to the second outer electrode. A multilayer capacitor constructed in this manner is known. The multilayer capacitor is mounted on the circuit board by connecting each external electrode of the multilayer capacitor and the circuit electrode on the circuit board by solder reflow or the like.

  In this case, the multilayer capacitor is directly mounted on the circuit board. Therefore, when a mechanical external force is applied to the circuit board and the circuit board is bent, the stress generated by the bending of the circuit board directly acts on the multilayer capacitor. Therefore, when the multilayer capacitor is directly mounted on the circuit board, a defect such as a crack may occur in the multilayer capacitor.

  Thus, an electronic component is known in which each external electrode of a multilayer capacitor is provided with an L-shaped lead terminal via a metal plate (see Patent Document 1 below). According to this electronic component, the multilayer capacitor is mounted on the circuit board via the lead terminal by connecting the lead terminal to the circuit board. Therefore, even when a mechanical external force is applied to the circuit board and the circuit board is bent, the stress generated by the bending of the circuit board is relieved by the lead terminals. As a result, defects such as cracks are less likely to occur in the multilayer capacitor.

JP 2000-306764 A

  However, in the electronic component described in Patent Document 1, the metal plate provided on the external electrode of the multilayer capacitor and the L-shaped lead terminal are connected by spot welding, bonding, or high-temperature solder. Therefore, although generation | occurrence | production of defects, such as a crack, can be suppressed, processes, such as spot welding, are needed for the connection of a lead terminal, and the cost has increased.

  Accordingly, an object of the present invention is to provide an electronic component that can be manufactured at a simple process and at a low cost while avoiding the occurrence of defects such as cracks in a chip-type component.

  An electronic component according to the present invention has a chip-type component having an element body, first and second external electrodes disposed on the element body, an accommodation space for accommodating the chip-type component, and is electrically insulative. A housing having a first lead terminal and a second lead terminal held by the housing. The first lead terminal is in contact with the first external electrode while one end is located in the accommodation space; The other end is located outside the housing, and the second lead terminal has one end located in the accommodation space and in contact with the second external electrode, and the other end is located outside the housing. The chip-type component located in the housing space is sandwiched between one end portion of the first lead terminal and one end portion of the second lead terminal, and a claw portion formed integrally with the housing. And the elasticity of one end of the first lead terminal and the elasticity of one end of the second lead terminal. And characterized by being pressed against the claw portion by.

  In the electronic component according to the present invention, the first external electrode of the chip-type component and one end of the first lead terminal are in contact with each other, and the second external electrode of the chip-type component and one end of the second lead terminal are in contact with each other. The part is in contact. Therefore, by connecting the other end portion of the first lead terminal and the other end portion of the second lead terminal to each circuit electrode of the circuit board, the chip-type component is connected to the circuit via the first and second lead terminals. Mounted on the board. Therefore, even when a mechanical external force is applied to the circuit board and the circuit board is bent, the stress generated by the bending of the circuit board is relieved by the lead terminals. As a result, defects such as cracks are less likely to occur in the chip-type component.

  In the electronic component according to the present invention, electrical connection is achieved by bringing the first external electrode of the chip-type component into contact with one end of the first lead terminal, and the second external of the chip-type component. Electrical connection is achieved by bringing the electrode and one end of the second lead terminal into contact with each other. Therefore, a process such as soldering or spot welding is not required when connecting the first external electrode and the first lead terminal and connecting the second external electrode and the second lead terminal. As a result, the process becomes simple and the electronic component can be manufactured at low cost. In addition, when the connection between the first external electrode and the first lead terminal and the connection between the second external electrode and the second lead terminal are performed by soldering, spot welding, or the like, the chip-type component is caused by thermal shock. Although damage may occur, the electronic component according to the present invention does not require a process such as soldering or spot welding, so that the chip-type component is hardly damaged by thermal shock.

  Further, in the electronic component according to the present invention, the chip-type component located in the housing space includes one end portion of the first lead terminal and one end portion of the second lead terminal, and a claw portion formed integrally with the housing. And is pressed against the claw portion by the elastic force of one end portion of the first lead terminal and the elastic force of one end portion of the second lead terminal. For this reason, it is difficult for the chip-type component to be detached from the housing after the chip-type component is incorporated into the housing. In addition, since the chip-type component is held by the elastic force of the first and second lead terminals, it is possible to further reduce external impact and stress on the chip-type component.

  Preferably, the first lead terminal has a folded portion extending from one end portion. In this way, the first lead terminal can generate a larger elastic force by the folded portion of the first lead terminal. For this reason, it is possible to further alleviate external impact and stress on the chip-type component, and it is possible to improve the holding ability of the chip-type component by the first lead terminal.

  Preferably, the first lead terminal has a projecting portion projecting sideways, and a groove having a V-shaped cross section that is narrowed toward the bottom is formed in the housing. The first lead terminal is attached to the housing by the protruding portion of the first lead terminal entering the groove and being locked. In this way, the protrusion of the first lead terminal and the groove are firmly connected. Therefore, the first lead terminal can be securely held by the housing.

  Preferably, the first lead terminal has a protruding portion protruding toward the side, and the housing has a protruding portion receiving recess for receiving the protruding portion of the first lead terminal, The first lead terminal is attached to the housing by bending the protruding portion of the first lead terminal into the protruding portion receiving recess. In this way, the protruding portion of the first lead terminal is securely held in the protruding portion receiving recess. Therefore, the first lead terminal can be securely held by the housing. Moreover, since the protrusion part of the 1st lead terminal has entered into the protrusion part accommodating recessed part, the protrusion part does not protrude outside the housing | casing. Therefore, it is possible to reduce the size of the entire electronic component.

  Preferably, the element body includes a first side surface on which the first external electrode is disposed, a second side surface on which the second external electrode is disposed while facing the first side surface, and the first side surface. A third side surface connecting the second side surface, and one end portion of the first lead terminal is opposed to the first support portion facing the first side surface and the third side surface. And a second support portion. If it does in this way, chip type parts will be supported not only by the 1st support part which counters the 1st side but also by the 2nd support part which counters the 3rd side. For this reason, the first lead terminal can securely hold the chip-type component in the accommodation space.

  Preferably, the element body has a first side surface on which the first external electrode is disposed, and a part of one end portion of the first lead terminal protrudes toward the first side surface. It is bent. In this way, the protruding portion of the first lead terminal is pressed against the first external electrode. Therefore, contact failure between the first lead terminal and the first external electrode is prevented. As a result, it is possible to improve the connection reliability between the first lead terminal and the first external electrode.

  Preferably, the casing includes a first main surface including an opening communicating with the accommodation space, a second main surface facing the first main surface, the first main surface, and the second main surface. The first lead terminal has a portion that extends from the one end portion and is disposed on the side surface of the housing. In this case, the first lead terminal is soldered to the circuit electrode of the circuit board in a state where the second main surface of the casing is opposed to the circuit board, so that the casing among the first lead terminals. The solder also adheres to the portion arranged on the side surface of. Therefore, it is possible to visually confirm the solder fillet after the electronic component is mounted on the circuit board.

  Preferably, an engagement piece is provided on a side surface of the housing, and the first lead terminal has an engagement piece opening to be engaged with the engagement piece. If it does in this way, it will become possible to hold | maintain a 1st lead terminal in a housing | casing reliably by the engagement piece provided in the housing | casing.

  Preferably, the other end portion of the first lead terminal located outside the housing is bent along the outer surface of the housing. If it does in this way, it will become difficult to protrude the 1st lead terminal outside the case. Therefore, it is possible to reduce the size of the entire electronic component.

  More preferably, the housing has an end accommodating recess that accommodates the other end of the first lead terminal, and the first lead terminal is bent at the other end of the first lead terminal. It is attached to a housing | casing by entering in an edge part accommodating recessed part. If it does in this way, the other end part of the 1st lead terminal will be locked in an end part accommodation crevice. Therefore, the first lead terminal can be securely held by the housing. Moreover, since the other end part of the 1st lead terminal is accommodated in the edge part accommodating recessed part, it becomes difficult to protrude the 1st lead terminal to the outer side of a housing | casing. Therefore, it is possible to reduce the size of the entire electronic component.

  Preferably, the other end of the first lead terminal has an opening for mounting member or a notch for mounting member through which the first mounting member for mounting the first lead terminal to the circuit board is inserted. ing. If it does in this way, when connecting the 1st lead terminal to each circuit electrode of a circuit board, processes, such as soldering, become unnecessary. As a result, the process becomes simple and the electronic component can be manufactured at low cost. In addition, when the connection between the first lead terminal and the circuit electrode of the circuit board is performed by soldering or the like, the chip-type component may be damaged by thermal shock, but in the electronic component according to the present invention, the soldering is not performed. Therefore, there is almost no possibility that the chip-type component is damaged by thermal shock.

  An electronic component according to the present invention includes a first chip-type component having a first element body, and first and first and second external electrodes disposed on the first element body, A second chip-type component having a second element body, and second and 2-2 external electrodes disposed on the second element body; and an accommodating space for accommodating the chip-type component. And a first lead terminal to a fourth lead terminal held by the casing, and the first lead terminal has one end portion located in the accommodation space and the first external portion 1-1. The other end is located outside the housing, the second lead terminal is located in the accommodation space and is in contact with the 1-2 external electrode, The other end is located outside the housing, and the third lead terminal is in contact with the 2-1 external electrode while one end is located in the accommodation space. The other end is located outside the casing, and the fourth lead terminal has one end positioned in the accommodation space and in contact with the 2-2 external electrode, and the other end is in the casing. The first chip-type component located outside the body and located in the accommodation space is integrated with one end of the 1-1 lead terminal and one end of the 1-2 lead terminal and the housing. The first claw portion is sandwiched between the first claw portion and the elastic force at one end of the first lead terminal and the elastic force at one end of the first lead terminal. The second chip-type component that is pressed against the housing space is integrated with one end of the 2-1 lead terminal and one end of the 2-2 lead terminal and the housing. And the elastic force of the one end portion of the 2-1 lead terminal and the second claw portion. -2 is pressed against the second claw by the elastic force of one end of the lead terminal, the first lead terminal and the third lead terminal are electrically connected, The lead terminal and the fourth lead terminal are electrically connected.

  In the electronic component according to the present invention, the first external electrode of the first chip-type component is in contact with one end portion of the 1-1 lead terminal, and the second external electrode of the first chip-type component is in contact. And the first lead terminal of the 1-2 lead terminal are in contact with each other, the first external electrode of the second chip-type component and the one end part of the 2-1 lead terminal are in contact with each other. The second external electrode of the chip-type component is in contact with one end of the 2-2 lead terminal. Therefore, the other end of the 1-1 lead terminal, the other end of the 1-2 lead terminal, the other end of the 2-1 lead terminal, and the other end of the 2-2 lead terminal are By connecting to each circuit electrode of the circuit board, the chip-type component is mounted on the circuit board via the first and second lead terminals. Therefore, even when a mechanical external force is applied to the circuit board and the circuit board is bent, the stress generated by the bending of the circuit board is relieved by the lead terminals. As a result, defects such as cracks are less likely to occur in the chip-type component.

  In the electronic component according to the present invention, the first external electrode of the first chip-type component and one end portion of the first lead terminal are brought into contact with each other to achieve electrical connection. Electrical connection is achieved by bringing the second external electrode of the chip-type component into contact with one end of the first-second lead terminal, and the first external electrode of the second chip-type component and the second 2- Electrical connection is achieved by contacting one end of one lead terminal, and by contacting the second external electrode of the second chip-type component and one end of the 2-2 lead terminal. The electrical connection is intended. Therefore, the connection between the first external electrode of the first chip-type component and the 1-1 lead terminal, the connection between the second external electrode of the first chip-type component and the 1-2 lead terminal, When connecting the first external electrode of the second chip-type component and the 2-1 lead terminal, and connecting the second external electrode of the second chip-type component and the 2-2 lead terminal In addition, processes such as soldering and spot welding are unnecessary. As a result, the process becomes simple and the electronic component can be manufactured at low cost. Also, the connection between the first external electrode of the first chip-type component and the 1-1 lead terminal, the connection between the second external electrode of the first chip-type component and the 1-2 lead terminal, The connection between the first external electrode of the second chip-type component and the 2-1 lead terminal and the connection between the second external electrode of the second chip-type component and the 2-2 lead terminal are soldered. When chip welding is performed by spot welding or the like, the chip-type component may be damaged by thermal shock, but the electronic component according to the present invention does not require a process such as soldering or spot welding. There is almost no risk of damage due to thermal shock.

  Further, in the electronic component according to the present invention, the first chip-type component located in the accommodation space is integrated with the one end portion of the 1-1 lead terminal, the one end portion of the 1-2 lead terminal, and the housing. And is pressed against the claw by the elastic force of one end of the 1-1 lead terminal and the elastic force of one end of the 1-2 lead terminal. It has been. Similarly, in the electronic component according to the present invention, the second chip-type component positioned in the accommodation space is integrated with the one end of the 2-1 lead terminal and the one end of the 2-2 lead terminal in the housing. And is pressed against the claw by the elastic force of one end of the 2-1 lead terminal and the elastic force of one end of the 2-2 lead terminal. It has been. For this reason, after the first and second chip-type components are assembled in the housing, the first and second chip-type components are difficult to be detached from the housing. In addition, the first chip-type component is held by the elastic force of the 1-1 and 1-2 lead terminals and the second chip-type component is the 2-1 and 2-2 lead terminal. Since it is held by the elastic force, it is possible to further reduce the impact and stress from the outside on the first and second chip-type components.

  In the electronic component according to the present invention, the first lead terminal and the third lead terminal are electrically connected, and the second lead terminal and the fourth lead terminal are electrically connected. Yes. Therefore, the first chip-type component and the second chip-type component can be electrically connected in parallel only by incorporating the first and second chip-type components into the housing.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic component which can be manufactured at a simple process and low cost can be provided, avoiding generation | occurrence | production of defects, such as a crack, in chip-type components.

FIG. 1 is a perspective view showing an electronic component according to the first embodiment. 2 is a cross-sectional view taken along line II-II in FIG. FIG. 3 is an exploded perspective view showing the electronic component according to the first embodiment. FIG. 4 is a cross-sectional view showing an electronic component according to the second embodiment. FIG. 5 is an exploded perspective view showing an electronic component according to the third embodiment. FIG. 6 is an exploded perspective view showing an electronic component according to the fourth embodiment. FIG. 7 is a cross-sectional view showing an electronic component according to the fifth embodiment. FIG. 8 is an exploded perspective view showing an electronic component according to the fifth embodiment. FIG. 9 is a cross-sectional view showing an electronic component according to the sixth embodiment. FIG. 10 is a perspective view showing an electronic component according to the seventh embodiment. 11 is a cross-sectional view taken along line XI-XI in FIG. FIG. 12 is an exploded perspective view showing an electronic component according to the seventh embodiment. FIG. 13 is a perspective view showing an electronic component according to the eighth embodiment. 14 is a cross-sectional view taken along line XIV-XIV in FIG. FIG. 15 is a perspective view showing each lead terminal of the electronic component according to the eighth embodiment. FIG. 16 is a cross-sectional view showing an electronic component according to the ninth embodiment. FIG. 17 is an exploded perspective view showing an electronic component according to the ninth embodiment. FIG. 18 is a sectional view showing an electronic component according to the tenth embodiment. FIG. 19 is a sectional view showing an electronic component according to the eleventh embodiment. FIG. 20 is an exploded perspective view showing the electronic component according to the eleventh embodiment. FIG. 21 is a cross-sectional view showing an electronic component according to the twelfth embodiment. FIG. 22 is an exploded perspective view showing an electronic component according to the twelfth embodiment. FIG. 23 is an exploded perspective view showing the electronic component according to the thirteenth embodiment. FIG. 24 is a sectional view showing an electronic component according to the thirteenth embodiment. FIG. 25 is an exploded perspective view showing the electronic component according to the fourteenth embodiment. FIG. 26 is a perspective view showing an electronic component according to the fifteenth embodiment. 27 is a sectional view taken along line XXVII-XXVII in FIG. FIG. 28 is an exploded perspective view showing the electronic component according to the fifteenth embodiment. FIG. 29 is a perspective view showing an electronic component according to the sixteenth embodiment. FIG. 30 is a cross-sectional view illustrating a state in which the electronic component according to the sixteenth embodiment is mounted on a substrate. FIG. 31 is an exploded perspective view showing an electronic component according to the sixteenth embodiment. FIG. 32 is a perspective view showing an electronic component according to the seventeenth embodiment. FIG. 33 is an exploded perspective view showing the electronic component according to the seventeenth embodiment. FIG. 34 is a perspective view showing an electronic component according to the eighteenth embodiment. 35 is a sectional view taken along line XXXV-XXXV in FIG. FIG. 36 is an exploded perspective view showing the electronic component according to the eighteenth embodiment. FIG. 37 is an exploded perspective view showing the electronic component according to the nineteenth embodiment. FIG. 38 is an exploded perspective view showing the electronic component according to the twentieth embodiment. FIG. 39 is a perspective view showing a modification of the lead terminal.

  Preferred embodiments of an electronic component according to the present invention will be described with reference to the drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and a duplicate description is omitted.

[1] First Embodiment An electronic component E1 according to a first embodiment will be described with reference to FIGS. The electronic component E1 includes a multilayer capacitor (chip-type component) 1, a pair of lead terminals 20A (first lead terminals) and 20B (second lead terminals), and a housing 100.

[1.1] Configuration of Multilayer Capacitor A multilayer capacitor 1 includes a dielectric body 10 and a pair of external electrodes 12A (first external electrodes) and 12B (second external electrodes) disposed on the outer surface of the dielectric body 10. And four (in this embodiment, four) internal electrodes 14A and 14B (see FIG. 2).

  The dielectric body 10 has a rectangular parallelepiped shape, and includes side surfaces 10a (first side surface) and 10b (second side surface) facing each other, side surfaces 10c (third side surface) and 10d facing each other, The side surfaces 10e and 10f are opposed to each other (see FIG. 3). The side surfaces 10c and 10d extend so as to connect the side surfaces 10a and 10b and the side surfaces 10e and 10f, and the side surfaces 10e and 10f extend so as to connect the side surfaces 10a and 10b and the side surfaces 10c and 10d. The dielectric body 10 can be formed of, for example, a dielectric ceramic material obtained by adding a rare earth element to barium titanate or strontium titanate. In the dielectric body 10, the length in the longitudinal direction can be set to, for example, about 1.0 mm, the width can be set to, for example, about 0.5 mm, and the thickness can be set, for example, to about 0.5 mm.

  The dielectric body 10 is formed by laminating a plurality of dielectric layers (not shown), a plurality (two in the present embodiment) of internal electrodes 14A, and a plurality (two in the present embodiment) of internal electrodes 14B. (See FIG. 2). The actual multilayer capacitor 1 is integrated to such an extent that the boundaries between the dielectric layers are not visible.

  The internal electrodes 14 </ b> A and 14 </ b> B are disposed inside the dielectric body 10. The internal electrodes 14A and the internal electrodes 14B are alternately stacked via dielectric layers. The capacitance of the multilayer capacitor 1 depends on the facing area of the portion where the internal electrodes 14A and 14B overlap each other when viewed from the stacking direction and the distance between the internal electrode 14A and the internal electrode 14B (ie, the thickness of the dielectric layer). Is defined.

  The internal electrode 14A extends in the opposing direction of the side surfaces 10a and 10b, and one end of the internal electrode 14A is exposed on the side surface 10a of the dielectric body 10, while the other end is closer to the side surface 10b of the dielectric body 10. Although it is located, it is not exposed to the side surface 10b. The internal electrode 14B extends in the opposing direction of the side surfaces 10a and 10b, and one end of the internal electrode 14B is exposed on the side surface 10b of the dielectric body 10, while the other end is closer to the side surface 10a of the dielectric body 10. Although it is located, it is not exposed to the side surface 10a. The internal electrodes 14A and 14B are made of, for example, Ag or Ni.

  The external electrode 12A covers the entire side surface 10a of the dielectric element body 10 and is formed so as to go around the side surfaces 10c to 10f adjacent to the side surface 10a. That is, the external electrode 12A is disposed on the side surface 10a and the portion of the side surfaces 10c to 10f near the side surface 10a. The external electrode 12A is physically and electrically connected to each internal electrode 14A.

  The external electrode 12A is formed, for example, by transferring an electrode paste mainly composed of Ag, Cu, or Ni to the side surface 10a, baking it at about 700 ° C. to 800 ° C., and performing electroplating. For electroplating, for example, Cu, Ni and Sn can be used.

  The external electrode 12B is formed so as to cover the entire side surface 10b of the dielectric element body 10 and wrap around the side surfaces 10c to 10f adjacent to the side surface 10b. That is, the external electrode 12B is disposed on the side surface 10b and the portion of the side surfaces 10c to 10f that is closer to the side surface 10b. The external electrode 12B is physically and electrically connected to each internal electrode 14B.

  The external electrode 12B is formed, for example, by transferring an electrode paste mainly composed of Ag, Cu, or Ni to the side surface 10b, baking it at about 700 ° C. to 800 ° C., and further performing electroplating. For electroplating, for example, Cu, Ni and Sn can be used.

[1.2] Configuration of Case The case 100 has a rectangular parallelepiped shape, and the side surfaces 100a (side surfaces) and 100b (side surfaces) facing each other and the side surfaces 100c (second main surfaces) and 100d facing each other. (First main surface) and side surfaces 100e (side surfaces) and 100f (side surfaces) facing each other (see FIG. 3). The housing 100 is molded from resin and has electrical insulation.

  The housing 100 has a housing space V for housing the multilayer capacitor 1, an insertion hole 102A through which the lead terminal 20A is inserted, and an insertion hole 102B through which the lead terminal 20B is inserted. The accommodation space V has a rectangular parallelepiped shape and communicates with the opening 104 formed in the central portion of the side surface 100d of the housing 100. That is, the accommodation space V is configured by a recess formed in the side surface 100 d of the housing 100.

  The insertion hole 102A is located between the accommodation space V and the side surface 100a. The insertion hole 102 </ b> A extends in the opposing direction of the side surfaces 100 c and 100 d and penetrates the housing 100. On the side surface 100c of the housing 100, a recess 106A is formed extending from the lower end of the insertion hole 102A toward the side surface 100a.

  The insertion hole 102B is located between the accommodation space V and the side surface 100b. The insertion hole 102B extends in the opposing direction of the side surfaces 100c and 100d and penetrates the housing 100. The side surface 100c of the housing 100 is formed with a recess 106B extending from the lower end of the insertion hole 102B toward the side surface 100b.

  On the side surface 100d of the housing 100, a claw portion 108A is provided near the side surface 100f and at an intermediate portion between the side surfaces 100a and 100b. The claw portion 108 </ b> A is formed integrally with the housing 100. That is, the claw portion 108A is formed of resin and has electrical insulation. The claw portion 108A has a rectangular parallelepiped base portion 108Aa and a tip portion 108Ab having a triangular cross section.

  The front end portion 108Ab is disposed on the surface of the base portion 108Aa that faces the side surface 100e, and the height (width in the facing direction of the side surfaces 100c and 100d) decreases toward the side surface 100e. In FIG. 3, the tip end portion 108 </ b> Ab is a flat surface whose upper surface side is inclined, and its lower surface side is a horizontal surface toward the accommodation space V.

  A claw portion 108B is provided on the side surface 100d of the housing 100 near the side surface 100e and in the middle of the side surfaces 100a and 100b. The claw portion 108B is formed integrally with the housing 100. That is, the claw portion 108B is formed of resin and has electrical insulation. The claw portion 108B has a rectangular parallelepiped base portion 108Ba and a tip portion 108Bb having a triangular cross section.

  The front end portion 108Bb is disposed on the surface of the base portion 108Ba toward the side surface 100f, and the height (width in the facing direction of the side surfaces 100c and 100d) decreases toward the side surface 100f. In FIG. 3, the tip end portion 108 </ b> Bb is a flat surface whose upper surface side is inclined, and its lower surface side is a horizontal surface facing the accommodation space V.

[1.3] Configuration of Lead Terminal The lead terminal 20A is configured by bending a metal plate. The lead terminal 20A has flat plate-like first to fifth portions 20Aa to 20Ae (see FIG. 2). The first portion 20Aa (folded portion) is inserted into the insertion hole 102A. One end of the first portion 20Aa is exposed on the side surface 100d of the housing 100, and the other end of the first portion 20Aa is exposed on the side surface 100c of the housing 100. The second portion 20Ab (folded portion) is disposed on the side surface 100d of the housing 100 and between the accommodation space V and the insertion hole 102A. One end of the second portion 20Ab is connected to one end of the first portion 20Aa, and the other end of the second portion 20Ab faces the accommodation space V.

  The third portion 20Ac (one end, the 1-1 support portion) extends in the facing direction of the side surfaces 100c and 100d in the housing space V in a state slightly separated from the wall of the housing space V. The side surface 10a of the dielectric body 10 of the multilayer capacitor 1 is opposed. Therefore, the third portion 20Ac is movable in the direction opposite to the side surfaces 100a and 100b. One end of the third portion 20Ac is connected to the other end of the second portion 20Ab, and the other end of the third portion 20Ac is located near the bottom surface of the accommodation space V.

  The fourth portion 20Ad (one end portion, the first-second support portion) extends in the direction in which the side surfaces 100a and 100b face each other in the vicinity of the bottom surface of the accommodation space V, and the dielectric body 10 of the multilayer capacitor 1 It faces the side surface 10c. One end of the fourth portion 20Ad is connected to the other end of the third portion 20Ac, and the other end of the fourth portion 20Ad is located below the side surface 10c of the dielectric body 10 of the multilayer capacitor 1. ing. The first and second portions 20Aa and 20Ab extending from the third and fourth portions 20Ac and 20Ad are folded portions that are folded back toward the third and fourth portions 20Ac and 20Ad.

  5th part 20Ae (other end part) is extended in the opposing direction of side surface 100a, 100b in the recessed part 106A. That is, the width of the recess 106A is substantially the same as the width of the lead terminal 20A. One end of the fifth portion 20Ae is connected to the other end of the first portion 20Aa, and the other end of the fifth portion 20Ae is located outside the side surface 100a of the housing 100.

  The lead terminal 20B is configured by bending a metal plate. The lead terminal 20B has flat plate-like first to fifth portions 20Ba to 20Be (see FIG. 2). The first portion 20Ba (folded portion) is inserted into the insertion hole 102B. One end of the first portion 20Ba is exposed on the side surface 100d of the housing 100, and the other end of the first portion 20Ba is exposed on the side surface 100c of the housing 100. The second portion 20Bb (folded portion) is disposed on the side surface 100d of the housing 100 and between the accommodation space V and the insertion hole 102B. One end of the second portion 20Bb is connected to one end of the first portion 20Ba, and the other end of the second portion 20Bb faces the accommodation space V.

  The third portion 20Bc (one end portion, the 2-1 support portion) extends in the facing direction of the side surfaces 100c and 100d in the housing space V in a state slightly separated from the wall of the housing space V. The side surface 10b of the dielectric body 10 of the multilayer capacitor 1 is opposed. Therefore, the third portion 20Bc is movable in the direction opposite to the side surfaces 100a and 100b. One end of the third portion 20Bc is connected to the other end of the second portion 20Bb, and the other end of the third portion 20Bc is located near the bottom surface of the accommodation space V.

  The fourth portion 20 </ b> Bd (one end portion, the 2-2 support portion) extends in the direction in which the side surfaces 100 a and 100 b face each other in the vicinity of the bottom surface of the accommodation space V, and the dielectric body 10 of the multilayer capacitor 1. It faces the side surface 10c. One end of the fourth portion 20Bd is connected to the other end of the third portion 20Bc, and the other end of the fourth portion 20Bd is located below the side surface 10c of the dielectric body 10 of the multilayer capacitor 1. ing. The first and second portions 20Ba and 20Bb extending from the third and fourth portions 20Bc and 20Bd are folded portions that are folded back toward the third and fourth portions 20Bc and 20Bd.

  The fifth portion 20Be (the other end) extends in the opposing direction of the side surfaces 100a and 100b in the recess 106B. That is, the width of the recess 106B is substantially the same as the width of the lead terminal 20B. One end of the fifth portion 20Be is connected to the other end of the first portion 20Ba, and the other end of the fifth portion 20Be is located outside the side surface 100b of the housing 100.

[1.4] Assembly Method and Structure of Electronic Component When assembling the electronic component E1, first, the multilayer capacitor 1, the lead terminals 20A and 20B, and the housing 100 described above are prepared. Before the assembly of the electronic component E1, as shown in FIG. 3, the fifth portion 20Ae of the lead terminal 20A is not bent and constitutes a flat plate together with the first portion 20Aa, and the lead terminal 20B. The fifth portion 20Be is not bent and constitutes a flat plate together with the first portion 20Ba. Further, the third portion 20Ac of the lead terminal 20A has an attachment angle with respect to the second portion 20Ab that is not 90 ° but an obtuse angle with respect to the second portion 20Ab (the first and fifth portions 20Aa, The third portion 20Bc of the lead terminal 20B is not attached to the second portion 20Bb, but is obtuse with respect to the second portion 20Bb. Are attached obliquely (so as to be away from the first and fifth portions 20Ba and 20Be).

  Subsequently, the first and fifth portions 20Aa and 20Ae of the lead terminal 20A are inserted into the insertion hole 102A so that the third and fourth portions 20Ac and 20Ad of the lead terminal 20A are positioned in the accommodation space V. . When the first and fifth portions 20Aa and 20Ae of the lead terminal 20A are inserted into the insertion hole 102A until the second portion 20Ab of the lead terminal 20A contacts the side surface 100d, the fifth portion 20Ae is within the recess 106A. The fifth portion 20Ae is bent toward the side surface 100a of the housing 100 so as to be positioned at the side. As a result, the first to third portions 20Aa to 20Ac exhibiting a U shape are hooked on a portion of the housing 100 between the accommodation space V and the insertion hole 102A, and the first and fifth portions exhibiting an L shape are formed. The portions 20Aa and 20Ae are caught on the side surface 100c of the housing 100. Accordingly, the lead terminal 20 </ b> A is held by the housing 100.

  Similarly, the first and fifth portions 20Ba and 20Be of the lead terminal 20B are inserted into the insertion hole 102B so that the third and fourth portions 20Bc and 20Bd of the lead terminal 20B are positioned in the accommodation space V. When the first and fifth portions 20Ba, 20Be of the lead terminal 20B are inserted into the insertion hole 102B until the second portion 20Bb of the lead terminal 20B contacts the side surface 100d, the fifth portion 20Be is in the recess 106B. The fifth portion 20Be is bent toward the side surface 100b of the housing 100 so as to be positioned at the side. As a result, the first to third portions 20Ba to 20Bc exhibiting a U shape are hooked on a portion of the housing 100 between the accommodation space V and the insertion hole 102B, and the first and fifth portions exhibiting an L shape are formed. The portions 20Ba and 20Be are caught on the side surface 100c of the housing 100. Therefore, the lead terminal 20B is held by the housing 100.

  Subsequently, the multilayer capacitor 1 is inserted into the accommodation space V. At this time, the multilayer capacitor 1 is pushed into the accommodation space V while the claws 108A and 108B are deformed by the dielectric body 10 of the multilayer capacitor 1.

  The multilayer capacitor 1 pushed into the accommodation space V is supported by the lead terminals 20A and 20B. Specifically, the external electrode 12A is in contact with the third and fourth portions 20Ac, 20Ad of the lead terminal 20A, and the external electrode 12B is in contact with the third and fourth portions 20Bc, 20Bd of the lead terminal 20B. The multilayer capacitor 1 is accommodated in the accommodation space V.

  Here, in a state where the lead terminals 20A and 20B do not support the multilayer capacitor 1, the third portion 20Ac of the lead terminal 20A has an obtuse angle with respect to the second portion 20Ab (first and fifth). The third portion 20Bc of the lead terminal 20B has an obtuse angle with respect to the second portion 20Bb (first and fifth portions 20Ba). , 20Be) so that it is attached diagonally. Therefore, in a state where the lead terminals 20A and 20B support the multilayer capacitor 1, the third portion 20Ac of the lead terminal 20A is pushed into the first portion 20Aa side, and the third portion 20Bc of the lead terminal 20B is the first portion 20Bc. 1 is pushed into the portion 20Ba.

  By the way, the first to third portions 20Aa to 20Ac of the lead terminal 20A have a U shape, and the third portion 20Ac is movable in the opposing direction of the side surfaces 100a and 100b. Therefore, when the third portion 20Ac of the lead terminal 20A is pushed into the first portion 20Aa, an elastic force is generated in the lead terminal 20A to return to the original shape, and the side surfaces 100a and 100b of the multilayer capacitor 1 are Elastic force slightly upward (facing the side surface 100d) from the facing direction is applied.

  Further, the first to third portions 20Ba to 20Bc of the lead terminal 20B have a U-shape, and the third portion 20Bc is movable in the opposing direction of the side surfaces 100a and 100b. Therefore, when the third portion 20Bc of the lead terminal 20B is pushed into the first portion 20Ba side, an elastic force is generated in the lead terminal 20B to return to the original shape, and the side surfaces 100a and 100b of the multilayer capacitor 1 are Elastic force slightly upward (facing the side surface 100d) from the facing direction is applied.

  The multilayer capacitor 1 is pressed against the claw portions 108A and 108B by an elastic force that is applied from the lead terminals 20A and 20B and slightly upward (toward the side surface 100d) from the facing direction of the side surfaces 100a and 100b. That is, the side surface 10d of the dielectric body 10 of the multilayer capacitor 1 is pressed against the lower surface of the tip portion 108Ab of the claw portion 108A and the lower surface of the tip portion 108Bb of the claw portion 108B. Therefore, the multilayer capacitor 1 is sandwiched between the lead terminals 20A and 20B and the claw portions 108A and 108B.

[1.5] Operational Effect In the first embodiment as described above, the external electrode 12A of the multilayer capacitor 1 and the third and fourth portions 20Ac, 20Ad of the lead terminal 20A are in contact with each other, and the multilayer capacitor 1 The external electrode 12B and the third and fourth portions 20Bc and 20Bd of the lead terminal 20B are in contact with each other. Accordingly, by connecting the fifth portion 20Ae of the lead terminal 20A and the fifth portion 20Be of the lead terminal 20B to each circuit electrode (not shown) of the circuit board, the multilayer capacitor 1 is connected via the lead terminals 20A and 20B. Mounted on the circuit board. Therefore, even when a mechanical external force is applied to the circuit board and the circuit board is bent, the stress generated by the bending of the circuit board is relieved by the lead terminals. As a result, defects such as cracks are less likely to occur in the multilayer capacitor 1.

  In the first embodiment, the external electrode 12A of the multilayer capacitor 1 and the third and fourth portions 20Ac, 20Ad of the lead terminal 20A are brought into contact with each other to achieve electrical connection. Electrical connection is achieved by bringing the electrode 12B into contact with the third and fourth portions 20Bc and 20Bd of the lead terminal 20B. Therefore, steps such as soldering and spot welding are not required when connecting the external electrode 12A and the lead terminal 20A and connecting the external electrode 12B and the lead terminal 20B. As a result, the process becomes simple and the electronic component E1 can be manufactured at a low cost. In addition, when the connection between the external electrode 12A and the lead terminal 20A and the connection between the external electrode 12B and the lead terminal 20B are performed by soldering, spot welding, or the like, the multilayer capacitor 1 may be damaged by thermal shock. Since the electronic component E1 according to the first embodiment does not require a process such as soldering or spot welding, the multilayer capacitor 1 is hardly damaged by a thermal shock.

  In the first embodiment, the multilayer capacitor 1 positioned in the accommodation space V includes the third and fourth portions 20Ac and 20Ad of the lead terminal 20A and the third and fourth portions 20Bc and 20Bd of the lead terminal 20B. The claws 108 </ b> A and 108 </ b> B formed integrally with the housing 100 are sandwiched. In the first embodiment, the multilayer capacitor 1 located in the accommodation space V includes the elastic force of the third and fourth portions 20Ac and 20Ad of the lead terminal 20A and the third and fourth portions 20Bc of the lead terminal 20B. , 20Bd is pressed against the claws 108A, 108B. For this reason, the multilayer capacitor 1 is difficult to be detached from the housing 100 after the multilayer capacitor 1 is incorporated into the housing 100. In addition, since the multilayer capacitor 1 is held by the elastic force of the lead terminals 20A and 20B, it is possible to further alleviate external impact and stress on the multilayer capacitor 1.

  In the first embodiment, the lead terminal 20A has folded portions (first and second portions 20Aa, 20Ab) extending from the third and fourth portions 20Ac, 20Ad, and the lead terminal 20B is , And have folded portions (first and second portions 20Ba, 20Bb) extending from the third and fourth portions 20Bc, 20Bd. In this way, the lead terminals 20A and 20B can generate a larger elastic force by the folded portions of the lead terminals 20A and 20B. Therefore, it is possible to further alleviate external impact and stress on the multilayer capacitor 1 and to improve the holding ability of the multilayer capacitor 1 by the lead terminals 20A and 20B.

  In the first embodiment, the lead terminal 20A includes a third portion 20Ac that faces the side surface 10a of the dielectric body 10, and a fourth portion 20Ad that faces the side surface 10c of the dielectric body 10. And has a third portion 20Bc facing the side surface 10b of the dielectric element body 10 and a fourth portion 20Bd facing the side surface 10c of the dielectric element body 10. In this way, the multilayer capacitor 1 has not only the third portion 20Ac of the lead terminal 20A facing the side surface 10a and the third portion 20Bc of the lead terminal 20B facing the side surface 10b, but also the lead terminal facing the side surface 10c. It is also supported by the fourth portions 20Ad and 20Bd of 20A and 20B. Therefore, the multilayer capacitor 1 can be reliably held in the accommodation space V by the lead terminals 20A and 20B.

[2] Second Embodiment Next, an electronic component E2 according to a second embodiment will be described with reference to FIG. Below, it demonstrates centering around difference with the electronic component E1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

  Concave portions 106A and 106B are not formed on the side surface 100c of the housing 100 of the electronic component E2. In addition, the other end of the first portion 20Aa of the lead terminal 20A extends to a position slightly separated from the side surface 100c, and the fifth portion 20Ae of the lead terminal 20A is formed on the side surfaces 100a and 100b at a position slightly separated from the side surface 100c. It extends in the opposite direction. Further, the other end of the first portion 20Ba of the lead terminal 20B extends to a position slightly separated from the side surface 100c, and the fifth portion 20Be of the lead terminal 20B is formed on the side surfaces 100a and 100b at a position slightly separated from the side surface 100c. It extends in the opposite direction.

  The electronic component E2 according to the second embodiment as described above has the same effects as the electronic component E1 according to the first embodiment described above.

  In the second embodiment, the other end of the first portion 20Aa of the lead terminal 20A extends to a position slightly away from the side surface 100c, and the other end of the first portion 20Ba of the lead terminal 20B is from the side surface 100c. It extends to a slightly distant position. Therefore, the fifth portion 20Ae of the lead terminal 20A and the fifth portion 20Be of the lead terminal 20B are connected to each circuit electrode (not shown) of the circuit board and laminated on the circuit board via the lead terminals 20A and 20B. When the capacitor 1 is mounted, the housing 100 floats from the circuit board. Therefore, even if a mechanical external force is applied to the circuit board and the circuit board is bent or the circuit board vibrates, the stress generated by the vibration or the bending of the circuit board is caused through the lead terminals 20A and 20B. Acts indirectly on 100. As a result, it is possible to further alleviate external impact and stress on the multilayer capacitor 1.

[3] Third Embodiment Next, an electronic component E3 according to a third embodiment will be described with reference to FIG. Below, it demonstrates centering around difference with the electronic component E1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

  The lead terminal 20A of the electronic component E3 has a pair of sixth portions 20Af (protruding portions) protruding sideways (in the width direction of the lead terminal 20A), in the vicinity of the fifth portion 20Ae of the first portions 20Aa. Is provided. Similarly, the lead terminal 20B of the electronic component E3 has a pair of sixth portions 20Bf (protruding portions) protruding sideward (in the width direction of the lead terminal 20B), and the fifth portion 20Be of the first portion 20Ba. It is provided in the vicinity.

  The housing 100 of the electronic component E3 does not have the insertion holes 102A and 102B. Instead, the housing 100 of the electronic component E3 has communication holes 110A and 110B that allow the side surface 100c of the housing 100 and the accommodation space V to communicate with each other.

  Grooves 112A having a V-shaped cross section (wedge shape) are formed on both side portions of the communication hole 110A in the opposing direction of the side surfaces 100e and 100f. Grooves 112B having a V-shaped cross section (wedge shape) are formed on both side portions of the communication hole 110B in the opposing direction of the side surfaces 100e and 100f.

  When the lead terminal 20A is attached to the housing 100, the second portion 20Ab of the lead terminal 20A is inserted into the communication hole 110A from the side surface 100c side. At this time, the third and fourth portions 20Ac and 20Ad face the side surface 100b. After the first to fourth portions 20Aa to 20Ad are inserted into the communication holes 110A, the pair of sixth portions 20Af are respectively inserted into the corresponding grooves 112A (portions shown in the circles shown by alternate long and short dashed lines in FIG. 5). See enlarged view). Accordingly, the sixth portion 20Af enters and is locked into the groove 112A, and the lead terminal 20A is attached to the housing 100.

  Similarly, when attaching the lead terminal 20B to the housing 100, the second portion 20Bb of the lead terminal 20B is inserted into the communication hole 110B from the side surface 100c side. At this time, the third and fourth portions 20Bc and 20Bd face the side surface 100a. After the first to fourth portions 20Ba to 20Bd are inserted into the communication holes 110B, the pair of sixth portions 20Bf are subsequently inserted into the corresponding grooves 112B (not shown). Accordingly, the sixth portion 20Bf enters and is locked in the groove 112B, and the lead terminal 20B is attached to the housing 100.

  The electronic component E3 according to the third embodiment as described above has the same effects as the electronic component E1 according to the first embodiment described above.

  In the third embodiment, the sixth portion 20Af enters the groove 112A and is locked, so that the lead terminal 20A is attached to the housing 100, and the sixth portion 20Bf enters the groove 112B. The lead terminal 20 </ b> B is attached to the housing 100 by being locked at. In this way, the sixth portion 20Af of the lead terminal 20A and the groove 112A are firmly connected, and the sixth portion 20Bf of the lead terminal 20B and the groove 112B are firmly connected. Therefore, the lead terminals 20A and 20B can be reliably held by the housing 100.

[4] Fourth Embodiment Next, an electronic component E4 according to a fourth embodiment will be described with reference to FIG. Below, it demonstrates centering around difference with the electronic component E3 which concerns on 3rd Embodiment, and the overlapping description is abbreviate | omitted.

  A groove 114A having a shape corresponding to the sixth portion 20Af is formed on both sides of the communication hole 110A in the opposing direction of the side surfaces 100e and 100f. The groove 114A located on the side surface 100e side extends from the communication hole 110A to the side surface 100e. The side surface 100e is provided with a recess 116A (first protrusion accommodating recess) connected to the end of the groove 114A on the side surface 100e side. The groove 114A located on the side surface 100f side extends from the communication hole 110A to the side surface 100f. The side surface 100f is provided with a recess 116A (first projecting portion accommodating recess) connected to the end of the groove 114A on the side surface 100f side (not shown).

  Grooves 114B having a shape corresponding to the sixth portion 20Bf are formed on both sides of the communication hole 110B in the opposing direction of the side surfaces 100e and 100f. The groove 114B located on the side surface 100e side extends from the communication hole 110B to the side surface 100e. The side surface 100e is provided with a recess 116B (second projecting portion accommodating recess) connected to the end of the groove 114B on the side surface 100e side. The groove 114B located on the side surface 100f side extends from the communication hole 110B to the side surface 100f. The side surface 100f is provided with a recess 116B (second projecting portion accommodating recess) connected to the end of the groove 114B on the side surface 100f side (not shown).

  When the lead terminal 20A is attached to the housing 100, the second portion 20Ab of the lead terminal 20A is inserted into the communication hole 110A from the side surface 100c side. At this time, the third and fourth portions 20Ac and 20Ad face the side surface 100b. After the first to fourth portions 20Aa to 20Ad are inserted into the communication holes 110A, the pair of sixth portions 20Af are subsequently inserted into the corresponding grooves 112A, respectively. Then, the excess portion of the sixth portion 20Af that protrudes from the groove 114A is bent and accommodated in the recess 116A (see the partially enlarged view shown in the circle of the one-dot chain line in FIG. 6). As a result, the sixth portion 20Af enters the groove 114A and the recess 116A, and the lead terminal 20A is attached to the housing 100.

  Similarly, when attaching the lead terminal 20B to the housing 100, the second portion 20Bb of the lead terminal 20B is inserted into the communication hole 110B from the side surface 100c side. At this time, the third and fourth portions 20Bc and 20Bd face the side surface 100a. After the first to fourth portions 20Ba to 20Bd are inserted into the communication holes 110B, the pair of sixth portions 20Bf are subsequently inserted into the corresponding grooves 112B, respectively. Then, the excess portion of the sixth portion 20Bf that protrudes from the groove 114B is bent and accommodated in the recess 116B (not shown). Accordingly, the sixth portion 20Bf enters the groove 114B and the recess 116B, and the lead terminal 20B is attached to the housing 100.

  The electronic component E4 according to the fourth embodiment as described above has the same effects as the electronic component E1 according to the first embodiment described above.

  Further, in the fourth embodiment, the sixth portion 20Af of the lead terminal 20A is bent after being inserted into the groove 114A and accommodated in the recess 116A, whereby the lead terminal 20A is attached to the housing 100. The sixth portion 20Bf of the lead terminal 20B is bent after being inserted into the groove 114B, and is accommodated in the recess 116B, so that the lead terminal 20B is attached to the housing 100. In this way, the sixth portion 20Af of the lead terminal 20A is securely held in the recess 116A, and the sixth portion 20Bf of the lead terminal 20B is securely held in the recess 116B. Therefore, the lead terminals 20A and 20B can be reliably held by the housing 100. In addition, since the sixth portion 20Af of the lead terminal 20A enters the recess 116A and the sixth portion 20Bf of the lead terminal 20B enters the recess 116B, each of the sixth portions 20Af and 20Bf is included in the housing 100. It does not protrude outside. As a result, the electronic component E4 as a whole can be downsized.

[5] Fifth Embodiment Next, an electronic component E5 according to a fifth embodiment will be described with reference to FIGS. Below, it demonstrates centering around difference with the electronic component E4 which concerns on 4th Embodiment, and the overlapping description is abbreviate | omitted.

  The lead terminal 20A of the electronic component E5 further includes a seventh portion 20Ag (the other end portion). The seventh portion 20Ag is disposed on the side surface 100a and extends in the opposing direction of the side surfaces 100c and 100d. One end of the seventh portion 20Ag is connected to the other end of the fifth portion 20Ae, and the other end of the seventh portion 20Ag is located near the center on the side surface 100a of the housing 100. Therefore, the first, fifth, and seventh portions 20Aa, 20Ae, and 20Ag are bent along the side surfaces 100c and 100a of the housing 100 so as to have a U-shape, and the housing space V and the side surface of the side surface 100c are folded. Hook on the part between 100a. Note that the fifth portion 20Ae and / or the seventh portion 20Ag may not be bent before the assembly of the electronic component E5, and may form a flat plate together with the first portion 20Aa.

  The third portion 20Ac of the lead terminal 20A has a convex portion 22A that is bent into a convex shape (crank shape). The convex portion 22A protrudes toward the side opposite to the first portion 20Aa. Therefore, the protrusion 22A is pressed against the external electrode 12A of the multilayer capacitor 1 in a state where the lead terminal 20A is assembled.

  The lead terminal 20B of the electronic component E5 further includes a seventh portion 20Bg (other end portion). The seventh portion 20Bg is disposed on the side surface 100b and extends in the opposing direction of the side surfaces 100c and 100d. One end of the seventh portion 20Bg is connected to the other end of the fifth portion 20Be, and the other end of the seventh portion 20Bg is located near the center on the side surface 100b of the housing 100. Therefore, the first, fifth, and seventh portions 20Ba, 20Be, and 20Bg are bent along the side surfaces 100c and 100b of the housing 100 so as to have a U-shape, and the accommodation space V and the side surfaces of the side surface 100c are folded. Hook on the part between 100b. Note that the fifth portion 20Be and / or the seventh portion 20Bg may not be bent before the assembly of the electronic component E5, and may constitute a flat plate together with the first portion 20Ba.

  The third portion 20Bc of the lead terminal 20B has a convex portion 22B that is bent into a convex shape (crank shape). The protrusion 22B protrudes toward the opposite side to the first portion 20Ba. Therefore, the protrusion 22B is pressed against the external electrode 12B of the multilayer capacitor 1 in a state where the lead terminal 20B is assembled.

  The electronic component E5 according to the fifth embodiment as described above has the same operational effects as the electronic component E4 according to the fourth embodiment described above.

  In the fifth embodiment, the third portion 20Ac of the lead terminal 20A has a convex portion 22A, and the third portion 20Bc of the lead terminal 20B has a convex portion 22B. Thus, the convex portion 22A of the lead terminal 20A is pressed against the external electrode 12A, and the convex portion 22B of the lead terminal 20B is pressed against the external electrode 12B. Therefore, contact failure between lead terminal 20A and external electrode 12A is prevented, and contact failure between lead terminal 20B and external electrode 12B is prevented. As a result, the connection reliability between the lead terminal 20A and the external electrode 12A and the connection reliability between the lead terminal 20B and the external electrode 12B can be improved.

  In the fifth embodiment, the seventh portion 20Ag of the lead terminal 20A is disposed on the side surface 100a, and the seventh portion 20Bg of the lead terminal 20B is disposed on the side surface 100b. In this case, when the lead terminal 20A is soldered to the circuit electrode of the circuit board and the lead terminal 20B is soldered to the circuit electrode of the circuit board with the side surface 100c of the housing 100 facing the circuit board, Solder also adheres to the seventh portions 20Ag and 20Bg of the lead terminals 20A and 20B. Therefore, it is possible to visually confirm the solder fillet after the electronic component E5 is mounted on the circuit board.

  In the fifth embodiment, the fifth and seventh portions 20Ae, 20Ag of the lead terminal 20A are bent along the side surfaces 100c, 100a of the housing 100, and the fifth and seventh portions of the lead terminal 20B are bent. The portions 20Be and 20Bg are bent along the side surfaces 100c and 100b of the housing 100. In this way, the lead terminals 20 </ b> A and 20 </ b> B are difficult to protrude outside the housing 100. Therefore, it becomes possible to reduce the size of the entire electronic component E5.

[6] Sixth Embodiment Next, an electronic component E6 according to a sixth embodiment will be described with reference to FIG. Below, it demonstrates centering around difference with the electronic component E1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

  On the side surface 100a of the housing 100 of the electronic component E6, a recess 118A is formed extending from the end on the side surface 100a side of the recess 106A toward the side surface 100d. Further, the side surface 100b of the housing 100 of the electronic component E6 is formed with a recess 118B extending from the end of the recess 106B on the side surface 100b side toward the side surface 100d.

  The lead terminal 20A of the electronic component E6 further includes a seventh portion 20Ag (the other end portion). The seventh portion 20Ag is disposed in a recess 118A formed on the side surface 100a and extends in the direction opposite to the side surfaces 100c and 100d. One end of the seventh portion 20Ag is connected to the other end of the fifth portion 20Ae, and the other end of the seventh portion 20Ag is located near the center on the side surface 100a of the housing 100. Therefore, the first, fifth, and seventh portions 20Aa, 20Ae, and 20Ag are bent along the side surfaces 100c and 100a (recesses 106A and 118A) of the housing 100 so as to have a U-shape. Of these, it is caught in the portion between the insertion hole 102A and the side surface 100a. The fifth portion 20Ae and / or the seventh portion 20Ag may not be bent before the assembly of the electronic component E6, and may constitute a flat plate together with the first portion 20Aa.

  The lead terminal 20B of the electronic component E6 further includes a seventh portion 20Bg (the other end portion). The seventh portion 20Bg is disposed in the recess 118B formed on the side surface 100b and extends in the direction opposite to the side surfaces 100c and 100d. One end of the seventh portion 20Bg is connected to the other end of the fifth portion 20Be, and the other end of the seventh portion 20Bg is located near the center on the side surface 100b of the housing 100. Therefore, the first, fifth, and seventh portions 20Ba, 20Be, and 20Bg are bent along the side surfaces 100c and 100b (recesses 106B and 118B) of the housing 100 so as to have a U shape, Of these, it is caught in the portion between the insertion hole 102B and the side surface 100b. Note that the fifth portion 20Be and / or the seventh portion 20Bg may not be bent before assembling the electronic component E6, and may constitute a flat plate together with the first portion 20Ba.

  The electronic component E6 according to the sixth embodiment as described above has the same operational effects as the electronic component E1 according to the first embodiment described above.

  In the sixth embodiment, since the seventh portion 20Ag of the lead terminal 20A enters the recess 118A and the seventh portion 20Bg of the lead terminal 20B enters the recess 118B, each seventh portion 20Ag , 20Bg does not protrude outside the housing 100. As a result, the electronic component E6 as a whole can be downsized.

  In the sixth embodiment, the seventh portion 20Ag of the lead terminal 20A is disposed in the recess 118A formed on the side surface 100a, and the seventh portion 20Bg of the lead terminal 20B is formed on the side surface 100b. It arrange | positions in the recessed part 118B. In this case, when the lead terminal 20A is soldered to the circuit electrode of the circuit board and the lead terminal 20B is soldered to the circuit electrode of the circuit board with the side surface 100c of the housing 100 facing the circuit board, Solder also adheres to the seventh portions 20Ag and 20Bg of the lead terminals 20A and 20B. Therefore, it is possible to visually confirm the solder fillet after the electronic component E6 is mounted on the circuit board.

[7] Seventh Embodiment Next, an electronic component E7 according to a seventh embodiment will be described with reference to FIGS. Below, it demonstrates centering around difference with the electronic component E1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

  The casing 100 of the electronic component E7 does not have the insertion holes 102A and 102B. Instead, the housing 100 of the electronic component E7 has a recess 120A extending in the facing direction of the side surfaces 100c and 100d in the side surface 100a, and a recess 122A extending in the facing direction of the side surfaces 100a and 100b is included in the housing space of the side surface 100d. The side surface 100b has a concave portion 120B extending in the opposite direction of the side surfaces 100c and 100d, and the concave portion 122B extending in the opposite direction of the side surfaces 100a and 100b. It has in the part between the accommodation space V and the side surface 100b (refer FIG.11 and FIG.12).

  In the lead terminal 20A of the electronic component E7, the first portion 20Aa enters the recess 120A, the second portion 20Ab enters the recess 122A, and the fifth portion 20Ae enters the recess 106A. At the same time, the other end of the fifth portion 20Ae is positioned on the side surface 100c of the housing 100 (see FIG. 11).

  In the lead terminal 20B of the electronic component E7, the first portion 20Ba enters the recess 120B, the second portion 20Bb enters the recess 122B, and the fifth portion 20Be enters the recess 106B. At the same time, the other end of the fifth portion 20Be is positioned on the side surface 100c of the housing 100 (see FIG. 11).

  When the lead terminal 20A is attached to the housing 100 (see FIG. 12), the first and second U-shaped first and second portions 20Ac and 20Ad of the lead terminal 20A are located in the accommodation space V. The third portions 20Aa to 20Ac are hooked on the recesses 122A and 120A. Then, the fifth portion 20Ae is bent toward the side surface 100c of the housing 100 (see FIGS. 10 and 11). As a result, the first and fifth portions 20Aa and 20Ae exhibiting an L shape are caught in the recesses 120A and 106A. Accordingly, the lead terminal 20 </ b> A is held by the housing 100.

  Similarly, when the lead terminal 20B is attached to the housing 100 (see FIG. 12), the lead terminal 20B has a U shape so that the third and fourth portions 20Bc and 20Bd of the lead terminal 20B are positioned in the accommodation space V. The first to third portions 20Ba to 20Bc are hooked on the recesses 122B and 120B. Then, the fifth portion 20Be is bent toward the side surface 100c of the housing 100 (see FIGS. 10 and 11). Thereby, the 1st and 5th part 20Ba and 20Be which exhibit L-shape are hooked in recessed part 120B and 106B. Therefore, the lead terminal 20B is held by the housing 100.

  The electronic component E7 according to the seventh embodiment as described above has the same operational effects as the electronic component E1 according to the first embodiment described above.

  In the seventh embodiment, the first, second and fifth portions 20Aa, 20Ab and 20Ae of the lead terminal 20A enter the recesses 120A, 122A and 106A, respectively, and the first, second and Since the fifth portions 20Ba, 20Bb, and 20Be enter the recesses 120B, 122B, and 106B, respectively, the first, second, and fifth portions 20Aa, 20Ab, and 20A of the lead terminal 20A and the first of the lead terminal 20B. The second and fifth portions 20Ba, 20Bb, and 20Be do not protrude outside the casing 100. For this reason, the electronic component E7 as a whole can be downsized.

  In the seventh embodiment, the first portion 20Aa of the lead terminal 20A is arranged in the recess 120A formed on the side surface 100a, and the first portion 20Ba of the lead terminal 20B is formed on the side surface 100b. It arrange | positions in the recessed part 120B. In this case, when the lead terminal 20A is soldered to the circuit electrode of the circuit board and the lead terminal 20B is soldered to the circuit electrode of the circuit board, each of the first portions 20Aa and 20Ba of the lead terminals 20A and 20B is also applied. Solder adheres. Therefore, it is possible to visually confirm the solder fillet after the electronic component E7 is mounted on the circuit board.

[8] Eighth Embodiment Next, an electronic component E8 according to an eighth embodiment will be described with reference to FIGS. Below, it demonstrates centering around difference with the electronic component E1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

  The housing 100 of the electronic component E8 does not have the insertion holes 102A and 102B and the recesses 106A and 106B. Instead, the casing 100 of the electronic component E8 is provided with an engagement piece 124A (first engagement piece) having an L shape on the side surface 100a, and an engagement piece 124B (first shape) having an L shape is provided. 2 engagement pieces) are provided on the side surface 100b. Each of the engagement pieces 124A and 124B has a base portion extending in the facing direction of the side surfaces 100a and 100b and a tip portion attached to the tip of the base portion and extending toward the side surface 100d in the facing direction of the side surfaces 100c and 100d. Yes.

  In the lead terminal 20A of the electronic component E8, the first portion 20Aa is disposed on the side surface 100a of the housing 100 (see FIGS. 13 and 14), and a rectangular opening is formed in the central portion of the first portion 20Aa. 24A (first engaging piece opening) is formed (see FIGS. 13 to 15). The opening 24A is large enough to allow the engagement piece 124A to pass therethrough. Of the first portion 20Aa, the upper portion of the opening 24A is located between the side surface 100a of the housing 100 and the tip of the engagement piece 124A. Therefore, the first portion 20Aa is hooked on the engagement piece 124A, that is, the lead terminal 20A and the engagement piece 124A are engaged.

  In the lead terminal 20B of the electronic component E8, the first portion 20Ba is disposed on the side surface 100b of the housing 100 (see FIG. 14), and a rectangular opening 24B (first portion) is formed in the central portion of the first portion 20Ba. 2 of engaging pieces) (see FIGS. 14 and 15). The opening 24B is large enough to allow the engagement piece 124B to pass therethrough. Of the first portion 20Ba, the upper portion of the opening 24B is located between the side surface 100b of the housing 100 and the tip of the engagement piece 124B. Therefore, the first portion 20Ba is hooked on the engagement piece 124B, that is, the lead terminal 20B and the engagement piece 124B are engaged.

  The electronic component E8 according to the eighth embodiment as described above has the same effects as the electronic component E1 according to the first embodiment described above.

  In the eighth embodiment, the engagement pieces 124A and 124B are provided on the side surfaces 100a and 100b of the housing 100, respectively, and the first portion 20Aa of the lead terminal 20A is engaged with the engagement piece 124A. It has an opening 24A, and the first portion 20Ba of the lead terminal 20B has an opening 24B that engages with the engagement piece 124B. In this way, the lead terminal 20A can be securely held in the housing by the engaging piece 124A provided in the housing 100, and the lead terminal 20B can be held by the engaging piece 124B provided in the housing 100. Can be securely held in the housing.

[9] Ninth Embodiment Next, an electronic component E9 according to a ninth embodiment will be described with reference to FIGS. Below, it demonstrates centering around difference with the electronic component E3 which concerns on 3rd Embodiment, and the overlapping description is abbreviate | omitted.

  The housing 100 of the electronic component E7 has a recess 126A (first end accommodating recess) extending in the facing direction of the side surfaces 100e and 100f on the side surface 100a. The recess 126A is located closer to the side surface 100c, and the width of the recess 126A is slightly larger than the width of the lead terminal 20A.

  The housing 100 of the electronic component E7 has a concave portion 126B extending in the facing direction of the side surfaces 100e and 100f on the side surface 100b. The recess 126B (second end receiving recess) is located closer to the side surface 100c, and the width of the recess 126B is slightly larger than the width of the lead terminal 20B.

  The lead terminal 20A of the electronic component E9 further includes a seventh portion 20Ag (the other end portion). The seventh portion 20Ag is disposed on the side surface 100a and extends in the opposing direction of the side surfaces 100c and 100d. One end of the seventh portion 20Ag is connected to the other end of the fifth portion 20Ae, and the other end of the seventh portion 20Ag is located near the center on the side surface 100a of the housing 100. Therefore, the first, fifth, and seventh portions 20Aa, 20Ae, and 20Ag are bent along the side surfaces 100c and 100a of the housing 100 so as to have a U-shape, and the housing space V and the side surface of the side surface 100c are folded. Hook on the part between 100a. The fifth portion 20Ae and / or the seventh portion 20Ag may not be bent before the assembly of the electronic component E9, and may constitute a flat plate together with the first portion 20Aa.

  The seventh portion 20Ag of the lead terminal 20A has a convex portion 26A that is bent into a convex shape (crank shape). The convex portion 26A protrudes toward the first portion 20Aa and is accommodated in a concave portion 126A provided on the side surface 100a of the housing 100.

  The lead terminal 20B of the electronic component E9 further includes a seventh portion 20Bg (the other end portion). The seventh portion 20Bg is disposed on the side surface 100b and extends in the opposing direction of the side surfaces 100c and 100d. One end of the seventh portion 20Bg is connected to the other end of the fifth portion 20Be, and the other end of the seventh portion 20Bg is located near the center on the side surface 100b of the housing 100. Therefore, the first, fifth, and seventh portions 20Ba, 20Be, and 20Bg are bent along the side surfaces 100c and 100b of the housing 100 so as to have a U-shape, and the accommodation space V and the side surfaces of the side surface 100c are folded. Hook on the part between 100b. Note that the fifth portion 20Be and / or the seventh portion 20Bg may not be bent before the assembly of the electronic component E9, and may constitute a flat plate together with the first portion 20Ba.

  The seventh portion 20Bg of the lead terminal 20B has a convex portion 26B that is bent into a convex shape (crank shape). The convex portion 26B protrudes toward the first portion 20Ba and is accommodated in a concave portion 126B provided on the side surface 100b of the housing 100.

  When attaching the lead terminal 20A to the housing 100 (see FIG. 17), the second portion 20Ab of the lead terminal 20A is inserted into the communication hole 110A from the side surface 100c side. At this time, the third and fourth portions 20Ac and 20Ad face the side surface 100b. When the first to fourth portions 20Aa to 20Ad are inserted into the communication holes 110A, the pair of sixth portions 20Af are subsequently inserted into the corresponding grooves 112A, respectively. Further, a part of the seventh portion 20Ag is pushed into the concave portion 126A to form the convex portion 26A in the seventh portion 20Ag. Accordingly, the sixth portion 20Af enters and is locked in the groove 112A, and the seventh portion 20Ag enters and is locked in the recess 126A, so that the lead terminal 20A is attached to the housing 100.

  Similarly, when the lead terminal 20B is attached to the housing 100 (see FIG. 17), the second portion 20Bb of the lead terminal 20B is inserted into the communication hole 110B from the side surface 100c side. At this time, the third and fourth portions 20Bc and 20Bd face the side surface 100a. After the first to fourth portions 20Ba to 20Bd are inserted into the communication holes 110B, the pair of sixth portions 20Bf are subsequently inserted into the corresponding grooves 112B, respectively. Further, a part of the seventh portion 20Bg is pushed into the concave portion 126B to form the convex portion 26A in the seventh portion 20Bg. Accordingly, the sixth portion 20Bf enters and is locked in the groove 112B, and the seventh portion 20Bg enters and is locked in the recess 126B, so that the lead terminal 20B is attached to the housing 100.

  The electronic component E9 according to the ninth embodiment as described above has the same operational effects as the electronic component E3 according to the third embodiment described above.

  In the ninth embodiment, the seventh portion 20Ag is bent and enters the recess 126A, whereby the lead terminal 20A is attached to the housing 100, and the seventh portion 20Bg is bent and the recess 126B. The lead terminal 20B is attached to the housing 100 by entering the inside. In this way, the seventh portion 20Ag of the lead terminal 20A is locked in the recess 126A, and the seventh portion 20Bg of the lead terminal 20B is locked in the recess 126B. Therefore, the lead terminals 20A and 20B can be reliably held by the housing 100. Further, since the seventh portion 20Ag of the lead terminal 20A is accommodated in the recess 126A and the seventh portion 20Bg of the lead terminal 20B is accommodated in the recess 126B, the lead terminals 20A and 20B are outside the casing 100. It becomes difficult to stick out. Therefore, it becomes possible to reduce the size of the entire electronic component E9.

[10] Tenth Embodiment Next, an electronic component E10 according to a tenth embodiment will be described with reference to FIG. Below, it demonstrates centering around difference with the electronic component E9 which concerns on 9th Embodiment, and the overlapping description is abbreviate | omitted.

  In the case lead terminals 20A and 20B of the electronic component E9, the seventh portions 20Ag and 20Bg do not have the convex portions 26A and 26B. Instead, the tip of the seventh portion 20Ag of the lead terminal 20A is bent into the recess 126A of the housing 100, and the tip of the seventh portion 20Bg of the lead terminal 20B is bent into the recess 126B of the housing 100. It has been.

  The electronic component E10 according to the tenth embodiment as described above has the same effects as the electronic component E9 according to the ninth embodiment described above.

[11] Eleventh Embodiment Next, an electronic component E11 according to an eleventh embodiment will be described with reference to FIGS. Below, it demonstrates centering around difference with the electronic component E1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

  On the side surface 100d of the housing 100, a claw portion 108A is provided near the side surface 100a and at an intermediate portion between the side surfaces 100e and 100f. A claw portion 108B is provided on the side surface 100d of the housing 100 near the side surface 100b and at an intermediate portion between the side surfaces 100e and 100f.

  A groove 114A having a shape corresponding to the sixth portion 30Af is formed on both sides of the communication hole 110A in the opposing direction of the side surfaces 100e and 100f. The groove 114A located on the side surface 100e side extends from the communication hole 110A to the side surface 100e. The side surface 100e is provided with a recess 116A (first protrusion accommodating recess) connected to the end of the groove 114A on the side surface 100e side. The groove 114A located on the side surface 100f side extends from the communication hole 110A to the side surface 100f. The side surface 100f is provided with a recess 116A (first projecting portion accommodating recess) connected to the end of the groove 114A on the side surface 100f side (not shown).

  Grooves 114B having a shape corresponding to the sixth portion 30Bf are formed on both sides of the communication hole 110B in the opposing direction of the side surfaces 100e and 100f. The groove 114B located on the side surface 100e side extends from the communication hole 110B to the side surface 100e. The side surface 100e is provided with a recess 116B (second projecting portion accommodating recess) connected to the end of the groove 114B on the side surface 100e side. The groove 114B located on the side surface 100f side extends from the communication hole 110B to the side surface 100f. The side surface 100f is provided with a recess 116B (second projecting portion accommodating recess) connected to the end of the groove 114B on the side surface 100f side (not shown).

  The electronic component E11 includes lead terminals 30A and 30B having different configurations from the lead terminals 20A and 20B of the electronic component E1.

  The lead terminal 30A has first to ninth portions 30Aa to 30Ai having a flat plate shape (see FIG. 20). The first portion 30Aa (the other end portion) is disposed on the side surface 100d between the insertion hole 110A and the side surface 100a, and extends in the opposing direction of the side surfaces 100a and 100b. One end of the first portion 30Aa is located on the side surface 100a side, and the other end of the first portion 30Aa faces the insertion hole 110A. From the other end of the first portion 30Aa, the second portion 30Ab and the sixth portion 30Af extend in a bifurcated state.

  The second portion 30Ab extends in the opposing direction of the side surfaces 100c and 100d in the insertion hole 110A and the accommodation space V. One end of the second portion 30Ab is connected to the other end of the first portion 30Aa, and the other end of the second portion 30Ab is located in the accommodation space V. In the second portion 30Ab, a third portion 30Ac (protruding portion) protruding toward the opposite side to the sixth portion 30Af is provided on the side edge opposite to the sixth portion 30Af. .

  In the accommodation space V, the fourth portion 30Ad extends in a direction opposite to the side surfaces 100a and 100b and in a direction away from the first portion 30Aa. In the present embodiment, the fourth portion 30Ad is attached to the second portion 30Ab so as to be approximately 90 ° with respect to the second portion 30Ab. One end of the fourth portion 30Ad is connected to the other end of the second portion 30Ab, and the other end of the fourth portion 30Ad is located in the accommodation space V. The fourth portion 30Ad is provided with a fifth portion 30Ae extending in a direction opposite to the side surfaces 100c and 100d and in a direction away from the first portion 30Aa on the side edge opposite to the eighth portion 30Ah. Yes.

  The sixth portion 30Af extends in the opposing direction of the side surfaces 100c and 100d in the insertion hole 110A and the accommodation space V. One end of the sixth portion 30Af is connected to the other end of the first portion 30Aa, and the other end of the sixth portion 30Af is located in the accommodation space V. The sixth portion 30Af is provided with a seventh portion 30Ag (protruding portion) protruding toward the opposite side to the second portion 30Ab on the side edge opposite to the second portion 30Ab. .

  In the accommodation space V, the eighth portion 30Ah extends in a direction opposite to the side surfaces 100a and 100b and away from the first portion 30Aa. In the present embodiment, the eighth portion 30Ah is attached to the sixth portion 30Af so as to be approximately 90 ° with respect to the sixth portion 30Af. One end of the eighth portion 30Ah is connected to the other end of the sixth portion 30Af, and the other end of the eighth portion 30Ah is located in the accommodation space V. The eighth portion 30Ah is provided with a ninth portion 30Ai extending in a direction opposite to the side surfaces 100c and 100d and in a direction away from the first portion 30Aa on the side edge opposite to the fourth portion 30Ad. Yes.

  The lead terminal 30B has flat plate-like first to ninth portions 30Ba to 30Bi (see FIG. 20). The first portion 30Ba (the other end) is disposed on the side surface 100d between the insertion hole 110B and the side surface 100b, and extends in the facing direction of the side surfaces 100a and 100b. One end of the first portion 30Ba is located on the side surface 100b side, and the other end of the first portion 30Ba faces the insertion hole 110B. From the other end of the first portion 30Ba, the second portion 30Bb and the sixth portion 30Bf extend in a bifurcated state.

  The second portion 30Bb extends in the insertion direction of the side surfaces 100c and 100d in the insertion hole 110B and the accommodation space V. One end of the second portion 30Bb is connected to the other end of the first portion 30Ba, and the other end of the second portion 30Bb is located in the accommodation space V. In the second portion 30Bb, a third portion 30Bc (protruding portion) protruding toward the opposite side to the sixth portion 30Bf is provided on the side edge on the opposite side to the sixth portion 30Bf. .

  In the accommodation space V, the fourth portion 30Bd extends in a direction opposite to the side surfaces 100a and 100b and in a direction away from the first portion 30Ba. In the present embodiment, the fourth portion 30Bd is attached to the second portion 30Bb so as to be approximately 90 ° with respect to the second portion 30Bb. One end of the fourth portion 30Bd is connected to the other end of the second portion 30Bb, and the other end of the fourth portion 30Bd is located in the accommodation space V. In the fourth portion 30Bd, a fifth portion 30Be extending in a direction opposite to the side surfaces 100c and 100d and in a direction away from the first portion 30Ba is provided on the side edge opposite to the eighth portion 30Bh. Yes.

  The sixth portion 30Bf extends in the insertion direction of the side surfaces 100c and 100d in the insertion hole 110B and the accommodation space V. One end of the sixth portion 30Bf is connected to the other end of the first portion 30Ba, and the other end of the sixth portion 30Bf is located in the accommodation space V. The sixth portion 30Bf is provided with a seventh portion 30Bg (protruding portion) protruding toward the opposite side to the second portion 30Bb on the side edge opposite to the second portion 30Bb. .

  In the accommodation space V, the eighth portion 30Bh extends in a direction opposite to the side surfaces 100a and 100b and in a direction away from the first portion 30Ba. In the present embodiment, the eighth portion 30Bh is attached to the sixth portion 30Bf so as to be approximately 90 ° with respect to the sixth portion 30Bf. One end of the eighth portion 30Bh is connected to the other end of the sixth portion 30Bf, and the other end of the eighth portion 30Bh is located in the accommodation space V. The eighth portion 30Bh is provided with a ninth portion 30Bi extending in a direction opposite to the side surfaces 100c and 100d and in a direction away from the first portion 30Ba on the side edge opposite to the fourth portion 30Bd. Yes.

  When the lead terminal 30A is attached to the housing 100, the second, fourth, sixth and eighth portions 30Ab, 30Ad, 30Ag, 30Ah of the lead terminal 30A are inserted into the communication hole 110A from the side surface 100c side. At this time, the fourth and eighth portions 30Ad and 30Ag face the side surface 100b. Subsequently, the third and seventh portions 30Ac and 30Ag are inserted into the corresponding grooves 114A, respectively. Then, the excess portion of the third portion 30Ac that protrudes from the groove 114A is bent and accommodated in the recess 116A, and the excess portion of the seventh portion 30Ag that protrudes from the groove 114A is bent and accommodated in the recess 116A. As a result, the third and seventh portions 30Ac, 30Ag enter the groove 114A and the recess 116A, and the lead terminal 30A is attached to the housing 100.

  Similarly, when attaching the lead terminal 30B to the housing 100, the second, fourth, sixth and eighth portions 30Bb, 30Bd, 30Bg, 30Bh of the lead terminal 30B are inserted into the communication hole 110B from the side surface 100c side. To do. At this time, the fourth and eighth portions 30Bd and 30Bg face the side surface 100a. Subsequently, the third and seventh portions 30Bc and 30Bg are inserted into the corresponding grooves 114B, respectively. Then, the excess portion of the third portion 30Bc that protrudes from the groove 114B is bent and accommodated in the recess 116B, and the excess portion of the seventh portion 30Bg that protrudes from the groove 114B is bent and accommodated in the recess 116B. Thereby, the third and seventh portions 30Bc, 30Bg enter the groove 114B and the recess 116B, and the lead terminal 30B is attached to the housing 100.

  Subsequently, the multilayer capacitor 1 is inserted into the accommodation space V. At this time, the multilayer capacitor 1 is pushed into the accommodation space V while the claws 108A and 108B are deformed by the external electrodes 12A and 12B of the multilayer capacitor 1.

  The multilayer capacitor 1 pushed into the accommodation space V is supported by the lead terminals 30A and 30B. Specifically, the external electrode 12A is in contact with the third and seventh portions 30Ac, 30Ah of the lead terminal 30A, and the external electrode 12B is in contact with the third and seventh portions 30Bc, 30Bh of the lead terminal 30B, The multilayer capacitor 1 is accommodated in the accommodation space V.

  The distance between the fifth and ninth portions 30Ae and 30Ai of the lead terminal 30A is set to be slightly larger than the width of the external electrode 12A of the multilayer capacitor 1, and the external electrode 12A is connected to the fifth portion 30Ae and the ninth portion. It is located between the portion 30Ai. In the state where the lead terminal 30A is attached to the housing 100, the distance between the fourth and eighth portions 30Ad, 30Ah of the lead terminal 30A and the claw portion 108A is slightly smaller than the height of the external electrode 12A of the multilayer capacitor 1. Is set. Therefore, when the multilayer capacitor 1 is accommodated in the accommodation space V, the multilayer capacitor 1 pushes the fourth and eighth portions 30Ad and 30Ah of the lead terminal 30A toward the side surface 100c. At this time, the fourth portion 30Ad of the lead terminal 30A has an acute angle with respect to the second portion 30Ab, and the eighth portion 30Ah has an acute angle with respect to the sixth portion 30Af (see FIG. 20). Accordingly, an elastic force for returning to the original shape is generated in the lead terminal 30A, and an elastic force in the direction of the claw portion 108A (in the direction of the side surface 100d) is applied to the multilayer capacitor 1.

  The distance between the fifth and ninth portions 30Be and 30Bi of the lead terminal 30B is set to be slightly larger than the width of the external electrode 12B of the multilayer capacitor 1, and the external electrode 12B includes the fifth portion 30Be and the ninth portion. It is located between the portion 30Bi. In the state where the lead terminal 30B is attached to the housing 100, the distance between the fourth and eighth portions 30Bd, 30Bh of the lead terminal 30B and the claw portion 108B is slightly smaller than the height of the external electrode 12B of the multilayer capacitor 1. Is set. Therefore, when the multilayer capacitor 1 is accommodated in the accommodation space V, the multilayer capacitor 1 pushes the fourth and eighth portions 30Bd and 30Bh of the lead terminal 30B toward the side surface 100c. At this time, the fourth portion 30Bd of the lead terminal 30B has an acute angle with respect to the second portion 30Bb, and the eighth portion 30Bh has an acute angle with respect to the sixth portion 30Bf (see FIG. 20). Therefore, an elastic force for returning to the original shape is generated in the lead terminal 30B, and an elastic force in the direction of the claw portion 108B (in the direction of the side surface 100d) is applied to the multilayer capacitor 1.

  The multilayer capacitor 1 is pressed against the claw portions 108A and 108B by the elastic force in the direction of the claw portions 108A and 108B (from the side surface 100d) applied from the lead terminals 20A and 20B. Therefore, the multilayer capacitor 1 is sandwiched between the lead terminals 20A and 20B and the claw portions 108A and 108B.

  The electronic component E11 according to the eleventh embodiment as described above has the same operational effects as the electronic component E1 according to the first embodiment described above.

  In the eleventh embodiment, the third and seventh portions 30Ac, 30Ag of the lead terminal 30A are bent after being inserted into the groove 114A, and are accommodated in the recess 116A. The third and seventh portions 30Bc, 30Bg of the lead terminal 30B are attached to the body 100, bent after being inserted into the groove 114B, and accommodated in the recess 116B, so that the lead terminal 30B is a housing. 100 is attached. In this way, the third and seventh portions 30Ac, 30Ag of the lead terminal 30A are securely held in the recess 116A, and the third and seventh portions 30Bc, 30Bg of the lead terminal 30B are held in the recess 116B. Holds securely. Therefore, the lead terminals 30 </ b> A and 30 </ b> B can be reliably held by the housing 100. Further, the third and seventh portions 30Ac and 30Ag of the lead terminal 30A enter the recess 116A, and the third and seventh portions 30Bc and 30Bg of the lead terminal 30B enter the recess 116B. It does not protrude outside of 100. As a result, the electronic component E11 as a whole can be downsized.

[12] Twelfth Embodiment Next, an electronic component E12 according to a twelfth embodiment will be described with reference to FIGS. Below, it demonstrates centering around difference with the electronic component E11 which concerns on 11th Embodiment, and the overlapping description is abbreviate | omitted.

  In the present embodiment, the fourth portion 30Ad of the lead terminal 30A has an attachment angle with respect to the second portion 30Ab that is not 90 ° but an obtuse angle with respect to the second portion 30Ab (from the first portion 30Aa It is mounted at an angle (so as to move away). The eighth portion 30Ah is attached obliquely so that the attachment angle with respect to the sixth portion 30Af is not 90 ° but becomes an obtuse angle with respect to the sixth portion 30Af (away from the first portion 30Aa). Yes.

  When the lead terminal 30A is attached to the housing 100, the distance between the fourth and eighth portions 30Ad, 30Ah of the lead terminal 30A and the claw portion 108A is substantially the same as the height of the external electrode 12A of the multilayer capacitor 1. Is set. Therefore, when the multilayer capacitor 1 is accommodated in the accommodation space V, the multilayer capacitor 1 pushes the fourth and eighth portions 30Ad and 30Ah of the lead terminal 30A toward the side surface 100c. At this time, the fourth portion 30Ad of the lead terminal 30A is approximately 90 ° with respect to the second portion 30Ab, and the eighth portion 30Ah is approximately 90 ° with respect to the sixth portion 30Af (see FIG. 22). . Accordingly, an elastic force for returning to the original shape is generated in the lead terminal 30A, and an elastic force in the direction of the claw portion 108A (in the direction of the side surface 100d) is applied to the multilayer capacitor 1.

  Further, the fourth portion 30Bd of the lead terminal 30B has an attachment angle with respect to the second portion 30Bb that is not 90 ° but an obtuse angle with respect to the second portion 30Bb (so as to be away from the first portion 30Ba). ) It is installed diagonally. The eighth portion 30Bh is attached obliquely so that the attachment angle with respect to the sixth portion 30Bf is not 90 ° but becomes an obtuse angle with respect to the sixth portion 30Bf (away from the first portion 30Ba). Yes.

  In the state where the lead terminal 30B is attached to the housing 100, the distance between the fourth and eighth portions 30Bd, 30Bh of the lead terminal 30B and the claw portion 108B is substantially the same as the height of the external electrode 12B of the multilayer capacitor 1. Is set. Therefore, when the multilayer capacitor 1 is accommodated in the accommodation space V, the multilayer capacitor 1 pushes the fourth and eighth portions 30Bd and 30Bh of the lead terminal 30B toward the side surface 100c. At this time, the fourth portion 30Bd of the lead terminal 30B is approximately 90 ° with respect to the second portion 30Bb, and the eighth portion 30Bh is approximately 90 ° with respect to the sixth portion 30Bf (see FIG. 22). . Therefore, an elastic force for returning to the original shape is generated in the lead terminal 30B, and an elastic force in the direction of the claw portion 108B (in the direction of the side surface 100d) is applied to the multilayer capacitor 1.

  The electronic component E12 according to the twelfth embodiment as described above exhibits the same operational effects as the electronic component E11 according to the eleventh embodiment described above.

[13] Thirteenth Embodiment Next, an electronic component E13 according to a thirteenth embodiment will be described with reference to FIGS. Below, it demonstrates centering around difference with the electronic component E1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

In the lead terminal 20A of the electronic component E13, a circular opening 28A ₁ (opening for mounting member) is formed in the vicinity of the other end of the fifth portion 20Ae. Opening 28A ₁ is screw 202A (mounting member) is large enough to be inserted. In the present embodiment, as shown in FIG. 24, the lead terminal 20A is attached to the circuit board 200 via a screw 202A.

Further, in the lead terminal 20B of the electronic component E13, a circular opening 28B ₁ (opening for mounting member) is formed in the vicinity of the other end of the fifth portion 20Be. Opening 28B ₁ is screw 202B (mounting member) is large enough to be inserted. In the present embodiment, as shown in FIG. 24, the lead terminal 20B is attached to the circuit board 200 via the screw 202B.

  The electronic component E13 according to the thirteenth embodiment as described above has the same effects as the electronic component E1 according to the first embodiment described above.

  In the thirteenth embodiment, the lead terminals 20A and 20B are attached to the circuit board 200 via the screws 202A and 202B, respectively. If it does in this way, when connecting lead terminal 20A, 20B to each circuit electrode (not shown) of circuit board 200, processes, such as soldering, become unnecessary. As a result, the process becomes simple and the electronic component E13 can be manufactured at a low cost. Further, when the connection between the lead terminal 20A and the circuit electrode of the circuit board 200 and the connection between the lead terminal 20B and the circuit electrode of the circuit board are performed by soldering or the like, the multilayer capacitor 1 may be damaged by thermal shock. However, in the present embodiment, as described above, a process such as soldering is not necessary, so that there is almost no possibility that the multilayer capacitor 1 is damaged by thermal shock.

  In this embodiment, the screws 202A and 202B are used to attach the lead terminals 20A and 20B to the circuit board 200. However, the lead terminals 20A and 20B and the circuit board 200 can be connected without being heated, and thus conductive. Various connecting members such as nuts and bolts and rivets can be used as long as they have properties.

[14] Fourteenth Embodiment Next, an electronic component E14 according to a fourteenth embodiment will be described with reference to FIG. Below, it demonstrates centering around difference with the electronic component E13 which concerns on 13th Embodiment, and the overlapping description is abbreviate | omitted.

In the lead terminal 20A of the electronic component E14, a slit-shaped notch 28A ₂ (a notch for mounting member) is formed in the vicinity of the other end of the fifth portion 20Ae. Notch 28A ₂ extends in the extending direction of the fifth portion 20Ae from the vicinity of the other end of the fifth portion 20Ae to the edge of the other end. Similarly, in the lead terminal 20B of the electronic component E14, a slit-shaped notch 28B ₂ (notch for mounting member) is formed near the other end of the fifth portion 20Be. Notch 28B ₂ extend in the extending direction of the fifth portion 20Be from the vicinity of the other end of the fifth portion 20Be to the edge of the other end.

  The electronic component E14 according to the fourteenth embodiment as described above exhibits the same operational effects as the electronic component E13 according to the thirteenth embodiment described above.

[15] Fifteenth Embodiment Next, an electronic component E15 according to a fifteenth embodiment will be described with reference to FIGS. Below, it demonstrates centering around difference with the electronic component E1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

  The casing 100 of the electronic component E15 does not have the insertion holes 102A and 102B. Further, the recesses 106A and 106B are not formed on the side surface 100c of the housing 100 of the electronic component E15. Instead, the housing 100 has insertion holes 128A, 128B, 130A, 130B and recesses 132A, 132B.

  The insertion holes 128A, 128B, 130A, 130B extend along the opposing direction of the side surfaces 100c, 100d. The insertion hole 128A is located between the accommodation space V and the side surface 100a and closer to the side surface 100e. The insertion hole 128B is located between the accommodation space V and the side surface 100b and closer to the side surface 100e. The insertion hole 130A is located between the accommodation space V and the side surface 100a and closer to the side surface 100f. The insertion hole 130B is located between the accommodation space V and the side surface 100b and closer to the side surface 100f.

  The recesses 132A and 132B are formed on the side surface 100c. The recess 132A has a U shape, one end is connected to the lower end of the insertion hole 128A, the other end is connected to the lower end of the insertion hole 130A, and the central portion extends to the side surface 100a. The recess 132B has a U shape, one end is connected to the lower end of the insertion hole 128B, the other end is connected to the lower end of the insertion hole 130B, and the center extends to the side surface 100b.

  The electronic component E15 includes lead terminals 40A and 40B having different configurations from the lead terminals 20A and 20B of the electronic component E1.

  The lead terminal 40A (first lead terminal) is configured by bending a metal rod-like body. The lead terminal 40A has round bar-shaped first to thirteenth portions 40Aa to 40Am (see FIG. 28). The first portion 40Aa (folded portion) is inserted into the insertion hole 128A. One end of the first portion 40Aa is exposed on the side surface 100d of the housing 100, and the other end of the first portion 40Aa is exposed on the side surface 100c of the housing 100. The second portion 40Ab (folded portion) is disposed between the accommodation space V and the insertion hole 128A. One end of the second portion 40Ab is connected to one end of the first portion 40Aa, and the other end of the second portion 40Ab faces the accommodation space V.

  The third portion 40Ac (one end portion, the 1-1 support portion) extends in the facing direction of the side surfaces 100c and 100d in the housing space V in a state slightly separated from the wall of the housing space V. The side surface 10a of the dielectric body 10 of the multilayer capacitor 1 is opposed. Therefore, the third portion 40Ac is movable in the direction opposite to the side surfaces 100a and 100b. One end of the third portion 40Ac is connected to the other end of the second portion 40Ab, and the other end of the third portion 40Ac is located near the bottom surface of the accommodation space V.

  The fourth portion 40Ad (one end portion, the first-second support portion) extends in the direction opposite to the side surfaces 100a and 100b in the vicinity of the bottom surface of the accommodation space V, and the dielectric element body 10 of the multilayer capacitor 1 It faces the side surface 10c. One end of the fourth portion 40Ad is connected to the other end of the third portion 40Ac, and the other end of the fourth portion 40Ad is located below the side surface 10c of the dielectric body 10 of the multilayer capacitor 1. ing. The first and second portions 40Aa and 40Ab extending from the third and fourth portions 40Ac and 40Ad are folded portions that are folded back toward the third and fourth portions 40Ac and 40Ad.

  The fifth portion 40Ae (the other end) extends in the opposing direction of the side surfaces 100a and 100b in the recess 132A. One end of the fifth portion 40Ae is connected to the other end of the first portion 40Aa, and the other end of the fifth portion 40Ae is exposed to the side surface 100a of the housing 100. The sixth portion 40Af (the other end portion) extends in the opposing direction of the side surfaces 100e and 100f in the recess 132A. One end of the sixth portion 40Af is connected to the other end of the sixth portion 40Af, and the other end of the sixth portion 40Af is located in the vicinity of the central portion in the recess 132A.

  The seventh portion 40Ag (folded portion) is inserted into the insertion hole 130A. One end of the seventh portion 40Ag is exposed on the side surface 100d of the housing 100, and the other end of the seventh portion 40Ag is exposed on the side surface 100c of the housing 100. The eighth portion 40Ah (folded portion) is disposed between the accommodation space V and the insertion hole 130A. One end of the eighth portion 40Ah is connected to one end of the seventh portion 40Ag, and the other end of the eighth portion 40Ah faces the accommodation space V.

  The ninth portion 40Ai (one end portion, the 1-1 support portion) extends in the facing direction of the side surfaces 100c and 100d in the housing space V in a state slightly separated from the wall of the housing space V. The side surface 10a of the dielectric body 10 of the multilayer capacitor 1 is opposed. Therefore, the ninth portion 40Ai is movable in the direction opposite to the side surfaces 100a and 100b. One end of the ninth portion 40Ai is connected to the other end of the eighth portion 40Ah, and the other end of the ninth portion 40Ai is located near the bottom surface of the accommodation space V.

  The tenth portion 40Aj (one end portion, the first-second support portion) extends in the direction opposite to the side surfaces 100a and 100b in the vicinity of the bottom surface of the accommodation space V, and the dielectric body 10 of the multilayer capacitor 1 It faces the side surface 10c. One end of the tenth portion 40Aj is connected to the other end of the ninth portion 40Ai, and the other end of the tenth portion 40Aj is located below the side surface 10c of the dielectric body 10 of the multilayer capacitor 1. ing. The seventh and eighth portions 40Ag and 40Ah extending from the ninth and tenth portions 40Ai and 40Aj are folded portions that are folded back to the ninth and tenth portions 40Ai and 40Aj.

  The eleventh portion 40Ak (the other end) extends in the opposing direction of the side surfaces 100a and 100b in the recess 132A. One end of the eleventh portion 40Ak is connected to the other end of the seventh portion 40Ag, and the other end of the eleventh portion 40Ak is exposed to the side surface 100a of the housing 100. The twelfth portion 40Al (the other end portion) extends in the opposing direction of the side surfaces 100e and 100f in the recess 132A. One end of the twelfth portion 40Al is connected to the other end of the twelfth portion 40Al, and the other end of the twelfth portion 40Al is located in the vicinity of the central portion in the recess 132A.

  The thirteenth portion 40Am (one end portion, the first or second support portion) extends in the direction opposite to the side surfaces 100e and 100f in the vicinity of the bottom surface of the accommodation space V, and the dielectric body 10 of the multilayer capacitor 1 It faces the side surface 10c. One end of the thirteenth portion 40Am is connected to the other end of the fourth portion 40Bd, and the other end of the thirteenth portion 40Am is connected to the other end of the tenth portion 40Aj.

  The lead terminal 40B (second lead terminal) is configured by bending a metal rod-like body. The lead terminal 40B has round bar-shaped first to thirteenth portions 40Ba to 40Bm (see FIG. 28). The first portion 40Ba (folded portion) is inserted into the insertion hole 128B. One end of the first portion 40Ba is exposed on the side surface 100d of the housing 100, and the other end of the first portion 40Ba is exposed on the side surface 100c of the housing 100. The second portion 40Bb (folded portion) is disposed between the accommodation space V and the insertion hole 128B. One end of the second portion 40Bb is connected to one end of the first portion 40Ba, and the other end of the second portion 40Bb faces the accommodation space V.

  The third portion 40Bc (one end portion, the 2-1 support portion) extends in the facing direction of the side surfaces 100c and 100d in the housing space V in a state slightly separated from the wall of the housing space V. The side surface 10b of the dielectric body 10 of the multilayer capacitor 1 is opposed. Therefore, the third portion 40Bc is movable in the direction opposite to the side surfaces 100a and 100b. One end of the third portion 40Bc is connected to the other end of the second portion 40Bb, and the other end of the third portion 40Bc is located near the bottom surface of the accommodation space V.

  The fourth portion 40Bd (one end portion, the 2-2 support portion) extends in the direction opposite to the side surfaces 100a and 100b in the vicinity of the bottom surface of the accommodation space V, and the dielectric element body 10 of the multilayer capacitor 1 It faces the side surface 10c. One end of the fourth portion 40Bd is connected to the other end of the third portion 40Bc, and the other end of the fourth portion 40Bd is located below the side surface 10c of the dielectric body 10 of the multilayer capacitor 1. ing. The first and second portions 40Ba and 40Bb extending from the third and fourth portions 40Bc and 40Bd are folded portions that are folded back toward the third and fourth portions 40Bc and 40Bd.

  5th part 40Be (other end part) is extended in the opposing direction of side surface 100a, 100b in the recessed part 132B. One end of the fifth portion 40Be is connected to the other end of the first portion 40Ba, and the other end of the fifth portion 40Be is exposed to the side surface 100b of the housing 100. The sixth portion 40Bf (the other end portion) extends in the opposing direction of the side surfaces 100e and 100f in the recess 132B. One end of the sixth portion 40Bf is connected to the other end of the sixth portion 40Bf, and the other end of the sixth portion 40Bf is located in the vicinity of the central portion in the recess 132B.

  The seventh portion 40Bg (folded portion) is inserted into the insertion hole 130B. One end of the seventh portion 40Bg is exposed on the side surface 100d of the housing 100, and the other end of the seventh portion 40Bg is exposed on the side surface 100c of the housing 100. The eighth portion 40Bh (folded portion) is disposed between the accommodation space V and the insertion hole 130B. One end of the eighth portion 40Bh is connected to one end of the seventh portion 40Bg, and the other end of the eighth portion 40Bh faces the accommodation space V.

  The ninth portion 40Bi (one end portion, the 2-1 support portion) extends in the facing direction of the side surfaces 100c and 100d in the housing space V in a state slightly separated from the wall of the housing space V. The side surface 10b of the dielectric body 10 of the multilayer capacitor 1 is opposed. Therefore, the ninth portion 40Bi can move in the direction in which the side surfaces 100a and 100b face each other. One end of the ninth portion 40Bi is connected to the other end of the eighth portion 40Bh, and the other end of the ninth portion 40Bi is located near the bottom surface of the accommodation space V.

  The tenth portion 40Bj (one end portion, the 2-2 support portion) extends in the direction opposite to the side surfaces 100a and 100b in the vicinity of the bottom surface of the accommodation space V, and the dielectric body 10 of the multilayer capacitor 1 It faces the side surface 10c. One end of the tenth portion 40Bj is connected to the other end of the ninth portion 40Bi, and the other end of the tenth portion 40Bj is located below the side surface 10c of the dielectric body 10 of the multilayer capacitor 1. ing. The seventh and eighth portions 40Bg and 40Bh extending from the ninth and tenth portions 40Bi and 40Bj are folded portions that are folded back toward the ninth and tenth portions 40Bi and 40Bj.

  The eleventh portion 40Bk (other end portion) extends in the opposing direction of the side surfaces 100a and 100b in the recess 132B. One end of the eleventh portion 40Bk is connected to the other end of the seventh portion 40Bg, and the other end of the eleventh portion 40Bk is exposed to the side surface 100b of the housing 100. The twelfth portion 40B1 (the other end portion) extends in the facing direction of the side surfaces 100e and 100f in the recess 132B. One end of the twelfth portion 40Bl is connected to the other end of the twelfth portion 40Bl, and the other end of the twelfth portion 40Bl is located in the vicinity of the center in the recess 132B.

  The thirteenth portion 40Bm (one end portion, the 2-2 support portion) extends in the direction opposite to the side surfaces 100e and 100f in the vicinity of the bottom surface of the accommodation space V, and the dielectric body 10 of the multilayer capacitor 1 It faces the side surface 10c. One end of the thirteenth portion 40Bm is connected to the other end of the fourth portion 40Bd, and the other end of the thirteenth portion 40Bm is connected to the other end of the tenth portion 40Bj.

  Before the assembly of the electronic component E15, as shown in FIG. 28, the fifth and sixth portions 40Ae, 40Af of the lead terminal 40A are not bent and are linear with the first portion 40Aa. The eleventh and twelfth portions 40Ak, 40Al of the lead terminal 40A are not bent, are linear with the seventh portion 40Ag, and the fifth and sixth portions 40Be, 40Bf of the lead terminal 40B are bent. The eleventh and twelfth portions 40Bk and 40Bl of the lead terminal 40B are not bent and are linear with the seventh portion 40Bg. Yes. Further, the third portion 40Ac of the lead terminal 40A has an attachment angle with respect to the second portion 40Ab that is not 90 ° but an obtuse angle with respect to the second portion 40Ab (so as to be away from the first portion 40Aa). ) The ninth portion 40Ai of the lead terminal 40A is attached obliquely so that the attachment angle with respect to the eighth portion 40Ah is not 90 ° but an obtuse angle with respect to the eighth portion 40Ah (seventh) The third portion 40Bc of the lead terminal 40B has an attachment angle with respect to the second portion 40Bb that is not 90 ° but an obtuse angle with respect to the second portion 40Bb. So that the ninth portion 40Bi of the lead terminal 40B is opposite to the eighth portion 40Bh. Mounting angle is at 90 ° rather than mounted obliquely (away from the seventh partial 40Bg) such that an obtuse angle with respect to the eighth part 40Bh that.

  When the lead terminal 40A is attached to the housing 100, the third, fourth, ninth, tenth and thirteenth portions 40Ac, 40Ad, 40Ai, 40Aj, 40Am of the lead terminal 40A are located in the accommodation space V. As described above, while inserting the first, fifth and sixth portions 40Aa, 40Ae, 40Af of the lead terminal 40A into the insertion hole 128A, the seventh, eleventh and twelfth portions 40Ag, 40Ak, 40Al is inserted into the insertion hole 130A. Subsequently, the fifth, sixth and eleventh portions 40Ae and 40Af are positioned in the recess 132A, and the eleventh and twelfth portions 40Ak and 40Al are positioned in the recess 132A. And the twelfth portions 40Ae, 40Af, 40Ak, 40Al are bent. As a result, the first to third portions 40Aa to 40Ac exhibiting a U shape are caught in the portion of the housing 100 between the accommodation space V and the insertion hole 128A, and the seventh to ninth shapes exhibiting a U shape are formed. The portions 40Ag to 40Ai are hooked on the portion of the housing 100 between the accommodation space V and the insertion hole 130A, and the first and fifth portions 40Aa and 40Ae having an L shape are hooked on the recess 132A. The present seventh and eleventh portions 40Ag, 40Ak are caught in the recess 132A. Accordingly, the lead terminal 40A is held in the housing 100.

  Similarly, when the lead terminal 40B is attached to the housing 100, the third, fourth, ninth, tenth and thirteenth portions 40Bc, 40Bd, 40Bi, 40Bj, and 40Bm of the lead terminal 40B are in the accommodation space V. The seventh, eleventh and twelfth portions 40Bg, 40Bg of the lead terminal 40B are inserted while inserting the first, fifth and sixth portions 40Ba, 40Be, 40Bf of the lead terminal 40B into the insertion hole 128A. 40Bk and 40Bl are inserted into the insertion hole 130A. Subsequently, the fifth, sixth and eleventh portions 40Be and 40Bf are located in the recess 132B, and the eleventh and twelfth portions 40Bk and 40Bl are located in the recess 132B. And the twelfth portions 40Be, 40Bf, 40Bk, 40Bl are bent. Thereby, the 1st-3rd part 40Ba-40Bc which exhibits U shape is hooked in the part between the accommodation space V and the insertion hole 128B among the housing | casing 100, and 7th-9th which exhibits U shape. The portions 40Bg to 40Bi are hooked on a portion of the housing 100 between the accommodation space V and the insertion hole 130B, and the first and fifth portions 40Ba and 40Be having an L shape are hooked on the recess 132B, thereby forming the L shape. The present seventh and eleventh portions 40Bg, 40Bk are caught in the recess 132B. Therefore, the lead terminal 40B is held by the housing 100.

  The electronic component E15 according to the fifteenth embodiment as described above has the same operational effects as the electronic component E1 according to the first embodiment described above.

[16] Sixteenth Embodiment Next, an electronic component E16 according to a sixteenth embodiment will be described with reference to FIGS. Below, it demonstrates centering around difference with the electronic component E15 which concerns on 15th Embodiment, and the overlapping description is abbreviate | omitted.

  Concave portions 132A and 132B are not formed on the side surface 100c of the housing 100 of the electronic component E16. Further, the fifth and sixth portions 40Ae and 40Af of the lead terminal 40A are not bent and are linear with the first portion 40Aa, and the eleventh and twelfth portions 40Ak and 40Al of the lead terminal 40A. Is not bent and is linear with the seventh portion 40Ag, and the fifth and sixth portions 40Be and 40Bf of the lead terminal 40B are not bent and linear with the first portion 40Ba. The eleventh and twelfth portions 40Bk and 40Bl of the lead terminal 40B are not bent and are linear with the seventh portion 40Bg.

  When the electronic component E16 is mounted on the circuit board 200, the fifth and sixth portions 40Ae and 40Af of the lead terminal 40A are inserted into openings (not shown) provided in the circuit board 200, and the lead terminal The eleventh and twelfth portions 40Ak and 40Al of 40A are inserted through the opening 200a (see FIG. 30) provided in the circuit board 200. Further, the fifth and sixth portions 40Be and 40Bf of the lead terminal 40B are inserted into openings (not shown) provided in the circuit board 200, and the eleventh and twelfth portions 40Bk and 40Bl of the lead terminal 40B are inserted. Is inserted into an opening 200b (see FIG. 30) provided in the circuit board 200. Subsequently, the sixth and twelfth portions 40Af and 40Al of the lead terminal 40A are soldered to the circuit board 200, and the sixth and twelfth portions 40Bf and 40Bl of the lead terminal 40B are soldered to the circuit board 200.

  The electronic component E16 according to the sixteenth embodiment as described above has the same operational effects as the electronic component E1 according to the first embodiment described above.

[17] Seventeenth Embodiment Next, an electronic component E17 according to a seventeenth embodiment will be described with reference to FIGS. Below, it demonstrates centering around difference with the electronic component E1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

  The housing 100 of the electronic component E17 does not have the insertion holes 102A and 102B. Further, the concave portions 106A and 106B are not formed on the side surface 100c of the housing 100 of the electronic component E17. Instead, the housing 100 has insertion holes 134A and 134B.

  The insertion holes 134A and 134B extend along the opposing direction of the side surfaces 100c and 100d. The insertion hole 134A is located between the accommodation space V and the side surface 100a and at the center of the side surfaces 100e and 100f. The insertion hole 134B is located between the accommodation space V and the side surface 100b and at the center of the side surfaces 100e and 100f.

  The electronic component E17 includes lead terminals 50A and 50B having different configurations from the lead terminals 20A and 20B of the electronic component E1.

  The lead terminal 50A (first lead terminal) is configured by bending a metal rod-like body. The lead terminal 50A has first to seventh portions 50Aa to 50Ag having a round bar shape (see FIG. 33). The first portion 50Aa (the folded portion, the other end portion) is inserted into the insertion hole 134A. One end of the first portion 50Aa is exposed at the side surface 100d of the housing 100, and the other end of the first portion 50Aa is located outside the side surface 100c of the housing 100. The second portion 50Ab (folded portion) is disposed between the accommodation space V and the insertion hole 134A. One end of the second portion 50Ab is connected to one end of the first portion 50Aa, and the other end of the second portion 50Ab faces the accommodation space V.

  The third portion 50Ac (folded portion) extends in the direction in which the side surfaces 100e and 100f face each other in the vicinity of the opening 104, and faces the side surface 10a of the dielectric body 10 of the multilayer capacitor 1. One end of the third portion 50Ac is connected to the other end of the second portion 50Ab, and the other end of the third portion 50Ac is near the opening 104, near the side surface 100a and near the side surface 100e. Located in the corner.

  The fourth portion 50Ad (one end portion, the 1-1 support portion) extends in the opposing direction of the side surfaces 100c and 100d in the accommodation space V in a state slightly separated from the wall of the accommodation space V. The side surface 10a of the dielectric body 10 of the multilayer capacitor 1 is opposed. Therefore, the fourth portion 50Ad is movable in the direction opposite to the side surfaces 100a and 100b. One end of the fourth portion 50Ad is connected to the other end of the third portion 50Ac, and the other end of the fourth portion 50Ad is located near the bottom surface of the accommodation space V. The first and second portions 40Aa and 40Ab extending from the third and fourth portions 50Ac and 50Ad are folded portions that are folded back toward the third and fourth portions 50Ac and 50Ad.

  The fifth portion 50Ae (one end portion) extends in the direction opposite to the side surfaces 100a and 100b in the vicinity of the bottom surface of the accommodation space V. One end of the fifth portion 50Ae is connected to the other end of the fourth portion 50Ad, and the other end of the fifth portion 50Ae is located near the bottom surface of the accommodation space V.

  The sixth portion 50Af (one end portion, the first or second support portion) extends in the direction opposite to the side surfaces 100e and 100f in the vicinity of the bottom surface of the housing space V, and the dielectric body 10 of the multilayer capacitor 1 It faces the side surface 10c. One end of the sixth portion 50Af is connected to the other end of the fifth portion 50Ae, and the other end of the sixth portion 50Af is located near the bottom surface of the accommodation space V and closer to the side surface 100f.

  The seventh portion 50Ag (one end portion, the first or second support portion) extends in the direction in which the side surfaces 100a and 100b face each other in the vicinity of the bottom surface of the accommodation space V, and the dielectric element body 10 of the multilayer capacitor 1 It faces the side surface 10c. One end of the seventh portion 50Ag is connected to the other end of the sixth portion 50Af, and the other end of the seventh portion 50Ag is near the bottom surface of the accommodation space V and close to the side surface 100a and the side surface 100f. Located in the corner of the side.

  The lead terminal 50B (second lead terminal) is configured by bending a metal rod-like body. The lead terminal 50B has round bar-shaped first to seventh portions 50Ba to 50Bg (see FIG. 33). The first portion 50Ba (the folded portion, the other end portion) is inserted into the insertion hole 134B. One end of the first portion 50Ba is exposed on the side surface 100d of the housing 100, and the other end of the first portion 50Ba is located outside the side surface 100c of the housing 100. The second portion 50Bb (folded portion) is disposed between the accommodation space V and the insertion hole 134B. One end of the second portion 50Bb is connected to one end of the first portion 50Ba, and the other end of the second portion 50Bb faces the accommodation space V.

  The third portion 50Bc (folded portion) extends in the direction in which the side surfaces 100e and 100f face each other in the vicinity of the opening 104, and faces the side surface 10b of the dielectric body 10 of the multilayer capacitor 1. One end of the third portion 50Bc is connected to the other end of the second portion 50Bb, and the other end of the third portion 50Bc is near the opening 104, near the side surface 100b and near the side surface 100f. Located in the corner.

  The fourth portion 50Bd (one end portion, the 2-1 support portion) extends in the facing direction of the side surfaces 100c and 100d in the housing space V in a state slightly separated from the wall of the housing space V. The side surface 10b of the dielectric body 10 of the multilayer capacitor 1 is opposed. Therefore, the fourth portion 50Bd is movable in the direction opposite to the side surfaces 100a and 100b. One end of the fourth portion 50Bd is connected to the other end of the third portion 50Bc, and the other end of the fourth portion 50Bd is located near the bottom surface of the accommodation space V. The first and second portions 40Ba and 40Bb extending from the third and fourth portions 50Bc and 50Bd are folded portions that are folded back toward the third and fourth portions 50Bc and 50Bd.

  The fifth portion 50Be (one end portion) extends in the direction opposite to the side surfaces 100a and 100b in the vicinity of the bottom surface of the accommodation space V. One end of the fifth portion 50Be is connected to the other end of the fourth portion 50Bd, and the other end of the fifth portion 50Be is located near the bottom surface of the accommodation space V.

  The sixth portion 50Bf (one end portion, the 2-2 support portion) extends in the direction in which the side surfaces 100e and 100f face each other in the vicinity of the bottom surface of the accommodation space V, and the dielectric body 10 of the multilayer capacitor 1 It faces the side surface 10c. One end of the sixth portion 50Bf is connected to the other end of the fifth portion 50Be, and the other end of the sixth portion 50Bf is located near the bottom surface of the accommodation space V and closer to the side surface 100e.

  The seventh portion 50Bg (one end portion, the 2-2 support portion) extends in the direction opposite to the side surfaces 100a and 100b in the vicinity of the bottom surface of the accommodation space V, and the dielectric element body 10 of the multilayer capacitor 1 It faces the side surface 10c. One end of the seventh portion 50Bg is connected to the other end of the sixth portion 50Bf, and the other end of the seventh portion 50Bg is near the bottom surface of the accommodation space V and close to the side surface 100b and side surface 100e. Located in the corner of the side.

  The electronic component E17 according to the seventeenth embodiment as described above has the same operational effects as the electronic component E1 according to the first embodiment described above.

[18] Eighteenth Embodiment Next, an electronic component E18 according to an eighteenth embodiment will be described with reference to FIGS. Below, it demonstrates centering around difference with the electronic component E6 which concerns on 6th Embodiment, and the overlapping description is abbreviate | omitted.

  The multilayer capacitor 1 of the electronic component E18 according to the eighteenth embodiment is a multi-terminal capacitor, and further includes terminal electrodes 12C and 12D in addition to the external electrodes 12A and 12B.

  The terminal electrode 12C has a rectangular shape and is formed so as to cover the central portion of the side surface 10f of the dielectric body 10 and to wrap around the side surfaces 10c and 10d adjacent to the side surface 10f. That is, the terminal electrode 12C is disposed at the center portion of the side surface 10f and the portion of the side surfaces 10c and 10d near the side surface 10f.

  The terminal electrode 12D has a rectangular shape and is formed so as to cover the central portion of the side surface 10e of the dielectric body 10 and to wrap around the side surfaces 10c and 10d adjacent to the side surface 10e. That is, the terminal electrode 12D is disposed at the center portion of the side surface 10e and the portion of the side surfaces 10c and 10d near the side surface 10e.

  In order to correspond to the multi-terminal multilayer capacitor 1, the housing 100 of the electronic component E18 according to the eighteenth embodiment has insertion holes 102C and 102D in addition to the insertion holes 102A and 102B, and has two claw portions. 108A and two claw portions 108B.

  The one claw portion 118A is provided on the side surface 100d, and is located between the accommodation space V and the side surface 100f and closer to the side surface 100a. The other claw portion 118A is provided on the side surface 100d, and is located between the accommodation space V and the side surface 100f and closer to the side surface 100b.

  One claw portion 118B is provided on the side surface 100d, and is located between the accommodation space V and the side surface 100e and closer to the side surface 100a. The other claw portion 118B is provided on the side surface 100d, and is located between the accommodation space V and the side surface 100e and closer to the side surface 100b.

  Similar to the insertion holes 102A and 102B, the insertion holes 102C and 102D extend in the direction opposite to the side surfaces 100c and 100d. The insertion hole 102C is located between the accommodation space V and the side surface 100f and between the two claw portions 108A. The insertion hole 102D is located between the accommodation space V and the side surface 100e and between the two claw portions 108B.

  In order to deal with the multi-terminal multilayer capacitor 1, the electronic component E18 according to the eighteenth embodiment includes lead terminals 20C and 20D in addition to the lead terminals 20A and 20B. The lead terminals 20C and 20D are configured similarly to the lead terminals 20A and 20B, and are inserted through the corresponding insertion holes 102C and 102D. The lead terminals 20C and 20D are attached to the housing 100 in the same manner as the lead terminals 20A and 20B.

  When the electronic component E18 is assembled, portions of the terminal electrode 12C that are disposed on the side surfaces 10c and 10f are connected to the lead terminal 20C. Moreover, the part arrange | positioned on side surface 10c, 10e among terminal electrode 12D is connected with lead terminal 20D.

  The electronic component E18 according to the eighteenth embodiment as described above has the same operational effects as the electronic component E6 according to the sixth embodiment described above.

[19] Nineteenth Embodiment Next, an electronic component E19 according to a nineteenth embodiment will be described with reference to FIG. Below, it demonstrates centering around difference with the electronic component E9 which concerns on 9th Embodiment, and the overlapping description is abbreviate | omitted.

  An electronic component E19 according to the nineteenth embodiment is configured such that two multilayer capacitors 1 are accommodated in one casing 100. Therefore, the electronic component E19 includes two multilayer capacitors 1, one housing 100, two lead terminals 20A, and two lead terminals 20B.

  The casing 100 has the same configuration as that obtained by integrating two casings 100 of the electronic component E9 according to the ninth embodiment arranged side by side.

  The electronic component E19 according to the nineteenth embodiment as described above exhibits the same operational effects as the electronic component E9 according to the ninth embodiment described above.

  In the nineteenth embodiment, a capacitor array can be obtained very simply by incorporating two multilayer capacitors 1 into the housing 100.

[20] 20th Embodiment Next, an electronic component E20 according to a 20th embodiment will be described with reference to FIG. Hereinafter, differences from the electronic component E19 according to the nineteenth embodiment will be mainly described, and overlapping descriptions will be omitted.

  A groove GA that connects the communication holes 110A and a groove GB that connects the communication holes 110B are formed on the side surface 100c of the housing 100. The two lead terminals 20A are connected to each other by a connecting member CA made of a metal plate made of the same material as the lead terminal 20A, and the two lead terminals 20B are connected to each other made of a metal plate made of the same material as the lead terminal 20B. It is connected by the member CB. In the present embodiment, the two lead terminals 20A and the connection member CA are integrally formed, and the two lead terminals 20B and the connection member CB are integrally formed.

  The electronic component E20 according to the twentieth embodiment as described above has the same effects as the electronic component E9 according to the ninth embodiment described above.

  In the twentieth embodiment, the two multilayer capacitors 1 can be electrically connected in parallel only by incorporating the two multilayer capacitors 1 into the housing 100.

[21] Modified Examples Although the preferred embodiment of the present invention has been described in detail above, the present invention is not limited to the above-described embodiment. For example, the present invention may be applied to chip-type components other than the multilayer capacitor 1 (for example, chip varistors and chip inductors).

  Also, as shown in FIG. 39, the second to fourth portions 20Ac to 20Ad of the lead terminal 20A may extend in a bifurcated state from the first portion 20Aa, and the second portion of the lead terminal 20B. The fourth parts 20Bc to 20Bd may extend in a state of being divided into two forks from the first part 20Ba. In this way, the bifurcated portion moves independently, so that it is possible to further reduce the external impact and stress on the multilayer capacitor 1.

DESCRIPTION OF SYMBOLS 1 ... Multilayer capacitor 10 ... Dielectric body 10a ... Side surface (1st side surface)
10b ... side surface (second side surface)
10c ... Side surface (third side surface)
12A ... external electrode (first external electrode)
12B ... External electrode (second external electrode)
20A ... Lead terminal (first lead terminal)
20Aa ... 1st part (folding part)
20Ab ... 2nd part (folding part)
20Ac ... 3rd part (one end part, 1st support part)
20Ad ... 4th part (one end part, 2nd support part)
20Ae ... 5th part (other end part)
20Af ... 6th part (protrusion part)
20 Ag ... seventh part (other end part)
20B ... Lead terminal (second lead terminal)
20Ba ... 1st part (folding part)
20Bb ... 2nd part (folding part)
20Bc ... 3rd part (one end part)
20Bd ... 4th part (one end)
20Be ... 5th part (other end part)
20Bf ... 6th part (protrusion part)
20Bg ... 7th part (other end part)
24A ... Opening (engaging piece opening)
24B ... opening 28A ₁ , 28B ₁ ... opening (opening for mounting member)
28A ₂ , 28B ₂ ... notch (notch for mounting member)
30A ... Lead terminal (first lead terminal)
30Aa ... 1st part (other end part)
30Ac ... 3rd part (protrusion part)
30 Ag ... 7th part (protrusion)
30B ... Lead terminal (second lead terminal)
30Ba ... 1st part (other end part)
30Bc ... 3rd part (protrusion part)
40A ... Lead terminal (first lead terminal)
40Aa ... 1st part (folding part)
40Ab ... 2nd part (folding part)
40Ac ... third part (one end, first support)
40Ad ... 4th part (one end part, 2nd support part)
40Ae ... 5th part (other end part)
40Af ... 6th part (other end part)
40 Ag ... Seventh part (folded part)
40Ah: Eighth part (folded part)
40Ai ... ninth part (one end, first support)
40Aj ... Tenth part (one end, second support)
40Ak ... Eleventh part (the other end)
40Al ... 12th part (other end part)
40 Am ... thirteenth part (one end, second support)
40B ... Lead terminal (second lead terminal)
40Ba ... 1st part (folding part)
40Bb ... 2nd part (folding part)
40Bc ... 3rd part (one end part)
40Bd ... Fourth part (one end)
40Be ... 5th part (other end part)
40Bf ... 6th part (other end part)
40Bg ... 7th part (folded part)
40Bh ... 8th part (folding part)
40 Bi ... ninth part (one end)
40Bj ... Tenth part (one end)
40Bk ... Eleventh part (the other end)
40Bl ... 12th part (other end part)
40 Bm ... thirteenth part (one end)
50A ... Lead terminal (first lead terminal)
50Aa ... 1st part (folding part, other end part)
50Ab ... 2nd part (folding part)
50Ac ... 3rd part (folding part)
50Ad ... 4th part (one end, 1st support part)
50Ae ... Fifth part (one end)
50Af ... sixth part (one end, second support)
50 Ag ... seventh part (one end, second support)
50B ... Lead terminal (second lead terminal)
50Ba ... 1st part (folding part, other end part)
50Bb ... 2nd part (folding part)
50Bc ... 3rd part (folding part)
50Bd ... Fourth part (one end)
50Be ... fifth part (one end)
50Bf ... Sixth part (one end)
50Bg ... 7th part (one end)
DESCRIPTION OF SYMBOLS 100 ... Housing | casing 100a, 100b, 100e, 100f ... Side surface 100c ... Side surface (2nd main surface)
100d ... Side surface (first main surface)
104 ... opening 108A, 108B ... claw part 112A, 112B ... groove 116A ... concave part (projection part accommodating concave part)
116B ... concave portion 124A ... engagement piece (engagement piece)
124B ... engagement piece 126A ... recess (end receiving recess)
126B ... concave portion 200 ... circuit board 202A, 202B ... screw (attachment member)
E1 to E21 ... Electronic components V ... Housing space

Claims (12)

A chip-type component having an element body, and first and second external electrodes disposed on the element body;
A housing having an accommodation space for accommodating the chip-type component and having electrical insulation;
A first lead terminal and a second lead terminal held in the housing;
The casing includes a claw portion provided on the casing and including a surface facing the accommodation space,
The first lead terminal has one end located in the housing space and in contact with the first external electrode, and the other end located outside the housing,
The second lead terminal has one end located in the housing space and in contact with the second external electrode, and the other end located outside the housing,
The chip-type components located in the housing space, and one end portion of the one end portion and the second lead terminal of the first lead terminal, with being held between front tight portion, the first An electronic component being pressed against the claw portion by an elastic force of the one end portion of the lead terminal and an elastic force of the one end portion of the second lead terminal.
  The electronic component according to claim 1, wherein the first lead terminal includes a folded portion extending from the one end portion. The first lead terminal has a protruding portion protruding toward the side,
The casing is formed with a V-shaped groove having a narrower width toward the bottom,
The first lead terminal is attached to the casing by the protrusion of the first lead terminal entering the groove and being locked. Electronic components described in 1. The first lead terminal has a protruding portion protruding toward the side,
The housing has a protruding portion receiving recess for receiving the protruding portion of the first lead terminal,
2. The first lead terminal is attached to the housing by bending the protruding portion of the first lead terminal into the protruding portion accommodating recess. Or the electronic component described in 2. The element body includes a first side surface on which the first external electrode is disposed, a second side surface on which the second external electrode is disposed while facing the first side surface, and the first side surface. A third side surface connecting the side surface and the second side surface;
The one end portion of the first lead terminal has a first support portion facing the first side surface and a second support portion facing the third side surface. The electronic component according to any one of claims 1 to 4. The element body has a first side surface on which the first external electrode is disposed;
The part of the one end portion of the first lead terminal is bent so as to protrude toward the first side surface, according to any one of claims 1 to 5. Electronic parts. The housing includes a first main surface including an opening communicating with the accommodation space, a second main surface facing the first main surface, the first main surface, and the second main surface. And a side surface connecting the surface,
7. The electronic component according to claim 1, wherein a portion of the first lead terminal extending subsequent to the one end is disposed on the side surface of the housing. 8. . An engagement piece is provided on the side surface of the housing,
The electronic component according to claim 7, wherein the first lead terminal has an engagement piece opening to be engaged with the engagement piece.   The said other end part of the said 1st lead terminal located in the outer side of the said housing | casing is bent along the outer surface of the said housing | casing, The any one of Claims 1-8 characterized by the above-mentioned. Electronic components described in 1. The housing has an end receiving recess for receiving the other end of the first lead terminal,
The first lead terminal is attached to the casing by bending the other end of the first lead terminal into the end receiving recess. 9. Electronic component described in 9.   The other end of the first lead terminal has a mounting member opening or a mounting member notch through which a mounting member for mounting the first lead terminal to the circuit board is inserted. The electronic component according to claim 1, wherein the electronic component is characterized in that A first chip-type component having a first element body, and first and first and second external electrodes disposed on the first element body;
A second chip-type component having a second element body, and 2-1 and 2-2 external electrodes disposed on the second element body;
A housing having an accommodation space for accommodating the chip-type component and having electrical insulation;
Comprising first to fourth lead terminals held in the housing;
The housing is
A first claw portion including a first surface facing the housing space and provided in the housing;
A second claw portion provided on the housing and including a second surface toward the housing space;
The first lead terminal has one end located in the housing space and in contact with the first external electrode, and the other end located outside the housing.
The second lead terminal has one end located in the accommodation space and in contact with the 1-2 external electrode, and the other end located outside the housing,
The third lead terminal has one end located in the accommodation space and in contact with the 2-1 external electrode, and the other end located outside the housing.
The fourth lead terminal has one end located in the housing space and in contact with the 2-2 external electrode, and the other end located outside the housing.
The first chip-type components located in the housing space, and one end portion of the one end and the 1-2 lead terminal of the first 1-1 lead terminals, before Symbol first pawl portion And is pressed against the first claw portion by the elastic force of the one end portion of the 1-1 lead terminal and the elastic force of the one end portion of the 1-2 lead terminal. And
The second chip-type components located in the housing space, and one end portion of the one end portion and the 2-2 lead terminals of the 2-1 lead terminals, and the previous SL second claw portion And is pressed against the second claw portion by the elastic force of the one end portion of the 2-1 lead terminal and the elastic force of the one end portion of the 2-2 lead terminal. And
The first lead terminal and the third lead terminal are electrically connected,
The electronic component, wherein the second lead terminal and the fourth lead terminal are electrically connected.

Images