JP4976140B2 - Resist composition - Google Patents

Description

  The present invention is a resist composition sensitive to radiation such as ultraviolet rays, far-ultraviolet rays, X-rays and electron beams, and has excellent safety during use, coating properties, remaining film ratio during development, and development. The present invention relates to a resist composition having excellent line width uniformity of a later pattern and excellent adhesion during development.

  In the manufacture of integrated circuits, color filters, liquid crystal elements and the like, fine processing is required. In order to satisfy this requirement, a resist has been used conventionally. In general, there are positive and negative resists, and both are usually dissolved in a solvent to form a resist composition in a solution state.

  This resist composition is applied onto a substrate such as a silicon substrate or a glass substrate by a known coating method such as spin coating, roller coating, slit coating, or ink jet, and then pre-baked to form a resist film. Depending on the wavelength range, exposure is performed with particle beams such as ultraviolet rays, far ultraviolet rays, X-rays, and electron beams, development is performed, and dry etching is performed as necessary to form a desired resist pattern.

  Various solvents have been conventionally used as the resist composition, and are selected and used in consideration of solubility, coatability, sensitivity, developability, pattern characteristics to be formed, and the like. For example, ethylene glycol monoethyl ether acetate has been known as a solvent excellent in various properties such as solubility, coating properties, and resist forming properties. However, in recent years, safety problems for human bodies have been pointed out, and safety is high. In addition, there has been a demand for a solvent with improved performance such as resist formation characteristics and excellent resin solubility and initiator solubility.

  As a solution to these problems, propylene glycol monomethyl ether acetate or the like is shown as a solvent in place of ethylene glycol monoethyl ether acetate (for example, Patent Document 1). However, a solvent that is considered to be safer than these ethylene glycol monoethyl ether acetates has a problem that characteristics such as resist formation characteristics and solubility are not sufficient. For example, in the case of propylene glycol monomethyl ether acetate, the film thickness distribution abnormality may occur due to the small amount of solvent remaining in the film when the resist is applied on the substrate, the line width uniformity, the resist film during development, Adhesion and the like are reduced.

  Further, although a technology for improving resin solubility and initiator solubility using β-type propylene glycol monomethyl ether acetate has been disclosed, it is still insufficient in terms of resin solubility and initiator solubility (for example, Patent Document 2).

Japanese Patent Publication No. 3-1659 JP-A-6-324483

  An object of the present invention is to provide a resist composition that not only enhances the properties of solubility during resist preparation and resist film adhesion during development, but also improves resist stability and is excellent in safety. .

  As a result of intensive studies, the present inventors have found that the above object can be achieved by using a specific organic solvent, and have reached the present invention.

That is, the present invention is a resist composition comprising a resist component and an organic solvent, wherein (a2) an alcohol compound group comprising a cycloalkylalkanol having a 4-7 membered cycloalkane ring, (b) (B1) an acetate compound group consisting of an acetate of an alcohol having a 4- to 8-membered C _2-6 cyclic ether skeleton and (b2) an acetate of a cycloalkylalkanol having a 4- to 7-membered cycloalkane ring, and (c) ( c1) at least selected from the group of ether compounds consisting of alkyl ethers of alcohols having a 4-8 membered C _2-6 cyclic ether skeleton and (c2) alkyl ethers of cycloalkylalkanols having 4-7 membered cycloalkane rings. A resist composition containing one organic solvent is provided.

The present invention also provides a resist composition comprising a resist component and an organic solvent, as the organic solvent, (a) (a1) an alcohol and a 4-8 membered C _2-6 cyclic ether skeleton of (a2) A group of alcohol compounds comprising a cycloalkyl alkanol having a 4-7 membered cycloalkane ring, (b) (b1) an alcohol acetate having a 4-8 membered C _2-6 cyclic ether skeleton, and (b2) 4-7 membered And (c) (c1) alkyl ethers of alcohols having a 4-8 membered C _2-6 cyclic ether skeleton and (c2) 4-7 members At least two compound groups among three compound groups of ether compound groups consisting of alkyl ethers of cycloalkylalkanols having a cycloalkane ring A plurality of organic solvents selected et respective one or more providing including resist composition.

  The resist composition comprises, as an organic solvent, an alcohol compound group consisting of tetrahydrofuran-2-ylmethanol and 4-hydroxymethylcyclohexylmethanol, tetrahydrofuran-2-ylmethyl acetate and 4-acetoxymethylcyclohexylmethyl acetate. A plurality of organic solvents each selected from at least two compound groups out of three compound groups of an ether compound group consisting of an acetate compound group, methoxymethyltetrahydrofuran and 1,4-bis (methoxymethyl) cyclohexane; May be.

The resist composition may further contain at least one solvent selected from carboxylic acid alkyl esters and aliphatic ketones as an organic solvent. In addition to the above-mentioned invention, the present specification includes a resist composition containing a resist component and an organic solvent, wherein (a) (a1) 4-8 membered C _2-6 cyclic ether is used as the organic solvent. An alcohol compound group consisting of an alcohol having a skeleton and (a2) a cycloalkylalkanol having a 4-7 membered cycloalkane ring; (b) (b1) an acetate of an alcohol having a 4-8 membered C _2-6 cyclic ether skeleton; And (b2) an acetate compound group consisting of an acetate of a cycloalkylalkanol having a 4-7 membered cycloalkane ring, and (c) (c1) an alkyl ether of an alcohol having a 4-8 membered C _2-6 cyclic ether skeleton And (c2) at least one selected from the group of ether compounds consisting of alkyl ethers of cycloalkylalkanols having a 4-7 membered cycloalkane ring Also described a resist composition containing a machine solvent.

  According to the present invention, the solubility at the time of resist preparation is improved, the resist stability is drastically improved, and the drying rate is adjusted by maintaining the amount of residual solvent in the resist film at the time of resist coating. A resist composition having improved safety such as line width uniformity and resist film adhesion during development, and high safety is provided.

In the present invention, an alcohol compound comprising (a) (a1) an alcohol having a 4- to 8-membered C _2-6 cyclic ether skeleton and (a2) a cycloalkylalkanol having a 4- to 7-membered cycloalkane ring as the organic solvent. Groups (b) (b1) acetates (acetate esters) of alcohols having a 4-8 membered C _2-6 cyclic ether skeleton and (b2) acetates of cycloalkylalkanols having a 4-7 membered cycloalkane ring (acetic acid) And (c) (c1) an alkyl ether of an alcohol having a 4-8 membered C _2-6 cyclic ether skeleton and (c2) a cycloalkylalkanol having a 4-7 membered cycloalkane ring. At least one organic solvent selected from the ether compound group consisting of the above alkyl ethers is used.

  These organic solvents can be used alone or in admixture of two or more at any ratio. Moreover, it can also use together with other organic solvents other than the above.

The “alcohol having a 4- to 8-membered C _2-6 cyclic ether skeleton” means an alcohol having a cyclic ether skeleton having 4 to 8 atoms constituting the ring and having 2 to 6 carbon atoms in the cyclic portion. Means. Examples of the ring constituting the 4- to 8-membered C _2-6 cyclic ether skeleton include oxetane ring, dioxetane ring (1,3-dioxetane ring, etc.), tetrahydrofuran ring (oxolane ring), dioxolane ring (1,3-dioxolane ring). Etc.), tetrahydropyran ring (oxane ring), dioxane ring (1,3-dioxane ring, 1,4-dioxane ring etc.), oxepane ring, dioxepane ring (1,3-dioxepane ring, 1,4-dioxepane ring, etc.) ), Dioxocan ring (1,3-dioxocan ring, 1,4-dioxocan ring, etc.) and the like. The alcohol may be a monohydric alcohol or a dihydric or higher polyhydric alcohol. The ring constituting the cyclic ether skeleton and the alcoholic hydroxyl group may be directly bonded or may be bonded via a linking group. Examples of the linking group include linear or branched alkylene groups having 1 to 4 carbon atoms (for example, methylene, ethylene, propylene, isopropylidene, trimethylene, tetramethylene groups, etc.). A preferred linking group is a methylene group or an ethylene group, and a methylene group is particularly preferred. The ring constituting the cyclic ether skeleton may have a substituent. Examples of the substituent include C _1-4 alkyl groups such as methyl, ethyl, propyl, and butyl groups.

The “cycloalkylalkanol having a 4 to 7-membered cycloalkane ring” is a compound in which a hydroxyalkyl group is bonded to a cycloalkane ring having 4 to 7 carbon atoms. The 4- to 7-membered cycloalkane ring includes a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, and a cycloheptane ring. The number of carbon atoms in the “alkanol” moiety is preferably 1 to 4, more preferably 1 or 2, and particularly preferably 1. Even if the alcohol is a monohydric alcohol (a compound in which one hydroxyalkyl group is bonded to a cycloalkane ring), a polyhydric alcohol having two or more valences (a compound in which a plurality of hydroxyalkyl groups are bonded to a cycloalkane ring) However, a dihydric or higher polyhydric alcohol is more preferable. The cycloalkane ring may have a substituent. Examples of the substituent include a C _1-4 alkyl group as described above.

  In the “alcohol acetate” of (b) and the “alkyl ether of alcohol” of (c), when the alcohol is a polyhydric alcohol, only one of a plurality of hydroxyl groups is acetated or alkyl ether. And two or more hydroxyl groups (for example, all hydroxyl groups) may be acetated or alkyletherified. In the present invention, it is more preferable that all hydroxyl groups are acetated or alkyletherified.

Examples of the alkyl in the “alkyl ether of alcohol” in the above (c) include C _1-4 alkyl groups such as methyl, ethyl, propyl and butyl groups.

(A1) Examples of the alcohol having a 4- to 8-membered C _2-6 cyclic ether skeleton include hydroxyoxetane, oxetane-2-yl-methanol, oxetan-2-yl-ethanol, oxetan-2-yl-propanol, Oxetane-2-yl-butanol, oxetane-3-yl-methanol, 2,3-dimethyloxetane-2-yl-methanol, 3,3-diethyloxetan-2-yl-methanol, 2-hydroxymethyloxetane-2- Alcohols having a 4-membered cyclic ether skeleton such as yl-methanol, 3-hydroxymethyloxetan-2-yl-ethanol, 4-hydroxymethyl-1,3-dioxetan-2-yl-methanol; hydroxytetrahydrofuran, 2,3 -Dihydroxytetrahydrofuran, tetrahydro Lan-2-yl-methanol, tetrahydrofuran-2-yl-ethanol, methyltetrahydrofuran-2-yl-methanol, 2,5-dihydroxydioxolane, 5-hydroxymethyldioxolan-2-yl-methanol, methyldioxolan-2-yl An alcohol having a 5-membered cyclic ether skeleton such as methanol; hydroxytetrahydropyran, 2,3-dihydroxytetrahydropyran, tetrahydropyran-2-yl-methanol, methyltetrahydropyran-2-yl-methanol, 2-hydroxydioxane, Alcohols having a 6-membered cyclic ether skeleton such as 2,5-dihydroxydioxane, 5-hydroxymethyldioxane-2-yl-methanol, methyldioxan-2-yl-methanol; Bread, 2,3-dihydroxyoxepane, oxepan-2-yl-methanol, methyloxepan-2-yl-methanol, 5-hydroxymethyldioxepan-2-yl-methanol, methyldioxepan-2-yl -Alcohols having a 7-membered cyclic ether skeleton such as methanol; and alcohols having an 8-membered cyclic ether skeleton such as 2-hydroxydioxocan and 2,3-dihydroxydioxocan. Among these, alcohols having a 5-membered cyclic ether skeleton (for example, alcohols having a tetrahydrofuran ring or a dioxolane ring) are preferable, and tetrahydrofuran-2-yl-methanol is particularly preferable.

  (a2) Examples of the cycloalkylalkanol having a 4- to 7-membered cycloalkane ring include cyclobutylmethanol, cyclobutylethanol, cyclobutylpropanol, cyclobutylbutanol, 2-methylcyclobutylmethanol, 2-methyl-3- Alcohols having a cyclobutane ring such as ethylcyclobutylmethanol and 3-hydroxymethylcyclobutylmethanol; cyclopentylmethanol, cyclopentylethanol, cyclopentylpropanol, cyclopentylbutanol, 2-methylcyclopentylmethanol, 2-methyl-3-ethylcyclopentylmethanol, 3- Alcohols having a cyclopentane ring such as hydroxymethylcyclopentylmethanol; cyclohexylmethanol, cyclohexylethanol, Alcohols having a cyclohexane ring such as cyclohexylpropanol, cyclohexylbutanol, 2-methylcyclohexylmethanol, 2-methyl-3-ethylcyclohexylmethanol, 4-hydroxymethylcyclohexylmethanol; cycloheptylmethanol, cycloheptylethanol, cycloheptylpropanol, cyclo Examples include alcohols having a cycloheptane ring such as heptylbutanol, 2-methylcycloheptylmethanol, 2-methyl-3-ethylcycloheptylmethanol, and 3-hydroxymethylcycloheptylmethanol. Among these, an alcohol having a cyclopentane ring or a cyclohexane ring is preferable, and an alcohol having a cyclohexane ring is particularly preferable. Further, dihydric or higher polyhydric alcohols are more preferable, and 4-hydroxymethylcyclohexyl methanol is particularly preferable.

(B1) Examples of acetates of alcohols having a 4- to 8-membered C _2-6 cyclic ether skeleton include hydroxyoxetane acetate, oxetane-2-yl-methyl acetate, oxetane-2-yl-ethyl acetate, and oxetane-2. -Yl-propyl acetate, oxetane-2-yl-butyl acetate, oxetane-3-yl-methyl acetate, 2,3-dimethyloxetane-2-yl-methyl acetate, 3,3-diethyloxetane-2-yl-methyl 4-membered such as acetate, 2-hydroxymethyloxetane-2-yl-methyl acetate, 3-hydroxymethyloxetane-2-yl-ethyl acetate, 4-hydroxymethyl-1,3-dioxetan-2-yl-methyl acetate, etc. Of alcohol having cyclic ether skeleton Cetate; hydroxytetrahydrofuran acetate, 2,3-dihydroxytetrahydrofuran acetate, 2,3-dihydroxytetrahydrofuran diacetate, tetrahydrofuran-2-yl-methyl acetate, tetrahydrofuran-2-yl-ethyl acetate, methyltetrahydrofuran-2-yl-methyl acetate 2, 5-dihydroxydioxolane acetate, 2,5-dihydroxydioxolane diacetate, 5-hydroxymethyldioxolan-2-yl-methyl acetate, methyldioxolan-2-yl-methyl acetate, etc. Acetate of alcohol; hydroxytetrahydropyran acetate, 2,3-dihydroxytetrahydropyran acetate, 2,3-dihydro Citetrahydropyran diacetate, tetrahydropyran-2-yl-methyl acetate, methyltetrahydropyran-2-yl-methyl acetate, 2-hydroxydioxane acetate, 2,5-dihydroxydioxane acetate, 2,5-dihydroxydioxane diacetate, Acetate of alcohol having 6-membered cyclic ether skeleton such as 5-hydroxymethyldioxan-2-yl-methyl acetate, methyldioxan-2-yl-methyl acetate; hydroxyoxepane acetate, 2,3-dihydroxyoxepane acetate 2,3-dihydroxyoxepane diacetate, oxepan-2-yl-methyl acetate, methyl oxepan-2-yl-methyl acetate, 5-hydroxymethyldioxepan-2-yl -Acetate of alcohol having 7-membered cyclic ether skeleton such as methyl acetate, methyldioxepan-2-yl-methyl acetate; 2-hydroxydioxocane acetate, 2,3-dihydroxydioxocane acetate, 2,3 -Acetate of alcohol having an 8-membered cyclic ether skeleton such as dihydroxydioxocandiacetate. Among these, acetates of alcohols having a 5-membered cyclic ether skeleton (for example, alcohols having a tetrahydrofuran ring or a dioxolane ring) are preferable, and tetrahydrofuran-2-yl-methyl acetate is particularly preferable.

  (b2) Examples of acetates of cycloalkyl alkanols having a 4- to 7-membered cycloalkane ring include, for example, cyclobutyl methyl acetate, cyclobutyl ethyl acetate, cyclobutyl propyl acetate, cyclobutyl butyl acetate, 2-methylcyclobutyl methyl acetate Acetate of alcohol having cyclobutane ring such as 2-methyl-3-ethylcyclobutylmethyl acetate, 3-hydroxymethylcyclobutylmethyl acetate; cyclopentylmethyl acetate, cyclopentylethyl acetate, cyclopentylpropyl acetate, cyclopentylbutyl acetate, 2-methyl Cyclopentylmethyl acetate, 2-methyl-3-ethylcyclopentylmethyl acetate, 3-hydroxymethylcyclopentylme Acetate of alcohol having cyclopentane ring such as tilacetate; cyclohexyl methyl acetate, cyclohexyl ethyl acetate, cyclohexyl propyl acetate, cyclohexyl butyl acetate, 2-methylcyclohexyl methyl acetate, 2-methyl-3-ethylcyclohexyl methyl acetate, 4-hydroxy Acetate of alcohol having a cyclohexane ring such as methylcyclohexylmethyl acetate and 4-acetoxymethylcyclohexylmethyl acetate; cycloheptylmethyl acetate, cycloheptylethyl acetate, cycloheptylpropyl acetate, cycloheptylbutyl acetate, 2-methylcycloheptylmethyl acetate, 2-Methyl-3-ethylcycloheptylmethylacete DOO, acetate of alcohols having cycloheptane ring such as 3-hydroxymethyl-cycloheptylmethyl acetate. Among these, an alcohol acetate having a cyclopentane ring or a cyclohexane ring is preferable, and an alcohol acetate having a cyclohexane ring is particularly preferable. Also, divalent or higher polyhydric alcohol acetate is preferable, and 4-acetoxymethylcyclohexylmethyl acetate is particularly preferable.

(c1) Examples of alkyl ethers of alcohols having a 4- to 8-membered C _2-6 cyclic ether skeleton include, for example, methoxyoxetane, ethoxyoxetane, propoxyoxetane, butoxyoxetane, methoxymethyloxetane, methoxyethyloxetane, methoxypropyloxetane Methoxybutyl oxetane, 2-methoxymethyl-2,3-dimethyloxetane, 2-methoxymethyl-3,3-diethyloxetane, 2-methoxymethyl-2-hydroxymethyloxetane, 2-methoxyethyl-3-hydroxymethyloxetane, Alkyl ethers of alcohols having a 4-membered cyclic ether skeleton such as 2-methoxymethyl-4-hydroxymethyl-1,3-dioxetane and 2-methoxymethyl-4-methoxymethyl-1,3-dioxetane; Xyltetrahydrofuran, 2-methoxy-3-hydroxytetrahydrofuran, 2,3-dimethoxytetrahydrofuran, methoxymethyltetrahydrofuran, methoxyethyltetrahydrofuran, 2-methoxymethyl-3-methyltetrahydrofuran, 2-methoxy-5-hydroxydioxolane, 2-methoxymethyl Alkyl ethers of alcohols having a 5-membered cyclic ether skeleton such as -5-hydroxymethyldioxolane, 2-methoxymethyl-3-methyldioxolane; methoxytetrahydropyran, 2methoxy-3-hydroxytetrahydropyran, 2,3-dimethoxytetrahydro Pyran, methoxymethyltetrahydropyran, methoxydioxane, 2-methyl-5-hydroxydioxane, 2,5-dimethoxydioxane, 2 Alkyl ethers of alcohols having a 6-membered cyclic ether skeleton such as methoxymethyl-5-hydroxymethyldioxane; 2-methoxyoxepane, 2-methoxy-3-hydroxyoxepane, 2,3-dimethoxyoxepane, 2- Methoxymethyloxepane, 2-methoxymethyl-3-methyloxepane, 5-methoxymethyldioxepan-2-yl-methanol, 2,5-bis (methoxymethyl) methyldioxepane, 2-methoxymethyl-methyl Alkyl ether of alcohol having 7-membered cyclic ether skeleton such as dioxepane; 8-membered cyclic such as 2-methoxydioxocan, 2-methoxy-3-hydroxydioxocan, 2,3-dimethoxydioxocan Examples thereof include alkyl ethers of alcohols having an ether skeleton. Among these, an alkyl ether of an alcohol having a 5-membered cyclic ether skeleton (for example, an alcohol having a tetrahydrofuran ring or a dioxolane ring) is preferable, and 2-methoxymethyltetrahydrofuran is particularly preferable.

  (c2) Examples of alkyl ethers of cycloalkyl alkanols having a 4- to 7-membered cycloalkane ring include methoxymethylcyclobutane, methoxyethylcyclobutane, methoxypropylcyclobutane, methoxybutylcyclobutane, 1-methoxymethyl-2-methylcyclobutane, Alkyl ethers of alcohols having a cyclobutane ring such as 1-methoxymethyl-2-methyl-3-ethylcyclobutane, 1-methoxymethyl-3-hydroxymethylcyclobutane, 1,3-bis (methoxymethyl) cyclobutane; methoxymethylcyclopentane , Methoxyethylcyclopentane, methoxypropylcyclopentane, methoxybutylcyclopentane, 1-methoxymethyl-2-methylcyclopentane, 1-methoxymethyl-2-methyl-3 Alkyl ethers of alcohols having a cyclopentane ring such as ethylcyclopentane, 1-methoxymethyl-3-hydroxymethylcyclopentane, 1,3-bis (methoxymethyl) cyclopentane; methoxymethylcyclohexane, methoxyethylcyclohexane, methoxypropyl Cyclohexane, methoxybutylcyclohexane, 1-methoxymethyl-2-methylcyclohexane, 1-methoxyethyl-2-methyl-3-ethylcyclohexane, 1-methoxymethyl-4-hydroxymethylcyclohexane, 1,4-bis (methoxymethyl) Alkyl ethers of alcohols having a cyclohexane ring such as cyclohexane; methoxymethylcycloheptane, methoxyethylcycloheptane, methoxypropylcycloheptane, methoxy Tylcycloheptane, 1-methoxymethyl-2-methylcycloheptane, 1-methoxymethyl-2-methyl-3-ethylcycloheptane, 1-methoxymethyl-3-hydroxymethylcycloheptane, 1,3-bis (methoxymethyl ) Alkyl ethers of alcohols having a cycloheptane ring such as cycloheptane. Among these, an alkyl ether of an alcohol having a cyclopentane ring or a cyclohexane ring is preferable, and an alkyl ether of an alcohol having a cyclohexane ring is particularly preferable. Further, alkyl ethers of dihydric or higher polyhydric alcohols are preferable, and 1,4-bis (methoxymethyl) cyclohexane is particularly preferable.

  Although the said organic solvent may be used independently, it can also be used in combination of 2 or more type considering the solubility of resin etc. When two or more types are used in combination, the alcohol compound group (a1) to (a2), the acetate compound group (b1) to (b2), and the ether compound group (c1) to (c2) A mixed system of a plurality of organic solvents each selected from at least two compound groups out of at least two compound groups is preferred, and in particular, a mixture of an organic solvent contained in the ether compound group and an organic solvent contained in the acetate compound group A system is preferred.

  When two organic solvents are used in combination as described above, the ratio between the two is appropriately selected according to the type and purpose of the solvent. For example, when the organic solvent contained in the ether compound group and the organic solvent contained in the acetate compound group are used in combination, the ratio of the two is the former / the latter (weight ratio) = 1/99 to 99/1, preferably It is about 5/95 to 95/5, more preferably about 10/90 to 90/10.

As long as the effects of the present invention are not hindered, another organic solvent (d) may be added (combined) to the organic solvent in the present invention. Examples of other organic solvent (d) that can be added include carboxylic acid alkyl esters and aliphatic ketones. Examples of the carboxylic acid esters include substituents such as hydroxyl groups, alkoxy groups (eg, C _1-4 alkoxy groups) such as lactic acid alkyl esters, acetic acid alkyl esters, propionic acid alkyl esters, and alkoxypropionic acid alkyl esters. And an alkyl ester of an aliphatic carboxylic acid having about 1 to 4 carbon atoms (eg, a C _1-6 alkyl ester) and the like, which may have an alkyl group.

More specifically, the lactate alkyl ester includes lactic acid C _1-6 alkyl ester such as methyl lactate and ethyl lactate, and the acetic acid alkyl ester includes acetic acid such as propyl acetate, n-butyl acetate and n-amyl acetate. a C _1-6 alkyl ester, a propionic acid alkyl ester, methyl propionate, ethyl propionate, propyl propionate, and propionic acid C _1-6 alkyl esters, such as butyl propionate, as alkoxypropionic acid alkyl ester Include C _1-4 alkoxy-propionic acid C _1-6 alkyl esters such as methyl methoxypropionate, ethyl ethoxypropionate, ethyl methoxypropionate, methyl ethoxypropionate, and the like. Moreover, as an aliphatic ketone, C3-C10 aliphatic ketones, such as 2-butanone, 2-pentanone, 2-hexanone, 2-heptanone, etc. are mentioned.

  In addition to the above, other organic solvents (d) that can be added include glycol ethers such as monopropylene glycol alkyl ether and dipropylene glycol alkyl ether; monopropylene glycol alkyl ether acetate (such as propylene glycol methyl ether acetate) Glycol ether acetates.

  The amount of the other organic solvent (d) can be appropriately selected within a range that does not impair the solubility of the resin and other properties as a resist solvent, but is usually 80% by weight with respect to the total amount of the organic solvent in the resist composition. Hereinafter, it is preferably 70% by weight or less, more preferably 50% by weight or less, particularly preferably 10% by weight or less, and may be substantially 0% by weight.

  The resist component in the resist composition of the present invention may be any conventionally known or known positive type or negative type resist. Illustrative of typical resists that can be used in the present invention, in the positive type, for example, those composed of a quinonediazide-based photosensitizer and an alkali-soluble resin, chemically amplified resists, etc., in the negative type, for example, Those containing a polymer compound having a photosensitive group such as polyvinyl cinnamate, those containing an aromatic azide compound or those containing an azide compound consisting of a cyclized rubber and a bisazide compound, those containing a diazo resin, Examples thereof include a photopolymerizable composition containing an addition-polymerizable unsaturated compound, a chemically amplified negative resist composed of an alkali-soluble resin and a crosslinking agent, and an acid generator.

  In the present invention, a preferable resist material to be used includes a quinonediazide photosensitizer and an alkali-soluble resin. Various positive resists composed of a quinonediazide-based photosensitizer and an alkali-soluble resin are conventionally known, but any of them may be used in the present invention and is not particularly limited.

  Examples of quinonediazide-based photosensitizers used in positive resists composed of these quinonediazide-based photosensitizers and alkali-soluble resins include, for example, 1,2-benzoquinonediazide-4-sulfonic acid, 1,2-naphthoquinonediazide-4 -Sulfonic acid, 1,2-naphthoquinonediazide-5-sulfonic acid, esters or amides of these sulfonic acids. The ester or amide compound of sulfonic acid can be obtained by a condensation reaction between the corresponding quinonediazidesulfonic acid or quinonediazidesulfonyl chloride and a compound having a hydroxyl group or a compound having an amino group.

  Examples of the compound having a hydroxyl group include dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phenol, naphthol, p-methoxyphenol, bisphenol A, pyrocatechol, pyrogallol, pyrogallol methyl ether, gallic acid, α, α ′, α ″ − Tris (4-hydroxyphenyl) -1,3,5-triisopropylbenzene, tris (hydroxyphenyl) methane, etc., and examples of the compound having an amino group include aniline, p-aminodiphenylamine, etc. These quinonediazide-based photosensitivities. The agent can be used alone or as a mixture of two or more.

  On the other hand, examples of the alkali-soluble resin include novolak resin, polyvinylphenol, polyvinyl alcohol, a copolymer of acrylic acid or methacrylic acid, and the like.

  As the novolak resin, for example, one kind of phenols such as phenol, o-cresol, m-cresol, p-cresol, xylenol, trimethylphenol, t-butylphenol, ethylphenol, 2-naphthol, 1,3-dihydroxynaphthalene, etc. Or the condensation polymerization product of 2 or more types and aldehydes, such as formaldehyde and paraformaldehyde, is mentioned. These alkali-soluble resins such as novolak resins can be used in combination of two or more as required, and other resins can also be added to improve the film-forming properties. As the quinonediazide sulfonic acid ester, an ester of a polycondensate of phenols and aldehydes or ketones with quinone diazide sulfonic acid can also be used.

  The use ratio of the quinonediazide-based photosensitizer and the alkali-soluble resin varies depending on the photosensitizer and alkali-soluble resin that are specifically used, and is generally in the range of 1: 1 to 1:20 by weight ratio. The present invention is not limited to this.

  Chemically amplified resists are also positive resists that can be preferably used in the present invention. This chemically amplified resist generates an acid upon irradiation, and forms a pattern by changing the solubility of the irradiated portion in the developer by a chemical change due to the catalytic action of this acid. And an acid-sensitive group-containing resin that decomposes in the presence of an acid to produce an alkali-soluble group such as a phenolic hydroxyl group or a carboxyl group.

  Examples of the acid generating compound that generates an acid upon irradiation are bissulfonyldiazomethanes such as bis (isopropylsulfonyl) diazomethane, bissulfonylmethanes such as methylsulfonyl p-toluenesulfonylmethane, and cyclohexylsulfonylcyclohexylcarbonyldiazomethane. Sulfonylcarbonyldiazomethanes, sulfonylcarbonylalkanes such as 2-methyl-2- (4-methylphenylsulfonyl) propiophenone, nitrobenzyl sulfonates such as 2-nitrobenzyl p-toluenesulfonate, pyrogallol trismethanesulfonate Alkyl or aryl sulfonates such as benzoin sulfonates such as benzoin tosylate, N- (trifluoromethyl sulfone) N-sulfonyloxyimides such as (Luoxy) phthalimide, pyrrolidones such as (4-fluoro-benzenesulfonyloxy) -3,4,6-trimethyl-2-pyridone, 2,2,2-trifluoro-1 -Sulphonic acid esters such as trifluoromethyl-1- (3-vinylphenyl) -ethyl 4-chlorobenzenesulfonate, onium salts such as triphenylsulfonium methanesulfonate, and the like. Two or more kinds can be mixed and used.

  In addition, an acid-sensitive group-containing resin that decomposes in the presence of an acid to produce an alkali-soluble group such as a phenolic hydroxyl group or a carboxyl group is an alkali having an acid-sensitive group and an alkali-soluble group that decomposes in the presence of an acid. It consists of a soluble resin part. Examples of the acid-sensitive group include substituted methyl groups such as a benzyl group, 1-substituted ethyl groups such as a 1-methoxyethyl group and 1-benzyloxyethyl group, 1-branched alkyl groups such as a t-butyl group, and trimethylsilyl. Silyl group such as a group, germyl group such as trimethylgermyl group, alkoxycarbonyl group such as t-butoxycarbonyl group, acyl group such as acetyl group, tetrahydropyranyl group, tetrahydrofuranyl group, tetrahydrothiopyranyl group, tetrahydrothio And cyclic acid-decomposable groups such as furanyl group. Among these acid-decomposable groups, preferred are benzyl group, t-butyl group, t-butoxycarbonyl group, tetrahydropyranyl group, tetrahydrofuranyl group, tetrahydrothiopyranyl group, tetrahydrothiofuranyl group and the like.

  Examples of the alkali-soluble resin having an alkali-soluble group such as a phenolic hydroxyl group or a carboxyl group include hydroxystyrene, hydroxy-α-methylstyrene, hydroxymethylstyrene, hydroxyadamantyl (meth) acrylate, carboxyadamantyl (meth) acrylate, and vinyl. Polymers or copolymers from vinyl monomers such as benzoic acid, carboxymethylstyrene, carboxymethoxystyrene, acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid, citraconic acid, mesaconic acid, cinnamic acid, Examples thereof include a copolymer of at least one of these monomers and another monomer, and a condensation polymerization resin such as a novolak resin.

  In addition to the above-mentioned chemically amplified resists, the resist is decomposed in the presence of an alkali-soluble resin, an acid generator, and an acid to reduce the solubility control effect of the alkali-soluble resin or promote the solubility of the alkali-soluble resin. Those containing the compound to be made are also known and such can be used.

  These resist components can be dissolved in the organic solvent described above to form the resist composition of the present invention. The proportion of the resist component can be appropriately set depending on the type of resist to be used and the type of solvent, but is usually 50 to 3000 parts by weight, preferably 70 to 2000 parts by weight, more preferably 100 to 100 parts by weight based on 100 parts by weight of the resist solid component. 1000 parts by weight of organic solvent is used. In particular, when 100 to 500 parts by weight of an organic solvent is used, the alkali-soluble resin often exhibits high solubility.

  Moreover, conventionally well-known various additives, such as surfactant and a sensitizer, can also be suitably mix | blended with these resist compositions according to the intended purpose. Moreover, when water-soluble, it can also be used by adding water.

  The resist composition of the present invention can be used in various applications such as production of semiconductor devices or liquid crystal display elements, but is preferably used as a photoresist composition for semiconductor production or liquid crystal display element production. Formation of the resist pattern using the resist composition of the present invention is performed, for example, as follows.

  First, the resist composition of the present invention is manufactured by dissolving a resist material in the above solvent, and the manufactured resist composition of the present invention is subjected to filter filtration if necessary to remove insolubles, and spin coating is performed. The film is applied onto a substrate such as silicon or glass by a conventionally known coating method such as roll coating, reverse roll coating, cast coating, doctor coating or the like so that the film thickness after pre-baking becomes 0.01 to 1000 μm, for example.

  The resist composition applied to the substrate is pre-baked, for example, on a hot plate to remove the solvent, and a resist film is formed. The prebaking temperature varies depending on the type of solvent or resist used, and is usually 30 to 200 ° C., preferably about 50 to 150 ° C.

  The exposure is performed after the resist film is formed. However, since the photosensitive area differs depending on the resist used, the exposure is performed using an exposure source corresponding to the photosensitive area of the resist. For exposure, for example, a known irradiation device such as a high-pressure mercury lamp, a metal halide lamp, an ultrahigh-pressure mercury lamp, a KrF excimer laser, an ArF excimer laser, an F2 laser, a soft X-ray irradiation device, or an electron beam drawing device is used. Irradiation in a predetermined pattern is performed by ultraviolet rays, far ultraviolet rays, X-rays, electron beams or the like. After exposure, in order to improve developability, resolution, pattern shape, etc., after baking is performed as necessary, development is performed. Further, if necessary after development, dry etching using gas plasma or the like is performed to remove the antireflection film or the like, and a resist pattern is formed.

  The development of the resist is usually performed using a developer and utilizing the difference in solubility in a solvent between an exposed area and an unexposed area or in an alkaline solution. Examples of the alkaline developer include inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate and sodium silicate, amines such as ammonia, ethylamine, diethylamine, triethylamine, diethylethanolamine, triethanolamine and benzylamine, formamide An aqueous solution or an aqueous solution in which amides such as tetramethylammonium hydroxide (TMAH), quaternary ammonium salts such as tetraethylammonium hydroxide and choline, and cyclic amines such as pyrrole and piperazine are dissolved is used.

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto.

Examples 1 to 10 (Example 1 is a reference example) , Comparative Examples 1 to 3
The composition shown in Table 1 is 2 g of an esterification reaction product of 1 mol of 2,4,4,4'-tetrahydroxybenzophenone and 3 mol of naphthoquinone-1,2-diazide-5-sulfonyl chloride and 8 g of cresol novolac resin. A coating solution of a positive photoresist composition was prepared by dissolving in 40 g of a solvent (numbers are weight ratios). The following evaluation tests (1) to (4) were performed on the coating solutions thus obtained. The results are shown in Table 1.
(1) Presence / absence of deposits The prepared coating solution filtered through a 0.2 μm membrane filter was allowed to stand at 40 ° C., and the presence / absence of precipitates in the coating solution after 2 months was examined.
(2) Sensitivity change The presence or absence of a sensitivity change of the photoresist composition after 3 months was examined. That is, the minimum exposure amount (sensitivity) when the coating solution immediately after preparation was applied to the substrate and dried was compared with the case where the coating solution that had been prepared for three months was applied to the substrate and dried. The case where there was no change was indicated as “◯”, and the case where the sensitivity was lowered was indicated as “X”.
(3) Cross-sectional shape The prepared coating solution is slit coated on a glass substrate and dried on a hot plate at 90 ° C. for 90 seconds to form a resist film having a film thickness of 1.3 μm. After being exposed through the mask, it was heated on a hot plate at 110 ° C. for 90 seconds, then developed with 2.38 wt% tetramethylammonium hydroxide aqueous solution (TMAH), washed with water and dried for 30 seconds. The cross-sectional shape of the resist pattern was observed and evaluated according to the following criteria.
○: No undercut occurs at the contact portion between the glass substrate and the resist pattern.
X: Undercut occurs at the contact portion between the glass substrate and the resist pattern (see FIG. 1).
(4) Application state The prepared coating solution is slit-coated on a glass substrate, and the film thickness of what is dried at 90 ° C. for 90 seconds with a hot plate is measured. The thing which was not able to apply | coat uniformly in the surface was made into "defect."

Abbreviations in the table are as follows.
THFF: tetrahydrofuran-2-yl-methanol CHAL: 4-hydroxymethylcyclohexylmethyl alcohol THFFA: tetrahydrofuran-2-yl-methyl acetate CHAA: 4-acetoxymethylcyclohexylmethyl acetate THFFM: 2-methoxymethyltetrahydrofuran CHAM: 1, 4-bis (methoxymethyl) cyclohexane PGMEA: Propylene glycol methyl ether acetate EL: Ethyl lactate

Examples 11-12, Comparative Example 4
Monohydroxyadamantyl acrylate and tetrahydropyranyl methacrylate were copolymerized to obtain a copolymer having a weight average molecular weight of 8,000 and comprising 70 mol% of monohydroxyadamantyl acrylate units and 30 mol% of tetrahydropyranyl methacrylate units. A solvent having a composition shown in Table 2 was added to the obtained resin so that the solid component was 25% by weight, and the mixture was heated at 50 ° C. for 10 minutes, and the dissolution rate (solubility) of the resin was examined. The results are shown in Table 2. The abbreviations in the table are the same as above.
○: A homogeneous transparent solution was obtained.
X: The granular insoluble resin remained on the vessel wall.

  The resist composition of the present invention is useful as a photoresist composition for production of semiconductor devices, liquid crystal display elements and the like because it has excellent solvent solubility and is safe and stable for the human body.

It is a schematic diagram which shows the state (evaluation: x) in which the undercut has arisen in the contact part of a glass substrate and a resist pattern in the evaluation test of a cross-sectional shape.

Explanation of symbols

1 Glass substrate 2 Resist pattern 3 Undercut part

Claims (4)

A resist composition comprising a resist component and an organic solvent, wherein (a2) an alcohol compound group consisting of a cycloalkylalkanol having a 4-7 membered cycloalkane ring, (b) (b1) 4-8 A group of acetate compounds consisting of an alcohol acetate having a C _2-6 cyclic ether skeleton and (b2) a cycloalkyl alkanol acetate having a 4-7 membered cycloalkane ring, and (c) (c1) 4-8 membered At least one organic solvent selected from the group of ether compounds consisting of alkyl ethers of alcohols having a C _2-6 cyclic ether skeleton and (c2) alkyl ethers of cycloalkyl alkanols having 4 to 7-membered cycloalkane rings. A resist composition comprising. A resist composition comprising a resist component and an organic solvent, as the organic solvent, an alcohol and (a2) 4 to 7 membered having C _2-6 cyclic ether skeleton of 4-8 membered (a) (a1) cyclo Alcohol group consisting of cycloalkyl alkanols having an alkane ring, (b) (b1) having an alcohol acetate having a 4-8 membered C _2-6 cyclic ether skeleton, and (b2) having a 4-7 membered cycloalkane ring (C) (c1) having an alkyl ether of an alcohol having a 4- to 8-membered _C2-6 cyclic ether skeleton and (c2) a 4- to 7-membered cycloalkane ring 1 type each from at least 2 compound groups among the 3 compound groups of the ether compound group which consists of the alkyl ether of a cycloalkyl alkanol. A plurality of organic solvents selected upper free herd resist composition. As an organic solvent, an alcohol compound group consisting of tetrahydrofuran-2-ylmethanol and 4-hydroxymethylcyclohexylmethanol, an acetate compound group consisting of tetrahydrofuran-2-ylmethylacetate and 4-acetoxymethylcyclohexylmethylacetate, methoxymethyltetrahydrofuran and The resist composition according to claim 2 , comprising a plurality of organic solvents each selected from at least two compound groups out of three compound groups of the ether compound group consisting of 1,4-bis (methoxymethyl) cyclohexane.   The resist composition according to any one of claims 1 to 3, further comprising at least one solvent selected from carboxylic acid alkyl esters and aliphatic ketones as an organic solvent.

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