JP4985337B2 - Adsorption heat pump device - Google Patents

Description

  The present invention relates to an adsorption heat pump apparatus that performs a heat exchange action through adsorption and desorption of an adsorbed medium in which an adsorbent undergoes a phase change between a liquid phase and a gas phase. The present invention is suitable for application to an adsorption-type refrigeration apparatus that evaporates the adsorbed medium by using the action of adsorbing the adsorbed medium and exhibits the refrigerating capacity by the latent heat of evaporation.

In an adsorption heat pump device such as a refrigeration system using an adsorption heat exchanger, if the adsorbed medium desorbed from the adsorbent in the desorption process is condensed in the case inner wall surface or piping, the condensed water is the next adsorption process. Since the amount of the adsorbed medium evaporated from the evaporator is reduced by being adsorbed by the adsorbent, the refrigerating capacity is impaired. In order to prevent this reduction in the refrigerating capacity, in the adsorption type refrigerator shown in Patent Document 1 below, the case of the portion filled with the adsorbent is heated to the saturation temperature or higher of the adsorbed medium.
JP 9-196494 A

  However, in the structure where the evaporator or the condenser is separated from the adsorption heat exchanger (adsorber), the connection pipe connecting the evaporator and the adsorption heat exchanger or the adsorption heat exchanger and the condenser is separated by a valve. If water vapor is present in the connecting pipe closer to the adsorption heat exchanger, the water vapor may condense in the desorption process and adhere to the pipe wall as droplets. In the adsorption process after completion of desorption, latent heat is taken from the droplets condensed on the tube wall and vaporized, so it is impossible to vaporize from the evaporator to be originally vaporized, and the performance is deteriorated. There is a problem.

  The present invention has been made paying attention to such problems existing in the prior art, and its purpose is to connect an evaporator and an adsorption heat exchanger, or an adsorption heat exchanger and a condenser. An object of the present invention is to provide an adsorption heat pump device capable of preventing the adsorbed medium from condensing in a pipe part.

In order to achieve the above object, the present invention employs the following technical means. That is, in the invention described in claim 1, the evaporator (1) for evaporating the adsorbed medium, the condenser (2) for condensing the adsorbed medium, and the adsorbed medium evaporated by the evaporator (1) are sucked. An adsorption heat exchanger (3) for alternately performing an adsorption step for adsorption and a desorption step for desorbing the adsorbed medium to be discharged to the condenser (2), and the evaporator (1) and the adsorption The evaporator-side piping (4) for connecting the heat exchanger (3), and the circulation of the adsorbed medium are provided between the evaporator-side piping (4) and the adsorption heat exchanger (3). The evaporator side valve means (5), the condenser side piping (6) connecting the adsorption heat exchanger (3) and the condenser (2), the adsorption heat exchanger (3) and the condenser side piping. In the adsorption heat pump apparatus provided with the condenser side valve means (7) provided between the unit (6) and intermittently circulating the adsorbed medium,
The adsorption heat exchanger (3) has a structure in which a high-temperature heat exchange medium is circulated inside when desorbing the adsorbed medium, and is connected to the evaporator side valve means (5). The adsorbed medium inflow portion (36, 361) formed to protrude from the heat exchanger (3), and the adsorbed medium inflow portion using the heat of the heat exchange medium passed through the adsorption heat exchanger (3) It has a heating means ( 34a, 42 ) for heating (36, 361).

  According to the first aspect of the present invention, the adsorbed medium inflow portion (36, 361) that connects the evaporator side valve means (5) and the adsorption heat exchanger (3) that most affect the performance, that is, The piping part closer to the adsorption heat exchanger (3) is heated from the part divided by the evaporator side valve means (5) to prevent the adsorbed medium from condensing into droplets in this piping part. It is possible to prevent a decrease in performance.

Hereinafter, in the invention according to claim 2, in the adsorption heat pump apparatus according to claim 1, the adsorption heat exchanger (3) is connected to the condenser side valve means (7) so as to be connected to the adsorption heat exchanger. The adsorbed medium outflow part (37, 371) formed by projecting from (3), and the adsorbed medium outflow part (37, 371 ) using the heat of the heat exchange medium passed through the adsorption heat exchanger (3) It is characterized by having heating means ( 35a, 42 ) for heating 371).

  Moreover, in invention of Claim 3, in the adsorption | suction heat pump apparatus of Claim 1 or 2, a heating means (34a, 35a, 40-42) heats an evaporator side valve means (5). It is characterized by.

  Moreover, in invention of Claim 4, in the adsorption heat pump apparatus of any one of Claims 1 thru | or 3, a heating means (34a, 35a, 40-42) is a condenser side valve means ( 7) is heated.

  Moreover, in invention of Claim 5, in the adsorption heat pump apparatus of any one of Claim 1 thru | or 4, a heating means (34a, 35a, 40-42) is an evaporator side piping part ( 4) is characterized by heating.

  Moreover, in invention of Claim 6, in the adsorption heat pump apparatus of any one of Claim 1 thru | or 5, a heating means (34a, 35a, 40-42) is a condenser side piping part ( 6) is heated.

  These are the adsorption heat exchanger from the valve means (5, 7), with the pipe section on the evaporator (1) side and the pipe section on the condenser (2) side as the boundary. The adsorbed medium inflow / outflow part (36, 37, 361, 371) close to (3), the valve means (5, 7), and the valve means (5, 7) to the evaporator (1) or the condenser (2). If it arrange | positions to the near piping part (4, 6) and arranges from the order in which the condensation of a to-be-adsorbed medium influences performance, Claim 1 and the order will be the order of Claims 2-6. According to the inventions according to the second to sixth aspects, even if there are many effects, in any case, the adsorbed medium can be prevented from condensing into droplets in the portion, Can be prevented.

In the invention according to claim 7 , in the adsorption heat pump device according to any one of claims 1 to 6, the adsorption heat exchanger (3) is an adsorption heat exchanger (3) as a heating means. A heat exchange medium branch path (42) for branching and heating a part of the heat exchange medium to be circulated is provided. According to the seventh aspect of the present invention, it is possible to easily realize a structure in which the heat of the heat exchange medium supplied to the adsorption heat exchanger (3) is utilized.

  Further, the adsorption heat exchanger (3) circulates the heat exchange medium having a low temperature when adsorbing the adsorbed medium, and the temperature of the heat exchange medium at this time is higher than the temperature of the evaporator (1). It is hot. For this reason, it can be used as a heating means by branching a part of the heat exchange medium in the adsorption process.

Moreover, in invention of Claim 8 , in the adsorption | suction heat pump apparatus of any one of Claim 1 thru | or 6, adsorption | suction heat exchanger (3) is a heat exchange medium tank part ( 34, 35), and is covered with a part (34a, 35a) of the heat exchange medium tank section (34, 35) as a heating means.

According to the eighth aspect of the present invention, the heat exchange medium tank section (34, 35) filled with the heat exchange medium is covered with a part (34a, 35a) to be supplied to the adsorption heat exchanger (3). It is possible to easily realize a structure for heating using the heat of the heat exchange medium.
In addition, the code | symbol in the parenthesis as described in a claim and said each means is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

(First Embodiment) (Comparative Example)
Hereinafter, the adsorption heat pump apparatus according to the first embodiment (comparative example) of the present invention will be described in detail with reference to FIGS. First, FIG. 1 is a partial schematic cross-sectional view showing the overall configuration of the adsorption heat pump apparatus in the first embodiment (comparative example) of the present invention. In this adsorption heat pump apparatus, an adsorbent described later contained in the adsorption heat exchanger 3 is a medium to be adsorbed in which the phase changes between a liquid phase and a gas phase (in this embodiment, water and water vapor. It is an adsorption heat pump apparatus that performs a heat exchange action through adsorption and desorption of water vapor.

  Therefore, using the action that the adsorbent adsorbs vapor in the gas phase, evaporating the water and exerting the refrigerating capacity by the latent heat of evaporation, it is applied to an air conditioner for vehicles as an adsorption refrigeration system It is suitable for this. The adsorption heat pump device is roughly classified into an evaporator 1 for evaporating water to make water vapor, a condenser 2 for condensing water vapor to make water, and a water vapor that is disposed between them and evaporated by the evaporator 1. And an adsorption heat exchanger 3 that alternately executes an adsorption process for sucking and adsorbing water and a desorption process for desorbing the adsorbed water vapor and discharging it to the condenser 2.

  In addition, description of the structure of the evaporator 1 and the condenser 2 is abbreviate | omitted. The adsorption heat exchanger 3 includes an adsorption module in the housing. FIG. 2 is an end view of the adsorption module 20 as a premise of the invention, and FIG. 3 is a cross-sectional view taken along the line III-III in FIG. 2 and 3, the adsorption module 20 includes a plurality of hot water pipes (heat medium tubes) 21 through which a heat exchange medium (hot water is used in the present embodiment. And an adsorbent packed layer 22 formed so as to be coupled to the outer peripheral surface of the hot water pipe 21.

  Further, in the adsorbent packed bed 22 between the hot water pipes 21, a water vapor passage (adsorbed medium passage) 25 through which water vapor flows is formed. FIG. 4 is a partially enlarged view of FIG. 2, and FIG. 5 is a schematic cross-sectional view showing the adsorbent packed layer 22 in FIG. As shown in FIG. 5, the adsorbent packed layer 22 is bonded to the outer peripheral surface of each hot water pipe 21 by filling the adsorbent 24 in a powder, particulate or fibrous metal powder 23 b and sintering it. Is formed.

  In this embodiment, a fibrous metal having excellent thermal conductivity is used as the porous sintered fin (porous heat transfer body) 23, and this fibrous metal is heated and sintered without melting. It is made into the sintered compact. In this embodiment, copper or copper alloy is used as the fibrous metal. The porous sintered fins 23 may be made of, for example, powder or particulate metal.

  Such porous fins 23 form fine pores 23a as shown in FIG. The pores 23a are fine pores suitable for filling the adsorbent 24 having a fine particle diameter. The adsorbent 24 is formed into a large number of fine particles, and is made of, for example, a material such as silica gel or zeolite. A large number of adsorbents 24 are filled in the pores 23 a of the porous fins 23.

  The porous fins 23 are sinter-bonded to the periphery of the hot water pipe 21 made of copper or a copper alloy. The adsorbent packed bed 22 composed of these is formed around the plurality of hot water pipes 21 so as to extend in the axial direction of the hot water pipe 21, and in this embodiment, the entire shape is cylindrical. ing. Further, in the adsorbent packed bed 22 between the hot water pipes 21, a water vapor passage 25 through which water vapor flows is arranged.

  The cross-sectional shape of the water vapor passage 25 is a circle in the present embodiment, but may be an ellipse, a rectangle, or the like. In the present embodiment, the water vapor passage 25 is disposed in a region surrounded by the six hot water pipes 21, but is disposed in a region surrounded by a plurality of other hot water pipes 21. May be.

  The water vapor passage 25 plays a role of allowing water vapor from the evaporator 1 to penetrate quickly into the adsorbent packed bed 22 around the hot water pipe 21 during adsorption. Further, at the time of desorption, the water vapor discharged from the adsorbent packed bed 22 around the hot water pipe 21 plays a role of promptly leading to the condenser 2 through the water vapor passage 25.

  The thickness of the adsorbent-filled layer 22 corresponds to the thickness L (see FIG. 5) of the porous sintered fin 23 that is sintered and bonded on the outer peripheral surface of the hot water pipe 21. In setting the thickness L of the adsorbent packed bed 22, as shown in FIGS. 4 and 5, the penetration depth r 2 of water vapor toward the hot water pipe 21 and the distance from the hot water pipe 21 (hereinafter referred to as the heat transfer distance). ) It is preferable to arrange the water vapor passage 25 between the hot water pipes 21 so that r1 is substantially equal.

  The penetration depth r2 is the distance from the inner peripheral surface of the water vapor passage 25 to the outer peripheral surface of the hot water pipe 21. Thus, by disposing the water vapor passage 25 between the hot water pipes 21 so that the penetration depth r2 related to the adsorption and desorption rate is substantially equal to the heat transfer distance r1, the diffusion resistance of water vapor is small. In addition, it is possible to provide a high-performance adsorption heat exchanger 3 that has excellent heat transfer characteristics and can shorten the time required for adsorption and desorption. This is the optimum adsorbent packed bed thickness L.

  Next, the adsorption heat exchanger 3 in which the adsorption module 20 described above is housed in the case 30 and integrally molded will be described with reference to FIG. In addition, in FIG. 1, the adsorption | suction module 20 demonstrated in FIGS. The adsorption heat exchanger 3A of the present embodiment roughly includes the adsorption module 20 accommodated in the case main body 31, and the partition plates 32 and 33 are fitted on both end faces thereof, and further, hot water tank parts (heat exchange medium tank parts are provided on both end faces thereof. ) 34 and 35 are assembled and integrally joined.

  The case main body 31 is formed in a cylindrical shape, and the columnar suction module 20 is accommodated therein. Moreover, the opening parts at both ends of the case body 31 are formed so as to be able to be sealed by the partition plates 32 and 33. And the inside of the case main body 31 comprises 1st area | region A1 in which the adsorbent filling layer 22 is formed, and 2nd area | region A2 in which the adsorbent filling layer 22 of the both sides is not formed.

  A plurality of hot water pipe holes 32a corresponding to the position of the hot water pipe 21 are provided so that the plurality of hot water pipes 21 protruding from the adsorption module 20 to both end surfaces pass through the partition plates 32 and 33 to be sealed. 33a is provided. The case body 31, the partition plates 32 and 33, and the hot water pipe holes 32a and 33a of the partition plates 32 and 33 and the hot water pipe 21 are airtightly joined by brazing or the like.

  Thus, by sealing the case main body 31 with the partition plates 32 and 33, the inside can be kept in a vacuum. This prevents other gases from entering the internal sealed space formed by the case body 31 and the partition plates 32 and 33 in addition to water vapor as the adsorbed medium.

  In FIG. 1, a water vapor inflow portion (adsorbed medium inflow portion) 36 for introducing water vapor from the evaporator 1 to the main adsorption heat exchanger 3A during adsorption is provided on the left side near the lower end of the case body 31. Yes. Further, on the left side in the vicinity of the upper end of the case main body 31, a water vapor outflow portion (adsorbed medium outflow portion) 37 that leads water vapor from the main adsorption heat exchanger 3 </ b> A to the condenser 2 at the time of desorption is provided.

  And between the evaporator 1, the evaporator side piping part 4 which connects the evaporator 1 and the adsorption heat exchanger 3, the evaporator side piping part 4, and the water vapor inflow part 36 of the adsorption heat exchanger 3 And an evaporator-side valve (evaporator-side valve means) 5 that is provided between them to interrupt the flow of water vapor. Also, between the condenser 2 and the condenser side piping part 6 for connecting the condenser 2 and the adsorption heat exchanger 3, the condenser side piping part 6 and the water vapor outlet part 37 of the adsorption heat exchanger 3, And a condenser side valve (condenser side valve means) 7 for intermittently circulating the water vapor.

As a characteristic configuration of this embodiment (comparative example) , an electric heater (electric heating means) 40 such as a ribbon heater is provided on the outer surfaces of the water vapor inflow / outflow portions 36 and 37, the valves 5 and 7 on both sides, and the pipe portions 4 and 6 on both sides. It is comprised so that these can be heated. Thereby, it can prevent that water vapor | steam condenses in these piping parts, and it becomes a water drop, and can prevent a performance fall.

  At the time of adsorption, the water vapor is distributed to the water vapor passage 25 of the adsorption module 20 through the evaporator 1 → the evaporator side piping part 4 → the evaporator side valve 5 → the water vapor inflow part 36. The water vapor distributed to the water vapor passage 25 penetrates into the adsorbent packed bed 22. In FIG. 1, the lower hot water tank section 34 is provided with a hot water inflow section 38 that guides hot water at the time of desorption, and the upper hot water tank section 35 is provided with a hot water outflow section 39 that guides hot water. ing. The warm water flows into the warm water inflow section 38 of the warm water tank section 34 and is distributed to a large number of warm water pipes 21, which are heated while flowing upward in the adsorbent packed bed 22.

  And the hot water after heat-exchanged with each hot water pipe 21 gathers in the hot water tank part 35, and flows out from the warm water outflow part 39. FIG. At the time of this desorption, water vapor is discharged from the heated adsorbent packed bed 22, and the discharged water is condensed through each water vapor passage 25 → water vapor outlet 37 → condenser side valve 7 → condenser side pipe part 6. To the vessel 2. In addition, the flow direction of warm water may be from the top in FIG.

  In FIG. 1, cold water flows through the hot water inflow portion 38 during adsorption. The cold water flows into the hot water inflow section 38 of the hot water tank section 34 and is distributed to the multiple hot water pipes 21 and flows upward in the adsorbent packed bed 22. And since the temperature of this cold water is higher than the temperature of the evaporator 1, the effect similar to heating is acquired. For this reason, it is possible to prevent water vapor from condensing in the piping parts 4 and 6 during adsorption and forming water droplets, and it is possible to prevent deterioration in performance.

  The case body 31, the partition plates 32 and 33, the hot water tank portions 34 and 35, and the pipes 36 to 39 of the inflow / outflow portion described above are formed of copper or a copper alloy and are airtightly and integrally joined by brazing or the like. . The case 30 and the hot water pipe 21 may have any shape such as a cylindrical shape, an elliptical shape, and a rectangular shape in the radial cross section.

  Next, an example of the manufacturing method of the adsorption heat exchanger 3A described above will be described. First, the hot water pipe 21 is inserted into a jig (not shown) on which a rod for forming the water vapor passage 25 stands, and the case main body 31 is put on the jig. The steam inflow / outflow pipes 36 and 37 may be assembled later, but are assumed to be assembled to the case body 31 first.

  Next, the gap in the case body 31 is filled with mixed powder obtained by mixing fibrous copper powder and the adsorbent 24. Then, after this mixed powder is pressed and hardened with another jig, it is once put in a furnace to sinter the adsorbent packed layer 22. Next, the stick for forming the water vapor passage 25 is gently wiped together with the lower jig so that the adsorption module 20 with the water vapor passage 25 opened is accommodated in the case main body 31.

  Next, the partition plates 32 and 33 are inserted above and below the hot water pipe 21, and the hot water pipe 21 is expanded (opened) and fixed. Furthermore, the hot water tank parts 34 and 35 are set above and below to complete the heat exchanger. The hot water inflow / outflow pipes 38 and 39 may be assembled later, but are first assembled in the tanks 34 and 35. Finally, the assembly is again placed in the furnace and the components are brazed together to complete the heat exchanger. The above assembly method is merely an example, and the present invention is not limited to this.

Next, features and effects of the present embodiment (comparative example) will be described. First, the adsorption heat exchanger 3 </ b> A includes a water vapor inflow portion 36 that is formed so as to protrude from the adsorption heat exchanger 3 </ b> A in order to connect to the evaporator-side valve 5, and includes heating means 40 that heats the water vapor inflow portion 36. Have.

  According to this, the water vapor inflow portion 36 that connects the evaporator side valve 5 and the adsorption heat exchanger 3A that most affect the performance, that is, the side closer to the adsorption heat exchanger 3A from the portion partitioned by the evaporator side valve 5 It is possible to prevent the water vapor from condensing and forming water droplets in the piping portion, and to prevent the performance from being deteriorated.

  Further, the adsorption heat exchanger 3A is provided with a water vapor outflow portion 37 formed so as to protrude from the adsorption heat exchanger 3A in order to connect to the condenser side valve 7, and heating means 40 for heating the water vapor outflow portion 37 is provided. Have. The heating means 40 heats the evaporator side valve 5 and the condenser side valve 7. Furthermore, the heating means 40 is also heating the evaporator side piping part 4 and the condenser side piping part 6. FIG.

  These are the water vapor inflow / outflow portions 36 and 37 closer to the adsorption heat exchanger 3A than the valves 5 and 7, with the piping 5 on the evaporator 1 side and the piping portion on the condenser 2 side as the boundary, respectively. When the valves 5 and 7 are divided into the pipe sections 4 and 6 closer to the evaporator 1 or the condenser 2 than the valves 5 and 7 and arranged in the order in which the condensation of water vapor affects the performance, the above order is obtained. According to these, although there are many effects, in any case, it is possible to prevent water vapor from condensing into the water droplets and forming water droplets, and it is possible to prevent a decrease in performance.

  Moreover, the electric heater 40 is used as a heating means. According to this, a heating structure can be easily realized by using, for example, an electric heater 40 such as a ribbon heater as the heating means.

(Second Embodiment) (Comparative Example)
Next, a second embodiment (comparative example) will be described. FIG. 6 is a partial cross-sectional view showing the configuration of the adsorption heat pump apparatus in the second embodiment (comparative example) of the present invention. In the following embodiments, the same components as those in the first embodiment (comparative example) described above are denoted by the same reference numerals, description thereof is omitted, and different configurations and features will be described.

The adsorption heat exchanger 3B of the present embodiment (comparative example) is one in which the adsorption heat pump device is mounted on a vehicle, and an exhaust gas pipe (heating means) 41 of an internal combustion engine is used as a heating means for steam inflow / outflow portions 36 and 37. And thermally connected. According to this, as a heating means, for example, a structure for heating using waste heat of exhaust gas can be easily realized by thermally connecting an exhaust gas pipe 41 such as a muffler pipe of a vehicle running engine. it can. Note that the flow direction of the exhaust gas may be from the bottom in FIG.

(Third embodiment)
Next, a third embodiment will be described. FIG. 7 is a partial cross-sectional view showing the configuration of the adsorption heat pump apparatus in the third embodiment of the present invention, and FIG. 8 is an enlarged detailed view of a portion VIII in FIG. A different characteristic part from each embodiment mentioned above is demonstrated.

  The adsorption heat exchanger 3C according to the present embodiment has a hot water branch path (heat exchange medium branch path, which heats the water vapor inflow / outflow portions 36 and 37 by branching a part of the hot water flowing through the adsorption heat exchanger 3C as a heating means. Heating means) 42 is provided. A part of the warm water flowing into the warm water tank section 34 in FIG. 7 flows through the warm water branch 42, flows through the outer surfaces of the steam inflow / outflow sections 36 and 37, and then flows into the warm water tank section 35. It is made up.

  For example, the hot water branch path 42 is made by pressing a copper or copper alloy plate material to produce a split path forming plate that is divided in half, and sandwiching the water vapor inflow / outflow portions 36 and 37 from both sides with the two plates, It can be realized by joining together with other members by brazing. According to this, the structure heated using the heat of the hot water supplied to the adsorption heat exchanger 3C can be easily realized.

(Fourth embodiment)
Next, a fourth embodiment will be described. FIG. 9 is a partial cross-sectional view showing the configuration of the adsorption heat pump apparatus according to the fourth embodiment of the present invention, and FIG. 10 is a cross-sectional view taken along the line XX in FIG. Features different from the above-described embodiment will be described. The adsorption heat exchanger 3D of the present embodiment covers the steam inflow / outflow portions (adsorbed medium outflow / inflow portions) 361 and 371 with parts (heating means) 34a and 35a of the hot water tank portions 34 and 35 as heating means.

  9 and 10, the water vapor that flows in from the evaporator 1 through the evaporator-side valve 5 is distributed from the water vapor inflow portion 361 to each water vapor passage 25. The water vapor inflow portion 361 is formed by press-molding a copper or copper alloy plate material. Similarly, the desorbed water vapor gathers from the water vapor passages 25 in the water vapor outflow portion 371 and is supplied to the condenser 2 via the condenser side valve 7.

  According to this, the steam inflow / outflow portions 361 and 371 are covered with the portions 34a and 35a of the hot water tank portions 34 and 35 filled with hot water, and heated using the heat of the hot water supplied to the adsorption heat exchanger 3D. It is possible to easily realize the structure.

(Other embodiments)
The present invention is not limited to the above-described embodiments, and can be modified or expanded as follows. For example, in the above-described second to fourth embodiments, only the steam inflow / outflow portions 36, 37, 361, and 371 are heated, but the configuration is such that the valves 5 and 7 on both sides and the piping portions 4 and 6 on both sides are heated. You may do it. Moreover, in the above-mentioned embodiment, although copper is used for the hot water pipe 21 and the porous fin 23, you may comprise with stainless steel, aluminum, etc. Moreover, the structure where the evaporator 1 and the condenser 3 are united may be sufficient.

1 is a partial schematic cross-sectional view illustrating an overall configuration of an adsorption heat pump apparatus according to a first embodiment (comparative example) of the present invention. It is an end view of adsorption module 20 used as the premise of the invention. It is III-III sectional drawing in FIG. FIG. 3 is a partially enlarged view of FIG. 2. It is typical sectional drawing which shows the adsorbent filling layer 22 in FIG. It is a fragmentary sectional view which shows the structure of the adsorption | suction type heat pump apparatus in 2nd Embodiment (comparative example) of this invention. It is a fragmentary sectional view which shows the structure of the adsorption | suction type heat pump apparatus in 3rd Embodiment of this invention. FIG. 8 is an enlarged detail view of a part VIII in FIG. 7. It is a fragmentary sectional view which shows the structure of the adsorption type heat pump apparatus in 4th Embodiment of this invention. It is XX sectional drawing in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Evaporator 2 ... Condenser 3 ... Adsorption heat exchanger 4 ... Evaporator side piping part 5 ... Evaporator side valve (Evaporator side valve means)
6 ... Condenser side piping 7 ... Condenser side valve (Condenser side valve means)
34, 35 ... Warm water tank (heat exchange medium tank)
34a, 35a ... a part of the water vapor tank (heating means)
36,361: Water vapor inflow portion (adsorbed medium inflow portion)
37, 371 ... Water vapor outflow part (adsorbed medium outflow part)
40. Electric heater (electric heating means)
41. Exhaust gas pipe (heating means)
42 ... Warm water branch (heat exchange medium branch, heating means)

Claims (8)

An evaporator (1) for evaporating the adsorbed medium;
A condenser (2) for condensing the adsorbed medium;
Adsorption in which the adsorption process for sucking and adsorbing the adsorbed medium evaporated in the evaporator (1) and the desorption process for desorbing the adsorbed medium to be discharged to the condenser (2) are performed alternately. A heat exchanger (3);
An evaporator-side piping (4) connecting the evaporator (1) and the adsorption heat exchanger (3);
An evaporator-side valve means (5) provided between the evaporator-side piping section (4) and the adsorption heat exchanger (3) for intermittently circulating the adsorbed medium;
A condenser side pipe section (6) connecting the adsorption heat exchanger (3) and the condenser (2);
In an adsorption heat pump apparatus comprising condenser side valve means (7) provided between the adsorption heat exchanger (3) and the condenser side pipe section (6) for intermittently circulating the adsorbed medium. ,
The adsorption heat exchanger (3)
It has a structure in which a high-temperature heat exchange medium is circulated inside when the adsorbed medium is desorbed,
In order to connect to the evaporator-side valve means (5), it comprises an adsorbed medium inflow portion (36, 361) formed to protrude from the adsorption heat exchanger (3),
It has a heating means ( 34a, 42 ) which heats the said to-be-adsorbed medium inflow part (36,361) using the heat | fever of the heat exchange medium distribute | circulated to the said adsorption heat exchanger (3), It is characterized by the above-mentioned. Adsorption heat pump device. The adsorption heat exchanger (3)
In order to connect with the condenser side valve means (7), it comprises an adsorbed medium outflow part (37, 371) formed to protrude from the adsorption heat exchanger (3),
It has a heating means ( 35a, 42 ) which heats the said to-be-adsorbed medium outflow part (37,371) using the heat | fever of the heat exchange medium distribute | circulated to the said adsorption heat exchanger (3), It is characterized by the above-mentioned. The adsorption heat pump apparatus according to claim 1.   The adsorption heat pump device according to claim 1 or 2, wherein the heating means (34a, 35a, 42) heats the evaporator side valve means (5).   The adsorption heat pump apparatus according to any one of claims 1 to 3, wherein the heating means (34a, 35a, 42) heats the condenser side valve means (7).   The adsorption heat pump apparatus according to any one of claims 1 to 4, wherein the heating means (34a, 35a, 42) heats the evaporator-side piping section (4).   The adsorption heat pump device according to any one of claims 1 to 5, wherein the heating means (34a, 35a, 42) heats the condenser side pipe section (6). The adsorption heat exchanger (3)
Wherein as a heating means, the claims 1, characterized in that it adsorption heat exchanger heat exchange medium branch path to heat tap a portion of the heat exchange medium to be circulated in (3) (42) provided 6 The adsorption heat pump apparatus of any one of these. The adsorption heat exchanger (3)
A heat exchange medium tank section (34, 35) for storing the heat exchange medium;
The adsorption heat pump according to any one of claims 1 to 6, wherein the heating means is covered with a part (34a, 35a) of the heat exchange medium tank (34, 35). apparatus.

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